KR102668463B1 - Flexible display apparatus - Google Patents

Abstract

The present invention relates to a flexible display device capable of detecting external pressure, comprising an active area and an inactive area, wherein the inactive area includes a first area adjacent to the active area, a second area where a circuit board is disposed, and a flexible substrate including a bending area located between the first area and the second area; a first support layer and a second support layer disposed on a lower surface of the first area and a lower surface of the second area, respectively; an elastic body disposed between the first support layer and the second support layer; a first conductive film disposed between the first support layer and the elastic body; a second conductive film disposed between the second support layer and the elastic body; and a wiring connected to any one of the first conductive film and the second conductive film to transmit the change in capacitance between the first conductive film and the second conductive film to an external device. It can have a thin thickness and is inexpensive. It is a flexible display device that can be manufactured at low cost.

Description

Flexible display apparatus {Flexible display apparatus}

The present invention relates to a display device, and more specifically, to a flexible display device capable of detecting pressure applied from the outside.

Recently, as we have entered the information age, the field of displays that visually express electrical information signals has developed rapidly, and in response to this, various display devices (Display Apparatus) with excellent performance such as thinness, lightness, and low power consumption have been developed. is being developed.

Specific examples of such display devices include Liquid Crystal Display Apparatus (LCD), Organic Light Emitting Display Apparatus (OLED), and Quantum Dot Display Apparatus.

The display device may include a display panel and a number of components to provide various functions. For example, one or more display driving circuits for controlling a display panel may be included in a display assembly. Examples of drive circuits include gate drivers, light emitting (source) drivers, power (VDD) routing, electrostatic discharge (ESD) circuits, multiplex (MUX) circuits, data signal lines, cathode contacts, and other functional elements. includes them. A number of peripheral circuits may be included in the display assembly to provide various types of additional functions, for example, touch sensing or fingerprint identification functions. Some components may be placed on the display panel itself, or on surrounding areas next to the display area, often referred to in this disclosure as an inactive area and/or non-active area. It may be possible.

Size and weight are important issues when designing the latest display devices. Additionally, a high ratio of the size of the display area to the size of the non-display area, sometimes referred to as the screen-to-bezel ratio, is one of the most important characteristics. However, placing some of the above-described components within a display assembly may require a large non-display area, which may add up to a significant portion of the display panel. The large non-display area tends to cause the display panel to be large, which makes it difficult to integrate the display panel into the housing of electronic devices. The large non-display area may also require large masking (e.g., bezel, border, covering material) to cover a significant portion of the display panel, making the device aesthetically unappealing.

Some components may be placed on a separate flexible printed circuit board and located on the backplane of the display panel. However, even with this configuration, components essential for panel operation, such as driver ICs and interfaces for connecting wires between the printed circuit film (FPC) and the active area, are still placed in the inactive area, limiting the amount of bezel size reduction. .

The purpose of the present invention is to provide a flexible display device capable of detecting a user's touch and applied pressure.

Another object of the present invention is to provide a flexible display device that has a touch sensing unit but has a thin thickness.

Another object of the present invention is to provide a flexible display device comprising a touch sensing unit at the bottom of the display unit.

A flexible display device for achieving these purposes includes an active area and an inactive area, wherein the inactive area includes a first area adjacent to the active area, a second area where a circuit board is disposed, and the first area and the a flexible substrate including a bending region located between second regions; a first support layer and a second support layer disposed on a lower surface of the first area and a lower surface of the second area, respectively; an elastic body disposed between the first support layer and the second support layer; a first conductive film disposed between the first support layer and the elastic body; a second conductive film disposed between the second support layer and the elastic body; and a wiring connected to any one of the first conductive film and the second conductive film to transmit the capacitance between the first conductive film and the second conductive film to an external device.

In the flexible display device according to the present invention, the first support layer and the second support layer may be made of synthetic resin (polyethylene terephthalate: PET).

In the flexible display device according to the present invention, the first conductive film and the second conductive film may be a transparent conductive film (Indium Tim Oxide).

In the flexible display device according to the present invention, the wiring is preferably connected to the first conductive film.

In the flexible display device according to the present invention, the first support layer and the second support layer may be formed to have different areas.

In the flexible display device according to the present invention, the first conductive film and the second conductive film may be formed to have different areas.

In the flexible display device according to the present invention, the elastic body may be formed in form PS (polymer sustained) or form PSA (polymer sustained alignment).

The flexible display device according to a preferred embodiment of the present invention is an organic light emitting diode display device.

The flexible display device according to the present invention can exhibit the following effects.

First, a flexible display device with a touch sensing function can be manufactured at a low cost.

Second, the thickness can be made thin by constructing a touch sensing unit at the bottom of the display unit.

1 is a diagram showing a plan view of a display panel according to a flexible display device according to the present invention.
FIG. 2 is an enlarged plan view of the dotted area II of FIG. 1, showing the arrangement of components around the notch area.
FIG. 3 is a cross-sectional view taken along the cutting line II' of FIG. 1 and shows a structure in which the flexible substrate of FIG. 1 is bent and folded.
FIGS. 4A and 4B are diagrams illustrating a method for detecting a pressure touch according to an embodiment.
Figure 5 is a schematic diagram showing the arrangement of a support layer, a conductive film, and wiring in a flexible display device according to the present invention.

With respect to the embodiments of the present invention disclosed in the text, specific structural and functional descriptions are merely illustrative for the purpose of explaining the embodiments of the present invention, and the embodiments of the present invention may be implemented in various forms and are not included in the text. It should not be construed as limited to the described embodiments.

Since the present invention can be subject to various changes and can have various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.

Terms such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, the second component may be referred to as a first component without departing from the scope of the present invention.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when a component is referred to as being “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Other expressions that describe the relationship between components, such as "between" and "immediately between" or "neighboring" and "directly adjacent to" should be interpreted similarly.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprises” or “has” are intended to designate the presence of a disclosed feature, number, step, operation, component, part, or combination thereof, and are intended to indicate the presence of one or more other features or numbers, It should be understood that this does not exclude in advance the possibility of the presence or addition of steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as indicating meanings consistent with the meanings they have in the context of the related technology, and unless clearly defined in the present application, should not be interpreted in an idealized or excessively formal sense. No.

Meanwhile, if an embodiment can be implemented differently, functions or operations specified within a specific block may occur differently from the order specified in the flowchart. For example, two consecutive blocks may actually be performed substantially simultaneously, or the blocks may be performed in reverse depending on the functions or operations involved.

In the present invention, “display device” refers to a liquid crystal module (LCM), an organic light emitting module (OLED module), and a quantum dot module (Quantum Dot Module) including a display panel and a driver for driving the display panel. It may include a display device. And, electronic devices including laptop computers, televisions, computer monitors, automotive displays, or other types of vehicles that are complete products or final products including LCM, OLED, and QD modules. It may also include a set electronic device or set apparatus, such as an equipment display, a mobile electronic device such as a smartphone, or an electronic pad.

Therefore, the display device in the present invention may include the display device itself in a narrow sense, such as an LCM, OLED, QD module, etc., and a set device that is an application product or end-consumer device including an LCM, OLED, QD module, etc.

In some cases, the LCM, OLED, and QD modules composed of the display panel and driving unit are expressed as a "display device" in the narrow sense, and the electronic device as a finished product including the LCM, OLED, and QD modules is referred to as a "set device." It can also be expressed separately. For example, a display device in the narrow sense includes a display panel of liquid crystal (LCD), organic light emitting (OLED), or quantum dot (Quantum Dot), and a source PCB, which is a control unit for driving the display panel, and the set device is connected to the source PCB. It may be a concept that further includes a set PCB, which is a set control unit that is electrically connected and controls the entire set device.

The display panel used in this embodiment is of all types, such as a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot display panel (QD), and an electroluminescent display panel. A display panel can be used, and is not limited to a specific display panel that can bend the bezel with the flexible substrate for the organic electroluminescent (OLED) display panel and the lower backplane support structure of this embodiment. Also, the display panel used in the display device according to the embodiment of the present invention is not limited to the shape or size of the display panel.

More specifically, when the display panel is an organic electroluminescence (OLED) display panel, it may include a plurality of gate lines, data lines, and pixels formed in intersection areas of the gate lines and data lines. And, an array including a thin film transistor, which is a device for selectively applying voltage to each pixel, an organic light emitting device (OLED) layer on the array, and an encapsulation substrate or encapsulation layer disposed on the array to cover the organic light emitting device layer. It may be configured to include (encapsulation), etc. The encapsulation layer protects the thin film transistor and the organic light emitting device layer from external shocks, and can prevent moisture or oxygen from penetrating into the organic light emitting device layer. Additionally, the layer formed on the array may include an inorganic light emitting layer, for example, a nano-sized material layer or quantum dots.

Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings. 1 is a plan view of a display panel according to a flexible display device according to the present invention. FIG. 2 is an enlarged plan view of the dotted line area II of FIG. 1, showing the arrangement of components around the notch area. FIG. 3 is a cross-sectional view taken along the cutting line II' of FIG. 1 and shows a structure in which the flexible substrate of FIG. 1 is bent and folded. FIGS. 4A and 4B are diagrams illustrating a method for detecting a pressure touch according to an embodiment. Figure 5 is a schematic diagram showing the arrangement of a support layer, a conductive film, and wiring in a flexible display device according to the present invention.

Referring to FIG. 1, the display panel 100 includes at least one active area 101 in which light emitting elements 112 and an array 111 are formed.

The display panel 100 may include an inactive area disposed at the periphery of the active area 101, of which the top, bottom, left and right sides of the active area 101 are a first inactive area 102 and a bending area 103. The opposite side can be referred to as the second inactive area 104. The active area 101 may have a rectangular shape, but is not limited to this, and various display devices such as circular, oval, or polygonal shapes may be applied to smart watches or automobile display devices. Therefore, the arrangement of the first inactive area 102 and the second inactive area 104 surrounding the active area 101 is limited to the organic electroluminescence (OLED) display panel 100 shown in FIG. no. Referring to the organic electroluminescence (OLED) display panel 100 shown in FIG. 1, the first inactive area 102 adjacent to the active area 101 includes light emitting elements 112 formed in the active area 101 and Various components for driving the arrays 111 may be located to provide a function for light emission. For example, circuits such as GIP (Gate In Panel, 123) and ESD (Electrostatic Discharge, 124), the cathode, which is part of the light emitting device, and the low potential voltage (VSS) wiring 122, which is the voltage reference point of the light emitting device. ) An encapsulation layer may be disposed to protect the light emitting device 112 from external moisture penetration or foreign substances. Multiple dam structures to prevent overflow to the outside of the display panel 100 during the application process of the foreign matter compensation layer among the encapsulation layers, and a scribing process to divide the mother substrate into individual display panels 100. ), a crack stopper structure (126), etc. may be disposed to prevent cracks that may occur during the process from being transmitted to the inside of the display panel (100). An area in the first inactive area 102 where components are placed may be referred to as a first component forming unit. The first component forming portion may be disposed along the long axis of the active area 101 and may be bent to have an inclined surface.

The crack prevention structure 126 of the present invention is designed so that the shock generated from the trimming line of the substrate 110 during the cutting process is not affected by the GIP 123 or ESD 124 formed in the first inactive area 102 or the low potential. It may reach and destroy the voltage (VSS) wiring 122 or, furthermore, provide a moisture permeable path to the light emitting element 112 or array 111 formed in the active area 101, causing dark spots to grow or pixel shrinkage. Shrinkage can be prevented from occurring.

The crack prevention structure 126 may be composed of an inorganic film or an organic film, and may be formed in a multi-layer structure of an inorganic film/organic film, but is not limited thereto. In Figure 1, the crack prevention structure 126 is disclosed as being disposed only on both long sides and one short side of the display panel 100, but it is not limited thereto. For example, the crack prevention structure 126 may also be disposed in the area where the bending area 103 and the notch 151 are formed and may be placed on the entire perimeter of the substrate 110.

In the area adjacent to the cut surface of the substrate 110 outside the crack prevention structure 126, part or all of the insulating films (GI, buffer layer, etc.) deposited on the entire surface when forming the active area are etched to form a substrate ( 110), a small amount of the insulating film may remain on the top or the upper surface of the substrate may be completely exposed so that the cutting shock is not transmitted to the insulating film.

Referring to FIG. 1, various components for driving the light emitting elements 112 and arrays 111 formed in the active area 101 are located in the second inactive area 104 to provide a function for stable light emission. You can. For example, a circuit board 136 electrically connected to a pad 135 formed to receive an external power source and a data driving signal or to exchange a touch signal is disposed, and a high potential voltage (VDD) extending from the circuit board 136 is provided. A power wiring 121, a low potential voltage (VSS) wiring 122, and/or a data voltage wiring 127 may be disposed.

The data voltage wire 127 of the present invention may be connected and disposed toward the data driver IC 137 that generates the light emitting signal of the light emitting device 112.

The area where the previously described pad 135 and data driver IC 137 are placed in the second inactive area may be referred to as the second component forming part. A portion of the high-potential voltage wiring 121 and the low-potential voltage wiring 122 may be disposed in the second component forming portion.

Referring to FIG. 1, the display panel 100 according to an embodiment of the present invention has a notch formed by cutting the lower edge of the display panel 100 for bending the bending area 103, as indicated by a dotted line. , 151) can be placed.

For example, when performing a cutting process to divide the mother substrate into individual panels, the display panel 100, which is part of the first inactive area 102, is cut to the inside of the first inactive area 102 near both lower edge areas. Thus, the notch 151 can be formed so that the cut surface is adjacent to the high potential voltage (VDD) wiring 121 or the low potential voltage (VSS) wiring 122.

The notch 151 of the present invention starts at one end of the flexible substrate 110, allows a bending process near the area, and ends the bending near the data driver IC 137, thereby forming the driver IC. The area of the flexible substrate where 137 and the circuit board pad 135 are located may be in contact with the rear side of the flexible substrate where the active area is formed.

The member connected to the pad 135 formed on the upper surface of the display panel 100 is not limited to the circuit board 136, and various members can be connected, and the position of the pad 135 is on the upper or rear surface of the display panel 100. It is also possible to place it.

The data driver IC 137 illustrated in FIG. 1 is illustrated as being placed on the top of the display panel, but is not limited to the data driver IC 137, and its location is not limited to the top of the display panel 100 and can be placed on the back. there is.

Figure 2 is an enlarged view of II of Figure 1. Referring to FIG. 2, it is an enlarged view of the area where the notch 151 is formed, and the components of the bending area 103, the first inactive area 102, and the second inactive area 104 are removed before the bending process. It has been initiated.

The notch 151 includes an active area 101, a first inactive area 102 arranged to surround the active area 101, and a second inactive area 104 formed beyond the bending area 103. In the panel 100, two corners of the flexible substrate 110 overlapping the first inactive region 102, bending region 103, and second inactive region 104 are cut inward to form a substrate cutting line as shown in FIG. 2. can be formed. For slim bezels or narrow bezels, the smaller the area of the substrate that is bent during the bending process, the less stress the substrate receives during bending, which can further improve fairness. Additionally, in order to prevent the propagation of cracks that may occur during the cutting process, a crack prevention structure 126 may be formed inside the substrate along the cutting surface. As shown in FIG. 2, the cut surface of the substrate can have rounded edges to improve fairness and durability.

The GIP 123 and the ESD 124 may be placed on the side of the active area 101 and may be placed along the outer edge of the low-potential voltage wire 122 for grounding. The gate signal or low-potential voltage and high-potential voltage are external power inputs from the pad 135 disposed in the second inactive region 104 through the high-potential voltage line 121, the data line 127, and the gate power line 125. ) may pass through the bending area 103 and enter the first inactive area 102. The data signal can be converted into a data signal by the driver IC 137 when the power input from the pad of the second inactive area passes through the bending area 103 and enters the active area 101 by extending the data line 127. . As these various wires pass through the bending area 103, most of the wires are exposed to tensile and contraction stress during the bending process, and the stress may be concentrated at a specific point, causing damage to the wire. This may cause a defect in which the display panel 100 does not operate properly. Therefore, it may be important to prevent stress from concentrating on a specific part of the flexible substrate 110 in order to protect the wires in the bending area 103.

FIG. 3 is a cross-sectional view taken along line II' of FIG. 1. For example, this is a cross-sectional view showing an exemplary stacked structure of the display panel 100. For convenience of illustration, in FIG. 3, the TFT array 111 and the light emitting device 112 formed on the flexible substrate 110 are displayed flat, and the encapsulation layer 113 is a three-layer film of inorganic film/organic film/inorganic film. It can be composed of a structure, and is not limited to a three-layer film, but a five-layer film structure or a multi-layer structure of five or more layers can also be possible, and in this drawing, it is shown as one layer.

The encapsulation layer 113 of the present invention includes the entire active area 101 and a first inactive area 102 surrounding the active area 101 to protect the vulnerable light emitting device 112 from external moisture or dust. It can be extended and deployed up to.

The encapsulation layer 113 of the present invention may be composed of a three-layer structure of inorganic film/organic film/inorganic film, and the inorganic film may be composed of Si-based SiNx, SiOx, and SiON.

The organic film applied to the encapsulation layer 113 may be referred to as a particle capping layer (PCL), and may be formed of a material such as epoxy resin, a type of polymer, and is limited to this. It doesn't work. Additionally, in the case of an inorganic film, an inorganic material composed of multiple layers of SiNx/SiON, rather than a single layer, may be used. Each inorganic film may be formed to a thickness of approximately 0.5 to 1㎛, and in the case of an organic film, it may be formed to a thickness of approximately 7 to 20㎛, but the thickness of the inorganic and organic films is not limited thereto.

A polarizing layer 114 is formed on the top of the encapsulation layer 113, an adhesive layer 141 and a decor film 142 may be disposed on the polarizing layer 114, and a cover window 143 is formed on the outside. It can be attached to protect the display panel 100 from the external environment.

The deco film (Deco Film 142) of the present specification is located on the upper part of the display panel 100 and blocks the first inactive area 102 outside the active area 101 from the user's view, thereby forming the first inactive area 102. Since the components are protected from external light sources and the user can only see the active area 101, aesthetics can be improved.

A first support layer 131 may be disposed on the lower or rear surface of the flexible substrate 110. The first support layer 131 may have a thickness of, for example, 100 μm to 125 μm, 50 μm to 150 μm, 75 μm to 200 μm, less than 150 μm, or greater than 100 μm, but is not limited to this thickness. The first support layer 131 may be made of, for example, polyethylene terephthalate (PET), but is not limited thereto.

A layer made of metal may be added to the lower part of the first support layer 131. Placing an additional metal layer may cause noise from the battery or semiconductor chips of the module to which the display panel 100 is attached, and such noise may cause the display panel 100 to Electromagnetic interference (EMI) may occur. Electromagnetic interference may cause malfunctions in the thin film transistor or organic light emitting device (OLED) of the TFT array 111 or abnormalities in the display screen. To prevent this, it is possible to have the effect of blocking electromagnetic interference (EMI) by disposing a metal layer with a thickness of about 0.1 mm. Alternatively, by disposing an additional metal layer, it is possible to have a heat dissipation effect that disperses heat generated from the light source of the display panel 100 and a rigidity effect that can more firmly support the flexible substrate 110.

A circuit board 136 and a pad portion 135 therefor may be formed on one end of the flexible substrate 110. When the bending process is performed, the pad portion 135 and the attached circuit board 136 are placed behind the screen of the active area 101, so that the size of the display panel 100 can be relatively small.

The circuit board 136, which is formed on the upper surface of the flexible substrate 110 but is bent and electrically connected to the driver IC 137 and the pad 135 and the pad 135, may be disposed on the opposite side of the active area 101.

For the same reason that the first support layer 131 is disposed in the active area 101 and the first inactive area 102 to support the flexible substrate 110, a second support layer 131 is also placed under the second inactive area 104. A support layer 132 may be disposed. The arrangement of the second support layer 132 can ensure process stability when attaching the circuit board 136 connected to the driver IC 137 and the pad 135 formed on the upper surface of the second inactive area 104. .

The first support layer 131 and the second support layer 132 may be made of synthetic resin (polyethylene terephthalate: PET). The first support layer 131 and the second support layer 132 may have the same area or length, or may have different lengths or areas.

An elastic body 134 may be disposed between the first support layer 131 and the second support layer 132. That is, an elastic body 134 that is pressed by external pressure and can provide restoring force when the external pressure is released can be formed between the first support layer 131 and the second support layer 132 facing each other. The elastic body 134 may be made of PS (polymer sustained) or PSA (polymer sustained alignment).

A first conductive film 301 is disposed between the first support layer 131 and the elastic body 134, and a second conductive film 302 is disposed between the second support layer 132 and the elastic body 134. This is placed. The first conductive film 301 and the second conductive film 302 may be made of a transparent conductive film (Indium Tim Oxide). The first conductive film 301 and the second conductive film 302 may have the same area or length, or may have different lengths or areas.

FIGS. 4A and 4B are diagrams illustrating a method for detecting a pressure touch according to an embodiment. As shown in FIGS. 4A and 4B, when a user makes a touch input, pressure transmitted through the cover class and the first support layer 131 is transmitted to the first conductive film 301. The distance d1 between the first conductive film 301 and the corresponding second conductive film 302 at the position where pressure is applied and the touch is input is reduced to the distance d2 of the touch area due to the touch. Accordingly, the effective capacitance between the first conductive film 301 and the second conductive film 302 increases, and a touch by pressure is recognized. At this time, the amount of change in the detected touch sensing signal is compared with a predetermined touch recognition threshold. If the measured change in capacitance is less than the touch recognition threshold, it is determined that no touch input has occurred. If the measured change in capacitance is greater than or equal to the touch recognition threshold, it is determined that a touch input has occurred. Depending on the embodiment, the location of the touch input may be determined and then the intensity of the touch input pressure may be measured. That is, the touch input intensity may be calculated using [Equation 1] and [Equation 2] depending on the size or size of the measured change in the touch sensing signal.

[Equation 1]

[Equation 2]

At this time, C represents the capacitance, Q is the amount of charge, V is the voltage, ε is the dielectric constant between parallel plates, A is the area of the parallel plates, and d is the gap between the parallel plates. Therefore, it can be seen that the case of Figure 4b was pressed with a greater intensity of pressure than the case of Figure 4a.

Figure 5 is a schematic diagram showing the arrangement of a support layer, a conductive film, and wiring in a flexible display device according to the present invention. As shown, a wiring 400 may be disposed to transmit the capacitance between the first conductive film 301 and the second conductive film 302 to an external device. At this time, it may be connected to either the first conductive film 301 or the second conductive film 302, but considering the ease of connection of the wiring 400, the first conductive film 301 on the first support layer 131 side ), it would be desirable to connect to . The signal transmitted through the wiring 400 may be provided to the circuit board 136.

As described above, touch detection can be performed by placing a conductive film between the first support layer and the elastic body and between the second support layer and the elastic body, and measuring the amount of change in capacitance between the two conductive films.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the following patent claims. You will understand that you can do it.

100: display panel
101: active area 102: first inactive area
103: bending area 104: second inactive area
110: substrate 111: TFT array
112: light emitting device 113: encapsulation layer
114: Polarizing layer 121: High potential voltage wiring
122: Low potential voltage wiring 123: GIP
124: ESD 125: Gate power line
126: Crack prevention structure 127: Data wiring
131: first support layer 132: second support layer
134: elastic body 135: pad
136: circuit board 137: driver IC
141: Adhesive layer 142: Eco film
143: Cover Window 151: Notch

Claims (11)

It includes an active area and an inactive area, wherein the inactive area includes a first area adjacent to the active area and surrounding the active area, a second area in which a circuit board is disposed and spaced apart from the first area, and the first area. A flexible substrate including a bending area located between the first area and the second area and connecting the first area and the second area;
a first support layer and a second support layer disposed on a lower surface of the first area and a lower surface of the second area, respectively;
an elastic body disposed between the first support layer and the second support layer;
a first conductive film disposed between the first support layer and the elastic body;
a second conductive film disposed between the second support layer and the elastic body;
A wiring connected to one of the first conductive film and the second conductive film to transmit a change in capacitance between the first conductive film and the second conductive film to an external device,
The flexible substrate is,
a crack prevention structure extending along an edge of the flexible substrate from the first area to the bending area and the second area;
a GIP circuit disposed in the first area adjacent to one side of the active area;
a low-potential voltage line extending between the GIP circuit and the crack prevention structure along the crack prevention structure in the first region, the bending region, and the second region;
a high-potential voltage line having a stem portion disposed in the first region adjacent to a lower side of the active region and a branch portion extending from the stem portion through the bending region to the second region;
a data line extending from a lower side of the active area, intersecting the stem and the branch in the first area, and extending to the bending area and the second area;
an ESD circuit located between the low-potential voltage wiring and the GIP circuit below the GIP circuit in the first area;
It extends from the GIP circuit to the bending area and the second area, overlaps a part of the ESD circuit in the first area and intersects the low-potential voltage wiring, and includes a partial area of the first area, the bending area, and The flexible display device further includes a gate power line disposed between the crack prevention structure and the low-potential voltage line in the second region. The flexible display device of claim 1, wherein the first support layer and the second support layer are made of synthetic resin (polyethylene terephthalate: PET). The flexible display device of claim 1, wherein the first conductive film and the second conductive film are transparent conductive films (Indium Tim Oxide). The flexible display device of claim 1, wherein the wiring is connected to the first conductive film. The flexible display device according to claim 1, wherein the first support layer and the second support layer are formed to have different areas. The flexible display device according to claim 1, wherein the first conductive film and the second conductive film are formed to have different areas. The flexible display device according to claim 1, wherein the elastic body is made of PS (polymer sustained) or PSA (polymer sustained alignment). The flexible display device of claim 1, wherein the active area includes an array of thin film transistors and organic light emitting diode elements. delete The flexible display device of claim 1, wherein the second area includes at least one driver integrated circuit (IC).
delete