KR102664089B1 - Ceramic Waveguide Duplexer - Google Patents

Abstract

The present invention provides a plurality of resonance cavities defined as partitions divided by a plurality of penetrating partitions formed by penetrating one side and the other side of a single ceramic block according to a predetermined pattern, and a common antenna among the plurality of resonance cavities and a common resonance for inputting and outputting signals. A common interface is formed as a hole structure penetrating the ceramic block within the cavity, and is formed as a step hole structure in which the hole diameter on the other side of the ceramic block is smaller than the hole diameter on one side of the ceramic block, and the step hole is formed on the outer surface of the ceramic block. At the common interface of the structure, a metal layer is excluded in a ring shape in the step area parallel to one side of the ceramic block to form an internal ring slot, allowing input and output of the wideband signal required by the duplexer and reducing the risk of damage. A waveguide duplexer is provided.

Description

Ceramic Waveguide Duplexer

The present invention relates to a ceramic waveguide duplexer, and to a ceramic waveguide duplexer having an input/output port of a common hole resonator structure.

As communication services evolve, data transmission speeds increase, and for this to happen, system bandwidth must also increase, and it is necessary to improve reception sensitivity and minimize interference caused by carriers of other communication systems. To this end, we face a situation where the requirements for low insertion loss, high rejection, and filters are increasing day by day. Coaxial resonant cavities manufactured using metal materials have advantages in terms of loss, size, and price compared to other resonant cavities such as dielectric resonant cavities, so they are mainly used to implement filters in mobile communication systems.

However, due to the low output and miniaturization of base station systems such as massive MIMO antennas, there are limitations in size even when using existing coaxial resonance cavities, and the need to implement ultra-small filters is emerging. For this reason, research on ceramic waveguide filters is being actively conducted as a filter to replace existing filters using coaxial resonance cavities. A ceramic waveguide filter is a filter that fills the cavity with a ceramic material with low loss and high dielectric constant, and can significantly reduce the size compared to existing coaxial resonance cavity filters and also provide excellent loss characteristics. A typical conventional ceramic waveguide filter requires a process of manufacturing each ceramic cavity independently, forming a partition, and then combining each cavity. The joining of cavities is accomplished through soldering, etc.

However, the cavity joining process has the problem that misalignment tolerances frequently occur during the joining process, which causes changes in characteristics and significantly lowers the yield of the product. Additionally, if the characteristics change due to processing errors, a tuning process is required by grinding one side of the ceramic. However, since ceramic is a very hard material, it requires advanced technology and fine tuning is difficult. In addition, when trying to provide transmission-zero to improve the attenuation characteristics of a ceramic waveguide filter, cross coupling is mainly used, but cross coupling between cavities that are not adjacent to each other is used. There was a problem that additional work was required to implement the ring.

To solve this problem, an integrated ceramic wave is created that penetrates the sections of a single ceramic block between one side and the other side according to a predetermined pattern and includes a plurality of resonant cavities defined by a plurality of penetrating partitions that separate the sections of the ceramic block. Guided filters have been proposed.

Figure 1 shows an example of a conventional integrated ceramic waveguide filter, and Figure 2 shows a cross-sectional view of the input/output port of the ceramic waveguide filter of Figure 1.

Figure 1 is a lower perspective view of an integrated ceramic waveguide filter. Referring to Figure 1, the integrated ceramic waveguide filter includes a plurality of penetrating partitions ( It is implemented in an integrated form including a plurality of resonance cavities 111 to 116 defined by 121 and 122). The plurality of penetrating partition walls 121 and 122 function as cavity walls that separate the plurality of resonance cavities 111 to 116, and a plurality of penetrating partition walls 121 and 122 are formed to be spaced apart from each other. The space between forms a coupling surface between the plurality of resonance cavities 111 to 116 and functions as a coupling window. Additionally, resonance grooves 111 to 116 may be formed in each of the plurality of resonance cavities 111 to 116 on one surface of the ceramic block 100 to lower the resonance frequency.

Meanwhile, as shown in FIG. 2, among the plurality of resonance cavities 111 to 116 of the ceramic waveguide filter, two resonance cavities 111 and 116 are provided as input/output ports for inputting and outputting signals to the ceramic waveguide filter. Interface grooves 141 and 142 are formed. The interface grooves 141 and 142 may be formed on the other surface of the ceramic block 100 at the positions of the corresponding resonance grooves 131 and 136, respectively. In this way, when the interface grooves 141 and 142 are formed to face the corresponding resonance grooves 131 and 136 in the ceramic block 100, the interface grooves 141 and 142 and the corresponding resonance grooves 131 and 136 are Signals are transmitted through capacitive coupling.

And in the ceramic wave guide filter formed as an integrated piece, a metal layer 160 is formed on the entire outer surface of the single ceramic block 100. Here, the metal layer 160 is formed inside the plurality of penetrating partitions 121 and 122, the plurality of resonance grooves 111 to 116, and the interface grooves 141 and 142. However, as shown in FIG. 2, a ring slot 151, which is an area where the metal layer 160 is removed, is formed around the interface grooves 141 and 142, and the metal layer 161 formed inside the interface grooves 141 and 142 ) and the external metal layer 160 are spaced apart from each other. That is, the ring slot 151 separates the metal layer 161 formed inside the interface grooves 141 and 142 from the external metal layer 160 so that they are isolated from each other. This is so that an input/output signal is applied to the metal layer 161 formed inside the interface grooves 141 and 142, and a ground voltage is applied to the metal layer 160 formed outside the interface grooves 141 and 142.

Such a ceramic waveguide filter is developed and used as a Band Pass Filter (BPF) for a single band for TDD (Time Division Duplex) massive MIMO devices. However, recently, demand for FDD (Frequency Division Duplex) or dual-band TDD applications is increasing. Therefore, there is a growing demand for an integrated ceramic waveguide duplexer that can be applied to FDD or dual-band TDD by replacing the filter used in TDD.

Korea Registered Patent No. 10-2241217 (registered on April 12, 2021)

The purpose of the present invention is to provide an integrated ceramic waveguide duplexer that can be manufactured in a small size using a common resonator having a stepped hole that can input and output the wideband signal required for the duplexer.

A ceramic waveguide duplexer according to an embodiment of the present invention for achieving the above object has a plurality of resonances defined as partitions divided by a plurality of penetrating partitions formed through one side and the other side of a single ceramic block according to a predetermined pattern. cavity; Among the plurality of resonant cavities, a step hole structure is formed with a hole structure penetrating the ceramic block within a section of the common resonant cavity that inputs and outputs signals with a common antenna, and has a hole diameter on the other side of the ceramic block that is smaller than the hole diameter on one side of the ceramic block. A common interface formed by; and a metal layer formed on the outer surface of the ceramic block and having an inner ring slot formed in a ring shape excluded from the common interface of the step hole structure in a step area parallel to one surface of the ceramic block.

The common interface may be formed in the shape of a hole with a multi-step structure whose diameter is repeatedly decreased step by step from one side of the ceramic block.

The width of the inner ring slot can be adjusted depending on the bandwidth of the signal input and output to the common antenna.

A ring slot may be formed in the metal layer in a ring shape with an inner circle spaced apart at a predetermined distance around the hole of the common interface on the other side of the ceramic block.

The plurality of resonance cavities may be formed in a structure that is symmetrical on both sides of the ceramic block by the plurality of penetrating partition walls, and the common resonance cavity may be located on a central axis of the ceramic block that is symmetrical on both sides.

Among the plurality of resonance cavities, a predetermined transmission resonance cavity band-pass filters the applied transmission signal to an adjacent resonance cavity using a capacitive coupling method and transmits the applied transmission signal to the common resonance cavity, and the common resonance cavity transmits the applied reception signal to the common resonance cavity. It can be band-pass filtered using capacitive coupling to an adjacent resonant cavity and then transmitted to a predetermined receiving resonant cavity.

The ceramic waveguide duplexer penetrates the ceramic block within each section of the transmission resonance cavity and the reception resonance cavity, and has a step hole structure in which the diameter on the other side of the ceramic block is smaller than the diameter on one side of the ceramic block, and has a step hole structure. The step area parallel to one surface of the ceramic block may further include a transmission interface and a reception interface in which an inner ring slot is formed excluding the metal layer in a ring shape.

The ceramic waveguide duplexer is formed in a groove shape at each position of the transmission resonance cavity and the reception resonance cavity on the other surface of the ceramic block, and a ring slot in which the metal layer formed on the other surface of the ceramic block is removed in a ring shape around the groove. It may further include a transmission interface and a reception interface having metal layers formed to be spaced apart from each other.

The ceramic waveguide duplexer may be formed in a groove shape at a position of at least one predetermined resonance cavity among the plurality of resonance cavities on one surface of the ceramic block, and may further include at least one resonance groove in which the metal layer is formed to the inside. You can.

The ceramic waveguide duplexer is formed through the ceramic block between at least two adjacent resonance cavities among the plurality of resonance cavities, and has a stepped hole structure in which the hole diameter on the other side of the ceramic block is smaller than the hole diameter on one side of the ceramic block. The inner surface may further include at least one coupling hole in which the metal layer is formed.

Therefore, the ceramic waveguide duplexer according to an embodiment of the present invention uses a common resonance cavity having an interface formed in the form of a hole with a step structure capable of inputting and outputting the wideband signal required by the duplexer, thereby reducing the risk of damage to the ceramic block and providing a wideband signal. It can operate stably and can be manufactured in a small size.

Figure 1 shows an example of a conventional integrated ceramic waveguide filter.
FIG. 2 shows a cross-sectional view of the input/output port of the ceramic waveguide filter of FIG. 1.
Figure 3 shows a top perspective view of an integrated ceramic waveguide duplexer according to an embodiment of the present invention.
Figure 4 shows a top view of the integrated ceramic waveguide duplexer of Figure 3.
Figure 5 shows a side cross-sectional view of the integrated ceramic waveguide duplexer of Figure 3.
FIG. 6 shows a cross-sectional side view of the interface hole of the common hole resonator structure of FIG. 3.
FIG. 7 is a diagram for explaining the bandwidth of signals input and output from the interface hall of FIG. 6.
Figure 8 shows a top perspective view of an integrated ceramic waveguide duplexer according to another embodiment of the present invention.
Figure 9 shows a top view of the integrated ceramic waveguide duplexer of Figure 8.
Figure 10 shows a side cross-sectional view of the integrated ceramic waveguide duplexer of Figure 8.
FIG. 11 shows an example of an interface board that inputs and outputs signals to the integrated ceramic waveguide duplexer of FIG. 8.
FIG. 12 shows a top view of the interface substrate of FIG. 11.
Figure 13 shows a side cross-sectional view of the interface substrate of Figure 11.
FIG. 14 shows a structure in which the integrated ceramic waveguide duplexer of FIG. 8 and the interface substrate of FIG. 11 are combined.

In order to fully understand the present invention, its operational advantages, and the objectives achieved by practicing the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the described embodiments. In order to clearly explain the present invention, parts not relevant to the description are omitted, and like reference numerals in the drawings indicate like members.

Throughout the specification, when a part "includes" a certain element, this does not mean excluding other elements, unless specifically stated to the contrary, but rather means that it may further include other elements. In addition, terms such as "... unit", "... unit", "module", and "block" used in the specification refer to a unit that processes at least one function or operation, which is hardware, software, or hardware. and software.

Figure 3 shows a top perspective view of the integrated ceramic waveguide duplexer according to an embodiment of the present invention, Figure 4 shows a top view of the integrated ceramic waveguide duplexer of Figure 3, and Figure 5 shows the integrated ceramic waveguide duplexer of Figure 3 Shows a side cross-sectional view. And FIG. 6 shows a side cross-sectional view of the interface hole of the common hole resonator structure of FIG. 3, and FIG. 7 is a diagram for explaining the bandwidth of a signal input and output from the interface hole of FIG. 6.

Referring to FIGS. 3 to 5, the integrated ceramic waveguide duplexer of this embodiment is also formed by penetrating between one surface and the other surface of the single ceramic block 200 in a predetermined pattern similar to the integrated ceramic waveguide filter shown in FIG. 1. It is implemented as an integrated unit including a plurality of resonance cavities (211 to 215) defined by a plurality of penetrating partition walls (221, 222).

Here, the ceramic block 100 is divided into five compartments by two through partitions 221 and 222 formed in a T shape on both sides of the ceramic block 200, penetrating the ceramic block 200. Therefore, five resonant cavities (211 to 215) were defined. Among the two T-shaped through partitions 221 and 222, the first through partition 221 separates the first to third resonance cavities 211 to 213 in the ceramic block 200, and the second through partition 222 ) distinguishes the first resonance cavity 211 and the fourth and fifth resonance cavities 214 and 215 from each other.

Here, as an example, a case where the through partitions 221 and 222 are formed to penetrate the ceramic block 200 in a T-shape is shown, but the plurality of through partitions 221 and 222 may be formed in a straight line spaced apart from each other. In addition to the T shape, it can also be formed in various branching pattern shapes such as a Y shape or a + shape. At this time, not only are the through partitions 221 and 222 spaced apart from each other, but they are not formed to the side boundary of the ceramic block 200, so the plurality of resonance cavities 211 to 215 are not completely separated by the through partition walls. Therefore, among the plurality of resonance cavities 211 to 215 separated by the through partitions 221 and 222, coupling may be achieved between adjacent resonance cavities through a region where the through partitions 221 and 222 are not formed. Accordingly, the penetrating partition walls 221 and 222 not only define the resonance cavities 211 to 215 by simply dividing the ceramic block 200, but also enable signals to be transmitted by coupling between the resonance cavities 211 to 215. Forms a signal transduction pathway.

The duplexer performs the operation of separating the transmission signal (TX) and the reception signal (RX) according to frequency in order to transmit and receive signals using a common antenna. Accordingly, in the duplexer according to the present embodiment shown in FIGS. 3 to 5, the first to fifth resonance cavities 211 to 215 separated by the through partitions 221 and 222 are left and right symmetrical on both sides of the ceramic block 200. It can be formed in a structure, and the first resonance cavity 211 located at the center transmits the transmission signal (TX) to the common antenna through the common interface 270, and the common antenna to which the reception signal (RX) is applied from the common antenna. It is a common resonant cavity used as a path and can be called a common resonator. However, it is obvious to those skilled in the art that the present invention is not limited to bilaterally symmetrical ceramic blocks. And here, the third and second resonance cavities 213 and 212 located on one side of the first resonance cavity 211 sequentially transmit the transmission signal TX transmitted from the transmitter (not shown) to the first resonance cavity 211. Assuming that it forms a transmission path that transmits to It is assumed that a reception path is formed that sequentially transmits RX) to a receiver (not shown).

Here, the first to third resonance cavities 211 to 213 function as a band pass filter (BPF) corresponding to the frequency band of the transmission signal (TX), preventing the reception signal (RX) from being transmitted to the transmitter. In addition, the first, fourth, and fifth resonance cavities 211, 214, and 215 function as BPFs corresponding to the frequency band of the reception signal RX to prevent the transmission signal TX from being transmitted to the receiver.

However, since the two through partitions 221 and 222 do not completely separate the third resonance cavity 213 and the fifth resonance cavity 215 adjacent to the first resonance cavity 211, the first resonance cavity 211 is While coupling is performed with the second and fourth resonance cavities (212, 214), cross-coupling is also performed with the third and fifth resonance cavities (213, 215). Such cross-coupling can improve the attenuation characteristics of the ceramic waveguide duplexer by generating transmission-zero at a frequency lower than the pass band.

In addition, resonance grooves 231 and 232 may be formed in at least one resonance cavity (here, the third and fifth resonance cavities 213 and 215 as an example) among the plurality of resonance cavities 211 to 215. The resonance grooves 231 and 232 may be formed on one surface of the ceramic block 200, and here, as an example, they are shown as being formed as circular grooves. However, the shape of the resonance grooves 231 and 232 can be changed in various ways. Here, each resonance groove 231 and 232 may be formed at the center where the electric field is concentrated in the area of the corresponding resonance cavity 213 and 215. This causes the effect of lowering the resonance frequency by increasing the capacitive component of each of the plurality of resonance cavities 211 to 215, thereby increasing the size of the ceramic waveguide duplexer compared to the case where the resonance grooves 231 and 232 are not formed. can be miniaturized.

Additionally, at least one interface may be formed in the ceramic waveguide duplexer of this embodiment. The duplexer requires three interfaces as input/output ports to input and output signals to the transmitter, receiver, and common antenna. Among the three interfaces, the transmission interface (not shown) receives the transmission signal (TX) from the transmitter, the reception interface (not shown) transmits the reception signal (RX) to the receiver, and the common interface 270 receives the transmission signal (TX) from the transmitter, and the common interface 270 receives the transmission signal (TX) from the transmitter. ) inputs and outputs a transmission signal (TX) or a reception signal (RX).

Here, for convenience of explanation, the transmitting interface and the receiving interface are not shown separately, but the transmitting interface and the receiving interface are two resonating cavities (herein, the third and It may be formed in the fifth resonance cavity (213, 215), and, like the interface grooves 141 and 142 shown in FIGS. 1 and 2, the corresponding resonance grooves 231 and 232 are formed on the other side of the ceramic block 200. It may be formed in the form of a groove at the position of . When the transmitting interface and the receiving interface are formed in the form of grooves such as the interface grooves 141 and 142, the transmitting interface and the receiving interface transmit signals through the corresponding resonant grooves 231 and 232 and capacitive coupling, respectively. .

However, when a signal is input/output using a coaxial cable, etc., the internal conductor of the coaxial cable is directly inserted into the designated position in the ceramic block 200 to transmit the signal through the corresponding resonance grooves 231 and 232 and capacitive coupling. It can be delivered. Therefore, in some cases, the transmission interface and reception interface are not formed in a specific shape and may be omitted as shown in FIGS. 3 to 5.

Meanwhile, a metal layer 260 is formed on the entire outer surface of the single ceramic block 200. Here, the metal layer 260 is also formed inside the plurality of penetrating partition walls 221 and 222 and the plurality of resonance grooves 231 and 232. And when the transmission interface and the reception interface are formed in the shape of a groove, as shown in FIG. 1, a ring slot may be formed around the groove with the metal layer 260 removed. That is, the transmitting interface and the receiving interface can be formed in the same structure as the interface configuration of the existing integrated ceramic waveguide filter.

However, in this embodiment, the common interface 270 is formed in the shape of a hole penetrating the ceramic block 200, unlike the existing interface configuration. In particular, as shown in FIGS. 5 and 6, the common interface 270 has a step structure in which the diameter on one side of the ceramic block 200 is larger than the diameter on the other side of the hole formed through the ceramic block 200. is formed by

Referring to FIG. 6, the common interface 270 is basically formed in the form of a cylindrical hole penetrating the ceramic block 200, but the upper diameter on one side of the ceramic block 200 is gradually larger than the lower portion 271 on the other side. It was formed as a multi-step structure with a plurality of step areas 272a and 272b expanded. Here, the common interface 270 is shown as having a multi-step structure in which the diameter is gradually increased from the other side to the one side of the ceramic block 200, but in some cases, it may be formed as a single step structure.

Additionally, a metal layer 261 is formed inside the hole-shaped common interface 270. However, on the other side of the ceramic block 200, a ring slot 251 is formed around the common interface 270, so that the metal layer 261 formed inside the common interface 270 is connected to the common interface on the other side of the ceramic block 200. It is spaced apart from the metal layer 260 formed on the outside of (270). At this time, the ring slot 251 has an inner circle spaced apart from the hole of the common interface 270 by a predetermined distance on the other side of the ceramic block 200, so that the metal layer 261 formed inside the common interface 270 is formed on the ceramic block 200. ) can be formed to extend to part of the other side of the. This is to allow the common interface 270 to input and output signals with a flat line-type input/output terminal formed on a PCB, etc., in addition to the input/output terminal such as a coaxial cable that can be inserted into the interior and transmit signals.

At the same time, ring-shaped internal slots 273 are formed in the step regions 272a and 272b to separate the metal layer formed inside the common interface 270 and the metal layer formed on one surface of the ceramic block 200 from each other. Here, the internal ring slots 273 formed in the step areas 272a and 272b, together with the multi-stage step hole structure, expand the bandwidth of signals input and output through the common interface 270. As shown in FIG. 6, the inner ring slot 273 may be formed parallel to one surface of the ceramic block 200 in the step areas 272a and 272b. By forming the inner ring slot 273, the common interface 270 transmits signals through capacitive coupling together with the metal layer 261 formed therein. At this time, the bandwidth of the signal that can be transmitted using the capacitive coupling method can be adjusted depending on the width of the internal ring slot 273.

In this way, when the common interface 270 is formed in the form of a hole with a step structure and an internal ring slot 273 is formed in one step area to transmit a signal by capacitive coupling, the bandwidth of the signal that can be transmitted is greatly expanded.

As described above, the duplexer receives both the transmission signal (TX) and the reception signal (RX) of different frequency bands and performs band-pass filtering. The transmission interface receives and transmits only the transmission signal (TX), and the reception interface receives and transmits only the reception signal (RX). Therefore, as shown in FIG. 7, the transmission interface may be configured to input and output signals in the transmission frequency band (TX band), and the reception interface may be configured to input and output signals in the reception frequency band (RX band).

However, the common interface 270, which must input and output both the transmission signal (TX) and the reception signal (RX) through a common antenna, must be configured to cover both the transmission frequency band (TX band) and the reception frequency band (RX band). In other words, the signal bandwidth required for input and output is very large compared to the transmission interface or reception interface. For example, if the transmission bandwidth (TX band) and the reception bandwidth (RX band) are each 300 MHz, the bandwidth required for the common interface 270 is simply the transmission bandwidth (TX band), as shown in FIG. ) and the reception bandwidth (RX band), which is the sum of 600 MHz, but must also include the transmission and reception guard band (TRX guard band) set to distinguish the transmission signal (TX) and the reception signal (RX). That is, the common interface 270 must be configured to input and output signals with a bandwidth corresponding to the sum of the transmission bandwidth (TX band), the reception bandwidth (RX band), and the transmission and reception guard band (TRX guard band).

As shown in FIG. 2, when the corresponding resonance grooves 131 and 136 and the interface grooves 141 and 142 are formed to face each other in the direction of one side and the other side of the ceramic block 100, the resonance grooves 131 and 136 and the interface As the spacing (g) between the grooves 141 and 142 becomes smaller, the capacity for capacitive coupling increases, thereby increasing the bandwidth of signals that can be input and output. However, even if the gap (g) between the resonance grooves 131 and 136 and the interface grooves 141 and 142 continues to be reduced, there is a limit to the bandwidth that can be expanded. Additionally, if the gap (g) between the resonance grooves (131, 136) and the interface grooves (141, 142) becomes very small (for example, 2 mm or less), there is a risk that the ceramic in that area will be damaged during firing or handling. there is.

In contrast, in this embodiment, the common interface 270 is formed in the form of a step-shaped hole penetrating the ceramic block 200, and the capacitive coupling is formed by the width of the inner ring slot 273 formed in one of the step regions. By adjusting the bandwidth, it is possible to transmit a wideband signal of 800MHz level without risk of damage. Therefore, the broadband transmission characteristics required for the interface 270 of the duplexer can be stably implemented, and the integrated ceramic waveguide duplexer can be miniaturized.

Figure 8 shows a top perspective view of an integrated ceramic waveguide duplexer according to another embodiment of the present invention, Figure 9 shows a top view of the integrated ceramic waveguide duplexer of Figure 8, and Figure 10 shows an integrated ceramic waveguide duplexer of Figure 8 Shows a side cross-sectional view.

The integrated ceramic waveguide duplexer shown in FIGS. 8 to 10 is also similar to the duplexer shown in FIGS. 3 to 5 in a plurality of penetrating partition walls 321 to 323 formed between one side and the other side of the single ceramic block 300. It is implemented in an integrated form including a number of resonance cavities (311 to 319, 31X) defined by .

Among the plurality of through partitions 321 to 323, the first through partition 321 has a shape in which two + characters are connected, and the first resonance cavity 311 and the is distinguished from the resonance cavities 312 to 315 and 316 to 319 located on both sides, and the first resonance cavity 311 and the X resonance cavity 31X are distinguished from each other. Here too, the first resonant cavity 311 is a common resonant cavity used as a common path for transmitting the transmission signal (TX) to the common antenna through the common interface 370 and receiving the reception signal (RX) from the common antenna. It can be said.

And the second penetrating partition 322 formed in a + shape separates the four resonance cavities 312 to 315 located on one side of the ceramic block 300 from each other, and the third penetrating partition wall also formed in a + shape ( 323) distinguishes four resonance cavities 312 to 315 located on the other side of the ceramic block 300 from each other.

Here, four resonance cavities 312 to 315 located on one side form a transmission path that transmits the transmission signal (TX) applied from the transmitter to the first resonance cavity 311, and four resonance cavities located on the other side It is assumed that the cavities 316 to 317 form a reception path that transmits the reception signal RX applied from the transmitter to the first resonance cavity 311. That is, the first to fifth resonance cavities 311 to 315 function as BPFs corresponding to the frequency band of the transmission signal TX to prevent the reception signal RX from being transmitted to the transmitter, and the first and sixth to ninth resonance cavities 311 to 315 function as BPFs corresponding to the frequency band of the transmission signal TX. The resonance cavities 311, 316 to 319 function as BPFs corresponding to the frequency band of the reception signal (RX) to prevent the transmission signal (TX) from being transmitted to the receiver. The

Meanwhile, in the duplexer shown in FIGS. 8 to 10, resonance grooves 331 to 338 are formed on one side of the ceramic block 300 in each of the eight resonance cavities 312 to 319 located on both sides. Each resonance groove (331 to 338) increases the capacitive component of the corresponding resonance cavity (312 to 319), causing the effect of lowering the resonance frequency, so that the size of the resonance cavity (312 to 319) can be reduced. do. In other words, it allows the duplexer to be miniaturized. And, on the other side of the ceramic block 300, a groove-shaped transmission interface 341 is formed at a position corresponding to the resonance groove 334 of the fifth resonance cavity 315 among the plurality of resonance cavities 311 to 319, A groove-shaped receiving interface 342 is formed at a position corresponding to the resonance groove 338 of the ninth resonance cavity 319. The groove-shaped transmitting interface 341 and receiving interface 342 have a resonance groove 334 formed in the fifth resonance cavity 315 and the ninth resonance cavity 319, similar to the interface grooves 141 and 142 shown in FIG. 1. , 338), capacitive coupling is achieved to transmit the signal.

At this time, ring slots 351 and 352, which are areas where the metal layer 160 is removed, are formed around each of the groove-shaped transmitting interface 341 and receiving interface 342 on the other surface of the ceramic block 300. The inner circles of the ring slots 351 and 352 may be formed to a size corresponding to the groove in which the transmitting interface 341 and the receiving interface 342 are formed, but the inner circles are formed at a predetermined distance from the edge of the groove. , the metal layer inside the transmitting interface 341 and the receiving interface 342 may be formed up to a portion of the other surface of the ceramic block 300 to input and output signals with a flat line-type input/output terminal formed on a PCB, etc.

Meanwhile, a common interface 370 for inputting and outputting a transmission signal (TX) and a reception signal (RX) through a common antenna is formed in the first resonance cavity 311. Even in the duplexer shown in FIGS. 8 to 10, the first resonance cavity 311 is a common resonance cavity through which the transmission signal (TX) is transmitted to the common antenna and the reception signal (RX) is applied from the common antenna, so the first resonance cavity 311 A common interface 370 is formed at 311. The common interface 370, like the common interface 270 shown in FIGS. 3 to 5, is formed in the form of a hole with a step structure whose diameter is larger on one side of the ceramic block 300 than on the other side, and has a single step structure. Alternatively, it may be formed in a multi-step structure. In addition, an internal ring slot is formed in at least one step area of the common interface 370 parallel to one surface of the ceramic block 300 to enable signals to be transmitted using a capacitive coupling method in a wide band. At this time, the first to third through partitions 321 to 322 are spaced apart from each other, between the second resonance cavity 312 and the fifth resonance cavity 315 and between the sixth resonance cavity 316 and the ninth resonance cavity 319. ), cross-coupling occurs between them, which generates a transmission zero point at a frequency lower than the pass band, thereby improving the attenuation characteristics of the ceramic waveguide duplexer.

In the duplexer configured as above, the transmission signal TX applied through the transmission interface 341 is transmitted by capacitive coupling to the resonance groove 334 formed in the fifth resonance cavity 315, and the fifth resonance cavity 315 is transmitted through capacitive coupling. The transmission signal (TX) delivered to (315) sequentially passes through the fourth, third, and second resonance cavities (314, 313, and 312) to the first resonance cavity (311) through capacitive coupling. It is filtered and transmitted, and the common interface 370 of the first resonance cavity 311 transmits the transmitted transmission signal TX to the common antenna. And the received signal (RX) transmitted from the common antenna to the common interface 370 is sequentially transmitted by capacitive coupling through the sixth to ninth resonance cavities 319, and is transmitted to the ninth resonance cavity 319. The formed receiving interface 342 receives signals through the resonance groove 338 and capacitive coupling and outputs them to the connected output terminal.

Meanwhile, the duplexer shown in FIGS. 8 to 10 further has at least one coupling hole 381, 382 penetrating the ceramic block 300 between adjacent resonance cavities among the plurality of resonance cavities 311 to 319. It can be. Here, as an example, the coupling holes 381 and 382 are shown as being formed between the third and fourth resonance cavities 313 and 314 and between the seventh and eighth resonance cavities 317 and 318, but the coupling holes ( 381, 382) may also be formed between other resonance cavities located adjacent to each other. Additionally, each of the coupling holes 381 and 382 may be formed as a single or multi-step structure with a diameter on one side of the ceramic block 300 that is larger than the diameter on the other side of the ceramic block 300, similar to the common interface 370. The coupling holes 381 and 382 serve to convert the sign of the cross coupling applied between the resonance grooves 331 and 334 or between the resonance grooves 335 and 338 to negative (-), so that the transmission zero point passes. Capacitance cross coupling formed in the lower part of the band is implemented.

It can be formed in a small size, and can be formed between adjacent resonant cavities to further lower the resonant frequency. Therefore, it is applied together with the resonance grooves 331 to 338 to further miniaturize the duplexer.

As described above, the duplexer of this embodiment is formed integrally within a single ceramic block (200, 300), and is located on both sides around the first resonance cavity (211, 311) located in the center of the ceramic block (200, 300). The formed plurality of resonant cavities 212 to 215 and 312 to 319 form a transmission path and a reception path through which the transmission signal TX and the reception signal RX are band-pass filtered and transmitted, respectively. At this time, a common interface 270, 370 is formed in the form of a step-shaped hole in the first resonance cavity 211, 311, which is a common resonator connected to the common antenna, so that signals can be input and output in a wide band, so the transmission signal ( Both TX) and received signals (RX) can be input and output stably.

Here, only the common interfaces 270 and 370 are shown as being formed in a step-structured hole shape, but in some cases, the transmitting interface and receiving interface may also be formed in a step-structured hole shape like the common interfaces 270 and 370. .

FIG. 11 shows an example of an interface board that inputs and outputs signals with the integrated ceramic waveguide duplexer of FIG. 8, FIG. 12 shows a top view of the interface board of FIG. 11, and FIG. 13 shows a side cross-sectional view of the interface board of FIG. 11. indicates. And FIG. 14 shows a structure in which the integrated ceramic waveguide duplexer of FIG. 8 and the interface substrate of FIG. 11 are combined.

As described above, in the integrated ceramic waveguide duplexer according to the present embodiment, the inner circle of the ring slots 351 and 352 corresponds to the grooves or holes of the transmitting interface 341 and the receiving interface 342 and the common interfaces 270 and 370. It is formed at a predetermined distance from the outside. This means that the internal metal layer 261 of the transmitting interface 341, the receiving interface 342, and the common interfaces 270, 370 is extended to the other side of the ceramic block 200, 300, forming not only an input/output terminal in the form of a coaxial cable, but also an input/output terminal in the form of a coaxial cable. This is to enable input and output of signals with a flat line-type input/output terminal of the board structure.

And in Figures 11 to 13, in order to implement a flat line-type input/output terminal, the interface board 400 is implemented as a strip line, for example. The interface substrate 400 having a strip line structure is implemented as a three-layer structure in which a dielectric plate 410 and metal plates 421 and 422 are formed on one side and the other side of the dielectric plate 410, respectively. And on one side of the interface substrate 400, signal pads 432, 442, and 452 are formed in areas corresponding to the common interfaces 270 and 370 of the duplexer and the transmission interface 341 and reception interface 342, respectively, and signal Pad ring slots 433, 443, and 453 are formed around the pad by removing the metal plate 421 at a predetermined distance to electrically isolate the metal plate 421 from the signal pads 432, 442, and 452.

Meanwhile, inside the dielectric plate 410, there are transmission lines 431, 441, and 451 connected to the positions where the signal pads 432, 442, and 452 are formed so that the transmission signal (TX) and the reception signal (RX) are transmitted. Via electrodes 434, 444, and 454 are formed between one end of each of the transmission lines (431, 441, and 451) and the corresponding signal pads (432, 442, and 452) to form the transmission lines (431, 441, and 451). and the corresponding signal pads 432, 442, and 452 are electrically connected.

As shown in FIG. 14, the interface substrate 400 of this structure is coupled to the other side of the ceramic waveguide duplexer. In this case, the three signal pads 432, 442, and 452 are connected to the common interface 270 and 370, respectively. ) and the internal metal layer 261 that extends from the inside of the transmission interface 341 and the reception interface 342 to the other surface of the ceramic blocks 200 and 300 and is electrically connected. Therefore, the common interfaces 270 and 370, the transmitting interface 341 and the receiving interface 342 allow signals to be input to the corresponding transmission lines 431, 441 and 451 through the three signal pads 432, 442 and 452. can be printed. In other words, signals can be easily input and output to the duplexer using flat line-type input/output terminals rather than input/output terminals such as coaxial cables.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom.

Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the attached claims.

200, 300: Ceramic block
211 ~ 215, 311 ~ 319: Resonant cavity
221, 222, 321 ~ 313: Penetrating bulkhead
231, 232, 331 ~ 338: Resonant groove
341: Transmit interface
342: Receiving interface
251, 351, 352: Ring slot
260, 360: metal layer
270, 370: Common interface
381, 382: Coupling hole
400: Interface board
431, 441, 451: Transmission lines
432, 442, 452: Signal pad
433, 443, 453: Pad ring slots
434, 444, 454: via electrodes

Claims (10)

A plurality of resonant cavities defined as compartments divided by a plurality of penetrating partitions formed through one side and the other side of a single ceramic block according to a predetermined pattern;
Among the plurality of resonant cavities, a step hole structure is formed with a hole structure penetrating the ceramic block within a section of the common resonant cavity that inputs and outputs signals with a common antenna, and has a hole diameter on the other side of the ceramic block that is smaller than the hole diameter on one side of the ceramic block. A common interface formed by; and
A metal layer formed on the outer surface of the ceramic block and having an inner ring slot formed in a ring shape except in a step area parallel to one surface of the ceramic block at the common interface of the step hole structure,
The plurality of resonance cavities are
It is formed in a structure that is symmetrical to each other on both sides of the ceramic block by the plurality of through partitions, and the common resonance cavity is located on the central axis of the ceramic block that is symmetrical to each other on both sides,
Among the plurality of resonance cavities, a predetermined transmission resonance cavity band-pass filters the applied transmission signal to an adjacent resonance cavity using a capacitive coupling method and transmits the applied transmission signal to the common resonance cavity, and the common resonance cavity transmits the applied reception signal to the common resonance cavity. A ceramic waveguide duplexer that performs band-pass filtering through capacitive coupling to adjacent resonant cavities and transmits the band-pass filtering to a predetermined receiving resonant cavity.
The method of claim 1, wherein the common interface is
A ceramic waveguide duplexer formed in the shape of a hole with a multi-step structure whose diameter is repeatedly gradually decreased from one side of the ceramic block. The method of claim 1, wherein the inner ring slot is
A ceramic waveguide duplexer whose width is adjusted according to the bandwidth of the signal input and output to the common antenna. The method of claim 3, wherein the metal layer
A ceramic waveguide duplexer in which a ring slot is formed by removing the other surface of the ceramic block into a ring shape with an inner circle spaced at a predetermined distance around the hole of the common interface. delete delete The method of claim 1, wherein the ceramic waveguide duplexer
The transmission resonance cavity and the reception resonance cavity have a step hole structure that penetrates the ceramic block within each section and has a diameter on the other side of the ceramic block that is smaller than the diameter on one side of the ceramic block, and in the step hole structure, one side of the ceramic block A ceramic waveguide duplexer further comprising a transmission interface and a reception interface in which an inner ring slot is formed in which the metal layer is excluded in a ring shape in a step area parallel to the. The method of claim 1, wherein the ceramic waveguide duplexer
A groove is formed on the other surface of the ceramic block at each location of the transmission resonance cavity and the reception resonance cavity, and a metal layer is formed around the groove spaced apart by a ring slot in which the metal layer formed on the other surface of the ceramic block is removed in a ring shape. A ceramic waveguide duplexer further comprising a transmitting interface and a receiving interface. The method of claim 1, wherein the ceramic waveguide duplexer
A ceramic waveguide duplexer further comprising at least one resonance groove formed in the shape of a groove on one surface of the ceramic block at a position of at least one predetermined resonance cavity among the plurality of resonance cavities, and in which the metal layer is formed to the inside. The method of claim 1, wherein the ceramic waveguide duplexer
A stepped hole structure is formed through the ceramic block between at least two adjacent resonance cavities among the plurality of resonance cavities, and the hole diameter on the other side of the ceramic block is smaller than the hole diameter on one side of the ceramic block. A ceramic waveguide duplexer further comprising at least one coupling hole in which a metal layer is formed.