KR102658860B1 - Vinylchloride resin composition - Google Patents
Vinylchloride resin composition Download PDFInfo
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- KR102658860B1 KR102658860B1 KR1020210133019A KR20210133019A KR102658860B1 KR 102658860 B1 KR102658860 B1 KR 102658860B1 KR 1020210133019 A KR1020210133019 A KR 1020210133019A KR 20210133019 A KR20210133019 A KR 20210133019A KR 102658860 B1 KR102658860 B1 KR 102658860B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- vinyl chloride
- chloride resin
- parts
- resin composition
- Prior art date
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims abstract description 113
- 239000011342 resin composition Substances 0.000 title claims abstract description 70
- 239000004014 plasticizer Substances 0.000 claims abstract description 59
- 239000012760 heat stabilizer Substances 0.000 claims description 61
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 36
- 150000001875 compounds Chemical class 0.000 claims description 32
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 claims description 19
- 235000015112 vegetable and seed oil Nutrition 0.000 claims description 17
- 239000008158 vegetable oil Substances 0.000 claims description 17
- -1 2-ethylhexyl Chemical group 0.000 claims description 15
- 238000006116 polymerization reaction Methods 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 8
- 239000006057 Non-nutritive feed additive Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 7
- 239000000049 pigment Substances 0.000 claims description 6
- 239000012963 UV stabilizer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000003549 soybean oil Substances 0.000 claims description 5
- 235000012424 soybean oil Nutrition 0.000 claims description 5
- HOQGHOMLEVKTBY-UHFFFAOYSA-N bis(2-ethylhexyl) cyclohexane-1,4-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1CCC(C(=O)OCC(CC)CCCC)CC1 HOQGHOMLEVKTBY-UHFFFAOYSA-N 0.000 claims description 4
- 238000009408 flooring Methods 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 3
- 239000002649 leather substitute Substances 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 3
- 235000019482 Palm oil Nutrition 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- HORIEOQXBKUKGQ-UHFFFAOYSA-N bis(7-methyloctyl) cyclohexane-1,2-dicarboxylate Chemical compound CC(C)CCCCCCOC(=O)C1CCCCC1C(=O)OCCCCCCC(C)C HORIEOQXBKUKGQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 239000004359 castor oil Substances 0.000 claims description 2
- 235000019438 castor oil Nutrition 0.000 claims description 2
- QGUFKMSGOYILME-UHFFFAOYSA-N dibutyl cyclohexane-1,4-dicarboxylate Chemical compound CCCCOC(=O)C1CCC(C(=O)OCCCC)CC1 QGUFKMSGOYILME-UHFFFAOYSA-N 0.000 claims description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 2
- 229940049918 linoleate Drugs 0.000 claims description 2
- 239000000944 linseed oil Substances 0.000 claims description 2
- 235000021388 linseed oil Nutrition 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- 229940049964 oleate Drugs 0.000 claims description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 claims description 2
- 239000002540 palm oil Substances 0.000 claims description 2
- 239000003784 tall oil Substances 0.000 claims description 2
- YKRIRCCNOOQQAI-UHFFFAOYSA-N 1-o-butyl 4-o-(2-ethylhexyl) cyclohexane-1,4-dicarboxylate Chemical compound CCCCOC(=O)C1CCC(C(=O)OCC(CC)CCCC)CC1 YKRIRCCNOOQQAI-UHFFFAOYSA-N 0.000 claims 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-M 9-cis,12-cis-Octadecadienoate Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC([O-])=O OYHQOLUKZRVURQ-HZJYTTRNSA-M 0.000 claims 1
- QSAWQNUELGIYBC-UHFFFAOYSA-L cyclohexane-1,2-dicarboxylate Chemical compound [O-]C(=O)C1CCCCC1C([O-])=O QSAWQNUELGIYBC-UHFFFAOYSA-L 0.000 claims 1
- 238000002845 discoloration Methods 0.000 abstract description 21
- 238000012545 processing Methods 0.000 abstract description 16
- 238000005034 decoration Methods 0.000 abstract description 11
- 238000013508 migration Methods 0.000 abstract description 11
- 230000005012 migration Effects 0.000 abstract description 11
- 230000000052 comparative effect Effects 0.000 description 17
- 239000000203 mixture Substances 0.000 description 10
- 239000003381 stabilizer Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 239000003921 oil Substances 0.000 description 6
- 235000019198 oils Nutrition 0.000 description 6
- 239000000123 paper Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- OEIWPNWSDYFMIL-UHFFFAOYSA-N dioctyl benzene-1,4-dicarboxylate Chemical group CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C=C1 OEIWPNWSDYFMIL-UHFFFAOYSA-N 0.000 description 3
- 238000007720 emulsion polymerization reaction Methods 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010557 suspension polymerization reaction Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 2
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000004088 foaming agent Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- SROBQEVKVSDXFQ-KHPPLWFESA-N (z)-4-oxo-4-(1-phenylpentoxy)but-2-enoic acid Chemical compound OC(=O)\C=C/C(=O)OC(CCCC)C1=CC=CC=C1 SROBQEVKVSDXFQ-KHPPLWFESA-N 0.000 description 1
- XXCVIFJHBFNFBO-UHFFFAOYSA-N 1-ethenoxyoctane Chemical compound CCCCCCCCOC=C XXCVIFJHBFNFBO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- BFLLYQMTHHKNBS-UHFFFAOYSA-N C(CCC)C1C(CCC(C1)C(=O)O)(C(=O)O)CC(CCCC)CC Chemical compound C(CCC)C1C(CCC(C1)C(=O)O)(C(=O)O)CC(CCCC)CC BFLLYQMTHHKNBS-UHFFFAOYSA-N 0.000 description 1
- JKTNUPMEJUHPBY-UHFFFAOYSA-N C(CCC)C=1C(=C(C(C(=O)O)=CC1)C(=O)O)CC1=CC=CC=C1.C(C=1C(C(=O)OCC2=CC=CC=C2)=CC=CC1)(=O)OCCCC Chemical compound C(CCC)C=1C(=C(C(C(=O)O)=CC1)C(=O)O)CC1=CC=CC=C1.C(C=1C(C(=O)OCC2=CC=CC=C2)=CC=CC1)(=O)OCCCC JKTNUPMEJUHPBY-UHFFFAOYSA-N 0.000 description 1
- LPRDCUAEVFTNHK-UHFFFAOYSA-N CCCCCCC(CCC)(CCC)OC(=O)C1=CC=CC=C1C(O)=O Chemical compound CCCCCCC(CCC)(CCC)OC(=O)C1=CC=CC=C1C(O)=O LPRDCUAEVFTNHK-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000008037 PVC plasticizer Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- DIMOQAGSNHTROK-UHFFFAOYSA-N bis(2-ethylhexyl) cyclohexane-1,2-dicarboxylate Chemical compound CCCCC(CC)COC(=O)C1CCCCC1C(=O)OCC(CC)CCCC DIMOQAGSNHTROK-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- XBZSBBLNHFMTEB-UHFFFAOYSA-N cyclohexane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCCC(C(O)=O)C1 XBZSBBLNHFMTEB-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-L cyclohexane-1,4-dicarboxylate Chemical compound [O-]C(=O)C1CCC(C([O-])=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-L 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- NKHAVTQWNUWKEO-UHFFFAOYSA-N fumaric acid monomethyl ester Natural products COC(=O)C=CC(O)=O NKHAVTQWNUWKEO-UHFFFAOYSA-N 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011084 greaseproof paper Substances 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- IRIAEXORFWYRCZ-UHFFFAOYSA-N n-butyl benzyl phthalate Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/014—Stabilisers against oxidation, heat, light or ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
Abstract
본 발명은 가공성이 우수하며, 가공 후 변색이 적고, 가소제 내이행성 및 열 안정성이 우수하여 실내 장식용 제품에 적용하기에 적합한 염화비닐 수지 조성물에 관한 것이다.The present invention relates to a vinyl chloride resin composition that has excellent processability, little discoloration after processing, and excellent plasticizer migration resistance and heat stability, making it suitable for application to interior decoration products.
Description
본 발명은 변색이 적고 열 안정성이 우수하며 친환경적인 염화비닐 수지 조성물에 관한 것이다.The present invention relates to an environmentally friendly vinyl chloride resin composition that has little discoloration, excellent thermal stability, and is environmentally friendly.
염화비닐 수지는 염화비닐의 단독 중합체 및 염화비닐을 50% 이상 함유한 혼성 중합체로서, 현탁중합과 유화 중합으로 제조되는 5대 범용 열가소성 플라스틱 수지 중의 하나이다. Vinyl chloride resin is a homopolymer of vinyl chloride and a copolymer containing more than 50% vinyl chloride, and is one of the five major general-purpose thermoplastic resins produced by suspension polymerization and emulsion polymerization.
염화비닐 수지는 기능성을 부여하기 위하여 가소제, 안정제, 충전제, 발포제 등의 부원료와 혼합하여 사용된다. 가소제는 염화비닐 수지에 유연성을 부여하여 가공성을 향상시키기 위하여 첨가되는 것으로, 기존에는 DEHP(Di-2-EthylHexyl Phthalate), DINP(Di-IsoNonyl Phthalate), DIDP(Di-Iso-Decyl Phthalate), BBP(Butyl Benzyl Phthalate), DBP(Di-n-butyl phthalate) 등의 프탈레이트계 가소제가 널리 사용되었다. Vinyl chloride resin is used by mixing with additives such as plasticizers, stabilizers, fillers, and foaming agents to provide functionality. Plasticizers are added to improve processability by giving flexibility to vinyl chloride resin. Previously, they were DEHP (Di-2-EthylHexyl Phthalate), DINP (Di-IsoNonyl Phthalate), DIDP (Di-Iso-Decyl Phthalate), and BBP. Phthalate plasticizers such as Butyl Benzyl Phthalate (Butyl Benzyl Phthalate) and Di-n-butyl phthalate (DBP) were widely used.
상기 프탈레이트계 가소제는 가소화 효율은 뛰어나지만 인체에 유해성을 나타내는 바, 최근 국내외에서 사용이 규제되고 있다. 이에, 프탈레이트계 가소제를 대체할 수 있는 물질로서 테레프탈레이트계 가소제, 에폭사이드계 가소제, 식물성 유지계 가소제, 사이클로헥산계 가소제 등이 제안되었다. 대표적인 친환경 가소제로는 디옥틸테레프탈레이트(DOTP)가 있으나, DOTP 가소제는 이행이 잘 되고, 자외선에 대한 내후성 및 겔링 속도가 떨어지는 등의 문제가 있어, 우수한 가공성 및 양호한 변색 특성을 요하는 실내 장식용 제품에는 사용되기 부적합한 측면이 있다.Although the phthalate-based plasticizer has excellent plasticization efficiency, it is harmful to the human body, and its use has recently been regulated at home and abroad. Accordingly, terephthalate-based plasticizers, epoxide-based plasticizers, vegetable oil-based plasticizers, and cyclohexane-based plasticizers have been proposed as substances that can replace phthalate-based plasticizers. A representative eco-friendly plasticizer is dioctyl terephthalate (DOTP), but DOTP plasticizer has problems such as easy migration, low weather resistance to ultraviolet rays and low gelling speed, making it an interior decoration product that requires excellent processability and good discoloration characteristics. There are aspects that make it unsuitable for use.
이에, 친환경 가소제를 포함하면서도 우수한 물성을 나타내는 염화비닐 수지 조성물의 개발이 요구된다.Accordingly, there is a need for the development of a vinyl chloride resin composition that exhibits excellent physical properties while containing an eco-friendly plasticizer.
본 발명은 가공성이 우수하며, 가공 후 변색이 적고, 가소제 내이행성 및 열 안정성이 우수하여 실내 장식용 제품에 적용하기에 적합한 염화비닐 수지 조성물 및 이를 포함하는 성형품을 제공하는 것을 목적으로 한다.The purpose of the present invention is to provide a vinyl chloride resin composition that has excellent processability, little discoloration after processing, excellent plasticizer migration resistance and thermal stability, and is suitable for application to interior decoration products, and a molded article containing the same.
상기 목적을 달성하기 위하여 본 발명은, In order to achieve the above object, the present invention,
염화비닐 수지;Vinyl chloride resin;
가소제; 및plasticizer; and
열 안정제; 를 포함하며,heat stabilizer; Includes,
상기 가소제는 하기 화학식 1로 표시되는 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일을 포함하고,The plasticizer includes a cyclohexane dicarboxylate-based compound represented by the following formula (1) and an epoxidized vegetable oil,
상기 열 안정제는 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 포함하는,The heat stabilizer includes a Ba-Zn-based heat stabilizer and a Na-Zn-based heat stabilizer.
염화비닐 수지 조성물을 제공한다:Provided is a vinyl chloride resin composition:
[화학식 1][Formula 1]
상기 화학식 1에서, In Formula 1,
R1 및 R2는 각각 독립적으로 탄소수 4 내지 12의 직쇄 또는 분지쇄 알킬기이다.R 1 and R 2 are each independently a straight or branched alkyl group having 4 to 12 carbon atoms.
또한, 본 발명은 상기 염화비닐 수지 조성물을 포함하는 성형품을 제공한다.Additionally, the present invention provides a molded article containing the vinyl chloride resin composition.
본 발명에 따른 염화비닐 수지 조성물은 겔링 속도가 높아 우수한 가공성을 나타내며, 가공 후 변색이 적고, 가소제 내이행성 및 열 안정성이 우수하여 실내 장식용 제품에 적합하게 사용될 수 있다.The vinyl chloride resin composition according to the present invention has a high gelling speed, exhibits excellent processability, has little discoloration after processing, and has excellent plasticizer migration resistance and thermal stability, so it can be suitably used in interior decoration products.
본 명세서에서 사용되는 용어는 단지 예시적인 실시예들을 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도는 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
본 발명은 다양한 변경을 가할 수 있고 여러 가지 형태를 가질 수 있는 바, 특정 실시예들을 예시하고 하기에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명을 특정한 개시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.Since the present invention can be subject to various changes and can take various forms, specific embodiments will be illustrated and described in detail below. However, this is not intended to limit the present invention to a specific disclosed form, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.
이하, 본 발명을 보다 상세히 설명하기로 한다.Hereinafter, the present invention will be described in more detail.
본 발명에 따른 염화비닐 수지 조성물은, 염화비닐 수지; 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일을 포함하는 가소제; 및 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 포함하는 열 안정제를 포함한다. 이러한 조성으로 인하여 본 발명에 따른 염화비닐 수지 조성물은 겔링 속도가 높아 가공성이 우수하고, 뛰어난 열 안정성을 나타내며, 가소제 내이행성이 우수할 뿐만 아니라, 가공 후 변색이 적은 특성을 나타낸다.The vinyl chloride resin composition according to the present invention includes vinyl chloride resin; Plasticizers including cyclohexane dicarboxylate-based compounds and epoxidized vegetable oils; and heat stabilizers including Ba-Zn-based heat stabilizers and Na-Zn-based heat stabilizers. Due to this composition, the vinyl chloride resin composition according to the present invention has a high gelling rate, excellent processability, excellent thermal stability, excellent plasticizer migration resistance, and shows little discoloration after processing.
상기 염화비닐 수지는 염화비닐 단량체가 단독 중합된 호모 중합체이거나, 또는 염화비닐 단량체 및 이와 공중합 가능한 공단량체가 중합된 공중합체일 수 있으며, 이들 중 어느 하나 또는 둘의 혼합물이 염화비닐 수지 조성물의 제조에 사용될 수 있다.The vinyl chloride resin may be a homopolymer obtained by homopolymerizing a vinyl chloride monomer, or a copolymer obtained by polymerizing a vinyl chloride monomer and a comonomer copolymerizable therewith, and any one or a mixture of the two may be used to prepare a vinyl chloride resin composition. can be used for
상기 염화비닐 단량체와 공중합 가능한 공단량체는 구체적으로, 초산 비닐, 프로피온산 비닐, 스테아린산 비닐 등의 비닐 에스테르류; 메틸 비닐 에테르, 에틸 비닐 에테르, 옥틸 비닐 에테르, 라우닐 비닐 에테르 등의 알킬기를 가지는 비닐 에테르(viny ether)류; 염화 비닐리덴 등의 할로겐화 비닐리덴류; 아크릴산, 메타크릴산, 푸마르산, 말레인산, 이타콘산, 무수 말레산, 무수 이타콘산 등의 불포화 카르본산 및 이들의 산무수물; 아크릴산 메틸, 아크릴산 에틸, 말레인산 모노 메틸, 말레인산 디메틸, 말레인산 부틸벤질 등의 불포화 카르본산 에스테르(ester)류; 스티렌, α-메틸 스티렌, 디비닐 벤젠 등의 방향족 비닐 화합물; 아크릴로니트릴 또는 메타크릴로니트릴 등의 불포화 니트릴류; 에틸렌 또는 프로필렌 등의 올레핀류; 또는 디알릴 프탈레이트 등의 가교성 단량체 등을 들 수 있으며, 이들 중 어느 하나 또는 둘 이상의 혼합물이 사용될 수 있다. 이중에서도, 염화비닐 단량체와의 상용성이 우수하고, 또 중합 후 수지 조성물을 구성하는 가소제에 대한 상용성을 향상시킬 수 있는 점에서 상기 공단량체는 초산 비닐 등을 포함하는 것이 보다 바람직할 수 있다.Comonomers copolymerizable with the vinyl chloride monomer specifically include vinyl esters such as vinyl acetate, vinyl propionate, and vinyl stearate; Vinyl ethers having an alkyl group such as methyl vinyl ether, ethyl vinyl ether, octyl vinyl ether, and launyl vinyl ether; Vinylidene halides such as vinylidene chloride; unsaturated carboxylic acids such as acrylic acid, methacrylic acid, fumaric acid, maleic acid, itaconic acid, maleic anhydride, and itaconic anhydride, and their acid anhydrides; unsaturated carboxylic acid esters such as methyl acrylate, ethyl acrylate, monomethyl maleate, dimethyl maleate, and butylbenzyl maleate; Aromatic vinyl compounds such as styrene, α-methyl styrene, and divinyl benzene; Unsaturated nitriles such as acrylonitrile or methacrylonitrile; olefins such as ethylene or propylene; or crosslinkable monomers such as diallyl phthalate, and any one or a mixture of two or more of these may be used. Among these, it is more preferable that the comonomer contains vinyl acetate, etc. because it has excellent compatibility with vinyl chloride monomer and can improve compatibility with the plasticizer constituting the resin composition after polymerization. .
앞서 설명한 바와 같이, 상기 염화비닐 수지는 염화비닐 단량체 단독, 또는 염화비닐 단량체 및 이와 공중합 가능한 공단량체를 중합 반응시켜 제조될 수 있다. 이때 중합 방법은 특별히 제한되지 않으며, 현탁 중합, 괴상 중합, 유화 중합, 또는 시드 유화 중합 등 본 발명이 속하는 기술분야에 알려진 통상의 중합 방법에 따라 수행될 수 있다. 이중에서도, 현탁 중합에 의해 제조되는 스트레이트 염화비닐 수지가 본 발명에 적합하게 사용될 수 있다. As described above, the vinyl chloride resin can be produced by polymerizing vinyl chloride monomer alone or vinyl chloride monomer and a comonomer copolymerizable therewith. At this time, the polymerization method is not particularly limited, and may be performed according to conventional polymerization methods known in the technical field to which the present invention pertains, such as suspension polymerization, bulk polymerization, emulsion polymerization, or seed emulsion polymerization. Among these, straight vinyl chloride resin produced by suspension polymerization can be suitably used in the present invention.
본 발명에서 사용 가능한 염화비닐 수지의 평균 입자 크기(D50)는 10 내지 400 ㎛, 또는 30 내지 200 ㎛, 보다 구체적으로는 50 내지 100 ㎛일 수 있다. 염화비닐 수지가 상기한 범위의 입자 크기를 가짐으로써 우수한 분산성을 나타내고, 가소화된 염화비닐 수지 조성물의 유동성을 보다 개선시킬 수 있다. The average particle size (D 50 ) of the vinyl chloride resin usable in the present invention may be 10 to 400 ㎛, or 30 to 200 ㎛, more specifically 50 to 100 ㎛. When the vinyl chloride resin has a particle size within the above range, it can exhibit excellent dispersibility and further improve the fluidity of the plasticized vinyl chloride resin composition.
평균 입자 크기(D50)가 400 ㎛를 초과하면 염화비닐 수지 입자 자체로 분산성이 낮고, 10 ㎛ 미만이면, 염화비닐 수지 입자간 응집으로 인해 분산성이 저하될 우려가 있다. 한편, 본 발명에 있어서 상기 염화비닐 수지의 평균 입자 크기(D50)는 광학현미경 관찰법, 광산란 측정법 등의 통상의 입자 크기 분포 측정방법에 따라 측정될 수 있다.If the average particle size (D 50 ) exceeds 400 ㎛, the dispersibility of the vinyl chloride resin particles themselves is low, and if it is less than 10 ㎛, there is a risk that the dispersibility may be reduced due to agglomeration between the vinyl chloride resin particles. Meanwhile, in the present invention, the average particle size (D 50 ) of the vinyl chloride resin can be measured according to conventional particle size distribution measurement methods such as optical microscope observation and light scattering measurement.
상기 염화비닐 수지의 중합도 및 중량평균 분자량은 염화비닐 수지 조성물을 구성하는 성분들, 특히 가소제와의 상용성 및 염화비닐 조성물의 가공성에 영향을 미칠 수 있는데, 중합 시 중합 조건의 제어를 통해 적절히 조절될 수 있다. The degree of polymerization and weight average molecular weight of the vinyl chloride resin may affect the compatibility with the components constituting the vinyl chloride resin composition, especially the plasticizer, and the processability of the vinyl chloride composition, and must be appropriately adjusted by controlling the polymerization conditions during polymerization. It can be.
구체적으로, 상기 염화비닐 수지는 중합도가 500 내지 3,000 이거나, 또는 중량평균 분자량(Mw)이 25,000 내지 300,000 g/mol일 수 있다. 상기와 같은 범위의 중합도 및 중량평균 분자량을 가질 경우 분산성이 우수하고, 가소제와의 상용성이 양호하며, 염화비닐 수지 조성물의 가공성을 개선시킬 수 있다. Specifically, the vinyl chloride resin may have a degree of polymerization of 500 to 3,000 or a weight average molecular weight (Mw) of 25,000 to 300,000 g/mol. When the degree of polymerization and weight average molecular weight are in the above range, dispersibility is excellent, compatibility with plasticizers is good, and processability of the vinyl chloride resin composition can be improved.
염화비닐 수지의 중합도가 500 미만이거나 중량평균 분자량이 25,000 g/mol 미만일 경우 물성이 부족해 가공성 및 가공 후 제품의 내구성이 저하될 우려가 있고, 중합도가 3,000 초과이거나 중량평균 분자량이 300,000 g/mol 초과일 경우 분자량이 너무 높아 성형 또는 가공이 어려울 수 있다. 보다 구체적으로는, 상기 염화비닐 수지는 중합도가 700 이상 1,700 미만이거나 또는 중량평균 분자량(Mw)가 45,000 내지 250,000 g/mol일 수 있다. If the degree of polymerization of the vinyl chloride resin is less than 500 or the weight average molecular weight is less than 25,000 g/mol, there is a risk that the processability and durability of the product after processing may be reduced due to insufficient physical properties, and if the degree of polymerization is more than 3,000 or the weight average molecular weight is more than 300,000 g/mol. In this case, the molecular weight may be too high, making molding or processing difficult. More specifically, the vinyl chloride resin may have a degree of polymerization of 700 to 1,700 or a weight average molecular weight (Mw) of 45,000 to 250,000 g/mol.
한편, 본 발명에 있어서, 염화비닐 수지의 중량평균 분자량(Mw)은 겔투과 크로마토그래피에 의한 표준 폴리스티렌 환산 값이다. 또, 염화비닐 수지의 중합도는 JIS K 6720-2에 의하여 측정될 수 있다.Meanwhile, in the present invention, the weight average molecular weight (Mw) of the vinyl chloride resin is a standard polystyrene conversion value determined by gel permeation chromatography. Additionally, the degree of polymerization of vinyl chloride resin can be measured according to JIS K 6720-2.
본 발명의 염화비닐 수지 조성물은 가소제로서 상기 화학식 1로 표시되는 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일을 포함한다. 이와 같이 가소제로 두 종류의 화합물을 혼합 사용함으로써, 겔링 속도, 내후성 및 내변색성, 가소제 내이행성 등의 물성을 증대시킬 수 있다. The vinyl chloride resin composition of the present invention includes a cyclohexane dicarboxylate-based compound represented by Formula 1 and an epoxidized vegetable oil as a plasticizer. By using a mixture of two types of compounds as a plasticizer, physical properties such as gelling speed, weather resistance, discoloration resistance, and plasticizer migration resistance can be increased.
상기 화학식 1로 표시되는 사이클로헥산 디카르복실레이트계 화합물은 치환기 위치에 따라 하기 화학식 1-1 내지 화학식 1-3으로 표시될 수 있다:The cyclohexane dicarboxylate-based compound represented by Formula 1 may be represented by the following Formulas 1-1 to 1-3 depending on the position of the substituent:
[화학식 1-1][Formula 1-1]
[화학식 1-2][Formula 1-2]
[화학식 1-3][Formula 1-3]
상기 화학식 1-1 내지 1-3에서 R1 및 R2는 화학식 1에서 정의한 바와 같다.In Formulas 1-1 to 1-3, R 1 and R 2 are as defined in Formula 1.
상기 화학식 1-1은 사이클로헥산-1,4-디카르복실레이트계 화합물이고, 상기 화학식 1-2는 사이클로헥산-1,3-디카르복실레이트계 화합물이며, 상기 화학식 1-3은 사이클로헥산-1,2-디카르복실레이트계 화합물이다.The formula 1-1 is a cyclohexane-1,4-dicarboxylate-based compound, the formula 1-2 is a cyclohexane-1,3-dicarboxylate-based compound, and the formula 1-3 is a cyclohexane-based compound. -1,2-dicarboxylate-based compound.
또한, 상기 화학식 1-1 내지 1-3에서, R1 및 R2는 각각 독립적으로 부틸기, 이소부틸기, 펜틸기, 헥실기, 헵틸기, 2-에틸헥실기, 옥틸기, 노닐기, 이소노닐기, 2-프로필헵틸기, 데실기, 또는 이소데실기이다. 바람직하게는, R1 및 R2는 각각 독립적으로 부틸기, 2-에틸헥실기, 또는 이소노닐기이다.Additionally, in Formulas 1-1 to 1-3, R 1 and R 2 are each independently a butyl group, isobutyl group, pentyl group, hexyl group, heptyl group, 2-ethylhexyl group, octyl group, nonyl group, It is an isononyl group, 2-propylheptyl group, decyl group, or isodecyl group. Preferably, R 1 and R 2 are each independently a butyl group, 2-ethylhexyl group, or isononyl group.
일 구현예에서, 상기 사이클로헥산 디카르복실레이트계 화합물은 디(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트, 디이소노닐사이클로헥산-1,2-디카르복실레이트, 디(2-에틸헥실)사이클로헥산-1,2-디카르복실레이트, 부틸(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트, 및 디부틸사이클로헥산-1,4-디카르복실레이트로 이루어진 군에서 선택되는 1종 이상일 수 있다. In one embodiment, the cyclohexane dicarboxylate-based compound is di(2-ethylhexyl)cyclohexane-1,4-dicarboxylate, diisononylcyclohexane-1,2-dicarboxylate, di (2-ethylhexyl)cyclohexane-1,2-dicarboxylate, butyl(2-ethylhexyl)cyclohexane-1,4-dicarboxylate, and dibutylcyclohexane-1,4-dicarboxylate. It may be one or more types selected from the group consisting of rates.
바람직하게는, 상기 사이클로헥산 디카르복실레이트계 화합물은 하기 화학식 1-4로 표시되는 디(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트(di(2-ethylhexyl) cyclohexane-1,4-dicarboxylate, DEHCH)일 수 있다:Preferably, the cyclohexane dicarboxylate-based compound is di(2-ethylhexyl)cyclohexane-1,4-dicarboxylate (di(2-ethylhexyl) cyclohexane-1) represented by the following formula 1-4: ,4-dicarboxylate, DEHCH) may be:
[화학식 1-4][Formula 1-4]
상기 DEHCH는 다른 사이클로헥산 디카르복실레이트계 화합물과 비교하여 가소화 효율과 가소제 내이행성이 보다 우수하고 겔링속도가 빠른 장점을 갖는다. 이에, 사이클로헥산 디카르복실레이트계 화합물로서 DEHCH를 사용할 경우 염화비닐 수지 조성물의 제반 물성을 더욱 향상시킬 수 있어 바람직하다.Compared to other cyclohexane dicarboxylate compounds, DEHCH has the advantages of superior plasticization efficiency and plasticizer migration resistance and a fast gelling speed. Accordingly, it is preferable to use DEHCH as a cyclohexane dicarboxylate-based compound because it can further improve the overall physical properties of the vinyl chloride resin composition.
상기 사이클로헥산 디카르복실레이트계 화합물은 염화비닐 수지 조성물에 포함되는 가소제 총 100 중량부에 대하여, 30 중량부 이상, 40 중량부 이상, 또는 50 중량부 이상이면서, 90 중량부 이하, 85 중량부 이하, 또는 80 중량부 이하의 범위로 포함됨이 바람직하다. The cyclohexane dicarboxylate-based compound is present in an amount of 30 parts by weight or more, 40 parts by weight, or 50 parts by weight, and 90 parts by weight or less, or 85 parts by weight, based on a total of 100 parts by weight of the plasticizer contained in the vinyl chloride resin composition. It is preferably included in the range of less than or equal to 80 parts by weight.
가소제 100 중량부에 대하여 사이클로헥산 디카르복실레이트계 화합물이 90 중량부를 초과하는 경우, 겔링 속도는 우수할 수 있으나, 가열감량이 증가하는 문제가 있을 수 있다. 또, 사이클로헥산 디카르복실레이트계 화합물의 함량이 가소제 조성물 100 중량부에 대하여 10 중량부 미만으로 너무 적을 경우, 겔링 속도가 떨어지고 가소화 효율이 낮은 문제가 있을 수 있으므로, 상기 범위를 만족함이 바람직하다. If the cyclohexane dicarboxylate-based compound exceeds 90 parts by weight based on 100 parts by weight of the plasticizer, the gelling speed may be excellent, but there may be a problem of increased heat loss. In addition, if the content of the cyclohexane dicarboxylate-based compound is too small, less than 10 parts by weight per 100 parts by weight of the plasticizer composition, there may be a problem of reduced gelling speed and low plasticization efficiency, so it is preferable to satisfy the above range. do.
상기 에폭시화 식물성 오일은 지방산 알킬 에스테르를 에폭시화 하여 제조된 에폭시화된 지방산 알킬 에스테르이다. 이러한 에폭시화 오일은 내열성, 내후성, 가소화 효율, 및 가열 감량을 개선시키는 효과를 나타낼 수 있으며, 경제성이 우수하다. The epoxidized vegetable oil is an epoxidized fatty acid alkyl ester prepared by epoxidizing a fatty acid alkyl ester. These epoxidized oils can improve heat resistance, weather resistance, plasticization efficiency, and heat loss, and are highly economical.
구체적으로 상기 에폭시화 식물성 오일은 식물성 지방산 에스테르의 불포화 결합에 에폭시기를 도입한 것으로서, 예를 들어 에폭시화 대두유(epoxidized soybean oil), 에폭시화 피마자유(epoxidized castor oil), 에폭시화 아마인유(epoxidized linseed oil), 에폭시화 팜유(epoxidized palm oil), 에폭시화 스테아레이트 (epoxidized stearate), 에폭시화 올리에이트(epoxidized oleate), 에폭시화 톨유(epoxidized tall oil), 및 에폭시화 리놀레이트(epoxidized linoleate)로 이루어지는 군에서 선택되는 1종 이상이 사용될 수 있다. 이 중, 가격적인 측면과 국내 수급의 용이성을 고려하였을 때 에폭시화 대두유가 바람직할 수 있다.Specifically, the epoxidized vegetable oil is one in which an epoxy group is introduced into the unsaturated bond of a vegetable fatty acid ester, for example, epoxidized soybean oil, epoxidized castor oil, and epoxidized linseed oil. oil), epoxidized palm oil, epoxidized stearate, epoxidized oleate, epoxidized tall oil, and epoxidized linoleate. One or more types selected from the group may be used. Among these, epoxidized soybean oil may be preferable when considering price and ease of domestic supply.
상기 에폭시화 식물성 오일은 염화비닐 수지 조성물에 포함되는 가소제 총 100 중량부에 대하여 10 중량부 이상, 15 중량부 이상, 또는 20 중량부 이상이면서, 70 중량부 이하, 60 중량부 이하, 또는 50 중량부 이하로 사용될 수 있다. The epoxidized vegetable oil is present in an amount of at least 10 parts by weight, at least 15 parts by weight, or at least 20 parts by weight, and at most 70 parts by weight, at most 60 parts by weight, or at 50 parts by weight, based on a total of 100 parts by weight of the plasticizer included in the vinyl chloride resin composition. It can be used below.
에폭시화 식물성 오일이 가소제 100 중량부 중 10 중량부 미만일 경우, 내열성 및 내후성 특성이 떨어질 수 있다. 반대로, 에폭시화 식물성 오일의 함량이 90 중량부를 초과하면 상대적으로 사이클로헥산 디카르복실레이트계 화합물의 함량이 줄어들어, 겔링 속도가 느려지고, 점도가 높고 내이행성이 저하되는 등의 문제가 발생할 수 있다. If the amount of epoxidized vegetable oil is less than 10 parts by weight out of 100 parts by weight of plasticizer, heat resistance and weather resistance properties may be reduced. Conversely, if the content of epoxidized vegetable oil exceeds 90 parts by weight, the content of cyclohexane dicarboxylate-based compounds is relatively reduced, which may cause problems such as slow gelling speed, high viscosity, and reduced migration resistance.
한편, 본 발명의 염화비닐 수지 조성물은 상술한 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일 외에, 추가의 가소제 화합물을 더 포함할 수 있다. 이러한 추가 가소제 화합물로는, 테레프탈레이트계 가소제, 식물성 오일, 시트레이트계 가소제 등을 들 수 있다. 추가 가소제 화합물은 본 발명의 효과를 저해하지 않도록, 염화비닐 수지 조성물 내 포함되는 가소제 총 100 중량부 중 50 중량부 이하, 또는 30 중량부 이하인 것이 바람직하다. Meanwhile, the vinyl chloride resin composition of the present invention may further include an additional plasticizer compound in addition to the cyclohexane dicarboxylate-based compound and epoxidized vegetable oil. Such additional plasticizer compounds include terephthalate-based plasticizers, vegetable oils, citrate-based plasticizers, and the like. The amount of the additional plasticizer compound is preferably 50 parts by weight or less, or 30 parts by weight or less, based on a total of 100 parts by weight of the plasticizer contained in the vinyl chloride resin composition, so as not to impair the effect of the present invention.
바람직한 일 구현예에서, 본 발명의 염화비닐 수지 조성물은 가소제로서 상술한 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일 외에 다른 가소제를 더 포함하지 않을 수 있다. 이때, 상기 사이클로헥산 디카르복실레이트계 화합물로는 DEHCH를, 에폭시화 식물성 오일로는 에폭시화 대두유를 사용할 수 있다.In a preferred embodiment, the vinyl chloride resin composition of the present invention may not further contain any plasticizer other than the cyclohexane dicarboxylate-based compound and epoxidized vegetable oil as the plasticizer. At this time, DEHCH can be used as the cyclohexane dicarboxylate-based compound, and epoxidized soybean oil can be used as the epoxidized vegetable oil.
상기 화학식 1로 표시되는 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일을 포함하는 가소제는, 염화비닐 수지 100 중량부에 대하여 20 중량부 이상, 22 중량부 이상, 또는 45 중량부 이상이면서, 100 중량부 이하, 80 중량부 이하, 또는 75 중량부 이하로 포함할 수 있다. 가소제가 염화비닐 수지 100 중량부에 대하여 30 중량부 미만으로 포함될 경우 염화비닐 수지 조성물의 유연성이 떨어지고, 100 중량부를 초과하면 조성물의 점도가 낮고 유연성이 극대화되어 제품에 부적합하고 가공 또한 어려울 수 있다.The plasticizer containing the cyclohexane dicarboxylate-based compound and epoxidized vegetable oil represented by Formula 1 is present in an amount of 20 parts by weight or more, 22 parts by weight, or 45 parts by weight or more, based on 100 parts by weight of the vinyl chloride resin, It may contain 100 parts by weight or less, 80 parts by weight or less, or 75 parts by weight or less. If the plasticizer is included in less than 30 parts by weight based on 100 parts by weight of the vinyl chloride resin, the flexibility of the vinyl chloride resin composition decreases, and if it exceeds 100 parts by weight, the viscosity of the composition is low and flexibility is maximized, making it unsuitable for products and processing may also be difficult.
상기 열 안정제는 염화비닐 수지 조성물의 내열성을 향상시키고 제품의 사용기간 중 물성 변화를 예방하는 목적으로 첨가되며, 본 발명에서는 열 안정제로서 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 동시에 포함한다.The heat stabilizer is added for the purpose of improving the heat resistance of the vinyl chloride resin composition and preventing changes in physical properties during the product's use. In the present invention, the heat stabilizer includes both a Ba-Zn-based heat stabilizer and a Na-Zn-based heat stabilizer. do.
Ba-Zn계 열 안정제는 열 안정성 및 투명성이 우수하여 데코레이션 시트와 같은 실내 장식용 염화비닐 수지 조성물에 사용된다. 그러나 일부 Ba-Zn계 열 안정제의 경우, 실내 장식용으로 시공된 후에 과도한 수분, 과도한 햇빛 등의 환경에 노출되면 염화비닐 수지나, 가소제 등 첨가제의 화학적 구조를 변경시킬 수 있고, 이에 따라 변색이 발생하는 단점이 있다. Ba-Zn-based heat stabilizers have excellent thermal stability and transparency and are used in vinyl chloride resin compositions for interior decoration such as decoration sheets. However, in the case of some Ba-Zn-based heat stabilizers, if exposed to environments such as excessive moisture or excessive sunlight after being used for interior decoration, the chemical structure of additives such as vinyl chloride resin or plasticizer may change, resulting in discoloration. There is a downside to this.
한편 Na-Zn계 열 안정제를 사용할 경우, 상대적으로 시공 후 변색 특성은 양호하지만, 열 안정성이 낮아 카렌다 혹은 압출 가공 중 제품이 탄화될 가능성이 있다. On the other hand, when using a Na-Zn-based heat stabilizer, the discoloration characteristics after construction are relatively good, but the heat stability is low, so there is a possibility that the product may carbonize during calendering or extrusion processing.
이에, 본 발명에서는 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 동시에 사용하여, 염화비닐 수지 조성물의 열안정성 뿐만 아니라 변색 특성을 크게 향상시켰다. Accordingly, in the present invention, the thermal stability as well as the discoloration characteristics of the vinyl chloride resin composition were greatly improved by simultaneously using a Ba-Zn-based heat stabilizer and a Na-Zn-based heat stabilizer.
상술한 효과를 확보하기 위하여, Ba-Zn계 열 안정제는 염화비닐 수지 조성물에 포함되는 열 안정제 총 100 중량부에 대하여 30 중량부 이상, 40 중량부 이상, 또는 50 중량부 이상으로 포함되는 것이 바람직하다. Ba-Zn계 열 안정제의 함량이 너무 낮으면 충분한 내열성을 확보할 수 없다. 또, Ba-Zn계 열 안정제의 함량이 지나치게 높으면 염화비닐 수지 조성물의 가공 시 Ba, Zn 성분과 가공 기기간 상호작용으로 제품 성형이 어려운 문제가 있을 수 있는 바, Ba-Zn계 열 안정제는 염화비닐 수지 조성물에 포함되는 열 안정제 총 100 중량부에 대하여 80 중량부 이하, 또는 70 중량부 이하인 것이 바람직하다.In order to ensure the above-described effect, the Ba-Zn-based heat stabilizer is preferably included in an amount of 30 parts by weight or more, 40 parts by weight, or 50 parts by weight or more based on a total of 100 parts by weight of the heat stabilizer included in the vinyl chloride resin composition. do. If the content of the Ba-Zn-based heat stabilizer is too low, sufficient heat resistance cannot be secured. In addition, if the content of the Ba-Zn-based heat stabilizer is too high, there may be problems in product molding due to the interaction between Ba and Zn components and processing equipment during processing of the vinyl chloride resin composition. Ba-Zn-based heat stabilizer is vinyl chloride. It is preferable that the heat stabilizer included in the resin composition is 80 parts by weight or less, or 70 parts by weight or less, based on a total of 100 parts by weight.
또, Na-Zn계 열 안정제는 염화비닐 수지 조성물의 내변색성을 향상시킬 수 있도록, 염화비닐 수지 조성물에 포함되는 열 안정제 총 100 중량부에 대하여 20 중량부 이상, 또는 30 중량부 이상이면서, 60 중량부 이하, 또는 50 중량부 이하의 범위로 포함되는 것이 바람직하다. In addition, the Na-Zn-based heat stabilizer is used in an amount of 20 parts by weight or more, or 30 parts by weight or more, based on a total of 100 parts by weight of the heat stabilizer contained in the vinyl chloride resin composition, so as to improve the discoloration resistance of the vinyl chloride resin composition. It is preferably contained in an amount of 60 parts by weight or less, or 50 parts by weight or less.
한편, 본 발명의 염화비닐 수지 조성물은 열 안정제로서 상술한 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제 외에, 목적하는 물성에 따라 통상 사용되는 기타 안정제를 더 포함할 수 있다. 이러한 기타 안정제로는 Ca-Zn계 화합물; K-Zn계 화합물; 유기 주석계 화합물; Mg-스테아레이트, Ca-스테아레이트, Pb-스테아레이트, Cd-스테아레이트, 또는 Ba-스테아레이트 등과 같은 메탈릭 비누계 화합물; 페놀계 화합물; 인산 에스테르계 화합물; 또는 아인산 에스테르계 화합물 등을 들 수 있다. 이러한 기타 안정제는 염화비닐 수지 조성물 중에 포함되는 열 안정제 총 100 중량부에 대하여, 30 중량부 이하, 또는 50 중량부 이하인 것이 바람직하다. Meanwhile, the vinyl chloride resin composition of the present invention may further include other commonly used stabilizers depending on the desired physical properties in addition to the Ba-Zn-based heat stabilizer and Na-Zn-based heat stabilizer as heat stabilizers. Other such stabilizers include Ca-Zn based compounds; K-Zn-based compounds; organotin-based compounds; Metallic soap-based compounds such as Mg-stearate, Ca-stearate, Pb-stearate, Cd-stearate, or Ba-stearate; phenolic compounds; Phosphate ester-based compounds; Or phosphorous acid ester-based compounds, etc. can be mentioned. These other stabilizers are preferably used in an amount of 30 parts by weight or less, or 50 parts by weight or less, based on a total of 100 parts by weight of the heat stabilizer included in the vinyl chloride resin composition.
본 발명의 염화비닐 수지 조성물은 상기 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제 외에 다른 안정제를 더 포함하지 않을 수 있다. 바람직한 본 발명의 일 구현예에 따른 염화비닐 수지 조성물은, 조성물 내에 포함되는 열 안정제 100 중량부 중 Ba-Zn계 열 안정제를 50 내지 70 중량부, Na-Zn계 열 안정제를 30 내지 50 중량부로 포함할 수 있다.The vinyl chloride resin composition of the present invention may not further contain any other stabilizer other than the Ba-Zn-based heat stabilizer and the Na-Zn-based heat stabilizer. A vinyl chloride resin composition according to a preferred embodiment of the present invention contains 50 to 70 parts by weight of a Ba-Zn-based heat stabilizer and 30 to 50 parts by weight of a Na-Zn-based heat stabilizer based on 100 parts by weight of the heat stabilizer contained in the composition. It can be included.
상기 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 포함하는 열 안정제는 염화비닐 수지 100 중량부에 대하여 0.1 중량부 이상, 0.5 중량부 이상, 1 중량부 이상, 또는 2 중량부 이상이면서 10 중량부 이하, 7 중량부 이하, 또는 5 중량부 이하로 포함되는 것이 바람직하다. 열 안정제의 함량이 0.1 중량부 미만이면 염화비닐 수지 조성물의 열 안정성을 확보할 수 없으며, 10 중량부를 초과하는 경우 조성물의 가공성이 떨어져 조성물이 기기에 달라붙는 등, 제품 생산 시 문제가 있을 수 있는 바, 상기 범위를 만족함이 바람직하다.The heat stabilizer including the Ba-Zn-based heat stabilizer and the Na-Zn-based heat stabilizer is present in an amount of 0.1 part by weight or more, 0.5 part by weight, 1 part by weight, or 2 parts by weight or more, and 10 parts by weight, based on 100 parts by weight of the vinyl chloride resin. Not more than 7 parts by weight, or not more than 5 parts by weight It is desirable to include it. If the content of the heat stabilizer is less than 0.1 parts by weight, the thermal stability of the vinyl chloride resin composition cannot be secured, and if it exceeds 10 parts by weight, the processability of the composition is reduced, which may cause problems during product production, such as the composition sticking to devices. However, it is desirable to satisfy the above range.
본 발명의 바람직한 일 구현예에 따른 염화비닐 수지 조성물은, 염화비닐 수지 100 중량부에 대하여 상기 가소제를 20 내지 100 중량부로 포함하고, 상기 열 안정제를 0.1 내지 10 중량부로 포함하는 것일 수 있다. The vinyl chloride resin composition according to a preferred embodiment of the present invention may include 20 to 100 parts by weight of the plasticizer and 0.1 to 10 parts by weight of the heat stabilizer based on 100 parts by weight of the vinyl chloride resin.
본 발명의 보다 바람직한 일 구현예에 따른 염화비닐 수지 조성물은, 염화비닐 수지 100 중량부에 대하여 상기 가소제를 20 내지 75 중량부로 포함하고, 상기 열 안정제를 2 내지 5 중량부로 포함하는 것일 수 있다. The vinyl chloride resin composition according to a more preferred embodiment of the present invention may include 20 to 75 parts by weight of the plasticizer and 2 to 5 parts by weight of the heat stabilizer based on 100 parts by weight of the vinyl chloride resin.
한편, 상기 염화비닐 수지 조성물은 상술한 열 안정제 외에, UV 안정제, 충전제, 안료, 가공조제 등과 같은 첨가제를 추가로 포함할 수 있다. 상기 첨가제는 염화비닐 수지 조성물에서 향상시키고자 하는 물성에 따라 적합하게 선택될 수 있다. Meanwhile, the vinyl chloride resin composition may further include additives such as UV stabilizers, fillers, pigments, processing aids, etc., in addition to the heat stabilizers described above. The additive may be appropriately selected depending on the physical properties to be improved in the vinyl chloride resin composition.
UV 안정제는 빛에 의한 손상을 방지하기 위하여 첨가할 수 있으며, 벤조페논계, 아민계, 벤조트리아졸계 등의 안정제가 사용될 수 있다. 이 중, 염화비닐 수지가 가장 취약한 280 내지 340 nm 영역의 자외선 흡수능이 우수한 벤조페논계 안정제가 적합하게 사용될 수 있고, 바람직하게는 2-히드록시-4-옥틸옥시벤조페논을 사용할 수 있다. UV 안정제는 염화비닐 수지 100 중량부에 대하여 0.1 내지 10 중량부, 또는 0.5 내지 5 중량부로 사용될 수 있다.UV stabilizers can be added to prevent damage from light, and stabilizers such as benzophenone-based, amine-based, and benzotriazole-based stabilizers can be used. Among these, a benzophenone-based stabilizer with excellent UV absorption ability in the 280 to 340 nm region, where vinyl chloride resin is most vulnerable, can be suitably used, and 2-hydroxy-4-octyloxybenzophenone can be preferably used. The UV stabilizer may be used in an amount of 0.1 to 10 parts by weight, or 0.5 to 5 parts by weight, based on 100 parts by weight of the vinyl chloride resin.
충전제는 염화비닐 수지 조성물의 생산성, 건조 상태의 감촉(Dry touch)감 등을 향상시키는 목적으로 사용되며, 탄산칼슘, 탈크, 이산화티탄, 카올린, 실리카, 알루미나, 수산화마그네슘 또는 점토로 이루어진 군에서 선택되는 어느 하나 이상인 것을 포함한다.The filler is used to improve the productivity and dry touch of the vinyl chloride resin composition, and is selected from the group consisting of calcium carbonate, talc, titanium dioxide, kaolin, silica, alumina, magnesium hydroxide, or clay. Includes one or more things that are
상기 본 발명에 따른 염화비닐 수지 조성물에서 상기 충전제는 염화비닐 수지 100 중량부에 대하여 바람직하게는 10 내지 150 중량부, 더욱 바람직하게는 50 내지 130 중량부 포함될 수 있다. 충전제가 50 중량부 미만으로 포함된 경우, 치수안정성과 경제성이 낮아지는 문제점이 있고, 130 중량부 초과하여 포함된 경우, 가공성이 저하되는 문제점이 있다.In the vinyl chloride resin composition according to the present invention, the filler may be included in an amount of preferably 10 to 150 parts by weight, more preferably 50 to 130 parts by weight, based on 100 parts by weight of the vinyl chloride resin. If the filler is included in less than 50 parts by weight, there is a problem that dimensional stability and economic efficiency are lowered, and if the filler is included in more than 130 parts by weight, there is a problem that processability is reduced.
상기 안료는 이산화티타늄, 카본블랙, 카드뮴계 안료 등일 수 있다. 상기 안료는 염화비닐 수지 100 중량부에 대하여 0.1 내지 20 중량부, 또는 1 내지 15 중량부로 포함될 수 있다. 안료가 0.1 중량부 미만으로 포함될 경우 색상 구현이 어려우며, 20 중량부를 초과하면 기계적 물성이 저하될 수 있다.The pigment may be titanium dioxide, carbon black, cadmium-based pigment, etc. The pigment may be included in an amount of 0.1 to 20 parts by weight, or 1 to 15 parts by weight, based on 100 parts by weight of the vinyl chloride resin. If the pigment is included in less than 0.1 parts by weight, it is difficult to realize color, and if it exceeds 20 parts by weight, mechanical properties may deteriorate.
가공조제는 염화비닐 수지 조성물의 겔링을 촉진하고, 균일한 혼련을 가능케 하고, 기계적 물성을 향상시키기 위하여 첨가할 수 있다. 가공조제는 알킬 아크릴레이트, 알킬메타크릴레이트, 또는 이들의 공중합체인 아크릴계 가공조제가 사용될 수 있다. 일례로, n-부틸아크릴레이트 및 메틸메타크릴레이트의 공중합체, 2-에틸헥실아크릴레이트, 메틸메타크릴레이트, 및 부틸메타크릴레이트 공중합체 등을 들 수 있으나, 이에 제한되는 것은 아니다. 이러한 가공조제는 염화비닐수지 100 중량부에 대하여 0.1 내지 10 중량부, 또는 0.3 내지 5 중량부로 사용될 수 있다.Processing aids can be added to promote gelling of the vinyl chloride resin composition, enable uniform mixing, and improve mechanical properties. The processing aid may be an acrylic processing aid such as alkyl acrylate, alkyl methacrylate, or a copolymer thereof. Examples include, but are not limited to, copolymers of n-butylacrylate and methyl methacrylate, 2-ethylhexyl acrylate, methyl methacrylate, and butyl methacrylate. These processing aids may be used in an amount of 0.1 to 10 parts by weight, or 0.3 to 5 parts by weight, based on 100 parts by weight of the vinyl chloride resin.
본 발명에 따른 염화비닐 수지 조성물은 상술한 염화비닐 수지, 가소제, 열 안정제, 및 선택적으로 기타 첨가제를 사용하여 당업계에 일반적으로 알려진 방법에 의하여 제조될 수 있으며, 그 제조방법은 특별히 한정되지 않는다.The vinyl chloride resin composition according to the present invention can be manufactured by methods generally known in the art using the above-described vinyl chloride resin, plasticizer, heat stabilizer, and optionally other additives, and the manufacturing method is not particularly limited. .
상기 염화비닐 수지 조성물은, 빠른 겔링 속도를 나타내어 가공성이 우수하고, 내후성 및 내변색성이 우수하여 가공 후 빛 또는 수분에 의한 변색이 적고, 열 안정성 및 가소제 내이행성이 우수하다. 또한 프탈레이트계 가소제를 포함하지 않으므로 친환경적이다.The vinyl chloride resin composition exhibits a fast gelling speed, has excellent processability, has excellent weather resistance and discoloration resistance, has less discoloration due to light or moisture after processing, and has excellent heat stability and plasticizer migration resistance. It is also environmentally friendly because it does not contain phthalate plasticizers.
본 발명의 염화비닐 수지 조성물은 상술한 바와 같은 우수한 특성으로 인해 내열 특성 및 내변색 특성 요구되는 분야에 적합하게 사용될 수 있다. 구체적으로, 상기 염화비닐 수지 조성물은 벽지, 바닥재, 데코레이션 시트, 포장재, 전선피복재, 자동차 내장재, 필름, 인조가죽, 타포린, 호스, 또는 튜브 등으로 사용될 수 있으며, 특히 벽지, 바닥재, 데코레이션 시트 등과 같은 실내 장식품에 특히 유용할 수 있다. The vinyl chloride resin composition of the present invention can be suitably used in fields requiring heat resistance and discoloration resistance due to its excellent properties as described above. Specifically, the vinyl chloride resin composition can be used as wallpaper, flooring, decoration sheets, packaging materials, wire covering materials, automobile interior materials, films, artificial leather, tarpaulins, hoses, or tubes, especially wallpaper, flooring, decoration sheets, etc. It can be particularly useful for upholstery.
한편, 본 발명의 다른 일 측면에 따르면, 상기 염화비닐 수지 조성물을 포함하는 성형품이 제공된다. 상기 성형품은 그 용도에 따라 상기 염화비닐 수지 조성물로부터 제조되거나, 안정제, 충진제, 및/또는 발포제 등의 첨가제를 추가로 첨가하여 제조될 수 있다.Meanwhile, according to another aspect of the present invention, a molded article containing the vinyl chloride resin composition is provided. The molded article may be manufactured from the vinyl chloride resin composition, or may be manufactured by additionally adding additives such as stabilizers, fillers, and/or foaming agents, depending on the intended use.
상기 성형품은 벽지, 바닥재, 데코레이션 시트, 포장재, 전선피복재, 자동차 내장재, 필름, 인조가죽, 타포린, 호스, 또는 튜브 등으로 사용될 수 있으며, 열 안정성, 내후성 및 내변색성이 우수한 바, 실내 장식품 분야에 특히 적합하게 사용될 수 있다.The molded product can be used as wallpaper, flooring, decoration sheets, packaging materials, wire coverings, automobile interior materials, films, artificial leather, tarpaulins, hoses, or tubes, and has excellent heat stability, weather resistance, and discoloration resistance, and in the field of interior decoration. It can be used particularly suitably.
이하, 하기 실시예에 의하여 본 발명을 더욱 상세하게 설명하고자 한다. 단, 하기 실시예는 본 발명을 예시하기 위한 것일 뿐 본 발명의 범위가 이들만으로 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through the following examples. However, the following examples are only for illustrating the present invention and the scope of the present invention is not limited to these only.
[실시예][Example]
<염화비닐 수지 조성물의 제조><Manufacture of vinyl chloride resin composition>
실시예 1Example 1
폴리염화비닐(한화솔루션 P-1000, 중합도 1000±50, Mw 90,000, D50 50~100㎛) 100 중량부에 대하여, 디(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트(DEHCH) 17.5 중량부, 에폭시화 대두유(Epoxidized Soybean Oil, ESO, 송원산업 E-700) 5 중량부, Ba-Zn계 열 안정제(BZ-150T, 송원산업) 1.25 중량부, 및 Na-Zn계 열 안정제(LFX 910d-1, 케이디켐) 1.25 중량부를 첨가하였다.For 100 parts by weight of polyvinyl chloride (Hanwha Solution P-1000, degree of polymerization 1000±50, Mw 90,000, D 50 50~100㎛), di(2-ethylhexyl)cyclohexane-1,4-dicarboxylate ( DEHCH) 17.5 parts by weight, epoxidized soybean oil (ESO, Songwon Industry E-700) 5 parts by weight, Ba-Zn-based heat stabilizer (BZ-150T, Songwon Industry) 1.25 parts by weight, and Na-Zn-based heat stabilizer 1.25 parts by weight of stabilizer (LFX 910d-1, KD Chem) was added.
여기에, 백색 안료(Dupont의 R-902) 15 중량부, UV 안정제(Solvay의 UV-531) 0.5 중량부, 가공조제(DOW의 K 125) 0.3 중량부를 첨가하고 Mixer로 혼합한 후 Roll mill을 사용하여 혼련하여 염화비닐 수지 조성물을 제조하였다. Here, 15 parts by weight of white pigment (Dupont's R-902), 0.5 parts by weight of UV stabilizer (Solvay's UV-531), and 0.3 parts by weight of processing aid (DOW's K 125) were added, mixed with a mixer, and then milled. A vinyl chloride resin composition was prepared by kneading.
실시예 2 내지 5Examples 2 to 5
DEHCH, ESO, Ba-Zn계 열 안정제, 및 Na-Zn계 열 안정제의 함량을 하기 표 1과 같이 한 것을 제외하고는, 실시예 1과 동일한 방법으로 염화비닐 수지 조성물을 제조하였다.A vinyl chloride resin composition was prepared in the same manner as in Example 1, except that the contents of DEHCH, ESO, Ba-Zn-based heat stabilizer, and Na-Zn-based heat stabilizer were as shown in Table 1 below.
비교예 1Comparative Example 1
가소제로 DEHCH 및 ESO 대신 디프로필헵틸프탈레이트(DPHP) 25 중량부를 사용하고, 열 안정제로서 Ba-Zn계 열 안정제(BZ-150T, 송원산업) 2 중량부를 사용한 것을 제외하고는 실시예 1과 동일한 방법으로 염화비닐 수지 조성물을 제조하였다.The same method as Example 1 except that 25 parts by weight of dipropylheptyl phthalate (DPHP) was used instead of DEHCH and ESO as a plasticizer, and 2 parts by weight of a Ba-Zn-based heat stabilizer (BZ-150T, Songwon Industry) was used as a heat stabilizer. A vinyl chloride resin composition was prepared.
비교예 2Comparative Example 2
가소제로 DEHCH 25 중량부를 사용한 것을 제외하고, 비교예 1과 동일한 방법으로 염화비닐 수지 조성물을 제조하였다.A vinyl chloride resin composition was prepared in the same manner as Comparative Example 1, except that 25 parts by weight of DEHCH was used as a plasticizer.
비교예 3Comparative Example 3
열 안정제로서 Ba-Zn계 열 안정제 대신 Na-Zn계 열 안정제(LFX 910d-1, 케이디켐) 2 중량부를 사용한 것을 제외하고, 비교예 2와 동일한 방법으로 염화비닐 수지 조성물을 제조하였다.A vinyl chloride resin composition was prepared in the same manner as in Comparative Example 2, except that 2 parts by weight of a Na-Zn-based heat stabilizer (LFX 910d-1, KD Chem) was used as a heat stabilizer instead of a Ba-Zn-based heat stabilizer.
<실험예><Experimental example>
(1) 실내 변색도 (△WI 및 △YI)(1) Indoor discoloration degree (△WI and △YI)
염화비닐 수지 조성물을 Roll mill 가공(170℃, 3분)과 Press 가공(180℃, 8분)을 순차적으로 진행하여 6 mm 평판을 제조하였다. The vinyl chloride resin composition was sequentially subjected to roll mill processing (170°C, 3 minutes) and press processing (180°C, 8 minutes) to prepare a 6 mm flat plate.
이렇게 제조된 시편에 대해, ASTM E313 규격으로 White Index(WI, 백색도)와 Yellow index(YI, 황색도)를 측정하였다. For the specimens prepared in this way, the White Index (WI, whiteness) and Yellow Index (YI, yellowness) were measured according to ASTM E313 standards.
이후, 상기 시편 2개를 각각 실내의 햇빛에 노출되는 장소 및 햇빛에 노출되지 않는 그늘진 장소에 6 개월간 보관한 후에 각각 WI 및 YI를 측정하고, 이를 최초 측정값과 비교하여 실내 변색도를 계산하였다. Thereafter, the two specimens were stored in a place exposed to indoor sunlight and a shady place not exposed to sunlight for 6 months, respectively, and then the WI and YI were measured, and the indoor discoloration degree was calculated by comparing these with the initial measurement value. .
(2) 열 안정성 (2) Thermal stability
염화비닐 수지 조성물을 Roll mill 가공(170℃, 3분)한 시트를 15 ㎜ × 480 ㎜의 Strap 형태로 잘라 190℃ Mathis Oven에 장착하였다. Oven 내에 장착된 시편이 15 ㎜/5분의 속도로 Oven밖으로 배출되도록 설정하였다. 시험 종료 후 변색 시작 시점까지의 길이(탄화되지 않은 길이, ㎜)를 통해 내열시간(분)을 계산하였다.The sheet obtained by roll milling the vinyl chloride resin composition (170°C, 3 minutes) was cut into a strap of 15 mm × 480 mm and placed in a Mathis Oven at 190°C. The specimen mounted in the oven was set to be discharged out of the oven at a rate of 15 mm/5 minutes. Heat resistance time (minutes) was calculated based on the length (uncarbonized length, mm) from the end of the test to the start of discoloration.
(3) 겔링 시간(3) Gelling time
염화비닐 수지 54 g을 95 ℃ Brabender Mixer에 투입, 30 rpm으로 10분간 믹싱하였다. 믹서에서의 가공시간 동안 토크 변화를 통해 수지의 겔링 시간을 분석하였다.54 g of vinyl chloride resin was added to a Brabender Mixer at 95°C and mixed at 30 rpm for 10 minutes. The gelling time of the resin was analyzed through torque changes during processing time in the mixer.
(4) 가소제 이행량(4) Plasticizer delivery amount
염화비닐수지 조성물을 Roll mill 가공(170℃, 3분)과 Press 가공(180℃, 8분)을 순차적으로 진행하여 두께 2 mm 평판을 제조하였다. 제조된 평판을 지름 약 4 cm의 원형 시편으로 절단하였다. The vinyl chloride resin composition was sequentially subjected to roll mill processing (170°C, 3 minutes) and press processing (180°C, 8 minutes) to prepare a 2 mm thick plate. The prepared plate was cut into circular specimens with a diameter of approximately 4 cm.
시편의 상/하부에 Polypropylene 재질의 유분 흡수용 기름종이를 위치시키고, 5kg 하중, 60℃에서 7일간 방치하여 가소제 이행을 촉진시켰다. 가소제 이행실험 종료 후 시편과 기름종이의 무게 변화율을 측정하였다. Oil-absorbing paper made of polypropylene was placed on the top and bottom of the specimen and left at 60°C for 7 days under a 5kg load to promote the transfer of plasticizer. After completing the plasticizer transition experiment, the weight change rate of the specimen and oil paper was measured.
시편의 무게 변화율은 [(시편의 무게변화/시험 전 시편의 무게) × 100]으로 계산하였고, 기름종이의 무게 변화율은 [(기름종이의 무게변화/시험전 기름종이의 무게) × 100]으로 계산하였다. The weight change rate of the specimen was calculated as [(weight change of the specimen/weight of the specimen before the test) × 100], and the weight change rate of the oil paper was calculated as [(weight change of the oil paper/weight of the oil paper before the test) × 100]. Calculated.
시편의 무게 감소량은 기름종이의 무게 증가량과 동일하여, 본 실험에서는 시편의 무게 변화율만으로 가소제 내이행성을 평가하였다.Since the weight loss of the specimen was the same as the weight increase of the greaseproof paper, in this experiment, the plasticizer migration resistance was evaluated only based on the weight change rate of the specimen.
상기 표 2 내지 4를 참조하면, 실시예 1 내지 5의 염화비닐 수지 조성물은 우수한 내열성, 가소제 내이행성 및 겔링 속도를 나타내며, 백색도 및 황색도의 변화가 현저히 적어, 우수한 내변색 특성을 나타내는 것을 확인할 수 있다. Referring to Tables 2 to 4, it can be seen that the vinyl chloride resin compositions of Examples 1 to 5 exhibit excellent heat resistance, plasticizer migration resistance, and gelling speed, and the changes in whiteness and yellowness are significantly small, showing excellent discoloration resistance properties. You can.
Claims (12)
가소제; 및
열 안정제; 를 포함하며,
상기 가소제는 하기 화학식 1로 표시되는 사이클로헥산 디카르복실레이트계 화합물 및 에폭시화 식물성 오일을 포함하고,
상기 열 안정제는 Ba-Zn계 열 안정제 및 Na-Zn계 열 안정제를 포함하는,
염화비닐 수지 조성물:
[화학식 1]
상기 화학식 1에서,
R1 및 R2는 각각 독립적으로 탄소수 4 내지 12의 직쇄 또는 분지쇄 알킬기이다.
Vinyl chloride resin;
plasticizer; and
heat stabilizer; Includes,
The plasticizer includes a cyclohexane dicarboxylate-based compound represented by the following formula (1) and an epoxidized vegetable oil,
The heat stabilizer includes a Ba-Zn-based heat stabilizer and a Na-Zn-based heat stabilizer.
Vinyl chloride resin composition:
[Formula 1]
In Formula 1,
R 1 and R 2 are each independently a straight or branched alkyl group having 4 to 12 carbon atoms.
가소제 100 중량부에 대하여,
사이클로헥산 디카르복실레이트계 화합물을 30 내지 90 중량부로 포함하고,
에폭시화 식물성 오일을 10 내지 70 중량부로 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
For 100 parts by weight of plasticizer,
Containing 30 to 90 parts by weight of a cyclohexane dicarboxylate-based compound,
A vinyl chloride resin composition comprising 10 to 70 parts by weight of epoxidized vegetable oil.
열 안정제 100 중량부에 대하여,
Ba-Zn계 열 안정제를 30 내지 90 중량부로 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
For 100 parts by weight of heat stabilizer,
A vinyl chloride resin composition comprising 30 to 90 parts by weight of a Ba-Zn-based heat stabilizer.
열 안정제 100 중량부에 대하여,
Ba-Zn계 열 안정제를 50 내지 70 중량부로 포함하고,
Na-Zn계 열 안정제를 30 내지 50 중량부를 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
For 100 parts by weight of heat stabilizer,
Contains 50 to 70 parts by weight of a Ba-Zn-based heat stabilizer,
A vinyl chloride resin composition comprising 30 to 50 parts by weight of a Na-Zn-based heat stabilizer.
상기 사이클로헥산 디카르복실레이트계 화합물은 디(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트, 디이소노닐사이클로헥산-1,2-디카르복실레이트, 디(2-에틸헥실)사이클로헥산-1,2-디카르복실레이트, 부틸(2-에틸헥실)사이클로헥산-1,4-디카르복실레이트, 및 디부틸사이클로헥산-1,4-디카르복실레이트로 이루어진 군에서 선택되는 1종 이상인, 염화비닐 수지 조성물.
According to paragraph 1,
The cyclohexane dicarboxylate-based compounds include di(2-ethylhexyl)cyclohexane-1,4-dicarboxylate, diisononylcyclohexane-1,2-dicarboxylate, and di(2-ethylhexyl). ) In the group consisting of cyclohexane-1,2-dicarboxylate, butyl (2-ethylhexyl) cyclohexane-1,4-dicarboxylate, and dibutylcyclohexane-1,4-dicarboxylate. One or more selected vinyl chloride resin compositions.
상기 에폭시화 식물성 오일은 에폭시화 대두유, 에폭시화 피마자유, 에폭시화 아마인유, 에폭시화 팜유, 에폭시화 스테아레이트, 에폭시화 올리에이트, 에폭시화 톨유, 및 에폭시화 리놀레이트로 이루어진 군에서 선택되는 1종 이상인, 염화비닐 수지 조성물.
According to paragraph 1,
The epoxidized vegetable oil is one selected from the group consisting of epoxidized soybean oil, epoxidized castor oil, epoxidized linseed oil, epoxidized palm oil, epoxidized stearate, epoxidized oleate, epoxidized tall oil, and epoxidized linoleate. More than one type of vinyl chloride resin composition.
상기 염화비닐 수지는 중합도가 500 내지 3,000 이거나, 또는 중량평균분자량이 25,000 내지 300,000 g/mol인, 염화비닐 수지 조성물.
According to paragraph 1,
The vinyl chloride resin composition has a degree of polymerization of 500 to 3,000 or a weight average molecular weight of 25,000 to 300,000 g/mol.
염화비닐 수지 100 중량부에 대하여,
가소제를 20 내지 100 중량부로 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
For 100 parts by weight of vinyl chloride resin,
A vinyl chloride resin composition comprising 20 to 100 parts by weight of a plasticizer.
염화비닐 수지 100 중량부에 대하여,
열 안정제를 0.1 내지 10 중량부로 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
For 100 parts by weight of vinyl chloride resin,
A vinyl chloride resin composition comprising 0.1 to 10 parts by weight of a heat stabilizer.
UV 안정제, 충전제, 안료, 및 가공조제로 이루어지는 군에서 선택되는 1종 이상의 첨가제를 포함하는, 염화비닐 수지 조성물.
According to paragraph 1,
A vinyl chloride resin composition comprising at least one additive selected from the group consisting of UV stabilizers, fillers, pigments, and processing aids.
A molded article comprising the vinyl chloride resin composition of claim 1.
벽지, 바닥재, 데코레이션 시트, 포장재, 전선피복재, 자동차 내장재, 필름, 인조가죽, 타포린, 호스, 또는 튜브인, 성형품.
According to clause 11,
Wallpaper, flooring, decorative sheets, packaging materials, wire covering materials, automobile interior materials, films, artificial leather, tarpaulins, hoses or tubes, and molded products.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP21883263.2A EP4234621A1 (en) | 2020-10-20 | 2021-10-20 | Vinyl chloride resin composition |
| PCT/KR2021/014763 WO2022086195A1 (en) | 2020-10-20 | 2021-10-20 | Vinyl chloride resin composition |
| US18/246,936 US20230365798A1 (en) | 2020-10-20 | 2021-10-20 | Vinylchloride resin composition |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20200135961 | 2020-10-20 | ||
| KR1020200135961 | 2020-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220052272A KR20220052272A (en) | 2022-04-27 |
| KR102658860B1 true KR102658860B1 (en) | 2024-04-18 |
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