KR102649147B1 - Method and apparatus for manufacturing a display device - Google Patents

Abstract

The present invention provides a method and apparatus for manufacturing a display device that improves the formation quality of the film member, including an attachment step of attaching a film member to a substrate; A first cutting step of cutting the film member into first and second parts along a cutting path parallel to the edge of the substrate; a second cutting step of cutting the second portion of the film member into at least two or more pieces; a gripping step wherein a plurality of gripping portions each grip the pieces of the second portion; and a removal step of removing the pieces of the second portion of the film member from the substrate, wherein the removal step includes moving the plurality of gripping parts in a first direction perpendicular to one side of the substrate. first movement step; and a second moving step in which each of the plurality of holding parts moves at a constant speed along a direction intersecting the first direction. A method for manufacturing a display device and a manufacturing apparatus for the same are provided.

Description

{Method and apparatus for manufacturing a display device}

The present invention relates to a method and apparatus for manufacturing a display device, and more particularly, to a method and apparatus for manufacturing a display device including a film member.

A display device is a device that visually provides data. This display device includes a display area and a peripheral area outside the display area. In the display area, scan lines and data lines are arranged to be insulated from each other, and pixel circuits electrically connected to the scan lines and data lines are arranged. Additionally, light emitting elements that are driven by each pixel circuit and emit light are disposed in the display area. The peripheral area may be provided with various wires that transmit electrical signals to the display area, a scan driver, a data driver, a control section, etc.

Meanwhile, in order to improve the function and quality of the display device, film members with various functions can be attached to the display device. To manufacture such a display device, a film forming process to form a conductive layer and an insulating layer as well as an attachment process for a film member may be performed.

However, when the film member is cut to fit the size of the substrate of the display device according to the conventional method and then attached to the substrate, the precise formation of the film member is difficult due to the work tolerance that occurs during cutting and the work tolerance that occurs during attachment. There was a problem that it was difficult.

The present invention is intended to solve various problems including the problems described above, and its purpose is to provide a manufacturing method and manufacturing apparatus for a display device that precisely and well forms a film member on a substrate. However, these tasks are illustrative and do not limit the scope of the present invention.

According to one aspect of the present invention, an attachment step of attaching a film member to a substrate; A first cutting step of cutting the film member into first and second parts along a cutting path parallel to the edge of the substrate; a second cutting step of cutting the second portion of the film member into at least two or more pieces; a gripping step wherein a plurality of gripping portions each grip the pieces of the second portion; and a removal step of removing the pieces of the second portion of the film member from the substrate, wherein the removal step includes moving the plurality of gripping parts in a first direction perpendicular to one side of the substrate. first movement step; and a second moving step of moving each of the plurality of holding units at a constant speed along a direction intersecting the first direction.

According to this embodiment, the film member may cover the edge of the substrate on a plane.

According to this embodiment, the cutting path may be located inside the edge of the substrate.

According to this embodiment, the second cutting step may include cutting the second portion of the film member in a direction intersecting the cutting path of the first cutting step.

According to this embodiment, the number of the plurality of gripping portions may be equal to the number of the pieces of the second portion of the film member.

According to this embodiment, the first moving step and the second moving step of the removal step may be performed simultaneously.

According to this embodiment, the edge of the substrate includes a first side edge and a second side edge, each extending in directions intersecting each other in a plane, and the pieces of the second portion are of the substrate. It may include a first piece and a second piece overlapping the first side edge and the second side edge, respectively.

According to this embodiment, the plurality of gripping portions include a first gripping portion and a second gripping portion respectively gripping the first piece and the second piece of the second portion of the film member, and removing the film member. The second moving step may include moving each of the first gripping part and the second gripping part at a constant speed along a direction intersecting each other on a plane.

According to this embodiment, the edge of the substrate further includes a third side edge extending in the same direction as the first side edge on a plane but extending in a direction intersecting the second side edge, and the second side edge The pieces of the portion may further include a third piece overlapping the third side edge of the substrate.

According to this embodiment, the second piece of the second portion may include a 2-1 piece and a 2-2 piece cut from each other in a direction intersecting the second side edge of the substrate.

According to this embodiment, the plurality of gripping parts respectively grip the first piece, the 2-1 piece, the 2-2 piece, and the third piece of the second portion of the film member. It includes a first gripping part, a 2-1 gripping part, a 2-2 gripping part, and a third gripping part, and in the second moving step of the removing step, the first gripping part and the third gripping part are flat. moving at a constant speed along the same direction as each other; and moving the 2-1 gripping part and the 2-2 gripping part at a constant speed along a direction intersecting the movement direction of the first gripping part on a plane.

According to this embodiment, the 2-1 gripping part and the 2-2 gripping part can move in directions toward each other on a plane.

According to this embodiment, the edge of the substrate may further include a rounded corner edge connecting the first side edge and the second side edge.

According to this embodiment, the second piece of the second portion may also overlap the corner edge of the substrate.

According to this embodiment, the pieces of the second portion may further include a corner piece that overlaps the corner edge of the substrate and is adjacent to the first piece and the second piece.

According to this embodiment, the second piece of the second portion may include a 2-1 piece and a 2-2 piece cut from each other in a direction intersecting the second side edge of the substrate.

According to another aspect of the present invention, a substrate; a film member attached to the substrate to cover an edge of the substrate when viewed in a first direction perpendicular to one side of the substrate; a laser beam irradiation unit that cuts the film member into a plurality of parts; a first gripping part and a second gripping part respectively gripping the cut portions of the film member; a first moving part that moves the first gripping part and the second gripping part in the first direction; a second moving unit that moves the first gripping unit at a constant speed along a second direction intersecting the first direction; and a third moving unit that moves the second gripping unit at a constant speed along a third direction intersecting the first direction and the second direction.

According to this embodiment, the first gripping part and the second gripping part each include a body; a first holder disposed on one side of the body and in contact with one surface of the film member; and a second holder pivotably connected to the other side of the body.

Other aspects, features and advantages other than those described above will become apparent from the detailed description, claims and drawings for carrying out the invention below.

These general and specific aspects may be practiced using any system, method, computer program, or combination of any system, method, or computer program.

According to one embodiment of the present invention as described above, the formation quality of the film member can be improved by carefully removing a portion of the film member after attaching the film member to the substrate. Of course, the scope of the present invention is not limited by this effect.

1 is a perspective view schematically showing a manufacturing apparatus for a display device according to an embodiment of the present invention.
2A to 2E are cross-sectional views schematically showing a method of manufacturing a display device according to an embodiment of the present invention.
3A to 3F are plan views schematically showing a method of manufacturing a display device according to an embodiment of the present invention.
4 to 6 are plan views schematically showing some steps of a method of manufacturing a display device according to other embodiments of the present invention.
Figure 7 is a plan view schematically showing a display device manufactured according to a method of manufacturing a display device according to an embodiment of the present invention.
FIG. 8 is a cross-sectional view schematically showing a part of the display device of FIG. 7.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the following embodiments, when a part of a film, region, component, etc. is said to be on or on another part, it is not only the case where it is directly on top of the other part, but also when another film, region, component, etc. is interposed between them. Also includes cases where there are.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In cases where an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

In this specification, “A and/or B” refers to A, B, or A and B. And, “at least one of A and B” indicates the case of A, B, or A and B.

In the following embodiments, when membranes, regions, components, etc. are said to be connected, if the membranes, regions, and components are directly connected, or/and other membranes, regions, and components are in the middle of the membranes, regions, and components. This also includes cases where they are interposed and indirectly connected. For example, in this specification, when membranes, regions, components, etc. are said to be electrically connected, when the membranes, regions, components, etc. are directly electrically connected, and/or other membranes, regions, components, etc. are interposed. indicates a case of indirect electrical connection.

The x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system and can be interpreted in a broad sense including these. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

1 is a perspective view schematically showing a manufacturing apparatus for a display device according to an embodiment of the present invention.

Referring to FIG. 1, the display device manufacturing apparatus 100 includes a support part ST, a substrate 10, a film member 110, a laser beam irradiation unit 120, a plurality of holding parts 130, and a first It may include a moving part 141, a second moving part 142, and a third moving part 143.

For example, the support part ST may have a plane defined by the second direction DR2 and the third direction DR3 in FIG. 1 . The substrate 10 may be placed on the support part ST. Although not shown in FIG. 1, a separate work stage (not shown) may be further provided on the support ST, and the substrate 10 may be placed on this work stage (not shown). The substrate 10 may be provided as a component of a display device 1 (see FIG. 8), which will be described later.

The film member 110 may be disposed on the substrate 10 . In some embodiments, on the substrate 10 and the film member 110, a display layer 20 (see FIG. 2A), an encapsulation layer 30 (see FIG. 2A), and a touch sensing layer 40 (see FIG. 2A), as described later, are provided on the substrate 10 and the film member 110. ) may be formed, but is omitted in Figure 1 for convenience of illustration. The film member 110 covers the edge E of the substrate 10 when viewed in a direction perpendicular to one side of the substrate 10 (for example, the first direction DR1 or the opposite direction). 10) Can be attached to the image. For example, the film member 110 may extend outwardly from a corresponding edge E to cover at least one edge E of the substrate 10 .

The film member 110 may be a component of the display device 1 and may have various functions depending on its purpose. In one embodiment, the film member 110 is an optical device that reduces the reflectance of light (extraneous light) incident from the outside toward the display device 1 and/or improves the color purity of light emitted from the display device 1. It may be a functional film. This optical functional film may be a polarizing film containing a retarder and/or a polarizer. For example, the phase retarder may include a λ/2 phase retarder and/or a λ/4 phase retarder.

The laser beam irradiation unit 120 is disposed on the upper part of the support portion ST and may be disposed to be spaced apart from the substrate 10 . The laser beam irradiation unit 120 may be arranged to face the substrate 10 . The laser beam irradiation unit 120 can emit a laser beam toward the film member 110 on the substrate 10, and can cut the film member 110 into a plurality of parts using the laser beam.

In one embodiment, the laser beam irradiation unit 120 may move relative to the film member 110, for example, may move along the second direction DR2 and/or the third direction DR3. The laser beam irradiation unit 120 radiates a laser beam to the film member 110 and simultaneously moves relative to the film member 110, thereby cutting the film member 110 along a predetermined cutting path. In another embodiment, it is also possible to adopt a structure that allows the substrate 10 and the film member 110 to move relative to the laser beam irradiation unit 120.

The laser used in the laser beam irradiation unit 120 may be, for example, an excimer laser, and this excimer laser may have a short wavelength of 308 nm. As another example, the type of laser may be a CO2 laser, YAG laser, nano second laser, femto second laser, Bessel beam, or Gaussian beam.

The plurality of gripping units 130 may respectively grip the cut portions of the film member 110 . For example, the plurality of holding parts 130 include a first holding part 131, a 2-1 holding part 132-1, and a 2-2 holding part ( 132-2) and a third gripping portion 133. As such, the plurality of gripping parts 130 may be provided in four pieces, but the present invention is not limited thereto. The number of the plurality of gripping parts 130 may be 2, 3, or 5 or more.

In one embodiment, the plurality of gripping parts 130 are arranged to be spaced apart from each other on a plane, and may be connected to and supported by the frame (F). Figure 1 shows that the frame F has a rectangular shape in plan and includes an opening disposed in the center, but the present invention is not limited thereto. The shape of the frame F on a plane may be modified in various ways. The frame F may have sufficient rigidity to support the plurality of gripping parts 130.

The first moving unit 141 may move the plurality of gripping units 130 in the first direction DR1. For example, the first moving part 141 may move the first holding part 131, the second holding part 132, and the third holding part 133 in the first direction DR1. The first direction DR1 may be a direction perpendicular to one side of the substrate 10 .

In one embodiment, the first moving part 141 is connected to the frame (F) and may be placed on one side of the guide part (GP). The guide part GP is disposed on the support part ST and may extend along the first direction DR1. Although FIG. 1 shows that the guide part GP has a rectangular bar shape, the shape of the guide part GP is not limited to this. The first moving part 141 may be connected to the guide part GP so as to be able to move linearly with respect to the guide part GP. In one embodiment, the guide part GP has a groove part GV extending along the first direction DR1, and the first moving part 141 has the groove part GV of the guide part GP disposed. Can be placed on the side. The first moving unit 141 may linearly move back and forth in the first direction DR1 along the groove GV. In one embodiment, the first moving unit 141 may include a linear motor, etc. As the first moving unit 141 linearly reciprocates along the first direction DR1, the first moving unit 141 moves the frame F and the plurality of gripping units 130 connected to the frame in the first direction DR1. ) can be moved to .

The second moving unit 142 may linearly move some of the plurality of gripping units 130 along a second direction DR2 that intersects the first direction DR1. For example, the second moving part 142 may move each of the first holding part 131 and the third holding part 133 along the second direction DR2 at a constant speed.

To this end, in one embodiment, the second moving part 142 may be disposed between the first gripping part 131 and the frame (F). For example, the second moving part 142 may be connected to the first gripping part 131 on one side, and may be connected to the frame F on the other side to enable linear movement. For example, the frame F may include a linear motion rail, and the second moving part 142 may include a linear motion block that moves along the linear motion rail. By linearly moving the second moving part 142 along the second direction DR2, the second moving part 142 can move the first gripping part 131 in the second direction DR2. Similarly, the second moving part 142 may be disposed between the third holding part 133 and the frame F, and may move the third holding part 133 in the second direction DR2.

The third moving unit 143 may linearly move another part of the plurality of gripping units 130 in a third direction DR3 that intersects the first direction DR1 and the second direction DR2. there is. For example, the third moving unit 143 may move each of the 2-1 gripping part 132-1 and the 2-2 gripping part 132-2 at a constant speed along the third direction DR3. .

To this end, as an example, the third moving part 143 may be disposed between the 2-1 gripping part 132-1 and the frame F. For example, the third moving part 143 may be connected to the 2-1 gripping part 132-1 on one side, and may be connected to the frame F on the other side to enable linear movement. For example, the frame F may include a linear motion rail, and the third moving part 143 may include a linear motion block that moves along the linear motion rail. By linearly reciprocating the third moving part 143 along the third direction DR3, the third moving part 143 moves the 2-1 gripping part 132-1 in the third direction DR3. You can. Similarly, the third moving part 143 may also be disposed between the 2-2 holding part 132-2 and the frame F, and may move the 2-2 holding part 132-2 in the third direction ( It can be moved to DR3).

The arrangement and movement direction of the plurality of gripping parts 130 can be modified in various ways without departing from the spirit of the present invention. Additionally, the shape of the frame (F) for this purpose can also be modified in various ways. In addition, although it has been described as an example that one first moving unit 141 simultaneously moves the plurality of holding units 130 through the frame F in the first direction DR1, the present invention is not limited thereto. A structure in which a plurality of first moving parts 141 are provided to independently move each of the plurality of holding parts 130 in the first direction DR1 can also be adopted.

2A to 2E are cross-sectional views schematically showing a method of manufacturing a display device according to an embodiment of the present invention.

Referring to FIG. 2A, a display layer 20 may be formed on the substrate 10. The display layer 20 may include a plurality of light emitting elements and a plurality of pixel circuits. Each light-emitting element is driven by a corresponding pixel circuit and can emit light.

In one embodiment, an encapsulation layer 30 may be disposed on the display layer 20. The encapsulation layer 30 covers a plurality of light emitting devices in the display layer 20 and can protect the light emitting devices from external moisture, foreign substances, and external air. The encapsulation layer 30 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

A touch sensing layer 40 may be disposed on the encapsulation layer 30. The touch sensing layer 40 can acquire coordinate information according to an external input, for example, a touch event. The touch sensing layer 40 may include sensing electrodes (sensing electrodes or touch electrodes) and trace lines electrically connected to the sensing electrodes. The touch sensing layer 40 can detect external input using a mutual cap method or a self-cap method.

According to one embodiment of the present invention, the film member 110 can be attached to the substrate 10 (attachment step). In some embodiments, after forming the above-described display layer 20, encapsulation layer 30, and touch sensing layer 40 on the substrate 10, the film member 110 may be attached. The film member 110 may be attached to the substrate 10 by an adhesive layer (ADH), and the adhesive layer (ADH) is, for example, an optical clear adhesive (OCA) or a pressure sensitive adhesive. , PSA) may be included.

In some embodiments, the film member 110 may include a first layer 110a and a second layer 110b. The first layer 110a is an optical functional layer and may include the above-described phase retarder and/or polarizer. The second layer 110b is a protective layer and is disposed on top of the first layer 110a, and can protect the first layer 110a. The second layer 110b may include a polymer resin such as polyethylene terephthalate (PET) or tri-acetyl cellulose (TAC).

In one embodiment, the film member 110 may cover the edge E of the substrate 10 on a plane. Here, ‘on a plane’ may mean ‘when viewed in a direction perpendicular to one side of the substrate 10 (eg, in the first direction DR1 or the opposite direction).’ For example, the film member 110 may protrude further outward than the edge E of the substrate 10 . The portion of the film member 110 that protrudes beyond the edge E of the substrate 10 may be removed through the steps shown in FIGS. 2B to 2E below.

Referring to FIG. 2B, by irradiating a laser beam to the film member 110 on the substrate 10, the film member 110 can be cut into a first part 111 and a second part 112 (first part 111). cutting step). The direction in which the laser beam is irradiated may be perpendicular to one side of the substrate 10 (eg, the first direction DR1 or the opposite direction). The location where the laser beam is irradiated may be located inside the edge E of the substrate 10. The first part 111 of the film member 110 is located inside the substrate 10, and the second part 112 is a part that overlaps the edge E of the substrate 10, and the first part 111 ) It may be a part placed outside the.

2C and 2D, the gripper 130 moves in a direction opposite to the first direction DR1 to approach the film member 110 on the substrate 10, and moves the second direction of the film member 110. Portion 112 may be gripped (grip step). At this time, the gripper 130 may grip the end of the second portion 112.

In one embodiment, each gripper 130 may include a body BP, a first holder HD1, and a second holder HD2. The first holder HD1 may be placed on one side of the body BP. In some embodiments, the first holder HD1 may be fixed to the body BP or may be slidably connected to the body BP. As shown in FIG. 2C, the first holder HD1 may be configured to contact one surface of the film member 110 as the gripper 130 approaches the film member 110.

The second holder HD2 may be pivotably connected to the other side of the body BP. For example, the second holder HD2 is disposed on the opposite side of the first holder HD1 with respect to the body BP and extends in a direction intersecting the first direction DR1 (e.g., a direction perpendicular to the drawing). It can pivot around a virtual axis of rotation (RA). To this end, the gripper 130 may be provided with a rotation power unit (not shown) that pivots the second holder HD2 and may include, for example, a rotation cylinder.

The second holder HD2 may be positioned to face the first holder HD1 after being pivoted as shown in FIG. 2D. The second holder HD2 may be in contact with the adhesive layer ADH disposed on the lower surface of the film member 110. In some embodiments, the first holder HD1 or the second holder HD2 may slide in a direction to approach each other and firmly grasp the second portion 112 of the film member 110.

Referring to FIG. 2E, the second portion 112 of the film member 110 may be removed from the substrate 10 (removal step). In one embodiment, the gripper 130 holding the second portion 112 of the film member 110 may move in the first direction DR1 perpendicular to one surface of the substrate 10 (first movement) step). Accordingly, the second part 112 may be partially separated from the substrate 10 . In addition, although not shown in the cross-sectional view of FIG. 2E, the gripper 130 may move in a direction intersecting the first direction DR1 (eg, a direction perpendicular to the drawing) (second movement step). Accordingly, the second portion 112 can be completely removed from the substrate 10 . That is, the removal step may include the first movement step and the second movement step.

In this case, the first part 111 of the film member 110 is cut from the second part 112, and the first part 111 may remain attached to the substrate 10. The first part 111 attached to the substrate 10 may be provided as the optical functional layer 50 of the display device 1.

On the other hand, the adhesive layer (ADH, see FIG. 2A) that attaches the film member 110 to the substrate 10 has very strong adhesiveness, so that the second portion 112 of the film member 110 can be attached using a vacuum pad or the like. It is difficult to remove . However, according to one embodiment of the present invention, the second portion 112 can be easily removed by using the gripper 130.

3A to 3F are plan views schematically showing a method of manufacturing a display device according to an embodiment of the present invention.

Referring to FIG. 3A , the substrate 10 may include edges E defining a shape on a plane of the substrate 10 . For example, the edge E of the substrate 10 may include a first side edge SE1 and a second side edge SE2 extending in directions that intersect each other on a plane. Additionally, the edge E of the substrate 10 may include a third side edge SE3 facing the first side edge SE1 and a fourth side edge SE4 facing the second side edge SE2. You can. The third side edge SE3 may extend in the same direction as the first side edge SE1 and may extend in a direction intersecting the second side edge SE2. The fourth side edge SE4 may extend in the same direction as the second side edge SE2 and may extend in a direction intersecting the first side edge SE1. For example, the first side edge SE1 and the third side edge SE3 extend in the second direction DR2, and the second side edge SE2 and the fourth side edge SE4 extend in the second direction DR2. It may extend in a third direction DR3 that intersects.

In some embodiments, the extended length of the fourth side edge SE4 may be shorter than the extended length of the second side edge SE2 as shown in FIG. 3A. In another embodiment, the extended length of the fourth side edge SE4 may be equal to the extended length of the second side edge SE2.

The edge E of the substrate 10 has a first corner edge CE1 connecting the first side edge SE1 and the second side edge SE2, and a second side edge SE2 and a third side edge SE3. ) may include a second corner edge (CE2) connecting the In some embodiments, the first corner edge CE1 and the second corner edge CE2 may be rounded. In another embodiment, the first corner edge (CE1) and the second corner edge (CE2) may be provided at a right angle. Hereinafter, unless otherwise specified, for convenience of explanation, the case where the first corner edge (CE1) and the second corner edge (CE2) are rounded will be described.

As described above, the film member 110 may be attached to the substrate 10 (attachment step). The film member 110 may cover the edge E of the substrate 10 in a plane view. For example, the film member 110 may cover the first side edge SE1, the second side edge SE2, and the third side edge SE3 of the substrate 10. Additionally, the film member 110 may cover the first corner edge (CE1) and the second corner edge (CE2).

In some embodiments, the film member 110 may not cover the fourth side edge SE4. An area where a printed circuit board, etc. can be attached may be disposed in an area adjacent to the fourth side edge SE4 of the substrate 10. In order to minimize the peripheral area (PA, see FIG. 7) of the display device 1, the substrate 10 is bent so that the fourth side edge SE4 of the substrate 10 is located on the back of the substrate 10. It can be. Accordingly, the film member 110 may not be disposed in an area adjacent to the fourth side edge SE4 of the substrate 10.

Referring to FIG. 3B, the film member 110 can be cut into a first part 111 and a second part 112 along the cutting path CP parallel to the edge E of the substrate 10 (see 1 cutting step). The laser beam described above may be used for cutting.

For example, the cutting path CP may be parallel (or parallel) to the first side edge SE1, the second side edge SE2, and the third side edge SE3 of the substrate 10 on a plane. Additionally, the cutting path CP may be parallel to the first corner edge CE1 and the second corner edge CE2 of the substrate 10. Here, since the first corner edge (CE1) and the second corner edge (CE2) may be rounded, 'the cutting path (CP) and the first corner edge (CE1) are parallel' means that the cutting path (CP) and the second corner edge (CE1) are rounded. 1 This may mean that the corner edges (CE1) are spaced apart from each other by a certain width. This can also be applied to the second corner edge CE2.

The first part 111 and the second part 112 of the film member 110 may be separated by a cutting path CP. That is, the second part 112 of the film member 110 may be disposed outside the first part 111.

In one embodiment, the cutting path CP may be located inside the edge E of the substrate 10. Accordingly, the second portion 112 of the film member 110 may overlap at least the edge E of the substrate 10 . The second portion 112 of the film member 110 may be removed from the substrate 10 in subsequent steps. That is, only the first portion 111 of the film member 110 remains attached to the substrate 10 .

As a comparative example, when the film member 110 is pre-cut to the size of the substrate 10 and then attached to the substrate 10, due to the work tolerance that occurs during cutting and the work tolerance that occurs during attachment, It may be very difficult to precisely form the film member 110.

However, according to one embodiment of the present invention, there is no need to cut the film member 110 in advance, and since the film member 110 is cut according to the shape of the substrate 10 after attaching the film member 110, Errors due to misalignment that may occur when attaching the film member 110 can be eliminated. Through this, it is possible to precisely form the film member 110 on any shape of the substrate 10.

Referring to FIG. 3C, the second portion 112 of the film member 110 may be cut into at least two pieces 112P (second cutting step). Even in the second cutting step, the laser beam emitted by the laser beam irradiation unit 120 (see FIG. 1) can be used.

In one embodiment, the second portion 112 of the film member 110 may be cut in a direction intersecting the cutting path CP of the first cutting step. In other words, since the cutting path CP is parallel to the edge E of the substrate 10, the second portion 112 of the film member 110 is aligned with the edge E of the substrate 10 in the second cutting step. It may be cut in a direction intersecting with , and a plurality of pieces 112P may be formed.

In this case, the number of pieces 112P of the second part 112 may be determined depending on the number of times the second part 112 is cut. For example, when the second part 112 is cut once, the second part 112 is divided into two pieces 112P. Figure 3C shows, in some embodiments, three cuts were performed, resulting in the second portion 112 being divided into four pieces 112P.

In one embodiment, the pieces 112P of the second portion 112 include a first piece 112P1 overlapping the first side edge SE1 of the substrate 10 and a first piece 112P1 overlapping the second side edge SE2. May include 2 pieces (112P2). Additionally, the pieces 112P of the second portion 112 may include a third piece 112P3 that overlaps the third side edge SE3 of the substrate 10 .

Additionally, the second piece 112P2 of the second portion 112 may be cut again in a direction intersecting the cutting path CP. That is, the second piece 112P2 of the second portion 112 is a 2-1 piece 112P2-1 and a 2-2 piece 112P2- cut from each other in a direction intersecting the second side edge SE2. 2) may be included.

In some embodiments, the second piece 112P2 of the second portion 112 may also overlap the corner edges CE1 and CE2 of the substrate 10. For example, the 2-1 piece (112P2-1) overlaps the first corner edge (CE1) of the substrate 10, and the 2-2 piece (112P2-2) overlaps the second corner edge (CE1) of the substrate 10. It can overlap with CE2).

Referring to FIG. 3D, the plurality of gripping units 130 may respectively grip the plurality of pieces 112P of the second portion 112 of the film member 110. For example, the plurality of holding parts 130 are first and second holding parts 131 and 2 respectively holding the first piece 112P1 and the second piece 112P2 of the second part 112 of the film member 110. It may include a gripping portion 132. Additionally, it may include a third gripping part 133 that grips the third piece 112P3 of the second part 112 of the film member 110. As described above, when the second piece 112P2 of the second part 112 of the film member 110 is divided into a 2-1 piece 112P2-1 and a 2-2 piece 112P2-2, The plurality of gripping parts 130 are 2-1 gripping parts 132-1 respectively gripping the 2-1 piece 112P2-1 and the 2-2 piece 112P2-2 of the second part 112. ) and a 2-2 gripping portion 132-2.

In one embodiment, the number of the plurality of gripping parts 130 may be the same as the number of pieces 112P of the second part 112 of the film member 110. Through this, it is possible to simultaneously remove the pieces 112P of the second portion 112 of the film member 110, and thus the removal process time can be minimized.

Referring to FIG. 3E , pieces 112P of the second portion 112 of the film member 110 may be removed from the substrate 10 . In one embodiment, although not shown in the plan view of FIG. 3E, the plurality of gripping parts 130 may move in the first direction DR1 perpendicular to one surface of the substrate 10 (first movement step). Accordingly, each piece 112P of the second part 112 of the film member 110 held by each holding part 130 may be partially separated from the substrate 10 . Additionally, the plurality of gripping parts 130 may each move in a direction intersecting the first direction DR1, for example, in the second direction DR2 or the third direction DR3 (second movement step). Through this, each piece 112P of the second part 112 of the film member 110 can be completely removed from the substrate 10.

In one embodiment, the first gripping part 131 and the third gripping part 133 may move in the same direction, for example, in the second direction DR2. The first gripper 131 may start from the opposite side of the first corner edge CE1 and move toward the first corner edge CE1 along the first side edge SE1. Additionally, the third gripper 133 may start from the opposite side of the second corner edge CE2 and move toward the second corner edge CE2 along the third side edge SE3. In this case, each of the first gripping part 131 and the third gripping part 133 can be separated from the free ends of the first piece 112P1 and the third piece 112P3, and the removal quality can be improved.

The second gripper 132 may move in a direction that intersects the first direction DR1 and at the same time intersects the movement direction of the first gripper 131 and the third gripper 133 . For example, the second gripper 132 may move along the third direction DR3 or a direction opposite to the third direction DR3.

In one embodiment, the 2-1st gripping part 132-1 and the 2-2nd gripping part 132-2 may move in directions toward each other. For example, the 2-1 gripping part 132-1 may move in a direction opposite to the third direction DR3, and the 2-2 gripping part 132-2 may move along the third direction DR3. there is. Through this, it is possible to avoid the 2-1st holding part 132-1 and the 2-2nd holding part 132-2 from interfering with each other at the starting position.

According to one embodiment, in the second movement step, each gripper 130 may move at a constant speed on a plane. For example, the first gripper 131 may completely remove the first piece 112P1 of the second portion 112 of the film member 110 while moving at a constant speed along the second direction DR2. Similarly, the third gripper 133 may completely remove the third piece 112P3 of the second portion 112 while moving at a constant speed along the second direction DR2. The 2-1 gripping part 132-1 completely removes the 2-1 piece 112P2-1 of the second part 112 while moving at a constant speed in a direction opposite to the third direction DR3, The 2-2 gripper 132-2 may completely remove the 2-2 piece 112P2-2 of the second portion 112 while moving at a constant speed along the third direction DR3.

As a comparative example, if the speed or direction of the gripper 130 changes when the gripper 130 removes the second portion 112 of the film member 110, the first portion of the remaining film member 110 ( 111) A large number of burrs may occur at the edges. In particular, the adhesive layer (ADH, see FIG. 2A) that attaches the film member 110 to the substrate 10 has very strong adhesiveness, so the occurrence of such burrs may increase. For example, without cutting the second part 112 of the film member 110 into a plurality of pieces 112P, the gripping part 130 moves along the entire edge E of the substrate 10 and moves the second part ( When 112) is removed, the speed and direction of the gripper 130 inevitably change significantly near the corner edges (CE1, CE2) of the substrate 10, and as a result, the problem of burr generation may become serious. .

However, according to one embodiment of the present invention, the second portion 112 of the film member 110 is divided into a plurality of pieces 112P, and each gripper 130 is used to remove each piece 112P. Since it moves at a constant speed along a specific direction on a plane, the occurrence of burrs, etc. can be minimized. Through this, the manufacturing quality of the display device 1 can be improved.

According to some embodiments, in the step of removing the second portion 112 of the film member 110, the first moving step and the second moving step of each gripper 130 may be performed simultaneously. That is, each gripper 130 may move in the first direction DR1 and simultaneously move in the second direction DR2 or the third direction DR3. Through this, the process time can be minimized.

Referring to FIG. 3F, the first portion 111 of the film member 110 may be maintained attached to the substrate 10 and will ultimately be provided as the optical functional layer 50 of the display device 1. You can.

4 to 6 are plan views schematically illustrating some steps of a method of manufacturing a display device according to other embodiments of the present invention, and show an appearance after a second cutting step is performed. Configurations that are the same or similar to those previously described with reference to FIGS. 3A to 3C are given the same reference numerals, and thus duplicate descriptions will be omitted.

Referring to FIG. 4 , the number and location of cuts of the second portion 112 of the film member 110 may vary. In one embodiment, in the second cutting step, the second portion 112 is cut in a direction intersecting the cutting path CP to form a plurality of pieces 112P, and each piece 112P is formed on the substrate 10. It can be formed to overlap each of the first side edge (SE1), second side edge (SE2), third side edge (SE3), first corner edge (CE1), and second corner edge (CE2). For example, the plurality of pieces 112P formed by cutting the film member 110 include the first piece 112P1 overlapping the first side edge SE1 of the substrate 10 and the second side edge of the substrate 10. A second piece (112P2) overlapping with (SE2), a third piece (112P3) overlapping with the third side edge (SE3) of the substrate 10, and overlapping with the first corner edge (CE1) of the substrate 10. It may include a first corner piece 112P and a second corner piece 112P that overlaps the second corner edge CE2 of the substrate 10. That is, five pieces 112P can be formed.

Referring to FIG. 5, the second piece 112P2 of the second portion 112 of the film member 110 is cut once more in the direction intersecting the cutting path CP, to form a second-1 piece 112P2- 1) and may include the 2-2 piece (112P2-2). In other words, the second piece 112P2 of the second portion 112 is the second piece 112P2-1 and the second piece 112P2-1 cut from each other in a direction intersecting the second side edge SE2 of the substrate 10. -Can contain 2 pieces (112P2-2). In this case, six pieces 112P can be formed.

Referring to FIG. 6 , in some embodiments, each corner edge CE1 and CE2 of the substrate 10 may have a right-angled shape. In this case, the cutting path CP extending parallel to the edge E of the substrate 10 may also form a right-angled vertex. In one embodiment, in the second cutting step, the second portion 112 of the film member 110 may be cut to intersect a right-angled vertex of the cutting path CP.

Figure 7 is a plan view schematically showing a display device manufactured according to a method of manufacturing a display device according to an embodiment of the present invention.

Referring to FIG. 7 , the display device 1 may include a display area DA and a peripheral area PA located outside the display area DA. The display device 1 may provide an image through an array of a plurality of pixels PX in the display area DA. A pixel (PX) can be defined as a light-emitting area where a light-emitting element emits light. In other words, an image can be provided by light emitted by a light-emitting element through a pixel (PX). The light emitting element may be driven by a pixel circuit. These light emitting elements and pixel circuits may be disposed in the display area DA. Additionally, various signal wires and power wires electrically connected to the pixel circuits may be disposed in the display area DA.

The peripheral area PA is an area that does not provide an image and may completely or partially surround the display area DA. In the peripheral area PA, various wires, driving circuits, etc. may be disposed to provide electrical signals or power to the display area DA.

The display device 1 may have an approximately rectangular shape when viewed in a direction perpendicular to its one surface. The corner where the x-direction side and the y-direction side meet may have a right-angled shape, or may be rounded to have a predetermined curvature as shown in FIG. 7. Of course, the planar shape of the display device 1 is not limited to a rectangle, and may have various shapes such as polygons such as triangles, circles, ellipses, and irregular shapes.

Although FIG. 7 shows a display device 1 having a flat display surface, the present invention is not limited thereto. In another embodiment, the display device 1 may include a three-dimensional display surface or a curved display surface. When the display device 1 includes a three-dimensional display screen, the display device 1 includes a plurality of display areas pointing in different directions, and may include, for example, a polygonal columnar display screen. In another embodiment, when the display device 1 includes a curved display surface, the display device 1 may be implemented in various forms such as a flexible, foldable, or rollable display device.

Meanwhile, hereinafter, for convenience of explanation, a case where the display device 1 is used in a smart phone will be described, but the display device 1 of the present invention is not limited to this. The display device 1 is a mobile phone, a smart phone, a tablet PC (tablet personal computer), a mobile communication terminal, an electronic notebook, an e-book, a portable multimedia player (PMP), a navigation device, and a UMPC (Ultra). It can be used as a display screen for not only portable electronic devices such as mobile PCs, but also various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT). In addition, the display device 1 according to one embodiment is mounted on a wearable device such as a smart watch, a watch phone, a glasses-type display, and a head mounted display (HMD). It can be used. In addition, the display device 1 according to one embodiment includes a dashboard of a car, a center information display (CID) disposed on the center fascia or dashboard of a car, and a room mirror display (a room mirror display instead of a side mirror of a car). room mirror display), entertainment for the backseat of a car, and can be used as a display screen placed on the back of the front seat.

In addition, the following will explain that the display device 1 includes an organic light emitting diode (OLED) as a light-emitting element, but the display device 1 of the present invention is not limited thereto. As another example, the display device 1 may be a light emitting display device including an inorganic light emitting diode, that is, an inorganic light emitting display device. As another example, the display device 1 may be a quantum dot light emitting display.

FIG. 8 is a cross-sectional view schematically showing a part of the display device of FIG. 7. FIG. 8 may correspond to a cross-section of the display device taken along line VIII- VIII' of FIG. 7.

Referring to FIG. 7, the display device 1 may include a stacked structure of a substrate 10, a display layer 20, an encapsulation layer 30, a touch sensing layer 40, and an optical function layer 50. there is.

The substrate 10 may have a multilayer structure including a base layer containing a polymer resin and an inorganic layer. For example, the substrate 10 may include a base layer containing a polymer resin and a barrier layer of an inorganic insulating layer. For example, the substrate 10 may include a first base layer 10a, a first barrier layer 10b, a second base layer 10c, and a second barrier layer 10d sequentially stacked. The first base layer 10a and the second base layer 10c are made of polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene napthalate (PEN), polyethyeleneterepthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), or/and cellulose acetate propio It may include cellulose acetate propionate (CAP), etc. The first barrier layer 10b and the second barrier layer 10d may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and/or silicon nitride. The substrate 10 may have flexible characteristics.

A display layer 20 may be disposed on the substrate 10 . The display layer 20 may include a pixel circuit layer (PCL), a pixel defining layer 17, and an organic light emitting diode (OLED). The pixel circuit layer (PCL) includes a thin film transistor (TFT), a buffer layer 11 disposed below or/and above the components of the thin film transistor (TFT), a first gate insulating layer 12, and a second gate insulating layer ( 13), it may include an interlayer insulating layer 14, a first planarization insulating layer 15, and a second planarization insulating layer 16.

The buffer layer 11 can reduce or block the infiltration of foreign substances, moisture, or external air from the lower part of the substrate 10, and can provide a flat surface on the substrate 10. The buffer layer 11 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure including the above-described materials.

The thin film transistor (TFT) on the buffer layer 11 includes a semiconductor layer (Act), and the semiconductor layer (Act) may include polysilicon. Alternatively, the semiconductor layer (Act) may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer (Act) may include a channel region (C) and a drain region (D) and a source region (S) disposed on both sides of the channel region (C), respectively. The gate electrode (GE) may overlap the channel area (C).

The gate electrode (GE) may include a low-resistance metal material. The gate electrode (GE) may contain a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer containing the above materials. there is.

The first gate insulating layer 12 between the semiconductor _layer (Act) and the _gate electrode (GE) is made of silicon oxide (SiO ₂ ), silicon nitride ( _SiN ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ).

The second gate insulating layer 13 may be provided to cover the gate electrode (GE). The second gate insulating layer 13, similar to the first gate _insulating layer 12 _, is made of silicon oxide (SiO ₂ ), silicon nitride ( _SiN , titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ).

The upper electrode (Cst2) of the storage capacitor (Cst) may be disposed on the second gate insulating layer 13. The upper electrode (Cst2) may overlap the gate electrode (GE) below it. At this time, the gate electrode GE and the upper electrode Cst2 that overlap with the second gate insulating layer 13 therebetween may form a storage capacitor Cst. That is, the gate electrode (GE) can function as the lower electrode (Cst1) of the storage capacitor (Cst).

In this way, the storage capacitor (Cst) and the thin film transistor (TFT) may be overlapped and formed. In some embodiments, the storage capacitor Cst may be formed so as not to overlap the thin film transistor (TFT).

The upper electrode (Cst2) is aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multiple layers of the foregoing materials. .

The interlayer insulating layer 14 may cover the upper electrode (Cst2). _The interlayer insulating layer 14 is made of silicon _oxide ( _{SiO 2 )} , silicon nitride ( _{SiN 5} ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ). The interlayer insulating layer 14 may be a single layer or a multilayer containing the above-described inorganic insulating material.

The drain electrode (DE) and the source electrode (SE) may each be located on the interlayer insulating layer 14. The drain electrode (DE) and the source electrode (SE) may be connected to the drain region (D) and the source region (S) through contact holes in the insulating layers below them, respectively. The drain electrode (DE) and source electrode (SE) may include a material with good conductivity. The drain electrode (DE) and source electrode (SE) may contain a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be a multilayer containing the above materials. Alternatively, it may be formed as a single layer. In one embodiment, the drain electrode (DE) and the source electrode (SE) may have a multilayer structure of Ti/Al/Ti.

The first planarization insulating layer 15 may cover the drain electrode (DE) and the source electrode (SE). The first planarization insulating layer 15 is made of general-purpose polymers such as polymethylmethacrylate (PMMA) or polystyrene (PS), polymer derivatives with phenolic groups, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, and fluorine polymers. , p-xylene-based polymers, vinyl alcohol-based polymers, and blends thereof may be included.

The second planarization insulating layer 16 may be disposed on the first planarization insulating layer 15 . The second planarization insulating layer 16 may include the same material as the first planarization insulating layer 15, and may be a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol-based group, or an acrylic-based material. It may include organic insulating materials such as polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and blends thereof.

An organic light emitting diode (OLED) may be disposed as a light emitting device on the pixel circuit layer (PCL) of the above-described structure. An organic light emitting diode (OLED) may include a stacked structure of a pixel electrode 21, an intermediate layer 22, and a common electrode 23. Organic light-emitting diodes (OLEDs), for example, may emit red, green, or blue light, or may emit red, green, blue, or white light. Organic light-emitting diodes (OLEDs) emit light through a light-emitting area, and the light-emitting area can be defined as a pixel (PX).

The pixel electrode 21 of the organic light-emitting diode (OLED) includes contact holes formed in the second planarization insulating layer 16 and the first planarization insulating layer 15, and a contact metal disposed on the first planarization insulating layer 15. It can be electrically connected to a thin film transistor (TFT) through (CM).

The pixel electrode 21 is made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ ), and indium. It may include a conductive oxide such as gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 21 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), and neodymium (Nd). , may include a reflective film containing iridium (Ir), chromium (Cr), or a compound thereof. In another embodiment, the pixel electrode 21 may further include a film formed of ITO, IZO, ZnO, or In ₂ O ₃ above and below the above-described reflective film.

A pixel defining film 17 having an opening 17OP exposing the central portion of the pixel electrode 21 is disposed on the pixel electrode 21. The pixel defining layer 17 may include an organic insulating material and/or an inorganic insulating material. The opening (17OP) can define the light emitting area of the light emitted from the organic light emitting diode (OLED). For example, the size/width of the opening 17OP may correspond to the size/width of the light emitting area. Accordingly, the size and/or width of the pixel PX may depend on the size and/or width of the opening 17OP of the corresponding pixel defining layer 17.

The middle layer 22 may include a light emitting layer 22b formed to correspond to the pixel electrode 21. The light-emitting layer 22b may include a polymer or low-molecular organic material that emits light of a predetermined color. Alternatively, the light-emitting layer 22b may include an inorganic light-emitting material or quantum dots.

A first functional layer 22a and a second functional layer 22c may be disposed below and above the light emitting layer 22b, respectively. For example, the first functional layer 22a may include a hole transport layer (HTL), or may include a hole transport layer and a hole injection layer (HIL). The second functional layer 22c is a component disposed on the light emitting layer 22b and may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The first functional layer 22a and/or the second functional layer 22c may be a common layer formed to entirely cover the substrate 10, similar to the common electrode 23, which will be described later.

The common electrode 23 is disposed on the pixel electrode 21 and may overlap the pixel electrode 21. The common electrode 23 may be made of a conductive material with a low work function. For example, the common electrode 23 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), and iridium ( It may include a (semi) transparent layer containing Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the common electrode 23 may further include a layer such as ITO, IZO, ZnO, or In2O3 on the (semi) transparent layer containing the above-mentioned material. The common electrode 23 may be formed integrally to cover the entire substrate 10 .

The encapsulation layer 30 is disposed on the display layer 20 and can cover the organic light emitting diode (OLED) of the display layer 20. The encapsulation layer 30 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. As an example, Figure 8 shows a first inorganic encapsulation layer 31 in which the encapsulation layers 30 are sequentially stacked, and an organic encapsulation layer. It is shown to include an encapsulation layer 32 and a second inorganic encapsulation layer 33.

The first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 may include one or more inorganic materials selected from the group consisting of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. there is. The organic encapsulation layer 32 may include a polymer-based material. Polymer-based materials may include acrylic resin, epoxy resin, polyimide, and polyethylene. In one embodiment, the organic encapsulation layer 32 may include acrylate. The organic encapsulation layer 32 can be formed by curing a monomer or applying a polymer. The organic encapsulation layer 32 may be transparent.

The touch-sensing layer 40 may be disposed on the encapsulation layer 30, as described above with reference to FIG. 2A, and the optical function layer 50 may be disposed on the touch-sensing layer 40. Although not shown in FIG. 8, an adhesive layer (ADH, see FIG. 2A) may be disposed between the touch sensing layer 40 and the optical function layer 50.

A cover window (CW) may be disposed on the optical functional layer 50. The cover window CW may be adhered using an adhesive member. The adhesive member may be, for example, an optical clear adhesive (OCA) or a pressure sensitive adhesive (PSA).

The cover window CW may have a high transmittance to transmit light emitted from the display layer 20 and may have a thin thickness to minimize the weight of the display device 1. Additionally, the cover window CW may have high strength and hardness to protect the display layer 20 from external shock. For example, the cover window CW may include glass or plastic. In one embodiment, the cover window (CW) may be ultra-thin tempered glass whose strength has been strengthened by chemical strengthening or thermal strengthening.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the attached patent claims.

1: display device
10: substrate
110: Film member
111: first part of film member
112: second part of film member
112P: Fragment of the second part
120: Laser beam irradiation unit
130: gripping part
141: first moving unit
142: Second moving unit
143: Third moving unit
CP: cutting path

Claims (18)

An attachment step of attaching a film member onto a substrate;
A first cutting step of cutting the film member into first and second parts along a cutting path parallel to the edge of the substrate;
a second cutting step of cutting the second portion of the film member into at least two or more pieces;
a gripping step wherein a plurality of gripping portions each grip the plurality of pieces of the second portion; and
a removal step of removing the pieces of the second portion of the film member from the substrate,
The removal step is,
A first moving step of moving the plurality of holding parts in a first direction perpendicular to one surface of the substrate; and
A second moving step in which each of the plurality of grip parts moves at a constant speed along a direction intersecting the first direction,
The second movement step is,
A method of manufacturing a display device, comprising moving at least two of the plurality of holding parts in a direction that intersects each other. According to paragraph 1,
The method of manufacturing a display device, wherein the film member covers the edge of the substrate on a plane. According to paragraph 1,
The cutting path is located inside the edge of the substrate. According to paragraph 1,
The second cutting step is,
Cutting the second portion of the film member in a direction intersecting the cutting path of the first cutting step. According to paragraph 1,
The method of manufacturing a display device, wherein the number of the plurality of holding portions is equal to the number of the pieces of the second portion of the film member. According to paragraph 1,
The first moving step and the second moving step of the removing step are performed simultaneously. According to paragraph 1,
The edge of the substrate includes a first side edge and a second side edge, each extending in directions that intersect each other in a plane,
The pieces of the second portion include a first piece and a second piece overlapping the first side edge and the second side edge of the substrate, respectively. In clause 7,
The plurality of gripping parts include a first gripping part and a second gripping part respectively gripping the first piece and the second piece of the second portion of the film member,
The second movement step of the removal step is,
A method of manufacturing a display device, comprising moving each of the first gripping part and the second gripping part at a constant speed along a direction intersecting each other on a plane. In clause 7,
The edge of the substrate further includes a third side edge extending in the same direction as the first side edge in a plane, but extending in a direction intersecting the second side edge,
The pieces of the second portion further include a third piece overlapping the third side edge of the substrate. According to clause 9,
The second piece of the second portion includes a 2-1 piece and a 2-2 piece cut from each other in a direction intersecting the second side edge of the substrate. According to clause 10,
The plurality of gripping parts include a first gripping part, a first gripping part for gripping the first piece, the 2-1 piece, the 2-2 piece, and the third piece of the second portion of the film member, respectively. It includes a 2-1 gripping portion, a 2-2 gripping portion, and a third gripping portion,
The second movement step of the removal step is,
moving the first gripping part and the third gripping part at a constant speed along the same direction on a plane; and
A method of manufacturing a display device comprising: moving the 2-1 holding part and the 2-2 holding part at a constant speed along a direction intersecting the movement direction of the first holding part on a plane. According to clause 11,
The method of manufacturing a display device, wherein the 2-1 holding part and the 2-2 holding part move in directions toward each other on a plane. In clause 7,
The edge of the substrate further includes a rounded corner edge connecting the first side edge and the second side edge. According to clause 13,
The method of manufacturing a display device, wherein the second piece of the second portion also overlaps the corner edge of the substrate. According to clause 13,
The pieces of the second portion further include a corner piece that overlaps the corner edge of the substrate and is adjacent to the first piece and the second piece. According to claim 14 or 15,
The second piece of the second portion includes a 2-1 piece and a 2-2 piece cut from each other in a direction intersecting the second side edge of the substrate. Board;
a film member attached to the substrate to cover an edge of the substrate when viewed in a first direction perpendicular to one side of the substrate;
a laser beam irradiation unit that cuts the film member into a plurality of parts;
a first gripping part and a second gripping part respectively gripping the plurality of cut portions of the film member;
a first moving part that moves the first gripping part and the second gripping part in the first direction;
a second moving unit that moves the first gripping unit at a constant speed along a second direction intersecting the first direction; and
A device that moves the second gripping part at a constant speed along the first direction and a third direction intersecting the second direction so that the second gripping part moves in a direction intersecting the moving direction of the first gripping part. 3. An apparatus for manufacturing a display device, including: a moving unit. According to clause 17,
The first gripping part and the second gripping part, respectively,
body;
a first holder disposed on one side of the body and in contact with one surface of the film member; and
A second holder pivotally connected to the other side of the body.

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