KR20220082736A - Display apparatus and electronic device including the same - Google Patents

Abstract

The present invention relates to a display device capable of displaying an image in an area where an electronic component is disposed as a second display area, and an electronic device having the same. A display device including a first display area and a second display area including a transmissive area to improve transmittance in the second display area, improve performance of electronic components, and improve visibility of external light in the second display area In the method, the substrate; a plurality of first light emitting devices disposed on the substrate and defining a first display area; a plurality of second light emitting elements disposed on the substrate and defining a second display area; an optical function layer disposed on the plurality of first light emitting elements and including a hole corresponding to the second display area; a metal layer disposed on the plurality of second light emitting devices and including a through portion corresponding to the transmissive area of the second display area; and a capping layer interposed between the plurality of second light emitting devices and the metal layer.

Description

Display apparatus and electronic device including the same

The present invention relates to a display device and an electronic device having the same.

2. Description of the Related Art In recent years, display devices have diversified their uses. In addition, the thickness of the display device is thin and the weight is light, and the range of its use is widening.

While the area occupied by the display area of the display device is enlarged, various functions grafted or linked to the display device are being added. As a method for adding various functions while increasing an area, research on a display device having a region for adding various functions other than image display inside the display region is continuing.

An object of the present invention is to provide a display device in which a display area is expanded so that an image can be displayed even in an area where an electronic component is disposed, and which minimizes deterioration in performance of an electronic component, and an electronic device having the same. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

According to one aspect of the present invention, there is provided a display device including a first display area and a second display area having a transmissive area, the display device comprising: a substrate; a plurality of first light emitting devices disposed on the substrate and defining the first display area; a plurality of second light emitting elements disposed on the substrate and defining the second display area; an optical function layer disposed on the plurality of first light emitting devices and including a hole corresponding to the second display area; a metal layer disposed on the plurality of second light emitting devices and including a through portion corresponding to the transmissive area of the second display area; and a capping layer interposed between the plurality of second light emitting devices and the metal layer.

According to the present embodiment, the metal layer is manganese (Mn), titanium (Ti), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), cobalt (Co), copper (Cu) , aluminum (Al), chromium nitride (CrN _x ), titanium nitride (TiN _x ), titanium aluminum nitride (TiAlN _x ), titanium carbide (TiC), molybdenum oxide (MoO _x ), chromium oxide (CrO _x ), and tungsten At least one selected from the group including oxide (WO _x ) may be included.

According to the present embodiment, the metal layer may overlap at least the plurality of second light emitting devices on a plane.

According to the present embodiment, the metal layer may not overlap the plurality of first light emitting devices on a plane surface.

According to the present embodiment, the capping layer may have a thickness such that the light reflected from the plurality of second light emitting devices and the light reflected from the metal layer are destructively interfered with each other.

According to this embodiment, the capping layer may include an organic insulating material.

According to the present embodiment, each of the plurality of second light emitting devices may include: a pixel electrode disposed on the substrate; a counter electrode disposed on the pixel electrode; and an intermediate layer interposed between the pixel electrode and the counter electrode.

According to the present embodiment, a pixel defining layer covering an edge of the pixel electrode of each of the plurality of second light emitting devices and including an opening defining a light emitting area of each of the plurality of second light emitting devices; may include

According to the present embodiment, the pixel defining layer may include a light blocking material.

According to the present embodiment, the encapsulation layer is disposed on the metal layer and includes at least one inorganic layer and at least one organic layer; may further include.

According to the present embodiment, the method further includes a light blocking pattern layer positioned in the second display area on the encapsulation layer, wherein the light blocking pattern layer includes: a body portion including a light blocking material; and a first opening and a second opening adjacent to the body portion.

According to the present exemplary embodiment, the first opening of the light blocking pattern layer overlaps any one of the plurality of second light emitting devices on a plane, and the second opening of the light blocking pattern layer is the second display area on a plane may overlap the transmission region of

According to the present embodiment, on an imaginary plane perpendicular to one surface of the substrate, the width of the body portion of the light blocking pattern layer may be smaller than the width of the pixel defining layer.

According to the present embodiment, a touch sensing layer interposed between the encapsulation layer and the light blocking pattern layer and including sensing electrodes and trace lines electrically connected to the sensing electrodes; may further include.

According to another aspect of the present invention, there is provided a display device comprising: a display device including a first display area and a second display area having different resolutions; and an electronic component overlapping the transmissive region provided in the second display region, wherein the display device includes: a substrate; a plurality of first light emitting devices disposed on the substrate and defining the first display area; a plurality of second light emitting elements disposed on the substrate and defining the second display area; an optical function layer disposed on the plurality of first light emitting devices and including holes corresponding to the second display areas; a metal layer disposed on the plurality of second light emitting devices and including a through portion corresponding to the transmissive area of the second display area; and a capping layer interposed between the plurality of second light emitting devices and the metal layer, the capping layer having a predetermined thickness so that the light reflected from the plurality of second light emitting devices and the light reflected from the metal layer interfere with each other destructively. ; An electronic device is provided, including.

According to the present embodiment, the capping layer may include a penetrating portion corresponding to the transmissive area of the second display area.

According to the present embodiment, the metal layer may overlap at least the plurality of second light emitting devices on a plane, but may not overlap the plurality of first light emitting devices.

According to the present embodiment, each of the plurality of second light emitting devices may include: a pixel electrode disposed on the substrate; a counter electrode disposed on the pixel electrode; and an intermediate layer interposed between the pixel electrode and the counter electrode, and a pixel defining layer covering an edge of the pixel electrode of each of the plurality of second light emitting devices and including a light blocking material. can

According to the present embodiment, an encapsulation layer disposed on the metal layer and having at least one inorganic layer and at least one organic layer; a touch sensing layer disposed on the encapsulation layer and including sensing electrodes and trace lines electrically connected to the sensing electrodes; and a light blocking pattern layer positioned in the second display area on the touch sensing layer.

According to this embodiment, the light blocking pattern layer may include a body portion including a light blocking material; and a first opening and a second opening at least partially surrounded by the body portion, wherein the first opening of the light blocking pattern layer overlaps any one of the plurality of second light emitting elements on a plane surface, and the The second opening of the light blocking pattern layer may overlap the transmissive area of the second display area in a plan view.

Other aspects, features and advantages other than those described above will become apparent from the following detailed description, claims and drawings for carrying out the invention.

These general and specific aspects may be embodied using a system, method, computer program, or combination of any system, method, and computer program.

According to an embodiment of the present invention made as described above, it is possible to provide a display device capable of displaying an image in an area in which an electronic component is disposed as a second display area, and an electronic device having the same. Furthermore, since the optical functional layer includes a hole corresponding to the second display region, transmittance in the second display region may be improved and the performance of the electronic component may be improved. In addition, through the capping layer and the metal layer disposed in the second display region, it is possible to reduce the reflectance of external light in the second display region and improve the visibility of external light. Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically illustrating an electronic device according to an embodiment of the present invention.
2 is a cross-sectional view schematically illustrating a part of an electronic device according to embodiments of the present invention.
3 is an equivalent circuit diagram of any one pixel circuit included in a display device according to an exemplary embodiment of the present invention.
4A is a plan view schematically illustrating a portion of a first display area of a display device of an electronic device according to an exemplary embodiment of the present invention.
4B is a plan view schematically illustrating a portion of a second display area of a display device of an electronic device according to an exemplary embodiment of the present invention.
5A is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to an exemplary embodiment.
5B is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to an exemplary embodiment.
6 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to an exemplary embodiment.
7 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to another exemplary embodiment of the present invention.
8 is a plan view schematically illustrating a portion of a display device of an electronic device according to an exemplary embodiment of the present invention.
9 is a plan view schematically illustrating a touch sensing layer of a display device according to an exemplary embodiment of the present invention.
10 is a cross-sectional view showing a laminated structure of a touch sensing layer according to an embodiment of the present invention.
11 and 12 are plan views each showing a first conductive layer and a second conductive layer among the touch sensing layers according to an embodiment of the present invention.
13 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to another exemplary embodiment of the present invention.
14 is a plan view schematically illustrating an arrangement of a light blocking pattern layer of a display device of an electronic device according to another exemplary embodiment of the present invention.
15 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to still another exemplary embodiment of the present invention.
16 is a plan view schematically illustrating an arrangement of a metal layer of a display device of an electronic device according to another exemplary embodiment of the present invention.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted. .

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility that one or more other features or components will be added is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In cases where certain embodiments may be implemented otherwise, a specific process sequence may be performed different from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the order described.

In the present specification, "A and/or B" refers to A, B, or A and B. And, "at least one of A and B" represents the case of A, B, or A and B.

In the following embodiments, when a film, region, or component is connected, when the film, region, or component is directly connected, or/and in the middle of another film, region, or component It includes cases where they are interposed and indirectly connected. For example, in the present specification, when it is said that a film, region, component, etc. are electrically connected, when the film, region, component, etc. are directly electrically connected, and/or another film, region, component, etc. is interposed therebetween. This indicates an indirect electrical connection.

The x-axis, y-axis, and z-axis are not limited to three axes on a Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

1 is a perspective view schematically illustrating an electronic device according to an embodiment of the present invention.

Referring to FIG. 1 , the electronic device 1 may include a display area DA and a peripheral area PA adjacent to the display area DA. The electronic device 1 may provide an image through an array of a plurality of pixels PX arranged in the display area DA.

The plurality of pixels PX may include a plurality of first pixels PX1 disposed in the first display area DA1 and a plurality of second pixels PX2 disposed in the second display area DA2. . The array of the plurality of first pixels PX1 and the array of the plurality of second pixels PX2 may be different from each other. For example, the array of second pixels PX2 of the second display area DA2 is such that the transmissive area TA is disposed between the plurality of second pixels PX2 disposed in the second display area DA2 . may be different from the array of the first pixels PX1 in the first display area DA1.

The electronic device 1 may provide a first image by using light emitted from the first pixels PX1 disposed in the first display area DA1 , and may provide a first image disposed in the second display area DA2 . A second image may be provided using light emitted from the two pixels PX2 . In some embodiments, the first image and the second image may be portions of any one image provided through the display area DA of the electronic device 1 . Alternatively, in some embodiments, the electronic device 1 may provide a first image and a second image independent of each other.

The second display area DA2 may include a transmission area TA positioned between the plurality of second pixels PX2 . The transmission area TA is an area through which light can pass, and the second pixel PX2 is not disposed therein.

The peripheral area PA is a non-display area that does not provide an image, and may entirely or partially surround the display area DA. A driver for providing an electrical signal or power to the display area DA may be disposed in the peripheral area PA. In the peripheral area PA, a pad that is an area to which an electronic device, a printed circuit board, or the like can be electrically connected may be disposed.

The second display area DA2 may have a circular shape or an elliptical shape on a plane as shown in FIG. 1 . Of course, the present invention is not limited thereto, and for example, the second display area DA2 may have a polygonal shape such as a quadrangle or a bar type.

The second display area DA2 may be disposed inside the first display area DA1 or at one side of the first display area DA1 . As shown in FIG. 1 , the second display area DA2 may be entirely surrounded by the first display area DA1 . In some embodiments, the second display area DA2 may be partially surrounded by the first display area DA1 . For example, the second display area DA2 may be positioned at one corner of the first display area DA1 and may be partially surrounded by the first display area DA1 .

A ratio of the second display area DA2 to the display area DA may be smaller than a ratio of the first display area DA1 to the display area DA. The electronic device 1 may include one second display area DA2 as shown in FIG. 1 , or may include two or more second display areas DA2 .

The electronic device 1 may have a rectangular shape with rounded corners on a plane as shown in FIG. 1 , but is not limited thereto. The electronic device 1 may have various shapes such as polygons, circles, and ovals.

The electronic device 1 includes a mobile phone, a smart phone, a tablet personal computer (PC), a mobile communication terminal, an electronic notebook, an e-book, a portable multimedia player (PMP), a navigation system, and an Ultra (UMPC). It may be a portable device such as a Mobile PC). In addition, in an embodiment, the electronic device 1 may be a wearable device such as a smart watch, a watch phone, a glasses display, and a head mounted display (HMD). have.

Meanwhile, in the following description, it will be described that the electronic device 1 includes an organic light emitting diode (OLED) as a light emitting element, but the electronic device 1 of the present invention is not limited thereto. As another embodiment, the electronic device 1 may include a light emitting display device including an inorganic light emitting diode, that is, an inorganic light emitting display device. The inorganic light emitting diode may include a PN diode including inorganic semiconductor-based materials. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and energy generated by recombination of the holes and electrons is converted into light energy to emit light of a predetermined color. The aforementioned inorganic light emitting diode may have a width of several to several hundred micrometers, and in some embodiments, the inorganic light emitting diode may be referred to as a micro LED. As another embodiment, the electronic device 1 may include a quantum dot light emitting display.

2 is a cross-sectional view schematically illustrating a part of an electronic device according to embodiments of the present invention.

Referring to FIG. 2 , the electronic device 1 may include a display device 10 and an electronic component 20 overlapping the display device 10 .

The display device 10 may include a first display area DA1 that is an area that displays a first image, and a second display area DA2 that displays a second image and overlaps the electronic component 20 . have.

The display device 10 includes a substrate 100 , a display layer DISL on the substrate 100 , a touch sensing layer 40 , an optical function layer 60 , and a lower protective film PF disposed under the substrate 100 . ) may be included. The display layer DISL includes a pixel circuit layer PCL including a thin film transistor TFT and insulating layers IL, an organic light emitting diode OLED as the light emitting device 200 , and a sealing member covering the light emitting device 200 . (ENCM) may be included. A buffer layer 111 may be disposed between the substrate 100 and the display layer DISL.

The substrate 100 may include glass or a polymer resin. For example, the substrate 100 including the polymer resin may have a flexible characteristic capable of bending, folding, rolling, or the like. In one embodiment, the substrate 100 may have a multilayer structure including a layer including a polymer resin and an inorganic layer (not shown).

The light emitting device 200 of the display layer DISL, that is, the organic light emitting diode OLED, may be electrically connected to the thin film transistor TFT. The organic light emitting diode (OLED) may emit light of different colors, for example, red, green, or blue light according to the type of organic material included therein.

The light emitting device 200 of the display layer DISL emits light through a light emitting area, and this light emitting area may be defined as a pixel PX. The pixel PX may be defined as an area capable of emitting red, green, or blue light, for example. The display area DA is an area providing an image, and since the image is provided through the array of pixels PX, the plurality of light emitting devices 200 may define the display area DA.

For example, the plurality of first light emitting devices 200 - 1 may define a first display area DA1 , and the plurality of second light emitting devices 200 - 2 may define a second display area DA2 . In detail, the light emitting area in which the first light emitting device 200 - 1 emits light is defined as the first pixel PX1 , and the area in which the array of the plurality of first pixels PX1 provides an image is the first display area. It may be defined as an area DA1. In addition, the light emitting area from which the second light emitting device 200 - 2 emits light is defined as the second pixel PX2 , and the area in which the array of the plurality of second pixels PX2 provides an image is the second display area It can be defined as (DA2).

A thin film transistor TFT electrically connected to the first light emitting device 200 - 1 may be disposed in the first display area DA1 . For example, a thin film transistor TFT electrically connected to the second light emitting device 200 - 2 positioned in the second display area DA2 may be disposed in the second display area DA2 as well. As another example, the thin film transistor TFT electrically connected to the second light emitting device 200 - 2 may be located in the peripheral area PA (refer to FIG. 1 ) instead of the second display area DA2 .

The second display area DA2 may include a transmission area TA in which the thin film transistor TFT and the light emitting device 200 are not disposed. The transmission area TA may be a region through which light/signal emitted from the electronic component 20 or light/signal incident to the electronic component 20 is transmitted (tansmission). In the display device 10 , the transmittance of the transmissive area TA is about 30% or more, about 40% or more, about 50% or more, about 60% or more, about 75% or more, about 80% or more, or , may be greater than or equal to about 85%, or greater than or equal to about 90%.

Although not shown in FIG. 2 , a lower metal layer may be disposed in the second display area DA2 . The lower metal layer may be disposed under the light emitting device 200 disposed in the second display area DA2. When the thin film transistor TFT is disposed in the second display area DA2 , the lower metal layer may be disposed under the thin film transistor TFT. For example, a lower metal layer may be disposed between the substrate 100 and the thin film transistor TFT. The lower metal layer may prevent light emitted from the electronic component 20 or reflected from the electronic component 20 from being incident on the thin film transistor TFT disposed in the second display area DA2. Through this, it is possible to prevent or minimize the performance degradation of the thin film transistor (TFT).

The light emitting device 200 may be covered with an encapsulation layer 300 or a sealing member ENCM such as a sealing substrate (not shown). As an optional embodiment, as shown in FIG. 2 , the organic light emitting diode (OLED) may be covered by the encapsulation layer 300 . In an embodiment, the encapsulation layer 300 may include one inorganic encapsulation layer and at least one organic encapsulation layer. For example, the encapsulation layer 300 may include first and second inorganic encapsulation layers 310 and 330 and an organic encapsulation layer 320 therebetween.

The touch sensing layer 40 may acquire coordinate information according to an external input, for example, a touch event. The touch sensing layer 40 may include a touch electrode and touch wires connected to the touch electrode. The touch sensing layer 40 may sense an external input using a self-capacitance method or a mutual capacitance method.

The touch sensing layer 40 may be formed on the sealing member ENCM. Alternatively, the touch sensing layer 40 may be separately formed on the touch substrate and then coupled to the sealing member ENCM through an adhesive layer such as an optically clear adhesive (OCA). As an embodiment, as shown in FIG. 2 , the touch-sensitive layer 40 may be formed directly on the sealing member ENCM, and in this case, the adhesive layer is between the touch-sensitive layer 40 and the sealing member ENCM. may not be included.

The optical function layer 60 may include an anti-reflection layer. The anti-reflection layer may reduce reflectance of light (external light) incident from the outside toward the display device 10 . In some embodiments, the optical function layer 60 may include a polarizing film (eg, a circularly polarizing film).

According to an embodiment of the present invention, the optical function layer 60 may include a hole 60H corresponding to the second display area DA2. For example, the hole 60H may correspond to the entire second display area DA2. Here, when the components 'correspond to' each other, the components overlap each other when the display device 10 is viewed in a direction perpendicular to one surface of the substrate 100 . The hole 60H may be a through-hole formed while a part of the optical functional layer 60 is completely removed along the thickness direction. Accordingly, the light transmittance of the second display area DA2, for example, the light transmittance of the transmitting area TA may be remarkably improved. In some embodiments, the hole 60H may be filled with a transparent material such as an optically clear resin (OCR).

The lower protective film PF may be attached to the lower surface of the substrate 100 . An adhesive layer (not shown) may be interposed between the lower protective film PF and the substrate 100 . Alternatively, the lower protective film PF may be directly formed on the lower surface of the substrate 100 . In this case, an adhesive layer is not interposed between the lower protective film PF and the substrate 100 .

The lower protective film PF may serve to support and protect the substrate 100 . In an optional embodiment, the lower protective film PF may include an opening PF-OP corresponding to the second display area DA2. The opening PF-OP of the lower protective film PF is a concave portion formed while a portion of the lower protective film PF is removed in the thickness direction. In some embodiments, the opening PF-OP of the lower protective film PF may be formed while a portion of the lower protective film PF is completely removed along the thickness direction. It may have a shape of a through-hole. In some embodiments, the opening PF-OP of the lower protective film PF may have a blind-hole shape while a portion of the lower protective film PF is partially removed along the thickness direction.

Since the lower protective film PF has the opening PF-OP, the transmittance of the second display area DA2, for example, the light transmittance of the transmitting area TA may be improved. The lower protective film PF may include an organic insulating material such as polyethylene terephthalate (PET) or polyimide (PI).

The electronic component 20 may be located in the second display area DA2. The electronic component 20 may be an electronic element using light or sound. For example, the electronic element is a sensor that measures a distance such as a proximity sensor, a sensor that recognizes a part of the user's body (eg, fingerprint, iris, face, etc.), a small lamp that outputs light, or an image sensor that captures an image ( eg, camera) and the like. The electronic element using light may use light of various wavelength bands, such as visible light, infrared light, and ultraviolet light. The electronic element using sound may use ultrasonic waves or sound of another frequency band. In some embodiments, the electronic component 20 may include sub-components such as a light emitting unit and a light receiving unit. The light emitting unit and the light receiving unit may have an integrated structure, or a pair of light emitting units and light receiving units may form one electronic component 20 in a physically separated structure.

One electronic component 20 or a plurality of electronic components 20 may be disposed in the second display area DA2 . When the electronic device 1 includes a plurality of electronic components 20 , the electronic device 1 may include a number of second display areas DA2 corresponding to the number of electronic components 20 . For example, the electronic device 1 may include a plurality of second display areas DA2 spaced apart from each other. In some embodiments, the plurality of electronic components 20 may be disposed in one second display area DA2 . For example, the electronic device 1 may include a bar-type second display area DA2, and a plurality of electronic components 20 may be disposed to be spaced apart from each other along the length direction of the second display area DA2. have.

3 is an equivalent circuit diagram of any one pixel circuit included in a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 3 , the display device 10 (refer to FIG. 2 ) emits light by receiving driving current through the pixel circuit PC and the pixel circuit PC located in the pixel circuit layer PCL (refer to FIG. 2 ). It may include a diode (OLED).

The pixel circuit PC may include a plurality of thin film transistors (TFTs) and a storage capacitor. According to an embodiment, as shown in FIG. 3 , the pixel circuit PC may include a first thin film transistor T1 , a second thin film transistor T2 , and a storage capacitor Cap. For example, the first thin film transistor T1 may be a driving TFT, and the second thin film transistor T2 may be a switching TFT. The second thin film transistor T2 is connected to the scan line SL and the data line DL, and a data signal input through the data line DL according to the scan signal Sn input through the scan line SL (Dm) may be transferred to the first thin film transistor T1.

The storage capacitor Cap is connected to the second thin film transistor T2 and the driving voltage line PL, and a driving voltage ELVDD applied to the driving voltage line PL and an arbitrary voltage applied to the second thin film transistor T2. It is possible to store the voltage corresponding to the difference of .

The first thin film transistor T1 is connected to the driving voltage line PL and the storage capacitor Cap, and is driven from the driving voltage line PL to the organic light emitting diode OLED in response to the voltage value stored in the storage capacitor Cap. current can be controlled. The opposite electrode of the organic light emitting diode OLED is connected to the common voltage ELVSS. An organic light emitting diode (OLED) may display an image by emitting light having a predetermined luminance by a driving current.

Although the case in which the pixel circuit PC includes two thin film transistors and one storage capacitor has been described in FIG. 3 , the present invention is not limited thereto. For example, the pixel circuit PC may include three or more thin film transistors and/or two or more storage capacitors. In an embodiment, the pixel circuit PC may include seven thin film transistors and one storage capacitor. The number of thin film transistors and storage capacitors may be variously changed according to the design of the pixel circuit PC. However, for convenience of description, a case in which the pixel circuit PC includes two thin film transistors and one storage capacitor will be described.

4A is a plan view schematically illustrating a part of a first display area of a display device of an electronic device according to an embodiment of the present invention, and FIG. 4B is a second display of the display device of an electronic device according to an embodiment of the present invention. It is a plan view schematically showing a part of an area.

Referring to FIG. 4A , first pixels PX1 may be disposed in the first display area DA1 . The first pixels PX1 may include a red first pixel Pr1 , a green first pixel Pg1 , and a blue first pixel Pb1 . In some embodiments, as shown in FIG. 4A , the red first pixel Pr1 , the green first pixel Pg1 , and the blue first pixel Pb1 may be arranged in a pentile pattern. In another embodiment, the red first pixel Pr1 , the green first pixel Pg1 , and the blue first pixel Pb1 may be arranged in a stripe pattern.

The red first pixel Pr1 , the green first pixel Pg1 , and the blue first pixel Pb1 may have different sizes (or widths). For example, the blue first pixel Pb1 is larger than the red first pixel Pr1 and the green first pixel Pg1, and the red first pixel Pr1 is larger than the green first pixel Pg1. can be large In some embodiments, the green first pixel Pg1 may have a rectangular shape, and adjacent green first pixels Pg1 may extend in different directions.

Referring to FIG. 4B , second pixels PX2 may be disposed in the second display area DA2 . The second pixels PX2 may include a red second pixel Pr2 , a green second pixel Pg2 , and a blue second pixel Pb2 . In some embodiments, the red second pixel Pr2 , the green second pixel Pg2 , and the blue second pixel Pb2 may be arranged in a pentile pattern. In another embodiment, the red second pixel Pr2 , the green second pixel Pg2 , and the blue second pixel Pb2 may be arranged in a stripe pattern.

The second display area DA2 may include transparent areas TA. In the second display area DA2 , the transmissive area TA may be disposed adjacent to the second pixels PX2 . For example, the second pixels PX2 may include at least two second pixels PX2 spaced apart from each other with the transmission area TA interposed therebetween. Since the second display area DA2 includes the transparent area TA, the first display area DA1 and the second display area DA2 may have different resolutions. For example, the number of second pixels PX2 per same area in the second display area DA2 may be less than the number of first pixels PX1 per same area in the first display area DA1 .

The second display area DA2 may include a pixel group PG including at least one second pixel PX2 and a transmission area TA. The pixel group PG may be defined as a pixel aggregate in which the plurality of second pixels PX2 are grouped into a preset unit. For example, FIG. 4B illustrates that eight second pixels PX2 form one pixel group PG, and adjacent pixel groups PG are disposed with the transmission area TA interposed therebetween.

For example, the pixel group PG may be surrounded by four transmission areas TA. The pixel group PG and the transmissive area TA may be alternately disposed along the x-direction and the y-direction, and for example, the pixel group PG and the transmissive area TA may be disposed in a grid shape.

The present invention is not necessarily limited thereto, and the number of second pixels PX2 included in one pixel group PG may be designed to be modified according to the resolution of the second display area DA2. In addition, the shape and arrangement of the transmissive area TA disposed around one pixel group PG on a plane may be designed with various modifications.

The transmission area TA is an area for light to pass through, and the second pixels PX2 may not be disposed. Also, the pixel circuit PC (refer to FIG. 3 ) and various wirings electrically connected to the pixel circuit PC may not be disposed in the transmission area TA.

5A and 5B are cross-sectional views schematically illustrating a part of a display device of an electronic device according to an exemplary embodiment of the present invention. 5A and 5B may correspond to a cross-section of the display device taken along line A-A' of FIG. 4A and a cross-section of the display device taken along line B-B' of FIG. 4B .

First, referring to FIG. 5A , the display device 10 may include a substrate 100 . In one embodiment, the substrate 100 may have a multilayer structure including a base layer including a polymer resin and an inorganic layer. For example, the substrate 100 may include a first base layer 101 , a first barrier layer 102 , a second base layer 103 , and a second barrier layer 104 sequentially stacked. The first base layer 101 and the second base layer 103 include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), Polyethyelenene napthalate (PEN), polyethyeleneterepthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), or/and cellulose acetate propio nate (cellulose acetate propionate: CAP), and the like. The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and/or silicon nitride. Such a substrate 100 may have a flexible characteristic.

A buffer layer 111 may be disposed on the substrate 100 . The buffer layer 111 may reduce or block penetration of foreign matter, moisture, or external air from the lower portion of the substrate 100 , and may provide a flat surface on the substrate 100 . The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure including the above-described material.

The pixel circuit layer PCL may be disposed on the buffer layer 111 . The pixel circuit layer PCL includes a pixel circuit PC including thin film transistors TFTs and a storage capacitor Cap, and an insulating layer IL disposed below or/and above components of the pixel circuit PC. may include

The pixel circuit PC may be disposed in the first display area DA1 and the second display area DA2, respectively. For example, the pixel circuit PC and the second display area DA2 in the first display area DA1. ) of the pixel circuit PC may have the same structure. As another example, the pixel circuit PC of the first display area DA1 and the pixel circuit PC of the second display area DA2 may have different structures. Hereinafter, for convenience of description, a case in which the pixel circuit PC of the first display area DA1 and the pixel circuit PC of the second display area DA2 have the same structure will be described, and the first display area The description will be focused on the pixel circuit PC of (DA1).

The thin film transistor TFT of the pixel circuit PC is connected to the semiconductor layer Act, the gate electrode GE overlapping the channel region of the semiconductor layer Act, and the source region and the drain region of the semiconductor layer Act, respectively. It may include a source electrode SE and a drain electrode DE.

The semiconductor layer Act on the buffer layer 111 may include polysilicon. Alternatively, the semiconductor layer Act may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region and a drain region and a source region respectively disposed on both sides of the channel region. The drain region and the source region may be regions doped with impurities.

The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and may be formed as a multilayer or single layer including the above material. have.

The first gate insulating layer 112 may be interposed between the semiconductor layer Act and the gate electrode GE. The first gate insulating layer 112 is, for example, silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ) It may include an inorganic insulating material such as.

The second gate insulating layer 113 may be provided to cover the gate electrode GE. The second gate insulating layer 113 is similar to the first gate insulating layer 112 , silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ). ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ) may include an inorganic insulating material.

In an embodiment, the storage capacitor Cap may be disposed to overlap the thin film transistor TFT. The storage capacitor Cap may include a first electrode CE1 and a second electrode CE2 overlapping each other. In some embodiments, the gate electrode GE of the thin film transistor TFT may include the first electrode CE1 of the storage capacitor Cap.

The second electrode CE2 of the storage capacitor Cap may be disposed on the second gate insulating layer 113 . The second electrode CE2 may overlap the gate electrode GE below it. In this case, the gate electrode GE and the second electrode CE2 overlapping with the second gate insulating layer 113 interposed therebetween may form a storage capacitor Cap. That is, the gate electrode GE overlapping the second electrode CE2 may function as the first electrode CE1 of the storage capacitor Cap. In another embodiment, the storage capacitor Cap may be formed not to overlap the thin film transistor TFT.

The second electrode CE2 includes aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). ), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multiple layers of the aforementioned materials. have.

The interlayer insulating layer 114 may cover the second electrode CE2 . The interlayer insulating layer 114 is silicon oxide (SiO ₂ ), silicon nitride (SiN _X ), silicon oxynitride (SiON), aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O) ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO ₂ ), and the like. The interlayer insulating layer 114 may be a single layer or a multilayer including the aforementioned inorganic insulating material.

The drain electrode DE and the source electrode SE may be respectively positioned on the interlayer insulating layer 114 . The drain electrode DE and the source electrode SE may be respectively connected to the drain region D and the source region S through contact holes formed in insulating layers below the drain electrode DE and the source electrode SE. The drain electrode DE and the source electrode SE may include a material having good conductivity. The drain electrode DE and the source electrode SE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), or the like, and a multilayer including the above material. Alternatively, it may be formed as a single layer. In an embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti/Al/Ti.

The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 is a general-purpose polymer such as Polymethylmethacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide-based polymer, an arylether-based polymer, an amide-based polymer, and a fluorine-based polymer. , p-xylene-based polymers, vinyl alcohol-based polymers, and organic insulating materials such as blends thereof.

The second planarization insulating layer 117 may be disposed on the first planarization insulating layer 115 . The second planarization insulating layer 117 may include the same material as the first planarization insulating layer 115 , a general general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic type It may include an organic insulating material such as a polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, and blends thereof.

The light emitting devices 200 may be disposed on the pixel circuit layer PCL having the above-described structure. In one embodiment, each light emitting device 200 is an organic light emitting diode (OLED), and includes a pixel electrode 210 , a counter electrode 230 disposed on the pixel electrode 210 , and the pixel electrode 210 and the counter electrode. It may include a stacked structure having an intermediate layer 220 interposed therebetween. For example, the light emitting devices 200 include first light emitting devices 200 - 1 disposed in the first display area DA1 and second light emitting devices 200 - 2 disposed in the second display area DA2 . can do. The first light emitting device 200 - 1 may emit light through the first pixel PX1 , and the second light emitting device 200 - 2 may emit light through the second pixel PX2 . For example, the first light emitting device 200-1 and the second light emitting device 200-2 may have the same structure as each other, and for convenience of description, the first light emitting device 200-1 will be mainly described below. do.

The pixel electrode 210 may be disposed on the second planarization insulating layer 117 . The pixel electrode 210 may be connected to the contact metal CM on the first planarization insulating layer 115 through a contact hole formed in the second planarization insulating layer 117 . The contact metal CM may be electrically connected to the thin film transistor TFT of the pixel circuit PC through a contact hole formed in the first planarization insulating layer 115 . Accordingly, the pixel electrode 210 may be electrically connected to the pixel circuit PC through the contact metal CM, and may receive a driving current from the pixel circuit PC.

The pixel electrode 210 includes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ : indium oxide), and indium. It may include a conductive oxide such as indium gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 210 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), or neodymium (Nd). , iridium (Ir), chromium (Cr), or a reflective layer including a compound thereof may be included. In another embodiment, the pixel electrode 210 may further include a film formed of ITO, IZO, ZnO, or In ₂ O ₃ above/under the above-described reflective film. In another embodiment, the pixel electrode 210 may have a three-layer structure of sequentially stacked ITO layer/Ag layer/ITO layer.

A pixel defining layer 120 may be disposed on the pixel electrode 210 . The pixel defining layer 120 may include an opening 120OP that covers an edge of the pixel electrode 210 and overlaps a central portion of the pixel electrode 210 . The opening 120OP may define a light emitting area of light emitted from the organic light emitting diode (OLED). The size/width of the opening 120OP may correspond to the size/width of the light emitting area. Accordingly, the size and/or width of the pixel PX may depend on the size and/or width of the opening 120OP of the corresponding pixel defining layer 120 .

The pixel-defining layer 120 prevents an arc from occurring at the edge of the pixel electrode 210 by increasing the distance between the edge of the pixel electrode 210 and the counter electrode 230 on the pixel electrode 210 . can play a role The pixel defining layer 120 is made of an organic insulating material such as polyimide, polyamide, acrylic resin, benzocyclobutene, hexamethyldiSL-1oxane (HMDSO), and phenol resin, and may be formed by spin coating or the like.

The intermediate layer 220 may include a light emitting layer formed to correspond to the pixel electrode 210 . The light emitting layer may include a polymer or a low molecular weight organic material that emits light of a predetermined color. Alternatively, the light emitting layer may include an inorganic light emitting material or quantum dots.

In an embodiment, the intermediate layer 220 may include a first functional layer (not shown) and a second functional layer (not shown) respectively disposed below and above the emission layer. The first functional layer is a component disposed under the light emitting layer, and may include, for example, a hole transport layer (HTL) or a hole transport layer and a hole injection layer (HIL). The second functional layer is a component disposed on the emission layer, and may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The first functional layer and/or the second functional layer may be a common layer formed to completely cover the substrate 100 like the counter electrode 230 to be described later.

The counter electrode 230 is disposed on the pixel electrode 210 and may overlap the pixel electrode 210 . The counter electrode 230 may be formed of a conductive material having a low work function. For example, the counter electrode 230 may include silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium ( Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof may include a (semi) transparent layer. Alternatively, the counter electrode 230 may further include a layer such as ITO, IZO, ZnO or In2O3 on the (semi)transparent layer including the above-described material. The counter electrode 230 may be integrally formed to cover the entire first and second display areas DA1 and DA2 .

According to an embodiment of the present invention, a capping layer 250 may be provided on the light emitting devices 200 . The capping layer 250 may include an inorganic insulating material such as silicon nitride, and/or an organic insulating material. When the capping layer 250 includes an organic insulating material, the capping layer 250 is, for example, a triamine derivative, a carbazole biphenyl derivative, an arylenediamine derivative, or an aluminum quinolium complex (Alq3). , acrylic (acrylic), polyimide (polyimide), may include an organic insulating material such as polyamide (polyamide).

An encapsulation layer 300 may be disposed on the capping layer 250 . The encapsulation layer 300 may overlap the light emitting device 200 . As described above, the encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. It shows a laminated structure of the organic encapsulation layer 320 and the second inorganic encapsulation layer 330 .

The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic material selected from among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. have. The organic encapsulation layer 320 may include a polymer-based material. The polymer-based material may include an acrylic resin, an epoxy-based resin, polyimide, polyethylene, and the like. In an embodiment, the organic encapsulation layer 320 may include an acrylate. The organic encapsulation layer 320 may be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may have transparency.

A touch sensing layer 40 including sensing electrodes and trace lines electrically connected to the sensing electrodes is disposed on the encapsulation layer 300 , and an optical function layer 60 may be disposed on the touch sensing layer 40 . have. As described above, the touch sensing layer 40 may acquire coordinate information according to an external input, for example, a touch event. The optical function layer 60 may reduce the reflectance of light (external light) incident from the outside toward the display device 10 , and/or may improve the color purity of light emitted from the display device 10 . .

In an embodiment, the optical functional layer 60 may include a retarder and/or a polarizer. The phase retarder may be a film type or liquid crystal coating type, and may include a λ/2 phase delay and/or a λ/4 phase delay. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may further include a protective film.

In another embodiment, the optical functional layer 60 may include a destructive interference structure. The destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light respectively reflected from the first and second reflective layers may destructively interfere, and thus external light reflectance may be reduced.

A cover window (not shown) may be disposed on the optical functional layer 60 . The cover window may have high transmittance to transmit light emitted from the light emitting device 200 , and may have a thin thickness to minimize the weight of the display device 10 . Also, the cover window may have strong strength and hardness to protect the display device 10 from external impact. The cover window may comprise, for example, glass or plastic.

In an embodiment, an adhesive member (not shown) may be disposed between the touch sensing layer 40 and the optical functional layer 60 and between the optical functional layer 60 and the cover window, respectively. As the adhesive member, a general one known in the art may be employed without limitation. The adhesive member may be, for example, a pressure sensitive adhesive (PSA) or an optically clear adhesive (OCA).

Meanwhile, referring to the second display area DA2 of the display device 10 , the electronic component 20 may be disposed to overlap the second display area DA2 of the display device 10 . A transmission area TA through which light emitted from or directed to the electronic component 20 is transmitted may be disposed in the second display area DA2 of the display device 10 .

Each of the insulating layers on the substrate 100 may include a hole corresponding to the transmission area TA. For example, the first gate insulating layer 112 , the second gate insulating layer 113 , the interlayer insulating layer 114 , the first planarization insulating layer 115 , the second planarization insulating layer 117 , and the pixel defining layer ( Each of 120 may include first to sixth holes H1 , H2 , H3 , H4 , H5 , and H6 positioned in the transmission area TA and overlapping each other. Also, the counter electrode 230 may include a seventh hole H7 overlapping the transmission area TA. Through this, the light transmittance in the transmission area TA may be improved.

According to an embodiment of the present invention, the optical function layer 60 may be disposed on the plurality of first light emitting devices 200 - 1 . The optical function layer 60 may overlap the first display area DA1 but may not overlap the second display area DA2 . For example, the optical function layer 60 may include a hole 60H (refer to FIG. 2 ) corresponding to the second display area DA2 .

As a comparative example, when the optical function layer 60 is disposed to overlap the second display area DA2 , the light transmittance in the transmission area TA of the second display area DA2 may be greatly reduced. For example, when the optical functional layer 60 includes a circularly polarized film, the transmittance of external light passing through the optical functional layer 60 may be about 45%. In this case, the performance of the electronic component 20 overlapping the second display area DA2 may be reduced. For example, when the electronic component 20 is an imaging device such as a camera, and the light transmittance in the transmission area TA of the second display area DA2 is low, the sensitivity of the imaging device, the quality of an image captured by the imaging device, etc. This may be lowered.

However, according to the exemplary embodiment of the present invention, since the optical functional layer 60 does not overlap the second display area DA2 , the optical transmittance is lost in the second display area DA2 by the optical functional layer 60 . can reduce Accordingly, the light transmittance in the transmission area TA of the second display area DA2 may be improved, and the performance of the electronic component 20 may be improved.

Meanwhile, since the optical function layer 60 does not overlap the second display area DA2 to improve light transmittance in the transmission area TA of the second display area DA2, the second display area DA2 ) may cause a problem that the reflectance of external light increases.

To solve this problem, according to an embodiment of the present invention, the display device 10 may include the metal layer 270 positioned in the second display area DA2. That is, the metal layer 270 may be positioned to overlap the second display area DA2 . The metal layer 270 is disposed on the plurality of second light emitting devices 200 - 2 , and may be interposed between the plurality of second light emitting devices 200 - 2 and the encapsulation layer 300 .

In an embodiment, the metal layer 270 may overlap the second display area DA2 but may not overlap the first display area DA1 . The metal layer 270 may overlap at least the plurality of second light emitting devices 200 - 2 on a plane surface, but may not overlap the plurality of first light emitting devices 200 - 1 . That is, the metal layer 270 may be positioned only in the second display area DA2 . In an embodiment, the metal layer 270 may be integrally formed in the second display area DA2 to overlap the plurality of second light emitting devices 200 - 2 . In this case, the encapsulation layer 300 may directly contact the top surface of the capping layer 250 in, for example, the first display area DA1 and directly contact the top surface of the metal layer 270 in the second display area DA2. have.

In an embodiment, the metal layer 270 may include a metal material having a relatively low light reflectance and a relatively high light absorptivity. For example, the metal layer 270 may include manganese (Mn), titanium (Ti), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), cobalt (Co), copper (Cu), aluminum ( Al), chromium nitride (CrNx), titanium nitride (TiNx), titanium aluminum nitride (TiAlNx), titanium carbide (TiC), molybdenum oxide (MoOx), chromium oxide (CrOx) and tungsten oxide (WOx). It may include at least one selected from. As a result, a portion of the external light incident on the second display area DA2 is absorbed by the metal layer 270 , thereby reducing the reflectance of the external light and improving the visibility problem caused by the external light.

In an embodiment, the metal layer 270 may include a through portion 270TH corresponding to the transmissive area TA of the second display area DA2. The through portion 270TH of the metal layer 270 may overlap the first to sixth holes H1 , H2 , H3 , H4 , H5 , H6 of the insulating layers and the seventh hole H7 of the counter electrode 230 . can Through this, the light transmittance in the transmission area TA may be improved. Since the metal layer 270 includes the through portion 270TH, the encapsulation layer 300 may directly contact the upper surface of the capping layer 250 in the transmission area TA of the second display area DA2. If the capping layer 250 includes a hole corresponding to the transmission area TA, the encapsulation layer 300 may directly contact the upper surface of the buffer layer 111 in the transmission area TA.

Meanwhile, as described above, a portion of the external light incident on the second display area DA2 is absorbed by the metal layer 270 , the other portion is reflected by the metal layer 270 , and the other portion is reflected by the metal layer 270 . ) can penetrate. External light passing through the metal layer 270 may be reflected by the plurality of second light emitting devices 200 - 2 , for example, the counter electrode 230 of each of the plurality of second light emitting devices 200 - 2 and / or it may be reflected from the pixel electrode 210 . According to an embodiment of the present invention, in order to reduce the reflectance of external light in the second display area DA2 and improve the visibility problem due to external light, the light reflected from the plurality of second light emitting devices 200 - 2 and the metal A capping layer 250 interposed between the plurality of second light emitting devices 200 - 2 and the metal layer 270 may be provided so that the light reflected by the layer 270 destructively interferes with each other. Detailed information on this will be described later with reference to FIG. 6 below.

The capping layer 250 may be disposed to overlap not only the first display area DA1 but also the second display area DA2 . In an embodiment, the capping layer 250 may include an organic insulating material. For example, the capping layer 250 is a triamine derivative, a carbazole biphenyl derivative, an arylenediamine derivative, an aluminium complex (Alq3), acrylic, polyimide, It may include an organic insulating material such as polyamide.

Referring to FIG. 5B , each of the insulating layers on the substrate 100 may cover the transmission area TA. For example, the first gate insulating layer 112 , the second gate insulating layer 113 , the interlayer insulating layer 114 , the first planarization insulating layer 115 , and the second planarization insulating layer 117 have the transmission area TA ) can be covered. However, the pixel defining layer 120 may include a sixth hole H6 positioned in the transmission area TA. Also, the counter electrode 230 may include a seventh hole H7 overlapping the transmission area TA.

6 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to an exemplary embodiment, and may correspond to a portion VI of the display device of FIG. 5A .

Referring to FIG. 6 , the external light L0 incident from the outside to the display device 10 (refer to FIG. 5A ) is the organic encapsulation layer 320 and the first inorganic encapsulation layer 310 of the encapsulation layer 300 (refer to FIG. 5A ). After passing through, it may be reflected from the metal layer 270 and the counter electrode 230 .

According to an embodiment of the present invention, the first light L1 reflected from the metal layer 270 may cause destructive interference with the second light L2 reflected from the counter electrode 230 , and through this, the external light reflectance This can be reduced. To this end, the capping layer 250 may be interposed between the metal layer 270 and the counter electrode 230 . The capping layer 250 may have a refractive index different from that of the metal layer 270 , and is formed between the first light L1 reflected from the metal layer 270 and the second light L2 reflected from the counter electrode 230 . It may have a predetermined thickness Dt so that the phase difference may be about 180 degrees.

Specifically, since the difference in the light path between the first light L1 and the second light L2 depends on the thickness dt of the capping layer 250 , the thickness dt of the capping layer 250 is adjusted A phase difference between the first light L1 and the second light L2 may be adjusted. Depending on the thickness dt of the capping layer 250 , the first light L1 and the second light L2 may destructively interfere with each other. That is, the thickness dt of the capping layer 250 may be determined such that the first light L1 reflected from the metal layer 270 and the second light L2 reflected from the counter electrode 230 can destructively interfere with each other. can

A portion of the external light L0 incident from the outside may also be reflected by the pixel electrode 210 . In consideration of this, the first light L1 reflected from the metal layer 270 , the second light L2 reflected from the counter electrode 230 , and the third light L3 reflected from the pixel electrode 210 are The thickness dt of the capping layer 250 may be determined so as to cause destructive interference as a whole. Through this, the reflectance of external light may be reduced and the visibility problem caused by external light may be improved.

7 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to another exemplary embodiment, and may correspond to part VII of the display device of FIG. 5A .

Referring to FIG. 7 , according to an embodiment of the present invention, the pixel defining layer 120 may further include a light blocking material, and the light blocking material includes, for example, chromium (Cr) or molybdenum (Mo). It may include an opaque metallic material, black ink and/or dye. Accordingly, the pixel defining layer 120 may absorb a portion of the external light L0 incident from the outside, and may further reduce the reflectance of the external light in the second display area DA2 .

8 is a plan view schematically illustrating a portion of a display device of an electronic device according to an exemplary embodiment of the present invention, and is centered on the planar shape of the optical functional layer.

Referring to FIG. 8 , the optical function layer 60 may include a hole 60H corresponding to the second display area DA2 . For example, the hole of the optical function layer 60 may correspond to the entire second display area DA2 . Accordingly, the optical function layer 60 may overlap the first display area DA1 but not overlap the second display area DA2. This is to reduce the loss of light transmittance due to the optical function layer 60 in the second display area DA2 as described above.

In one embodiment, the hole 60H of the optical functional layer 60 is formed by removing a portion corresponding to the hole 60H of the optical functional layer 60 using a mechanical process such as a punching process. can do. In another embodiment, a portion corresponding to the hole 60H of the optical functional layer 60 may be made optically transparent by using a chemical process such as a bleaching process, and through this, the optical functional layer ( A hole 60H of 60 may be formed. Of course, the present invention is not limited to this method, and any method capable of physically or optically removing a portion of the optical functional layer 60 (ie, a portion in which a hole is located) may be used without limitation.

As a comparative example, it may be considered that pattern holes corresponding only to the transmission area TA of the second display area DA2 are formed in the optical function layer 60 . In this case, the size (ie, area) of the pattern holes corresponding only to the transmission area TA is relatively very small, and the design of the pattern holes must also be changed according to the design change of the transmission area TA. There may be difficulties in the process. However, according to the exemplary embodiment of the present invention, since the hole 60H corresponding to the entire second display area DA2 is formed, difficulties in processing may be reduced.

9 is a plan view schematically illustrating a touch sensing layer of a display device according to an exemplary embodiment of the present invention.

Referring to FIG. 9 , the touch sensing layer 40 includes first sensing electrodes 410 and first trace lines 415-1 to 415-4 connected to the first sensing electrodes 410 . , second sensing electrodes 420 , and second trace lines 425-1 to 425-5 connected to the second sensing electrodes 420 may be included. The first sensing electrodes 410 and the second sensing electrodes 420 are disposed in the display area DA, and the first trace lines 415-1 to 415-4 and the second trace lines 425-1 to 425-1 to 425 - 5 may be disposed in the peripheral area PA.

The first sensing electrodes 410 may be arranged along the ±y direction, and the second sensing electrodes 420 may be arranged along the ±x direction crossing the ±y direction. The first sensing electrodes 410 arranged along the ±y direction may be connected to each other by a first connection electrode 411 between the adjacent first sensing electrodes 410, and each of the first sensing lines 410C1 to 410C1 to 410C4) may be formed. The second sensing electrodes 420 arranged along the ±x direction may be connected to each other by a second connection electrode 421 between the adjacent second sensing electrodes 420, and each of the second sensing lines 420R1 to 420R1 to 420R5) may be formed. The first sensing lines 410C1 to 410C4 and the second sensing lines 420R1 to 420R5 may cross each other. For example, the first sensing lines 410C1 to 410C4 and the second sensing lines 420R1 to 420R5 may vertically cross each other.

The first sensing lines 410C1 to 410C4 may be connected to the pads of the sensing signal pad unit 440 through first trace lines 415 - 1 to 415 - 4 formed in the peripheral area PA. For example, the first trace lines 415-1 to 415-4 may have a double routing structure respectively connected to upper and lower sides of the first sensing lines 410C1 to 410C4, respectively. First trace lines 415 - 1 to 415 - 4 respectively connected to upper and lower sides of the first sensing lines 410C1 to 410C4 may be respectively connected to corresponding pads.

The second sensing lines 420R1 to 420R5 may be connected to the pads of the sensing signal pad unit 440 through second trace lines 425 - 1 to 425 - 5 formed in the peripheral area PA. For example, the second trace lines 425 - 1 to 425 - 5 may be respectively connected to corresponding pads.

9 shows a double routing structure in which each of the first trace lines 415-1 to 415-4 is connected to upper and lower sides of the first sensing lines 410C1 to 410C4, respectively. may improve sensing sensitivity (or touch sensitivity). However, the present invention is not limited thereto. In another embodiment, the first trace lines 415-1 to 415-4 may have a single routing structure connected to upper or lower sides of the first sensing lines 410C1 to 410C4.

10 is a cross-sectional view showing a laminated structure of a touch sensing layer according to an embodiment of the present invention.

Referring to FIG. 10 , the touch sensing layer 40 may include a first conductive layer CML1 and a second conductive layer CML2 . The first insulating layer 43 may be interposed between the first conductive layer CML1 and the second conductive layer CML2 , and the second insulating layer 45 may be positioned on the second conductive layer CML2 . The first sensing electrodes 410 (refer to FIG. 9), the first connection electrodes 411 (refer to FIG. 9), the second sensing electrodes 420 (refer to FIG. 9), and the second connection electrode described above with reference to FIG. 9 Each of 421 (refer to FIG. 9 ) may be included in one of the first conductive layer CML1 or the second conductive layer CML2.

The first and second conductive layers CML1 and CML2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum (Mo), mendelebium (Mb), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In addition, the transparent conductive layer may include a conductive polymer such as PEDOT, metal nanowires, graphene, and the like.

The first and second conductive layers CML1 and CML2 may be single-layered or multi-layered. The single-layered first and second conductive layers CML1 and CML2 may include a metal layer or a transparent conductive layer, and materials of the metal layer and the transparent conductive layer are as described above. One of the first and second conductive layers CML1 and CML2 may include a single metal layer. The single metal layer may include a molybdenum layer, or an alloy layer of MoMb. One of the first and second conductive layers CML1 and CML2 may include a multi-layered metal layer. The multi-layered metal layer may include, for example, three layers of a titanium layer/aluminum layer/titanium layer, or may include two layers of a molybdenum layer/mendelebium layer. Alternatively, the multi-layered metal layer may include a metal layer and a transparent conductive layer. The first and second conductive layers CML1 and CML2 may have different stacked structures or may have the same stacked structure. For example, the first conductive layer CML1 may include a metal layer and the second conductive layer CML2 may include a transparent conductive layer. Alternatively, the first and second conductive layers CML1 and CML2 may include the same metal layer.

Materials of the first and second conductive layers CML1 and CML2 and the arrangement of sensing electrodes provided in the first and second conductive layers CML1 and CML2 may be determined in consideration of sensing sensitivity. The RC delay may affect the sensing sensitivity. Since the sensing electrodes including the metal layer have lower resistance compared to the transparent conductive layer, the RC value may be reduced, and thus the charging time of the capacitor defined between the sensing electrodes may be reduced. can The sensing electrodes including the transparent conductive layer are not visually recognized by the user compared to the metal layer, and the input area may increase to increase capacitance.

The first and second insulating layers 43 and 45 may each include an inorganic insulating material and/or an organic insulating material. The inorganic insulator may include silicon oxide, silicon nitride, or silicon oxynitride, and the organic insulator may include an organic polymer.

Some of the first and second sensing electrodes 410 and 420 and the first and second connection electrodes 411 and 421 described above with reference to FIG. 9 are located in the first conductive layer CML1, and the rest are located in the first conductive layer CML1. It may be located in the second conductive layer CML2. In an embodiment, the first conductive layer CML1 includes first connection electrodes 411 , and the second conductive layer CML2 includes first and second sensing electrodes 410 and 420 , and second connection electrodes. Electrodes 421 may be included. In another embodiment, the first conductive layer CML1 includes first and second sensing electrodes 410 and 420 , and second connection electrodes 421 , and the second conductive layer CML2 includes a first connection Electrodes 411 may be included. In another embodiment, the first conductive layer CML1 includes the first sensing electrodes 410 and the first connection electrodes 411 , and the second conductive layer CML2 includes the second sensing electrodes 420 . and second connection electrodes 421 . In this case, the first sensing electrodes 410 and the first connection electrodes 411 are provided on the same layer to be integrally connected, and the second sensing electrode 420 . ) and the second connection electrodes 421 are also provided on the same layer, so a contact hole may not be provided in the insulating layer between the first conductive layer CML1 and the second conductive layer CML2 .

Meanwhile, FIG. 10 shows that the touch sensing layer 40 includes a first conductive layer CML1 , a first insulating layer 43 , a second conductive layer CML2 , and a second insulating layer 45 . , as another embodiment, a layer including an inorganic insulating material or an organic insulating material may be further disposed under the first conductive layer CML1 .

11 and 12 are plan views each showing a first conductive layer and a second conductive layer among the touch sensing layers according to an embodiment of the present invention.

11 and 12 , the first and second sensing electrodes 410 and 420 and the first and second connection electrodes 411 and 421 may have a mesh (or grid, lattice) shape. When the first and second sensing electrodes 410 and 420 include a metal layer, in order to prevent being viewed by a user and/or to transmit light emitted through each pixel PX, in FIGS. 11 and 12 , As shown, it may have a mesh shape.

11 and 12 , the first and second sensing electrodes 410 and 420 may be formed of a mesh-shaped metal layer including holes 410H and 420H, respectively. Similarly, the first and second connection electrodes 411 and 421 may also include a mesh-shaped metal layer, and may include holes 411H and 421H, respectively. The holes 410H, 420H, 411H, and 421H may be disposed to overlap the pixel PX.

The first conductive layer CML1 may include a first connection electrode 411 as shown in FIG. 11 . The first connection electrode 411 may electrically connect the first connection electrode 411 and the first sensing electrodes 410 formed on a different layer to each other. The first connection electrode 411 electrically connecting the first sensing electrodes 410 to each other is connected to the first sensing electrodes 410 through the contact hole CNT formed in the first insulating layer 43 (refer to FIG. 6 ). can be connected with

The second conductive layer CML2 may include a first sensing electrode 410 , a second sensing electrode 420 , and a second connection electrode 421 as shown in FIG. 12 . The second sensing electrodes 420 may be connected to each other by second connection electrodes 421 formed on the same layer as the second sensing electrodes 420 . For example, the second sensing electrodes 420 may include the same material as the second connection electrodes 421 and may be integrally formed. The first sensing electrodes 410 may be electrically connected to each other by first connecting electrodes 411 formed on a different layer from the first sensing electrodes 410 . The first sensing electrodes 410 may be connected to the first sensing electrodes 410 through a contact hole CNT formed in the first insulating layer 43 .

13 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to another exemplary embodiment of the present invention. Descriptions of the same or corresponding components as those described above with reference to FIG. 5A will be omitted, and differences will be mainly described below.

Referring to FIG. 13 , the touch sensing layer 40 is positioned in the first display area DA1 and the second display area DA2 , and may be disposed on the encapsulation layer 300 . As described above, the touch sensing layer 40 includes the first conductive layer CML1 and the second conductive layer CML2, and the first insulating layer between the first conductive layer CML1 and the second conductive layer CML2 (CML2). 43), and a second insulating layer 45 on the second conductive layer CML2. The first conductive layer CML1 and the second conductive layer CML2 are positioned to overlap the pixel defining layer 120 instead of overlapping the pixels PX to transmit light emitted through the pixel PX, respectively. can do.

According to an embodiment of the present invention, the display device 10 may further include a light blocking pattern layer 50 disposed on the encapsulation layer 300 and positioned in the second display area DA2. For example, the light blocking pattern layer 50 may be disposed on the touch sensing layer 40 . That is, the touch sensing layer 40 may be interposed between the encapsulation layer 300 and the light blocking pattern layer 50 . Of course, the present invention is not limited thereto, and as another example, the light blocking pattern layer 50 may be interposed between the touch sensing layer 40 and the encapsulation layer 300 .

In an embodiment, the light blocking pattern layer 50 includes a body portion 50 -BP including a light blocking material, and a first opening 50 -OP1 and a second opening 50 adjacent to the body portion 50 -BP. -OP2) may be included. The light blocking material may include, for example, a metal material such as chromium (Cr) or molybdenum (Mo), black ink, and/or dye. The light blocking pattern layer 50 may further reduce the reflectance of external light in the second display area DA2 by absorbing a portion of external light incident from the outside. On the other hand, in terms of reducing the external light reflectance, it may be preferable that the light blocking pattern layer 50 is disposed on the touch sensing layer 40 .

In an embodiment, the body portion 50 -BP of the light blocking pattern layer 50 may be disposed to overlap the pixel defining layer 120 . The first opening 50 - OP1 of the light blocking pattern layer 50 overlaps any one of the plurality of second light emitting devices 200 - 2 , and the second opening 50 - OP2 has the second display area DA2 ) may overlap the transmission area TA. Light emitted from the plurality of second light emitting devices 200 - 2 may pass through the first opening 50 -OP1. In addition, a decrease in light transmittance of the transmission area TA through the second opening 50 - OP2 may be prevented.

In an embodiment, on an imaginary plane perpendicular to one surface of the substrate 100 (ie, on a cross-section), the width W1 of the body portion 50-BP of the light blocking pattern layer 50 is equal to the pixel defining layer ( 120 may be equal to or smaller than the width W2. Light emitted from the second light emitting devices 200 - 2 generally travels in a direction perpendicular to one surface of the substrate 100 (eg, +z direction), but some of it travels in a direction oblique to the +z direction. can In this case, when the width W1 of the body portion 50 -BP of the light blocking pattern layer 50 is greater than the width W2 of the pixel defining layer 120 , the light emitted from the second light emitting devices 200 - 2 is By blocking a portion of the light, the luminance of the display device 10 may decrease. To prevent this, according to an embodiment of the present invention, the width W1 of the body portion 50 -BP of the light blocking pattern layer 50 may be equal to or smaller than the width W2 of the pixel defining layer 120 . can

14 is a plan view schematically illustrating an arrangement of a light blocking pattern layer of a display device of an electronic device according to another exemplary embodiment of the present invention.

Referring to FIG. 14 , the first opening 50 - OP1 and the second opening 50 - OP2 of the light blocking pattern layer 50 are at least partially formed by the body portion 50 -BP of the light blocking pattern layer 50 , respectively. may be surrounded by As an example, although FIG. 14 illustrates that the first opening 50 -OP1 and the second opening 50 -OP2 are entirely surrounded by the body portion 50 -BP, the present invention is not limited thereto. Planes of the first and second openings 50 - OP1 and 50 - OP2 of the light blocking pattern layer 50 according to the shape and arrangement of the plurality of second light emitting devices 200 - 2 in the second display area DA2 The shape and arrangement of the phase may be variously modified.

As described above, the first opening 50 - OP1 of the light blocking pattern layer 50 overlaps any one of the plurality of second light emitting devices 200 - 2 , and the second opening 50 - OP2 is the first opening 50 -OP2 of the light blocking pattern layer 50 . The second display area DA2 may overlap the transmission area TA of the display area DA2 . Through this, light emitted from the plurality of second light emitting devices 200 - 2 may pass through the first opening 50 - OP1, and thus a decrease in luminance may be prevented. In addition, a decrease in light transmittance of external light incident through the transmission area TA may be prevented.

15 is a cross-sectional view schematically illustrating a part of a display device of an electronic device according to still another exemplary embodiment of the present invention. Descriptions of the same or corresponding components as those described above with reference to FIGS. 5A and 13 will be omitted, and differences will be mainly described below.

Referring to FIG. 15 , the metal layer 270 is disposed to overlap at least a plurality of second light emitting devices 200 - 2 on a plane, and the metal layer 270 is provided in plurality, and one metal layer 270 is provided. ) may be disposed to overlap one second light emitting device 200 - 2 . That is, the plurality of metal layers 270 may not be integrally formed and may be disposed to be spaced apart from each other.

In an embodiment, each metal layer 270 may not overlap the light blocking pattern layer 50 on a plane surface, and may be disposed to correspond to the first opening 50 - OP1 of the light blocking pattern layer 50 . That is, in order to reduce the reflectance of external light in a region that does not overlap the light blocking pattern layer 50 , the metal layer 270 may be positioned at least in a region that does not overlap the light blocking pattern layer 50 .

In an embodiment, each metal layer 270 may have an area larger than an area of the opening 120OP of the pixel defining layer 120 . Here, 'area' means an area on a plane when viewed in a direction perpendicular to one surface of the substrate 100 . That is, the area of each metal layer 270 may be larger than the area of each second pixel PX2 . In some embodiments, each metal layer 270 may have an area greater than or equal to the area of the pixel electrode 210 of the second light emitting device 200 - 2 .

16 is a plan view schematically illustrating an arrangement of a metal layer of a display device of an electronic device according to another exemplary embodiment of the present invention.

Referring to FIG. 16 , each metal layer 270 may have an island shape or an isolated shape on a plane view. As an embodiment, each metal layer 270 may have a shape corresponding to a shape on a plane of the second pixel PX2 . For example, when the second pixel PX2 is disposed in a pentile pattern, the metal layers 270 may also be disposed in a pentile pattern. As another example, when the second pixel PX2 is disposed in a stripe pattern, the metal layers 270 may also be disposed in a stripe pattern. Of course, the present invention is not limited to the shape of the metal layer 270 on a plane. In any case, the metal layers 270 may be disposed to overlap at least the second pixel PX2 . Accordingly, the reflectance of external light in the second pixel PX2 that does not overlap the light blocking pattern layer 50 (refer to FIG. 15 ) may be reduced.

So far, only a display device and an electronic device having the same have been mainly described, but the present invention is not limited thereto. For example, such a display device and a manufacturing method for manufacturing an electronic device having the same will also fall within the scope of the present invention.

Although the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

1: electronic device
10: display device
100: substrate
20: electronic component
200: light emitting device
210: pixel electrode
220: middle layer
230: counter electrode
250: capping layer
270: metal layer
270TH: Penetration
300: encapsulation layer
40: touch sensing layer
50: light blocking pattern layer
50-BP: body part
50-OP1: first opening
50-OP2: second opening
60: optical function layer
60H: Hall
DA1: first display area
DA2: second display area
TA: transmission area

Claims (20)

A display device comprising a first display region and a second display region including a transmissive region, the display device comprising:
Board;
a plurality of first light emitting devices disposed on the substrate and defining the first display area;
a plurality of second light emitting elements disposed on the substrate and defining the second display area;
an optical function layer disposed on the plurality of first light emitting devices and including a hole corresponding to the second display area;
a metal layer disposed on the plurality of second light emitting devices and including a through portion corresponding to the transmissive area of the second display area; and
and a capping layer interposed between the plurality of second light emitting devices and the metal layer. According to claim 1,
The metal layer includes manganese (Mn), titanium (Ti), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), cobalt (Co), copper (Cu), aluminum (Al), chromium nitride (CrN _x ), titanium nitride (TiN _x ), titanium aluminum nitride (TiAlN _x ), titanium carbide (TiC), molybdenum oxide (MoO _x ), chromium oxide (CrO _x ) and tungsten oxide (WO _x ) A display device comprising at least one selected from the group comprising. According to claim 1,
The metal layer overlaps with at least the plurality of second light emitting elements on a plane surface. According to claim 1,
The metal layer does not overlap the plurality of first light emitting devices on a plane surface. According to claim 1,
The capping layer has a thickness such that the light reflected from the plurality of second light emitting devices and the light reflected from the metal layer are destructively interfered with each other. According to claim 1,
The capping layer includes an organic insulating material. According to claim 1,
Each of the plurality of second light emitting devices,
a pixel electrode disposed on the substrate;
a counter electrode disposed on the pixel electrode; and
and an intermediate layer interposed between the pixel electrode and the counter electrode. 8. The method of claim 7,
and a pixel defining layer covering an edge of the pixel electrode of each of the plurality of second light emitting devices and including an opening defining a light emitting region of each of the plurality of second light emitting devices. 9. The method of claim 8,
The pixel defining layer includes a light blocking material. 9. The method of claim 8,
and an encapsulation layer disposed on the metal layer and including at least one inorganic layer and at least one organic layer. 11. The method of claim 10,
It further includes; a light blocking pattern layer located in the second display area on the encapsulation layer,
The light blocking pattern layer may include a body portion including a light blocking material; and a first opening and a second opening adjacent to the body portion. 12. The method of claim 11,
The first opening of the light blocking pattern layer overlaps any one of the plurality of second light emitting devices on a plane,
and the second opening of the light blocking pattern layer overlaps the transmissive area of the second display area on a plane surface. 12. The method of claim 11,
On a virtual plane perpendicular to one surface of the substrate, a width of the body portion of the light blocking pattern layer is smaller than a width of the pixel defining layer. 12. The method of claim 11,
and a touch sensing layer interposed between the encapsulation layer and the light blocking pattern layer, the touch sensing layer including sensing electrodes and trace lines electrically connected to the sensing electrodes. a display device including a first display area and a second display area having different resolutions; and
and an electronic component overlapping the transmissive area provided in the second display area;
The display device is
Board;
a plurality of first light emitting devices disposed on the substrate and defining the first display area;
a plurality of second light emitting elements disposed on the substrate and defining the second display area;
an optical function layer disposed on the plurality of first light emitting devices and including holes corresponding to the second display areas;
a metal layer disposed on the plurality of second light emitting devices and including a through portion corresponding to the transmissive area of the second display area; and
a capping layer interposed between the plurality of second light emitting devices and the metal layer, the capping layer having a predetermined thickness so that the light reflected from the plurality of second light emitting devices and the light reflected from the metal layer interfere with each other destructively; Including, an electronic device. 16. The method of claim 15,
The capping layer may include a through portion corresponding to the transmissive area of the second display area. 16. The method of claim 15,
The metal layer overlaps at least the plurality of second light emitting devices on a plane surface, but does not overlap the plurality of first light emitting devices. 16. The method of claim 15,
Each of the plurality of second light emitting devices may include: a pixel electrode disposed on the substrate; a counter electrode disposed on the pixel electrode; and an intermediate layer interposed between the pixel electrode and the counter electrode.
The electronic device further comprising: a pixel defining layer covering an edge of the pixel electrode of each of the plurality of second light emitting devices and including a light blocking material. 19. The method of claim 18,
an encapsulation layer disposed on the metal layer and having at least one inorganic layer and at least one organic layer;
a touch sensing layer disposed on the encapsulation layer and including sensing electrodes and trace lines electrically connected to the sensing electrodes; and
The electronic device further comprising a; light blocking pattern layer located in the second display area on the touch sensing layer. 20. The method of claim 19,
The light blocking pattern layer may include a body portion including a light blocking material; and a first opening and a second opening at least partially surrounded by the body portion.
The first opening of the light blocking pattern layer overlaps any one of the plurality of second light emitting devices on a plane,
and the second opening of the light blocking pattern layer overlaps the transmissive area of the second display area in a plan view.

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