KR102627010B1 - Slim planar light source and method of manufacturing the same - Google Patents

Abstract

One embodiment of the present invention includes a PCB board with wiring formed inside and a PSR layer formed on the upper surface, an LED light source mounted on the PCB board, covering the LED light source, and emitting light output from the LED light source. It is possible to provide a slim surface light source including a transparent resin layer that guides and outputs light to a surface opposite to the PCB substrate, and a micro-optic lens film disposed on the light exit surface of the transparent resin layer.

Description

Slim surface light source and slim surface light source manufacturing method {SLIM PLANAR LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a slim surface light source and a method of manufacturing a slim surface light source, and to a slim surface light source and a method of manufacturing a slim surface light source that can improve luminous efficiency by placing a micro-optic lens film on the light exit surface of the surface light source.

In general, automobiles are equipped with various lighting devices at the front and rear to provide automobile safety and driving convenience. These lighting devices include devices such as headlights, tail lights, and turn signals that operate by directly emitting light using lamps. In addition, the front and rear of the car are equipped with reflectors that function by reflecting light so that the car can be easily recognized from the outside.

These lighting devices use various types of light sources according to recent technological developments. In the past, lighting devices using regular light bulbs developed into lighting devices using LEDs, but even when using LEDs, there was a light guide that reflected light on the side of the light source, so there was a limit to making the lighting devices slimmer. Therefore, there was a need for the development of a lighting device for automobiles that is thinner, uses the space of the automobile efficiently, and is advantageous in design.

Prior literature: Korean registered patent 10-1253987

The prior literature relates to a 'light guide plate for a surface light source device and a backlight unit using the same,' which not only has high frontal brightness by increasing the light efficiency in the backlight, but also has a wide viewing angle and excellent luminance uniformity. It relates to a light guide plate for a surface light source device and a backlight unit using the same. will be. For this purpose, in the prior literature, a light guide plate including an entrance surface through which light is incident from a light source disposed along an axis, an exit surface through which the incident light is emitted, and a back surface facing the exit surface, wherein the exit surface includes a lenticular, a prism, or A microlens shape is formed, and a plurality of unit cells with a micro prism pattern engraved on the rear surface are dispersedly arranged, wherein the unit prism ridges of the micro prism pattern are curved, and the travel direction of the ridges is parallel to the arrangement direction of the light source. Do it as

In this way, in order to improve light uniformity and increase light efficiency in surface light sources, various studies are being conducted on the arrangement of internal components and manufacturing processes.

In order to solve the above problems, the present invention aims to provide a slim surface light source that can improve the light extraction effect of the surface light source by forming a micro-optic lens film on the light exit surface of the surface light source.

One embodiment of the present invention includes a PCB board with wiring formed inside and a PSR layer formed on the upper surface, an LED light source mounted on the PCB board, covering the LED light source, and emitting light output from the LED light source. It is possible to provide a slim surface light source including a transparent resin layer that guides and outputs light to a surface opposite to the PCB substrate, and a micro-optic lens film disposed on the light exit surface of the transparent resin layer.

The micro-optic lens film may include a translucent sheet and a plurality of micro-optic lenses formed on one surface of the translucent sheet.

The micro-optic lens may be formed of a material different from the light-transmitting sheet.

The micro-optic lens may be a concave lens in which a concave portion is formed inside a transparent resin layer.

The slim surface light source may further include a reflection portion formed on a surface opposite to the light exit surface of the transparent resin layer.

The reflective portion may be a reflective film applied to the upper surface of the PSR layer of the PCB substrate.

The reflective portion may be a reflective pattern formed on the upper surface of the PSR layer of the PCB substrate.

The reflective portion may include a convex pattern formed below the PSR layer, and a PSR layer in which irregularities are formed in the shape of the convex pattern.

The reflective portion includes a PSR layer partially removed from the PCB board in a pattern shape, a convex pattern formed in an area where the PSR layer has been removed and lower than the thickness of the PSR layer, and a convex pattern formed on the PSR layer. It may include a plurality of solder pads formed higher.

The slim surface light source may further include a side reflector formed on at least one side of the transparent resin layer.

The LED light source may be a side-emitting type LED mounted on the PCB board and having one side as a light emission surface and the other side opposite to the light emission surface. In this case, the slim surface light source may be a side-emitting type LED. It may further include a light blocking portion formed in the upper area of the LED.

The light blocking part may have a transmittance of 5 to 30% for transmitting light emitted from the LED light source.

The light blocking part may include a light blocking pad, one end of which exposes the other side of the side-emitting LED, and the other end of which is formed to cover the one side. The light blocking part is formed outside the light blocking pad, and is exposed to a light source. It may further include a light blocking pattern formed so that the light leakage ratio increases as the distance increases.

The transparent resin layer may include a first transparent resin layer covering the LED light source, a fluorescent sheet layer laminated on top of the first transparent resin layer, and a second transparent resin layer laminated on top of the fluorescent sheet layer. there is.

Another embodiment of the present invention includes preparing a PCB board on which internal wiring and a PSR layer are formed on the upper surface, and an LED light source is mounted on the upper surface, and is disposed on the PCB board to emit light from the LED light source on one side. preparing a transparent resin layer that receives input and outputs light to a side opposite to the PCB substrate, preparing a micro-optic lens film to be placed on the transparent resin layer, the PCB substrate, the transparent resin layer, A method for manufacturing a slim surface light source can be provided, including sequentially stacking micro-optic lens films and placing them between an upper presser plate and a lower presser plate, and pressing the upper presser plate and the lower presser plate.

Preparing the micro-optic lens film includes preparing a light-transmitting sheet, preparing a mold with a micro-lens pattern formed thereon, and pressing the light-transmitting sheet into the mold to form a micro-optic lens pattern on one side of the light-transmitting sheet. It may include the step of forming.

Forming the micro-optic lens film includes preparing a light-transmitting sheet, forming a light-transmitting layer made of a different material from the light-transmitting sheet on one side of the light-transmitting sheet, and preparing a mold on which the micro-lens pattern is formed. , and forming a micro-lens pattern with the light-transmitting layer by pressing the light-transmitting layer into a mold in which the lens pattern is formed.

The step of forming the micro optical lens film includes preparing a light-transmitting sheet, coating a UV resin layer on one side of the light-transmitting sheet, preparing a mold in which a micro lens pattern is formed, and the lens pattern is It may include forming a micro lens pattern with the UV resin layer by pressing the UV resin layer on the formed mold, and curing the micro lens pattern.

The step of preparing the transparent resin layer includes sequentially forming a first transparent resin layer covering the LED light source, a fluorescent sheet layer to be laminated on top of the first transparent layer, and a second transparent resin layer to be laminated on top of the fluorescent sheet layer. It can be prepared by layering.

According to the present invention, a slim surface light source that can improve the light extraction effect of the surface light source can be obtained by forming a micro-optic lens film on the light exit surface of the surface light source.

1 is a cross-sectional view of a slim surface light source according to an embodiment of the present invention.
Figure 2 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.
Figure 3 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.
Figure 4 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.
Figure 5 is a diagram showing a method of manufacturing a slim surface light source according to another embodiment of the present invention.
Figure 6 is an example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.
Figure 7 is another example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.
Figure 8 is another example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.
Figure 9 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.
Figure 10 is a plan view of a slim surface light source according to another embodiment of the present invention.
Figure 11 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.
Figure 12 is a diagram showing a method of manufacturing a slim surface light source according to another embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the attached drawings.

1 is a cross-sectional view of a slim surface light source according to an embodiment of the present invention.

Referring to FIG. 1, the slim surface light source 100 according to this embodiment may include a PCB substrate 110, an LED light source 120, a transparent resin layer 130, and a micro optical lens film 140. there is.

The PCB board 110 is a board on which electronic components can be mounted on the surface by forming wiring lines inside a plurality of layers of the board. In this embodiment, the PCB board 110 may have a wiring line 112 formed inside the board body 111 in which a plurality of layers are stacked, and a portion of the wiring line is exposed at the top of the board to be mounted, such as an LED. It can be formed to enable contact with parts. A PSR layer 113 may be formed on the surface of the PCB board body 111. The PSR (Photo Imageable Solder Resist) layer can be formed to protect the circuit by coating an invariant compound ink that is durable in a chemical environment and at the same time prevent solder leakage from occurring between circuits during the soldering process.

The LED light source 120 may be mounted on the PCB board 110. The LED light source may be a light source using LED, a semiconductor that converts electrical energy into light energy. In this embodiment, one LED light source is shown as being mounted, but multiple LED light sources may be mounted on the PCB board depending on the purpose or shape of the slim surface light source. In addition, the method of mounting the LED light source on the PCB board can be mounted in a side edge or direct form depending on the purpose or shape of the surface light source. In this embodiment, a side type LED may be included. The slim surface light source according to this embodiment can be applied to automobile tail lights, DRLs, etc. Therefore, unlike the flat surface light source applied to the BLU of electronic products, LEDs can be mounted in the middle of the surface light source and these can form a unique light emission form of the surface light source.

The transparent resin layer 130 is disposed on the PCB board 110 and may be formed to cover the LED light source 120. The transparent resin layer 130 can guide the light emitted from the LED light source 120 and output the light to the surface opposite to the PCB board 110. The transparent resin layer 130 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The slim surface light source according to this embodiment may include a diffusion agent in the transparent resin layer 130 in order to output the light input from the LED light source 120 to one surface of the transparent resin layer 130. The transparent resin layer 130 may be formed to completely cover the LED light source 120.

The micro optical lens film 140 may be disposed on the light exit surface of the transparent resin layer 130. The micro-optic lens film 140 may have micro-optic lenses 142 formed in a plurality of fine patterns on the light-transmitting sheet 141. The micro-optic lens 142 may have a concave-convex structure formed on the light-transmitting sheet 141 in a concave or convex shape. In this embodiment, the light-transmitting sheet 141 and the micro-optic lens 142 may be formed of different materials. For example, the micro-optic lens film 140 may be made of a light-transmitting material such as PET, PC, or PMMA. In this embodiment, light passing through the transparent resin layer 130 may pass through the light-transmitting sheet 141 and then through the micro-optic lens 142. In this way, the micro-optic lens 142 disperses the light emitted from the slim surface light source, thereby improving the uniformity of the output light from the slim surface light source. In this embodiment, the micro-optic lens 142 is shown as being formed on the entire surface of the light-emitting surface of the translucent sheet 141. However, the micro-optic lens 142 may be formed only in a partial area of the translucent sheet 141. .

The slim surface light source 100 according to this embodiment may further include a light blocking portion 150. The light blocking portion 150 is formed on the light exit surface of the micro optical lens film 140 and may be formed on top of the LED light source 120. The light blocking portion 150 may reflect light output from the top of the LED light source among the light emitted from the LED light source 120 back into the micro optical lens film 140 and the transparent resin layer 130. The light reflected in this way may move inside the transparent resin layer 130 and be emitted to an area where the light blocking portion is not formed. As a result, when the light blocking part 150 is formed, the overall light uniformity can be improved by increasing the light intensity emitted from the area where the light blocking part of the transparent resin layer 130 is not formed, compared to the case without the light blocking part. The light blocking part 150 may use white ink containing SiO2 or TiO2. In this embodiment, the light blocking portion 150 may be formed on the upper surface of the transparent resin layer 130 by screen printing, deposition, photolithography, etc. The light blocking portion may be formed to have a transmittance of 1 to 99%, preferably 5 to 30%. By doing this, it is possible to prevent dark areas from forming in the area where the light blocking portion 150 is formed, thereby improving light uniformity across the entire surface light source.

The slim surface light source 100 according to this embodiment may further include a reflection pattern 150 between the PCB substrate 110 and the transparent resin layer 130. The reflective pattern 150 may be a fine pattern capable of forming irregularities on the top of the PSR layer 113 of the PCB substrate. In this embodiment, the reflection pattern 150 is formed on the PSR coating layer 113 of the PCB substrate, so that light moving from the transparent resin layer 130 toward the PCB substrate can be reflected and reflected in the opposite direction to the substrate. . The reflective pattern 150 may be formed in a mesh shape or a dot shape in which a plurality of lines having a predetermined area are woven in a mesh shape. The material forming the reflective pattern 150 may be formed by printing or depositing TiO ₂ or the like on the upper part of the PCB substrate 110 . By forming the reflection pattern 150 in this way, the light extraction efficiency can be improved by increasing the reflection efficiency inside the slim surface light source according to this embodiment.

Figure 2 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 2, the slim surface light source 200 according to this embodiment may include a PCB substrate 210, an LED light source 220, a transparent resin layer 230, and a micro optical lens film 240. there is.

The PCB board 210 is a board on which electronic components can be mounted on the surface by forming wiring lines inside a plurality of layers of the board. In this embodiment, the PCB board 210 may have a wiring line 212 formed inside the board body 211 in which a plurality of layers are stacked, and a portion of the wiring line is exposed at the top of the board to be mounted, such as an LED. It can be formed to enable contact with parts. A PSR layer 213 may be formed on the surface of the PCB board body 211. The PSR (Photo Imageable Solder Resist) layer can be formed to protect the circuit by coating an invariant compound ink that is durable in a chemical environment and at the same time prevent solder leakage from occurring between circuits during the soldering process.

The LED light source 220 may be mounted on the PCB board 210. The LED light source may be a light source using LED, a semiconductor that converts electrical energy into light energy. In this embodiment, one LED light source is shown as being mounted, but multiple LED light sources may be mounted on the PCB board depending on the purpose or shape of the slim surface light source. In addition, the method of mounting the LED light source on the PCB board can be mounted in a side edge or direct form depending on the purpose or shape of the surface light source. In this embodiment, a side type LED may be included. The slim surface light source according to this embodiment can be applied to automobile tail lights, DRLs, etc. Therefore, unlike the flat surface light source applied to the BLU of electronic products, LEDs can be mounted in the middle of the surface light source and these can form a unique light emission form of the surface light source.

The transparent resin layer 230 is disposed on the PCB board 210 and may be formed to cover the LED light source 220. The transparent resin layer 230 can guide the light emitted from the LED light source 220 and output the light to the surface opposite to the PCB board 210. The transparent resin layer 230 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The slim surface light source according to this embodiment may include a diffusion agent in the transparent resin layer 230 in order to output the light input from the LED light source 220 to one surface of the transparent resin layer 230. The transparent resin layer 230 may be formed to completely cover the LED light source 220.

The micro optical lens film 240 may be disposed on the light exit surface of the transparent resin layer 230. The micro-optic lens film 240 may have a plurality of fine patterns formed on one surface of the light-transmitting sheet 241 to form a micro-optic lens 242. The micro-optic lens 242 may have a concave-convex structure formed on the light-transmitting sheet 241 in a concave or convex shape. In this embodiment, the light-transmitting sheet 241 and the micro-optic lens 242 may be formed of different materials. For example, the micro-optic lens film 140 may be made of a light-transmitting material such as PET, PC, or PMMA. Additionally, the light-transmitting sheet 241 and the micro-optic lens 242 may be made of different materials. In this embodiment, the micro-optic lens film 240 is arranged so that the light output from the transparent resin layer 230 first passes through the micro-optic lens 242 and then passes through the light-transmitting sheet 241. In this way, the micro-optic lens 242 disperses the light emitted from the slim surface light source, thereby improving the uniformity of the output light from the slim surface light source.

The slim surface light source 200 according to this embodiment may further include a light blocking portion 250. The light blocking portion 250 is formed on the light exit surface of the micro-optic lens film 240 and may be formed on top of the LED light source 220. The light blocking portion 250 may reflect light output from the top of the LED light source among the light emitted from the LED light source 220 back into the micro optical lens film 240 and the transparent resin layer 230. The light reflected in this way may move inside the transparent resin layer 230 and be emitted to an area where the light blocking portion is not formed. As a result, when the light blocking part 250 is formed, the overall light uniformity can be improved by increasing the light intensity emitted from the area where the light blocking part of the transparent resin layer 230 is not formed, compared to the case without the light blocking part. The light blocking part 250 may use white ink containing SiO2 or TiO2. In this embodiment, the light blocking portion 250 may be formed on the upper surface of the transparent resin layer 230 by screen printing, deposition, photolithography, etc. The light blocking portion may be formed to have a transmittance of 1 to 99%, preferably 5 to 30%. By doing this, it is possible to prevent dark areas from forming in the area where the light blocking portion 250 is formed, thereby improving light uniformity across the entire surface light source.

The slim surface light source 200 according to this embodiment may further include a reflection portion 260 between the PCB substrate 210 and the transparent resin layer 230. The reflector 260 may include a convex pattern 261 formed on the lower portion of the PSR layer 213 of the PCB substrate 210 and a PSR layer 262 having irregularities formed in the shape of the convex pattern. The slim surface light source 200 according to this embodiment forms a convex pattern 261 on the upper surface of the PCB substrate body 211 before forming the PSR layer 213 on the upper surface of the PCB substrate body 211, and forms the convex pattern 261 on the upper surface of the PCB substrate body 211. The PSR layer 213 can be formed to cover (261). The convex pattern 261 may be formed in a mesh shape or a dot shape. The convex pattern 261 may be formed of the same material as the electrode for device mounting on the upper surface of the PCB board body 211 in the process of forming the electrode. If the PSR layer 213 is formed to cover the convex pattern 261, the PSR layer 213 with irregularities 262 identical to the irregularities caused by the convex pattern 261 can be formed. The unevenness 262 formed on the PSR layer may serve as a reflector. The irregularities 262 formed on the PSR layer can reflect light directed toward the PCB substrate among the light passing through the transparent resin layer 230 and reflect it in the direction of the light exit surface of the transparent resin layer. By forming the reflector 260 in this way, the reflection efficiency inside the transparent resin layer 230 of the slim surface light source can be increased, thereby increasing the light extraction efficiency exiting the light exit surface.

Figure 3 is a diagram for explaining a reflection part in a slim surface light source according to another embodiment of the present invention. Since the other configurations except for the reflector in FIG. 3 are the same as those in FIG. 2, only the reflector will be described below.

Figure 3 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.

In FIG. 3, the reflector 360 includes a PSR layer 361 partially removed in a pattern form from the PCB board, a convex pattern 362 formed lower than the thickness of the PSR layer in the area where the PSR layer was removed, and the convex pattern. It is formed on the PSR layer and may include a plurality of solder pads 363 formed higher than the PSR layer. The slim surface light source 300 according to this embodiment forms a convex pattern 362 on the upper surface of the PCB substrate body 311 before forming the PSR layer 313 on the upper surface of the PCB substrate body 311, and forms the convex pattern 362 on the upper surface of the PCB substrate body 311. PSR layers 313 and 361 may be formed so that (362) is exposed. The convex pattern 362 may be formed in a mesh shape or a dot shape. The convex pattern 362 may be formed of the same material as the electrode for device mounting on the upper surface of the PCB board body 311 in the process of forming the electrode. After forming the PSR layer 313 on the entire PCB board body 311 to cover the convex pattern 362, a portion of the PSR layer can be removed to expose the convex pattern 362 and the electrode for device mounting. there is. In this embodiment, a portion of the PSR layer may be removed to expose the electrode and the convex pad 362, and a solder pad may be formed on the exposed electrode and the convex pattern 362. The solder pad formed on the electrode is for bonding elements mounted on the electrode. On the other hand, the solder pad 363 formed on the convex pattern 362 is not for a separate electrical connection, and by forming the solder pad 363 higher than the PSR layer 313, the solder pad 363 is a reflective part. can play a role. The solder pad 363 formed higher than the PSR layer 313 can reflect light directed toward the PCB substrate among the light passing through the transparent resin layer 330 and reflect it in the direction of the light exit surface of the transparent resin layer. By forming the reflector 360 in this way, the reflection efficiency inside the transparent resin layer 330 of the slim surface light source can be increased, thereby increasing the light extraction efficiency exiting the light exit surface.

Figure 4 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.

Referring to Figure 4, the slim surface light source 400 according to this embodiment includes a PCB substrate 410, an LED light source 420, a transparent resin layer 430, a micro-optic lens film 440, and a side reflector ( 470) may be included.

The PCB board 410 is a board on which electronic components can be mounted on the surface by forming wiring lines inside a plurality of layers of the board. In this embodiment, the PCB board 410 may have a wiring line 412 formed inside the board body 411 in which a plurality of layers are stacked, and a portion of the wiring line is exposed at the top of the board to be mounted, such as an LED. It can be formed to enable contact with parts. A PSR layer 413 may be formed on the surface of the PCB board body 411. The PSR (Photo Imageable Solder Resist) layer can be formed to protect the circuit by coating an invariant compound ink that is durable in a chemical environment and at the same time prevent solder leakage from occurring between circuits during the soldering process.

The LED light source 420 may be mounted on the PCB board 410. The LED light source may be a light source using LED, a semiconductor that converts electrical energy into light energy. In this embodiment, one LED light source is shown as being mounted, but multiple LED light sources may be mounted on the PCB board depending on the purpose or shape of the slim surface light source. In addition, the method of mounting the LED light source on the PCB board can be mounted in a side edge or direct form depending on the purpose or shape of the surface light source. In this embodiment, a side type LED may be included. The slim surface light source according to this embodiment can be applied to automobile tail lights, DRLs, etc. Therefore, unlike the flat surface light source applied to the BLU of electronic products, LEDs can be mounted in the middle of the surface light source and these can form a unique light emission form of the surface light source.

The transparent resin layer 430 is disposed on the PCB board 410 and may be formed to cover the LED light source 420. The transparent resin layer 430 can guide the light emitted from the LED light source 420 and output the light to the surface opposite to the PCB board 410. The transparent resin layer 430 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The slim surface light source according to this embodiment may include a diffusion agent in the transparent resin layer 430 in order to output the light input from the LED light source 420 to one surface of the transparent resin layer 430. The transparent resin layer 430 may be formed to completely cover the LED light source 420.

The micro optical lens film 440 may be disposed on the light exit surface of the transparent resin layer 430. The micro-optic lens film 440 may have micro-optic lenses 442 formed in a plurality of fine patterns on the light-transmitting sheet 441. The micro-optic lens 442 may have a concave-convex structure formed on the light-transmitting sheet 441 in a concave or convex shape. In this embodiment, the light-transmitting sheet 441 and the micro-optic lens 442 may be formed of different materials. For example, the micro-optic lens film 140 may be made of a light-transmitting material such as PET, PC, or PMMA. In this embodiment, light passing through the transparent resin layer 430 may pass through the micro-optic lens 442 and then through the light-transmitting sheet 441. In this way, the micro-optic lens 442 disperses the light emitted from the slim surface light source, thereby improving the uniformity of the output light from the slim surface light source. In this embodiment, the micro-optic lens 442 is shown as being formed on the entire surface of the light-emitting surface of the light-transmitting sheet 441. However, the micro-optic lens 442 may be formed only in a partial area of the light-transmitting sheet 441. .

The side reflector 470 may be formed on at least one side of the transparent resin layer 430. The light emitted from the transparent resin layer 430 may be emitted to the outside of the transparent resin layer because the total reflection of light traveling inside the transparent resin layer is broken on the surface of the transparent resin layer. In this embodiment, a micro-optic lens 440 can be formed to use one side of the transparent resin layer 430 as a light emission surface so that the most light is output from that side. However, light can also be emitted from the side of the transparent resin layer 430. In this embodiment, by forming a reflector 470 on the side of the transparent resin layer 430, the light emitted from the side is redirected to the transparent resin layer 430. ) can be reflected internally. By doing this, the path of light that can exit from the side of the transparent resin layer can be changed to the light exit surface, thereby increasing the overall light efficiency of the slim surface light source.

The slim surface light source 400 according to this embodiment may further include a light blocking portion 450. The light blocking portion 450 is formed on the light exit surface of the transparent resin layer 430 and may be formed in the upper area of the LED light source 420. The light blocking portion 450 may reflect light output from the top of the LED light source among the light emitted from the LED light source 420 back into the transparent resin layer 430. The light reflected in this way may move inside the transparent resin layer 430 and be emitted to an area where the light blocking portion is not formed. As a result, when the light blocking part 450 is formed, the overall light uniformity can be improved by increasing the light intensity emitted from the area where the light blocking part of the transparent resin layer 430 is not formed, compared to the case without the light blocking part. The light blocking part 450 may use white ink containing SiO2 or TiO2. In this embodiment, the light blocking portion 450 may be formed on the upper surface of the transparent resin layer 430 by screen printing, deposition, photolithography, etc. The light blocking portion may be formed to have a transmittance of 1 to 99%, preferably 5 to 30%. By doing this, it is possible to prevent dark areas from forming in the area where the light blocking portion 450 is formed, thereby improving light uniformity across the entire surface light source.

Figure 5 is a diagram showing a method of manufacturing a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 5, the slim surface light source manufacturing method according to the present embodiment includes the steps of preparing a PCB board on which internal wiring and a PSR layer are formed on the upper surface, and an LED light source is mounted on the upper surface, and on the PCB board. Preparing a transparent resin layer that is disposed to receive light from the LED light source on one side and output light to a side opposite to the PCB board, and preparing a micro-optic lens film to be disposed on the transparent resin layer. It may include sequentially stacking the PCB board, the transparent resin layer, and the micro-optic lens film and placing them between the upper press plate and the lower press plate, and pressing the upper press plate and the lower press plate.

In the step of preparing the PCB board, a PCB board 510 with internal wiring and a PSR layer formed on the upper surface and an LED light source mounted on the upper surface can be prepared. A PCB board is a board on which electronic components can be mounted on the surface by forming wiring lines inside multiple layers of the board. In this embodiment, a wiring line may be formed inside the PCB board 510, and a portion of the wiring line may be exposed at the top of the board to enable contact with mounted components such as LEDs. A PSR layer may be formed on the surface of the PCB substrate. The LED light source 520 may be mounted on the PCB board. The LED light source may be a light source using LED, a semiconductor that converts electrical energy into light energy. In this embodiment, one LED light source is shown as being mounted, but multiple LED light sources may be mounted on the PCB board depending on the purpose or shape of the slim surface light source. In addition, the method of mounting the LED light source on the PCB board can be mounted in a side edge or direct form depending on the purpose or shape of the surface light source.

In the step of preparing the transparent resin layer, a transparent resin layer 530 is disposed on the PCB substrate to receive light from the LED light source on one side and output light to the side opposite to the PCB substrate. . The transparent resin layer 530 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The transparent resin layer 530 may include a diffusion agent.

In the step of preparing the micro-optic lens film 540, a micro-optic lens film to be placed on the transparent resin layer can be prepared. The micro-optic lens film 540 may be a micro-optic lens formed with a plurality of fine patterns on a light-transmissive sheet. The micro-optic lens may have a concave-convex structure formed in a convex shape on the light-transmitting sheet. In this embodiment, the light-transmitting sheet and micro-optic lens film may be formed of different materials. For example, the micro-optic lens film 340 may be made of a light-transmitting material such as PET, PC, or PMMA.

In the slim surface light source manufacturing method according to this embodiment, the prepared PCB board 510, transparent resin layer 530, and micro-optic lens film 540 are sequentially stacked and placed on the upper pressing plate 502 and the lower pressing plate 501. ) can be placed in between. Afterwards, the upper pressing plate 502 and the lower pressing plate 501 can be pressed. At this time, the upper pressing plate 502 and the lower pressing plate 501 can be compressed while applying heat. The transparent resin layer 530 can be firmly attached to the PCB substrate 510 and the micro-optic lens film 540 by thermal compression. In this embodiment, instead of using an injection process to form the transparent resin layer and micro-optic lens, the process is simplified by forming the transparent resin layer and micro-optic lens film in the form of a separate sheet and then attaching them at once through a thermocompression process. Also, compared to the injection process, cheaper materials can be used.

Figure 6 is an example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.

Referring to FIG. 6, the step 600 of preparing a micro optical lens film includes preparing a light-transmitting sheet (Step 1), preparing a mold on which a micro lens pattern is formed (not shown), and placing the light-transmitting sheet in the mold. It may include forming a micro lens pattern on one side of the light-transmissive sheet by pressing (step 2). In the step of preparing the light-transmitting sheet (step 1), the light-transmitting sheet 641 may be formed of a light-transmitting material such as PET, PC, PMMA, or silicon. In the step of forming the micro lens pattern (step 2), the light transmissive sheet 641 may be pressed into a mold 605 in which the micro lens pattern is formed, thereby forming a micro lens pattern 642 on one side of the light transmissive sheet. In the step of forming the micro lens pattern, heat may be applied to the mold 605 and compressed. Thereafter, by removing the mold, a micro optical lens film 640 with a micro lens pattern 642 formed on one side according to this embodiment can be obtained.

Figure 7 is another example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.

Referring to FIG. 7, the step 700 of preparing a micro optical lens film includes preparing a light-transmitting sheet, forming a light-transmitting layer of a material different from the light-transmitting sheet on one side of the light-transmitting sheet (Step 1), and micro It may include preparing a mold on which a lens pattern is formed (not shown) and forming a micro-lens pattern with the light-transmitting layer by pressing the light-transmitting layer into the mold (step 2). In the step of preparing the light-transmitting sheet and forming a light-transmitting layer made of a material different from the light-transmitting sheet on one side of the light-transmitting sheet (step 1), the light-transmitting sheet 741 is made of a light-transmitting material such as PET, PC, PMMA, or silicon. The light transmissive layer 706 may be formed of a material different from that of the light transmissive sheet. In the step of forming the micro-lens pattern (step 2), the light-transmitting layer 706 may be pressed to the mold 705 in which the micro-lens pattern is formed, thereby forming the micro-lens pattern 742 as the light-transmitting layer. In the step of forming the micro lens pattern, heat may be applied to the mold 705 and compressed. Thereafter, by removing the mold, a micro optical lens film 740 with a micro lens pattern 742 formed on one side according to this embodiment can be obtained.

Figure 8 is another example of the step of preparing a micro-optic lens film in the slim surface light source manufacturing method according to an embodiment of the present invention.

Referring to FIG. 8, the step 800 of preparing a micro optical lens film includes preparing a light-transmitting sheet (Step 1), coating a UV resin layer on one side of the light-transmitting sheet (Step 2), and forming a micro lens pattern. It may include preparing a formed mold (not shown) and pressing the UV resin layer on the mold to form a micro lens pattern with the UV resin layer and curing the micro lens pattern (step 3). In the step of preparing the light-transmitting sheet (step 1), the light-transmitting sheet 841 may be formed of a light-transmitting material such as PET, PC, PMMA, or silicon. In the step of coating a UV resin layer on one surface of the light-transmitting sheet (Step 2), the UV resin layer 807 may include gel-like UV resin. The UV resin layer 807 can be cured by UV irradiation. In the step of forming and curing the micro lens pattern (step 3), the UV resin layer 807 is pressed into the mold 805 in which the micro lens pattern is formed, thereby forming the micro lens pattern 842 with the UV resin layer. there is. The micro lens pattern 842 can be cured by irradiating UV to the UV resin layer. Thereafter, by removing the mold, a micro optical lens film 840 with a micro lens pattern 842 formed on one side according to this embodiment can be obtained.

Figure 9 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 9, the slim surface light source 900 according to this embodiment includes a PCB substrate 910, a plurality of LED light sources 921 and 922, a transparent resin layer 930, a micro optical lens film 940, It may include a light blocking portion 950.

The PCB board 910 is a board on which electronic components can be mounted on the surface by forming wiring lines inside a plurality of layers of the board. In this embodiment, the PCB board 910 may have a wiring line formed inside the board body in which a plurality of layers are stacked, and a portion of the wiring line is exposed at the top of the board to make contact with mounted components such as LEDs. It can be formed to do so. A PSR layer may be formed on the surface of the PCB board body. The PSR (Photo Imageable Solder Resist) layer can be formed to protect the circuit by coating an invariant compound ink that is durable in a chemical environment and at the same time prevent solder leakage from occurring between circuits during the soldering process.

A plurality of LED light sources 921 and 922 may be mounted on the PCB board 910. The LED light source may be a light source using LED, a semiconductor that converts electrical energy into light energy. In this embodiment, the LED light source may be a side-emitting LED having one side that is a light emission surface and the other side facing the light emission surface. When mounted on a PCB board, a side-emitting LED can emit light on a side parallel to the PCB board. In the slim surface light source according to this embodiment, a plurality of side-emitting LEDs can be mounted on a PCB board. The slim surface light source according to this embodiment can be applied to automobile tail lights, DRLs, etc. Therefore, unlike the flat surface light source applied to the BLU of electronic products, LEDs can be mounted in the middle of the surface light source and these can form a unique light emission form of the surface light source.

The transparent resin layer 930 is disposed on the PCB board 910 and may be formed to cover the LED light sources 921 and 922. The transparent resin layer 930 can guide the light emitted from the LED light sources 921 and 922 and output the light to the surface opposite to the PCB board 910. The transparent resin layer 930 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The slim surface light source according to this embodiment may include a diffusion agent in the transparent resin layer 930 to output light input from the LED light sources 921 and 922 to one surface of the transparent resin layer 930. The transparent resin layer 930 may be formed to completely cover the LED light sources 921 and 922.

The micro optical lens film 940 may be disposed on the light exit surface of the transparent resin layer 930. The micro-optic lens film 940 may be a micro-optic lens formed with a plurality of fine patterns on a light-transmissive sheet. The micro-optic lens may have an uneven structure formed in a concave or convex shape on the light-transmitting sheet. The micro-optic lens film 940 may be made of a light-transmitting material such as PET, PC, or PMMA. In this way, the micro optical lens film 940 disperses the light emitted from the slim surface light source, thereby improving the uniformity of the output light from the slim surface light source.

The slim surface light source 900 according to this embodiment may further include a light blocking portion 950. The light blocking portion 950 is formed on the light exit surface of the transparent resin layer 930 and may be formed on top of the LED light source 920. The light blocking portion 950 may include a transparent film 951, a light blocking pad 952 formed on one side of the transparent film, and an adhesive portion 953 formed on one side of the transparent film and covering the light blocking pad. . The light blocking pad 952 may reflect light output from the top of the LED light source, among the light emitted from the LED light source 920, back into the transparent resin layer 930. The light reflected in this way may move inside the transparent resin layer 930 and be emitted to an area where the light blocking pad is not formed. As a result, when the light blocking pad 952 is formed, the overall light uniformity can be improved by increasing the light intensity emitted from the area where the light blocking pad of the transparent resin layer 930 is not formed, compared to the case without the light blocking pad. The light blocking pad 952 may use white ink containing SiO2 or TiO2. The light blocking pad may be formed to have a transmittance of 1 to 99%, preferably 5 to 30%. By doing this, it is possible to prevent dark areas from forming in the area where the light blocking pad 952 is formed, thereby improving light uniformity across the entire surface light source.

In this embodiment, the light blocking pad 952 may be formed so that one end exposes the other side of the side-emitting LED and the other end covers the one side. If the light blocking pad 952 completely covers the LED, the light that can be emitted from the first LED 921 is blocked by the light blocking pad formed on the top of the second LED 922 and is not transmitted to the top of the second LED 922. Dark areas may be formed. In this embodiment, the light blocking pad 952 does not completely cover the LED, but covers only one side of the side-emitting type LED and exposes the other side, thereby reducing the blocking of light emitted from nearby LEDs by the light blocking pad. The occurrence of dark spots can be minimized.

Figure 10 is a plan view of a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 10, the slim surface light source 1000 according to this embodiment includes a PCB substrate (not shown), an LED light source 1020, a transparent resin layer (not shown), a micro-optic lens film 1040, and a light blocking portion ( 1050). In this embodiment, the light blocking portion 1050 will be described in detail.

The light blocking portion 1050 is formed on the top of the micro-optic lens film 1040 and directs the light output from the top of the LED light source among the light emitted from the LED light source 1020 back into the micro-optic lens film and the inside of the transparent resin layer. It can be reflected. The light reflected in this way may move inside the transparent resin layer and be emitted to an area where the light blocking portion is not formed. As a result, when the light blocking part 1050 is formed, the overall light uniformity can be improved by increasing the light intensity emitted from the area where the light blocking part of the micro optical lens film 1040 is not formed, compared to the case without the light blocking part. The light blocking part 1050 may use white ink containing SiO2 or TiO2. The light blocking portion may be formed to have a transmittance of 1 to 99%, preferably 5 to 30%. By doing this, it is possible to prevent dark areas from forming in the area where the light blocking portion 1050 is formed, thereby improving light uniformity across the entire surface light source.

In the slim surface light source 1000 according to the present embodiment, the light blocking portion 1050 has one end exposing the other side of the side-emitting LED 1020, and the other end includes a light blocking pad 1052 formed to cover the one side, and the It is formed on the outside of the light blocking pad and may include a light blocking pattern 1054 formed so that the light leakage ratio increases as the distance from the light source increases.

In this embodiment, the light blocking pad 1052 does not completely cover the LED, but covers only one side of the side-emitting type LED and exposes the other side, thereby reducing the blocking of light emitted from nearby LEDs by the light blocking pad. The occurrence of dark spots can be minimized. The light blocking pattern 1054 is formed in the outer area of the light blocking pad, and may be formed in the form of a plurality of patterns whose sizes gradually become smaller so that the light leakage ratio increases as the distance from the light source increases. In this embodiment, the dot-shaped light blocking pattern 1054 is formed, but the shape of the light blocking pattern may be implemented in various ways. Additionally, in this embodiment, the light-shielding pattern 1054 is formed on the light exit surface of the micro-optic lens film 1040, and the light-shielding pattern in an embossed shape can be formed so that light is emitted to an area where the light-shielding pattern is not formed. . On the contrary, a light blocking pad is formed on the front of the light exit surface of the micro optical lens film 1040, and a part of the light blocking pad is removed so that the light leakage ratio increases as the distance from the light source increases. It can also be formed in an intaglio shape to form a light blocking pattern. there is. If the light blocking pattern is formed in an intaglio shape, the light blocking pattern can be formed so that the area removed from the light blocking pad becomes larger as the distance from the light source increases.

Figure 11 is a cross-sectional view of a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 11, the slim surface light source 1100 according to this embodiment may include a PCB substrate 1110, an LED light source 1120, a transparent resin layer 1130, and a micro-optic lens film 1140. there is. Since the slim surface light source 1110 according to the present embodiment is different from the slim surface light source according to the embodiment of FIG. 1 only in the transparent resin layer, the description will focus on this part.

In the slim surface light source 1100 according to this embodiment, the transparent resin layer 1130 includes a first transparent resin layer 1131 covering the LED light source 1120, and a fluorescent light source laminated on top of the first transparent resin layer 1131. It may include a sheet layer 1133 and a second transparent resin layer 1132 laminated on top of the fluorescent sheet layer.

The first transparent resin layer 1131 may guide the light emitted from the LED light source 1120 and output the light to a surface opposite to the PCB board 1110. The first transparent resin layer 1131 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The first transparent resin layer 1131 may be formed to completely cover the LED light source 1120.

The fluorescent sheet layer 1133 is laminated on top of the first transparent resin layer 1131 and may include a phosphor for changing the color of light passing through the first transparent resin layer 1131. For example, if the LED light source 1120 outputs blue light, the fluorescent sheet layer 1133 includes a yellow phosphor to convert the blue light into white light and output it. In this way, by adding a fluorescent sheet layer in the slim surface light source according to this embodiment, the color of light output from the slim surface light source can be freely modified without being limited by the color output from the LED light source. The fluorescent sheet layer 1133 may be in the form of a film coated with a phosphor. Additionally, the fluorescent sheet layer 1133 may be in the form of a plate in which phosphors are bonded.

The second transparent resin layer 1132 may be laminated on top of the fluorescent sheet layer 1133. The second transparent resin layer 1132 may be formed of the same material as the first transparent resin layer 1131.

Figure 12 is a diagram showing a method of manufacturing a slim surface light source according to another embodiment of the present invention.

Referring to FIG. 12, the slim surface light source manufacturing method according to this embodiment includes the steps of preparing a PCB board on which internal wiring and a PSR layer are formed on the upper surface and an LED light source is mounted on the upper surface, and on the PCB board. Preparing a transparent resin layer that is disposed to receive light from the LED light source on one side and output light to a side opposite to the PCB board, and preparing a micro-optic lens film to be disposed on the transparent resin layer. It may include sequentially stacking the PCB board, the transparent resin layer, and the micro-optic lens film and placing them between the upper press plate and the lower press plate, and pressing the upper press plate and the lower press plate. Since the slim surface light source manufacturing method 1200 according to the present embodiment is different from the slim surface light source manufacturing method according to the embodiment of FIG. 5 only in the transparent resin layer, the description will focus on this part.

In the slim surface light source manufacturing method according to this embodiment, the step of preparing a transparent resin layer includes a first transparent resin layer 1231 covering the LED light source, a fluorescent sheet layer 1233 to be laminated on the first transparent layer, and the The second transparent resin layer 1232 stacked on top of the fluorescent sheet layer can be prepared by sequentially stacking.

The first transparent resin layer 1231 may be an EVA or POE sheet. EVA and POE sheets are widely used as solar encapsulation materials and can increase light transmission and reliability. The first transparent resin layer 1231 may be formed to completely cover the LED light source 1220.

The fluorescent sheet layer 1233 may be laminated on top of the first transparent resin layer 1231 and may include a phosphor for changing the color of light passing through the first transparent resin layer 1231. In this way, by adding a fluorescent sheet layer in the slim surface light source according to this embodiment, the color of light output from the slim surface light source can be freely modified without being limited by the color output from the LED light source. The fluorescent sheet layer 1233 may be in the form of a film coated with a phosphor. Additionally, the fluorescent sheet layer 1233 may be in the form of a plate in which phosphors are bonded.

The second transparent resin layer 1232 may be laminated on top of the fluorescent sheet layer 1233. The second transparent resin layer 1232 may be formed of the same material as the first transparent resin layer 1231.

In the slim surface light source manufacturing process according to this embodiment, a PCB substrate 1210 on which an LED light source is mounted, a first transparent resin layer 1231, a fluorescent sheet layer 1233, a second transparent resin layer 1232, and micro optics. The lens films 1240 may be sequentially stacked, placed between the upper presser plate 1202 and the lower presser plate 1201, and then pressed through a thermocompression process.

Although the present invention has been described above with reference to preferred embodiments and examples, those skilled in the art may modify the present invention in various ways without departing from the spirit and scope of the present invention as set forth in the following patent claims. and that it can be changed. For example, the material of the transparent resin layer or the shape of the lens in the micro-optic lens film can be changed in various ways.

110: PCB board 120: LED light source
130: Transparent resin layer 140: Micro optical lens film
150: light blocking part

Claims (21)

A PCB board with wiring formed inside and a PSR layer formed on the top surface;
A side-emitting LED light source mounted on the PCB board and having one side as a light emission surface and the other side facing the light emission surface;
a transparent resin layer that covers the LED light source, guides light output from the LED light source, and outputs light to a surface opposite to the PCB board;
a micro-optic lens film disposed on the light exit surface of the transparent resin layer; and
A light-shielding portion formed on the top of the micro-optic lens film and in the upper area of the side-emitting LED light source.
Includes,
The micro optical lens film,
light transmitting sheet; and
Including a plurality of micro-optic lenses formed on one surface of the light-transmissive sheet,
A slim surface light source, wherein the light-transmitting sheet and the micro-optic lens are formed of different materials.
delete delete delete According to paragraph 1,
A reflection portion formed on the surface opposite to the light exit surface of the transparent resin layer.
A slim surface light source further comprising:
According to clause 5,
The reflector,
A slim surface light source, characterized in that it is a reflective film applied to the upper surface of the PSR layer of the PCB board.
According to clause 5,
The reflector,
A slim surface light source characterized in that it is a reflection pattern formed on the upper surface of the PSR layer of the PCB substrate.
According to clause 5,
The reflector,
A convex pattern formed below the PSR layer; and
PSR layer with irregularities formed in the shape of the convex pattern
A slim surface light source comprising:
According to clause 5,
The reflector,
A PSR layer partially removed in a pattern form from the PCB board;
a convex pattern formed in an area from which the PSR layer was removed and lower than the thickness of the PSR layer; and
A plurality of solder pads formed on the convex pattern and higher than the PSR layer.
A slim surface light source comprising:
According to paragraph 1,
A side reflector formed on at least one side of the transparent resin layer
A slim surface light source further comprising:
delete delete According to paragraph 1,
A slim surface light source, wherein the light blocking portion transmits light emitted from the LED light source having a transmittance of 5 to 30%.
According to paragraph 1,
The light blocking part,
A light-shielding pad with one end exposing the other side of the side-emitting LED and the other end covering the one side.
A slim surface light source comprising:
According to clause 14,
The light blocking part,
A light-shielding pattern formed on the outside of the light-shielding pad so that the light leakage ratio increases as the distance from the light source increases.
A slim surface light source further comprising:
According to paragraph 1,
The transparent resin layer is,
a first transparent resin layer covering the LED light source;
a fluorescent sheet layer laminated on top of the first transparent resin layer; and
A second transparent resin layer laminated on top of the fluorescent sheet layer
A slim surface light source comprising:
delete delete delete delete delete

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