KR102615987B1 - Thermoelectric module - Google Patents

Abstract

A thermoelectric module according to an embodiment of the present invention includes a first heat sink, a first copper substrate disposed on the first heat sink, a thermoelectric element disposed on the first copper substrate, and a first copper substrate disposed on the thermoelectric element. 2 comprising a copper substrate, a second heat sink disposed on the second copper substrate, and a moisture absorbent integrally formed to be disposed on a lower surface of the first heat sink and an upper surface of the second heat sink, the moisture absorbent It includes an area partially surface-treated with acrylic composite and carbon black, and exposes a portion of the upper surface of the second heat sink.

Description

Thermoelectric module {THERMOELECTRIC MODULE}

The present invention relates to a thermoelectric module, and more specifically, to a heat sink structure of a thermoelectric module.

Thermoelectric phenomenon is a phenomenon caused by the movement of electrons and holes inside a material, and means direct energy conversion between heat and electricity.

Thermoelectric elements are a general term for devices that use thermoelectric phenomena, and have a structure in which a P-type thermoelectric material and an N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

Thermoelectric devices can be divided into devices that use temperature changes in electrical resistance, devices that use the Seebeck effect, a phenomenon in which electromotive force is generated due to a temperature difference, and devices that use the Peltier effect, a phenomenon in which heat absorption or heat generation occurs due to current. .

Thermoelectric elements are widely applied to home appliances, electronic components, and communication components. For example, thermoelectric elements can be applied to cooling devices, heating devices, power generation devices, etc. Accordingly, the demand for thermoelectric performance of thermoelectric elements is increasing.

The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg. A plurality of thermoelectric legs are arranged in an array between the upper substrate and the lower substrate, a plurality of upper electrodes are arranged between the plurality of thermoelectric legs and the upper substrate, and a plurality of thermoelectric legs are arranged in an array between the upper substrate and the upper substrate. A plurality of lower electrodes are disposed between the thermoelectric leg and the lower substrate.

One of the upper and lower substrates of the thermoelectric element becomes a heat absorbing surface, and the other becomes a heat dissipating surface. At this time, the temperature of the heat absorbing surface may be lower than the temperature of the surrounding air, and accordingly, condensation water may be generated around the heat absorbing surface.

Condensate may contaminate the area around the thermoelectric element, cause freezing in winter, and reduce the performance and reliability of the thermoelectric element.

The technical problem to be achieved by the present invention is to provide a heat sink structure for a thermoelectric module.

A thermoelectric module according to an embodiment of the present invention includes a first heat sink, a first copper substrate disposed on the first heat sink, a thermoelectric element disposed on the first copper substrate, and a first copper substrate disposed on the thermoelectric element. 2 comprising a copper substrate, a second heat sink disposed on the second copper substrate, and a moisture absorbent integrally formed to be disposed on a lower surface of the first heat sink and an upper surface of the second heat sink, the moisture absorbent It includes an area partially surface-treated with acrylic composite and carbon black, and exposes a portion of the upper surface of the second heat sink.

The acrylic composite may include an acrylic ester composite.

The first copper substrate is a heat absorbing surface, the second copper substrate is a heat dissipating surface, and the moisture absorbent is disposed on the entire lower surface of the first heat sink, the side of the first heat sink, and the first copper substrate. It extends along the side surface, the side surface of the thermoelectric element, the side surface of the second copper substrate, and the side surface of the second heat sink, and may be disposed on a portion of the upper surface of the second heat sink.

The moisture absorbent may expose a middle area of the upper surface of the second heat sink.

The area of the middle region may be 30 to 70% of the area of the top surface of the second heat sink.

The moisture absorption sheet disposed on the lower surface of the first heat sink, the side of the first heat sink, the side of the first copper substrate, the side of the thermoelectric element, and the side of the second copper substrate are hydrophilic treated, and the second The moisture absorption sheet disposed on the upper surface of the heat sink may not be hydrophilic treated.

Capillaries may be formed in moisture absorption sheets disposed on the side of the first heat sink, the side of the first copper substrate, the side of the thermoelectric element, and the side of the second copper substrate.

At least a portion of the surface of the first heat sink may be water-repellent treated.

The thermoelectric element includes a first resin layer disposed on the first copper substrate, a first electrode disposed on the first resin layer, a P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode, It includes a second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, and a second resin layer disposed on the second electrode, and at least one of the first resin layer and the second resin layer is It is an elastic insulating layer.

At least one of the first resin layer and the second resin layer may include polydimethylsiloxane (PDMS) and aluminum oxide.

The first copper substrate and the second copper substrate may be pure copper with a thickness of 140 μm or more.

At least one of the P-type thermoelectric leg and the N-type thermoelectric leg is a polycrystalline thermoelectric leg, and a Ni plating layer may be formed on at least one of a surface bonded to the first electrode and a surface bonded to the second electrode.

According to an embodiment of the present invention, a thermoelectric module with excellent thermoelectric performance and high reliability can be obtained. In particular, by preventing the generation of condensate on the heat absorbing surface, problems such as mold or ice occurring around the thermoelectric module can be prevented, and thus it can be applied to various applications such as vehicles.

1 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention.
Figure 2 is a perspective view of a thermoelectric module according to an embodiment of the present invention.
Figure 3 is an exploded perspective view of a thermoelectric module according to an embodiment of the present invention.
Figure 4 is a cross-sectional view of a portion of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention.
Figure 5 is a perspective view of a thermoelectric module according to an embodiment of the present invention.
Figure 6 is a perspective view of a thermoelectric module according to another embodiment of the present invention.
Figure 7 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention.
8 to 11 show heat sinks included in the thermoelectric module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to that other component, but also is connected to that component. It can also include cases where other components are 'connected', 'combined', or 'connected' due to another component between them.

Additionally, when described as being formed or disposed "above" or "below" each component, "above" or "below" refers not only to cases where two components are in direct contact with each other, but also to one This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it may include not only the upward direction but also the downward direction based on one component.

Figure 1 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention, Figure 2 is a perspective view of a thermoelectric module according to an embodiment of the present invention, and Figure 3 is an exploded perspective view of a thermoelectric module according to an embodiment of the present invention. , and Figure 4 is a cross-sectional view of a portion of a thermoelectric element included in a thermoelectric module according to an embodiment of the present invention.

1 to 4, the thermoelectric element 100 includes a first resin layer 110, a plurality of first electrodes 120, a plurality of P-type thermoelectric legs 130, and a plurality of N-type thermoelectric legs 140. ), a plurality of second electrodes 150, and a second resin layer 160.

The plurality of first electrodes 120 are disposed between the first resin layer 110 and the lower surfaces of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140, and the plurality of second electrodes 150 ) is disposed between the second resin layer 160 and the upper surfaces of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140. Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 are electrically connected by the plurality of first electrodes 120 and the plurality of second electrodes 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the first electrode 120 and the second electrode 150 and electrically connected may form a unit cell.

A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may be disposed on each first electrode 120, and a pair of P-type thermoelectric legs 140 may be disposed on each second electrode 150. A pair of N-type thermoelectric legs 140 and P-type thermoelectric legs 130 may be arranged so that one of the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 overlaps.

Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth telluride (Bi-Te)-based thermoelectric legs containing bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 130 contains antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium for 100 wt% of the total weight. A mixture containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of (Ga), tellurium (Te), bismuth (Bi), and indium (In), and 0.001 wt% of Bi or Te. It may be a thermoelectric leg containing from 1 wt%. For example, the main raw material is Bi-Se-Te, and Bi or Te may be further included in an amount of 0.001 to 1 wt% of the total weight. The N-type thermoelectric leg 140 contains selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium for 100 wt% of the total weight. A mixture containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of (Ga), tellurium (Te), bismuth (Bi), and indium (In), and 0.001 wt% of Bi or Te. It may be a thermoelectric leg containing from 1 wt%. For example, the main raw material is Bi-Sb-Te, and Bi or Te may be further included in an amount of 0.001 to 1 wt% of the total weight.

The P-type thermoelectric leg 130 and N-type thermoelectric leg 140 may be formed in a bulk form. In general, the bulk P-type thermoelectric leg 130 or the bulk N-type thermoelectric leg 140 is manufactured by heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for the thermoelectric leg, and then manufacturing the ingot. It can be obtained through the process of sintering and cutting the sintered body. At this time, the P-type thermoelectric leg 130 and N-type thermoelectric leg 140 may be polycrystalline thermoelectric legs. For polycrystalline thermoelectric legs, when sintering the powder for thermoelectric legs, it can be compressed to 100 MPa to 200 MPa. For example, when sintering the P-type thermoelectric leg 130, the powder for the thermoelectric leg may be sintered at 100 to 150 MPa, preferably 110 to 140 MPa, and more preferably 120 to 130 MPa. Also, when sintering the N-type thermoelectric leg 130, the powder for the thermoelectric leg may be sintered at 150 to 200 MPa, preferably 160 to 195 MPa, and more preferably 170 to 190 MPa. In this way, when the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are polycrystalline thermoelectric legs, the strength of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be increased. Accordingly, even when the thermoelectric element 100 according to an embodiment of the present invention is applied to an application with vibration, for example, a vehicle, cracks occur in the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. Problems can be prevented, and the durability and reliability of the thermoelectric element 100 can be improved.

At this time, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume, or may have different shapes and volumes. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different, the height or cross-sectional area of the N-type thermoelectric leg 140 is changed to the height or cross-sectional area of the P-type thermoelectric leg 130. It may be formed differently.

The performance of a thermoelectric element according to an embodiment of the present invention can be expressed as a thermoelectric figure of merit (ZT). The thermoelectric performance index (ZT) can be expressed as Equation 1.

Here, α is the Seebeck coefficient [V/K], σ is the electrical conductivity [S/m], and α ² σ is the power factor (Power Factor, [W/mK ² ]). And, T is the temperature, and k is the thermal conductivity [W/mK]. k can be expressed as a·c _p ·ρ, where a is the thermal diffusivity [cm2/S], cp is the specific heat [J/gK], and ρ is the density [g/cm3].

To obtain the thermoelectric performance index of a thermoelectric element, the Z value (V/K) is measured using a Z meter, and the thermoelectric performance index (ZT) can be calculated using the measured Z value.

According to another embodiment of the present invention, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may have the structure shown in FIG. 4(b). Referring to FIG. 4(b), the thermoelectric legs 130 and 140 include thermoelectric material layers 132 and 142 and first plating layers 134-1 and 144 laminated on one side of the thermoelectric material layers 132 and 142. -1), the second plating layer (134-2, 144-2), the thermoelectric material layer (132, 142) and the first plating layer laminated on one side of the thermoelectric material layer (132, 142) and the other side disposed opposite to the other side. First bonding layers (136-1, 146-1) disposed between (134-1, 144-1) and between the thermoelectric material layers (132, 142) and the second plating layers (134-2, 144-2), respectively. And the second bonding layer (136-2, 146-2), and the first metal layer ( 138-1, 148-1) and second metal layers 138-2, 148-2.

Here, the thermoelectric material layers 132 and 142 may include semiconductor materials such as bismuth (Bi) and tellurium (Te). The thermoelectric material layers 132 and 142 may have the same material or shape as the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 described in FIG. 5(a). As described above, when the thermoelectric material layers 132 and 142 are polycrystalline, the thermoelectric material layers 132 and 142, the first bonding layers 136-1 and 146-1, and the first plating layers 134-1 and 144- The bonding strength of 1) and the bonding strength between the thermoelectric material layers 132 and 142, the second bonding layers 136-2 and 146-2, and the second plating layers 134-2 and 144-2 can be increased. Accordingly, even if the thermoelectric element 100 is applied to an application in which vibration occurs, for example, a vehicle, the first plating layer (134-1, 144-1) and the second plating layer (134-2, 144-2) are P-type. The problem of carbonization due to separation from the thermoelectric leg 130 or the N-type thermoelectric leg 140 can be prevented, and the durability and reliability of the thermoelectric element 100 can be improved.

And, the first metal layers (138-1, 148-1) and the second metal layers (138-2, 148-2) may be selected from copper (Cu), copper alloy, aluminum (Al), and aluminum alloy, and 0.1 It may have a thickness of 0.5 mm to 0.5 mm, preferably 0.2 to 0.3 mm.

Next, the first plating layers (134-1, 144-1) and the second plating layers (134-2, 144-2) may each include at least one of Ni, Sn, Ti, Fe, Sb, Cr, and Mo. and may have a thickness of 1 to 20㎛, preferably 1 to 10㎛. The first plating layer (134-1, 144-1) and the second plating layer (134-2, 144-2) are a semiconductor material Bi or Te in the thermoelectric material layer (132, 142) and the first metal layer (138-1, 148-1) and the second metal layer (138-2, 148-2), so that not only can the performance of the thermoelectric element be prevented from deteriorating, but also the first metal layer (138-1, 148-1) and the second metal layer (138-2, 148-2) are prevented. 2 Oxidation of the metal layers (138-2, 148-2) can be prevented.

At this time, between the thermoelectric material layers (132, 142) and the first plating layers (134-1, 144-1) and between the thermoelectric material layers (132, 142) and the second plating layers (134-2, 144-2), the first plating layer (134-2, 144-2) Bonding layers 136-1 and 146-1 and second bonding layers 136-2 and 146-2 may be disposed. At this time, the first bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 may include Te. For example, the first bonding layer (136-1, 146)-1 and the second bonding layer (136-2, 146-2) are Ni-Te, Sn-Te, Ti-Te, Fe-Te, Sb- It may include at least one of Te, Cr-Te, and Mo-Te. According to an embodiment of the present invention, the thickness of each of the first bonding layers 136-1 and 146-1 and the second bonding layers 136-2 and 146-2 is 0.5 to 100 μm, preferably 1 to 50 μm. It may be ㎛. According to an embodiment of the present invention, the first plating layer including Te between the thermoelectric material layers 132 and 142 and the first plating layers 134-1 and 144-1 and the second plating layers 134-2 and 144-2. By arranging the bonding layers (136-1, 146-1) and the second bonding layers (136-2, 146-2) in advance, Te in the thermoelectric material layers (132, 142) is formed in the first plating layer (134-1, 144). -1) and diffusion to the second plating layer (134-2, 144-2) can be prevented. Accordingly, the occurrence of Bi rich areas can be prevented.

Te content from the center of the thermoelectric material layer (132, 142) to the interface between the thermoelectric material layer (132, 142) and the first bonding layer (136-1, 146-1) or the center of the thermoelectric material layer (132, 142) The Te content from to the interface between the thermoelectric material layers (132, 142) and the second bonding layer (136-2, 146-2) may be 0.8 to 1 times the Te content at the center of the thermoelectric material layers (132, 142). , preferably 0.85 to 1 time, more preferably 0.9 to 1 time, and even more preferably 0.95 to 1 time.

In addition, the content of Te in the first bonding layer (136-1, 146-1) or the second bonding layer (136-2, 146-2) is the same as or similar to the content of Te in the thermoelectric material layer (132, 142). can do. For example, the Te content in the first bonding layer (136-1, 146-1) or the second bonding layer (136-2, 146-2) is 0.8 of the Te content in the thermoelectric material layer (132, 142). to 1 time, preferably 0.85 to 1 time, more preferably 0.9 to 1 time, and even more preferably 0.95 to 1 time. Here, the content may be a weight ratio. For example, when the content of Te in the thermoelectric material layers 132 and 142 is 50 wt%, the first bonding layer (136-1, 146-1) or the second bonding layer (136-2, 146-2) ) The content of Te may be 40 to 50 wt%, preferably 42.5 to 50 wt%, more preferably 45 to 50 wt%, and even more preferably 47.5 to 50 wt%.

And, the interface between the thermoelectric material layers (132, 142) and the first bonding layers (136-1, 146-1) or the interface between the thermoelectric material layers (132, 142) and the second bonding layers (136-2, 146-2). From the interface, the interface between the first plating layer (136-1, 146-1) and the first bonding layer (136-1, 146-1) or the second plating layer (134-2, 144-2) and the second bonding layer (136) -2, 146-2) The Te content up to the interface between the liver can be uniformly distributed. For example, the interface between the thermoelectric material layers 132 and 142 and the first bonding layers 136-1 and 146-1 or the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2. ) From the interface between the first plating layer (136-1, 146-1) and the first bonding layer (136-1, 146-1) or the second plating layer (134-2, 144-2) and the second bonding layer (136-2, 146-2) The rate of change in the weight ratio of Te to the interface between them may be 0.8 to 1, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, and even more preferably 0.95 to 1 times. You can. And, the surface in contact with the first plating layer (134-1, 144-1) in the first bonding layer (136-1, 146-1), that is, the first plating layer (136-1, 146-1) and the first bonding layer The interface between (136-1, 146-1) or the surface in contact with the second plating layer (134-2, 144-2) in the second bonding layer (136-2, 146-2), that is, the second plating layer (134-2) , 144-2) and the second bonding layer (136-2, 146-2), the content of Te is the first bonding layer (136-1, 146-1) in the thermoelectric material layer (132, 142). The contact surface, that is, the interface between the thermoelectric material layers (132, 142) and the first bonding layers (136-1, 146-1), or the second bonding layer (136-2, 146-2) within the thermoelectric material layers (132, 142) ), that is, the content of Te at the interface between the thermoelectric material layers 132 and 142 and the second bonding layers 136-2 and 146-2 is 0.8 to 1 times, preferably 0.85 to 1 times, and further. Preferably it may be 0.9 to 1 time, more preferably 0.95 to 1 time. Here, the content may be a weight ratio.

And, the Te content in the center of the thermoelectric material layers (132, 142) is at the interface between the thermoelectric material layers (132, 142) and the first bonding layer (136-1, 146-1) or the thermoelectric material layers (132, 142). It can be seen that the Te content at the interface between the second bonding layers 136-2 and 146-2 is the same or similar. That is, the interface between the thermoelectric material layers (132, 142) and the first bonding layers (136-1, 146-1) or the interface between the thermoelectric material layers (132, 142) and the second bonding layers (136-2, 146-2). The Te content of the interface may be 0.8 to 1 times, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, and even more preferably 0.95 to 1 times the Te content of the center of the thermoelectric material layer (132, 142). there is. Here, the content may be a weight ratio. Here, the center of the thermoelectric material layers 132 and 142 may mean a peripheral area including the center of the thermoelectric material layers 132 and 142. In addition, the boundary surface may mean the boundary surface itself, or may mean including the boundary surface and an area around the boundary adjacent to the boundary surface within a predetermined distance from the boundary surface.

In addition, the Bi content in the center of the thermoelectric material layers (132, 142) is at the interface between the thermoelectric material layers (132, 142) and the first bonding layer (136-1, 146-1) or between the thermoelectric material layers (132, 142). It can be seen that the Bi content at the interface between the second bonding layers 136-2 and 146-2 is the same or similar. For example, the Bi content of the center of the thermoelectric material layer (132, 142) is the interface between the thermoelectric material layer (132, 142) and the first bonding layer (136-1, 146-1) or the thermoelectric material layer (132, 142). ) and the second bonding layer (136-2, 146-2) 0.8 to 1 times, preferably 0.85 to 1 times, more preferably 0.9 to 1 times, even more preferably 0.95 to 1 times the Bi content of the interface between the second bonding layers (136-2, 146-2) It could be a boat. Here, the content may be a weight ratio.

Here, a plurality of first electrodes 120 disposed between the first resin layer 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the second resin layer 160 and the P-type thermoelectric leg 140. The plurality of second electrodes 150 disposed between the leg 130 and the N-type thermoelectric leg 140 may include at least one of copper (Cu), silver (Ag), and nickel (Ni).

Also, the first resin layer 110 and the second resin layer 160 may have different sizes. For example, the volume, thickness, or area of one of the first resin layer 110 and the second resin layer 160 may be formed to be larger than the volume, thickness, or area of the other one. Accordingly, the heat absorption or heat dissipation performance of the thermoelectric element can be improved.

At this time, the P-type thermoelectric leg 130 or N-type thermoelectric leg 140 may have a cylindrical shape, a polygonal pillar shape, an oval pillar shape, etc.

According to an embodiment of the present invention, the first resin layer 110 may be disposed on the first metal substrate 170, and the second metal substrate 180 may be disposed on the second resin layer 160.

The first metal substrate 170 and the second metal substrate 180 include a first resin layer 110, a plurality of first electrodes 120, a plurality of P-type thermoelectric legs 130, and a plurality of N-type thermoelectric legs ( 140), a plurality of second electrodes 150, a second resin layer 160, etc. can be supported. Accordingly, the first metal substrate 170 and the second metal substrate 180 can be used interchangeably with the first metal support and the second metal support, respectively. When the first metal substrate 170 and the second metal substrate 180 are used according to an embodiment of the present invention, there is less possibility of cracking compared to a ceramic substrate, and thus durability can be improved and heat conduction performance can be improved. This can be significantly higher.

The area of the first metal substrate 170 may be larger than the area of the first resin layer 110, and the area of the second metal substrate 180 may be larger than the area of the second resin layer 160. That is, the first resin layer 110 may be disposed in an area spaced a predetermined distance from the edge of the first metal substrate 170, and the second resin layer 160 may be disposed from the edge of the second metal substrate 180. It may be placed in an area spaced apart by a predetermined distance.

At this time, the width and length of the first metal substrate 170 may be greater than the width and length of the second metal substrate 180, or the thickness of the first metal substrate 170 may be greater than the thickness of the second metal substrate 180. .

At this time, the thickness of the first metal substrate 170 and the second metal substrate 180 may be 100 μm or more, preferably 120 μm or more, and more preferably 140 μm or more, and the flatness may be 0.05 mm or less. If the thickness of the first metal substrate 170 and the second metal substrate 180 satisfies these conditions, the physical strength of the thermoelectric module can be increased, and even if the thermoelectric module is applied to applications that generate strong vibrations such as vehicles, the substrate Deformation can be prevented.

In addition, the first metal substrate 170 and the second metal substrate 180 may contain copper, and more preferably, may be made of 99.9% or more pure copper. The CTE (Coefficient of Thermal Expansion) of pure copper is about 17.6m/mK, which is lower than the CTE of brass, which is about 19.9m/mK. When the first metal substrate 170 and the second metal substrate 180 are made of pure copper, stress due to thermal change may be reduced. Accordingly, even if the thermoelectric module is applied to an application exposed to high temperatures, such as a vehicle, separation of the thermoelectric leg due to deformation of the substrate can be prevented, thereby improving the durability and reliability of the thermoelectric module.

The first resin layer 110 and the second resin layer 160 may be made of a silicone resin composition containing polydimethylsiloxane (PDMS).

Here, the inorganic filler may be included in 68 to 88 vol% of the resin layer. If the inorganic filler is included in less than 68 vol%, the heat conduction effect may be low, and if the inorganic filler is included in more than 88 vol%, the adhesion between the resin layer and the metal substrate may be lowered, and the resin layer may be easily broken.

The thickness of the first resin layer 110 and the second resin layer 160 may be 0.02 to 0.6 mm, preferably 0.1 to 0.6 mm, and more preferably 0.2 to 0.6 mm, and the thermal conductivity may be 1 W/mK or more. , preferably 10 W/mK or more, more preferably 20 W/mK or more. When the thickness of the first resin layer 110 and the second resin layer 160 satisfies this numerical range, the first resin layer 110 and the second resin layer 160 repeat contraction and expansion according to temperature changes. Even so, the bonding between the first resin layer 110 and the first metal substrate 170 and the bonding between the second resin layer 160 and the second metal substrate 180 may not be affected.

The inorganic filler may include at least one of aluminum oxide and nitride, and the nitride may include at least one of boron nitride and aluminum nitride. Here, boron nitride may be a boron nitride aggregate in which plate-shaped boron nitride is aggregated.

When the first resin layer 110 and the second resin layer 160 contain aluminum oxide, high heat conduction performance of the first resin layer 110 and the second resin layer 160 can be obtained.

At this time, when the first resin layer 110 and the second resin layer 160 are made of a resin composition containing PDMS and aluminum oxide, the first resin layer 110 and the second resin layer 160 are elastic and insulating. It can be a layer. If the first resin layer 110 and the second resin layer 160 have elasticity, thermal shock can be alleviated even if contraction and expansion are repeated according to temperature changes, and accordingly, the thermoelectric element 100 can be used at high temperatures such as vehicles. Even if applied to an application exposed to , the durability and reliability of the thermoelectric element 100 can be increased because separation of the thermoelectric leg can be prevented.

In this way, when the first resin layer 110 is disposed between the first metal substrate 170 and the plurality of first electrodes 120, the first metal substrate 170 and the plurality of first electrodes are formed without a separate ceramic substrate. Heat transfer between the layers 120 is possible, and no separate adhesive or physical fastening means is required due to the adhesive performance of the first resin layer 110 itself. Accordingly, the overall size of the thermoelectric module can be reduced and the durability of the thermoelectric module can be increased.

Meanwhile, the thermoelectric module according to an embodiment of the present invention further includes a sealing portion 190.

The sealing part 190 may be disposed on the side of the first resin layer 110 and the side of the second resin layer 160. That is, the sealing part 190 is connected to the first metal substrate 170 and the second metal. It is disposed between the substrate 180, the side of the first resin layer 110, the outermost edge of the plurality of first electrodes 120, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140. It may be arranged to surround the outermost side of the outermost layer, the outermost side of the plurality of second electrodes 150, and the side of the second resin layer 160. Accordingly, the first resin layer 110, a plurality of first electrodes 120, a plurality of P-type thermoelectric legs 130, a plurality of N-type thermoelectric legs 140, a plurality of second electrodes 150 and 2 The resin layer can be sealed from external moisture, heat, contamination, etc.

Here, the sealing portion 190 is located on the side of the first resin layer 110, the outermost edge of the plurality of first electrodes 120, the plurality of P-type thermoelectric legs 130, and the plurality of N-type thermoelectric legs 140. A sealing case 192, the sealing case 192, and the second metal substrate 180 disposed at a predetermined distance from the outermost, outermost of the plurality of second electrodes 150, and the side of the second resin layer 160. It may include a sealing material 194 disposed between the sealing case 192 and the first metal substrate 170 and a sealing material 196 disposed between the sealing case 192 and the first metal substrate 170 . In this way, the sealing case 192 may contact the first metal substrate 170 and the second metal substrate 180 through the sealing materials 194 and 196. Accordingly, when the sealing case 192 is in direct contact with the first metal substrate 170 and the second metal substrate 180, heat conduction occurs through the sealing case 192, and as a result, the problem of lowering △T is solved. It can be prevented.

Here, the sealing materials 194 and 196 may include at least one of an epoxy resin and a silicone resin, or may include a tape with at least one of an epoxy resin and a silicone resin applied to both sides. The sealing materials 194 and 196 serve to seal the space between the sealing case 192 and the first metal substrate 170 and between the sealing case 192 and the second metal substrate 180, and the first resin layer 110 , the sealing effect of the plurality of first electrodes 120, the plurality of P-type thermoelectric legs 130, the plurality of N-type thermoelectric legs 140, the plurality of second electrodes 150, and the second resin layer 160. It can be used in combination with finishing materials, finishing layers, waterproofing materials, waterproofing layers, etc.

Meanwhile, a guide groove (G) may be formed in the sealing case 192 for pulling out the wires 200 and 202 connected to the electrodes. For this purpose, the sealing case 192 may be an injection molded product made of plastic or the like, and may be used interchangeably with the sealing cover.

Although not shown, an insulating material may be further included to surround the sealing portion 190. Alternatively, the sealing portion 190 may include an insulating component.

Meanwhile, the thermoelectric module according to an embodiment of the present invention can be applied to an air conditioning device, for example, a vehicle air conditioning device. More specifically, the thermoelectric module according to an embodiment of the present invention may be embedded in a ventilated seat of a vehicle.

Figure 5 is a perspective view of a thermoelectric module according to an embodiment of the present invention, Figure 6 is a perspective view of a thermoelectric module according to another embodiment of the present invention, and Figure 7 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention. . 8 to 11 show heat sinks included in the thermoelectric module according to an embodiment of the present invention.

Referring to FIGS. 5 to 7 , the thermoelectric module 1000 includes a thermoelectric element 100 and a first heat sink 600 and a second heat sink 610. Here, the thermoelectric element 100 may be a thermoelectric element according to FIGS. 1 to 4.

According to an embodiment of the present invention, a first metal substrate 170 is disposed on the first heat sink 600, and a second heat sink 610 is disposed on the second metal substrate 180 of the thermoelectric element 100. is placed.

Here, the first heat sink 600 may have the structure shown in FIGS. 8 to 10. For convenience of explanation, only the first heat sink 600 is described as an example, but the present invention is not limited thereto and the second heat sink 610 may have the same structure as the first heat sink 600.

Referring to FIGS. 8 to 10, the first heat sink 600 is a flat plate of the first plane 602 and the second plane 604, which is the opposite side of the first plane 602, so as to be in surface contact with air. It may be formed in a structure in which at least one flow path pattern forming an air flow path C1, which is a constant air movement path, is implemented on a shaped base.

It is also possible to implement such a channel pattern by folding the substrate to form a curvature pattern with constant pitch (P1, P2) and height (T1), that is, forming a folded structure. In addition to the structure shown in FIG. 8, it can be formed in various modified forms as shown in FIG. 10. That is, the first heat sink 600 according to an embodiment of the present invention can be implemented in a structure that has two surfaces on which air makes surface contact and forms a flow path pattern to maximize the contact surface area. In the structure shown in FIG. 8, when air flows in from the direction of the flow path C 1 of the inlet, the above-described first plane 602 and the second plane 604, which is the opposite side of the first plane 602, are formed. It allows the air and air to contact and move evenly toward the end (C2) of the flow path, allowing contact with much more air in the same space than the contact surface with a simple plate shape, allowing for heat absorption or heat generation. The effect is further enhanced. Here, the direction from C1 to C2 may be the first direction of FIGS. 5 and 6 or a direction opposite to the first direction.

In particular, in order to further increase the contact area of the air, the first heat sink 600 according to an embodiment of the present invention has a protruding resistance pattern 606 on the surface of the substrate, as shown in FIGS. 8 and 9. It can be configured to include. Considering the unit channel pattern, these resistance patterns 606 may be formed on the first curved surface B1 and the second curved surface B2, respectively.

Furthermore, as shown in the partially enlarged view of FIG. 9, the resistance pattern 606 is formed as a protruding structure inclined to have a constant inclination angle (θ) in the direction in which the air enters, so as to maximize friction with the air, thereby increasing the contact area. or to further increase contact efficiency. Furthermore, a groove 608 is formed on the surface of the substrate in front of the resistance pattern 606, and a portion of the air in contact with the resistance pattern 606 is channeled into the groove (hereinafter referred to as the 'flow groove 608'). It can be formed to pass through the front and back of the substrate to further increase the frequency or area of contact. In addition, in the example shown in Figure 9, the resistance pattern is formed in a structure arranged to maximize resistance in the direction of air flow, but it is not limited to this shape, and the resistor protrudes so that the degree of resistance can be adjusted according to the resistance design. The direction of the pattern can be designed in the opposite direction, and in Figure 9, the resistance pattern 606 is implemented to be formed on the outer surface of the heat sink, but the structure can also be modified to be formed on the inner surface of the heat sink.

Figure 10 is a conceptual diagram showing various implementation examples of the flow path pattern of the above-described first heat sink 600.

As shown in Figure 10, (a) a pattern having a curvature is repeatedly formed at a constant pitch (P1), (b) the unit pattern of the flow pattern is implemented as a repeating structure of a pattern structure with an attachment, or (c) ) and (d), the unit pattern can be varied to have a cross-section of a polygonal structure. Of course, the above flow path pattern can be provided with the resistance pattern described above in FIG. 9 on the surfaces B1 and B2 of the pattern.

The flow pattern shown in Figure 10 is formed to have a constant pitch structure and a constant period. However, unlike this, the pitch of the unit pattern is not made uniform and the period of the pattern can also be modified to be implemented non-uniformly. Of course, the height (T1) of each unit pattern can also be varied non-uniformly.

Referring again to FIGS. 5 to 7 , air may flow in the first direction of the thermoelectric module 1000 or in a direction opposite to the first direction.

When the thermoelectric module 1000 is applied to a device that generates hot or cold air, at least one of the first metal substrate 170 and the second metal substrate 180 can be a heat absorbing surface, and the other can be a heat generating surface. there is. Hereinafter, for convenience of explanation, the case where the first metal substrate 170 serves as a heat absorbing surface and the second metal substrate 180 serves as a heat emitting surface will be described as an example.

In the thermoelectric module 1000, the heat absorbing surface may be a low temperature part, and the heating surface may be a high temperature part. Accordingly, the air passing through the first heat sink 600 disposed on the first metal substrate 170 side is cooled, and the air passing through the second heat sink 610 disposed on the second metal substrate 180 side is cooled. Can be hotter than air. That is, the air passing through the first heat sink 600 disposed on the first metal substrate 170 side is cool air, and the air passing through the second heat sink 610 disposed on the second metal substrate 180 side is cool air. The air can be warm air. Although not shown, the flow path through which air passes through the first heat sink 600 disposed on the first metal substrate 170 side passes through the second heat sink 610 disposed on the second metal substrate 180 side. It can be separated from the flow path through which air flows, and the air passing through the first heat sink 600 disposed on the first metal substrate 170 side and the second heat sink disposed on the second metal substrate 180 side ( 610) The air that has passed may not mix with each other. Accordingly, cool air can be discharged through the flow path through which air passing through the first heat sink 600 disposed on the first metal substrate 170 side, and the heat sink 600 disposed on the second metal substrate 180 side can be discharged. 2 Warm air may be discharged through the flow path through which the air passing through the heat sink 610 flows.

Accordingly, the thermoelectric module 1000 according to an embodiment of the present invention can be applied to an air conditioning device or a ventilation device. For example, the thermoelectric module 1000 according to an embodiment of the present invention may be applied to a vehicle air conditioning or ventilation device, and, for example, may be embedded in a vehicle seat.

Meanwhile, the temperature of the first heat sink 600 may be lower than the temperature of the air passing through the first heat sink 600, and accordingly, the air passing through the first heat sink 600 may be condensed to generate condensate water. You can. This condensate is mainly generated when external moist air passes through the first heat sink 600 during low-temperature air conditioning in the hot and humid summer, and the performance of the thermoelectric module 1000 may deteriorate due to mold generated as a result. there is. On the contrary, during high-temperature air conditioning in winter, condensate may be generated in the area of the second heat sink 610, and the condensate generated at this time may be frozen due to cold external air. As a result, the performance of the thermoelectric module 1000 may be lowered. If the thermoelectric module 1000 is embedded in a vehicle seat, etc., there is a possibility that the surrounding area of the thermoelectric module 1000 may be contaminated due to mold caused by condensate.

According to an embodiment of the present invention, the moisture absorbent 700 may be arranged to surround the first heat sink 600 and the second heat sink 610. At this time, in order to not obstruct the flow of air, the moisture absorbent 700 is disposed on the side of the first heat sink 600 and the second heat sink 610 except for the inlet through which air flows in and the outlet through which air is discharged. You can.

The moisture absorbent 700 includes a first region 710 disposed on the lower surface of the first heat sink 600, a first region 720 disposed on the side of the first heat sink 600, and a first metal substrate 170. ), a third region 730 disposed on the side of the thermoelectric element 100 and the second metal substrate 180, a fourth region 740 and a second heat sink disposed on the side of the second heat sink 610 It may include a fifth area 750 disposed on the upper surface of 610 . The first area 710, the second area 720, the third area 730, the fourth area 740, and the fifth area 750 are separate areas for convenience of explanation, and are integrally formed and extended. It can be.

According to an embodiment of the present invention, when the moisture absorbent 700 is disposed on the lower surface of the first heat sink 600, during low-temperature air conditioning in the summer, condensate formed inside or around the first heat sink 600 is absorbed by gravity. It falls down due to the impact and can be absorbed by the moisture absorbent 700. Accordingly, it is possible to prevent the problem of contamination caused by condensation water formed in or around the first heat sink 600. As another example, if the moisture absorbent 700 is disposed on the upper surface of the second heat sink 610, some or all of the condensation water formed inside or around the second heat sink 610 during high-temperature air conditioning in winter is 2 It may be absorbed in the upper direction of the heat sink 610, that is, in the direction of the fifth region 750 of the moisture absorbent 700. Accordingly, it is possible to prevent the problem of condensate freezing inside or around the second heat sink 610.

At this time, the moisture absorption material 700 may be made of a moisture absorption sheet, and the moisture absorption sheet may be fabric or paper such as a woven fabric, knitted fabric, or non-woven fabric with a moisture absorption function, and may include, for example, rayon and PET (polyethylene terephthalate). there is.

At this time, a portion of the moisture-absorbing sheet may be subjected to surface treatment, for example, hydrophilic treatment. In this way, when the surface of the moisture absorption sheet is treated to be hydrophilic, condensation water formed around the first heat sink 600 or condensation water formed around the second heat sink 610 can be efficiently absorbed into the moisture absorbent material 700. there is.

Here, a portion of the moisture-absorbing sheet may be treated to be hydrophilic using at least one of an acrylic composite, silica, and carbon black. Here, the acrylic composite may include an acrylic ester composite. For example, the moisture-absorbing sheet can be hydrophilically treated with acrylic ester composite and carbon black, and thus the moisture-absorbing performance of the moisture-absorbing sheet can be significantly improved compared to the case without hydrophilic treatment, and other than acrylic ester composite and carbon black. It can be improved by more than 30% compared to the case where the material is hydrophilically treated.

As described above, the moisture absorbent 700 is disposed on the lower surface of the first heat sink 600, the side of the first heat sink 600, the side of the first metal substrate 170, and the thermoelectric element 100. It extends along the side surface, the side surface of the second metal substrate 180, and the side surface of the second heat sink 610, and may be disposed on a portion of the upper surface of the second heat sink 610.

In this way, when the moisture absorbent 700 extends from the first heat sink 600 to the second heat sink 610, the condensate generated and absorbed in the first heat sink 600 is stored in the first heat sink 600. In comparison, it may evaporate in the second heat sink 610, which has a relatively high temperature. When condensate evaporates in the second heat sink 610, problems of contamination or freezing caused by the condensate can be prevented.

Meanwhile, in order for the condensed water absorbed in the first area 710 to be efficiently transferred to the fourth area 740 and the fifth area 750 around the second heat sink 610, the first area 710 of the moisture absorbing sheet ), the second region 720 and the third region 730 may be hydrophilic, and the fourth region 740 and the fifth region 750 may not be hydrophilic. In order to efficiently remove the condensate water generated in the first heat sink 600 and the condensate water generated in the second heat sink 610, the first area 710, the second area 720, and the fourth area 740 And the fifth area 750 may be subjected to hydrophilic treatment, and the third area 730 may not be hydrophilic treated. At this time, among both sides of the moisture absorbent 700, only the side in contact with the thermoelectric module 1000 may be hydrophilic treated, and the opposite side, the side exposed to the outside, may not be hydrophilic treated.

In addition, in order to efficiently transfer the condensate absorbed in the first area 710 to the fourth area 740 and the fifth area 750 around the second heat sink 610, the second area 720 of the moisture absorbing sheet ), capillaries may be formed up to the third region 730 and fourth region 740. The capillary can be formed by the porous structure of fabric or paper, such as woven, knitted, or non-woven fabric, which is a moisture-absorbing sheet, and this causes the condensate on the first heat sink 600 side to be drawn up to the second heat sink 610 side. You can.

Meanwhile, the first area 710 of the moisture absorbent 700 may be arranged to cover the entire area of the lower surface of the first heat sink 600. Accordingly, all of the condensed water generated in the first heat sink 600 can be absorbed into the moisture absorbent 700.

Additionally, the moisture absorbent 700 may be disposed on the upper surface of the second heat sink 610, and may be disposed so that a portion of the upper surface of the second heat sink 610 is exposed. To this end, the second to fourth areas 720 to 740 between the first area 710 and the fifth area 750 may gradually become narrower in width as shown in FIG. 6 .

Here, the area of the exposed area may be 30 to 70%, preferably 40 to 60%, of the total area of the upper surface of the second heat sink 610. If the fifth area 750 of the hygroscopic material 700 is disposed in less than 30% of the total area of the upper surface of the second heat sink 610, condensed water may not evaporate efficiently, and the moisture absorbent 700 may If the fifth area 750 is arranged to exceed 70% of the total area of the upper surface of the second heat sink 610, the flow path of high temperature gas passing through the second heat sink 610 may be obstructed, As a result, heat generation performance may deteriorate. Here, the exposed area may include the middle area of the upper surface of the second heat sink 610.

Meanwhile, referring to FIG. 11 , at least one hole 800 may be formed in the first heat sink 600. As described above, when the first heat sink 600 has a folding structure, the side 604 of the both sides 602 and 604 of the first heat sink 600 is opposite to the side on which the moisture absorbent 700 is disposed. It may flow down or accumulate in the folded area. When a hole is formed in the folded portion of the first heat sink 600 as in the embodiment of the present invention, the side on which the moisture absorbent 700 is disposed is opposite to the side among the two sides 602 and 604 of the first heat sink 600. Condensed water flowing down along the surface 604 may be directly absorbed by the moisture absorbent 700.

At this time, at least one of the two sides 602 and 604 of the first heat sink 600 may be treated with water repellent treatment. Accordingly, the condensed water collected on both sides 602 and 604 of the first heat sink 600 can efficiently flow toward the moisture absorbent 700.

In this way, the thermoelectric module according to an embodiment of the present invention can be applied to a heating and cooling device. Here, the cooling and heating device may be a device that includes at least one of a cooling function and a heating function, and may be an air conditioning device or a ventilation device.

The thermoelectric module according to an embodiment of the present invention can be applied to a variety of applications that require at least one of a cooling function and a heating function, such as furniture, home appliances, vehicles, chairs, beds, clothes, bags, etc.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can do it.

Claims (12)

first heat sink,
A first copper substrate disposed on the first heat sink,
A thermoelectric element disposed on the first copper substrate,
A second copper substrate disposed on the thermoelectric element,
a second heat sink disposed on the second copper substrate, and
It includes a moisture absorbing material integrally formed to be disposed on the lower surface of the first heat sink and the upper surface of the second heat sink,
A thermoelectric module wherein the moisture absorbent includes a surface surface-treated with acrylic composite and carbon black, and exposes a portion of the upper surface of the second heat sink. According to paragraph 1,
The acrylic composite is a thermoelectric module comprising an acrylic ester composite. According to paragraph 1,
The first copper substrate is a heat absorbing surface, and the second copper substrate is a heat dissipating surface,
The moisture absorbent is disposed on the entire lower surface of the first heat sink, and is disposed on the side of the first heat sink, the side of the first copper substrate, the side of the thermoelectric element, the side of the second copper substrate, and the second A thermoelectric module extending along the side of the heat sink and disposed on a portion of the upper surface of the second heat sink. According to paragraph 3,
The thermoelectric module wherein the moisture absorbent exposes a middle area of the upper surface of the second heat sink. According to paragraph 4,
The thermoelectric module wherein the area of the middle area is 30 to 70% of the area of the upper surface of the second heat sink. According to paragraph 3,
The moisture absorption sheet disposed on the lower surface of the first heat sink, the side of the first heat sink, the side of the first copper substrate, the side of the thermoelectric element, and the side of the second copper substrate are hydrophilic treated, and the second The moisture-absorbing sheet placed on the top of the heat sink is a thermoelectric module that has not been hydrophilically treated. According to clause 6,
A thermoelectric module in which capillaries are formed in moisture absorption sheets disposed on a side of the first heat sink, a side of the first copper substrate, a side of the thermoelectric element, and a side of the second copper substrate. According to paragraph 3,
A thermoelectric module wherein at least a portion of the surface of the first heat sink is water-repellent treated. According to paragraph 1,
The thermoelectric element is,
A first resin layer disposed on the first copper substrate,
A first electrode disposed on the first resin layer,
A P-type thermoelectric leg and an N-type thermoelectric leg disposed on the first electrode,
A second electrode disposed on the P-type thermoelectric leg and the N-type thermoelectric leg, and
Comprising a second resin layer disposed on the second electrode,
At least one of the first resin layer and the second resin layer is an elastic insulating layer. According to clause 9,
At least one of the first resin layer and the second resin layer includes PDMS (polydimethylsiloxane) and aluminum oxide. According to paragraph 1,
The first copper substrate and the second copper substrate are pure copper having a thickness of 140㎛ or more. According to clause 9,
At least one of the P-type thermoelectric leg and the N-type thermoelectric leg is a polycrystalline thermoelectric leg, and a Ni plating layer is formed on at least one of a surface bonded to the first electrode and a surface bonded to the second electrode.

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