KR102606889B1 - Upper and lower conducting sheet manufacturing apparatus and manufacturing method for memory module test - Google Patents

Abstract

According to the present invention, a plurality of conductive parts 12 are arranged upright inside the insulating part 11 and disposed between the memory module 20 and the test equipment 30 to connect the terminal 21 of the memory module 20 and the test equipment 30. In the upper and lower conductive sheet manufacturing apparatus for memory module testing for manufacturing the upper and lower conductive sheets 10 that electrically connect the terminals 31 of the test equipment 30, a first solution made of an electrically insulating material is applied by screen printing. The first screen printing unit 110 forms the insulating portion 11 of the upper and lower conductive sheets 10 by applying an insulating layer 111 with a plurality of conductive holes 112 formed thereon and stacking it on the upper part of the base substrate 50. ); A first curing unit 120 that cures each insulating layer 111 formed by the first screen printing unit 110; A second solution containing an electrically conductive material is applied by screen printing to form a conductive layer 131 at the inner position of each conductive hole 112, thereby forming the conductive portion 12 of the upper and lower conductive sheets 10. a second screen printing unit 130; and a second curing unit 140 that cures each conductive layer 131 formed by the second screen printing unit 130. An apparatus for manufacturing an upper and lower conductive sheet for memory module testing is disclosed.

Description

Upper and lower conductive sheet manufacturing equipment and manufacturing method for memory module testing {UPPER AND LOWER CONDUCTING SHEET MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR MEMORY MODULE TEST}

The present invention relates to a manufacturing apparatus and method of an upper and lower conductive sheet for memory module testing. More specifically, a plurality of conductive parts are arranged upright inside the insulating part and disposed between the memory module and the test equipment to connect the terminals of the memory module and the test equipment. It relates to a manufacturing apparatus and manufacturing method for upper and lower conductive sheets for memory module testing that electrically connect the terminals of.

In general, memory modules (semiconductor packages) undergo a post-manufacturing test process to check for defects that may occur during the packaging process. Figure 20 shows the configuration of a general memory module test equipment 200. Referring to the drawing, the conventional memory module test equipment 200 includes a test board 30 for inputting a test signal to the memory module 10 to be inspected, and a test board 30 for seating the memory module 10 on the test board 30. A test socket 60 was provided.

In addition, the test socket 60 is electrically connected to the terminal 11 of the memory module 10 and the terminal of the test equipment 200 (for example, the terminal of the test socket 60 or the terminal of the test board 30). The upper and lower conductive sheets 40 for connection were disposed so that the test signal output from the test board 30 could be input to the memory module 10.

Regarding the conventional upper and lower conductive sheets for testing, prior art 1 'Registered Patent Publication No. 10-1026992 (2011.03.29), Test Socket for Memory Module' Prior Art 2 'Registered Utility Model Publication No. 20-0311804 (2003.04.16) ), 'Socket device for chip inspection' and prior art 3 'Patent Publication No. 10-2502104 (2023.02.16), Connector for electrical connection' has been disclosed.

However, the upper and lower conductive sheets of prior art 1 and 2 had clips formed inside them into which the terminals of the memory module were inserted, and the lower portions of each clip were protruded so as to be connected to the terminals of the test equipment.

In addition, the upper and lower conductive sheet of prior art 3 has a plurality of conductive parts arranged upright inside an insulating part made of an insulating material. In the case of the conductive part, a magnetic field is applied to a liquid conductive elastic insulating material containing conductive particles to cause the conductive particles to move up and down. It was aligned and manufactured into a hardened structure in this state.

However, in the case of the upper and lower conductive sheets disclosed in each prior art 1 and 2, the structure is complicated because the number of clips corresponding to or greater than the number of terminals of the memory module must be provided inside, so the manufacturing cost is bound to increase, and the manufacturing cost of the memory module is inevitably increased. There was a problem that damage to the terminal occurred as the terminal was directly connected to the clip, and in the case of the upper and lower conductive sheets disclosed in Prior Art 3, there was a problem that the manufacturing equipment cost was significantly excessive because equipment for applying a magnetic field to the conductive particles was essential.

In addition, prior arts 1, 2, and 3 all have limitations in miniaturizing the clips or conductive parts corresponding to each terminal of the memory module, making it difficult to manufacture upper and lower conductive sheets that conform to the fine pitch structure of ultra-small memory modules. There was a problem where it was limited.

Publication of Patent No. 10-2023-00511944 (2023.04.19), Test device for semiconductor package. Registered Patent Publication No. 10-1026992 (2011.03.29), test socket for memory module Registered Utility Model Publication No. 20-0311804 (April 16, 2003), Socket device for chip inspection Registered Patent Publication No. 10-2502104 (2023.02.16), connector for electrical connection

The present invention was created to solve the above-mentioned problems, and the purpose of the present invention is to ensure that no deformation or damage occurs in the terminal when inspecting a memory module, that manufacturing costs and manufacturing equipment costs can be significantly reduced, and that large quantities of memory modules can be easily manufactured. The aim is to provide a manufacturing apparatus and method for upper and lower conductive sheets for memory module testing that can be produced and that conform to the fine pitch structure of ultra-small memory modules.

In order to achieve the above object, the apparatus for manufacturing upper and lower conductive sheets for memory module testing according to the present invention has a plurality of conductive parts 12 arranged upright inside the insulating part 11 and includes a memory module 20 and test equipment ( Manufacture of upper and lower conductive sheets for memory module testing to manufacture the upper and lower conductive sheets 10 that are disposed between the 30) and electrically connect the terminals 21 of the memory module 20 and the terminals 31 of the test equipment 30. In the device, a first solution made of an electrically insulating material is applied using a screen printing method to form an insulating layer 111 with a plurality of conductive holes 112 formed thereon by stacking the upper and lower conductive sheets 10 on the base material 50. ) a first screen printing unit 110 forming the insulating part 11; A first curing unit 120 that cures each insulating layer 111 formed by the first screen printing unit 110; A second solution containing an electrically conductive material is applied by screen printing to form a conductive layer 131 at the inner position of each conductive hole 112, thereby forming the conductive portion 12 of the upper and lower conductive sheets 10. a second screen printing unit 130; and a second curing unit 140 that cures each conductive layer 131 formed by the second screen printing unit 130.

Here, the first solution and the second solution are UV curable liquid solutions whose curing time is shortened by UV light, and the first curing unit 120 is each insulator layer formed by the first screen printing unit 110 ( 111) is cured by irradiating UV light, and the second curing unit 140 can be cured by irradiating UV light to each conductive layer 131 formed by the third screen printing unit 150.

In addition, a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the upper surface of the base material 50, and a separation support is formed on the bottom surface of the upper and lower conductive sheets 10. A third screen printing unit 150 forming the unit 13; And a third curing unit 160 for curing the third member layer 151 formed by the third screen printing unit 150, wherein the first screen printing unit 110 is configured to perform the third screen printing. The first solution is applied to the upper surface of the third member layer 151 formed by the unit 150 to form an insulating layer 111, and the second screen printing unit 130 is formed by a third screen printing unit ( The conductor layer 131 may be formed by applying the second solution to the upper surface of the third member layer 151 formed by 150).

In addition, in the third solution, the separation support portion 13 formed while curing may be made of a material that is relatively weaker than the insulating portion 11 and the conductive portion 12.

Additionally, the third solution may be made of a material that dissolves when the separation support portion 13 formed while hardening is immersed in water or a specific solution.

In addition, a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the top of the base material 50 around the side of the upper and lower conductive sheets 10, thereby forming the upper and lower conductive sheets ( A third screen printing unit 150 forming the separation border 14 of 10); and a third curing unit 160 that cures the third member layer 151 formed by the third screen printing unit 150.

In addition, in the third solution, the separation edge portion 14 formed while curing may be made of a material whose strength is relatively weaker than that of the insulating portion 11.

Additionally, the third solution may be made of a material that dissolves when the hardened separation edge portion 14 is immersed in water or a specific solution.

Meanwhile, in the method of manufacturing the upper and lower conductive sheets for memory module testing according to the present invention to achieve the above object, a plurality of conductive parts 12 are arranged upright inside the insulating part 11 and the memory module 20 and the test Up and down energization for memory module testing to manufacture the up and down energizing sheet 10 that is placed between the equipment 30 and electrically connects the terminal 21 of the memory module 20 and the terminal 31 of the test equipment 30. In the sheet manufacturing method, a first solution made of an electrically insulating material is applied by screen printing to form an insulating layer 111 with a plurality of conductive holes 112 on the top of the base material 50. Step (S220); A first curing step (S220) of curing the insulating layer 111 formed through the first screen printing step (S220) by irradiating UV light; A second screen printing step (S230) of applying a second solution containing an electrically conductive material using a screen printing method to form a conductive layer 131 at the inner position of each conductive hole 112 on the base substrate 50; And a second curing step (S240) of curing the conductor layer 131 formed through the second screen printing step (S230) by irradiating UV light. The first curing step (S220), the second screen printing step (S230), and the second curing step (S240) are sequentially repeated to form the insulating portion 11 of the upper and lower conductive sheets 10 as each insulating layer 111 is stacked. By forming and stacking the conductor layers 131, the conductive portion 12 of the upper and lower conductive sheets 10 can be formed.

Here, a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the upper surface of the base material 50, and a separation support is formed on the bottom surface of the upper and lower conductive sheets 10. A third screen printing step (S250) to form the portion 13; And a third curing step (S260) of curing the third member layer 151 formed through the third screen printing step (S250) by irradiating UV light, wherein the first screen printing step (S220) is formed by applying the first solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250) and stacking each insulator layer 111 upward, and the second screen printing step (S230) ) can be formed by applying a second solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250) and stacking each conductor layer 131 upward.

In addition, in the third solution, the separation support portion 13 formed while curing is made of a material with relatively weaker strength than the insulating portion 11 and the conductive portion 12, or the separation support portion formed while curing ( 13) may be made of a material that dissolves when immersed in water or a specific solution.

In addition, a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the lateral circumference of the upper and lower conductive sheets 10 on top of the base material, forming the upper and lower conductive sheets 10. A third screen printing step (S250) of forming a separation border 14; and a third curing step (S260) of curing the third member layer 151 formed through the third screen printing step (S250) by irradiating UV light.

Meanwhile. In the third solution, the separation edge portion 14 formed while hardening is made of a material with relatively weaker strength than the insulating portion 11, or the hardened separation edge portion 14 is immersed in water or a specific solution. It can be made of a material that dissolves.

According to the manufacturing apparatus and manufacturing method of the upper and lower conductive sheets for memory module testing according to the present invention,

First, the first screen printing unit 110 applies a first solution made of an electrically insulating material using a screen printing method to stack an insulating layer 111 with a plurality of conductive holes 112 formed on the top of the base substrate 50. While forming, the insulating portion 11 of the upper and lower conductive sheets 10 is formed, and the first curing portion 120 hardens each insulating layer 111 formed by the first screen printing portion 110, and the second curing portion 120 The screen printing unit 130 applies a second solution containing an electrically conductive material using a screen printing method to form a conductive layer 131 at the inner position of each conductive hole 112, thereby forming a layer of the upper and lower conductive sheets 10. By forming the conductive part 12, and the second curing part 140 hardening each conductive layer 131 formed by the second screen printing part 130, when inspecting the memory module 20, the terminal ( 21) There is no deformation or damage to the product, and it is easy to manufacture, so manufacturing costs and manufacturing equipment costs can be significantly reduced, and mass production is possible. In addition, in the case of the silk screen printing method, the tolerance is 5/1,000 mm (5 microns), which allows the formation of a fine-sized conductive part 12 inside the insulating part 11, conforming to the fine pitch structure of an ultra-small memory module. It is possible to manufacture upper and lower conductive sheets.

Second, the first solution and the second solution are UV-curable liquid solutions whose curing time is shortened by UV light, and the first curing unit 120 is each insulator layer formed by the first screen printing unit 110 ( 111) is cured by irradiating UV light, and the second curing unit 140 irradiates UV light to each conductive layer 131 formed by the third screen printing unit 150 to cure it, allowing natural drying and curing. In comparison, the curing time can be significantly reduced, and compared to heat drying, the curing time can be further reduced and the defect rate due to thermal deformation can be significantly reduced.

Third, the third screen printing unit 150 applies a third solution made of an electrically insulating material by screen printing to form a third member layer 151 on the upper surface of the base material 50, forming an upper and lower conductive sheet ( A separation support portion 13 is formed on the bottom surface of 10), and the third curing portion 160 hardens the third member layer 151 formed by the third screen printing portion 150, and the third curing portion 160 hardens the third member layer 151 formed by the third screen printing portion 150. The first screen printing unit 110 applies the first solution to the upper surface of the third member layer 151 formed by the third screen printing unit 150 to form an insulating layer 111 by laminating the second screen. The printing unit 130 is a vertical conductive sheet manufactured by applying a second solution to the upper surface of the third member layer 151 formed by the third screen printing unit 150 to form a conductive layer 131. As the bottom of the (10) hardens, it adheres to the base substrate (50), preventing damage or deformation to the upper and lower conductive sheets (10) during the process of separating from the base substrate (50).

Fourth, in the third solution, the separation support portion 13 formed while curing is made of a material with relatively weaker strength than the insulating portion 11 and the conductive portion 12, so that it is external to the upper and lower conductive sheets 10. When pressure is applied, the separation support 13, which has relatively weak strength, can be broken and separated from the base base 50, so the upper and lower conductive sheets 10 can be easily separated from the base base 50, and during the separation process Damage or deformation of the upper and lower conductive sheets 10 can be prevented.

Fifth, the third solution is made of a material that dissolves when the separation support portion 13 formed while curing is immersed in water or a specific solution, so that the base substrate 50 on which each upper and lower conductive sheet 10 is formed can be dissolved in water or water. Since the separation support portion 13 is dissolved and removed simply by immersing it in a specific solution, there is no need to pressurize the upper and lower conductive sheets 10 to separate them from the base material 50. Accordingly, during the separation process, the upper and lower conductive sheets 13 are removed. (10) Damage or deformation can be fundamentally prevented.

Sixth, the third screen printing unit 150 applies a third solution made of an electrically insulating material by screen printing to form a third member layer 151 around the sides of the upper and lower conductive sheets 10 of the base substrate 50. A separation edge portion 14 of the upper and lower conductive sheets 10 is formed by stacking the upper portion, and the third hardening portion 160 is formed by the third member layer 151 formed by the third screen printing portion 150. By curing, when it is desired to simultaneously form a plurality of upper and lower conductive sheets 10 on one base material 50, each upper and lower conductive sheet 10 can be placed in close contact, so that the upper and lower conductive sheets 10 are manufactured simultaneously. ) has the advantage of greatly increasing the quantity, and by removing the separation edge portion 14, each upper and lower conductive sheet 10 can be separated, making the separation process easier.

Seventh, when the separation edge portion 14 formed as the third solution is cured is made of a material with relatively weaker strength than the insulating portion 11, when external pressure is applied to the upper and lower conductive sheets 10, the strength is relatively reduced. As the weak separation edge portion 14 is broken, each upper and lower conductive sheet 10 can be easily separated, and damage or deformation to the upper and lower conductive sheets 10 during the separation process can be prevented. In addition, if the third solution is made of a material that dissolves when the hardened separation edge portion 14 is immersed in water or a specific solution, the base material 50 on which each upper and lower conductive sheet 10 is formed can be dissolved in water or a specific solution. Since the separation edge portion 14 is dissolved and removed simply by immersing it in water, there is no need to apply pressure to separate each upper and lower conductive sheet 10. As a result, damage is done to the upper and lower conductive sheets 10 during the separation process. It is possible to fundamentally prevent loss or deformation.

1 is a side cross-sectional view showing a configuration in which an upper and lower conductive sheet is arranged between a memory module and a test equipment according to a preferred embodiment of the present invention;
Figure 2 is a schematic diagram showing the configuration of an apparatus for manufacturing upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention;
Figure 3 is a perspective view for explaining the screen printing method of each screen printing unit according to a preferred embodiment of the present invention;
Figure 4 is a side view showing a state in which an insulating layer is formed on the base substrate according to a preferred embodiment of the present invention;
Figure 5 is a side view showing a state in which a conductive layer is formed on the base substrate according to a preferred embodiment of the present invention;
Figure 6 is a side view showing a state in which insulating layers are stacked upward according to a preferred embodiment of the present invention;
Figure 7 is a side view showing a state in which conductor layers are stacked upward according to a preferred embodiment of the present invention;
8 and 9 are side views showing a state in which an insulating portion and a conductive portion are formed by stacking an insulating layer and a conductive layer upward according to a preferred embodiment of the present invention;
Figure 10 is a side view showing the upper and lower conductive sheets separated from the base substrate according to a preferred embodiment of the present invention;
Figure 11 is a schematic diagram showing the configuration of the upper and lower conductive sheet manufacturing apparatus for memory module testing according to a preferred embodiment of the present invention, further provided with a third screen printing unit and a third curing unit;
Figure 12 is a side view showing a state in which a support portion for separation is formed while a third member layer is laminated on a base substrate according to a preferred embodiment of the present invention;
Figure 13 is a side view showing a state in which an insulating layer is formed on top of the third member layer according to a preferred embodiment of the present invention;
Figure 14 is a side view showing a state in which a conductor layer is formed on the third member layer according to a preferred embodiment of the present invention;
Figure 15 is a side view showing a state in which an insulating layer and a conductive layer are stacked upward to form an insulating portion and a conductive portion according to a preferred embodiment of the present invention;
Figure 16 is a side view showing a state in which the upper and lower conductive sheets are separated from the base substrate through the separation support according to a preferred embodiment of the present invention;
Figure 17a is a plan view showing a state in which a plurality of upper and lower conductive sheets are closely adhered and manufactured simultaneously according to a preferred embodiment of the present invention;
Figure 17b is a plan view showing a state in which the upper and lower conductive sheets are separated from each other with the separation edge portion removed according to a preferred embodiment of the present invention;
Figure 18a is a side view showing a state in which a border portion is formed while a third member layer is laminated on a base substrate according to a preferred embodiment of the present invention;
Figure 18b is a side view showing the state in which an insulating layer is formed on the base substrate according to a preferred embodiment of the present invention;
Figure 18c is a side view showing a state in which a conductive layer is formed on the base substrate according to a preferred embodiment of the present invention;
Figure 18d is a side view showing a state in which an insulating layer, a conductive layer, and a third member layer are stacked to form an insulating portion, a conductive portion, and an edge portion, respectively, according to a preferred embodiment of the present invention;
Figure 18e is a side view showing a state in which the upper and lower conductive sheets are separated from each other with the edge portion removed according to a preferred embodiment of the present invention;
Figure 19 is a flowchart showing each step of the method of manufacturing an upper and lower conductive sheet for memory module testing according to a preferred embodiment of the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor should appropriately define the concept of terms in order to explain his or her invention in the best way. Based on the principle of definability, it must be interpreted with meaning and concept consistent with the technical idea of the present invention.

Accordingly, the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent the entire technical idea of the present invention, so at the time of filing this application, various alternatives are available to replace them. It should be understood that equivalents and variations may exist.

First, the configuration and function of the upper and lower conductive sheet manufacturing apparatus for memory module testing according to a preferred embodiment of the present invention will be described. As shown in FIG. 1, the apparatus for manufacturing upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention has a plurality of conductive parts 12 arranged upright inside the insulating part 11, and the memory module 20 and A manufacturing device for manufacturing the upper and lower conductive sheets 10 that are disposed between the test equipment 30 and electrically connect the terminal 21 of the memory module 20 and the terminal 31 of the test equipment 30, as shown in FIG. As shown in Figure 2, it includes a first screen printing unit 110, a first curing unit 120, a second screen printing unit 130, and a second curing unit 140. Here, the terminal 31 of the test equipment 30 may be a terminal of a test socket or a terminal of a test board on which the test socket is mounted.

First, the first screen printing unit 110 is a device for forming an insulating layer 111 for manufacturing the insulating part 11 of the upper and lower conductive sheets 10, and screen prints a first solution made of an electrically insulating material. The insulating layer 111, in which a plurality of conductive holes 112 are formed, is applied in such a way that the upper and lower conductive sheets 10 are formed by laminating them to a predetermined thickness (for example, 5 μm to 10 μm) on the top of the base material 50. An insulating portion 11 is formed.

Here, the first solution may be made of polyethylene, silicone, acrylic, or polyurethane. In addition, various materials that can maintain an insulating state when cured in the technical field to which the present invention pertains may be used.

In addition, the second screen printing unit 130 and the third screen printing unit 150, which will be described later, including the first screen printing unit 110, form respective layers 111, 131, and 151 by screen printing, Figure 3 As shown, each screen printing unit (110, 130, 150) has a printing network (171) disposed at the upper position of the base substrate (50) and made of mesh so that each solution can penetrate, and is disposed on the printing network (171) and each It may include a mask 172 with mask holes 173 opening upward and downward at positions corresponding to the layers 111, 131, and 151, and a squeegee 174 that pressurizes each solution injected onto the mask 172 so that it is thinly and evenly applied. there is.

For example, with the mask 172 having a shape corresponding to the insulating layer 111 to be formed placed on the upper surface of the base material 50 along with the printing net 171, the first solution is injected into one position. When the first solution injected with the squeegee 174 is pressed to the other position, the first solution that has penetrated the printing net 171 passes through the mask hole 173 to a set position on the base substrate 50, that is, the insulator layer 111. ) can be applied to the position where it should be placed, and when the mask 172 and the printing net 171 are removed on the base material 50, an insulator layer 111 with a plurality of conductive holes 112 is formed as shown in FIG. 4. It can be formed on the top of the base substrate 50.

The first curing unit 120 hardens each insulating layer 111 formed by the first screen printing unit 110. Here, as shown in FIG. 2, the base substrate 50 on which the insulating layer 111 is formed is transported by a transport means 190 such as a conveyor, and the first curing is performed at the position where the first screen printing unit 110 is disposed. The unit 120 can be moved to the arranged position, and in contrast, the base substrate 50 is fixedly disposed and the first screen printing unit 110 and the first curing unit 120 are sequentially disposed. You can also move to the specified location.

In addition, the first curing unit 120 can apply heat or hot air to dry the insulating layer 111 faster than natural drying, and the first solution is a UV curable liquid solution in which the curing time is shortened by UV light. In this case, it is preferable that the first curing unit 120 cures each insulating layer 111 formed by the first screen printing unit 110 by irradiating UV light.

The second screen printing unit 130 is a device for forming a conductive layer 131 for manufacturing the conductive portion 12 of the upper and lower conductive sheet 10, and contains an electrically conductive material as shown in FIG. 5. The second solution is applied using a screen printing method to form a conductive layer 131 with a predetermined thickness (for example, 5 μm to 10 μm) at the inner position of each conductive hole 112, thereby forming a layer of the upper and lower conductive sheets 10. A conductive portion 12 is formed.

Here, the second solution may be in the form of a base resin containing electrically conductive powder (powder), and the powder components include copper powder, silver powder, silver-coated copper powder, nickel-coated copper powder, and silver-coated nickel powder. A variety of conductive powders such as metal-coated polymer powder can be used, and the concentration of the electrically conductive powder is such that the base resin is cured, that is, the laminated conductor layer 131 is cured to form the conductive portion 12. It is desirable to have a concentration that allows electricity to be conducted through the top and bottom exposed above and below the insulating portion 11.

In addition, it is preferable that the thickness of the conductor layer 131 formed by the second screen printing unit 130 corresponds to the thickness of the insulating layer 111 formed by the first screen printing unit 110. do.

In addition, the second screen printing unit 130 is similar to the printing method of the first screen printing unit 110 described above, and the mask 172 corresponding to the conductive layer 131 is used as a base along with the printing net 171. When the second solution is injected to one side while placed on the upper surface of the substrate 50 and the injected second solution is laterally pressed to the other side using the squeegee 174, the second solution penetrates the printing net 171. It can be applied to a set position on the base material 50 through the mask hole 173, that is, the position where the conductive layer 131 is to be placed, and the mask 172 and the printing net 171 are formed on the base material 50. When removed, a conductive layer 131 can be formed on the base substrate 50 as shown in FIG. 5 .

The second curing unit 140 hardens each conductive layer 131 formed by the second screen printing unit 130. Here, as shown in FIG. 2, the base substrate 50 on which the conductive layer 131 is formed is transported by a transfer means 190 such as a conveyor, and the second screen printing unit 130 is disposed at the position. The curing unit 140 can be moved to the disposed position, and in contrast, the base substrate 50 is fixedly disposed, and the second screen printing unit 130 and the second curing unit 140 are sequentially moved to the base substrate 50. You can also move to the deployed location.

In addition, the second curing unit 140 can apply heat or hot air to dry the conductor layer 131 faster than natural drying, and the second solution is a UV curable liquid in which the curing time is shortened by UV light. In the case of a solution, the second curing unit 140 is preferably cured by irradiating UV light to each conductive layer 131 formed by the second screen printing unit 130.

In addition, in the drawing, in the manufacturing process, an insulating layer 111 is first formed on the base substrate 50 through the first screen printing unit 110, and an insulating layer is formed through the second screen printing unit 130 disposed at the rear. Although the conductor layer 131 is formed on the base substrate 50 on which 111 is formed, this is not limited, and the first screen printing unit 110 is placed at the front end of the manufacturing process to first form the base substrate 50. ) and the second screen printing unit 130 is disposed at the rear end to form an insulating layer 111 on the base substrate 50 on which the conductive layer 131 is formed.

However, in the manufacturing process, the first curing unit 120 is placed immediately after the first screen printing unit 110, and the second curing unit 140 is placed immediately after the second screen printing unit 130. , It is preferable that the next layer is formed on the base substrate 50 while the first layer formed on the base substrate 50 is cured.

And, when the insulator layer 111 and the conductor layer 131 are formed on the base substrate 50 through the first screen printing unit 110 and the second screen printing unit 130, respectively, as shown in FIG. 6 As shown in FIG. As shown in Figure 7, the second screen printing unit 130 is used to stack the conductor layer 131 on the upper surface of the conductor layer 131 formed on the base substrate 50.

In addition, using the first screen printing unit 110 and the second screen printing unit 130, the set height (for example, 0.5 to 1.0 mm) of the upper and lower conductive sheet 10 is used as shown in FIGS. 8 and 9. ), a plurality of insulator layers 111 are stacked upward to form the insulating portion 11 of the upper and lower conductive sheets 10, and a plurality of conductor layers 131 are stacked upward to form a conductive portion of the upper and lower conductive sheets 10. The screen printing method described above is repeated so that (12) is formed. Therefore, it is possible to manufacture the upper and lower conductive sheet 10 with the lower part attached to the base substrate 50 as shown in FIG. 9, and the upper and lower conductive sheet 10 can be separated from the base substrate 50 as shown in FIG. 10. Therefore, it can be used as a vertical conduction sheet for connecting each terminal 21 and 31 vertically between the memory module 20 and the test equipment 30.

Inspection of the memory module 20 through the combined configuration of the first screen printing unit 110, first curing unit 120, second screen printing unit 130, and second curing unit 140 as described above. There is no deformation or damage to the terminal 21, and manufacturing is easy, so manufacturing costs and manufacturing equipment costs can be significantly reduced, and mass production is possible. In addition, in the case of the silk screen printing method, the tolerance is 5/1,000 mm (5 microns), which allows the formation of a fine-sized conductive part 12 inside the insulating part 11, conforming to the fine pitch structure of an ultra-small memory module. It is possible to manufacture upper and lower conductive sheets.

In addition, the first solution and the second solution are UV-curable liquid solutions whose curing time is shortened by UV light, and the first curing unit 120 is each insulator layer formed by the first screen printing unit 110 ( 111) is cured by irradiating UV light, and the second curing unit 140 irradiates UV light to each conductive layer 131 formed by the third screen printing unit 150 to cure it, allowing natural drying and curing. In comparison, the curing time can be significantly reduced, and compared to heat drying, the curing time can be further reduced and the defect rate due to thermal deformation can be significantly reduced.

Meanwhile, as shown in Figure 11, the apparatus for manufacturing the upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention uses the third screen printing unit 150 and the third curing unit 160 to produce the upper and lower conductive sheets ( By forming a separation support portion 13 on the bottom surface of 10, the manufactured upper and lower conductive sheet 10 can be easily separated from the base substrate 50.

For this purpose, as shown in FIG. 12, the third screen printing unit 150 applies a third solution made of an electrically insulating material by screen printing to apply the third member layer 151 to the upper part of the base substrate 50. A separation support portion 13 is formed on the bottom surface of the upper and lower conductive sheets 10 while laminating them to a predetermined thickness (for example, 5 μm to 10 μm).

Here, the thickness of the third member layer 151 formed by the third screen printing unit 150 is appropriately determined according to the process or separation method of separating the manufactured upper and lower conductive sheet 10 from the base substrate 50. It can be adjusted.

In addition, the third screen printing unit 150 uses a mask 172 corresponding to the third member layer 151, similar to the printing method of the first screen printing unit 110 and the second screen printing unit 130 described above. ) is placed on the upper surface of the base substrate 50 together with the printing net 171, the third solution is injected into one position, and the injected third solution is laterally pressed with the squeegee 174 to the other position, thereby forming the printing net. The third solution that has penetrated (171) may be applied to a set position on the base substrate 50 through the mask hole 173, that is, a position where the third member layer 151 is to be placed, and the base substrate 50 When the mask 172 and the printing net 171 are removed from the top, the third member layer 151 can be formed on the upper surface of the base substrate 50 as shown in FIG. 12.

In addition, the third curing unit 160 hardens the third member layer 151 formed by the third screen printing unit 150, and as shown in FIG. 13, the first screen printing unit 110 is a third screen printing unit. The first solution is applied to the upper surface of the third member layer 151 formed by the printing unit 150 to form an insulating layer 111, and as shown in FIG. 14, the second screen printing unit 130 is 3 A conductor layer 131 is formed by applying a second solution to the upper surface of the third member layer 151 formed by the screen printing unit 150.

Therefore, as shown in FIG. 15, the third member layer 151 is laminated on the upper surface of the base material 50 to form a support portion 13 for separation on the bottom surface of the upper and lower conductive sheets 10. By separating the separation support 13, the upper and lower conductive sheet 10 can be easily separated from the base substrate 50 as shown in FIG. 16, so that the bottom of the manufactured upper and lower conductive sheet 10 is hardened. It is possible to prevent the upper and lower conductive sheets 10 from being damaged or deformed during the process of being attached to the base substrate 50 and separating from the base substrate 50.

In addition, in the third solution, the separation support portion 13 formed while curing is made of a material with relatively weaker strength than the insulating portion 11 and the conductive portion 12, so that it is external to the upper and lower conductive sheets 10. When pressure is applied, the separation support 13, which has relatively weak strength, can be broken and separated from the base base 50, so the upper and lower conductive sheets 10 can be easily separated from the base base 50, and during the separation process Damage or deformation of the upper and lower conductive sheets 10 can be prevented.

In addition, the third solution may be made of a material that dissolves when the separation support portion 13 formed while hardening is immersed in water or a specific solution. For example, if the third solution contains polyethylene or silicon, the upper and lower conductive sheets 10 and the base material 50 with the separation support 13 formed at the bottom are immersed in acetone to form the separation support 13. As the polyethylene or silicone component contained in ) is dissolved in acetone, the upper and lower conductive sheets 10 can be easily separated from the base substrate 50.

Polyethylene and silicon are exemplified as components contained in the third solution, and acetone is exemplified as a solvent component for dissolving them, but it is not limited thereto and can dissolve a specific solute (separation support 13) in the field of chemical technology. A variety of solvents can be used.

In this way, the separation support portion 13 is dissolved and removed simply by immersing the base material 50 on which each upper and lower conductive sheet 10 is formed in water or a specific solution (solvent), so that the upper and lower conductive sheets 10 are used as a base. There is no need to apply pressure to separate from the base material 50, and thus damage or deformation to the upper and lower conductive sheets 10 during the separation process can be fundamentally prevented.

Meanwhile, considering the productivity and manufacturing cost of the upper and lower conductive sheets, it is desirable to increase the number of upper and lower conductive sheets 10 that can be manufactured simultaneously. The apparatus for manufacturing upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention is Using the first screen printing unit 110, the first curing unit 120, the second screen printing unit 130, and the second curing unit 140, a plurality of upper and lower conductive sheets 10 are simultaneously printed as shown in FIG. 17A. It can be manufactured by forming a separation border 14 around the side of the upper and lower conductive sheets 10 using the third screen printing unit 150 and the third curing unit 160, thereby forming a plurality of pieces as shown in FIG. 17. At the same time, each upper and lower conductive sheet 10 manufactured can be easily separated.

For this purpose, as shown in FIG. 18A, the third screen printing unit 150 applies a third solution made of an electrically insulating material by screen printing to form a third member layer 151 around the side of the upper and lower conductive sheets 10. ) is laminated on the upper part of the base substrate 50 to form a border portion 14 for separating the upper and lower conductive sheets 10 (see FIG. 18D).

The third curing unit 160 hardens the third member layer 151 formed by the third screen printing unit 150.

In addition, as shown in Figure 18b, the first screen printing unit 110 is formed so that the insulating layer 111 is disposed at the inner position of the third member layer 151, and as shown in Figure 18c, the second screen printing unit 130 ) is formed so that the conductor layer 131 is disposed inside the conductor hole 112 of the insulator layer 111. The first curing unit 120 and the second curing unit 140 harden the respective layers 111 and 131.

The process of sequentially forming the third member layer 151, the insulator layer 111, and the conductor layer 131 is repeated multiple times to form a plurality of conductive portions 12 inside the insulating portion 11 as shown in FIG. 18D. ) can be manufactured simultaneously with a plurality of upper and lower conductive sheets 10 in which the upper and lower conductive sheets 10 are arranged upright and the separation border 14 is arranged upright around the sides of the insulating part 11 and the conductive part 12.

Therefore, when it is desired to form a plurality of upper and lower conductive sheets 10 simultaneously on one base substrate 50, each upper and lower conductive sheet 10 can be placed in close contact, so that the upper and lower conductive sheets 10 manufactured simultaneously While the quantity can be greatly increased, each upper and lower conductive sheet 10 can be separated by removing the separation edge portion 14 as shown in Figure 18e, which has the advantage of making the separation process easier.

In addition, when the separation edge portion 14 formed as the third solution hardens is made of a material with relatively weaker strength than the insulating portion 11, when external pressure is applied to the upper and lower conductive sheets 10, the strength is relatively reduced. As the weak separation edge portion 14 is broken, each upper and lower conductive sheet 10 can be easily separated, and damage or deformation to the upper and lower conductive sheets 10 during the separation process can be prevented.

In addition, if the third solution is made of a material that dissolves when the hardened separation edge portion 14 is immersed in water or a specific solution, the base material 50 on which each upper and lower conductive sheet 10 is formed can be dissolved in water or a specific solution. Since the separation border portion 14 is dissolved and removed as shown in FIG. 18e simply by immersing it in Damage or deformation can be fundamentally prevented.

Next, each step of the method of manufacturing the upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention will be described. In the method of manufacturing the upper and lower conductive sheets for memory module testing, a plurality of conductive parts 12 are arranged upright inside the insulating part 11 and disposed between the memory module 20 and the test equipment 30 to form a memory module 20. A manufacturing method for manufacturing an upper and lower conductive sheet 10 that electrically connects the terminal 21 of and the terminal 31 of the test equipment 30, as shown in FIG. 19, the first screen printing step (S220) , a first curing step (S220), a second screen printing step (S230), and a second curing step (S240).

First, in the first screen printing step (S220), a first solution made of an electrically insulating material is applied by screen printing using the above-described first screen printing unit 110 to form a plurality of conductive holes as shown in FIG. 4. An insulating layer 111 having (112) formed thereon is formed on the base substrate 50.

The first curing step (S220) uses the above-described first curing unit 120 to cure the insulating layer 111 formed through the first screen printing step (S220) by irradiating UV light.

The second screen printing step (S230) is performed by applying a second solution containing an electrically conductive material by screen printing using the above-described second screen printing unit 130 to print the base substrate 50 as shown in FIG. 5. ) A conductor layer 131 is formed at the inner location of each conductor hole 112 on the top.

The second curing step (S240) uses the above-described second curing unit 140 to cure the conductor layer 131 formed through the second screen printing step (S230) by irradiating UV light.

In addition, as shown in FIGS. 6 to 8, the first screen printing step (S220), the first curing step (S220), the second screen printing step (S230), and the second curing step (S240) are sequentially repeated. As each insulator layer 111 is stacked, the insulating portion 11 of the upper and lower conductive sheets 10 is formed, and the conductor layers 131 are stacked to form the conductive portion 12 of the upper and lower conductive sheets 10. .

Here, the drawing illustrates that the first screen printing step (S220) and the first curing step (S220) are performed first, and then the second screen printing step (S230) and the second curing step (S240) are performed later, but it is limited to this. This does not mean that the second curing step (S240) and the second curing step (S240) may be performed first, and then the first screen printing step (S220) and the first curing step (S220) may be performed later.

In addition, the method of manufacturing the upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention is to form the upper and lower conductive sheets 10 from the base substrate 50 through the third screen printing step (S250) and the third curing step (S260). can be easily separated.

To this end, in the third screen printing step (S250), a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the upper surface of the base substrate 50, thereby conducting upward and downward conduction. A separation support 13 is formed on the bottom of the sheet 10, and the third curing step (S260) is performed by applying UV light to the third member layer 151 formed through the third screen printing step (S250). Irradiate and harden.

In addition, in the first screen printing step (S220), each insulating layer 111 is stacked upward by applying the first solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250). The second screen printing step (S230) applies the second solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250) to move each conductor layer 131 upward. Formed by stacking.

Here, the third solution is such that the separation support portion 13 formed while curing is made of a material whose strength is relatively weaker than that of the insulating portion 11 and the conductive portion 12, or the separation support portion formed while curing ( 13) may be made of a material that dissolves when immersed in water or a specific solution.

In addition, the method of manufacturing the upper and lower conductive sheets for memory module testing according to a preferred embodiment of the present invention facilitates the mutual convenience of the upper and lower conductive sheets 10 manufactured together through the third screen printing step (S250) and the third curing step (S260). It can be made separable.

To this end, in the third screen printing step (S250), a third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the lateral circumference of the upper and lower conductive sheets 10 from the top of the base material. ) to form a separation edge portion 14 of the upper and lower conductive sheets 10, and the third curing step (S260) is performed by forming a third member layer 151 formed through the third screen printing step (S250). It is cured by irradiating UV light.

Here, in the third solution, the separation border 14 formed while hardening is made of a material with relatively weaker strength than the insulating part 11, or the hardened separation border 14 is made of water or a specific solution. It may be made of a material that dissolves when immersed in it.

As described above, although the present invention has been described with limited examples and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalence of the claims to be described.

110... first screen printing unit 111... insulator layer
112...Conductive Engineering 120...1st Hardening Department
130...second screen printing unit 131...conductor layer
140...2nd curing section 150...3rd screen printing section
151...Third member layer 160...Third hardened section
10...Upper and lower conductive sheets 11...Insulation section
12...Conductive part 13...Removal support part
14... Separation border 20... Memory module
21...terminal 30...test equipment
31...Terminal 50...Base base material
S210... first screen printing step S220... first curing step
S230...2nd screen printing step S240...2nd curing step
S250...3rd screen printing step S260...3rd curing step

Claims (10)

A plurality of conductive parts 12 are arranged upright between the plurality of insulating parts 11 and are disposed between the memory module 20 and the test equipment 30 to connect the terminal 21 of the memory module 20 to the test equipment 30. In the upper and lower conductive sheet manufacturing apparatus for memory module testing for manufacturing the upper and lower conductive sheets 10 that electrically connect the terminals 31 of the test equipment 30,
According to the screen printing method, each of a plurality of insulating layers 111 corresponding to the first solution made of an electrically insulating material is sequentially stacked at different positions on the upper surface of the base substrate 50, and the plurality of insulating parts The first screen printing unit 110 forming (11)
A first curing unit 120 that cures each of the plurality of insulating layers 111 each time the plurality of insulating layers 111 are sequentially stacked;
According to the screen printing method, each of a plurality of conductive layers 131 corresponding to the second solution made of an electrically conductive material is sequentially stacked between the plurality of insulating portions 11 to form the conductive portion 12. A second screen printing unit 130 forming a; and
A second curing unit 140 that cures each of the plurality of conductive layers 131 each time the plurality of conductive layers 131 are sequentially stacked,
Each time each of the plurality of insulating layers 111 is sequentially stacked at different positions on the upper surface of the base material 50, from the upper surface of the base material 50 among the plurality of conductive holes 112. Conductive holes 112 are sequentially formed at different heights,
The second screen printing unit 130,
An apparatus for manufacturing a top and bottom conductive sheet for memory module testing, wherein each of the plurality of conductor layers (131) is repeatedly stacked in each of the conductor holes (112) formed at different heights.
In claim 1,
The first and second solutions are UV-curable liquid solutions whose curing time is shortened by UV light,
The first curing unit 120 cures each insulating layer 111 formed by the first screen printing unit 110 by irradiating UV light,
The second curing unit 140 is a device for manufacturing upper and lower conductive sheets for memory module testing, wherein the second curing unit 140 cures each conductor layer 131 formed by the third screen printing unit 150 by irradiating UV light.
In claim 1,
A third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the upper surface of the base material 50, and a separation support is formed on the bottom surface of the upper and lower conductive sheets 10. A third screen printing unit 150 forming 13); and
It further includes a third curing unit 160 that cures the third member layer 151 formed by the third screen printing unit 150,
The first screen printing unit 110 applies the first solution to the upper surface of the third member layer 151 formed by the third screen printing unit 150 to form an insulating layer 111,
The second screen printing unit 130 is characterized in that the conductive layer 131 is formed by applying a second solution to the upper surface of the third member layer 151 formed by the third screen printing unit 150. A device for manufacturing upper and lower conductive sheets for memory module testing.
In claim 3,
The third solution is,
A device for manufacturing upper and lower conductive sheets for memory module testing, wherein the separation support portion (13) formed while curing is made of a material with relatively weaker strength than the insulating portion (11) and the conductive portion (12).
In claim 3,
The third solution is,
A device for manufacturing upper and lower conductive sheets for memory module testing, wherein the separation support portion 13 formed while cured is made of a material that dissolves when immersed in water or a specific solution.
In claim 1,
A third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the top of the base material 50 around the side of the upper and lower conductive sheet 10, thereby forming the upper and lower conductive sheet 10. A third screen printing unit 150 forming a separation border 14; and
A third curing unit (160) that cures the third member layer (151) formed by the third screen printing unit (150).
A plurality of conductive parts 12 are arranged upright between the plurality of insulating parts 11 and are disposed between the memory module 20 and the test equipment 30 to connect the terminal 21 of the memory module 20 to the test equipment 30. In the method of manufacturing the upper and lower conductive sheets for memory module testing for manufacturing the upper and lower conductive sheets 10 that electrically connect the terminals 31 of the test equipment 30,
According to the screen printing method, each of a plurality of insulating layers 111 corresponding to the first solution made of an electrically insulating material is sequentially stacked at different positions on the upper surface of the base substrate 50, and the plurality of insulating parts A first screen printing step (S210) forming (11);
A first curing step (S220) of curing each of the plurality of insulating layers (111) each time the plurality of insulating layers (111) are sequentially stacked;
According to the screen printing method, each of a plurality of conductive layers 131 corresponding to the second solution made of an electrically conductive material is sequentially stacked between the plurality of insulating portions 11 to form the conductive portion 12. A second screen printing step (S230) to form a; and
A second curing step (S240) of curing each of the plurality of conductive layers 131 each time the plurality of conductive layers 131 are sequentially stacked,
In the first screen printing step (S210),
Each time each of the plurality of insulating layers 111 is sequentially stacked at different positions on the upper surface of the base material 50, from the upper surface of the base material 50 among the plurality of conductive holes 112. Conductive holes 112 are sequentially formed at different heights,
In the second screen printing step (S230),
A method of manufacturing a top and bottom conductive sheet for memory module testing, wherein each of the plurality of conductor layers (131) is repeatedly stacked in each of the conductor holes (112) formed at different heights.
In claim 7,
A third solution made of an electrically insulating material is applied by screen printing to form a third member layer 151 on the upper surface of the base material 50, and a separation support is formed on the bottom surface of the upper and lower conductive sheets 10. 13) a third screen printing step (S250) to form; and
It further includes a third curing step (S260) of curing the third member layer 151 formed through the third screen printing step (S250) by irradiating UV light,
The first screen printing step (S210) is formed by applying the first solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250) and stacking each insulating layer 111 upward. ,
The second screen printing step (S230) is formed by applying a second solution to the upper surface of the third member layer 151 formed through the third screen printing step (S250) and stacking each conductor layer 131 upward. A method of manufacturing an upper and lower conductive sheet for memory module testing, characterized in that:
In claim 8,
The third solution is,
The separation support portion 13 formed while curing is made of a material that is relatively weaker than the insulating portion 11 and the conductive portion 12, or
A method of manufacturing an upper and lower conductive sheet for memory module testing, wherein the separation support portion 13 formed while cured is made of a material that dissolves when immersed in water or a specific solution.
In claim 7,
Separation of the upper and lower conductive sheets 10 by applying a third solution made of an electrically insulating material using a screen printing method to form a third member layer 151 on the lateral circumference of the upper and lower conductive sheets 10 on top of the base material. A third screen printing step (S250) of forming an edge portion 14; and
A third curing step (S260) of curing the third member layer 151 formed through the third screen printing step (S250) by irradiating UV light. Manufacturing method.