KR102598629B1 - Electronic device including antenna - Google Patents

Abstract

Surrounding a first plate, a second plate facing in a direction opposite to the first plate, and a space between the first plate and the second plate, connected to the second plate, or formed integrally with the second plate, A housing comprising a side member including a first portion comprising a conductive material, the first portion of the side member comprising a plurality of through holes aligned in a first direction substantially parallel to the first plate. (through-holes), and a housing including a non-conductive material in the through-holes, disposed within the space to face the through-holes, a structure including at least one conductive path, and electrically connected to the conductive path. An electronic device including a wireless communication circuit is disclosed. In addition to this, various embodiments identified through the specification are possible.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING ANTENNA}

Embodiments disclosed in this document relate to technology for implementing an electronic device including an antenna.

With the development of mobile communication technology, electronic devices equipped with antennas are becoming widely distributed. An electronic device may transmit and/or receive a radio frequency (RF) signal including a voice signal or data (e.g., a message, photo, video, music file, or game) using an antenna.

Meanwhile, recent electronic devices can perform 5th generation communication using millimeter waves.

When the side member of the housing of an electronic device is a metal frame, distortion may occur when signals are radiated to the side by the metal frame. In order to ensure that the signal is radiated from the antenna without distortion, the side member of the portion of the housing where the radiator is placed may be formed of a non-metallic material such as plastic.

Additionally, the electronic device can implement dual linear polarization using the radiator of the antenna. Additionally, in order to generate dual linear polarization, the structure of the power feeder may become complicated. If it is not easy to mount a power feeder that generates dual linear polarization inside the antenna, it may not be easy for the radiator to generate dual linear polarization.

Embodiments disclosed in this document are intended to provide an electronic device that can secure radiation performance while maintaining a metal side member around the antenna.

An electronic device according to an embodiment disclosed in this document surrounds a first plate, a second plate facing in an opposite direction to the first plate, and a space between the first plate and the second plate, and the second plate A housing comprising a side member connected to a plate or formed integrally with the second plate and including a first portion comprising a conductive material, wherein the first portion of the side member is substantially connected to the first plate. A housing including a plurality of through-holes aligned in a parallel first direction, and a non-conductive material in the through-holes, disposed within the space to face the through-holes, and comprising at least one It may include a structure including a conductive path and a wireless communication circuit electrically connected to the conductive path.

In addition, an electronic device according to another embodiment disclosed in this document includes a housing including a side member, a radiator formed on a first portion of the side member including a conductive material, and a plurality of power feeders that feed power to the radiator. wherein the radiator includes a plurality of through holes arranged in a slot shape and a non-conductive material disposed in the through holes, each of the plurality of power feeders includes a plurality of conductive paths, and the plurality of At least two of the conductive paths may be arranged to partially overlap the same through hole.

In addition, an electronic device according to another embodiment disclosed in this document surrounds a first plate, a second plate facing in an opposite direction to the first plate, and a space between the first plate and the second plate, a housing including a side member connected to or formed integrally with the second plate, and a printed circuit board disposed within the space, the housing including a first portion including a conductive material; and the first portion includes a plurality of through holes and at least one conductive path disposed to face the through holes, wherein the conductive path includes a first path toward the plurality of through holes, a second path and a third path branched and extended from the first path and at least partially overlapping the plurality of through holes, wherein the first path receives power from a power feeder included in the printed circuit board, and the first path receives power from a power feeder included in the printed circuit board. The second path and the third path may feed power to the plurality of through holes.

According to embodiments disclosed in this document, by forming an antenna on a side member of a housing formed of a metal frame, millimeter wave radiation performance can be secured while maintaining the side member around the radiator of the antenna as metal.

Additionally, according to the embodiments disclosed in this document, mounting efficiency can be improved by generating dual linear polarization while placing a power feeder inside the antenna.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments.
FIGS. 3A to 3C are diagrams showing the third antenna module described with reference to FIG. 2.
FIG. 4 shows a cross section along line B-B' of the third antenna module of FIG. 3A.
FIG. 5A is a diagram illustrating through holes and a plurality of conductive paths according to an embodiment.
FIG. 5B is a diagram illustrating a first part, a substrate including a plurality of power feeders, and an RFIC, according to an embodiment.
FIG. 5C is a diagram illustrating a transmission line and an RFIC connected to connections of conductive paths according to an embodiment.
FIG. 6 is a diagram illustrating a first portion, a through hole, a first path, a second path, and a third path according to an embodiment.
FIG. 7A is a diagram illustrating in detail a first portion, a through hole, a first path, a second path, and a third path according to an embodiment.
FIG. 7B is a detailed diagram of a substrate including a first portion and a power feeder according to an embodiment.
FIG. 8A is a diagram showing through holes and a plurality of conductive paths according to another embodiment.
Figure 8b is a diagram showing a power supply structure through a plurality of conductive paths according to another embodiment.
FIG. 9 is a diagram illustrating a first portion and a plurality of through holes including slits crossing each other according to an embodiment.
Figure 10 is a diagram showing a through hole including a first portion and slits crossing each other according to another embodiment.
FIG. 11A is a diagram illustrating through holes and a plurality of conductive paths according to an embodiment.
FIG. 11B is a diagram illustrating a first part, a first substrate including first to fourth power feeders, and a second substrate including fifth to eighth power feeders, according to an embodiment.
FIGS. 12A to 12D are diagrams showing vertical and horizontal polarization generated from intersecting through holes according to an embodiment.
FIG. 13 is a diagram illustrating a first portion and a through hole including slits crossing each other according to another embodiment.
FIG. 14 is a diagram illustrating a first portion and a through hole including slits crossing each other according to another embodiment.
FIGS. 15A to 15H are diagrams illustrating through holes that intersect each other disposed on a side member of a housing of an electronic device according to various embodiments.
Figure 16 is a diagram showing an antenna structure including a plurality of power feeders according to an embodiment.
FIG. 17 is a diagram illustrating a structure in which an antenna structure including a plurality of conductive patches and the printed circuit board of FIG. 16 are connected through a connection portion, according to an embodiment.
FIG. 18 is a diagram illustrating a housing and a side member of an electronic device according to an embodiment.
Figure 19a is a diagram showing a coupling structure of an electronic device according to an embodiment.
Figure 19b is a diagram showing a through hole of an electronic device according to an embodiment.
Figure 20 is a graph showing impedance bandwidth characteristics of an antenna structure according to an embodiment.
21 is a graph showing gain characteristics of an antenna structure according to an embodiment.
Figure 22 is a graph showing the radiation pattern of the antenna structure according to one embodiment.
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of the present invention are described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives to the embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197. ) may include. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted, or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented while being embedded in the display device 160 (e.g., a display).

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor), and an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, an image signal processor). , sensor hub processor, or communication processor). Additionally or alternatively, the auxiliary processor 123 may be set to use less power than the main processor 121 or to specialize in a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input device 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (eg, stylus pen).

The sound output device 155 may output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display device 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display device 160 may include touch circuitry configured to detect a touch, or a sensor circuit configured to measure the intensity of force generated by the touch (e.g., a pressure sensor). there is.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through an electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 388 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 provides a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (e.g., a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (e.g., a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed and authenticated.

The antenna module 197 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module may include one antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) in addition to the radiator may be additionally formed as part of the antenna module 197.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be the same or different type of device from the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technologies may be used.

FIG. 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments. Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC 226, fourth RFIC 228, first radio frequency front end (RFFE) 232, second RFFE 234, first antenna module 242, second antenna module 244, and antenna It may include (248). The electronic device 101 may further include a processor 120 and a memory 130. Network 199 may include a first network 292 and a second network 294. According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the network 199 may further include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and second RFFE 234 may form at least a portion of wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

The first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first network 292, and legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network 294, and 5G network communication through the established communication channel. can support. According to various embodiments, the second network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network 294. It can support the establishment of a communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed within a single chip or a single package with the processor 120, the auxiliary processor 123, or the communication module 190. there is.

When transmitting, the first RFIC 222 converts the baseband signal generated by the first communication processor 212 into a frequency range of about 700 MHz to about 3 GHz for use in the first network 292 (e.g., a legacy network). It can be converted into a radio frequency (RF) signal. Upon reception, the RF signal is obtained from a first network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242) and via an RFFE (e.g., first RFFE 232). Can be preprocessed. The first RFIC 222 may convert the pre-processed RF signal into a baseband signal to be processed by the first communication processor 212.

The second RFIC 224, when transmitting, connects the first communications processor 212 or the baseband signal generated by the second communications processor 214 to a second network 294 (e.g., a 5G network). It can be converted to an RF signal (hereinafter referred to as a 5G Sub6 RF signal) in the Sub6 band (e.g., approximately 6 GHz or less). Upon reception, the 5G Sub6 RF signal is obtained from the second network 294 (e.g., 5G network) via an antenna (e.g., second antenna module 244) and an RFFE (e.g., second RFFE 234) It can be preprocessed through . The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 converts the baseband signal generated by the second communication processor 214 into an RF signal in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second network 294 (e.g., a 5G network). It can be converted into a signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be obtained from a second network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248) and preprocessed through a third RFFE 236. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal to be processed by the second communication processor 214. According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

According to one embodiment, the electronic device 101 may include a fourth RFIC 228 separately from the third RFIC 226 or at least as part of it. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz). After conversion, the IF signal can be transmitted to the third RFIC (226). The third RFIC 226 can convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by a third RFIC 226. . The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to one embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to one embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be placed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in some area (e.g., bottom surface) of the second substrate (e.g., sub PCB) separate from the first substrate, and the antenna 248 is located in another part (e.g., top surface). is disposed, so that the third antenna module 246 can be formed. According to one embodiment, antenna 248 may include an antenna array that may be used for beamforming, for example. By placing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce the loss (e.g. attenuation) of signals in the high frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communication by transmission lines. Because of this, the electronic device 101 can improve the quality or speed of communication with the second network 294 (eg, 5G network).

The second network 294 (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to the first network 292 (e.g., a legacy network) (e.g., a legacy network). Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device 101 may access the access network of the 5G network and then access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in the memory 230 and stored in the memory 230, 120, first communication processor 212, or second communication processor 214).

3A to 3C illustrate one embodiment of the structure of the third antenna module 246 described with reference to FIG. 2, for example. FIG. 3A is a perspective view of the third antenna module 246 viewed from one side, and FIG. 3B is a perspective view of the third antenna module 246 viewed from the other side. Figure 3c is a cross-sectional view taken along line A-A' of the third antenna module 246.

3A to 3C, in one embodiment, the third antenna module 246 includes a printed circuit board 310, an antenna array 330, a radio frequency integrate circuit (RFIC) 352, and a power manage (PMIC). It may include an integrate circuit (354) and a module interface (370). Optionally, the third antenna module 246 may further include a shielding member 390. In other embodiments, at least one of the above-mentioned parts may be omitted, or at least two of the above parts may be formed integrally.

The printed circuit board 310 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 310 may provide electrical connections between the printed circuit board 310 and/or various electronic components disposed externally using wires and conductive vias formed in the conductive layer.

Antenna array 330 (e.g., 248 in FIG. 2) may include a plurality of antenna elements 332, 334, 336, or 338 arranged to form a directional beam. The antenna elements may be formed on the first surface of the printed circuit board 310 as shown. According to another embodiment, the antenna array 330 may be formed inside the printed circuit board 310. According to embodiments, the antenna array 330 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.

The RFIC 352 (e.g., 226 in FIG. 2) may be placed in another area of the printed circuit board 310 (e.g., a second side opposite the first side), spaced apart from the antenna array. there is. The RFIC is configured to process signals in a selected frequency band that are transmitted/received through the antenna array 330. According to one embodiment, the RFIC 352 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal in a designated band during transmission. When receiving, the RFIC 352 may convert the RF signal received through the antenna array 352 into a baseband signal and transmit it to the communication processor.

According to another embodiment, when transmitting, the RFIC 352 transmits an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (e.g., 228 in FIG. 2) in a selected band. It can be up-converted to an RF signal. When receiving, the RFIC 352 may down-convert the RF signal obtained through the antenna array 352, convert it into an IF signal, and transmit it to the IFIC.

The PMIC 354 may be disposed in another area (eg, the second surface) of the printed circuit board 310, spaced apart from the antenna array. The PMIC can receive voltage from the main PCB (not shown) and provide the necessary power to various components (e.g., RFIC 352) on the antenna module.

The shielding member 390 may be disposed on a portion (eg, the second surface) of the printed circuit board 310 to electromagnetically shield at least one of the RFIC 352 or the PMIC 354. According to one embodiment, the shielding member 390 may include a shield can.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connection member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connection member, the RFIC 352 and/or PMIC 354 of the antenna module may be electrically connected to the printed circuit board.

FIG. 4 shows a cross section along line B-B' of the third antenna module 246 of FIG. 3A. The printed circuit board 310 of the illustrated embodiment may include an antenna layer 411 and a network layer 413.

The antenna layer 411 may include at least one dielectric layer 437-1, and an antenna element 336 and/or a power feeder 425 formed on or inside the outer surface of the dielectric layer. The feeding unit 425 may include a feeding point 427 and/or a feeding line 429.

The network layer 413 includes at least one dielectric layer 437-2, at least one ground layer 433 formed on or inside the outer surface of the dielectric layer, at least one conductive via 435, and a transmission line. (423), and/or may include a signal line (429).

In addition, in the illustrated embodiment, the third RFIC 226 of FIG. 3C is connected to the network layer 413 through, for example, first and second solder bumps 440-1 and 440-2. can be electrically connected to. In other embodiments, various connection structures (eg, solder or BGA) may be used instead of connections. The third RFIC 226 may be electrically connected to the antenna element 336 through the first connection part 440-1, the transmission line 423, and the power feeder 425. The third RFIC 226 may also be electrically connected to the ground layer 433 through the second connection portion 440-2 and the conductive via 435. Although not shown, the third RFIC 226 may also be electrically connected to the module interface mentioned above through the signal line 429.

Figure 5a shows through-holes (512, 514, 516, 518) and a plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548). FIG. 5B is a diagram illustrating the first portion 510, the substrate 550 including a plurality of power feeders 572, 574, 576, and 578, and the RFIC 560 according to an embodiment. FIG. 5C is a diagram showing a transmission line 570 and an RFIC 560 connected to the connection portions 552, 554, 556, and 558 of the conductive paths 542, 544, 546, and 548, according to an embodiment.

In one embodiment, the first portion 510 may be at least a portion of a side member surrounding the space between the first plate and the second plate of the housing. The first portion 510 may include a conductive material. A plurality of through holes 512, 514, 516, and 518 or slots may be formed in the first portion 510. In this document, each of the plurality of through holes 512, 514, 516, and 518 may be referred to as a slot.

In one embodiment, the first power supply unit 572 may be formed using a plurality of conductive paths 522, 532, and 542. The second power supply unit 574 may be formed using a plurality of conductive paths 524, 534, and 544. The third power supply unit 576 may be formed using a plurality of conductive paths 526, 536, and 546. The fourth power supply unit 578 may be formed using a plurality of conductive paths 528, 538, and 548.

In one embodiment, Figure 5A shows through holes (512, 514, 516, 518) and a plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548). ) may be a top view of the antenna structure 500 including. FIG. 5B is a side view of the antenna structure 500 including the first portion 510, a substrate 550 including a plurality of feeders 572, 574, 576, and 578, and an RFIC 560. ) can be. In this document, the antenna structure 500 may be referred to as structure 500.

In one embodiment, the plurality of through holes 512, 514, 516, and 518 or slots may be aligned in the first direction. For example, the first direction may be parallel to one edge of the structure 500. For example, if the structure 500 has a rectangular shape, the first direction may be the X-axis direction parallel to the edge of the longer side of the structure 500. Figure 5a illustrates the case where the first to fourth through holes 512, 514, 516, and 518 are disposed on the structure 500, resulting in four plural through holes 512, 514, 516, and 518. did. However, it is not limited to this, and the number of the plurality of through holes 512, 514, 516, and 518 disposed on the structure 500 may be more or less than four.

In one embodiment, a plurality of through holes 512, 514, 516, and 518 or slots may be formed to penetrate the first portion 510. FIG. 5B illustrates a case where a plurality of through holes 512, 514, 516, and 518 completely penetrate the first portion 510. However, the present invention is not limited thereto, and the plurality of through holes 512, 514, 516, and 518 may penetrate at least a portion of the first portion 510. The plurality of through-holes 512, 514, 516, and 518 may be empty spaces, but are not limited thereto, and the through-hole area may be a non-conductive area in terms of the RF signal. The plurality of through holes 512, 514, 516, and 518 may be filled with a dielectric having low electrical conductivity. A plurality of through holes 512, 514, 516, and 518 implemented in the first portion 510 may transmit and/or receive RF signals.

In one embodiment, at least a portion of the plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) has a plurality of through holes (512, 514, 516). , 518). In one embodiment, at least a portion of the plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) has a plurality of through holes (512, 514, 516). , 518). For example, a plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) include a plurality of through holes (512, 514, 516, 518). It can be arranged spaced apart in the Z-axis direction.

In one embodiment, the plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) are the first to twelfth paths (522, 524, 526, 528). , 532, 534, 536, 538, 542, 544, 546, 548).

In one embodiment, the first to fourth paths 542, 544, 546, and 548 may be arranged adjacent to a plurality of through holes 512, 514, 516, and 518 on one side of the structure 500. there is. The first to fourth paths 542, 544, 546, and 548 may be arranged to face the first portion 510. For example, the first to fourth paths 542, 544, 546, and 548 may be arranged to face the plurality of through holes 512, 514, 516, and 518 in a second direction different from the first direction. . The second direction may be substantially perpendicular to the first direction. For example, the second direction may be the Y-axis direction. The first to fourth paths 542, 544, 546, and 548 may be arranged in the same number as the plurality of through holes 512, 514, 516, and 518.

In one embodiment, the fifth to eighth paths 522, 524, 526, and 528 may extend from one end of the first to fourth paths 542, 544, 546, and 548. The fifth to eighth paths 522, 524, 526, and 528 may be arranged to face the plurality of through holes 512, 514, 516, and 518. For example, the fifth to eighth paths 522, 524, 526, and 528 may be arranged to extend across the plurality of through holes 512, 514, 516, and 518 in the second direction. The fifth to eighth paths 522, 524, 526, and 528 may be arranged in the same number as the plurality of through holes 512, 514, 516, and 518.

In one embodiment, when viewed in the Z-axis direction, portions of the fifth to eighth paths 522, 524, 526, and 528 may overlap a plurality of through holes 512, 514, 516, and 518. The fifth to eighth paths 522, 524, 526, and 528 may be arranged to be spaced apart from the plurality of through holes 512, 514, 516, and 518 in the Z-axis direction.

In one embodiment, the ninth to twelfth paths 532, 534, 536, and 538 may extend from one end of the first to fourth paths 542, 544, 546, and 548. The ninth to twelfth paths (532, 534, 536, and 538) may be extended and spaced apart from the fifth to eighth paths (522, 524, 526, and 528). The ninth to twelfth paths 532, 534, 536, and 538 may be arranged to face the plurality of through holes 512, 514, 516, and 518. For example, the ninth to twelfth paths 532, 534, 536, and 538 may be arranged to extend across the plurality of through holes 512, 514, 516, and 518 in the second direction. The ninth to twelfth paths 532, 534, 536, and 538 may be arranged in the same number as the plurality of through holes 512, 514, 516, and 518.

In one embodiment, when viewed in the Z-axis direction, portions of the ninth to twelfth paths 532, 534, 536, and 538 may overlap a plurality of through holes 512, 514, 516, and 518. The ninth to twelfth paths 532, 534, 536, and 538 may be arranged to be spaced apart from the plurality of through holes 512, 514, 516, and 518 in the Z-axis direction.

In one embodiment, the first to fourth paths 542, 544, 546, and 548 may be arranged to be spaced apart from the plurality of through holes 512, 514, 516, and 518. The fifth to eighth paths (522, 524, 526, 528) and the ninth to twelfth paths (532, 534, 536, 538) branch from the first to fourth paths (542, 544, 546, 548). can be placed. The fifth path 522 and the ninth path 532 branched from the first path 542 may be formed to overlap the first through hole 512 .

In one embodiment, connection portions 552, 554, 556, and 558 may be formed in the first to fourth paths 542, 544, 546, and 548. The connection parts 552, 554, 556, and 558 are connected to the first to fourth paths 542, 544, 546, and 548 and have a thickness thinner than the first to fourth paths 542, 544, 546, and 548. It may be a part. The connection portions 552, 554, 556, and 558 of the first to fourth paths 542, 544, 546, and 548 may be connected to an RFIC 560, which is a wireless communication circuit. For example, as shown in FIG. 5C, the connection portions 552, 554, 556, and 558 of the first to fourth paths 542, 544, 546, and 548 use a transmission line 570 or a via. It can be connected to the RFIC (560) through. Each of the connection parts 552, 554, 556, and 558 of the first to fourth paths 542, 544, 546, and 548 may receive power from the RFIC 560. The connections 552, 554, 556, and 558 of the first to fourth paths 542, 544, 546, and 548 are connected to the RFIC 560 circuit through the transmission line 570 to transmit and/or mmWave signals. You can receive it. The transmission line 570 may separately connect the connections 552, 554, 556, and 558 to the RFIC 560. The transmission line 570 may be implemented on the substrate 550.

In one embodiment, the substrate 550 may include first to twelfth paths 522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, and 548. A plurality of through holes (512, 514, 516, 518) and first to twelfth paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544) included in the first portion (510) , 546, and 548), a non-conductive layer may be disposed between them. The non-conductive layer included in the substrate 550 includes a plurality of through holes 512, 514, 516, 518 and first to twelfth paths 522, 524, 526, 528, 532 included in the first portion 510. , 534, 536, 538, 542, 544, 546, 548) can be prevented from short-circuiting.

In one embodiment, the fifth path 522 and the ninth path 532 branched from the first path 542 may feed signals of the same frequency and same phase to the overlapping first through-hole 512. . The first through hole 512 may radiate a supplied signal. Accordingly, the structure 500 can transmit and/or receive RF signals using the first to fourth through holes 512, 514, 516, and 518.

FIG. 6 is a diagram 600 showing a first portion 510, a through hole 610, a first path 640, a second path 620, and a third path 630 according to an embodiment.

In one embodiment, the through hole 610 (e.g., the first through hole 512 in FIG. 5A) is at least a portion of the side member and may penetrate the first portion 510 made of a conductive material. For example, the through hole 610 may penetrate the first portion 510 in the Z-axis direction. The through hole 610 may have a slot structure. The electronic device 101 may transmit and/or receive an RF signal of a designated frequency through the through-hole 610. The metal area including the through hole 610 may be a radiator that radiates an RF signal of a designated frequency. The electronic device 101 may radiate an RF signal through the through hole 610 or slot. Accordingly, in a structure including a through hole 610, a slot is formed in a conductive material and a portion of the first portion 510 filled with a non-metallic material may function as an radiator of the electronic device 101.

In one embodiment, the first path 640 may be arranged to face the through hole 610. One side of the first path 640 (e.g., first path 542 in FIG. 5A) is connected to a second path 620 (e.g., fifth path 522 in FIG. 5A) and a third path 630 (e.g., : Can branch to the ninth path 532 in FIG. 5A). The other side of the first path 640 may be connected to a wireless communication circuit (eg, RFIC 560 in FIG. 5B).

In one embodiment, the first path 640 may include a connection portion 650. The connection unit 650 is connected to a port of a wireless communication circuit (e.g., RFIC 560 in FIG. 5C) and can receive a signal and feed the signal to the through hole 610. The connection portion 650 of the first path 640 may be implemented as a micro strip or strip-shaped transmission line to feed a signal. The connection portion 650 of the first path 640 is connected to an RFIC (e.g., RFIC 560 in FIG. 5c) through a transmission line (e.g., transmission line 570 in FIG. 5c) to transmit and/or receive a signal. can do.

In one embodiment, the second path 620 and the third path 630 may be arranged to pass over the through hole 610. The second path 620 and the third path 630 may be implemented as two transmission lines disposed directly above the through hole 610 or slot. Each of the second path 620 and the third path 630 may be designed to have a characteristic impedance of about 50Ω. In one embodiment, on one side of the second path 620 and/or the third path 630, open stubs 621 and 631 have a different width from the second path 620 and the third path 630. ) can be connected. The open stubs 621 and 631 may match or match the input impedances of the through hole 610 and the second path 620 and the third path 630.

In one embodiment, the second path 620 and the third path 630 may be combined with the first path 640 on one side. The first path 640 combined into one line may be connected to a port of a wireless communication circuit. For example, the first path 640 may be connected to a port of a wireless communication circuit (eg, RFIC 560 in FIG. 5B).

In one embodiment, the first path 640 is wider than a 50Ω transmission line and may have a characteristic impedance of about 35Ω. For example, the first path 640 may function as a T-type combiner (3dB T-junction) that combines 3dB power. The first path 640 may function as an impedance converter that changes the impedance from about 50Ω to about 35Ω.

In one embodiment, a triangular slit 660 may be disposed at a junction of the transmission line where the first path 640, the second path 620, and the third path 630 are joined. The groove 660 may provide impedance matching when the first path 640 is combined with the second path 620 and the third path 630.

FIG. 7A shows a first portion 510, a through hole 710 (e.g., the first through hole 512 in FIG. 5a), and a first path 740 (e.g., the first path in FIG. 5a) according to an embodiment. (542)), a second path 720 (e.g., the fifth path 522 in FIG. 5A), and a third path 730 (e.g., the ninth path 532 in FIG. 5A). 7A may be a top view of structure 700.

In one embodiment, the through hole 710 may be formed in the first portion 510. As another example, a non-conductive material may be disposed in the through-hole 710. The relative dielectric constant of the non-conductive material may be, for example, about 3.5.

In one embodiment, the basic resonant frequency of the radiator may be set by the length of a slot such as the through hole 710. For example, the length of the through hole 710 in the first direction (X-axis) may be approximately 3.6 mm, and the length in the second direction (Y-axis) may be approximately 1.0 mm. In this case, the through hole 710 may have a length of about 0.5 λg or more and about 0.6 λg or less at about 28 GHz used in 5G communications. λg can be defined as the wavelength in waveguide, which is the wavelength within the through-hole 710.

In one embodiment, the first path 740 may have a line width of about 0.23 mm to about 0.7 mm in the first direction (X-axis) and a length of about 3.3 mm in the second direction (Y-axis). there is. For example, the line width of the first path 740 may gradually increase as it gets closer to one side combined with the second path 720 and the third path 730. The first path 740 may function as an impedance converter.

In one embodiment, the second path 720 and the third path 730 branch from the first path 740 and have overlapping portions 721 and 731 that at least partially overlap the through hole 710 and the through hole. It may include open stubs 722 and 732 (e.g., 621 and 631 in FIG. 6) disposed past 710. The line width of the overlapping portions 721 and 731 in the first direction (X-axis) may be about 0.23 mm. The length of the overlapping portions 721 and 731 in the second direction (Y-axis) may be about 1.5 mm. The line width of the open stubs 722 and 732 in the first direction (X-axis) may be about 0.1 mm. The length of the open stubs 722 and 732 in the second direction (Y-axis) may be about 1.2 mm. Additionally, the second path 720 and the third path 730 may each be spaced apart from the center of the through hole 710 by about 1.6 mm. Accordingly, the second path 720 and the third path 730 may be spaced apart by about 3.2 mm.

FIG. 7B is a diagram illustrating in detail the substrate 750 including the first portion 510 and the power feeder 760 according to an embodiment. 7A may be a side view of structure 700. The first portion 510 of FIG. 7B may include through holes 710. The power supply unit 760 of FIG. 7B may include a first path 740, a second path 720, and/or a third path 730.

In one embodiment, through holes 710 may be formed in the first portion 510. The thickness of the first portion 510 in the height direction (Z-axis) may be about 0.5 mm.

In one embodiment, the first path 740 may be connected to the second path 720 and/or the third path 730. The first path 740 may transmit signals to the second path 720 and/or the third path 730.

In one embodiment, the substrate 750 may include a plurality of power feeders 760. For example, a conductive layer including a power feeder 760 may be disposed inside the substrate 750. The substrate 750 may face one side of the first portion 510 including the through hole 710. A dielectric layer 770 made of a non-conductive dielectric may be included between the power feeding portion 760 and the first portion 510 included in the substrate 750. The thickness of the dielectric layer 770 in the height direction (Z-axis) may be about 0.1 mm. As another example, a gap of approximately 0.1 mm may be formed between the power feeding portion 760 and the first portion 510.

FIG. 8A is a diagram 800 showing through holes 812, 814, 816, and 818 and a plurality of conductive paths 822, 824, 826, 828, 832, 834, 836, and 838 according to another embodiment. .

In one embodiment, the first to fourth through holes 812, 814, 816, and 818 may have substantially the same structure and function as the through holes 512, 514, 516, and 518 described in FIG. 5A. . Therefore, redundant description regarding the through holes 812, 814, 816, and 818 will be omitted below.

In one embodiment, the first to eighth conductive paths 822, 824, 826, 828, 832, 834, 836, and 838 may extend in the second direction (Y-axis). The first to eighth conductive paths (822, 824, 826, 828, 832, 834, 836, 838) are connected to the first to fourth through holes (812, 814, 816, 818) with respect to the Z-axis direction. It can be placed at the top. Parts of the first to eighth conductive paths (822, 824, 826, 828, 832, 834, 836, 838) may overlap the first to fourth through holes (812, 814, 816, 818). .

In one embodiment, the first and second conductive paths 822 and 832 may be arranged to pass over the first through hole 812. The first through hole 812 may receive power from the first and second conductive paths 822 and 832 and radiate signals.

In one embodiment, the first and second conductive paths 822 and 832 passing through the first through hole 812 may apply power in-phase.

FIG. 8B is a diagram 800 showing a power supply structure through a plurality of conductive paths 822, 824, 826, 828, 832, 834, 836, and 838 according to another embodiment.

In one embodiment, the first to eighth conductive paths 822, 824, 826, 28, 832, 834, 836, and 838 may form a power feeder. The first to eighth conductive paths 822, 824, 826, 828, 832, 834, 836, and 838 may be connected to the wireless communication circuit 940. The first to eighth conductive paths 822, 824, 826, 828, 832, 834, 836, and 838 may receive a signal of a frequency to be radiated from the wireless communication circuit 940. The wireless communication circuit 940 may include transmission and reception circuitry for transmitting and/or receiving RF signals. The transmitting and receiving circuitry of the wireless communication circuit 940 includes first to eighth power amplifiers (PA) (842, 844, 846, 848, 852, 854, 856, 858) and a plurality of low noise amplifiers. LNA) may be included.

In one embodiment, the first to eighth conductive paths (822, 824, 826, 828, 832, 834, 836, 838) are connected to the first to eighth power amplifiers (842, 844, 846, 848, 852, 854). , 856, 858). Accordingly, a plurality of power amplifiers (842, 844, 846, 848, 852, 854, 856, 858) can be used. For example, if there are four first to fourth through holes 812, 814, 816, and 818, eight chains can be used. When feeding power to the first through hole 812 using the first and second conductive paths 822 and 832, the power gain ( gain can be increased by 3dB.

In one embodiment, the wireless communication circuit 940 may supply power to the first and second conductive paths 822 and 832 corresponding to the first through hole 812. The wireless communication circuit 940 may feed signals having the same phase to the first and second conductive paths 822 and 832. When feeding signals having the same phase to the first and second conductive paths 822 and 832, the first and second conductive paths 822 and 832 are formed without adding components such as the distributor 700 structure of FIG. 7A. 832) and a wireless communication circuit 940 can be implemented.

FIG. 9 is a diagram 900 showing a first portion 510 and a plurality of through holes 910 and 920 including slits 912, 914, 922, and 924 that intersect each other, according to an embodiment.

In one embodiment, the plurality of through holes 910 and 920 may include a first through hole 910 and/or a second through hole 920. The first through hole 910 may include a first slit 912 and/or a second slit 914. The first through hole 910 may have a cross shape where the first slit 912 and the second slit 914 intersect each other. For example, the first through hole 910 may have a structure in which two rectangular first slits 912 and second slits 914 intersect each other at the central portion. The first through hole 910 is arranged so that the elongated portions of the first slit 912 and the second slit 914 have different directions, so that the first slit 912 and the second slit 914 have different directions. Polarization can be generated in one direction. Likewise, the second through hole 920 includes a third slit 922 and a fourth slit 924, and may have a cross shape where the third slit 922 and the fourth slit 924 intersect each other. .

In one embodiment, the first slit 912 of the first through hole 910 extends long in the first direction (X-axis), and the second slit 914 extends long in the second direction (Y-axis). You can. The second slit 914 may be formed to penetrate the central portion of the first slit 912 extending long from the first through hole 910 in the first direction (X-axis). Likewise, the third slit 922 of the second through hole 920 may extend long in the first direction (X-axis), and the fourth slit 924 may extend long in the second direction (Y-axis). there is.

In one embodiment, the first slit 912 and the second slit 914 forming the first through hole 910 may be arranged to intersect each other perpendicularly to form polarized waves that intersect each other perpendicularly. The polarized wave generated by the first slit 912 and the polarized wave generated by the second slit 914 may be perpendicular to each other. For example, vertical polarization (V-pol.) in the second direction (Y-axis) is formed by the first slit 912, and vertical polarization (V-pol.) is formed in the first direction (X-axis) by the second slit 914. Horizontal polarization (H-pol.) can be formed.

FIG. 10 is a diagram 1000 showing a plurality of through holes 1010 and 1020 crossing each other according to another embodiment.

In one embodiment, the plurality of through holes 1010 and 1020 may include a third through hole 1010 and a fourth through hole 1020. The third through hole 1010 may include a fifth slit 1012 and/or a sixth slit 1014. The third through hole 1010 may have a cross shape where the fifth slit 1012 and/or the sixth slit 1014 intersect each other. Likewise, the fourth through hole 1020 includes a seventh slit 1022 and/or an eighth slit 1024 and has a cross shape where the seventh slit 1022 and/or the eighth slit 1024 intersect each other. You can have

In one embodiment, the fifth slit 1012 may extend long in the third direction D3 and the sixth slit 1014 may extend long in the fourth direction D4. The third direction D3 may be a direction from the upper left to the lower right among directions intersecting the X and Y axes on the XY plane. The fourth direction D4 may be a direction from the upper right to the lower left among directions intersecting the X and Y axes on the XY plane. The sixth slit 1014 may be formed to penetrate the central portion of the fifth slit 1012 in the third through hole 1010. Likewise, the seventh slit 1022 may extend long in the third direction D3 and the eighth slit 1024 may extend long in the fourth direction D4.

In one embodiment, the fifth slit 1012 and the sixth slit 1014 forming the third through hole 1010 may be arranged to intersect each other perpendicularly to form polarized waves that intersect each other perpendicularly. For example, polarization in the fourth direction (D4) is formed by the fifth slit (1012) extending long in the third direction (D3), and the sixth slit (1014) extending long in the fourth direction (D4) Polarization in the third direction D3 may be formed.

Figure 11a is a diagram showing through holes (1112, 1114, 1116, 1118) and a plurality of power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178) according to another embodiment. FIG. 11B shows the first portion 510, the first layer 1140 including the first to fourth power feeders 1162, 1164, 1166, and 1168 of the substrate 550, and the substrate 550 according to an embodiment. ) This is a diagram showing the second layer 1150 including the 5th to 8th power feeders 1172, 1174, 1176, and 1178. Figure 11a may be a top view of the antenna structure 1100 including through holes (1112, 1114, 1116, 1118) and a plurality of feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178). there is. FIG. 11B shows the first portion 1110, the first layer 1140 including the first to fourth power feeders 1162, 1164, 1166, and 1168 of the substrate 550, and the fifth to fourth power feeders of the printed circuit board. This may be a side view of an antenna structure 1100 including a second layer 1150 including 8 power feeders 1172, 1174, 1176, and 1178. In this document, the antenna structure 1100 may be referred to as structure 1100.

In one embodiment, the plurality of through holes 1112, 1114, 1116, and 1118 include two slits (e.g., the fifth slit in FIG. 10) that intersect each other in the third direction D3 and the fourth direction D4. (1012) and a sixth slit (1014). The plurality of through holes 1112, 1114, 1116, and 1118 may be aligned in the first direction (X-axis). The virtual extension lines in the third direction D3 and the fourth direction D4 may form an acute angle (eg, 45 degrees) with one edge of the side member including the first portion 510 . FIG. 11A illustrates a case in which four plurality of through holes 1112, 1114, 1116, and 1118 are arranged on the structure 1100. However, it is not limited to this, and the number of the plurality of through holes 1112, 1114, 1116, and 1118 disposed on the structure 1100 may be more or less than four.

In one embodiment, a plurality of through holes 1112, 1114, 1116, and 1118 may be formed to penetrate the first portion 510. The first portion 510 including a plurality of through holes 1112, 1114, 1116, and 1118 may be a conductor. RF signals may be transmitted and/or received through a plurality of through holes 1112, 1114, 1116, and 1118. A plurality of through holes 1112, 1114, 1116, and 1118 may be implemented in the first portion 510 for transmission and/or reception of RF signals.

In one embodiment, a plurality of power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178) may be disposed on a plurality of through holes (1112, 1114, 1116, 1118). In one embodiment, the plurality of power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, and 1178) may be arranged to face the plurality of through holes (1112, 1114, 1116, and 1118). For example, the plurality of power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178) may be arranged to be spaced apart from the plurality of through holes (1112, 1114, 1116, 1118) in the Z-axis direction. You can.

In one embodiment, the third direction D3 and the fourth direction D4 may perpendicularly intersect each other. The plurality of through holes 1112, 1114, 1116, and 1118 may be cross-shaped in the third direction D3 and fourth direction D4. A plurality of through holes (1112, 1114, 1116, 1118) receive power from a plurality of power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178) in the third direction (D3) and the fourth direction. (D4) can radiate a polarized signal.

In one embodiment, the third direction D3 and the fourth direction D4 may be inclined by about 45 degrees from the first direction (X-axis) and the second direction (Y-axis). The plurality of through holes 1112, 1114, 1116, and 1118 may generate linear polarization inclined by about 45 degrees with respect to the first direction (X-axis) and the second direction (Y-axis).

In one embodiment, the plurality of feeders 1162, 1164, 1166, 1168, 1172, 1174, 1176, and 1178 are first to fourth feeders 1162, 1164, and 1166 formed in the third direction D3. , 1168) and fifth to eighth power feeders 1172, 1174, 1176, and 1178 formed in the fourth direction D4. The first to fourth power feeders 1162, 1164, 1166, and 1168 have slits (e.g., slits in FIG. 10) arranged in the fourth direction D4 among the plurality of through holes 1112, 1114, 1116, and 1118. A signal can be supplied to 6 slits (1014). The fifth to eighth power feeders 1172, 1174, 1176, and 1178 have slits (e.g., slits in FIG. 10) arranged in the third direction D3 among the plurality of through holes 1112, 1114, 1116, and 1118. A signal can be supplied to 5 slits (1012).

In one embodiment, the first layer 1140 of the substrate 550 may include first to fourth power feeders 1162, 1164, 1166, and 1168. The second layer 1150 of the substrate 550 may include fifth to eighth power feeders 1172, 1174, 1176, and 1178. The first to fourth power feeders 1162, 1164, 1166, and 1168 may be a conductive metal layer disposed inside the first layer 1140 of the substrate 550. The fifth to eighth power feeders 1172, 1174, 1176, and 1178 may be a conductive metal layer disposed inside the second layer 1150 of the substrate 550. The first to eighth power feeders (1162, 1164, 1166, 1168, 1172, 1174, 1176, 1178) are spaced apart from each other at regular intervals within the first and second layers (1140, 1150) of the substrate 550. can be placed.

In one embodiment, the first through hole 1112 may receive power using the first power feeder 1162 and the fifth power feeder 1172.

In one embodiment, the first to fourth power feeders 1162, 1164, 1166, and 1168 are disposed on the first layer 1140 of the substrate 550 and the fifth to eighth feeders 1172, 1174, 1176, 1178 may be disposed on the second layer 1150 of the substrate 550 and implemented in different layers.

In one embodiment, the substrate 550 may include an insulating layer made of a non-conductive dielectric disposed therein. For example, between the first and second layers 1140 and 1150 of the substrate 550, first to fourth power feeders 1162, 1164, 1166, 1168 and fifth to eighth power feeders 1172, A first dielectric layer 1180 may be disposed to separate between 1174, 1176, and 1178). In addition, the first layer 1140 of the substrate 550 includes a second dielectric layer 1190 that separates the first to fourth power feeders 1162, 1164, 1166, and 1168 and the first portion 510. can be placed. The first and second dielectric layers 1180 and 1190 include the first portion 510, the first to fourth power feeders (1162, 1164, 1166, 1168), and/or the fifth to eighth feeders (1172, 1174). , 1176, 1178) can be prevented from short-circuiting each other.

In one embodiment, the first power feeder 1162 and the fifth power feeder 1172 may feed power to the first through hole 1112. The first power feeder 1162 and the fifth power feeder 1172 may feed power to generate polarized waves perpendicular to each other. The first through-hole 1112 can generate dual linear polarizations that are polarized perpendicular to each other based on the supplied signal. In the structure 1100, the first portion 1110 around the plurality of through holes 1112, 1114, 1116, and 1118 may be a radiator. Structure 1100 may transmit and/or receive a dual linearly polarized RF signal using a plurality of through holes 1112, 1114, 1116, and 1118. If each polarization crosses vertically, isolation between the two polarizations can be secured.

FIGS. 12A to 12D are diagrams 1200 showing vertical and horizontal polarization generated from intersecting through holes according to an embodiment.

In one embodiment, the through hole 1201 (e.g., the first through hole 1112 in FIG. 11A) may include first and second slits 1210 and 1220 that intersect each other. The first slit 1210 may include first and second portions 1212 and 1214. The second slit 1220 may include third and fourth portions 1222 and 1224. The through hole may have a cross-shaped structure including first to fourth parts 1212, 1214, 1222, and 1224, as shown in FIG. 12A. The first and second parts 1212 and 1214 may receive horizontally polarized power in the left and right directions from the power feeder 1262 (e.g., the first feeder 1162 in FIG. 11B) and radiate a horizontally polarized signal. The third and fourth parts 1222 and 1224 may receive vertically polarized power from the power feeder 1272 (e.g., the fifth feeder 1172 in FIG. 11B) and radiate a vertically polarized signal.

In one embodiment, through holes including slits that intersect each other may form a horizontal polarization 1250 and a vertical polarization 1260 as shown in FIG. 12B. The through hole can generate a signal polarized in the direction in which the power is received.

In one embodiment, a through hole including slits crossing each other may generate a current as shown in FIG. 12C. The through hole may receive power from a plurality of conductive paths to generate a surface current on the surface of the metal layer excluding the through hole.

In one embodiment, a through hole including slits crossing each other may form an electric field (E-field) as shown in FIG. 12D. The through hole may receive power from a plurality of conductive paths to generate an electric field directed from one side of the through hole to the other side.

FIG. 13 is a diagram 1300 showing a first portion 510 and a plurality of through holes 1310 and 1320 including slits 1312, 1314, 1322, and 1324 that intersect each other according to another embodiment. .

In one embodiment, the plurality of through holes 1310 and 1320 may include a fifth through hole 1310 and/or a sixth through hole 1320. The fifth through hole 1310 may include a ninth slit 1312 and a tenth slit 1314. The fifth through hole 1310 may have a cross shape where the ninth slit 1312 and the tenth slit 1314 intersect each other. The sixth through hole 1320 includes an 11th slit 1322 and a 12th slit 1324, and may have a cross shape where the 11th slit 1322 and the 12th slit 1324 intersect each other.

In one embodiment, the ninth slit 1312 of the fifth through hole 1310 may extend in the first direction (X-axis), and the tenth slit 1314 may extend in the second direction (Y-axis). . The tenth slit 1314 may be formed to penetrate the central portion of the ninth slit 1312. Likewise, the eleventh slit 1322 of the sixth through hole 1320 may extend long in the first direction (X-axis), and the twelfth slit 1324 may extend long in the second direction (Y-axis). there is.

In one embodiment, the ninth slit 1312 and the tenth slit 1314 forming the fifth through hole 1310 may have different lengths. The ninth slit 1312 and the tenth slit 1314 may have different frequency bands. For example, when the length of the ninth slit 1312 is longer than the length of the tenth slit 1314, the frequency band of the signal radiating from the ninth slit 1312 is that of the signal radiating from the tenth slit 1314. It may be lower than the frequency band. Accordingly, a dual band radiator can be formed in which the vertical polarization formed by the ninth slit 1312 and the horizontal polarization formed by the tenth slit 1314 have different frequencies. Likewise, the 11th slit 1322 and the 12th slit 1324 forming the sixth through hole 1320 may have different lengths.

FIG. 14 is a diagram 1400 showing a first portion 510 and a plurality of through holes 1410 and 1420 including slits 1412, 1414, 1422 and 1424 that intersect each other according to another embodiment. .

In one embodiment, the plurality of through holes 1410 and 1420 may include a seventh through hole 1410 and/or an eighth through hole 1420. The seventh through hole 1410 may include a thirteenth slit 1412 and a fourteenth slit 1414. The seventh through hole 1410 may have a cross shape where the thirteenth slit 1412 and the fourteenth slit 1414 intersect each other. The eighth through hole 1320 includes a 15th slit 1422 and a 16th slit 1424, and may have a cross shape where the 15th slit 1422 and the 16th slit 1424 intersect each other.

In one embodiment, the thirteenth slit 1412 of the seventh through hole 1410 may extend in the third direction D3, and the fourteenth slit 1414 may extend in the fourth direction D4. The fourteenth slit 1414 may be formed to penetrate the central portion of the thirteenth slit 1412. Likewise, the fifteenth slit 1422 of the eighth through hole 1420 may extend long in the third direction D3, and the sixteenth slit 1424 may extend long in the fourth direction D4.

In one embodiment, the thirteenth slit 1412 and the fourteenth slit 1414 forming the seventh through hole 1410 may have different lengths. The thirteenth slit 1412 and the fourteenth slit 1414 may have different frequency bands. For example, when the length of the 13th slit 1412 is longer than the length of the 14th slit 1414, the frequency band of the signal radiating from the 13th slit 1412 is that of the signal radiating from the 14th slit 1414. It may be lower than the frequency band. Accordingly, a dual-band radiator can be formed in which the vertical polarization formed by the thirteenth slit 1412 and the horizontal polarization formed by the fourteenth slit 1414 have different frequencies. Likewise, the fifteenth slit 1422 and the sixteenth slit 1424 forming the eighth through hole 1420 may have different lengths.

15A to 15H illustrate intersecting through holes 1512, 1514, 1516, 1518, 1522, 1524, 1526, 1528, 1532, 1534, 1536, and 1538 disposed on side members of a housing of an electronic device according to various embodiments. ) are drawings 1500 showing ).

In one embodiment, the housing may include a first plate 1540, a second plate 1550, and a side member 1560.

In one embodiment, the first plate 1540 may form the first side (or front) of the electronic device 101. The first plate 1540 may be formed to face the first side of the electronic device 101. At least a portion of the first plate 1540 may be substantially transparent. For example, the first plate 1540 may be formed of a glass plate or a polymer plate including various coating layers. The first plate 1540 may expose the display of the display device 160 through a substantially transparent portion of the first surface.

In one embodiment, the second plate 1550 may form the second side (or back) of the electronic device 101. The second plate 1550 may be formed to face the second side of the electronic device 101. Accordingly, the second plate 1550 may be formed to face in the opposite direction to the first plate 1540. The second plate 1550 may be substantially opaque. For example, the second plate 1550 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

In one embodiment, the side member 1560 may form a side surface surrounding the space between the first and second surfaces of the electronic device 101. The side member 1560 may surround the space between the first plate 1540 and the second plate 1550. The side member 1560 may be connected to the second plate 1550. For example, the side member 1550 is coupled to the first plate 1540 and the second plate 1550 and may have a side bezel structure including metal and/or polymer. As another example, the side member 1560 is formed integrally with the second plate 1550 and may include the same material as the second plate 1550 (eg, a metal material such as aluminum).

In one embodiment, the side member 1560 may include first to third portions 1510, 1520, and 1530 (eg, first portion 510 in FIG. 5A). For example, as shown in FIG. 15A , the first portion 1510 may be placed at the top of the electronic device 101. The top of the electronic device 101 may be in the -Y-axis direction. As another example, as shown in FIG. 15B, the second part 1520 may be placed at the upper left of the electronic device 101. As another example, the third part 1530 may be placed at the upper right of the electronic device 101, as shown in FIG. 15C.

In one embodiment, the first to third parts 1510, 1520, and 1530 may include a conductive material and a non-conductive material. First to fourth through holes 1512, 1514, 1516, and 1518 aligned in a first direction (X-axis) substantially parallel to the first plate 1540 may be disposed in the first portion 1510. Fifth to eighth through holes 1522, 1524, 1526, and 1528 aligned in the first direction (X-axis) may be disposed in the second portion 1520. Ninth to twelfth through holes 1532, 1534, 1536, and 1538 aligned in the first direction (X-axis) may be disposed in the third portion 1530. The first to fourth through holes 1512, 1514, 1516, and 1518 included in the first portion 1510 may be formed in the metal frame of the electronic device 101. The fifth to eighth through holes 1522, 1524, 1526, and 1528 included in the second part 1520 are spaced apart from the first to fourth through holes 1512, 1514, 1516, and 1518 of the electronic device 101. and can be formed on a metal frame. The 9th to 12th through holes 1532, 1534, 1536, and 1538 included in the third portion 1530 are the 1st to 8th through holes 1512, 1514, 1516, 1518, 1522, 1524, 1526, and 1528. It may be formed on the metal frame of the electronic device 101 and spaced apart from it. The inside of the first to twelfth through holes (1512, 1514, 1516, 1518, 1522, 1524, 1526, 1528, 1532, 1534, 1536, 1538) may be filled with a non-conductive material.

In one embodiment, four cross-shaped radiating through holes or slots may be disposed in the first to third portions 1510, 1520, and 1530 of the side member 1560, as shown in FIGS. 15A to 15D. However, the present invention is not limited thereto, and the number of cross-shaped radiating through holes or slots disposed in the first to third portions 1510, 1520, and 1530 may be more or less than four. Additionally, FIGS. 15A to 15D illustrate a case where the direction in which one of the cross-shaped radiating through holes or the through holes of the slot is disposed is parallel to the X-axis. However, it is not limited to this, and as shown in FIGS. 15e to 15h, the through-hole or slit forming the cross-shaped radiation through-hole or slot may be rotated in a third direction (e.g., in FIG. 10) according to the polarization direction of the signal to be radiated from the cross-shaped radiation through-hole or slot. It may also be arranged in the third direction (D3)) or the fourth direction (e.g., the fourth direction (D4) in FIG. 10).

FIG. 16 is a diagram 1600 showing a printed circuit board 1610 including a plurality of power feeders 1622, 1624, 1626, 1628, 1632, 1634, 1636, and 1638 according to an embodiment.

In one embodiment, the third RFIC 226 may be disposed on the printed circuit board 1610. For example, the third RFIC 226 may be mounted on one side of the printed circuit board 1610 in the form of a surface mount device (SMD). The printed circuit board 1610 may transmit a signal of a designated frequency transmitted and/or received by the third RFIC 226 to the radiator.

In one embodiment, the antenna structure 1610 may include a plurality of feeders 1622, 1624, 1626, 1628, 1632, 1634, 1636, and 1638. The first to fourth power feeders 1622, 1624, 1626, and 1628 are connected to the third RFIC 226 and can transmit signals of a designated frequency transmitted and/or received by the third RFIC 226. The fifth to eighth power feeders 1632, 1634, 1636, and 1638 are connected to the third RFIC 226 and can transmit signals of a designated frequency transmitted and/or received by the third RFIC 226. The first to fourth power feeders 1622, 1624, 1626, and 1628 have a frequency specified in a radiator including a through hole or slot (e.g., the fifth slit 1012 of the third through hole 1010 in FIG. 10). By transmitting the signal, the radiator may radiate a signal polarized in a first direction (eg, the third direction (D3) in FIG. 10). The fifth to eighth power feeders (1632, 1634, 1636, and 1638) have a frequency specified in a radiator including a through hole or slot (e.g., the sixth slit 1014 of the third through hole 1010 in FIG. 10). By transmitting the signal, the radiator may radiate a polarized signal in a second direction (eg, the fourth direction D4 in FIG. 10).

FIG. 17 shows a structure in which an antenna structure 1710 including a plurality of conductive patches 1712, 1714, 1716, and 1718 according to an embodiment and a printed circuit board 1610 of FIG. 16 are connected by a connection member 1740. This is the drawing shown (1700).

In one embodiment, the antenna structure 1710 may include a plurality of conductive patches 1712, 1714, 1716, and 1718. A plurality of conductive patches 1712, 1714, 1716, and 1718 may be disposed inside the antenna structure 1710 or on one side of the antenna structure 1710. A plurality of conductive patches 1712, 1714, 1716, and 1718 may be arranged at designated intervals on the antenna structure 1710. The plurality of conductive patches 1712, 1714, 1716, and 1718 may emit or receive RF signals. The plurality of conductive patches 1712, 1714, 1716, and 1718 may receive RF signals from the RFIC 226 disposed on the printed circuit board 1610.

In one embodiment, as shown in FIG. 17, four conductive patches 1712, 1714, 1716, and 1718 may be arranged on one side of the antenna structure 1710. However, it is not limited thereto, and the antenna structure 1710 may include more or less than four conductive patches. Additionally, each of the plurality of conductive patches 1712, 1714, 1716, and 1718 may have a circular or polygonal shape, but is not limited thereto.

In one embodiment, the connecting member 1740 may include a connecting portion (e.g., connecting portions 552, 554, 556, and 558 of FIG. 5A). The connecting member 1740 may include the printed circuit board 1610 of FIG. 16. It may be formed of a flexible printed circuit board (FPCB) connecting a plurality of conductive patches 1712, 1714, 1716, and 1718. The connection member 1740 includes a plurality of conductive patches 1712, 1714, and 1718. Signals may be transmitted between 1716, 1718) and a printed circuit board 1610.

In one embodiment, the antenna structure 1710 and the printed circuit board 1610 connected by the connecting member 1740 may form one antenna module. The plurality of conductive patches 1712, 1714, 1716, and 1718 of the antenna structure 1710 are connected to a plurality of feeders formed on the printed circuit board 1610 (e.g., the first to eighth feeders 1622 of FIG. 16, Beams can be formed in different directions from the radiators (e.g., the third and fourth through holes 1010 and 1020 of FIG. 10) that receive power from 1624, 1626, 1628, 1632, 1634, 1636, 1638). . The electronic device 101 may transmit and/or receive signals in different directions using beams formed in different directions.

FIG. 18 is a diagram 1800 showing a housing and a side member 1560 of an electronic device according to an embodiment.

In one embodiment, the first portion (e.g., first portion 1510 in FIG. 15A) corresponds to the first and second plates (e.g., first and second plates 1540 in FIG. 15A) of the housing of the electronic device 101. , 1550) may be included in a side member (e.g., the side member 1560 in Figure 15A) surrounding the space between them. The radiators 1010 and 1020 of the first part 1510 have a straight shape as shown in Figures 5A to 5C. It may be in the form of a through hole or slot, or a cross-shaped through hole or slot as shown in FIGS. 9 to 14.

In one embodiment, the first portion 1510 may face the printed circuit board 310. For example, the inner surface of the first part 1510, which is a metal layer on the outer side surface or a part of the metal housing, may be in close contact with one surface of the printed circuit board 310. The first part 1510 may include a through hole for coupling to the printed circuit board 310.

In one embodiment, an additional adhesive layer or external bonding structure is further included on one side of the first part 1510 or the printed circuit board 310 for coupling when the first part 1510 and the printed circuit board 310 are coupled. can do. For example, the external coupling structure can be implemented as a metal mechanism or an injection structure.

In one embodiment, a third RFIC 226 may be mounted on one side of the printed circuit board 310. The first part 1510 is electrically connected to the third RFIC 226 and can transmit and/or receive a signal at a designated frequency.

FIG. 19A is a diagram 1900 showing an electronic device 101 in which an antenna structure 1710 and a printed circuit board 1610 are combined, according to an embodiment.

In one embodiment, a third RFIC 226 may be attached to one of both sides of the antenna structure 1710 facing the first plate. A plurality of conductive patches (eg, a plurality of conductive patches 1712, 1714, 1716, and 1718 of FIG. 17) may be disposed on one side of the antenna structure 1710 facing the second plate. A side surface of the antenna structure 1710 may be connected to the printed circuit board 310 through a connection member 1740. The first part 1510 may be attached face-to-face to the printed circuit board 310 of the electronic device 101.

In one embodiment, connection member 1740 may include a plurality of conductive paths. A plurality of conductive paths may connect the antenna structure 1710 and the printed circuit board 310 (e.g., the board 550 of FIG. 5A), thereby electrically connecting the antenna structure 1710 and the printed circuit board 310. . The printed circuit board 310 and the antenna structure 1710 may be electrically connected to the third RFIC (226). The printed circuit board 310 and the antenna structure 1710 may form beams in different directions to transmit and/or receive signals of a designated frequency.

FIG. 19B is a diagram 1950 showing through holes 1831 to 1838 of the electronic device 101 according to an embodiment.

In one embodiment, the electronic device 101 may include a first glass layer 1810, a second glass layer 1820, a conductive layer 1830, and/or a printed circuit board 1840. The conductive layer 1830 may be disposed between the first glass layer 1810 and the second glass layer 1820.

In one embodiment, the conductive layer 1830 may include a plurality of through holes 1831 to 1838. For example, a plurality of through holes 1831 to 1834 may be disposed in the central portion of the conductive layer 1830. As another example, the plurality of through holes 1835 to 1838 may be disposed in an edge area of the conductive layer 1830 that is closer to the first glass layer 1810 than the second glass layer 1820.

In one embodiment, the plurality of through holes 1831 to 1838 may be implemented as slots. At least some of the through holes or slots can be replaced with a conductive layer 1850 provided separately on the first glass layer 1810 or the second glass layer 1820. For example, the conductive layer 1850 may be implemented on the first glass layer 1810. As another example, the conductive layer 1850 may be formed between the first glass layer 1810 and the internal structure. As another example, the conductive layer 1850 may be implemented on the internal structure separately from the first glass layer 1810. The conductive layer 1850 may be formed to surround a plurality of through holes 1831 to 1838. For example, the conductive layer 1850 is formed between the through holes 1835 to 1838 and the first glass layer 1810 as shown in FIG. 19B to cover at least a portion of the openings of the through holes 1835 to 1838. It can be.

FIG. 20 is a graph 2000 showing impedance bandwidth characteristics of an antenna structure according to an embodiment.

In one embodiment, measure the S-parameter for the structure of a 1x4 antenna in which four through holes are arranged in a straight line among radiators having a straight through hole or slot shape as shown in FIG. 5A or FIG. 19B and/or This may be a simulation result. When measuring S-parameters, the impedance characteristics of the radiator or power feeder can be confirmed.

In one embodiment, the first S-parameter (S1) indicated by a thick line may be a reflection coefficient (S11) characteristic of each of the two through-holes disposed on both left and right edges among the four through-holes. The reflection coefficient characteristics of the through-hole disposed on the left edge and the through-hole disposed on the right edge may be substantially the same.

In one embodiment, the second S-parameter (S2) indicated by a thin line may be a reflection coefficient (S11) characteristic of each of the two through-holes disposed in the central portion among the four through-holes. Reflection coefficient characteristics of each of the two through holes disposed in the central portion may be substantially the same.

In one embodiment, when a plurality of conductive paths connecting the radiator and the power feeder are double arranged when facing the radiator, the impedance characteristics of the radiator or the power feeder can be adjusted.

In one embodiment, when adjusting the impedance characteristics of the radiator or power feeder, the reflection coefficient characteristics of the radiator according to frequency can be adjusted. For example, if the signal has a reflection coefficient of about 10 dB or less at a specified frequency, it can be set to transmit and/or receive the signal without distortion. When the reflection coefficient characteristics are adjusted as shown in the thick solid line in FIG. 20, signals in a frequency band of about 28 GHz or more and about 38.8 GHz or less can be transmitted and/or received. Accordingly, wideband transmission and reception characteristics of the antenna structure can be secured.

FIG. 21 is a graph 2100 showing gain characteristics of an antenna according to an embodiment.

In one embodiment, the electronic device 101 may include a plurality of through holes or slots on one side. For example, the radiation pattern can be measured and/or simulated by forming a plurality of through holes or slots in the +Y direction or at the top. FIG. 21 may show measurement and/or simulation results when the electronic device 101 is viewed from the -X direction.

In one embodiment, the plurality of through holes or slots may have a straight 1x4 through hole or slot structure as shown in FIG. 5A or FIG. 19B. A plurality of through holes or slots may form a vertical polarization component. Figure 21 may be a side view of the entire radiation pattern of a 1x4 array including a plurality of through holes or slots.

In one embodiment, when a signal is fed to a radiator using a plurality of conductive paths, the gain characteristics of the antenna structure can be increased in the radiation direction. For example, in Figure 21, it can be seen that the radiation pattern increases in the Y-axis direction.

In one embodiment, when a plurality of conductive paths are supplied symmetrically with respect to the center of the radiator, a signal radiation pattern may be formed symmetrically. For example, in Figure 21, it can be seen that the radiation pattern is symmetrical about the Y axis.

FIG. 22 is a graph 2200 showing the radiation pattern of an antenna structure according to an embodiment.

In one embodiment, FIG. 22 may show measurement and/or simulation results when the electronic device 101 is viewed from the +Y direction.

In one embodiment, the plurality of through holes or slots may have a straight 1x4 through hole or slot structure as shown in FIG. 5A or FIG. 19B. A plurality of through holes or slots may form a vertical polarization component. Figure 22 may be a front view of the entire radiation pattern of a 1x4 array including a plurality of through holes or slots.

In one embodiment, when a signal is fed to a radiator using a plurality of conductive paths, the gain characteristics of the antenna structure can be increased in the radiation direction. For example, in Figure 22, it can be seen that the radiation pattern increases in the Z-axis direction.

In one embodiment, when a plurality of conductive paths are supplied symmetrically with respect to the center of the radiator, a signal radiation pattern may be formed symmetrically. For example, in Figure 22, it can be seen that the radiation pattern is symmetrical about the Z axis.

The electronic device 101 according to various embodiments includes a first plate (e.g., the first plate 1540 in FIG. 15A) and a second plate facing in the opposite direction to the first plate 1540 (e.g., the first plate 1540 in FIG. 15A). 2 plate 1550), and surrounds the space between the first plate 1540 and the second plate 1550, and is connected to the second plate 1550 or integrated with the second plate 1550. A housing formed and including a side member (e.g., side member 1560 in FIG. 15A) including a first portion (e.g., first portion 510 in FIG. 5A) comprising a conductive material, the side member comprising: The first portion 510 of 1560 has a plurality of through-holes aligned in a first direction substantially parallel to the first plate 1540 (e.g., the X-axis direction in FIG. 5A). ) (e.g., a plurality of through holes 512, 514, 516, and 518 in FIG. 5A), and a housing including a non-conductive material in the through holes 512, 514, 516, and 518, and the space within the space. It is disposed to face the through holes 512, 514, 516, and 518, and has at least one conductive path (e.g., the first to twelfth paths 522, 524, 526, 528, 532, 534, 536 of FIG. 5A). 538, 542, 544, 546, 548) (e.g., the antenna structure 500 of FIG. 5A) and the conductive path (e.g., the first to twelfth paths 522, 524, 526 of FIG. 5A). 528, 532, 534, 536, 538, 542, 544, 546, 548)) and may include a wireless communication circuit (e.g., RFIC 560 of FIG. 5A) electrically connected to the wireless communication circuit.

In one embodiment, the through holes (eg, the plurality of through holes 910 and 920 in FIG. 9) may include a cross shape.

In one embodiment, the through holes 512, 514, 516, and 518 may extend long in the first direction (X-axis direction).

In one embodiment, the conductive paths 522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548, the first path 542, 544, 546, 548, the first A second path (522, 524, 526, 528) extending from one end of the first path (542, 544, 546, 548), and a second path (522, 524, 526, 528) extending from one end of the first path (542, 544, 546, 548). It may include third paths 532, 534, 536, and 538 that extend and are spaced apart from the paths 522, 524, 526, and 528.

In one embodiment, the connections of the first path 542, 544, 546, and 548 (e.g., connections 552, 554, 556, and 558 in FIG. 5A) may be connected to the wireless communication circuit 560. there is.

In one embodiment, when viewed from the outside of the through hole (512, 514, 516, 518), a portion of the second path (522, 524, 526, 528) and the third path (532, 534, 536, 538) ) may overlap with one of the through holes (512, 514, 516, 518).

In one embodiment, the portions of the second paths 522, 524, 526, and 528 are oriented in a second direction (e.g., Y-axis direction in FIG. 5A) substantially perpendicular to the first direction (X-axis direction). extended, and the portion of the third path 532, 534, 536, and 538 may extend in the second direction (Y-axis direction).

In one embodiment, a first conductive pattern (e.g., open stub 621 in FIG. 6) connected to the ends of the second paths 522, 524, 526, and 528, and the third paths 532, 534, It may further include a second conductive pattern (e.g., open stub 631 in FIG. 6) connected to the ends of 536 and 538).

The electronic device 101 according to various embodiments includes a housing including a side member 1560, and a radiator formed on a first portion 510 of the side member 1560 including a conductive material (e.g., a plurality of devices in FIG. 5B). Through holes 512, 514, 516, and 518), and a plurality of power feeders feeding power to the radiators 512, 514, 516, and 518 (e.g., a plurality of power feeders 572, 574 in FIG. 5B). 576, 578), wherein the radiator (512, 514, 516, 518) includes a plurality of through holes (512, 514, 516, 518) arranged in a slot shape, and the through holes (512, 514) , 516, 518), and each of the plurality of feeders (572, 574, 576, 578) has a plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548), and at least two of the plurality of conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) The conductive paths 522 and 532 may be arranged to partially overlap the same through hole 512.

In one embodiment, the at least two conductive paths 522 and 532 arranged to partially overlap the same through hole 512 may transmit an in-phase signal to the same through hole 512. there is.

In one embodiment, including a plurality of power amplifiers (PA) (e.g., the first to eighth power amplifiers 842, 844, 846, 848, 852, 854, 856, and 858 of FIG. 8B) It further includes a wireless communication circuit (e.g., the wireless communication circuit 940 of FIG. 8B), and each of the plurality of power amplifiers 842, 844, 846, 848, 852, 854, 856, and 858 is connected to the plurality of conductive It may be electrically connected to each of the paths 522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, and 548.

In one embodiment, each of the plurality of through holes (e.g., the plurality of through holes 910 and 920 of FIG. 9) moves in a first direction, which is the direction in which the plurality of through holes 910 and 920 are aligned. A first slit extending in the (X-axis direction) (e.g., the first slit 1210 in FIG. 12), and a second slit extending in a second direction (Y-axis direction) perpendicular to the first direction (X-axis direction). It includes 2 slits (e.g., the second slit 1220 in FIG. 12), and the first slit 1210 and the second slit 1220 have different feeders (e.g., the feeder 1262 in FIG. 12A, You can receive urgent power by using 1272)).

In one embodiment, the different feeders 1262 and 1272 include a first feeder 1262 that overlaps the first slit 1210, and a second feeder that overlaps the second slit 1220. It includes 1272, and the first feeder 1262 and the second feeder 1272 can feed signals polarized at different phases.

In one embodiment, each of the plurality of through holes (e.g., the plurality of through holes 1010 and 1020 of FIG. 10) moves in a first direction, which is the direction in which the plurality of through holes 1010 and 1020 are aligned. (X-axis direction) or a third slit (e.g., extending in a third direction (e.g., D3 direction in FIG. 10) that is different from the second direction (Y-axis direction) perpendicular to the first direction (X-axis direction) : the fifth slit 1012 in FIG. 10) and the fourth slit (e.g., the sixth slit in FIG. 10 (e.g., the D4 direction in FIG. 10) extending in the fourth direction perpendicular to the third direction D3 (e.g., the D4 direction in FIG. 10) 1014), and the third slit 1012 and the fourth slit 1014 can receive power using different power feeders 1262 and 1272.

In one embodiment, the third slit 1012 and the fourth slit 1014 form an angle of 45 degrees with the direction in which the plurality of through holes 1010 and 1020 are aligned (X-axis direction) and The slit 1012 and the fourth slit 1014 can receive signals polarized in phases that are 90 degrees different from each other.

The electronic device 101 according to various embodiments includes a first plate 1540, a second plate 1550 facing in an opposite direction to the first plate 1540, and the first plate 1540 and the second plate. A housing surrounding the space between (1550) and including a side member (1560) connected to or formed integrally with the second plate (1550), and a printed circuit disposed within the space. The housing includes a substrate (e.g., the substrate 550 in FIG. 5B), and the housing includes a first part 510 including a conductive material, and the first part 510 has a plurality of through holes 512. , 514, 516, 518), and at least one conductive path (522, 524, 526, 528, 532, 534, 536, 538, 542) disposed to face the through holes (512, 514, 516, 518). , 544, 546, 548), and the conductive paths (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) include the plurality of through holes (512, A first path (542, 544, 546, 548) heading to 514, 516, 518, branched and extended from the first path (542, 544, 546, 548), and the plurality of through holes (512, 514, Includes a second path (522, 524, 526, 528) and a third path (532, 534, 536, 538) that at least partially overlap with the first path (542, 544, 546, 548) ) receives power from a power supply unit included in the printed circuit board 550 (e.g., a plurality of power supply units 572, 574, 576, and 578 in FIG. 5B, and the second path 522, 524, 526, and 528 ) and the third path (532, 534, 536, 538) may supply power to the plurality of through holes (512, 514, 516, 518).

In one embodiment, the plurality of through holes (e.g., the plurality of through holes 910 and 920 in FIG. 9) include a first slit 912 and a first slit 912 arranged perpendicularly to the first slit 912. It includes two slits 914, and the printed circuit board 550 is disposed on a first layer (e.g., the first layer 1140 in FIG. 11B) and at least partially overlaps the first slit 912. 1 is disposed on a power feeder (e.g., the first power feeder 1162 in FIG. 11b), and a second layer (e.g., the first layer 1150 in FIG. 11b) spaced apart from the first layer 1140, and It may include a second power feeder (eg, the fifth power feeder 1172 in FIG. 11B) that at least partially overlaps the second slit 914.

In one embodiment, the plurality of through holes (e.g., the plurality of through holes 1010 and 1020 in FIG. 10) may form an angle of 45 degrees with the edge of the side member 1560.

In one embodiment, the frequencies of signals radiating from the first slit (e.g., the ninth slit 1312 in FIG. 13) and the second slit (e.g., the tenth slit 1314 in FIG. 13) may be different from each other. there is.

In one embodiment, the at least one conductive path (522, 524, 526, 528, 532, 534, 536, 538, 542, 544, 546, 548) is connected to the plurality of through holes (512, 514, 516). , 518) is disposed on the printed circuit board (e.g., the printed circuit board 1610 of FIG. 16), or the printed circuit board 1610 and the wireless communication circuit (e.g., the third RFIC 226 of FIG. 16). ) may be disposed on at least one side of a connecting member (e.g., the connecting member 1740 in FIG. 17) or inside the connecting member 1740.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In this document, “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “A. Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product (computer pro memory product). Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or on two user devices (e.g. : It can be distributed (e.g. downloaded or uploaded) directly or online between smartphones. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single entity or a plurality of entities. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In electronic devices,
Surrounding a first plate, a second plate facing in a direction opposite to the first plate, and a space between the first plate and the second plate, connected to the second plate, or formed integrally with the second plate, , a housing comprising a side member comprising a first portion comprising a conductive material,
The first portion of the side member is:
a plurality of through-holes aligned in a first direction substantially parallel to the first plate; and
a housing containing a non-conductive material in the through holes;
a structure disposed within the space to face the through holes and including at least one conductive path; and
It includes a wireless communication circuit electrically connected to the conductive path,
Each of the plurality of through holes,
first slit; and
It includes a second slit that intersects the first slit,
The first slit and the second slit receive power using different power feeders,
The different feeders are,
a first power feeder that at least partially overlaps the first slit and is disposed on a first layer;
An electronic device comprising a second power feeder that at least partially overlaps the second slit and is disposed on a second layer spaced apart from the first layer. In claim 1,
The first slit and the second slit have a cross shape that intersects each other perpendicularly. In claim 1,
The first slit and the second slit are elongated and extend in different directions. The method of claim 1, wherein the conductive path is:
first path,
a second path extending from one end of the first path, and
An electronic device comprising a third path extending from the end of the first path and being spaced apart from the second path. In claim 4,
The connection portions of the first path are connected to the wireless communication circuit. The method of claim 4, when viewed from outside the through hole,
An electronic device wherein a portion of the second path and a portion of the third path overlap one of the through holes. In claim 6,
the portion of the second path extends in a second direction substantially perpendicular to the first direction,
The portion of the third path extends in the second direction. In claim 4,
a first conductive pattern connected to an end of the second path, and
The electronic device further includes a second conductive pattern connected to an end of the third path. In electronic devices,
A housing including side members;
a radiator formed on a first portion of the side member including a conductive material; and
It includes a plurality of power feeders that feed power to the radiator,
The emitter is,
A plurality of through holes arranged in a slot shape; and
Comprising a non-conductive material disposed within the through holes,
Each of the plurality of power feeders includes a plurality of conductive paths,
At least two conductive paths among the plurality of conductive paths are arranged to partially overlap the same through hole,
Each of the plurality of through holes,
a first slit extending in a first direction; and
It includes a second slit extending in a second direction perpendicular to the first direction,
Each of the plurality of power feeders,
a first power feeder that at least partially overlaps the first slit and is disposed on a first layer;
An electronic device comprising a second power feeder that at least partially overlaps the second slit and is disposed on a second layer spaced apart from the first layer. In claim 9,
The at least two conductive paths arranged to partially overlap the same through hole transmit an in-phase signal to the same through hole. In claim 10,
Further comprising a wireless communication circuit including a plurality of power amplifiers,
An electronic device wherein each of the plurality of power amplifiers is electrically connected to each of the plurality of conductive paths. In claim 9,
The first slit extends in the first direction in which the plurality of through holes are aligned,
The first slit receives power using the first feeder,
The second slit is an electronic device that receives power using the second power feeder. In claim 12,
The first feeder and the second feeder are electronic devices that feed signals polarized in different phases. In claim 9,
Each of the plurality of through holes,
a third slit extending in the first direction, which is the direction in which the plurality of through holes are aligned, or in a third direction, which is a direction different from the second direction perpendicular to the first direction; and
It includes a fourth slit extending in a fourth direction perpendicular to the third direction,
The third slit and the fourth slit receive power using different power feeders. In claim 14,
The third slit and the fourth slit form a 45 degree angle with the direction in which the plurality of through holes are aligned.
An electronic device in which the third slit and the fourth slit receive signals polarized in phases that are different from each other by an angle of 90 degrees. In electronic devices,
a first plate, a second plate facing in a direction opposite to the first plate, and surrounding the space between the first plate and the second plate, connected to the second plate, or formed integrally with the second plate. A housing including side members; and
It includes a first power feeder and a second power feeder, and includes a printed circuit board disposed in the space,
The housing includes a first portion comprising a conductive material,
The first part is,
Includes a plurality of through holes,
Each of the first power feeder and the second power feeder,
At least one conductive path disposed to face the through holes,
The at least one conductive path is,
a first path toward the plurality of through holes;
a second path and a third path branching and extending from the first path and at least partially overlapping the plurality of through holes;
The plurality of through holes receive power through the at least one conductive path,
The plurality of through holes are,
first slit; and
It includes a second slit disposed perpendicular to the first slit,
The first power feeder,
disposed on a first layer and at least partially overlapping the first slit,
The second power feeder,
An electronic device disposed on a second layer spaced apart from the first layer and at least partially overlapping the second slit. delete In claim 16,
The electronic device wherein the plurality of through holes form an angle of 45 degrees with an edge of the side member. In claim 16,
An electronic device in which the frequencies of signals radiating from the first slit and the second slit are different from each other. In claim 16,
The at least one conductive path is,
disposed on the printed circuit board, or
An electronic device disposed on at least one side of or inside the connecting member connecting the printed circuit board and the wireless communication circuit.

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