KR102596020B1 - Heat Dissipation Filler with Improved Heat Dissipation Efficiency and Method for Manufacturing the Same - Google Patents

Abstract

A heat dissipation filler with improved heat dissipation efficiency and a method for manufacturing the same are disclosed.
According to one aspect of this embodiment, a first synthesis process of primarily synthesizing heat dissipation filler particles using a preset material, depending on the ceramic material constituting the heat dissipation filler, and heat dissipation filler particles synthesized according to the first synthesis process. A second synthesis process of secondarily synthesizing a heat dissipation filler by modifying its size and shape, and a coating process of coating the surface of the heat dissipation filler synthesized in the second synthesis process with a silane coupling agent. Provides a filler manufacturing method.

Description

Heat dissipation filler with improved heat dissipation efficiency and method for manufacturing the same {Heat Dissipation Filler with Improved Heat Dissipation Efficiency and Method for Manufacturing the Same}

This embodiment relates to a heat dissipation filler with improved heat dissipation efficiency and a method of manufacturing the same.

The content described in this section simply provides background information for this embodiment and does not constitute prior art.

Recently, as electronic devices such as mobile phones and laptops, which are necessities of our lives, have become smaller and more functional, the heat generated when using the devices has a significant impact on the reliability and durability of the devices.

For this reason, research on efficient heat dissipation is actively underway around the world. As a material for the body, chassis, and heat sink, which make up most of the electronic devices with heat-generating components, the most widely used metal to date is a metal with high thermal conductivity.

However, as devices become thinner and lighter, alternative materials with high thermal conductivity and heat dissipation are required. In particular, polymer composite materials, which have advantages such as lightness, processability, formability, and light weight, are attracting attention as an alternative material.

In order to increase the thermal conductivity of a polymer composite material, there are ways to increase the thermal conductivity in a desired direction by increasing the filling rate of the filler or improving the orientation of the filler. Materials conventionally used as fillers include carbon-based materials such as graphite, CNT, and graphene.

However, these carbon-based materials have the characteristic of absorbing all visible light wavelength bands. Accordingly, when heat insulating materials containing carbon-based materials are used in electronic devices, especially electronic devices including light sources, their performance is reduced.

Accordingly, there is a demand for a heat dissipation filler that has excellent heat dissipation characteristics but does not absorb light in the visible wavelength range.

One embodiment of the present invention aims to provide a heat dissipation filler with excellent heat dissipation characteristics and a method for manufacturing the same while not absorbing light in the visible wavelength range.

According to one aspect of this embodiment, a first synthesis process of primarily synthesizing heat dissipation filler particles using a preset material, depending on the ceramic material constituting the heat dissipation filler, and heat dissipation filler particles synthesized according to the first synthesis process. A second synthesis process of secondarily synthesizing a heat dissipation filler by modifying its size and shape, and a coating process of coating the surface of the heat dissipation filler synthesized in the second synthesis process with a silane coupling agent. Provides a filler manufacturing method.

According to one aspect of this embodiment, the preset material is magnesium acetate tetrahydrate (Mg(CH ₃ COO) ₂ 4H ₂ O) when the ceramic material constituting the heat dissipation filler is magnesium oxide (MgO). Do it as

According to one aspect of this embodiment, the heat dissipating filler particles synthesized according to the first synthesis process are characterized by having a size of several hundred nm.

According to one aspect of this embodiment, the heat dissipating filler particles synthesized according to the first synthesis process are characterized in that they have a spherical or cubic shape.

According to one aspect of this embodiment, the second synthesis process is characterized by increasing the size of the heat dissipating filler particles synthesized according to the first synthesis process to several μm.

According to one aspect of this embodiment, the second synthesis process is characterized in that the heat dissipation filler is collectively synthesized into a spherical shape.

According to one aspect of this embodiment, the silane coupling agent is characterized in that it is any one of phenyl-based, vinyl-based, epoxy-based, methacrylic-based, and amine-based.

According to one aspect of this embodiment, a heat dissipating filler manufactured by the above method is provided.

According to one aspect of this embodiment, the heat dissipation filler is characterized by having a thermal diffusivity of 1.4 mm ² /s or more.

According to one aspect of this embodiment, the heat dissipation filler is characterized by having a thermal diffusivity of 2.75W/(m*K) or more.

As described above, according to one aspect of the present embodiment, there is an advantage in that it does not absorb light in the visible wavelength band and has excellent heat dissipation characteristics.

1 is a flowchart showing a method of manufacturing a heat dissipation filler according to an embodiment of the present invention.
Figure 2 is a flowchart showing a method for primarily synthesizing heat dissipating filler particles according to the first embodiment of the present invention.
Figure 3 is a flowchart showing a method for primarily synthesizing heat dissipating filler particles according to the second embodiment of the present invention.
Figure 4 is a flowchart showing a method for secondary synthesis of heat dissipating filler particles according to an embodiment of the present invention.
Figure 5 is a flowchart showing a method of coating the surface of a heat dissipation filler according to an embodiment of the present invention.
Figure 6 is a diagram showing a scanning electron microscope image of primarily synthesized heat dissipating filler particles according to an embodiment of the present invention.
Figure 7 is a diagram showing a scanning electron microscope image of a secondarily synthesized heat dissipation filler according to an embodiment of the present invention.
Figure 8 is a diagram showing a heat dissipation filler manufactured according to an embodiment of the present invention.
Figure 9 is a graph showing the thermal diffusivity and thermal conductivity of a paint containing a heat dissipation filler and a paint without a heat dissipation filler according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention. While describing each drawing, similar reference numerals are used for similar components.

Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. The term and/or includes any of a plurality of related stated items or a combination of a plurality of related stated items.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "include" or "have" should be understood as not precluding the existence or addition possibility of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. .

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains.

Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

Additionally, each configuration, process, process, or method included in each embodiment of the present invention may be shared within the scope of not being technically contradictory to each other.

1 is a flowchart showing a method of manufacturing a heat dissipation filler according to an embodiment of the present invention.

Heat dissipation filler is included in the paint to improve the heat dissipation characteristics of the paint. The heat dissipating filler is mixed with the materials that make up the paint (e.g., resin, etc.) in a preset ratio to allow the paint to achieve its original purpose, while at the same time improving the heat dissipation characteristics of the composition to which the paint is applied. . The heat dissipating filler may be mixed with the paint components in a ratio of 4 to 5:5 to 6. If the heat dissipation filler is included in more than the corresponding proportion, heat dissipation characteristics are improved, but viscosity and fluidity decrease, so the paint may not fully perform its role. Therefore, the heat dissipation filler manufactured according to the manufacturing method of FIG. 1 improves the heat dissipation characteristics of the paint as it is mixed with the paint components at a preset ratio.

Heat dissipating filler particles are first synthesized (S110). Heat dissipating filler particles are first synthesized using preset materials suitable for the ceramic material constituting the heat dissipating filler. Here, the ceramic material constituting the heat dissipation filler may be magnesium oxide (MgO), aluminum oxide (Al ₂ O ₃ ), or silicon dioxide (SiO ₂ ), and precursors to be described later are selected accordingly and primarily used as heat dissipation filler particles. It is synthesized. The heat dissipating filler particles that are primarily synthesized have a size of several hundred nm and have a spherical or cubic shape. The primary synthesis of heat dissipating filler particles is carried out by the method of FIG. 2 or FIG. 3.

Figure 2 is a flowchart showing a method for primarily synthesizing heat dissipating filler particles according to the first embodiment of the present invention.

The heat dissipating filler precursor is completely dissolved in the alcoholic solvent at room temperature (S210). Dissolution of the heat dissipating filler precursor proceeds until it is saturated in the alcoholic solvent (e.g., ethanol, etc.) at room temperature. Here, the heat dissipation filler precursor is implemented as metal alkoxide, metal acetate, metal chloride, or metal nitrate, and the type of metal is determined depending on the ceramic material constituting the heat dissipation filler. For example, when the heat dissipating filler is magnesium oxide, the heat dissipating filler precursor may be implemented as magnesium alkoxide, magnesium acetate, magnesium chloride, or magnesium nitrate, or as their respective hydrates. there is. When the heat dissipation filler is aluminum oxide (Al ₂ O ₃ ) or silicon dioxide (SiO ₂ ), the heat dissipation filler precursor is replaced with aluminum or silicon (Si) instead of magnesium.

After adjusting the pH within a preset range using ammonia water, it is stirred in the preset first environment (S220). After dissolving the heat dissipating filler precursor in an alcoholic solvent, aqueous ammonia is additionally added. Aqueous ammonia acts as a catalyst and at the same time adjusts the pH of the solution within a preset range. Here, the preset range may be 6.5 to 8.5, and as the pH increases, the size of the heat dissipating filler particles to be primarily synthesized increases.

After adjusting the pH of the solution using ammonia water, stirring is performed in a preset first environment. Here, the preset first environment may be an environment in which stirring is performed for approximately 24 hours at room temperature.

The stirred solution is centrifuged to separate only the product from the solvent (S230). After stirring is performed in a preset first environment, the stirred solution is centrifuged. Centrifugation can be performed for 5 minutes at a rotation speed of around 8000 rpm, and the solvent and product are separated using centrifugation.

The separated product can be further purified using ethanol or isopropanol. By purifying the separated product at least once using ethanol or isopropanol, residues other than the separated product can be removed.

Dry the product in a vacuum oven (S240). After separation of the solvent is completed and the product (heat dissipating filler particles) that has been further purified is placed in a vacuum oven and dried. Drying can take place for several tens of minutes at a temperature of around 100°C.

The dried product is pulverized (S250). After the above-described drying process is performed, the dried product (heat dissipating filler particles) is pulverized. Agate grinding can be used for pulverization, and thus the dried product (heat dissipating filler particles) can be pulverized into powder form.

The pulverized product is heat treated in a preset second environment (S260). Heat treatment is performed on the pulverized product (heat dissipating filler particles) in powder form. Here, the preset second environment may be an environment in which a temperature of 600 to 800° C. is applied for several hours. In this way, when the pulverized product is exposed to the preset second environment, organic matter (acetate) around the magnesium particles is volatilized, oxygen is combined with the magnesium particles, and magnesium oxide (heat dissipation filler particles) is produced.

In addition, because centrifugation is performed to separate only the product and drying is performed, the magnesium oxide (heat dissipating filler particles) produced through heat treatment alone has a spherical shape.

Through the above-described process, spherical heat dissipating filler particles are primarily synthesized.

The method of first synthesizing heat dissipating filler particles can also be carried out through the process shown in FIG. 3.

Figure 3 is a flowchart showing a method for primarily synthesizing heat dissipating filler particles according to the second embodiment of the present invention.

Dissolve a preset amount of heat dissipation filler precursor in distilled water (S310). Any one of the above-mentioned heat dissipation filler precursors is dissolved in distilled water at an amount of 10 wt%.

Impregnate the solution and MCC in a 1:1 ratio (S320). The heat dissipating filler precursor solution is impregnated with MCC (Micro Crystalline Cellulose) at a 1:1 weight ratio.

The solution impregnated with MCC is dried in a preset first environment (S330). The MCC-impregnated solution is dried in an oven under a preset first environment. Here, the preset first environment may be an environment in which a temperature of around 120°C is applied for several hours.

The dried product is calcined at a preset first temperature in a crucible (S340). The dried product is charged into a crucible and calcined at a preset first temperature. Here, the preset first temperature may be around 500°C. When the preset first temperature is provided, the MCC is removed. At this time, as the MCC is removed, the heat dissipating filler precursor impregnated in the fine pores contained within the MCC is formed into heat dissipating filler particles. For example, when the heat dissipating filler precursor is magnesium nitrate, the heat dissipating filler particles formed may be magnesium oxide (powder).

After calcination, it is fired at a preset second temperature (S350). The heat dissipating filler particles formed through the calcination process are fired at a preset second temperature, 500 to 1000°C, and are primarily synthesized in a cubic shape.

Heat dissipating filler particles primarily synthesized according to the above-described process are shown in FIG. 6.

Figure 6 is a diagram showing a scanning electron microscope image of primarily synthesized heat dissipating filler particles according to an embodiment of the present invention.

Referring to FIG. 6, the primarily synthesized heat dissipating filler particles have a certain shape (illustrated as a sphere in FIG. 6) and have a size of several hundred nm. As shown in FIG. 6, the primarily synthesized heat dissipating filler particles may have a size of approximately 300 nm.

Referring again to FIG. 1, heat dissipating filler particles are secondarily synthesized (S120). Heat dissipating filler particles are secondarily synthesized using the primary synthesized heat dissipating filler particles. As the heat dissipating filler particles are secondarily synthesized, the size of the particles increases to approximately several μm and the shape can be uniformly synthesized into a spherical shape. Secondary synthesis of heat dissipating filler particles is carried out by the method in FIG. 4.

Figure 4 is a flowchart showing a method for secondary synthesis of heat dissipating filler particles according to an embodiment of the present invention.

The primarily synthesized heat dissipating filler particles are dispersed in water in a preset amount (S410). 5 to 50% by weight of the primarily synthesized heat dissipating filler particles are dispersed in water.

The mixture in which the heat-radiating filler particles are dispersed is sprayed into a drying chamber having a preset temperature (S420). The mixture in which the heat-radiating filler particles are dispersed is sprayed into the drying chamber using a spray, etc. At this time, the hay chamber may be a chamber in which an air stream having a temperature of 150 to 200° C. is supplied inside, and the air stream has a temperature of 150 to 200° C.

The mixture in which the heat dissipating filler particles are dispersed is dried (S430). As the mixture dries, the heat dissipating filler particles, which have a size of several hundred nm through primary synthesis, uniformly increase in size to several μm and are synthesized in the form of spherical particles.

The heat dissipation filler secondarily synthesized according to the above-described process is shown in FIG. 7.

Figure 7 is a diagram showing a scanning electron microscope image of a secondarily synthesized heat dissipation filler according to an embodiment of the present invention.

Referring to FIG. 7, the secondarily synthesized heat dissipating filler particles have a spherical shape and a size of several μm.

Referring again to FIG. 1, the surface of the heat dissipation filler is coated (S130). A silane coupling agent is coated on the surface of the heat dissipation filler. When coating treatment is performed, the heat dissipation filler that is finally manufactured can increase the interfacial adhesion with the components that make up the paint, and when mixed with the corresponding components, it can reduce the viscosity of the mixture and improve fluidity, thereby improving heat conduction. It can be improved. In addition, the ceramic material that makes up the heat dissipation filler can react with moisture in the air and hydrolyze, and surface coating treatment can block moisture contact, improving the durability of the heat dissipation filler or paint mixed with heat dissipation filler. . The coating treatment of the heat dissipating filler is carried out by the method shown in FIG. 5.

Figure 5 is a flowchart showing a method of coating the surface of a heat dissipation filler according to an embodiment of the present invention.

The silane coupling agent is mixed with an organic solvent and then hydrolyzed by adding a catalyst (S510). The silane coupling agent includes phenyl-based, vinyl-based, epoxy-based, methacrylic-based or amine-based materials. This silane coupling agent is mixed with an organic solvent. Mixing the silane coupling agent with the organic solvent can be carried out while stirring in a preset environment (at a temperature of around 70°C for several tens of minutes). Based on 100 mL of organic solvent, the silane coupling agent may be mixed in a volume of 1 to 3 g.

At this time, when mixing the two, a catalyst may be added together. The catalyst may be an acid or a base, and typically may be ammonia water. A catalyst is added together with the protons, and stirring proceeds in the above-described environment. Since the silane coupling agent is mixed with the catalyst and the organic solvent, hydrolysis proceeds. When 28% concentration of ammonia water is added as a catalyst, the catalyst may be added in an amount of 1 to 5 g based on 100 mL of organic solvent.

The heat dissipating filler prepared in the hydrolyzed solution is added and stirred (S520). Heat dissipating filler is added into the hydrolyzed solution and stirred. Stirring may be carried out in a preset second environment (for about 12 hours at a temperature of about 70° C.). The heat dissipating filler prepared in the hydrolyzed solution is added and stirred, and the condensation reaction proceeds. A condensation reaction proceeds, and coating treatment is performed on the surface of the heat dissipation filler. Based on 100 mL of organic solvent, the heat dissipating filler to be added can be mixed in an amount of 1 to 10 g.

The stirred solution is centrifuged and washed (S530). Centrifugation is performed to separate the product in the solution stirred with the addition of heat dissipation filler from the solvent. Centrifugation can be performed for 5 minutes at a rotation speed of around 8000 rpm, and the heat dissipating filler coated on the surface is separated from the solvent.

Additional purification can be performed using ethanol or isopropanol on the separated heat dissipation filler. By purifying the separated heat dissipation filler at least once using ethanol or isopropanol, residues other than the separated product can be removed. Ethanol or isopropanol to be used for purification may be used in an amount of 10 to 50 mL per 1 g of heat dissipation filler.

The washed product is dried in a preset environment (S540). After the heat dissipating filler coated on the surface is cleaned, it is dried for several hours at a temperature of around 90°C using a drying oven. As drying progresses, a heat dissipation filler with a size of several micrometers coated on the surface is finally produced. The heat dissipation filler manufactured in this way has excellent heat dissipation characteristics as shown in FIG. 8.

Figure 8 is a graph showing the thermal diffusivity and thermal conductivity of a paint containing a heat dissipation filler and a paint without a heat dissipation filler according to an embodiment of the present invention. The thermal diffusivity and thermal conductivity of the paint according to an embodiment of the present invention are those of the paint containing a heat dissipation filler when magnesium oxide is contained as much as 80% by weight.

Referring to FIG. 8, the paint including a heat dissipation filler according to an embodiment of the present invention has a maximum thermal diffusivity of 1.710 mm ² /s and a thermal conductivity of up to 3.637 W/(m*K). On the other hand, the paint that does not contain a heat dissipation filler according to an embodiment of the present invention has a thermal diffusivity of up to 0.165 mm ² /s and a thermal conductivity of up to 0.229 W/(m*K). In other words, it can be seen that the thermal conductivity of the paint containing a heat dissipating filler according to an embodiment of the present invention increases by about 11 to 18 times, and the thermal diffusivity increases by about 11 to 14 times, compared to a typical paint that does not. Based on this, it can be confirmed that when the heat dissipation filler according to an embodiment of the present invention is included in the paint, the heat dissipation characteristics are significantly improved compared to paints that are not.

Referring again to FIG. 1, the heat dissipation filler manufactured in this way is manufactured as shown in FIG. 9.

Figure 9 is a diagram showing a heat dissipation filler manufactured according to an embodiment of the present invention.

Ceramic materials such as magnesium oxide are implemented into a sphere several micrometers in size, and the surface of the spherical ceramic material is coated with a silane coupling agent.

The manufactured heat dissipation filler is mixed with the components of the paint at a preset ratio and can be manufactured into a paint.

However, the heat dissipation filler manufactured according to an embodiment of the present invention is limited to being included in the paint, but is not necessarily limited thereto, and can be mixed with any object that requires heat dissipation to improve heat dissipation characteristics. there is.

In Figures 1 to 5, each process is described as being sequentially executed, but this is merely an illustrative explanation of the technical idea of an embodiment of the present invention. In other words, a person skilled in the art to which an embodiment of the present invention pertains can change the order depicted in each drawing or perform one or more of the processes without departing from the essential characteristics of an embodiment of the present invention. Since various modifications and variations can be applied by executing in parallel, FIGS. 1 to 5 are not limited to the time series order.

Meanwhile, the processes shown in Figures 1 to 5 can be implemented as computer-readable codes on a computer-readable recording medium. Computer-readable recording media include all types of recording devices that store data that can be read by a computer system. That is, computer-readable recording media include storage media such as magnetic storage media (eg, ROM, floppy disk, hard disk, etc.) and optical read media (eg, CD-ROM, DVD, etc.). Additionally, computer-readable recording media can be distributed across networked computer systems so that computer-readable code can be stored and executed in a distributed manner.

The above description is merely an illustrative explanation of the technical idea of the present embodiment, and those skilled in the art will be able to make various modifications and variations without departing from the essential characteristics of the present embodiment. Accordingly, the present embodiments are not intended to limit the technical idea of the present embodiment, but rather to explain it, and the scope of the technical idea of the present embodiment is not limited by these examples. The scope of protection of this embodiment should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of rights of this embodiment.

Claims (10)

A first synthesis process of primarily synthesizing heat dissipating filler particles using a preset material, depending on the ceramic material constituting the heat dissipating filler;
a second synthesis process of secondarily synthesizing a heat dissipation filler by modifying the size and shape of the heat dissipation filler particles synthesized according to the first synthesis process; and
It includes a coating process of coating a silane coupling agent on the surface of the heat dissipation filler synthesized in the second synthesis process,
The first synthesis process is,
A dissolution process of dissolving a heat dissipating filler precursor implemented as any one of magnesium alkoxide, magnesium acetate, and magnesium chloride in an alcoholic solvent at room temperature;
A stirring process of adjusting the pH within the range of 6.5 to 8.5 using aqueous ammonia and then stirring in a preset first environment;
A separation process of centrifuging the stirred solution to separate only the product from the solvent;
A purification process of purifying the separated product using ethanol or isopropanol;
Drying process of drying the product in a vacuum oven;
A grinding process of grinding the dried product; and
A heat dissipation filler manufacturing method comprising a heat treatment process of heat treating the pulverized product in an environment where a temperature of 600 to 800° C. is applied for several hours. delete According to paragraph 1,
The heat dissipating filler particles synthesized according to the first synthesis process are,
A method of manufacturing a heat dissipating filler, characterized in that it has a size of several hundred nm. According to paragraph 1,
The heat dissipating filler particles synthesized according to the first synthesis process are,
A method of manufacturing a heat dissipating filler, characterized in that it has a spherical or cubic shape. According to paragraph 3,
The second synthesis process is,
A method of manufacturing a heat dissipating filler, characterized in that the size of the heat dissipating filler particles synthesized according to the first synthesis process is increased to several μm. According to paragraph 4,
The second synthesis process is,
A method of manufacturing a heat dissipation filler, characterized in that the heat dissipation filler is collectively synthesized into a spherical shape. According to paragraph 1,
The silane coupling agent,
A method of manufacturing a heat dissipating filler, characterized in that the silane coupling agent is any one of phenyl-based, vinyl-based, epoxy-based, methacrylic-based and amine-based. A heat dissipating filler manufactured by the manufacturing method of any one of claims 1 and 3 to 7.


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