KR102594214B1 - Treatment agent for preventing precipitation outside of metal pattern, and production method for printed wiring board and package using the same - Google Patents

Abstract

(Problem) On the premise of using hydrogen peroxide, which directly contributes to the inactivation of Pd residues, the deterioration of the treatment agent over time, specifically the consumption of hydrogen peroxide in the alkaline region, is suppressed, and the dissolution of the underlying metal is suppressed. Provides a treatment agent for preventing out-of-pattern precipitation in electroless plating that can remove Pd residues that cause out-of-pattern precipitation in electroless plating.
(Solution) The treatment agent for preventing precipitation other than metal patterns of the present invention contains hydrogen peroxide and one or more compounds selected from the group consisting of aldose, aldonic acid, aldalic acid, salts thereof, and lactone bodies thereof, and has a pH of 7.1 or higher. There is a characteristic in

Description

Anti-precipitation treatment agent for metal patterns, and method for manufacturing printed wiring boards and packages using the same {TREATMENT AGENT FOR PREVENTING PRECIPITATION OUTSIDE OF METAL PATTERN, AND PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PACKAGE USING THE SAME}

The present invention relates to a treatment agent for preventing metal pattern precipitation and a method for manufacturing printed wiring boards and packages using the same. In particular, it relates to a treatment agent for preventing precipitation outside the metal pattern, which removes and inactivates Pd residues that cause precipitation outside the metal pattern, and a method for manufacturing printed wiring boards and packages using the treatment agent.

Printed wiring on a substrate is generally obtained by forming a metal pattern on a substrate and repeatedly forming another metal film. For example, a Cu pattern is formed as the metal pattern on a substrate, and a Ni film is formed as the other metal film by selectively plating Ni only on the Cu pattern.

In this case, first, in order to form a Cu pattern, a palladium catalyst core is formed as a plating catalyst core on the substrate (plating catalyst treatment), and then electroless Cu plating treatment is performed. After that, the necessary conductor circuit patterns are masked and the unnecessary portions are etched. By this etching, unnecessary portions of Cu and palladium catalyst cores are removed, but palladium catalyst cores may partially remain (hereinafter, palladium attached to points other than the metal pattern may be referred to as “Pd residue”). . In this state, if electroless Ni plating, etc. in the next step is performed, there is a problem that the Ni plating, etc. is performed at unintended points.

Therefore, in general, after forming the Cu pattern, excess palladium adhering to areas other than the Cu pattern is removed, and then the next step of electroless plating (for example, electroless Ni plating, etc.) is performed. As a treatment agent used in this Pd residue removal process, the following methods have been proposed so far.

First, it is a treatment agent that dissolves Pd residues. For example, Patent Document 1 proposes removing unnecessary electroless plating catalysts using a solution containing at least one selected from thiocyanate, thiosulfate, cyanide compound, sulfite, and permanganate as a main component. However, in this method, since excessive treatment is performed to achieve a sufficient Pd residue removal effect, there is a problem such as dissolution of the Cu pattern, which is the base metal. The second is a treatment agent that deactivates Pd residues by adsorbing an inhibitor on the Pd residues. However, this method has problems such as non-adhesion of subsequent plating, unevenness, and deterioration in properties due to the adsorbed treatment agent.

The third is a treatment agent that inactivates Pd residues by oxidizing them with hydrogen peroxide and converting them into palladium oxide. Hereinafter, it is referred to as “removing Pd residues,” including inactivation of these Pd residues. For example, Patent Document 2 discloses a plating catalyst core removal method in which the plating catalyst core formed on the resin surface is oxidized and the oxidized plating catalyst core is dissolved and removed. It is also disclosed that the plating catalyst core is oxidized using an oxidizing agent containing at least one of permanganate, chromate, hydrogen peroxide, perchlorate, chlorate, chlorite, and peroxoate as a main component. Although this method does not cause the above-mentioned plating non-adherence, unevenness, or deterioration of properties, when the hydrogen peroxide is used in an alkaline environment, the consumption of the hydrogen peroxide is significant, that is, the treatment agent deteriorates over time. Because of this, there are problems such as not being able to withstand practical use.

Japanese Patent Publication No. 8-139435 Japanese Patent Publication No. 2001-342574

The present invention was made with attention to the above-mentioned circumstances, and its purpose is to suppress deterioration over time, suppress dissolution of metal patterns such as Cu, which are the underlying material, and remove Pd, which is a source of precipitation outside the pattern of electroless plating. The object is to provide an anti-precipitation treatment agent other than metal patterns that can sufficiently remove (deactivate) residues. Hereinafter, the “metal out-of-pattern precipitation prevention treatment agent” of the present invention may be referred to as the “out-of-pattern precipitation prevention treatment agent” or simply as “treatment agent.”

The metal pattern precipitation prevention treatment agent of the present invention, which was able to solve the above problems, contains hydrogen peroxide and one or more compounds selected from the group consisting of aldose, aldonic acid, aldalic acid, salts thereof, and lactone bodies thereof, and has a pH of 7.1. It is characterized by being more than one thing.

The compound preferably has 3 to 6 carbon atoms in the case of the aldose and aldonic acid, and 4 to 6 carbon atoms in the case of the aldalic acid. It is more preferable that the above compound has at least either 5 or 6 carbon atoms.

Additionally, in the present invention, a method for manufacturing a printed wiring board using the above-described metal pattern precipitation prevention treatment agent is specified. The manufacturing method of the printed wiring board is a method of manufacturing a printed wiring board by performing an electroless plating treatment on a base material on which a metal pattern is formed, wherein the base material on which the metal pattern is formed is brought into contact with a treatment agent for preventing precipitation outside the metal pattern. It is characterized by including at least a plating process and an electroless plating treatment process in this order. After the step of contacting the metal pattern with a precipitation prevention treatment agent, it is preferable to perform the step of treating with a solution containing a cyan compound, and then perform the electroless plating treatment step.

In the present invention, a method of manufacturing a package using a precipitation prevention treatment agent other than the metal pattern described above is also specified. The method of manufacturing the package is a method of manufacturing a package by performing electroless plating on a base material on which a metal pattern is formed, including a step of contacting the base material on which the metal pattern is formed with a precipitation prevention treatment agent other than the metal pattern, and electroless plating. It is characterized by including at least the plating process in this order. After the step of contacting the metal pattern with a precipitation prevention treatment agent, it is preferable to perform the step of treating with a solution containing a cyan compound, and then perform the electroless plating treatment step.

By using the treatment agent for preventing out-of-pattern precipitation of the present invention, deterioration of the solution over time, specifically rapid consumption of hydrogen peroxide in the alkaline region, is suppressed, thus eliminating the need to remove Pd residues that cause out-of-pattern precipitation. This can be carried out effectively while suppressing dissolution of the phosphorus metal pattern.

Figure 1 is a diagram showing the deterioration of hydrogen peroxide over time according to the presence or absence and type of the compounds of the examples.
Figure 2 is a diagram showing the deterioration of hydrogen peroxide over time according to the presence or absence and type of the compound of the comparative example.

The present inventors have conducted extensive research to solve the above problems. Ultimately, for the purpose of forming an electroless plating film that does not precipitate outside the metal pattern and has a good appearance, a treatment agent used in the out-of-pattern precipitation prevention treatment performed before the electroless plating treatment was examined. Hereinafter, the processing agent of this invention is demonstrated.

First, the treatment agent of the present invention uses hydrogen peroxide in an alkaline region to remove Pd residues. Hydrogen peroxide causes a reaction to generate oxygen in the alkaline region, and the Pd residue is oxidized and inactivated by this oxygen. Since this reaction is catalyzed by Pd residues, it occurs selectively on Pd residues and can efficiently deactivate Pd residues. Additionally, Pd residues can be removed without dissolving the underlying metal pattern, for example, the Cu pattern.

However, as described above, when hydrogen peroxide is used in an alkaline region, hydrogen peroxide is violently consumed by self-decomposition, that is, deterioration over time is significant, making it unusable for practical use. Therefore, intensive research was conducted to obtain a treatment agent that can be used practically by suppressing the deterioration of the treatment agent over time, specifically the consumption of hydrogen peroxide in the alkaline region, and continuously exhibiting the Pd residue removal effect of the hydrogen peroxide. It was carried out.

As a result, it was found that one or more compounds selected from the group consisting of aldose, aldonic acid, aldalic acid, their salts, and their lactone bodies should be contained together with the hydrogen peroxide, and the present invention was completed.

As the aldose and the aldonic acid, those having 3 to 6 carbon atoms are preferably used. Specifically, the aldoses include glycelaldehyde with 3 carbon atoms, erythrose and threonose with 4 carbon atoms, ribose, arabinose, xylose, and lyxose with 5 carbon atoms, and allose and altrose with 6 carbon atoms. , glucose, mannose, gulose, idose, galactose, and talose. As the aldonic acid, glyceric acid with 3 carbon atoms, erythronic acid with 4 carbon atoms, threonic acid, ribbon acid with 5 carbon atoms, arabinonic acid, xylonic acid, lixonic acid, alonic acid with 6 carbon atoms, altronic acid, gluconic acid, mannonic acid, Examples include gulonic acid, idonic acid, galactonic acid, and talonic acid. As the aldalic acid, one having 4 to 6 carbon atoms is preferably used. Specifically, erythraric acid, trearic acid with 4 carbon atoms, ribaric acid, arabinal acid, xylaric acid with 5 carbon atoms, alalic acid with 6 carbon atoms, altraric acid, glucaric acid, mannaric acid, idaric acid, and galac. Tar acid can be mentioned. The above aldoses and the like can be used without distinction between stereoisomers.

Additionally, salts thereof can be used. Examples of salts include alkali metal salts such as Na and K, and alkaline earth metal salts such as Ca and Mg. Furthermore, lactone forms of these compounds can also be used.

Among the above compounds, compounds having 5 and 6 carbon atoms are more preferable. That is, as aldoses, ribose, arabinose, xylose, and lyxose having 5 carbon atoms, and allose, altrose, glucose, mannose, gulose, idose, galactose, and tallose having 6 carbon atoms are more preferable. As aldonic acids, more preferred are ribbon acid, arabinonic acid, xylonic acid, and lixonic acid having 5 carbon atoms, and alonic acid, altronic acid, gluconic acid, mannonic acid, gulonic acid, idonic acid, galactonic acid, and talonic acid having 6 carbon atoms. As aldalic acid, ribaric acid, arabinalic acid, and xylaric acid having 5 carbon atoms, and alalic acid, altaric acid, glucaric acid, mannaric acid, idaric acid, and galactaric acid having 6 carbon atoms are more preferable. Additionally, salts thereof can be used. Furthermore, lactone forms of these compounds can also be used.

The concentration of the compound may vary depending on the amount of hydrogen peroxide as described below, but can be, for example, 0.0007 mol/L or more, further 0.010 mol/L or more, and further 0.07 mol/L or more. Moreover, even if the content of the compound is too large, the effect is saturated, so the upper limit of the content of the compound is about 7 mol/L. The upper limit can be set to 2 mol/L or less, and can further be set to 1 mol/L or less. For example, when sodium gluconate is used as the above compound, the sodium gluconate concentration can be set to 0.07 mol/L.

In the present invention, hydrogen peroxide is essential as described above. The concentration of hydrogen peroxide can be, for example, 0.03 mol/L or more. The concentration of the hydrogen peroxide can be further 0.10 mol/L or more, and even 0.50 mol/L or more. Additionally, even if there is too much hydrogen peroxide, the effect is saturated, so the upper limit of the content is about 30 mol/L. This upper limit can be further set to 20 mol/L or less, and can further be set to 10 mol/L or less.

The processing agent according to the present invention is premised on being alkaline, and its pH is 7.1 or higher. If the pH is lower than this, the effect of hydrogen peroxide in removing the Pd residue is not sufficiently exerted. pH is preferably 7.5 to 10. The treatment agent of the present invention is preferably controlled to a predetermined pH by adding water to the above compound and hydrogen peroxide and adding a pH adjuster. The type of pH adjuster is not particularly limited as long as it can be adjusted to the alkaline range described above. For example, sodium hydroxide, sulfuric acid, etc. can be used. In the present invention, the preferable content of the pH adjuster relative to the total amount of the treatment agent may be appropriately controlled according to the composition of the treatment agent so that a desirable pH is obtained.

Next, a method for manufacturing a printed wiring board and package using the above treatment agent will be described.

The manufacturing method of the printed wiring board and package of the present invention is a method of manufacturing a printed wiring board or package by subjecting a substrate on which a metal pattern is formed to electroless plating to form another metal film on the metal pattern. As,

A substrate on which the metal pattern is formed,

(i) A process of contacting a metal pattern with a precipitation prevention treatment agent,

(ii) Electroless plating process for forming other metal films

It is characterized by including at least in this order.

The metal constituting the metal pattern, that is, the conductor circuit, may be any commonly used metal, and examples include Cu, W, Mo, Ag, Al, or alloys using these as a base. Among these, it is preferable to use Cu or Cu alloy, which has high conductivity and can keep costs down.

Hereinafter, the case where a Cu pattern is formed as the metal pattern using an electroless plating method and a Ni film is formed as the other metal film will be described as an example.

The conditions for forming the metal pattern using the electroless plating method may be those generally used. For example, when forming a Cu pattern, a palladium catalyst core is formed as a plating catalyst core on a substrate (plating catalyst treatment), and then electroless Cu plating treatment is performed. After that, the necessary conductor circuit patterns are masked and the unnecessary portions are etched. Next, as in the following process, the substrate on which the Cu pattern is formed is brought into contact with a treatment agent for preventing precipitation other than the metal pattern.

(i) Process of contacting the metal pattern with a precipitation prevention treatment agent

Using the treatment agent of the present invention, precipitation prevention treatment is performed on areas other than the metal pattern (i.e., other than the Cu pattern). The treatment agent of the present invention may be brought into contact with the surface of the substrate on which the Cu pattern is formed, for example, by immersion or the like.

The liquid temperature of the processing agent is not particularly limited, and can be, for example, within the range of 0 to 80°C. It is especially preferable that it is within the range of 25 to 60°C. In order to increase the liquid temperature, heating may be performed by indirect heating using a water bath or direct heating using a heater, as implemented in the examples described later.

The contact time with the processing agent (in the case of immersion, the immersion time with the processing agent) is preferably 1 minute or more and 30 minutes or less. This is because the treatment is not sufficiently performed for less than 1 minute, and Pd residue is likely to remain. On the other hand, if it is too long, productivity will decrease, so it is better to set it to 30 minutes or less as described above.

Preferably, after step (i), a step of treatment with a solution containing a cyan compound is performed, and then the electroless plating step of step (ii) is performed. As a process of treating with a solution containing this cyanide compound, for example, a solution containing 0.01 to 1.5 mol/L of a cyanide compound such as potassium cyanide and having a liquid temperature of, for example, 0 to 80°C, for example, Examples include immersion for more than 1 minute and less than 30 minutes.

(ii) Electroless plating process for forming other metal films

In order to form another metal film, for example a Ni film, on the substrate on which the Cu pattern, etc. is applied, after the precipitation prevention treatment outside the metal pattern (preferably further, with a solution containing a cyan compound) After the processing step), electroless Ni plating treatment is performed. The conditions of this process are not particularly limited, and processes that are generally implemented can be adopted.

In the method for manufacturing a printed wiring board or package of the present invention, processes other than those described above may be adopted, without particular regard to processes that are generally implemented. For example, as a treatment before performing the electroless Ni plating treatment, a degreasing step of degreasing the surface by immersing it in a degreasing solution that is an acidic or alkaline solution at, for example, 65°C for 5 minutes. ； A soft etching process in which the substrate surface is lightly roughened (soft etched) with an etching solution such as sulfuric acid or sodium persulfate, and then the residue remaining on the surface is removed using an acid cleaning solution such as sulfuric acid; a known method A pickling process to be performed; a process of forming a palladium catalyst core for forming electroless Ni plating, etc. may be performed in order. In addition, as a method of manufacturing the package, methods generally practiced as the method of mounting the printed wiring board and the resin encapsulation method can be adopted.

The treatment agent for preventing precipitation outside the metal pattern of the present invention is used not only on a substrate on which a Cu pattern is applied as exemplified above, but also on the Ni film, for example, after forming the Ni film. It can also be used when forming another metal film, for example, a gold film. That is, the substrate on which the Ni film was formed was treated with the above treatment agent before further electroless gold plating to form another metal film (gold film), and the residue of Pd used for the electroless Ni plating treatment was removed. can also be removed.

Example

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not originally limited by the following examples, and may be implemented with appropriate changes within the scope suitable for the previous and latter purposes. Of course, it is possible, and they are all included in the technical scope of the present invention. Additionally, in the examples, a Cu pattern is formed as the metal pattern, but the present invention is also applicable to patterns of metals other than Cu.

[Example 1]

In Example 1, the relationship between the type of compound and the hydrogen peroxide consumption rate was examined.

In detail, the hydrogen peroxide consumption rate was determined by the following procedure.

1. Into each beaker, 0.07 mol/L of the compounds in Table 1 were added, and deionized water (DI water) was added to completely dissolve them.

2. To the solution in 1 above, hydrogen peroxide was added to a concentration of 3 mol/L, sodium hydroxide was further added to adjust the pH to 9, and deionized water was added to match the liquid level of each beaker.

3. The beaker of 2 above was placed in a water bath set at 40°C, the liquid temperature was set to 40°C, and the beaker was left at 40°C for 6 hours. Then, the ratio of the hydrogen peroxide concentration when the above-mentioned hydrogen peroxide concentration: 3 mol/L was 100% was measured every 1 hour (1h) from the start of leaving until 6 hours (6h). The results are shown in Figures 1 and 2. Additionally, the hydrogen peroxide consumption rate after standing for 6 hours was determined. This hydrogen peroxide consumption rate was obtained from the formula: 100 The results are shown in Table 1.

[Table 1]

From Table 1, Figures 1 and 2, the following can be seen. That is, it can be seen that when the compound of the present invention is used, almost no consumption of hydrogen peroxide occurs even after the start of leaving, and more than 80% of hydrogen peroxide is present even after 6 hours. In particular, the compounds of Examples 1 to 8 in Table 1 were hardly consumed, with a hydrogen peroxide consumption rate of 1% even after 6 hours. It can be seen that when the compound specified in the present invention is used together with hydrogen peroxide, the effect of hydrogen peroxide in removing the Pd residue can be continuously exerted without deterioration over time. Additionally, from the results in Figure 1, it can be seen that higher effects are obtained when the carbon number of the compound is higher.

On the other hand, in the case of a blank to which no compound was added (Comparative Example 1), as shown in Figures 1 and 2, consumption of hydrogen peroxide began immediately after the start of leaving, and after 3 hours (3h), the hydrogen peroxide was below 50%. , 70% was consumed after 6 hours. Moreover, from the results in FIG. 2, in the case of Comparative Examples 2 to 5, as in the case of the blank of Comparative Example 1, consumption of hydrogen peroxide begins immediately after the start of leaving, reaching less than 50% after 3 hours, and 70% after 6 hours. I was spent. That is, as in Comparative Example 2 and Comparative Example 3, there was no effect in citric acid or acetic acid containing carboxylic acid. Also, although not shown in Table 1 and Figure 2, formic acid was also ineffective. From this, it can be seen that the effect is not obtained with carboxylic acids other than saccharides. Also, as shown in Comparative Example 4, no effect was obtained even when glutaric acid with 5 carbon atoms was used, which has carboxylic acid but no hydroxyl group. Additionally, as shown in Comparative Example 5, the effect was not obtained even with alditols such as glucitol, which have a hydroxyl group but do not have an aldehyde group or a carboxyl group.

[Example 2]

In Example 2, sodium gluconate was used as the compound, and the concentration, hydrogen peroxide concentration, and liquid properties of this sodium gluconate were changed, and the effect on the dissolution amount of Cu as the base metal, hydrogen peroxide consumption rate, and precipitation outside the pattern and the appearance of the plating film were determined. was investigated.

The treatment agent was prepared according to the following procedure.

(1) Sodium gluconate was placed in each beaker, and deionized water (DI water) was added so that the concentration of sodium gluconate was as shown in Table 2 to completely dissolve it.

(2) To the solution of 1 above, hydrogen peroxide was added to the concentration shown in Table 2. In addition, in Examples 1 to 8 and Comparative Example 4, sodium hydroxide was added to adjust the pH, and in Comparative Example 3, sulfuric acid was added. The pH was adjusted by adding deionized water to match the liquid level of each beaker.

(3) The beaker of 2 above was placed in a water bath set to the same temperature as the liquid temperature shown in Table 2, and the liquid temperature of the treatment agent was set as shown in Table 2.

Additionally, as Comparative Example 1, instead of the hydrogen peroxide and sodium gluconate, potassium cyanide: 0.25 mol/L (15 g/L) was used. As Comparative Example 2, instead of the hydrogen peroxide and sodium gluconate, thiourea 0.025 mole was used. A treatment agent using mol/L (2 g/L), concentrated hydrochloric acid 0.6 mol/L, and ammonium nitrate 0.1 mol/L was also prepared.

[Hydrogen peroxide consumption rate]

Each treatment agent was left to stand at the liquid temperature shown in Table 2 for 1 hour. And the hydrogen peroxide consumption rate after leaving for 1 hour was determined. This hydrogen peroxide consumption rate was obtained from the equation: 100 And, cases where the hydrogen peroxide consumption rate was less than 20% were evaluated as passing.

Next, as an object to be processed, a copper plate with a size of 5 cm x 5 cm in which a 0.7 mg/dm2 Pd film was formed was prepared. This object to be treated was immersed in the treatment agent for the treatment time shown in Table 2. Moreover, in Example 8 of Table 2, after immersion in the said processing agent, it was then immersed in 0.25 mol/L (40 degreeC) of potassium cyanide for 1 minute. After immersion in the treatment agent, in Example 8, it was immersed in the potassium cyanide solution and washed to obtain a sample for evaluation.

Using the evaluation sample, the amount of dissolution of Cu, the base metal, was measured in the following manner. In addition, the presence or absence of precipitation outside the pattern and the appearance of the plating film were observed as follows.

[Dissolution amount of Cu, the base metal]

After the copper plate was immersed for 30 minutes so as to immerse 5000 cm 2 per liter of the treatment agent, the copper concentration in the treatment agent was measured. And the case where the copper concentration in the processing agent was 10 mg/L or less was evaluated as passing because the dissolution of the base metal was suppressed.

[Observation of the presence or absence of precipitation outside the pattern and the appearance of the plating film]

Evaluation of out-of-pattern precipitation was performed by producing the following samples. That is, electroless Cu plating was formed using a Pd catalyst on a 3 cm The formed sample was prepared. Next, this sample was immersed in the treatment agent for the treatment time shown in Table 2. After that, after washing, electroless Ni plating was performed to form electroless Ni plating with a thickness of 7 μm. Moreover, in Example 8 of Table 2, after immersion in the said processing agent, it was then immersed in 0.25 mol/L (40 degreeC) of potassium cyanide for 1 minute. After that, after washing, electroless Ni plating was performed to form electroless Ni plating with a thickness of 7 μm.

The case where Ni plating was not formed in addition to the Cu pattern was evaluated as pass and OK, and the case where Ni plating was formed in addition to the Cu pattern was evaluated as failure and NG. Additionally, the appearance of the plating was observed with the naked eye, and in cases where no unevenness occurred, the appearance of the plating film was evaluated as acceptable and OK. In cases where unevenness occurred, the appearance of the plating film was evaluated as Fail and evaluated as NG.

These results are listed in Table 2.

[Table 2]

From Table 2, the following can be seen. Comparative Example 1 is an example in which a conventionally used Pd residue remover: potassium cyanide aqueous solution was used instead of hydrogen peroxide and the compound specified in the present invention. In Comparative Example 1, the amount of Cu, the base metal, dissolved increased. Comparative Example 2 is an example in which an aqueous solution containing a Pd residue remover containing an adsorption additive: thiourea, concentrated hydrochloric acid, and ammonium nitrate was used instead of hydrogen peroxide and the compound specified in the present invention. In this comparative example 2 as well, the amount of dissolved Cu, the base metal, increased. Additionally, unevenness occurred in the appearance of the plating film.

Comparative Example 3 used hydrogen peroxide and a compound specified in the present invention, but since the liquid was acidic, the amount of dissolved Cu, which was the base metal, increased. When the liquid is acidic, it is thought that hydrogen peroxide mainly elutes Cu. In addition, the effect of Pd removal by hydrogen peroxide was not effective, so a large amount of Pd residue remained and precipitation outside the pattern occurred. Furthermore, since appearance unevenness also occurred, the appearance of the plating film deteriorated.

Comparative Example 4 is an example in which hydrogen peroxide was used but no prescribed compound was used. In Comparative Example 4, it can be seen that the consumption rate of hydrogen peroxide was very high and it could not be used practically.

In contrast, in Examples 1 to 8, since the treatment agent specified in the present invention is used, the treatment agent does not deteriorate over time, and the Pd residue that causes precipitation outside the pattern of electroless plating is removed and the underlying metal is dissolved. was able to be carried out satisfactorily while suppressing .

Claims (8)

A treatment agent used for electroless plating using a palladium catalyst core after forming a metal pattern on a substrate, comprising: hydrogen peroxide; one selected from the group consisting of aldose, aldonic acid, aldalic acid, salts thereof, and lactone bodies thereof; An anti-precipitation treatment agent for metal patterns containing the above compounds and having a pH of 7.1 to 10. According to claim 1,
The compound has a carbon number of 3 to 6 in the case of the aldose and the aldonic acid, and has a carbon number of 4 to 6 in the case of the aldalic acid. A treatment agent for preventing precipitation outside the metal pattern. According to claim 1,
The compound is a metal pattern precipitation prevention treatment agent having at least either 5 or 6 carbon atoms. delete A method of manufacturing a printed wiring board by performing electroless plating on a substrate on which a metal pattern is formed, comprising:
A print comprising at least the steps of bringing the base material on which the metal pattern is formed into contact with the metal pattern non-precipitation prevention treatment agent according to any one of claims 1 to 3 and an electroless plating treatment step in this order. Manufacturing method of a wiring board. According to claim 5,
A method of manufacturing a printed wiring board comprising: contacting the metal pattern with an anti-precipitation treatment agent, followed by treatment with a solution containing a cyan compound, and then performing the electroless plating process. A method of manufacturing a package by performing electroless plating on a substrate on which a metal pattern is formed, comprising:
A package comprising at least the steps of bringing the base material on which the metal pattern is formed into contact with the metal pattern precipitation prevention treatment agent according to any one of claims 1 to 3 and an electroless plating treatment step in this order. Manufacturing method. According to claim 7,
A method of manufacturing a package comprising: contacting the metal pattern with a precipitation prevention treatment agent, followed by treatment with a solution containing a cyan compound, and then carrying out the electroless plating process.

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