JP5136746B2 - Surface treatment method of aluminum or aluminum alloy - Google Patents

Description

  The present invention relates to a surface treatment method for aluminum or an aluminum alloy, and more particularly to a surface treatment method for aluminum or an aluminum alloy when UBM (under bump metal) or bumps are formed on a wafer by plating.

  Conventionally, as a method of forming a UBM or bump on a silicon wafer, a zinc film is formed by subjecting an aluminum thin film electrode patterned on the wafer to a zinc replacement treatment, and then a bump is formed by electroless nickel plating. Method of forming bumps by electroless nickel plating after applying palladium treatment instead of zinc replacement treatment, or forming bumps by autocatalytic electroless nickel plating after directly replacing the surface of the aluminum thin film electrode with nickel The method of doing is used.

  In addition, UBM or bumps on which an electroless nickel plating film is formed by such a method are further subjected to electroless copper plating on the electroless nickel plating film in order to improve electrical characteristics, in particular to lower electrical resistance. There is. In this case, the electroless nickel film is not catalytic and cannot be electroplated directly on the electroless nickel film. Therefore, conventionally, a copper replacement treatment for imparting catalytic properties to the electroless nickel film has been performed. Has been.

  However, this copper replacement treatment tends to erode the electroless nickel film, and as a result, the substrate (aluminum or aluminum alloy) is attacked (eroded), and adhesion of the electroless copper plating film formed by the copper replacement process There was a problem that the characteristics would be lowered.

JP 2004-263267 A

  The present invention has been made in view of the above circumstances, and an aluminum or aluminum alloy is formed by forming an electroless nickel plating film on aluminum or an aluminum alloy, and further forming an electroless copper plating film on the electroless nickel plating film. When processing the surface of the electroless, without giving excessive corrosion to the electroless nickel film, it imparts good catalytic properties and forms an electroless copper plating film, giving high adhesion of the electroless copper plating film It is an object of the present invention to provide a surface treatment method for aluminum or aluminum alloy.

  As a result of intensive studies to achieve the above object, the present inventor formed an electroless nickel plating film on aluminum or an aluminum alloy, and further formed an electroless copper plating film on the electroless nickel plating film. When treating the surface of aluminum or an aluminum alloy, an intermediate plating film of Ag, Au, Pd, Pt, Rh or an alloy thereof is formed on the surface of the electroless nickel plating film by displacement plating or electroless plating. By forming an electrolytic copper plating film, good catalytic properties can be imparted to form an electroless copper plating film, and the obtained electroless copper plating film should also have high adhesion. The present invention has been found and the present invention has been made.

Therefore, the present invention provides the following surface treatment method for aluminum or aluminum alloy.
Claim 1:
Aluminum or aluminum alloy which forms an electroless nickel plating film on the aluminum or aluminum alloy of the object to be treated having at least aluminum or aluminum alloy on the surface, and further forms an electroless copper plating film on the electroless nickel plating film The surface treatment method of
The object to be treated contains a metal salt or oxide that can replace aluminum, a solubilizing agent for ions of the metal, and an alkali, and the metal that can replace aluminum is manganese, cobalt, nickel , Copper, silver, platinum, gold or palladium, which is immersed in an aluminum oxide film removal solution having a pH of 10 to 13.5, and is formed on the aluminum or aluminum alloy surface layer of the object to be treated Forming a substituted metal layer of a metal replaceable with aluminum contained in the removal liquid while removing the oxide film;
The step of removing the substitution metal layer with an acidic solution having an oxidizing action, and the electroless nickel plating film directly or after performing zinc substitution treatment on the aluminum or aluminum alloy exposed by removing the substitution metal layer. A nickel plating process including a process of forming
An intermediate plating step of forming an intermediate plating film of Ag, Au, Pd, Pt, Rh or an alloy thereof by displacement plating or electroless plating on the surface of the electroless nickel plating film; A surface treatment method for aluminum or an aluminum alloy, comprising a copper plating step of forming an electrolytic copper plating film.
Claim 2:
The surface treatment method according to claim 1, wherein the aluminum oxide film removal liquid further contains a surfactant.

  According to the present invention, when an electroless nickel plating film is formed on aluminum or an aluminum alloy, and an electroless copper plating film is further formed on the electroless nickel plating film to treat the surface of the aluminum or aluminum alloy, A good catalytic property can be imparted to form an electroless copper plating film, and the obtained electroless copper plating film has high adhesion.

Hereinafter, the present invention will be described in more detail.
According to the surface treatment method of the present invention, an electroless nickel plating film is formed on the aluminum or aluminum alloy of the object to be processed having at least aluminum or aluminum alloy on the surface, and electroless copper plating is further formed on the electroless nickel plating film. It is a surface treatment method of aluminum or aluminum alloy for forming a film,
A nickel plating step of forming an electroless nickel plating film on the aluminum or aluminum alloy by removing the aluminum oxide film formed on the aluminum or aluminum alloy surface layer of the workpiece;
An intermediate plating step for forming an intermediate plating film of Ag, Au, Pd, Pt, Rh or an alloy thereof by displacement plating or electroless plating on the surface of the electroless nickel plating film, and no effect on the surface of the intermediate plating film A copper plating process for forming an electrolytic copper plating film is included. Hereafter, each said process is demonstrated.

[Nickel plating process]
In the present invention, the aluminum oxide film formed on the surface of the aluminum or aluminum alloy of the object to be processed is removed to form an electroless nickel plating film on the aluminum or aluminum alloy. A conventionally known method can be applied, and an electroless nickel plating film is formed on the exposed aluminum or aluminum alloy by removing the aluminum oxide film.

  In this case, the object to be treated is immersed in a removal solution for aluminum oxide film containing a metal that can replace aluminum, and a replacement metal layer of a metal that can be replaced with aluminum contained in the removal solution while removing the aluminum oxide film. It is also possible to form the electroless nickel plating film on the aluminum or aluminum alloy formed by removing the metal substitution layer with an acidic solution having an oxidizing action and exposing the metal substitution layer.

  As this removal solution for aluminum oxide film, a salt containing a metal salt replaceable with aluminum, an acid, and preferably a surfactant (acid removal solution), or a metal salt replaceable with aluminum Alternatively, an oxide, a solubilizing agent for the metal ions, an alkali, and preferably a surfactant, having a pH of 10 to 13.5 (an alkaline removal solution) is preferably used. Can do.

(Acid remover)
The metal constituting the metal salt contained in the acid removal solution is not particularly limited as long as it is a metal that can be replaced with aluminum, but is preferably a metal having a smaller ionization tendency than aluminum, such as zinc, iron, cobalt, and the like. Nickel, tin, lead, copper, mercury, silver, platinum, gold, palladium and the like, and examples of the metal salt include water-soluble salts such as nitrates and sulfates of such metals. In particular, sulfate is preferable for reasons such as the stability of the removal solution and the less aggressiveness to the aluminum or aluminum alloy material. These may be used alone or in combination of two or more. Among them, silver, nickel, and copper are preferable because they are less likely to precipitate in other sites, and particularly copper and silver have a much smaller ionization tendency than aluminum, so that the substitution reaction is more likely to proceed and the etching processing time is reduced. This is preferable because it can be shortened.

  The concentration of the metal salt used in the acid removal solution is not particularly limited, but is usually 1 ppm or more, preferably 10 ppm or more as the metal amount, and usually 10,000 ppm or less, preferably 5,000 ppm or less as the upper limit. . If the concentration of the metal salt is too small, it may not be sufficiently replaced with the base aluminum or it may be necessary to replenish the metal salt. On the other hand, when the concentration is too high, when aluminum or an aluminum alloy is an electrode patterned on the wafer, the member other than the aluminum or aluminum alloy substrate is eroded or other than the aluminum or aluminum alloy substrate. There is a case where it protrudes and precipitates on the member.

  The acid contained in the acid removal solution is not particularly limited, but it needs to be an acid that dissolves the oxide film, and examples thereof include sulfuric acid, phosphoric acid, hydrochloric acid, and hydrofluoric acid. May be used alone or in combination of two or more. Among these, sulfuric acid is preferable from the viewpoint of the stability of the removing liquid and the less aggressiveness to the aluminum or aluminum alloy material.

  The concentration in the acid removal solution is not particularly limited, but is usually 10 g / L or more, preferably 15 g / L or more, and the upper limit is usually 500 g / L or less, preferably 300 g / L or less. If the concentration of the acid is too small, the oxide film may not be dissolved and may not be effective. On the other hand, if the concentration is too large, members other than the aluminum or aluminum alloy substrate may be affected.

(Alkaline remover)
The metal constituting the metal salt or metal oxide contained in the alkaline removal solution is not particularly limited as long as it is a metal that can be replaced with aluminum, but is preferably a metal that has a lower ionization tendency than aluminum. Zinc, iron, cobalt, nickel, tin, lead, copper, mercury, silver, platinum, gold, palladium, etc., and the metal salts include water-soluble salts such as nitrates and sulfates of such metals. Can be mentioned. Among these, manganese and zinc are preferable because they have a small reduction potential difference from aluminum as a base material.

  The concentration of the metal salt or metal oxide used in the alkaline removal liquid is not particularly limited, but the metal amount is usually 1 ppm (mg / L) or more, preferably 10 ppm (mg / L) or more, and the upper limit. Usually, it is 10,000 ppm (mg / L) or less, preferably 5,000 ppm (mg / L) or less. If the concentration of the metal salt or metal oxide is too small, it may not be sufficiently replaced with the base aluminum, or it may be necessary to replenish the metal salt or metal oxide. On the other hand, when the concentration is too high, when aluminum or an aluminum alloy is an electrode patterned on the wafer, the member other than the aluminum or aluminum alloy substrate is eroded or other than the aluminum or aluminum alloy substrate. There is a case where it protrudes and precipitates on the member.

  The solubilizing agent for the metal ions contained in the alkaline removal solution is not particularly limited, and usual complexing agents and chelating agents can be used. Specifically, glycolic acid, lactic acid, malic acid, tartaric acid, citric acid, gluconic acid, heptogluconic acid and other hydroxycarboxylic acids and salts thereof, glycine, aminodicarboxylic acid, nitrilotriacetic acid, EDTA, hydroxyethylethylenediaminetriacetic acid, Aminocarboxylic acids such as diethylenetriaminepentaacetic acid and polyaminopolycarboxylic acid and salts thereof, phosphite chelating agents such as HEDP, aminotrimethylphosphonic acid and ethylenediaminetetramethylphosphonic acid and salts thereof, and amines such as ethylenediamine, diethylenetriamine and triethylenetetramine A system chelating agent can be used.

  The concentration of the solubilizer used in the alkaline removal liquid is not particularly limited, but the total concentration of the solubilizer with respect to the metal salt used is 0.5 to 10 (molar ratio), preferably 0.8-5 (molar ratio) is good.

  The alkali contained in the alkaline removal liquid is not particularly limited, but it needs to be an alkali (base) that dissolves the oxide film, for example, a hydroxide of an alkali metal such as LiOH, NaOH, or KOH. Can be used. The amount of alkali added is an amount that makes the pH of the removal solution within a specified range, that is, an amount that makes the pH 10 to 13.5, preferably 11 to 13. If the pH is less than 10, the dissolution rate may be remarkably reduced. If the pH exceeds 13.5, the dissolution rate may be too high to be controlled.

  The oxide film removal liquid preferably contains a surfactant from the viewpoint of imparting water wettability in both the acidic removal liquid and the alkaline removal liquid. The surfactant to be used is not particularly limited. For example, nonionic surfactants such as polyethylene glycol, polyoxyethylene / oxypropylene block copolymer type activator, and other anionic and cationic interfaces are used. An activator is mentioned, and the nonionic type and the anionic type are preferable from the viewpoint of uniform processability. These may be used alone or in combination of two or more.

  For example, when polyethylene glycol is used as the surfactant, the molecular weight is not particularly limited, but is usually 100 or more, preferably 200 or more, and the upper limit is usually 20,000 or less, preferably 6,000 or less. . If the molecular weight is too large, the solubility may be poor, while if the molecular weight is too small, water wettability may not be provided. A commercially available product can be used as the polyethylene glycol.

  The concentration of the surfactant in the removal solution is not particularly limited, but is usually 1 ppm or more (mg / L), preferably 10 ppm (mg / L) or more, and the upper limit is usually 5,000 ppm (mg / L). L) or less, preferably 2,000 ppm (mg / L) or less. If the concentration of the surfactant in the removal solution is too small, the effect of water wettability obtained by adding the surfactant may be low. On the other hand, if the concentration is too large, it may be on a member other than aluminum or an aluminum alloy. In some cases, the substituted metal is deposited.

  The oxide film removal solution is preferably prepared as an aqueous solution from the viewpoint of operational safety in both the acidic removal solution and the alkaline removal solution, but other solvents such as methanol, ethanol, IPA, etc. Or a mixed solvent with water can be used. These solvents may be used alone or in combination of two or more.

  The immersion conditions for immersing the workpiece having aluminum or aluminum alloy in the removal liquid are not particularly limited and can be appropriately set in view of the thickness of the aluminum oxide film to be removed. 1 minute or more, preferably 2 minutes or more, and the upper limit is usually 20 minutes or less, preferably 15 minutes or less. If the immersion time is too short, the substitution may not proceed and the removal of the oxide film may be insufficient. On the other hand, if the immersion time is too long, the removal solution may enter from a small hole in the replacement metal layer, and aluminum or aluminum There is a risk that the alloy will be eluted.

  Also, the temperature at the time of immersion is not particularly limited, but is usually 30 ° C. or higher, preferably 35 ° C. or higher, and the upper limit is usually 100 ° C. or lower, preferably 95 ° C. or lower. If the immersion temperature is too low, the oxide film may not be dissolved. On the other hand, if the immersion temperature is too high, members other than aluminum or aluminum alloy may be affected. In addition, at the time of immersion, it is preferable to perform liquid agitation and rocking of an object to be processed from the viewpoint of uniform processing.

  When the above oxide film removal liquid is used, the aluminum oxide film is removed and a metal replacement metal layer that can be replaced with aluminum is formed. This metal replacement layer is removed by an acidic liquid having an oxidizing action. The plating can be performed directly on the aluminum or aluminum alloy from which the substitution metal layer has been removed or after the zinc substitution treatment or the palladium treatment.

  When removing the substitution metal layer with an acidic liquid having an oxidizing action, an acidic liquid having an oxidizing action is used from the viewpoint of reducing the reactivity with aluminum or an aluminum alloy as a base. In this case, the acidic liquid having an oxidizing action includes an acid having an oxidizing action such as nitric acid or an aqueous solution thereof, an acid having no oxidizing action such as sulfuric acid and hydrochloric acid, or an aqueous solution thereof, and an oxidizing agent such as hydrogen peroxide, persulfuric acid. What added 1 type, or 2 or more types, such as sodium, ammonium persulfate, potassium persulfate, etc. is used preferably. In this case, the acid has an action of dissolving the substituted metal, and the oxidant has an action of reducing the reactivity to the aluminum or aluminum alloy substrate. Of the oxidizers, hydrogen peroxide is preferable because it is composed of hydrogen and oxygen, and is reduced to water, and it is stable and easy to handle. Potassium persulfate is preferred.

  Here, when nitric acid is used as the acid (and oxidizing agent), the amount of nitric acid in the solution (aqueous solution) is usually 200 ml / L or more, preferably 300 ml / L or more, and the upper limit is usually 1,000 ml / L or less. Preferably it is 700 ml / L or less. If the amount of nitric acid is too small, the oxidizing power is low and the reaction may not stop. In addition, the nitric acid 1,000 ml / L is a case where the total amount is nitric acid.

  In the case of using an oxidizing agent, the amount of oxidizing agent in the solution is usually 50 g / L or more, preferably 75 g / L or more, and the upper limit is usually 500 g / L or less, preferably 300 g / L or less. If the amount of the oxidizing agent is too small, the oxidizing power is low and the reaction may not stop. On the other hand, if the amount is too large, the economy may be poor. In addition, the concentration of acid such as hydrochloric acid and sulfuric acid used together with the oxidizing agent is usually 10 g / L or more, preferably 15 g / L or more, and the upper limit is usually 500 g / L or less, preferably 300 g / L or less. . If the acid concentration is too low, the substitutional metal layer may be difficult to dissolve. On the other hand, if the acid concentration is too high, members other than aluminum or aluminum alloy may be eroded. The acid used here is preferably a non-oxidizing acid, but may be an oxidizing acid such as nitric acid, or an oxidizing acid mixed with a non-oxidizing acid. May be.

  In such dissolution treatment, the treatment time is not particularly limited, and for example, the dissolution treatment can be performed in 5 to 300 seconds. As the dissolution treatment temperature, for example, a condition of 10 to 40 ° C. can be adopted. Further, during the dissolution treatment, the object to be plated may be stationary or swinging, and liquid agitation may be performed.

  An electroless nickel plating film is formed on the aluminum or aluminum alloy exposed by removing the aluminum oxide film. For this electroless nickel plating, a known electroless nickel plating bath can be used, for example, electroless containing nickel sulfate, organic acid (succinic acid, malic acid, citric acid, etc.), sodium hypophosphite, etc. A nickel plating bath is mentioned, and a commercially available plating bath can also be used.

  The film thickness of the electroless nickel plating film to be formed is usually about 1 to 20 μm, and the plating temperature and the plating time are selected according to the film thickness of the plating film to be formed. Usually, the plating temperature is 50 to 95 ° C. The plating time is 5 to 120 minutes.

  The electroless nickel plating can be applied directly to the surface of aluminum or aluminum alloy, and the electroless nickel plating treatment is performed after the activation treatment is performed on the surface of aluminum or aluminum alloy by zinc replacement treatment, palladium treatment or the like. May be performed. As such an activation treatment, it is particularly preferable to form a zinc coating on the surface of the aluminum or aluminum alloy by performing a zinc substitution treatment, particularly an alkali zinc substitution treatment, from the viewpoint of improving the adhesion of the plating film.

  Here, the zinc substitution treatment specifically refers to performing a treatment for substitution deposition of zinc using a solution containing a zinc salt. In the case of alkaline zinc substitution treatment, an alkaline zinc acid solution is used, and as the acidic zinc substitution treatment, zinc is substituted and precipitated using a solution containing an acidic zinc salt. These can be performed by a known method. Further, as the palladium treatment, a treatment for displacement deposition of palladium using a solution containing a palladium salt is performed, and can be performed by a known method.

[Intermediate plating process]
In the present invention, an intermediate plating film of Ag, Au, Pd, Pt, Rh or an alloy thereof is formed on the surface of the electroless nickel plating film formed in the nickel plating process by displacement plating or electroless plating. For this displacement plating or electroless plating, a known displacement plating bath or electroless plating bath containing Ag, Au, Pd, Pt or Rh can be used, for example, metal (Ag, Au, Pd, Pt, Ph). Displacement plating baths containing salts, inorganic acids (sulfuric acid, hydrochloric acid, etc.), organic acids (succinic acid, malic acid, citric acid, etc.), metal (Ag, Au, Pd, Pt, Ph) salts, complexing agents ( Electroless plating baths containing organic acids, EDTA, etc.), reducing agents (formic acid, sodium hypophosphite, hydrazine, etc.) and the like can be mentioned, and commercially available plating baths can also be used.

  The thickness of the intermediate plating film to be formed is usually about 0.005 to 1.0 μm, preferably about 0.01 to 0.5 μm, and the plating temperature and plating time are selected according to the thickness of the plating film to be formed. Usually, the plating temperature is 30 to 80 ° C., and the plating time is 10 seconds to 10 minutes. By forming an intermediate plating film of Ag, Au, Pd, Pt, Rh, or an alloy thereof, and forming an electroless copper plating film by a copper plating process to be described later, it imparts good catalytic properties and is electroless. A copper plating film can be formed.

[Copper plating process]
In the present invention, an electroless copper plating film is formed on the surface of the intermediate plating film formed in the intermediate plating step. For this electroless copper plating, a known electroless copper plating bath can be used, and examples thereof include an electroless copper plating bath containing copper sulfate, a complexing agent (tartaric acid, EDTA, etc.), formalin and the like. A plating bath can also be used.

  The film thickness of the electroless copper plating film to be formed is usually about 0.05 to 10 μm, and the plating temperature and the plating time are selected according to the film thickness of the plating film to be formed. 75 degreeC and plating time are 5 minutes-6 hours.

  As an object to be processed having aluminum or an aluminum alloy on at least the surface targeted by the present invention, a non-aluminum material (for example, silicon, FRA (printed circuit board), even if all of the objects to be processed are formed of aluminum or an aluminum alloy. The whole or part of the surface of the base material)) may be coated with aluminum or an aluminum alloy. Moreover, it does not specifically limit as the form of the aluminum or aluminum alloy, For example, it can apply favorably with respect to a blank material, a rolling material, a casting material, a membrane | film | coat, etc. In the case where an aluminum or aluminum alloy film is formed on the surface of a non-aluminum material, the method for forming this film is not particularly limited, but examples of the formation method include a vacuum deposition method, a sputtering method, and an ion plate. A vapor phase plating method such as a plating method is suitable.

  The thickness of this film is usually 0.5 μm or more, preferably 1 μm or more, from the viewpoint of reliably leaving aluminum or an aluminum alloy substrate. The upper limit of the thickness is not particularly limited, but is usually 100 μm or less.

  Further, the component of the film is not particularly limited as long as it is aluminum or an aluminum alloy. For example, Al—Si (Si content: 0.5 to 1.0% by weight), Al—Cu (Cu content) The present invention can also be applied to alloy films such as 0.5 to 1.0% by weight).

Hereinafter, the present invention will be described more specifically with reference examples and comparative examples .

[ Reference Example 1]
As the object to be plated, a silicon plate coated with an aluminum layer having a thickness of 5 μm by a sputtering method was used, and the treatments shown in Table 1 were sequentially performed on the aluminum layer. Table 2 shows the results of the evaluation of the properties of the obtained plating film.

酸化皮膜除去液：金属塩として硫酸亜鉛を２ｇ／Ｌ、可溶化剤としてＥＤＴＡ・２Ｎａを１０ｇ／Ｌ、界面活性剤としてＰＥＧ（ポリエチレングリコール）−１０００を１ｇ／Ｌ、アルカリとしてＮａＯＨを含み、ｐＨを１２．４に調整した水溶液

Oxide film removing solution: 2 g / L of zinc sulfate as a metal salt, 10 g / L of EDTA · 2Na as a solubilizer, 1 g / L of PEG (polyethylene glycol) -1000 as a surfactant, NaOH as an alkali, pH Aqueous solution adjusted to 12.4

[ Reference Example 2]
Reference Example, except that the displacement gold plating (gold sulfite) of (8) was replaced with displacement gold plating (cyan gold) (chemical solution: Epitus TDL-20 (manufactured by Uemura Kogyo Co., Ltd.), condition: film thickness 0.05 μm). The treatment was carried out in the same manner as in 1. Table 2 shows the results of the evaluation of the properties of the obtained plating film.

[ Reference Example 3]
The same as in Reference Example 1 except that the displacement gold plating (gold sulfite) of (8) was electroless Pd plating (chemical solution: Epitus TFP-30 (manufactured by Uemura Kogyo Co., Ltd.), condition: film thickness 0.06 μm). And processed. Table 2 shows the results of the evaluation of the properties of the obtained plating film.

[Comparative Example 1]
The treatment was performed in the same manner as in Reference Example 1 except that the displacement gold plating (gold sulfite) of (8) was not performed. Table 2 shows the results of the evaluation of the properties of the obtained plating film.

[Comparative Example 2]
Except for the replacement gold plating (gold sulfite) of (8) being copper replacement treatment (chemical solution: copper sulfate 0.5 g / L sulfuric acid (62.5%) 10 g / L), conditions: 20 ° C. for 30 seconds) The treatment was performed in the same manner as in Reference Example 1. Table 2 shows the results of the evaluation of the properties of the obtained plating film.

・無電解銅めっき皮膜の外観：目視と実体顕微鏡により観察し、未着とムラなしを良好、未着又はムラありを不良とした。
・密着性：シリコン板をめっき皮膜ごと折り割り、めっき皮膜が剥がれないで割れたものを良好、Ｎｉ／Ｃｕ間で剥がれたものを不良とした。
・素地へのアタック：アルミ素地へのアタック（侵食）がないものを「なし」、アルミ素地を侵食しているものを「あり」とした。

-Appearance of electroless copper plating film: Observed visually and with a stereomicroscope, unsatisfactory and non-uniformity were good, unsatisfactory or non-uniformity was considered unsatisfactory.
-Adhesiveness: The silicon plate was folded together with the plating film, and the one that cracked without peeling off the plating film was good, and the one that was peeled off between Ni / Cu was considered bad.
・ Attack on the substrate: “None” indicates that there is no attack (erosion) on the aluminum substrate, and “Yes” indicates that the aluminum substrate is eroded.

Claims (2)

Aluminum or aluminum alloy which forms an electroless nickel plating film on the aluminum or aluminum alloy of the object to be treated having at least aluminum or aluminum alloy on the surface, and further forms an electroless copper plating film on the electroless nickel plating film The surface treatment method of
The object to be treated contains a metal salt or oxide that can replace aluminum, a solubilizing agent for ions of the metal, and an alkali, and the metal that can replace aluminum is manganese, cobalt, nickel , Copper, silver, platinum, gold or palladium, which is immersed in an aluminum oxide film removal solution having a pH of 10 to 13.5, and is formed on the aluminum or aluminum alloy surface layer of the object to be treated Forming a substituted metal layer of a metal replaceable with aluminum contained in the removal liquid while removing the oxide film;
The step of removing the substitution metal layer with an acidic solution having an oxidizing action, and the electroless nickel plating film directly or after performing zinc substitution treatment on the aluminum or aluminum alloy exposed by removing the substitution metal layer. A nickel plating process including a process of forming
An intermediate plating step of forming an intermediate plating film of Ag, Au, Pd, Pt, Rh or an alloy thereof by displacement plating or electroless plating on the surface of the electroless nickel plating film; A surface treatment method for aluminum or an aluminum alloy, comprising a copper plating step of forming an electrolytic copper plating film.   The surface treatment method according to claim 1, wherein the aluminum oxide film removal liquid further contains a surfactant.