KR102590955B1 - 인터포저 조립체 및 방법 - Google Patents

인터포저 조립체 및 방법 Download PDF

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Publication number
KR102590955B1
KR102590955B1 KR1020217029745A KR20217029745A KR102590955B1 KR 102590955 B1 KR102590955 B1 KR 102590955B1 KR 1020217029745 A KR1020217029745 A KR 1020217029745A KR 20217029745 A KR20217029745 A KR 20217029745A KR 102590955 B1 KR102590955 B1 KR 102590955B1
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South Korea
Prior art keywords
contact
delete delete
interposer assembly
slot
spring arm
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Application number
KR1020217029745A
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English (en)
Korean (ko)
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KR20210125574A (ko
Inventor
폴 알. 테일러
트렌트 두
제임스 에스. 힐레만
Original Assignee
암페놀 인터콘 시스템즈, 아이엔씨.
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Publication of KR20210125574A publication Critical patent/KR20210125574A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01L24/14—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/245—Contacts for co-operating by abutting resilient; resiliently-mounted by stamped-out resilient contact arm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020217029745A 2019-02-22 2020-02-21 인터포저 조립체 및 방법 Active KR102590955B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962808934P 2019-02-22 2019-02-22
US62/808,934 2019-02-22
US16/797,536 US11223152B2 (en) 2019-02-22 2020-02-21 Interposer assembly and method
US16/797,536 2020-02-21
PCT/US2020/019276 WO2020172561A1 (en) 2019-02-22 2020-02-21 Interposer assembly and method

Publications (2)

Publication Number Publication Date
KR20210125574A KR20210125574A (ko) 2021-10-18
KR102590955B1 true KR102590955B1 (ko) 2023-10-17

Family

ID=72141854

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217029745A Active KR102590955B1 (ko) 2019-02-22 2020-02-21 인터포저 조립체 및 방법

Country Status (8)

Country Link
US (1) US11223152B2 (https=)
EP (1) EP3921900A4 (https=)
JP (2) JP2022520873A (https=)
KR (1) KR102590955B1 (https=)
CN (1) CN113875094A (https=)
SG (1) SG11202108353UA (https=)
TW (1) TWI836018B (https=)
WO (1) WO2020172561A1 (https=)

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WO2023066489A1 (en) * 2021-10-21 2023-04-27 Dynex Semiconductor Limited Press-pack semiconductor device package
JP7837729B2 (ja) * 2022-01-24 2026-03-31 日本航空電子工業株式会社 コネクタ
WO2024010901A1 (en) * 2022-07-08 2024-01-11 Samtec, Inc. Compression interposer
TW202418675A (zh) * 2022-10-28 2024-05-01 大陸商安費諾商用電子產品（成都）有限公司 用於電連接器之端子、電連接器及其製造方法

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Also Published As

Publication number Publication date
WO2020172561A1 (en) 2020-08-27
TW202038407A (zh) 2020-10-16
EP3921900A4 (en) 2022-10-26
EP3921900A1 (en) 2021-12-15
JP2022520873A (ja) 2022-04-01
SG11202108353UA (en) 2021-08-30
KR20210125574A (ko) 2021-10-18
JP2025074117A (ja) 2025-05-13
US20200274277A1 (en) 2020-08-27
TWI836018B (zh) 2024-03-21
CN113875094A (zh) 2021-12-31
US11223152B2 (en) 2022-01-11

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