KR102581524B1 - 전자 빔에 의해 야기된 기판의 손상을 측정하는 방법 - Google Patents
전자 빔에 의해 야기된 기판의 손상을 측정하는 방법 Download PDFInfo
- Publication number
- KR102581524B1 KR102581524B1 KR1020197009299A KR20197009299A KR102581524B1 KR 102581524 B1 KR102581524 B1 KR 102581524B1 KR 1020197009299 A KR1020197009299 A KR 1020197009299A KR 20197009299 A KR20197009299 A KR 20197009299A KR 102581524 B1 KR102581524 B1 KR 102581524B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- damage
- afm
- exposed area
- electron beam
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 238000010894 electron beam technology Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000005259 measurement Methods 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 8
- 230000000704 physical effect Effects 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000021715 photosynthesis, light harvesting Effects 0.000 claims description 3
- 239000000523 sample Substances 0.000 description 19
- 238000002604 ultrasonography Methods 0.000 description 18
- 230000008901 benefit Effects 0.000 description 5
- 230000003993 interaction Effects 0.000 description 4
- 238000011835 investigation Methods 0.000 description 4
- 238000000386 microscopy Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000010079 rubber tapping Methods 0.000 description 3
- 238000003957 acoustic microscopy Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000004680 force modulation microscopy Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 238000004630 atomic force microscopy Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/043—Analysing solids in the interior, e.g. by shear waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
- G01N29/0681—Imaging by acoustic microscopy, e.g. scanning acoustic microscopy
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/0095—Semiconductive materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q30/00—Auxiliary means serving to assist or improve the scanning probe techniques or apparatus, e.g. display or data processing devices
- G01Q30/02—Non-SPM analysing devices, e.g. SEM [Scanning Electron Microscope], spectrometer or optical microscope
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/32—AC mode
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
-
- G01N2033/0095—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/50—Detectors
- G01N2223/507—Detectors secondary-emission detector
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/014—Resonance or resonant frequency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02827—Elastic parameters, strength or force
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0427—Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Acoustics & Sound (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Medicinal Chemistry (AREA)
- Food Science & Technology (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16186519.1 | 2016-08-31 | ||
| EP16186519.1A EP3290929A1 (de) | 2016-08-31 | 2016-08-31 | Verfahren zur messung des durch einen elektronenstrahl verursachten schadens eines substrats |
| PCT/NL2017/050572 WO2018044164A2 (en) | 2016-08-31 | 2017-08-30 | Method for measuring damage of a substrate caused by an electron beam |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190041526A KR20190041526A (ko) | 2019-04-22 |
| KR102581524B1 true KR102581524B1 (ko) | 2023-10-05 |
Family
ID=56990222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020197009299A KR102581524B1 (ko) | 2016-08-31 | 2017-08-30 | 전자 빔에 의해 야기된 기판의 손상을 측정하는 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11774381B2 (de) |
| EP (2) | EP3290929A1 (de) |
| KR (1) | KR102581524B1 (de) |
| WO (1) | WO2018044164A2 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020031329A1 (ja) * | 2018-08-09 | 2020-02-13 | 株式会社島津製作所 | 走査型プローブ顕微鏡、および走査型プローブ顕微鏡を用いた物性量測定方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5253516A (en) * | 1990-05-23 | 1993-10-19 | Digital Instruments, Inc. | Atomic force microscope for small samples having dual-mode operating capability |
| US5386720A (en) * | 1992-01-09 | 1995-02-07 | Olympus Optical Co., Ltd. | Integrated AFM sensor |
| JP4820740B2 (ja) * | 2006-12-08 | 2011-11-24 | エスアイアイ・ナノテクノロジー株式会社 | 加工用ダイヤモンド探針の加工方法 |
| WO2008141301A1 (en) * | 2007-05-10 | 2008-11-20 | Veeco Instruments Inc. | Non-destructive wafer-scale sub-surface ultrasonic microscopy employing near field afm detection |
| DE112008003233B4 (de) * | 2007-11-27 | 2021-05-06 | Intermodulation Products Ab | Intermodulationsrasterkraftspektroskopie |
| US8692193B2 (en) * | 2010-08-05 | 2014-04-08 | Hermes Microvision, Inc. | Method for inspecting EUV reticle and apparatus thereof |
| US9466463B1 (en) * | 2012-11-20 | 2016-10-11 | Multibeam Corporation | Charged particle beam substrate inspection using both vector and raster scanning |
-
2016
- 2016-08-31 EP EP16186519.1A patent/EP3290929A1/de not_active Withdrawn
-
2017
- 2017-08-30 KR KR1020197009299A patent/KR102581524B1/ko active IP Right Grant
- 2017-08-30 EP EP17762237.0A patent/EP3507607B1/de active Active
- 2017-08-30 WO PCT/NL2017/050572 patent/WO2018044164A2/en unknown
- 2017-08-30 US US16/325,995 patent/US11774381B2/en active Active
Non-Patent Citations (3)
| Title |
|---|
| C. K. Harnett 등, Low-energy electron-beam patterning of amine-functionalized self-assembled monolayers, APPLIED PHYSICS LETTERS, vol. 76, no. 17, pp2466-2468, 2000.4.24.* |
| Cheng, Zhao-Hui 등, Damage-free metrology of porous low-k dielectrics using CD-SEM, Proc. of SPIE, vol. 5375, pp665-674, 2004.5.24.* |
| U. Rabe 등, Quantitative determination of contact stiffness using atomic force acoustic microscopy, Ultrasonics 38, pp430-437, 2000.* |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3507607A2 (de) | 2019-07-10 |
| EP3290929A1 (de) | 2018-03-07 |
| EP3507607B1 (de) | 2023-08-02 |
| KR20190041526A (ko) | 2019-04-22 |
| WO2018044164A2 (en) | 2018-03-08 |
| US11774381B2 (en) | 2023-10-03 |
| WO2018044164A3 (en) | 2018-04-19 |
| US20210333226A1 (en) | 2021-10-28 |
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| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |