KR102578367B1 - Rf module and antenna apparatus including the same - Google Patents

Abstract

The present invention relates to an RF module for an antenna and an antenna device including the same. In particular, the RF filter arranged on the front of the main board, the radiating element module arranged in front of the RF filter, and the RF filter and the radiating element module between the RF filter and the radiating element module. At least one reflector grill pin and the RF filter that are disposed to ground (GND) the radiating element module and to introduce external air from the front to the rear of the RF filter or to discharge external air from the rear to the front of the RF filter It is coupled to the front of and includes a radome cover that protects the radiating element module from the outside, providing the advantage of greatly improving overall heat dissipation performance.

Description

RF module for antenna and antenna device including the same {RF MODULE AND ANTENNA APPARATUS INCLUDING THE SAME}

The present invention relates to an RF module for an antenna and an antenna device including the same. More specifically, the radiating element module and the RF element are completely separated from the main board, but are arranged to be exposed to the outside air in front, and are equipped with a conventional radiating element. It relates to an RF module for an antenna that can solve the difficulty in designing heat dissipation to the front side and an antenna device including the same.

Base station antennas, including repeaters used in mobile communication systems, have various shapes and structures, and usually have a structure in which a plurality of radiating elements are appropriately arranged on at least one reflector standing upright in the longitudinal direction.

Recently, research has been actively conducted to satisfy the high-performance requirements for multiple input/output (MIMO)-based antennas while achieving miniaturization, weight reduction, and low-cost structures. In particular, in the case of antenna devices with patch-type radiating elements to implement linear polarization or circular polarization, the radiating elements are usually plated on a dielectric substrate made of plastic or ceramic material and then connected to a PCB (printed circuit board) through soldering. The method is widely used.

1 is an exploded perspective view showing an example of an antenna device according to the prior art.

As shown in FIG. 1, the antenna device 1 according to the prior art has a plurality of radiating elements 35 output in a desired direction to the front side of the antenna housing main body 10 in the beam output direction to facilitate beam forming. Arranged, a radome (50) is mounted on the front end of the antenna housing main body (10) with a plurality of radiating elements (35) interposed thereto for protection from the external environment.

More specifically, the antenna device 1 according to the prior art includes an antenna housing body 10 that is provided in the shape of a thin rectangular enclosure with an open front and a plurality of heat dissipation fins 11 integrally formed on the rear, and an antenna housing. It includes a main board 20 stacked on the rear inside the main body 10 and an antenna board 30 stacked on the front inside the antenna housing main body 10.

On the front of the antenna board 30, patch-type radiating elements or dipole-type radiating elements 35 are mounted, and on the front of the antenna housing main body 10, radiating elements ( A radome 50 may be installed to ensure smooth radiation from 35).

However, in one example (1) of the antenna device according to the prior art, the front part of the antenna housing main body 10 is provided so that the entire front part is shielded by a single radome 50, and the radome 50 dissipates heat of the antenna device. It becomes a hindering factor. Here, when the radome 50 is removed and the radiating elements 35 are exposed to the outside, the antenna board 30 is inevitably exposed to the outside, so protection from the external environment is inevitably very insufficient.

In addition, the antenna board 30 is also made of FR-4, a general PCB material with low thermal conductivity, and is installed in front of the installation space (not shown) where the main board is installed, which is a space that generates a lot of heat, like the radome 50. There is a problem in that it is difficult to change the heat dissipation design to the front in that everything is shielded.

For this reason, not only digital elements but also analog amplification elements must be intensively mounted on the rear side, which is the direction of heat dissipation, between the front and back sides of the main board. As a result, the heat dissipation area is concentrated and the overall heat dissipation performance of the antenna device 1 is greatly reduced. There is a problem.

The present invention was developed to solve the above-described technical problem. An RF module for an antenna that can significantly improve heat dissipation performance by enabling distributed heat dissipation to the front and rear of the system by placing the antenna RF module in the front so that it is exposed to the outside air. The purpose is to provide an antenna device including the same.

In addition, the present invention provides an RF module for an antenna including a plurality of reflector grill fins that performs the grounding function of radiating elements and simultaneously performs a reflector function to block signal interference with rear electronic elements, and an antenna containing the same. The purpose is to provide a device.

In addition, the present invention is an antenna comprising a plurality of RF modules that are easily assembled into a front housing that divides the installation space of the main board and the front outdoor air space by modularly manufacturing a unit RF filter, a unit radiating element module, and a unit radome cover. Another purpose is to provide an RF module and an antenna device including the same.

In addition, the present invention is an antenna that allows for a simplified design of the front and rear components of the main board by providing the amplifier elements and surge board, which were conventionally mounted on the main board, completely separated from the installation space where the main board is installed or spaced apart from the main board. Another purpose is to provide an RF module and an antenna device including the same.

The technical problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

One embodiment of the RF module for an antenna according to the present invention includes an RF filter arranged on the front of the main board, a radiating element module arranged on the front of the RF filter, and disposed between the main board and the RF filter, on one side in the width direction. or an amplifying unit body having a substrate seating space with an opening on the other side, which is seated inside the amplifying unit body, where the front end of the border is signal-connected to the RF filter, the rear end of the border is signal-connected to the main board, and is provided on one side and the other side. an amplification element module including an amplification unit board on which at least one analog amplification element is mounted, and an amplification unit cover provided to cover the amplification unit board, wherein heat generated from the analog amplification elements of the amplification unit board is One side and the other side in the width direction of the amplification element module are provided through a plurality of amplification unit heat sink fins integrally formed on the outer surface of the amplification unit body and a plurality of amplification unit cover heat sink fins integrally formed on the outer surface of the amplification unit cover. Distributes heat to the outside air in front of the front.

Here, on one of the two sides of the amplification board, one of the PAs implementing 2T2R as the analog amplification element is mounted, and on the other side of the two sides of the amplification part board, a PA implementing 2T2R as the analog amplification element. Another one of them may be mounted and placed.

In addition, the RF filter includes a filter body in which a plurality of cavities are formed to open forward, and resonance bars respectively disposed inside the cavities, and the reflector grill pins are located on the upper, lower, and left sides along the front edge of the filter body. and extending in the right direction, but may be arranged to have a predetermined distance from each other.

Additionally, the reflector grill pin may perform a reflector function together with the filter outer panel disposed to shield the front of the filter body.

Additionally, the reflector grill pin may be set in consideration of the length of the radiating element included in the radiating element module.

Additionally, the RF filter and the reflector grill pin may be manufactured integrally by a die casting mold method using a metal molding material.

Additionally, some of the reflector grill fins may be extended to overlap reflector grill fins formed on adjacent RF filters.

In addition, the RF filter includes a filter body in which a plurality of cavities are formed to open forward, a resonance bar each disposed inside the cavity, and a filter outer panel disposed to shield the front of the filter body, and the radiating element module may be seated and coupled to the inside of the filter body to cover the entire surface of the filter outer panel.

In addition, a plurality of hook coupling parts are formed on the edge of the radome cover, and the radome cover can be hooked to the stepped part of the filter body by engaging the hook coupling parts.

Additionally, the radome cover may be coupled to the filter body while hiding the radiating element module from the outside.

In addition, the amplifying element module can receive signals from the main board and the RF filter, respectively, amplify them by a predetermined value, and output them.

Additionally, the amplifier board may be coupled to the RF filter through a feed through pin terminal and may be coupled to the main board through a socket pin.

Additionally, the amplifier board may be provided with at least one male socket part for coupling with a socket pin to the main board.

Additionally, the RF filter and the radiating element module may be coupled to a feed-through pin via a through-pin terminal.

An antenna device according to an embodiment of the present invention includes a main board on which at least one digital element is mounted on the front or back, a rear housing in the form of an enclosure formed to be open in front of the installation space where the main board is installed, and the rear housing of the rear housing. It includes a front housing arranged to shield the open front and partition the installation space of the rear housing and an external space, and a plurality of RF modules disposed in front of the front housing and connected to the main board through an electrical signal line. And, each of the plurality of RF modules includes an RF filter arranged in front of the main board, a radiating element module arranged in front of the RF filter, and disposed between the main board and the RF filter, with one side or the other side in the width direction. An amplifying unit body having an open substrate seating space, which is seated inside the amplifying unit body, where the front end of the border is signal-connected to the RF filter, the rear end of the border is signal-connected to the main board, and at least one amplification unit body is installed on one side and the other side. An amplification element module including an amplification unit board on which an analog amplification element is mounted and an amplification unit cover provided to cover the amplification unit board, and heat generated from the analog amplification elements of the amplification unit board is generated by the amplification unit. Front external air on one side and the other side of the width direction of the amplification element module is supplied through a plurality of amplification unit heat sink fins integrally formed on the outer surface of the body and a plurality of amplification unit cover heat sink fins integrally formed on the outer surface of the amplification unit cover. Dissipates and dissipates heat.

Here, on one of the two sides of the amplification board, one of the PAs implementing 2T2R as the analog amplification element is mounted, and on the other side of the two sides of the amplification part board, a PA implementing 2T2R as the analog amplification element. Another one of them may be mounted and placed.

In addition, it is arranged to be spaced apart from the rear of the main board in the installation space of the rear housing, but is disposed to have the same front surface as the main board in the installation space of the rear housing and a surge substrate part that is closely disposed on the front of the rear housing. It further includes a PSU board portion disposed on an upper side of the main board, and the surge substrate portion and the PSU board portion and the PSU board portion and the main board may each be electrically connected to each other via at least one bus bar.

Additionally, a plurality of heat dissipation fins may be integrally formed on the front of the front housing.

Additionally, at least one female socket portion for coupling the RF filter and a socket pin may be formed on the front of the main board.

In addition, it further includes an RFIC substrate portion spaced apart from the front of the main board in the installation space of the rear housing, but disposed in close contact with the back of the front housing, and the RFIC substrate portion includes an FPGA device mounted on the main board. RFIC elements corresponding to can be mounted and arranged.

Additionally, the heat generated from the RFIC elements may be heat-conducted and dissipated through surface thermal contact with the front housing.

In addition, the front ends of the plurality of RF modules are located further forward from the edge of the front housing, are coupled to the edge portion of the front housing, and are formed to surround the sides of the plurality of RF modules disposed at the outermost edge. It may further include at least one ventilation panel provided.

Additionally, a plurality of ventilation holes of a predetermined size may be formed in the ventilation panel.

According to an embodiment of the RF module for an antenna and an antenna device including the same according to the present invention, the following various effects can be achieved.

First, by spatially separating the heat generated from the heating elements of the antenna device, distributed heat dissipation to the front and rear of the antenna device is possible, which has the effect of greatly improving heat dissipation performance.

Second, by changing the existing single radome, which interferes with heat dissipation to the front of the antenna, into a unit radome that is combined for each RF module, it is possible to eliminate heat dissipation obstacles and protect the radiating element module more effectively.

Third, the RF-related amplifying elements, which were previously concentrated on the main board, are changed to an RF module along with an RF filter, and the outdoor air space is placed outside the front, which has the effect of greatly improving the overall heat dissipation performance of the antenna device.

Fourth, by separating the RF-related amplification elements and the RFIC board from the main board, the number of layers of the main board, which is a multi-layer board, is greatly reduced, which has the effect of reducing the manufacturing cost of the main board.

Fifth, RF-related parts with frequency dependence are configured as RF modules, and these are detachably coupled to connect signals through a front housing with a more heat dissipation function, preventing defects or defects in individual RF-related parts constituting the antenna device. In case of damage, only the corresponding RF module can be replaced, making maintenance and repair of the antenna device easy.

Sixth, since distributed heat dissipation of the antenna device is possible, the length and volume of the heat sink (heat dissipation fin) formed integrally with the rear housing can be reduced, thereby facilitating the overall slim design of the product.

Seventh, during the configuration of the RF module, the RF filter and amplification element module are completely separated in the front and rear directions, which has the effect of minimizing mutual thermal influence.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is an exploded perspective view showing an example of an antenna device according to the prior art;
Figure 2 is a perspective view showing an antenna device according to an embodiment of the present invention;
Figure 3 is an exploded perspective view of Figure 2,
Figure 4 is an exploded perspective view to explain the attachment and detachment of the RF module assembly to the front housing;
Figure 5 is an exploded perspective view showing the front housing and the rear housing in a separated state;
Figure 6 is an exploded perspective view showing the assembly of the front housing to the rear housing;
Figure 7 is a perspective view showing the configuration of Figure 2 with the ventilation panel removed;
Figures 8a and 8b are exploded perspective views showing the assembly relationship of various boards to the rear housing;
Figure 9 is an exploded perspective view showing the combined state of the surge board part in the structure of Figure 2;
Figure 10 is an exploded perspective view showing the coupling position of the RFIC board part in the configuration of Figure 2;
Figure 11 is an exploded perspective view showing the RFIC board part of Figure 10 coupled to the back of the front housing;
Figure 12 is an exploded perspective view showing the installation of the RF module in the front housing of Figure 2;
Figure 13 is an enlarged perspective view showing the front of the front housing where the RF module is attached and detached and the back of the RF module;
Figure 14 is a cut-away perspective view showing the RF module coupled to the main board;
Figure 15 is a perspective view showing a unit RF module in the configuration of Figure 2,
Figure 16 is an exploded perspective view of Figure 15;
Figures 17a to 17d are exploded perspective views showing the installation of the radiating element module, RF filter, and amplifying element module in the configuration of the RF module,
Figure 18 is an exploded perspective view showing the installation of a radome in the configuration of an RF module;
Figures 19a and 19b are exploded perspective views showing the installation of the amplifying element module in the configuration of the RF module;
Figure 20 is a perspective view showing another embodiment of an amplifying element module in the configuration of an RF module;
Figure 21 is an exploded perspective view showing the installation of the radiating element module, RF filter, and amplifying element module in the configuration of Figure 20,
Figures 22a and 22b are exploded perspective views showing the installation of the amplifying element module in the configuration of Figure 20;
Figures 23a and 23b are exploded perspective views of the radiating element module,
Figure 24 is an exploded perspective view showing the installation of the radome of the radiation director among the configuration of the radiation element module;
Figure 25 is a perspective view and partially enlarged view showing the shape and arrangement of the reflector grill pins in the RF module of Figure 2;
Figure 26 is a partially enlarged perspective view showing the arrangement relationship of the reflector grill pins;
FIGS. 27A and 27B are cross-sectional views and partially enlarged views taken along lines AA and BB of FIG. 15.

Hereinafter, an RF module for an antenna and an antenna device including the same according to an embodiment of the present invention will be described in detail with reference to the attached drawings.

When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing embodiments of the present invention, if detailed descriptions of related known configurations or functions are judged to impede understanding of the embodiments of the present invention, the detailed descriptions will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the component is not limited by the term. Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

In the present invention, a single radome of a conventional antenna device is provided as a unit radome combined for each RF module, and the RF-related components mounted on the main board inside the antenna housing are configured as an RF module with an RF filter or separated from the main board. By doing so, the technical idea is to spatially separate and disperse the heat generated from various heating elements of the antenna device. Hereinafter, the RF module for an antenna and an antenna device including the same will be described based on an embodiment shown in the drawing. do.

FIG. 2 is a perspective view showing an antenna device according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of FIG. 2, FIG. 4 is an exploded perspective view for explaining the attachment and detachment of the RF module assembly to the front housing, and FIG. 5 is an exploded perspective view showing the front housing and the rear housing in a separated state, Figure 6 is an exploded perspective view showing the assembly of the front housing to the rear housing, and Figure 7 is a state in which the ventilation panel is removed in the configuration of Figure 2. It is a perspective view, and Figures 8A and 8B are an exploded perspective view showing the assembly relationship of various boards with respect to the rear housing, Figure 9 is an exploded perspective view showing the connection of the surge board part in the configuration of Figure 2, and Figure 10 is an exploded perspective view of Figure 2. It is an exploded perspective view showing the attachment position of the RFIC board part in the configuration, and FIG. 11 is an exploded perspective view showing the RFIC board part of FIG. 10 coupled to the back of the front housing.

As shown in FIGS. 2 to 7, the antenna device 100 according to an embodiment of the present invention includes a rear housing 110 that forms the rear exterior of the antenna device 100, and a portion of the front exterior of the antenna device. It includes a front housing 140 forming a .

In addition, the antenna device 100 includes a main board 170 installed in close contact with the installation space 115 of the rear housing 110, a PSU board portion 180 disposed on the upper side of the main board 170, and a main board. A surge substrate portion 190 disposed further apart from the rear than 170, an RFIC substrate portion 150 disposed in close contact with the back of the front housing 140, and an antenna stacked on the front of the front housing 140. Includes an RF module (Radio Frequency Module) 200 (hereinafter abbreviated as 'RF module').

The rear housing 110 and the front housing 140 are combined with the RF module 200 to form the overall appearance of the antenna device 1, and, although not shown, are supports provided for installation of the antenna device 100. It can play a role in mediating binding to poles. However, unless there are restrictions on the installation space of the antenna device 100, the combination of the rear housing 110 and the front housing 140 does not necessarily have to be coupled to the support pole, but to a vertical structure such as the inner or outer wall of a building. It is also possible to install and fix it directly as a wall-mounted type. In particular, in the case of the antenna device 100 according to one embodiment of the present invention, it has great significance in that it is designed to be slim to minimize front and rear thickness, making wall-mounted installation easier. This will be explained in more detail later.

The rear housing 110 and the front housing 140 are made of a metal material with excellent thermal conductivity to facilitate heat dissipation due to heat conduction as a whole, and are formed in the shape of a rectangular parallelepiped enclosure with a thin thickness in the front-to-back direction. In particular, the rear housing ( The front of the 110 is formed to be open and has a predetermined installation space 115, thereby providing a main board 170 on which digital devices (e.g., FPGA (Field Programmable Gate Array) devices 173) are mounted, and a PSU (Power It plays a role in mediating the installation of the PSU board unit 180 on which the Supply Unit elements are mounted and the surge board unit 190 on which the surge component elements are mounted.

Meanwhile, although not shown in the drawing, the inner surface of the rear housing 110 is mounted on the rear of the digital element (FPGA element 173, etc.) mounted on the rear of the main board 170 and/or the rear of the PSU board unit 180. It may be formed in a shape that matches the external protruding shape of the PSU element 183, etc., and the surge component elements mounted on the back of the surge substrate unit 190. This is to maximize heat dissipation performance by maximizing the thermal contact area with the back surfaces of the main board 170, the PSU board unit 180, and the surge substrate unit 190.

On both left and right sides of the rear housing 110, a worker in the field carries the antenna device 100 according to an embodiment of the present invention or holds it to facilitate manual installation on a support pole (not shown) or the inner or outer wall of a building. A handle portion 130 may be further installed.

In addition, various external mounting members 400 may be installed on the outside of the lower ends of the antenna housings 110 and 130 for cable connection with a base station device (not shown) and coordination of internal components. The outer mounting member 400 is provided in the form of at least one optical cable connection terminal (socket), and a connection terminal of a coaxial cable (not shown) may be connected to each connection terminal.

Referring to FIG. 2, a plurality of rear heat dissipation fins 111 may be integrally formed on the back of the rear housing 110 to have a predetermined pattern shape. Here, the heat generated from each heating element of the main board 170, PSU board 180, and surge substrate unit 190 installed in the installation space 115 of the rear housing 110 is generated by a plurality of rear heat dissipation fins 111. Heat can be dissipated directly to the rear through .

As shown in (b) of FIG. 4, the plurality of rear heat dissipation fins 111 are arranged to be inclined upward toward the left and right ends based on the center portion of the left and right widths, and radiate heat to the rear of the rear housing 110. The heat may be designed to disperse more quickly by forming an upward airflow distributed to the left and right sides of the rear housing 110, respectively. However, the shape of the rear heat dissipation fin 111 is not necessarily limited to this. For example, although not shown in the drawing, if a blower fan module (not shown) is further provided on the rear side of the rear housing 110 to facilitate the flow of outside air, the heat dissipated by the blower fan module will be dissipated more quickly. To ensure proper discharge, the rear heat dissipation fins 111 may be formed to be parallel to the left and right ends of the blowing fan module disposed in the center, respectively.

In addition, although not shown, a portion of the plurality of rear heat dissipation fins 111 includes a mounting portion (not shown) to which a clamping device (not shown) for coupling the antenna device 1 to the support pole (not shown) is coupled. It can be formed as Here, the clamping device is used to adjust the directionality of the antenna device 100 by rotating and rotating the antenna device 100 according to an embodiment of the present invention installed at the tip of the antenna in the left and right directions or tilting and rotating in the up and down directions. It may be a configuration.

However, a clamping device for tilting and rotating the antenna device 100 does not necessarily have to be coupled to the mounting portion. For example, when installing the antenna device 100 as a wall-mounted type on the inner or outer wall of a building, a clamp panel in the shape of a latch plate that is easy to attach to the wall-mounted type may be coupled to the mounting portion.

Meanwhile, as shown in FIGS. 1 to 7 , one embodiment of the antenna device 1 is arranged to be spaced apart from the rear of the main board 170 in the installation space 115 of the rear housing 110, but is located at the rear. Among the installation space 115 of the surge board portion 190 and the rear housing 110, which are placed in close contact with the front of the housing 110, the front is arranged to match the front of the main board 170, but the main board 170 It may further include a PSU board unit 180 disposed on the upper side.

Here, the front end of the surge substrate 190 is supported on the back of the main board 170, and the rear end is supported by a plurality of spaced-apart supports 197 that are supported on the front of the surge substrate 190. It may be arranged to be spaced a predetermined distance rearward from.

Referring to FIGS. 8A and 8B, the surge substrate unit 190, the PSU board unit 180, the main board 170, and the PSU board unit 180 are electrically connected via at least one bus bar 195 and 185, respectively. can be interconnected.

More specifically, the surge substrate unit 190 is disposed on the relatively lower side of the installation space 115 of the rear housing 110 with the main board 170 in between, and on the contrary, the PSU board unit 180 is located on the main board 170. The bars are disposed on the relatively upper side of the installation space 115 of the rear housing 110 with the board 170 in between, and can be electrically connected to each other via the long type bus bar 195. The ends and middle portions of the long type bus bar 195 can be stably fastened by a plurality of bus bar fastening screws 195'.

Additionally, the PSU board unit 180 is arranged in direct contact with the top of the main board 170, and can be electrically connected to each other via the short-type bus bar 185. Each end of the short type bus bar 185 can be stably fastened and fixed by a plurality of bus bar fastening screws 185'.

Meanwhile, one embodiment of the antenna device 1, as shown in FIGS. 10 and 11, is arranged to be spaced apart from the front of the main board 170 in the installation space 115 of the rear housing 110, but is located at the front. It may further include an RFIC substrate portion 150 disposed in close contact with the rear surface of the housing 140.

In the RFIC substrate unit 150, RFIC elements (not indicated) corresponding to the FPGA elements 173 mounted on the main board 170 may be mounted and arranged. The RFIC substrate unit 150 separates the RFIC elements that were mounted together with the FPGA elements 173 described above on the front or rear of the existing main board 170 from the main board 170, and is substantially a core component of front heat dissipation. It may be arranged to be in surface thermal contact with the back of the front housing 140.

Here, as shown in FIG. 10, the RFIC substrate unit 150 includes a plurality of spaced-apart supports 157, the front end of which is supported on the back of the front housing 140, and the rear end of the unit supported on the front of the main board 170. It can be arranged to be spaced a predetermined distance forward from the main board 170. In this way, by disposing the RFIC substrate 150 forward and away from the main board 170, thermal separation between the RFIC substrate 150 and the main board 170 can be achieved.

At the rear of the RFIC substrate unit 150, as shown in FIG. 11, it can be electrically connected to the main board 170 by penetrating the thermal separator 160 provided for physical and thermal separation from the main board 170. there is.

More specifically, on the front of the RFIC substrate 150, as shown in FIG. 10, the male socket portion 235a of the amplifier substrate 235 and the socket pin are coupled to each other as part of the configuration of the RF module 200 to be described later. A plurality of intermediate female socket portions 155 are formed on the back of the RFIC substrate 150, and an intermediate male socket portion is formed on the back of the RFIC substrate 150 to be coupled with the final female socket portion 171 formed on the front of the main board 170 and a socket pin. (161) can be formed. Here, the middle male socket portion 161 is formed on the back of the RFIC substrate portion 150, and is provided with a thermal separator plate 160 to enable socket pin coupling with the final female socket portion 171 of the main board 170. It may penetrate through and be exposed to the rear side of the thermal separation plate 160.

The middle arm socket portion 150 formed in the RFIC substrate portion 150 may be exposed to the front side through the socket penetration portion 143 (see FIG. 12, described later) formed in the front housing 140. In this way, the male socket portion 235a of the amplification unit substrate 235 may be coupled with the socket pin to the middle female socket portion 155 exposed to the front.

The thermal separator 160 prevents the heat generated from the RFIC substrate 150 from moving toward the installation space 115 of the rear housing 110, which is a relatively rear space, and directly moves to the front through the front housing 140. It is preferable that it is made of an insulating material to induce heat dissipation.

The front housing 140 is installed and seated in the installation space 115 of the rear housing 110 between the main board 170, the PSU board 180, the surge substrate 190, and the front RF module 200. It plays a role in dividing. In addition, the front housing 140 is partitioned to distinguish between the installation space 115 on the rear housing 110 side and other spaces, so that heat generated in the installation space 115 on the rear housing 110 side is transmitted through RF. Thermal blocking and separation functions can be performed so as not to affect the module 200.

Here, the meaning of 'thermal blocking' is that the heat generated from the RF module 200 located on the front exterior air (or front space), defined as the front front of the front housing 140, is blocked from the rear space of the front housing 140 ( In other words, it is desirable to understand it as blocking heat intrusion into the installation space 115 of the rear housing 110, and the meaning of 'thermal separation' is the It is desirable to understand that the thermal configuration is arranged separately to enable heat dissipation to the front as well as to the rear by separating some of the plurality of heat generating elements distributed and distributedly mounted on the front and back of the main board 170.

A plurality of heat dissipation fins 141 may be integrally formed on the front of the front housing 140. The front housing 140 and the plurality of heat dissipation fins 141 are made of a metal material with excellent thermal conductivity, and heat or RFIC elements in the installation space 115 of the rear housing 110 are transmitted through the front housing 140. The heat generated from the fields can be easily dissipated forward through heat conduction.

In addition, an embodiment of the antenna device 100 according to the present invention may further include at least one ventilation panel 120, 120a to 120d, as shown in FIG. 6. The front ends of the plurality of RF modules 200 are positioned further forward from the edge of the front housing 140, and at least one ventilation panel 120, 120a ~ 120d is coupled to the edge of the front housing 140, It can be combined in a form that surrounds the sides of the plurality of RF modules 200 disposed on the outermost side.

In one embodiment of the antenna device 100 according to the present invention, as shown in FIG. 6, each of the first ventilation panel 120a and the second ventilation panel 120b is coupled to the front of the front housing 140. In addition to being coupled to shield the upper and lower portions of the RF modules 200 located at the upper and lower portions of the plurality of RF modules 200, each of the third ventilation panel 120c and the fourth ventilation panel 120b is, It may be combined to shield the left and right sides of the RF module 200 located on the left and right sides of the plurality of RF modules 200 coupled to the front of the front housing 140.

Here, ventilation holes of a predetermined size are formed throughout at least one of the ventilation panels 120 and 120a to 120d, and external air from the external space flows into the front side of the front housing 140 through the ventilation holes. Since the heat radiated to the front can flow out smoothly to the external space, ventilation can be increased. If the ventilation of outdoor air is increased, the heat dissipation performance toward the front side of the front housing 140 can be greatly improved.

In addition, as will be described later, the RF module 200 is exposed to the front outside air, which is defined as the front front of the front housing 140, and at least one ventilation panel 120 is exposed to the front outside air. ), it can serve to block external access by unauthorized users without access rights as well as external foreign substances.

Here, as referred to in FIG. 5, a plurality of fastening screws 125 are sequentially connected to a plurality of ventilation panel fastening grooves 120' formed at the rear end of at least one ventilation panel 120 and of the front housing 140. At least one ventilation panel 120 may be coupled to the edge portion of the front housing 140 by engaging the ventilation panel fastening holes 140' formed to be spaced apart along the edges of the edge.

In addition, as shown in FIG. 7, at least one ventilation panel 120 includes a reflector grill pin 224 and a front housing 140 formed integrally with the RF filter 220 among the components of the RF module 200 to be described later. ) are provided to be spaced apart, so that the front end portion can be electrically connected to the reflector grill pin 224 so that the ground (GND) role, which is a part of the function of the reflector grill pin 224, can be smoothly performed.

Figure 12 is an exploded perspective view showing the installation of the RF module on the front housing of the configuration of Figure 2, Figure 13 is an enlarged perspective view showing the front of the front housing and the back of the RF module where the RF module is attached and detached, and Figure 14 is It is a cut-away perspective view showing the coupling of the RF module to the main board, Figure 15 is a perspective view showing the unit RF module in the configuration of Figure 2, Figure 16 is an exploded perspective view of Figure 15, and Figures 17a to 17d are of the RF module. It is an exploded perspective view showing the installation of the radiating element module, RF filter, and amplifying element module during the configuration. Figure 18 is an exploded perspective view showing the installation of the radome during the configuration of the RF module, and Figures 19a and 19b are during the configuration of the RF module. This is an exploded perspective view showing the installation of the amplification element module.

12 to 19D, an embodiment of the RF module 200 for an antenna according to the present invention includes an RF filter 220 arranged on the front of the main board 170, and an RF filter 220 on the front of the RF filter 220. It is disposed between the radiating element module 210, the RF filter 220, and the radiating element module 210 to ground the radiating element module 210, and from the front to the back of the RF filter 220. It includes at least one reflector grill fin 224 that introduces outdoor air into or outflows outdoor air from the rear of the RF filter to the front.

The RF module 200 is a collection of analog RF components. For example, the amplification element module 230 is an RF component including an amplifier board 235 on which an analog amplification element that amplifies an RF signal is mounted, and an RF filter ( 220) is an RF component for frequency filtering the input RF signal to a desired frequency band, and the radiating element module 210 is an RF component that receives and transmits the RF signal.

Therefore, the RF module 200 for an antenna according to the present invention can be defined as follows as another embodiment.

The RF module 200 for an antenna according to the present invention is an RF module 200 for an antenna including an analog RF component, wherein the analog RF component includes an RF filter 220 and an RF filter disposed in front of the RF filter 220. It may be implemented in an embodiment that includes a radiating element module 210 and an analog amplifying element (not shown) on the amplifying element module 230 disposed behind the RF filter 220.

Here, the amplification element module 230 may be electrically connected to the main board 170 inside the rear housing 110 via an amplification board 235, which will be described later. In addition, it has already been described that the RFIC substrate 150 may be interposed between the amplifier substrate 235 and the main board 170 for such electrical connection.

Meanwhile, the RF module assembly 300 for an antenna, which will be described later, can be formed by providing a plurality of RF modules 200 implemented in various embodiments described above. Therefore, from the perspective of a manufacturer of RF components, a plurality of RF modules 200 are pre-assembled in the front housing 140, or each RF module 200 or RF module assembly 300 can be pre-assembled on a module basis. ) It has the advantage of creating a new market environment as it becomes possible to manufacture, distribute and sell RF components individually.

In addition, at least one reflector grill pin 224 may be integrally molded with the RF filter 220. That is, the RF filter 220 can be manufactured by a die casting mold method using a molding material made of metal. Here, since the reflector grill pin 224 is also made of a metal material for its function, the RF filter 220 and the reflector grill pin 224 are manufactured using a molding material of the same metal component. It can be manufactured in one piece using the same die casting mold method. However, the material of the RF filter 220 and the reflector grill pin 224 is not necessarily limited to a metal material, and may be formed of a dielectric material, but it may also be possible to form a film of a conductive material on the outer surface.

Here, an embodiment of the RF module 200 for an antenna according to the present invention is an amplification device disposed between the main board 170 and the RF filter 220 and equipped with at least one analog amplification element (not indicated). It may further include a device module 230.

In this way, the RF module 200, in which the radiating element module 210 is coupled to the front and the amplifying element module 230 to the rear, centered on the RF filter 220, is as shown in FIGS. 12 to 14. , each unit module may be coupled with a socket pin to the main board 170 via the front housing 140.

To this end, as shown in FIGS. 12 to 14, a socket penetrating portion 143 is formed to penetrate the front housing 140 in the front-to-rear direction, and a contact portion 147 is formed around the socket penetrating portion 143. can be formed. A ring installation groove 149 may be formed in the contact portion 147 into which a foreign matter inflow prevention ring 144, which will be described later, is inserted and interposed. In addition, module assembly screws 146 for installing the RF module 200 may be provided inside the socket penetrating portion 143 to be spaced vertically. The module assembly screw 146 may be assembled through the rear portion of the front housing 140 forward and fastened to the rear side of the RF module 200.

Meanwhile, as shown in (b) of FIG. 13, the rear portion of the RF module 200 is exposed rearwardly through penetration of the male socket portion 235a of the amplification substrate 235, which will be described later, and the front housing 140 ) The joining flange 238 may be formed to be joined to the contact portion 147 of the. A screw boss 239 to which the module assembly screw 146 is fastened may be formed on the joint flange 238.

Here, the RF module 200 is provided to be exposed to the outside air in front of the front housing 140, so it is necessary to prevent foreign substances, including rain or dust, from entering. The RF module 200 according to an embodiment of the present invention is, as shown in FIG. 14, the joint flange 238 of the RF module 200 is in close contact with the contact portion 147 of the front housing 140. When the fastening force is increased using the module assembly screw 146 through operation, the foreign matter inflow prevention ring 144 disposed in the ring installation groove 149 is connected to the joint flange 238 and the front housing 140 of the RF module 200. The space between the adhesive parts can be sealed.

Meanwhile, the amplification element module 230 receives the signal from the main board 170 and the signal from the RF filter 220, amplifies it by a predetermined value, and outputs the signal.

Here, the amplification element module 230 is seated inside the amplification unit body 231 and an amplification unit body 231 having a substrate seating space 233 open on one side or the other side in the width direction, and the edge front end is RF. The signal is connected to the filter 220, and the rear end of the border is connected to the main board 170 (if the RFIC substrate 150 is provided separately from the main board 170, the RFIC substrate 150 corresponds to this) and the signal. It may include a connected amplification unit substrate 235 and an amplification unit cover 236 provided to cover the amplification unit substrate 235.

As shown in FIGS. 17A to 17D, this amplification element module 230 is easily electrically connected to the RF filter 220, which will be described later, through feed-through pin coupling, and the amplification unit body 231 Physical coupling can be achieved through the module assembly screws 250 fastened through the screw assembly grooves 234a of the assembly panel 234 formed in .

The amplification unit substrate 235 is coupled to the RF filter 220 through a feed through-pin terminal 226, and is connected to the main board 170 (more preferably, the RFIC substrate unit ( 150)) can be combined with a socket pin.

In addition, the amplifier board 235 is coupled with a socket pin to the main board 170 (or, in an embodiment in which the RFIC board part 150 is provided separately from the main board 170, the RFIC board part 150). At least one male socket portion 235a may be provided to achieve this.

The amplification unit substrate 235 is tightly coupled to the inner surface of the amplification unit body 231, and the heat generated from the analog amplification elements of the amplification unit board 235 is transmitted to the external space on the outer surface of the amplification unit body 231. A plurality of heat sink fins 232 for dissipating heat may be formed integrally. At least one of a PA element and an LNA element may be mounted on the amplifier board 235 as an analog amplification element.

The analog amplification elements (PA element and LNA element), which are the main heating elements, were conventionally mounted on the main board 170 provided in the installation space 115 between the rear housing 110 and the front housing 140. In the case of one embodiment of the present invention, the installation space is manufactured as a module unit such as the amplification element module 230, and the design is changed to be exposed to the front outside air, which is defined as the front space of the front housing 140, which is a space where heat dissipation is easy. (115) It can create the advantage of dispersing the thermal overload of the phase and improving heat dissipation performance.

Here, the amplification unit substrate 235 is installed so that one side is in close contact with the inner surface of the substrate seating space 233 of the amplification unit body 231, as shown in FIGS. 19A and 19B, and is one of the analog amplification elements. Two PAs (251, 252), which are power amplifiers, can be mounted on the other side to form 2T2R.

Heat generated from the two PAs 251 and 252 can be easily dissipated to the outside through a plurality of amplifier heat sink fins 232 integrally formed adjacent to the inner surface of the substrate seating space 233.

Figure 20 is a perspective view showing another embodiment of the amplifying element module in the configuration of the RF module, and Figure 21 is an exploded perspective view showing the installation of the radiating element module, the RF filter, and the amplifying element module in the configuration of Figure 20, Figures 22a and Figure 22b is an exploded perspective view showing the installation of the amplifying element module in the configuration of Figure 20.

In one embodiment of the amplification element module 230 described with reference to FIGS. 15 to 19b, the amplification unit substrate 235 is installed in the substrate seating space 233 on one side (or the other side) in the open width direction of the amplification unit body 231. ) is seated, and analog amplification elements (PA elements and LNA elements) are mounted only on the opposite side (the other side) opposite to the open side of the amplification unit body 231 among both sides of the amplification unit board 235, and have a heat dissipation function. It is designed to dissipate heat generated from analog amplification elements through a plurality of amplification unit heat sink fins 232 formed integrally with the amplification unit body 231 to perform.

However, the two PAs 251 and 252 do not necessarily have to be centrally installed on the other side of the amplifier board 235, and as shown in FIGS. 20 to 22B, one each is mounted on both sides of the amplifier board 235. can be placed. That is, as referred to in FIG. 22A, one 251 of the PAs 251 and 252 implementing 2T2R in one RF module 200a is connected to the other side of the amplification unit substrate 235 (i.e., the amplification unit cover 236a to be described later). It can be mounted and arranged to implement 1T1R on the side opposite to the ) side. In addition, as referred to in FIG. 22b, the other 252 of the PAs 251 and 252 implementing 2T2R in one RF module 200a is connected to one side of the amplifier substrate 235 (i.e., the substrate seating space 233). It can be mounted and arranged to implement 1T1R on the surface facing the inner surface of the . Therefore, each side of the amplifier substrate 235 implements 1T1R, and one RF module 200a implements 2T2R.

In addition, as referred to in FIGS. 22A and 22B, the outer surface of the amplification unit cover 236a provided to cover the substrate seating space 233 of the amplification unit body 231 has a surface outside the amplification unit body 231 described above. A plurality of amplification unit heat sink fins 232 integrally formed on the side and a corresponding plurality of amplification unit cover heat sink fins 236b may be formed integrally.

According to another embodiment of the amplification element module 230 configured as described above, two PAs 251 and 252 implementing 2T2R within one RF module 200a are each installed on both sides of the amplifier board 235 with 1T1R. By dispersing the heat generated from both sides of the amplification unit substrate 235 and dissipating it through both sides of the amplification unit body 231 and the amplification unit cover 236a, heat dissipation performance can be maximized. provides.

Meanwhile, as shown in FIG. 16, the RF filter 220 includes a filter body 221 in which a plurality of cavities 222 are formed to open forward, and a resonance bar 223 each disposed inside the cavities 222. It may include a filter outer panel 228 arranged to shield the front of the filter body 221. A filter tuning cover 227 may be coupled between the filter outer panel 228 and the filter body 221.

Here, the radiating element module 210 may be seated and coupled to the inside of the filter body 221 to cover the entire surface of the filter outer panel 228.

Meanwhile, the RF module 200 may further include a radome cover 240 that is coupled to the front end of the RF filter 220 and protects the radiating element module 210 from the outside.

A plurality of hook coupling portions 241 are formed on the edge of the radome cover 240, and the radome cover 240 can be hooked to the step portion of the filter body 221 by engaging the hook coupling portion. In other words, the material of the radome cover 240 may be made of a resin material that facilitates the transmission of radio waves, and since the heat generated when the radiating element module 210 is driven is minimal, it may be made of an insulating material unrelated to heat dissipation. Does not matter.

The material of the radome cover 240 is made of the same material as that of the existing single radome panel, but can be divided into one unit for each RF module 200 and then combined.

The radome cover 240 may serve to protect the radiating element module 210 from the external environment (foreign substances, etc.) by being coupled to the filter body 221 while hiding the radiating element module 210 from the outside. In particular, the radome cover 240, although not shown in the drawing, is installed so that the RF module 200 is exposed to the front outside air, which is the front space of the front housing 140, so that foreign substances such as rainwater are exposed to the radiating element module 210. It is desirable to have a sealing structure that completely blocks inflow into the provided interior.

Here, the RF filter 220 and the radiating element module 210 are electrically connected to each other through a feed through-pin coupling method via the through-pin terminal 226, as shown in FIG. 18. can be connected

Hereinafter, the RF module 200 for an antenna according to the present invention implemented in various embodiments described above will be described in more detail with reference to the attached drawings.

As shown in FIGS. 10 to 14, the RF module 200 may be stacked and arranged on the front of the main board 170 via the front housing 140.

In the antenna device 100 according to an embodiment of the present invention, a plurality of RF modules 200 are provided to form one component of the RF module assembly 300 for an antenna.

Here, as shown in FIGS. 10 and 12, a total of eight RF modules 220 are arranged adjacently in the left and right directions, and a plurality of such RF modules 200 are arranged in a total of four rows in the vertical direction. What has been adopted is adopted. However, it is not necessarily limited to this, and it is natural that the arrangement position and number of RF modules 200 can be designed and modified in various ways.

In addition, in one embodiment of the present invention, the RF filter 220 has a predetermined cavity 222 formed on one side, and a resonance bar 223 composed of a DR (Dielectric Resonator) or a metallic resonance rod within the cavity 222. Although it is explained as an example that it is a cavity filter provided, the RF filter 220 is not limited to this and various filters such as dielectric filters can be adopted.

In addition, a plurality of radiating element modules 210 are combined to correspond to the number of each of the plurality of RF filters 220, and each of the radiating element modules 210 can implement 2T2R. Accordingly, the antenna device 100 according to an embodiment of the present invention illustrates a model in which a total of 64T64R is implemented, but is not limited thereto. For example, if the radiating element placement area can be doubled, it is possible for each of the radiating element modules 210 to be equipped to implement 1T1R, and assuming that heat dissipation performance can be further improved, the radiating element module 210 ) It is also possible for each to be equipped to implement 4T4R.

Generally, in order to implement beamforming, a plurality of radiating element modules 210 are required as an array antenna, and the multiple radiating element modules 210 generate a narrow directional beam. This can increase the concentration of radio waves in a designated direction. Recently, a number of radiating element modules 210 are dipole-type dipole antennas or patch-type patch antennas are used with the highest frequency, and are designed and arranged to be spaced apart to minimize mutual signal interference. do.

Figures 23a and 23b are exploded perspective views of the radiating element module, and Figure 24 is an exploded perspective view showing the installation of the radiating director to the radome among the configuration of the radiating element module.

In one embodiment of the RF module 200 for an antenna according to the present invention, the radiating element module 210 is formed to be long up and down, as shown in FIGS. 23A and 23B, and includes a plurality of RF filters 220 A printed circuit board for radiating elements 211 arranged on the front, respectively, at least one antenna patch circuit 212 formed with a pattern printed on the front of the printed circuit board 211 for radiating elements, and at least one antenna patch circuit 212 ) It may include a feed line 213 that feeds each of them.

On the front of the printed circuit board 211 for the radiating element, as shown in FIG. 23A, the above-described antenna patch circuit unit is a dual polarization patch element that generates a dual polarization of either orthogonal ±45 polarization or vertical/horizontal polarization. (163) can be printed and formed. Three antenna patch circuit units 212 may be printed and formed to be spaced apart in the vertical direction (longitudinal direction), and each antenna patch circuit unit 212 may be interconnected by a feed line 213.

Meanwhile, on the printed circuit board 211 for a radiating element, as shown in FIG. 23b, an input-side feeding line and an output-side feeding line are formed by branching from the feed line 213 to apply or output a feed signal, and the input-side feeding line At the front end of the line and the output-side feeding line, an input-side through-hole 214a and an output-side through-hole 214b for inserting the through-pin terminal disposed at the rear of the radiating element printed circuit board 211 may be formed to penetrate. A through-pin terminal 226, which is one of the components of the RF filter 220, is inserted into the input-side through-hole 214a and the output-side through-hole 214b, respectively, and can be connected to the power supply line 213.

Meanwhile, the radiation director 217 is made of a thermally conductive or conductive metal material and is electrically connected to the antenna patch circuit 212. The radiation director 217 may serve to guide the direction of the radiation beam in an omnidirectional direction. In the RF module 200 for an antenna according to an embodiment of the present invention, a total of three radiation directors 217 are disposed in each RF module 200 to secure maximum gain.

In addition, the radiation director 217 has a plurality of coupling holes 217a into which a plurality of coupling protrusions 247a formed on the back of the radome cover 24 are respectively fitted, as shown in FIGS. 23A and 23B. can be formed.

Therefore, as shown in FIG. 24, the radiation director 217 includes a plurality of coupling protrusions 247a and a plurality of coupling projections 247a described above on the back of the radome cover 240 together with the printed circuit board 211 for radiating elements. After the modules are coupled through the hole 217a, the radome cover 240 can be easily assembled by coupling the radome cover 240 to the RF filter 220 through the hook coupling portion 241.

Generally, in an antenna device, a reflector provides a ground for the antenna circuit and functions as a reflective surface. For example, the rear radiation of a dual polarized antenna is reflected in the main radiation direction, thereby improving the beam efficiency of the dual polarized antenna. In one embodiment of the present invention, the reflector grill pin 224 and the outer panel 228, which will be described later, may perform a reflector function together.

FIG. 25 is a perspective view and a partially enlarged view showing the shape and arrangement of the reflector grill pins in the RF module of FIG. 2, and FIG. 26 is a partially enlarged perspective view showing the arrangement relationship of the reflector grill pins.

As shown in FIGS. 25 and 26, the reflector grill fin 224 is formed by combining the reflector grill fins 224 of adjacent RF filters 220 to form a mesh shape in which a grill-shaped heat dissipation hole is formed. It can be achieved. The plurality of heat dissipation holes formed by the plurality of reflector grill fins 224 allow heat radiated from the front housing 140, which is the rear side of the relatively rear plurality of RF filters 220, to be easily ventilated to the external space. As a configuration that plays a role, it can serve as a heat discharge hole that discharges heat generated inside between the front of the front housing 140 and the reflector grill fin 224 to the outside. Accordingly, it is possible to actively use external air for heat dissipation of the antenna device 100.

As shown in FIG. 25, each of the plurality of reflector grill pins 224-1 to 224-4 is installed on one side of the RF filter 220 to perform a sufficient ground (GND) role and at the same time maintain a predetermined ventilation performance. The formed reflector grill pins 224-1, 224-3 and the reflector grill pins 224-2, 224-4 formed on the other side of the RF filter 220 adjacent to them do not contact each other, but overlap each other on an arbitrary vertical line (i.e. , may be formed to extend (so as to overlap). In this way, by arranging the reflector grill pins 224-1 and 224-2 to overlap each other, there is an advantage that the ground sharing area on the side of the antenna increases.

Here, the spacing (d1, d2) between the reflector grill pins 224 can be appropriately designed by simulating their durability and heat dissipation characteristics, preferably considering the arrangement spacing of the radiating elements included in the radiating element module 210. It can be set as follows. In addition, the spacing (d1, d2) between the reflector grill pins 224 may be designed in consideration of the wavelength of the operating frequency, as will be described later. For example, in order to reduce radio wave loss, the spacing (d) between the reflector grill pins 224 can be set to 1/20λ or less of the operating frequency.

In addition, the spacing between the reflector grill pins 224 in one RF module 200 is less than 1/10λ, and when multiple RF modules 200 are assembled, the reflector grill pins 224 are staggered and have a size of less than 1/20λ. A hole can be formed.

For example, the spacing (d1, d2) between the reflector grill pins 224 may be set to have a size within the range of 1/10λ to 1/20λ of the operating frequency. Here, the spacing 1/10λ has meaning as the upper limit threshold for performing a sufficient ground (GND) role of the radiating element module 210, and the spacing 1/20λ is the heat radiation hole formed by the plurality of reflector grill fins 224. It has meaning as a lower threshold to secure the minimum flow of external air through .

Therefore, the spacing (d1, d2) between the reflector grill pins 224 is preferably formed to have a range greater than 1/20λ of the operating frequency and smaller than 1/10λ of the operating frequency.

In addition, the reflector grill pin 224 is arranged to cover the front surface of the plurality of RF filters 220 together with the filter outer panel 228 described above, and can serve as a ground for the plurality of radiating element modules 210. . For this purpose, the filter outer panel 228, the filter body 221 of the RF filter 220, and the reflector grill pin 224 are all preferably made of metal.

In terms of the ground (GND) function, the reflector grill pin 224 serves as a common ground between the plurality of RF filters 220 and the plurality of heat dissipation element modules 210 along with the above-mentioned filter outer panel 228. It can be defined as a configuration that performs the function of expanding an area.

Furthermore, the reflector grill pin 224 not only performs the role of grounding the radiating element module 210, but also serves to connect the RF filter 220 exposed to the front outdoor air, which is defined as the front front of the front housing 130, from the outside. It can also play a protective role.

FIGS. 27A and 27B are cross-sectional views and partially enlarged views taken along lines A-A and B-B of FIG. 15.

Referring to Figure 27a, with the radiating element module 210 coupled to the radome cover 240, when the radome cover 240 is assembled in close contact with the RF filter 220 toward the rear, at the same time, the through pin terminal 226 ), an assembly force is generated toward the connection space (226a) provided, and the assembly tolerance is eliminated by receiving elastic support from the elastic ground washer (226b) disposed on the front side of the connection space (226a), and the feed through pin is moved directly from the designated position. The combination is complete.

In addition, referring to FIG. 27b, when the RF filter 220 and the amplification device module 230 are tightly coupled to each other, the through pin terminal 229 is provided inside the RF filter 220 and is connected to the amplification device module 230. When connected to the through-pin connection terminal 229c, which mediates the electrical connection of Thrupine bonding may be completed.

Therefore, the assembly of each component of the RF module 200 is completed in a simple manner by combining each feed through pin, and at the same time, in connecting the RF module 200 itself to the front of the main board 170, as described above. The overall assembly can be greatly improved by the simple operation of combining socket pins.

As such, the antenna device 100 according to an embodiment of the present invention is provided with a single existing radome as a unit radome cover 240 separated for each RF module 200, so that each radiating element module 210 effectively protects the internal system heat of the antenna device 100 and can be easily dissipated in all directions, including the front as well as the rear, thereby significantly improving heat dissipation performance compared to the prior art.

Above, an embodiment of an RF module for an antenna and an antenna device including the same according to the present invention has been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiments, and it is natural that various modifications and equivalent implementations can be made by those skilled in the art in the technical field to which the present invention pertains. . Therefore, the true scope of rights of the present invention will be determined by the claims described later.

100: antenna device 110: rear housing
111: rear heat dissipation fin 115: installation space
120, 120a ~ 120d: Ventilation panel 130: Handle part
140: Front housing 141: Front heat dissipation fin
143: Socket penetration part 144: Foreign matter inflow prevention ring
146: module assembly screw 147: face attachment part
149: Ring installation groove 150: RFIC substrate part
153: RFIC elements 155: middle female socket portion
157: Separation supporter 160: Thermal separation plate
161: Middle male socket 170: Main board
171: final arm socket 173: digital device
180: PSU board part 183: PSU element
185: Busbar 185': Busbar fastening screw
190: surge substrate 195: bus bar
195': Busbar fastening screw 200: RF module
210: Radiating element module 211: Printed circuit board for radiating element
212: antenna patch circuit 213: feed line
214a: input side through hole 214b: output side through hole
217: Radiating director 217a: Multiple coupling holes
220: RF filter 221: filter body
222: cavity 223: resonant bar
224: Reflector grill pin 226: Through pin terminal
227: Filter tuning cover 228: Filter outer panel
229: through pin terminal 230: amplification element module
231: Amplification unit body 232: Amplification unit heat sink fin
233: Board seating space 234: Assembly panel
235: Amplification unit substrate 235a: Male socket unit
236: Amplification unit cover 238: Joint flange
239: screw boss 240: radome cover
241: Hook coupling portion 247a: Multiple coupling protrusions
250: module assembly screw 300: antenna RF module assembly
400: outer mounting member

Claims (24)

RF filter arranged on the front of the main board;
A radiating element module disposed in front of the RF filter; and
An amplifying unit body disposed between the main board and the RF filter and having a substrate seating space open on one side or the other side in the width direction, seated inside the amplifying unit body, the edge front end of which is signal connected to the RF filter, The rear end of the border is signal-connected to the main board, and includes an amplification element module including an amplification unit board on which at least one analog amplification element is mounted on one side and the other side, and an amplification unit cover provided to cover the amplification unit board; Including,
The heat generated from the analog amplification elements of the amplification unit substrate is generated by a plurality of amplification unit heat sink fins integrally formed on the outer surface of the amplification unit body and a plurality of amplification unit covers integrally formed on the outer surface of the amplification unit cover. An RF module for an antenna that distributes heat dissipation to the outside air in front of one side and the other side of the width direction of the amplification element module through a heat sink fin. In claim 1,
On one of both sides of the amplifier board, one of the PAs implementing 2T2R as the analog amplification element is mounted,
An RF module for an antenna, wherein the other one of the PAs implementing 2T2R as the analog amplification element is mounted on the other side of the two sides of the amplifier board. In claim 1,
It is disposed between the RF filter and the radiating element module to ground (GND) the radiating element module, and introduces external air from the front to the rear of the RF filter or discharges external air from the rear to the front of the RF filter. at least one reflector grill fin; and
A radome cover coupled to the front of the RF filter and protecting the radiating element module from the outside; It further includes,
The at least one reflector grill pin is integrally molded with the RF filter. In claim 3,
The RF filter includes a filter body formed with a plurality of cavities opening forward, and a resonance bar each disposed inside the cavities; Including,
The reflector grill pins extend in the upper, lower, left, and right directions along the front edge of the filter body, and are arranged and formed to have a predetermined separation distance from each other. In claim 4,
The reflector grill pin performs a reflector function together with a filter outer panel arranged to shield the front of the filter body. In claim 4,
The reflector grill pin is an RF module for an antenna set in consideration of the length of the radiating element included in the radiating element module. In claim 3,
An RF module for an antenna in which the RF filter and the reflector grill pin are manufactured integrally by a die casting mold method using a metal molding material. In claim 3,
Some of the reflector grill fins are formed to extend to overlap each other with reflector grill fins formed in adjacent RF filters. In claim 1,
The RF filter is,
A filter body formed with a plurality of cavities opening forward;
Resonant bars each disposed inside the cavity; and
a filter outer panel disposed to shield the front of the filter body; Including,
The radiating element module is an RF module for an antenna, which is seated and coupled to the inside of the filter body so as to cover the entire surface of the filter outer panel. In claim 9,
A radome cover coupled to the front of the RF filter and protecting the radiating element module from the outside; It further includes,
A plurality of hook coupling parts are formed on the edge of the radome cover,
The radome cover is hooked to the step portion of the filter body by engaging the hook coupling portion. In claim 10,
The radome cover is coupled to the filter body while hiding the radiating element module from the outside. In claim 1,
The amplification element module is an RF module for an antenna that receives a signal from the main board and a signal from the RF filter, amplifies the signal by a predetermined value, and outputs the signal. In claim 1,
The amplifier board is coupled to the RF filter through a feed-through pin and a through-pin terminal, and is coupled to the main board through a socket pin. In claim 13,
An RF module for an antenna, wherein the amplifier board is provided with at least one male socket part for coupling with a socket pin to the main board. In claim 1,
The RF filter and the radiating element module are coupled to a feed-through pin via a through-pin terminal. A main board with at least one digital element mounted on the front or back side;
a rear housing in the form of an enclosure formed to be open in front of the installation space where the main board is installed;
a front housing arranged to shield the open front of the rear housing and to partition an installation space of the rear housing and an external space; and
a plurality of RF modules disposed in front of the front housing and connected to the main board through electrical signal lines; Including,
Each of the plurality of RF modules,
an RF filter arranged on the front of the main board;
A radiating element module disposed in front of the RF filter; and
An amplifying unit body disposed between the main board and the RF filter and having a substrate seating space open on one side or the other side in the width direction, seated inside the amplifying unit body, the edge front end of which is signal connected to the RF filter, The rear end of the border is signal-connected to the main board, and includes an amplification element module including an amplification unit board on which at least one analog amplification element is mounted on one side and the other side, and an amplification unit cover provided to cover the amplification unit board; Including,
The heat generated from the analog amplification elements of the amplification unit substrate is generated by a plurality of amplification unit heat sink fins integrally formed on the outer surface of the amplification unit body and a plurality of amplification unit covers integrally formed on the outer surface of the amplification unit cover. An antenna device that distributes heat to the outside air in front of one side and the other side of the amplification element module in the width direction through a heat sink fin. In claim 16,
On one of both sides of the amplifier board, one of the PAs implementing 2T2R as the analog amplification element is mounted,
An antenna device, wherein the other one of the PAs implementing 2T2R as the analog amplification element is mounted on the other side of the amplification unit board. In claim 16,
a surge board portion disposed to be spaced apart from the rear of the main board in the installation space of the rear housing and in close contact with the front of the rear housing; and
a PSU board portion arranged to have the same front surface as the main board in the installation space of the rear housing and disposed above the main board; It further includes,
The antenna device wherein the surge substrate unit and the PSU board unit, and the PSU board unit and the main board are each electrically connected via at least one bus bar. In claim 16,
An antenna device in which a plurality of heat dissipation fins are integrally formed on the front of the front housing. In claim 16,
An antenna device in which at least one female socket portion for coupling the RF filter and a socket pin is formed on the front of the main board. In claim 16,
an RFIC substrate portion spaced apart from the front of the main board in the installation space of the rear housing and in close contact with the back of the front housing; It further includes,
An antenna device in which RFIC elements corresponding to FPGA elements mounted on the main board are mounted on the RFIC substrate. In claim 21,
The antenna device is such that heat generated from the RFIC elements is in surface contact with the front housing and is dissipated through heat conduction. In claim 16,
The front ends of the plurality of RF modules are positioned further forward from the edge of the front housing,
At least one ventilation panel coupled to an edge of the front housing and wrapped around sides of the plurality of RF modules disposed at the outermost edge; An antenna device further comprising: In claim 23,
An antenna device in which a plurality of ventilation holes of a predetermined size are formed in the ventilation panel.

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