KR102543846B1 - Rf module, rf module assembly for antenna and an antenna apparatus including the same - Google Patents

Abstract

The present invention relates to an RF module for an antenna, an RF module assembly, and an antenna device including the same, and in particular, an RF filter having at least four outer surfaces, a radiating element module disposed on any one of the outer surfaces of the RF filter, the It is disposed on the other side of the outer surface of the RF filter, and is disposed between the amplification unit board on which the analog amplification element is mounted and the RF filter and the radiating element module to ground (GND) the radiating element module and in the RF filter It includes a reflector for dissipating generated heat to the outside, and is coupled with socket pins in module units to a main board disposed on the antenna housing. According to this, a radome obstructing heat dissipation to the front of the antenna is unnecessary, and by spatially separating the heat generated from the heating elements of the antenna device, it is possible to disperse heat to the front and rear of the antenna device, thereby greatly improving heat dissipation performance. have

Description

RF module for antenna, RF module assembly and antenna device including the same

The present invention relates to an RF module for an antenna, an RF module assembly, and an antenna device including the same, and more particularly, a radome of a conventional antenna device is unnecessary, and a radiating element module and an RF element are placed outside the front of an antenna housing. It relates to an RF module for an antenna, an RF module assembly, and an antenna device including the same that can improve heat dissipation performance, slim manufacturing, and reduce product manufacturing costs by arranging to be exposed.

Base station antennas, including repeaters used in mobile communication systems, have various shapes and structures, and generally have a structure in which a plurality of radiating elements are properly disposed on at least one reflector erected in the longitudinal direction.

Recently, studies are being actively conducted to achieve a compact, lightweight, and low-cost structure while satisfying high-performance requirements for a multiple-input-output (MIMO)-based antenna. In particular, in the case of an antenna device to which a patch-type radiating element for implementing linear polarization or circular polarization is applied, a radiating element made of a dielectric substrate of plastic or ceramic material is usually plated and coupled to a PCB (printed circuit board) through soldering. method is widely used.

1 is an exploded perspective view showing an example of an antenna device according to the prior art.

As shown in FIG. 1, in the antenna device 1 according to the prior art, a plurality of radiating elements 35 are output in a desired direction to facilitate beam forming toward the front side of the antenna housing body 10, which is the beam output direction. Arranged to be exposed, for protection from the external environment, a radome (radome, 50) is mounted on the front end of the antenna housing body (10) with a plurality of radiating elements (35) interposed therebetween.

More specifically, the antenna device 1 according to the prior art includes an antenna housing body 10 having a shape of a thin rectangular parallelepiped housing with an open front surface and having a plurality of heat dissipation fins 11 integrally formed on the rear surface thereof, and an antenna housing It includes a main board 20 stacked on the rear side of the inside of the main body 10 and an antenna board 30 stacked on the front side of the inside of the antenna housing body 10 .

On the front of the antenna board 30, patch-type radiating elements or dipole-type radiating elements 35 are mounted, and on the front of the antenna housing body 10, while protecting each part inside from the outside, the radiating elements 35 ) A radome 50 that allows smooth radiation from can be installed.

However, in one example (1) of the antenna device according to the prior art, since the front portion of the antenna housing body 10 is shielded by the radome 50, the radome 50 itself inhibits frontal heat dissipation of the antenna device. functioning as an element. In addition, the radiating elements 35 are also designed to perform only transmission and reception of RF signals, so heat generated from the radiating elements 35 is not emitted forward. For this reason, there is a problem that the heat dissipation efficiency is greatly reduced because the heat generated in the high heating element inside the antenna housing body 10 must be uniformly discharged to the rear of the antenna housing body 10, and to solve this problem Demand for a new heat dissipation structure design is increasing.

In addition, according to the example (1) of the antenna device according to the prior art, due to the volume of the radome 50 and the volume occupied by the arrangement structure in which the radiating element 35 is spaced from the front of the antenna board 30, the in-building ( It is very difficult to implement a slim-sized base station required for in-building or 5G shadow areas.

The present invention has been made to solve the above technical problem, by removing the radome and disposing the antenna RF module outside the antenna housing so that it is exposed to the outside air, dissipation of heat to the front and rear of the antenna housing is possible, thereby increasing heat dissipation performance. Its object is to provide an RF module for an antenna that can be improved, an RF module assembly, and an antenna device including the same.

In addition, the present invention, in addition to stably protecting the RF filter inside, performing a grounding function between the radiating element and the RF filter, as well as easily dissipating heat generated from the RF filter side to the outside and at the same time radiating element Another object is to provide an RF module for an antenna including a reflector for grounding (GND) and an antenna device including the same.

The technical problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

One embodiment of the RF module for an antenna according to the present invention is an RF filter having at least four outer surfaces, a radiating element module disposed on one of the outer surfaces of the RF filter, and a radiating element module disposed on the other surface of the outer surface of the RF filter. It is disposed, and is disposed between the amplification unit board on which the analog amplification element is mounted and the RF filter and the radiating element module to ground (GND) the radiating element module and to mediate the heat generated in the RF filter to dissipate to the outside. and a reflector for the antenna, and the RF module for the antenna is coupled with a socket pin to the main board disposed in the antenna housing.

Here, the RF module for the antenna before being coupled with the socket pin to the main board, the RF filter is closely installed on the rear surface of the reflector, and then the radiating element module is placed on the front surface of the reflector to generate electrical signals to the RF filter. It can be defined as an assembly closely installed so that a connection is made.

In addition, the amplification unit substrate may be provided inside an amplification unit substrate body disposed parallel to the RF filter, and the RF filter and the amplification unit substrate body may be electrically connected to each other through sliding coupling.

In addition, the RF filter and the amplification unit substrate may be electrically connected by a coaxial connector when the RF filter is slidably coupled to the amplification unit substrate body.

Also, the RF filter and the reflector may be coupled by a fem nut.

In addition, in the reflector, a plurality of installation holes through which the RF filter is installed from the front to the rear and a bending coupling portion bent rearward at an inner rim end portion of the plurality of installation openings are formed, and the fem nut is the bending coupling portion After being fastened to the fem nut fixing hole penetrating in the front and rear directions, the RF filter may be coupled by an operation in which a filter fixing screw penetrating the RF filter passes through the fem nut from front to rear and is fastened.

In addition, the reflector may be laminated and coupled to the front surface of the RF filter, and a plurality of heat sinks may be integrally formed on the rear surface of the reflector so as to protrude backward to accommodate the RF filter.

In addition, the reflector may be stacked and coupled to the rear surface of the RF filter, and a plurality of heat sinks may be integrally formed on the front surface of the reflector so as to protrude forward to accommodate the RF filter.

In addition, the reflector is provided in plural to correspond to the number of the RF filters, and is coupled to shield the front surface of each of the RF filters, and a portion in contact with each of the reflectors may be provided to be in contact with a zigzag shape. there is.

In addition, a plurality of heat radiation holes are formed in the reflector, and the plurality of heat radiation holes are 1/10 of the distance between the radiation element modules when the distance between the radiation element modules is arranged at half-wavelength (1/2λ) intervals. to 1/20 or less in size.

In addition, a plurality of the RF filter, the radiating element module, and the amplification unit substrate may be manufactured in an array form in a vertical direction or a left-right direction and coupled to the front surface of the antenna housing in module units.

In addition, the RF filter includes a filter body having a predetermined space in which the amplification unit substrate is disposed, and in the amplification unit substrate, some of the analog amplification elements are mounted and disposed in close contact with an inner surface of the filter body. and a sub-amplification sub-board on which the remaining part of the analog amplification elements are mounted and stacked on the main amplification sub-board.

In addition, a metal paste via hole filled with a thermally conductive metal component may be formed in a portion of the main amplification unit substrate where the analog amplification element is mounted.

In addition, the analog amplification element mounted on the amplification unit substrate may include an RFIC element.

In addition, the RF filter may include a filter body using one of a cavity filter and a dielectric ceramic filter, and a filter heat sink panel made of a thermally conductive material may be further provided on at least one of both surfaces of the filter body.

In addition, an FPGA module including an FPGA board on which an FPGA device separated from the main board is mounted is disposed on one side of the RF filter, and the socket pin may be coupled to the main board.

In addition, the FPGA module may include an FPGA module body in which the FPGA substrate is disposed, and an element heat sink panel may be disposed on at least one of both end surfaces of the FPGA module body.

In addition, a socket portion is provided at an end of the amplification unit substrate for socket pin coupling to a main board, and a plurality of RF transmission lines and a GND (ground) terminal line are provided in the socket portion, and the plurality of RF transmission lines A terminal pin related to and a terminal pin related to the GND (ground) terminal line may be blanked.

An RF module assembly for an antenna according to an embodiment of the present invention, a plurality of RF filters each having at least four outer surfaces, a plurality of radiating element modules disposed on any one of the outer surfaces of each of the plurality of RF filters, the It is disposed on the other side of the outer surface of each of the plurality of RF filters, and is disposed between the amplifier board on which the analog amplification element is mounted and the plurality of RF filters and the plurality of radiating element modules to ground the radiating element module (GND) In addition, it includes a reflector for mediating heat dissipation to the outside of the heat generated in the RF filter, and the RF module assembly for the antenna is coupled with a socket pin to a main board disposed in the antenna housing.

An antenna device according to an embodiment of the present invention includes a main board on which at least one digital element is mounted on the front or rear surface, an antenna housing in the shape of a housing having an open front so that the main board is installed, and an electrical connection between the main board and the main board. It includes an RF module assembly connected through a signal line, wherein the RF module assembly includes a plurality of RF filters each having at least four outer surfaces, and a plurality of radiating elements disposed on one of the outer surfaces of each of the plurality of RF filters. module, disposed on the other side of the outer surface of each of the plurality of RF filters, and an amplification unit substrate on which an analog amplification element is mounted and disposed between the plurality and the RF filter and the plurality of radiating element modules to ground the radiating element module (GND) and a reflector for mediating heat dissipation to the outside of the heat generated in the RF filter, and the RF module assembly is coupled with a socket pin to the main board of the antenna housing in units of modules.

According to an embodiment of an antenna RF module, an RF module assembly, and an antenna device including the same according to the present invention, the following various effects can be achieved.

First, by spatially separating heat generated from heat generating elements of an antenna device, it is possible to distribute heat to the front and rear of the antenna device, thereby greatly improving heat dissipation performance.

Second, since a radome obstructing heat dissipation toward the front of the antenna is unnecessary, it has the effect of greatly reducing the manufacturing cost of the product.

Third, the RF-related amplification elements conventionally mounted on the main board are configured as an RF module together with an RF filter and placed outside the antenna housing, thereby greatly improving the overall heat dissipation performance of the antenna device.

Fourth, by separating the RF-related amplification elements from the main board, the number of layers of the main board, which is a multi-layer board, is greatly reduced, thereby reducing the manufacturing cost of the main board.

Fifth, by configuring RF components having frequency dependence as an RF module and making them detachable from the antenna housing, when defects or damage to individual RF components constituting the antenna device occur, the corresponding antenna RF module There is an advantage in that maintenance and repair of the antenna device is easy by replacing only the antenna device.

Sixth, since the antenna device can dissipate heat dissipation, it is possible to reduce the length and volume of the heat sink (radiation fin) integrally formed on the rear surface of the antenna housing, so that the slim design of the product as a whole has an easy effect.

Seventh, as heat dissipation is possible through the radiation director performing the radiation function of electromagnetic waves among the radiating element modules, it has the effect of maximizing the front heat dissipation area of the antenna device.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is an exploded perspective view showing an example of an antenna device according to the prior art;
2 is a front perspective view and a rear perspective view showing an antenna device according to an embodiment of the present invention;
3a and 3b are an exploded perspective view of the front part and an exploded perspective view of the rear part of FIG. 2;
4 is a cross-sectional view taken along line AA of FIG. 2 and a partially enlarged view thereof;
5 is a partially cut-away perspective view taken along line BB of FIG. 2 and a partially enlarged view thereof;
6 is a perspective view showing a reflector in the configuration of FIG. 2;
7 is a perspective view showing the installation of the main board to the rear housing in the configuration of FIG. 2;
Figure 8 is an exploded perspective view showing the installation of the RF module to the main board of the configuration of Figure 2,
9 is a perspective view showing a state diagram in which the filter body is separated from the rear housing during the installation process of FIG. 8;
10 is a perspective view showing an RF module in the configuration of FIG. 8;
FIG. 11 is a cross-sectional view taken along line CC of FIG. 10 and is a perspective cut-away perspective view in which the interior is partially projected;
12a and 12b are exploded perspective views showing the RF module of FIG. 10;
13 is a detailed view of an amplification unit substrate of the configuration of the RF module of FIG. 10;
14 is a cutaway perspective view showing the coupling of the amplification unit substrate to the main board;
15 is an exploded perspective view showing an RF module assembled to a main board among the configurations of FIG. 3;
Figure 16 is an exploded perspective view showing the assembly of the radiating element module to the reflector of the configuration of Figure 3,
17 is a conceptual diagram showing a modification of an RF module according to an embodiment of the present invention;
18 is a cross-sectional view showing a modified example of a coupling structure between a reflector and an RF module;
19 is a cross-sectional view showing various modified examples of a heat sink integrated reflector;
20 is a perspective view showing a reflector separated by RF module unit and its coupling structure;
21 is a cross-sectional view and a plan view showing a modified example of an amplifying unit substrate;
22 is a cross-sectional view showing various installation views of a main board and an RF module assembly to a rear housing;
23 is a perspective view showing various modifications of the RF module;
24 is a perspective view showing a heat dissipation structure of a module type FPGA device;
25 is a conceptual diagram showing a detailed arrangement of a socket part of an amplification unit substrate and a female socket part of a main board.

Hereinafter, an RF module for an antenna according to an embodiment of the present invention, an RF module assembly, and an antenna device including the same will be described in detail with reference to the accompanying drawings.

In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the corresponding component is not limited by the term. In addition, unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this application, they should not be interpreted in an ideal or excessively formal meaning. don't

The present invention does not necessarily need to have a radome of a conventional antenna device, and configures RF-related amplifying elements mounted on a main board inside an antenna housing as an RF module together with an RF filter, so that various heating elements of an antenna device The technical idea is to spatially separate the heat generated from the antenna, and hereinafter, an RF module for an antenna, an RF module assembly, an antenna device including the same, and an assembly method of the antenna RF module are based on an embodiment shown in the drawing. be explained by

2 is a front perspective view (a) and a rear perspective view (b) showing an antenna device according to an embodiment of the present invention, and FIGS. 3a and 3b are an exploded perspective view of the front part and an exploded perspective view of the rear part of FIG. 2, 4 is a cross-sectional view taken along the line A-A of FIG. 2 and a partially enlarged view thereof, FIG. 5 is a partially cut perspective view taken along the line B-B of FIG. 2 and a partially enlarged view thereof, and FIG. 6 is a reflector of the configuration of FIG. It is a perspective view shown.

As illustrated in FIGS. 2 to 5 , the antenna device 100 according to an embodiment of the present invention includes an antenna housing 105 forming an external appearance of the antenna device. The antenna housing 105 includes a rear housing 110 forming the exterior of the rear side of the antenna device 100 and a front housing 130 forming the exterior of the front side of the antenna device 100.

In addition, the antenna device 100 according to an embodiment of the present invention includes a main board 120 closely installed in the inner space 110S of the antenna housing 105 and an antenna stacked on the front surface of the front housing 130. It further includes a radio frequency module (RF module) 200 (hereinafter, abbreviated as 'RF module') for use.

The antenna housing 105 is combined with the RF module 200 to form the appearance of the entire antenna device 1 and, although not shown, mediates the coupling to the holding pole provided for installation of the antenna device 100. can fulfill its role. However, unless the installation space of the antenna device 100 is restricted, the antenna housing 105 does not necessarily have to be coupled to the holding pole, and is directly installed and fixed in a wall-mounted type on a vertical structure such as an inner or outer wall of a building. It is also possible. In particular, in the case of the antenna device 100 according to an embodiment of the present invention, it has a great meaning in making wall-mounted installation easier by designing slim to minimize the front and rear thickness. This will be described in more detail later.

The antenna housing 105 is made of a metal material with excellent thermal conductivity so that heat dissipation is advantageous as a whole, and is formed in a rectangular parallelepiped housing shape with a thin thickness in the front-back direction, and the front surface of the rear housing 110 is formed to be open. and has a predetermined internal space 110S, although not shown in the drawing, a main board on which digital elements (eg, Field Programmable Gate Array (FPGA) elements and/or Power Supply Unit (PSU) elements) are mounted. It serves to mediate the installation of (120).

On the other hand, although not shown in the drawing, the inner surface of the rear housing 110 is formed in a shape matching the external protruding shape by digital devices (FPGA devices, etc.) and/or PSU devices mounted on the rear surface of the main board 120. It can be. This is to maximize heat dissipation performance by increasing a thermal contact area with the rear surface of the main board 120 .

On the left and right sides of the antenna housing 105, although not shown in the drawing, a worker transports the antenna device 100 according to an embodiment of the present invention in the field or against a holding pole (not shown) or an inner or outer wall of a building. A handle portion that can be gripped to facilitate manual installation may be further installed.

In addition, outside the lower end of the antenna housing 105, various external mounting members 500 for cable connection with a base station device (not shown) and tuning of internal parts may be assembled through.

Referring to FIG. 2 , a plurality of rear heat dissipation fins 111 may be integrally formed on the rear surface of the rear housing 110 to have a predetermined pattern shape. Here, heat generated from the main board 120 installed in the inner space 110S of the rear housing 110 may be directly radiated to the rear through the plurality of rear heat radiating fins 111 .

A plurality of rear heat dissipation fins 111 are disposed inclined upward toward the left and right ends based on the middle of the left and right widths (see FIG. 2 (b)), so that heat dissipated to the rear of the rear housing 110 is dissipated, respectively. It may be designed so that heat is more quickly dispersed by forming rising air currents dispersed in the left and right directions of the rear housing 110 . However, the shape of the rear heat dissipation fin 111 is not necessarily limited thereto. For example, although not shown in the drawing, when a blowing fan module (not shown) is provided on the rear side of the rear housing 110, the rear heat dissipating fin 111 so that the heat dissipated by the blowing fan module is more quickly discharged. It may be adopted that they are formed in parallel to the left end and the right end, respectively, in the blowing fan module disposed in the middle.

In addition, although not shown, a mounting portion (not shown) to which a clamping device (not shown) for coupling the antenna device 1 to a holding pole (not shown) is coupled to a portion of the plurality of rear heat radiation fins 111 is integrated. can be formed as Here, the clamping device rotates and rotates the antenna device 100 according to an embodiment of the present invention installed at the front end in the left and right directions or tilts and rotates in the vertical direction to adjust the directionality of the antenna device 100 can be config.

However, a clamping device for tilting, rotating, and rotating the antenna device 100 does not have to be coupled to the mounting unit. For example, when the antenna device 100 is installed on an inner or outer wall of a building in a wall-hung type, a clasp plate-shaped clamp panel that can be easily coupled in a wall-hung type may be coupled to the mounting portion.

Hereinafter, the RF module 200 for an antenna according to the present invention will be described in more detail with reference to the accompanying drawings.

The RF module 200 may include an RF filter 140, a radiating element module 160, and an amplifier substrate 146. In addition, the RF module 200 may further include a reflector 150 serving as a ground (GND) of the radiating element module 160. However, the reflector 150 does not only serve as a ground for the radiating element module 160, but is an RF filter exposed to the front outside air defined as the front front of the front housing 130 of the antenna housing 105 to be described later. It can also serve to protect 140 from the outside.

The RF module 200 configured as described above may be stacked on the front surface of the main board 120 via the front housing 130 among the antenna housings 105 as shown in FIGS. 2 to 5 . .

In the antenna device 100 according to an embodiment of the present invention, the RF filter 140 is provided in plurality to form one component of the RF module assembly for an antenna.

Here, as referenced to FIGS. 2 and 3, a total of eight RF filters 140 are arranged adjacently in the left and right directions, and a plurality of such RF filters 140 are arranged in four rows in the vertical direction, respectively. adopt what has been However, it is not necessarily limited to this, and it will be taken for granted that the arrangement position and the number of RF filters 140 can be variously designed and modified.

In addition, in one embodiment of the present invention, the RF filter 140 is a cavity filter in which a cavity is formed on one side and a resonator composed of a dielectric resonator (DR) or a metallic resonator is provided in the space. It is explained with an example. However, the RF filter 140 is not limited thereto, and various filters such as a dielectric filter may be employed.

In addition, the plurality of radiating element modules 160 are coupled to correspond to the number of each of the plurality of RF filters 140, and each of the radiating element modules 160 implements 2T2R. Accordingly, the antenna device 100 according to an embodiment of the present invention illustrates a model in which a total of 64T64R is implemented, but is not limited thereto.

On the other hand, the RF module 200, as described above, is disposed to cover the plurality of RF filters 140, may further include a reflector 150 serving as a ground for the plurality of radiating element modules 160. there is. To this end, the reflector 150 is preferably made of a metal material.

Here, the reflector 150 may further function as a reflective layer of the radiating element module 160 . Accordingly, the reflector 150 may concentrate the RF signal by reflecting the RF signal output from the radiating element module 160 in a direction corresponding to the directing direction.

In addition, the reflector 150, as a function specific to the RF module 200 according to the embodiment of the present invention, may perform a function of heat dissipation of system heat generated from the antenna device to the outside air.

To this end, the reflector 150, as shown in FIG. 6, may be formed in a mesh shape in which a plurality of heat dissipation holes 155 are perforated. The plurality of heat dissipation holes 155 are configured to communicate the inside and outside of the reflector 150, and the heat generated from the RF filter 140 located in the rear space of the reflector 150 is transferred to the outside of the reflector 150. It can serve as a heat exhaust hole for dissipation. Accordingly, outside air can be actively used for heat dissipation of the antenna device 100 .

Meanwhile, the size of the heat dissipation hole 155 may be properly designed by simulating the durability and heat dissipation characteristics of the reflector 150. It can be designed considering the wavelength of the frequency. For example, the size of the heat dissipation holes 155 may be set to have a size within a range of 1/10λ to 1/20λ of the operating frequency.

Here, the interval 1/10λ is meaningful as an upper limit threshold for serving as a sufficient ground (GND) of the radiating element module 160, and the interval 1/20λ is the minimum through the heat radiation hole 155 of the reflector 150. It has meaning as a lower limit threshold for securing outside air flow.

Therefore, the size of the heat radiation hole 155 is preferably formed to have a range greater than 1/20λ of the operating frequency and smaller than 1/10λ of the operating frequency.

In particular, in terms of the ground (GND) function, the reflector 150 is provided in a singular number between the plurality of RF filters 140 and the plurality of heat dissipation element modules 160 to perform a common ground function. can be defined as

More specifically, as shown in FIG. 6 , the reflector 150 may be formed in a rectangular metal plate shape stacked on front ends of the plurality of RF filters 140 . On the front surface of the reflector 150, an antenna mounting unit 151 on which each of the heat dissipating element modules 160 to be described later is seated may be formed in a planar shape to correspond to the position of the RF filter 140. Here, since the antenna mounting unit 151 is formed in a flat shape, the front surface of the filter body 141 is in thermal contact with the rear surface of the rear RF filter 140, and the rear surface of the front radiating element module 160 is the surface. By being seated in thermal contact, it is possible to improve heat dissipation performance by a thermal conduction method.

In addition, as shown in FIG. 6 , the reflector 150 has an edge portion of the reflector 150 that is bent backward to surround and protect the sides of the plurality of RF filters 140 coupled to the front surface of the front housing 130. A plate 154 is formed, a plurality of screw fixing grooves 153 are formed spaced apart in multiple places along the edge of the edge bending plate 154, and a plurality of screw fixing grooves 153 and the front housing 130 are formed. It can be coupled to the front of the front housing 130 by an operation in which a plurality of assembly screws (reference numerals not indicated) are fastened to the plurality of screw through-holes 133 formed along the edge.

The RF module 200 for an antenna may be detachably coupled to the antenna housing 105 as shown in FIGS. 2 to 5 . The antenna RF module 200 may be physically coupled to the front housing 130 by bolting (or screw coupling), and the amplifier substrate 146 constituting the antenna RF module 200 is the main board. It can be attached to (120) in a socket pin coupling method. Specifically, the amplifier substrate 146 is provided with a socket portion 146' of FIG. 11A, which will be described later, and the socket pin portion 146' of the amplifier substrate 146 is provided on the front surface of the main board 120. A coupled female socket portion 125 may be provided. The specific configuration and function of the amplification unit substrate 146 will be described in more detail later.

As shown in FIGS. 3A and 3B , the front housing 130 includes the main board 120 installed and seated in the inner space 110S of the antenna housing 105 and the RF module 200 stacked on the front side thereof. ) plays a role of partitioning between In addition, the front housing 130 is partitioned so that the internal space 110S on the antenna housing 105 side and other spaces are distinguished, so that the heat generated in the internal space 110S on the antenna housing 105 side is RF. Thermal blocking and separation functions may be performed so as not to affect the filter 140 side.

Here, the meaning of 'thermal blocking' is that the heat generated from the RF module 200 located on the front outside air (or front space) defined as the front front of the front housing 130 is the rear space of the front housing 130 ( That is, it is preferable to understand that heat intrusion into the inner space 110S of the rear housing 110 is blocked, and the meaning of 'thermal separation' is originally laminated to the inner space 110S of the rear housing 110. It is preferable to understand that some of the plurality of heat generating elements centrally and distributedly mounted on the front and rear surfaces of the main board 120 are separated and the thermal configuration is separated and arranged to enable front heat dissipation as well as rear heat dissipation.

In addition, in the current market situation in which there are numerous manufacturers of antenna devices and components or equipment included therein, manufacturers who manufacture only the RF module 200 pre-assemble a plurality of RF modules 200 into the front housing 130. ), or as a module unit that can be temporarily assembled, it is possible to distribute and sell it, which has the advantage of establishing a new market environment.

In the front housing 130, a plurality of screw through holes 133 for screw fixing of the reflector 150 may be formed at a plurality of locations along the edge. In addition, through the front housing 130, socket pins 146' formed on the amplifier board 146 of the RF filter 140 pass through, respectively, and are coupled to the female socket 125 of the main board 120. At least a through slit 135 to become may be formed.

Here, between the rear edge of the front housing 130 and the front edge of the rear housing 110, it is exposed to the outside through the heat radiation hole 155 of the reflector 150 described above, so one embodiment of the present invention When the antenna device 100 according to the example is installed outside a building (ie, outdoors), rainwater may permeate during rainy weather, and a waterproof gasket ring (not shown) may be interposed to prevent inflow of rainwater. there is. In addition, the front and rear surfaces of the plurality of through slits 135 penetrating the front housing 130 protect the socket portion 146' of the amplifier board 146 passing through them from the outside, and rainwater passes through them. A foreign substance inflow prevention ring (not shown) may be interposed therebetween to prevent foreign substances such as from entering the inner space 110S of the rear housing 110 .

In this way, the antenna device 100 according to an embodiment of the present invention adopts a simple socket pin coupling method in constructing a predetermined electrical signal line between the main board 120 and the RF filter 140, so that the conventional RF Since there is no need to use a separate direct coaxial connector (DCC) for electrically connecting the filter 140 and the main board 120, the manufacturing cost of the product is greatly reduced.

However, it will be understood that the adoption of the socket pin coupling method of the RF filter 140 here creates an effective effect in terms of electrical coupling, and in order to prevent any flow of the RF filter 140 in terms of physical coupling, Of course, it is also possible to additionally adopt a plurality of screw fastening methods. For example, as referenced to FIGS. 12A and 12B described later, a fixing screw 142 is provided through a plurality of screw through-holes 142a formed at the rear end edge of the filter body 141 during the construction of the RF filter 140. ) It is possible to create a more robust fixing effect by screw fastening to the front housing 130 using.

Figure 7 is an exploded perspective view showing the installation of the main board to the rear housing of the configuration of Figure 2, Figure 8 is an exploded perspective view showing the installation of the RF module assembly to the main board of the configuration of Figure 2, Figure 9 8 is a perspective view showing a state in which the filter body is separated from the rear housing during the installation process of FIG. 8, FIG. 10 is a perspective view showing an RF module in the configuration of FIG. 8, and FIG. 11 is a cross-sectional view taken along line C-C in FIG. 12a and 12b are exploded perspective views showing the RF module of FIG. 10, FIG. 13 is a detailed view of the amplifier board of the configuration of the RF module of FIG. 10, and FIG. 14 is amplification 15 is an exploded perspective view showing the assembly of the RF module to the main board among the configurations of FIG. 3, and FIG. It is an exploded perspective view showing the assembly of the device module.

One embodiment of the antenna RF module 200 according to the present invention, the RF filter 140, the RF filter 160, the radiating element module 160 disposed on one side, and the other side of the RF filter 140 disposed, and may include an amplification unit substrate 146 on which an analog amplification element is mounted.

Here, the RF filter 140 may be formed to have at least four outer surfaces. That is, the RF filter 140 has a tetrahedral shape when it has four outer surfaces, a pentahedron shape when it has five outer surfaces, and a hexahedron shape when it has six outer surfaces. Therefore, in the following, 'one side' and 'the other side' of the RF filter 140 refer to any one side of at least four outer side surfaces and the other side except for the one side side, indicating physically complete mutually opposite sides. It should be understood as meaning not a concept, but one side and one side of the other sides except the one side.

Therefore, in another embodiment of the RF module 200 for an antenna according to the present invention, as shown in FIGS. 2 to 5, the heat generated from the RF filter 140 and the heat generated from the analog amplifying element are dissipated in different directions. can be defined as an example.

In addition, since the RF module 200 for an antenna according to the present invention has a configuration in which the amplifier substrate 146 is disposed inside the RF filter 140, the external appearance of the RF module 200 is substantially an RF filter ( 140) and an embodiment that can be configured by the radiating element module 160 provided at the front end, of course.

In addition, the RF module 200 is an assembly of analog RF components, for example, the amplifier substrate 146 is an RF component mounted with an analog amplification device for amplifying the RF signal, and the RF filter 140 is an input RF signal An RF component for frequency filtering into a desired frequency band, and the radiating element module 160 is an RF component that serves to receive and transmit an RF signal.

Therefore, the RF module 200 for an antenna according to the present invention may be defined as follows as another embodiment.

The RF module 200 for an antenna according to the present invention is an RF module 200 for an antenna including analog RF components, and the analog RF components include an RF filter 140 having at least four outer surfaces, and an RF filter ( A radiating element module 160 disposed on one of the outer surfaces of the 140) and an analog amplifying element (not shown) on the amplification unit substrate 146 disposed on the other surface of the RF filter 140 include

Here, the amplifier substrate 146 may be electrically connected to the main board 120 inside the antenna housings 110 and 130 . More specifically, as will be described later, the amplification unit substrate 146 may be electrically connected to the main board 120 through a socket pin coupling method.

In addition, another embodiment of the RF module 200 for an antenna according to the present invention includes an RF filter 140, a radiating element module 160 disposed in front of the RF filter 140, and an RF filter 140 And a concept including a reflector 150 disposed between the radiating element module 160 to ground (GND) the radiating element module 160 and to mediate the heat generated in the RF filter 140 to radiate to the outside. can be defined as

In more detail, another embodiment of the antenna RF module 200 according to the present invention is stacked with respect to the front surface of the main board 120 installed in the inner space 110S of the antenna housings 110 and 130. The RF filter 140, the radiating element module 160 stacked on the front surface of the RF filter 140, and the RF filter 140 are disposed to cover the ground (GND) role of the radiating element module 160. In addition to performing, it may include a reflector 150 that mediates heat generated from the RF filter 140 side to dissipate heat to the outside. Here, as described above, it is natural that the reflector 150 may further function as a reflection layer capable of intensively irradiating radiation signals.

In particular, when it is assumed that the RF filter 140 has at least four outer surfaces, the radiating element module 160 is stacked on one side (front surface) of the RF filter 140, and the amplifier substrate 146 is disposed on the other one of the outer surfaces of the RF filter 140, and the heat generated from the amplification unit substrate 146 on which at least one analog amplification element is mounted is transferred to the RF filter adjacent to the amplification unit substrate 146 ( After heat is radiated through one of the sidewalls of 140), heat may be finally radiated to the outside via the reflector 150.

Meanwhile, another embodiment of the antenna RF module 200 according to the present invention may be detachably coupled to the antenna housing 105. That is, the RF module 200 for an antenna according to the present invention includes an RF filter 200, a radiating element module 160 disposed in front of the RF filter 200, an RF filter 140 and a radiating element module ( 160), and the antenna RF module 200 may be defined as another embodiment that is detachably coupled to the antenna housing 105. Specifically, the object to which the antenna RF module 200 is detachable is the main board 120 disposed in the inner space 110S of the rear housing 110 among the configuration of the antenna housing 105, and the front housing 130 It can be detachably coupled as a medium.

According to this, when RF components constituting the antenna device 100 are defective or damaged by configuring RF components having frequency dependence as an RF module and making them detachable from the antenna housing 105, , there is an advantage in that maintenance and repair of the antenna device 100 is easy by replacing only the RF module 200 for the corresponding antenna.

In addition, the reflector 150 is disposed to cover the RF filter 140, and the exposed RF filter 140 protrudes outward from the front of the front housing 130 based on the internal space 110S of the antenna housing 105. ) can be arranged to cover all. In this way, the RF filter 140 exposed to the outside air (or front space) defined as the front front of the front housing 130 is protected from the external environment using the reflector 150, and at the same time, as described above, Since air flows in and out through the many heat dissipation holes 155 are designed to be smooth, higher front heat dissipation performance can be improved.

On the other hand, since the RF module 200 implemented in various embodiments described above is provided in plurality, it is possible to configure an RF module assembly for an antenna to be described later.

As referenced to FIGS. 11A and 11B , the plurality of RF filters 140 have a filter body forming predetermined spaces C1 and C2 on one side and the other side in the width direction based on the partition wall 143 in the middle ( 141), a plurality of resonators (DR, not shown) installed in a plurality of cavities (not shown) provided in one of the predetermined spaces C1 and C2 (see reference numeral “C1” in FIG. 11A), Amplifier substrate 146 disposed in the other one of the predetermined spaces C1 and C2 (refer to reference numeral “C2” in FIG. 11B), coupled to the female socket 125 of the main board 120 and electrically connected thereto. ) may be included. Here, the filter body 141 is made of a metal material and is manufactured through a die casting molding method.

A plurality of RF filters 140 may be employed and disposed as a cavity filter for filtering a frequency band of an output signal compared to an input signal through frequency adjustment using a plurality of resonators (DR) installed on the “C1” side of a predetermined space. there is. However, the RF filter 140 is not necessarily limited to a cavity filter, and as described above, a ceramic waveguide filter is not excluded.

For the RF filter 140, having a small thickness in the front-back direction is advantageous in designing the slimming of the entire product. In terms of slimming design of such a product, adoption of a ceramic waveguide filter, which is advantageous in miniaturization design, may be considered as the RF filter 140 rather than a cavity filter in which a design for reducing a thickness in the front and rear directions is limited. However, in order to satisfy the high power performance of the base station antenna required in the 5G frequency environment, the accompanying antenna heat dissipation problem must be inevitably solved, and the RF filter 140 is used as a heat transfer medium to effectively dissipate the heat generated inside the antenna Adoption of a cavity filter may be preferred in that the heat generated in the RF filter 140 can be transferred to the front of the antenna housing 105.

In particular, in the antenna device 100 according to an embodiment of the present invention, the plurality of RF filters 140 are in the form of an RF module 200 and escape from the limited internal space 110S of the antenna housing 105 to the outside air. Adoption of a cavity filter may be more preferable in that it is installed to be directly exposed, and heat dissipation is possible through all directions except for the installation surface of the RF filter 140. Hereinafter, the adoption of a cavity filter as the RF filter 140 in the antenna device 100 according to an embodiment of the present invention will be described as an example.

As referred to in FIGS. 10 to 12B, the antenna device 100 according to an embodiment of the present invention includes an RFIC element (not shown), a conventional RF element mounted on the front or rear surface of the main board 120, and a PA. (Power Amplifier) elements and LNA (Low Noise Amplifier) elements are separately mounted on the amplification board 146 of the RF filter 140, and the entire RF filter 140 is exposed to the outside air, thereby significantly improving heat dissipation performance. provides the advantage of

That is, in the prior art, a radome installed in front of the antenna housing not only becomes an obstacle that hinders heat dissipation toward the front side, but also prevents digital elements or PSUs with high heat generation from RF elements (RFIC, PA and LNA elements, etc.). In addition, there is a problem in that heat concentration occurs inside the antenna housing by being concentratedly mounted on the main board. In addition, since the concentrated heat must be radiated only to the rear side of the antenna housing, heat dissipation efficiency is greatly reduced.

However, in the case of the antenna device 100 according to an embodiment of the present invention, as shown in FIG. 13, a plurality of RF modules 200 are placed in a front surface independent of the internal space 110S of the antenna housing 105. It is installed separately but installed so that it is directly exposed to the outside air, and the amplifier board 146 is added to a part of the sidewall of the RF filter 140 to disperse the RF elements 146a-1, 146a-2, 146c mounted on the conventional main board. By arranging the heat dissipation, the dissipated heat can be dissipated to the outside more quickly.

Here, the RF elements may be analog amplification elements, and as described above, include PA (Power Amplifier) elements 146a-1 and 146a-2, LNA (Low Noise Amplifier) elements 146c, and the like.

More specifically, the amplification unit substrate 146 has a pair of PA elements 146a-1 and 146-2, one of analog amplification elements, mounted on either side of both sides, and an LNA, one of analog amplification elements. Devices may be mounted and arranged, and circulators 146d-1 and 146d-2 decoupling between the two may be circuit-connected. However, it is not necessarily necessary that the above-described analog amplification element is mounted on only one side of both sides of the amplification unit substrate 146, and it is natural that the amplification unit substrate 146 may be distributedly mounted on both sides of the amplifier substrate 146 depending on the embodiment. will say that

In addition, since the amplifier substrate 146 is separately mounted on the side of the RF filter 140, the number of layers of the main board 120 made of multi-layers can be reduced, thereby reducing the manufacturing cost of the main board 120. provides

The amplifying unit substrate 146 is installed to be seated inside the other one of the predetermined spaces C1 and C2 (C2), and at least the end of the socket unit 146' protrudes toward the rear side of the filter body 141. It can be seated and installed so that it can be exposed.

Meanwhile, as illustrated in FIGS. 10 to 12B , the plurality of RF filters 140 dissipate heat generated from the amplifier substrate 146 from the predetermined space C2 to the outside of the filter body 141. A filter heat sink panel 148 may be further included.

A plurality of screw fixing holes 149a are formed around the predetermined space C2 of the filter body 141, and a plurality of screw through holes 149b are formed at the edge of the filter heat sink panel 148, In an operation in which the plurality of fixing screws 149 pass through the plurality of screw through holes 149b on the outside of the filter body 141 and are fastened to the plurality of screw fixing holes 149a, the filter heat sink panel 148 is It may be fixed to the body 141.

Here, the amplification unit substrate 146 installed inside the predetermined space C2 of the filter body 141 is provided so that its outer surface is in thermal contact with the inner surface of the filter heat sink panel 148, so that the amplification unit substrate 146 ) The heat generated from the filter heat sink panel 148 may be conducted through the filter heat sink panel 148 and may be discharged to the outside through the filter heat sink fins 148a integrally formed outside the filter heat sink panel 148 .

Meanwhile, although not shown in the drawing, the RF filter 200 for an antenna according to the present invention is disposed between the filter heat sink panel 148 and the amplifier substrate 146 to remove heat generated from the amplifier substrate 146. A heat transfer medium that is collected and transferred to the filter heat sink panel 148 may be further included.

The heat transfer medium may be formed of any one of a vapor chamber or a heat-pipe provided to transfer heat through a phase change of a refrigerant flowing in a closed interior. The vapor chamber is preferred when the distance between the amplification unit substrate 146, which is a heat source, and the filter heat sink panel 148 is relatively small, and the heat pipe is preferred when the distance between the amplification unit substrate 146, which is a heat source, and the filter heat sink panel 148 is relatively small. Its adoption may be preferred if the distance between it and the panel 148 is relatively large.

As referenced to FIGS. 10 to 12B and 14 , the plurality of RF filters 140 are provided on the front surface of the main board 120 using the socket portion 146' formed on the amplifier substrate 146. In addition to being detachably coupled to the female socket portion 125, the filter body 141 is screwed to the front housing 130 using a fixing screw 142 through a plurality of screw through-holes 142a formed at the rear end edge of the filter body 141. This makes it more stable. Here, the socket portion 146' formed on the amplifier substrate 146 penetrates through the through slit 135 formed on the front surface of the front housing 130 corresponding to the external space, as shown in FIG. It has already been described that a foreign substance inflow prevention ring (not shown) may be interposed between the filter body 141 and the front housing 130 in that the socket pin is coupled to the socket portion 125 .

On the other hand, on the front surface of the filter body 141, at least one fixing boss 147 for screw fixing of a plurality of radiating element modules 160 to be described later may be installed as shown in FIGS. 10 to 12B. . At least one fixed boss 147 penetrates through the boss through-hole 157 formed in the reflector 150 and is penetrated and exposed to the front surface of the antenna placement unit 151 of the reflector 150, and a plurality of radiating element modules 160 ) This is the part where the element fixing screw 180 for fixing is fastened.

Here, at least one fixing boss 147 may be made of a metal material that is easy to conduct heat. Therefore, as described above, the filter body 141 and the fixing boss 147 are made of a metal material that is easy to conduct heat, and the heat generated from the filter body 141 is limited, even if the radome is removed. It provides the advantage of easy heat dissipation to the front. Furthermore, among the components of the radiating element module 160 to be described later, the radiation director 165 is also made of a metal material that is easy to conduct heat, and the front heat dissipation performance can be further improved in terms of expanding the heat dissipation area at the front. This will be described in more detail later.

For the implementation of beamforming, as referenced in FIGS. 2 to 5, a plurality of radiating element modules 160 are required as an array antenna, and the plurality of radiating element modules 160 are narrow. It is possible to increase the concentration of radio waves in a designated direction by generating a narrow directional beam. Recently, a plurality of radiating element modules 160, a dipole-type dipole antenna or a patch-type patch antenna are used with the highest frequency, and are designed and arranged to be spaced apart so that mutual signal interference is minimized. do. Conventionally, in general, a radome for protecting a plurality of radiating element modules 160 from the outside in order to prevent the arrangement design of such a plurality of radiating element modules 160 from being changed by external environmental factors as an essential component. did Therefore, only for the area covered by the radome, the plurality of radiating element modules 160 and the antenna board on which the plurality of radiating element modules 160 are installed are not exposed to the outside air, resulting in the operation of the antenna device 100. There was no choice but to be very limited in dissipating heat to the outside.

As shown in FIGS. 10 to 12B, the radiating element module 160 of the antenna device 100 according to an embodiment of the present invention is formed vertically and long, and a plurality of antennas formed on the front surface of the reflector 150. The radiating element module cover 161, which is respectively arranged on the mounting unit 151, is disposed in close contact with the rear surface of the radiating element module cover 161, and is disposed between the antenna arranging unit 151, and the antenna patch circuit unit 163a And the power supply line (163b) is formed of a printed circuit board 162 for a radiating element printed and formed of a conductive metal material, and for radiation electrically connected to the antenna patch circuit part 163a of the printed circuit board 162 for a radiating element. A director 165 may be included.

On the front side of the printed circuit board 162 for the radiating element, the above-described antenna patch circuit unit 163a may be printed as a dual polarization patch element for generating either orthogonal ±45 polarization or vertical/horizontal polarization. there is. Three antenna patch circuit units 163a may be printed and formed to be spaced apart in a vertical direction (longitudinal direction), and each antenna patch circuit unit 163 may be interconnected by a power supply line 163b.

In the conventional antenna device, since the feed line must form a separate feed line at the bottom of the printed circuit board on which the antenna patch circuit is mounted, the feed structure is complicated, such as having a plurality of through holes for this purpose, and the feed structure is for the radiating element It occupies the lower space of the printed circuit board 162, and a problem occurs as an element that hinders direct surface thermal contact between the RF filter 140 and the printed circuit board 162 for the radiating element, but the practice of the present invention The power supply line 163b according to the example is formed by pattern printing together with the antenna patch circuit unit 163a on the same front surface as the printed circuit board 162 for the radiating element on which the antenna patch circuit unit 163a is pattern-printed, so that the power supply structure is very In addition to being simple, there is an advantage of being able to secure a coupling space that is in direct surface thermal contact on the RF filter 140 and the printed circuit board 162 for the radiating element.

Meanwhile, the radiation director 165 is formed of a thermally conductive or conductive metal material and is electrically connected to the antenna patch circuit unit 163a. The radiation director 165 may also perform a function of inducing the direction of the radiation beam in the forward direction and simultaneously transferring heat generated from the rear of the printed circuit board 162 for the radiation element to the front through heat conduction. The radiation director 165 may be made of a metal of a conductive material through which electricity flows well, and may be installed to be spaced apart from each other in front of each antenna patch circuit unit 163a.

In the embodiment of the present invention, the radiating element using the antenna patch circuit 163a and the radiation director 165 has been described, but when a dipole antenna is applied, the configuration of the radiation director can be omitted, and the height of the dipole antenna is relatively high. , the amount of heat dissipation may be increased by dissipating heat to a farther place than the front surface of the reflector 150.

Referring to FIGS. 4 and 10 to 12B , the radiation director 165 may be electrically connected to the antenna patch circuit unit 163a through the director through-hole 164c. The overall size, shape and installation position of the radiation director 165 may be appropriately designed by measuring the characteristics of a radiation beam radiated from the corresponding antenna patch circuit unit 163a, experimentally, or by simulating the corresponding characteristics. The radiation director 165 serves to guide the direction of the radiation beam generated from the antenna patch circuit unit 163a in all directions, further reducing the beam width of the overall antenna and improving the characteristics of the side lobe. In addition, it compensates for loss due to the patch-type antenna and can perform a heat dissipation function as well as being made of conductive metal. The shape of the radiation director 165 is preferably formed in an appropriate shape for guiding the direction of the radiation beam in all directions, for example, a non-directional circular shape, but is not limited thereto.

Meanwhile, at least two antenna patch circuit units 163a and the radiating director 165 may constitute one radiating element module 160. 10 to 12b show an example in which three antenna patch circuit units 163a and a radiation director 165 form one unit radiating element module 160, and a radiating element module for increasing gain. The number of the antenna patch circuit unit 163a and the radiation director 165 may be varied according to an optimal design.

A through hole 164c is formed in the radiation director 165, and the radiation director 165 may be electrically connected to the antenna patch circuit unit 163a through the through hole 164c. More specifically, the radiation director 165 and the antenna patch circuit unit 1163a may be electrically connected via an element fixing screw 180 provided for fixing to the front surface of the filter body 141 .

Here, the radiating element module cover 161 is injection molded of a non-conductive plastic material, and on one side of the radiating element module cover 161, as shown in FIGS. 12A and 12B, the radiation director 165 A director fixing part 167 that is molded to the rear surface is provided, and a director fixing protrusion 168 coupled to the director 165 for radiation may be formed to protrude forward.

Here, the radiation director 165 may be press-fitted and fixed into at least one director fixing groove (reference numeral not indicated) formed to be recessed at a position corresponding to the at least one director fixing protrusion 168 .

In addition, at least one substrate fixing hole 164b for coupling with the RF filter 140 may be formed through the radiating element module cover 161 . After the element fixing screw 180 passes through the through hole 164c of the radiation director 165 and the substrate fixing hole 164b of the radiating element module cover 161 through at least one substrate fixing hole 164b, It can be firmly coupled to the antenna mounting portion 151 of the reflector 150 through the substrate through-hole 164a formed in the printed circuit board 162 for the radiating element.

In addition, at least one reinforcing rib 166 is formed on the front of the radiating element module cover 161 to form the appearance of the radiating element module cover 161, and reinforces the strength of the radiating element module cover 161, which is a plastic material. can do.

The RF module 200 having such a configuration transfers heat generated from the RF filter 140 corresponding to the front side with respect to the front housing 130 through contact with the rear surface of the reflector 150 or through the reflector 150. It can be directly discharged to the outside through the heat dissipation holes 155 formed in.

Meanwhile, the RF module assembly for an antenna according to the present invention may be defined as including the RF module 200 implemented in various forms of embodiments as follows.

As an embodiment, a plurality of RF filters 140 detachably coupled to the front of the main board 120, a plurality of radiating element modules 160 stacked on the front of the plurality of RF filters 140, and a plurality of A reflector ( 150) may be included.

As another embodiment, the RF module 200 includes a plurality of RF filters 140 disposed apart from each other by a predetermined distance in the vertical direction and the left and right directions, and a plurality of radiating radiation stacked on the front surface of the plurality of RF filters 140. It includes a reflector 150 disposed to partition between the element module 160, the plurality of RF filters 140 and the plurality of radiating element modules 160, and the plurality of RF filters 140 include an antenna housing 105 ) It may be implemented in a form that is detachably coupled to the front surface of the main board 120 stacked in the internal space 110S in a socket pin coupling method.

In addition, as another embodiment, the RF module 200 includes a plurality of RF filters 140 each having at least four outer surfaces, and any one of the outer surfaces of each of the plurality of RF filters 140 (eg, For example, a plurality of radiating element modules 160 stacked on the front surface) and a plurality of RF filters 140 disposed on the other of the outer surfaces of each, and an amplification unit substrate on which at least one analog amplification element is mounted ( 146) and a reflector 150 disposed between the plurality and the RF filter 140 and the plurality of radiating element modules 160 to serve as a common ground for the plurality of radiating element modules 160, and at least one Heat generated from the analog amplification element may be radiated through one of the side walls of the plurality of RF filters 140 and then radiated forward through the reflector 150 .

Finally, as another embodiment, the RF module 200 is detachably coupled to the front surface of the main board 120, a plurality of RF filters 140 each having at least four outer surfaces, and a plurality of RF filters ( 140) includes a plurality of radiating element modules 160 stacked on one of the outer surfaces (eg, the front surface) and a reflector 150 disposed to cover the plurality of RF filters 140; , The reflector 150 is made of a metal material to perform a grounding function between the plurality of RF filters 140 and the plurality of radiating element modules 160 and to reflect electromagnetic waves irradiated from the radiating element module 160 forward. However, it may be implemented in a form in which a plurality of heat dissipation holes 155 are formed to dissipate heat generated from the plurality of RF filters 140 to the front or side.

The assembly process of the RF module 200 and the antenna device 100 according to an embodiment of the present invention configured as described above will be briefly described with reference to the accompanying drawings (in particular, FIG. 7 or less).

First, as referenced to FIGS. 10 to 13 , one embodiment of a method of assembling the RF module 200 for an antenna according to the present invention is either one side or the other side of the filter body 140 manufactured by die casting. The amplification unit substrate 146 on which the analog amplification element is mounted is coupled to the amplification unit. Then, after disposing the reflector 150 having a plurality of heat radiation holes 155 formed on the front of the RF filter 140, the printed circuit board 162 for the radiating element of the radiating element module 160 on the reflector 150. ) is placed. After disposing the radiating element module cover 161 of the radiating element module 160 on the printed circuit board 162 for the radiating element, the radiating director 165 of the radiating element module 160 is placed on the radiating element module cover 161 ), by electrically connecting the radiation director 165 and the printed circuit board 162 for the radiation element, the assembly of the RF module 200 is completed. Later, the amplifier board 146 is connected to the main board 120 It can be combined with a socket pin coupling method on the front side.

Meanwhile, according to an embodiment of the method of assembling the antenna device 100 according to the present invention, as shown in FIGS. 8, 9, and 13, the inside of the antenna housing 105 in which the main board 120 is installed. The front housing 130 is coupled to and fixed to the front end of the rear housing 110 so that the space 110S and the external space are completely divided, and then the socket portion 146 of the amplifier substrate 146 of the plurality of RF modules 200 ') is coupled to the female socket portion 125 of the main board 120 by way of socket pin coupling.

And, as shown in FIG. 14, when the reflector 150 is screwed along the rim end of the rear housing 110, and then a plurality of radiating element modules 160 are coupled to the antenna mounting unit 151, respectively, the antenna Assembly of device 100 is complete.

17 is a conceptual diagram showing a modification of an RF module according to an embodiment of the present invention, FIG. 18 is a cross-sectional view showing a modification of a coupling structure between a reflector and an RF module, and FIG. 19 is a various modification of a heat sink integrated reflector. 20 is a perspective view showing a reflector separated by RF module unit and its coupling structure, FIG. 21 is a cross-sectional view and a plan view showing a modified example of an amplification unit substrate, and FIG. 22 is a main board for a rear housing and 23 is a perspective view showing various modifications of an RF module, FIG. 24 is a perspective view showing a heat dissipation structure of a module-type FPGA device, and FIG. 25 is a number of amplifier boards. It is a conceptual diagram showing the specific arrangement of the socket part and the female socket part of the main board.

Hereinafter, the RF module 200 for antenna, which is each individual component of the antenna device 100 according to an embodiment of the present invention that has already been described, and a usable variant of the antenna device 100 will be described in more detail with reference to the accompanying drawings. Let's explain.

As referred to in FIG. 17, the RF module 200 is manufactured separately from the RF filter 140 and the RF filter 140, and the socket pin is coupled to the female socket portion 125 of the main board 120. The amplification unit module 300 including the amplification unit substrate 146 having the unit 146' may be included. The amplification unit substrate 146 of the amplification unit module 300 may be disposed inside the amplification unit substrate body 301 to be protected from the outside. However, although the coupling method of the amplifier board 146 to the main board 120 is exemplified by socket pin coupling, any configuration for slot or other electrical connection may be used.

In addition, the filter body 141 of the RF filter 140 and the amplifying unit substrate body 301 of the amplifying unit module 300 may be slidingly bonded to each other in a front-back direction or a vertical direction.

Here, the filter body 141 of the RF filter 140 is physically fixed to the front housing 130, and the amplification unit substrate body 301 of the amplification unit module 300 and the coaxial connector (Direct Coaxial Connect, DCC) It can be electrically connected via (146D).

The amplifier board body 301 is first coupled with a socket pin to the main board 120 before fixing the RF filter 140 to the front housing 130, and then electrically connected to the main board 120 by the coaxial connector 146D as described above. Modules can be combined by the operation of settling so that they can be connected. However, the electrical connection does not necessarily have to be made through the coaxial connector 146D, and it will be taken for granted that any configuration capable of electrical signal connection can be employed.

A modification of the RF module 200 having such a configuration is, when the RF filter 140 is defective or needs to be replaced for other reasons, the RF filter 140 alone is separated from the amplifying unit substrate body 301 with one touch and Since it can be replaced, A/S provides an advantageous advantage.

On the other hand, in the RF module 200 for an antenna according to an embodiment of the present invention referred to in FIGS. As an embodiment in which a plurality of radiating element modules 160 are installed in close contact with each RF filter 140 on the front of the ) by assembling the entire module in the front housing 130. explained. However, in the case of the above-described RF module 200 for an antenna according to an embodiment of the present invention, in order to replace any one of the plurality of RF filters 140, the reflector 150 must be separated from the front housing 130. There may be inconveniences in the process that require prior work.

As a modification to solve the above-described inconvenience in the process, the reflector 150, as referred to in FIG. 18, the RF filter 140 through the PAM nut 158 installed on the front edge end side of the RF filter (140) may have a structure that is coupled.

More specifically, a plurality of installation holes 150s through which the RF filter 140 is installed from the front to the rear are formed at a position where the RF filter 140 is installed among the reflector 150, and a plurality of installation holes 150s ) may be formed with bending coupling portions 150a bent toward the rear side at the end portions of the inner rims, respectively. Here, the RF filter 140 has a width that can be inserted into the plurality of fittings 150s, except for the width of the front edge ends 140C1 and 140C2 and the rear edge end (reference numeral not indicated), which will be described later. It can be formed to have a length.

In addition, a fem nut fixing hole 150s through which a fem nut 158 to be described later is fastened may be formed in a portion of the reflector 150 where the bending coupling portion 150a is formed, penetrating in the front and rear directions. The fem nut fixing hole 150s may be formed at a position corresponding to a filter screw fastening hole 140h formed in the RF filter 140 to be described later.

As described above, the front edge ends 140C1 and 140C2 of the RF filter 140 are formed to be larger than the width of the plurality of fittings 150s, and the bended bending coupling portion 150a of the reflector 150 ), and a filter screw fastening hole 140h to which the filter fixing screw 153 is fastened may be formed at the mutually interviewed portion through the front and rear directions. In addition, in the rear surface of the front edge ends 140C1 and 140C2 of the RF filter 140 in which the filter screw fastening hole 140h is formed, a fixed end accommodating groove ( 140s) may be incised.

Each fem nut 158 is coupled to the fem nut fixing hole 150s formed in the bending coupling part 150a of the reflector 150 from the rear side, so that the fixing end 150s is at the front end of the fem nut fixing hole 150s. It is fixed so as to be caught, and the filter fixing screw 153 is applied from the front side to the filter screw fastening holes 140h of the front edge ends 140C1 and 140C2 of the RF filter 140 and the bending coupling portion 150a of the reflector 150. It can be fastened to the fem nut 158 by penetrating at the same time.

In the modified example of the RF module 200 having such a configuration, when the filter fixing screw 153 is separated from the fem nut 158, only the desired RF filter 140 is separated from the reflector 150 for replacement or repair. Since it can be done, it provides an advantage of easy separation and replacement of the RF filter 140 requiring A/S among the plurality of RF filters 140 without separating the reflector 150.

On the other hand, the reflector 150 does not necessarily have to be provided with a metal material of SUS or STS. That is, although not shown in the drawings, the reflector 150 may be manufactured by injection molding with a plastic resin material and then plated on the entire surface. When the reflector 150 is injection-molded with a plastic resin material, it has an advantage that the shape of the plurality of heat dissipation holes 155 can be designed in various shapes.

In addition, the reflector 150 does not need to be made of SUS or STS material, and may be manufactured by a die casting method using an Al (aluminum) or Mg (magnesium) material.

At this time, as shown in (a) of FIG. 19, a heat sink 159 is provided on the rear side of the reflector 150 separately from the filter heat sink panel 148 covering the amplifier substrate 146 of the RF module 200. It may be integrally formed so as to protrude into. Here, each of the RF filters 140 may be individually accommodated and combined in a space provided between the heat sinks 159 .

In addition, as shown in (b) of FIG. 19, the front surface of the reflector 150 is integrally formed to protrude forward separately from the filter heat sink panel 148 covering the amplifier substrate 146 of the RF module 200. It can be. Here, each of the RF filters 140 may be individually accommodated and combined in a space provided between the heat sinks 159 . In this case, the overall assembly of the RF module assembly to the front housing 130 has the advantage of being easy.

In addition, the heat sink 159 is not integrally formed with the reflector 150, but is integrally formed with the rear front housing 130, so that installation spaces for each of the RF filters 140 may be provided.

Meanwhile, in the embodiments of the present invention described above, the reflector 150 is provided in a single panel shape, and a plurality of RF filters 140 are coupled to the single reflector 150. However, FIG. 20 As referenced, the reflector 150 may be provided with a plurality of reflectors 150a and 150b separated into two or more, but modified and implemented in a form coupled to each of the RF filters 140.

In this case, it is easy to adopt a waterproof structure and individual assembly of the front housing 130 or the main board 120 for each RF module 200 is possible, thereby providing an advantage of improving A/S performance.

However, it is preferable that each of the plurality of reflectors 150 come into contact with each other in a curved zigzag shape as shown in FIG. 20 to minimize antenna pattern distortion.

In addition, when the intervals of the radiating element modules 160 are arranged at half-wavelength (1/2λ) intervals, the plurality of heat dissipation holes 155 formed in the reflector 150 have a size compared to the intervals of the radiating element modules 160. It is preferably formed to have a range of 1/10 to 1/20 or less, and may be designed in a form including a polygonal shape forming a closed loop as well as a circular or quadrangular shape. However, the size and shape of the plurality of heat dissipation holes 155 are not intended to limit some ranges, and it will be taken for granted that the various sizes and shapes can be designed in a combined form.

In addition, although not shown in the drawing, the RF filter 140 of the RF module 200 is not manufactured as an individual unit, but may be manufactured as a module unit in a left-right or vertical array form. For example, as in one embodiment of the present invention, when the RF module 200 has eight RF filters 140 disposed in the left-right direction and four RF filters 140 disposed in the vertical direction. , 8 RF filters 140 in the left and right directions can be manufactured in units of 4 modules in one combination, and 4 RF filters 140 in the vertical direction can be manufactured in units of 8 modules in one combination. can In this way, the RF filter 140, the radiating element module 160, and the amplification unit substrate 146 manufactured in an array form may be coupled to the front surface of the antenna housing 105 in module units.

On the other hand, as shown in (a) of FIG. 21, the amplification unit board 146 is separated into two PCBs, and a plurality of analog amplification elements may be separately mounted.

More specifically, as shown in FIG. 21, the amplification unit substrate 146 is placed in close contact with the inner surface of the filter heat sink panel 148, and the above-described socket unit 146' is provided at an end thereof. Among the plurality of analog amplification elements, the amplification element having a relatively large heating value is mounted and arranged to be stacked on the main amplifier board 146a and the main amplifier board 146a, and has a relatively high heating value among the plurality of analog amplification elements A sub-amplifier board 146b on which a small amplification element is mounted may be included.

Here, when an amplification element with a relatively high calorific value is mounted on the opposite side of the main amplifier substrate 146a to the surface in contact with the filter heat sink panel 148, the main amplifier substrate 146a has a plurality of metal paste via holes ( 146”) can be formed.

Since the plurality of metal paste via holes 146” are filled with a metal component having excellent thermal conductivity, the heat generated from the analog amplification element (eg, TR element, 146-1) having a relatively high calorific value is transferred to the plurality of metal paste via holes. Heat can be easily conducted toward the filter heat sink panel 148 through (146”).

In this way, the modified example of the amplification unit substrate 146 is provided as two separate PCBs and separately mounts the amplification element with a relatively high heating value and the amplification element 146-2 with a relatively small heating value by separately mounting the main amplifier board ( In addition to improving thermal conductivity through 146a), the complexity of the signal connection structure of the main amplifier substrate 146a and the sub amplifier substrate 146b can be improved.

The effect of improving the thermal conductivity and improving the complexity of the signal connection structure according to the modified example of the amplifier board 146 as described above extends to the main board 120 stacked in the inner space 110S of the rear housing 110. Applicable.

More specifically, the main board 120 may also be provided by being separated into two PCBs like the amplifier board 146 .

That is, referring to (a) of FIG. 22, the main board 120, as a single PCB, is provided in the inner space 110S of the rear housing 110, and the RF module 200 is the amplifying unit substrate 146 It has already been described that it is provided with a structure in which socket pins are coupled and electrically connected through the socket portion 146' of the socket.

However, as shown in (b) of FIG. 22, the main board 120 is arranged to be in close contact with the inner surface of the rear housing 110, and the first heating element having a relatively large heat generation amount among a plurality of digital elements ( 128a) is mounted on the first main board 120a, and the second heating element 128b, which is arranged to be stacked on the front surface of the first main board 120a and has a relatively small heating value among a plurality of digital elements, is mounted. It may include 2 main boards 120b. Here, the first heating element 128a may be an FPGA device, and the second heating element 128b may be an RFIC device.

When the main board 120 is provided separately as the first main board 120a and the second main board 120b, the socket portion 146' formed on the amplifying unit substrate 146 of the RF module 200 is a socket. The female socket portion 125 for pin coupling is preferably formed on the front surface of the second main board 120b.

In addition, when the main board 120 is provided separately as the first main board 120a and the second main board 120b, the front surface of the front housing 130 has a second board mounted on the second main board 120b. A plurality of heat sink fins 139 for radiating heat generated from the heating element 128b to the front may be integrally formed.

Here, a digital signal may be connected between the first main board 120a and the second main board 120b.

Meanwhile, as shown in (c) of FIG. 22, among the digital devices, the RFIC device 128b may be centrally installed on the RF module 200 or the amplifying unit substrate 146 of the RF module assembly. However, in this case, it is preferable that the location is designed so that optimal heat dissipation performance is implemented in relation to the analog elements on the amplifier board 146 already provided inside the RF filter 140.

So far, the RF filter 140 of the RF module 200 has been described as being employed as a cavity filter, as referred to in (a) of FIG. 23 .

However, the RF module 200 is not necessarily limited to the cavity filter 140-Ca, and as referred to in (b) of FIG. 23, a dielectric ceramic filter 140-Ce is employed. It is also possible.

In this case, the filter heat sink panel 148 may be formed on both sides of the filter body 141 provided with the dielectric ceramic filter 140-Ce, respectively, as shown in (b) of FIG. 23 .

As described above, since the embodiments of the present invention are structures that effectively dissipate heat generated from electric components to outside air corresponding to the front of the front housing 130, as referenced in FIG. 24, the existing main board 120 The FPGA element 128a having a relatively large heating value among a plurality of digital elements mounted on the module can be modularized into the FPGA module 400 and moved to the front of the front housing 130 corresponding to the external space like the RF module 200. there is. Here, the FPGA module 400 includes an FPGA module body 401 in which the above-described FPGA device 128 is disposed, and at least one of both end surfaces of the FPGA module body 401 has an element heat sink panel ( 403) can be modified to increase the heat dissipation performance. That is, by preparing the FPGA device 128a in the form of the FPGA module 400 and configuring it to be coupled to the main board 120 with socket pins, a better heat dissipation design is possible. However, since the FPGA module body 401 is directly exposed to outside air, it is preferable to apply a waterproof structure that prevents inflow of rainwater and the like like the RF module 200.

In addition, as referenced in FIG. 25 , a plurality of RF transmission lines and GND (ground) terminal lines may be provided in the socket portion 146 ′ formed at an end of the amplifier substrate 146 . Here, it is necessary to set a predetermined distance between the RF transmission line and the GND (ground) terminal line on the microstrip.

In the case of the female socket portion 125 formed on the main board 120, since there is a predetermined pitch, the pitch interval may be different depending on the connector used.

Here, when arranging the RF transmission line, the distance (d) between the terminal pin related to the RF transmission line and the terminal pin related to the GND (ground) terminal line is “Pitch (Pitch) * n (number of pins) > d” It is preferable to arrange so that To this end, it is preferable to blank a terminal pin related to the RF transmission line and a terminal pin related to the GND (ground) terminal line.

In this way, the antenna device 100 according to an embodiment of the present invention facilitates the internal system column of the antenna device 100 in all directions including the front as well as the rear as much as the area exposed to the outside air due to the deletion of the radome. Dissipation is possible, and the radiating element module 160 is arranged to be exposed to the outside air through the reflector 150, thereby distributing heat to the front and rear of the antenna device 100, thereby significantly improving heat dissipation performance compared to the prior art. have

In addition, while it is possible to reduce the forward protruding length by the volume occupied by the conventional radome, the front and rear lengths of the plurality of rear heat dissipation fins 111 integrally formed on the rear surface of the rear housing 130 are reduced as much as the forward heat dissipation is possible. Therefore, the front and rear thickness of the antenna device 100 can be designed to be slim as a whole, and accordingly, wall-mounted type installation on the inner or outer wall of a building can be easily achieved.

In the above, various embodiments of an RF module for an antenna, an RF module assembly, and an antenna device including the same according to the present invention have been described in detail with reference to the accompanying drawings. However, it should be taken for granted that the embodiments of the present invention are not necessarily limited by the above-described embodiments, and various modifications and implementation within the equivalent range are possible by those skilled in the art to which the present invention belongs. will be. Therefore, it will be said that the true scope of the present invention is determined by the claims described later.

100: antenna device 105: antenna housing
110: rear housing 110S: inner space
111: rear radiation fin 120: main board
125: female socket part 128a: first heating element
128b: second heating element 130: front housing
140: RF filter 141: filter body
142a: screw through hole 143: bulkhead
146: amplification unit substrate 146': socket unit
146a-1,146a-2: PA element 146c: LNA element
147 fixed boss 148 heat sink panel
149a: screw fixing hole 149b: screw through hole
150: reflector 151: antenna placement unit
155: multiple heat sinks 157: boss through-holes
160: radiating element module 161: radiating element module cover
162: printed circuit board 163a: antenna patch circuit unit
163b: feed line 165: radiation director
166: reinforcing rib 167: director fixing part
168: director fixing protrusion 200: RF module
300: amplification module 500: external mounting member

Claims (20)

A radiating element module disposed on one of the outer surfaces of the RF filter;
an amplification unit substrate disposed on the other one of outer surfaces of the RF filter and having an analog amplification element mounted thereon; and
a reflector disposed between the RF filter and the radiating element module to ground (GND) the radiating element module and to mediate heat generated from the RF filter to radiate to the outside; In the RF module for an antenna comprising a,
The RF module for the antenna is coupled to the socket pin to the main board disposed in the antenna housing, the RF module for the antenna. The method of claim 1,
In the RF module for the antenna before being coupled with the socket pin to the main board, the RF filter is closely installed on the rear surface of the reflector, and then the radiating element module is electrically connected to the RF filter on the front surface of the reflector. An RF module for an antenna, defined as an assembly closely installed to be made. The method of claim 1,
The amplification unit substrate is provided inside an amplification unit substrate body disposed parallel to the RF filter,
The RF filter and the amplification unit substrate body are electrically signal-connected to each other by a mutually sliding coupling operation, an RF module for an antenna. The method of claim 3,
The RF filter and the amplifier substrate are electrically connected by a coaxial connector when the RF filter is slidably coupled to the amplifier substrate body. The method of claim 1,
The RF filter and the reflector are coupled by a PAM nut, an RF module for an antenna. The method of claim 5,
In the reflector, a plurality of installation holes through which the RF filter is installed from the front to the rear and a bending joint bent rearward at an end portion of an inner rim of the plurality of installation holes are formed,
After the fem nut is fastened to the fem nut fixing hole penetrating the bending coupling part in the front and rear directions, the filter fixing screw penetrating the RF filter penetrates the fem nut from the front to the rear and is fastened to the RF filter Is coupled, the RF module for the antenna. The method of claim 1,
The reflector is laminated and coupled to the front surface of the RF filter,
An RF module for an antenna, wherein a plurality of heat sinks are integrally formed on a rear surface of the reflector so as to protrude backward to accommodate the RF filter. The method of claim 1,
The reflector is stacked and coupled to the rear surface of the RF filter,
An RF module for an antenna, wherein a plurality of heat sinks are integrally formed on the front surface of the reflector so as to protrude forward to accommodate the RF filter. The method of claim 1,
The reflector is
Provided in plurality to correspond to the number of the RF filters,
Doedoe coupled to shield the front surface of each of the RF filters, the portion in contact with each of the reflector is provided to come into contact with a curved shape in a zigzag form, the RF module for the antenna. The method of claim 1,
A plurality of heat dissipation holes are formed in the reflector,
The plurality of heat radiation holes, when the spacing of the radiating element modules is arranged at half-wavelength (1/2λ) intervals, having a size of 1/10 to 1/20 or less of the spacing of the radiating element modules, RF for antennas module. The method of claim 1,
The RF filter, the radiating element module, and the amplification unit substrate are manufactured in an array form in a vertical or horizontal direction and coupled to the front surface of the antenna housing in module units. The method of claim 1,
The RF filter may include a filter body having a predetermined space in which the amplifier substrate is disposed; including,
The amplification unit substrate includes a main amplification unit substrate on which some of the analog amplification elements are mounted and disposed in close contact with the inner surface of the filter body, and a main amplification unit substrate on which the remaining parts of the analog amplification elements are mounted and stacked on the main amplification unit substrate An RF module for an antenna comprising a sub-amplifier substrate disposed thereon. The method of claim 12,
An RF module for an antenna, wherein a metal paste via hole filled with a thermally conductive metal component is formed in a portion of the main amplifier substrate where the analog amplification element is mounted. The method of claim 1,
The analog amplification element mounted on the amplification unit substrate includes an RFIC element, an RF module for an antenna. The method of claim 1,
The RF filter includes a filter body employed as either a cavity filter or a dielectric ceramic filter,
At least one of both sides of the filter body, a filter heat sink panel made of a thermally conductive material is further provided, the RF module for an antenna. The method of claim 1,
On one side of the RF filter, an FPGA module including an FPGA board having an FPGA device separated from the main board mounted therein is disposed, and the socket pin is coupled to the main board. The method of claim 16
The FPGA module may include: an FPGA module body in which the FPGA substrate is disposed; including,
An element heat sink panel is disposed on at least one of both end surfaces of the FPGA module body, an RF module for an antenna. The method of claim 1,
A socket portion is provided at an end of the amplification unit substrate for socket pin coupling to the main board,
The socket portion is provided with a plurality of RF transmission lines and GND (ground) terminal lines,
Blank processing between the terminal pins associated with the plurality of RF transmission lines and the terminal pins associated with the GND (ground) terminal line, the RF module for the antenna. a plurality of RF filters each having at least four outer surfaces;
A plurality of radiating element modules disposed on one of outer surfaces of each of the plurality of RF filters;
an amplification unit substrate disposed on the other one of outer surfaces of each of the plurality of RF filters and having an analog amplification element mounted thereon; and
A reflector disposed between the plurality and the RF filter and the plurality of radiating element modules to ground (GND) the radiating element module and to mediate heat generated from the RF filter to radiate heat to the outside; In the RF module assembly for an antenna comprising a,
The RF module assembly for the antenna is coupled with a socket pin to the main board disposed in the antenna housing, the RF module assembly for the antenna. a main board on which at least one digital device is mounted on the front or rear;
an antenna housing in the shape of a housing having an open front so that the main board is installed therein; and
an RF module assembly connected to the main board through an electrical signal line; including,
The RF module assembly may include a plurality of RF filters each having at least four outer surfaces;
A plurality of radiating element modules disposed on one of outer surfaces of each of the plurality of RF filters;
an amplification unit substrate disposed on the other one of outer surfaces of each of the plurality of RF filters and having an analog amplification element mounted thereon; and
A reflector disposed between the plurality and the RF filter and the plurality of radiating element modules to ground (GND) the radiating element module and to mediate heat generated from the RF filter to radiate heat to the outside; Including,
The RF module assembly is coupled with a socket pin to the main board of the antenna housing in units of modules.

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