KR102575267B9 - 웨이퍼의 칩핑 검사 장치 및 방법 - Google Patents

웨이퍼의 칩핑 검사 장치 및 방법

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Publication number
KR102575267B9
KR102575267B9 KR1020220153690A KR20220153690A KR102575267B9 KR 102575267 B9 KR102575267 B9 KR 102575267B9 KR 1020220153690 A KR1020220153690 A KR 1020220153690A KR 20220153690 A KR20220153690 A KR 20220153690A KR 102575267 B9 KR102575267 B9 KR 102575267B9
Authority
KR
South Korea
Prior art keywords
wafer
chipping
inspecting
inspecting chipping
Prior art date
Application number
KR1020220153690A
Other languages
English (en)
Other versions
KR102575267B1 (ko
Inventor
김현태
나지은
Original Assignee
(주)에프피에이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)에프피에이 filed Critical (주)에프피에이
Priority to KR1020220153690A priority Critical patent/KR102575267B1/ko
Application granted granted Critical
Publication of KR102575267B1 publication Critical patent/KR102575267B1/ko
Publication of KR102575267B9 publication Critical patent/KR102575267B9/ko

Links

KR1020220153690A 2022-11-16 2022-11-16 웨이퍼의 칩핑 검사 장치 및 방법 KR102575267B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020220153690A KR102575267B1 (ko) 2022-11-16 2022-11-16 웨이퍼의 칩핑 검사 장치 및 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020220153690A KR102575267B1 (ko) 2022-11-16 2022-11-16 웨이퍼의 칩핑 검사 장치 및 방법

Publications (2)

Publication Number Publication Date
KR102575267B1 KR102575267B1 (ko) 2023-09-07
KR102575267B9 true KR102575267B9 (ko) 2024-01-11

Family

ID=87974889

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220153690A KR102575267B1 (ko) 2022-11-16 2022-11-16 웨이퍼의 칩핑 검사 장치 및 방법

Country Status (1)

Country Link
KR (1) KR102575267B1 (ko)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4973062B2 (ja) * 2006-08-14 2012-07-11 ヤマハ株式会社 半導体チップの検査方法及びウェハのクラック検査装置
JP2010161216A (ja) * 2009-01-08 2010-07-22 Toshiba Corp パターン検査装置およびパターン検査方法
KR20120106913A (ko) * 2011-03-16 2012-09-27 삼성테크윈 주식회사 자동 광학 검사기의 자동 초점 조절 장치.
KR101606093B1 (ko) * 2015-06-26 2016-03-24 주식회사 넥서스원 기판 결함 검사장치 및 방법
JP2021093336A (ja) * 2019-12-12 2021-06-17 株式会社日立ハイテク 画像調整方法および荷電粒子ビームシステム

Also Published As

Publication number Publication date
KR102575267B1 (ko) 2023-09-07

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