KR102572247B1 - Antenna using slot and electronic device including the same - Google Patents

Abstract

According to various embodiments, the electronic device surrounds a first plate, a second plate facing in a direction opposite to the first plate, and a space between the first plate and the second plate, and is coupled to the second plate, or , a housing including a side member integrally formed with the second plate, a display visible through at least a portion of the first plate, and an antenna structure disposed inside the housing, wherein a first U-shaped slot A first conductive layer including a first area including a second area and a second area in contact with the first area, and a second conductive layer facing and spaced apart from the first conductive layer, the first conductive layer facing the first U-shaped slot. An antenna structure including a second conductive layer including a third area including a 2U-shaped slot, and a fourth area contacting the third area and facing the second area, and the first conductive layer or the second conductive layer. and at least one wireless communication circuit electrically coupled to the layer and configured to transmit and/or receive signals having a frequency between 3 GHz and 100 GHz. Other various embodiments may be possible.

Description

Antenna using slot and electronic device including it

Various embodiments of the present invention relate to an antenna using a slot and an electronic device including the same.

With the development of wireless communication technology, electronic devices (eg, electronic devices for communication) are commonly used in daily life, and thus, the use of content is increasing exponentially. Due to the rapid increase in the use of these contents, the network capacity is gradually reaching its limit, and since the commercialization of the 4G (4th generation) communication system, high-frequency (eg mmWave) bands (eg 3 A communication system (eg, 5th generation (5G), pre-5G communication system, or new radio (NR)) that transmits and/or receives a signal using a frequency of a GHz to 300 GHz band is being researched.

Next-generation wireless communication technology can actually transmit and receive signals using a frequency range of 3 GHz to 100 GHz, and an efficient mounting structure to overcome high free space loss due to frequency characteristics and increase antenna gain and a new antenna structure corresponding to this are required. It is a developing trend.

The aforementioned antenna may be configured to form a beam pattern in the front and/or rear direction of the electronic device. Recently, an antenna using a pair of conductive layers spaced apart at regular intervals with a dielectric interposed therebetween (e.g., a shorted patch antenna ) or polarized antennas) are being developed. However, this type of antenna mainly operates only in a single band, and operates in multiple bands (e.g., a first frequency band (e.g., a frequency band ranging from about 24 GHz to 34 GHz) or a second frequency band (about 37 GHz to about 34 GHz)). In the frequency band in the 44 GHz range)), it may be difficult to fully utilize due to insufficient bandwidth.

Various embodiments of the present disclosure may provide an antenna using a slot and an electronic device including the same.

According to various embodiments, an antenna using a slot capable of operating in multi-band (eg, dual-band) and an electronic device including the same may be provided.

According to various embodiments, an antenna using a slot configured to adjust an operating frequency band or expand a bandwidth, and an electronic device including the same may be provided.

According to various embodiments, the electronic device surrounds a first plate, a second plate facing in a direction opposite to the first plate, and a space between the first plate and the second plate, and is coupled to the second plate, or , a housing including a side member integrally formed with the second plate, a display visible through at least a portion of the first plate, and an antenna structure disposed inside the housing, wherein a first U-shaped slot A first conductive layer including a first area including a second area and a second area in contact with the first area, and a second conductive layer facing and spaced apart from the first conductive layer, the first conductive layer facing the first U-shaped slot. An antenna structure including a second conductive layer including a third area including a 2U-shaped slot, and a fourth area contacting the third area and facing the second area, and the first conductive layer or the second conductive layer. and at least one wireless communication circuit electrically coupled to the layer and configured to transmit and/or receive signals having a frequency between 3 GHz and 100 GHz.

An antenna according to various embodiments of the present invention is configured to operate in a dual band of a first frequency band (eg, low band) and a second frequency band (eg, high band) by a slot formed in a pair of conductive layers. The bandwidth of the second frequency band (eg, high band) may be extended by using another conductive layer (eg, a plate-shaped stub) disposed between the conductive layers.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.
1 is a block diagram of an electronic device in a network environment according to various embodiments.
2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks according to various embodiments.
3A is a perspective view of a mobile electronic device according to various embodiments.
3B is a rear perspective view of a mobile electronic device according to various embodiments.
3C is an exploded perspective view of a mobile electronic device according to various embodiments.
FIG. 4A shows an embodiment of the structure of the third antenna module described with reference to FIG. 2 .
FIG. 4B shows a cross section along the line Y-Y' of the third antenna module shown in (a) of FIG. 4A.
5A is a perspective view of an antenna module according to various embodiments of the present invention.
5B is a cross-sectional view illustrating a stacked structure of the antenna module of FIG. 5A according to various embodiments of the present invention.
5C is a plan view illustrating a partially projected state of the antenna module of FIG. 5A according to various embodiments of the present invention.
6A and 6B are graphs illustrating reflection coefficients and gains of the antenna module of FIG. 5A according to various embodiments of the present invention.
6C is a diagram illustrating a radiation pattern for each frequency of the antenna module of FIG. 5A according to various embodiments of the present invention.
7 is a graph showing a reflection coefficient according to a change in width of a U-shaped slot of the antenna module of FIG. 5A according to various embodiments of the present invention.
8A is a perspective view of an antenna module according to various embodiments of the present invention.
8B is a cross-sectional view illustrating a stacked structure of the antenna module of FIG. 8A according to various embodiments of the present invention.
8C is a plan view illustrating a partially projected state of the antenna module of FIG. 8A according to various embodiments of the present invention.
9A to 9L are graphs illustrating a relationship between frequency change according to partial structural change of an antenna structure.
10A is a perspective view of an antenna module according to various embodiments of the present invention.
10B is a cross-sectional view illustrating a stacked structure of the antenna module of FIG. 10A according to various embodiments of the present invention.
10C is a cross-sectional view of the stacked structure of the antenna module of FIG. 10A viewed from another direction according to various embodiments of the present disclosure.
10D is a plan view illustrating a partially projected state of the antenna module of FIG. 10A according to various embodiments of the present invention.
11A is a graph showing reflection coefficients of the antenna module of FIG. 10A according to various embodiments of the present invention.
11B is a diagram illustrating a radiation pattern for each frequency of the antenna module of FIG. 10A according to various embodiments of the present invention.
11C is a graph showing reflection coefficients of an antenna module according to an arrangement relationship between a third conductive layer and a fourth conductive layer according to various embodiments of the present invention.
12A is a perspective view of an antenna module according to various embodiments of the present invention.
12B is a cross-sectional view illustrating a stacked structure of the antenna module of FIG. 12A according to various embodiments of the present invention.
12c is a plan view illustrating a partially projected state of the antenna module of FIG. 12a according to various embodiments of the present invention.
13A is a graph showing reflection coefficients of the antenna module of FIG. 12A according to various embodiments of the present invention.
13B is a diagram illustrating a radiation pattern for each frequency of the antenna module of FIG. 12A according to various embodiments of the present invention.
14 is a perspective view of an antenna module according to various embodiments of the present invention.
15 is a diagram illustrating a radiation pattern of the antenna module of FIG. 14 according to various embodiments of the present invention.
16A to 16D are diagrams illustrating beam scanning performance according to a phase difference of the antenna module of FIG. 14 according to various embodiments of the present invention.
17 is a perspective view of an antenna module according to various embodiments of the present invention.
18A and 18B are perspective and cross-sectional views of an antenna module having a double substrate stack structure according to various embodiments of the present invention.
19 is a graph showing the gain and reflection coefficient of the antenna module of FIG. 18A according to various embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present invention.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , process commands or data stored in the volatile memory 132 , and store resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that may operate independently of or in conjunction therewith. , sensor hub processor, or communication processor). Additionally or alternatively, the secondary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used for a component (eg, the processor 120) of the electronic device 101 from an outside of the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (eg, a stylus pen).

The sound output device 155 may output sound signals to the outside of the electronic device 101 . The audio output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to detect a touch or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by a touch. .

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 388 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunications network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module may include one antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas by the communication module 190, for example. It can be. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna. According to some embodiments, other components (eg, RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as it is or additionally processed and provided as at least part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology. this can be used

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in this document may include a unit implemented by hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Device-readable storage media may be provided in the form of non-transitory storage media. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smartphones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a singular entity or a plurality of entities. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2 is a block diagram 200 of an electronic device 101 in a network environment including a plurality of cellular networks, according to various embodiments.

Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third An RFIC 226, a fourth RFIC 228, a first radio frequency front end (RFFE) 232, a second RFFE 234, a first antenna module 242, a second antenna module 244, and an antenna (248). The electronic device 101 may further include a processor 120 and a memory 130 . The second network 199 may include a first cellular network 292 and a second cellular network 294 . According to another embodiment, the electronic device 101 may further include at least one of the components illustrated in FIG. 1 , and the second network 199 may further include at least one other network. According to one embodiment, a first communication processor 212, a second communication processor 214, a first RFIC 222, a second RFIC 224, a fourth RFIC 228, a first RFFE 232, and the second RFFE 234 may form at least a portion of the wireless communication module 192 . According to another embodiment, the fourth RFIC 228 may be omitted or included as part of the third RFIC 226 .

The first communication processor 212 may establish a communication channel of a band to be used for wireless communication with the first cellular network 292 and support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel. communication can be supported. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 may transmit data to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294. It is possible to support establishment of a corresponding communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented on a single chip or in a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120, the co-processor 123, or the communication module 190. there is.

The first RFIC 222, when transmitted, transmits a baseband signal generated by the first communication processor 212 to about 700 MHz to about 700 MHz used in the first cellular network 292 (eg, a legacy network). It can be converted into a radio frequency (RF) signal at about 3 GHz. Upon reception, an RF signal is obtained from a first cellular network 292 (eg, a legacy network) via an antenna (eg, the first antenna module 242) and transmits an RFFE (eg, the first RFFE 232). It can be preprocessed through The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .

When transmitting, the second RFIC 224 uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter referred to as a 5G Sub6 RF signal) of a Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, a 5G network) through an antenna (eg, the second antenna module 244), and an RFFE (eg, the second RFFE 234) ) can be pretreated through. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 and the second communication processor 214 .

The third RFIC 226 transfers the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, a 5G network). ) into an RF signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248) and preprocessed via a third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .

The electronic device 101, according to one embodiment, may include a fourth RFIC 228 separately from or at least as part of the third RFIC 226. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an intermediate frequency band (eg, about 9 GHz to about 11 GHz) RF signal (hereinafter referred to as IF signal). ), the IF signal may be transmitted to the third RFIC 226. The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second cellular network 294 (eg, a 5G network) via an antenna (eg, antenna 248) and converted to an IF signal by a third RFIC 226. there is. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to an example, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to one embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or processor 120 may be disposed on a first substrate (eg, main PCB). In this case, the third RFIC 226 is provided on a part (eg, bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is placed on another part (eg, top surface). is disposed, the third antenna module 246 may be formed. By arranging the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal of a high frequency band (eg, about 6 GHz to about 60 GHz) used for 5G network communication by a transmission line. As a result, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).

According to one embodiment, the antenna 248 may be formed of an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 226 may include, for example, a plurality of phase shifters 238 corresponding to a plurality of antenna elements as a part of the third RFFE 236. During transmission, each of the plurality of phase converters 238 may convert the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . During reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (eg, 5G network) may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 292 (eg, a legacy network) ( Example: Non-Stand Alone (NSA)). For example, a 5G network may include only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)) and no core network (eg, a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with the legacy network (eg LTE protocol information) or protocol information for communication with the 5G network (eg New Radio (NR) protocol information) is stored in the memory 230, and other parts (eg processor 120, the first communications processor 212, or the second communications processor 214).

3A is a perspective view of the front of a mobile electronic device 300 according to various embodiments. 3B is a rear perspective view of a mobile electronic device 300 according to various embodiments.

Referring to FIGS. 3A and 3B , a mobile electronic device 300 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments has a first surface (or front surface) 310A, a second surface ( Alternatively, it may include a housing 310 including a rear surface) 310B, and a side surface 310C surrounding a space between the first surface 310A and the second surface 310B. In one embodiment (not shown), the housing may refer to a structure forming some of the first face 310A, the second face 310B, and the side face 310C. According to one embodiment, the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) that is at least partially transparent. The second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 may be formed, for example, of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be. The side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, a metal material such as aluminum).

In the illustrated embodiment, the front plate 302 includes two first regions 310D that are bent from the first surface 310A toward the back plate 311 and extend seamlessly, the front plate 310D. It can be included on both ends of the long edge of (302). In the illustrated embodiment (see FIG. 3B ), the back plate 311 has long edges of two second regions 310E that are curved from the second surface 310B toward the front plate 302 and extend seamlessly. Can be included at both ends. In some embodiments, the front plate 302 (or the rear plate 311) may include only one of the first regions 310D (or the second regions 310E). In one embodiment, some of the first regions 310D or the second regions 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 300, the side bezel structure 318 is the first area 310D or the second area 310E as described above is not included. 1 thickness (or width), and may have a second thickness thinner than the first thickness on a side surface including the first region 310D or the second region 310E.

According to an embodiment, the electronic device 300 includes a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, camera modules 305, 312, and 313, and key input. At least one of the device 317 , the light emitting element 306 , and the connector holes 308 and 309 may be included. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306) or may additionally include other components.

The display 301 may be exposed through a substantial portion of the front plate 302, for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first region 310D of the side surface 310C. In some embodiments, a corner of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 . In one embodiment (not shown), in order to expand the area where the display 301 is exposed, the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same.

In one embodiment (not shown), a recess or an opening is formed in a part of the screen display area of the display 301, and the audio module 314 aligned with the recess or the opening, the sensor At least one of the module 304 , the camera module 305 , and the light emitting device 306 may be included. In one embodiment (not shown), on the rear surface of the screen display area of the display 301, the audio module 314, the sensor module 304, the camera module 305, the fingerprint sensor 316, and the light emitting element 306 ) may include at least one of them. In one embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic stylus pen. can be placed. In some embodiments, at least a portion of the sensor modules 304 and 319 and/or at least a portion of the key input device 317 are in the first area 310D and/or the second area 310E. can be placed.

The audio modules 303 , 307 , and 314 may include microphone holes 303 and speaker holes 307 and 314 . A microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).

The sensor modules 304 , 316 , and 319 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 300 or an external environmental state. The sensor modules 304, 316, and 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module (eg, a proximity sensor) disposed on the first surface 310A of the housing 310. (not shown) (eg, a fingerprint sensor), and/or a third sensor module 319 (eg, an HRM sensor) and/or a fourth sensor module 316 disposed on the second surface 310B of the housing 310. ) (eg, a fingerprint sensor). The fingerprint sensor may be disposed on the second surface 310B as well as the first surface 310A (eg, the display 301) of the housing 310. The electronic device 300 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor 304 may be further included.

The camera modules 305, 312, and 313 include a first camera device 305 disposed on the first surface 310A of the electronic device 300 and a second camera device 312 disposed on the second surface 310B. ), and/or flash 313. The camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

The key input device 317 may be disposed on the side surface 310C of the housing 310 . In one embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included may include soft keys or the like on the display 301. It can be implemented in different forms. In some embodiments, the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310 .

The light emitting device 306 may be disposed on, for example, the first surface 310A of the housing 310 . The light emitting element 306 may provide, for example, state information of the electronic device 300 in the form of light. In one embodiment, the light emitting device 306 may provide, for example, a light source interlocked with the operation of the camera module 305 . The light emitting element 306 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 308 and 309 include a first connector hole 308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device. and a second connector hole (eg, an earphone jack) 309 capable of accommodating a connector for transmitting and receiving an audio signal.

3C is an exploded perspective view of a mobile electronic device 320 according to various embodiments.

Referring to FIG. 3C , the mobile electronic device 320 (eg, the mobile electronic device 300 of FIG. 3A ) includes a side bezel structure 321, a first support member 3211 (eg, a bracket), a front plate ( 322), a display 323, a printed circuit board 324, a battery 325, a second support member 326 (eg, a rear case), an antenna 327, and a rear plate 328. . In some embodiments, the electronic device 320 may omit at least one of the components (eg, the first support member 3211 or the second support member 326) or may additionally include other components. . At least one of the components of the electronic device 320 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B , and duplicate descriptions will be omitted below.

The first support member 3211 may be disposed inside the electronic device 320 and connected to the side bezel structure 321 or integrally formed with the side bezel structure 321 . The first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display 323 may be coupled to one surface of the first support member 3211 and the printed circuit board 324 may be coupled to the other surface. A processor, memory, and/or interface may be mounted on the printed circuit board 324 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

Memory may include, for example, volatile memory or non-volatile memory.

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 320 with an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 325 is a device for supplying power to at least one component of the electronic device 320, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 325 may be disposed on a substantially coplanar surface with the printed circuit board 324 , for example. The battery 325 may be integrally disposed inside the electronic device 320 or may be disposed detachably from the electronic device 320 .

The antenna 327 may be disposed between the back plate 328 and the battery 325 . The antenna 327 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 327 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In one embodiment, an antenna structure may be formed by a part of the side bezel structure 321 and/or the first support member 3211 or a combination thereof.

FIG. 4A shows one embodiment of the structure of the third antenna module 246 described, for example, with reference to FIG. 2 . (a) of FIG. 4A is a perspective view of the third antenna module 246 viewed from one side, and (b) of FIG. 4A is a perspective view of the third antenna module 246 viewed from the other side. 4A(c) is a cross-sectional view of the third antenna module 246 along the line XX'.

Referring to FIG. 4A, in one embodiment, the third antenna module 246 includes a printed circuit board 410, an antenna array 430, a radio frequency integrate circuit (RFIC) 452, and a power manage integrate circuit (PMIC). (454). Optionally, the third antenna module 246 may further include a shielding member 490 . In other embodiments, at least one of the aforementioned components may be omitted or at least two of the components may be integrally formed.

The printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 410 may provide an electrical connection between the printed circuit board 410 and/or various electronic components disposed externally using wires and conductive vias formed on the conductive layer.

Antenna array 430 (eg, 248 in FIG. 2 ) may include a plurality of antenna elements 432 , 434 , 436 , or 438 arranged to form a directional beam. The antenna elements 432, 434, 436, or 438 may be formed on the first surface of the printed circuit board 410 as shown. According to another embodiment, the antenna array 430 may be formed inside the printed circuit board 410 . According to embodiments, the antenna array 430 may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) of the same or different shapes or types.

An RFIC 452 (eg, 226 in FIG. 2 ) may be disposed in another area of the printed circuit board 410 (eg, a second surface opposite the first surface) spaced apart from the antenna array. there is. The RFIC is configured to process signals of a selected frequency band transmitted/received through the antenna array 430. According to an embodiment, the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. When receiving, the RFIC 452 may convert the RF signal received through the antenna array 430 into a baseband signal and transmit the converted baseband signal to the communication processor.

According to another embodiment, the RFIC 452 transmits an IF signal (eg, about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (eg, 228 of FIG. 2 ) to a selected band during transmission. can be up-converted to an RF signal of When receiving, the RFIC 452 down-converts the RF signal obtained through the antenna array 430, converts the RF signal into an IF signal, and transmits the converted signal to the IFIC.

The PMIC 454 may be disposed in another partial area (eg, the second surface) of the printed circuit board 410 , spaced apart from the antenna array 430 . The PMIC may receive voltage from a main PCB (not shown) and provide power necessary for various components (eg, the RFIC 452) on the antenna module.

The shielding member 490 may be disposed on a portion (eg, the second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 and the PMIC 454 . According to one embodiment, the shielding member 490 may include a shield can.

Although not shown, in various embodiments, the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC 452 and/or the PMIC 454 of the antenna module may be electrically connected to the printed circuit board through the connection member.

FIG. 4B shows a cross section along the line Y-Y' of the third antenna module 246 shown in (a) of FIG. 4A. The printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413 .

Referring to FIG. 4B , the antenna layer 411 includes at least one dielectric layer 437-1, and an antenna element 436 and/or a power supply unit 425 formed on or inside an outer surface of the dielectric layer. can include The power supply unit 425 may include a power supply point 427 and/or a power supply line 429 .

The network layer 413 includes at least one dielectric layer 437-2, and at least one ground layer 433 formed on or inside the dielectric layer, at least one conductive via 435, and a transmission line. 423, and/or a signal line 429.

In addition, in the illustrated embodiment, the RFIC 452 (eg, the 3RFIC 226 of FIG. 2) of (c) shown in FIG. 4A includes, for example, first and second solder bumps 440 -1, 440-2) may be electrically connected to the network layer 413. In other embodiments, various connection structures (eg solder or BGA) may be used instead of connections. The RFIC 452 may be electrically connected to the antenna element 436 through the first connection part 440 - 1 , the transmission line 423 , and the power supply part 425 . The RFIC 452 may also be electrically connected to the ground layer 433 through the second connection portion 440 - 2 and the conductive via 435 . Although not shown, the RFIC 452 may also be electrically connected to the above-mentioned module interface through the signal line 429 .

5A is a perspective view of an antenna module 500 according to various embodiments of the present invention. 5B is a cross-sectional view illustrating a stacked structure of the antenna module 500 of FIG. 5A according to various embodiments of the present invention. FIG. 5B is a cross-sectional view viewed along the line X1-X1' of FIG. 5A.

The antenna module 500 of FIG. 5A is at least partially similar to the third antenna module 246 of FIG. 2, or may further include other embodiments of the antenna module.

Referring to FIG. 5A , the antenna module 500 may be disposed in an internal space of an electronic device. According to an embodiment, the antenna module 500 may be disposed such that a beam pattern is formed in a direction (eg, a side surface 310C of FIG. 3A) of an electronic device (eg, the electronic device 300 of FIG. 3A). In another embodiment, the antenna module 500 may be a rear plate (eg, the rear plate 311 of FIG. 3B) (eg, the second plate) or a front plate of an electronic device (eg, the electronic device 300 of FIG. 3A). (eg, the front plate 302 of FIG. 3A) (eg, the first plate) may be arranged so that a beam pattern is formed toward at least a part. According to one embodiment, the antenna module 500 may include a printed circuit board 510 on which a plurality of insulating layers are stacked and disposed in an internal space of an electronic device (eg, the electronic device 300 of FIG. 3A ). .

According to various embodiments, the antenna module 500 may include an antenna structure R1. According to one embodiment, the antenna structure R1 may be formed on the printed circuit board 510 . According to one embodiment, the printed circuit board 510 may include a first surface 511 and a second surface 512 facing the opposite direction of the first surface 511 . According to one embodiment, the antenna structure R1 may include conductive layers 520 and 530 respectively disposed through at least two layers among a plurality of insulating layers of the printed circuit board 510 . According to one embodiment, the antenna structure R1 includes a first conductive layer 520 disposed on a printed circuit board 510 and a second conductive layer 530 facing and spaced apart from the first conductive layer 520. can do. According to one embodiment, the first conductive layer 520 may be disposed to be exposed on the first surface 511 of the printed circuit board. In another embodiment, the first conductive layer 520 may be disposed through any one insulating layer inside the printed circuit board 510 . According to one embodiment, the second conductive layer 530 may be disposed to be exposed on the second surface 512 of the printed circuit board 510 . In another embodiment, the second conductive layer 530 may be disposed through any one insulating layer inside the printed circuit board 510 .

According to various embodiments, the first conductive layer 520 includes a first area A1 including a first U-shaped slot 521 and a second area A2 contacting the first area A1. ) may be included. According to one embodiment, the second conductive layer 530 includes a second U-shaped slot 531 facing the first U-shaped slot 521 and a third area A3 facing the first area A1. ) and a fourth area A4 contacting the third area A3 and facing the second area A2. According to one embodiment, the first U-shaped slot 521 and the second U-shaped slot 531 may be formed from each of the conductive layers 520 and 530 through a process such as etching. According to one embodiment, the first U-shaped slot 521 and the second U-shaped slot 531 are formed in the direction of the first area A1 from the boundary between the first area A1 and the second area A2. It can be. According to one embodiment, the first U-shaped slot 521 and the second U-shaped slot 531 may have the same shape and overlap each other when viewing the first conductive layer 520 from above. .

According to various embodiments, the antenna structure R1 includes a first space 5411 formed between the first area A1 and the third area A3 and between the second area A2 and the fourth area A4. It may include a second space 5421 formed in. According to an embodiment, the antenna structure R1 includes the first dielectric 541 and the second area A2 filled in the first space 5411 between the first area A1 and the third area A3. A second dielectric 542 filled in the second space 5421 between the fourth regions A4 may be included. According to one embodiment, the first dielectric 541 and the second dielectric 542 may include an insulating material or air disposed between the first conductive layer 520 and the second conductive layer 530. . In another embodiment, the first dielectric 541 and the second dielectric 542 may include an insulating layer of the printed circuit board 510 disposed between the first conductive layer 520 and the second conductive layer 530. may be

According to various embodiments, the antenna structure R1 is disposed between the second area A2 and the fourth area A4 and is electrically connected to the wireless communication circuit 590 from at least a portion of the second conductive layer 530. It may include a first feed line 550 connected thereto. According to one embodiment, one end of the first feed line 550 may be electrically connected to the second conductive layer 530 through the first feed part 551 (eg, a conductive via). According to one embodiment, the other end of the first feed line 550 is electrically connected to the wireless communication circuit 590 through the first feed line 552 disposed between the first conductive layer 520 and the second conductive layer. can be connected According to one embodiment, the wireless communication circuit 590 may be disposed on the second side 512 of the printed circuit board 510 . In another embodiment, the wireless communication circuit 590 connects a conductive cable (eg, a flexible printed circuit board (FPCB)) in an internal space of an electronic device (eg, the electronic device 300 of FIG. 3A ). It may be arranged to be spaced apart from the printed circuit board 510 through the. In another embodiment, the wireless communication circuit 590 is disposed on a printed circuit board (eg, a substrate) spaced apart from the printed circuit board 510, and connected to the printed circuit board 510 through a conductive cable. It may be electrically connected to the antenna structure R1. According to one embodiment, the first power supply unit 551 may be disposed to be electrically connected to the first power supply line 550 in the second space 5421 . In another embodiment, the first power supply unit 551 may be disposed to be electrically connected to the first power supply line 550 in the first space 5411 . In this case, at least a part of the first feed line 550 may extend to the first space 5411. According to one embodiment, the wireless communication circuit 590 includes a first area A1 of the first conductive layer 520 including the first U-shaped slot 521 and a second U-shaped slot 531. A signal having a frequency in the range of 3 GHz to 100 GHz may be transmitted and/or received through the third region A3 of the second conductive layer 530 . According to one embodiment, the first area A1 of the first conductive layer 520 including the first U-shaped slot 521 and the second conductive layer 530 including the second U-shaped slot 531 The third region A3 of may operate as a patch antenna (eg, a shorted patch antenna) forming vertical polarization.

According to various embodiments, the antenna structure R1 includes a first region A1 of the first conductive layer 520 including the first U-shaped slot 521 and a second U-shaped slot 531 including the first area A1. Through the third region A3 of the second conductive layer 530, it is possible to operate in a dual band. According to one embodiment, the antenna structure R1 includes a first region A1 and a second conductive layer of the first conductive layer 520 including the first U-shaped slot 521 and the second U-shaped slot 531 . A first frequency band (eg, a frequency band in the range of about 24 GHz to 34 GHz) (eg, about 28 GHz band) and a second frequency band (eg, about 37 GHz) designated through the third region A3 of the layer 530 It can operate in a frequency band ranging from GHz to 44 GHz) (e.g., a band of about 39 GHz).

5C is a plan view illustrating a partially projected state of the antenna module 500 of FIG. 5A according to various embodiments of the present invention.

Referring to FIG. 5C , the second space 5421 is a cavity filled with dielectric between the second area A2 of the first conductive layer 520 and the fourth area A4 of the second conductive layer 530 ( cavity) may be included. According to an embodiment, the second space 5421 may be formed in a rectangular shape having a certain depth from a boundary between the first area A1 and the second area A2 toward the second area A2. According to one embodiment, the second space 5421 is an electrical connecting member electrically connecting the first conductive layer 520 and the second conductive layer 530 in a vertical direction along a boundary line of the second space 5421. It may be formed to be electrically disconnected through (543). According to an embodiment, the electrical connection member 543 may include a plurality of conductive vias disposed from the first conductive layer 520 to the second conductive layer 530 along the boundary line of the second space 5241. there is.

According to various embodiments, the first frequency band (eg, low band) of the antenna structure R1 may be changed according to the lengths L of the first U-shaped slot 521 and the second U-shaped slot 531. there is. For example, even if the lengths L of the first U-shaped slot 521 and the second U-shaped slot 531 are changed for impedance matching of the first frequency band (eg, low band), the second antenna structure R1 A variation width of a frequency band (eg, high band) may be kept small. Therefore, the antenna structure R1 according to an exemplary embodiment of the present invention may be advantageous for shifting the first frequency band (eg, low band) in a state where the change width of the second frequency band (eg, high band) is kept small. connect. In another embodiment, the fundamental resonant frequency may be changed according to the size, vertical spacing, or position of the power supply unit of the first area A1 of the first conductive layer 520 and the third area A3 of the second conductive layer 530. It may be determined, and the additional frequency band may be determined by the overall length (L) of the first U-shaped slot 521 and / or the second U-shaped slot 531, the width of the slot, or the protruding length of the slot.

6A and 6B are graphs illustrating reflection coefficients and gains of the antenna module 500 of FIG. 5A according to various embodiments of the present invention. FIG. 6C is a diagram illustrating a radiation pattern for each frequency of the antenna module 500 of FIG. 5A according to various embodiments of the present invention.

Referring to FIGS. 6A to 6C , a 1 U-shaped slot (eg, the 1 U-shaped slot 521 of FIG. 5A ) and a 2 U-shaped slot (eg, the 2 U-shaped slot 531 of FIG. 5A ) An antenna structure including an antenna structure (eg, the antenna structure R1 of FIG. 5A) has a gain of about 2.87 dBi in a first frequency band (eg, low band) having a bandwidth of about 1 GHz in the range of about 27.7 GHz to 28.7 GHz. has a gain of about 2.87 dBi in a second frequency band (eg, high band) having a bandwidth of about 2.9 GHz in the range of about 37 GHz to 39.9 GHz, and can be operated smoothly (eg, area 601 in FIGS. 6A and 6B). It can be seen that it can be operated smoothly with (eg, area 602 of FIGS. 6A and 6B).

FIG. 7 is a graph showing reflection coefficients according to changes in the widths of the U-shaped slots 521 and 531 of the antenna module 500 of FIG. 5A according to various embodiments of the present invention.

Referring to FIG. 7, the length of the first U-shaped slot (eg, the first U-shaped slot 521 of FIG. 5A) and the second U-shaped slot (eg, the second U-shaped slot 531 of FIG. 5A) ( Example: The first frequency band (eg, low band) may be shifted according to the length (L) of FIG. 5C. In this case, it can be seen that the range of change in the second frequency band (eg, high band) is small in the designated frequency band (eg, about 39 GHz band). For example, the antenna structure (eg, the antenna structure R1 of FIG. 5C ) may include a first U-shaped slot (eg, the first U-shaped slot 521 of FIG. 5A ) in a first frequency band (eg, low band). ) and the length of the 2U-shaped slot (eg, the 2U-shaped slot 531 in FIG. 5A) (eg, the length (L) in FIG. 5C) is 3.2 mm, it can operate in a frequency band of about 30 GHz. And, in the case of 3.5 mm, it can operate in about 28 GHz frequency band, and in the case of 3.8 mm, it can be seen that it operates in about 26 GHz frequency band. Therefore, the length of the first U-shaped slot (eg, the first U-shaped slot 521 of FIG. 5A) and the second U-shaped slot (eg, the second U-shaped slot 531 of FIG. 5A) (eg, the length of FIG. 5C When the length (L) of is increased to a certain level, the antenna structure (eg, the antenna structure (R1) of FIG. 5C) maintains a small change in the second frequency band (eg, high band), while maintaining the first frequency band (eg, the antenna structure (R1) of FIG. 5C). Example: It can be seen that the frequency shifts gradually from the low band to the low frequency band.

8A is a perspective view of an antenna module 800 according to various embodiments of the present invention. 8B is a cross-sectional view illustrating a stacked structure of the antenna module 800 of FIG. 8A according to various embodiments of the present invention. FIG. 8B is a cross-sectional view taken along the line X2-X2' of FIG. 8A.

In describing the exemplary embodiments of the present invention, the same reference numerals have been given to the same elements as those described above, and detailed descriptions thereof may be omitted.

The antenna module 800 of FIG. 8A is at least partially similar to the third antenna module 246 of FIG. 2, or may further include other embodiments of the antenna module.

Referring to FIG. 8A , the antenna module 800 may include an antenna structure R2. According to one embodiment, the antenna structure (R2) includes a first conductive layer 520 including a first U-shaped slot 521 and a second conductive layer 530 including a second U-shaped slot 531. can include According to one embodiment, in at least the second dielectric 542 between the first conductive layer 520 and the second conductive layer 530, disposed substantially parallel to the first conductive layer 520, the first conductive layer When viewing 520 from the top, a third conductive layer 560 disposed to have a smaller area than that of the first conductive layer 520 may be included. According to one embodiment, the third conductive layer 560 may be disposed parallel to the first conductive layer 520 and the second conductive layer 530 . According to an embodiment, the third conductive layer 560 is formed from a ground layer (eg, a conductive layer) disposed between the first conductive layer 520 and the second conductive layer 530 among insulating layers of the printed circuit board. It may be arranged to extend with an area. According to one embodiment, the third conductive layer 560 may be electrically connected to the conductive connecting member 543 electrically connecting the first conductive layer 520 and the second conductive layer 530 . According to one embodiment, the wireless communication circuitry 590 may be configured to transmit and/or receive signals having a frequency ranging from 3 GHz to 100 GHz via the antenna structure R2. According to one embodiment, the third conductive layer 560 may be disposed between the first conductive layer 520 and the first feed line 550 . According to one embodiment, the third conductive layer 560 may be disposed at a position capable of being coupled with the first feed line 560 (capacitively coupled). According to one embodiment, the third conductive layer 560 may be substantially disposed within the second dielectric 542 . In another embodiment, at least a portion of the third conductive layer 560 may extend into the first dielectric 541 . According to one embodiment, when viewing the first conductive layer 520 from the top, the third conductive layer 560 is directed in a first direction (direction ①) from the first space 5411 to the second space 5421. It may include a first edge 561 extending along a second direction (direction ②) perpendicular to . According to one embodiment, the third conductive layer 560 is disposed in the first edge 561 and may include a recess 562 (eg, a groove) formed in a first direction (① direction). According to one embodiment, the recess 562 may be formed to have a predetermined depth at the center of the first edge 561 when viewing the first conductive layer 520 from the top. Accordingly, the third conductive layer 560 may include a first protrusion 5611 and a second protrusion 5612 respectively protruding from both ends of the recess 562 .

According to various embodiments, the antenna structure R2 is a third conductive layer 560 disposed to be spaced apart from the first feed line 550 at regular intervals between the first conductive layer 520 and the second conductive layer 530. ), the bandwidth of the second frequency band (eg, high band) can be extended.

8C is a plan view illustrating a partially projected state of the antenna module 800 of FIG. 8A according to various embodiments of the present invention.

Referring to FIG. 8C , the third conductive layer 560 may be substantially disposed at the center of the second space 5421 when viewing the first conductive layer 520 from above. According to one embodiment, the recess 562 may be disposed substantially at the center of the first edge 561 when viewing the first conductive layer 520 from the top. According to an embodiment, the third conductive layer 560 includes a first protrusion 5611 and a second protrusion 5612 formed so that both ends protrude by the recess 562 disposed on the first edge 561. can do. According to one embodiment, the first protrusion 5611 and the second protrusion 5612 may have substantially the same shape and size. According to one embodiment, when viewing the first conductive layer 520 from the top, the first feed line 550 is substantially transverse to the center of the third conductive layer 560 in the first direction (① direction). It can be arranged so as to be worn. According to one embodiment, the first feeding part 551 electrically connected to the first feeding line 550 overlaps or overlaps the recess 562 when viewing the first conductive layer 520 from the top. It can be placed in a location where it is not. According to one embodiment, the third conductive layer 560 is disposed so that the recess 562 substantially overlaps at least a portion of the second space 5421 when viewing the first conductive layer 520 from the top. It can be. In another embodiment, the third conductive layer 560 may be disposed such that at least a portion of the recess 562 overlaps at least a portion of the first space 5411 .

According to various embodiments, the bandwidth of the second frequency band (eg, high band) of the antenna structure R2 may be changed according to the change in the width S_w of the first protrusion 5611 and the second protrusion 5612. . For example, the bandwidth of the second frequency band (eg, high band) of the antenna structure R2 may be changed according to a change in length from the recess 562 to the first protrusion 5611 and the second protrusion 5612. . According to one embodiment, the antenna structure R2 includes a first region A1 of the first conductive layer 520 including the first U-shaped slot 521 and a second U-shaped slot 531. It can be operated in the second frequency band (eg, about 28 GHz band) designated through the third region A3 of the second conductive layer 530, and the third conductive layer 560 serving as a conductive stub Through this, the bandwidth of the designated second frequency band (eg, about 39 GHz band) can be expanded.

9A to 9L are graphs illustrating a relationship between frequency change according to partial structural change of an antenna structure. A numerical unit of the corresponding part according to the structure change of the antenna structure shown in FIGS. 9A to 9L may be mm.

9A and 9B show changes in the width (eg, width C_w of FIG. 8C ) and depth (eg, a cavity) of a second space (eg, the second space 5421 of FIG. 8C ) (eg, a cavity). It is a graph showing the reflection coefficient of the antenna structure (eg, the antenna structure R2 of FIG. 8C) according to the change in the depth (C_h) of FIG. 8C.

Referring to FIG. 9A, the antenna structure R2 has a small change width in the second frequency band (eg, high band) according to a change in the width (C_w) of the second space 5421, and the first frequency band (eg, high band) : low band) is shifted to a designated frequency band. For example, as the width C_w of the second space 5421 increases, it can be seen that the first frequency band shifts to a lower frequency band (region 901).

Referring to FIG. 9B, the antenna structure R2 has a first frequency band (eg, low band) and a second frequency band (eg, high band) according to a change in the depth (C_h) of the second space 5421. change can be seen. For example, it can be seen that the first frequency band and the second frequency band are shifted to a lower frequency band as the depth of the second space 5421 increases (regions 902 and 903).

9C to 9E show an antenna structure (eg, the second space 5421 of FIG. 8C) according to a change in position of the first feeder (eg, the first feeder 551 of FIG. 8C) in the second space (eg, the second space 5421 of FIG. 8C). : A graph showing the reflection coefficient of the antenna structure R2 of FIG. 8C.

Referring to FIG. 9C , the antenna structure R2 is the distance (eg, the distance (eg, the inner surface 5421b of FIG. 8C) from the first feeding part 551 to the inner surface of the second space 5421 (eg, the inner surface 5421b in FIG. 8C). It can be seen that the impedance characteristic changes in the second frequency band (eg, high band) according to the change in the distance F_w (region 904).

Referring to FIG. 9D, the antenna structure R2 is a distance (eg, a distance in FIG. 8C ( It can be seen that, according to the change of F_h), the impedance characteristics are changed together in the first frequency band (eg, low band) and the second frequency band (eg, high band) (regions 905 and 906).

Referring to FIG. 9E, the antenna structure R2 has a height from the second conductive layer (eg, the second conductive layer 530 of FIG. 8B) to the first power supply unit 551 (eg, the height F_t of FIG. 8B). )), it can be seen that the impedance characteristics and the operating frequency band are changed together in the first frequency band (eg, low band) and the second frequency band (eg, high band) (regions 907 and 908).

9F and 9G show the protrusion length (eg, protrusion length P_h of FIG. 8C) and width (eg, width P_w of FIG. 8C) of the first conductive layer (eg, first conductive layer 520 of FIG. 8C). ) is a graph showing the reflection coefficient of an antenna structure (eg, the antenna structure R2 of FIG. 8C) according to a change in. For example, the second conductive layer (eg, the second conductive layer 530 of FIG. 8B) also It may be changed correspondingly to the conductive layer 520 .

Referring to FIG. 9F, the antenna structure R2 has a small change width in the first frequency band (eg, low band) according to the change in the protruding length P_h of the first conductive layer 520, and the second frequency It can be seen that the band (eg, high band) is shifted to a designated frequency band. For example, it can be seen that as the protruding length P_h of the first conductive layer 520 increases, the operating frequency band shifts to a lower frequency band (region 909).

Referring to FIG. 9G , it can be seen that the impedance characteristic for changing the bandwidth of the second frequency band (eg, high band) of the antenna structure R2 changes according to the change in the width P_w of the first conductive layer 520. can (area 910).

9H and 9I show an antenna structure (eg, spacing W in FIG. 8C) and protruding length (eg, protruding length H in FIG. 8C) of the first U-shaped slot 521. : A graph showing the reflection coefficient of the antenna structure R2 of FIG. 8C. For example, the 2 U-shaped slot (eg, the 2 U-shaped slot 531 of FIG. 8B ) may also be changed to correspond to the 1 U-shaped slot 521 .

Although not shown, the change in the first frequency band and the second frequency band according to the change in the width (eg, the width (L) of FIG. 8C) of the first U-shaped slot 521 is insufficient, so the corresponding graph is omitted.

Referring to FIG. 9H , the antenna structure R2 has a first frequency band (eg, low band) and a second frequency band (eg, high band) according to a change in the spacing (W) of the first U-shaped slot 521. It can be seen that the operating frequency band in is changed together. For example, it can be seen that the antenna structure R2 shifts from the first frequency band and the second frequency band to a high frequency band as the spacing W of the first U-shaped slot 521 increases (regions 911 and 912).

Referring to FIG. 9I, the antenna structure R2 has a small change width in the second frequency band (eg, high band) according to the change in the protruding length H of the first U-shaped slot 521, while the first frequency band It can be seen that a band (eg, low band) is shifted to a designated frequency band. For example, it can be seen that as the protrusion length H increases, the antenna structure shifts from the first frequency band to the lower frequency band (region 913).

9J to 9L are graphs showing the reflection coefficient of an antenna structure (eg, the antenna structure R2 of FIG. 8C) according to a structural change of a third conductive layer (eg, the third conductive layer 560 of FIG. 8C). .

Referring to FIG. 9J , the antenna structure R2 includes the first protrusion (eg, the first protrusion 5611 of FIG. 8C) and the second protrusion (eg, the second protrusion of FIG. 8C) of the third conductive layer 560. 5612)), the first frequency band (eg, low band) has a small change width according to the change in the width (eg, width (S_w) of FIG. 8C), while the second frequency band (eg, high band) has a bandwidth It can be changed (area 914).

Referring to FIG. 9K, the antenna structure R2 is formed from the first edge (eg, the first edge 561 of FIG. 8C) to the second space (eg, the second space 5421 of FIG. 8C) of the third conductive layer 560. )) in the second frequency band (eg, high band) according to a change in the distance (eg, distance S_l in FIG. 8C) to the inner surface (eg, inner surface 5421a in FIG. 8C) and the frequency band It can be seen that it is changed (region 915).

Referring to FIG. 9L, the antenna structure R2 is formed from a first feed line (eg, the second feed line 550 of FIG. 8B) to a third conductive layer (eg, the third conductive layer 560 of FIG. 8B). It can be seen that the impedance characteristics and frequency band are changed in the second frequency band (eg, high band) according to the change in height (eg, height S_t in FIG. 8B) (region 916).

10A is a perspective view of an antenna module 1000 according to various embodiments of the present invention. 10B is a cross-sectional view illustrating a stacked structure of the antenna module 1000 of FIG. 10A according to various embodiments of the present invention. 10C is a cross-sectional view of the stacked structure of the antenna module 1000 of FIG. 10A viewed from another direction according to various embodiments of the present invention. FIG. 10B is a partially projected cross-sectional view of the main structure of the antenna module 1000 in the direction of line X3-X3' of FIG. 10A. FIG. 10C is a partially projected cross-sectional view of the main structure of the antenna module 1000 in the line X4-X4' direction of FIG. 10A.

In describing the exemplary embodiments of the present invention, the same reference numerals have been given to the same elements as those described above, and detailed descriptions thereof may be omitted.

The antenna module 1000 of FIG. 10A is at least partially similar to the third antenna module 246 of FIG. 2 or may further include other embodiments of the antenna module.

Referring to FIGS. 10A to 10C , the antenna module 1000 may include an antenna structure R3. According to one embodiment, the antenna structure (R3) includes a first conductive layer 520 including a first U-shaped slot 521 and a second conductive layer 530 including a second U-shaped slot 531. can include According to an embodiment, between the first conductive layer 520 and the second conductive layer 530, the first conductive layer 520 is disposed substantially parallel to the first conductive layer 520, and the first conductive layer 520 can be viewed from above. In this case, a third conductive layer 560 disposed to have a smaller area than the first conductive layer 520 may be included. According to one embodiment, in a layer that is not the same as the third conductive layer 560 between the first conductive layer 520 and the second conductive layer 530, the first conductive layer 520 and the second conductive layer 520 are substantially parallel to each other. When the first conductive layer 520 is viewed from above, the fourth conductive layer 570 has an area smaller than that of the first conductive layer 520 and is disposed at a position that does not overlap with the third conductive layer 560. can include According to one embodiment, the third conductive layer 560 and the fourth conductive layer 570 may be disposed side by side without overlapping when viewing the first conductive layer 520 from above. According to one embodiment, at least a portion of the third conductive layer 560 and/or the fourth conductive layer 570 may be formed in the second space 5421 . According to one embodiment, the fourth conductive layer 570 may be formed to have substantially the same size and shape as the third conductive layer 560 . In another embodiment, the third conductive layer 560 and the fourth conductive layer 570 may be arranged to at least partially overlap the first conductive layer 520 when viewed from above. According to one embodiment, the wireless communication circuitry 590 may be configured to transmit and/or receive signals having a frequency ranging from 3 GHz to 100 GHz via the antenna structure R3.

According to various embodiments, the antenna structure R3 may include the first feed line 550 at least partially disposed between the third conductive layer 560 and the second conductive layer 530 . According to one embodiment, one end of the first feed line 550 is electrically connected to the second conductive layer 520 through the first feed part 551 (eg, a conductive via), and the other end is the first feed line It may be electrically connected to the wireless communication circuit 590 through 552. According to one embodiment, the antenna structure R3 may include a second feed line 553 at least partially disposed between the first conductive layer 510 and the fourth conductive layer 570 . According to one embodiment, one end of the second feed line 553 is electrically connected to the first conductive layer 520 through the second feed part 554 (eg, a conductive via), and the other end is the second feed line It may be electrically connected to the wireless communication circuit 590 through 555.

According to various embodiments, the third conductive layer 560 may be disposed between the second area A2 of the first conductive layer 520 and the first feed line 550 . According to one embodiment, the third conductive layer 560 may be disposed at a position capable of being coupled with the first feed line 560 (capacitively coupled). According to one embodiment, the third conductive layer 560 may be substantially disposed within the second dielectric 542 . In another embodiment, at least a portion of the third conductive layer 560 may extend into the first dielectric 541 .

According to various embodiments, the fourth conductive layer 570 may be disposed between the fourth area A4 of the second conductive layer 530 and the second feed line 553 . According to one embodiment, the fourth conductive layer 570 may be disposed at a position capable of being coupled with the second feed line 553 (capacitively coupled). According to one embodiment, the fourth conductive layer 570 may be substantially disposed within the second dielectric 542 . In another embodiment, at least a portion of the fourth conductive layer 570 may extend into the first dielectric 541 .

According to various embodiments, the antenna structure R3 is symmetrical with the third conductive layer 560 disposed between the first conductive layer 520 and the first feed line 550 and the third conductive layer 560. and to the fourth conductive layer 570 disposed between the second conductive layer 530 and the second feed line 553 and to the first feed line 550 and the second feed line 553 fed symmetrically to each other. The radiation output of the antenna module corresponding to the frequency input by may be increased.

10D is a plan view illustrating a partially projected state of the antenna module 1000 of FIG. 10A according to various embodiments of the present invention.

Referring to FIG. 10D , when viewing the first conductive layer 520 from above, the third conductive layer 560 and the fourth conductive layer 570 may be disposed side by side without overlapping each other. According to one embodiment, when viewing the first conductive layer 520 from above, the first feed line 550 crosses the substantially center of the third conductive layer 560 in the first direction (① direction). It can be arranged so as to be worn. According to one embodiment, when viewing the first conductive layer 520 from above, the second feed line 553 crosses the substantially center of the fourth conductive layer 570 in the first direction (direction ①). It can be arranged so as to be worn.

According to various embodiments, the antenna structure (R3) is a feeding structure (differential feed structure) arranged symmetrically with each other, and since it is dual-fed through two feed lines (550, 553), the input port is doubled and the antenna structure The input power applied to R3 is increased, and thus the output power of the antenna module 1000 can be increased.

11A is a graph showing reflection coefficients of the antenna module 1000 of FIG. 10A according to various embodiments of the present invention. FIG. 11B is a diagram illustrating a radiation pattern for each frequency of the antenna module 1000 of FIG. 10A according to various embodiments of the present invention.

Referring to FIGS. 11A and 11B, the antenna structure (eg, the antenna structure R3 of FIG. 10A) includes a first U-shaped slot (eg, the first U-shaped slot 521 of FIG. 10A), and a second U-shaped slot. (Example: the 2U-shaped slot 531 in FIG. 10A), the third conductive layer (eg the third conductive layer 560 in FIG. 10A) and the fourth conductive layer (eg the 4th conductive layer in FIG. 10A ( 570)), even though they are dual-fed with a differential structure, the first frequency band (eg, approximately 28 GHz frequency band) (eg, 1101 area) and the second frequency band (eg, approximately 39 GHz frequency band) (eg, 1102 area), it can be seen that it operates smoothly.

FIG. 11C is a graph showing the reflection coefficient of the antenna module 1000 according to the arrangement relationship of the third conductive layer 560 and the fourth conductive layer 570 according to various embodiments of the present invention.

10D and 11C , when the first conductive layer 520 is viewed from above, the distance F_x between the first feed line 550 and the fourth conductive layer 570 and/or the second feed line 553 ) and the third conductive layer 560, a change in performance of the antenna module 1000 may occur. For example, as the distance F_x between the first feed line 550 and the fourth conductive layer 570 and/or the distance F_x between the second feed line 553 and the third conductive layer 560 decreases, the antenna It can be seen that the performance of the module is deteriorated in the first frequency band (eg, low band) and the second frequency band (eg, high band) (regions 1103 and 1104). Therefore, it may be advantageous in terms of performance of the antenna module to space the third conductive layer 560 and the fourth conductive layer 570 apart as much as possible.

12A is a perspective view of an antenna module 1200 according to various embodiments of the present invention. 12B is a cross-sectional view illustrating a stacked structure of the antenna module 1200 of FIG. 12A according to various embodiments of the present invention. FIG. 12B is a cross-sectional view of a partially projected main structure of the antenna module 1200 in the direction of line X5-X5' of FIG. 12A.

In describing the exemplary embodiments of the present invention, the same reference numerals have been given to the same elements as those described above, and detailed descriptions thereof may be omitted.

The antenna module 1200 of FIG. 12A is at least partially similar to the third antenna modules 246 of FIG. 2 or may further include other embodiments of the antenna module.

Referring to FIG. 12A , the antenna module 1200 may include a first antenna structure R4 and a second antenna structure R5 disposed within the first antenna structure R4. According to an embodiment, the first antenna structure R4 may form vertical polarization by the first conductive layer 520 and the second conductive layer 530 spaced apart from the first conductive layer 520 . According to one embodiment, the second antenna structure R5 may include a dipole antenna disposed between the first conductive layer 520 and the second conductive layer 530 and forming horizontally polarized waves. According to one embodiment, the wireless communication circuitry 590 may be configured to transmit and/or receive signals having a frequency in the range of 3 GHz to 100 GHz via the first antenna structure R4 and the second antenna structure R5. can

According to various embodiments, the first antenna structure R4 includes a first conductive layer 520 including a first U-shaped slot 521 and a second conductive layer 530 including a second U-shaped slot 531 . ) may be included. According to an embodiment, between the first conductive layer 520 and the second conductive layer 530, the first conductive layer 520 is disposed substantially parallel to the first conductive layer 520, and the first conductive layer 520 can be viewed from above. In this case, a third conductive layer 560 disposed to have a smaller area than the first conductive layer 520 may be included. According to an embodiment, the third conductive layer 560 may be disposed between the second area A2 of the first conductive layer 520 and the first feed line 550 . According to one embodiment, the third conductive layer 560 may be disposed at a position capable of being coupled with the first feed line 560 (capacitively coupled).

According to various embodiments, the second antenna structure R5 includes a pair of conductive patterns 581 and 582 disposed on different layers closer to the second conductive layer 530 than the first feed line 550. can do. According to one embodiment, the pair of conductive patterns 581 and 582 may be disposed substantially parallel to the first conductive layer 520 . According to one embodiment, the second antenna structure R5 includes a first conductive pattern (formed at an end of a first conductive line 5811 extending from the second space 5421 to at least a part of the first space 5411). 581) may be included. According to an embodiment, the second antenna structure R5 includes a second conductive line 5821 disposed to overlap the first conductive line 5811 when viewing the first conductive layer 520 from the top. The second conductive pattern 582 may be disposed at an end of the second conductive line 5821 so as to overlap at least a portion of the first conductive pattern 581 . According to one embodiment, the first conductive line 5811 may be electrically connected to the wireless communication circuit 590 through the third power supply line 5812 in the second space 5421 . According to an embodiment, the first conductive pattern 581 and the second conductive pattern 582 are formed in the second area (when viewing the first conductive layer 520 from above) within the first space 5411. It may be disposed at a position extending from A2) toward the first area A1 to pass through the first U-shaped slit 521 of the first conductive layer 520 .

According to various embodiments, the first antenna structure R4 includes a first conductive layer 520 and a second conductive layer 530 spaced apart from each other with the first feed line 550 and the third conductive layer 560 interposed therebetween. ), it can operate in the first frequency band and the second frequency band. According to one embodiment, the second antenna structure R5 is disposed at each end of a pair of conductive lines 5811 and 5821 disposed between the first feed line 550 and the second conductive layer 530. It can operate in the first frequency band and the second frequency band through the conductive patterns 581 and 582 .

According to various embodiments, the first conductive pattern 581 and the second conductive pattern 582 of the second antenna structure R5 are, when the first conductive layer 520 is viewed from above, the first antenna structure R4 ) may be disposed so as not to overlap with the first conductive layer 520 and the second conductive layer 530.

FIG. 12C is a plan view illustrating a partially projected state of the antenna module 1200 of FIG. 12A according to various embodiments of the present invention.

Referring to FIG. 12C , the third conductive layer 560 may be substantially disposed at the center of the second space 5421 when viewing the first conductive layer 520 from above. According to one embodiment, the first feed line 550 crosses substantially the center of the third conductive layer 560 in the first direction (direction ①) when the first conductive layer 520 is viewed from above. can be placed in a row. According to one embodiment, the pair of conductive lines 5811 and 5821 of the second antenna structure R5 are connected to the first feed line 550 when the first conductive layer 520 is viewed from the top. It may be arranged to bypass the first feed line 550 in order to avoid interference. For example, the pair of conductive lines 5811 and 5821 may be formed to be longer than the first feed line 550, and the first feed line 550 passes again at a point past the first feed line 550. You can detour to line L1. Accordingly, the first conductive pattern 581 and the second conductive pattern 582 may be disposed at symmetric positions with respect to the imaginary line L1 through which the first feed line 550 passes. In another embodiment, the second antenna structure R5 includes only the first U-shaped slot 521 and the second U-shaped slot 531 without the third conductive layer 560 (eg, FIG. It may be included in the antenna structure R1 of 5a in the same way.

13A is a graph showing reflection coefficients of the antenna module 1200 of FIG. 12A according to various embodiments of the present invention. FIG. 13B is a diagram illustrating a radiation pattern for each frequency of the antenna module 1200 of FIG. 12A according to various embodiments of the present invention.

Referring to FIGS. 13A and 13B , the antenna module including the first antenna structure R4 and the second antenna structure R5 can be smoothly operated in a first frequency band having a bandwidth ranging from about 27.5 GHz to 28.5 GHz. (eg, area 1301 of FIG. 13A), and can be smoothly operated in a second frequency band having a bandwidth ranging from about 37 GHz to 39.9 GHz (eg, area 1302 of FIG. 13A).

14 is a perspective view of an antenna module 1400 according to various embodiments of the present invention.

The antenna module 1400 of FIG. 14 is at least partially similar to the third antenna module 246 of FIG. 2 or may further include other embodiments of the antenna module.

Referring to FIG. 14 , the antenna module 1400 includes a first antenna array including a printed circuit board 1410 and a plurality of antenna structures 1421 , 1422 , 1423 , and 1424 disposed on the printed circuit board 1410 . (1420). According to one embodiment, the first antenna array 1420 of the antenna module 1400 may include antenna structures 1421, 1422, 1423, and 1424 having a 1×4 array structure, but is not limited thereto. For example, the antenna module 1400 may include an antenna array having various numbers of antenna structures and arrangements.

According to various embodiments, the printed circuit board 1410 may include a first surface 1411 and a second surface 1412 facing in a direction opposite to the first surface 1411 . According to one embodiment, the antenna array 1420 may be sequentially disposed side by side on the printed circuit board 1410, and the first antenna structure (including the first conductive layer 1421a and the second conductive layer 1421b) 1421), a second antenna structure 1422 including the third conductive layer 1422a and the fourth conductive layer 1422b, and a third antenna including the fifth conductive layer 1423a and the sixth conductive layer 1423b. The fourth antenna structure 1424 including the structure 1423 and/or the seventh conductive layer 1424a and the eighth conductive layer 1424b may be included. According to one embodiment, the first antenna structure 1421, the second antenna structure 1422, the third antenna structure 1423, and the fourth antenna structure 1424 are the antenna structure R1 of FIG. 5A, FIG. It may have substantially the same configuration as at least one of the antenna structure R2 of FIG. 8a, the antenna structure R3 of FIG. 10a, or the antenna structures R4 and R5 of FIG. 12a. According to one embodiment, the antenna module 1400 may include a wireless communication circuit 1430 disposed on the second surface 1412 of the printed circuit board 1410 and electrically connected to the antenna array 1420. . In another embodiment, the wireless communication circuit 1430 may be disposed at a position spaced apart from the printed circuit board 1410 through a conductive cable (eg, a flexible printed circuit board (FPCB)). According to one embodiment, the wireless communication circuitry 1430 may be configured to transmit and/or receive signals having a frequency ranging from 3 GHz to 100 GHz through the first antenna array 1420 .

According to various embodiments, the antenna module 1400 is an antenna array 1420 through a phase shifter disposed in an RF chain in which each antenna structure and a wireless communication circuit are electrically connected to have a specific phase. The direction of the beam pattern of can be adjusted or beam coverage with a specific scanning range can be secured.

15 is a diagram illustrating a radiation pattern of the antenna module 1400 of FIG. 14 according to various embodiments of the present invention. 16A to 16D are diagrams illustrating beam scanning performance according to a phase difference of the antenna module 1400 of FIG. 14 according to various embodiments of the present invention.

Referring to FIGS. 15 and 16a to 16d, when phases are sequentially input in increments of 45° using a phase shifter (eg, a 3-bit phase shifter) in a 28GHz frequency band, the direction of the beam pattern gradually changes. It can be seen that, based on this, beam scanning of ±30° (total coverage of 60°) is possible.

17 is a perspective view of an antenna module 1700 according to various embodiments of the present invention.

The antenna module 1700 of FIG. 17 is at least partially similar to the third antenna module 246 of FIG. 2 or may further include other embodiments of the antenna module.

Referring to FIG. 17 , an antenna module 1700 may include a printed circuit board 1710 and a plurality of antenna arrays 1720 , 1730 , and 1740 disposed on the printed circuit board 1710 . According to one embodiment, the printed circuit board 1710 may include a first surface 1711 and a second surface 1712 facing in a direction opposite to the first surface 1711 . According to one embodiment, the antenna module 1700 includes a plurality of antennas 1721, 1722, 1723, and 1724 sequentially disposed on the first surface 1711 of the printed circuit board 1710 at regular intervals. A first antenna array 1720, a second antenna array 1730 including a plurality of first antenna structures 1731, 1732, 1733, and 1734 disposed on an edge area of the printed circuit board 1710, and/or a plurality of A third antenna array 1740 including a plurality of second antenna structures 1741, 1742, 1743, and 1744 disposed at positions corresponding to the first antenna structures 1731, 1732, 1733, and 1734. can According to one embodiment, the antenna module 1700 includes a plurality of antennas 1721, 1722, 1723, and 1724 of a first antenna array 1720 and a second antenna array 1730 on a printed circuit board 1710. The plurality of first antenna structures 1731, 1732, 1733, and 1734 of and the second antenna structures 1741, 1742, 1743, and 1744 of the third antenna array 1740 are arranged to have a 1×4 array structure. Not limited to this. For example, the antenna module 1700 may include various numbers of antennas, antenna structures, and antenna arrays having various arrangements.

According to various embodiments, the first antenna array 1720 includes, on the first surface 1711 of the printed circuit board 1710, the first antenna 1720 including the first conductive patch 1721a and the second conductive patch 1721a. A second antenna 1722 including a patch 1722a, a third antenna 1723 including a third conductive patch 1723a, and/or a fourth antenna 1724 including a fourth conductive patch 1724a can be placed. According to an embodiment, the first antenna array 1720 may have a beam pattern formed in a third direction toward which the first surface 1711 of the printed circuit board 1710 faces (eg, direction ③ in FIG. 17 ). According to an embodiment, the third direction (eg, the direction ③ of FIG. 17 ) faces the rear plate (eg, the rear plate 311 of FIG. 3B ) of the electronic device (eg, the electronic device 300 of FIG. 2B ). direction may be included.

According to various embodiments, the second antenna array 1730 includes a first antenna structure (including a first conductive layer 1731a and a second conductive layer 1731b disposed on one edge region of the printed circuit board 1710). 1731), a second antenna structure 1732 including the third conductive layer 1732a and the fourth conductive layer 1732b, and a third antenna including the fifth conductive layer 1733a and the sixth conductive layer 1733b. structure 1733 and/or a fourth antenna structure 1734 including a seventh conductive layer 1734a and an eighth conductive layer 1734b. According to one embodiment, the first antenna structure 1731, the second antenna structure 1732, the third antenna structure 1733, and the fourth antenna structure 1734 are the antenna structure R1 of FIG. 5A, FIG. The antenna structure R2 of FIG. 8A, the antenna structure R3 of FIG. 10A, or the first antenna structure R4 of FIG. 12A may be disposed in a structure at least partially similar to at least one antenna structure.

According to various embodiments, the third antenna array 1740 includes a fifth antenna structure 1741 including a first conductive pattern 1741a and a second conductive pattern 1741b disposed between a pair of conductive layers; A sixth antenna structure 1742 including a third conductive pattern 1742a and a fourth conductive pattern 1742b, and a seventh antenna structure 1743 including a fifth conductive pattern 1743a and a sixth conductive pattern 1743b. ) and/or an eighth antenna structure 1744 including the seventh conductive pattern 1744a and the eighth conductive pattern 1744b. According to an embodiment, the fifth antenna structure 1741, the sixth antenna structure 1742, the seventh antenna structure 1743, and/or the eighth antenna structure 1744 may be the second antenna structure (of FIG. 12A) described above. R5) may be arranged in a structure at least partially similar to that of R5).

According to various embodiments, the second antenna array 1730 may operate as a vertically polarized antenna (eg, a patch antenna) in which a beam pattern is formed in a fourth direction (eg, direction ④ of FIG. 17) perpendicular to the third direction. can The third antenna array 1740 may operate as a horizontally polarized antenna (eg, a dipole antenna) in which a beam pattern is formed in a fourth direction (eg, direction ④ in FIG. 17). Accordingly, the second antenna array 1730 and the third antenna array 1740 may operate as dual polarization antennas having beam patterns formed in the same direction. According to an embodiment, the fourth direction (eg, direction ④ of FIG. 17 ) is a direction in which a side surface (eg, side surface 310E of FIG. 3B ) of an electronic device (eg, electronic device 300 of FIG. 3B ) faces. can include

According to various embodiments, the antenna module 1700 is disposed on the second surface 1712 of the printed circuit board 1710, and includes a first antenna array 1720, a second antenna array 1730, and a third antenna array ( 1440) and a wireless communication circuit 1750 electrically connected. In another embodiment, the wireless communication circuit 1750 may be disposed at a position spaced apart from the printed circuit board 1710 through a conductive cable (eg, a flexible printed circuit board (FPCB)). According to one embodiment, the wireless communication circuit 1750 transmits a signal having a frequency in the range of 3 GHz to 100 GHz through the first antenna array 1720, the second antenna array 1730, and the third antenna array 1740. It can be configured to transmit and/or receive.

According to various embodiments, the antenna module 1700 is a phase shifter disposed in an RF chain in which the antenna arrays 1720, 1730, and 1740 and the wireless communication circuit 1750 are electrically connected to have a specific phase ( A direction of a beam pattern of the antenna arrays 1720, 1730, and 1740 may be adjusted through a phase shifter, or beam coverage having a specific scanning range may be secured.

An antenna module (eg, the antenna module 800 of FIG. 8A) according to various embodiments of the present invention includes a pair of spaced apart conductive layers (eg, the first conductive layer 520 and the second conductive layer of FIG. 8A). (530)) by including U-shaped slots (eg, the first U-shaped slot 521 and the second U-shaped slot 531 of FIG. 8A) disposed facing each other in the second frequency band (eg, high band) ), the first frequency band (eg, low band) may be shifted while maintaining a small change width, and a pair of conductive layers (eg, the first conductive layer 520 and the second conductive layer 530 of FIG. 8A) ) (eg, the third conductive layer 560 of FIG. 8A) (eg, a conductive stub) disposed between the first frequency band (eg, low band) while maintaining a small variation range, A bandwidth of two frequency bands (eg, high band) may be extended.

18A and 18B are perspective and cross-sectional views of an antenna module 1800 having a double substrate stack structure according to various embodiments of the present invention.

Referring to FIGS. 18A and 18B , an antenna module 1800 using a conductive patch according to an exemplary embodiment of the present invention may be formed by stacking two printed circuit boards.

The antenna module 1800 of FIG. 18A is at least partially similar to the third antenna module 246 of FIG. 2 or may further include another embodiment of the antenna module.

According to various embodiments, the antenna module 1800 may include a first printed circuit board 1810 and a second printed circuit board 1820 disposed to be at least partially stacked with the first printed circuit board 1810. there is. According to one embodiment, the first printed circuit board 1810 may include a first surface 1801 and a second surface 1802 facing in a direction opposite to the first surface 1801 . According to one embodiment, the second printed circuit board 1820 includes a third side 1803 facing the second side 1802 and a fourth side 1804 facing the opposite direction of the third side 1803. can do. According to one embodiment, the first printed circuit board 1810 is exposed on the first surface 1801 or is located on the first surface 1801 rather than the second surface 1802 inside the first printed circuit board 1810. A first conductive layer 1811 disposed at a close position may be included. According to one embodiment, when the first surface 1801 is viewed from above, the second printed circuit board 1820 is arranged to correspond to the first conductive layer 1811 and is exposed on the fourth surface 1804, or A second conductive layer 1821 disposed in a position closer to the fourth surface 1804 than the third surface 1803 inside the second printed circuit board 1820 may be included.

According to various embodiments, the first printed circuit board 1810 is disposed between the first conductive layer 1811 and the second surface 1802, and includes a wireless communication circuit (eg, the wireless communication module 192 of FIG. 2 ). It may include a conductive line 1813 having a certain length electrically connected to. According to one embodiment, when viewing the first surface 1801 from above, at least a portion of the conductive line 1813 may be disposed at a position overlapping the first conductive layer 1811 . According to one embodiment, the first printed circuit board 1810 is electrically connected to the conductive line 1813 and the first power supply 1812 extends to the second surface 1802 of the first printed circuit board 1810. ) may be included. According to one embodiment, the first power supply 1812 may include a conductive via vertically penetrating the first printed circuit board 1810 . According to one embodiment, the second printed circuit board 1820 is electrically connected to the second conductive layer 1821 and extends to the third surface 1803 to face the first power supply unit 1812. A power supply unit 1822 may be included. According to one embodiment, the first feeding part 1812 may be disposed to be exposed on the second surface 1802 . According to one embodiment, the second feed unit 1822 may be disposed to be exposed on the third surface 1803. For example, when the first printed circuit board 1810 and the second printed circuit board 1820 overlap each other, the first power supply 1812 and the second power supply 1822 are electrically connected to each other through a soldering or conductive bonding process. can be connected Therefore, the antenna module 1800 is a pair of conductive layers in which the first conductive layer 1811 of the first printed circuit board 1810 and the second conductive layer 1821 of the second printed circuit board 1820 are spaced apart from each other. It can operate as a patch, and the first power supply unit 1812 and the second power supply unit 1822 can operate as one power supply unit. According to one embodiment, the antenna module 1800 is a space 1805 where the second surface 1802 of the first printed circuit board 1810 and the third surface 1803 of the second printed circuit board 1820 face each other. While this vacuum state is maintained, they may be attached to each other through a conductive bonding process. According to one embodiment, the first printed circuit board 1810 and the second printed circuit board 1820 may be bonded to each other through an anisotropic conductive film (ACF).

FIG. 19 is a graph showing the gain and reflection coefficient of the antenna module 1800 of FIG. 18A according to various embodiments of the present invention, and radiation performance is compared with that of an antenna module constructed on a single substrate (eg, a single printed circuit board). are doing

As shown in FIG. 19, in the case of an antenna module having a double-substrate structure of FIG. 18A (eg, the antenna module 1800 of FIG. 18A), it exhibits a higher gain than an antenna module implemented on a single substrate and has a relatively wide bandwidth. It can be seen that this is secured. For example, based on -10 dB, in the case of an antenna module implemented on a single board, a bandwidth of about 1 GHz of 27.5 GHz to 28.5 GHz is secured (section 1901), but in the case of an antenna module having a double board structure, a bandwidth of 26 GHz to 28.5 GHz is secured. It can be seen that a relatively wider bandwidth of about 3.5 GHz of 29.5 GHz is secured (section 1902).

According to various embodiments, an electronic device (eg, the electronic device 300 of FIG. 3A ) includes a first plate (eg, the front plate 302 of FIG. 3A ) and a second plate facing in a direction opposite to the first plate. (Example: the back plate 311 of FIG. 3B), and a side member surrounding the space between the first plate and the second plate, coupled to the second plate, or integrally formed with the second plate (eg: A housing including the side bezel structure 318 of FIG. 3A), a display (eg, the display 301 of FIG. 3A) visible through at least a portion of the first plate, and an antenna structure disposed inside the housing (eg, the display 301 of FIG. 3A). : As the antenna structure R1 of FIG. 5B), a first region (eg, the first area including the first U-shaped slot 521 of FIG. 5B) (eg, the first U-shaped slot 521 of FIG. 5B) A first conductive layer (eg, the first conductive layer 520 of FIG. 5B) including a first area A1) and a second area (eg, second area A2 of FIG. 5B) in contact with the first area. and a second conductive layer (for example, the second conductive layer 530 of FIG. 5B) facing the first conductive layer while being spaced apart from the second U-shaped slot (for example, FIG. 5B) facing the first U-shaped slot. A third region (eg, the third region A3 of FIG. 5B) including the second U-shaped slot 531 of the , and a fourth region (eg, the third region A3) that is in contact with the third region and faces the second region. An antenna structure including a second conductive layer including a fourth area A4 in FIG. 5B and electrically connected to the first conductive layer or the second conductive layer, and transmitting a signal having a frequency between 3 GHz and 100 GHz and/or at least one wireless communication circuit configured to receive (eg, wireless communication circuit 590 in FIG. 5B).

According to various embodiments, the antenna structure has a first frequency band (eg, low band) according to the size of the first U-shaped slot of the first conductive layer and the second U-shaped slot of the second conductive layer. this can be determined.

According to various embodiments, the antenna structure fills a first space (eg, the first space 5411 of FIG. 5B) between the first area of the first conductive layer and the third area of the second conductive layer. A first dielectric (eg, the first dielectric 541 of FIG. 5B) and a second space between the second region of the first conductive layer and the fourth region of the second conductive layer (eg, the second space of FIG. 5B) 5421) may include a second dielectric (eg, the second dielectric 542 of FIG. 5B).

According to various embodiments, the antenna structure is disposed substantially parallel to the first conductive layer, at least within the second dielectric, and has an area smaller than that of the first conductive layer when viewed from above the first conductive layer. A third conductive layer (eg, the third conductive layer 560 of FIG. 8A) may be further included.

According to various embodiments, the third conductive layer, when viewing the first conductive layer from above, in a first direction from the first space toward the second space (eg, the first direction (① direction of FIG. 8A) )) and a first edge (eg, the first edge 561 of FIG. 8A) extending along a second direction (eg, the second direction (direction ②) of FIG. 8A), wherein the first edge may include a recess (eg, the recess 562 of FIG. 8A) formed in the first direction.

According to various embodiments, the antenna structure may include a second frequency band (eg, high band) may be determined.

According to various embodiments, the antenna structure (eg, the antenna structure R2 of FIG. 8A) extends between the second conductive layer and the third conductive layer, and when viewing the first conductive layer from above, It may include an electrical path (eg, the first power supply line 550 of FIG. 8B ) overlapping at least partially with the third conductive layer and electrically connecting the second conductive layer and the wireless communication circuit.

According to various embodiments, the third conductive layer may be disposed at a position where coupling with the electrical path is possible.

According to various embodiments, the electrical path may include a first power supply extending between the second conductive layer and the third conductive layer, within the second space, or extending from the second space to at least a part of the third space. A line (eg, the first feed line 550 of FIG. 8B) and a first feed part disposed at one end of the first feed line and electrically connected to the second conductive layer (eg, the first feed line 550 of FIG. 8B). A power supply unit 551) and a first power supply line electrically connected to the wireless communication circuit from the other end of the first power supply line (eg, the first power supply line 552 of FIG. 8B).

According to various embodiments, the first feed line may be disposed to cross the center of the third conductive layer when viewing the first conductive layer from above.

According to various embodiments, the antenna structure is disposed substantially parallel to the first conductive layer, at least within the second dielectric, and when the first conductive layer is viewed from above, an area smaller than that of the first conductive layer. and may further include a fourth conductive layer (eg, the fourth conductive layer 570 of FIG. 10B) disposed in parallel with the third conductive layer and having the same shape as the third conductive layer.

According to various embodiments, the antenna structure may include a plurality of insulating layers, and the third conductive layer and the fourth conductive layer may be disposed on different insulating layers.

According to various embodiments, the antenna structure (eg, the antenna structure R3 of FIG. 10B) extends between the second conductive layer and the third conductive layer, and when viewing the first conductive layer from above, A first electrical path (eg, the first power supply line 550 of FIG. 10B) overlapping the third conductive layer and electrically connecting the second conductive layer and the wireless communication circuit, and the first electrical path and a second conductive layer extending between the first conductive layer and at least partially overlapping the fourth conductive layer when the first conductive layer is viewed from above, electrically connecting the first conductive layer and the wireless communication circuit. An electrical path (eg, the second feed line 553 of FIG. 10B) may be included.

According to various embodiments, a printed circuit board (eg, the printed circuit board 510 of FIG. 5B) including a plurality of insulating layers is further included, and the first conductive layer is disposed on a first layer of the insulating layers. And, the second conductive layer may be disposed on a second layer spaced apart from the first layer among the insulating layers.

According to various embodiments, the second space may include a plurality of conductive vias electrically connected from the first conductive layer to the second conductive layer through the plurality of insulating layers and arranged at regular intervals (eg, FIG. 5B ). of the conductive connection member 543).

According to various embodiments, the wireless communication circuit may be disposed on the printed circuit board or may be spaced apart from the printed circuit board through a conductive cable.

According to various embodiments, the beam extends from the first space between the first area and the third area to at least a part of the second space between the second area and the fourth area, and in the same direction as the antenna structure. An additional antenna structure on which a pattern is formed (eg, the second antenna structure R5 of FIG. 12A) may be further included.

According to various embodiments, the additional antenna structure (eg, the second antenna structure R5 of FIG. 12B) is formed in the second space by a first conductive line (eg, the first conductive line 5811 of FIG. 12B). to at least a partial area of the first space and electrically connected to the wireless communication circuit (eg, the first conductive pattern 581 of FIG. 12B) and a first conductive pattern that is not identical to the first conductive pattern. In a layer, a second conductive line disposed from the second space to at least a part of the first space by a second conductive line (eg, the second conductive line 5821 of FIG. 12B) spaced apart from the first conductive line. A conductive pattern (eg, the second conductive pattern 582 of FIG. 12B) may be included.

According to various embodiments, the antenna structure extends between the second conductive layer and the third conductive layer, and at least partially overlaps the third conductive layer when viewing the first conductive layer from above, wherein the and an electrical path electrically connecting the second conductive layer and the wireless communication circuit, wherein the electrical path comprises the first conductive line and/or the second conductive line when viewing the first conductive layer from above. It can be placed in a non-overlapping position.

According to various embodiments, the wireless communication circuit may be configured to transmit and/or receive a signal having a frequency between 3 GHz and 100 GHz through the additional antenna structure.

In addition, the embodiments of the present invention disclosed in the present specification and drawings are only presented as specific examples to easily explain the technical content according to the embodiments of the present invention and help understanding of the embodiments of the present invention, and do not cover the scope of the embodiments of the present invention. It is not meant to be limiting. Therefore, the scope of various embodiments of the present invention should be construed as including all changes or modified forms derived based on the technical spirit of various embodiments of the present invention in addition to the embodiments disclosed herein are included in the scope of various embodiments of the present invention. .

500: antenna module 510: printed circuit board
520: first conductive layer 521: first U-shaped slot
530: second conductive layer 531: second U-shaped slot
541 first dielectric 542 second dielectric
550: first feed line 560: third conductive layer
R1, R2, R3, R4, R5: antenna structure

Claims (22)

In electronic devices,
A first plate, a second plate facing in the opposite direction to the first plate, and a side surface that surrounds a space between the first plate and the second plate and is coupled to the second plate or integrally formed with the second plate. a housing including a member;
a display visible through at least a portion of the first plate;
An antenna structure disposed inside the housing,
a first conductive layer including a first area including a first U-shaped slot and a second area in contact with the first area; and
A second conductive layer facing and spaced apart from the first conductive layer, a third area including a second U-shaped slot facing the first U-shaped slot, and a third area contacting the third area and facing the second area An antenna structure including a second conductive layer including a fourth region to; and
An electronic device comprising at least one wireless communication circuit electrically connected to the first conductive layer or the second conductive layer and configured to transmit or receive a signal having a frequency between 3 GHz and 100 GHz.
According to claim 1,
The antenna structure,
An electronic device in which a first frequency band is determined according to sizes of the first U-shaped slot of the first conductive layer and the second U-shaped slot of the second conductive layer.
According to claim 2,
The first frequency band includes a frequency band in the range of 24 GHz to 34 GHz.
According to claim 1,
The antenna structure,
a first dielectric filling a first space between the first region of the first conductive layer and the third region of the second conductive layer; and
and a second dielectric filling a second space between a second region of the first conductive layer and a fourth region of the second conductive layer.
According to claim 4,
The antenna structure,
and a third conductive layer disposed in at least the second dielectric substantially parallel to the first conductive layer and having an area smaller than that of the first conductive layer when viewed from above the first conductive layer.
According to claim 5,
The third conductive layer includes a first edge extending along a second direction perpendicular to a first direction from the first space toward the second space when the first conductive layer is viewed from above, The electronic device of claim 1 , wherein the first edge includes a recess formed in the first direction.
According to claim 6,
The antenna structure,
The electronic device of claim 1 , wherein a bandwidth of the second frequency band is determined according to a width of the recess formed along the first direction or a depth of the recess formed along the second direction.
According to claim 7,
The second frequency band includes a frequency band in the range of 37 GHz to 44 GHz.
According to claim 5,
The antenna structure,
It extends between the second conductive layer and the third conductive layer, and when the first conductive layer is viewed from above, at least partially overlaps the third conductive layer, and electrically connects the second conductive layer and the wireless communication circuit. An electronic device that includes an electrical path leading to
According to claim 9,
The third conductive layer is disposed at a position capable of being coupled to the electrical path.
According to claim 9,
The electrical path is
a first feed line disposed in the second space between the second conductive layer and the third conductive layer;
a first feeding unit disposed at one end of the first feeding line and electrically connected to the second conductive layer; and
An electronic device comprising a first feed line electrically connected to the wireless communication circuit from the other end of the first feed line.
According to claim 11,
The electronic device of claim 1 , wherein the first feed line is disposed to cross a center of the third conductive layer when viewing the first conductive layer from above.
According to claim 5,
The antenna structure,
At least within the second dielectric, it is disposed substantially in parallel with the first conductive layer, and when the first conductive layer is viewed from above, it has an area smaller than that of the first conductive layer and is disposed parallel to the third conductive layer. and a fourth conductive layer having the same shape as the third conductive layer.
According to claim 13,
The antenna structure includes a plurality of insulating layers,
The third conductive layer and the fourth conductive layer are disposed on different insulating layers.
According to claim 13,
The antenna structure,
It extends between the second conductive layer and the third conductive layer, and when the first conductive layer is viewed from above, at least partially overlaps the third conductive layer, and electrically connects the second conductive layer and the wireless communication circuit. A first electrical path connecting to; and
It extends between the first electrical path and the fourth conductive layer, at least partially overlaps the fourth conductive layer when the first conductive layer is viewed from above, and electrically connects the first conductive layer and the wireless communication circuit. An electronic device including a second electrical path connecting to
According to claim 4,
Further comprising a printed circuit board comprising a plurality of insulating layers;
The first conductive layer is disposed on a first layer of the insulating layers,
The second conductive layer is disposed in a second layer spaced apart from the first layer among the insulating layers.
According to claim 16,
The second space is formed through a plurality of conductive vias electrically connected from the first conductive layer to the second conductive layer through the plurality of insulating layers and arranged at regular intervals.
According to claim 16,
The wireless communication circuit is disposed on the printed circuit board or disposed spaced apart from the printed circuit board through a conductive cable.
According to claim 1,
An additional antenna extending from a first space between the first area and the third area to at least a part of a second space between the second area and the fourth area, and having a beam pattern formed in the same direction as the antenna structure. An electronic device further comprising a structure.
According to claim 19,
The additional antenna structure,
a first conductive pattern disposed from the second space to at least a part of the first space by a first conductive line and electrically connected to the wireless communication circuit; and
In an insulating layer that is not the same as the first conductive pattern, a second conductive pattern is disposed from the second space to at least a part of the first space by a second conductive line spaced apart from the first conductive line. electronic devices that do.
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