KR102571868B1 - A light module and an apparatus for detecting wafer edge - Google Patents

Abstract

A wafer edge inspection apparatus according to an embodiment of the present invention includes a first light source for generating and emitting light to the outside, disposed on a front surface of the first light source, and transmitting light emitted from the first light source to an edge surface of a wafer. A filter for condensing light, a second light source for generating and emitting light to the outside, and a first light path changer for changing the path of light incident from the second light source and making it incident to the first reflector and the second reflector, respectively; , a first reflector for incident light from the first light path changer to the upper bevel of the wafer edge, and a second reflector for incident light from the first light path changer to the lower bevel of the wafer edge and a detection unit for detecting reflected light incident from the first light path changing unit.

Description

Light source module and wafer edge inspection device for wafer edge inspection {A LIGHT MODULE AND AN APPARATUS FOR DETECTING WAFER EDGE}

The present invention relates to a lighting module for inspection for accurately inspecting the edge of a wafer, and a wafer edge inspection apparatus using the lighting module for inspection.

In order to manufacture semiconductors, many companies have process equipment for manufacturing semiconductors and inspection and measurement equipment for inspecting semiconductor production. In the past, in order to increase production in the same area, the area ratio occupied by inspection and measurement equipment for production inspection has been reduced, and the area ratio occupied by process equipment that directly affects manufacturing has been increased.

However, with the development of technology, the difficulty of semiconductor microprocessing has increased, and as a result, the importance of inspection and measurement for production inspection has also increased. In the past, only a part of the semiconductor produced was inspected and measured to solve this problem, but inspection of some semiconductors makes it difficult to represent the quality of the entire product. In order to solve this problem, it is necessary to inspect or measure the entire production of semiconductors, but it is difficult to increase the proportion of space occupied by inspection and measurement equipment due to the problem of production volume. These problems cause a decrease in semiconductor production yield.

On the other hand, there are more and more “Fab-less” companies that design and outsource production without having a separate semiconductor production plant. As a result, the production capacity of “foundary” companies that only produce has become important, and interest in reducing costs and increasing production yield has greatly increased. Due to the nature of manufacturing, which requires efficient use of space to produce many products at the same time, we want to increase the number of process equipment. . As a result, the foundry company falls into a dilemma of having to increase process equipment to increase production, but also increase inspection and measurement equipment to inspect the increased production.

Among wafer inspections, there is a process of inspecting chipping or cracks on the edge portion. The edge part consists of a top bevel, an apex, and a bottom bevel, and in the past, three optical systems are used to inspect these edge parts, or optical systems that follow the surface are used to measure. . However, this conventional method requires a lot of space, has a problem in that it is difficult to maintain the quality according to the state of each module, and has a problem that the wafer and the inspection module collide and apply a secondary impact.

An object of the present invention is to provide a light source module for edge inspection and an inspection device capable of uniformly radiating light to each surface of a wafer edge portion and eliminating the possibility of contact with a wafer.

A wafer edge inspection apparatus according to an embodiment of the present invention includes a first light source for generating and emitting light to the outside, disposed on a front surface of the first light source, and transmitting light emitted from the first light source to an edge surface of a wafer. A filter for condensing light, a second light source for generating and emitting light to the outside, and a first light path changer for changing the path of light incident from the second light source and making it incident to the first reflector and the second reflector, respectively; , a first reflector for incident light from the first light path changer to the upper bevel of the wafer edge, and a second reflector for incident light from the first light path changer to the lower bevel of the wafer edge and a detection unit for detecting reflected light incident from the first light path changing unit.

The first reflector reflects the incident light reflected from the wafer edge to the first light path changer, and the second reflector reflects the incident light reflected from the wafer edge to the first light path changer. 1 the light path changing unit may change the paths of the reflected light incident from the first reflector and the light incident from the second reflector to be incident to the detector.

The wafer edge inspection device further includes a second light path changing unit disposed between the second light source and the first light path changing unit, changing a path of reflected light incident from the first light path changing unit and making it incident to the detection unit. The detection unit may be disposed in a vertical direction of the second light path changing unit.

In the wafer edge inspection apparatus, the first reflector and the second reflector may be disposed to face each other in a direction perpendicular to the first light path changer.

The first light source includes a light source plate having a plurality of line light sources, and the filter is disposed in front of the light source plate and includes a diffusion plate for diffusing light generated by the light source; and a light collecting plate disposed on the front surface of the diffusion plate and condensing the light diffused by the diffusion plate to the edge of the wafer.

The diffusion plate may include a third reflector that is individually disposed on the front surface of each line light source and reflects light incident from the line light source; a fourth reflector that reflects light incident from the third reflector; and a grating in which protruding pillars are repeatedly disposed at regular intervals to diffuse light reflected from the fourth reflector.

The light collecting plate may have a shape in which one convex portion has a semicircular cross section and extends in a transverse direction, and a plurality of convex portions are continuously stacked and arranged in a longitudinal direction.

In the light collecting plate, the lateral direction of the convex portion and the plane of the wafer may be parallel to each other or disposed at an acute angle.

The light source plate and the filter have a first hole through which the light reflected by the first reflector from the first light path changer to the upper bevel of the wafer edge passes, and the light incident from the first light path changer through the second reflector. A second hole through which light reflected from the lower bevel of the wafer edge may be provided.

A light source module for wafer edge inspection according to another embodiment of the present invention includes a first light source for generating and emitting light to the outside, disposed on a front surface of the first light source, and transmitting light emitted from the first light source to the wafer A filter for condensing light to an edge surface of a second light source for generating and emitting light to the outside, and a first light path for changing the path of light incident from the second light source and making it incident to the first reflector and the second reflector, respectively A changer; a first reflector for making light incident from the first light path changer incident on the upper bevel of the wafer edge; and a first reflector for making light incident from the first light path changer incident on the lower bevel of the wafer edge. 2 reflectors; may be included.

The first reflector reflects the incident light reflected from the wafer edge to the first light path changer, and the second reflector reflects the incident light reflected from the wafer edge to the first light path changer. 1 the light path changing unit may change the paths of the reflected light incident from the first reflector and the light incident from the second reflector to be incident to the detector.

The light source module for wafer edge inspection is disposed between the second light source and the first light path changing unit, and changes the path of reflected light incident from the first light path changing unit to enter the second light path changing unit into the detection unit. Wealth may be further included.

The present invention has an effect of uniformly irradiating light to each surface of the edge portion of the wafer by using a light source perpendicular to the wafer and an additional light source capable of irradiating light to the bevel side.

In addition, the present invention can eliminate the possibility of contact with the wafer that may occur because the light source and the detection unit are not disposed on the upper and lower sides of the wafer.

In addition, since the present invention uses only one detection unit, the overall size can be miniaturized.

1 and 2 are diagrams for explaining a light source module for inspecting a wafer edge and an apparatus for inspecting a wafer edge according to an exemplary embodiment.
FIG. 3 is a cross-sectional view of the wafer edge inspection apparatus of FIG. 2 taken along the line A-A', and is a view for explaining a path through which light is incident on a wafer.
FIG. 4 is a cross-sectional view of the wafer edge inspection apparatus of FIG. 2 taken along the line A-A', and is a view for explaining a path through which light is reflected from a wafer.
5, 6, 7 and 8 are diagrams for explaining structures of the first light source 110 and the filter 120 according to an embodiment of the present invention.

Hereinafter, specific contents for carrying out the invention will be described in detail with reference to the accompanying drawings.

1 and 2 are diagrams for explaining a light source module for inspecting a wafer edge and an apparatus for inspecting a wafer edge according to an exemplary embodiment.

Referring to FIGS. 1 and 2 , the wafer edge inspection apparatus may include a filter 120 on one side of a housing 105 and a first light source on a rear surface of the filter 120 .

In addition, one side may include a first hole 160 and a second hole 161 .

The first hole 160 is a hole through which light incident from the first light path changer 140 is reflected by the first reflector 150 to the upper bevel of the wafer edge.

The second hole 161 is a hole through which light incident from the first light path changer 140 is reflected by the second reflector 151 to the lower bevel of the wafer edge.

FIG. 3 is a cross-sectional view of the wafer edge inspection apparatus of FIG. 2 taken along the line A-A', and is a view for explaining a path through which light is incident on a wafer.

Referring to FIG. 3 , the wafer edge inspection apparatus 100 includes a first light source 110, a filter 120, a second light source 130, a first light path changer 140, and a first reflector 150. , a second reflector 151, a second light path changer 170, and a detector 180 may be included.

The light source module for wafer edge inspection includes a first light source 110, a filter 120, a second light source 130, a first light path changer 140, a first reflector 150, and a second reflector 151. ) and a second optical path changing unit 170 . A light source module for wafer edge inspection may refer to a configuration excluding a detection unit and the like.

The first light source 110 may generate light and emit it to the outside. The first light source 110 may be provided on one side of the housing 105 .

The filter 120 may be disposed on the front side (a side from which light is emitted) of the first light source 110 and condense the light emitted from the first light source 110 to the edge surface of the wafer 190 . Looking at the amount of light irradiated to the edge surface of the wafer condensed by the filter 120, the amount of light irradiated to the Apex by the angle of condensed light, etc. It is more than the amount of light irradiated to the top bevel and bottom bevel.

The second light source 130 may generate and emit light to the outside, pass through the second light path changing unit 170 and enter the first light path changing unit 140 . The second light source 130 may be provided inside the housing 105 .

The first light path changer 140 may change the path of the light incident from the second light source 130 and make it incident to the first reflector 150 and the second reflector 151 . For example, the light path changer 140 may be implemented in a prism shape, and may reflect light incident from the second light source 130 to the first reflector 150 and the second reflector 151. there is. In this embodiment, the light path changing unit 140 has been described based on a prism shape as an example, but it is not limited thereto and may be implemented in various ways, such as using two reflectors.

The first reflector 150 may cause light incident from the first light path changer 140 to be incident on the upper bevel of the wafer edge through the first hole 160 . For example, the first reflector 150 may be disposed in an upward direction perpendicular to the first light path changer 140 .

The second reflector 151 may cause light incident from the first light path changer 140 to be incident on the lower bevel of the wafer edge through the second hole 161 . For example, the second reflector 150 may be disposed in a downward direction perpendicular to the first light path changer 140 .

The first hole 160 may pass light incident from the first reflector 150 , and the second hole 161 may pass light incident from the second reflector 151 .

Through the light path as above, the light generated by the first light source 110 and the second light source 130 may be focused on the edge surface of the wafer.

FIG. 4 is a cross-sectional view of the wafer edge inspection apparatus of FIG. 2 taken along the line A-A', and is a view for explaining a path through which light is reflected from a wafer.

Referring to FIG. 4 , the wafer edge inspection apparatus 100 includes a first light source 110, a filter 120, a second light source 130, a first light path changer 140, and a first reflector 150. , a second reflector 151, a second light path changer 170, and a detector 180 may be included.

The first reflector 150 may cause reflected light reflected from the wafer edge surface and incident through the first hole 160 to be incident to the first light path changer 140 .

The second reflector 151 may cause the reflected light reflected from the wafer edge surface to pass through the second hole 161 and enter the first light path changer 140 .

The first light path changer 140 may change the path of light incident from the first reflector 150 and the second reflector 151 and make it incident to the second light path changer 170 .

The second light path changing unit 170 may change the path of light incident from the first optical path changing unit 140 and make it incident to the detection unit 180 .

The detector 180 may detect light incident from the second light path changer 170 . The detector 180 may generate information about the edge surface of the wafer 190 using the detected light.

The detection unit 180 may be disposed above or below the second optical path changing unit 170 perpendicularly.

The determination unit (not shown) may determine whether or not the edge surface is defective by using the information detected by the detection unit 180 . The determination unit (not shown) may be provided inside or outside the wafer edge inspection apparatus 100 .

As described above, the present invention is composed of a first light source 110 that radiates light to the entire wafer edge and a second light source 130 that radiates light only to the upper and lower bevels of the wafer edge, so that the second light source The portion 130 additionally irradiates the light irradiated to the upper and lower bevels, which is insufficient only by the first light source 110, so that light can be uniformly irradiated to each surface of the wafer edge portion. In this way, the quality of an image obtained through the reflected light can be improved by uniformly irradiating the entire edge of the wafer with light.

In addition, the present invention can eliminate the possibility of contact with the wafer that may occur by being provided in the wafer edge inspection apparatus without disposing the first light source portion and the detection unit on the upper and lower sides of the wafer. In other words, since there is no arrangement of structures on the upper and lower sides of the wafer, there is an effect that the wafer is not damaged even if it is unintentionally moved in the vertical direction in the process of moving the wafer to inspect the edge of the wafer.

In addition, since the present invention uses only one detection unit, the overall size can be miniaturized.

5, 6, 7 and 8 are diagrams for explaining structures of the first light source 110 and the filter 120 according to an embodiment of the present invention.

Referring to FIG. 5 , the first light source 110 may include a plurality of line light sources 112 , 113 , 114 , 115 , and 116 .

The filter 120 may be disposed on the front side (a side from which light is emitted) of the first light source 110 and condense the light emitted from the first light source 110 to the edge surface of the wafer 190 .

A first hole 160 and a second hole 161 may be provided on the surface where the first light source 110 and the filter 120 are provided.

Referring to FIG. 6, in a cross section taken along the line B-B 'of FIG. 120 may include a plurality of diffusion plates 620 and light collecting plates 630 .

The light source plate 610 and the filter 120 may have a first hole 160 and a second hole 161 .

A plurality of diffusion plates 621 , 622 , 623 , 624 , 625 , and 626 corresponding to each of the plurality of line light sources 111 , 112 , 113 , 114 , 115 , and 116 may be provided. For example, the first diffusion plate 621 is provided on the front of the first line light source 111, the second diffusion plate 622 is provided on the front of the second line light source 112, and the third A third diffuser plate 623 is provided on the front part of the line light source 113, a fourth diffuser plate 624 is provided on the front part of the fourth line light source 114, and A second diffusion plate 625 may be provided on the front portion, and a sixth diffusion plate 626 may be provided on the front portion of the sixth line light source 116 .

Light generated from the plurality of line light sources 111, 112, 113, 114, 115, and 116 is diffused through a plurality of diffusion plates 621, 622, 623, 624, 625, and 626, and the diffused light is diffused through the light collecting plate 630. ), the light may be concentrated (incident) to the edge surface of the wafer 190 .

Referring to FIG. 7, a diagram for specifically explaining the first light source line 111 and the first diffusion plate 621, the first diffusion plate 621 includes a third reflector 710 and a fourth reflector. 711 and a grating 712 may be included.

Light generated from the first light source line 111 may be reflected by the third reflector 710 . A portion of the reflected light may be incident to the fourth reflector 711 or may be incident to the grating 712 .

For example, the third reflector 710 may be disposed at an acute angle with respect to the optical axis of the light source generated by the first light source line 111 and inclined upward on the optical axis.

The fourth reflector 711 may cause light incident from the third reflector 710 to the grating 712 .

For example, the fourth reflector 711 may be disposed at a predetermined angle with respect to the third reflector 710 . In this embodiment, the fourth reflector 711 is illustrated based on being disposed perpendicularly to the first light source line 111, but the angle at which the fourth reflector 711 is disposed is not limited thereto.

In the grating 712, protruding pillars may be repeatedly arranged at regular intervals. The grating 712 may diffuse light incident from the third reflector 710 and the fourth reflector 711 and make it incident to the light collecting plate 630 .

Referring to FIG. 8 , a perspective view of the light collecting plate 630 is illustrated, and the light collecting plate 630 may include a convex portion. The cross-section of one convex portion is semicircular and extends in a horizontal direction (horizontal direction), and the light collecting plate 630 may have a shape in which a plurality of convex portions are continuously stacked and arranged in a longitudinal direction (vertical direction).

A horizontal direction (horizontal direction) of the convex portion of the light collecting plate 630 and a plane of the wafer may be disposed parallel to each other or at an acute angle.

The described embodiments may be configured by selectively combining all or part of each embodiment so that various modifications can be made.

Also, it should be noted that the examples are for explanation and not limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical spirit of the present invention.

100: wafer edge inspection device
110: first light source
120: filter
130: second light source
140: first optical path changing unit
150: first reflector
151: second reflector
170: second optical path changing unit
180: detection unit

Claims (12)

A first light source including a light source plate equipped with a plurality of line light sources;
a third reflector that is individually disposed on the front surface of each line light source, diffuses the light generated from the first light source, and reflects light incident from the line light source; and reflects light incident from the third reflector A diffusion plate including a fourth reflector and a grating in which protruding pillars are repeatedly arranged at regular intervals to diffuse light reflected from the fourth reflector, and disposed on the front surface of the diffusion plate a key filter comprising a light collecting plate condensing the light diffused by the diffusion plate to the edge of the wafer;
a second light source generating and emitting light to the outside;
a first light path changing unit that changes the path of the incident light from the second light source and makes it incident to the first reflecting unit and the second reflecting unit, respectively;
a first reflector for incident light from the first optical path changer to an upper bevel of a wafer edge;
a second reflector for incident light from the first optical path changer to a lower bevel of the wafer edge; and
and a detection unit configured to detect reflected light incident from the first light path changing unit.
According to claim 1,
The first reflector,
When the light reflected from the wafer edge is incident, it is reflected to the first light path changer;
The second reflector,
When the light reflected from the wafer edge is incident, it is reflected to the first light path changer;
The first light path changing unit,
Wafer edge inspection apparatus for changing the paths of the reflected light incident from the first reflector and the incident light from the second reflector and incident to the detector.
According to claim 1,
A second light path changer disposed between the second light source and the first light path changer, and changing a path of the reflected light incident from the first light path changer to make it incident to the detector;
The detecting unit,
A wafer edge inspection device disposed in a vertical direction of the second light path changing unit.
According to claim 1,
The first reflector and the second reflector are disposed to face each other in a direction perpendicular to the first light path changer.
delete delete According to claim 1,
The light collecting plate,
A wafer edge inspection apparatus characterized in that one cross section is semicircular and includes a convex portion extending in a transverse direction, and a plurality of convex portions are continuously stacked and arranged in a longitudinal direction.
According to claim 7,
The light collecting plate,
Wafer edge inspection apparatus, characterized in that the transverse direction of the convex portion and the plane of the wafer are parallel to each other or disposed at an acute angle.
According to claim 1,
The light source plate and the filter
a first hole through which light incident from the first light path changer by the first reflector is reflected to the upper bevel of the wafer edge; and
The wafer edge inspection apparatus, wherein the second reflector includes a second hole through which light that reflects light incident from the first light path changing unit to a lower bevel of the wafer edge passes.
A first light source including a light source plate equipped with a plurality of line light sources;
a third reflector that is individually disposed on the front surface of each line light source, diffuses the light generated from the first light source, and reflects light incident from the line light source; and reflects light incident from the third reflector A diffusion plate including a fourth reflector and a grating in which protruding pillars are repeatedly arranged at regular intervals to diffuse light reflected from the fourth reflector, and disposed on the front surface of the diffusion plate a key filter comprising a light collecting plate condensing the light diffused by the diffusion plate to the edge of the wafer;
a second light source generating and emitting light to the outside;
a first light path changing unit that changes the path of the incident light from the second light source and makes it incident to the first reflecting unit and the second reflecting unit, respectively;
a first reflector for incident light from the first optical path changer to an upper bevel of a wafer edge; and
A light source module for wafer edge inspection comprising a; second reflector for injecting the light incident from the first light path changer to the lower bevel of the wafer edge;
According to claim 10,
The first reflector,
When the light reflected from the wafer edge is incident, it is reflected to the first light path changer;
The second reflector,
When the light reflected from the wafer edge is incident, it is reflected to the first light path changer;
The first light path changing unit,
A light source module for wafer edge inspection, wherein the path of the reflected light incident from the first reflector and the light incident from the second reflector are changed and incident to the detector.
According to claim 10,
and a second light path changing unit disposed between the second light source and the first light path changing unit, and changing a path of the reflected light incident from the first light path changing unit to enter the detection unit. light source module.

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