KR102556882B1 - By-product Dry Collector for Semiconductor Process Using Ceramic Filter - Google Patents

Abstract

The present invention relates to a dry collection device for semiconductor process by-products using a ceramic filter, and in particular, rapidly evaporates moisture contained in exhaust gas and by-products through irradiation of microwaves on an exhaust line between a process chamber and a trip. A microwave dryer is installed, and the trip installed between the microwave dryer and the vacuum pump is a ceramic filter type trip that passes through the microwave dryer and collects a large amount of dried process by-products through the pores of the ceramic filter. It is characterized in that a control unit for performing the overall control function of the semiconductor process by-product dry collection device is installed outside the microwave dryer and the ceramic filter type trip.
Therefore, during the semiconductor device manufacturing process, the reaction by-products included in the exhaust gas of the process chamber are rapidly dried using a microwave dryer, and then more efficiently and in large quantities through the heat-resistant and chemical-resistant ceramic filter pores in the ceramic filter type trip. As it can be collected, it is possible to safely collect and process a large amount of by-products compared to the internal collection area of the trip, as well as to minimize the downtime of semiconductor manufacturing equipment due to the replacement of the trip that collects process by-products, and to inspect the facility And the cost of replacing the trip can be significantly reduced, the lifespan of vacuum pumps and scrubbers can be significantly extended, and productivity and reliability in semiconductor manufacturing can be further improved.

Description

Semiconductor process by-product dry collection device using ceramic filter {By-product Dry Collector for Semiconductor Process Using Ceramic Filter}

The present invention relates to a dry collection device for semiconductor process by-products using a ceramic filter, and more particularly, in a semiconductor device manufacturing process, reaction by-products included in exhaust gas discharged from a process chamber are rapidly formed in the form of fine powder using microwaves. After drying, it is possible to collect and safely process a large amount more efficiently using heat-resistant and chemical-resistant ceramic filter pores, and to increase the replacement or repair cycle of trips that collect process by-products, thereby reducing the downtime of semiconductor manufacturing equipment. Semiconductor process by-product dry collection device using a ceramic filter invented to minimize, significantly reduce trip replacement costs due to facility inspection and saturated collection of by-products, and significantly extend the lifespan of vacuum pumps and scrubbers. It is about.

In general, a semiconductor manufacturing process largely consists of a pre-process (Fabrication process) and a post-process (Assembly process). The pre-process is to deposit a thin film on a wafer in various process chambers, It refers to a process of manufacturing a so-called semiconductor chip by repeatedly performing a process of selectively etching the deposited thin film and processing a specific pattern. After separation, it refers to the process of assembling into a finished product by combining with a lead frame.

At this time, in the processor chamber, the wafer process is actually performed in the entire semiconductor process, and the vacuum pump sucks gas from the processor chamber to maintain the vacuum of the chamber to proceed with the process in a vacuum state, and the scrubber filters before exhausting. This refers to a device that filters or collects toxic gases, etc.

However, in the process of manufacturing a semiconductor using such a semiconductor manufacturing apparatus, a large amount of various toxic, corrosive, and flammable gases that are fatal to the human body are used.

For example, in the Chemical Vapor Deposition (CVD) process, a large amount of silane, dichlorosilane, ammonia, nitrogen oxide, arsine, phosphine, diboron, boron, trichloride, etc. are used, which are semiconductor processes. Only a trace amount is consumed, and the waste gas discharged in excess contains a relatively high concentration of toxic substances.

In addition, in various semiconductor processes such as low-pressure CVD process, plasma-enhanced CVD, plasma etching, and epitaxial deposition, various toxic waste gas by-products are generated.

Waste gas treatment, which is a by-product, has recently emerged as an important issue as interest in the environment has increased, and it is now legally required to remove toxic substances from waste gas before discharging such waste gas into the atmosphere.

On the other hand, only a portion of the gas introduced into the chamber for the process according to semiconductor manufacturing is used for the process and the rest is exhausted. Although it is easily introduced into a state and used in a process, chemicals in a liquid state are converted into a gaseous state for use in a process.

It is used in the process by lowering the vessel pressure or heating to make it into a gaseous state, and then flowing it into the chamber for use in the process. After flowing into the chamber, the remaining chemicals flow into the vacuum pump in either a gaseous or liquid state and react or form powder. that can cause

In other words, when the gas used in the semi-drug manufacturing process reacts in the exhaust line or in the vacuum pump and scrubber during the exhausting process to form powder, it leads to pipe clogging or reduced efficiency of the vacuum pump and scrubber, as well as sudden stop of the vacuum pump. etc. may occur. In particular, when a problem such as an unexpected stop of the vacuum pump occurs during production, it may cause large economic losses such as disposal due to defective products and a decrease in equipment operation rate.

That is, the waste gas discharged from the process chamber is solidified and turned into powder when it comes into contact with the atmosphere or when the ambient temperature is low. There is a problem of causing failure and contaminating wafers in the process chamber by causing backflow of exhaust gas.

In order to solve the above problems, conventionally, as shown in FIG. 1, a trip 4, which is a collector, is installed on the exhaust line 2 between the processor chamber 1 and the vacuum pump 3, and the vacuum pump 3 After forcibly sucking the waste gas in the processor chamber 1, it is sent to the first and second scrubbers 5 and 6 that collect solid or liquid particles floating in the gas using liquid. Part of the reaction gas (by-product) or chemical can be collected in the trip 4 in the form of liquid or powder.

In this way, when the trip 4 is installed on the exhaust line 2 between the gas outlet of the processor chamber 1 and the inlet of the vacuum pump 3, the flow from the processor chamber 1 to the vacuum pump 3 Vacuum pump (3), which can be generated by all the by-products discharged from the processor chamber (1) flowing into the vacuum pump (3) as they are partially collected in liquid or powder form as the by-products react in the trip (4) , the first and second scrubbers (5, 6) themselves can solve problems such as deterioration in efficiency and sudden stop with a short cycle, and the vacuum pump (3) is unexpectedly stopped with a short cycle. In the event that this occurs during semiconductor production, it was possible to prevent economic losses due to disposal due to defective products and a decrease in equipment utilization rate, to some extent.

On the other hand, as a way to solve the problems of the prior art as described above, "by-product collection device of semiconductor manufacturing equipment" and "semiconductor process by-product collection device" have been developed in large quantities, and are registered in Korean Patent Publication No. 10-0647725 (November 2006). 13), 10-0676927 (January 25, 2007), 10-1024504 (March 17, 2011), 10-1806480 (December 01, 2017), 10-1840332 (2018 March 14, 2018) and 10-1865337 (May 31, 2018).

However, the above-mentioned "by-product collecting device of semiconductor manufacturing equipment" and "semiconductor process by-product collecting device" both collect by-products in a gel form by rapidly dropping the temperature of high-temperature process chemicals through a cooling line, and then collect moisture through time. is removed, and a configuration and method of curing and fixing in the form of a hard powder to a metal panel or the like are adopted, which increases the number of stops of the process chamber, thereby increasing the waiting time of the process chamber.

In addition, the entire process time (TAT) becomes longer due to this, which causes a decrease in productivity and an increase in product price, and the trip cleaning cycle is short. After separation, the trip itself is disassembled, and the by-products adhered to the surface of the metal plate are removed using various chemicals and tools, and then the trip is assembled again, reinstalled in the facility, and then reused. There are also problems that come with it.

In addition, strong acidic by-products are initially attached and deposited in the form of gel on the metal panel in the trip, and then hardened and adhered in the form of powder over time, so the metal panel is easily corroded and the life of the trip itself is short.

In addition, due to the integration of the semiconductor process, the thin film deposition method is converted from CVD (Chemical Vapor Deposition) to ALD (Atomic Layer Deposition), and the amount of reaction by-products used is increasing. Existing collection devices, which are collected in the form of hard powder as it passes, expose many problems due to the increase in the number of stops of the process chamber for cleaning, so a large-capacity semiconductor by-product collection device that can increase the cleaning cycle is required. .

Republic of Korea Patent Registration No. 10-1024504 (2011.03.17.) Republic of Korea Patent Registration No. 10-1806480 (2017.12.01.) Republic of Korea Patent Registration No. 10-1840332 (2018.03.14.) Republic of Korea Patent Registration No. 10-1865337 (2018.05.31.)

The present invention has been made to solve these conventional problems, and a first ceramic filter type trip having a microwave dryer installed between the process chamber and the trip and having a ceramic filter built in between the microwave dryer and the vacuum pump. is installed to quickly dry the reaction by-products contained in the exhaust gas discharged from the process chamber in the semiconductor device manufacturing process using a microwave dryer, and then through the pores of the heat-resistant and chemical-resistant ceramic filter in the first ceramic filter type trip. By enabling more efficient and large collection, it is possible to safely collect and process a large amount of by-products compared to the internal collection area of the trip, as well as increase the replacement or repair cycle of the trip that collects process by-products, thereby stopping semiconductor manufacturing equipment To provide a semiconductor process by-product dry collection device using a ceramic filter that can minimize time, significantly reduce costs for equipment inspection and trip replacement, and significantly extend the lifespan of vacuum pumps and scrubbers. There is a purpose.

Another object of the present invention is to further install a second ceramic filter type trip and a compressor for supplying air pulses between the vacuum pump and the first scrubber, so that even if some process by-products pass through the first ceramic filter type trip and the vacuum pump, the Since it can be collected secondarily through the second ceramic filter type trip, by-products generated in the semiconductor manufacturing process can be collected and processed more completely, thereby further improving the reliability of by-product collection and productivity according to semiconductor manufacturing. And to provide a semiconductor process by-product dry collection device using a ceramic filter that can further improve the reliability of product quality.

Other detailed objects of the present invention will be clearly identified and understood by experts or researchers in the art through the specific contents described below.

The present invention for achieving the above object is to install a trip having a predetermined shape on an exhaust line between a process chamber and a vacuum pump, and to install first and second scrubbers at the rear of the vacuum pump, so that the process chamber In constructing a semiconductor process by-product dry collection device for collecting reaction by-products in exhaust gas discharged from, moisture contained in exhaust gas and by-products is removed through irradiation of microwaves on an exhaust line between the process chamber and the trip. A microwave dryer that evaporates at a high speed is installed, and the trip installed on the exhaust line between the microwave dryer and the vacuum pump has a ceramic filter inside and passes through the microwave dryer in a high temperature state. A first ceramic filter-type trip that collects a large amount of process by-products through the pores of the ceramic filter is installed, and the vacuum pump, the microwave dryer, and the first ceramic filter-type trip are installed outside the microwave dryer and the first ceramic filter-type trip. It is characterized by installing a control unit that performs overall control functions of the semiconductor process by-product dry collection device, including tripping.

At this time, the microwave dryer, a hollow cylindrical housing having a gas inlet and a gas outlet in the center of the upper and lower plates, respectively; a microwave generator installed close to the inside of the housing and generating microwaves of 5 to 30 GHz toward a silicon carbide (SiC) heating element through which exhaust gas passes through the center in response to an output signal of a control unit; In a state installed inside the microwave generator, it performs an electrical insulation function between the microwave generator and the silicon carbide heating element, and at the same time, an insulating function that blocks the conduction of high-temperature heat generated from the silicon carbide heating element to the microwave generator. an insulator; It has ultra-high temperature heat resistance that does not burn or melt from 1400 ° C or more to 2000 ° C, and absorbs microwaves generated from the microwave generator in a form installed inside the insulator and insulator to generate high-temperature heat to pass through its central through hole It is characterized in that it consists of; a silicon carbide heating element that rapidly evaporates the moisture contained in the exhaust gas and process by-products that are doing so that the by-products have a fine powder (powder) form.

In addition, a cooling pipe through which cooling water flows is further installed between the inner surface of the housing and the outer surface of the microwave generator to prevent the microwave generator from overheating due to the high-temperature heat generated from the silicon carbide heating element. do.

In addition, on the inside of the silicon carbide heating element through which the exhaust gas passes, when the exhaust gas discharged from the processor chamber passes through the inside of the silicon carbide heating element, diffracts and passes while being in contact with the silicon carbide heating element for a long time as possible. In order to minimize friction with the exhaust gas, the exhaust gas passage retardation plate is installed in a spiral shape so as to be able to .

In addition, the first ceramic filter type trip includes a hollow body having a gas inlet and a gas outlet formed at the center of the upper and lower plates, respectively; a ceramic filter support plate installed in the horizontal direction above a point 1/4 to 2/5 above the lower plate relative to the overall height of the main body; It is manufactured using silica and has a shape formed to have an outer diameter relatively smaller than the inner diameter of the main body so that an exhaust gas passage having a predetermined width can be formed between the inner surface of the main body and the outer surface of the main body. The microwave dryer a ceramic filter that passes through and collects the by-products changed into fine powder into numerous pores provided therein and allows only pure exhaust gas to pass therethrough; A brush having a plurality of brushes on a rotating shaft and operating in response to an output signal of a control unit in a state installed inside the ceramic filter, and brushing by-product powders collected in the pores of the ceramic filter through the brush toward the by-product collection container. a driving motor; It is detachably installed on the bottom surface of the ceramic filter base plate, but has a form installed so that an exhaust gas passage having a predetermined width is formed between the bottom surface and the lower surface of the main body, and the process of passing the exhaust gas through the ceramic filter and the Characterized in that it consists of a by-product collection container for collecting by-product powders falling in response to the operation of the brush drive motor.

In addition, the outside of the ceramic filter has a shape composed of a perforated plate wrapped around the outer surface of the ceramic filter and an air push that vibrates the perforated plate, and vibrates the ceramic filter as well as itself in response to the output signal of the control unit. It is characterized by further installing an air hammer for forcibly blowing off by-products in the form of powder collected in the pores of the ceramic filter.

In addition, a second ceramic filter type trip for collecting residual process by-products is further installed on the exhaust line between the vacuum pump and the first scrubber, and inside the second ceramic filter type trip, 2 It is characterized by installing a compressor for supplying air pulses that forcibly shakes off the by-products in the form of fine powder that are collected individually through air pulses that are intermittently provided in response to the output signal of the control unit.

At this time, the second ceramic filter type trip includes a main body having a cylindrical shape with a gas inlet and a gas outlet formed at the center of the side surface and the top plate and having an open bottom surface; It is manufactured using silica, and has a shape molded into a cylindrical shape having a relatively smaller outer diameter than the inner diameter of the main body so that a by-product collecting space having a predetermined width is formed between the outer surface and the inner surface of the main body, and the open upper surface is While the exhaust gas passing through the vacuum pump is discharged to the scrubber side in a state where it is fixedly installed on the top surface of the main body to communicate with the gas outlet, by-products in the form of fine powder remaining in the exhaust gas are collected into numerous pores provided therein. and a ceramic filter that allows only pure exhaust gas to pass through; A by-product that has a cylindrical shape with an open top and is detachably coupled to the bottom opening of the main body, is caught on the ceramic filter and then freely falls or is forcibly separated from the outer surface of the ceramic filter by air pressure generated by a compressor and falls Characterized in that it consists of a by-product collection container for collecting powders.

As described above, according to the semiconductor process byproduct dry collection device using a ceramic filter of the present invention, a microwave dryer is installed between the process chamber and the trip, and a ceramic filter is installed between the microwave dryer and the vacuum pump. By installing a ceramic filter type trip, the reaction by-products included in the exhaust gas discharged from the process chamber in the semiconductor device manufacturing process are rapidly dried using a microwave dryer, and then heat resistance and chemical resistance in the first ceramic filter type trip Through ceramic filter pores, it is possible to collect more efficiently and in a large amount, so that a large amount of by-products compared to the internal collection area of the trip can be safely collected and treated, and the semiconductor manufacturing equipment is stopped due to the replacement of the trip that collects process by-products. Time can be minimized, costs associated with equipment inspection and trip replacement can be significantly reduced, lifespan of vacuum pumps and scrubbers can be greatly extended, and productivity and reliability in semiconductor manufacturing can be further improved. can

In addition, in the present invention, by further installing a second ceramic filter type trip and a compressor for supplying air pulses between the vacuum pump and the first scrubber as necessary, some process by-products pass through the first ceramic filter type trip and the vacuum pump Even if it is, it can be collected secondarily through the second ceramic filter type trip, so by-products generated in the semiconductor manufacturing process can be more completely collected and processed, thereby further improving the reliability of by-product collection, as well as in semiconductor manufacturing. It is a very useful invention, such as being able to further improve productivity and reliability of product quality.

Other effects of the present invention will be clearly identified and understood by experts or researchers in the art through the specific details described below or during the process of implementing the present invention.

1 is a schematic configuration diagram of a conventional general semiconductor process by-product collection system
Figure 2 is a schematic configuration diagram of a semiconductor process by-product dry collection system to which the present invention is applied
Figure 3 is a front cross-section and an exhaust gas flow chart of a combined state of a microwave dryer and a first ceramic filter type trip in the present invention
Figure 4 is a front cross-section and an exhaust gas flow chart of a coupled state of a second ceramic filter type trip and air pulse supply compressor in the present invention

Since the present invention can have various changes and various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, it should be understood that this is not intended to limit the present invention to the specific disclosed form, and includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

Referring to the following drawings, preferred embodiments of the present invention will be described in more detail.

2 shows a schematic configuration diagram of a semiconductor process by-product dry collection system to which the present invention is applied, and FIG. 3 shows a front cross-section of a combined state of a microwave dryer and a first ceramic filter type trip and an exhaust gas flow diagram of the present invention, FIG. 4 shows a cross-sectional view of a coupled state of a second ceramic filter type trip and a compressor for supplying air pulses and a flow chart of exhaust gas in the present invention.

According to this, the device of the present invention,

A trip 4 having a predetermined shape is installed on the exhaust line 2 between the process chamber 1 and the vacuum pump 3, and first and second scrubbers 5 are installed at the rear of the vacuum pump 3. In constructing a semiconductor process by-product dry collection device for collecting reaction by-products in the exhaust gas discharged from the process chamber 1 by installing (6),

A microwave dryer (7) is installed on the exhaust line (2) between the process chamber (1) and the trip (4) to quickly evaporate moisture contained in the exhaust gas and by-products through microwave irradiation. do,

As the trip 4 installed on the exhaust line 2 between the microwave dryer 7 and the vacuum pump 3, a ceramic filter 43 is provided therein, and the microwave dryer 7 A first ceramic filter type trip (4') is installed to collect a large amount of the dried process by-products through the pores of the ceramic filter (43),

The outside of the microwave dryer 7 and the first ceramic filter type trip 4' includes the vacuum pump 3, the microwave dryer 7 and the first ceramic filter type trip 4', It is characterized by installing a control unit 8 that performs overall control functions of the by-product dry collection device.

At this time, the microwave dryer 7,

a cylindrical hollow housing 71 having a gas inlet 712 and a gas outlet 714 formed at the center of the upper and lower plates 711 and 713;

In a state installed close to the inside of the housing 71, in response to the output signal of the controller 8, microwaves of 5 to 30 GHz are directed toward the silicon carbide (SiC) heating element 74 through which the exhaust gas passes through the center. a microwave generator 72 that generates;

In a state installed inside the microwave generator 72, electrical insulation is performed between the microwave generator 72 and the silicon carbide heating element 74, and at the same time, high-temperature heat generated from the silicon carbide heating element 74 an insulator and heat insulator 73 that blocks conduction toward the microwave generator 72;

It has ultra-high temperature heat resistance to withstand high heat of 1,000 ~ 2,000 ℃ and absorbs the microwave generated from the microwave generator 72 in the form installed inside the insulator and insulator 73 and generates high-temperature heat to create its own Characterized in that it is composed of; a silicon carbide heating element 74 that quickly evaporates the moisture contained in the exhaust gas and process by-products passing through the central hole so that the by-products have a fine powder form.

In addition, between the inner surface of the housing 71 and the outer surface of the microwave generator 72, in order to prevent the microwave generator 72 from being overheated by the high-temperature heat generated from the silicon carbide heating element 74, there is an internal It is characterized in that a cooling pipe 75 through which cooling water flows is further installed.

In addition, inside the silicon carbide heating element 74 through which the exhaust gas passes, when the exhaust gas discharged from the process chamber 1 passes through the inside of the silicon carbide heating element 74, the silicon carbide heating element 74 In order to minimize friction with the exhaust gas, It is characterized in that it is formed inclined toward the lower part with a vertical central axis by a predetermined angle (θ).

In addition, the first ceramic filter type trip 4',

a hollow body 41 having a gas inlet 412 and a gas outlet 414 formed at the center of the upper and lower plates 411 and 413;

a ceramic filter support plate 42 installed in the horizontal direction above a point 1/4 to 2/5 above the lower plate 413 relative to the overall height of the main body 41;

It is manufactured using silica and has an outer diameter that is relatively smaller than the inner diameter of the main body 41 so that an exhaust gas passage (EGP) having a predetermined width can be formed between the inner surface of the main body 41 and the outer surface of the main body 41. The microwave dryer (7) has a molded shape and is installed in close contact between the bottom surface of the upper plate (411) of the body (41) and the upper surface of the ceramic filter base plate (42) inside the body (41) When the exhaust gas passing through is discharged to the vacuum pump 3 side through the exhaust gas passage (EGP), it passes through the microwave dryer 7 and into the numerous pores provided in the by-products themselves that have been changed into fine powder form. a ceramic filter 43 that collects and allows only pure exhaust gas to pass through;

Equipped with a plurality of brushes 441 on the rotating shaft and operated in response to the output signal of the control unit 8 in a state installed inside the ceramic filter 43, and the pores of the ceramic filter 43 through the brush 441 A brush drive motor 44 that shakes by-product powders collected in the field toward the by-product collection container 45;

It is detachably installed on the bottom surface of the ceramic filter base plate 42, but has a form installed so that an exhaust gas passage (EGP) having a predetermined width is formed between the bottom surface of itself and the bottom surface of the main body 41, and exhaust Characterized in that it consists of a by-product collection container 45 for collecting free-falling by-product powders in response to the process of gas passing through the ceramic filter 43 and the operation of the brush drive motor 44.

In addition, the outside of the ceramic filter 43 has a form composed of a perforated plate 461 wrapped around the outer surface of the ceramic filter 43 and an air push 462 for vibrating the perforated plate 461, In response to the output signal of the control unit 8, the air hammer 46 vibrates the ceramic filter 43 as well as itself and forcibly blows off by-products in the form of powder collected in the pores of the ceramic filter 43. characterized by its installation.

In addition, a second ceramic filter type trip 10 for collecting residual process by-products is further installed on the exhaust line 2 between the vacuum pump 3 and the first scrubber 5, and the second ceramic filter type Inside the trip 10, by-products in the form of fine powder secondarily collected in the outer pores of the ceramic filter 102 are forcibly shaken off through air pulses intermittently provided in response to the output signal of the control unit 8. It is characterized in that a compressor 11 for supplying air pulses is installed.

At this time, the second ceramic filter type trip 10,

a main body 101 having a cylindrical shape with a gas inlet 101a and a gas outlet 1011a formed at the center of the side surface and the top plate 1011 and having an open bottom;

It is manufactured using silica and has a cylindrical shape with an outer diameter relatively smaller than the inner diameter of the main body 101 so that a by-product collection space (BPCS) having a predetermined width is formed between the outer surface and the inner surface of the main body 101. Exhaust gas passing through the vacuum pump 3 is discharged to the scrubber side in a state in which it has a molded shape and is fixed to the ceiling surface of the upper surface 1011 of the main body 10 so that the open upper surface communicates with the gas outlet 1011a. a ceramic filter 102 that collects by-products in the form of fine powder remaining in exhaust gas in the process of being processed into numerous pores provided therein and allows only pure exhaust gas to pass therethrough;

In the form of a cylindrical shape with an open top and detachably coupled to the bottom opening of the main body 101, it is caught on the ceramic filter 102 and then freely falls or is forced from the outer surface of the ceramic filter by air pressure generated by a compressor It is characterized in that it consists of; a by-product collecting container 103 that collects the by-product powder that is separated and falls.

Here, reference numeral 9 denotes a valve installed to block the exhaust line 2 when the microwave dryer 7 and the first and second ceramic filter type trips 4' and 10 are to be replaced or repaired. 415 is a container entrance detachably installed on one side of the bottom of the main body 41 of the first ceramic filter type trip 4' to empty the by-products collected in the by-product collecting container 45.

The action and effect of the semiconductor process by-product dry collection device using the ceramic filter of the present invention configured as described above will be described in detail with reference to the accompanying drawings.

First, as shown in FIGS. 2 to 4, the dry collection device for semiconductor process byproducts using a ceramic filter to which the present invention is applied is placed on the exhaust line 2 between the process chamber 1 and the vacuum pump 3. The process chamber 1 of the known semiconductor process by-product collection apparatus having a configuration in which a trip 4 having a shape is installed and first and second scrubbers 5 and 6 are installed at the rear of the vacuum pump 3 ) And a microwave dryer (7) is further installed between the trip (4), and the trip (4) installed on the exhaust line (2) between the microwave dryer (7) and the vacuum pump (3) is In addition to installing a ceramic filter type trip (4'), a control unit (8) is installed outside the microwave dryer (7) and the first ceramic filter type trip (4') to perform the process during the semiconductor device manufacturing process. The reaction by-products included in the exhaust gas discharged from the chamber 1 are rapidly dried using a microwave dryer 7, and then a heat-resistant and chemical-resistant ceramic filter 43 is placed in the first ceramic filter type trip 4'. ) through the stomata to collect more efficiently and in large quantities as the main technological component.

At this time, it is installed on the exhaust line 2 between the process chamber 1 and the trip 4 to quickly remove the exhaust gas discharged from the process chamber 1 and the moisture contained in the by-products through irradiation of microwaves. The microwave dryer 7, which evaporates at a speed, is largely composed of a housing 71, a microwave generator 72, an insulator and insulator 73, and a silicon carbide heating element 74. do it with

Among the microwave dryer 7 composed of such components, the housing 71 is molded into a hollow cylindrical shape using stainless steel having excellent corrosion resistance, etc., and is installed so that disassembly and assembly is possible, A gas inlet 712 and a gas outlet 174 are formed at the center of the lower plates 711 and 173, respectively.

In addition, the microwave generator 72 has a form installed close to the inside of the housing 71, operates in response to a driving signal output from the control unit 8, and exhausts microwaves of 5 to 30 GHz. It performs the function of generating gas in the direction of the silicon carbide (SiC) heating element 74 passing through the center.

In addition, the insulator and heat insulator 73 is formed of glass wool, quartz wool, diatomaceous earth, magnesium carbonate powder, magnesia powder, calcium silicate, pearlite, etc., and the inside of the microwave generator 72 And has a form installed between the outer surface of the silicon carbide heating element 74 to be described later.

The insulator and insulator 73 performs an electrical insulation function between the microwave generator 72 and the silicon carbide heating element 74, and at the same time, the high-temperature heat generated from the silicon carbide heating element 74 is transferred to the microwave generator. (72) It performs the function of blocking conduction to the side.

In addition, the silicon carbide heating element 74 has ultra-high temperature heat resistance to withstand high heat of 1,000 to 2,000 ° C., and in the form of a cylindrical shape so that a through hole through which exhaust gas can pass is formed in the center, the insulator and insulator ( 73) is installed inside.

The silicon carbide heating element 74 absorbs microwaves generated from the microwave generator 72 and generates high-temperature heat to remove moisture contained in exhaust gas and process by-products passing through its central aperture. Through the method of evaporating at high speed, it performs the function of rapidly drying process by-products in the form of fine powder (powder).

Therefore, during the semiconductor manufacturing process, reaction by-products included in the exhaust gas discharged from the processor chamber 1 are rapidly dried through the microwave dryer 7 instead of being supplied to the trip 4 in a gel form as in the prior art. It can be changed into fine powder, that is, powder form, and then sent to the trip (4) side.

In addition, in the present invention, a cooling pipe 75 through which cooling water flows is further installed between the inner surface of the housing 71 and the outer surface of the microwave generator 72, thereby generating a high temperature generated in the silicon carbide heating element 74. It is possible to prevent the microwave generator 72 from being overheated by the heat of the microwave dryer 7 itself, so that the lifespan of the microwave dryer 7 can be greatly extended.

In addition, in the present invention, an exhaust gas passage retardation plate 76 formed by spirally forming a plate body cut to a predetermined width and length in a vertical direction is further installed inside the silicon carbide heating element 74 through which the exhaust gas passes.

Therefore, when the exhaust gas discharged from the processor chamber 1 passes through the through hole of the silicon carbide heating element 74 in a vertical direction, it hits the upper surface of the exhaust gas passage retardation plate 76 having a spiral shape and is diffracted. Since it flows in the form, the exhaust gas containing the process by-products is passed in contact with the silicon carbide heating element 74 generating heat at a high temperature for a long time as possible, and the process by-products included in the exhaust gas are dried as much as possible. It turns into a fine powder form.

In addition, in the present invention, by forming the exhaust gas passage retardation plate 76 inclined downward by a predetermined angle (θ: for example, 10 to 30 °) with respect to the vertical central axis, the exhaust gas and the exhaust gas passage retardation plate It is possible to minimize friction that may occur between the exhaust gas passage retardation plates 76, thereby minimizing the flow resistance of the exhaust gas that may occur due to the exhaust gas passage retardation plate 76.

On the other hand, it is installed instead of the trip 4 installed on the exhaust line 2 between the microwave dryer 7 and the vacuum pump 3, and the by-products dried while passing through the microwave dryer 7 are dried. The first ceramic filter-type trip 4 ', which collects a large amount of , is basically a main body 41, a ceramic filter base plate 42, a ceramic filter 43, a brush drive motor 44, and a by-product collection container 45. It is composed of the basic main technical points.

At this time, the main body 41 among the components of the first ceramic filter type trip 4' is molded into a hollow cylinder shape using stainless steel having excellent corrosion resistance, etc., and is installed to enable disassembly and assembly. A gas inlet 412 and a gas outlet 414 are formed in the center of the upper and lower plates 411 and 413, respectively.

In addition, the ceramic filter base plate 42 is formed in a washer shape using stainless steel having excellent corrosion resistance, etc., and is located 1/4 to 2/5 from the lower plate 413 relative to the overall height of the main body 41. In addition to the function of supporting the ceramic filter 43 by installing in the horizontal direction, a detailed configuration is not shown, but a function to detachably combine the by-product collection container 45 to be described later by further providing a container fixture on the bottom surface carry out

In addition, the ceramic filter 43 is made of silica, and the main body 41 can form an exhaust gas passage (EGP) having a predetermined width between the inner surface of the main body 41 and the outer surface of the main body 41. It has a shape formed to have a relatively smaller outer diameter than the inner diameter of the body 41, and installed in close contact between the bottom surface of the top plate 411 of the body 41 and the top surface of the ceramic filter base plate 42 inside the body 41 have

Such a ceramic filter 43, when the exhaust gas passing through the microwave dryer 7 is discharged to the vacuum pump 3 side through the exhaust gas passage (EGP), the microwave dryer 7 Byproducts that pass through and are changed into fine powder (powder) form are collected into numerous pores provided in themselves and perform the function of allowing only pure exhaust gas to pass through.

In addition, the brush driving motor 44 is provided with a plurality of brushes 441 on a rotating shaft and is operated in response to an output signal of the controller 8 in a state installed inside the ceramic filter 43, and the brushes ( 441), by-product powder collected in the pores of the ceramic filter 43 is forcibly shaken off, and accumulated in the by-product collection container 45 to be automatically collected.

In addition, the by-product collecting container 45 is detachably installed on the bottom surface of the ceramic filter base plate 42, but an exhaust gas passage having a predetermined width between its bottom surface and the bottom surface of the main body 41 ( EGP) has a form installed to form.

Such a by-product collecting container 45 collects by-product powders that fall freely or forcibly fall in response to the operation of the brush drive motor 44 while the exhaust gas passes through the ceramic filter 43. Later, when the inside of the first ceramic filter type trip 4' becomes saturated with process by-products in the form of dry powder, the operator separates it from the bottom surface of the ceramic filter base plate 42 in the main body 41, and then the inside It performs the function of collecting by-product powder in the form of fine powder collected in a designated place or collection container.

In addition, in the present invention, a perforated plate 461 wrapped around the outer surface of the ceramic filter 43 and an air push 462 vibrating the perforated plate 461 are configured on the outside of the ceramic filter 43. An air hammer (46) having the same was further installed.

In such an air hammer 46, the perforated plate 461 vibrates in response to a driving signal output from the control unit 8 at predetermined time intervals stored therein or when a worker manipulates a key as needed. , By forcibly vibrating the ceramic filter 43, the by-products in the form of powder collected in the pores of the ceramic filter 43 are forcibly shaken off to automatically collect them in the by-product collection container 45. .

On the other hand, in the present invention, a first ceramic filter type trip (4 ') installed on the exhaust line (2) between the microwave dryer (7) and the vacuum pump (3) in order to more completely collect semiconductor process by-products In addition, a second ceramic filter type trip 10 is further installed on the exhaust line 2 between the vacuum pump 3 and the first scrubber 5, and the inside of the second ceramic filter type trip 10 In the furnace, a compressor 11 for supplying air pulses was further installed.

At this time, the second ceramic filter type trip 10 has a configuration in which a main body 101, a ceramic filter 103, and a by-product collection container 103 are mutually coupled, and some process by-products have a main by-product collection function. 1 Even if it is discharged to the first and second scrubbers (5, 6) through the ceramic filter type trip (4') and the vacuum pump (3), it is further collected secondarily through the second ceramic filter type trip (10). By performing the function of providing a solution, by-products generated in the semiconductor manufacturing process can be more completely collected and processed.

Among the components of the second ceramic filter type trip 10, the main body 101 has a gas inlet 101a and a gas outlet 1011a formed in the center of the side surface and the top plate 1011, respectively, and the second ceramic The filter type trip 10 itself is detachably coupled on the exhaust line 2 between the vacuum pump 3 and the first scrubber 5.

In addition, the ceramic filter 102 is manufactured using silica, and a by-product collecting space (BPCS) having a predetermined width is formed between the outer surface and the inner surface of the main body 101 relative to the inner diameter of the main body 101. In a state in which it is molded into a cylindrical body shape having a small outer diameter, it has a shape fixed to the ceiling surface of the upper surface 1011 of the main body 10 so that the open upper surface communicates with the gas outlet 1011a.

Such a ceramic filter 102 is used when the exhaust gas passing through the vacuum pump 3 is discharged to the scrubber side, in a state in which it is not completely collected by the second ceramic filter type trip 10, and the vacuum pump 3 Residual process by-products (actually, very fine powdery by-products) in the exhaust gas that has passed through are collected into the numerous pores provided therein and perform the function of allowing only pure exhaust gas to pass through.

In addition, the by-product collection container 103 has a cylindrical shape with an open top and is detachably coupled to the bottom opening of the main body 101 through screwing or several bolts, and is hung on the ceramic filter 102 Then, it finally collects by-product powders that fall freely or are forcibly separated from the outer surface of the ceramic filter 102 by the air pressure generated intermittently in the air pulse supply compressor 11.

Of course, when the by-product collection container 103, including the interior space of the second ceramic filter type trip 10, is saturated by the process by-product in the form of dry powder, the operator removes it from the bottom of the main body 71. After separation, the by-product powder in the form of fine powder collected therein can be collected by moving it to a designated place or a collection container.

In addition, in a state where the air pulse supply compressor 11 is installed outside the second ceramic filter type trip 10, only the air discharge hose goes inside the ceramic filter 102 in the second ceramic filter type trip 10 It has an insert installed form.

The compressor 11 for supplying air pulses is operated in response to a drive signal output from the control unit 8 at predetermined time intervals (i.e., intermittently), and blows air pulses outward strongly from the inside of the ceramic filter 102. will give

Therefore, by-products in the form of fine powder secondarily collected and accumulated on the outer surface, including the pores of the ceramic filter 102 of the second ceramic filter type trip 10, are supplied from the compressor 11 for pulse supply. After being forcibly separated by air pressure, they are automatically collected in the by-product collection container 103.

Meanwhile, the microwave dryer 7 and the first ceramic filter type trip 4 'are installed between the processor chamber 1 and the vacuum pump 3, and the vacuum pump 3 and the first scrubber ( 5) If the second ceramic filter type trip 10 is further installed in between, process by-products can be collected as much as possible through the second ceramic filter type trip 10, so solid or liquid particles floating in the gas using liquid Among the first and second scrubbers 5 and 6 that collect (捕集), the installation of the first scrubber 5 may be excluded (that is, the solid or liquid floating in the exhaust gas only with the first scrubber 6) particles can be collected), and even if the capacity of the first ceramic filter type trip 4' is greatly reduced, the collection efficiency of by-products is similar, so the installation cost can be reduced accordingly.

In addition, when a large amount of process by-products are collected on the outer surface including the pores of the ceramic filter 102 of the second ceramic filter type trip 10, the by-product collection container 103 is operated by operating the pulse supply compressor 11 ), so that the inspection and replacement cycle for the second ceramic filter type trip 10 can be significantly extended, and thus costs can also be significantly reduced.

On the other hand, looking at the manufacturing method of the ceramic filter 43 used in the ceramic filter type trip (4') (10) of the apparatus of the present invention, the cleaning step, the crushing step, the particle size separation step, the mixing step, and the kneading step , Aging step, vacuum extrusion molding step, drying step, and, manufactured through a high-temperature firing step.

At this time, the cleaning step is a step of removing foreign substances to increase the purity of silica products or silica discarded after use in various industrial fields, and foreign substances are removed by physical or chemical methods to increase the purity of silica products or silica discarded after use. To remove foreign substances from the silica product or silica by using, it includes a physical cleaning step and a chemical cleaning step.

More specifically, the cleaning operation is completed through a chemical cleaning step in which foreign substances other than silica attached to the silica are removed through a physical cleaning step, then etched using chemicals, rinsed, and then dried.

Here, the physical cleaning step is a step of removing foreign substances other than silica attached to the silica using a cutter and a grinder, and the chemical removal step is to remove foreign substances from the silica through the physical cleaning step by using a chemical After etching, it is a step of cleaning by rinsing so that the pH of water is 6 to 8 and then performing exhaust drying.

In the cleaning step, any one of the physical cleaning step and the chemical cleaning step as described above may be performed, or the silica may be cleaned using both the physical cleaning step and the chemical cleaning step.

In addition, the cleaning step may further include a rinsing step and a drying step.

The rinsing step is a step of rinsing and cleaning the silica etched by the chemicals using a cleaning solution and water until the pH of the water reaches 6 to 8.

The drying step is a step of forcibly drying the rinsed silica in an exhaust state at a high temperature of 100° C. or more to prevent contamination of the rinsed silica by moisture.

The crushing step is a step of crushing the high-purity silica cleaned by the washing step to have a desired particle size, distribution, and shape.

In the crushing step, the silica is firstly crushed to a size of several centimeters, and then crushed again to a size of several millimeters. As a process, the silica is crushed using a jaw crusher, cone crusher, impact crusher, or the like.

After crushing the silica to have a desired particle size, distribution, and shape as described above, the silica crushed to have a plurality of particle sizes is separated by particle size through the particle size separation step.

Here, the crushed silica is separated into particle sizes of 0.5 mm to 1 mm, 0.2 mm to 0.5 mm, and 200 mesh.

After separating the crushed silica by particle size as described above, the mixing step is performed. In this mixing step, the silica separated by particle size is mixed in a predetermined mixing ratio, and clay, sintering agent, binder, and organic matter are mixed. After adding, mix for about 10 to 15 minutes.

In the mixing step, the silica separated by particle size is mixed at a ratio of 10 to 30 parts by weight of 0.5 mm to 1 mm particles, 20 to 60 parts by weight of 0.2 mm to 0.5 mm particles, and 10 to 30 parts by weight of 200 mesh particles.

In the mixing step, the silica separated by particle size is mixed in a ratio of 10 to 30 parts by weight of 0.5 mm to 1 mm particles, 20 to 60 parts by weight of 0.2 mm to 0.5 mm particles, and 10 to 30 parts by weight of 200 mesh particles as described above. The reason is to increase the packing density and adjust the pore size when vacuum extruding the half weight aged in the vacuum extrusion molding step into a predetermined filter shape.

The clay is mixed in an amount of 5 to 15 parts by weight to improve the strength of the ceramic filter by increasing the viscosity and increasing the sintering density when manufacturing the ceramic filter.

Meanwhile, in the mixing step, the sintering agent is mixed in an amount of 5 to 20 parts by weight. For example, glaze, cullet, frit, etc. are used as the sintering agent.

In addition, in the mixing step, the binder is mixed in an amount of 1 to 5 parts by weight. For example, the binder is a material for reinforcing the viscosity of the ceramic filter to be produced by vacuum extrusion molding in the vacuum extrusion molding step, and is PVA, MC, or starch. organic binder materials such as

In addition, in the mixing step, the organic material is mixed in an amount of 1 to 5 parts by weight. For example, as the organic material, sawdust, rice bran, carbon, etc., which can form pores in the vacuum extruded filter by burning in the high-temperature firing step, are used.

In addition, the organic material is mixed with 20 to 30 parts by weight of particles having a size of 0.1 mm to 2 mm so as to form pores of 10 μm in the vacuum extrusion molded filter in the high-temperature sintering step.

As described above, when the vacuum extrusion molded filter is heated to a high temperature in the high temperature sintering step, the organic material burns to form pores with a size of 1 to 2 μm in the vacuum extrusion molded filter, so that the ceramic filter can filter even ultra-fine dust. .

The kneading step is a process of making a dough by mixing water and a lubricant with silica mixed with clay, a sintering agent, a binder, and an organic material in the mixing step, and then sufficiently compacting them for about 1 to 3 minutes.

Here, the water is mixed in a ratio of 15 to 20 parts by weight and the lubricant is 1 to 5 parts by weight. For example, the lubricant is used to reduce friction when the dough made in the kneading step is vacuum extruded into a predetermined filter shape. Use oleic acid, rice bran oil, cooking oil, etc.

The aging step may remove air contained in the dough by sealing the dough compacted in the kneading step and then aging it at a constant temperature for a predetermined time. After aging for 6 hours to 36 hours at a temperature of 20 ℃ to 30 ℃ to remove the air contained in the dough.

The vacuum extrusion step is a process of vacuum extrusion molding the dough that has undergone the aging step as described above into a predetermined filter shape.

Here, the reason for vacuum extruding the dough that has passed through the aging step into a predetermined filter shape through the vacuum extrusion step is that even if air contained in the dough is removed through the aging step of the dough compacted in the kneading step, the aging step Even after that, since air is included in the dough, if vacuum extrusion is not performed, the molded ceramic filter goes through a drying step and a high-temperature firing step in a state in which air is included.

When the molded ceramic filter goes through the drying step and the high-temperature firing step in the state of containing air, a bloating phenomenon occurs in which the portion of the ceramic filter containing air swells, and the blotting phenomenon occurs. The part is very easily broken, resulting in a decrease in strength of the ceramic filter and a problem in that uniform quality cannot be maintained.

Therefore, after the air contained in the dough is primarily removed in the aging step, the dough is vacuum extruded into a predetermined filter shape to completely remove the remaining air contained in the dough even after the aging step, Even if the ceramic filter molded into a predetermined filter shape through the vacuum extrusion step undergoes a drying step and a high-temperature firing step, the blotting phenomenon does not occur, so that the strength of the ceramic filter does not decrease and the ceramic filter of uniform quality does not occur. can produce

The drying step is a process of drying the ceramic filter molded into a predetermined filter shape through the vacuum extrusion molding step at a constant temperature for a predetermined time. Dry for at least 24 hours.

The high-temperature firing step is a process of heating the filter dried in the drying step to a high temperature to densify the surface structure and simultaneously burning the organic matter to form pores. For example, the high-temperature firing step is a process of forming pores. is heated at 1000 ° C to 1200 ° C for at least 12 hours to densify the surface structure to improve thermal shock resistance and at the same time burn the organic material to form pores.

Such a high-temperature firing step may include a preheating step, a firing step, and a cooling step, the preheating step and the cooling step are performed at about 1 ° C./min to 2 ° C./min, and the firing step is performed at a high temperature of 1000 ° C. to 1200 ° C. It is fired in a furnace, and the firing proceeds for at least 12 hours.

Here, the high-temperature firing step uses a shuttle kiln or tunnel furnace.

The ceramic filter manufactured by this method has a thermal expansion coefficient as low as 0.5x10 ~ 6/℃ by mixing silica separated by predetermined particle size at a predetermined mixing ratio, and thus the thermal shock resistance is very good, and the ceramic filter is damaged due to thermal expansion. In addition, thermal shock resistance is further improved by densifying the surface structure through a high-temperature firing step, and at the same time, the air pulse pressure becomes 4-5kg/cm, so that not only high-temperature environmental conditions of 500℃ or more, but also 5kg It can be used without difficulty even under high-pressure environmental conditions of more than /cm ² .

When the high-temperature firing step is completed, the inspection step is performed and then the product is shipped.

Meanwhile, as the silica, natural silica or fused silica obtained by melting natural crystalline silica and then cooling it at room temperature may be used.

Although the detailed description of the present invention described above has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art will find the spirit of the present invention described in the claims to be described later. And it will be understood that the present invention can be variously modified and changed without departing from the technical scope.

1: process chamber
2: exhaust line
3: vacuum pump
4 : Trip
4 ': first ceramic filter type trip 41: main body
411: top plate 412: gas inlet
413: lower plate 414: gas outlet
415: container entrance door
42: ceramic filter support plate 43: ceramic filter
44: brush drive motor 441: brush
45: by-product collection container 46: air hammer
461: perforated plate 462: air push
EGP: Exhaust gas passage
7: Microwave Dryer
71: housing
711: top plate 712: gas inlet
713: lower plate 714: gas outlet
72: microwave generator 73: insulator and insulator
74: silicon carbide heating element 75: cooling pipe
76: exhaust gas passage retardation plate
8: control unit
9: valve
10: 2nd ceramic filter type trip
101: main body 101a: gas inlet
1011: top plate 1011a: gas outlet
102: ceramic filter 103: by-product collection container
BPCS: by-product collection space
11: Compressor for air pulse supply

Claims (8)

A semiconductor for collecting reaction by-products in the exhaust gas discharged from the process chamber by installing a trip having a predetermined shape on an exhaust line between the process chamber and the vacuum pump, and installing first and second scrubbers at the rear of the vacuum pump. In configuring the process by-product dry collection device,
A microwave dryer is installed on an exhaust line between the process chamber and the trip to rapidly evaporate moisture contained in exhaust gas and by-products through microwave irradiation,
The trip installed on the exhaust line between the microwave dryer and the vacuum pump has a ceramic filter therein, passes through the microwave dryer in a high temperature state, and collects a large amount of dried process by-products through the pores of the ceramic filter Install a ceramic filter type trip,
A ceramic filter characterized in that a control unit for performing overall control functions of the semiconductor process by-product dry collection device including the vacuum pump, the microwave dryer and the ceramic filter type trip is installed outside the microwave dryer and the ceramic filter type trip. Semiconductor process by-product dry collection device using According to claim 1,
The microwave dryer,
a housing having a gas inlet and a gas outlet at the center of the upper and lower plates, respectively;
a microwave generator installed close to the inside of the housing and generating microwaves of 5 to 30 GHz toward a silicon carbide (SiC) heating element through which exhaust gas passes through the center in response to an output signal of a control unit;
In a state installed inside the microwave generator, it performs an electrical insulation function between the microwave generator and the silicon carbide heating element, and at the same time, an insulating function that blocks the conduction of high-temperature heat generated from the silicon carbide heating element to the microwave generator. an insulator;
1In the form installed inside the insulator and insulator, it absorbs the microwave generated from the microwave generator and generates high-temperature heat to quickly remove the moisture contained in the exhaust gas and process by-products passing through its central aperture. A semiconductor process by-product dry collection device using a ceramic filter, characterized in that composed of; a silicon carbide heating element that evaporates at a rate so that the by-products have a fine powder (powder) form. According to claim 2,
A semiconductor process by-product dry collection device using a ceramic filter, characterized in that a cooling pipe is further installed between the inner surface of the housing and the outer surface of the microwave generator. According to claim 2,
Inside the silicon carbide heating element, when the exhaust gas discharged from the processor chamber passes through the inside of the silicon carbide heating element, it diffracts in a state of contact with the silicon carbide heating element for a long time and is formed in a spiral so that it can pass through Install the exhaust gas passage retardation plate,
The exhaust gas passage retardation plate is a semiconductor process by-product dry collection device using a ceramic filter, characterized in that formed inclined by a predetermined angle toward the lower part of the vertical central axis to minimize friction with the exhaust gas. According to claim 1,
The ceramic filter type trip,
a main body having a gas inlet and a gas outlet at the center of the upper and lower plates, respectively;
a ceramic filter support plate installed in the horizontal direction above a point 1/4 to 2/5 above the lower plate relative to the overall height of the main body;
In a state in which the main body is installed in close contact between the bottom surface of the upper plate and the upper surface of the ceramic filter base plate inside the main body, the exhaust gas passing through the microwave dryer passes through an exhaust gas passage formed between the inner surface of the main body and the outer surface of the main body. When discharged to the side of the vacuum pump through the microwave dryer, the by-products changed into fine powder form are collected into numerous pores provided therein and pass only pure exhaust gas through the ceramic filter;
A brush having a plurality of brushes on a rotating shaft and operating in response to an output signal of a control unit in a state installed inside the ceramic filter, and brushing by-product powders collected in the pores of the ceramic filter through the brush toward the by-product collection container. a driving motor;
A by-product collection container having a form detachably installed on the bottom surface of the ceramic filter base plate and collecting by-product powders falling in response to the process of exhaust gas passing through the ceramic filter and the operation of the brush driving motor; Semiconductor process by-product dry collection device using a ceramic filter. According to claim 5,
Outside the ceramic filter,
It has a form composed of a perforated plate wrapped around the outer surface of the ceramic filter and an air push that vibrates the perforated plate, vibrates the ceramic filter as well as itself in response to the output signal of the control unit, and collects in the pores of the ceramic filter. Semiconductor process by-product dry collection device using a ceramic filter, characterized in that by further installing an air hammer for forcibly blowing the by-products in the form of powder. According to claim 1,
A second ceramic filter type trip for collecting residual process by-products is further installed on an exhaust line between the vacuum pump and the first scrubber installed at the rear of the vacuum pump, and a ceramic filter type trip is installed inside the second ceramic filter type trip. A semiconductor using a ceramic filter, characterized by installing a compressor for supplying air pulses that forcibly shakes off by-products in the form of fine powder secondarily collected in the outer pores through air pulses intermittently provided in response to the output signal of the control unit. Process by-product dry capture units. According to claim 7,
The second ceramic filter type trip,
a main body having a cylindrical shape with a gas inlet and a gas outlet formed at the center of the side surface and the top plate and having an open bottom;
It has a shape formed in a cylindrical shape having a relatively smaller outer diameter than the inner diameter of the main body so that a by-product collecting space having a predetermined width is formed between the outer surface of the main body and the inner surface of the main body, and the open upper surface communicates with the gas outlet. While the exhaust gas passing through the vacuum pump is discharged to the scrubber side while it is fixedly installed on the upper surface of the main body, by-products in the form of fine powder remaining in the exhaust gas are collected in the numerous pores provided therein, and only pure exhaust gas passes through. A ceramic filter to be;
A by-product that has a cylindrical shape with an open top and is detachably coupled to the bottom opening of the body, is caught on the ceramic filter and then freely falls or is forcibly separated from the outer surface of the ceramic filter by air pressure generated by a compressor and falls A by-product collection container for collecting powders; semiconductor process by-product dry collection device using a ceramic filter, characterized in that consisting of.

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