KR102545386B1 - Low temperature fast curing epoxy resin composition for improving high temperature moisture resistance - Google Patents

Abstract

The present invention relates to a low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance, and more particularly, to a low-temperature fast-curing epoxy resin composition using a polythiol isocyanate-based curing agent to improve high-temperature and high-humidity adhesive strength and high-temperature and high-humidity adhesive strength. It relates to a resin composition.
The present invention is a low-temperature fast-curing epoxy resin composition, a one-component epoxy composition comprising an epoxy resin, a polythiol curing agent and a curing accelerator, wherein the polythiol curing agent is included in 10 to 50 parts by weight based on 100 parts by weight of the epoxy resin, It is possible to provide a low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance, characterized in that it is polythiolisocyanate of the following formula (1) obtained by the reaction of a tetrafunctional thiol-based resin having four thiol groups and isocyanate. .
[Formula 1]

Description

Low temperature fast curing epoxy resin composition for improving high temperature moisture resistance}

The present invention relates to a low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance, and more particularly, to a low-temperature fast-curing epoxy resin composition using a polythiol isocyanate-based curing agent to improve high-temperature and high-humidity adhesive strength and high-temperature and high-humidity adhesive strength. It relates to a resin composition.

Epoxy resin is a thermosetting plastic having two or more epoxy groups in a molecule, and has excellent adhesion to metal materials, and has excellent physical properties after curing such as heat resistance and electrical insulation, and is used in adhesives, paints, and semiconductor packaging.

Such an epoxy resin undergoes a crosslinking reaction through heating, and as the crosslinking reaction proceeds at a temperature of 120° C. or higher, there is a problem in that thermal damage to components for electronic materials with low heat resistance, in particular, optical components used in cameras, cannot be avoided. .

In order to solve this problem, epoxy resin is a polythiol curing agent of a Thiol-Epoxy Reaction type curing method that cures very quickly even at low temperatures. was used for

However, epoxy resins are heat resistant when using conventional polythiol curing agents that require PCT (Pressure Cooker Test) evaluation of 85℃, Rh85% (relative humidity 85%) or high temperature, high humidity and high pressure for the high temperature and high humidity reliability evaluation criteria of electronic products. and high-temperature, high-humidity reliability is becoming a problem.

At this time, the thiol-based curing agent has the advantage of minimizing damage to parts for electronic materials due to fast curing at low temperature as it has fast curing characteristics, but has a weak moisture resistance and a problem in that adhesive strength is lowered in a high humidity environment. there is.

Republic of Korea Patent Publication No. 10-2016-0077132 (2016.07.01.)

The present invention has been made to solve the above problems, and an object of the present invention is cured at a low temperature to minimize damage caused by heat of electronic material components, and to maintain good adhesive strength in a high humidity environment. An object of the present invention is to provide an epoxy resin composition including a polythiol-based curing agent having improved curability and moisture resistance.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the present invention, according to a preferred embodiment of the present invention, is a one-component epoxy composition comprising an epoxy resin, a polythiol curing agent and a curing accelerator in a low-temperature fast-curing epoxy resin composition, wherein the above The polythiol curing agent is included in an amount of 10 to 50 parts by weight based on 100 parts by weight of the epoxy resin, polythiolisocyanate having a structure represented by Formula 1 obtained by reacting a tetrafunctional thiol-based resin having four thiol groups and isocyanate. It is possible to provide a low-temperature fast-curing epoxy resin composition for improving high-temperature moisture resistance, characterized in that the system.

[Formula 1]

According to a preferred embodiment, the epoxy resin is characterized in that it is selected from bisphenol F-type epoxy resins, rubber-based modified epoxy resins, and mixtures thereof.

According to a preferred embodiment, the curing accelerator is characterized in that it is selected from an imidazole compound, a solid dispersed amine adduct-based compound, and mixtures thereof that are solid at room temperature.

According to a preferred embodiment, the low-temperature fast-curing epoxy resin composition is characterized in that at least one selected from diluents, fillers, antifoaming agents, dispersants, thixotropic agents and pigments is added according to the use.

According to a preferred embodiment, the low-temperature fast-curing epoxy resin composition has a glass transition temperature (Tg) of 18 to 80 ° C, and high-temperature and high-humidity adhesive strength (Kgf, 85 ° C, Rh85% ) characterized in that the adhesive strength reduction rate of 4 to 17% or less.

As described above, the low-temperature fast-curing epoxy resin composition for high-temperature and moisture resistance according to the present invention includes a thiol-based curing agent and is rapidly cured at a low temperature, and has an advantage in that moisture resistance, which is a disadvantage of the thiol-based curing agent, is improved.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

With reference to the accompanying drawings below, specific details for the practice of the present invention will be described in detail. Like reference numbers refer to like elements, regardless of drawing, and "and/or" includes each and every combination of one or more of the recited items.

Terms used in this specification are for describing the embodiments and are not intended to limit the present invention. In this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. As used herein, "comprises" and/or "comprising" does not exclude the presence or addition of one or more other elements other than the recited elements.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used in a meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless explicitly specifically defined.

Hereinafter, preferred embodiments of the present invention will be described in detail.

The present invention relates to a low-temperature, fast-curing epoxy resin composition for improving high-temperature and moisture resistance, and is characterized by improved moisture resistance while rapidly curing at a low temperature as a one-component epoxy composition containing an epoxy resin, a polythiol curing agent, and a curing accelerator.

In the present invention, an epoxy resin, a polythiol isocyanate-based curing agent and a curing accelerator are main components, and may be configured by adding a diluent, a filler, an antifoaming agent, a thixotropic agent, a pigment, and the like depending on the use.

First, the polythiol curing agent is polythiolisocyanate of Formula 1 obtained by reacting a tetrafunctional thiol-based resin having four thiol groups with isocyanate.

[Formula 1]

The polythiol curing agent is a tetrafunctional thiol-based resin having four thiol groups, which is obtained by reacting (2,2-bis((3-(3-(isocyanatomethyl) with isocyanate using PETMP (Pentaerythritol tetrakis (3-mercaptopropionate))) )-3,5,5-trimethylcyclohexylcarbamoylthio)propanoyloxy)methyl)propane-1,3-diylbis(3-(3-(isocyanayomethyl)-3,5,5-trimethylcyclohexylcarbamoylthio)propanoate)) is preferably used.

The polythiol curing agent of the present invention is not only structurally stable as isocyanate is synthesized in each of the four thiol groups in PETMP, which is a tetrafunctional thiol-based resin, but also has improved moisture resistance and has high high temperature and high humidity adhesive strength.

The polythiol curing agent may be used by synthesizing one, two, or three isocyanates by varying the number of isocyanates in the thiol group, but when three are synthesized and used, the high-temperature and high-humidity adhesive strength is somewhat insufficient, and two or one There is a problem in that the hardness increases as the curing speed is too fast when the dog is synthesized and used.

In addition, the polythiol curing agent is preferably included in an amount of 10 to 50 parts by weight based on 100 parts by weight of the epoxy resin.

When the polythiol curing agent is included in less than 10 parts by weight, there is a problem in that the high temperature and high humidity adhesive strength is not maintained for a long time. There is a growing problem.

Next, the epoxy resin is selected from bisphenol F-type epoxy resins, rubber-modified epoxy resins, and mixtures thereof, but is not limited thereto.

The epoxy resin is a bifunctional or more functional compound having two reactive groups such as bisphenol A type epoxy resin, phenol novolac epoxy resin, alicyclic epoxy resin, urethane type epoxy resin, epoxy reactive diluents, solvent dilution type epoxy resin, and solid epoxy resin. It is preferable to use an epoxy resin.

According to a preferred embodiment, the epoxy resin is used by mixing a bisphenol F-type epoxy resin and a rubber-modified epoxy at a ratio of 7:3.

Specifically, the epoxy resin can compensate for the brittleness of the bisphenol F-type epoxy resin by mixing and using rubber-modified epoxy resin, which is a rubber-based resin, and when the ratio of the rubber-modified epoxy exceeds 3, the adhesive strength is reduced. When the ratio of the bisphenol F-type epoxy resin exceeds 7, there is a problem in that brittleness is reduced.

In addition, it is preferable to use two or more epoxy functional groups as the epoxy resin, and when used as a diluent, a resin having one epoxy functional group may be used.

The curing accelerator is selected from imidazole compounds that are solid at room temperature, solid dispersed amine adduct compounds, and mixtures thereof.

According to a preferred embodiment, the present invention can improve the adhesive force by using a polyamine adduct as the curing accelerator.

Here, the curing accelerator is a latent curing agent, and the latent curing agent means a compound that is insoluble in the epoxy resin at room temperature, but is solubilized by heating to function as a curing accelerator. The latent curing agent includes an amine-epoxy adduct system that is a reaction product of an amine compound and an epoxy compound, and a urea-type adduct system that is a reaction product of an amine compound and an isocyanate compound or a urea compound.

The imidazole compound that is a solid at room temperature is 2-heptadecylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-undecylimidazole, 2-phenyl-4-methyl-5 -Hydroxymethylimidazole, -Phenyl-4-benzyl-5-hydroxymethylimidazole, 2,4-diamino-6-(2-methylimidazolyl-(1))-ethyl-S- Triazine, 2,4-diamino-6-(2'-methylimidazolyl-(1)')-ethyl-S-triazine-isocyanuric acid adduct, 2-methylimidazole, 2- Phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole-trimellitate, 1-cyano Ethyl-2-phenylimidazole-trimellitate, N-(2-methylimidazolyl-1-ethyl)-urea, N,N'-(2-methylimidazolyl-(1)-ethyl)- Adipoyldiamide and the like can be used, but are not limited thereto.

Epoxy compounds used as one of the raw materials for the production of the solid-dispersible amine adduct-based latent curing accelerator (amine-epoxy adduct-based) are, for example, polyhydric phenols such as bisphenol A, bisphenol F, catechol, and resorcinol or polyglycidyl ether obtained by reacting a polyhydric alcohol such as glycerin or polyethylene glycol with epichlorohydrin; glycidyl ether esters obtained by reacting epichlorohydrin with hydroxycarboxylic acids such as p-hydroxybenzoic acid and β-hydroxynaphthoic acid; polyglycidyl esters obtained by reacting epichlorohydrin with polycarboxylic acids such as phthalic acid and terephthalic acid; glycidylamine compounds obtained by reacting epichlorohydrin with 4,4'-diaminodiphenylmethane or m-aminophenol; Further, polyfunctional epoxy compounds such as epoxidized phenol novolac resin, epoxidized cresol novolac resin, and epoxidized polyolefin; monofunctional epoxy compounds such as butyl glycidyl ether, phenyl glycidyl ether, and glycidyl methacrylate; etc. can be used, but is not limited thereto.

Among the above-mentioned amines, compounds having a tertiary amino group in the molecule are raw materials that provide latent hardening accelerators with excellent hardening accelerating ability, and examples of such compounds include, for example, dimethylaminopropylamine and diethylamino Amine compounds such as propylamine, di-n-propylaminopropylamine, dibutylaminopropylamine, dimethylaminoethylamine, diethylaminoethylamine, and N-methylpiperazine, 2-methylimidazole, 2-ethyl primary or secondary amines having a tertiary amino group in the molecule such as imidazole compounds such as imidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole; 2-dimethylaminoethanol, 1-methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-butoxymethyl-2-dimethylaminoethanol, 1-( 2-Hydroxy-3-phenoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-ethyl-4-methylimidazole, 1-(2- Hydroxy-3-butoxypropyl)-2-methylimidazole, 1-(2-hydroxy-3-butoxypropyl)-2-ethyl-4-methylimidazole, 1-(2-hydroxyl Roxy-3-phenoxypropyl)-2-phenylimidazoline, 1-(2-hydroxy-3-butoxypropyl)-2-methylimidazoline, 2-(dimethylaminomethyl)phenol, 2,4 ,6-tris(dimethylaminomethyl)phenol, N-β-hydroxyethylmorpholine, 2-dimethylaminoethanethiol, 2-mercaptopyridine, 2-benzoimidazole, 2-mercaptobenzoimidazole, 2- Mercaptobenzothiazole, 4-mercaptopyridine, N,N-dimethylaminobenzoic acid, N,N-dimethylglycine, nicotinic acid, isonicotinic acid, picolinic acid, N,N-dimethylglycine hydrazide, N,N-dimethyl alcohols, phenols, thiols, carboxylic acids and hydrazides having a tertiary amino group in the molecule, such as propionic acid hydrazide, nicotinic acid hydrazide, and isonicotinic acid hydrazide; etc. can be used.

In the present invention, in order to further improve the storage stability of the epoxy resin composition, when preparing the latent curing accelerator used in the present invention by addition reaction of the epoxy compound and the amine compound, two active hydrogens in the molecule as a third component An active hydrogen compound having the above may be added. Although the example of such an active hydrogen compound is shown below, it is not limited to this. That is, for example, bisphenol A, bisphenol F, bisphenol S, hydroquinone, catechol, resorcinol, pyrogallol, polyhydric phenols such as phenol novolak resin, polyhydric alcohols such as trimethylolpropane, adipic acid, phthalic acid, etc. polyhydric carboxylic acids, 1,2-dimercaptoethane, 2-mercaptoethanol, 1-mercapto-3-phenoxy-2-propanol, mercaptoacetic acid, anthranilic acid, lactic acid, and the like.

The solid dispersion type amine adduct type latent curing accelerator curing accelerator used in the present invention. As another isocyanate compound used as a raw material for production, for example, n-butyl isocyanate, isopropyl isocyanate, phenyl isocyanate, benzyl isocyanate, etc. functional isocyanate compounds; Hexamethylene diisocyanate, toluylene diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane-4,4'-diisocyanate, isophorone diisocyanate, xylylene diisocyanate, paraphenylene diisocyanate, 1,3,6 - Polyfunctional isocyanate compounds such as hexamethylene triisocyanate and bicycloheptane triisocyanate; Moreover, terminal isocyanate group containing compound obtained by reaction of these polyfunctional isocyanate compounds and an active hydrogen compound; etc. can be used. Examples of such a terminal isocyanate group-containing compound include an addition compound having a terminal isocyanate group obtained by reaction of toluylene diisocyanate and trimethylolpropane, and an addition compound having terminal isocyanate group obtained by reaction of toluylene diisocyanate and pentaerythritol. Compounds and the like may be used, but are not limited thereto.

In addition, the urea compound may use urea, thiourea, etc., but is not limited thereto.

Next, in the present invention, it is preferable to add at least one selected from diluents, fillers, antifoaming agents, dispersing agents, thixotropic agents and pigments depending on the use.

As the filler, natural silica, synthetic silica, alumina, calcium carbonate, etc. may be used as a generally used filler. According to a preferred embodiment, the filler is a mixture of calcium carbonate and fumed silica.

Specifically, by using 16 parts by weight of calcium carbonate and 3 parts by weight of fumed silica relative to 100 parts by weight of the epoxy resin, moisture resistance can be improved within a range that does not damage substrates including parts for electronic materials.

In addition, in the present invention, in addition to fillers, antifoaming agents, dispersants, thixotropic agents, and pigments, it is also possible to add additives such as release agents, colorants, binders, modifiers, and flexibility imparting agents that are generally added without departing from the scope of the present invention.

Additives containing acidic substances such as carboxyl groups that hinder the anion curing reaction of epoxy in silane-based adhesion promoters, colorants, dispersants, antifoaming agents, flame retardants, etc. may be somewhat limited, and latent curing accelerators may be dissolved It can be carried out with various changes except for substances such as benzene, toluene, acetone, MEK, and solvents such as alcohols that impair storage stability.

That is, the present invention can improve moisture resistance by using a polythiol curing agent mixed with polythiol isocyanate, and when measuring the high-temperature and high-humidity adhesive strength (Kgf, 85 ℃, Rh 85%) with a high-temperature and high-humidity environment tester, initial adhesion The adhesive strength reduction rate of the adhesive strength after 240 hours after being put into the high-temperature, high-humidity environment test device compared to the strength is 4 to 17% or less, and the adhesive strength can be maintained for a long time even in a high-temperature, high-humidity environment.

In addition, the present invention can maintain adhesive strength in a high-temperature, high-humidity environment, and has a low glass transition temperature, making it suitable for use as an adhesive in fields requiring impact resistance.

At this time, the adhesive using the present invention preferably has a glass transition temperature of 18 to 80 ° C, more preferably 18 to 65 ° C.

As the present invention has a low glass transition temperature (Tg) in the range of 18 to 80 ° C., when used as an adhesive, it can be used as an adhesive in areas requiring impact resistance, such as parts for electronic materials that can be damaged by impact. Suitable for use as an adhesive, on the other hand, in the case of an epoxy resin having a high glass transition temperature, heat resistance is improved, but the hardness of the resin to be adhered to or coated on the substrate is high, so it does not meet the impact resistance against dropping impact.

In addition, the present invention can be used as a sealant for electronic parts or a raw material thereof in addition to adhesives.

Hereinafter, the configuration and operation of the present invention will be described in more detail through preferred embodiments, comparative examples, and experimental examples of the present invention. However, the following examples are provided to aid understanding of the present invention, and the scope of the present invention is not limited to the following examples. Contents not described herein can be technically inferred by those skilled in the art, so description thereof will be omitted.

Example 1

70 g of bisphenol F-type epoxy resin and 30 g of rubber-modified epoxy resin were used as the epoxy resin in the one-component, low-temperature, fast-curing epoxy composition, and 10 g of polythiol isocyanate and 67 g of tetrafunctional thiol were used as the polythiol curing agent, and polyamine adduct was used as a curing accelerator. 12 g was used, and the filler used was 16 g of calcium carbonate and 3 g of fumed silica compared to 100 g of epoxy resin, and mixed using a 3-roll milling machine in the composition ratio shown in Table 1 After stirring for 30 minutes at 1 bar, it was prepared by vacuum defoaming.

Example 2

An epoxy resin was prepared in the same manner as in Example 1, but 15 g of polythiol isocyanate and 57 g of tetrafunctional thiol were used as the polythiol curing agent, as shown in Table 1.

Example 3

An epoxy resin was prepared in the same manner as in Example 1, but 25 g of polythiol isocyanate and 47 g of tetrafunctional thiol were used as the polythiol curing agent, as shown in Table 1.

Example 4

An epoxy resin was prepared in the same manner as in Example 1, but 40 g of polythiol isocyanate and 32 g of tetrafunctional thiol were used as the polythiol curing agent, as shown in Table 1.

Example 5

An epoxy resin was prepared in the same manner as in Example 1, but 22 g of polythiol isocyanate and 12 g of tetrafunctional thiol were used as the polythiol curing agent, and are shown in Table 1.

Comparative Example 1

An epoxy resin was prepared in the same manner as in Example 1, but 0 g of polythiol isocyanate and 72 g of tetrafunctional thiol were used as the polythiol curing agent, as shown in Table 1.

Experimental example

The physical properties of the epoxy resins prepared according to Examples 1 to 5 and Comparative Example 1 were measured by the following experimental methods.

(1) Glass transition temperature (Tg): A specimen was prepared with 0.1 g of the composition, and the specimen cured by heating in a circulation oven at 80 ° C for 50 minutes using a thermal analyzer, TMA (TA), was heated at -20 ° C to 150 °C. Tg was measured by analyzing at a heating rate of 10/min to ℃.

(2) High-temperature and high-humidity adhesive strength (kgf): The adhesive specimen was hardened by heating in a circulation oven at 80 ° C for 50 minutes using slide glass (thickness 1mm) and NTB plastic (7.45mm × 7.45mm, thickness 0.4mm). and the initial adhesive strength was measured at room temperature in a shear strength test mode. Then, the adhesive strength was measured after being placed in a high-temperature, high-humidity environment tester under conditions of 85 ° C and 85% Rh, and left for 120 hr and 240 hr. showed up

division Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 epoxy resin Bisphenol F-type
Epoxy resin (g) 70 70 70 70 70 70 rubber-based modification
Epoxy resin (g) 30 30 30 30 30 30 polythiol
curing agent polythiol
isocyanate
(g) 10 15 25 40 50 0 tetrafunctional thiol (g) 67 57 47 32 22 72 hardening accelerator polyamine adduct
(g) 12 12 12 12 12 12 filler fumed silica
(Fumed silica)
(g) 3 3 3 3 3 3 Calcium Carbonate (g) 16 16 16 16 16 16 Property evaluation result Glass transition temperature (Tg, TMA) 35 43 47 55 65 28 High-temperature, high-humidity adhesive strength
(Kgf) Early 9.2 9.7 10.1 8.2 7.6 8.5 120hr 8.6 9.1 9.5 7.9 7.8 7.4 240hrs 7.6 8.5 9.2 7.8 7.2 6.3 Decrease rate (%) 17.1 12.6 9.1 4.4 5.2 26.1

The present invention applies polythiol isocyanate, which is a polythiol curing agent obtained by the reaction of a tetrafunctional thiol-based resin and isocyanate, so that the epoxy resin composition is rapidly cured at a low temperature, and at the same time, high-temperature moisture resistance that compensates for the moisture resistance, which is a disadvantage of polythiol-based curing agents, is provided. This improved low-temperature fast-curing epoxy resin composition is intended to be prepared.

As shown in Table 1, in Examples 1 to 5, the reduction rate of high-temperature and high-humidity adhesive strength was greatly improved when polythiol isocyanate was mixed and used than when tetrafunctional thiol was used alone (Comparative Example 1), It can be confirmed that polythiol isocyanate improves moisture resistance in a high-temperature, high-humidity environment.

In addition, in Examples 1 to 5, in order to improve moisture resistance in a high temperature and high humidity environment, polythiol isocyanate is required in an amount of at least 10 parts by weight based on 100 parts by weight of the epoxy resin, preferably 10 to 50 parts by weight based on 100 parts by weight of the epoxy resin. It can be confirmed that the weight part should be included.

It can be seen that the adhesive strength of the polythiol curing agent increases at high temperature and high humidity as the contents of polythiol isocyanate and tetrafunctional thiol are adjusted, and when 25 parts by weight of polythiol isocyanate and 47 parts by weight of tetrafunctional thiol are used, the adhesive strength increases, and the high temperature and high humidity It can be seen that the adhesive reliability is improved as the adhesive strength decrease rate of the adhesive strength (85 ℃, Rh 85%, 240 hours) is lowered and the adhesive strength can be maintained for a long time.

It can be seen that the present invention has a low glass transition temperature (Tg) in the range of 18 to 80 ° C in Examples 1 to 5, and accordingly, the epoxy resin composition according to the present invention is an electronic material requiring impact resistance including drop impact. It can be confirmed that it is suitable for use as an adhesive in fields such as parts for use.

In addition, the low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance of the present invention may be prepared by a general manufacturing process by mixing a conventional epoxy resin composition with a polythiol curing agent and an epoxy resin of the present invention, and the scope of the present invention It is also possible to add generally added fillers, colorants, binders, modifiers, etc., as long as they do not deviate from the above.

Although the embodiments of the present invention have been described with reference to the above and accompanying drawings, those skilled in the art to which the present invention pertains can implement the present invention in other specific forms without changing the technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Claims (5)

In the low-temperature fast-curing epoxy resin composition,
A one-component epoxy composition comprising an epoxy resin, a polythiol curing agent and a curing accelerator,
The epoxy resin is used by mixing a bisphenol F-type epoxy resin and a rubber-modified epoxy resin in a ratio of 7: 3,
The curing accelerator uses a solid dispersion type polyamine adduct,
The polythiol curing agent
It contains 10 to 50 parts by weight compared to 100 parts by weight of the epoxy resin,
It is polythiolisocyanate of formula 1 obtained by the reaction of a tetrafunctional thiol-based resin having four thiol groups and isocyanate, and the polythiol curing agent synthesizes isocyanate on each of the four thiol groups of the tetrafunctional thiol-based resin. It is not only structurally stable, but also has improved moisture resistance and has high temperature and high humidity adhesive strength.
The low-temperature fast-curing epoxy resin composition has a glass transition temperature (Tg) of 18 to 80 ° C, and the adhesive strength reduction rate after 240 hours of high-temperature and high-humidity adhesive strength (Kgf, 85 ° C, Rh85%) is 4 A low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance, characterized in that 17% or less.
[Formula 1]

delete delete According to claim 1,
The low-temperature fast-curing epoxy resin composition is a low-temperature fast-curing epoxy resin composition for improving high-temperature and moisture resistance, characterized in that at least one selected from diluents, fillers, antifoaming agents, dispersants, thixotropic agents and pigments are added according to the use. delete