KR102544674B1 - Non-contact metal card structure - Google Patents

Abstract

A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer comprising a module antenna and It has overlapping slits (S), and the slits are oriented differently. One metal layer may be a front card body (FCB, CF1), and another layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).

Description

Non-contact metal card structure

This disclosure broadly covers RFID that can operate in "contactless" mode (ISO 14443 or NFC/ISO 15693), including dual interface (DI) smartcards that can also operate in "contact" mode (ISO 7816-2). (radio frequency identification) wearable devices with chips or chip modules (CM) (activity tracking bands, watches, smart jewelry, rings, bangles, cuffs, bracelets, talisman charms, lockets (locket, etc.), RFID-enabled SIM cards (or payment cards, e-tickets, chip cards, etc.), “payment objects” (or “payment devices”) such as financial payment cards, “affluent metal cards”. , or "smartcard", and more particularly to mechanical and electrical connection to a spiral of wire or loop(s) of wire, such as a charm bracelet in payment applications, or to a tag, token , a transponder chip module (including a transponder chip module with an integrated coupling frame (CF) suitable for implantation, embedding, insertion or placement in laminated metal layers, metal casings, metal housings, smart cards) TCMs), coupling frame antennas (CFAs), coupling frames (CFs), transponder chip modules (TCMs), or antenna modules (AM).

The technology disclosed herein can be applied to data carriers that work closely with contactless readers, small form factor tags, tokens, mobile phones, wearable devices, key-fobs, security badges, travel frequency RFID devices including “non-secure smart cards and tags” such as frequent traveler cards, loyalty cards, access control cards, medical alert tags, hotel room keys in the form of metal cards, contactless cards in the form of key cards, etc. may be applicable.

A smart card is an example of an RFID device having an antenna module (AM) or transponder chip module (TCM) disposed within an inlay substrate or card body (CB).

When operating in contactless mode, the passive antenna module (AM) or transponder chip module (TCM) can be powered by RF from an external RFID reader, and can also communicate with the external RFID reader by RF.

The Dual Interface Antenna Module (AM) or Transponder Chip Module (TCM) is the “face-up side” or “contact side” ( or a contact pad array (CPA) comprising typically 6 or 8 contact pads (CP or “ISO pads”) disposed on a surface). A connecting bridge (CBR) may be placed on the front side of the tape to make a connection between two components, such as an RFID chip and a module antenna on the other face-down side of the module tape.

A conventional antenna module (AM) or transponder chip module (TCM) is generally rectangular, has four sides, and measures 8.2 mm × 10.8 mm for a 6-contact module and 11.8 mm × 13.0 mm for an 8-contact module. can be roughly measured with As disclosed herein, a generally rectangular transponder chip module (TCM) may have a larger or smaller form factor than a conventional transponder chip module (TCM). Alternatively, the transponder chip module (TCM) may be round, oval or other non-rectangular shape.

A module antenna (MA) may be placed on the module tape (MT) to implement contactless interfaces such as ISO 14443 and NFC/ISO 15693. Contact pads CP may be disposed on the module tape MT to implement a contact interface such as ISO 7816. The module antenna MT may be wire-wound or etched, for example as follows:

- The module antenna (MA) may contain several turns of wire, such as a 50 μm diameter insulated wire. See US 6378774 (2002, Toppan), eg Figures 12A, B thereof.

- The module antenna (MA) may be a chemically etched planar antenna (PA) structure. See US 8100337 (2012, SPS), eg FIG. 3 thereof.

- The module antenna (MA) may be a laser etched planar antenna (PA) structure. See US 9272370 (2016, AmaTech).

A planar antenna (PA) structure, or simply “planar antenna (PA)”, whether chemically etched (CES) laser etched (LES), is a type of antenna structure (AS) and encloses the RFID chip on the backside of the module tape ( It may include a long conductive trace or track with two ends disposed in the outer region of the MT) and in the form of a planar rectangular spiral. This creates many traces or tracks (actually one long spiral trace or track) separated by space (actually one long spiral space). The track (or trace) width may be approximately 100 μm. The planar antenna can be fabricated on something other than the module tape, such as a separate substrate, and can be bonded with the module tape.

A module antenna (MA) typically connected to an RFID chip (CM) on a substrate or module tape (MT) may be referred to as a "transponder chip module" or simply a "transponder" or "module". Reference may be made to US 9489613, US 9475086 and US 9390364 for examples of transponder chip modules (and coupling frames).

A general object of the present invention is to provide a technique for integrating a passive transponder chip module into an RFID device such as (but not limited to) a smart card.

Another object of the present invention is to provide an improved combination of a contactless reader and a smartcard (such as a dual interface smartcard and an RFID device including a metal or metallized smartcard).

A transponder chip module (TCM) as used herein may generally include an RFID chip and module antenna disposed on one side (rear side) of the module tape and contact pads on the opposite side (front side) of the module tape. Discussion can be made of passive transponder chip modules that operate primarily or exclusively in the main, contactless mode (eg ISO 14443, 15693). However, the techniques disclosed herein may be applicable to dual interface transponder chip modules capable of operating in both non-contact and contact mode (eg, ISO 7816).

In accordance with the present invention, in general, an RFID device comprises (i) a transponder chip module (TCM) having a module antenna (MA) and an RFID chip (IC), and (ii) an aperture (MO) and a slit for receiving the TCM. It includes a coupling frame (CF) having (S). The coupling frame may be placed very close to the transponder chip module such that the slits and openings overlap the module antennas. The RFID device may be a payment object such as an ISO metal card body having a slit (S) for functioning as a coupling frame.

A coupling frame (CF) coupled with a transponder chip module (TCM) may provide inductive coupling with a contactless reader or point of sale (POS) terminal or other RFID device. Coupling frames (CFs) combined with transponder chip modules (TCMs) can enhance (including enable) or enhance contactless communication between transponder chip modules and contactless terminals.

As used herein, “coupling frame” (CF) is a metal layer, a metal frame, having an electrical discontinuity in the form of a non-conductive stripe or slit (S) extending from the outer edge of the layer to its interior location; It may comprise a metal plate or any electrically conductive medium or surface, and the coupling frame (CF) has slits (S) for example on at least one side thereof the module antenna (MA) of the transponder chip module (TCM). It may be oriented to overlap (cross over) with. The slit S may be straight and may have a width and a length. In some embodiments, the slit S may extend into the opening MO for receiving the transponder chip module. In another embodiment, there may be only a slit for a transponder chip module (TCM) and no opening. A coupling frame of this type, generally a layer of metal having an opening for receiving a transponder chip module and a slit extending into the opening from the periphery of the layer, where the slit overlaps at least part of the module antenna, US 9812782, US 9390364, US 9634391, US 9798968, and US 9475086.

The overlap of the module antenna and the slit may be less than 100%. In addition, the width and length of the slit can greatly affect the resonant frequency of the system and can be used as a tuning mechanism. As the width of the slit changes, a change in overlap between the slit and the antenna occurs.

In use, the coupling frame is placed in close proximity to the transponder chip module, such as on top of the module, such that a slit (or other discontinuity) overlaps at least a portion of the module antenna of the transponder chip module, so that the coupling frame is contactless with the reader. Strengthen (including activation) the coupling between the transponder chip module and other RFID devices such as If the slit is not heavily chipped with the antenna, communication with the transponder chip module may be inhibited (or inhibited, including deactivation). The coupling frame may be integrated into an RFID device such as a smart card, may constitute substantially the entire body of a metal smart card, may be integrated into a transponder chip module, and may include components of a payment object. .

In order to meet the communication requirements of a given smartcard application, for example with respect to maximum communication read/write range, the chip (IC) must have a minimum power level delivered to it. The module antenna (MA) inductance, resistance and capacitance all affect the power level delivered to the chip (IC). At maximum communication distance from the reader antenna, the module antenna (MA) delivers the minimum chip (IC) power level. The better the performance of a given chip (IC) and a given module antenna (MA), the longer the maximum communication distance of the transponder chip module (TCM) to the reader antenna.

The present disclosure also relates to a passive RFID device operating on the principle of inductive coupling to achieve data communication and harvest energy from and to a contactless reader and to drive an active element, particularly for integration into payment and identification objects. It is about.

In their various embodiments, the invention(s) described herein may be used in RFID applications, payment smart cards, payment smart cards with dynamic displays, identity cards, loyalty cards, access control cards, payment objects, wearable devices. It may be related to industries and commercial industries such as , smart jewelry, and the like.

According to the present invention, generally a metal smart card (SC) has a transponder chip module (TCM) with a module antenna (MA) and a card body (CB) comprising two discontinuous metal layers (ML), each layer has a slit (S) overlapping the module antenna, and the slits are oriented differently. One metal layer may be the front card body (FCB, CF1) and the other layer may be the rear card body (RCB, CF2) with magnetic stripe (MS) and signature panel (SP).

The present invention focuses on the arrangement of the metal layer as a coupling frame in the card body of the smart card. Typically, the transponder chip module is added to the smart card after the card body has already been manufactured.

According to some embodiments of the present invention, the metal smart card may include at least two metal layers each having a slit (S) and functioning as a coupling frame (CF). For example, the card body of a smart card is:

A first metal layer (ML, FCB) having a first slit (S1) extending from an outer edge to a first module opening (MO1) for receiving a transponder chip module (TCM) - the first metal layer is a first couple Functioning as a ring frame CF1 -; and

A second metal layer (ML, RCB) having a second slit (S2) extending from the outer edge to the second module opening (MO2) for receiving the transponder chip module (TCM) - the second metal layer is the first couple Functioning as a ring frame (CF2) -; may include,

The two coupling frames CF1 and CF2 mechanically support each other, especially around the two slits S1 and S2 and the module opening MO.

The slits S1 and S2 in the various metal layers CF1 and CF2 may overlap a portion of the module antenna MA of the transponder chip module TCM, respectively. The slits in the different metal layers may be oriented or positioned differently such that they are not aligned with each other.

The first metal layer may be provided with a recess for receiving the second metal layer. The two metal layers may be separated by a layer of non-conductive material such as an adhesive film.

The second metal layer may form the rear surface of the smart card, and may include a magnetic strip (MS); signature panel (SP); And it may include (support) any one or all of holograms.

One or both of the coupling frames (CF1, CF2) can be connected to the device to supply power to the circuit or to improve the read/write performance of the smart card with a reader.

The second module opening (MO2) of the second metal layer (CF2) is an elongated, contoured or looped slit (S2) or multi-slit to improve the overall mechanical stability of the smart card. (S) may be substituted.

The smartcard and transponder chip module may be passive, harvesting power from an external reader.

The module antenna of the transponder chip module may include a planar antenna comprising one long conductive track arranged in a helical pattern.

The front card body (FCB) may have a thickness of 760 μm to 800 μm.

The rear card body RCB may have a thickness of 300 μm to 400 μm.

As a result, smartcards can operate in both contact and contactless modes. Contact mode is facilitated by contact pads on the front of the smartcard. However, it is generally preferred that smartcards be intended (and used) only in contactless mode.

It should be understood that the metal smartcards described herein are “predominantly” metal and may include other materials such as protective layers, signature panels, transponder chip modules themselves, inks, and the like.

In their various embodiments, the invention(s) described herein may be useful in industry and commerce, such as RFID applications, payment smart cards, loyalty cards, gift cards, hotel key cards, identification cards, access control cards, wearable devices, and the like. it may be about

Other objects, features and advantages of the invention(s) disclosed herein, and various embodiments thereof, may become apparent in light of the description of some exemplary embodiments that follow.

With detailed reference to embodiments of the present disclosure, a non-limiting example thereof may be shown in the accompanying drawings (Figures). Some drawings may be in the form of diagrams. Some elements in the drawings may be exaggerated for clarity of illustration, and other elements may be omitted.
Any text appearing in the figures (legends, notes, reference numbers, etc.) is hereby incorporated by reference.
Some elements are represented by letters (“AM”, “BA”, “CB”, “CCM”, “CM”, “MA”, “MT”, “PA”, “TCM”, etc.) instead of or in addition to numbers. can appear Some similar (including substantially identical) elements of various embodiments may be similarly numbered by other letters such as "A", "B", "C", etc., or variations thereof, given a number such as "310";("310A","310B","310C"), or simply as a number ("310"), collectively (all at once) or individually (one at a time).
The drawings presented herein may depict other embodiments of an RFID device, such as a smart card, a solid metal card, a plastic hybrid metal card (also referred to as an embedded metal card) or a payment object such as a wearable device. Some of the drawings may omit components such as a transponder chip module or a module antenna for clarity of illustration. Some of the drawings may only show components of the RFID device, such as the coupling frame.
1 is a diagram (cross-sectional view) of a dual interface smart card (SC) and reader.
Fig. 2a is a diagram (sectional view) showing a coupling frame of a card body of a smart card.
2B is a diagram (partial perspective view) showing a smart card with a metal card body modified to function as a coupling frame.
Figure 3a is a schematic view of the front side of a smartcard (SC), which may be a metal card or a composite metal card with a slit (S) serving as a coupling frame (CF).
Fig. 4a is a diagram (perspective view) showing the assembly of a metal smartcard consisting mainly of two coupling frames (CF) with slits (S) featuring inserts to hide the module openings (MO).
FIG. 4B is a diagram showing the shape and features of a rear card body (RCB) featuring a module opening (MO), slits (S) and recesses for receiving a magnetic stripe (MS) and signature panel (SP) ( rear view).
Fig. 5a is a diagram (perspective view) showing the assembly of a metal smart card consisting mainly of two coupling frames (CF) with slits (S) omitting a module opening (MO) at the rear of the smart card.
5B is a diagram (rear view) showing the shape and features of a rear card body (RCB) featuring an extended slit (S) and recess for receiving a magnetic stripe (MS) and signature panel (SP). .
Figure 6a is a diagram (perspective view) showing the assembly of a metal smartcard mainly consisting of two coupling frames (CF) with parallel slits (S) omitting the module opening (MO) at the rear of the smartcard.
FIG. 6B is a diagram of the rear of a metal smartcard featuring a rear card body (RCB) panel comprising an extended slit (S) and recess for receiving a magnetic stripe (MS) and signature panel (SP) (rear side). is also).

Various embodiments (or examples) may be described to explain the teachings of the invention(s) and should be construed as illustrative rather than limiting. It should be understood that the invention(s) is not intended to be limited to these specific examples. It should be understood that some individual features of the various embodiments may be combined with each other in other ways than shown. Reference herein to "one embodiment," "an embodiment," or similar formulation may mean that a particular feature, structure, operation, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. there is. Some embodiments may not be explicitly designated as such (“Examples”).

The embodiments and aspects may be described and illustrated in connection with illustrative and illustrative systems, apparatus and methods without limiting their scope. Certain configurations and details may be set forth in order to provide an understanding of the invention(s). However, it is apparent to one skilled in the art that the invention(s) may be practiced without some of the specific details set forth herein. In addition, some well-known steps or components may be generally described or even omitted for illustrative clarity. An element referred to in the singular (e.g., “widget”), unless expressly stated otherwise (e.g., one or just one widget”), is not plural instances of the element (e.g., “at least one widget”). ”) can be interpreted as including the possibility of

In the following description, some specific details may be set forth in order to provide an understanding of the invention(s) disclosed herein. It is apparent to one skilled in the art that the invention(s) may be practiced without these specific details. Any dimensions or materials described herein are approximate and are to be regarded as illustrative unless otherwise indicated. Headings (usually underlined) may be provided as an aid to the reader and should not be construed as limiting.

Some processes can be presented and described as a series of steps (sequences). It is to be understood that the sequence of steps is exemplary and that the steps may be performed in an order different from that presented, that some steps described may be omitted, and that some additional steps may be omitted from the sequence and described elsewhere. .

Reference may be made to the disclosures of prior patents, publications and applications. Some text and figures from these sources may be presented herein, but may be modified, edited, or annotated so as to blend more seamlessly with the disclosure of this application. Citation or identification of any reference is not to be construed as an admission that such reference is available as prior art to the present disclosure.

1 is a diagram (sectional view) of a conventional dual interface smart card (SC) and reader as an example of an RFID device. This RFID device is “dual interface” because it can interact with external contact readers (eg ISO 7816) or non-contact readers (eg ISO 14443, 15693).

The diagram shows a smart card (SC) 100 in cross section with a contact reader (eg ISO 7816) and a non-contact reader (eg ISO 14443). The antenna module (AM, or transponder chip module TCM) 102 includes a module antenna (MA) 114 for interfacing with a non-contact reader and a module tape (MT) 110, one side (rear side) of the module tape (MT) ) may include an RFID chip (CM or IC) 112 disposed on. The antenna module (AM) may include contact pads (CP) 116 disposed on the other side (front side) of the module tape (MT) for interfacing with the contact leader. The card body (CB) 120 may include a substrate having a recess (R) 122 extending on one side thereof for receiving an antenna module (AM). (Recess (R) may be stepped, such as wider at the surface of card body (CB) to accommodate the profile of antenna module (AM).) Booster antenna (BA) 130 is (i) a card antenna (CA) component 312 and (ii) a coupler coil (CC) component. (314). It can be noted that as a result of the recess R being stepped, part of the card body CB may extend below the antenna module AM, more specifically the module antenna MA.

In the following, an RFID device having mostly only a non-contact interface (and no contact interface) is described. In the following, most RFID devices having a coupling frame rather than a booster antenna can be described.

coupling frame

According to some embodiments of the present invention, the booster antenna in an RFID device may be removed or replaced with a “coupling frame” (CF). Generally, the overall function of both the booster antenna and coupling frame is to enable (enhance) coupling and communication between the transponder chip module (TCM) and an external contactless reader (or other RFID device).

As used herein, a coupling frame generally includes a conductive planar surface or element (such as a conductive layer or conductive foil) having an outer edge and a slit (S) extending from the outer edge of the conductive surface to its interior location or It may contain discontinuities such as non-conductive stripes. The coupling frame may be a curved surface rather than a flat surface.

Most of the coupling frames described herein may have a "continuous" surface, with slits (electrical discontinuities) for overlapping the module antenna and, in some embodiments, for accommodating mounting of transponder chip modules. It may comprise a foil or sheet or layer of metal having suitable openings (MO). Coupling frames can be printed, fabricated from wire grids or arrays (such as embedded wires (copper or silver)) and physical connections can be made through overlapping wires to create the coupling frame. The coupling frame may be a metal mesh.

When referring to the overall coupling frame being "continuous", it should be understood that the slits S represent points of discontinuity both mechanically and electrically. A “discontinuous” coupling frame may be fabricated from embedded wires in a pattern suitable for a solid metal layer or substrate, all of which may be arranged to represent slits/discontinuities.

In use, the slit S is placed very adjacent to (very close to or side-by-side) the transponder chip module (TCM) with the module antenna (MA) such that the slit (S) overlaps (transversely, above or below) at least a portion of the module antenna. It can be. For example, the slit S may extend from a location outside the module antenna across (or overlap) at least a portion of the traces of the module antenna, such as extending over all traces on one side of the module antenna. It can be further extended into the inner realm (no-man's land).

In use, the coupling frame CF may be positioned such that the slit S overlaps or intersects at least a portion of the trace of the module antenna MA on at least one side thereof. The slit S may extend at least partially, including completely across only one side of the module antenna, further across a central region ("no man's land") of the module antenna (no trace) to the opposite side of the module antenna. can be extended Both the coupling frame and module antenna are substantially planar, positioned very close to each other, parallel to each other, and may be separated by an air gap or dielectric layer of no more than 10 μm, 50 μm or 20 μm. In general, the closer the coupling frame is to the module antenna (smaller separation), the better the communication with the external contactless reader (eg read/write performance) will be. As the separation distance increases, read/write performance may degrade.

The coupling frame can improve communication (signal, power) between the external contactless reader and the transponder chip module when the slit crosses (crosses) the trace of the module antenna on at least one side thereof.

The transponder chip module is integrated into an RFID device, which is usually a smartcard (plastic smartcard, metal smartcard, metal veneer smartcard, hybrid smartcard). The coupling frame may be integrated into the smart card. See US 9,475,086. The coupling frame frame can be integrated into the transponder chip module itself. See US 9,390,364. As disclosed herein, the transponder chip module may be incorporated into other RFID devices such as wearable devices, smart jewelry, and payment objects including payment accessories.

A coupling frame may be incorporated into the metal payment device to enable contactless communication. A coupling frame may be incorporated into any RFID device having multiple transponder chip modules to selectively enable communication with a given one of the transponder chip modules. Multiple coupling frames may be incorporated into a given RFID device. The coupling frame can replace (if necessary remove) the booster antenna in the RFID device.

Integration of the coupling frame into the RFID device

According to the invention, generally the transponder chip module (with or without its own coupling frame) can be integrated into an RFID device such as a smartcard or payment object. The device may configure a passive transponder.

- The smart card may include a metal layer that is deformed (typically with a properly positioned slit for the module antenna) to serve as a coupling frame.

- The entire metal card body of the metal smart card may be provided with slits (S or other discontinuous points) to function as a coupling frame.

- The entire metal card body of a metal smartcard may be provided with slits (S or other discontinuous points) with inserts or interlocking metal panels, each insert or interlocking metal panel having a slit (S or other discontinuous points). branch) may be provided.

- The metal layer (having a dielectric layer and a metal layer) of the hybrid smartcard may be provided with slits (S or other discontinuous points) to act as a coupling frame.

- the payment object may include a "wearable" device embodied as a jewelry item, bangle, bracelet, etc. having a deformed metal component (typically with a properly positioned slit for the module antenna) to function as a coupling frame; can

- The card body can be made of aluminum and can be painted directly through an anodizing procedure. Jewelry items can be manufactured to have a rustic appearance that will wear (rust) during use so that the appearance of the product improves over time.

The metal layer of the metal hybrid smart card (aka embedded metal card) may include a metal core having two metal layers with slits located in different directions (including opposite directions) or offset from each other (including in the same direction), and , the metal layer is electrically insulated by a dielectric such as a screen printed adhesive film or a pre-assembled adhesive/plastic laminate. Alternatively, the metal layer may have a recess milled or etched in one side over the area of the slit to accommodate the reinforcing structure around the area of the slit S to prevent bending of the finished card.

A metal jewelry item with a transponder inside can act as a payment object. To insert a transponder into a metal case or metal amulet, the metal usually acts like a Faraday cage where all electromagnetic transmission and reception is degraded. As disclosed herein, by providing slits or slots (or insulating strips or stripes) in a metal component of a metal amulet, the component can function as a coupling frame. A transponder device (with or without its own coupling frame incorporated therein) may be positioned, embedded or inserted into the metal charm and may couple with the metal charm which eventually couples with an external contactless reader that generates an electromagnetic field. there is.

Contactless communication between the RFID chip of the transponder chip and an external RFID reader or other RFID device may be enhanced or enabled by incorporating the coupling frame into the device.

The slits (S) in the coupling frame may be linear (straight) or curved and may have a width of approximately 20 microns, 50 microns, 100 microns, 500 microns, 1-2 mm and a length of approximately 8-13 mm, but may have other dimensions and form factor. The slits S may be arranged to overlap (cross) the traces of the module antenna at 90° or other angles. The slit S may be other than a straight line.

The slit S may be camouflaged as part of the card artwork, or the existence of the card may be made invisible (hidden or inconspicuous) by applying lacquer and ink. Slits S may be widened to facilitate display of artwork or to form visible decorative features, and the area of the slits may be filled with decorative panels, which may be of a different material, texture or color than the other elements of the card.

It should be understood that the coupling frame may be on a different plane than the module antenna. The slit in the coupling frame extends into the inner region (no man's land) of the module antenna and overlaps all turns of the module antenna on one side thereof, including external turns (or traces) of at least a portion of the module antenna on one side thereof. may overlap or intersect with The slit may be long enough to overlap one or more turns of the module antenna on the opposite side of the module antenna. The slit may be wide enough to overlap one or more internal turns of the module antenna on one or more adjacent face(s) of the module antenna.

The transponder chip module (with or without its own coupling frame) may be integrated into an RFID device, which may be a smartcard or other payment object.

The coupling frame may be movable to selectively enable (enhance) or disable (inhibit) communication with a transponder chip module integrated into the RFID device. The coupling frame may be associated with more than one transponder chip module in a single RFID device and may be movable such that one or the other of the transponder chip modules is selectively activated, or none of the transponder chip modules is selectively activated. can

2A shows an example of a smartcard 200 having a coupling frame (CF) 220 integrated into a card body (CB) 202 having a stepped recess (R). The transponder chip module (TCM) 210 has a planar antenna (PA), which may be a laser etched antenna structure (LES). The coupling frame (CF) has an opening (MO) 208 for receiving the transponder chip module (TCM). It may have an extending slit (not visible). The dotted line schematically indicates that the coupling frame may include a metal layer in the lamination of the card body. The inner edge of the coupling frame (CF) will overlap with the external rotation of at least a portion of the module antenna (MA), which can be a planar antenna (PA), which is a laser etched antenna structure (LES) in the transponder chip module (TCM) ( or can be crushed). When viewed from another point of view, the outer portion of the module antenna MA may protrude from the inner portion of the coupling frame CF. The Coupling Frame (CF) can enhance the communication between the transponder chip module and other RFID devices such as non-compliant readers. The transponder chip module may be a dual interface supporting both contactless and contact communication with an external reader.

2B shows a transponder chip module (TCM) 210 disposed in a card body (CB) 202 of a metal card (MC) or metal smart card (SC) 200, substantially the entire card body ( For example, 760 μm thick) may include metal and be referred to as a metal card body (MCB). The transponder chip module (TCM) may reside in an aperture (MO) 208 extending completely through the card body, and the aperture may be stepped as shown with a larger area portion and a smaller area portion. This may result in an air gap 203 behind the transponder chip module (TCM), which may be filled with a non-conductive filler 204. In a conventional metal smartcard (without a slit to function as a coupling frame), the air gap behind the transponder chip module may allow electromagnetic radiation from an external reader to interact with the transponder chip module.

Slit (S) 230 extends from the outer edge of metal card body (MCB) to opening (MO) and overlaps an outer portion of module antenna (MA) 212, which may be a laser etched antenna structure (LES) ( down as shown). Similarly, slits may be provided through the metal layer of a hybrid smartcard. The slit S deforms the metal card body MCB or layer so that it can act as a coupling frame 220 to enhance contactless communication with the transponder chip module.

Figure 2b shows a coupling frame 220 substantially surrounding the transponder chip module and having an opening for receiving the transponder chip module.

Although module apertures for transponder chip modules may be shown in the drawings of this embodiment and some other embodiments, it should be understood that many of the techniques described herein can be applied to coupling frames with slits without module apertures. These coupling frames may not be strictly coplanar with the transponder chip modules, but may be placed very close and parallel.

A metal payment object, such as a metal smartcard, may feature a cavity for receiving a transponder chip module (TCM). The cavity may not completely penetrate the payment object or may be covered from one side by continuous metal. The transponder chip module may be shielded from the continuous metal layer by a magnetic shielding material. This allows the cavity to be hidden. Also, the slit may be hidden by gems or crystals.

of the coupling frame opening

There is usually a sizable opening (Module opening (MO), central opening (CO)) in the body of the coupling frame to accommodate the transponder chip module, and a slit (S) in the coupling frame extends from the opening to the coupling frame. Noteworthy are some views of the prior publications discussed above, such as FIGS. 2C and 2D of US 9,475,086 extending to the outer edges of . This was driven by the need to keep the form factor and coupling frame of the smart card as close to the module antenna as possible. The coupling frame is generally substantially coplanar with the module antenna and generally surrounds it.

As disclosed herein, the coupling frame (CF) may be a planar (or non-planar, 3D) conductive element having an outer periphery (edge) and having a slit (S) extending from the outer edge to an interior location of the conductive element. can In the RFID device, the coupling frame can be arranged (arranged) to overlap the transponder chip module, and the slit (S) is oriented (arranged) so that it overlaps (transversely or downwardly) with the rotation (trace) of the module antenna on one side thereof. ) can be As distinguished from the coupling frame disclosed, for example, in US 9475086 (see also US 9489613 and US 9390364), the inner end of the slit S in the coupling frame disclosed herein accommodates a transponder chip module (TCM). It does not need to terminate in a separate opening sized to do so. Basically, it is the slits, not the openings, that determine the electrical properties of the coupling frame. Some of the coupling frames disclosed herein may be non-planar, including curved or tubular.

In many of the examples and embodiments presented herein, the coupling frame and transponder chip module may be incorporated into a payment object, which may be referred to as a "payment device" or simply a "device".

Coupling frame example

FIG. 3A shows a front view of a smartcard (SC) 300 , which may be a metal card having a metal layer (ML) that may make up substantially the entire thickness of the card body (CB) 302 . The card body (CB) has a module opening (MO) 308 into which a transponder chip module (TCM) 310 can be placed and a metal card body (MCB) 302 as a coupling frame (CF) 320. It may have a slit (S) 330 extending from the module opening (MO) to the outer circumference of the metal layer (ML) to function. The metal layer (ML) (or card body (CB) or metal card body (MCB)) may comprise stainless steel, titanium or any other metal or metal alloy, the metal being provided with slits, slots or gaps to Create an open loop coupling frame (CF) very close to and substantially completely surrounding the ponder chip module (TCM).

The slit (S) may overlap at least a portion of the module antenna (MA, not shown) of the transponder chip module. In some examples and embodiments of the coupling frame integrated into the RFID device disclosed herein, there need not be an opening MO in the coupling frame CF for the transponder chip module TCM.

This concept of modifying a metal element to have a slit (S) to function as a coupling frame (CF) could be applied to other products incorporating an antenna module (AM) or transponder chip module (TCM), such as watches, wearables, and the like. can

The slit S may completely extend through the metal layer ML forming the coupling frame CF. The slit S may only extend partially through the metal layer, and the remaining material in the metal layer below the slit S may have a thickness below the transparency threshold or skin depth for the metal layer. The slit S may have a smaller width than the opening. The slit S may be at least partially filled with an electrically non-conductive material selected from the group consisting of polymers, epoxy resins, and reinforced epoxy resins. The reinforcing structure RS may be disposed at a position of the slit S to reinforce the metal layer ML.

The activation distance for a transponder chip module (TCM) disposed in (or below or above) the opening (MO) of the coupling frame is at least 20 mm; at least 25 mm; at least 30 mm; at least 35 mm; 40 mm or less; and may be greater than 40 mm.

Components can be connected across slits, such as capacitors, to improve performance. The transponder chip module may also contain capacitors to improve coupling.

Metal smart card design using coupling frame

FIG. 4A shows an exploded view of a solid metal smartcard comprising two metal layers (ML) attached together (bonded to each other) by an adhesive film (AF) 405 . A front card body (FCB) (402) composed of a metal layer (ML) includes a first module opening (MO1) (403) to receive a specially designed transponder chip module (TCM) (401). The front card body (FCB) 402 may have a thickness of 760 μm to 800 μm. A rear card body (RCB) 408 fits into a pocket milled, etched, stamped or otherwise formed on the back side of the front card body (FCB) 402 . The front card body (FCB) 402 includes a first slit (S1) 404 that allows the front card body (FCB) to act as a coupling frame (CF). The module antenna on the transponder chip module (TCM) may suitably overlap the front card body (FCB) 402 to enable optimal performance of the device when operating in contactless communication with an external reader.

An insert 406 made of plastic or other suitable non-conductive material may be disposed behind the first module opening (MO1) 403 in the front card body (FCB) 402, and the transponder chip module (TCM) ( 401) and may be milled or otherwise shaped to accommodate the volume occupied by the chip IC. An insert adhesive 407 in film or liquid form may be provided to bond the insert 406 to the card. The rear card body (RCB) 408 is composed of a metal layer (ML) featuring a second module opening (MO2) 412 and a second slit (S2); It works as a coupling frame (CF). The rear card body (RCB) 402 may have a thickness of 300 μm to 400 μm. The insert 406 may consist of multiple components and may include antenna windings and/or tuning circuitry with capacitors to affect the resonant characteristics of the smartcard.

4B shows the outer surface of the rear card body (RCB) 408 panel. A second slit (S2) 409 is shown starting from the inner edge of the panel around the entire circumference of the assembled card in this example. It should be noted that a small gap is provided between the inner edges of the rear card body (RCB) 408 and the front card body (FCB) 402 to prevent electrical shorting of the second slit (S2) 409; , this gap may be on the order of 10 μm to 50 μm. The rear card body (RCB) 408 also features two recesses which may be formed by any suitable technique including laser ablation, chemical etching or milling. A single recess may be used to receive the magnetic stripe (ie magnetic stripe recess (MSR) 414). A second recess for the signature panel, namely the signature panel recess (SPR) 413, may also be provided. These recesses may allow these features to lie flush with the card surface. Alternatively, the recesses may simply be textured areas to aid in the alignment and adhesion of appropriate features.

One or both of the front card body (FCB) 402 and rear card body 408 may be coated with a dielectric material. For example, the coating can be hard abrasive decorative black diamond-like carbon (DLC) characterized by very high electrical resistivity. This can be achieved by controlling the ratio of conductive carbon (eg graphitic sp2 hybridized and amorphous carbon) to insulating carbon (eg diamondoid sp3 hybridized carbon). Alternative coatings are contemplated and may be clear or other colors, which also include the use of paints and lacquers or coating layers to achieve the desired finish. The coating(s) are applied to either the front card body (FCB) 402 or the rear card body (RCB) 408 to provide the necessary electrical insulation between the two panels and to perform each as a coupling frame (CF). It may be applied to part or all of the surface or edge of the Using a dielectric or high resistivity coating in this way allows the slit (S2) 409 to start inside the overall card structure and extend towards the second module opening (MO2) 412. This configuration is important because it allows the assembled card to be strengthened by offsetting the position of the two slits (S1, 404; S2, 409), in this particular example, so that they are perpendicular to each other so that the module opening (MO1, 403; MO2, 412) to stabilize the card.

One or both of the front card body (FCB) 402 and the rear card body (RCB) 408 may have respective slits ( S1, S2) or other locations across the device or circuit assembly. Additional circuits or devices may be housed in layers independent of the FCB and RCB, for example present between them to interact with eddy currents induced in the respective coupling frames CF1 and CF2.

The slits S1, 404; S2, 409 can be made discontinuous and less visible by cutting them to narrower widths (eg, 10 μm, 20 μm, 50 μm to 150 μm), which can be achieved, for example, by laser cutting. there is. Also, the apparent width of the slits (S1, 404; S2, 409) can be reduced by the thickness of the coating applied to the front or rear card body (FCB 402, RCB 408). For example, in the case of a diamond-like carbon (DLC) coating, each edge of the slits (S1, 404; S2, 409) may have a coating thickness of 5 microns, thereby reducing the apparent slit width to 10 microns. can The use of alternative coating types or multiple coating layers can greatly reduce the apparent slit width.

Attention is drawn to US 15818785, filed on November 21, 2017, particularly Figure 16A thereof, which describes a smart card having multiple metal layers with slits, wherein the slits in the various layers are oriented opposite to each other.

5A shows a transponder chip module (TCM) 501, a front card body (FCB) 502, a first slit (S1) 504, a module opening (MO) 503, and an adhesive film (AF) 505. ) shows an exploded view of a configuration similar to that shown in FIGS. 4A and 4B with a similar layout. The design does not necessarily have inserts at module locations. The rear card body (RCB) 506 may include a second slit (S2) 507 and may receive a magnetic stripe (MS) 508 and a signature panel (SP) 509 .

5B shows the outer surface of the rear card body (RGB) 506. The panel shown features a magnetic strip recess (MSR) 510 and a signature panel recess (SPR) 511 . As mentioned above, the rear card body (RCB) does not feature a module opening (MO). Instead, the design includes an area around the area extending inwardly from the edge of the rear card body (RCB) 506 panel on the inside of the metal smartcard and overlapping the module antenna (MA) of the transponder chip module (TCM) 501. It features an extended slit (S2) 507 describing the loop.

The second slit (S2) 507 is formed as shown to leave a region of solid metal behind the transponder chip module (TCM) 501 instead of the module opening (MO). In this way, the second slit (S2) 507 can guide the induced eddy current around the module antenna (MA) and allow inductive coupling so that the rear card body (RCB) functions as a coupling frame (CF). there is. Additionally, the design of the second slit (S2) 507 in this way eliminates the need for an insert or other filling material to cover the module opening (MO) and the card body behind the transducer chip module (TCM) 501. to prevent the occurrence of potential weak spots.

Slit (S2) 507 may describe any shape, including a helix, to optimize the overlap of a given module antenna (MA) and coupling frame. Slit (S2) 507 may have a variable width along its length, for example, it may be 100 μm wide at the edge of the panel when close to the module antenna (MA) to enhance the radio frequency communication performance of the device. It can start and widen to 300 μm. The slits S1, 504; S2, 507 may be filled with resin or other material to prevent penetration of liquid or debris during card use. Slit (S2) 507 may also be hidden by placement of a security hologram, logo or other feature.

6A shows an exploded view of a variant of a solid metal dual interface card. In this case, the first slit (S1) 604 of the front card body (FCB) 602 extends parallel to the second slit (S2) of the rear card body (RCB) 606, but is positioned such that the slits do not overlap. is offset, thereby increasing the mechanical stability of the card near the location of the transponder chip module (TCM) 601. The illustrated configuration is equally applicable to the rear card body (RCB) 606 panel including the module opening (MO) and the second slit (S2).

6B shows a rear view of the assembled solid metal dual interface card, excluding the magnetic stripe (MS) 608 and signature panel (SP) 609. Offsets of the positions of slits (S1) 604 and (S2) 607 are shown so that the slits do not overlap. A rear card body (RCB) 606 fits into a pocket milled, etched, stamped or otherwise formed on the back side of the front card body (FCB) 602 . The pocket allows the rear card body (RCB) 606 to be bent around its circumference by a frame from the front card body (FCB) 602. This frame may serve to stabilize the front card body (FCB) 602 during fabrication of the pocket. For example, if a pocket is formed by milling tool stress on the metal layer ML comprising the front card body (FCB) 602, it may cause permanent warping. The presence of the frame shown in FIG. 6B can add rigidity and stability to the front card body (FCB) 602 and the overall card assembly.

To aid in the milling of pockets, easily machined metals or metal alloys may be used in the construction of the card, especially if the size of the rear card body (RCB) 606 occupies a significant portion (e.g., greater than 25%) of the area of the card. Can be selected for some or all of them. It may include aluminum alloys such as duralumin or various alloys of stainless steel.

Another benefit of using a metal alloy relates to reading and writing data to and from the high coercivity magnetic stripe (MS) 608. Placing a magnetic stripe on top of a non-magnetic metal or metal alloy (e.g., 300 series stainless steel, aluminum, aluminum alloy, titanium) can cause data corruption and reading problems using conventional magnetic stripe readers. data) is reduced.

While the disclosed invention is shown in the form of a single card, showing a single front card body (FCB) and corresponding rear card body (RCB), cards of various designs may be assembled into multiple card arrays prior to cutting and isolating each card. You have to understand that you can. In this way, the front card body (FCB) may consist of a panel having a series of recesses on one side designed to receive the panels forming the rear card body (RCB) of each final card. The assembly process may include, but is not limited to, any of buffing, cleaning, lamination, printing, lacquering, laser engraving, surface coating, sandblasting, and insertion into voids and slits S. . The final card may be formed by etching or milling from an assembled multiple card array to increase manufacturing efficiency.

Although the invention(s) have been described with respect to a limited number of embodiments, these should not be construed as limiting the scope of the invention(s), but rather as examples of some embodiments. Those skilled in the art may anticipate other possible variations, modifications, and implementations that fall within the scope of the invention(s) and claims based on the disclosure(s) set forth herein.

Claims (15)

As a metal smart card,
A first metal layer (ML, FCB) having a first slit (S1) extending from an outer edge of the first metal layer to a module opening (MO1) for receiving a transponder chip module (TCM) - said first metal layer serves as a first coupling frame CF1 -; and
A second metal layer (ML, RCB) having a second slit (S2) extending from an outer edge of the second metal layer; includes,
The two metal layers mechanically support each other,
the second slit describes a loop around an area overlapping the module antenna of the transponder chip module, the second slit being further formed to leave an area of solid metal behind the transponder chip module;
metal smart card. According to claim 1,
slits (S1, S2) of each metal layer (CF1, CF2) overlap a part of the module antenna (MA) of the transponder chip module (TCM);
metal smart card. According to claim 1 or 2,
The second slit (S2, 507, 607) is an expansion slit extending inward from the edge of the second metal layer (ML, RCB, 506, 606) inside the metal smart card,
metal smart card. According to claim 1 or 2,
The second slits (S2, 507, 607) have various widths along their lengths,
metal smart card. According to claim 1,
The slit S2 of one metal layer CF2 is positioned in a different position or orientation from the slit S1 of the other metal layer CF1 so that the slits of the metal layer are not aligned with each other.
metal smart card. According to claim 5,
The first slit of the first metal layer extends parallel to the second slit of the second metal layer but is offset in position so that the slits do not overlap, the first metal layer being the front card body and the second metal layer being the rear card body. body,
metal smart card. According to claim 1,
Further comprising a recess in the first metal layer for receiving the second metal layer.
metal smart card. According to claim 1,
Disposed on the second metal layer RCB:
magnetic stripe (MS);
signature panel (SP); and
hologram; further comprising one or more of
metal smart card. According to claim 1,
The second metal layer functions as a second coupling frame,
One or both of the coupling frames (CF1, CF2) are connected to a device circuit to supply power to the circuit or improve the read / write performance of the smart card with a reader.
metal smart card. According to claim 1,
wherein the smartcard is operable in both contact and contactless mode;
metal smart card. According to claim 1,
further comprising a layer of non-conductive material separating the metal layer;
metal smart card. According to claim 1,
the two metal layers are bonded to each other by an adhesive film;
metal smart card. According to claim 1,
a transponder chip module having a module antenna;
The module antenna comprises a planar antenna comprising one long conductive track arranged in a spiral pattern.
metal smart card. According to claim 1,
the first metal layer is a front card body and the second metal layer is a rear card body;
The front card body (FCB) has a thickness of 760 μm to 800 μm; and
The rear card body (RCB) has a thickness of 300 μm to 400 μm,
metal smart card. According to claim 1,
The second metal layer functions as a second coupling frame (CF2),
metal smart card.

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