KR102534151B1 - Hot water floor with improved heat transfer - Google Patents

Hot water floor with improved heat transfer Download PDF

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Publication number
KR102534151B1
KR102534151B1 KR1020220082208A KR20220082208A KR102534151B1 KR 102534151 B1 KR102534151 B1 KR 102534151B1 KR 1020220082208 A KR1020220082208 A KR 1020220082208A KR 20220082208 A KR20220082208 A KR 20220082208A KR 102534151 B1 KR102534151 B1 KR 102534151B1
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South Korea
Prior art keywords
hot water
heat transfer
heat
water pipe
floor
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KR1020220082208A
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Korean (ko)
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박대지
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박대지
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/122—Details
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/022—Flooring consisting of parquetry tiles on a non-rollable sub-layer of other material, e.g. board, concrete, cork
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D19/00—Details
    • F24D19/02—Arrangement of mountings or supports for radiators
    • F24D19/0203—Types of supporting means
    • F24D19/0213—Floor mounted supporting means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/141—Tube mountings specially adapted therefor
    • F24D3/142—Tube mountings specially adapted therefor integrated in prefab construction elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
    • E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
    • E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/20—Heat consumers
    • F24D2220/2081—Floor or wall heating panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

A hot-water-heated floor (100) with improved heat transfer according to the present invention comprises: an insulation layer (110) installed on a concrete foundation floor with a certain thickness to prevent heat from escaping to a concrete floor; a hot water pipe (120) evenly installed directly above the insulation layer (110) as a whole to allow hot water heated by a boiler to circulate therethrough; heat transfer fins (130) installed to be attached directly above the hot water pipe (120), and having heat, which is generated by the hot water circulating through the hot water pipe (120), to be transferred thereto; a heat conduction layer (140) installed directly above the heat transfer fins (130) to transfer the heat, which is transferred through the heat transfer fins (130) from the hot water pipe (120), widely and evenly in all directions; and a surface layer (150) installed directly above the heat conduction layer (140) and on which a floor finishing material such as floor paper can be installed.

Description

열전달력을 높인 온수난방바닥{Hot water floor with improved heat transfer}Hot water floor with improved heat transfer}

본 발명은 온수난방바닥에 관한 것으로, 더욱 구체적으로는 온수관의 열을 보다 효율적으로 빠르게 전달할 수 있는 열전달력을 높인 온수난방바닥에 관한 것이다.The present invention relates to a warm water heating floor, and more particularly, to a warm water heating floor with increased heat transfer power capable of more efficiently and quickly transferring heat from a hot water pipe.

온수난방바닥은 뜨거운 물을 이용한 난방 방식으로, 보일러에서 뜨거워진 물이 온수관을 순환하면서 바닥을 따뜻하게 하게 된다. 온수난방바닥은 오랫동안 주택 등에 사용되고 있으나 보일러에 사용되는 연료의 비용 상승에 따라 효율적인 난방을 통해 비용을 절감할 필요가 생겼다. 이를 위한 기술이 등록특허 제10-1168836호의 「에너지 절약형 온수난방바닥」에 개시되어 있고, 그 대표도면이 도 1 및 도 2에 도시되어 있다.The hot water heating floor is a heating method using hot water, and the hot water from the boiler circulates through the hot water pipes to warm the floor. Hot water heating floors have been used in houses for a long time, but as the cost of fuel used in boilers increases, there is a need to reduce costs through efficient heating. A technology for this is disclosed in "Energy-saving hot water heating floor" of Patent Registration No. 10-1168836, and representative drawings thereof are shown in FIGS. 1 and 2.

도 1 및 도 2에 도시된 바와 같이, 종래의 온수난방바닥은 단열층(10), 열전도층(20), 표층(30), 온수관(40) 및 방열지연관(50)으로 구성되어 있다.As shown in FIGS. 1 and 2, the conventional hot water heating floor is composed of a heat insulating layer 10, a heat conductive layer 20, a surface layer 30, a hot water pipe 40, and a heat radiation delay pipe 50.

단열층(10)은 열이 바닥을 통해 콘크리트 기초로 방출되지 않게 한다.The thermal insulation layer 10 prevents heat from dissipating through the floor to the concrete foundation.

열전도층(20)은 단열층(10)의 상면에 적층되어 있다.The heat conductive layer 20 is laminated on the upper surface of the heat insulating layer 10 .

표층(30)은 열전도층(20)의 상면에 적층되어 있다.The surface layer 30 is laminated on the upper surface of the heat conductive layer 20 .

온수관(40)은 단열층(10)과 열전도층(20) 사이에 사(蛇)행상으로 설치되어 있고, 온수관(40)은 보일러(도시되지 않음), 펌프(도시되지 않음) 등에 연결되게 설치된다.The hot water pipe 40 is installed in a pedestal between the heat insulating layer 10 and the heat conductive layer 20, and the hot water pipe 40 is connected to a boiler (not shown), a pump (not shown), and the like. installed

방열지연관(50)은 온수관(40)의 빈 공간에 위치하게 단열층(10)과 열전도층(20) 사이에 설치되어 있다. 방열지연관(50)은 내부에 중공(51)이 형성되고, 중공(51)에 공기가 충전되어 온수관(40)을 통해 공급되는 열을 지연시켜 방출시키게 된다.The heat dissipation delay pipe 50 is installed between the heat insulating layer 10 and the heat conductive layer 20 to be positioned in the empty space of the hot water pipe 40 . The heat dissipation delay pipe 50 has a hollow 51 formed therein, and air is filled in the hollow 51 to delay and release heat supplied through the hot water pipe 40.

상술한 구성을 갖는 종래의 온수난방바닥은 온수관(40)이 열전도층(20)에 닿는 부위가 온수관(40)의 윗부위로 거의 선접촉을 하기 때문에, 원형의 온수관(40)의 표면을 통해 사방으로 나오는 열이 효율적으로 열전도층(20)으로 전달되지 못하여 표층(30)의 난방을 위해 버려지는 열이 많았다. In the conventional hot water heating floor having the above configuration, since the part where the hot water pipe 40 touches the heat conductive layer 20 almost makes linear contact with the upper part of the hot water pipe 40, the circular hot water pipe 40 Since heat coming out in all directions through the surface was not efficiently transferred to the heat conductive layer 20 , a lot of heat was wasted for heating the surface layer 30 .

본 발명은 상술한 종래기술의 문제점을 해결하고자 창안된 것으로, 본 발명의 과제는 열전달핀들을 온수관에 길이방향으로 부착되게 설치함으로써 온수관의 원형 표면에서 나오는 열이 보다 효율적으로 열전도층으로 전달될 수 있는 열전달력을 높인 온수난방바닥을 제공하는 것이다.The present invention was devised to solve the above-mentioned problems of the prior art, and the object of the present invention is to install heat transfer fins attached to the hot water pipe in the longitudinal direction so that the heat from the circular surface of the hot water pipe is more efficiently transferred to the heat conductive layer. It is to provide a hot water heating floor with increased heat transfer power that can be.

상술한 본 발명의 과제를 달성하기 위하여, 본 발명은 콘크리트 기초 바닥 위에 일정 두께로 설치되어 열이 콘크리트 바닥으로 빠져 나가는 것을 방지하는 단열층, 상기 단열층 바로 위에 전체적으로 골고루 설치되어 보일러에서 가열된 뜨거운 물이 순환되는 온수관, 상기 온수관 바로 위에 부착되게 설치되어, 상기 온수관을 순환하는 상기 뜨거운 물에 의해 생기는 열이 전달되는 열전달핀들, 상기 열전달핀들 바로 위에 설치되어 상기 온수관에서 상기 열전달핀들을 통해 전달되는 열이 사방으로 넓게 고루 전달되는 열전도층 및 상기 열전도층 바로 위에 설치되고 그 위에 장판 등의 바닥 마감재가 설치될 수 있는 표층을 포함하는 것을 특징으로 하는 열전달력을 높인 온수난방바닥을 제공한다.In order to achieve the above-described object of the present invention, the present invention is a heat insulating layer installed on a concrete foundation floor to a certain thickness to prevent heat from escaping to the concrete floor, and the hot water heated in the boiler is evenly installed directly above the heat insulating layer A circulating hot water pipe, heat transfer fins installed directly above the hot water pipe to transfer heat generated by the hot water circulating through the hot water pipe, installed directly above the heat transfer pins, from the hot water pipe through the heat transfer fins Provides a hot water heating floor with increased heat transfer power, characterized in that it includes a heat conduction layer through which heat is transmitted widely and evenly in all directions, and a surface layer installed directly on the heat conduction layer and on which a floor finishing material such as a flooring can be installed. .

본 발명은 상기 열전달핀들이 여러개의 낱개의 열전달핀이 하나의 이음봉으로 일정 간격을 두고 이어져 있는 것을 특징으로 하고, 상기 열전달핀은 열전달율을 높게 하기 위해 전도성이 높은 금속재료로 만들어진 것을 다른 특징으로 하며, 상기 열전달핀은 위쪽으로의 열전달을 좋게 하기 위해 상단이 하단 보다 긴 역사다리꼴을 갖는 것을 또 다른 특징으로 하고, 상기 열전달핀은 원형의 상기 온수관에 밀착되게 부착될 수 있게 반원형의 부착홈이 형성된 것과 상기 부착홈은 상기 온수관의 표면에 잘 고정되게 하기 위해 끝부위에 쐐기들이 형성된 것을 또 다른 특징으로 한다.The present invention is characterized in that the heat transfer fins are a plurality of individual heat transfer fins connected at regular intervals with one joint rod, and the heat transfer fins are made of a highly conductive metal material to increase the heat transfer rate. Another feature of the heat transfer fin is that it has an inverted trapezoid with an upper end longer than a lower end in order to improve heat transfer upward, and the heat transfer fin has a semicircular attachment groove so that it can be closely attached to the circular hot water pipe. It is formed and the attachment groove is another feature in that wedges are formed at the end to be well fixed to the surface of the hot water pipe.

본 발명은 상기 이음봉이 상기 열전달핀에 전달되는 열이 전달되지 않게 플라스틱과 같은 열전달율이 낮은 재료로 만들어지는 것을 특징으로 하고, 상기 이음봉은 현장에서 상기 온수관의 직선 구간과 곡선 구간 모두에 쉽고 편하게 설치 될 수 있게 작업자가 손으로 원하는대로 쉽게 펴거나 구부릴 수 있는 자바라 형태로 형성된 것과 상기 이음봉은 현장에서 작업자가 톱 등의 절단 도구를 사용하여 원하는 길이 만큼 잘라 사용할 수 있는 것을 다른 특징으로 한다.The present invention is characterized in that the connecting rod is made of a material having a low heat transfer rate such as plastic so that the heat transmitted to the heat transfer pin is not transferred, and the connecting rod is easily and conveniently used in both the straight section and the curved section of the hot water pipe in the field. It is formed in the form of a bellows that can be easily stretched or bent as desired by the operator so that it can be installed by hand, and the joint bar is another feature that the operator can cut to a desired length using a cutting tool such as a saw at the site.

본 발명의 열전달력을 높인 온수난방바닥에 따르면, 온수관의 원형 표면에서 나오는 열이 열전달핀들을 통해 열전도층으로 전달되기 때문에, 종래에 비해 열이 버려지는 양이 크게 줄고 효율적으로 열전도층으로 전달될 수 있고, 이 덕분에 난방에 필요한 비용을 크게 줄일 수 있다.According to the hot water heating floor with increased heat transfer power of the present invention, since the heat from the circular surface of the hot water pipe is transferred to the heat conductive layer through the heat transfer fins, the amount of heat wasted is greatly reduced and efficiently transferred to the heat conductive layer compared to the prior art. This can significantly reduce heating costs.

도 1은 종래의 에너지 절약형 온수난방바닥의 조립사시도;
도 2는 도 1의 온수난방바닥의 분해사시도;
도 3은 본 발명의 바람직한 실시예에 따른 열전달력을 높인 온수난방바닥의 분해사시도;
도 4는 도 3의 온수관과 열전달핀들의 일부를 확대하여 도시한 분해사시도;
도 5는 도 4의 열전달핀의 정면도이다.1 is an assembled perspective view of a conventional energy-saving hot water heating floor;
Figure 2 is an exploded perspective view of the hot water heating floor of Figure 1;
Figure 3 is an exploded perspective view of a hot water heating floor with increased heat transfer power according to a preferred embodiment of the present invention;
Figure 4 is an exploded perspective view showing a portion of the hot water pipe and heat transfer fins of Figure 3 in an enlarged manner;
5 is a front view of the heat transfer fins of FIG. 4;

이하, 첨부한 도면들을 참조로 본 발명의 바람직한 실시예에 따른 열전달력을 높인 온수난방바닥에 대하여 구체적으로 설명한다.Hereinafter, a warm water heating floor with increased heat transfer power according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 3은 본 발명의 바람직한 실시예에 따른 열전달력을 높인 온수난방바닥의 분해사시도, 도 4는 도 3의 온수관과 열전달핀들의 일부를 확대하여 도시한 분해사시도, 그리고 도 5는 도 4의 열전달핀의 정면도이다.Figure 3 is an exploded perspective view of a hot water heating floor with increased heat transfer power according to a preferred embodiment of the present invention, Figure 4 is an exploded perspective view showing a portion of the hot water pipe and heat transfer fins of Figure 3 in an enlarged manner, and Figure 5 is an exploded perspective view of Figure 4 This is a front view of the heat transfer fin.

도 3에 도시한 바와 같이, 본 실시예에 따른 열전달력을 높인 온수난방바닥(100)은 단열층(110), 온수관(120), 열전달핀들(130), 열전도층(140) 및 표층(150)을 포함한다.As shown in FIG. 3, the hot water heating floor 100 with increased heat transfer power according to the present embodiment includes a heat insulating layer 110, a hot water pipe 120, heat transfer pins 130, a heat conductive layer 140, and a surface layer 150. ).

단열층(110)은 콘크리트 기초 바닥 위에 일정 두께로 설치되어, 열이 콘크리트 바닥으로 빠져 나가는 것을 방지하게 된다.The heat insulating layer 110 is installed to a certain thickness on the concrete foundation floor to prevent heat from escaping to the concrete floor.

온수관(120)은 단열층(110) 바로 위에 전체적으로 골고루 설치되어, 보일러에서 가열된 뜨거운 물이 온수관(120)을 통해 순환되게 된다. 온수관(120)은 순환을 위해 펌프와 연결되게 된다.The hot water pipe 120 is installed evenly as a whole immediately above the heat insulation layer 110, so that the hot water heated in the boiler is circulated through the hot water pipe 120. The hot water pipe 120 is connected to the pump for circulation.

열전달핀들(130)은 온수관(120) 위에 부착되게 설치되어, 온수관(120)을 순환하는 뜨거운 물에 의해 생기는 열이 열전달핀들(130)으로 빠르게 전달되게 된다.The heat transfer pins 130 are installed so as to be attached to the hot water pipe 120, so that heat generated by the hot water circulating through the hot water pipe 120 is quickly transferred to the heat transfer pins 130.

열전달핀들(130)은, 도 4 및 도 5에 확대하여 도시한 바와 같이, 여러개의 낱개의 열전달핀(131)이 하나의 이음봉(132)으로 일정 간격을 두고 이어져 있다.As the heat transfer fins 130 are enlarged and shown in FIGS. 4 and 5 , a plurality of individual heat transfer fins 131 are connected by one joint bar 132 at regular intervals.

열전달핀(131)은 열전달율을 높게 하기 위해 전도성이 높은 금속재료로 만들어진다. 열전달핀(131)은 위쪽으로의 열전달을 좋게 하기 위해 상단(133)이 하단(134) 보다 긴 역사다리꼴을 갖고, 원형의 온수관(120)에 밀착되게 부착될 수 있게 반원형의 부착홈(135)이 형성된다. The heat transfer fin 131 is made of a highly conductive metal material in order to increase the heat transfer rate. The heat transfer fin 131 has an inverted trapezoid shape in which the upper end 133 is longer than the lower end 134 in order to improve heat transfer upward, and has a semicircular attachment groove 135 so that it can be closely attached to the circular hot water pipe 120. ) is formed.

부착홈(135)은 온수관(120)의 표면에 잘 고정되게 하기 위해 끝부위에 쐐기들(136)이 형성된다. 반원형의 부착홈(135)이 온수관(120)의 절반 이상의 표면에 부착되어 온수관(120)에서 나오는 열을 빠르게 흡수하기 때문에 종래에 비해 온수관(120)의 열의 전달력이 크게 높아지고 열의 손실이 줄어들게 된다.Wedges 136 are formed at the end of the attachment groove 135 to be well fixed to the surface of the hot water pipe 120. Since the semicircular attachment groove 135 is attached to more than half of the surface of the hot water pipe 120 to quickly absorb heat from the hot water pipe 120, the heat transfer power of the hot water pipe 120 is greatly increased compared to the prior art and heat loss this will decrease

이음봉(132)은 열전달핀(131)에 전달되는 열이 전달되지 않게 플라스틱과 같은 열전달율이 낮은 재료로 만들어지되, 현장에서 온수관(120)의 직선 구간과 곡선 구간 모두에 쉽고 편하게 설치 될 수 있게 작업자가 손으로 원하는대로 쉽게 펴거나 구부릴 수 있는 자바라 형태로 형성된다. 또한, 이음봉(132)은 현장에서 작업자가 톱 등의 절단 도구를 사용하여 원하는 길이 만큼 잘라 사용할 수 있다.The joint rod 132 is made of a material with a low heat transfer rate such as plastic so that the heat transferred to the heat transfer pin 131 is not transferred, but it can be easily and conveniently installed in both the straight section and the curved section of the hot water pipe 120 in the field. It is formed in the form of a bellows that can be easily stretched or bent as desired by the operator. In addition, the joint bar 132 can be cut to a desired length by a worker using a cutting tool such as a saw in the field.

열전도층(140)은 열전달핀들(130) 바로 위에 설치되어 온수관(120)에서 나와 열전달핀들(130)을 통해 전달되는 열이 사방으로 넓게 고루 전달된다. The heat conduction layer 140 is installed directly above the heat transfer pins 130 so that the heat transmitted from the hot water pipe 120 through the heat transfer pins 130 is widely and evenly transferred in all directions.

표층(150)은 열전도층(140) 바로 위에 설치되고, 그 위에 장판 등의 바닥 마감재가 설치될 수 있다.The surface layer 150 is installed directly on the heat conductive layer 140, and a floor finishing material such as a floor covering may be installed thereon.

이상 본 발명의 바람직한 실시예를 참고로 열전달력을 높인 온수난방바닥에 대하여 설명하였지만, 본 발명의 사상을 벗어나지 않는 범위 안에서 다양한 변경, 변형 또는 수정이 가능함은 당업자에게 명백하다.Although the hot water heating floor with increased heat transfer power has been described with reference to preferred embodiments of the present invention, it is clear to those skilled in the art that various changes, modifications or modifications are possible within the scope of the present invention.

100 : 온수난방바닥 110 : 단열층
120 : 온수관 130 : 열전달핀들
131 : 낱개의 열전달핀 132 : 이음봉
133 : 상단 134 : 하단
135 : 반원형의 부착홈 136 : 쐐기들
140 : 열전도층 150 : 표층100: hot water heating floor 110: insulation layer
120: hot water pipe 130: heat transfer pins
131: individual heat transfer pin 132: joint bar
133: top 134: bottom
135: semicircular attachment groove 136: wedges
140: heat conduction layer 150: surface layer

Claims (9)

콘크리트 기초 바닥 위에 일정 두께로 설치되어, 열이 콘크리트 바닥으로 빠져 나가는 것을 방지하는 단열층(110);
상기 단열층(110) 바로 위에 전체적으로 골고루 설치되어, 보일러에서 가열된 뜨거운 물이 순환되는 온수관(120);
상기 온수관(120) 바로 위에 부착되게 설치되어, 상기 온수관(120)을 순환하는 상기 뜨거운 물에 의해 생기는 열이 전달되는 열전달핀들(130);
상기 열전달핀들(130) 바로 위에 설치되어, 상기 온수관(120)에서 상기 열전달핀들(130)을 통해 전달되는 열이 사방으로 넓게 고루 전달되는 열전도층(140); 및
상기 열전도층(140) 바로 위에 설치되고, 그 위에 장판 등의 바닥 마감재가 설치될 수 있는 표층(150)을 포함하며,
상기 열전달핀들(130)은 여러개의 낱개의 열전달핀(131)이 하나의 이음봉(132)으로 일정 간격을 두고 이어져 있고, 상기 이음봉(132)은 상기 열전달핀(131)에 전달되는 열이 전달되지 않게 플라스틱과 같은 열전달율이 낮은 재료로 만들어지는 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).A heat insulating layer 110 installed on the concrete foundation floor to a certain thickness to prevent heat from escaping to the concrete floor;
A hot water pipe 120 installed evenly on the entirety directly above the heat insulating layer 110 and circulating hot water heated in a boiler;
Heat transfer pins 130 installed to be attached directly above the hot water pipe 120 to transfer heat generated by the hot water circulating through the hot water pipe 120;
a heat conduction layer 140 installed directly above the heat transfer fins 130 so that the heat transferred from the hot water pipe 120 through the heat transfer fins 130 is widely and evenly transferred in all directions; and
It is installed directly above the heat conductive layer 140 and includes a surface layer 150 on which a floor finishing material such as a floor can be installed,
In the heat transfer fins 130, a plurality of individual heat transfer fins 131 are connected at regular intervals by a single joint 132, and the joint rod 132 generates heat transferred to the heat transfer fin 131. Hot water heating floor (100) with increased heat transfer, characterized in that it is made of a material with a low heat transfer rate such as plastic so as not to be transferred. 삭제delete 청구항 1에 있어서, 상기 열전달핀(131)은 열전달율을 높게 하기 위해 전도성이 높은 금속재료로 만들어진 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The warm water heating floor (100) of claim 1, wherein the heat transfer fins (131) are made of a highly conductive metal material to increase the heat transfer rate. 청구항 1 또는 청구항 3에 있어서, 상기 열전달핀(131)은 위쪽으로의 열전달을 좋게 하기 위해 상단(133)이 하단(134) 보다 긴 역사다리꼴을 갖는 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The hot water heating floor with increased heat transfer power according to claim 1 or claim 3, characterized in that the heat transfer fin 131 has an inverted trapezoidal shape in which the upper end 133 is longer than the lower end 134 in order to improve heat transfer upward. 100). 청구항 4에 있어서, 상기 열전달핀(131)은 원형의 상기 온수관(120)에 밀착되게 부착될 수 있게 반원형의 부착홈(135)이 형성된 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The warm water heating floor (100) of claim 4, wherein the heat transfer fin (131) has a semicircular attachment groove (135) formed so that it can be closely attached to the circular hot water pipe (120). . 청구항 5에 있어서, 상기 부착홈(135)은 상기 온수관(120)의 표면에 잘 고정되게 하기 위해 끝부위에 쐐기들(136)이 형성된 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The hot water heating floor (100) of claim 5, wherein the attachment groove (135) has wedges (136) formed at the end to be well fixed to the surface of the hot water pipe (120) . 삭제delete 청구항 1에 있어서, 상기 이음봉(132)은 현장에서 상기 온수관(120)의 직선 구간과 곡선 구간 모두에 쉽고 편하게 설치 될 수 있게 작업자가 손으로 원하는대로 쉽게 펴거나 구부릴 수 있는 자바라 형태로 형성된 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The method according to claim 1, wherein the coupling rod 132 is formed in the form of a bellows that can be easily and conveniently installed in both the straight section and the curved section of the hot water pipe 120 in the field, so that the operator can easily stretch or bend it as desired by hand. A warm water heating floor (100) with increased heat transfer power, characterized in that. 청구항 1에 있어서, 상기 이음봉(132)은 현장에서 작업자가 톱 등의 절단 도구를 사용하여 원하는 길이 만큼 잘라 사용할 수 있는 것을 특징으로 하는 열전달력을 높인 온수난방바닥(100).The hot water heating floor (100) with increased heat transfer power according to claim 1, characterized in that the connecting rod (132) can be cut to a desired length by a worker using a cutting tool such as a saw in the field.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200241473Y1 (en) * 1998-06-19 2001-12-01 오선교 Heating Piping Plate
KR20120010446A (en) * 2010-07-26 2012-02-03 (주) 미도랜드 Heat panel
KR101168836B1 (en) * 2011-06-30 2012-07-25 정연현 Energy saving-type heating floor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200241473Y1 (en) * 1998-06-19 2001-12-01 오선교 Heating Piping Plate
KR20120010446A (en) * 2010-07-26 2012-02-03 (주) 미도랜드 Heat panel
KR101168836B1 (en) * 2011-06-30 2012-07-25 정연현 Energy saving-type heating floor

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