KR102527957B1 - Light emitting module - Google Patents

Abstract

According to one embodiment of the present invention, the main body including a through-hole having a cross section having a first shape; a light source unit provided in the through-hole of the main body and having a second shape different from the first shape; a window provided in a direction in which light is emitted from the light source unit and sealing one side of the through-hole; The light source module includes a waterproof resin filled in the main body to seal the other side of the through-hole, and a guard provided in the main body to seal between the through-hole and the light source unit.

Description

Light source module {LIGHT EMITTING MODULE}

The present invention relates to a light source module capable of performing a sterilization function.

Ultraviolet (UV) has different properties depending on the type of wavelength, and is applied to a sterilization module by using properties according to the type of wavelength. A mercury (Hg) lamp is generally used in a sterilization module using ultraviolet rays. A sterilization action is performed using ozone (O ₃ ) generated by a wavelength emitted from a mercury lamp. However, since mercury (Hg) lamps contain mercury inside, there is a problem in that they can pollute the environment as the usage time increases.

Recently, sterilization modules using various ultraviolet rays have been developed and provided. In addition, various sterilization targets are also applied. Such a sterilization module is embedded in a specific device such as a refrigerator, washing machine, humidifier or water purifier.
(Patent Document 1) KR 10-2009-0081658 A

An object of the present invention is to provide a light source module having a structure capable of preventing leakage.

According to one embodiment of the present invention, the main body including a through-hole having a cross section having a first shape; a light source unit provided in the through-hole of the main body and having a second shape different from the first shape; a window provided in a direction in which light is emitted from the light source unit and sealing one side of the through-hole; The light source module includes a waterproof resin filled in the main body to seal the other side of the through-hole, and a guard provided in the main body to seal between the through-hole and the light source unit.

In addition, according to another embodiment of the present invention, the main body including a through-hole; a light source unit provided in the through hole of the main body; a window provided in a direction in which light is emitted from the light source unit and sealing one side of the through-hole; A light source module including a waterproof resin filled in the main body and sealing the other side of the through hole is provided.

Since the light source module according to an embodiment of the present invention has a structure capable of preventing leakage, it is possible to prevent the light source module from being broken due to water penetrating into the light source module.

In addition, according to an embodiment of the present invention, it is possible to prevent an electrical defect from occurring in the device due to penetration of water along the light source module into the device in which the light source module is installed.

In addition, according to an embodiment of the present invention, since the size of the light source module can be minimized, the application range of the light source module is wide and water leakage to the light source module installation part can be prevented.

1A is a perspective view of a light source module according to an embodiment of the present invention.
Figure 1b is an exploded perspective view of a light source module according to an embodiment of the present invention.
1C is an exploded perspective view illustrating a coupling relationship between a guard unit and a light source unit according to an exemplary embodiment.
2A and 2B are exploded perspective views of a light source module according to another embodiment of the present invention.
3A and 3B are cross-sectional views of a light source module according to an embodiment of the present invention.
4A is a perspective view of a light source module according to an embodiment of the present invention.
4B is an exploded perspective view of a light source module according to an embodiment of the present invention.
4C is a cross-sectional view of a light source module according to an embodiment of the present invention.
4D is an exploded perspective view of a light source module according to another embodiment of the present invention.
4E is a cross-sectional view of a light source module according to another embodiment of the present invention.
5A to 5D are cross-sectional views illustrating a state in which a light source module according to an embodiment of the present invention is installed.
6A and 6B are cross-sectional views illustrating enlarged light emitting diodes of a light source unit according to an embodiment of the present invention.

Since the present invention can have various changes and various forms, specific embodiments will be illustrated in the drawings and described in detail in the text. However, it should be understood that this is not intended to limit the present invention to the specific disclosed form, and includes all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Like reference numerals have been used for like elements throughout the description of each figure. In the accompanying drawings, the dimensions of the structures are shown enlarged than actual for clarity of the present invention. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A is a perspective view of a light source module according to an embodiment of the present invention. 1B is an exploded perspective view of a light source module according to an embodiment of the present invention.

The light source module 100 according to FIGS. 1A and 1B includes a main body 110 , a window 130 , a guard part 140 , and a light source unit 150 . In addition, although not shown in FIGS. 1A and 1B, a waterproof resin is filled in the main body 110. Details of the filling form of the waterproof resin will be described with reference to FIG. 3 .

The main body 110 includes a through hole 111 . The through-hole 111 extends in the longitudinal direction (z-axis direction) of the main body 110, and the main body 110 has a shape opened in the longitudinal direction by the through-hole 111.

The main body 110 may have a length (length in the z-axis direction) capable of maximally securing an irradiation angle of light emitted from a light source, for example, the light emitting diode 151 provided inside the main body 110 . In particular, the main body 110 may have an extended shape so that there is no radiation angle loss due to the connectors 152 and 153.

Although the through hole 111 is illustrated as having a circular cross section in FIG. 1B, the shape of the through hole 111 is not limited thereto. Accordingly, the through hole 111 may have various shapes such as a square, a rectangle, a trapezoid, a rhombus, a triangle, an ellipse, a semicircle, and a semi-ellipse in addition to a circular shape.

A photocatalyst may be applied to the inner surface of the through hole 111 . When the photocatalyst is irradiated with ultraviolet rays, sterilizing substances such as hydroperoxide (H ₂ O ₂ ), hydroxyl, and hydroperoxyl radical may be generated. These bactericidal substances can damage the bacteria or the DNA, proteins, and fats inside the bacteria, causing the bacteria or bacteria to lose their activity.

The photocatalyst is applied to the inner surface of the through-hole 111 to receive light emitted from the light source unit 150 . A sterilizing material may be generated by reacting the photocatalyst with light, and thus the inner surface of the through-hole 111 may be disinfected. The light source unit 100 according to the present invention may be installed in an environment with high humidity, such as a refrigerator, washing machine, humidifier, air conditioner, or water purifier. In a high-humidity environment, bacterial growth may be active, so inside the light source unit 100 may be contaminated. Accordingly, by applying the photocatalyst to the inside of the light source unit 100, especially to the inner surface of the through hole 111, the light source unit 100 can be prevented from being contaminated by bacteria even when continuously used.

The photocatalyst applied to the inner surface of the through hole 111 is titanium oxide (TiO ₂ ), zinc oxide (ZnO), cadmium sulfide (CdS), zirconium oxide (ZrO ₂ ), vanadium oxide (V ₂ O ₃ ), tungsten oxide (WO ₃ ), and at least one selected from combinations thereof.

However, the position where the photocatalyst is applied is not necessarily limited to the inner surface of the through hole 111 . The photocatalyst may also be applied to the exterior of the main body 110 and the window 130 .

A thread 113 may be provided on one side of the main body 110 . The thread 113 may be used to fasten the main body 110 to other structures. For example, the main body 110 may be coupled to an auxiliary body or to a water tank in which a light source module is installed. When the main body 110 is fastened thereto, other components fastened to the main body 110 have threads corresponding to the thread 113 of the main body 110.

In the case of using a screw-type fastening structure, the plurality of screw wires 113 distributes and bears stress applied to the light source module 100 or the main body 110, so fastening strength can be improved. In addition, when using the spiral 113 method, the user can install the light source module 100 in a water tank or the like without additional equipment, so convenience can be improved.

In addition, although not shown in the drawing, a waterproof tape may be further provided on the screw line 113 to improve the waterproof structure. The waterproof tape may be Teflon (PTFE), polyethyl terephthalate (PET), acrylic resin, urethane resin, polyvinyl chloride (PVC), or the like. Since the waterproof tape has a relatively thin thickness and is flexible, it can closely adhere to the thread 113 . Accordingly, when the screw 113 of the main body 110 is combined with the corresponding screw, the waterproof tape fills the space between the two screws and water can be prevented from penetrating between the screws.

However, the thread 113 as a fastening method of the main body 110 is only exemplary. Therefore, a person skilled in the art can fasten the main body 110 to the auxiliary body or the water tank using various methods without the thread 113.

Referring to FIG. 1B , the main body 110 may include a protrusion 112 protruding in the z-axis direction. The protrusion 112 may have a shape different from that of the cross section of the through hole 111 . For example, when the through hole 111 has a circular cross section, the protruding portion 112 may have a rectangular shape with a rounded end. The protrusion 112 may perform a function of protecting the window 130 from external impact. However, in some cases, the protruding portion 112 may not be provided.

In addition, the protruding portion 112 may function as a portion that the user grips when the user installs the light source module 100 in a water tank or the like. The user can grip the protrusion 112 and rotate the light source module 100 in a screw manner to easily install it in a water tank or the like.

The height of the protrusion 112 may be such that the connectors 152 and 153 of the light source unit 150 do not come into contact with the main body 110 . Therefore, even if the connectors 152 and 153 are provided on the same side as the light emitting diode 151, the connectors 152 and 153 are not damaged by the main body 110.

The protrusion end 114 may have an inclined shape. Specifically, the end 114 of the protrusion may have an inclination spreading towards the end. Accordingly, light emitted from the light emitting diode 151 provided inside the through-hole 111 may spread more widely along the slope of the end 114 of the protrusion. Accordingly, an irradiation angle of the light source module 100 may be increased and light may be irradiated to a wider area of the tank.

The main body 110 is made of polyethylene, polypropylene, polyvinylchloride, polystyrene, ABS resin (Acrylonitrile-Butadiene-Styrene resin), methacrylate resin, and polyamide. (Polyamide), Polycarbonate, Polyacetyl, Polyethylene terephthalate, Modified Polyphenylene Oxide, Polybutylen terephthalate, Polyurethane, Phenol It may include any one selected from a resin (Phenolic resin), a urea resin (Urea resin), a melamine resin (Melamine resin), and combinations thereof.

The main body 110 may be manufactured using a method such as injection molding or extrusion molding.

A window 130 is provided in the main body 110 . The window 130 is provided in a direction in which light is emitted from the light source unit 150 and seals one side of the through hole 111 .

Therefore, the window 130 prevents water from penetrating into the main body 110 and is optically transparent so that light emitted from the light source unit 150 can exit the main body 110 .

At this time, being optically transparent means that the window 130 can transmit light in a specific wavelength range. For example, the window 130 may transmit light in an ultraviolet wavelength band. In particular, according to an embodiment of the present invention, the window 130 transmits only light in the UV-B and UV-C wavelength bands (about 100 nm to about 280 nm, and about 280 nm to about 320 nm) among the ultraviolet wavelength bands. , light in other wavelength bands may have a property of not being transmitted.

As the window 130 selectively transmits light in a partial wavelength band as described above, the sterilization effect of the light source module 100 may be improved. For example, light in the visible light wavelength band (about 380 nm to about 800 nm) or UV-A wavelength band (about 320 nm to about 380 nm) is helpful for the growth of phototrophic bacteria to be removed. because it can be In particular, in the case of UV-A wavelength, since it can promote the photoreactivation reaction of bacteria, the sterilization effect can be reduced. Accordingly, the window 130 may perform a function of not transmitting a specific wavelength of light emitted from the light source unit 150 .

Accordingly, the window 130 may further include a polarizing film on a surface of the window 130 to transmit only light in a specific wavelength band (eg, UV-B and UV-C wavelength bands).

The window 130 seals one side of the through hole 111 of the main body 110 and prevents water from penetrating into the light source module 100 through the through hole 111 . To this end, the window 130 may have a shape corresponding to the cross section of the through hole 111 of the main body 110 . For example, as shown in FIG. 1B , when the through hole 111 has a circular cross section, the window 130 may also have a circular shape. However, since there is no restriction on the cross-sectional shape of the through-hole 111, there is no restriction on the shape of the window 130 either. The window 130 may have various shapes such as a square, a rectangle, a trapezoid, a rhombus, a triangle, an ellipse, a semicircle, and a semi-ellipse in addition to a circular shape to correspond to the cross section of the through hole 111 .

The optically transparent window 130 may be formed using at least one of quartz, fused silica, poly methyl methacrylate (PMMA) resin, and a fluorine-based polymer resin material. .

The surface of the window 130 may be coated with water repellent. When the water-repellent coating is applied to the surface of the window 130 , water droplets that fall on the window 130 do not spread and can be easily separated from the surface of the window 130 by agglomeration. Therefore, it is possible to prevent a decrease in the amount of ultraviolet light emitted to the outside by water droplets falling on the window 130 .

A first waterproof member 121 may be provided between the window 130 and the main body 110 . The first waterproof member 121 fills an empty space between the window 130 and the main body 110 . Accordingly, the first waterproof member 121 may be made of a material having elasticity and may have a slightly larger diameter than the diameter of the through hole 111 .

After the first waterproof member 121 having a slightly larger diameter than the diameter of the through hole 111 is once compressed, it may be inserted into the through hole 111 of the main body 110 in a compressed state. The inserted first waterproof member 121 has elasticity and expands within the through-hole 111, and thus the through-hole 111 and the first waterproof member 121 may come into close contact. After the first waterproof member 121 is inserted, a window 130 may be provided in the through hole 111 . The window 130 may be pushed in the z-axis direction by the guard unit 140 or the like, and thus may come into close contact with the first waterproof member 121 . Accordingly, an empty space between the main body 110 and the window 130 may be removed, and the light source module 100 may be watertight.

The first waterproof member 121 not only prevents water from penetrating into the light source module 100 , but also functions as a buffer between the main body 110 and the window 130 . Therefore, the shock applied to the main body 110 may be transferred to the window 130 after being buffered. Accordingly, even when the window 130 is manufactured using a material having relatively low impact resistance, such as glass, breakage of the window 130 can be prevented.

The first waterproof member 121 may be formed of Viton, E.P.R (ETYLENE PROPYLENE), TEFLON, or KALREZ as a material, but is not limited thereto.

A guard unit 140 may be provided on the window 130 . The open portion of the guard portion 140 has a shape different from that of the through hole 111 . At this time, the open part shape of the guard part 140 means the shape of the opening excluding the area covered by the guard part 140 . The area covered by the guard unit 140 is meant to include an area covered by the wings 141 included in the guard unit 140 .

The guard part 140 has a wing 141 , and the wing 141 is integrally provided with the guard part 140 inside the guard part 140 . Since the wings 141 are provided, the open portion shape of the guard portion 140 is different from the cross-sectional shape of the through hole 111 .

For example, when the outer appearance of the guard part 140 is circular and the wing 141 protrudes from the inside of the guard part 140 like a string provided in a circle, the shape of the open part of the guard part 140 is attached to the wing 141. It has the shape of a rectangle whose two opposite sides are arcs, excluding the area covered by

A shape of the open portion of the guard unit 140 corresponds to a shape of the circuit board 155 of the light source unit 150 . The relationship between the circuit board 155 and the guard unit 140 will be described in detail in the description of FIG. 1C below.

The outer diameter of the guard unit 140 may be similar to that of the window 130 . Accordingly, the guard unit 140 may push the window 130 in the z-axis direction from the rear surface of the window 130 . Accordingly, as described above, the window 130 and the main body 111 or the first waterproof member 121 may come into close contact.

In addition, the outer shape of the guard part 140 may correspond to the shape of the cross section of the through hole 111 of the main body 110 . For example, when the shape of the cross section of the through hole 111 is circular, the outer appearance of the guard part 140 may also be circular. The external shape of the guard unit 140 may have various shapes such as a square, a rectangle, a trapezoid, a rhombus, a triangle, an ellipse, a semi-circle, and a semi-ellipse in addition to a circular shape to correspond to the cross section of the through-hole 111 .

The exterior of the guard part 140 does not necessarily need to come into close contact with the inner surface of the through hole 111 . However, the exterior of the guard part 140 may adhere to the through hole 111 so that the guard part 140 and the light source unit 150 in close contact with the guard part 140 may be fixed within the main body 110 . At this time, the outer appearance of the guard part 140 and the through-hole 111 do not have to be in close contact so as to be watertight.

In addition, although not shown in the drawing, a screw thread may be provided on the outside of the guard unit 140 . The screw line provided on the exterior of the guard part 140 may correspond to the screw line provided on the inner surface of the through hole 111 . Accordingly, the guard unit 140 may be coupled to the main body 110 in a screw manner. Since the guard part 140 is coupled to the main body 110 in a screw manner, the outer appearance of the guard part 140 and the through hole 111 may be brought into close contact. Accordingly, since the guard unit 140 can be more stably fixed in the main body 110, the structural stability of the light source module 100 can be improved. In addition, the user can further strengthen the watertight structure between the first waterproof member 121 and the window 130 by further pushing the guard part 140 in the z-axis direction along the outer spiral of the guard part 140. .

In addition, in addition to the method of fixing the guard part 140 with a screw type, the guard part 140 is coupled to the main body 110 by a hook type or a method of making and fixing the guard part 140 in the form of an elastic ring having elasticity. You may.

Also, according to one embodiment of the present invention, a pressing member 125 for fixing the guard part 140 to the main body 110 may be further provided. Although the pressing member 125 coupled with a screw is shown in FIG. 1B, the installation method of the pressing member 125 is not limited to the screw type.

The pressing member 125 may be a hook type fixed to the main body 110 and the guard part 140 in a hook manner. In addition, it is also possible to fix the guard part 140 by inserting the elastic ring-shaped fixing member into the rear side of the guard part 140 after contraction and using the force of expansion of the contracted elastic ring. In this case, a concave portion into which the elastic ring 140 can be inserted may be further provided on the inner surface of the through hole 111 .

When the pressing member 125 is provided in the form of a screw, the screw thread provided on the outer surface of the pressing member 125 may be engaged with the screw thread 113 of the main body 110 . By rotating the pressing member 125 along the screw line 113 of the main body 110, the pressing member 125 can be easily moved in the window 130 direction (z-axis direction). In addition, as the pressure member 125 moves in the direction of the window 130, components provided on the pressure member 125 may come into close contact with each other. At this time, components provided on the pressing member 125 include not only the circuit board 155 in contact with the pressing member 125, but also the guard part 140, the window 130, and the first waterproof member 121. ), and the main body 110.

As the components described above are brought into close contact with each other by the pressing member 125, the water-tightness of the light source module 100 according to the present invention can be improved.

The shape of the open part of the guard part 140 is determined according to the shape of the guard part 140 and the shape of the wing 141 . Furthermore, the shape of the open part of the guard part 140 is determined according to the shape of the circuit board 155 .

The guard unit 140 may function as a spacer to space the circuit board 155 of the light source unit 150 and the window 130 apart. Accordingly, the thickness of the guard unit 140 in the z-axis direction may be set to minimize loss of light emitted from the light source unit 150 . Accordingly, according to one embodiment, the thickness of the guard unit 140 in the z-axis direction may be set to be about 200 μm or more and about 2 mm or less. However, this is exemplary, and the distance between the transparent member 140 and the substrate 161 may be set to 2 mm or more according to embodiments.

The thickness of the wings 141 may be smaller than the thickness of the guard part 140 . Therefore, the wing 141 has a shape protruding from the inside of the guard part 140 . There is no particular limitation on the position where the wing 141 is provided, but the wing 141 may be provided integrally with the bottom surface of the guard part 140.

The guard part 140 is polyethylene, polypropylene, polyvinylchloride, polystyrene, ABS resin (Acrylonitrile-Butadiene-Styrene resin), methacrylate resin, polyamide. (Polyamide), Polycarbonate, Polyacetyl, Polyethylene terephthalate, Modified Polyphenylene Oxide, Polybutylen terephthalate, Polyurethane, Phenol It may include any one selected from a resin (Phenolic resin), a urea resin (Urea resin), a melamine resin (Melamine resin), and combinations thereof.

A light source unit 150 may be provided on the guard unit 140 . The light source unit 150 may include a light emitting diode 151 , connectors 152 and 153 , a wiring unit 154 , and a circuit board 155 .

The shape of the light source unit 150 is different from the shape of the through hole 111 of the main body 110 . For example, when the through hole 111 of the main body 110 has a first shape, the light source unit 150 has a second shape different from the first shape. In this case, the shape of the light source unit 150 may mean the shape of the circuit board 155 included in the light source unit 150 .

The light emitting diode 151 included in the light source unit 150 may be a vertical light emitting diode.

In this case, the light emitting diode 151 includes a conductive substrate, a metal reflective layer formed on the conductive substrate, an N-type semiconductor layer formed on the metal reflective layer, an active layer formed on the N-type semiconductor layer, and a P-type semiconductor layer formed on the active layer. As the light emitting diode 151 has a structure in which the conductive substrate is bonded to the N-type semiconductor layer as described above, there is no problem of leakage current being formed at the bonding interface between the thin P-GaN and the conductive substrate. Accordingly, light emitting efficiency of the light emitting diode 151 may be improved.

In addition, according to an embodiment, the vertical light emitting diode 151 may further include a transparent electrode layer formed of ITO or Ni/Au on the P-type semiconductor layer. Also, the surface of the N-type semiconductor layer in contact with the metal reflective layer may be roughened.

However, the shape of the light emitting diode 151 is not limited to the vertical type light emitting diode.

The light emitting diode 151 includes a first conductivity type semiconductor layer, a second conductivity type semiconductor layer disposed on the first conductivity type semiconductor layer, and an active layer disposed between the second conductivity type semiconductor layer and the first conductivity type semiconductor layer. It may include a mesa including a first electrode disposed on the mesa. At this time, the first conductivity-type semiconductor layer includes a first contact region disposed around the mesa along the periphery of the first conductivity-type semiconductor layer and a second contact region at least partially surrounded by the mesa, and the first electrode is At least a portion of the first contact area and at least a portion of the second contact area may be electrically connected.

The light emitting diode 151 may perform a function of emitting light to the outside of the light source module 100 . According to an embodiment of the invention, light emitted from the light emitting diode 151 may have a wavelength in the ultraviolet wavelength band. In particular, the light emitting diode 151 may emit light in a UV-C wavelength band (about 100 nm to about 280 nm) among ultraviolet wavelength bands. As described above, since light in the UV-A wavelength band (about 320 nm to about 380 nm) can promote a photoreactivation reaction of phototrophic bacteria, the light emitting diode 151 is a UV-A light emitting diode 151. Only light in the C wavelength band can be emitted.

According to an embodiment of the present invention, a plurality of light emitting diodes 151 may be provided.

The light emitting diode 151 may be connected to an external power source through connectors 152 and 153 and a wiring unit 154 . The light emitting diode 151 and the connectors 152 and 153 are provided on the same side.

According to the embodiments shown in FIGS. 1B and 1C , the circuit board 155 may include metal. Therefore, when using the circuit board 155 shown in FIGS. 1B and 1C , it is difficult to form a pattern on the rear surface of the surface provided with the light emitting diodes 151 . In this case, the pattern means to include pads on which the light emitting diode 151, the connectors 152 and 153, and the like can be provided.

Accordingly, according to the embodiment shown in FIGS. 1B and 1C, the light emitting diode 151 and the connectors 152 and 153 are provided on the same side.

According to FIG. 1B , the circuit board 155 has a shape different from that of the through hole 111 . A light reflection layer may be provided on one surface of the circuit board 155 . The light reflective layer may be provided on the surface where the light emitting diode 151 is provided, and light emitted from the light emitting diode 151 may be reflected toward the window 130 to improve light efficiency of the light source module 100 .

A light reflection layer may also be provided on the inner surface of the guard part 140 . Accordingly, among the light emitted from the light emitting diode 151, light that does not travel straight in the z-axis direction may be reflected from the inner surface of the guard unit 140 and then emitted toward the window.

A photocatalyst may be applied on the inner surface of the guard unit 140 and the circuit board 155 . Matters related to the photocatalyst are as described above. The photocatalyst generates a sterilizing substance by receiving ultraviolet rays, and thus, contamination of the inner surface of the guard part 140 or the circuit board 155 can be prevented.

The light reflecting layer or photocatalyst may include a metal or metal oxide. Therefore, in order to prevent a short circuit between the light reflective layer or photocatalyst on the circuit board 155 and the light emitting diode 151, the connectors 152 and 153, or the wiring unit 154, the light reflective layer or the light The catalyst and the light emitting diode 151, the connectors 152 and 153, or the wiring unit 154 may be insulated.

The circuit board 155 may include metal. The metal may be an alloy of copper, aluminum, iron, and combinations thereof, and the like. However, the type of metal that can be used for the circuit board 155 is not limited, and the above-described metals are merely exemplary.

As will be described later, as the circuit board 155 and the guard part 140 are sealed, heat generated from the light emitting diodes 151 provided on the front surface of the circuit board 155 may need to be discharged to the rear surface of the circuit board 155. there is. Accordingly, the circuit board 155 may include a material having relatively high thermal conductivity.

According to the present invention, a waterproof resin is provided on the rear surface of the circuit board 155 . Details regarding the waterproof resin will be described later in the description of FIG. 3 .

1C is an exploded perspective view illustrating a coupling relationship between a guard unit and a light source unit according to an exemplary embodiment.

Referring to FIG. 1C , a coupling relationship between the guard unit 140 and the light source unit 150 can be confirmed. The guard part 140 includes a wing 141, and the wing 141 may be provided to the guard part 140 in the form of a string formed in a circle.

A plurality of wings 141 may be provided, and when two wings 141 are provided, the two wings 141 may be provided to the guard unit 140 in a form facing each other. The size of the wings 141 is not particularly limited. However, the size and shape of the wing 141 may be determined so that the guard unit 140 and the light source unit 150 may come into close contact with each other.

The wing 141 may be integrally provided with the guard part 140 on the bottom surface of the guard part 140 . Accordingly, a step 142 is provided on the bottom surface of the guard part 140 . The height of the step 142 is equal to the thickness of the wings 141. In addition, the height of the step 142 may be the same as the thickness of the circuit board 155 of the light source unit 150 . Accordingly, the light source unit 150 may be inserted into the portion of the step 142 provided in the guard part 140 . Therefore, when the guard unit 140 and the light source unit 150 are coupled, the bottom surface of the guard unit 140 and the bottom surface of the light source unit 150 can be connected flatly and continuously. The direction width may be equal to the distance between the two wings 141 of the guard unit 140 . Accordingly, when the light source unit 150 and the guard unit 140 are coupled, the gap between the guard unit 140 and the light source unit 150 may be sealed. In addition, when the size of the guard part 140 is the same as the size of the cross section of the main body through-hole, so that the guard part 140 and the through-hole come into close contact with each other, the light source unit 150 is coupled to the guard part 140 so that the light emitting diode ( 151) can be completely sealed.

Accordingly, even if the waterproof resin is filled on the rear surface of the circuit board 155, the waterproof resin does not penetrate into the front surface of the circuit board 155 or the first surface of the circuit board 155 where the light emitting diodes 151 are provided.

Concave portions 143 and 143' may be provided on the side of the guard portion 140 . Positions of the concave portions 143 and 143' in the guard portion 140 may vary depending on the provision form of the light source unit 150. Specifically, the concave portions 143 and 143' may be provided at locations where the connectors 152 and 153 of the light source unit 150 and the wire portion 154 are disposed. Accordingly, even when the guard unit 140 and the circuit board 155 are in close contact with each other, components of the light source unit 150 are not damaged by the guard unit 140 .

In addition, the concave portions 143 and 143' of the guard portion 140 also perform a function of fixing the wiring portion 154 and the connectors 152 and 153. Specifically, in a state where the guard part 140 and the circuit board 155 are in close contact with each other, the wiring part 154 and the connectors 152 and 153 provided in the concave parts 143 and 143' allow the light source unit 100 to Even if it fluctuates, it can be fixed without moving.

The wing 141 may be provided with a fixing protrusion 144 . The fixing protrusion 144 prevents the circuit board 155 from moving beyond the wing 141 in the z-axis direction of the wing 141 when the circuit board 155 and the guard part 140 are coupled. The number and shape of the fixing protrusions 144 are not limited. The fixing protrusion 144 may be extended in the x-axis direction or the y-axis direction according to the provided shape of the wing 141 . Accordingly, movement of the circuit board 155 in the z-axis direction may be restricted. One or more fixing protrusions 144 may be provided on each wing 141 .

The circuit board 155 corresponds to the shape of the open portion defined by the guard portion 140 and the wing 141 . Therefore, when the guard part 140 is circular and the wing 141 has the shape of a chord provided in a circle, the circuit board 155 will have a shape similar to a rectangle made of two arcs and a straight line connecting the two arcs. can However, the shape of the circuit board 155, the wing 141, or the guard part 140 is not limited thereto. A person skilled in the art may design each component in a form different from that shown in the drawings.

However, even when the shape of the circuit board 155, the wing 141, or the guard part 140 is changed, the circuit board 155 is the same as the open part defined by the guard part 140 and the wing 141. have a shape

As described above, according to one embodiment of the present invention, the light source module 100 has a watertight structure. Accordingly, it is possible to prevent water from penetrating into the light source module 100 . In addition, even if water penetrates into the light source module 100, the water that penetrates does not flow into the device in which the light source module 100 is installed along the light source module 100. Accordingly, penetration of water into the device along the light source module 100 may be prevented.

2A and 2B are exploded perspective views of a light source module according to another embodiment of the present invention.

In describing the embodiments disclosed in FIGS. 2A and 2B, the same configuration as the above-described items will not be described in order to avoid duplication of content. Accordingly, a person skilled in the art may employ configurations disclosed in other embodiments to implement the embodiments disclosed in FIGS. 2A and 2B.

According to FIG. 2A , the light source module 100 includes a main body 110 , a first waterproof member 121 , and a light source unit 150 . In addition, the light source unit 150 includes a circular circuit board 155 .

According to one embodiment of the present invention, since the shape of the circuit board 155 corresponds to the cross-sectional shape of the through hole 111 of the main body 110, the main body 110 and the circuit board can be formed without the guard part 140. (155) can be sealed. Therefore, when filling the back side of the circuit board 155 with waterproof resin, the waterproof resin does not penetrate beyond the circuit board 155 or to the front side of the circuit board 155 .

Although the cross section of the through hole 111 and the circuit board 155 are shown as circular in FIG. 2A , the cross section of the through hole 111 and the shape of the circuit board 155 are not limited thereto. They can have a variety of shapes, such as squares, rectangles, trapezoids, rhombuses, triangles, ellipses, semi-circles, and semi-ellipses.

As the circuit board 155 has a shape corresponding to the cross section of the through hole 111, the guard part 140 does not have wings. Accordingly, the open portion defined by the guard portion 140 also has a shape corresponding to the through hole 111 .

According to the embodiment shown in FIG. 2A, the circuit board 155 includes a resin composition layer. For example, the circuit board 155 may have a multilayer structure including a resin composition layer. The resin composition layer included in the circuit board 155 may be a glass fiber fabric or the like. The glass fiber fabric may be a mixture of glass fiber, epoxy resin, phenol resin, and the like.

In addition, the circuit board 155 may include a metal layer provided on the resin composition layer. For example, the circuit board 155 may have a form in which a metal layer/resin composition layer/metal layer are sequentially stacked. In this case, the metal layer may be an alloy formed of copper, silver, iron, aluminum, gold, or a combination thereof.

As the multilayer circuit board 155 including the resin composition layer is used, the light emitting diode 151 and the connector 152 can be provided on both sides of the circuit board 155 . Accordingly, the light emitting diode 151 may be provided on one surface of the circuit board 155, and the connector 152 may be provided on the rear surface of the surface on which the light emitting diode 151 is provided.

By providing the connector 152 and the light emitting diode 151 on different surfaces of the circuit board 155, the overall size of the light source unit 100 can be reduced.

In addition, by providing the connector 152 and the light emitting diode 151 on different sides of the circuit board 155, the light emitting diode 151 may be disposed closer to the window 130. Accordingly, the amount of light blocked by the outer wall of the main body 110 among the light emitted from the light emitting diode 151 can be significantly reduced. In addition, since the light emitting diode 151 is positioned close to the window 130, there is less light blocked by the main body 110, and thus a relatively wider irradiation angle can be secured.

As described above, by providing the connector 152 and the light emitting diode 151 on different surfaces of the circuit board 155, a wider irradiation angle can be secured, and the size of the circuit board 155 is made smaller. It is also possible to do As the size of the circuit board 155 can be made smaller, the overall size of the light source module 100 can also be made smaller.

As the overall size of the light source module 100 decreases, the size of an opening drilled in an outer wall of a water tank or the like to install the light source module 100 may decrease. Accordingly, a leakage phenomenon in which water penetrates through the opening can be prevented.

In addition, although the top of the main body 110 is shown as protruding in FIG. 2A, according to FIG. 2A, the connector 152 is provided on the back surface of the circuit board 155, as much as the height of the connector 152, There is no need to protrude the upper part of the main body 110. Therefore, the upper part of the main body 110 may be flat without protruding parts.

The guard unit 140 pushes and fixes the window 130 in the z-axis direction and functions as a spacer that separates the window 130 from the circuit board 155 .

Referring to FIG. 2B , the coupling relationship between the guard unit 140 and the light source unit 150 can be confirmed in more detail.

According to FIG. 2B, the guard part 140 does not include a step as shown in FIG. 1C. This is because the shape of the circuit board 155 is the same as that of the cross section of the through hole 111 .

When the guard part 140 has a donut shape, the outer diameter of the guard part 140 may be the same as the diameter of the circuit board 155 . In addition, the inside diameter of the guard part 140 may be smaller than the diameter of the circuit board 155 . Accordingly, the guard unit 140 may function as a spacer so that the circuit board 155 does not meet the window 130 provided on the guard unit 140 .

The height of the guard part 140 may be such that the light emitting diode 151 is protected from contact with the window 130 while maximizing an irradiation angle of the light emitting diode 151 . As the height of the guard part 140 surrounding the light emitting diode 151 increases, light emitted from the light emitting diode 151 in a lateral direction may be blocked by the guard part 140 . Therefore, the height of the guard part 140 may be a minimum height capable of protecting the light emitting diode 151 from contacting the window 130 .

3A and 3B are cross-sectional views of a light source module according to an embodiment of the present invention.

Referring to FIGS. 3A and 3B , it can be confirmed that the waterproof resin 180 is filled on the rear surface of the circuit board 155 or on the second surface of the circuit board 155 . The waterproof resin 180 is made by curing the waterproof resin composition and seals one side of the through hole 111 .

The waterproof resin composition includes epoxy resin, silicone oil, polyethylene, polypropylene, polyvinylchloride, polystyrene, and ABS resin (Acrylonitrile-Butadiene-Styrene). resin), Methacrylate resin, Polyamide, Polycarbonate, Polyacetyl, Polyethylene terephthalate, Modified Polyphenylene Oxide, Polybutylene terephthalate At least one selected from polybutylen terephthalate, polyurethane, phenolic resin, urea resin, melamine resin, and combinations thereof may be used.

It is preferable that the waterproof resin 180 does not react with water and can prevent penetration of water.

In addition, it is preferable that the waterproof resin 180 is not deformed by heat. This is because when the water tank in which the light source module 100 is installed is heated when the waterproof resin 180 is deformed by heat, the shape and physical properties of the waterproof resin 180 in the light source module 100 may change.

In particular, when a thermoplastic resin having a low glass transition temperature is used, the shape of the waterproof resin 180 is deformed due to an increase in ambient temperature or heat emitted from the light emitting diode 151, and the outside along the deformed gap. Moisture and water may permeate into the light source module 100 . Therefore, the waterproof resin 180 may be formed using a material having a relatively high glass transition temperature.

In addition, the waterproof resin 180 can be manufactured using a waterproof resin composition that is easy to mold. Ease of molding means that application of the waterproof resin composition and curing of the waterproof resin composition are relatively easy.

As the curing of the waterproof resin composition, heat curing, UV curing, natural curing, and the like may be used. However, in order to improve the efficiency of the process, a natural curing method may be used as a method of curing the waterproof resin composition. The natural curing method may refer to applying a waterproof resin composition at room temperature and then curing it through drying. Therefore, in the natural curing method, since a separate heating process or an ultraviolet irradiation process is unnecessary, the manufacturing process efficiency of the light source module 100 can be improved.

In order to naturally cure the waterproof resin composition, a curing agent and/or a coupling agent may be further included in the waterproof resin composition.

The process of filling the waterproof resin 180 may be performed in an environment with low humidity. Accordingly, the humidity of the inner space of the light source module 100 sealed by the waterproof resin 180 and the window 130 may be relatively low. If the internal humidity of the light source module 100 is lowered in this way, condensation in which water vapor inside the light source module 100 is liquefied can be prevented even if the internal temperature of the light source module 100 changes later.

As the waterproof resin 180 seals the inside of the light source module 100, the temperature of the circuit board 155 provided inside the light source module 100 is hardly affected by the external temperature. Accordingly, even when the temperature of the environment in which the light source module 100 is installed increases or decreases, the temperature of the circuit board 155 can be maintained constant.

According to the present invention, since the temperature of the circuit board 155 is kept constant, normal operation of the light source module 100 can be ensured even in an extreme environment of high or low temperature.

The waterproof resin 180 may also perform a function of dissipating heat generated inside the light source module 100 to the outside. In this case, the thermal conductivity of the waterproof resin 180 is relatively high.

In order to increase the thermal conductivity of the waterproof resin 180, the waterproof resin composition is mixed with carbon-based nanofiller, graphite nanoplatelets (GNPs), silica, carbon nanotube, etc. It can be. For example, the waterproof resin composition may be a mixture of an epoxy resin, a carbon-based nanofiller, and graphite nanopallets (GNPs).

According to an embodiment, diglycidyl ether of bisphenol-A (DGEBA) and 2-ethyl-4-methylimidazole, and γ-aminopropyltri By mixing a mixture of ethoxysilane (γ-aminopropyl-triethoxysilane), carbon-based nanofiller, graphite nanoplatelets (GNPs), silica, carbon nanotube, etc. , a waterproof resin composition can be produced.

The thermal conductivity of the waterproof resin 180 prepared according to the above embodiment is about 7.06 W/(m·K), which is significantly higher than the thermal conductivity of about 0.28 W/(m·K) of general epoxy resin. Therefore, even if the waterproof resin 180 seals the inside of the main body 110 provided with the light source unit 150, the heat generated from the light source unit 150 can easily escape to the outside of the main body 110. Accordingly, heat generated from the light source unit 150 is accumulated inside the main body 110 to prevent the light source unit 150 from malfunctioning.

Referring to FIG. 3A , it can be seen that the wings 141 provided on both sides of the guard unit 140 are in contact with the circuit board 155 . Accordingly, when the uncured waterproof resin composition is filled into the blank body 110, the waterproof resin composition does not penetrate toward the front surface of the circuit board 155. Accordingly, a problem that the resin composition covers the window 130 and blocks light emitted from the light emitting diode 151 does not occur.

Referring to FIG. 3B , the shape of the circuit board 155 corresponds to the shape of the cross section of the through hole 111 . Accordingly, the guard unit 140 is not provided with wings, and the bottom surface of the guard unit 140 and the top surface of the circuit board 155 come into contact with each other. Even in this case, there is no fear that the waterproof resin composition penetrates toward the window 130 beyond the circuit board 155 .

In particular, referring to FIG. 3B , since the connectors 152 and 153 are provided on the rear surface of the circuit board 155, there is more room for exposure to water penetrating into the rear surface of the light source unit. Therefore, in the case of the embodiment as shown in FIG. 3B , the waterproof resin 180 may be filled in a form completely surrounding the connectors 152 and 153 .

Referring to FIGS. 3A and 3B , a second waterproof member 122 may be further provided outside the main body 110 . When the light source module 100 is installed in a water tank or the like, the second waterproof member 122 seals a portion where the light source module 100 is installed, for example, between the inner wall of the water tank and the light source module 100 . Accordingly, it is possible to prevent water from leaking into the water tank through the opening where the light source module 100 is installed.

The second waterproof member 122 may be formed of Viton, E.P.R (ETYLENE PROPYLENE), TEFLON, or KALREZ as a material, but is not limited thereto.

A concave portion capable of accommodating the second waterproof member 122 may be provided on the exterior of the main body 110 . As can be seen in the drawing, at least a part of the second waterproof member 122 is inserted into the concave portion provided on the exterior of the main body 110 .

4A is a perspective view of a light source module according to an embodiment of the present invention. 4B is an exploded perspective view of a light source module according to an embodiment of the present invention. 4C is a cross-sectional view of a light source module according to an embodiment of the present invention.

In addition, Figures 4d and 4e is an exploded perspective view and cross-sectional view of the light source module according to another embodiment of the present invention, respectively.

Hereinafter, a light source module according to an embodiment of the present invention will be described with reference to FIGS. 4A to 4E.

According to one embodiment of the present invention, the light source module 100 may further include an auxiliary body 160 . The auxiliary body 160 may be coupled to the main body 110 .

As shown in Figures 4b and 4c, when the main body 110 has a thread, the auxiliary body 160 may have a thread corresponding to the thread of the main body (110). Accordingly, the main body 110 and the auxiliary body 160 may be screwed together.

However, the coupling method of the auxiliary body 160 and the main body 110 is not limited to the screw type. The auxiliary body 160 and the main body 110 may be detachably coupled using a hook.

When coupling the main body 110 and the auxiliary body 160 by means of screws, a waterproof tape may be further provided between the threads of the main body 110 and the auxiliary body 160 . The waterproof tape may be Teflon (PTFE), polyethyl terephthalate (PET), acrylic resin, urethane resin, polyvinyl chloride (PVC), or the like. Since the waterproof tape is relatively thin and flexible, it can closely adhere to the thread. Accordingly, when the screw of the main body 110 and the corresponding screw of the auxiliary body 160 are combined, the waterproof tape fills the space between the two screws and water can be prevented from penetrating between the screws.

The auxiliary body 160 is made of polyethylene, polypropylene, polyvinylchloride, polystyrene, ABS resin (Acrylonitrile-Butadiene-Styrene resin), methacrylate resin, polyamide. (Polyamide), Polycarbonate, Polyacetyl, Polyethylene terephthalate, Modified Polyphenylene Oxide, Polybutylen terephthalate, Polyurethane, Phenol It may include any one selected from a resin (Phenolic resin), a urea resin (Urea resin), a melamine resin (Melamine resin), and combinations thereof.

Materials constituting the main body 110 and the auxiliary body 160 do not necessarily have to be the same.

In addition, the shape of the main body 110 and the shape of the auxiliary body 160 does not have to be the same. Specifically, when the fastening part of the main body 110 is circular, the fastening part 161 of the auxiliary body may be circular or other shapes. For example, as shown in the drawing, when the fastening part of the main body 110 is circular, the fastening part 161 of the auxiliary body 160 may be rectangular. Accordingly, even when the fastening part of the main body 110 does not match the shape of the fastening part of the water tank to be assembled, the auxiliary body 160 having the fastening part 161 corresponding to the shape of the fastening part of the water tank to be assembled is introduced, thereby introducing the light source module. (100) can be installed.

In addition, the outer shape of the main body 110 and the outer shape of the auxiliary body 160 may be different from each other. For example, the main body 110 may have a circular shape, and the auxiliary body 160 may have a polygonal shape. The auxiliary body 160 having a polygonal shape is easy for a user to grip when the light source module 100 is installed in a water tank or the like in a screw manner.

In addition, when comparing the fastening part of the main body 110 and the fastening part of the auxiliary body 160, the size of the fastening part of the auxiliary body 160 may be smaller than the size of the fastening part of the main body 110. A description of the size of the fastening portion will be described later in detail in the description of FIGS. 5A and 5B.

The third waterproof member 123 and the fixing member 170 may be provided to the fastening part 161 of the auxiliary body 160 .

When the light source module 100 including the auxiliary body 160 is installed in a water tank or the like, the third waterproof member 123 prevents water from leaking out along an opening formed in the water tank or the like to install the light source module 100 therein. .

The third waterproof member 123 may be made of a material having elasticity and has low reactivity with water. The third waterproof member 123 may be formed of Viton, E.P.R (ETYLENE PROPYLENE), TEFLON, or KALREZ as a material, but is not limited thereto.

The fixing member 170 is a member for fixing the light source module 100 including the auxiliary body 160 to a water tank or the like. Therefore, the fixing member 170 and the light source module 100 are spaced apart from each other with the inner wall of the water tank or the like interposed therebetween. The fixing member 170 may have a screw thread corresponding to the fastening portion 161 of the auxiliary body 160 . Accordingly, by rotating and coupling the fixing member 170, the light source module 100 may be fixed to the inner wall of the water tank or the like.

In addition, the third waterproof member 123 may be provided on the same surface as the surface on which the fixing member 170 is provided or on the same surface as the surface on which the light source module 100 is provided. That is, the third waterproof member 123 may be provided inside or outside the water tank. A person skilled in the art may determine the installation position of the third waterproof member 123 in consideration of the overall size of the light source module 100 .

The waterproof resin 180 fills at least a portion of the inside of the main body 110 and the inside of the fastening part 161 of the auxiliary body 160 . The inside of the fastening part 161 has a hollow structure like the through hole 111 of the main body 110, and the waterproof resin 180 may be filled inside the fastening part 161.

At this time, the amount of filling the waterproof resin 180 can be varied as needed. Therefore, the inside of the main body 110 and the fastening part 161 of the auxiliary body 160 may be filled with waterproof resin so that the waterproof resin 180 comes into contact with the rear surface of the circuit board 155 . However, in some cases, the waterproof resin 180 may fill only a portion of the fastening portion 161 . However, it is preferable to fill the waterproof resin 180 to seal one side of the fastening part 161 in order to improve the waterproof function.

The auxiliary body 160 disclosed in FIGS. 4A to 4B may be applied to both an embodiment in which the guard unit 140 includes wings and an embodiment in which the wing is not included.

In the embodiment shown in FIGS. 4D and 4E , the light emitting diode 151 and the connector 152 are provided on different sides of the circuit board 155 . As can be seen in FIG. 4E , in this case, the waterproof resin 180 may be provided in a form completely surrounding the connector 152 .

5A to 5D are cross-sectional views illustrating a state in which a light source module according to an embodiment of the present invention is installed.

Referring to FIGS. 5A and 5C , each light source module without an auxiliary body is installed in a water tank. In addition, referring to FIGS. 5B and 5D , the light source module including the auxiliary body is installed in the water tank. Hereinafter, the light source modules installed in FIGS. 5A to 5D will be compared and described.

The light source module is coupled to an opening provided on the outer wall of the water tank. The opening provided on the outer wall of the water tank may have a screw thread corresponding to a screw provided on the main body or the auxiliary body of the light source module.

5A and 5C, the opening provided on the outer wall of the water tank has a first width W1. In contrast, in the case of FIGS. 5B and 5D, the opening provided on the outer wall of the water tank has a second width W2. The first width W1 is relatively larger than the second width W2.

Since the second width W2 is smaller than the first width W1, a relatively small opening is sufficient when installing the light source module employing the auxiliary body. Accordingly, it may be relatively less likely that water inside the tank leaks out of the tank through the opening.

In addition, since the size of the opening is small, the stress applied to the water tank is relatively low due to the opening and the light source module coupled to the opening.

Depending on the presence or absence of the auxiliary module, the height between the light source module and the surface of the water also varies. The height H2 when the auxiliary module is included is smaller than the height H1 when the auxiliary module is not included. Therefore, when including the auxiliary module, the light source module is provided closer to the surface of the water.

Accordingly, the amount of light irradiated to the water stored in the water tank may be increased. Specifically, when the light source module is provided close to the surface of the water, all light emitted from the light source module can be irradiated onto the water regardless of an emission angle. Therefore, by employing the auxiliary module, water sterilization efficiency using the light source module can be improved.

6A and 6B are cross-sectional views illustrating enlarged light emitting diodes of a light source unit according to an embodiment of the present invention.

As described above, the light emitting diode 151 according to the present invention may be implemented in various forms. 6A and 6B are cross-sectional views illustrating one embodiment of a light emitting diode.

The light emitting diode may be configured in various forms such as a vertical type or a flip type, and FIG. 6A shows a vertical light emitting diode, and FIG. 6B shows a flip type light emitting diode. However, the configuration of the light emitting diode is not limited thereto, and the following drawings should be understood as an embodiment of the present invention.

Referring to FIG. 6A , the light emitting diode 151 includes a first conductivity type semiconductor layer 1511 , an active layer 1512 and a second conductivity type semiconductor layer 1513 . A substrate 1500 used as a first electrode, an adhesive layer 1501, and a reflective layer 1509 are disposed under the first conductivity type semiconductor layer 1511 of the light emitting diode 151 to form the second conductivity type semiconductor 1513. A second electrode 1520 may be provided on the top.

The substrate 1510 may be made of a conductive material, such as Si, GaAs, GaP, AlGaINP, Ge, SiSe, GaN, AlInGaN, or InGaN, or Al, Zn, Ag, W, Ti, Ni, Au, Mo, or Pt. , Pd, Cu, Cr or Fe, or a single metal or an alloy thereof.

The second conductivity-type semiconductor layer 1513 may be disposed on the first conductivity-type semiconductor layer 1511, and the active layer 1512 includes the first conductivity-type semiconductor layer 1511 and the second conductivity-type semiconductor layer 1513. can be placed in between. The first conductivity type semiconductor layer 1511, the active layer 1512, and the second conductivity type semiconductor layer 1513 may include a III-V series compound semiconductor, for example, (Al, Ga, In)xNy. It may include a nitride-based semiconductor such as. The first conductivity type semiconductor layer 1511 may include first conductivity type impurities (eg, Si), and the second conductivity type semiconductor layer 1513 may include second conductivity type impurities (eg, Mg). can include Also, the opposite may be true.

In one embodiment of the present invention, the first conductivity type semiconductor layer 1511 may be subjected to a roughening process. Accordingly, light generated from the active layer 1512 may be reflected at the roughened interface.

In an embodiment of the present invention, a reflective layer 1509 may be interposed between the first conductivity type semiconductor layer 1511 and the light source substrate 1510 . The reflective layer 1509 may be made of a metal material having a high reflectance, such as silver (Ag) or aluminum (Al), and may be made of other metals or alloys thereof having a high reflectance.

Meanwhile, an adhesive layer 1501 may be interposed between the reflective layer 1509 and the substrate 1510, and the adhesive layer 1501 may improve adhesion between the substrate 1510 and the reflective layer 1509 so that the substrate 1510 may adhere to the reflective layer 1509. ) to prevent separation from In addition, although not shown, an anti-diffusion layer may be interposed between the adhesive layer 1501 and the reflective layer 1509 . The anti-diffusion layer may prevent metal elements from being diffused into the reflective layer 1509 from the adhesive layer 1509 or the substrate 1510 to maintain reflectivity of the reflective layer 1509 .

A second electrode 1520 is disposed on the second conductivity type semiconductor layer 1513 . Accordingly, light can be emitted by supplying current from the substrate 1510 used as the first electrode and the second electrode 1520 to the first conductivity type semiconductor layer 1511 and the second conductivity type semiconductor layer 1513. there is.

Referring to FIG. 6B , the light emitting diode 151 according to an exemplary embodiment of the present invention includes a first conductivity type semiconductor layer 1511, an active layer 1512, and a second conductivity type semiconductor layer 1513. ), the first insulating layers 1530a and 1530b, the first electrode 1540, and the second insulating layer 1550 may be included, and further, the substrate 1510 and the second electrode 1520 may be included. there is.

The substrate 1510 is not limited as long as it can grow the first conductivity-type semiconductor layer 1511, the active layer 1512, and the second conductivity-type semiconductor layer 1513, and for example, a sapphire substrate or silicon carbide. It may be a substrate, a gallium nitride substrate, an aluminum nitride substrate, a silicon substrate, or the like. A side surface of the substrate 1510 may include an inclined surface, and thus extraction of light generated from the active layer 1512 may be improved.

The second conductivity-type semiconductor layer 1513 may be disposed on the first conductivity-type semiconductor layer 1511, and the active layer 1512 includes the first conductivity-type semiconductor layer 1511 and the second conductivity-type semiconductor layer 1513. can be placed in between. The first conductivity type semiconductor layer 1511, the active layer 1512, and the second conductivity type semiconductor layer 1513 may include a III-V series compound semiconductor, for example, (Al, Ga, In)xNy. It may include a nitride-based semiconductor such as. The first conductivity type semiconductor layer 1511 may include first conductivity type impurities (eg, Si), and the second conductivity type semiconductor layer 1513 may include second conductivity type impurities (eg, Mg). can include Also, the opposite may be true. The active layer 1512 may include a multi-quantum well structure (MQM). When a forward bias is applied to the light emitting diode, light is emitted while electrons and holes are combined in the active layer 1512 . The first conductivity type semiconductor layer 1511, the active layer 1512, and the second conductivity type semiconductor layer 1513 are formed on the substrate 1510 using a technique such as metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE). ) can be grown on

The light emitting diode may include at least one mesa M including an active layer 1512 and a second conductivity type semiconductor layer 1513 . The mesa M may include a plurality of protrusions, and the plurality of protrusions may be spaced apart from each other. It is not limited thereto, and the light emitting diode may include a plurality of mesas M spaced apart from each other. The side surface of the mesa M may be formed to be inclined by using a technique such as photoresist reflow, and the inclined side surface of the mesa M may improve light emitting efficiency generated in the active layer 1512 .

A first contact region P1 and a second contact region P2 exposed through the mesa M are provided on the first conductivity type semiconductor layer 1511 . Since the mesa M is formed by removing the active layer 1512 and the second conductivity type semiconductor layer 1513 disposed on the first conductivity type semiconductor layer 1511, the portion excluding the mesa M is the first conductivity type semiconductor layer. It becomes the contact region which is the exposed upper surface of the type semiconductor layer 1511. The first electrode 1540 may be electrically connected to the first conductive semiconductor layer 1511 by contacting the first contact region P1 and the second contact region P2 . The first contact region P1 may be disposed around the mesa M along the periphery of the first conductivity type semiconductor layer 1511, and specifically, between the mesa M and the side surface of the light emitting diode. It may be disposed along the outer edge of the upper surface of the semiconductor layer. The second contact region P2 may be at least partially surrounded by the mesa M.

The second electrode 1520 is disposed on the second conductivity type semiconductor layer 1513 and can be electrically connected to the second conductivity type semiconductor layer 1513 . The second electrode 1520 is formed on the mesa M and may have the same shape as the mesa M. The second electrode 1520 includes a reflective metal layer 1521 and may further include a barrier metal layer 1522 , and the barrier metal layer 1522 may cover top and side surfaces of the reflective metal layer 1521 . For example, by forming a pattern of the reflective metal layer 1521 and forming the barrier metal layer 1522 thereon, the barrier metal layer 1522 may be formed to cover the upper and side surfaces of the reflective metal layer 1521 . For example, the reflective metal layer 1521 may be formed by depositing and patterning Ag, Ag alloy, Ni/Ag, NiZn/Ag, or TiO/Ag layers.

Meanwhile, the barrier metal layer 1522 may be formed of Ni, Cr, Ti, Pt, Au, or a composite layer thereof. Specifically, Ni/Ag/[Ni/ Ti]2/Au/Ti may be a composite layer, and more specifically, at least a portion of the upper surface of the second electrode 1520 may include a Ti layer having a thickness of 300 Å. When the region of the upper surface of the second electrode 1520 in contact with the first insulating layer is made of a Ti layer, the adhesive strength between the first insulating layers 1530a and 1530b and the second electrode 1520 is improved, thereby increasing the reliability of the light emitting diode. can be improved

An electrode protection layer 1560 may be disposed on the second electrode 1520 . The electrode protection layer 1560 may be made of the same material as the first electrode 1540, but is not limited thereto.

The first insulating layers 1530a and 1530b may be disposed between the first electrode 1540 and the mesa M. Through the first insulating layers 1530a and 1530b, the first electrode 1540 and the mesa M may be insulated, and the first electrode 1540 and the second electrode 1520 may be insulated. The first insulating layers 1530a and 1530b may partially expose the first contact region P1 and the second contact region P2. Specifically, the first insulating layers 1530a and 1530b may expose a portion of the second contact region P2 through the opening 1530a, and the first insulating layers 1530a and 1530b may be the first conductive semiconductor layer. At least a portion of the first contact area P1 may be exposed by covering only a part of the first contact area P1 between the periphery of the 1511 and the mesa M.

The first insulating layers 1530a and 1530b may be disposed on the second contact area P2 and along the periphery of the second contact area P2. At the same time, the first insulating layers 1530a and 1530b may be disposed adjacent to the mesa M rather than an area where the first contact area P1 and the first electrode 1540 come into contact.

The first insulating layers 1530a and 1530b may have an opening 1530b exposing the second electrode 2120 . The second electrode 2120 may be electrically connected to a pad or a bump through the opening 1530b.

Although not shown, when viewed from a plan view, a region where the first contact region P1 and the first electrode 240 come into contact is disposed along the entire outer perimeter of the upper surface of the first conductivity type semiconductor layer 1511 . Specifically, the region where the first contact region P1 and the first electrode 1540 come into contact may be disposed to be adjacent to all four side surfaces of the first conductive semiconductor layer 1511 and completely surround the mesa M. can In this case, since the contact area between the first electrode 1540 and the first conductivity type semiconductor layer 1511 may increase, the current flowing from the first electrode 1540 to the first conductivity type semiconductor layer 1511 is more effective. It can be dissipated, so the forward voltage can be further reduced.

In one embodiment of the present invention, the first electrode 1540 and the second electrode 1520 of the light emitting diode 151 may be mounted on the substrate 1510 directly or through pads.

For example, when the light emitting diode is mounted on the substrate 1510 through the pad, two pads disposed between the light emitting diode 151 and the substrate 1510 may be provided, and each of the two pads may have a first It may contact the electrode 1540 and the second electrode 1520 . For example, the pad may be solder or eutectic methyl, but is not limited thereto. For example, AuSn may be used as the eutectic metal.

As another example, when the light emitting diode is directly mounted on the substrate 1510, the first electrode 1540 and the second electrode 1520 of the light emitting diode may be directly bonded to the wiring on the substrate 1510. In this case, the bonding material may include an adhesive material having conductive properties. For example, the bonding material may include at least one conductive material among silver (Ag), tin (Sn), and copper (Cu). However, this is exemplary, and the bonding material may include various materials having conductivity.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art do not deviate from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that the present invention can be variously modified and changed within the scope not specified.

Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100: light source module 110: main body
111: through hole 112: protrusion
113: screw 121: first waterproofing member
122: second waterproofing member 123: third waterproofing member
130: window 140: guard unit
141: wing 150: light source unit
151: light emitting diode 152, 153: connector
154: wiring part 155: circuit board
160: auxiliary body 161: coupling part
170: fixing member 180: waterproof resin
125: pressing member

Claims (18)

A main body including a through hole having a first shape in cross section;
a light source unit provided in the through-hole of the main body and having a second shape different from the first shape;
a window provided in a direction in which light is emitted from the light source unit and sealing one side of the through-hole;
A waterproof resin filled in the main body to seal the other side of the through hole,
An open portion is formed and includes a guard portion disposed between the window and the light source unit,
The light source unit may include a circuit board having the second shape and having a first surface and a second surface; and a light emitting diode provided on the first surface of the circuit board to emit light,
The waterproof resin is provided on the second surface of the circuit board. According to claim 1,
The first shape is a circle, and the second shape is a light source module having a rectangular shape including an arc. delete According to claim 1,
The waterproof resin and the window are spaced apart with the circuit board interposed therebetween. According to claim 1,
A connector for connecting the light source unit and an external power source is provided on the first surface of the circuit board,
The light source module wherein the waterproof resin is filled to cover at least the connector. According to claim 1,
The light source module further comprising a waterproof member provided between the main body and the light source unit. According to claim 1,
The light source unit is a light source module that emits ultraviolet rays. According to claim 1,
Further comprising an auxiliary body coupled to the main body,
The auxiliary body includes a fastening part that can be coupled to the outer wall of the water tank,
The light source module of claim 1 , wherein a size of a cross section of the fastening part is smaller than a size of a cross section of the through hole. According to claim 8,
The auxiliary body is screwed to the outer wall of the water tank and the main body. According to claim 8,
The fastening part includes an opening extending along the longitudinal direction of the fastening part,
The waterproof resin is filled in the opening to seal the inside of the main body. A main body including a through hole;
a light source unit provided in the through hole of the main body;
a window provided in a direction in which light is emitted from the light source unit and sealing one side of the through-hole;
A waterproof resin filled in the main body to seal the other side of the through hole,
Further comprising an auxiliary body coupled to the main body,
The auxiliary body includes a fastening part coupled to an opening provided in the water tank,
The light source module of claim 1 , wherein a size of a cross section of the fastening part is smaller than a size of a cross section of the through hole. According to claim 11,
The light source unit
a circuit board having a first side and a second side; and
A light emitting diode provided on the first surface of the circuit board to emit light;
The waterproof resin is provided on the second surface of the circuit board. According to claim 12,
The waterproof resin is in contact with the second surface of the circuit board. According to claim 12,
The light source unit further comprises a connector provided on the second surface. According to claim 12,
Wherein the circuit board has a shape corresponding to a cross section of the through-hole. delete According to claim 11,
The auxiliary body is screwed to the outer wall of the water tank and the main body. According to claim 11,
The fastening part includes an opening extending along the longitudinal direction of the fastening part,
The waterproof resin is filled in the opening to seal the inside of the main body.

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