KR102523093B1 - Film for punching process and display device including the same - Google Patents

Abstract

A film for a laser punching process and a display device including the same are provided. The film for the laser punching process has excellent adhesion and weak peeling force, so it can minimize the inflow of foreign substances that may occur during the display device manufacturing process and suppress edge lifting, burr generation, and air bubble inflow. . In addition, the film for the laser punching process is suitable for cutting using an ultraviolet laser to perform punching in a desired shape.

Description

Film for laser punching process and display device including the same {Film for punching process and display device including the same}

It relates to a film for laser punching process and a display device including the same.

When manufacturing electronic devices such as displays such as LCD and OLED, a cutting process or punching process for cutting a film to the size of the electronic device is required. In order to minimize the inflow of foreign substances caused by static electricity during the cutting process and improve the yield of electronic devices, films having antistatic functions are widely used as various auxiliary materials for electronic devices.

Currently, a cutting process using a knife is mainly applied, but problems such as edge lifting, burr generation, or air bubble inflow occur during the cutting process. In order to solve this problem, a cutting process using an ultraviolet laser instead of a knife is being reviewed.

Therefore, while suppressing foreign matter inflow, edge lifting, burr generation, air bubble inflow, etc., it is suitable for cutting process using ultraviolet laser and has excellent adhesion and weak peeling force. There is a demand for

One aspect is to provide a film for a laser punching process suitable for cutting using an ultraviolet laser while having excellent adhesion and weak peeling force and suppressing foreign matter inflow, edge lifting, burr generation, and bubble inflow.

Another aspect is to provide a display device including the film for the laser punching process.

According to one aspect,

As a film for laser punching process,

polyester base materials; and

An adhesive layer positioned on at least one surface of the polyester-based substrate; includes,

The adhesive layer is a cured layer of an adhesive composition containing a silicone-based adhesive and an ultraviolet absorber,

The UV absorber includes a triazine-based UV absorber,

It has a light transmittance of 20% or less at a wavelength of 330 nm to 380 nm,

It has a light transmittance of 60% or more at a wavelength of 450 nm or more,

A film for laser punching process that satisfies Equation 1 below is provided.

[Equation 1]

0 < │A1-P1│≤ 4 gf/inch

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film,

P1 is the peel force of the film including the adhesive layer excluding the UV absorber under a 180° angle and a speed of 0.3 mpm for the polyester film.

It may have a light transmittance of 5% to 20% at the wavelength of 330 nm to 380 nm.

The water contact angle (deg.) of the film may satisfy Equation 2 below:

[Equation 2]

118 °≤ water contact angle (deg.) < 128 °

The film has a peel force of 15 gf / inch or less at a speed of 0.3 mpm at a 180 ° angle relative to a polyester film at room temperature,

Peel force may be 30 gf/inch or less under a 180 ° angle and a speed of 2.4 mpm for a polyester film at room temperature.

The film may satisfy Equation 3 below:

[Equation 3]

5 gf/inch < (A2-A1)/2 < 10 gf/inch

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film at room temperature,

A2 is the peel force of the film under a 180° angle, 2.4 mpm speed for a polyester-based film at room temperature.

The silicone-based pressure-sensitive adhesive may include a first silicone-based pressure-sensitive adhesive and a second silicone-based pressure-sensitive adhesive including a resin containing two different types of siloxane and silane.

The content of the first silicone-based pressure-sensitive adhesive may be greater than that of the second silicone-based pressure-sensitive adhesive.

The content of the UV absorber may be 2.5 parts by weight or less based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive.

The adhesive composition may further include a curing agent, an adhesion accelerator, a catalyst, and a solvent.

The adhesive layer may have a thickness of 5 to 10 μm.

The surface resistance of the film surface measured according to the ASTM D257 standard may be 1 x 10 ⁴ to 1 x 10 ¹¹ Ω/cm ² .

A fluorine-containing silicone release film may be additionally disposed on the adhesive layer.

According to another aspect,

An adherend to which the film for the above-described laser punching process is adhered; and

Including; thin film display panel;

The adherend includes a sheet, and a display device is provided.

A film for a laser punching process according to an embodiment includes an adhesive layer positioned on at least one surface of a polyester-based substrate, the adhesive layer is a cured layer of an adhesive composition including a silicone-based adhesive and an ultraviolet absorber, and the ultraviolet absorber contains a triazine-based ultraviolet absorber, has a light transmittance of 20% or less at a wavelength of 330 nm to 380 nm, and has a light transmittance of 60% or more at a wavelength of 450 nm or more, and may satisfy Equation 1 above.

The film for the laser punching process has excellent adhesion and weak peeling strength, and can provide a film suitable for cutting using an ultraviolet laser while suppressing foreign matter inflow, edge lifting, burr generation, and air bubble inflow.

1 is a cross-sectional view of a film for a laser punching process according to one embodiment.
2 is a UV spectrum result for the films for laser punching process prepared by Example 1, Comparative Example 5, and Comparative Example 11.

Hereinafter, a film for a laser punching process and a display device including the same will be described in detail with reference to embodiments and drawings of the present invention. These examples are only presented as examples to explain the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control. Also, although methods and materials similar or equivalent to those described herein may be used in the practice or testing of the present invention, suitable methods and materials are described herein.

In this specification, the term "include" means that other components may be further included without excluding other components unless otherwise stated.

The term "combination of these" as used herein means a mixture or combination of one or more of the recited elements.

The term “and/or” as used herein is meant to include any and all combinations of one or more of the items listed in relation to it. The term "or" as used herein means "and/or". The expression “at least one” or “one or more” in front of elements in this specification does not mean that the entire list of elements can be modified and individual elements of the description can be modified.

In this specification, when an element is referred to as being disposed “on” or “above” another element, one element may be directly disposed on the other element, or elements intervened between the elements may be present. may exist. On the other hand, when an element is referred to as being disposed “directly on” or “directly over” another element, intervening elements may not be present.

In the present specification, "~ polymer (resin)" or "~ copolymer (resin)" means "~ polymer (resin)" or "~ copolymer (resin)" and "~ polymer (resin) derivative" thereof. or "a derivative of a copolymer (resin)" in a broad sense.

In the present specification, "polyester-based substrate" or "polyester-based film" is a broad concept including both "~ polyester film" and "derivative substrate or film containing polyester". In this specification, "polyester-based substrate" and "polyester-based film" may be derived from a polyester-based resin having the same composition and physical properties, or even if the composition is different or the composition is the same, the melting point (m.p.) and It may be derived from a polyester-based resin having a difference in the same physical properties.

Unless otherwise stated, all percentages, parts, ratios, etc. are by weight. Also, when an amount, concentration, or other value or parameter is given as either a range, preferred range, or list of upper preferred and lower preferred values, this means any upper range limit or preferred value and any lower limit, regardless of whether the range is separately disclosed. It is to be understood as specifically disclosing all ranges formed from any pair of range limits or preferred values.

Where ranges of numerical values are recited herein, the ranges are intended to include their endpoints and all integers and fractions within the range, unless stated otherwise. It is intended that the scope of the present invention not be limited to the specific values recited when defining the range.

Unless otherwise specified in the present specification, the unit "parts by weight" means the weight ratio between each component, and the unit "parts by mass" means a value obtained by converting the weight ratio between each component into a solid content.

1 is a cross-sectional view of a film for a laser punching process according to one embodiment.

Referring to FIG. 1 , in the film 100 for a laser punching process according to an embodiment, a polyester substrate 10 and an adhesive layer 20 are positioned on one side of the polyester substrate 10 . Although not shown, the adhesive layer 20 may be positioned on both sides of the polyester substrate 10 . The adhesive layer 20 is a cured layer of an adhesive composition including a silicone-based adhesive and a UV absorber, the UV absorber includes a triazine-based UV absorber, has a light transmittance of 20% or less at a wavelength of 330 nm to 380 nm, and has a 450 It may have a light transmittance of 60% or more at a wavelength of nm or more, and satisfy the following equation 1:

[Equation 1]

0 <│A1-P1│≤ 4 gf/inch

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film,

P1 is the peel force of the film including the adhesive layer excluding the UV absorber under a 180° angle and a speed of 0.3 mpm for the polyester film.

For example, it may have a light transmittance of 5% to 20% in the 330 nm to 380 nm wavelength. For example, it may be 60% to 80% at a wavelength of 450 nm or more.

The film 100 for laser punching process according to one embodiment has excellent adhesion and weak peeling force while maintaining light transmittance at a wavelength of 330 nm to 380 nm and a wavelength of 450 nm or more within the above range, and foreign matter inflow, edge It is possible to provide a film suitable for cutting using an ultraviolet laser while suppressing lifting, burr generation, and bubble inflow.

The polyester-based substrate 10 may be a transparent film. The polyester-based substrate 10 has light transmittance and thermal stability at the same time. The polyester-based substrate 10 may be a transparent flexible polymer film. For example, the polyester-based substrate 10 may include at least one polymer film selected from polyethylene terephthalate, polyethylene naphthalate, polyarylate, polycarbonate, polyetherimide, polyamideimide, polyimide, and polybenzoxazole. can be For example, the polyester-based substrate 10 may be polyethylene terephthalate. However, it is not limited thereto, and the polymer film may further include other polymers having sufficient optical properties such as sufficient mechanical/thermal stability for specific applications and high transmittance of light having a specific wavelength.

The polyester-based substrate 10 according to one embodiment may be a single layer or may have a multilayer structure of two or more layers. When the polyester-based substrate 10 has a multi-layer structure of two or more layers, all polymer materials constituting each layer may be the same or different from each other.

The thickness of the polyester-based substrate 10 may be 5 to 500 μm.

The polyester base material 10 may be base films disclosed in Korean Patent Publication Nos. 2014-0085218, 2013-0109547, and 2006-0071636, and the entirety of the above patent documents is hereby cited. integrated into

The adhesive layer 20 may be a cured layer of an adhesive composition including a silicone-based adhesive and an ultraviolet absorber. For example, the silicone-based pressure-sensitive adhesive may include a first silicone-based pressure-sensitive adhesive and a second silicone-based pressure-sensitive adhesive including two different types of siloxane and a resin containing silane. Here, “resin containing two different types of siloxane and silane” means “resin containing two types of siloxane and silane having different substituents, the number of substituents, the content of each substituent, or the content of siloxane and silane. means "resin". For example, the first silicone-based pressure-sensitive adhesive and the second silicone-based pressure-sensitive adhesive may be a resin containing siloxane and silane having different substituents. For example, the first silicone-based pressure-sensitive adhesive and the second silicone-based pressure-sensitive adhesive may be a resin containing siloxane and silane having different numbers of substituents. For example, the first silicone-based pressure-sensitive adhesive and the second silicone-based pressure-sensitive adhesive may be a resin containing siloxane and silane having different substituent contents. For example, the first silicone-based pressure-sensitive adhesive and the second silicone-based pressure-sensitive adhesive may be a resin containing siloxane and silane having different contents of siloxane and silane. For example, each of the first silicone-based adhesive and the second siloxane-based adhesive may be a polydimethylsiloxane-based adhesive. For example, the first silicone-based pressure-sensitive adhesive may be a polydimethylsiloxane-based pressure-sensitive adhesive composed of a resin containing 32 to 36% by weight of siloxane and silane substituted with a dimethyl group, a methyl group, or a vinyl group. For example, the second silicone-based pressure-sensitive adhesive may be a polydimethylsiloxane-based pressure-sensitive adhesive composed of a resin containing 16 to 26% by weight and 38 to 48% by weight of dimethylsiloxane and chlorotrimethylsilane, respectively.

remind Silicone-based adhesives may be silicone-based adhesives disclosed in Korean Patent Registration No. 2240167, Korean Patent Publication No. 2020-0120918, Korean Patent Registration No. 2170926, and Korean Patent Publication No. 2020-0035474, and the above Patent Document are incorporated herein by reference in their entirety.

A content of the first silicone-based pressure-sensitive adhesive may be greater than that of the second silicone-based pressure-sensitive adhesive. If the content of the first silicone-based pressure-sensitive adhesive is equal to or smaller than the content of the second silicone-based pressure-sensitive adhesive, both low-speed peeling force and high-speed peeling force are high at room temperature, which is not suitable for a film for laser punching process.

The minimum absorption wavelength range of the ultraviolet absorber may be 330 nm to 380 nm.

For example, the UV absorber may include a triazine-based UV absorber. An example of the triazine-based UV absorber may be a hydroxy group-containing triazine-based UV absorber, for example, a hydroxyphenyl (benzo) triazine-based UV absorber. Specific examples of the triazine-based ultraviolet absorber include 2,4-diphenyl-6-(2-hydroxy-4-methoxyphenyl)-1,3,5-triazine, 2,4-diphenyl-6-( 2-hydroxy-4-ethoxyphenyl) -1,3,5-triazine, 2,4-diphenyl- (2-hydroxy-4-propoxyphenyl) -1,3,5-triazine, 2,4-diphenyl-(2-hydroxy-4-propoxyphenyl)-1,3,5-triazine, 2,4-diphenyl-(2-hydroxy-4-butoxyphenyl)-1 ,3,5-triazine, 2,4-diphenyl-6-(2-hydroxy-4-butoxyphenyl)-1,3,5-triazine, 2,4-diphenyl-6-(2 -Hydroxy-4-hexyloxyphenyl)-1,3,5-triazine, 2,4-diphenyl-6-(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine , 2,4-diphenyl-6-(2-hydroxy-4-dodecyloxyphenyl)-1,3,5-triazine, 2,4-diphenyl-6-(2-hydroxy-4- Benzyloxyphenyl) -1,3,5-triazine, 2,4-diphenyl-6- (2-hydroxy-4-butoxyethoxy) -1,3,5-triazine, 2,4- Bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-butoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-4- Methoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-4-ethoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-4-propoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-butoxyphenyl)-1,3,5-triazine , 2,4,6-tris(2-hydroxy-4-butoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-hexyloxyphenyl)- 1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy -4-dodecyloxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-4-benzyloxyphenyl) -1,3,5-triazine, 2,4 ,6-tris(2-hydroxy-4-ethoxyethoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-butoxyethoxyphenyl)- 1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-propoxyethoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2- Hydroxy-4-methoxycarbonylpropyloxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-4-ethoxycarbonylethyloxyphenyl)-1,3 ,5-triazine, 2,4,6-tris(2-hydroxy-4-(1-(2-ethoxyhexyloxy)-1-oxopropan-2-yloxy)phenyl)-1,3 ,5-triazine, 2,4,6-tris (2-hydroxy-3-methyl-4-methoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy hydroxy-3-methyl-4-ethoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-3-methyl-4-propoxyphenyl) -1,3, 5-triazine, 2,4,6-tris(2-hydroxy-3-methyl-4-butoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy -3-methyl-4-butoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy-3-methyl-4-hexyloxyphenyl) -1,3,5 -triazine, 2,4,6-tris(2-hydroxy-3-methyl-4-octyloxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy- 3-methyl-4-dodecyloxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-3-methyl-4-benzyloxyphenyl)-1,3,5 -triazine, 2,4,6-tris (2-hydroxy-3-methyl-4-ethoxyethoxyphenyl) -1,3,5-triazine, 2,4,6-tris (2-hydroxy Roxy-3-methyl-4-butoxyethoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-3-methyl-4-propoxyethoxyphenyl)- 1,3,5-triazine, 2,4,6-tris(2-hydroxy-3-methyl-4-methoxycarbonylpropoxyphenyl)-1,3,5-triazine, 2,4, 6-tris(2-hydroxy-3-methyl-4-ethoxycarbonylethoxyphenyl)-1,3,5-triazine, 2,4,6-tris(2-hydroxy-3-methyl- 4-(1-(2-ethoxyhexyloxy)-1-oxopropan-2-yloxy)phenyl)-1,3,5-triazine, 2-hydroxyphenyl-s-triazine, or hydroxy A hydroxyphenyl benzotriazine etc. are mentioned.

The content of the UV absorber may be 2.5 parts by weight or less based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. For example, the content of the UV absorber may be 1 to 2.5 parts by weight based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. If the content of the UV absorber is less than 1 part by weight, the UV absorbing function is lowered, making it difficult to apply to the laser punching process. If the content of the ultraviolet absorber exceeds 2.5 parts by weight, agglomeration occurs in the adhesive layer, and due to cloudiness, light transmittance at a wavelength of 450 nm is low, adhesion is low, and the appearance is poor, which is not suitable for the laser punching process.

The adhesive composition may further include a curing agent, an adhesion accelerator, a catalyst, and a solvent.

Examples of the curing agent may include reactive polysiloxane. The content of the curing agent may be 1.1 to 2.4 parts by weight based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. If the content of the curing agent is out of the above range, adhesion between the polyester base material 10 and the adhesive layer 20 becomes poor.

Examples of the adhesion promoter may include siloxane having an organic group. The content of the adhesion promoter may be greater than 0 and less than 1.5 parts by weight based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. If the content of the adhesion promoter exceeds 1.5 parts by weight, the adhesiveness and appearance between the polyester base material 10 and the adhesive layer 20 become poor, making it unsuitable for the laser punching process.

An example of the catalyst may be an organic platinum complex. The content of the catalyst may be 0.6 to 1.4 parts by weight based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. If the content of the catalyst is out of the above range, the adhesiveness and appearance between the polyester-based substrate 10 and the adhesive layer 20 become poor, making it unsuitable for the laser punching process.

The solvent is not limited to the solvent, but includes, for example, toluene, xylene, and other aromatic type solvents; alcohol type solvents such as n-butyl alcohol, propylene glycol methyl ether, diacetone alcohol and ethyl cellosolve; ester type solvents such as butyl acetate, ethyl acetate and cellosolve acetate; ketone type solvents such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone; and dimethyl formamide may be used. These solvents may be used alone or as a mixture of two or more solvents. The amount of the solvent to be used can be appropriately determined depending on the concentration of the substances used in the adhesive layer, the purpose, the molecular weight of the resin, and the concentration of the solution.

The adhesive layer 20 may have a thickness of 5 to 10 μm. If the thickness of the adhesive layer 20 is less than 5 μm, the UV absorbing function is lowered, making it difficult to apply to the laser punching process. If the thickness of the adhesive layer 20 exceeds 10 μm, curl and edge lifting occur on the surface of the film, making it difficult to apply to the laser punching process.

If necessary, the adhesive layer 20 may include fillers such as leveling agents, antioxidants, activators, corrosion inhibitors, optical brighteners, antioxidants, pigments, dyes, thickeners, colloidal silica, and alumina sol. It may contain additives such as inorganic particles, acrylic based particulates such as poly methyl methacrylate type.

The adhesive layer 20 is formed by spray coating, brush coating, curtain-flow coating, gravure coating, roll coating, spin ( It can be prepared by applying using a known coating method such as spin coating, bar coating and electrostatic coating. The drying temperature may be appropriately selected depending on the solvent, but may be, for example, 80 °C to 160 °C.

The film 100 for laser punching process may satisfy Equation 1 below:

[Equation 1]

0 < │A1-P1│≤ 4 gf/inch

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film,

P1 is the peel force of the film including the adhesive layer excluding the UV absorber under a 180° angle and a speed of 0.3 mpm for the polyester film.

The film 100 for laser punching process has a weak peeling force similar to that of an adhesive film including a conventional adhesive layer (without UV absorbers).

The water contact angle (deg.) of the film 100 for laser punching process may satisfy Equation 2 below:

[Equation 2]

118 °≤ water contact angle (deg.) < 128 °

The film 100 for laser punching process may have excellent adhesion and weak peeling power within the range of the water contact angle (deg.).

The film 100 for laser punching process has a peel force of 15 gf/inch or less at room temperature at a speed of 0.3 mpm at a 180 ° angle for a polyester film, and at a speed of 2.4 mpm at a 180 ° angle for a polyester film at room temperature. The peel force may be 30 gf/inch or less under

The film 100 for laser punching process may satisfy Equation 3 below:

[Equation 3]

5 gf/inch < (A2-A1)/2 < 10 gf/inch

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film at room temperature,

A2 may be the peel force of the film under a 180 ° angle, 2.4 mpm rate for the polyester film at room temperature.

The film 100 for the laser punching process has both a weak low-speed peeling force and a weak high-speed peeling force, and can satisfy physical properties required for an adhesive film.

The surface resistance measured according to the ASTM D257 standard for the surface of the film 100 for laser punching process may be 1 x 10 ⁴ to 1 x 10 ¹¹ Ω/cm ² . For example, the surface resistance measured according to the ASTM D257 standard for the surface of the film 100 for laser punching process may be 1 x 10 ⁵ to 1 x 10 ¹⁰ or 1 x 10 ⁵ to 1 x 10 ⁸ .

A fluorine-containing silicone release film may be additionally disposed on the adhesive layer 20 . The fluorine-containing silicone release film may be a release film disclosed in Korean Patent Registration No. 2171736, and the entire patent document is incorporated herein by reference.

A display device according to another embodiment includes an adherend to which the film for the aforementioned laser punching process is adhered; and a thin film display panel, and the adherend may include a filter or sheet.

Through the following Examples and Comparative Examples, the configuration of the present invention and its effects will be described in more detail. However, these examples are intended to specifically explain the present invention, and the scope of the present invention is not limited to these examples.

[Example]

Example 1: Manufacturing of film for laser punching process

As a substrate, a polyethylene terephthalate (PET) film (75 μm-XD5DA2, Toray Advanced Materials Co., Ltd.) having a thickness of 75 μm was prepared.

Separately, the first polydimethylsiloxane-based adhesive (DOWSIL ^TM 7645 Adhesive, Mw: about 630,000, DOW CORINING) composed of a resin containing 32 to 36% by weight of silane substituted with siloxane and dimethyl, methyl, and vinyl groups A second polydimethylsiloxane-based adhesive (DOWSIL ^TM 7663 Adhesive, Mw: about 420,000, DOW CORINING g) 50 parts by weight and 1 part by weight of 2-hydroxyphenyl-s-triazine (BASF, Tinuvin477) as an ultraviolet absorber were added and stirred for 30 minutes to obtain a mixture. Then, 1.5 parts by weight of a reactive polysiloxane (SYL-OFF ^® SL 7028 Crosslinker) as a curing agent, 1 part by weight of a siloxane having an organic group (SYL-OFF ^TM SL 9250 Anchorage Additive) as an adhesion promoter, and dispersed in polysiloxane as a catalyst After adding 1 part by weight of a reactive organic platinum complex (SYL-OFF ^TM 4000 Catalyst) in turn, it was diluted with 10 parts by weight of toluene and stirred for 30 minutes to obtain an adhesive composition.

The adhesive composition was applied to a prepared polyethylene terephthalate (PET) film with a bar coater and dried at 150° C. for 5 minutes to form an adhesive layer having a thickness of 5 μm. Then, the polyethylene terephthalate (PET) film on which the adhesive layer was formed was laminated with a fluorine-containing silicon release film (50 μm-RSF501) having a thickness of 50 μm to prepare a film for laser punching process.

Example 2: Manufacturing of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 2 parts by weight of reactive polysiloxane (SYL-OFF ^® SL 7028 Crosslinker) was used as a curing agent.

Example 3: Manufacturing of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 2 parts by weight of 2-hydroxyphenyl-s-triazine (BASF, Tinuvin477) was used as an ultraviolet absorber.

Example 4: Manufacturing of film for laser punching process

Same method as in Example 1, except for using 2 parts by weight of reactive polysiloxane (SYL-OFF ^® SL 7028 Crosslinker) as a curing agent and 2 parts by weight of 2-hydroxyphenyl-s-triazine (BASF, Tinuvin477) as an ultraviolet absorber. A film for the laser punching process was prepared.

Comparative Example 1: Preparation of film for laser punching process

Excluding the use of 50 parts by weight of the first polydimethylsiloxane-based adhesive (DOWSIL ^TM 7645 Adhesive, DOW CORINING) composed of a resin containing 32 to 36% by weight of siloxane and silane substituted with dimethyl, methyl, and vinyl groups, A film for laser punching process was prepared in the same manner as in Example 1.

Comparative Example 2: Preparation of film for laser punching process

Excluding the use of 150 parts by weight of the first polydimethylsiloxane-based adhesive (DOWSIL ^TM 7645 Adhesive, manufactured by DOW CORINING) composed of a resin containing 32 to 36% by weight of siloxane and silane substituted with dimethyl, methyl, and vinyl groups, A film for laser punching process was prepared in the same manner as in Example 1.

Comparative Example 3: Preparation of film for laser punching process

Except for using 20 parts by weight of the second polydimethylsiloxane-based adhesive (DOWSIL ^TM 7663 Adhesive, manufactured by DOW CORINING) composed of a resin containing 16 to 26% by weight and 38 to 48% by weight of dimethylsiloxane and chlorotrimethylsilane, respectively , A film for laser punching process was prepared in the same manner as in Example 1.

Comparative Example 4: Preparation of film for laser punching process

Except for using 100 parts by weight of the second polydimethylsiloxane-based adhesive (DOWSIL ^TM 7663 Adhesive, manufactured by DOW CORINING) composed of a resin containing 16 to 26% by weight and 38 to 48% by weight of dimethylsiloxane and chlorotrimethylsilane, respectively. , A film for laser punching process was prepared in the same manner as in Example 1.

Comparative Example 5: Preparation of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 3 parts by weight of 2-hydroxyphenyl-s-triazine (BASF, Tinuvin477) was used as an ultraviolet absorber.

Comparative Example 6: Preparation of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 1 part by weight of reactive polysiloxane (SYL-OFF ^® SL 7028 Crosslinker) was used as a curing agent.

Comparative Example 7: Preparation of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 0.5 parts by weight of siloxane having an organic group (SYL-OFF ^TM SL 9250 Anchorage Additive) was used as an adhesion promoter.

Comparative Example 8: Preparation of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that 1.5 parts by weight of siloxane (SYL-OFF ^TM SL 9250 Anchorage Additive) having an organic group was used as an adhesion promoter.

Comparative Example 9: Preparation of film for laser punching process

A film for a laser punching process was prepared in the same manner as in Example 1, except that 0.5 parts by weight of a reactive organic platinum complex (SYL-OFF ^TM 4000 Catalyst) dispersed in polysiloxane was used as a catalyst.

Comparative Example 10: Preparation of film for laser punching process

A film for a laser punching process was prepared in the same manner as in Example 1, except that 1.5 parts by weight of a reactive organic platinum complex (SYL-OFF ^TM 4000 Catalyst) dispersed in polysiloxane was used as a catalyst.

Comparative Example 11: Preparation of film for laser punching process

A film for laser punching process was prepared in the same manner as in Example 1, except that an adhesive composition containing no ultraviolet absorber was used.

Evaluation Example 1: Evaluation of physical properties

The physical properties of each of the films for laser punching process prepared by Examples 1 to 4 and Comparative Examples 1 to 11 were evaluated as follows. The results are partially shown in Table 1 and FIG. 2 below.

(1) Surface resistance (Ω/cm ² )

For each film for laser punching process, sheet resistance was measured using a 4-point probe measuring device (Loresta-GP MCP-T610, Mitsubishi Chemical Analytech) according to the ASTM D257 standard.

(2) UV spectrum - light transmittance (%) at a wavelength of 330 nm to 380 nm

The adhesive composition used in each laser punching process was put into a quartz cell with a size of 10 mm x 10 mm x 50 mm, and the light transmittance at a wavelength of 330 nm to 380 nm was measured using a UV spectrum device (MPC-3100, Shimadzu). After measuring 5 times, The average value was obtained.

(3) Water contact angle (deg.)

For each film for laser punching process, the water contact angle with respect to the surface of the film was measured 10 times using a contact angle meter (Drop Master 300, Kyowa Co., Ltd.), and an average value thereof was obtained.

(4) Low speed peel force (gf/inch) and high speed peel force (gf/inch)

Each film for the laser punching process was cut into 1 inch thick strips. After removing the fluorine-containing silicone release film from the cut strip, the surface of the adhesive layer was coated with a polyethylene terephthalate (PET) film (50㎛-XD500P, Toray Advanced Materials Co., Ltd., m.p.: 230 ℃) using a 2 kg rubber roller. and left at room temperature for 1 hour to prepare a sample. Then, the sample was peeled at room temperature using a peel force measuring device (AR-2000, TA instruments) at a speed of 30 mm/min (low speed peel), 240 mm/min (high speed peel) and after 1 day and 7 days at an angle of 180 °. Peel force was measured on the basis of days later.

In addition, the peel force measurement equipment (AR-2000 , TA instruments) at a speed of 30 mm/min (low-speed peeling) and at an angle of 180 ° after 1 day, the peel force was obtained by substituting into the following formula 1.

[Equation 1-1]

Difference in peel strength according to the presence or absence of UV absorber in the adhesive layer (gf/inch) = │A1-P1│

In the expression

A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed (low speed peel force) for the polyethylene terephthalate (PET) film,

P1 is the peel force (low-speed peel force) of the film including the adhesive layer excluding the UV absorber under a speed of 0.3 mpm at an angle of 180 ° to the polyethylene terephthalate (PET) film.

In addition, in Equation 3-1, the sample was measured at room temperature at a speed of 30 mm/min (low speed peel), 240 mm/min (high speed peel) and at an angle of 180 ° using a peel force measuring device (AR-2000, TA instruments). The peel force on the basis of 1 day later was substituted and obtained.

[Equation 3-1]

Difference in peel force according to peel speed (gf/inch) = (A2-A1)/2

In the expression

A1 is the peel force of the polyethylene terephthalate (PET) film at room temperature under a 180 ° angle, 0.3 mpm speed (low speed peel force),

A2 is the peel force of the polyethylene terephthalate (PET) film at room temperature under a 180° angle and a speed of 2.4 mpm (high-speed peel force).

(5) Adhesion

For each film for laser punching process (4) Polyethylene terephthalate (PET) film (75 ㎛-XD5DA2, Toray Advanced Materials Co., Ltd.) substrate and adhesive layer when measuring low-speed peel force and high-speed peel force (gf/inch) It was confirmed with the naked eye whether or not the liver was closely adhered to. At this time, adhesion was evaluated as follows.

O: When the adhesion between the base material and the adhesive layer is good

X: In case of poor adhesion between the substrate and the adhesive layer

△: When peeling off due to partial poor adhesion between the base material and the adhesive layer

(6) Appearance evaluation - laser punchability

For each film for laser punching process, a UV laser with a wavelength of 355 nm was irradiated with a pulse width of 12 x 10 ^-12 seconds using a picosecond laser (RAPID, Lumera laser GmbH), and the appearance was visually confirmed. At this time, the appearance was evaluated as follows.

O: In case of laser punching

X: In case of no laser punching

division surface
resistance
(Ω/cm ² ) water contact angle
(°) light transmittance
(%) adhesion normal temperature,
1 day later
(gf/inch) normal temperature,
7 days later
(gf/inch) Exterior @350 nm @450 nm A1 A2
(A2-A1)/2
│A1-P1│ A1
A2
Example 1 4x10 ⁶ 123 19.8 77.9 O 10 22 6 One 12 21 O Example 2 5x10 ⁶ 124 19.8 78 O 9 21 6 0 11 21 O Example 3 7x10 ⁷ 118 11.4 60.2 O 13 26 6.5 4 15 29 O Example 4 6x10 ⁷ 119 11.5 60.4 O 12 25 6.5 3 14 28 O Comparative Example 1 5x10 ⁶ 122 19.9 77.9 O 20 43 11.5 11 22 48 O Comparative Example 2 6x10 ⁶ 125 19.8 78.1 X - - - - - - - Comparative Example 3 4x10 ⁶ 123 19.8 77.8 X - - - - - - - Comparative Example 4 4x10 ⁶ 124 19.8 78.2 O 18 37 9.5 9 22 46 O Comparative Example 5 6x10 ⁷ 115 7.2 51.7 X 14 30 8 5 18 38 X Comparative Example 6 6x10 ⁶ 123 19.8 77.9 X - - - - - - - Comparative Example 7 5x10 ⁶ 123 19.8 78.2 X - - - - - - - Comparative Example 8 5x10 ⁶ 123 19.9 78.1 β 10 24 7 One 13 27 X Comparative Example 9 4x10 ⁶ 123 19.9 78.3 X - - - - - - - Comparative Example 10 4x10 ⁶ 123 19.8 78 β 12 27 7.5 3 14 26 X Comparative Example 11 4x10 ⁶ 123 81.7 88.7 O 9 17 4 - 11 20 X

** '-' sign indicates that the peel force cannot be measured due to insufficient adhesion between the substrate and the adhesive layer

Referring to Table 1, the films for laser punching process prepared in Examples 1 to 4 have a surface resistance of 5x10 ⁶ to 6 x10 ⁷ Ω/cm ² and a water contact angle of 118 ° to 124 ° and 350 nm and 450 nm The light transmittance at the wavelength was 11.4 to 19.8% and 60.2 to 78%, respectively. In addition, the films for laser punching process prepared in Examples 1 to 4 have a low-speed peel force (A1) of 13 gf / inch or less and a high-speed peel force (A2) of 26 gf / inch or less (A2- A1)/2 was 6.5 gf/inch or less, and │A1-P1│ was 4 gf/inch or less. In addition, the films for laser punching process prepared by Examples 1 to 4 had a low-speed peel force (A1) of 15 gf/inch or less and a high-speed peel force (A2) of 29 gf/inch or less after 7 days at room temperature and excellent appearance. did

In comparison, the films for the laser punching process prepared by Comparative Example 1 and Comparative Example 4 have a small content of the first polydimethylsiloxane-based adhesive or a large content of the second polydimethylsiloxane-based adhesive, so at room temperature, 1 day After and after 7 days, the low-speed peel strength (A1) and high-speed peel strength (A2), and (A2-A1)/2 and |A1-P1| after 1 day at room temperature were all high, respectively. The films for laser punching process prepared in Comparative Example 2 and Comparative Example 3 are when an excessive amount of the first polydimethylsiloxane-based adhesive is added or the content of the second polydimethylsiloxane-based adhesive is small, and adhesion between the substrate and the adhesive layer is poor. It was bad. This is considered to be due to the fact that since the content of the first polydimethylsiloxane-based pressure-sensitive adhesive resin is lower than that of the second polydimethylsiloxane-based pressure-sensitive adhesive resin, adhesion is different depending on the degree of curing. The film for laser punching process prepared in Comparative Example 5 had low light transmittance at a wavelength of 450 nm, poor adhesion, and poor appearance because an excessive amount of ultraviolet absorber was added and agglomeration occurred in the adhesive layer. The film for the laser punching process prepared in Comparative Example 6 had a low content of the curing agent, and thus had a problem of not being properly adhered to the polyester film. The film for laser punching process prepared in Comparative Example 7 had a small content of the adhesion promoter, so that a coating film was not preferably formed during curing of the adhesive film, resulting in poor adhesion between the substrate and the adhesive layer. The film for laser punching process prepared in Comparative Example 8 had an excessive amount of adhesion accelerator, resulting in poor adhesion between the substrate and the adhesive layer and poor appearance. The film for laser punching process prepared in Comparative Example 9 had a small content of catalyst, so that a coating film was not preferably formed during curing of the adhesive film, and adhesion between the substrate and the adhesive layer was poor. The film for laser punching process prepared in Comparative Example 10 had an excessive amount of catalyst added, and thus, adhesion between the substrate and the adhesive layer was partially poor and the appearance was also poor. The film for laser punching process prepared in Comparative Example 11 did not contain an ultraviolet absorber and was not suitable for laser punching.

From this, the films for laser punching process prepared by Examples 1 to 4 had similar surface resistance, water contact angle, 350 nm and 450 nm compared to the film for laser punching process prepared by Comparative Example 11 (without UV absorber). It can be seen that it has light transmittance at the wavelength and has excellent adhesion and weak peeling power. Furthermore, it can be confirmed that the films for laser punching process prepared in Examples 1 to 4 are suitable for laser punching process films suitable for cutting using an ultraviolet laser.

10: polyester base material, 20: adhesive layer, 100: film for laser punching process

Claims (13)

As a film for laser punching process,
polyester base materials; and
An adhesive layer positioned on at least one surface of the polyester-based substrate; includes,
The adhesive layer is a cured layer of an adhesive composition containing a silicone-based adhesive and an ultraviolet absorber,
The UV absorber includes a triazine-based UV absorber,
It has a light transmittance of 20% or less at a wavelength of 330 nm to 380 nm,
It has a light transmittance of 60% or more at a wavelength of 450 nm or more,
Satisfying Equation 1 below,
A film for laser punching process in which the water contact angle (deg.) of the film satisfies Equation 2 below:
[Equation 1]
0 < │A1-P1│≤ 4 gf/inch
In the expression
A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film,
P1 is the peel force of the film including the adhesive layer excluding the UV absorber under a 180° angle and a speed of 0.3 mpm for the polyester film.
[Equation 2]
118 °≤ water contact angle (deg.) < 128 ° According to claim 1,
Having a light transmittance of 5% to 20% at the wavelength of 330 nm to 380 nm, a film for laser punching process. delete According to claim 1,
The film has a peel force of 15 gf / inch or less at a speed of 0.3 mpm at a 180 ° angle relative to a polyester film at room temperature,
A film for laser punching process having a peel force of 30 gf/inch or less under a 180 ° angle to a polyester film at room temperature and a speed of 2.4 mpm. According to claim 1,
The film satisfies the following formula 3, a film for laser punching process:
[Equation 3]
5 gf/inch < (A2-A1)/2 < 10 gf/inch
In the expression
A1 is the peel force of the film under a 180 ° angle, 0.3 mpm speed for a polyester-based film at room temperature,
A2 is the peel force of the film under a 180° angle, 2.4 mpm speed for a polyester-based film at room temperature. According to claim 1,
The film for laser punching process, wherein the silicone-based adhesive includes a first silicone-based adhesive and a second silicone-based adhesive including two different types of siloxane and a resin containing silane. According to claim 6,
The content of the first silicone-based pressure-sensitive adhesive is greater than the content of the second silicone-based pressure-sensitive adhesive, a film for laser punching process. According to claim 6,
A film for laser punching process in which the content of the ultraviolet absorber is 2.5 parts by weight or less based on 100 parts by weight of the first silicone-based pressure-sensitive adhesive. According to claim 1,
The adhesive composition further comprises a curing agent, an adhesion promoter, a catalyst, and a solvent, a film for laser punching process. According to claim 1,
The thickness of the adhesive layer is 5 ~ 10 ㎛, a film for laser punching process. According to claim 1,
The surface resistance measured according to the ASTM D257 standard for the surface of the film is 1 x 10 ⁴ to 1 x 10 ¹¹ Ω / cm ² , a film for laser punching process. According to claim 1,
A film for laser punching process in which a fluorine-containing silicon release film is additionally disposed on the adhesive layer. An adherend to which the film for laser punching process according to claim 1 is adhered; and
Including; thin film display panel;
The display device, wherein the adherend includes a sheet.

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