KR102509716B1 - Multi-functional processing additives - Google Patents
Multi-functional processing additives Download PDFInfo
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- KR102509716B1 KR102509716B1 KR1020220131066A KR20220131066A KR102509716B1 KR 102509716 B1 KR102509716 B1 KR 102509716B1 KR 1020220131066 A KR1020220131066 A KR 1020220131066A KR 20220131066 A KR20220131066 A KR 20220131066A KR 102509716 B1 KR102509716 B1 KR 102509716B1
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- 239000000654 additive Substances 0.000 title claims abstract description 53
- 238000012545 processing Methods 0.000 title claims abstract description 52
- 230000000996 additive effect Effects 0.000 claims abstract description 32
- 229920001577 copolymer Polymers 0.000 claims description 12
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 claims description 12
- QWOVEJBDMKHZQK-UHFFFAOYSA-N 1,3,5-tris(3-trimethoxysilylpropyl)-1,3,5-triazinane-2,4,6-trione Chemical compound CO[Si](OC)(OC)CCCN1C(=O)N(CCC[Si](OC)(OC)OC)C(=O)N(CCC[Si](OC)(OC)OC)C1=O QWOVEJBDMKHZQK-UHFFFAOYSA-N 0.000 claims description 11
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 claims description 11
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 claims description 10
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 10
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- -1 poly(ethylene trifluoride chloride) Polymers 0.000 claims description 8
- GFKCWAROGHMSTC-UHFFFAOYSA-N trimethoxy(6-trimethoxysilylhexyl)silane Chemical compound CO[Si](OC)(OC)CCCCCC[Si](OC)(OC)OC GFKCWAROGHMSTC-UHFFFAOYSA-N 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 abstract description 20
- 239000000126 substance Substances 0.000 abstract description 4
- 230000036314 physical performance Effects 0.000 abstract description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 12
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 9
- 230000005611 electricity Effects 0.000 description 9
- 239000003063 flame retardant Substances 0.000 description 9
- 230000003068 static effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 7
- 239000000428 dust Substances 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- AVXWWBFBRTXBRM-UHFFFAOYSA-N 3-bromopyridine-4-carboxylic acid Chemical compound OC(=O)C1=CC=NC=C1Br AVXWWBFBRTXBRM-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 2
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 1
- MJRYPELKKIPFMR-UHFFFAOYSA-N 3,3-dihydroxypropyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCC(O)O MJRYPELKKIPFMR-UHFFFAOYSA-N 0.000 description 1
- KFGFVPMRLOQXNB-UHFFFAOYSA-N 3,5,5-trimethylhexanoyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(=O)CC(C)CC(C)(C)C KFGFVPMRLOQXNB-UHFFFAOYSA-N 0.000 description 1
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
- CHDVXKLFZBWKEN-UHFFFAOYSA-N C=C.F.F.F.Cl Chemical compound C=C.F.F.F.Cl CHDVXKLFZBWKEN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 235000002597 Solanum melongena Nutrition 0.000 description 1
- 244000061458 Solanum melongena Species 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000003000 extruded plastic Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000010094 polymer processing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
- C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/22—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers modified by chemical after-treatment
- C08L27/24—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers modified by chemical after-treatment halogenated
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- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
Abstract
Description
본 발명은 폴리머에 첨가되어 가공성을 향상시키는 첨가제에 대한 것이다.The present invention relates to an additive that is added to a polymer to improve processability.
폴리머는 가공시에 여러 원인에 의해 팽창이 발생하는데, 이러한 팽창은 폴리머를 이용한 제품 생산의 시간과 비용을 크게 증가시켜 효율성을 떨어뜨리게 된다. 따라서, 하기 특허문헌에 기재된 것처럼, 폴리머를 이용한 제품 생산 시, 폴리머에 첨가되어 가공성을 향상시키기 위한 가공 첨가제가 널리 사용되고 있다.Polymers expand due to various causes during processing, and this expansion greatly increases the time and cost of producing products using polymers, thereby reducing efficiency. Therefore, as described in the following patent documents, processing additives are widely used to improve processability by being added to polymers when producing products using polymers.
<특허문헌><Patent Document>
특허 제10-0188479호(1999. 01. 12. 등록) "중합체 가공 첨가제 조성물"Patent No. 10-0188479 (registered on Jan. 12, 1999) "Polymer Processing Additive Composition"
종래의 가공 첨가제를 사용하여 가공성을 향상시킬 수 있으나, 최근 중합체를 이용한 제품은 여러 전기적, 화학적, 물리적 특성을 요구하여, 폴리머를 이용한 제품 생산 시, 상기 기능을 부여할 수 있는 다양한 첨가제가 폴리머에 혼합되게 되어, 가공 첨가제가 사용됨에도 가공성이 떨어지는 문제가 있다.Conventional processing additives can be used to improve processability, but recently, products using polymers require various electrical, chemical, and physical properties. It is mixed, and there is a problem of poor processability even when processing additives are used.
본 발명은 상기의 문제점을 해결하기 위해 안출된 것으로,The present invention has been made to solve the above problems,
본 발명은 중합체에 첨가되어 가공성을 향상시키는 다기능성 가공 첨가제를 제공하는데 그 목적이 있다.An object of the present invention is to provide a multi-functional processing additive that is added to a polymer to improve processability.
또한, 본 발명은 가공성을 향상시키면서도 동시에 여러 전기적, 화학적, 물리적 성능을 개선할 수 있는 다기능성 가공 첨가제를 제공하는데 그 목적이 있다.In addition, an object of the present invention is to provide a multifunctional processing additive capable of improving processability and simultaneously improving various electrical, chemical, and physical performances.
본 발명은 앞서 본 목적을 달성하기 위해서 다음과 같은 구성을 가진 실시예에 의해서 구현된다.The present invention is implemented by an embodiment having the following configuration in order to achieve the above object.
본 발명의 일 실시예에 따르면, 본 발명에 따른 가공 첨가제는 올레인산 아미드, 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트, 2,3-디하이드록시프로필 옥타데카노에이트, 폴리(에틸렌 트리플루오라이드 클로라이드), 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머, 비스페놀 A 비스(디페닐 포스페이트), 1,6-비스(트리메톡시실릴)헥산 및 4-터트-부틸스티렌, 폴리(스티렌-코-알파-메틸스티렌)을 반응시켜 제조되는 것을 특징으로 한다.According to one embodiment of the present invention, the processing additive according to the present invention is oleic acid amide, tris [3- (trimethoxysilyl) propyl] isocyanurate, 2,3-dihydroxypropyl octadecanoate, poly (ethylene trifluoride chloride), 4,4'-difluorobenzophenone-hydroxyquinone copolymer, bisphenol A bis(diphenyl phosphate), 1,6-bis(trimethoxysilyl)hexane and 4-tert -It is characterized in that it is prepared by reacting butyl styrene and poly(styrene-co-alpha-methylstyrene).
본 발명의 다른 실시예에 따르면, 본 발명에 따른 가공 첨가제는 올레인산 아미드 30 내지 40중량부, 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트 30 내지 40중량부, 2,3-디하이드록시프로필 옥타데카노에이트 7 내지 13중량부, 폴리(에틸렌 트리플루오라이드 클로라이드) 7 내지 13중량부, 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머 7 내지 13중량부, 비스페놀 A 비스(디페닐 포스페이트) 30 내지 40중량부, 1,6-비스(트리메톡시실릴)헥산 7 내지 10중량부, 4-터트-부틸스티렌 15 내지 20중량부 및 폴리(스티렌-코-알파-메틸스티렌) 7 내지 10중량부를 반응시켜 제조되는 것을 특징으로 한다.According to another embodiment of the present invention, the processing additive according to the present invention is 30 to 40 parts by weight of oleic acid amide, 30 to 40 parts by weight of tris [3- (trimethoxysilyl) propyl] isocyanurate, 2,3- 7 to 13 parts by weight of dihydroxypropyl octadecanoate, 7 to 13 parts by weight of poly(ethylene trifluoride chloride), 7 to 13 parts by weight of 4,4'-difluorobenzophenone-hydroxyquinone copolymer, 30 to 40 parts by weight of bisphenol A bis(diphenyl phosphate), 7 to 10 parts by weight of 1,6-bis(trimethoxysilyl)hexane, 15 to 20 parts by weight of 4-tert-butylstyrene and poly(styrene-co- It is characterized in that it is prepared by reacting 7 to 10 parts by weight of alpha-methylstyrene).
본 발명의 또 다른 실시예에 따르면, 본 발명에 따른 가공 첨가제는 입자 형태를 가지는 것을 특징으로 한다.According to another embodiment of the present invention, the processing additive according to the present invention is characterized in that it has a particle form.
본 발명은 앞서 본 실시예에 의해 다음과 같은 효과를 얻을 수 있다.The present invention can obtain the following effects by the above embodiment.
본 발명은 중합체에 첨가되어 가공성을 향상시킬 수 있는 효과가 있다.The present invention has the effect of improving processability by being added to a polymer.
또한, 본 발명은 가공성을 향상시키면서도 동시에 여러 전기적, 화학적, 물리적 성능을 개선할 수 있는 효과가 있다.In addition, the present invention has the effect of improving processability and improving various electrical, chemical, and physical performances at the same time.
이하에서는 본 발명에 따른 다기능성 가공 첨가제를 상세히 설명한다. 특별한 정의가 없는 한 본 명세서의 모든 용어는 본 발명이 속하는 기술분야의 통상의 지식을 가진 기술자가 이해하는 당해 용어의 일반적 의미와 동일하고 만약 본 명세서에 사용된 용어의 의미와 충돌하는 경우에는 본 명세서에 사용된 정의에 따른다. 또한, 본 발명의 요지를 불필요하게 흐릴 수 있는 공지 기능 및 구성에 대해 상세한 설명은 생략한다. 명세서 전체에서, 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.Hereinafter, the multifunctional processing additive according to the present invention will be described in detail. Unless there is a special definition, all terms in this specification are the same as the general meaning of the term understood by a person skilled in the art to which the present invention belongs, and if it conflicts with the meaning of the term used in this specification, the present invention Follow the definitions used in the specification. In addition, detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted. Throughout the specification, when a part "includes" a certain component, it means that it may further include other components without excluding other components unless otherwise stated.
본 발명의 일 실시예에 따른 다기능성 가공 첨가제는 중합체에 첨가되어 가공성을 향상시키는 물질로, 올레인산 아미드 30 내지 40중량부, 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트 30 내지 40중량부, 2,3-디하이드록시프로필 옥타데카노에이트 7 내지 13중량부, 폴리(에틸렌 트리플루오라이드 클로라이드) 7 내지 13중량부, 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머 7 내지 13중량부, 비스페놀 A 비스(디페닐 포스페이트) 30 내지 40중량부, 1,6-비스(트리메톡시실릴)헥산 7 내지 10중량부, 4-터트-부틸스티렌 15 내지 20중량부, 폴리(스티렌-코-알파-메틸스티렌) 7 내지 10중량부 및 중합촉진제 0.01 내지 2중량부를 포함하는 가공 첨가제 조성물을 반응시켜 제조되는 것을 특징으로 한다. 상기 다기능성 가공 첨가제는 입자 형태를 가지며, 일정 크기를 가지나 바람직하게는 0.001 내지 1mm의 평균 입도를 가지게 된다.The multifunctional processing additive according to an embodiment of the present invention is a material added to a polymer to improve processability, 30 to 40 parts by weight of oleic acid amide, 30 to 40 parts by weight of tris [3- (trimethoxysilyl) propyl] isocyanurate 40 parts by weight, 7 to 13 parts by weight of 2,3-dihydroxypropyl octadecanoate, 7 to 13 parts by weight of poly(ethylene trifluoride chloride), 4,4'-difluorobenzophenone-hydroxyquinone 7 to 13 parts by weight of copolymer, 30 to 40 parts by weight of bisphenol A bis(diphenyl phosphate), 7 to 10 parts by weight of 1,6-bis(trimethoxysilyl)hexane, 15 to 20 parts by weight of 4-tert-butylstyrene It is characterized in that it is prepared by reacting a processing additive composition containing 7 to 10 parts by weight of poly(styrene-co-alpha-methylstyrene) and 0.01 to 2 parts by weight of a polymerization accelerator. The multifunctional processing additive has a particle shape and has a predetermined size, but preferably has an average particle size of 0.001 to 1 mm.
상기 올레인산 아미드(Oleic acid amide, CAS No. : 301-02-0)는 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트와 함께 중합체의 가공성을 향상시키기 위해 사용되는 구성으로 30 내지 40중량부 범위에서 사용되게 된다The oleic acid amide (CAS No.: 301-02-0) is a composition used to improve the processability of polymers together with tris [3- (trimethoxysilyl) propyl] isocyanurate, and is 30 to It will be used in the range of 40 parts by weight
상기 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트(Tris[3-(trimethoxysilyl)propyl] isocyanurate, CAS No. : 26115-70-8)은 올레인산 아미드와 함께 중합체의 가공성을 향상시키기 위해 사용되는 구성으로, 30 내지 40중량부 범위에서 사용되게 된다.The tris [3- (trimethoxysilyl) propyl] isocyanurate (Tris [3- (trimethoxysilyl) propyl] isocyanurate, CAS No.: 26115-70-8) together with oleic acid amide to improve the processability of the polymer As a composition used for, it is used in the range of 30 to 40 parts by weight.
상기 2,3-디하이드록시프로필 옥타데카노에이트(2,3-dihydroxypropyl octadecanoate, CAS N0. : 123-94-4)는 중합체의 정전기 발생을 방지하기 위해 사용하는 구성으로, 7 내지 13중량부 범위에서 사용되게 된다. 중합체의 제품의 일 예로 계측 기기 등에서 사용되는 케이블 등을 예로 들 수 있는데, 상기 케이블에서 정전기가 발생하는 경우 계측의 정확도가 떨어지므로, 2,3-디하이드록시프로필 옥타데카노에이트가 사용되어 정전기를 방지하는 전기적 특성을 향상시키게 된다.The 2,3-dihydroxypropyl octadecanoate (2,3-dihydroxypropyl octadecanoate, CAS No.: 123-94-4) is a component used to prevent the generation of static electricity in the polymer, 7 to 13 parts by weight will be used in range. An example of a polymer product is a cable used in a measuring device, etc., and when static electricity is generated in the cable, measurement accuracy is reduced. Therefore, 2,3-dihydroxypropyl octadecanoate is used to reduce static electricity. to improve the electrical properties that prevent
상기 폴리(에틸렌 트리플루오라이드 클로라이드)(Poly(ethylene trifluoride chloride, CAS No. : 9002-83-9)는 중합체의 유전율을 낮추기 위해 사용하는 구성으로, 7 내지 13중량부 범위에 사용되게 된다. 일반적으로 비극성 폴리올레핀 수지는 절연성이 높고 유전율이 낮은 특성을 가지나 기계적 물성이 떨어져 극성 폴리올레핀 수지가 일부 혼합 사용되므로, 유전율이 높아져 주파수 변화에 따른 큰 영향을 받을 수 있는데, 폴리(에틸렌 트리플루오라이드 클로라이드)가 사용되어 유전율을 낮추어 주파수 변화에 따른 영향을 줄여 전기적 특성을 향상시키게 된다.The poly(ethylene trifluoride chloride, CAS No.: 9002-83-9) is a composition used to lower the dielectric constant of the polymer, and is used in the range of 7 to 13 parts by weight. General As a result, non-polar polyolefin resins have high insulation and low permittivity, but have low mechanical properties and are partially mixed with polar polyolefin resins, so the dielectric constant increases and can be greatly affected by frequency changes. Poly(ethylene trifluoride chloride) It is used to lower the permittivity and reduce the effect of frequency change to improve electrical characteristics.
상기 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머(4,4′-Difluorobenzophenone-hydroquinone copolymer, CAS No. : 29658-26-2)는 중합체의 방사능에 대한 저항성을 향상시키기 위해 사용하는 구성으로 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머는 방사능에 대한 저항성를 가지고 있음이 널리 알려져 있으며, 7 내지 13중량부 범위에 사용되게 된다. 중합체로 제조된 제품이 고온 및 다습한 환경에서 오랫 동안 있는 경우 제품 물성의 변화로 추가적으로 부여한 전기적 특성이 저하되게 되는데, 상기 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머는 고온 및 다습한 환경에서의 제품 물성 저하를 방지해 전기적 특성이 저하되는 것을 줄일 수 있도록 한다. 위에서 제품의 일 예로 든 케이블의 경우 방사능을 이용하는 각종 기기(예컨대 의료 기기 등)에 사용될 수 있는데, 상기 케이블이 방사능에 계속적으로 노출되는 경우 그 기능을 수행하지 못해 안전 사고가 발생할 수 있는데, 4,4'-디플루오로벤조페논이 사용되어 방사능에 대한 저항성을 향상시키게 된다.The 4,4'-difluorobenzophenone-hydroxyquinone copolymer (4,4'-Difluorobenzophenone-hydroquinone copolymer, CAS No.: 29658-26-2) is used to improve the resistance to radiation of the polymer It is widely known that the 4,4'-difluorobenzophenone-hydroxyquinone copolymer has resistance to radioactivity, and is used in the range of 7 to 13 parts by weight. When a product made of a polymer is exposed to a high temperature and high humidity environment for a long time, the electrical properties additionally given due to the change in product properties are deteriorated. The 4,4'-difluorobenzophenone-hydroxyquinone copolymer is It prevents the deterioration of product properties in a humid environment to reduce the deterioration of electrical properties. In the case of the cable as an example of the product above, it can be used in various devices (eg, medical devices) that use radiation. If the cable is continuously exposed to radiation, it may fail to perform its function and cause a safety accident. 4'-Difluorobenzophenone is used to improve resistance to radiation.
상기 비스페놀 A 비스(디페닐 포스페이트)(Bisphenol A Bis(diphenyl phosphate, CAS No. : 5945-33-5)는 중합체의 난연성을 향상시키기 위해 사용하는 구성으로, 30 내지 40중량부 범위에서 사용되게 된다. 다양한 전기적 특성을 가진 플라스틱 제품은 열에 계속적으로 노출되게 되므로, 비스페놀 A 비스(디페닐 포스페이트)가 첨가되어 난연성을 향상시키게 된다.The bisphenol A bis(diphenyl phosphate) (Bisphenol A Bis(diphenyl phosphate, CAS No.: 5945-33-5) is a component used to improve the flame retardancy of the polymer, and is used in the range of 30 to 40 parts by weight Since plastic products with various electrical properties are continuously exposed to heat, bisphenol A bis(diphenyl phosphate) is added to improve flame retardancy.
상기 1,6-비스(트리메톡시실릴)헥산(1,6-Bis(trimethoxysilyl)hexane, CAS No. : 87135-01-1)은 다기능성 가공 첨가제를 구성하는 성분의 결합력을 증대시키기 위해 사용하는 구성으로, 7 내지 10중량부 범위에서 사용되게 된다.The 1,6-bis (trimethoxysilyl) hexane (CAS No.: 87135-01-1) is used to increase the bonding strength of components constituting multifunctional processing additives. As a configuration, it is used in the range of 7 to 10 parts by weight.
상기 4-터트-부틸스티렌(4-tert-Butylstyrene, CAS No. : 1746-23-2)는 입자 형태로 제조된 가공 첨가제의 중합체 내에서의 분산성을 향상시키기 위해 사용하는 구성으로, 15 내지 20중량부 범위에서 사용되게 된다.The 4-tert-butylstyrene (4-tert-Butylstyrene, CAS No.: 1746-23-2) is a component used to improve the dispersibility of a processing additive prepared in the form of particles in a polymer, It is used in the range of 20 parts by weight.
상기 폴리(스티렌-코-알파-메틸스티렌)(Poly(styrene-co-α-methylstyrene), CAS No.: 9011-11-4)는 중합체와의 상용성을 향상시키기 위해 사용하는 구성으로, 7 내지 10중량부 범위에서 사용되게 된다.The poly (styrene-co-alpha-methylstyrene) (Poly (styrene-co-α-methylstyrene), CAS No.: 9011-11-4) is a composition used to improve compatibility with polymers, 7 to 10 parts by weight.
상기 중합촉진제는 중합을 촉진하는 구성으로, 0.01 내지 2중량부 범위에서 사용되며, 종래의 다양한 중합촉진제가 사용될 수 있으며 예컨대 비스(3,5,5-트리메틸헥사노일)퍼옥사이드(bis(3,5,5-Trimethylhexanoyl) peroxide, CAS No. : 3851-87-4)가 사용될 수 있다.The polymerization accelerator is a composition that promotes polymerization, and is used in the range of 0.01 to 2 parts by weight, and various conventional polymerization accelerators may be used, such as bis (3,5,5-trimethylhexanoyl) peroxide (bis (3, 5,5-Trimethylhexanoyl) peroxide, CAS No.: 3851-87-4) can be used.
이하, 실시예를 통해서 본 발명을 보다 상세히 설명하기로 한다. 하지만, 이들은 본 발명을 보다 상세하게 설명하기 위한 것일 뿐 본 발명의 권리범위가 이에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through examples. However, these are only for explaining the present invention in more detail and the scope of the present invention is not limited thereto.
<실시예 1> 가공 첨가제의 제조<Example 1> Preparation of processing additives
1. 가공첨가제 11. Processing additives 1
(1) 물(Diw) 1000중량부가 들어 있는 반응기(A)에 지방산 10중량부와 수산화나트륨 2중량부를 첨가한 후 교반하고 90℃로 승온하여 지방산염을 형성하고, 상기 반응기(A)에 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트(수중유화된 형태(Latex)로 사용) 35중량부, 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머(수중유화된 형태(Latex)로 사용) 10중량부, 비스페놀 A 비스(디페닐 포스페이트)(수중유화된 형태(Latex)로 사용) 35중량부를 첨가시킨 후, 비스(3,5,5-트리메틸헥사노일)퍼옥사이드 0.2중량부를 첨가하여 질소 퍼징하였다.(1) After adding 10 parts by weight of fatty acid and 2 parts by weight of sodium hydroxide to a reactor (A) containing 1000 parts by weight of water (Diw), stirring and raising the temperature to 90 ° C. to form a fatty acid salt, the tris in the reactor (A) [3-(trimethoxysilyl)propyl] isocyanurate (used in the form emulsified in water (Latex)) 35 parts by weight, 4,4'-difluorobenzophenone-hydroxyquinone copolymer (emulsified in water) bis(3,5,5-trimethylhexanoyl)per Nitrogen purging was performed by adding 0.2 parts by weight of oxide.
(2) 반응기(B)에 올레인산 아미드(에탄올에 용해시켜 사용) 35중량부, 2,3-디하이드록시프로필 옥타데카노에이트 10중량부, 폴리(에틸렌 트리플루오라이드 클로라이드) 10중량부, 1,6-비스(트리메톡시실릴)헥산 8중량부, 4-터트-부틸스티렌 17중량부, 폴리(스티렌-코-알파-메틸스티렌) 8중량부를 첨가하여 생성한 혼합물을 반응기(A)에 첨가하고 반응시켰다.(2) In the reactor (B), 35 parts by weight of oleic acid amide (used after being dissolved in ethanol), 10 parts by weight of 2,3-dihydroxypropyl octadecanoate, 10 parts by weight of poly(ethylene trifluoride chloride), 1 A mixture obtained by adding 8 parts by weight of ,6-bis(trimethoxysilyl)hexane, 17 parts by weight of 4-tert-butylstyrene, and 8 parts by weight of poly(styrene-co-alpha-methylstyrene) was placed in a reactor (A). added and reacted.
(3) 상기 (2) 과정에서 반응이 완료된 반응액에 묽은 황산을 가하여 응집시키고 응집물의 온도를 100℃까지 상승시켜 입자의 강성을 부여한 후, 함수율이 1% 이하가 될 때까지 유동층 건조기에서 건조하고 분쇄하여 입자상의 가공첨가제 1을 얻었다.(3) Dilute sulfuric acid was added to the reaction solution after completion of the reaction in the step (2) to agglomerate, and the temperature of the agglomerate was raised to 100 ° C to give rigidity to the particles, and then dried in a fluidized bed dryer until the moisture content was 1% or less. and pulverized to obtain a particulate processing additive 1.
2. 가공첨가제 22. Processing additives 2
올레인산 아미드를 사용하지 않고 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트 70중량부를 사용한 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 2를 얻었다.Processing additive 2 was obtained in the same manner as in Example 1-1, except that 70 parts by weight of tris[3-(trimethoxysilyl)propyl] isocyanurate was used without using oleic acid amide.
3. 가공첨가제 33. Processing additives 3
트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트를 사용하지 않고 올레인산 아미드 70중량부를 사용한 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 3을 얻었다.Processing additive 3 was obtained in the same manner as in Example 1-1, except that 70 parts by weight of oleic acid amide was used without using tris[3-(trimethoxysilyl)propyl] isocyanurate.
4. 가공첨가제 44. Processing additives 4
4-터트-부틸스티렌를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 4를 얻었다.Processing additive 4 was obtained in the same manner as in Example 1-1 except that 4-tert-butylstyrene was not used.
5. 가공첨가제 55. Processing additives 5
2,3-디하이드록시프로필 옥타데카노에이트를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 5를 얻었다.Processing additive 5 was obtained in the same manner as in Example 1, except that 2,3-dihydroxypropyl octadecanoate was not used.
6. 가공첨가제 66. Processing additives 6
폴리(에틸렌 트리플루오라이드 클로라이드)를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 6을 얻었다.Processing additive 6 was obtained in the same manner as in Example 1-1 except that poly(ethylene trifluoride chloride) was not used.
7. 가공첨가제 77. Processing additives 7
4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 7을 얻었다.Processing additive 7 was obtained in the same manner as in Example 1-1 except that the 4,4'-difluorobenzophenone-hydroxyquinone copolymer was not used.
8. 가공첨가제 88. Processing additives 8
비스페놀 A 비스(디페닐 포스페이트)를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 8을 얻었다.Processing additive 8 was obtained in the same manner as in Example 1-1 except that bisphenol A bis(diphenyl phosphate) was not used.
9. 가공첨가제 99. Processing additives 9
1,6-비스(트리메톡시실릴)헥산를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 9를 얻었다.Processing additive 9 was obtained in the same manner as in Example 1-1 except that 1,6-bis(trimethoxysilyl)hexane was not used.
10. 가공첨가제 1010. Processing additives 10
폴리(스티렌-코-알파-메틸스티렌)를 사용하지 않은 것을 제외하고는 다른 조건을 실시예 1의 1과 동일하게 하여 가공첨가제 10을 얻었다.Processing additive 10 was obtained in the same manner as in Example 1, except that poly(styrene-co-alpha-methylstyrene) was not used.
<실시예 2> 시료의 분산성 평가<Example 2> Evaluation of dispersibility of samples
1. 마스터배치 시료 준비1. Masterbatch sample preparation
LDPE 95중량부 및 가공첨가제 5중량부를 사용하여 마스터배치 시료 1 내지 10을 준비하였다. 마스터배치 시료 1 내지 10은 각각 가공첨가제 1 내지 10을 사용하였다.Masterbatch samples 1 to 10 were prepared using 95 parts by weight of LDPE and 5 parts by weight of a processing additive. Masterbatch samples 1 to 10 used processing additives 1 to 10, respectively.
2. 분산성 평가2. Dispersion evaluation
(1) 마스터배치 시료 1 내지 10에 대하여 SEM으로 분산 형태와 분산 입자 크기를 확인하여, 분산성을 평가하였다. 분산성은 SEM 이미지를 확인하여 입자가 응집되어 100um 이상의 입자가 대략 20% 이상 있는 경우 분산성이 나쁘다고 평가하였다.(1) The dispersibility was evaluated by checking the dispersion form and the dispersed particle size with SEM for Masterbatch Samples 1 to 10. Dispersibility was evaluated by checking the SEM image, and the dispersibility was bad when the particles were aggregated and the particles of 100 μm or more were approximately 20% or more.
(2) 분산성 평가 결과, 마스터배치 시료 4, 9 및 10은 분산성이 나쁨으로 평가되고, 마스터배치 시료 1 내지 3 및 5 내지 8은 분산성이 좋음으로 평가되어, 형성된 가공첨가제가 제대로 코팅되지 않고, 수지와 상용성을 향상시키는 성분, 성분의 결합력 증대시키는 성분 등이 사용되지 않은 경우 분산성이 떨어짐을 알 수 있다.(2) As a result of dispersibility evaluation, masterbatch samples 4, 9 and 10 were evaluated as having poor dispersibility, and masterbatch samples 1 to 3 and 5 to 8 were evaluated as having good dispersibility, and the formed processing additives were properly coated. It can be seen that the dispersibility is poor when the component improving the compatibility with the resin and the component increasing the bonding strength of the component are not used.
<실시예 3> 가공성 평가<Example 3> Processability evaluation
1. 상기 마스터배치 시료 1, 2, 3, 4, 9 및 10에 대하여 Thermofisher사의 rheodrove7 단일 스크류(다이 직경은 1.5mm로, L=20d임)를 이용하여 시편을 일정 전단속도(~400s-1)로 압출하여 시험하였다. 시험평가 항목으로 압출 시작으로부터 90분이 지난 후 압력을 측정하고(압출기의 압력계 이용 측정), 용융균열 제거 시간(압출 초기에 배출되는 Strand의 상태에서 용융 균열 현상이 육안 감지 가능하며 시간이 지남에 따라 이 현상이 제거됨)을 확인하여, 그 결과를 표 1에 나타내었다. 또한, 다이 출구면에서 압출된 플라스틱이 축적되는 현상이 발생하는 시간을 확인하여 마스터배치 시료 1, 2, 3, 4, 9 및 10에 대하여 빌드업이 먼저 발생하는 순서를 확인하였다.1. For masterbatch samples 1, 2, 3, 4, 9 and 10, the specimens were subjected to a constant shear rate (~ 400 s -1 ) and tested by extrusion. As a test evaluation item, the pressure is measured after 90 minutes from the start of extrusion (measured using the pressure gauge of the extruder), and the melting crack removal time (the melting crack phenomenon can be visually detected in the state of the strand discharged at the beginning of extrusion, and the This phenomenon was removed) was confirmed, and the results are shown in Table 1. In addition, by checking the time at which the extruded plastic accumulates at the die exit surface, the order in which build-up occurs first for masterbatch samples 1, 2, 3, 4, 9, and 10 was confirmed.
2. 표 1을 보면, 마스터 배치 시료 2 및 3가 마스터배치 시료 1보다 내압감소와 용융 균열 제거 시간이 상대적으로 떨어짐을 알 수 있어, 올레인산 아미드와 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트를 혼합 사용 시 각각 사용할 때보다 가공성을 향상시킬 수 있음을 알 수 있다. 또한, 마스터 시료 4, 9 및 10이 마스터 배치 시료 1보다 내압감소와 용융 균열 제기 시간이 떨어짐을 확인할 수 있다. 빌드업이 먼저 발생한 순서대로 나타내면, 마스터배치 4, 마스터배치 10, 마스터배치 3, 마스터배치 2, 마스터배치 9, 마스터배치 1의 순서대로 빌드업이 나타나, 내압감소와 용융 균열 제거 시간에 대한 평가 결과와 유사한 결과를 가짐을 알 수 있다.2. Looking at Table 1, it can be seen that master batch samples 2 and 3 have relatively lower pressure reduction and melting crack removal time than master batch sample 1, so that oleic acid amide and tris [3- (trimethoxysilyl) propyl] It can be seen that when isocyanurate is used in combination, processability can be improved compared to when each isocyanurate is used. In addition, it can be seen that master samples 4, 9, and 10 have a lower withstand pressure decrease and melting crack raising time than master batch sample 1. If the build-up is shown in the order in which it occurred first, the build-up appears in the order of master batch 4, master batch 10, master batch 3, master batch 2, master batch 9, master batch 1, and the evaluation of the pressure reduction and melting crack elimination time It can be seen that the results are similar to those of
<실시예 4> 전기적 성질 확인<Example 4> Confirmation of electrical properties
1. 전기 시료의 준비1. Preparation of electrical samples
저밀도 폴리에틸렌 70중량부, 에틸렌에틸아크릴레이트 30중량부, 가공첨가제 10중량부 및 디큐밀 페록사이드 2중량부를 혼합한 후 성형하여 필름 형태의 전기 시료 1 내지 5을 준비하였다. 상기 전기 시료 1 내지 5는 각각 가공 첨가제 1 및 5 내지 8을 사용하였다.70 parts by weight of low-density polyethylene, 30 parts by weight of ethylene ethyl acrylate, 10 parts by weight of a processing additive, and 2 parts by weight of dicumyl peroxide were mixed and molded to prepare electrical samples 1 to 5 in the form of a film. The electrical samples 1 to 5 used processing additives 1 and 5 to 8, respectively.
2. 정전기 발생 평가2. Evaluation of static electricity generation
(1) 플라스틱에 정전기가 발생하면 먼지가 달라붙게 되므로, 인위적으로 먼지가 부유하는 환경을 조성하는 후, 전기 시료 1 내지 5를 상기 환경에 노출시킨 후, 상기 전기 시료 1 내지 5에 붙어있는 먼지의 양을 육안으로 평가하였다.(1) Since dust adheres to plastic when static electricity is generated, an environment in which dust is artificially suspended is created, and after exposing the electrical samples 1 to 5 to the environment, the dust attached to the electrical samples 1 to 5 The amount of was visually evaluated.
(2) 상기 전기 시료 1 내지 5의 정전기 발생 평가 결과를 보면, 전기 시료 2가 1 및 3 내지 5에 비하여 먼지의 양이 현저히 많음을 확인하였다. 이를 통해, 가공 첨가제에 2,3-디하이드록시프로필 옥타데카노에이트가 사용되는 경우 정전기 발생을 억제할 수 있음을 알 수 있다.(2) Looking at the static electricity generation evaluation results of the electrical samples 1 to 5, it was confirmed that the amount of dust in electrical sample 2 was significantly greater than that of electrical samples 1 and 3 to 5. From this, it can be seen that generation of static electricity can be suppressed when 2,3-dihydroxypropyl octadecanoate is used as a processing additive.
3. 유전율 평가3. Permittivity evaluation
(1) Dielectric Analyzer를 이용하여 전기 시료 1 내지 5에 대하여 8GHz에서 유전율을 측정하였다.(1) The dielectric constant of electrical samples 1 to 5 was measured at 8 GHz using a dielectric analyzer.
(2) 상기 전기 시료 1 내지 5의 유전율 측정 결과를 보면, 전기 시료 3 및 4가 1, 2 및 5에 비해 유전율이 높고, 시료 3이 시료 4보다 유전율이 높음을 확인하였다. 이를 통해, 가공 첨가제에 폴리(에틸렌 트리플루오라이드 클로라이드)가 사용되는 경우 저유전율을 가지도록 할 수 있음을 알 수 있고, 폴리(에틸렌 트리플루오라이드 클로라이드)보다는 효과는 적으나 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머 역시 저유전율을 가지도록 할 수 있음을 알 수 있다.(2) Looking at the results of measuring the permittivity of the electrical samples 1 to 5, it was confirmed that the dielectric constants of the electrical samples 3 and 4 were higher than those of the electrical samples 1, 2 and 5, and the dielectric constant of the sample 3 was higher than that of the sample 4. From this, it can be seen that when poly (ethylene trifluoride chloride) is used as a processing additive, it can be made to have a low dielectric constant, and although the effect is less than that of poly (ethylene trifluoride chloride), 4,4'-di It can be seen that the fluorobenzophenone-hydroxyquinone copolymer can also have a low dielectric constant.
<실시예 5> 고온 및 다습한 환경에 유지 후 전기적 특성 평가<Example 5> Evaluation of electrical properties after maintaining in a high temperature and high humidity environment
1. 전기 시료 1 및 4를 70℃의 온도 및 95%의 항온항습 조건에서 15일 동안 처리한 후, 건조한 전기 시료 1 및 4를 사용하여 위와 같은 방법으로 정전기 발생 평가를 수행하였다.1. After treating electrical samples 1 and 4 at a temperature of 70° C. and constant temperature and humidity of 95% for 15 days, static electricity generation was evaluated using the dried electrical samples 1 and 4 in the same manner as above.
2. 실시예 4의 2의 실험 후 전기 시료 1 및 4에 붙어 있는 먼저의 양은 별 차이가 없었으나, 실시예 5의 1의 실험 후에는 시료 4가 시료 1에 비해 현저하게 많은 먼지가 달라 붙어 있음을 확인할 수 있었다. 이를 통해, 상기 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머는 고온 및 다습한 환경에서의 제품 물성 저하를 방지해 전기적 특성(정전기 발생 억제)이 저하되는 것을 줄일 수 있음을 알 수 있다.2. After the experiment of Example 4-2, there was no significant difference in the amount of dust attached to electrical samples 1 and 4, but after the experiment of Example 5-1, sample 4 had significantly more dust than sample 1, it was possible to confirm that From this, it can be seen that the 4,4'-difluorobenzophenone-hydroxyquinone copolymer can reduce the deterioration of electrical properties (inhibition of generation of static electricity) by preventing deterioration of product properties in a high temperature and high humidity environment. can
<실시예 6> 난연성 평가<Example 6> Flame retardancy evaluation
1. 난연 시료의 준비1. Preparation of flame retardant samples
저밀도 폴리에틸렌 70중량부, 에틸렌에틸아크릴레이트 30중량부, 난연제(실란으로 표면처리된 수산화알루미늄) 30중량부, 가공첨가제 10중량부 및 디큐밀 페록사이드 2중량부를 혼합하여 1/16 인치의 두께를 가지는 난연 시료 1 내지 3을 준비하였다. 상기 난연 시료 1 내지 3은 각각 가공 첨가제 1, 4 및 8을 사용하였다.70 parts by weight of low density polyethylene, 30 parts by weight of ethylene ethyl acrylate, 30 parts by weight of flame retardant (aluminum hydroxide surface treated with silane), 10 parts by weight of processing additive, and 2 parts by weight of dicumyl peroxide were mixed to obtain a thickness of 1/16 inch. Eggplant flame retardant samples 1 to 3 were prepared. The flame retardant samples 1 to 3 used processing additives 1, 4 and 8, respectively.
2. 난연도 평가2. Flame retardancy evaluation
(1) 난연 시료 1 내지 3에 대하여 적정비, 목면 연소, 연소율 및 난연도를 UL94에 따라 평가하였으며, 그 결과를 표 2에 나타내었다.(1) Flame retardancy Proper ratio, cotton burning, burning rate and flame retardancy of samples 1 to 3 were evaluated according to UL94, and the results are shown in Table 2.
(2) 표 2를 보면, 난연 시료 1에 비해 난연 시료 2가 연소율이 떨어지고, 난연 시료 2에 비해 난연 시료 3이 연소율이 떨어짐을 확인할 수 있어, 비스페놀 A 비스(디페닐 포스페이트)를 사용하는 경우 난연성을 향상시킬 수 있고, 코팅을 통해 분산성을 향상시키는 경우 더욱 난연성을 향상시킬 수 있음을 알 수 있다.(2) Looking at Table 2, it can be seen that the burning rate of the flame retardant sample 2 is lower than that of the flame retardant sample 1, and the burning rate of the flame retardant sample 3 is lower than that of the flame retardant sample 2. When using bisphenol A bis(diphenyl phosphate) It can be seen that flame retardancy can be improved, and flame retardancy can be further improved when dispersibility is improved through coating.
이상에서, 출원인은 본 발명의 바람직한 실시예들을 설명하였지만, 이와 같은 실시예들은 본 발명의 기술적 사상을 구현하는 일 실시예일 뿐이며 본 발명의 기술적 사상을 구현하는 한 어떠한 변경예 또는 수정예도 본 발명의 범위에 속하는 것으로 해석되어야 한다.In the above, the applicant has described the preferred embodiments of the present invention, but these embodiments are only one embodiment of implementing the technical idea of the present invention, and any changes or modifications are the same as those of the present invention as long as they implement the technical idea of the present invention. should be construed as falling within the scope.
Claims (3)
상기 가공 첨가제는 올레인산 아미드 30 내지 40중량부, 트리스[3-(트리메톡시실릴)프로필] 이소시아누레이트 30 내지 40중량부, 2,3-디하이드록시프로필 옥타데카노에이트 7 내지 13중량부, 폴리(에틸렌 트리플루오라이드 클로라이드) 7 내지 13중량부, 4,4'-디플루오로벤조페논-하이드록퀴논 코폴리머 7 내지 13중량부, 비스페놀 A 비스(디페닐 포스페이트) 30 내지 40중량부, 1,6-비스(트리메톡시실릴)헥산 7 내지 10중량부, 4-터트-부틸스티렌 15 내지 20중량부 및 폴리(스티렌-코-알파-메틸스티렌) 7 내지 10중량부을 반응시켜 제조되는 것을 특징으로 하는 가공 첨가제.According to claim 1,
The processing additive is oleic acid amide 30 to 40 parts by weight, tris [3- (trimethoxysilyl) propyl] isocyanurate 30 to 40 parts by weight, 2,3-dihydroxypropyl octadecanoate 7 to 13 parts by weight 7 to 13 parts by weight of poly(ethylene trifluoride chloride), 7 to 13 parts by weight of 4,4'-difluorobenzophenone-hydroxyquinone copolymer, 30 to 40 parts by weight of bisphenol A bis(diphenyl phosphate) 7 to 10 parts by weight of 1,6-bis(trimethoxysilyl)hexane, 15 to 20 parts by weight of 4-tert-butylstyrene, and 7 to 10 parts by weight of poly(styrene-co-alpha-methylstyrene) were reacted. Processing additives, characterized in that produced.
상기 가공 첨가제는 입자 형태를 가지는 것을 특징으로 하는 가공 첨가제.According to claim 2,
Processing additive, characterized in that the processing additive has a particle form.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023076A (en) * | 2005-07-12 | 2007-02-01 | Mitsui Chemicals Inc | Flame-retardant resin composition |
| JP2016125035A (en) * | 2015-01-08 | 2016-07-11 | 株式会社Adeka | Flame retardant agent composition and flame retardant synthetic resin composition |
| JP2020186063A (en) * | 2014-11-14 | 2020-11-19 | ガラ・インダストリーズ・インコーポレイテッドＧａｌａ Ｉｎｄｕｓｔｒｉｅｓ， Ｉｎｃ． | Film for packaging adhesive material |
| WO2021206077A1 (en) * | 2020-04-07 | 2021-10-14 | 出光興産株式会社 | Resin composition pellet |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023076A (en) * | 2005-07-12 | 2007-02-01 | Mitsui Chemicals Inc | Flame-retardant resin composition |
| JP2020186063A (en) * | 2014-11-14 | 2020-11-19 | ガラ・インダストリーズ・インコーポレイテッドＧａｌａ Ｉｎｄｕｓｔｒｉｅｓ， Ｉｎｃ． | Film for packaging adhesive material |
| JP2016125035A (en) * | 2015-01-08 | 2016-07-11 | 株式会社Adeka | Flame retardant agent composition and flame retardant synthetic resin composition |
| WO2021206077A1 (en) * | 2020-04-07 | 2021-10-14 | 出光興産株式会社 | Resin composition pellet |
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