KR102509271B1 - Acoustic output device - Google Patents

Abstract

The present invention relates to an audio output device, wherein the audio output device includes: a housing having a space therein; an audio output unit positioned within the space of the housing and outputting sound; and a sound output unit positioned within the space of the housing. It includes a temperature sensor mounting board located at the bottom and a temperature sensor located within a space of the housing and mounted on the temperature sensor mounting board, the temperature sensor overlapping the sound output unit located at the top.

Description

Acoustic output device {ACOUSTIC OUTPUT DEVICE}

The present invention relates to an audio output device, and more particularly, to an audio output device capable of measuring temperature.

Recently, a wireless device such as a wireless earphone that receives and reproduces a sound signal wirelessly using a wireless communication technology such as Bluetooth communication is widely used as an audio output device such as an earphone.

Since these wireless earphones do not require an electric wire for connection to a main body device that transmits sound signals, user convenience is greatly improved and storage and the like are easily and widely used.

However, these earphones are limited to simply reproducing sound signals wirelessly transmitted from the main body device.

Patent Publication No. 10-2009-0010717 (published date: January 30, 2009, title of invention: multi-function wireless earphone) Publicated Utility Model No. 20-2019-0003275 (published date: December 31, 2019, design name: structure of wireless earphone for auto pairing)

The problem to be solved by the present invention is to measure the wearer's body temperature using an earphone.

An audio output device according to one feature of the present invention includes a housing having a space therein, an audio output unit located within the space of the housing and outputting sound, located within the space of the housing and located below the audio output unit. A temperature sensor mounting substrate and a temperature sensor positioned within a space of the housing and mounted on the temperature sensor mounting substrate may be included, and the temperature sensor may be positioned to overlap the sound output unit located thereon.

The sound output device according to the above feature may further include a bracket located in a space of the housing and in which the sound output unit is located, and the temperature sensor mounting substrate may be positioned below the bracket.

The bracket may include a main bracket portion in which the sound output unit is located and a sub-bracket portion located below the main bracket portion and coupled to the main bracket portion, and the temperature sensor mounting substrate may be located below the sub-bracket portion. can

The housing may include a support protruding from an inner surface toward the bracket, and the sub-bracket portion may include a plurality of coupling protrusions protruding toward the support from a lower end of the sub-bracket and positioned on an upper surface of the support. .

The sound output device according to the above feature may further include a waterproof plate positioned between the main bracket part and the sub bracket part.

The waterproof plate may have a mesh structure having a plurality of holes.

The temperature sensor-mounted substrate may include at least one sound groove located at an edge of the temperature sensor-mounted substrate and recessed toward the inside of the housing, and the sound of the sound output unit is generated by sound of the sound groove adjacent to each other and the housing. It may be output to the outside through at least one vent located between the inner surfaces.

The temperature sensor mounting substrate may include a mounting portion on which the temperature sensor is mounted and a connection portion connected to the mounting portion and extending in one direction, located below the sound output unit, wherein the at least one sound groove is formed on the mounting portion. can be located on the edge of

The connection part may be a flexible circuit board.

The connecting portion may extend upward along a separation space between the housing and the sound output unit.

The housing may include at least one recessed portion facing the at least one sound groove and recessed outward from an inner surface of the housing.

According to this feature, since the wearer's body temperature is measured using an audio output device that outputs an audio signal and then transmitted to the main body device worn by the wearer, there is no need to separately provide a thermometer.

Due to this, the wearer can measure his/her own body temperature using the sound output device whenever necessary.

Therefore, since most of the cases of respiratory diseases such as colds or flu exceed the normal body temperature, the wearer of the sound output device can quickly measure his/her own body temperature using the sound output device he or she owns. Depending on your own body temperature, you can take necessary measures such as rapid isolation or a visit to the hospital.

This can prevent or slow down the spread of highly contagious diseases.

1 is a cross-sectional view obtained by cutting an earphone according to an embodiment of the present invention along one direction.
2 is a perspective view of a main bracket part of an earphone according to an embodiment of the present invention.
3 is a perspective view of a sub-bracket part of an earphone according to an embodiment of the present invention.
4A is a plan view of a temperature sensor module of an earphone according to an embodiment of the present invention.
4B is a perspective view of a temperature sensor module of an earphone according to an embodiment of the present invention.
5 and 6 are enlarged views of different parts of an earphone according to an embodiment of the present invention.

Hereinafter, the embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings, but the same or similar elements are given the same reference numerals regardless of reference numerals, and redundant description thereof will be omitted. In addition, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of a related known technology may obscure the gist of the embodiment disclosed in this specification, the detailed description thereof will be omitted.

Terms including ordinal numbers, such as first and second, may be used to describe various components, but the components are not limited by the terms. These terms are only used for the purpose of distinguishing one component from another.

Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, each step described can be performed regardless of the listed order, except for the case where it must be performed in the listed order due to a special causal relationship.

In this application, terms such as "comprise" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Hereinafter, the wireless earphone of the present invention will be described with reference to the accompanying drawings.

As an embodiment of the present invention, wireless earphones will be described as an example of a sound output device.

Referring to FIG. 1 , an earphone according to an embodiment of the present invention is located in a housing 10 having an empty space in the middle and having an upper housing part 101 and a lower housing part 102, respectively. The bracket 20 having the main bracket part 201 and the sub bracket part 203, the waterproof plate 30 located between the main bracket part 201 and the sub bracket part 202, and the main bracket 201 The audio output unit 40 located, the temperature sensor module 50 located below the sub-bracket unit 202, the cover 60 located below the temperature sensor module 50, and the lower housing unit 102 An eartip 70 may be provided.

The posture of the earphone shown in FIG. 1 is the posture when the earphone is mounted in a charging case (not shown), and the ear tip and a part of the housing 10 are inserted into the charging groove formed in the charging case to charge the earphone. .

As already described, the housing 10 having an empty space therein may include an upper housing part 101 and a lower housing part 102 each having an empty space therein.

The upper housing portion 101 may have an empty space therein, have a substantially rectangular cross-sectional shape, and may have a shape in which all other surfaces except for the lower portion are blocked.

The lower housing part 102 may be positioned below the upper housing part 101 and coupled with the upper housing part 101 .

The lower housing part 102 has an open upper part and side surfaces are closed, so that the first part 1021 coupled to the upper housing part 101 is connected seamlessly with the side surface of the first part 1021 and extends downward. It may include a second part 1022 and a third part 1023 that is seamlessly connected to the side surface of the second part 1022 and extends downward.

All of the first part 1021 to the third part 1023 may have empty spaces therein, and these empty spaces may be connected to each other and conduct.

The first part 1021 and the second part 1022 adjacent to each other may be seamlessly connected, and the third part 1023 may be seamlessly connected to the second part 1022 .

The first part 1021 and the second part 1022 may each have a substantially rectangular cross-section with a central portion having an empty space. It may extend in an oblique direction.

The third portion 1023 connected to the second portion 1022 may be a portion into which the ear tip 70 is inserted and mounted.

An outer surface of the third portion 1023 may include a coupling groove for coupling the ear tip 70 .

An end of the third portion 1023 that is in contact with the outside may have an rim portion E1023 surrounding the inner space of the third portion 1023, and is surrounded by the rim portion E1023 and is surrounded by the outside and The adjacent hole may be a sound outlet H1023 that outputs sound to the outside.

In this case, as shown in FIG. 1 , the diameter of the second portion 1022 may be smaller than the diameter of the first portion 1021 .

A charging terminal 11 for charging the earphone and an operation button for controlling the operation of the earphone may be located on the lower surface of the first part 1021 that is not connected to the second part 1022 and is exposed to the outside. , At least one magnet may be positioned to accurately insert the earphone into the corresponding position of the charging case and the charging groove.

Therefore, the magnets mounted on these earphones react with the magnets mounted on the charging case and the charging recess so that they can be quickly and accurately positioned in the charging case.

At least one support (P1022) for coupling with the sub-bracket (202) may be provided on the inner surface of the second part (1022).

As shown in FIG. 5 , such a support (P1022) may be a protruding part that protrudes from the inner surface of the second portion 1022 toward the inner side, that is, toward the temperature sensor module 50.

When there are a plurality of supports P1022, the plurality of supports P1022 may be spaced apart from each other, and the corresponding second part 1022 between the two adjacent supports P1022 has a recessed part that is depressed outward from the inner surface ( D1022) may be located.

The support (P1022) may have a flat upper surface.

In the empty space formed by the first part 1021 of the upper housing part 101 and the lower housing part 102 coupled to each other, a battery for supplying power required for operation of the earphone and a control module 13 for battery charging operation The printed circuit board 131 on which the etc. are mounted may be located.

At this time, the printed circuit board 131 may be a flexible printed circuit board (FPCB), and as shown in FIG. 1, it extends in a planar direction along the lower surface of the flat first portion 1021. Then, it may be positioned in a form extending upward along the adjacent side surface of the first part 1021 and the adjacent side surface of the upper housing part 101 .

As already described, the bracket 20 may include a main bracket portion 201 and a sub bracket portion 202.

The main bracket part 201 may be located in the second part 1022 of the lower housing part 102 .

As shown in FIG. 2, the main bracket portion 201 has a lower surface 211 having an opening S211, a side surface 212 having a height of a predetermined size and surrounding the lower surface 211, and a lower surface A plurality of coupling protrusions 213 protruding downward from 211 may be provided. The upper part of the main bracket part 201 can be opened, and a component (eg, the sound output part 40) positioned on the main bracket part 201 can be easily seated.

Therefore, the inside of the main bracket part 201 may have an empty space S201 surrounded by the lower surface 211 and the side surface 212, and the sound output unit 40 is seated in the empty space S201 can be located.

The sub-bracket portion 202 coupled to the lower portion of the main bracket portion 201 may have the shape shown in FIG. 3 as an example.

As shown in FIG. 3, the sub-bracket portion 202 has a lower surface 221 having a central opening S221, a side surface 222 surrounding the lower surface 221, and a downward direction from the lower surface 221 A plurality of coupling protrusions 223 protruding may be provided. Like the upper bracket part 201, the upper part of this sub-bracket part 202 can also be opened.

At this time, the opening S221 located on the lower surface 221 overlaps with the opening S211 located on the lower surface 211 of the main bracket part 201, so that the two openings S211 and S221 may conduct each other. .

Therefore, the sound output from the sound output unit 40 located on the main bracket unit 201 passes through the opening S211 located on the lower surface 211 of the main bracket unit 201 and then enters the sub-bracket unit 202. Through the second part 1023 of the lower housing part 102 through the opening S221 located on the lower surface 221 of the outside, for example, into the user's ear.

As shown in FIG. 3, the mounting position of the lower surface 221 of the sub-bracket part 202 can be made at approximately the middle height of the side surface 222, and the side surface 222 is centered on the lower surface 221 It can protrude in an upward direction and a downward direction.

Accordingly, in the sub-bracket unit 202, an empty space S202 surrounded by the lower surface 221 and the side surface 222 may be located. Sound output from the sound output unit 40 may be output to the outside through the empty space S202 of the sub-bracket unit 202 .

The side surface 222 of the sub-bracket unit 202 of the present example may include a flat surface, the cutting portion F202, and a partially opened open portion H202.

Accordingly, the temperature sensor module 50 located below the sub-bracket portion 202 may extend upward through the cutting portion F202, which is a flat surface.

In addition, the open portion H202 of the sub-bracket portion 202 may be a passage for wires or the like.

When the main bracket part 201 and the sub-bracket part 202 are coupled to each other, the coupling protrusion 213 of the main bracket part 201 is inserted into the side surface 222 of the sub-bracket part 202 and the sub-bracket part (202) can be located on top of the lower surface (221).

The plurality of coupling protrusions 223 of the sub-bracket portion 202 may be positioned on the support P1022 of the lower housing portion 102 as shown in FIG. 5 .

Therefore, by the support (P1022) of the lower housing part 102, the sub-bracket part 202 does not move downward any more and the position is limited by the support (P1022) to stably attach to the sub-bracket part 202. can be located

As shown in FIG. 1, the waterproof plate 30 may be located in the inner space S202 of the sub-bracket unit 202.

The waterproof plate 30 can prevent the inflow of moisture or the like into the earphone from the outside.

Therefore, the coupling protrusion 213 of the main bracket portion 201 inserted into the side surface 222 of the sub-bracket portion 202 can be coupled to the upper surface of the waterproof plate 30, and the sub-bracket portion 202 The upper part of the lower surface 222 of may be coupled with the lower surface of the waterproof plate 30.

An adhesive member 90 such as double-sided tape or adhesive is attached or applied to the upper and lower surfaces of the waterproof plate 30, respectively, so that the coupling protrusion 213 of the main bracket part 201 and the sub-bracket part 202 Engagement with the lower surface 221 may be performed.

Since the waterproof plate 30 has a mesh structure, even if the waterproof plate 30 is positioned so that the sub-bracket portion 202 blocks the opening S221, the sound is transmitted from the sound output unit 40 to the waterproof plate 30 It can be stably output to the outside by passing through a plurality of holes located in .

As already described, the sound output unit 40 is mounted on the main bracket unit 201, receives a sound signal wirelessly transmitted from an electronic device that communicates wirelessly with the earphone, and outputs the corresponding sound.

Accordingly, the sound output unit 40 may include a receiver for receiving sound signals, an armature, a voice coil, a permanent magnet, and a diaphragm.

The temperature sensor module 50 positioned below the sub-bracket part 202 may also be attached to a corresponding position of the sub-bracket part 202 using an adhesive member 90 .

The temperature sensor module 50 may be, for example, a temperature sensor module using infrared rays, and as shown in FIGS. 4A and 4B, the temperature sensor 51 and the temperature sensor mounting substrate on which the temperature sensor 51 is mounted. (52) may be provided.

When the temperature sensor 51 is an infrared temperature sensor, an infrared receiver receives infrared rays reflected from the measurement object, and a signal processing unit measures the temperature using the infrared emissivity of the measurement object reflected through the infrared receiver and outputs a temperature detection signal. etc. can be provided.

The temperature sensor mounting substrate 52 on which the temperature sensor 51 is mounted may include a mounting portion 521 on which the temperature sensor 51 is mounted and a connection portion 522 connected to one edge of the mounting portion 521. there is.

As shown in FIGS. 4A and 4B , the mounting portion 521 may have a planar shape of various shapes, such as a substantially rectangular shape, and may include a recessed groove P521 recessed inward on at least a part of an edge (eg, an edge surface). can be provided.

In this example, two recessed grooves P521 are located at the edges facing each other on opposite sides, but, unlike this, may be additionally located at the other edge located on the opposite side of the edge to which the connection part 522 is connected.

In an alternative example, the mounting portion 521 may have a planar shape of various shapes, such as a circle, and in this case, a recessed groove P521 may be positioned at at least one of the edges of the mounting portion 521 .

By means of such at least one recessed groove P521, as shown in FIG. 6, a vent through which air passes between the inner surface of the second part 1022 of the lower housing part 102 and the corresponding edge where the recessed groove P521 is located. (H521) may be located.

Accordingly, sound output from the sound output unit 40 may pass through the ventilation hole H521 and be output in an outward direction. The recessed groove P521 may be a sound groove for passing sound, and the ventilation hole H521 may be a sound hole that is a hole through which sound passes.

In this example, the recessed groove P521 may be located facing the recessed part D1022 located on the second part 1022 and the opposite side as shown in FIG. 5 .

As such, the recessed groove P521 and the recessed part D1022 having recessed parts in opposite directions may be positioned to face each other. Therefore, compared to the case where the depressed portion D1022 does not exist or has a protruding portion protruding inward instead of the depressed portion D1022, the vent H521 of the present example is an empty space between the depressed portion P521 and the depressed portion D1022. ) may further increase, so that the amount of sound passing through the ventilation hole H521 may also increase.

However, in an alternative example, the depressed portion D1022 may be omitted, and in this case, the position of the inner surface of the corresponding second portion 1022 between the supports P1022 is the same regardless of the positional movement in the vertical direction. can do.

A coupling board 523 for coupling with the sub-bracket unit 202 may be provided on the top of the mounting portion 521, and an adhesive member 90 is positioned on a predetermined portion of the coupling board 523 to form a mounting portion 521. And the combination with the sub-bracket portion 202 can be made.

The connecting portion 522 may extend long in a predetermined direction as shown in FIGS. 4A and 4B.

In this example, at least a portion of the temperature sensor mounting substrate 52, particularly the connection portion 522, may be a flexible substrate such as a flexible printed circuit board (FPCB).

As described above, one side of the connection part 522 may be electrically and physically connected to one edge of the mounting part 521 .

In addition, as shown in FIG. 1 , the other side of the connection part 522 located on the opposite side of the one side may be electrically and physically connected to the connecting substrate 131 . Accordingly, a connector 5221 for connection with the printed circuit board 131 may be located on the other side of the connection part 522 .

Therefore, as shown in FIG. 1, by male-female coupling between the connector 5221 of the connection part 522 and the connector 1311 located on the printed circuit board 131, the temperature sensor mounting board 52 and the printed circuit board ( 131) may be connected to each other to perform input and output of electrical signals.

The connection part 522 connected to the mounting part 521 is bent upward at the cutting part F202 of the sub-bracket part 202, and then the inner surface of the housing 10 and the bracket adjacent to each other as shown in FIG. It may extend upward along the empty space between the outer surfaces of (20).

Then, the connection part 522 may extend in an oblique direction from the top of the sound output part 40 located on the bracket 20 along the top of the sound output part 40 . At this time, the audio output unit 40 and the connection unit 522 may be connected through a connector or the like.

Next, the connecting portion 522 is bent toward the printed circuit board 131 located on the inner lower surface of the second part 1022, and then along the plane direction parallel to the inner lower surface of the second part 1022 printed circuit board. It moves on the substrate 131 and can be electrically and physically connected to the printed circuit board 131 positioned below through the connector 5221 .

In this way, since the earphone of this example includes the temperature sensor module 50 where the temperature is measured, the body temperature of the user using the earphone can be measured.

For example, when the driving of the temperature sensor module 50 is started by a user's operation of a control button, the temperature sensor 51 receives infrared rays reflected from inside the user's ear to obtain a temperature corresponding to the body temperature inside the user's ear. A detection signal can be generated.

The temperature detection signal generated by the temperature sensor 51 is signal-processed by a signal processing unit provided in the temperature sensor module 50, and then the printed circuit board 131 through the connection unit 522 of the temperature sensor mounting board 52. ) and can be input to the control module 13, such as a control chip mounted on the printed circuit board 131.

Accordingly, the control module 13 may transmit the body temperature determined by the temperature monitoring signal or the temperature detection signal to an electronic device (eg, a smart phone) possessed by the user through the communication unit.

Due to this, the electronic device may process the transmitted signal to determine the body temperature, and output the determined body temperature or the body temperature transmitted from the earphone to an information display unit such as a liquid crystal display device.

In this way, the user can quickly and accurately measure his/her own body temperature whenever the user desires using the earphones in use without carrying a separate body temperature measuring device.

In addition, in the earphone of this example, the sound output unit 40 and the temperature sensor module 50 may be respectively mounted on the top and bottom along the vertical direction intersecting the plane direction, instead of being arranged side by side in the plane direction.

Due to the arrangement of the sound output unit 40 and the temperature sensor module 50 in the vertical direction, even if the temperature sensor module 50 is added, the size of the earphone, particularly in the width direction, does not or hardly increase. will not be

In addition, even if the temperature sensor module 50 is disposed to overlap with the sound output unit 40 under the audio output unit 40 that outputs sound, the sound output unit is provided by the recessed groove P521 formed in the temperature sensor module 50. The sound output from 40 can be stably output toward the user through the ventilation hole H521 formed by the recessed groove P521.

As shown in FIG. 1, the cover 60 may be positioned between the temperature sensor 51 and the third part 1023 of the lower housing part 102, and foreign substances such as moisture or dust input from the outside may be removed. It can be prevented from entering the earphone.

In this example, the cover 60 is positioned to be adhered between the lower end of the temperature sensor 51 and the inner surface of the edge portion E1023 of the third portion 1023 through the adhesive member 90, so that the third portion ( 1023) may be positioned to block the acoustic outlet H1023.

The cover 60 may have an infrared through-hole in the middle and may have a donut shape having a substantially circular planar shape.

Since the temperature sensor 51 of this example is a sensor that measures temperature using infrared rays as already described, the infrared through-hole may be positioned to face the infrared receiver of the temperature sensor 51 located at the top.

Accordingly, the infrared receiver may be exposed to the outside through the infrared penetration hole. Due to this, infrared rays output from the temperature sensor 51 and incident toward the earphone from the outside temperature subject, for example, the earphone user's side, can pass through the infrared penetration hole and be irradiated toward the earphone without any interference.

Due to this, the temperature (eg, body temperature) of the temperature measurement difference using the temperature sensor 51 may be normally sensed.

The ear tip 70 is inserted into the user's ear so that the third part 1023 of the earphone can be stably inserted into the user's ear without injury.

In this example, the adhesive members 90 for bonding or coupling different components to each other may have different shapes or application positions depending on positions.

The technical features disclosed in each embodiment of the present invention are not limited to the corresponding embodiment, and unless incompatible with each other, the technical features disclosed in each embodiment may be merged and applied to other embodiments.

Therefore, in each embodiment, each technical feature is mainly described, but each technical feature may be merged and applied to each other unless incompatible with each other.

The present invention is not limited to the above-described embodiments and accompanying drawings, and various modifications and variations will be possible from the viewpoint of those skilled in the art to which the present invention belongs. Therefore, the scope of the present invention should be defined by not only the claims of this specification but also those equivalent to these claims.

10: housing 101: upper housing portion
102: lower housing part 20: bracket
201: main bracket part 202: sub bracket part
30: waterproof plate 40: sound output unit
50: temperature sensor module 51: temperature sensor
52: temperature sensor mounting substrate 521: mounting part
522: connection part 60: cover
70: ear tip P1022: support
P1521: recessed groove, sound groove H1521: vent, sound hole
D1022: recessed part

Claims (11)

A housing having a space therein;
a sound output unit located within the space of the housing and outputting sound;
a temperature sensor mounting substrate positioned within the space of the housing and positioned below the sound output unit;
a temperature sensor positioned within the space of the housing and mounted on the temperature sensor mounting substrate; and
It is located in the space of the housing and includes a bracket having a main bracket portion in which the sound output unit is located and a sub-bracket portion located under the main bracket portion and coupled to the main bracket portion,
The temperature sensor is located to overlap the sound output unit located at the top,
The temperature sensor mounting board is located under the sub-bracket unit
sound output device. A housing having a space therein;
a sound output unit located within the space of the housing and outputting sound;
a temperature sensor mounting substrate positioned within the space of the housing and positioned below the sound output unit; and
A temperature sensor located in the space of the housing and mounted on the temperature sensor mounting substrate
including,
The temperature sensor is located to overlap the sound output unit located at the top,
The temperature sensor mounting board is located at an edge of the temperature sensor mounting board and includes at least one sound groove recessed toward the inside of the housing,
The sound of the sound output unit is output to the outside through at least one ventilation hole located between the sound grooves adjacent to each other and the inner surface of the housing.
sound output device. According to claim 2,
It is located in the space of the housing and further includes a bracket in which the sound output unit is located,
The temperature sensor mounting board is positioned under the bracket. According to claim 3,
The bracket is
a main bracket in which the sound output unit is located; and
A sub-bracket unit located below the main bracket unit and coupled to the main bracket unit
including,
The temperature sensor mounting board is located under the sub-bracket unit. According to claim 1 or 4,
The housing includes a support protruding toward the bracket from an inner surface,
The sub-bracket unit includes a plurality of coupling protrusions protruding toward the support from a lower end of the sub-bracket and positioned on an upper surface of the support. According to claim 1 or 4,
The sound output device further comprising a waterproof plate positioned between the main bracket part and the sub bracket part. According to claim 6,
The waterproof plate has a mesh structure having a plurality of holes. According to claim 2,
The temperature sensor mounting substrate,
a mounting part located under the sound output part and in which the temperature sensor is mounted; and
A connecting portion connected to the mounting portion and extending in one direction
including,
The at least one sound output device is located at an edge of the mounting portion. According to claim 8,
The audio output device of claim 1 , wherein the connecting portion is a flexible circuit board. According to claim 8,
The sound output device of claim 1 , wherein the connection part extends upward along a separation space between the housing and the sound output part. According to claim 2,
The audio output device of claim 1 , wherein the housing includes at least one recessed portion facing the at least one sound groove and recessed outward from an inner surface of the housing.

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