KR102507400B1 - Apparatus for diagnosing temperature measuring circuit - Google Patents

Abstract

A temperature measuring circuit diagnostic device according to the present invention includes a first resistance element having one end electrically connected to a voltage source, one end electrically connected to the other end of the first resistance element, and the other end electrically connected to ground, and resistance according to temperature. A temperature measuring circuit diagnostic device for diagnosing whether a temperature measuring circuit having a temperature measuring element whose value is changed is out of order, one end of which is electrically connected to the voltage source and one end of the first resistance element, and a resistance value according to temperature a changing diagnostic element; a first switch element disposed between the first resistance element and the temperature measurement element and electrically connecting one end of the temperature measurement element to another end of the first resistance element, the other end of the diagnosis element, and the ground; and controlling the first switch element so that one end of the temperature measuring element and the other end of the diagnostic element are electrically connected in response to input of a first diagnosis request signal requesting a diagnosis of whether the temperature measuring element is out of order, and a processor for diagnosing whether the temperature measuring element is out of order based on a first voltage applied to the temperature measuring element.

Description

Temperature measuring circuit diagnostic device {Apparatus for diagnosing temperature measuring circuit}

The present invention relates to a temperature measurement circuit diagnosis device, and more particularly, to a temperature measurement circuit diagnosis device for diagnosing whether a temperature measurement element included in a temperature measurement circuit for measuring temperature is out of order.

Recently, as demand for portable electronic products such as laptop computers, video cameras, and mobile phones has rapidly increased, and development of electric vehicles, batteries for energy storage, robots, and satellites has been in full swing, high-performance secondary batteries that can be repeatedly charged and discharged. Research on this is actively progressing.

Currently commercialized secondary batteries include nickel cadmium batteries, nickel hydrogen batteries, nickel zinc batteries, and lithium secondary batteries. It is in the limelight because of its very low self-discharge rate and high energy density.

On the other hand, these secondary batteries are sometimes used as a single secondary battery, but in many cases, a plurality of secondary batteries are connected in series and / or parallel to provide a high-voltage and / or large-capacity power storage device, It is used in the form of a battery pack including a battery management device that controls overall charging and discharging operations of internal secondary batteries.

A battery management device used in such a battery pack monitors the state of the battery using a temperature measuring circuit, a current measuring circuit, a voltage measuring circuit, etc., and estimates SOC and SOH using the monitoring result, or balances voltage between batteries. or to protect the battery from overcharge, overcurrent, high voltage, overcurrent, low temperature, high temperature, etc.

In particular, in monitoring the state of the battery, the temperature of the battery is essentially data used to estimate the SOC and SOH. Accordingly, when a failure occurs in the temperature measurement circuit for measuring the temperature of the battery or an error in the measured temperature value increases, the estimated SOC and SOH cannot be estimated using the battery temperature, or the estimated SOC and SOH There is a problem that the error rate increases.

In order to solve this problem, the conventional temperature measuring circuit diagnosis method periodically compares the temperature value measured from a separate temperature measuring device and the temperature measuring circuit, and compares the temperature value measured from the temperature measuring device with the temperature measuring circuit. If the temperature difference between the measured temperature values is out of a certain range, it is diagnosed that a failure has occurred in the temperature measuring circuit. Since the conventional temperature measurement method requires the use of a separate temperature measurement device, there is a problem in that failure of the temperature measurement circuit in the battery pack itself cannot be diagnosed. In addition, when a failure is diagnosed in the temperature measurement circuit, there is no method for repairing the failure of the temperature measurement circuit other than a method of replacing a part.

Accordingly, there is a demand for a method of self-diagnosing whether or not the temperature measuring circuit is faulty within the battery pack and repairing the temperature measuring circuit in addition to a method of replacing parts when a fault occurs in the temperature measuring circuit.

In the present invention, a processor controls a first switch element so that a diagnostic element is electrically connected to a temperature measuring element in place of a first resistance element of a temperature measuring circuit connected in series between a voltage source and a ground and a first resistance element among temperature measuring elements, An object of the present invention is to provide a temperature measuring circuit diagnosis device capable of diagnosing whether a temperature measuring device is out of order based on a first voltage applied to the temperature measuring device.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned above can be understood by the following description and will be more clearly understood by the examples of the present invention. It will also be readily apparent that the objects and advantages of the present invention may be realized by means of the instrumentalities and combinations indicated in the claims.

A temperature measuring circuit diagnostic device according to the present invention for solving the above technical problem is a first resistance element having one end electrically connected to a voltage source and one end electrically connected to the other end of the first resistance element, and the other end electrically connected to the ground. A temperature measuring circuit diagnostic device for diagnosing failure of a temperature measuring circuit having a temperature measuring element connected to and having a resistance value changing according to temperature, one end of which is electrically connected to the voltage source and one end of the first resistance element , a diagnostic element whose resistance value changes according to temperature; a first switch element disposed between the first resistance element and the temperature measurement element and electrically connecting one end of the temperature measurement element to another end of the first resistance element, the other end of the diagnosis element, and the ground; and controlling the first switch element so that one end of the temperature measuring element and the other end of the diagnostic element are electrically connected in response to input of a first diagnosis request signal requesting a diagnosis of whether the temperature measuring element is out of order, and a processor for diagnosing whether the temperature measuring element is out of order based on a first voltage applied to the temperature measuring element.

Preferably, when the first diagnosis request signal is input, the processor controls the first switch element so that one end of the temperature measuring element and the other end of the diagnostic element are electrically connected, and requests a temperature measurement to request temperature measurement. When a signal is input, the first switch element may be controlled so that one end of the temperature measuring element and the other end of the first resistance element are electrically connected.

Preferably, the processor determines whether the first voltage is included in the reference voltage range, and as a result of the determination, if the first voltage is not included in the reference voltage range, it may be diagnosed that a failure has occurred in the temperature measuring device. .

Preferably, the temperature measuring circuit diagnosis device includes a second resistance element having one end electrically connected to the other end of the diagnosis element; and a second switch element disposed between the diagnosis element and the second resistance element and electrically connecting one of one end of the second resistance element and the other end of the diagnosis element, the other end of the first resistance element, and the ground. may further include.

Preferably, the processor may control the second switch element so that one end of the second resistance element and the ground are electrically connected when the first diagnosis request signal is input.

Preferably, the processor controls the first switch element so that one end of the temperature measuring element is electrically connected to the ground when a failure is diagnosed in the temperature measuring element as a result of the diagnosis, and the second resistance element is electrically connected to the ground. The second switch element may be controlled so that one end of the and the other end of the diagnostic element are electrically connected.

Preferably, the processor may measure the temperature based on the second voltage applied to the diagnosis element when it is diagnosed that a failure has occurred in the temperature measurement element as a result of the diagnosis.

A battery pack according to the present invention may include the temperature measuring circuit diagnosis device.

A battery management device according to the present invention may include the temperature measuring circuit diagnosis device.

According to the present invention, the processor replaces the first resistance element of the temperature measuring element and the first resistance element of the temperature measuring circuit connected in series between the voltage source and the ground so that the diagnostic element is electrically connected to the temperature measuring element. By controlling the switch element and diagnosing whether the temperature measuring element is faulty based on the first voltage applied to the temperature measuring element, it is possible to easily diagnose whether the temperature measuring element is faulty without having a separate temperature measuring device.

The following drawings attached to this specification illustrate preferred embodiments of the present invention, and together with the detailed description of the present invention serve to further understand the technical idea of the present invention, the present invention is the details described in such drawings should not be construed as limited to
1 is a diagram showing the configuration of a temperature measuring circuit diagnosis device according to an embodiment of the present invention.
2 is a diagram schematically illustrating a connection configuration between a temperature measuring circuit diagnosis device and a temperature measuring circuit according to an embodiment of the present invention.
3 is a diagram illustrating an example in which a processor of a temperature measuring circuit diagnosis apparatus controls an operating state of a first switch element to diagnose a temperature measuring element of a temperature measuring circuit according to an embodiment of the present invention.
FIG. 4 is a diagram illustrating an example of controlling an operating state of a first switch element when a processor of a temperature measuring circuit diagnosis apparatus diagnoses that a failure has occurred in a temperature measuring circuit according to an embodiment of the present invention.
5 is a diagram showing the configuration of a temperature measuring circuit diagnosis device according to another embodiment of the present invention.
6 is a diagram schematically illustrating a connection configuration between a temperature measuring circuit diagnostic device and a temperature measuring circuit according to another embodiment of the present invention.
7 illustrates an example in which a processor of a temperature measuring circuit diagnosis apparatus controls operating states of a first switch element and a second switch element to diagnose a temperature measuring element of a temperature measuring circuit according to another embodiment of the present invention. it is a drawing
8 illustrates an example of controlling operating states of a first switch element and a second switch element when a failure occurs in a temperature measuring circuit diagnosis by a processor of a temperature measuring circuit diagnosis apparatus according to another embodiment of the present invention. it is a drawing

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to the usual or dictionary meaning, and the inventor appropriately uses the concept of the term in order to explain his/her invention in the best way. It should be interpreted as a meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

Therefore, since the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention, various alternatives may be used at the time of this application. It should be understood that there may be equivalents and variations.

In addition, in the description of the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

Terms including ordinal numbers, such as first and second, are used for the purpose of distinguishing one of the various elements from the rest, and are not used to limit the elements by such terms.

Throughout the specification, when a part "includes" a certain component, it means that it may further include other components, not excluding other components unless otherwise stated. In addition, a term such as <control unit> described in the specification means a unit that processes at least one function or operation, which may be implemented as hardware or software, or a combination of hardware and software.

In addition, throughout the specification, when a part is said to be “connected” to another part, this is not only the case where it is “directly connected”, but also the case where it is “indirectly connected” with another element in the middle. include

1 is a diagram showing the configuration of a temperature measurement circuit diagnosis device 100 according to an embodiment of the present invention, and FIG. 2 is a diagram showing a temperature measurement circuit diagnosis device 100 according to an embodiment of the present invention and a temperature measurement circuit It is a diagram schematically showing the connection configuration.

First, referring to FIGS. 1 and 2 , the apparatus 100 for diagnosing a temperature measuring circuit according to an embodiment of the present invention may diagnose whether a temperature measuring circuit for measuring a temperature inside a battery pack is out of order.

To this end, the temperature measurement circuit diagnosis device 100 according to an embodiment of the present invention may be included in a battery pack having a temperature measurement circuit or may be included in a battery management system (BMS) included in the battery pack.

The temperature measuring circuit may include a first resistance element R1 and a temperature measuring element Rth1.

More specifically, as shown in FIG. 2 , one end of the first resistance element R1 may be electrically connected to the voltage source Vi. Here, the voltage source Vi may output a voltage of a preset voltage value to the temperature measuring circuit.

In one embodiment, the first resistance element R1 may be a resistance element whose resistance value is predetermined as the first resistance value.

The temperature measuring element Rth1 may have one end electrically connected to the other end of the first resistance element R1 and the other end electrically connected to the ground GND. In one embodiment, the temperature measuring element Rth1 may be a thermistor element whose resistance value changes according to temperature.

In other words, the first resistance element R1 and the temperature measuring element Rth1 may be connected in series between the voltage source Vi and the ground GND.

Meanwhile, there is no particular limitation on the type of the battery pack as long as it can be repeatedly charged and discharged. As an example, the battery pack may include a plurality of lithium polymer battery cells made of a pouch type.

Also, the battery pack may include a plurality of battery cells electrically connected in series and/or parallel. Of course, the case where the battery pack includes only one unit cell is also included in the scope of the present invention.

Also, the battery pack may be electrically coupled to various loads. For example, the load may be a traveling device (eg, an electric vehicle or a hybrid vehicle) driven using electric power, an unmanned aerial vehicle such as a drone, or a mobile device.

The apparatus 100 for diagnosing a temperature measuring circuit according to an embodiment of the present invention includes a diagnosis element Rth2, a first switch element SW1, a sensing unit 110, a memory unit 120, a processor 130, and a notification unit. (140).

One end of the diagnostic element Rth2 may be electrically connected to the voltage source Vi and one end of the first resistance element R1. That is, as shown in FIG. 2 , one end of the diagnostic element Rth2 and one end of the first resistance element R1 may be electrically connected to the voltage source Vi.

In one embodiment, the diagnosis element Rth2 may be a thermistor element whose resistance value changes according to temperature. Preferably, the diagnostic element Rth2 may be a thermistor element having the same resistance value according to temperature as that of the temperature measuring element Rth1.

The first switch element (SW1) is located between the first resistance element (R1) and the temperature measuring element (Rth1), one end of the temperature measuring element (Rth1) and the other end of the first resistance element (R1), the diagnostic element ( Any one of the other end of Rth2) and the ground (GND) may be electrically connected.

More specifically, the first switch element (SW1) is "a" contact electrically connected to one end of the temperature measuring element (Rth1), "b" contact electrically connected to the other end of the first resistance element (R1), the diagnosis A “c” contact electrically connected to the other end of the element Rth2 and a “d” contact electrically connected to the ground GND may be provided.

The first switch element (SW1) is in an operating state such that any one of the "a" contact, the "b" contact, the "c" contact", and the "d" contact is electrically connected in response to the control signal of the processor 130. may change.

The sensing unit 110 may provide a measurement signal indicating the first voltage applied to the temperature measuring element Rth1 to the processor 130 at predetermined intervals.

To this end, the sensing unit 110 may include a voltage sensor configured to measure the first voltage. In one embodiment, the sensing unit 110 may measure a voltage applied between the other end of the first resistance element R1 and one end L1 of the temperature measuring element Rth1 as the first voltage.

When the measurement signal is received from the sensing unit 110 , the processor 130 may determine a digital value of the first voltage through signal processing and store it in the memory unit 120 .

The memory unit 120 is a semiconductor memory device, and stores a plurality of program codes prepared to write, erase, and update data generated by the processor 130 and to limit the discharge current of the battery B. In addition, the memory unit 120 may store preset values of various predetermined parameters used in the implementation of the present invention.

The type of the memory unit 120 is not particularly limited as long as it is a known semiconductor memory device capable of writing, erasing, and updating data. As an example, the memory unit 120 may be DRAM, SDRAM, flash memory, ROM, EEPROM, registers, and the like. The memory unit 120 may further include a storage medium storing program codes defining the control logic of the processor 130 . The storage medium includes an inactive storage device such as a flash memory or a hard disk. The memory unit 120 may be physically separated from the processor 130 or integrally integrated with the processor 130 .

Hereinafter, a process of measuring a temperature using a temperature measuring circuit according to an embodiment of the present invention will be described.

The processor 130 may electrically connect one end of the temperature measurement element Rth1 and the other end of the first resistance element R1 to the first switch element ( SW1) can be controlled.

Here, the temperature measurement request signal may be a signal input to the processor 130 from a battery management system (BMS) or a vehicle control device included in the vehicle. That is, the temperature measurement request signal is input to the processor 130 to acquire the temperature of the battery pack used by the battery management system (BMS) or vehicle control device to control charging and discharging of the battery pack and manage the battery pack. could be a signal

When a temperature measurement request signal is input, the processor 130 may control the first switch element SW1 so that one end of the temperature measurement element Rth1 and the other end of the first resistance element R1 are electrically connected. .

In other words, when the temperature measurement request signal is input, the processor 130, as shown in FIG. 2 , electrically connects the “a” contact and the “b” contact of the first switch element SW1 to the first switch. The operating state of the element SW1 can be controlled.

Thereafter, the processor 130 calculates the voltage value of the first voltage applied to the temperature measuring element Rth1, the preset voltage value of the voltage output from the voltage source Vi, and the preset first voltage value of the first resistance element R1. A resistance value of the temperature measuring element Rth1 according to the current temperature may be calculated using the resistance value.

In this case, the processor 130 may calculate the resistance value of the temperature measuring element Rth1 according to the current temperature through Ohm's law.

Thereafter, the processor 130 may measure the temperature based on temperature-resistance value mapping data in which the resistance value of the temperature measuring element Rth1 is mapped according to the temperature. More specifically, the processor 130 may read a temperature corresponding to the resistance value of the temperature measuring element Rth1 calculated from the temperature-resistance value mapping data, and determine the read temperature as the current temperature.

Hereinafter, a process of diagnosing whether a temperature measuring circuit is out of order according to an embodiment of the present invention will be described.

FIG. 3 shows the operating state of the first switch element SW1 in order for the processor 130 of the apparatus 100 for diagnosing the temperature measuring circuit according to an embodiment of the present invention to diagnose the temperature measuring element Rth1 of the temperature measuring circuit. It is a drawing showing an example of controlling.

Referring to FIG. 3 , the processor 130 connects one end of the temperature measuring element Rth1 and the diagnostic element in response to input of a first diagnosis request signal requesting a diagnosis of whether or not the temperature measuring element Rth1 has failed. The first switch element SW1 may be controlled so that the other end of Rth2 is electrically connected.

Here, the first diagnosis request signal may be a signal input to the processor 130 from a battery management system (BMS) or a vehicle control device included in the vehicle.

When the first diagnosis request signal is input, the processor 130 may control the first switch element SW1 so that one end of the temperature measurement element Rth1 and the other end of the diagnosis element Rth2 are electrically connected. .

In other words, when the first diagnosis request signal is input, the processor 130 determines the operating state of the first switch element SW1 such that the "a" contact and the "c" contact of the first switch element SW1 are electrically connected. can control.

Thereafter, the processor 130 may diagnose whether the temperature measuring element Rth1 is out of order based on the first voltage applied to the temperature measuring element Rth1.

More specifically, the processor 130 determines whether the first voltage applied to the temperature measuring element Rth1 is included in the reference voltage range, and if the first voltage is not included in the reference voltage range, the temperature is measured. It can be diagnosed that a failure has occurred in the element Rth1.

Here, failure of the temperature measuring element Rth1 may mean a case in which a resistance value of the temperature measuring element Rth1 that changes according to temperature is different from a resistance value according to the above-described temperature-resistance value mapping data.

Meanwhile, when the first switch element SW1 is controlled such that one end of the temperature measuring element Rth1 and the other end of the diagnostic element Rth2 are electrically connected, a temperature measuring element is connected between the voltage source Vi and the ground GND. (Rth1) and the diagnostic element (Rth2) may be connected in series. At this time, as described above, since the temperature measurement element Rth1 and the diagnosis element Rth2 are thermistor elements having the same resistance value according to temperature, each of the temperature measurement element Rth1 and the diagnosis element Rth2 outputs an output from the voltage source Vi. voltage can be equally distributed.

Using this, the processor 130 may set the reference voltage range using the voltage value of the voltage output from the voltage source Vi. More specifically, the processor 130 may set the reference voltage range based on half the voltage value of the voltage output from the voltage source Vi.

At this time, the processor 130 may set the reference voltage range using Equation 1 below.

<Equation 1>

Here, Vref is a reference voltage range, and Vi is a voltage value of a voltage output from a voltage source.

According to the configuration of the present invention, the temperature measuring element (Rth1) of the temperature measuring circuit without the need to diagnose whether the temperature measuring circuit is faulty by comparing the temperature measured from the temperature measuring circuit with the temperature measured from the separate temperature measuring device By simply controlling only the first switch element SW1 so that it is electrically connected to the diagnosis element Rth2, it is possible to diagnose whether the temperature measuring element is out of order.

4 is a diagram for controlling the operating state of the first switch element SW1 when the processor 130 of the apparatus 100 for diagnosing the temperature measuring circuit according to an embodiment of the present invention diagnoses that a failure has occurred in the temperature measuring circuit. It is a drawing showing an example.

Referring further to FIG. 4 , when the processor 130 diagnoses that a failure has occurred in the temperature measuring element Rth1 of the temperature measuring circuit, the processor 130 electrically connects one end of the temperature measuring element Rth1 to the ground GND. The first switch element SW1 may be controlled.

In other words, when the processor 130 diagnoses that a failure has occurred in the temperature measuring element Rth1 of the temperature measuring circuit, the processor 130 controls the "a" contact and the "d" contact of the first switch element SW1 to be electrically connected. 1 The operating state of the switch element (SW1) can be controlled.

Accordingly, as shown in FIG. 4 , the circuit connected to the temperature measuring element Rth1 in which the failure occurs forms a closed circuit, so that the voltage output from the voltage source Vi may not be applied.

Through this, it is possible to prevent the voltage output from the voltage source Vi from being applied to the temperature measuring element Rth1 where the failure occurs, thereby preventing the temperature measuring element Rth1 from being intensified.

Meanwhile, the processor 130 may selectively include an application-specific integrated circuit (ASIC) known in the art, other chipsets, logic circuits, registers, communication modems, data processing devices, etc., to execute various control logics. there is. At least one or more of the various control logics that can be executed by the processor 130 are combined, and the combined control logics may be written in a computer readable code system and recorded in a computer readable recording medium. The type of the recording medium is not particularly limited as long as it can be accessed by the processor 130 included in the computer. As an example, the recording medium includes at least one selected from the group including ROM, RAM, register, CD-ROM, magnetic tape, hard disk, floppy disk, and optical data recording device. In addition, the code system may be modulated into a carrier signal and included in a communication carrier at a specific time, and may be distributed and stored and executed in computers connected to a network. In addition, functional programs, code and code segments for implementing the combined control logics can be readily inferred by programmers skilled in the art to which the present invention pertains.

The notification unit 140 may receive a diagnosis result of whether the temperature measuring element Rth1 is out of order from the processor 130 and output the result to the outside. More specifically, the notification unit 140 includes at least one of a display unit displaying the diagnosis result of whether the temperature measuring element Rth1 is out of order using one or more of symbols, numbers, and codes, and a speaker device outputting sound. can be provided

Meanwhile, the battery management device according to the present invention may include the above-described temperature measuring circuit diagnosis device. Through this, it is possible to diagnose whether or not the temperature measuring circuit included in the battery management device is out of order.

Meanwhile, the battery pack according to the present invention may include the above-described temperature measuring circuit diagnosis device. Through this, it is possible to diagnose whether or not the temperature measurement circuit included in the battery pack is out of order.

Hereinafter, an apparatus 100' for diagnosing a temperature measuring circuit according to another embodiment of the present invention will be described.

5 is a diagram showing the configuration of a temperature measurement circuit diagnosis device 100' according to another embodiment of the present invention, and FIG. 6 is a temperature measurement circuit diagnosis device 100' according to another embodiment of the present invention and temperature measurement It is a diagram schematically showing the connection configuration between circuits.

First, referring to FIGS. 5 and 6 , a temperature measuring circuit diagnosis apparatus 100' according to another embodiment of the present invention includes a second resistor element R2, a second switch element SW2', and a diagnosis element Rth2. '), a first switch element SW1', a sensing unit 110', a memory unit 120', a processor 130', and a notification unit 140'.

Compared to the temperature measurement circuit diagnosis device 100 according to another embodiment of the present invention, some components are added to the temperature measurement circuit diagnosis device 100' according to another embodiment of the present invention, and the role of some components is different. Since it has only been added, repeated descriptions will be omitted.

The second resistance element R2 may have one end electrically connected to the other end of the diagnosis element Rth2' and the other end electrically connected to the ground (GND).

In another embodiment, the second resistance element R2 may be a resistance element having the same resistance value as the first resistance value of the first resistance element R1 included in the temperature measuring circuit.

The second switch element (SW2) is located between the diagnosis element (Rth2') and the second resistance element (R2), one end of the second resistance element (R2) and the other end of the diagnosis element (Rth2'), Any one of the other end of the first resistance element R1 and the ground GND may be electrically connected.

More specifically, the second switch element (SW2) is an "e" contact electrically connected to one end of the second resistance element (R2), an "f" contact electrically connected to the other end of the diagnostic element (Rth2'), A “g” contact electrically connected to the other end of the first resistance element R1 and “h” electrically connected to the ground GND may be provided.

The second switch element SW2 is in an operating state such that any one of the "e" contact, the "f" contact, the "g" contact", and the "h" contact is electrically connected in response to the control signal of the processor 130. may change.

To this end, the "h" contact of the second switch element SW2 may be electrically connected to the first node N1 between the first resistor R1 and the first switch element SW1'.

Also, the "c" contact of the first switch element SW1' may be electrically connected to the second node N2 between the diagnosis element Rth2' and the second switch element SW2.

The sensing unit 110' transmits a measurement signal representing the first voltage applied to the temperature measuring element Rth1' and the second voltage applied to the diagnostic element Rth2' to the processor 130' at predetermined intervals. can be provided with

To this end, the sensing unit 110' may include a voltage sensor configured to measure the first voltage and the second voltage. In another embodiment, the sensing unit 110 ′ may measure a voltage applied between the other end of the first resistance element R1 and one end L1 of the temperature measuring element Rth1 as the first voltage. Also, the sensing unit 110 ′ may measure a voltage applied between the second switch element SW2 and the second resistance element R2 (L2) as the second voltage.

When the measurement signal is received from the sensing unit 110', the processor 130' may determine digital values of the first voltage and the second voltage through signal processing and store them in the memory unit 120'.

Hereinafter, a process of measuring a temperature using a temperature measuring circuit according to another embodiment of the present invention will be described.

The processor 130' controls the first switch element to electrically connect one end of the temperature measurement element Rth1 and the other end of the first resistance element R1 in response to input of a temperature measurement request signal requesting temperature measurement. (SW1') can be controlled.

Also, the processor 130' controls the second switch element SW2 so that one end of the second resistor element R2 and the ground GND are electrically connected in response to whether a temperature measurement request signal is input. can

More specifically, when the temperature measurement request signal is input, the processor 130' electrically connects one end of the temperature measurement element Rth1 and the other end of the first resistance element R1 to the first switch element SW1'. ) can be controlled.

In other words, when the temperature measurement request signal is input, the processor 130' controls the "a" contact and the "b" contact of the first switch element SW1' to be electrically connected, as shown in FIG. 1 It is possible to control the operating state of the switch element (SW1').

Also, when a temperature measurement request signal is input, the processor 130' can control the second switch element SW2 so that one end of the second resistor element R2 and the ground GND are electrically connected. .

In other words, the processor 130' can control the operating state of the second switch element SW2 so that the "e" contact and the "g" contact of the second switch element SW2 are electrically connected.

Accordingly, the circuit connected to the second resistance element R2 forms a closed circuit, so that the voltage output from the voltage source Vi may not be applied.

Thereafter, the processor 130' determines the voltage value of the first voltage applied to the temperature measuring element Rth1, the preset voltage value of the voltage output from the voltage source Vi, and the preset voltage value of the first resistance element R1. 1 The resistance value of the temperature measuring element Rth1 according to the current temperature may be calculated using the resistance value.

At this time, the processor 130' may calculate the resistance value of the temperature measuring element Rth1 according to the current temperature through Ohm's law.

Thereafter, the processor 130' may measure the temperature based on temperature-resistance value mapping data in which the resistance value of the temperature measuring element Rth1 is mapped according to the temperature. More specifically, the processor 130' may read a temperature corresponding to the resistance value of the temperature measuring element Rth1 calculated from the temperature-resistance value mapping data, and determine the read temperature as the current temperature.

Hereinafter, a process of diagnosing whether a temperature measuring circuit is out of order according to another embodiment of the present invention will be described.

7 is a diagram of the first switch element SW1' and the processor 130' of the temperature measuring circuit diagnosis device 100' according to another embodiment of the present invention to diagnose the temperature measuring element Rth1 of the temperature measuring circuit. It is a diagram showing an example of controlling the operating state of the second switch element SW2.

Referring further to FIG. 7 , the processor 130' connects one end of the temperature measuring element Rth1 and the diagnosis in response to input of a first diagnosis request signal requesting a diagnosis of whether or not the temperature measuring element Rth1 is out of order. The first switch element SW1' may be controlled so that the other end of the element Rth2 is electrically connected.

At this time, the processor 130' may control the second switch element SW2 to maintain a state in which one end of the second resistance element R2 and the ground GND are electrically connected.

When the first diagnosis request signal is input, the processor 130' controls the first switch element SW1' so that one end of the temperature measurement element Rth1 and the other end of the diagnosis element Rth2 are electrically connected. can

In other words, when the first diagnosis request signal is input, the processor 130' operates the first switch element SW1' so that the "a" contact and the "c" contact of the first switch element SW1' are electrically connected. operation status can be controlled.

Thereafter, the processor 130' may diagnose whether the temperature measuring element Rth1 is out of order based on the first voltage applied to the temperature measuring element Rth1.

More specifically, the processor 130' determines whether the first voltage applied to the temperature measuring element Rth1 is included in the reference voltage range, and if the first voltage is not included in the reference voltage range, the temperature measurement element Rth1 is included in the reference voltage range. It can be diagnosed that a failure has occurred in the measurement element Rth1.

Hereinafter, when it is diagnosed that a failure has occurred in the temperature measuring element Rth1, the temperature measuring element Rth2' and the second resistive element R2 are used instead of the temperature measuring element Rth1 and the first resistance element R1. Describe the process of measuring .

8 illustrates the first switch element SW1' and the second switch when a failure occurs in the diagnosis of the temperature measuring circuit by the processor 130' of the apparatus 100' for diagnosing the temperature measuring circuit according to another embodiment of the present invention. It is a diagram showing an example of controlling the operating state of the element SW2.

Referring further to FIG. 8 , when the processor 130' diagnoses that a failure has occurred in the temperature measuring element Rth1 of the temperature measuring circuit, the processor 130' electrically connects one end of the temperature measuring element Rth1 to the ground (GND). The first switch element (SW1') may be controlled, and the second switch element (SW2) may be controlled so that one end of the second resistance element (R2) and the other end of the diagnostic element (Rth2') are electrically connected. there is.

In other words, when the processor 130' diagnoses that a failure has occurred in the temperature measuring element Rth1 of the temperature measuring circuit, the "a" contact and the "d" contact of the first switch element SW1' are electrically connected. The operating state of the first switch element (SW1') is controlled as much as possible, and the operating state of the second switch element (SW2) is controlled so that the "e" contact and the "f" contact of the second switch element (SW2) are electrically connected. do,

Accordingly, as shown in FIG. 8 , the voltage output from the voltage source Vi may not be applied by forming a closed circuit in the circuit connected to the temperature measuring element Rth1 in which the failure occurs.

Thereafter, the processor 130' determines the voltage value of the second voltage applied to the diagnostic element Rth2', the preset voltage value of the voltage output from the voltage source Vi, and the preset voltage value of the second resistance element R2. A resistance value of the diagnosis element Rth2′ according to a current temperature may be calculated using the first resistance value.

At this time, the processor 130' may calculate the resistance value of the diagnosis element Rth2' according to the current temperature through Ohm's law.

Thereafter, the processor 130' may measure the temperature based on temperature-resistance value mapping data in which the resistance value of the diagnosis element Rth2' is mapped according to the temperature. More specifically, the processor 130' may read the temperature corresponding to the resistance value of the diagnostic element Rth2' calculated from the temperature-resistance value mapping data, and determine the read temperature as the current temperature.

According to the configuration of the present invention, when a failure occurs in the temperature measuring element Rth1 for measuring the temperature, the thermistor element is the same as the temperature measuring element Rth1 and is a diagnosis for diagnosing whether or not the temperature measuring element Rth1 is out of order. By measuring the temperature using the element Rth2, the temperature can be continuously measured even if the temperature measuring element Rth1 fails.

The notification unit 140' may receive the temperature measured by the processor 130' using the diagnosis element Rth2' and output it to the outside. More specifically, the notification unit 140' includes at least one of a display unit that displays the temperature measured using the diagnosis element Rth2' using one or more of symbols, numbers, and codes, and a speaker device that outputs sound. can be provided.

The embodiments of the present invention described above are not implemented only through devices and methods, and may be implemented through a program that realizes functions corresponding to the configuration of the embodiments of the present invention or a recording medium on which the program is recorded. Implementation can be easily implemented by an expert in the technical field to which the present invention belongs based on the description of the above-described embodiment.

Although the present invention has been described above with limited examples and drawings, the present invention is not limited thereto and will be described below and the technical spirit of the present invention by those skilled in the art to which the present invention belongs. Of course, various modifications and variations are possible within the scope of the claims.

In addition, since the present invention described above can be variously substituted, modified, and changed without departing from the technical spirit of the present invention to those skilled in the art, the above-described embodiments and attachments It is not limited by the drawings, but all or part of each embodiment can be configured by selectively combining them so that various modifications can be made.

Rth1: temperature measuring element
R1: first resistance element
100: temperature measuring circuit diagnostic device
Rth2: diagnostic element
SW1: first switch element
110: sensing unit
120: memory unit
130: processor
140: notification unit
SW2: second switch element
R2: second resistance element

Claims (9)

A temperature measuring circuit diagnostic device for diagnosing failure of a temperature measuring circuit having a first resistance element having one end electrically connected to a voltage source and a temperature measuring element having a resistance value varying according to temperature and having the other end electrically connected to the ground. in
a diagnostic element having one end electrically connected between the voltage source and one end of the first resistance element and having a resistance value changed according to temperature;
It is located between the other end of the first resistance element and one end of the temperature measuring element, and electrically connects one end of the temperature measuring element and the other end of the first resistance element, the other end of the diagnostic element, or the ground according to a controlled operating state. A first switch element to connect;
a second resistance element electrically connected to ground at the other end;
a second switch element positioned between the other end of the diagnostic element and one end of the second resistance element and electrically connecting one end of the second resistance element and the other end of the diagnosis element or the ground according to a controlled operating state; and
Controls the operating state of the first switch element so that one end of the temperature measuring element and the other end of the diagnostic element are electrically connected in response to input of the first diagnosis request signal requesting a diagnosis of whether the temperature measuring element is out of order or not. and a processor diagnosing whether the temperature measuring element is out of order based on a first voltage applied to the temperature measuring element,
the processor,
When it is diagnosed that a failure has occurred in the temperature measuring element, an operating state of the first switch element is controlled so that one end of the temperature measuring element and the ground are electrically connected, and one end of the second resistance element is connected to the diagnostic element. Controlling the operating state of the second switch element so that the other end is electrically connected, and measuring the temperature based on the second voltage applied between one end of the second resistance element and the second switch element Characterized in that Temperature measuring circuit diagnostic device.
According to claim 1,
The processor
When the first diagnosis request signal is input, the first switch element is controlled so that one end of the temperature measurement element and the other end of the diagnosis element are electrically connected, and a temperature measurement request signal requesting temperature measurement is input. A temperature measuring circuit diagnostic device controlling the first switch element so that one end of the temperature measuring element and the other end of the first resistance element are electrically connected.
According to claim 1,
The processor
The temperature measurement circuit diagnosis apparatus for determining whether the first voltage is included in a reference voltage range and diagnosing that a failure has occurred in the temperature measuring device if the first voltage is not included in the reference voltage range as a result of the determination.
delete According to claim 1,
The processor
and controlling the second switch element so that one end of the second resistance element and the ground are electrically connected when the first diagnosis request signal is input.
delete delete A battery management device comprising the temperature measuring circuit diagnosis device according to any one of claims 1 to 3 and 5.
A battery pack comprising the temperature measuring circuit diagnosis device according to any one of claims 1 to 3 and 5.

Images