KR102499870B1 - Flexible grinding pad with an electroplated diamond tip - Google Patents

Abstract

The present invention relates to a flexible electrodeposited diamond polishing pad capable of firmly attaching a diamond polishing tip by a simple coupling structure and at the same time maintaining the flexibility of the polishing pad itself, and is detachable from the holder 11 of the grinder 10. In the flexible polishing pad to; A ring-shaped or disk-shaped mesh network 21 made of metal; a thermoplastic resin layer 22 coupled to the rear surface of the mesh network 21 in a heat-sealed state; a masking layer 23 applied to form a conductive pattern region 26 of a certain shape on the upper surface of the mesh network 21; An electrodeposited diamond layer 24 including diamond particles 25 is electrodeposited in the conductive pattern region 26, and the resin layer 22 and the masking layer 23 are heat-sealed to form the mesh network ( 21) is impregnated between the mesh from the back and top surfaces and mutually fused.

Description

Flexible electrodeposited diamond polishing pad {Flexible grinding pad with an electroplated diamond tip}

The present invention relates to a flexible electrodeposited diamond polishing pad, and more particularly, to a flexible electrodeposited diamond polishing pad capable of firmly attaching an electrodeposited diamond layer by a simple coupling structure and at the same time maintaining the flexibility of the polishing pad itself.

In general, the polishing pad is in the form of a flat disc, unlike a conventional cup wheel in which the central part is concavely recessed, and is usually provided with an electrodeposited diamond polishing layer such as diamond particles to polish the surface of the object to be polished, It can be replaced according to the degree of wear during use.

These abrasive pads are made of various types of diamond abrasive layers depending on the purpose of roughing to roughen the surface or polishing to refine or polish the surface in accordance with working conditions. This abrasive layer is a mixture of resin and diamond particles. A resin tip integrally molded on a pad made of resin, a metal tip mixed with metal powder and diamond particles and sintered integrally or separately on a metal mesh, and a diamond on the pad with a certain pattern of the mask layer. Particles are electrodeposited and plated. In the resin tip or metal tip, diamond particles are distributed in a resin tip or metal tip having a certain volume, and when a polishing pad is used, the resin tip or metal tip is gradually worn away, and the diamond particles are continuously exposed to the tip surface, so that the polishing action can be performed for a long time. However, since the electrodeposited diamond layer is composed of a single layer, once it is removed, the life of the polishing pad is exhausted and the service life is relatively short.

Here, the conventional method of electrodepositing diamond particles on a pad is to electrodeposit diamond particles on a pad made of non-conductive resin material while temporarily attaching a steel plate on the back surface of the pad, or Conductive coating is directly applied on the pad made of, thereby electrodepositing diamond particles.

However, since the pad itself is made of a resin material, such a conventional polishing pad has a structural weakness in attaching diamond particles by resin, and also has a disadvantage in that the adhesion of the particles is weak due to this, and also has a disadvantage in that the diamond particles are attached by the resin. In the process of removing the temporarily attached steel plate after electrodepositing diamond particles with the steel plate temporarily attached on the top, not only is it difficult to separate the steel plate from the pad on which the diamond particles are electrodeposited, but in the process of removing the steel plate, the pad There is a high risk of damage to the

On the other hand, in some cases, as an alternative to the above problems, diamond particles are electrodeposited on the steel plate and then molded to cover the steel plate or support the back surface with resin, but in this case, the corner of the object to be polished can be easily polished. Although the pad itself can be flexibly deformed to do so, there is a limit to elastically restoring the shape of the pad after polishing, which causes inconvenience in use.

Korea Utility Model Publication No. 20-2009-0001978 (2009. 03. 04)

The present invention is intended to solve the above-mentioned problems. The present invention increases the lifespan and polishing effect of the device by firmly attaching the electrodeposited diamond layer by a simple bonding structure, and at the same time maintains the flexibility of the polishing pad itself to polish the object to be polished. It is to provide a flexible electrodeposited diamond polishing pad that can be easily contacted and restored to its shape to provide convenience in polishing work.

According to the features of the present invention, in the flexible polishing pad to be detachable on the holder 11 of the grinder 10;

A ring-shaped or disk-shaped mesh network 21 made of metal;

a thermoplastic soft resin layer 22 coupled to the rear surface of the mesh network 21 in a heat-sealed state;

a masking layer 23 coated to form a conductive pattern region 26 of a certain shape on the upper surface of the mesh network 21 and heat-sealable with the resin layer 22;

an electrodeposited diamond layer 24 electrodeposited and plated with diamond particles 25 in the conductive pattern region 26;

The resin layer 22 and the masking layer 23 are impregnated between the mesh nets from the back and top surfaces of the mesh net 21 through thermal fusion, and are fused to each other. A flexible electrodeposited diamond polishing pad is provided.

According to another feature of the present invention, a primer layer 27 is applied to the lower surface of the mesh network 21 to reinforce the adhesion between the mesh network 21 and the resin layer 22. Flexible electrodeposited diamond polishing pad is provided.

According to another feature of the present invention, there is provided a flexible electrodeposited diamond polishing pad, characterized in that the bottom surface of the resin layer 22 is coupled with a back surface attachment cloth 28 including a cotton cloth.

As described above, according to the present invention, as the diamond particles 25 are electrodeposited on the mesh 21, such as a wire mesh, the diamond particles 25 are electrodeposited on the mesh 21 to increase the adhesion and at the same time to make it soft. Since the resin layer 22 and the masking layer 23 are impregnated between the meshes on the back and top of the mesh 21 and fused to each other, the mesh between the integrally fused resin layer 22 and the masking layer 23 Since the mesh 21 is firmly attached and coupled, the flexibility of the polishing pad 20 itself can be ensured, and structural robustness and stability of the polishing pad 20 can be enhanced.

In addition, according to the present invention, if the primer layer 28 is applied to the lower surface of the mesh network 21 before attaching the resin layer 22 to the mesh network 21, the adhesion between the mesh network 21 and the resin layer 22 can increase In addition, it is convenient to attach and detach on the holder 11 of the grinder 10 by combining a back-attached cloth 28 such as cotton cloth on the bottom surface of the resin layer 22 and providing a Velcro member 30, etc. At the same time, there is an advantage of increasing the adhesive force for coupling the Velcro member 30 to the bottom surface of the resin layer 22.

1 is a cross-sectional view according to an embodiment of the present invention
Figure 2 is an exploded perspective view showing a coupled state of the present invention
Figure 3 is an exploded perspective view showing an operating state of the present invention
4 is an exploded perspective view according to an embodiment of the present invention

Objects, features and advantages of the present invention described above will become more apparent through the detailed description that follows. Hereinafter, a preferred embodiment of the present invention will be described based on the accompanying drawings.

1 to 4 show a preferred embodiment of the present invention. As shown in FIG. 1, the polishing pad 20 of the present invention is a flexible pad structure capable of elastic deformation and restoration by integrally bonding the resin layer 22 to the bottom surface of the mesh 21 by thermal fusion. , and an electrodeposited diamond layer 24 including diamond particles 25 is electrodeposited on the upper surface of the mesh network 21, leaving a conductive pattern region 26 of a certain shape on the mesh network 21. By forming a non-conductive masking layer 23 , electrodeposition is performed only within the conductive pattern region 26 .

In the polishing pad 20 of the present invention, the resin layer and the masking layer are respectively formed on the lower and upper surfaces of the mesh network 21 during the thermal fusion process of the resin layer 21 and the masking layer 23. As the mesh network 21 on which the diamond particles 25 are electrodeposited is firmly bonded between the resin layer 21 and the masking layer 23 as they are mutually fused in an impregnated state permeated through the mesh, the polishing pad 20 is used to During polishing, since the diamond 25 particles attached to the mesh 21 do not displace and maintain a solid attachment state, polishing performance can be maintained high. In addition, when a primer is applied between the mesh network 21 and the resin layer 22, the adhesion between the resin layer 22 and the mesh network 21 can be further increased. In addition, in order to couple the Velcro member 30 to the bottom surface of the resin layer 22, the adhesive is easily permeated through a back-mounted cloth 28 such as cotton cloth to increase the adhesive strength. The coupling state and configuration will be described with reference to FIGS. 2 to 4 as follows.

As shown in FIG. 2, the polishing pad 20 of the present invention is provided in the form of a disk or ring in which an electrodeposited diamond layer 24 containing diamond particles 25 is electrodeposited in a certain pattern on the upper surface of the pad, and It is detachable on the holder 11 of the grinder 10 by the Velcro member 30 or the like, and the polishing pad 20 of the present invention is flexible as shown in FIG. 3, the polishing pad has flexibility as a whole. As it has a structure, it is not only easy to attach and detach the Velcro member 30 as described above, but also when the Velcro member 30 is attached to and detached from the holder 11, the polishing pad is elastically restored to mount or It is convenient for replacement, and when polishing the corner of the object to be polished, not only can it be deformed in response to the shape of the surface of the object to be polished, but also the shape is restored to its original state after polishing, so that other polishing operations can be easily performed. If explained by 4, it is as follows.

As shown in FIG. 4, the polishing pad 20 of the present invention is provided with a mesh network 21 in the form of a disk of a certain diameter or a ring in which the center of the disk is punched to a certain size. ) is made of a wire mesh woven by wire to form a mesh of a certain size, and a resin layer 22 of the same size is attached to the bottom of the mesh 21. At this time, when the primer layer 27 is applied to the rear surface of the mesh network 21, the resin layer 22 can be firmly attached to the mesh network 21.
In this way, a masking layer 23 is formed on the upper surface of the mesh network 21 on which the resin layer 22 is formed on the bottom surface to shield the conductivity of the mesh network 21 by silk printing or the like. This masking layer 23 is a non-conductive resin material that can be heat-sealed with the resin layer 22, and diamond particles remain on the conductive pattern area 26 remaining in a constant shape as the mesh network 21 is covered with the non-conductive material. (25) is electrodeposited. In this electrodeposition process, when diamond particles 25 are electrically electrodeposited on the mesh 21 in a scattered state, the diamond particles 25 in the conductive pattern region 26 are electrodeposited and plated. An electrodeposited diamond layer 24 fixedly bonded to the mesh network 21 is formed.
In this way, when the masking layer 23 is formed on the upper surface of the mesh network 21 and the resin layer 22 is formed on the back surface of the mesh network 21, heat is applied to separate the masking layer 23 and the resin layer 22. mutually heat-sealed. Through this thermal fusion, the resin layer 22 on the back of the mesh 21 and the masking layer 23 on the top of the mesh 21 are melted, respectively, and penetrated and impregnated between the meshes from the back and top of the mesh 21, are mutually fused As the resin layer 22 and the masking layer 23 are fused to each other through the mesh network 21 as described above, the bonding force between the mesh network 21 and the diamond electrodeposited layer 24 to the polishing pad is increased, thereby increasing the polishing pad 20 ) increases the structural stability.
On the other hand, the Velcro member 30 may be coupled to the bottom surface of the resin layer 22. At this time, the Velcro member 30 can be firmly attached to the resin layer 22, such as a cloth attached to the back surface. (28) is further combined so that the adhesive or the like can be easily penetrated. A hole for mounting on the holder 11 may be formed at the center of the finally completed polishing pad 20 . Symbols not described above indicate the device-side Velcro 12 provided on the side of the holder 11 and detached from the Velcro member 30 .

delete

delete

The present invention described above is not limited by the foregoing embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within a range that does not deviate from the technical spirit of the present invention. will be clear to those who have knowledge of

10: grinder 11: holder
20: polishing pad 21: mesh net
22: resin layer 23: masking layer
24: electrodeposited diamond layer 25: diamond particles
26: conductive pattern area 27: primer coating layer
28: back attachment 30: Velcro member

Claims (3)

In the flexible polishing pad detachable on the holder 11 of the grinder 10;
A ring-shaped or disk-shaped mesh network 21 made of metal;
a thermoplastic soft resin layer 22 coupled to the rear surface of the mesh network 21 in a heat-sealed state;
a masking layer 23 coated to form a conductive pattern region 26 of a certain shape on the upper surface of the mesh network 21 and heat-sealable with the resin layer 22;
an electrodeposited diamond layer 24 in which diamond particles 25 are electrodeposited and plated in the conductive pattern region 26;
The resin layer 22 and the masking layer 23 are impregnated between the mesh nets from the back and top surfaces of the mesh net 21 through thermal fusion and are fused to each other. Flexible electrodeposited diamond polishing pad.
The flexible electrodeposited diamond polishing pad according to claim 1, characterized in that a primer layer (27) is applied to the lower surface of the mesh network (21) to increase adhesion between the mesh network (21) and the resin layer (22).
[4] The flexible electrodeposited diamond polishing pad according to claim 1 or 2, characterized in that a back-mounted fabric (28) including cotton cloth is coupled to the bottom surface of the resin layer (22).

Images