KR102499328B1 - Vaporizer - Google Patents

Abstract

The present embodiments are a body having a spray nozzle for injecting a source material into a vaporization space below and a vaporization space for vaporizing the injected source material in communication with the spray nozzle, and a predetermined temperature difference (ΔT) between the spray nozzle and the vaporization space. ) and a heat blocking means for generating or a temperature maintaining means for maintaining the internal temperature of the spray nozzle at a low temperature and maintaining the internal temperature of the vaporization space at a high temperature.
Thus, the present embodiments can contribute to increasing the vaporization efficiency by maintaining a temperature difference between the spray nozzle and the vaporization space of the vaporizer or maintaining a low or high temperature.

Description

Vaporizer {Vaporizer}

The present embodiments relate to a vaporizer provided in a substrate processing apparatus for depositing a thin film on a substrate, and more specifically, to a vaporizer capable of increasing vaporization efficiency.

In general, a semiconductor memory device, a liquid crystal display device, an organic light emitting device, and the like are manufactured by laminating a structure having a desired shape by performing a plurality of semiconductor processes on a substrate.

A semiconductor manufacturing process includes a process of depositing a predetermined thin film on a substrate, a photolithography process of exposing a selected region of the thin film, and an etching process of removing the thin film of the selected region. A substrate processing process for manufacturing such a semiconductor is performed in a substrate processing apparatus including a process chamber in which an optimal environment for the process is created.

A substrate to be processed and a substrate seating portion on which the substrate is seated are provided in the process chamber, and a process gas containing a source material is sprayed onto the substrate. Deposition and etching processes are performed on the substrate by the source material contained in the process gas.

Meanwhile, in order to perform thin film deposition and etching processes, source materials used for deposition and etching are supplied to the aforementioned process chamber. Such a source material can be maintained in a liquid state at room temperature. In the case of a liquid state, the source material must be changed to a gaseous state before it can be used in a semiconductor processing process.

The source material that is changed into a gaseous state may be vaporized in a vaporizer provided in the substrate processing apparatus and supplied to the process chamber. At this time, when the vaporization efficiency of the source material in the vaporizer is low, the non-vaporized source material adheres to the inner wall of the vaporizer to provide a cause of deteriorating the performance and lifespan of the vaporizer, and the non-vaporized source material and the vaporized source material If they flow together into the process chamber, they may provide a cause of wafer defects in the semiconductor manufacturing process.

Moreover, if the vaporization efficiency of the vaporizer is low, the replacement cycle of the vaporizer is shortened and the overall speed of the semiconductor manufacturing process is lowered, thereby reducing the production cost of the product.

An object of the present embodiments is to provide a vaporizer for improving vaporization efficiency through a temperature difference or maintaining a temperature between a high temperature and a low temperature.

According to one embodiment, the spray nozzle for injecting the source material into the vaporization space below; a body communicating with the spray nozzle and having a vaporization space for vaporizing the injected source material; and a heat blocking means generating a predetermined temperature difference (ΔT) between the spray nozzle and the vaporizing space.

According to one embodiment, the spray nozzle for injecting the source material into the vaporization space below; a body communicating with the spray nozzle and having a vaporization space for vaporizing the source material; and a temperature maintaining means for maintaining the internal temperature of the spray nozzle at a low temperature and maintaining the internal temperature of the vaporizing space at a high temperature.

Optionally, the body includes a first heater disposed on an inner wall surrounding the vaporization space to heat and vaporize the injected source material introduced into the vaporization space; and a discharge unit configured to discharge the vaporized source material when the injected source material is vaporized by the first heater in the vaporization space.

Optionally, the predetermined temperature difference (ΔT) may have a range of 100 °C to 200 °C.

Optionally, the temperature of the spray nozzle is maintained at a low temperature (room temperature) of 20 ° C to 50 ° C within the range of ΔT, and the temperature of the vaporization space is maintained at a high temperature of 150 ° C to 250 ° C within the range of ΔT there is.

Optionally, the vaporizer may further include a first inlet for supplying a carrier gas promoting diffusion of the source material together with the source material to the spray nozzle.

Optionally, the heat shielding unit may include at least one spraying hole that is a spraying passage of the source material.

Optionally, the heat blocking means may be made of a plastic-based material.

Optionally, the heat blocking means may have a thickness of 5 to 50 mm.

Optionally, the temperature maintaining means may maintain the low temperature (room temperature) in the range of 20 °C to 50 °C and maintain the high temperature in the range of 150 °C to 250 °C.

Optionally, the temperature maintaining unit may include at least one spraying hole that is a spraying passage of the source material, is made of a plastic-based material, and has a thickness of 5 to 50mm.

Optionally, the vaporizer is disposed in the lower portion of the vaporization space, the second inlet for introducing the vaporization auxiliary gas; and a first diffuser having a porous structure to diffuse the vaporization assist gas introduced through the second inlet into the vaporization space.

Optionally, the vaporizer is disposed in the lower portion of the vaporization space, the second inlet for introducing the vaporization auxiliary gas; and a first diffuser disposed below the vaporization space to diffuse the vaporization assist gas introduced through the second inlet into the vaporization space. and a second diffuser having one end communicating with the first diffuser and disposed on a side of the vaporization space to further diffuse the vaporization assist gas into the vaporization space at the side.

As described above, in the present embodiments, the temperature difference (pressure difference) generated in the vaporization space of the spray nozzle and the body due to the optimal design of the heat blocking means or the temperature maintaining means disposed between the spray nozzle and the vaporization space of the vaporizer during injection or vaporization ) increases, or it has the effect of increasing the vaporization efficiency by maintaining low and high temperatures.

In addition, the present embodiments increase the vaporization efficiency by diluting the source material that is not sufficiently vaporized in the vaporization space of the body due to the vaporization auxiliary gas introduced into the vaporization space or re-vaporizing the source material by the heated auxiliary gas. can be further stimulated.

In addition, the present embodiments apply a physical impact to the source material that is not sufficiently vaporized, which can accumulate on the surface of the lower or side portion of the vaporizer, and flow it into the vaporization space of the body to pick up the source material to vaporize again, thereby promoting vaporization efficiency. can make it

In addition, since the present embodiments vaporize the source material that is not sufficiently vaporized in the vaporization space of the vaporizer by the vaporization assist gas, the vaporization efficiency of the vaporizer as a whole is promoted.

In addition, the present embodiments allow the source material to flow from the lower side to the upper side in the discharge unit of the body, so that the non-vaporized source material can be suppressed from flowing into the process chamber through the discharge unit.

It is not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those skilled in the art from the description below.

1 is a cross-sectional view showing an example of a vaporizer according to an exemplary embodiment.
FIG. 2 is a cross-sectional view showing a heat shield provided in the vaporizer of FIG. 1 in more detail.
3 is a schematic cross-sectional view of another example of a vaporizer according to an embodiment.
4 is a cross-sectional view schematically illustrating another example of a vaporizer according to an embodiment.

The vaporizer disclosed in the following embodiments will be described in more detail with reference to the drawings. Terms disclosed in the following embodiments are only used to describe a specific example, but are not limited thereto.

For example, terms such as 'include', 'have' or 'consist of' disclosed in the following embodiments mean that the corresponding component may be inherent unless otherwise stated, It should be understood as further including other components rather than excluding other components.

Also, terms such as “first” and “second” disclosed in the following embodiments may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. In addition, terms specifically defined in consideration of the configuration and operation of the embodiment are only for describing the embodiment, and do not limit the scope of the embodiment.

In addition, 'above', which is a singular expression used in the description and claims of the embodiments disclosed in the following embodiments, may be understood to include plural expressions as well, unless the context clearly indicates otherwise, and 'or/' and' or 'and/or' should be understood to include any and all possible combinations of one or more of the related items listed.

In addition, in the case where it is described as being formed on the "upper (above)" or "on or under" of each element disclosed in the following embodiments, the upper (upper) or lower (lower) ( on or under) includes both elements formed by directly contacting each other or by indirectly placing one or more other elements between the two elements. In addition, when expressed as “up (up)” or “down (on or under)”, it should be understood to include the meaning of not only the upward direction but also the downward direction based on one element.

In addition, relational terms such as "upper/upper/upper" and "lower/lower/lower" disclosed in the following embodiments do not necessarily require or imply any physical or logical relationship or order between such entities or elements. However, it may be understood that it is used only to distinguish one entity or element from another entity or element.

Hereinafter, a vaporizer connected to the vaporization processing device (process chamber) will be described in more detail based on the above-mentioned viewpoints.

<First embodiment of vaporizer>

1 is a cross-sectional view showing an example of a vaporizer according to an embodiment, and FIG. 2 is a cross-sectional view showing a heat blocking means provided in the vaporizer of FIG. 1 in more detail. FIG. 2 will be cited as an aid when describing FIG. 1 .

Referring to FIG. 1, a vaporizer 100 according to an embodiment includes a first inlet 110, a spray nozzle 120, a heat blocking means 130, and a body 100A, and the body 100A may include a vaporization space (S), a first heater 140 and a discharge unit (150).

In one embodiment, the first inlet 110 is provided at the top of the vaporizer 100, and is a passage through which a source material in a liquid state or a mist state in which liquid particles form a fog-like state is introduced. .

The first inlet 110 may further introduce a carrier gas, for example, a process gas, as well as the source material. The carrier gas refers to an inert gas such as argon gas or nitrogen gas, and as will be described later, it can be used to promote diffusion of a source material.

The source material or the source material and the carrier gas introduced into the first inlet 110 may be supplied to the spray nozzle 120 below.

In one embodiment, the spray nozzle 120 may be provided with a spray nozzle 121 communicating with the first inlet portion 110 while being disposed below the aforementioned first inlet portion 110 .

The injection nozzle 121 may expand the source material or the source material and the carrier gas introduced through the first inlet 110 and inject them into the vaporization space S of the body 100 .

For example, when the source material passing through the spray nozzle 121 of the spray nozzle 120 reacts with the carrier gas, the number of particles of the source material is further divided into finer particles and the number of particles of the source material increases, thereby expanding more actively. It can be sprayed by allowing this to happen.

In one embodiment, the heat blocking means 130 is to be maintained at a low temperature (room temperature) in the spray nozzle 120, and to be maintained at a high temperature in the vaporization space (S) of the body (100A), the spray nozzle 120 and It may be disposed between the vaporization space (S) of the body (100A).

Preferably, the heat blocking means 130 is maintained at a low temperature (room temperature) in the spray nozzle 120 during spraying or evaporation, and is maintained at a high temperature in the vaporization space S of the body 100A, the body 100A of the vaporization space (S) of the spray nozzle 120 and the body 100A so that the difference between the temperature generated in the vaporization space (S) and the temperature generated in the spray nozzle 120 can have a temperature difference by a predetermined ΔT can be appropriately placed between them. The temperature difference may be proportional to the pressure difference mechanism.

The reason for the temperature difference by ΔT is to maintain a low temperature (room temperature) in the spray nozzle 120 and to maintain a high temperature in the vaporization space S of the body 100A to spray or / and spread the above-described source material. This is because it can accelerate and ultimately increase the vaporization efficiency.

For example, the spray nozzle 120 so that the difference (ΔT) between the temperature generated in the vaporization space (S) of the body (100A) and the temperature generated in the spray nozzle 120 may have a range of 100 ° C to 200 ° C And between the vaporization space (S) of the body (100A), the arrangement position of the heat shielding means (130) can be properly designed.

Preferably, the temperature of the spray nozzle 120 may be maintained at a low temperature (room temperature) of 20 ° C to 50 ° C within the range of the above-mentioned ΔT, and the temperature of the vaporization space (S) of the body (100A) is the above-mentioned ΔT It may be implemented to be maintained at a high temperature of 150 ° C to 250 ° C within the range of.

In the past, since there is no heat blocking means 130, it was not easy to maintain a low temperature (room temperature) in the spray nozzle 120, and it was not easy to maintain a high temperature in the vaporization space S of the body 100A. Therefore, it ultimately had the disadvantage of lowering the vaporization efficiency of the source material.

For example, since the source material is not smoothly sprayed and/or diffused, vaporization efficiency is lowered.

However, heat blocking means so that the temperature of the vaporization space (S) of the body (100A) is maintained at a high temperature of 150 ° C to 250 ° C, and the temperature of the spray nozzle 120 is maintained at a low temperature (room temperature) of 20 ° C to 50 ° C. 130 is properly disposed between the spray nozzle 120 and the vaporization space S of the body 100A, thereby causing a temperature difference ΔT in the range of 100 ° C to 200 ° C, ultimately increasing the vaporization efficiency.

To this end, the heat blocking means 130 maintains the above-mentioned temperature difference (ΔT) while maintaining the diffusion of the source material sprayed by the spray nozzle 120 at least one spray hole 131, which is a spray passage of the source material. can include

For example, at least one spray hole 131 may be provided near the center of the spray nozzle 120 in order to sustain the diffusion of the source material. Preferably, it may be provided with one injection hole 131.

The source material passing through the at least one injection hole 131 may be injected into the vaporization space S of the body 100A and continuously diffused to be substantially supplied to the vaporization space S of the body 100A.

Although most of the source material introduced into the vaporization space (S) of the body (100A) has been diffused, it is not vaporized, that is, the vaporization space of the body (100A) as a mist in which the liquid particles form a mist-like form. (S) can be diffused.

This mist may be vaporized by appropriate temperature and pressure conditions applied to the vaporization space (S) of the body (100A) and physical impact of the vaporization auxiliary gas. The temperature and pressure conditions for vaporization of the source material and the vaporization auxiliary gas will be described in detail by later configurations.

In addition, the heat blocking means 130 according to an embodiment may be made of a plastic-based material to maintain the above-described temperature difference ΔT as shown in FIG. 2 .

For example, the heat blocking unit 130 may be any one of polyethylene terephthalate (PET), polyethylene (PE), polypropylene (PP), polystyrene (PS), and polyvinyl chloride (PVC), or a combination thereof. It can be made of material.

Moreover, the heat blocking means 130 shown in FIG. 2 has a thickness T of 5 mm to 50 mm in thickness and may be disposed between the spray nozzle 120 and the vaporization space S of the body 100A. .

For example, unless the thickness (T) of the heat blocking means 130 is 5 mm to 50 mm, a temperature difference (ΔT) in the range of 100 ° C to 200 ° C could not be generated. However, it is not necessarily limited to this thickness.

In one embodiment, the first heater 140 may be provided to surround the vaporization space (S) of the body (100A). For example, a vaporization space (S) in which the source material is vaporized is formed in the vaporizer 100, and the first heater 140 may be provided to surround the vaporization space (S).

The first heater 140 is implemented in an induction heating method or/and an electric heating method, and through this, it is possible to heat and vaporize the source material diffusing in the vaporization space S of the body 100A.

For example, the first heater 140 heats the inner wall (B) of the vaporizer 100 through the implemented induction heating method or / and the electric heating method, and the heat transferred by the heated inner wall (B) is returned to the body. By heating the source material in the vaporization space (S) of (100A), it is possible to vaporize the source material.

Here, since the first heater 140 heats the inner wall B of the vaporizer 100, it is possible to suppress the adhesion of the source material to the inner wall B of the vaporizer 100, and the vaporizer 100 The vaporization of the source material may be promoted by maintaining the temperature of the vaporization space S at a high temperature.

As such, although the first heater 140 is limited to being located on the inner wall (B), it is not limited thereto and the first heater 140 is placed on the surface of the inner wall (B) so as to be expressed in the vaporization space (S) of the body (100A). May be disposed, may be disposed only on the side (B, inner wall), which are both sides of the vaporization space (S) of the body (100A).

In one embodiment, the discharge unit 150 is provided on the inner wall (B) of the vaporizer 100, and the source material vaporized in the vaporization space (S) of the body (100A) to the outside, for example, to the process chamber (not shown). It may be a passageway for evacuation.

For example, the discharge unit 150 is the body 100A when the source material passing through the above-described heat blocking means 130 is vaporized by the first heater 140 in the vaporization space S of the body 100A. ) The source material vaporized in the vaporization space S may be discharged toward the process chamber.

At this time, the vaporized source material discharged through the discharge unit 150 is a result generated due to the temperature difference (ΔT) in the range of 100 ° C to 200 ° C. would.

On the other hand, the lower part of the above-described vaporization space (S) of the body (100A) has no structure formed, or materials that can further promote the vaporization of the source material in the vaporization space (S) of the body (100A) can be introduced. Various modifications are possible, such as a structure having a structure can be formed. This will be explained below.

<Second Embodiment of Vaporizer>

3 is a schematic cross-sectional view of another example of a vaporizer according to an embodiment.

Referring to FIG. 3, the vaporizer 100 according to an embodiment includes a first inlet 110, a spray nozzle 120, a heat blocking means 130, a first heater 140, an outlet 150, It includes a second inlet 160 and a first diffuser 170 .

Here, the first inlet 110, the spray nozzle 120, the heat blocking means 130, the first heater 140, and the outlet 150 shown in FIG. 3 have been described in FIG. Although omitted, it is of course similarly or identically applied in this embodiment. At this time, the first heater 140 and the discharge unit 150 may be provided in the body 100A.

Hereinafter, the description will focus on the second inlet 160 and the first diffuser 170, which are not disclosed in FIG. 1 .

In one embodiment, the second inlet 160 is provided at the lower part of the vaporizer 100 or the lower part of the body 100A, and may introduce the vaporization assist gas. However, it is not necessarily limited to this arrangement.

For example, the second inlet 160 may be disposed in a portion where a large amount of unvaporized source material remains in the vaporization space S of the body 100A, even if not at the bottom of the vaporizer 100.

At this time, the temperature and flow rate of the vaporization auxiliary gas flowing into the second inlet 160 may be controlled by a second heater (not shown) and a flow controller (not shown) provided outside the vaporizer 100. .

The second heater is provided outside the body 100A and is connected to the second inlet 160, and may serve to heat the vaporization assist gas supplied to the second inlet 160. Therefore, in the embodiment, the temperature of the vaporization assist gas is controlled by the first heater 140 and the second heater, and may be introduced into the second inlet 160 or / and the vaporization space S of the body 100A, , The temperature may be adjusted again by the first heater 140 in the vaporization space S of the body 100A.

On the other hand, the flow controller is provided outside the vaporizer 100 and is connected to the second heater or / and the second inlet 160, so that the second inlet 160 and / or the vaporization space of the body 100A ( S) may play a role of adjusting the flow rate of the vaporization auxiliary gas introduced into.

In addition, valves for blocking the flow of the vaporized auxiliary gas may be provided in a pipe connecting the second inlet 160, the second heater, and the flow controller.

In one embodiment, the first diffuser 170 is disposed below the vaporization space (S) of the body (100A), preferably between the vaporization space (S) of the body (100A) and the second inlet (160). may be disposed between them and may have a porous structure.

The first diffuser 170 may serve to diffuse the vaporization assist gas introduced through the aforementioned second inlet 160 into the vaporization space S of the body 100A. It is preferable that the source material passing through the heat blocking unit 130 and the vaporization assist gas passing through the first diffuser 170 are sprayed in opposite directions in the vaporization space S of the body 100A.

The reason for diffusing the vaporization assist gas is to prevent the vaporization assist gas introduced into the vaporization space S of the body 100A through the first diffuser 170 from affecting the deposition and etching processes of the process chamber (not shown). This is because the vaporization of the source material being vaporized in the vaporization space (S) of the body (100A) can be further promoted.

In addition, the reason for diffusing the vaporized auxiliary gas is to form a pressure difference between the second inlet 160 and the vaporized space (S) of the body (100A) so that the vaporized auxiliary gas in the vaporized space (S) of the body (100A) Even if introduced, it is because by suppressing the pressure rise in the vaporization space (S) of the body (100A), it is possible to further promote vaporization of the source material of the mist by applying a physical impact to the source material of the mist.

The vaporization assist gas diffused into the vaporizer 100 is transferred to the vaporization space S of the body 100A through the first diffuser 170 in consideration of the uniform pressure distribution in the vaporization space S of the body 100A. It is better to spread it evenly.

In this case, the aforementioned discharge unit 150 transfers the vaporized auxiliary gas present in the vaporization space S of the body 100A together with the source material vaporized in the vaporization space S of the body 100A to the outside, for example, the process chamber. (not shown) may be further discharged to the side.

<Third Embodiment of Vaporizer>

4 is a cross-sectional view schematically illustrating another example of a vaporizer according to an embodiment.

4, the vaporizer 100 according to an embodiment includes a first inlet 110, a spray nozzle 120, a heat blocking means 130, a first heater 140, an outlet 150, It may include a second inlet 160, a second heater (not shown), a flow controller (not shown), a first diffuser 170, and a second diffuser 180.

Here, the first inlet 110, the spray nozzle 120, the heat blocking means 130, the first heater 140, the outlet 150, the second inlet 160, the first inlet 110 shown in FIG. 2 The heater (not shown), the flow controller (not shown) and the first diffuser 170 are the same as those shown in FIGS. 1 to 3, so a description thereof is omitted, but the same or similar application is applied in this embodiment. Of course.

However, although the first heater 140 of FIGS. 1 to 3 is disposed on the inner wall surrounding the vaporization space S of the body 100A, the first heater 140 of this embodiment vaporizes the body 100A. When the second diffuser 180 to be described later is disposed at a position corresponding to the side of the space S, the first diffuser 180 of FIGS. 1 to 3 is disposed on the side so as to surround the second diffuser 180. It can be said that there is a difference from the heater 140.

However, the first heater 140 is not limited to being disposed to surround the second diffuser 180, and may be disposed in various positions such as being disposed inside the second diffuser 180.

In one embodiment, the second diffuser 180 is disposed on the side where the vaporization space S of the body 100A is disposed, for example, it is disposed to surround the vaporization space S of the body 100A, and the first diffuser 170 And / or may be in communication with the second inlet (160).

The second diffuser 180 has a porous structure like the first diffuser 170 described above, and converts the vaporization assist gas introduced through the first diffuser 170 and/or the second inlet 160 into the vaporizer 100. It may play a role of more uniformly diffusing into the vaporization space (S).

In this way, due to the first diffuser 170 disposed below the vaporizer 100 and the second diffuser 180 disposed on the side of the vaporizer 100, the body 100A staying in the vaporization space S Vaporization of the source material may be further promoted.

In this case, the discharge unit 150 according to an embodiment is the body 100A by the first diffuser 170 and the second diffuser 180 together with the source material vaporized in the vaporization space S of the body 100A. Vaporization assist gas present in the vaporization space S of may be further discharged to the outside, for example, to a process chamber (not shown).

On the other hand, the heat blocking means 130 disclosed in the vaporizer of FIGS. 1 to 4 described above may be replaced with a temperature maintaining means 190.

That is, the temperature maintaining means 190, unlike the heat blocking means 130 of FIGS. 1 to 4 generating a predetermined temperature difference (ΔT) between the spray nozzle 120 and the body 100A, the spray nozzle 120 It is possible to maintain the internal temperature of the low temperature and maintain the internal temperature of the vaporization space (S) of the body (100A) at a high temperature.

For example, the temperature maintaining means 190 maintains the internal temperature of the spray nozzle 120 at a low temperature (room temperature) in the range of 20 ° C to 50 ° C during spraying or vaporization of the source material, and in the range of 150 ° C to 250 ° C It is possible to maintain the internal temperature of the vaporization space (S) of the body (100A) at a high temperature.

In other words, the temperature maintaining means 190 according to an embodiment does not generate a predetermined temperature difference between the vaporization space (S) of the spray nozzle 120 and the body 100A, the spray nozzle 120 and the body ( It can be said that the purpose is to maintain the internal temperature of the vaporization space (S) of 100A) differently at a predetermined temperature as described above.

Through this temperature maintenance, in this embodiment, the vaporization efficiency could be further increased compared to the prior art.

Although only a few of the embodiments disclosed above have been described as described above, various other forms of implementation are possible. The technical contents of the above-described embodiments may be combined in various forms unless they are incompatible with each other, and through this, may be implemented in a new embodiment.

In addition, it is obvious to those skilled in the art that the embodiments disclosed above may be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

Accordingly, the foregoing embodiments should not be construed as restrictive in all respects and should be considered as illustrative. The scope of this embodiment should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of this embodiment are included in the scope of this embodiment.

100: vaporizer
110: first inlet
120: atomizing nozzle
121: injection nozzle
130: heat blocking means
131: injection hole
140: first heater
150: discharge unit
160: second inlet
170: first diffuser
180: second diffuser
190: temperature maintenance means

Claims (12)

A spray nozzle for injecting the source material into the vaporization space below;
a body communicating with the spray nozzle and having a vaporization space for vaporizing the injected source material;
A predetermined temperature difference (ΔT) between the spray nozzle and the vaporization space, including at least one spray hole disposed between the spray nozzle and the vaporization space of the body so that a portion thereof is exposed to the vaporization space and is a spray passage of the source material. ) heat blocking means for generating;
a second inlet disposed below the vaporization space and introducing a vaporization auxiliary gas; and
A vaporizer comprising a first diffuser for diffusing the vaporization assist gas introduced through the second inlet into the vaporization space. According to claim 1,
The heat blocking means is made of a plastic-based material, the vaporizer. According to claim 1,
The heat blocking means has a thickness of 5 to 50 mm, the vaporizer. According to claim 1,
The predetermined temperature difference (ΔT) has a range of 100 ° C to 200 ° C, the vaporizer. According to claim 4,
The temperature of the spray nozzle is
Maintained at a low temperature (room temperature) of 20 ° C to 50 ° C within the range of ΔT,
The temperature of the vaporization space,
A vaporizer maintained at a high temperature of 150 ° C to 250 ° C within the range of ΔT. A spray nozzle for injecting the source material into the vaporization space below;
a body communicating with the spray nozzle and having a vaporization space for vaporizing the source material;
Maintaining the internal temperature of the spray nozzle at a low temperature, including at least one spray hole disposed between the spray nozzle and the vaporization space of the body so that a portion is exposed to the vaporization space and is a spray passage of the source material; temperature maintaining means for maintaining the internal temperature of the vaporization space at a high temperature;
a second inlet disposed below the vaporization space and introducing a vaporization auxiliary gas; and
A vaporizer comprising a first diffuser for diffusing the vaporization assist gas introduced through the second inlet into the vaporization space. According to claim 6,
The temperature maintaining means,
A vaporizer that maintains the low temperature in the range of 20 ° C to 50 ° C and maintains the high temperature in the range of 150 ° C to 250 ° C. According to claim 6,
The temperature maintaining means,
A vaporizer made of a plastic-based material and having a thickness of 5 to 50 mm. According to claim 1 or 6,
the body,
a first heater disposed on an inner wall surrounding the vaporization space to heat and vaporize the injected source material introduced into the vaporization space; and
When the injected source material is vaporized by the first heater in the vaporization space, the vaporizer further comprises a discharge unit for discharging the vaporized source material. According to claim 1 or 6,
The vaporizer further comprises a first inlet for supplying a carrier gas that promotes diffusion of the source material together with the source material to the spray nozzle. According to claim 1 or 6,
The first diffuser is a vaporizer having a porous structure. According to claim 1 or 6,
A vaporizer comprising a second diffuser having one end communicating with the first diffuser and disposed at a side of the vaporization space to further diffuse the vaporization assist gas into the vaporization space at the side.

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