KR102498313B1 - Electrically insulated heat radiation composite material - Google Patents

Abstract

An insulating heat dissipation composite is provided. An insulating heat-dissipating composite material according to an embodiment of the present invention is implemented by including a polymer matrix as a body and an insulating heat-dissipating filler dispersed in the polymer matrix. According to this, the insulating heat-dissipating composite material can be very suitable as a heat-dissipating member of a heat source in an electronic device, which must have a dielectric breakdown voltage of a certain level or more, as it exhibits excellent heat-dissipating performance and at the same time has excellent insulation performance. In addition, as it can be molded into various shapes, it is easy to deploy to a support member or housing having a complex structure. Furthermore, in the case of an insulating heat dissipation composite with improved mechanical strength, it can be widely applied to parts or electronic devices to which an external force can be applied temporarily or continuously.

Description

Insulating heat radiation composite {Electrically insulated heat radiation composite material}

The present invention relates to an insulating heat-dissipating composite material, and more particularly, to an insulating heat-dissipating composite material having light weight, heat dissipation and insulation properties, and a manufacturing method thereof.

Heat build-up in electronic components, light fixtures, converter housings and other devices that generate unwanted heat can shorten operating life and reduce operating efficiency. In order to prevent this, heat radiating members or heat dissipating devices such as heat sinks and heat exchangers are used together with devices that generate heat, and metals, which are usually excellent heat conductors, are used as the subject of heat radiating members or heat dissipating devices. come. However, the metal is heavy and has a high production cost.

In recent years, a heat dissipation member manufactured using an injection molding or extrudable polymer resin has been proposed, and many studies have been conducted due to advantages such as lightness and low unit price due to the material characteristics of the polymer resin itself.

However, a heat dissipation member manufactured using a polymer resin expresses heat dissipation characteristics through a thermally conductive filler. Generally, a thermally conductive filler having excellent heat dissipation performance also has electrical conductivity, so that a heat dissipation member implemented with this material expresses electrical conductivity. There is a problem that is very inappropriate for use in electronic devices requiring insulation.

Publication No. 10-2016-0031103

The present invention has been devised in view of the above points, and the present invention aims to provide an insulating heat dissipation composite that can be applied as a support for a heat source requiring insulation and an external housing as it simultaneously exhibits heat dissipation performance and insulation performance. .

In addition, another object of the present invention is to provide an insulating heat dissipation composite material having mechanical strength such as tensile strength and flexural modulus capable of supporting an external force.

In addition, another object of the present invention is to provide a heat dissipation unit, a heat dissipation housing or a heat dissipation support member through the insulating heat dissipation composite as described above.

In order to solve the above problems, the present invention provides an insulating composite material comprising a polymer matrix as a body and an insulating heat dissipating filler dispersed in the polymer matrix.

According to one embodiment of the present invention, the polymer matrix is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO) , polyethersulfone (PES), polyetherimide (PEI), and may include one compound selected from the group consisting of polyimide, or a mixture or copolymer of two or more kinds.

In addition, the insulating heat radiation filler may be provided in an amount of 43 to 435 parts by weight based on 100 parts by weight of the polymer matrix.

In addition, the insulating heat-dissipating filler is selected from the group consisting of magnesium oxide, talc, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, silicon carbide and manganese oxide. One or more may be included.

In addition, the average particle diameter of the insulating heat-radiating filler may be 10 nm to 600 μm.

In addition, the insulating composite may further include at least one additive selected from the group consisting of a dispersant, an antioxidant, a work improver, a coupling agent, a stabilizer, a flame retardant, a pigment, an impact improver, and a strength enhancer.

In addition, a protective coating layer may be further provided on the outer surface of the polymer matrix.

In addition, the present invention is a polymer matrix as a body; Provided is an insulating composite material comprising a metal core layer provided inside the polymer matrix and an insulating heat dissipating filler dispersed in the polymer matrix.

According to one embodiment of the present invention, the metal core layer may be one metal selected from the group consisting of aluminum, magnesium, iron, titanium, and copper, or an alloy containing at least one metal.

In addition, a protective coating layer may be further provided on the outer surface of the polymer matrix, and in this case, the protective coating layer may be an insulating heat dissipation coating layer.

In addition, the metal core layer may be provided on the polymer matrix such that one surface is exposed, and the insulating composite may further include a protective coating layer provided on an outer surface of the polymer matrix including the exposed surface of the metal core layer.

In addition, the present invention provides a heat dissipation housing comprising the insulating heat dissipation composite according to the present invention.

In addition, the present invention provides a heat dissipation support member comprising an insulating heat dissipation composite.

According to the present invention, the insulating heat dissipation composite exhibits excellent heat dissipation performance and at the same time has excellent insulation performance, so it can be very suitable as a heat dissipation member of a heat source in an electronic device that must have a dielectric breakdown voltage of a certain level or higher. In addition, as it can be molded into various shapes, it is easy to deploy the application to a support member or housing having a complex structure. Furthermore, in the case of an insulating heat dissipation composite with improved mechanical strength, it can be widely applied to parts or electronic devices to which an external force can be applied temporarily or continuously.

1 is a cross-sectional view of an insulating heat dissipation composite according to an embodiment of the present invention, and
2 and 3 are cross-sectional views of an insulating heat dissipation composite according to another embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. This invention may be embodied in many different forms and is not limited to the embodiments set forth herein. In order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and the same reference numerals are added to the same or similar components throughout the specification.

Referring to FIG. 1, an insulating heat dissipation composite material 1000 according to an embodiment of the present invention is implemented with a polymer matrix 200 and a heat dissipation filler 100 dispersed in the polymer matrix 200, and the polymer matrix 200 ) The outer surface of the protective coating layer 400 may be further provided.

First, the polymer matrix 200 will be described.

The polymer matrix 200 is the body of the insulating heat-dissipating composite 1000, and does not impede the dispersibility of the heat-dissipating filler 100 described later, and is not limited when it is implemented as a polymer compound capable of injection molding. As a preferred example for this, the polymer matrix 200 may be a known thermoplastic polymer compound. The thermoplastic polymer compound is preferably polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone ( PES), polyetherimide (PEI), and a compound selected from the group consisting of polyimide, or a mixture or copolymer of two or more kinds.

For example, the polyamide may be a known polyamide-based compound such as nylon 6, nylon 66, nylon 11, nylon 610, nylon 12, nylon 46, nylon 9T (PA-9T), keyana, and aramid.

For example, the polyester may be a known polyester-based compound such as polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), or polycarbonate.

For example, the polyolefin may be a known polyolefin-based compound such as polyethylene, polypropylene, polystyrene, polyisobutylene, or ethylene vinyl alcohol.

The liquid crystal polymer may be used without limitation in the case of a polymer exhibiting liquid crystallinity in a solution or dissolved state, and may be a known type, so the present invention is not particularly limited thereto.

Next, the insulating heat dissipating filler 100 dispersed in the polymer matrix 200 will be described.

The insulating heat-dissipating filler 100 may be selected without limitation as long as it is known to have both insulating and heat-dissipating properties in its material. For example, the insulating heat-dissipating filler 100 is a group consisting of magnesium oxide, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide, silicon carbide and manganese oxide. It may contain one or more selected from.

In addition, since the particle diameter of the insulating heat-dissipating filler 100 may be selected in consideration of the volume/thickness of the above-described polymer matrix 200, the present invention is not particularly limited thereto. For example, the insulating heat dissipating filler 100 may have an average particle diameter of 10 nm to 600 μm. If the average particle diameter exceeds 600 μm, dispersibility may be deteriorated, and surface quality may be deteriorated as a part may protrude to the surface of the polymer matrix. In addition, if the average particle diameter is less than 10 nm, there is a concern about an increase in product price, and as the thermal resistance increases, there is a risk of deterioration in heat dissipation performance, in particular, in radiation performance to the outside such as air. In addition, there is a problem that the amount of the insulating heat-dissipating filler protruding from the surface may be increased, which may deteriorate heat dissipation performance and insulation.

In addition, the structure of the insulating heat-dissipating filler 100 can be selected differently according to the purpose, so it is not particularly limited in the present invention. For example, the insulating heat dissipating filler 100 may be porous or non-porous. Alternatively, the insulating heat-dissipating filler 100 may be a core-shell type filler in which a known conductive heat-dissipating filler such as carbon-based or metal is used as a core and an insulating component surrounds the core.

In addition, in the case of the insulating heat-dissipating filler 100, the surface may be modified with a functional group such as a silane group, an amino group, an amine group, a hydroxy group, a carboxyl group, etc. there is. At this time, the functional group may be directly bonded to the surface of the filler, or indirectly bonded to the filler through a substituted or unsubstituted aliphatic hydrocarbon having 1 to 20 carbon atoms or a substituted or unsubstituted aromatic hydrocarbon having 6 to 14 carbon atoms. can

The insulating heat dissipating filler 100 may be included in an amount of 43 to 435 parts by weight based on 100 parts by weight of the above-described polymer matrix. If the insulating heat dissipating filler is included in less than 43 parts by weight based on 100 parts by weight of the polymer matrix, the desired level of heat dissipation performance may not be expressed. In addition, if the insulating heat-dissipating filler exceeds 435 parts by weight, the mechanical strength of the implemented insulating heat-dissipating composite material is lowered and can be easily broken or crushed by physical impact. In addition, as the amount of the insulating heat-dissipating filler 100 protruding from the surface of the polymer matrix 200 increases, surface roughness increases, and thus the surface quality of the heat-dissipating composite material may deteriorate. In addition, even if the insulating heat radiation filler is further provided, the degree of improvement in heat radiation performance may be insignificant.

Meanwhile, the insulating heat dissipation composite 1000 may further include a protective coating layer 400 on an outer surface of the polymer matrix 200 . The protective coating layer 400 prevents the escape of the insulating heat-dissipating filler 100 located on the surface of the polymer matrix, prevents scratches due to physical stimuli applied to the surface, and further improves the insulation of the heat-dissipating composite depending on the material It can be easily applied to applications such as electronic devices requiring higher surface resistance, dielectric breakdown voltage, and dielectric breakdown strength.

The protective coating layer 400 may be implemented with a known thermosetting polymer compound or thermoplastic polymer compound. The thermosetting polymer compound may be one compound selected from the group consisting of epoxy-based, urethane-based, ester-based, and polyimide-based resins, or a mixture or copolymer of two or more kinds. In addition, the thermoplastic polymer compound is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES) ), one compound selected from the group consisting of polyetherimide (PEI) and polyimide, or a mixture or copolymer of two or more, but is not limited thereto.

The protective coating layer 400 may have a thickness of 0.1 to 1000 μm, but is not limited thereto, and may be implemented by changing according to the purpose.

On the other hand, the protective coating layer 400 may prevent radiation of heat conducted through the insulating heat dissipating filler 100 into the air. Accordingly, in order to further improve heat dissipation, in particular, heat radiation into the outside air, the protective coating layer 400 may be a heat dissipating coating layer further provided with an insulating heat dissipating filler. The insulating heat-dissipating filler may be used without limitation in the case of a known insulating heat-dissipating filler, and since the description is the same as the insulating heat-dissipating filler 100 dispersed in the polymer matrix 200 described above, a detailed description thereof will be omitted.

In addition, since the particle diameter of the insulating heat-dissipating filler that may be further included in the protective coating layer 400 may be appropriately changed in consideration of the thickness of the protective coating layer 400, the present invention is not particularly limited thereto.

In addition, the type of insulating heat-dissipating filler that may be further included in the protective coating layer 400 may be the same as or different from the insulating heat-dissipating filler 100 dispersed in the polymer matrix 200.

In addition, the content of the heat dissipating filler that may be further included in the protective coating layer 400 may be 1 to 50 parts by weight based on 100 parts by weight of the polymer compound forming the protective coating layer, but is not limited thereto.

On the other hand, the insulating heat-dissipating composite 1000 further contains other additives such as stabilizers such as heat stabilizers and light stabilizers, plasticizers, strength improvers, impact improvers, antioxidants, dispersants, work improvers, coupling agents, UV absorbers, antistatic agents, and flame retardants. can be provided

The strength improving agent may be used without limitation in the case of a known component capable of improving the strength of the insulating heat dissipation composite, and as non-limiting examples thereof, carbon fiber, glass fiber, glass beads, zirconium oxide, wollastonite, and gypsum selected from the group consisting of cite, boehmite, magnesium aluminate, dolomite, calcium carbonate, magnesium carbonate, mica, talc, silicon carbide, kaolin, calcium sulfate, barium sulfate, silicon dioxide, ammonium hydroxide, magnesium hydroxide and aluminum hydroxide One or more components may be included as strength improving agents. The strength improver may be included in an amount of 0.5 to 200 parts by weight based on 100 parts by weight of the heat radiation filler, but is not limited thereto. For example, when glass fibers are used as the strength improver, the glass fibers may have a diameter of 2 to 8 mm.

In addition, the impact modifier can be used without limitation in the case of a known component that can improve the impact resistance such as impact strength, tensile strength, flexural strength, and dimensional stability by improving the flexibility and stress relaxation of the polymer matrix, and thermoplastic resin and/or a rubber-based resin. The thermoplastic resin may be, for example, a polycaprolactone-polyamine copolymer. In addition, the rubber-based resin may be natural rubber or synthetic rubber. The synthetic rubber is styrene butadien rubber (SBR), butadiene rubber (BR), chloroprene rubber (CR), isoprene rubber (IR), isobutene isoprene rubber , IIR), acrylonitrile-butadiene rubber (NBR), ethylene propylene rubber (EPR), ethylene propylene diene monomer rubber, acrylic rubber, silicone rubber, It may be at least one selected from the group consisting of fluororubber and urethane rubber, but is not limited thereto. Meanwhile, in the case of an impact modifier such as the polycaprolactone-polyamine copolymer, dispersibility of the insulating heat-radiating filler and miscibility with the polymer matrix may be further improved.

In addition, the impact modifier may be an elastic particle having a core/shell structure. For example, an allyl-based resin may be used for the core, and the shell portion may be a polymer resin having a functional group capable of reacting to increase compatibility and bonding strength with a thermoplastic polymer compound.

In addition, the impact modifier may be included in an amount of 0.5 to 200 parts by weight based on 100 parts by weight of the heat radiation filler, but is not limited thereto.

In addition, the antioxidant is provided to prevent breaking of the main chain of a polymer matrix forming a polymer matrix by shear during extrusion or injection, for example, a thermoplastic polymer compound, and to prevent thermal discoloration. As the antioxidant, known antioxidants may be used without limitation, and as non-limiting examples thereof, tris (nonyl phenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite, bis (2 organophosphites such as ,4-di-t-butylphenyl)pentaerythritol diphosphite, distearyl pentaerythritol diphosphite or the like; alkylated monophenols or polyphenols; alkylated reaction products of polyphenols with dienes, such as tetrakis[methylene(3,5-di-tert-butyl-4-hydroxyhydrocinnamate)] methane, or the like; butylated reaction products of para-cresol or dicyclopentadiene; alkylated hydroquinones; hydroxylated thiodiphenyl ether; alkylidene-bisphenol; benzyl compounds; esters of monohydric or polyhydric alcohols with beta-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid; octadecyl-3-(3,5-di-tert-butyl-l-4-hydroxyphenyl)propionate; pentaerythrityl-tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; Benzenepropanoic acid with 3-(1,1-dimethylethyl)-4-hydroxy-5-methyl-,2,4,8,10-tetraoxaspiro[5,5]undecane-3,9- Esters of diylbis(2,2-dimethyl-2,1-2,1-ethanediyl) (Benzenepropanoic acid, 3-(1,1-dimethylethyl)-4-hydroxy-5-methyl-, 2,4,8 ,10-tetraoxaspiro[5.5]undecane-3,9-diylbis(2,2-dimethyl-2,1-ethanediyl) ester); esters of monohydric or polyhydric alcohols with beta-(5-tert-butyl-4-hydroxy-3-methylphenyl)-propionic acid; Distearylthiopropionate, dilaurylthiopropionate, ditridecylthiopropionate, neopentanetetrayl 3-(dodecylthio)propionate or other similar esters of thioalkyl or thioaryl compounds such as those; amides of beta-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionic acid or the like, or mixtures thereof. The antioxidant may be provided in an amount of 0.01 to 0.5 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, the heat stabilizer may be used without limitation in the case of known heat stabilizers, but non-limiting examples thereof include triphenyl phosphite, tris-(2,6-dimethylphenyl) phosphite, tris-(mixed mono- and dinonylphenyl) phosphite (tris-(mixed mono-and di-nonylphenyl)phosphate), bis(2,6-di-ter-butyl-4-methylphenyl)pentaerythtol-diphosphate (Bis(2, organic phosphites such as 6-di-ter-butyl-4-methylphenyl)pentaerythritol-diphosphite) or the like; phosphonates such as dimethylbenzene phosphonate or the like, phosphates such as trimethyl phosphate, or the like, or mixtures thereof. The heat stabilizer may be included in an amount of 0.01 to 0.5 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, the light stabilizer may be used without limitation in the case of known light stabilizers, but non-limiting examples thereof include 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5 benzotriazoles such as -tert-octylphenyl)-benzotriazole and 2-hydroxy-4-n-octoxy benzophenone or the like or mixtures thereof. The light stabilizer may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, the plasticizer may be used without limitation in the case of known plasticizers, but non-limiting examples thereof include dioctyl-4,5-epoxy-hexahydrophthalate, tris-(octoxycarbonylethyl) isocyanurate, phthalic acid esters such as tristearin, epoxidized soybean oil or the like, or mixtures thereof. The plasticizer may be included in an amount of 0.5 to 3.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, if the dispersant is a known dispersant capable of improving the dispersibility of the insulating heat-radiating filler, it may be used without limitation, and as an example thereof, it may be a siloxane having an alkoxy and an alkyl group as a functional group. The content of the dispersant may vary depending on the type and content of the insulating heat-dissipating filler to be added, so the present invention is not particularly limited thereto. It may be included in parts by weight.

In addition, as the antistatic agent, known antistatic agents may be used without limitation, and as non-limiting examples thereof, glycerol monostearate, sodium stearyl sulfonate, sodium dodecylbenzenesulfonate, polyether block amides, or mixtures thereof, including, for example, BASF under the tradename Irgastat; Arkema under the trade name PEBAX; and from Sanyo Chemical industries under the trade name Pelestat. The antistatic agent may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, the work improver may use a known work improver without limitation, and as non-limiting examples thereof, metal stearate, stearyl stearate, pentaerythritol tetrastearate, beeswax, montan wax (montan wax), paraffin wax, polyethylene wax or the like or mixtures thereof. The work improver may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, as the UV absorber, known UV absorbers may be used without limitation, and non-limiting examples thereof include hydroxybenzophenone; hydroxybenzotriazole; hydroxybenzotriazine; cyanoacrylate; oxanilides; benzoxazinones; 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3,-tetramethylbutyl)-phenol; 2-hydroxy-4-n-octyloxybenzophenone; 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(octyloxy)-phenol; 2,2'-(1,4-phenylene)bis(4H-3,1-benzoxazin-4-one); 1,3-bis[(2-cyano-3,3-diphenylacryloyl)oxy]-2,2-bis[[(2-cyano-3,3-biphenylacryloyl)oxy] methyl]propane; 2,2'-(1,4-phenylene) bis(4H-3,1-benzoxazin-4-one); 1,3-bis[(2-cyano-3,3-diphenylacryloyl)oxy]-2,2-bis[[(2-cyano-3,3-diphenylacryloyl)oxy] methyl]propane; nano-sized inorganic materials such as titanium oxide, cerium oxide and zinc oxide having a particle size of less than 100 nm; or the like, or mixtures thereof. The UV absorber may be included in an amount of 0.01 to 3.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, known coupling agents may be used as the coupling agent without limitation, and as an example thereof, a silane-based coupling agent and/or maleic acid-grafted polypropylene may be used. The coupling agent may be included in an amount of 0.01 to 10.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.

In addition, the flame retardant is, for example, a halogenated flame retardant, similar tetrabromo bisphenol A oligomers such as BC58 and BC52 (like tretabromo bisphenol A oligomers), brominated polystyrene or poly(dibromo-styrene), brominated epoxy, Decabromodiphenylene oxide, pentabromobenzyl acrylate monomer, pentabromobenzyl acrylate polymer, ethylene-bis(tetrabromophthalimide, bis(pentabromobenzyl)ethane, Mg(OH) ₂ and Al( Metal hydroxides such as OH) ₃ , melamine cyanurate, phosphor-based FR systems such as red phosphorus, melamine polyphosphates, phosphate esters, metal phosphinates, ammonium polyphosphates, expandable graphite , sodium or potassium perfluorobutane sulfate, sodium or potassium perfluorooctane sulfate, sodium or potassium diphenylsulfonesulfonate and sodium- or potassium-2,4,6,-trichlorobenzoate and N-(p- Tolylsulfonyl)-p-toluenesulfimide potassium salt, N-(N'-benzylaminocarbonyl) sulfanylimide potassium salt, or mixtures thereof, but is not limited thereto. 0.1 to 50 parts by weight based on 100 parts by weight of the polymer compound forming the may be included.

The above-described insulating heat-dissipating composite material 1000 according to an embodiment of the present invention includes a polymer compound forming a polymer matrix and an insulating heat-dissipating filler, and a composition further provided with other additives is stirred through a conventional method and then mixed with a solvent. It may be melted or melted, subjected to a known molding method such as injection or compression, and then subjected to a solidification process such as drying and/or cooling to be implemented as an insulating heat dissipation composite material. In the case of a specific manufacturing method, since the method and the conditions according to the method can be designed differently according to the specific type of polymer compound forming the polymer matrix, the present invention is not particularly limited thereto.

Meanwhile, as shown in FIGS. 2 and 3 , in order to implement an insulating heat dissipation composite material 1001 or 1002 having more improved mechanical strength, the metal core in the polymer matrix 201 or 202 having an insulating heat radiation filler 101 or 102 is provided. Layers 300 and 301 are provided.

Since the description of the insulating heat-dissipating fillers 101 and 102 and the polymer matrix 201 and 202 is the same as the description of the insulating heat-dissipating filler 100 and the polymer matrix 200 in the description of FIG. 1, a detailed description thereof will be omitted.

The metal core layers 300 and 301 exhibit predetermined heat dissipation performance while securing mechanical strength to the insulating heat dissipation composites 1001 and 1002 . The metal core layers 300 and 301 have good compatibility with the polymer matrices 201 and 202, have excellent mechanical strength even at a small thickness without separating the interface between the polymer matrix 201 and 202 and the metal core layer 300, and can be injection molded. In the case of a metal material having heat resistance to the extent possible and having a predetermined thermal conductivity at the same time, it can be used without limitation. As a non-limiting example, the metal core layer 300 may be one metal selected from the group consisting of aluminum, magnesium, iron, titanium, and copper, or an alloy containing at least one metal.

In addition, the metal core layers 300 and 301 may be provided so that the entire surface is surrounded by the polymer matrix 201 (see FIG. 2), or may be provided in the polymer matrix 202 so that the lower surface of the metal core layer 301 is exposed, (See FIG. 3 ), when at least three surfaces of the metal core layers 300 and 301 are in contact with the polymer matrix 201 and 202, the specific positions of the metal core layers 300 and 301 within the polymer matrix 200 are not limited in the present invention.

In addition, the thickness of the metal core layers 300 and 301 may be 0.5 to 90% of the total thickness of the insulating heat dissipation composites 1001 and 1002 . If the thickness of the metal core layer (300,301) is less than 0.5% of the total thickness of the insulating heat dissipation composite (1000,1001), it may be difficult to secure the desired level of mechanical strength, and if it exceeds 90%, the desired level It is difficult to express heat dissipation performance, especially radiation characteristics, and formability into complex shapes may be deteriorated. In addition, the thicker metal core layer greatly increases the volume resistance of the insulating heat-dissipating composite, which significantly reduces insulation, which may make it difficult to use in electronic devices or parts that require insulation.

In addition, the metal core layers 300 and 301 have a bar shape having a predetermined aspect ratio, a plate shape having a predetermined area, or a plurality of wires or bars spaced apart at predetermined intervals inside an edge wire or bar having a predetermined shape such as a square or a circle. It can be a shape having a parallel structure, a lattice structure, a honeycomb structure, and various structures in which these are mutually combined.

On the other hand, the insulating heat dissipation composite (1001, 1002) may further include a protective coating layer (401, 402) provided on the outer surface of the polymer matrix (201, 202), the protective coating layer (401, 402) to improve the radiation characteristics of the insulating heat dissipation It may be a coating layer, and a detailed description thereof replaces the description of the protective coating layer 400 of FIG. 1 .

Meanwhile, when one surface of the metal core layer 301 is exposed as shown in FIG. 3, the protective coating layer 401 is provided on the outer surface of the polymer matrix 202 including the exposed surface of the metal core layer 301. can

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments presented herein, and those skilled in the art who understand the spirit of the present invention may add elements within the scope of the same spirit. However, other embodiments can be easily proposed by means of changes, deletions, additions, etc., but these will also fall within the scope of the present invention.

100,101,102: Insulating heat radiation filler 200,201,202: Polymer matrix
300,301: metal core layer 1000,1001,1002: insulating heat dissipation composite

Claims (14)

A polymer matrix as a body;
Dispersed in the polymer matrix, 43 to 435 parts by weight based on 100 parts by weight of the polymer matrix, magnesium oxide, talc, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, Contains at least one selected from the group consisting of strontium titanate, beryllium oxide, silicon carbide, and manganese oxide, and has an average particle diameter of 10 nm ~ 600 μm insulating heat dissipation filler; and
An insulating heat-dissipating composite comprising: 0.5 to 200 parts by weight based on 100 parts by weight of the insulating heat-dissipating filler, and an impact modifier that is a polycaprolactone-polyamine copolymer. A polymer matrix as a body;
a metal core layer provided so that the front surface is located inside the polymer matrix or the other surface except for one side is located inside the polymer matrix;
Dispersed in the polymer matrix, 43 to 435 parts by weight based on 100 parts by weight of the polymer matrix, magnesium oxide, talc, titanium dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, Contains at least one selected from the group consisting of strontium titanate, beryllium oxide, silicon carbide, and manganese oxide, and has an average particle diameter of 10 nm ~ 600 μm insulating heat dissipation filler; and
An insulating heat-dissipating composite comprising: 0.5 to 200 parts by weight based on 100 parts by weight of the insulating heat-dissipating filler, and an impact modifier that is a polycaprolactone-polyamine copolymer. delete According to claim 1 or 2,
An insulating heat-dissipating composite material further comprising an insulating heat-dissipating coating layer on an outer surface. A heat dissipation housing comprising the insulating heat dissipation composite according to claim 1 or claim 2. delete delete delete delete delete delete delete delete delete

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