KR102482981B1 - Paint composition containing specific compound and process for forming a durable coating layer using the same - Google Patents

Paint composition containing specific compound and process for forming a durable coating layer using the same Download PDF

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KR102482981B1
KR102482981B1 KR1020210088722A KR20210088722A KR102482981B1 KR 102482981 B1 KR102482981 B1 KR 102482981B1 KR 1020210088722 A KR1020210088722 A KR 1020210088722A KR 20210088722 A KR20210088722 A KR 20210088722A KR 102482981 B1 KR102482981 B1 KR 102482981B1
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weight
formula
parts
adhesive resin
compound represented
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KR1020210088722A
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Korean (ko)
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한규택
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윤경찬
케이알엠 주식회사
주식회사 한국방재안전기술
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Priority to KR1020220153068A priority patent/KR20230011259A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08Anti-corrosive paints
    • C09D5/10Anti-corrosive paints containing metal dust
    • C09D5/103Anti-corrosive paints containing metal dust containing Al
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/46Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
    • C04B41/48Macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515Other specific metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515Other specific metals
    • C04B41/5155Aluminium
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/60After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
    • C04B41/61Coating or impregnation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/29Compounds containing one or more carbon-to-nitrogen double bonds
    • C08K5/30Hydrazones; Semicarbazones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45Heterocyclic compounds having sulfur in the ring
    • C08K5/46Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C08K5/47Thiazoles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00Coating compositions based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08Anti-corrosive paints
    • C09D5/082Anti-corrosive paints characterised by the anti-corrosive pigment
    • C09D5/084Inorganic compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08Anti-corrosive paints
    • C09D5/10Anti-corrosive paints containing metal dust
    • C09D5/106Anti-corrosive paints containing metal dust containing Zn
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/63Additives non-macromolecular organic

Abstract

The present invention relates to a paint composition for corrosion prevention and durability enhancement of a structure, comprising: a powder mixture consisting of 0.8% by weight of zinc, 0.06 to 0.11% by weight of phosphorus and the balance of aluminum (Al); and an adhesive resin in which the powder mixture is uniformly dispersed, wherein the adhesive resin further includes 0.1 to 0.2 parts by weight of a compound represented by chemical formula 1, and 0.1 to 0.2 parts by weight of a compound represented by chemical formula 2, and 0.1 to 0.2 parts by weight of a compound represented by chemical formula 3, respectively, based on 100 parts by weight of the adhesive resin.

Description

특정 화합물을 포함하는 도료 조성물 및 이를 이용한 내구성 피막 접착공법{Paint composition containing specific compound and process for forming a durable coating layer using the same}Paint composition containing specific compound and process for forming a durable coating layer using the same}

본 발명은 철재 구조물이나 콘크리트 구조물의 부식 방지 및 내구성 증진을 위한 도료 조성물 및 이를 이용한 피막 접착공법에 관한 것으로서, 더욱 상세하게는 상온에서도 간단하게 시공할 수 있고, 물성이 우수한 내식 피막을 균일하게 형성할 수 있는 도료 조성물 및 이를 이용한 피막 접착공법에 관한 것이다.The present invention relates to a coating composition for preventing corrosion and enhancing durability of a steel structure or concrete structure and a film bonding method using the same, and more particularly, to a coating composition that can be simply applied at room temperature and uniformly forms a corrosion-resistant film with excellent physical properties. It relates to a coating composition that can be used and a film adhesion method using the same.

일반적으로 철재 구조물이나 콘크리트 구조물은 대부분 수분과 대기 등의 부식환경에 노출되므로, 부식을 방지할 수 있도록 그 표면을 방식처리하는 방법이 사용되고 있다.In general, steel structures or concrete structures are mostly exposed to corrosive environments such as moisture and air, and thus, a method of anticorrosive treatment of the surface is used to prevent corrosion.

예를 들어, 철재 구조물이나 콘크리트 구조물의 표면에 에폭시계, 비닐에스테르계, 불소수지계, 아크릴고무계, 염화고무계 등의 도료를 이용하여 피막을 형성하는 방법이 개발되었다. 그러나, 이들은 유기질계 도료이기 때문에 초기 성능은 우수하지만 열팽창계수나 신장률 등의 변형특성이 구조물과 차이를 나타낸다. 따라서, 시간이 경과함에 따라 형성된 피막이 구조물로부터 탈락되어 접착강도가 저하되는 문제점이 있다. For example, a method of forming a film on the surface of a steel structure or concrete structure by using an epoxy-based, vinyl ester-based, fluororesin-based, acrylic rubber-based, or chlorinated rubber-based paint has been developed. However, since these are organic paints, they have excellent initial performance, but show differences in deformation characteristics such as thermal expansion coefficient and elongation from structures. Therefore, there is a problem in that the formed film is detached from the structure over time and the adhesive strength is lowered.

이러한 문제점을 해결하기 위하여 본 출원인은 크롬, 니켈 등의 금속성분을 첨가하고 알루미늄을 주재료로 하는 금속 혼합물 분말 함유 도료 조성물을 이용한 산화알루미늄 피막 접착공법을 제안하였다(대한민국 특허 제10-0503561호 참조). 상기 금속 혼합물 분말 함유 도료 조성물을 이용하면 부착강도, 신장성 등의 물성이 우수한 내식 알루미늄 피막을 형성할 수 있다. 그러나, 크롬과 니켈의 부재료를 첨가한 도료 조성물은 강도는 좋으나 중량이 커서 피막 형성시 시간이 경과함에 따라 도막의 처짐 및 흐름 현상에 일조하는 문제점이 있다.In order to solve this problem, the present applicant proposed an aluminum oxide film bonding method using a paint composition containing a metal mixture powder containing aluminum as a main material and adding metal components such as chromium and nickel (Refer to Korean Patent No. 10-0503561) . When the coating composition containing the metal mixture powder is used, a corrosion-resistant aluminum film having excellent physical properties such as adhesion strength and elongation can be formed. However, the coating composition with the addition of chromium and nickel as sub-materials has good strength but a large weight, which contributes to sagging and flow of the coating film over time during film formation.

따라서, 시간 경과에 따른 피막의 처짐성을 개선하면서 접착강도를 더욱 개선시킨 조성물에 대한 요구는 계속되고 있다.Therefore, there is a continuing demand for a composition with further improved adhesive strength while improving the deflection of the film over time.

본 발명이 이루고자 하는 기술적 과제는 상기한 문제점을 해결하기 위한 것으로서, 시간 경과에 따른 피막의 처짐성을 개선하면서 접착강도를 더욱 개선시켜 내구성이 향상된 도료 조성물을 제공하는데 있다.A technical problem to be achieved by the present invention is to solve the above problems, and to provide a coating composition with improved durability by further improving adhesive strength while improving film sagging over time.

본 발명이 이루고자 하는 다른 기술적 과제는 상기 도료 조성물을 이용한 피막 접착공법을 제공하는데 있다.Another technical problem to be achieved by the present invention is to provide a film adhesion method using the coating composition.

상기 기술적 과제를 해결하기 위하여 본 발명에 따라 아연 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물; 및 상기 분말 혼합물이 균일하게 분산된 접착수지;로 구성된, 구조물의 부식 방지 및 내구성 증진을 위한 도료 조성물은,In order to solve the above technical problem, according to the present invention, a powder mixture consisting of 0.8% by weight of zinc, 0.06 to 0.11% by weight of phosphorus, and the remaining amount of aluminum (Al); And an adhesive resin in which the powder mixture is uniformly dispersed; a coating composition for preventing corrosion and enhancing durability of a structure,

상기 접착수지는 접착수지 100 중량부를 기준으로 The adhesive resin is based on 100 parts by weight of the adhesive resin

하기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부,0.1 to 0.2 parts by weight of a compound represented by Formula 1 below;

하기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및0.1 to 0.2 parts by weight of a compound represented by Formula 2 below, and

하기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 포함한다. 0.1 to 0.2 parts by weight of a compound represented by Formula 3 below.

<화학식 1><Formula 1>

Figure 112022071491123-pat00033
Figure 112022071491123-pat00033

<화학식 2><Formula 2>

Figure 112022071491123-pat00034
Figure 112022071491123-pat00034

<화학식 3><Formula 3>

Figure 112021078059916-pat00003
Figure 112021078059916-pat00003

본 발명의 도료 조성물에 있어서, 상기 접착수지는 상기 접착수지 100 중량부를 기준으로 하기 화학식 4로 표시되는 화합물 0.05 내지 0.1 중량부를 더 포함할 수 있다.In the paint composition of the present invention, the adhesive resin may further include 0.05 to 0.1 parts by weight of a compound represented by Formula 4 based on 100 parts by weight of the adhesive resin.

<화학식 4><Formula 4>

Figure 112021078059916-pat00004
Figure 112021078059916-pat00004

상기 다른 기술적 과제를 달성하기 위하여 본 발명의 피막 접착공법은,In order to achieve the above other technical problem, the film bonding method of the present invention,

(a) 아연(Zn) 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물을 준비하는 단계; 및(a) preparing a powder mixture consisting of 0.8% by weight of zinc (Zn), 0.06 to 0.11% by weight of phosphorus, and the balance of aluminum (Al); and

(b) 상기 준비된 분말 혼합물을, 접착수지와 상기 접착수지 100 중량부를 기준으로 하기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부, 하기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및 하기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 더 혼합한 복합 접착수지에 균일하게 분산시키고, 구조물 표면에 분사하여 피막을 형성하는 단계;를 포함한다. (b) 0.1 to 0.2 parts by weight of a compound represented by Formula 1, 0.1 to 0.2 parts by weight of a compound represented by Formula 2, and Formula 3 below, based on 100 parts by weight of an adhesive resin and the adhesive resin. and uniformly dispersing 0.1 to 0.2 parts by weight of the indicated compound in the further mixed composite adhesive resin and spraying it on the surface of the structure to form a film.

<화학식 1><Formula 1>

Figure 112022071491123-pat00035
Figure 112022071491123-pat00035

<화학식 2><Formula 2>

Figure 112022071491123-pat00036
Figure 112022071491123-pat00036

<화학식 3><Formula 3>

Figure 112021078059916-pat00007
Figure 112021078059916-pat00007

본 발명의 피막 접착공법에 있어서, 접착수지 100 중량부를 기준으로, 상기 복합 접착수지에 하기 화학식 4로 표시되는 화합물 0.05 내지 0.1 중량부를 더 혼합할 수 있다. In the film bonding method of the present invention, based on 100 parts by weight of the adhesive resin, 0.05 to 0.1 parts by weight of the compound represented by Formula 4 may be further mixed with the composite adhesive resin.

<화학식 4><Formula 4>

Figure 112021078059916-pat00008
Figure 112021078059916-pat00008

본 발명에 따른 도료 조성물을 이용하여 철재와 같은 구조물 표면에 피막을 형성시 부착강도가 개선되고 내굴곡성 등의 물성도 양호하며, 피막의 처짐성 등도 개선되므로, 구조물의 보호에 효과적으로 사용될 수 있다. When forming a film on the surface of a structure such as a steel material using the coating composition according to the present invention, the adhesion strength is improved, the physical properties such as bending resistance are good, and the sagging property of the film is also improved, so it can be effectively used for protection of structures.

이하 본 발명에 대하여 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. Hereinafter, the present invention will be described in detail. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to the usual or dictionary meaning, and the inventor appropriately uses the concept of the term in order to explain his/her invention in the best way. It should be interpreted as a meaning and concept consistent with the technical idea of the present invention based on the principle that it can be defined.

본 발명에 따른 도료 조성물은 아연 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물; 및 상기 분말 혼합물이 균일하게 분산된 접착수지;로 구성된, 구조물의 부식 방지 및 내구성 증진을 위한 도료 조성물로서,The coating composition according to the present invention is a powder mixture consisting of 0.8% by weight of zinc, 0.06 to 0.11% by weight of phosphorus and the balance of aluminum (Al); And an adhesive resin in which the powder mixture is uniformly dispersed. As a coating composition for preventing corrosion and enhancing durability of structures,

상기 접착수지는 접착수지 100 중량부를 기준으로 The adhesive resin is based on 100 parts by weight of the adhesive resin

하기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부,0.1 to 0.2 parts by weight of a compound represented by Formula 1 below;

하기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및0.1 to 0.2 parts by weight of a compound represented by Formula 2 below, and

하기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 포함한다. 0.1 to 0.2 parts by weight of a compound represented by Formula 3 below.

<화학식 1><Formula 1>

Figure 112022071491123-pat00037
Figure 112022071491123-pat00037

<화학식 2><Formula 2>

Figure 112022071491123-pat00038
Figure 112022071491123-pat00038

<화학식 3><Formula 3>

Figure 112021078059916-pat00011
Figure 112021078059916-pat00011

이미 알려진 바와 같이, 접착수지에 분산된 분말 혼합물의 주성분인 알루미늄은 빠르게 산화되어 산화알루미늄(Al2O3) 피막을 형성한다. 산화알루미늄 피막은 산소나 수분 등 철재나 콘크리트 구조물을 부식시킬 수 있는 외부환경과의 접촉을 차단한다. As is already known, aluminum, which is the main component of the powder mixture dispersed in the adhesive resin, is rapidly oxidized to form an aluminum oxide (Al 2 O 3 ) film. The aluminum oxide film blocks contact with the external environment, such as oxygen or moisture, that can corrode steel or concrete structures.

알루미늄 분말에 혼합된 0.8 중량%의 아연 성분은 피막의 내마모성과 내후성의 향상에 기여한다. 0.8% by weight of the zinc component mixed with the aluminum powder contributes to the improvement of the wear resistance and weather resistance of the film.

또한, 본 발명의 분말 혼합물에는 인(P)이 0.06 내지 0.11중량% 포함되는데, 첨가된 인은 전술한 금속 분말들이 접착수지에 균일하게 분산되도록 도움을 주며, 아울러 산화알루미늄 피막의 균일성과 견고성을 향상시키는 기능을 한다. In addition, the powder mixture of the present invention contains 0.06 to 0.11% by weight of phosphorus (P), and the added phosphorus helps to uniformly disperse the above-mentioned metal powders in the adhesive resin, and also improves the uniformity and durability of the aluminum oxide film. function to improve.

전술한 분말 혼합물들은 구조물 표면에 고착시킬 수 있도록 적절한 접착수지와 혼합시켜 균일하게 분산시킨 다음, 분사, 도포된다. 이러한 접착수지는 적용방법에 따라 점도를 조절하여 사용할 수 있는데, 접착성 및 탄성이 우수한 폴리우레탄 수지 또는 에폭시 수지를 사용하는 것이 잘 알려져 있다. 특히 폴리우레탄 수지는 염화물 및 탄산가스에 대한 침투억제 성능이 우수하며, 내약품성, 수분 및 산소 등의 내침투성도 양호하다. 이 외에 포름 알데이드 수지, 에틸렌비닐아세테이트 공중합체 수지 등의 다른 접착수지 성분이 더 포함될 수 있다.The powder mixtures described above are mixed with an appropriate adhesive resin to be adhered to the surface of the structure, uniformly dispersed, and then sprayed and applied. Such an adhesive resin may be used by adjusting the viscosity according to the application method, and it is well known to use a polyurethane resin or an epoxy resin having excellent adhesiveness and elasticity. In particular, the polyurethane resin has excellent permeation inhibition performance for chloride and carbon dioxide gas, and also has good chemical resistance and permeability resistance to moisture and oxygen. In addition, other adhesive resin components such as formaldehyde resin and ethylene vinyl acetate copolymer resin may be further included.

본 발명의 도료 조성물에 있어서, 상기 접착수지는 접착수지 100 중량부를 기준으로 상기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부, 상기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및 상기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 더 포함한다.In the coating composition of the present invention, the adhesive resin is 0.1 to 0.2 parts by weight of the compound represented by Formula 1, 0.1 to 0.2 parts by weight of the compound represented by Formula 2, and the compound represented by Formula 3, based on 100 parts by weight of the adhesive resin. It further includes 0.1 to 0.2 parts by weight of the compound to be.

화학식 1 및 화학식 2로 표시되는 화합물들은 강직한 화학구조를 가지고 있고, 이들 화합물들은 인공적인 또는 태양광의 자외선에 의해 경화반응을 일으켜 견고해지므로, 피막의 접착 강도가 증대될 뿐만 아니라 피막의 처짐성도 개선된다. 더불어, 화학식 3으로 표시되는 화합물은 보수층의 강도를 더욱 개선한다.The compounds represented by Formulas 1 and 2 have rigid chemical structures, and these compounds are hardened by a curing reaction by artificial or sunlight ultraviolet rays, so that not only the adhesive strength of the film increases, but also the sagging of the film. Improved. In addition, the compound represented by Formula 3 further improves the strength of the repair layer.

본 발명의 도료 조성물에 있어서, 상기 접착수지는 상기 접착수지 100 중량부를 기준으로 하기 화학식 4로 표시되는 화합물 0.05 내지 0.1 중량부를 더 포함하는 것이 전술한 화합물의 기능을 더 증진시키는데 바람직하다.In the coating composition of the present invention, the adhesive resin preferably further comprises 0.05 to 0.1 parts by weight of a compound represented by Formula 4 based on 100 parts by weight of the adhesive resin to further enhance the function of the above-mentioned compound.

<화학식 4><Formula 4>

Figure 112021078059916-pat00012
Figure 112021078059916-pat00012

또한, 본 발명의 도료 조성물에 있어서, 상기 접착수지는 상기 접착수지 100 중량부를 기준으로 하기 화학식 5로 표시되는 화합물 0.05 내지 0.1 중량부를 더 포함하면, 전술한 효과를 더욱 증대시킬 수 있다.In addition, in the coating composition of the present invention, when the adhesive resin further includes 0.05 to 0.1 parts by weight of a compound represented by Formula 5 based on 100 parts by weight of the adhesive resin, the above effect can be further increased.

<화학식 5><Formula 5>

Figure 112021078059916-pat00013
Figure 112021078059916-pat00013

이들 화학식 4 및 5로 표시되는 화합물들 역시 강직한 화학구조를 가지고 있고, 이들 화합물들은 특히 보수층 표면에서 인공적인 자외선 광 또는 태양광의 자외선에 의해 경화반응을 일으켜 견고해지므로, 화학식 1 및 화학식 2의 화합물과 병용시 피막의 접착 강도 증대와 피막 처짐성 개선에 더욱 기여한다. The compounds represented by Chemical Formulas 4 and 5 also have rigid chemical structures, and these compounds are hardened by a hardening reaction caused by artificial ultraviolet light or ultraviolet light of sunlight, especially on the surface of the repair layer. When used in combination with a compound, it contributes to increasing the adhesive strength of the coating and improving the sagging of the coating.

특히, 화학식 5로 표시되는 화합물을 H자 형의 강직한 화학구조를 가지고 있어 전술한 효과를 더욱 증대시킬 수 있다.In particular, since the compound represented by Chemical Formula 5 has an H-type rigid chemical structure, the aforementioned effect can be further enhanced.

본 발명의 피막 접착공법은, The film bonding method of the present invention,

(a) 아연(Zn) 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물을 준비하는 단계; 및(a) preparing a powder mixture consisting of 0.8% by weight of zinc (Zn), 0.06 to 0.11% by weight of phosphorus, and the balance of aluminum (Al); and

(b) 상기 준비된 분말 혼합물을, 접착수지와 상기 접착수지 100 중량부를 기준으로 상기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부,상기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및 상기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 더 혼합한 복합 접착수지에 균일하게 분산시키고, 구조물 표면에 분사하여 피막을 형성하는 단계;를 포함한다.(b) the prepared powder mixture, 0.1 to 0.2 parts by weight of the compound represented by Formula 1, 0.1 to 0.2 parts by weight of the compound represented by Formula 2, and the above Formula 3 based on 100 parts by weight of the adhesive resin and the adhesive resin. and uniformly dispersing 0.1 to 0.2 parts by weight of the indicated compound in the further mixed composite adhesive resin and spraying it on the surface of the structure to form a film.

상기 복합 접착수지는 접착수지 100 중량부를 기준으로, 상기 화학식 4으로 표시되는 화합물 0.05 내지 0.1 중량부를 더 혼합할 수 있고, 상기 접착수지 100 중량부를 기준으로 상기 화학식 5로 표시되는 화합물 0.05 내지 0.1 중량부를 더 포함할 수 있다.The composite adhesive resin may further mix 0.05 to 0.1 parts by weight of the compound represented by Chemical Formula 4 based on 100 parts by weight of the adhesive resin, and 0.05 to 0.1 parts by weight of the compound represented by Chemical Formula 5 based on 100 parts by weight of the adhesive resin. Wealth may be further included.

분말 혼합물과 복합 접착수지의 혼합비는 0.2:10 ~ 3:10 정도가 바람직하며 피막 분사를 위해 적절한 용제에 분산 및 용해시킨 도포액을 분사하면 대기 중 상온에서 건조 및 자연경화되어 피막이 형성되므로 매우 간단하고 경제적으로 시공할 수 있다. 피막 형성 후 자외선 발생기를 이용하여 화학식으로 표시된 화합물들을 경화시킬 수 있으나, 태양광에 포함된 자외선에 의해 점차 경화되도록 할 수 있다.The mixing ratio of the powder mixture and the composite adhesive resin is preferably about 0.2:10 to 3:10. When spraying a coating solution dispersed and dissolved in an appropriate solvent for coating spraying, it is dried and cured naturally at room temperature in the air to form a coating, which is very simple. and can be built economically. After forming the film, the compounds represented by the formula may be cured using an ultraviolet ray generator, but may be gradually cured by ultraviolet rays included in sunlight.

형성되는 피막은 1회 도포를 기준으로 100㎛ 이하의 두께로 형성하는 것이 바람직한데, 필요에 따라 이와 같은 피막층을 수회 적층하여 형성하거나, 본 발명에 따른 도료 조성물로 형성된 피막층과 통상적인 접착수지 또는 본 발명의 복합 접착수지만으로 이루어진 피막층을 교호로 수회 형성하므로서 더욱 강력한 피막층을 형성할 수도 있다.The formed film is preferably formed to a thickness of 100 μm or less based on one application. If necessary, it is formed by laminating such a film layer several times, or a film layer formed of the coating composition according to the present invention and a conventional adhesive resin or A stronger coating layer can be formed by alternately forming coating layers made of only the composite adhesive resin of the present invention several times.

이와 같은 공법으로 형성된 피막은 부착강도가 개선되고 내굴곡성 등의 물성도 양호하며, 피막의 처짐성 등도 개선된다. 또한, 철재나 콘크리트 구조물의 부식 원인인 염화물 이온, 아황산 가스, 수분, 산소 등의 침투에 대한 뛰어난 방호력을 보일 수 있다. The film formed by this method has improved adhesion strength, good physical properties such as bending resistance, and improved sagging property of the film. In addition, it can show excellent protection against penetration of chloride ions, sulfurous acid gas, moisture, oxygen, etc., which are causes of corrosion of steel or concrete structures.

이하, 본 발명을 구체적으로 설명하기 위해 실시예를 들어 상세하게 설명하기로 한다. 그러나, 본 발명에 따른 실시예들은 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예들에 한정되는 것으로 해석되어져서는 안된다. 본 발명의 실시예들은 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되어지는 것이다.Hereinafter, examples will be described in detail to explain the present invention in detail. However, the embodiments according to the present invention can be modified in many different forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

[화학식 1 화합물의 합성][Synthesis of Formula 1 Compound]

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

Figure 112021078059916-pat00014
Figure 112021078059916-pat00014

300ml의 4구 플라스크에 4-히드록시신남산tert부틸(1-c-43a) 10.08g(45.4㎜ol), N,N-디메틸포름아미드 100ml, 탄산칼륨 9.4g을 더하고 10분간 교반했다. 이 혼합물 중에 아크릴산-6-클로로헥실 10.1g(53㎜ol)을 더하고, 90℃에서 6시간 교반했다. 이 반응 혼합물을 10℃로 냉각하고, 물 100ml를 더하고 1시간 교반했다. 이 혼합물을 여과하여, 조생성물을 고체로서 얻었다. 이 고체를 아세톤 25ml에 녹이고, 메탄올 45ml 중에 적하하고 0℃로 냉각했다. 발생한 고체를 여과하고, 다시 아세톤 12ml에 용해하고, 헥산 25ml 중에 적하하고 0℃로 냉각했다. 얻어진 고체를 여과, 건조함으로써, 화합물 1-1이 8.56g 얻어졌다(수율 50%).10.08 g (45.4 mmol) of 4-hydroxycinnamic acid tertbutyl (1-c-43a), 100 ml of N,N-dimethylformamide, and 9.4 g of potassium carbonate were added to a 300 ml four-neck flask, and the mixture was stirred for 10 minutes. In this mixture, 10.1 g (53 mmol) of 6-chlorohexyl acrylate was added, and the mixture was stirred at 90°C for 6 hours. The reaction mixture was cooled to 10°C, 100 ml of water was added, and the mixture was stirred for 1 hour. The mixture was filtered to obtain the crude product as a solid. This solid was dissolved in 25 ml of acetone, dropped into 45 ml of methanol, and cooled to 0°C. The generated solid was filtered, dissolved again in 12 ml of acetone, added dropwise into 25 ml of hexane, and cooled to 0°C. By filtering and drying the obtained solid, 8.56 g of compound 1-1 was obtained (yield 50%).

200ml의 3구 플라스크에 화합물 1-1 8.5g, 디클로로메탄 22ml를 더하고 교반했다. 이 혼합물 중에 포름산 22ml를 적하하고, 40℃에서 5시간 교반했다. 이 반응 혼합물을 30도 이하로 냉각하고, 디클로로메탄 50ml를 더했다. 유기층을 분리하고, 물 70ml로 4회, 포화 식염수 70ml로 1회 세정했다. 얻어진 용액을 황산나트륨으로 건조했다. 황산나트륨을 여과 분별한 후, 용매를 증류 제거했다. 얻어진 고체에 헥산 10ml와 톨루엔 4ml를 더하고 실온에서 30분 교반했다. 이 혼합물을 여과, 건조함으로써 화합물 1-2가 6.30g 얻어졌다(수율 87%).8.5 g of compound 1-1 and 22 ml of dichloromethane were added to a 200 ml three-necked flask and stirred. 22 ml of formic acid was dripped into this mixture, and it stirred at 40 degreeC for 5 hours. The reaction mixture was cooled to 30 degrees or less, and 50 ml of dichloromethane was added. The organic layer was separated and washed 4 times with 70 ml of water and once with 70 ml of saturated brine. The resulting solution was dried over sodium sulfate. After filtering out sodium sulfate, the solvent was distilled off. 10 ml of hexane and 4 ml of toluene were added to the obtained solid, and it stirred at room temperature for 30 minutes. By filtering and drying this mixture, 6.30 g of compound 1-2 was obtained (yield 87%).

100ml의 3구 플라스크에 2,5-디히드록시벤즈알데히드 1.31g, 디클로로메탄 25ml, 화합물 1-2 6.05g, N,N-디메틸아미노피리딘 0.07g을 더하고 5℃에서 10분 교반했다. 이 혼합물 중에 N,N-디이소프로필카르보디이미드 2.98g을 10도 이하를 유지하면서 적하하고, 30℃에서 6시간 교반했다. 이 반응 혼합물에 물 0.08ml를 더한 후, 고체를 여과해서 제거했다. 얻어진 용액을 칼럼(실리카겔+알루미나, 디클로로메탄)에 통과시킨 후, 용매를 증류 제거했다. 얻어진 고체를 아세톤 10ml에 용해시키고, 메탄올 30ml 중에 적하하고 0℃로 냉각했다. 얻어진 고체를 여과, 건조함으로써, 화합물 1-3이 4.80g 얻어졌다(수율 69%).1.31 g of 2,5-dihydroxybenzaldehyde, 25 ml of dichloromethane, 6.05 g of compound 1-2, and 0.07 g of N,N-dimethylaminopyridine were added to a 100 ml three-necked flask, and the mixture was stirred at 5°C for 10 minutes. In this mixture, 2.98 g of N,N-diisopropylcarbodiimide was added dropwise while maintaining the temperature at 10 degrees or less, and the mixture was stirred at 30°C for 6 hours. After adding 0.08 ml of water to the reaction mixture, the solid was removed by filtration. After passing the obtained solution through a column (silica gel + alumina, dichloromethane), the solvent was distilled off. The obtained solid was dissolved in 10 ml of acetone, added dropwise into 30 ml of methanol, and cooled to 0°C. By filtering and drying the obtained solid, 4.80g of compounds 1-3 were obtained (yield 69%).

100ml의 3구 플라스크에 화합물 1-3 4.8g, 2-히드라지노벤조티아졸 1.07g, 테트라히드로퓨란 20ml를 더하고, 50℃에서 15시간 교반했다. 이 반응 혼합물을 실온까지 냉각하고, 석출한 고체를 여과했다. 얻어진 고체를 실리카겔 칼럼 크로마토그래피(디클로로메탄/아세트산에틸=10/1)로 정제했다. 칼럼 통과 후의 용액을 여과, 건조함으로써 화학식 1의 화합물을 2.40g 얻었다.4.8 g of compounds 1-3, 1.07 g of 2-hydrazinobenzothiazole, and 20 ml of tetrahydrofuran were added to a 100 ml three-necked flask, and the mixture was stirred at 50°C for 15 hours. The reaction mixture was cooled to room temperature, and the precipitated solid was filtered. The obtained solid was purified by silica gel column chromatography (dichloromethane/ethyl acetate = 10/1). 2.40g of the compound of Formula 1 was obtained by filtering and drying the solution after passing through a column.

1H NMR(CDCl3)δ : 1.41-1.61(p, 8H), 1.65-1.80(p, 4H), 1.7(br, 1H), 1.80-1.97(p, 4H), 4.02(t, 2H), 4.17(t, 2H), 5.82(d, 2H), 6.10-6.18(dd, 2H), 6.39-6.44(s+d, 3H), 6.93(dd, 4H), 7.09(t, 2H), 7.23(s, 1H), 7.30(d, 1H), 7.43(d, 1H), 7.50-7.58(p, 4H), 7.75-7.89(p, 3H), 8.10(s, 1H). 1 H NMR (CDCl 3 )δ: 1.41-1.61 (p, 8H), 1.65-1.80 (p, 4H), 1.7 (br, 1H), 1.80-1.97 (p, 4H), 4.02 (t, 2H), 4.17(t, 2H), 5.82(d, 2H), 6.10-6.18(dd, 2H), 6.39-6.44(s+d, 3H), 6.93(dd, 4H), 7.09(t, 2H), 7.23( s, 1H), 7.30 (d, 1H), 7.43 (d, 1H), 7.50-7.58 (p, 4H), 7.75-7.89 (p, 3H), 8.10 (s, 1H).

LC-MS:m/z 885.61[M+]LC-MS: m/z 885.61 [M+]

[화학식 2 화합물의 합성][Synthesis of Formula 2 Compound]

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

반응 용기에

Figure 112021078059916-pat00015
,
Figure 112021078059916-pat00016
탄산칼륨, 에탄올, 테트라키스(트리페닐포스핀)팔라듐(0)을 더하고 가열 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피 및 재결정에 의해 정제를 행하여,
Figure 112021078059916-pat00017
의 화합물 2-1을 얻었다.in the reaction vessel
Figure 112021078059916-pat00015
,
Figure 112021078059916-pat00016
Potassium carbonate, ethanol, and tetrakis(triphenylphosphine)palladium(0) were added and heated and stirred. After performing a normal post-treatment, purification is performed by column chromatography and recrystallization,
Figure 112021078059916-pat00017
of Compound 2-1 was obtained.

반응 용기에

Figure 112021078059916-pat00018
,
Figure 112021078059916-pat00019
, N,N-디메틸아미노피리딘, 디클로로메탄을 더했다. 이어서 디이소프로필카르보디이미드를 더하고 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피 및 재결정에 의해 정제를 행하여,
Figure 112021078059916-pat00020
으로 표시되는 화합물 2-2를 얻었다.in the reaction vessel
Figure 112021078059916-pat00018
,
Figure 112021078059916-pat00019
, N,N-dimethylaminopyridine and dichloromethane were added. Then, diisopropyl carbodiimide was added and stirred. After performing a normal post-treatment, purification is performed by column chromatography and recrystallization,
Figure 112021078059916-pat00020
Compound 2-2 represented by was obtained.

반응 용기에 화합물 2-1, 2-2, 히드라진일수화물, 에탄올을 더하고 가열 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피에 의해 정제를 행하여, 화학식 2로 표시되는 화합물을 얻었다.Compounds 2-1 and 2-2, hydrazine monohydrate, and ethanol were added to the reaction vessel, followed by heating and stirring. After carrying out normal post-treatment, purification was performed by column chromatography to obtain a compound represented by formula (2).

MS(m/z):853[M++1]MS(m/z):853[M++1]

[화학식 3 화합물의 합성][Synthesis of Formula 3 Compound]

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

0 ℃, 질소 분위기 하에서 디엠에프(DMF) 10ml에 포스포릴 트리클로라이드 (1.27 g, 8.3 mmol)를 천천히 적가한 후에, 1시간 동안 교반하였다. 여기에 싸이에노[2,3-d]싸이아졸-2-아민(1 g, 6.4 mmol)을 투입하고 80 ℃로 가온하여 교반함으로서 반응을 진행시켰다. 이어서, 상온으로 온도를 낮추고 물 30ml를 넣어 반응을 종결시켰다. 생성된 고체에 1N NaOH 30 ml를 투입한 다음 클로로포름 50 ml를 다시 투입하여 용해시킨 후, 물로 2회 세척 후에 유기층을 분리한 다음, 무수황산마그네슘을 넣고 교반한 후 여과하여 여액을 감압 증류하였다. 농축한 화합물을 클로로포름과 에?K아세에이트를 이용하여 실리카 컬럼을 통해 정제하여 고체 중간체 3-1(0.91g, 77%, MS: [M+H]+ = 184.0)을 제조하였다.Phosphoryl trichloride (1.27 g, 8.3 mmol) was slowly added dropwise to 10 ml of DMF at 0 °C under a nitrogen atmosphere, followed by stirring for 1 hour. Thieno[2,3-d]thiazol-2-amine (1 g, 6.4 mmol) was added thereto, and the mixture was heated to 80 °C and stirred to proceed with the reaction. Then, the temperature was lowered to room temperature, and the reaction was terminated by adding 30 ml of water. 30 ml of 1N NaOH was added to the resulting solid, and then 50 ml of chloroform was added to dissolve it. After washing twice with water, the organic layer was separated, stirred with anhydrous magnesium sulfate, and filtered, and the filtrate was distilled under reduced pressure. The concentrated compound was purified through a silica column using chloroform and E?K acetate to prepare a solid intermediate 3-1 (0.91g, 77%, MS: [M+H]+ = 184.0).

0 ℃에서, 중간체 3-1 (1 g, 5.4 mmol)를 아세트산 3 ml, 프로피온산 7 ml에 투입한 후 30분 동안 교반하였다. 아질산나트륨 (0.39 g, 5.7 mmol)을 황산 16 ml에 녹인 후 천천히 적가한 다음 5 ℃ 이하로 유지하면서 30분 동안 교반하였다. N,N-다이에틸아닐린 (1.2 g, 8.1 mmol)을 메탄올 5 ml에 용해시켜 천천히 적가한 후 2시간 동안 교반하였다. 이때 2N 소듐아세테이트 수용액으로 pH 5-7 사이로 유지될 수 있게 적정하였다. 반응 완료 후에 혼합물을 물과 메탄올로 2회 필터링하고 세척하여 고체 중간체 3-2 (1.4 g, 75%, MS: [M+H]+ = 345.1)을 제조하였다.At 0 °C, intermediate 3-1 (1 g, 5.4 mmol) was added to 3 ml of acetic acid and 7 ml of propionic acid, followed by stirring for 30 minutes. After dissolving sodium nitrite (0.39 g, 5.7 mmol) in 16 ml of sulfuric acid, it was slowly added dropwise and stirred for 30 minutes while maintaining below 5 °C. After slowly adding N,N-diethylaniline (1.2 g, 8.1 mmol) dissolved in 5 ml of methanol dropwise, the mixture was stirred for 2 hours. At this time, the pH was titrated to be maintained between 5-7 with a 2N sodium acetate aqueous solution. After completion of the reaction, the mixture was filtered and washed twice with water and methanol to obtain solid intermediate 3-2 (1.4 g, 75%, MS: [M+H]+ = 345.1).

중간체 3-2 (0.5 g, 1.5 mmol)와 2-(4-부톡시페닐)아세토나이트릴 (0.33 g, 1.7 mmol)을 에탄올 10ml에 녹였다. 이 혼합물 용액에 피페리딘 5 mol%를 첨가한 후에 2시간 동안 환류시켰다. 반응 혼합물의 온도를 상온으로 낮춘 후에 생성된 고체를 클로로포름 20 ml와 물 20 ml 를 사용하여 3회 추출하였다. 황산 마그네슘으로 물을 제거하고 용매를 증발시킨 후에 클로로포름과 에?K아세에이트를 이용하여 실리카 컬럼을 통해 정제하여 화학식 3의 화합물 (0.45 g, 60%, MS: [M+H]+ = 515.3)을 제조하였다.Intermediate 3-2 (0.5 g, 1.5 mmol) and 2-(4-butoxyphenyl)acetonitrile (0.33 g, 1.7 mmol) were dissolved in 10 ml of ethanol. After adding 5 mol% of piperidine to the mixture solution, it was refluxed for 2 hours. After lowering the temperature of the reaction mixture to room temperature, the resulting solid was extracted three times using 20 ml of chloroform and 20 ml of water. After removing water with magnesium sulfate and evaporating the solvent, the compound of formula 3 (0.45 g, 60%, MS: [M+H]+ = 515.3) was purified through a silica column using chloroform and ethyl K acetate. was manufactured.

[화학식 4 화합물의 합성][Synthesis of Formula 4 Compound]

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

Figure 112021078059916-pat00021
Figure 112021078059916-pat00021

4-브로모벤조산(50g), tert-부틸알코올(20.3g), 디메틸아미노피리딘(12.2g)을 디클로로메탄에 용해시키고, 디이소프로필카르보디이미드(DIC, 37.7g)를 35℃에서 적하하고, 5시간 교반했다. 반응액을 여과하고, 여과액을 농축했다. 고체를 칼럼 크로마토그래피로 정제하여, 화합물 4-1(49g)을 얻었다.4-Bromobenzoic acid (50 g), tert-butyl alcohol (20.3 g), and dimethylaminopyridine (12.2 g) were dissolved in dichloromethane, and diisopropylcarbodiimide (DIC, 37.7 g) was added dropwise at 35°C. , and stirred for 5 hours. The reaction liquid was filtered, and the filtrate was concentrated. The solid was purified by column chromatography to obtain compound 4-1 (49 g).

화합물 4-1(49g)을 NMP에 용해시키고, 탄산칼륨(34.2g), 에틸아크릴레이트(24.8g)를 더했다. 질소 치환을 행하고, 아세트산팔라듐(0.43g)을 더하고, 110℃에서 가열 교반했다. 4시간 교반 후, 물(300ml)을 더하고, 아세트산에틸에 의해 추출했다. 유기층을 1% 염산, 포화 식염수에 의해 세정했다. 황산나트륨에 의해 탈수하고, 유기층을 농축했다. 얻어진 화합물을 에탄올 100ml에 용해시키고, 수산화칼륨(15.2g), 에탄올 50ml, 물 50ml를 더했다. 실온에서 5시간 교반 후, 물을 100ml 더하고, 염산으로 중화했다. 수층을 아세트산에틸로 추출하고, 농축함에 의해 오일상 고체(화합물 4-2, 14.7g)를 얻었다.Compound 4-1 (49 g) was dissolved in NMP, and potassium carbonate (34.2 g) and ethyl acrylate (24.8 g) were added. Nitrogen substitution was performed, palladium acetate (0.43 g) was added, and the mixture was heated and stirred at 110°C. After stirring for 4 hours, water (300 ml) was added, and ethyl acetate extracted. The organic layer was washed with 1% hydrochloric acid and brine. It was dehydrated with sodium sulfate, and the organic layer was concentrated. The obtained compound was dissolved in 100 ml of ethanol, and potassium hydroxide (15.2 g), 50 ml of ethanol, and 50 ml of water were added. After stirring at room temperature for 5 hours, 100 ml of water was added and neutralized with hydrochloric acid. The aqueous layer was extracted with ethyl acetate and concentrated to obtain an oily solid (Compound 4-2, 14.7 g).

얻어진 화합물 4-2를 디클로로메탄에 용해시키고, DMAP(2.90g), 4-히드록시부틸아크릴레이트(10.3g), DMF 400ml를 더했다. 실온에서 DIC(9.0g)를 천천히 적하하고, 24시간 교반했다. 물로 세정하고, 디클로로메탄으로 추출했다. 실리카겔 칼럼 크로마토그래피로 정제했다. 얻어진 오일상 화합물에 포름산을 더하고, 실온에서 9시간, 45℃에서 4시간 교반했다. 반응계 중에 물 100ml를 더하고, 수산화나트륨으로 중화한 후, 아세트산에틸에 의해 추출했다. 유기층을 농축·건조하여, 화합물 4-3(6.5g)을 얻었다.The obtained compound 4-2 was dissolved in dichloromethane, and DMAP (2.90 g), 4-hydroxybutyl acrylate (10.3 g), and DMF 400 ml were added. DIC (9.0 g) was slowly added dropwise at room temperature, and the mixture was stirred for 24 hours. Washed with water and extracted with dichloromethane. It was purified by silica gel column chromatography. Formic acid was added to the obtained oily compound, and the mixture was stirred at room temperature for 9 hours and at 45°C for 4 hours. After adding 100 ml of water to the reaction system and neutralizing with sodium hydroxide, extraction was performed with ethyl acetate. The organic layer was concentrated and dried to obtain compound 4-3 (6.5 g).

화합물 4-3(6.5g)을 디클로로메탄 200ml에 용해시키고, DMAP(0.6g), 디히드록시벤즈알데히드(1.2g)를 더했다. 실온에서 DIC(2.5g)를 적하하고, 10시간 교반했다. 반응액을 여과하고, 유기층을 농축했다. 실리카겔 칼럼 크로마토그래피에 의해 정제를 행하여, 화합물 4-4(5g)를 얻었다.Compound 4-3 (6.5 g) was dissolved in 200 ml of dichloromethane, and DMAP (0.6 g) and dihydroxybenzaldehyde (1.2 g) were added. DIC (2.5 g) was added dropwise at room temperature and stirred for 10 hours. The reaction liquid was filtered, and the organic layer was concentrated. Purification was performed by silica gel column chromatography to obtain compound 4-4 (5 g).

화합물 4-4(5g)를 에탄올 50ml에 용해시키고, 벤조티아졸히드라진 유도체를 더하고, 45℃에서 5시간 교반했다. 실온까지 냉각하면, 고체가 석출하여, 여과에 의해 회수했다. 재결정에 의해 정제하여, 화학식 4로 표시되는 화합물을 3.5g 얻었다.Compound 4-4 (5 g) was dissolved in 50 ml of ethanol, a benzothiazolehydrazine derivative was added, and the mixture was stirred at 45°C for 5 hours. When cooled to room temperature, solid precipitated and was collected by filtration. It was purified by recrystallization to obtain 3.5 g of a compound represented by the formula (4).

[화학식 5 화합물의 합성][Synthesis of Compound of Formula 5]

이하에 나타내는 방법에 의해, 하기 화합물을 합성했다.The following compounds were synthesized by the methods shown below.

Figure 112021078059916-pat00022
Figure 112021078059916-pat00022

반응용기에

Figure 112021078059916-pat00023
, 트리에틸아민, 디클로로메탄, 숙신산클로리드를 더하고 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피 및 재결정에 의해 정제를 행하여, 화합물 5-1을 얻었다.in the reaction vessel
Figure 112021078059916-pat00023
, triethylamine, dichloromethane, and succinic acid chloride were added and stirred. After performing normal post-treatment, purification was performed by column chromatography and recrystallization to obtain compound 5-1.

반응 용기에 화합물 5-1과 디클로로메탄을 더했다. -78℃로 냉각하면서 삼브롬화붕소를 더하고 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피 및 재결정에 의해 정제를 행하여, 화합물 5-2를 얻었다.Compound 5-1 and dichloromethane were added to the reaction vessel. While cooling to -78°C, boron tribromide was added and stirred. After carrying out normal post-treatment, purification was performed by column chromatography and recrystallization to obtain compound 5-2.

반응 용기에 화합물 5-2,

Figure 112021078059916-pat00024
, N,N-디메틸아미노피리딘, 디클로로메탄을 더했다. 디이소프로필카르보디이미드를 더하고 교반했다. 통상의 후처리를 행한 후, 칼럼 크로마토그래피 및 재결정에 의해 정제를 행하여, 화학식 5의 화합물을 얻었다.compound 5-2 to the reaction vessel;
Figure 112021078059916-pat00024
, N,N-dimethylaminopyridine and dichloromethane were added. Diisopropylcarbodiimide was added and stirred. After performing usual post-treatment, purification was performed by column chromatography and recrystallization to obtain a compound of formula (5).

MS(m/z):1543[M++1]MS(m/z): 1543[M++1]

<실시예 1><Example 1>

아연 0.8 중량%, 인 0.1 중량% 및 나머지량의 알루미늄으로 이루어진 분말 혼합물과, 폴리우레탄 수지로 된 접착수지와 접착수지 100 중량부를 기준으로 상기 합성한 화학식 1, 화학식 2 및 화학식 3으로 표시되는 화합물 각각 0.15 중량부 및 광중합개시제 Irgacure907(BASF사제) 0.0015 중량부를 혼합한 복합수지를 1: 10의 비율로 혼합하고 용매에 분산 및 용해시킨 다음, 철재 표면에 스프레이법으로 분사하여 도포, 상온에서 소정시간 방치하여 본 공법에 따른 35㎛ 두께의 피막을 형성하고 상온에서 건조 및 자연경화시켰다. A powder mixture composed of 0.8% by weight of zinc, 0.1% by weight of phosphorus, and the balance of aluminum, an adhesive resin made of a polyurethane resin, and the compounds represented by Formulas 1, 2, and 3 synthesized above based on 100 parts by weight of the adhesive resin. A composite resin containing 0.15 parts by weight of each and 0.0015 parts by weight of photopolymerization initiator Irgacure907 (manufactured by BASF) was mixed at a ratio of 1:10, dispersed and dissolved in a solvent, and then applied by spraying to the steel surface by spraying, at room temperature for a predetermined time. After leaving it to form a 35 μm thick film according to this method, it was dried and cured naturally at room temperature.

이어서, 고압 수은 램프를 이용하여 자외선을 40mW/㎠의 강도로 20분동안 조사한 후, 아래 기재된 품질기준 테스트에 따라 각종 물성을 평가하였다. Subsequently, ultraviolet rays were irradiated at an intensity of 40 mW/cm 2 for 20 minutes using a high-pressure mercury lamp, and various physical properties were evaluated according to the quality standard test described below.

<실시예 2><Example 2>

상기 방법으로 합성한 화학식 4의 화합물을 접착수지 100 중량부를 기준으로 0.08 중량부 비율로 더 혼합한 것을 제외하고는 실시예 1과 동일하게 제조하였다.It was prepared in the same manner as in Example 1, except that the compound of Formula 4 synthesized by the above method was further mixed in an amount of 0.08 parts by weight based on 100 parts by weight of the adhesive resin.

<실시예 3><Example 3>

상기 방법으로 합성한 화학식 5의 화합물을 접착수지 100 중량부를 기준으로 0.08 중량부 비율로 더 혼합한 후 건조시켜 보수재 조성물을 제조한 후 시공 테스트를 한 것을 제외하고는 실시예 2와 동일하게 제조하였다.The compound of Formula 5 synthesized by the above method was further mixed in an amount of 0.08 parts by weight based on 100 parts by weight of the adhesive resin, dried to prepare a repair material composition, and then tested in the same manner as in Example 2, except that the construction test was performed. .

비교예 1Comparative Example 1

비교예는 본 출원인의 대한민국 특허 제10-0503561호에 기재된 조성물을 이용하였다. As a comparative example, the composition described in Korean Patent No. 10-0503561 of the present applicant was used.

아연 0.3중량%, 크롬 0.5중량% 니켈 0.7중량%, 인 0.1중량% 및 알루미늄 97.8중량%의 비율로 이루어진 분말 혼합물과 폴리우레탄 수지를 1: 10의 비율로 혼합하고 용매에 분산 및 용해시킨 다음 실험 대상 물질 표면에 스프레이법으로 분사하여 도포하고 상온에서 소정시간 방치하여 35㎛ 두께의 피막을 형성하였다.A powder mixture consisting of 0.3% by weight of zinc, 0.5% by weight of chromium, 0.7% by weight of nickel, 0.1% by weight of phosphorus, and 97.8% by weight of aluminum was mixed with a polyurethane resin at a ratio of 1:10, dispersed and dissolved in a solvent, and then tested. It was applied by spraying on the surface of the target material and left at room temperature for a predetermined time to form a film with a thickness of 35 μm.

피막의 접착강도 측정Measurement of film adhesion strength

실시예 1-3 및 비교예 1에 따라 형성된 피막의 부착강도를 확인하기 위하여 다음과 같은 시험을 실시하였다.In order to confirm the adhesion strength of the films formed according to Examples 1-3 and Comparative Example 1, the following tests were conducted.

철재 구조물에 전술한 방법에 따른 실시예 1의 산화알루미늄 피막을 형성한 후 강재 부착물을 부착시켜 KS F 4715-01 및 JIS A 6910 규격에 따른 부착력 시험기를 사용하여 인장력을 가하는 방법으로 측정하였다. After forming the aluminum oxide film of Example 1 according to the method described above on the steel structure, the steel attachment was attached and measured by applying a tensile force using an adhesion tester according to KS F 4715-01 and JIS A 6910 standards.

실시예 1의 피막 접착강도는 46kgf/cm2, 실시예 2의 피막 접착강도는 48kgf/cm2이고, 실시예 3의 피막 접착강도는 49kgf/cm2이고 비교예 1의 피막 접착강도는 35kgf/cm2 정도로 나타났다.The film adhesive strength of Example 1 was 46 kgf/cm 2 , the film adhesive strength of Example 2 was 48 kgf/cm 2 , the film adhesive strength of Example 3 was 49 kgf/cm 2 and the film adhesive strength of Comparative Example 1 was 35 kgf/cm 2 . Appeared to be about 2 cm.

Claims (4)

아연 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물; 및
상기 분말 혼합물이 균일하게 분산된 접착수지;로 구성된, 구조물의 부식 방지 및 내구성 증진을 위한 도료 조성물에 있어서,
상기 접착수지는 접착수지 100 중량부를 기준으로
하기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부,
하기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및
하기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 포함하는 것을 특징으로 하는 도료 조성물:
<화학식 1>
Figure 112022071491123-pat00039

<화학식 2>
Figure 112022071491123-pat00040

<화학식 3>
Figure 112022071491123-pat00027
A powder mixture consisting of 0.8% by weight of zinc, 0.06 to 0.11% by weight of phosphorus and the balance of aluminum (Al); and
In the coating composition for preventing corrosion and enhancing durability of structures, consisting of an adhesive resin in which the powder mixture is uniformly dispersed,
The adhesive resin is based on 100 parts by weight of the adhesive resin
0.1 to 0.2 parts by weight of a compound represented by Formula 1 below;
0.1 to 0.2 parts by weight of a compound represented by Formula 2 below, and
A coating composition comprising 0.1 to 0.2 parts by weight of a compound represented by Formula 3 below:
<Formula 1>
Figure 112022071491123-pat00039

<Formula 2>
Figure 112022071491123-pat00040

<Formula 3>
Figure 112022071491123-pat00027
제1항 에 있어서,
상기 접착수지는 상기 접착수지 100 중량부를 기준으로 하기 화학식 4로 표시되는 화합물 0.05 내지 0.1 중량부를 더 포함하는 것을 특징으로 하는 도료 조성물:
<화학식 4>
Figure 112021078059916-pat00028
According to claim 1,
The coating composition characterized in that the adhesive resin further comprises 0.05 to 0.1 parts by weight of a compound represented by Formula 4 based on 100 parts by weight of the adhesive resin:
<Formula 4>
Figure 112021078059916-pat00028
(a) 아연(Zn) 0.8 중량%, 인 0.06 내지 0.11 중량% 및 나머지 량의 알루미늄(Al)으로 이루어진 분말 혼합물을 준비하는 단계; 및
(b) 상기 준비된 분말 혼합물을, 접착수지와 상기 접착수지 100 중량부를 기준으로 하기 화학식 1로 표시되는 화합물 0.1 내지 0.2 중량부, 하기 화학식 2로 표시되는 화합물 0.1 내지 0.2 중량부 및 하기 화학식 3으로 표시되는 화합물 0.1 내지 0.2 중량부를 더 혼합한 복합 접착수지에 균일하게 분산시키고, 구조물 표면에 분사하여 피막을 형성하는 단계;를 포함하는 것을 특징으로 하는 피막 접착공법:
<화학식 1>
Figure 112022071491123-pat00041

<화학식 2>
Figure 112022071491123-pat00042

<화학식 3>
Figure 112022071491123-pat00031
(a) preparing a powder mixture consisting of 0.8% by weight of zinc (Zn), 0.06 to 0.11% by weight of phosphorus, and the balance of aluminum (Al); and
(b) 0.1 to 0.2 parts by weight of a compound represented by Formula 1, 0.1 to 0.2 parts by weight of a compound represented by Formula 2, and Formula 3 below, based on 100 parts by weight of an adhesive resin and the adhesive resin. Forming a film by uniformly dispersing 0.1 to 0.2 parts by weight of the indicated compound in a further mixed composite adhesive resin and spraying it on the surface of the structure; a film bonding method comprising:
<Formula 1>
Figure 112022071491123-pat00041

<Formula 2>
Figure 112022071491123-pat00042

<Formula 3>
Figure 112022071491123-pat00031
제3항에 있어서,
상기 복합 접착수지는 접착수지 100 중량부를 기준으로, 하기 화학식 4로 표시되는 화합물 0.05 내지 0.1 중량부를 더 혼합한 것을 특징으로 하는 피막 접착공법:
<화학식 4>
Figure 112022071491123-pat00032
According to claim 3,
The composite adhesive resin is a film bonding method characterized by further mixing 0.05 to 0.1 parts by weight of a compound represented by the following formula (4) based on 100 parts by weight of the adhesive resin:
<Formula 4>
Figure 112022071491123-pat00032
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KR20170086047A (en) * 2014-12-04 2017-07-25 디아이씨 가부시끼가이샤 Polymerizable compound, composition, polymer, optically anisotropic body, liquid crystal display device and organic el element
KR20170101194A (en) * 2014-12-25 2017-09-05 디아이씨 가부시끼가이샤 Polymerizable compound and optically anisotropic object
KR20170105000A (en) * 2015-01-16 2017-09-18 디아이씨 가부시끼가이샤 Polymerizable composition and optically anisotropic body
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