KR102470396B9 - Manufacturing method of thin film transistor - Google Patents

Manufacturing method of thin film transistor

Info

Publication number
KR102470396B9
KR102470396B9 KR1020200182316A KR20200182316A KR102470396B9 KR 102470396 B9 KR102470396 B9 KR 102470396B9 KR 1020200182316 A KR1020200182316 A KR 1020200182316A KR 20200182316 A KR20200182316 A KR 20200182316A KR 102470396 B9 KR102470396 B9 KR 102470396B9
Authority
KR
South Korea
Prior art keywords
manufacturing
thin film
film transistor
transistor
thin
Prior art date
Application number
KR1020200182316A
Other languages
Korean (ko)
Other versions
KR20220091114A (en
KR102470396B1 (en
Inventor
김학성
문창진
박종휘
장용래
주영민
Original Assignee
한양대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한양대학교 산학협력단 filed Critical 한양대학교 산학협력단
Priority to KR1020200182316A priority Critical patent/KR102470396B1/en
Publication of KR20220091114A publication Critical patent/KR20220091114A/en
Application granted granted Critical
Publication of KR102470396B1 publication Critical patent/KR102470396B1/en
Publication of KR102470396B9 publication Critical patent/KR102470396B9/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401Multistep manufacturing processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725Source or drain electrodes for field effect devices
    • H01L29/41733Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66969Multistep manufacturing processes of devices having semiconductor bodies not comprising group 14 or group 13/15 materials
KR1020200182316A 2020-12-23 2020-12-23 Manufacturing method of thin film transistor KR102470396B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020200182316A KR102470396B1 (en) 2020-12-23 2020-12-23 Manufacturing method of thin film transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200182316A KR102470396B1 (en) 2020-12-23 2020-12-23 Manufacturing method of thin film transistor

Publications (3)

Publication Number Publication Date
KR20220091114A KR20220091114A (en) 2022-06-30
KR102470396B1 KR102470396B1 (en) 2022-11-23
KR102470396B9 true KR102470396B9 (en) 2022-12-27

Family

ID=82215426

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200182316A KR102470396B1 (en) 2020-12-23 2020-12-23 Manufacturing method of thin film transistor

Country Status (1)

Country Link
KR (1) KR102470396B1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060053587A (en) * 2004-11-17 2006-05-22 삼성전자주식회사 Thin film transistor array panel and manufacturing method thereof
KR101275856B1 (en) * 2011-06-21 2013-06-18 한국과학기술연구원 Method for forming pattern of metal oxide and method for manufacturing thin film transistor using the same
KR20180085888A (en) * 2017-01-20 2018-07-30 엘지전자 주식회사 Heteo junction solar cell and fabricating method thereof

Also Published As

Publication number Publication date
KR20220091114A (en) 2022-06-30
KR102470396B1 (en) 2022-11-23

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Legal Events

Date Code Title Description
AMND Amendment
E601 Decision to refuse application
X091 Application refused [patent]
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]