KR102470080B1 - Metal flooring for preventing noise between floors - Google Patents

Abstract

Disclosed is a metal flooring material for preventing noise between floors that can minimize damage due to an impact unlike the existing ceramic flooring material by using a metal plate having a multi-layered structure for a flooring material. The present invention provides the metal flooring material for preventing noise between floors which comprises: a metal layer; a printed layer formed on an upper portion of the metal layer; a heat insulating layer formed on a lower portion of the metal layer; and an impact absorbing layer formed on a lower portion of the heat insulating layer.

Description

Metal flooring for preventing noise between floors}

The present invention relates to a metal flooring material for preventing inter-floor noise, and more particularly, to using a metal plate having a multi-layered structure for the flooring material, unlike existing ceramic floor coverings, metal for preventing inter-floor noise that can minimize damage caused by impact It's about material flooring.

In general, in the case of apartment houses or multi-story buildings, most of the air propagation sound is blocked by the concrete slab structure, but when shock or vibration is directly applied to the floor by people walking or falling objects from the upper floors, It is transformed into solid propagation sound and is hardly attenuated, and is radiated to lower floors or adjacent households through floor slabs, ceilings, and walls.

The floor impact sound is a lightweight impact sound that generates a lot of high-frequency sound, such as when a bowl or object is dropped or a chair is moved, and a heavy impact sound that generates a lot of low-frequency sound, such as a child's running sound or an adult's walking. is divided into

In recent years, as disputes between neighbors due to floor impact noise (inter-floor noise) have emerged as a serious social problem, the Korean government established the "Standard for Preventing Noise Between Floors in Apartment Houses" in March 2014 to reduce noise between floors in apartment houses by public notice of the Ministry of Construction and Transportation. The floor impact sound performance grade, including five types of standard floor structures for the

In addition, in accordance with the "Rules on Equipment Standards for Buildings," the floors of residential buildings must be installed with insulation materials to increase their efficiency and prevent heat loss during heating and cooling.

Accordingly, the slab floor of a building such as a residential multi-unit dwelling such as an apartment or a villa must simultaneously satisfy the insulation and inter-floor noise blocking regulations to prevent heat from being transferred to the lower part of the inter-floor structure.

Meanwhile, various materials are used to finish the floor of a building. In the case of general floor finishing, it is performed by simply solidifying the cement on the floor surface and then flattening it, but this simply forms a gray floor surface, which is very poor in aesthetics, and due to the nature of cement, cracks occur and chemical resistance The downside is that it is difficult to use for a long time.

In order to improve this, a method of constructing tiles on the floor surface is widely used. The tile refers to a finishing material mainly made of ceramic, and has a thin thickness compared to its size, and thus has the advantage of giving a unique sense of shape to the floor when attached to the floor. In addition, in the case of the tile, since it is installed separately from the floor surface, it can be replaced when damaged, and has the advantage of being able to use tiles having various sizes and shapes.

However, in the case of such tiles, not only can they be damaged by impact due to the nature of ceramics, but also have a characteristic that transmits noise to the floor as it is, so it has a disadvantage that an additional noise prevention structure must be constructed.

Therefore, it is necessary to develop a new flooring material to improve the disadvantages of these tiles.

(0001) Republic of Korea Patent No. 10-1649601 (0002) Republic of Korea Patent No. 10-1560085

The present invention has been made to solve the above problems, and an object of the present invention is to provide a floor covering for preventing inter-floor noise having a multi-layer structure including a metal layer.

In addition, another object of the present invention is to provide a metal flooring material for preventing inter-floor noise that can simultaneously have an insulation effect and an inter-floor noise prevention effect by forming a heat insulating layer and a shock absorbing layer on the lower surface of the metal layer.

Another object of the present invention is to provide a metal flooring material for preventing inter-floor noise that can express various shapes and colors by forming a printed layer capable of expressing colors on the upper surface of the metal layer.

Another object of the present invention is to provide a metal flooring material for preventing inter-floor noise including a cork layer under the metal layer.

The object of the present invention is not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, the present invention is a metal layer; a printed layer formed on top of the metal layer; a heat insulating layer formed under the metal layer; And it provides a metallic flooring material for preventing inter-floor noise including a shock absorbing layer formed under the heat insulating layer.

In one embodiment, a protective layer is additionally formed on the upper portion of the printed layer, and the printed layer includes plasma-treating a surface of the metal layer; and forming a printed layer on the surface of the plasma-treated metal layer, wherein the plasma treatment is performed using high-pressure glow plasma under an oxygen condition, and the protective layer is formed by covering the printed layer at regular intervals. perforating with; coating a compound for forming a protective layer on top of the printed layer; and curing the compound for forming the protective layer and then forming a polarization structure on the surface, wherein the perforation passes through the printed layer to the metal layer to a predetermined depth, and the protective layer When silver is applied, it may pass through the perforations of the printed layer and come into contact with the inside of the metal layer.

In one embodiment, a gap is formed at a position corresponding to the perforation on the top of the metal layer, and the gap is formed by applying a protective agent to the surface of the metal; drilling the metal coated with the protective agent at regular intervals; Forming a primary void by dipping the drilled metal into a primary etching solution and performing primary etching to expand the inner wall of the perforation; Forming a secondary void on the wall surface of the void by immersing the metal in which the primary void is formed in a secondary etchant; It may be prepared by a method including the step of removing the protective agent after the formation of the secondary pores is completed.

In one embodiment, the polarization structure on the surface of the protective layer, (a) applying a pattern material to the surface of the protective layer; (b) forming a pre-pattern by etching the pattern material at regular intervals; (c) after the etching is completed, applying a polarizing material on the exposed protective layer and the remaining pre-pattern; (d) attaching the polarizing material to the side surface of the pre-pattern through etching; and (e) removing the pre-pattern, wherein step (b) forms a pre-pattern by applying a pattern material on the protective layer and then performing a lithography or imprinting process, The etching may be a milling process performed by forming plasma using gas under a pressure of 0.1 mTorr to 10 mTorr and then accelerating the plasma to 100 eV to 5,000 eV.

In one embodiment, a conductive layer formed under the metal layer between the metal layer and the heat insulating layer; and a heating layer formed under the conductive layer, wherein the conductive layer includes 3 to 10 parts by weight of a linear carbon compound based on 100 parts by weight of a conductive polymer, and the linear carbon compound is mixed with the conductive polymer to form a network. forming a structure, and the heating layer includes heating lines arranged at regular intervals; and a waterproof layer formed under the heating wire.

In one embodiment, the heat insulating layer and the shock absorbing layer may include installing a collection plate below a spray nozzle and applying a high voltage between the spray nozzle and the collection plate; supplying a dissolved or melted polymer through the injection nozzle; discharging the molten polymer to the outside of the injection nozzle by rotating a centrifugal rotation unit in which the injection nozzle is installed; forming nanofibers on an upper portion of the collecting plate by applying a high voltage as the discharged polymer moves downward; Forming a thermal insulation layer by ultrasonically welding the nanofibers; arranging a polymeric vibration absorber on top of the heat insulating layer; forming a shock-absorbing layer by applying a compound for forming a shock-absorbing layer on top of the polymeric absorber; and attaching a lower portion of the heat insulating layer to the heat generating layer, wherein the shock absorbing layer-forming compound impregnates a portion of the heat insulating layer, and the polymer vibration absorber is made of polyurethane and has a diameter of 0.1 to 0.10. It has a spherical shape of 5 mm, and the shock absorbing layer may include the polymer vibration absorber therein.

In one embodiment, a cork layer may be further included under the metal layer.

According to an embodiment of the present invention, it is possible to provide a metal flooring material capable of expressing various shapes by forming a printing layer on top of a metal plate, and also capable of expressing various shapes by printing wood or stone shapes different from those of the metal plate. can

In addition, the present invention includes a heat insulating layer and a shock absorbing layer under the metal plate, thereby providing a metal flooring material capable of reducing inter-floor noise as well as providing an appropriate heat insulating effect without the construction of additional heat insulating materials.

In addition, the present invention can provide a metallic flooring material that can minimize cracking or cracking even when used for a long time because it has high durability, unlike flooring materials made of conventional ceramics.

In addition, the present invention includes a cork layer at the bottom of the ?O inner layer, which can improve thermal insulation and shock absorption, as well as recycle the bear stone layer when discarded after use, and the cork layer can be naturally decomposed, so it is environmentally friendly. It is possible to provide a metallic floor covering capable of minimizing contamination.

Effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present invention.

1 shows the structure of a metal flooring material according to an embodiment of the present invention.
2 shows that a polarization pattern is formed on top of a protective layer according to an embodiment of the present invention.
Figure 3 shows the bonding structure of the metal layer and the protective layer by perforation of the printed layer according to an embodiment of the present invention.
4 illustrates (a) formation of primary voids by primary etching of a metal layer and (b) formation of secondary voids by secondary etching according to an embodiment of the present invention.

Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described in this specification may be modified in various ways. Certain embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are only intended to facilitate understanding of various embodiments. Therefore, the technical idea is not limited by the specific embodiments disclosed in the accompanying drawings, and it should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

Terms including ordinal numbers, such as first and second, may be used to describe various components, but these components are not limited by the above terms. The terminology described above is only used for the purpose of distinguishing one component from another.

In this specification, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded. It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

Meanwhile, a “module” or “unit” for a component used in this specification performs at least one function or operation. And a "module" or "unit" may perform a function or operation by hardware, software, or a combination of hardware and software. In addition, a plurality of “modules” or “units” other than “modules” or “units” to be executed in specific hardware or to be executed in at least one processor may be integrated into at least one module. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In addition, in describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be abbreviated or omitted.

1 shows the structure of the flooring material of the present invention.

The present invention is a metal layer; a printed layer formed on top of the metal layer; a heat insulating layer formed under the metal layer; And it relates to a metal flooring material for preventing inter-floor noise including a shock absorbing layer formed under the heat insulating layer.

The metal layer 100 is a central layer of the metal flooring material of the present invention, and unlike existing flooring materials, it is made of metal and can have high durability. In this case, the metal layer may be made of iron, copper, aluminum, zinc, magnesium, tin, titanium, or an alloy thereof, preferably made of aluminum or stainless. In addition, since the metal layer 100 is used as a part supporting the load of the flooring material of the present invention, it is preferable to have a thickness capable of having sufficient strength. That is, the metal layer may be made to have a thickness of 1 to 20 mm, and if it is made to a thickness of less than 1 mm, it may not support the load applied to the top, so that settlement may occur or be stretched and damaged when a load is applied, and a thickness exceeding 20 mm If it has a lot of weight, it may be difficult to construct.

Various functional layers may be included above and below the metal layer. At this time, a protective layer 300 including a printing layer 200, which mainly determines aesthetics, may be formed on the upper part, and a heat insulating layer 400 and a shock absorbing layer 500, which are functional layers for enhancing the function of the metal layer, may be formed on the lower part. can do.

The printing layer 200 is a layer that forms various shapes on the surface of the metal, and may simply print in a single color such as white, black, or blue, but may have a shape that can represent the shape of a natural object such as marble or wood. or form a specific shape, figure, symbol or character to give a new aesthetic sense to the user or deliver certain information. As an example, if a tree ring pattern is formed on the upper part of the metal layer, although it is a flooring material made of metal, it may have an aesthetic effect similar to that of a flooring material made of wood. Can also be used as a role.

In addition, when the printed layer 200 is formed, plasma treatment may be performed on the surface of the metal layer 100 to increase bonding strength between the printed layer and the surface of the printed layer. The plasma treatment increases the surface roughness of the metal layer 100 by artificially causing damage to the surface of the metal layer 100 , and may serve to increase the surface area of the metal layer 100 . In general, since the metal layer 100 and the printed layer 200 are bonded by van der Waals attraction without chemical bonding, bonding strength can be increased when the surface area is increased. In addition, it is preferable to use high-pressure glow plasma with excellent etching power under oxygen conditions for the plasma surface treatment used at this time. Through this, in the case of the surface of the metal, a desired roughness can be formed with only a short treatment time.

In the case of the printing layer 200, since it is a part that is in contact with the human body, it can be performed using an eco-friendly paint. In particular, it is more preferable to form using a water-based paint in order to minimize the emission of volatile organic compounds, which have been a lot of problems recently. In addition, since the bonding force of the printed layer appears only through van der Waals attraction as described above, in order to further improve this, the printed layer 200 may be perforated 210 at regular intervals. Such perforations allow the compound for forming the protective layer to be described below to permeate into the lower part of the printed layer through capillary action, and at this time, the compound for forming the protective layer is bonded to the metal layer to physically fix the printed layer. can be done That is, in the case of the printed layer, since it can be fixed through physical bonding between the protective layer and the metal layer as well as the bonding force between the printed layer and the metal layer, it can have higher durability than the conventional metal surface printed layer (FIG. 3 Reference).

In addition, in order to further improve the bonding force of the printing layer as described above, a gap 110 is formed at a position corresponding to the perforation 210 on the top of the metal layer, and the gap is formed by applying a protective agent to the surface of the metal. step; drilling the metal coated with the protective agent at regular intervals; Forming a primary void by dipping the drilled metal into a primary etching solution and performing primary etching to expand the inner wall of the perforation; Forming a secondary void on the wall surface of the void by immersing the metal in which the primary void is formed in a secondary etchant; It may be prepared by a method including removing the protective layer after the formation of the secondary pores is completed.

In the case of the etchant used in the present invention, since the metal can be randomly corroded and removed, a protective agent may be applied to the surface of the metal layer to prevent damage to the surface of the metal layer. The protective agent may simply be a non-polar solution or oil that is not mixed with the etchant, and it is also possible to use it as a protective agent by attaching a film or applying a polymer material.

After the protective agent is applied as described above, the upper part of the metal to which the protective agent is applied may be drilled at regular intervals. In this case, the perforation of the metal is formed at the same position as the perforation of the printed layer, and a compound for forming a protective layer to be described later can penetrate into the metal layer 100 through the perforation of the printed layer.

In addition, in the case of simply perforating the metal layer as described above, the compound for forming the protective layer and the metal layer may be simply fixed only by surface frictional force. Therefore, in order to further increase the fixing force, it is preferable to expand the inner wall of the perforated part by etching the perforated metal layer (refer to the enlarged view of FIG. 3). In this case, when the compound for forming the protective layer is injected into the rapid layer and cured, the diameter may be larger than that of the perforation formed in the printed layer, and through this, the durability of the printed layer and the protective layer may be greatly increased. have.

At this time, the etching may be performed through primary etching and secondary etching. The drilled metal may be immersed in the primary etching solution to form the primary gap 110, and after the primary etching is completed, the secondary etching is performed by dipping in the secondary etching solution to form the wall surface of the gap. New micropores (secondary pores, 111) may be formed (see FIG. 4).

In this case, the primary etchant may include oxalic acid (C ₂ H ₂ O ₄ ), acetic acid (CH ₃ COOH), nitric acid (HNO ₃ ), hydrochloric acid (HCl), hydrogen peroxide (H ₂ O ₂ ), and distilled water. Preferably, the etching solution may include 0.5 to 5 parts by weight of oxalic acid, 0.1 to 5 parts by weight of acetic acid, 5 to 40 parts by weight of nitric acid, 5 to 40 parts by weight of hydrochloric acid, and 0.5 to 5 parts by weight of hydrogen peroxide, based on 100 parts by weight of distilled water.

As described above, by being immersed in the primary etching solution, the inner wall of the perforated portion of the metal surface can be expanded (Fig. 4 (a)).

In addition, by forming secondary pores (pores) inside the pores generated by the primary etching, it is possible to further improve bonding with a compound for forming a protective layer to be described later (FIG. 4(b)). To this end, etching may be performed by immersing the metal in a secondary etchant after the primary etching is completed, and the secondary etchant used at this time is 0.5 to 8 parts by weight of sodium bicarbonate and 5 to 8 parts by weight of sodium hydroxide based on 100 parts by weight of distilled water. 20 parts by weight and sodium tetraborate 0.5 to 8 parts by weight may be included. By using the secondary etchant as described above, a secondary void can be formed on the wall surface of the primary void, and through this, when a compound for forming a protective layer to be described below penetrates into the void, a stronger bonding force can be obtained. have.

After the gaps in the metal layer are formed as described above, the protective agent on the surface of the metal may be removed and a printed layer may be formed.

In addition, after forming the printed layer 200, perforation 210 may be performed at the same position as the position of the gap. At this time, it is preferable that the perforation is performed to have a diameter of 0.01 to 0.5 mm. When the perforation has a diameter of less than 0.01 mm, it may not be easy to penetrate the compound for forming the protective layer, and when the perforation has a diameter exceeding 0.5 mm, the perforation hole may be exposed and seen in the wavy portion, resulting in poor aesthetics. . In addition, the distance between each of the perforations is the same as the distance between the pores, and the distance may be 1 to 10 mm. When the interval is less than 1 mm, the color development of the printed layer may deteriorate, and when the interval exceeds 10 mm, the effect of increasing durability of the printed layer due to the perforation may decrease.

After the perforation holes are formed in the printed layer as described above, the protective layer 300 may be formed on the surface of the printed layer. In the case of the protective layer 300, it is formed by applying a compound for forming a protective layer after the printed layer 200 is cured. At this time, the compound for forming a protective layer can penetrate into the metal layer through perforations formed in the printed layer. It is as described above that the adhesion and durability are increased by this penetration (see FIG. 3).

In addition, after the compound for forming the protective layer is cured to form the protective layer, a polarization structure may be formed on the surface of the protective layer (see FIG. 2). In general, dyes or pigments used in printed layers are known to be discolored or discolored when exposed to ultraviolet rays for a long time. Therefore, by forming a polarizing structure on the surface of the protective layer in order to minimize such discoloration or discoloration, the amount of incident ultraviolet light can be significantly reduced, and through this, the lifespan of the printed layer can be increased.

To this end, the polarization structure on the surface of the protective layer may include: (a) applying a pattern material to the surface of the protective layer; (b) forming a pre-pattern by etching the pattern material at regular intervals; (c) after the etching is completed, applying a polarizing material on the exposed protective layer and the remaining pre-pattern; (d) attaching the polarizing material to the side surface of the pre-pattern through etching; and (e) removing the prepattern.

The step (a) is a step of applying the pattern material 320 to the surface 310 of the protective layer, and is a step of applying the pattern material to the surface of the protective layer 310 to produce a layer on which a pre-pattern will be formed ( See Figure 2 (b)). At this time, the pattern material 320 may be applied to the surface of the protective layer through a method such as spray, roller coating, or deposition, and since the height of the polarization pattern is determined in proportion to the thickness of the pre-pattern layer, It is more preferable to apply using a vapor deposition that can be applied uniformly with a thickness of .

The pattern material 320 may be made of polystyrene, chitosan, polyvinylalcohol, polymethyl methacrylate (PMMA), photoresist, or a conductive polymer. The pattern material 320 is formed into a predetermined shape by a lithography or imprinting process (FIG. 2(c)), and a polarizing material 330 is deposited on the side surface by etching. In this case, the height and spacing of the polarizing material 330 may be adjusted by adjusting the height and spacing of the prepattern.

A pre-pattern may be formed by applying the pattern material 320 and then etching the pattern material at regular intervals ((c) of FIG. 2). In this case, the etching may be performed using a lithography or imprinting process as described above, and the same process as previously known for the lithography or imprinting process may be used.

After the prepattern is formed as described above, a polarizing material 330 may be applied on the prepattern ((d) of FIG. 2 ). The polarizing material may include gold, platinum, silver, copper, aluminum, zinc oxide, chromium, indium tin oxide (ITO), nickel, iron, titanium, molybdenum, silicon, zinc oxide or titanium oxide. can be used Since the polarizing material is uniformly applied to the surface of the protective layer, it is uniformly attached not only to the upper portion of the prepattern but also to the surface of the protective layer exposed through a lithography or imprinting process ((d) of FIG. 2).

After the polarizing material 330 is applied as described above, the polarizing material may be attached to the wall surface of the pre-pattern by nickname (Fig. 2(e)). Looking at this in detail, the polarizing material 330 is scattered in all directions by the etching. At this time, in the case of the polarizing material 330 attached to the exposed protective layer, it does not flow out of the pre-pattern and is formed on the wall surface of the pre-pattern. can be attached That is, after the nicking is completed as described above, the polarizing material 330 may exist on the wall surface of the pre-pattern. To this end, the etching may be performed by a milling process, particularly an ion milling process, in which plasma is formed using gas under a pressure of 0.1 mTorr to 10 mTorr and then the plasma is accelerated to 100 eV to 5,000 eV. In addition, the gas used for the ion milling is preferably selected from the group consisting of argon, helium, nitrogen, oxygen, and mixtures thereof.

As described above, when the polarizing material 330 is attached to the side of the pre-pattern and then the pre-pattern 320 is removed, only the polarizing material remains (FIG. 2(f)), and the protection is performed using this. A polarization pattern may be formed on the surface of the layer.

An insulating layer 400 may be formed below the metal layer. The heat insulation layer 400 is installed to block the cold air of the slab on which the metallic flooring material is installed, and is made of a non-woven fabric using nanofibers and can have high thermal insulation properties. In addition, this heat insulating layer is formed at the same time as the shock absorbing layer to be described later, and can be manufactured quickly and at a low cost compared to separately formed and bonded as in the conventional method.

The shock absorbing layer 500 is formed below the heat insulating layer 400 and is a layer for absorbing shock and vibration transmitted from the upper portion of the flooring material, and contains balls made of urethane therein so as to effectively absorb vibration. have.

Looking at this in detail, the vibration transmitted from the surface of the flooring material has a certain wavelength. Although such vibration is generally absorbed by a plate-shaped elastic body, when the vibration is in contact with a spherical elastic body having an integer ratio of wavelengths, it can be more easily absorbed and attenuated by resonating with the elastic body. Therefore, in the case of the present invention, the vibration can be more effectively absorbed by including a polyurethane ball having a diameter of 0.1 to 5 mm inside the shock absorbing layer. At this time, the polyurethane balls may be used by mixing spherical balls having a diameter of 0.1 to 5 mm in a uniform ratio in order to absorb various vibrations.

Also, as described above, the heat insulating layer 400 and the shock absorbing layer 500 may be manufactured in one process and attached to the metal layer. To this end, in the heat insulating layer and the shock absorbing layer, installing a collection plate under the injection nozzle and applying a high voltage between the injection nozzle and the collection plate; supplying the melted or melted polymer through the injection nozzle; Discharging the molten polymer to the outside of the injection nozzle by rotating a centrifugal rotation unit in which the injection nozzle is installed; forming nanofibers on an upper portion of the collecting plate by applying a high voltage as the discharged polymer moves downward; Forming a thermal insulation layer by ultrasonically welding the nanofibers; arranging a polymeric vibration absorber on top of the heat insulating layer; Forming a shock absorbing layer by applying a compound for forming a shock absorbing layer on top of the polymer absorber; and attaching a lower portion of the heat insulating layer to the heating layer.

The nanofibers are produced by spraying polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyethylene terephthalate, polycarbonate, or mixtures thereof in a solvent type or molten form to have a diameter of 50 to 100 nm and electrospinning. As in the above method, the polymer may be sprayed onto the collecting plate in a solvent type or molten type to form nanofibers, and then made into a nonwoven fabric to form the heat insulating layer.

Looking at the nanofiber manufacturing method in detail, a polymer resin is dissolved in a solvent or supplied to a melting tank, heated to make it into a molten state, and then the dissolved or melted polymer resin is supplied to a spray nozzle.

At this time, one or more injection nozzles may be installed in the direction of the collecting plate installed in the front, and a centrifugal injection nozzle having a plurality of nozzles radially arranged on the outer surface of the centrifugal rotation unit may be used.

When a plurality of injection nozzles are disposed in the direction of the collection plate, a voltage of 5 to 40 kV to the injection nozzle and a voltage of 1 to 10 kV to the collection plate may be applied using a high voltage generator, and the injected polymer resin is nanofibers can be formed.

At this time, if the voltage applied to the injection nozzle is less than 5 kV, the formation of nanofibers may not be smooth, and if a voltage exceeding 40 kV is supplied, the supplied power reaches the collector plate to generate an arc or generate nanofibers. can be oxidized or melted.

In addition, a voltage of 1 to 10 kV may be supplied to the collection plate so that the nanofibers may be attached by applying electrostatic attraction to the generated nanofibers. When the voltage applied to the collection plate is less than 1 kV, it may be difficult to collect nanofibers due to weakening of the electrostatic attraction, and when a voltage exceeding 10 kV is applied, an arc may be generated by being energized with the injection nozzle.

In the case of using a centrifugal sprayer, a plurality of sprayers may be radially installed around the centrifugal rotation unit, and centrifugal force may be applied to the polymer resin to be sprayed as the centrifugal rotation unit rotates during injection. Molten or melted polymer resin may be introduced into the centrifugal rotation unit, and may be supplied to the spray nozzle by rotation of the centrifugal rotation unit.

In addition, as described above, a high voltage generator is electrically connected to the injection nozzle to apply a voltage of 5 to 40 kV. At this time, it is possible to apply the high voltage by connecting the high voltage generator to each of the spray nozzles, but since the spray nozzle is connected to the centrifugal rotation unit, it is also possible to connect the high voltage generator to the centrifugal rotation unit and simultaneously apply the high voltage.

In addition, a collection plate is provided on the side or bottom of the centrifugal injector, and as described above, the collection plate can effectively collect nanofibers generated by applying a voltage of 1 to 10 kV using a high voltage generator. can

As described above, after the spinning of the nanofibers is completed, the heat insulating layer can be formed by fusing them using ultrasonic waves.

After the formation of the heat insulating layer 400 is completed, spherical balls made of the urethane resin may be arranged as a polymer vibration absorber on top of the heat insulating layer. At this time, it is as described above that the urethane balls are randomly arranged to absorb vibrations having various wavelengths.

As described above, after the arrangement of the polymeric vibration absorber is completed, a shock absorbing layer may be formed by applying a compound for forming a shock absorbing layer. At this time, the compound for forming the shock absorbing layer is manufactured to have an appropriate viscosity to form a shock absorbing layer including the polymer shock absorber therein and impregnates a part of the heat insulating layer to further perform a role of fixing the heat insulating layer. have. In this process, it is preferable to impregnate 10 to 50% of the thickness of the heat insulating layer with the compound for forming the shock absorbing layer. When less than 10% of the heat insulating layer is impregnated with the compound for forming the shock absorbing layer, the fixing power of the heat insulating layer may be reduced, and when the compound for forming the shock absorption layer is impregnated with more than 50%, the heat insulating property may be deteriorated.

As described above, after the formation of the heat insulating layer 400 and the shock absorbing layer 500 is completed, the heat insulating layer may be attached to the lower portion of the rapid layer.

In addition, a conductive layer and a heating layer may be formed between the metal layer and the heat insulating layer. Since the metal flooring material has high conductivity, it can give a user a cold feeling when simply used as a flooring material, and in particular, in winter, it can easily conduct indoor heat to the outside to lower the internal temperature. Therefore, by forming a constant heating layer under the metal layer, the temperature of the metal layer can be kept constant, and the user's body temperature can be prevented from falling.

The conductive layer is formed below the metal layer and can evenly distribute heat generated in the heating layer to the metal layer. When the metal layer is made of copper with high conductivity, heat conduction is easy and the heat generated in the heating layer can be spread uniformly. However, for durability and chemical resistance, the metal layer may be made of aluminum alloy or stainless steel with low conductivity. . In this case, local heating may occur because the heat supplied from the heating layer is not uniformly conducted, which may cause inconvenience to the user and damage to the printing layer. Therefore, it is preferable to quickly transfer the heat generated in the heating layer to the entire flooring by forming a conductive layer under the metal layer.

To this end, the conductive layer may include 3 to 10 parts by weight of the linear carbon compound based on 100 parts by weight of the conductive polymer.

The linear carbon compound is used as a means for primarily transferring heat generated in the heating layer, and may be mixed with the conductive polymer to form a kind of network structure. Such a network structure enables heat to be easily transferred through various paths, and even if some breaks occur, the heat can be transferred by bypassing the broken parts, so that its performance can be maintained even during long-term use. In this case, the linear carbon compound may be included in an amount of 3 to 10 parts by weight based on 100 parts by weight of the conductive polymer. When the amount of the linear carbon compound is less than 3 parts by weight, the network structure may not be formed, and when the amount of the linear carbon compound is greater than 10 parts by weight, aggregation of the linear carbon compound may occur.

The conductive polymer refers to a polymer resin capable of conducting heat, and secondarily transfers the heat transferred by the linear carbon compound to the metal layer, and can be used as a matrix to which the linear carbon compound can be fixed.

After the formation of the conductive layer is completed as described above, a heating layer may be formed under the conductive layer. The heating layer may be manufactured by arranging previously used heating wires at regular intervals and then forming a waterproof layer on the surface. However, both ends of the heating wire are formed at the ends of the flooring material and connectors are attached to adjacent flooring materials. It is possible to connect the heating wire formed under each flooring material of the installation machine. Through this, the entire heating wire under the flooring material can be connected and controlled as one, and also divided into 2 to 5 parts to be controlled, so that the temperature of the floor can be easily controlled.

It is preferable to finish by forming a waterproof layer after the heating wire is installed. This waterproof layer is formed to protect the heating wire from moisture and at the same time prevent corrosion of the metal layer due to moisture, and to prevent the penetration of moisture as described above. It can be formed by applying a polymer resin that can be.

In addition, a cork layer may be further included under the metal layer. Cork refers to a porous layer formed on the outer skin of a plant, has some elasticity, and can have high insulation properties because it consists of a plurality of compartments. In the case of the present invention, by forming such a cork layer under the metal layer, it is possible to further improve the thermal insulation and shock absorption properties of the metal flooring material. The cork layer may be formed above or below the heat insulation layer or the stratification absorption layer, and is preferably formed between the metal layer and the heat insulation layer to simultaneously perform primary insulation and shock absorption.

In addition, if the cork layer is provided at all times, when the metal flooring material is discarded after use is completed, it can be rapidly reprocessed or melted and reused, and the cork layer can be biodegraded even if simply discarded or landfilled. Therefore, in the case of the metal flooring material of the present invention, compared to conventional flooring materials, the environmental impact can be minimized. Flooring can be provided.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific embodiments described above, and is common in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Of course, various modifications are possible by those with knowledge of, and these modifications should not be individually understood from the technical spirit or prospect of the present invention.

100: metal layer
110: primary void
111: secondary void
200: printing layer
210: perforation
300: protective layer
310: protective layer surface
320: pattern material
330: polarizing material
400: heat insulation layer
500: shock absorbing layer

Claims (7)

metal layer;
a printed layer formed on top of the metal layer;
a heat insulating layer formed under the metal layer; and
a shock absorbing layer formed under the heat insulating layer;
In the metal flooring material for preventing inter-floor noise comprising a,
A protective layer is additionally formed on top of the printed layer,
The printed layer,
Plasma-treating the surface of the metal layer; and
forming a printing layer on the surface of the plasma-treated metal layer;
It is formed by a method comprising
The plasma treatment is performed using high-pressure glow plasma under oxygen conditions,
The protective layer,
perforating the printed layer at regular intervals;
coating a compound for forming a protective layer on top of the printed layer; and
curing the compound for forming a protective layer and then forming a polarization structure on the surface;
It is prepared by a method comprising
The perforations are perforated to a predetermined depth through the printed layer to the metal layer, have a diameter of 0.01 to 0.5 mm, and are formed at intervals of 1 to 10 mm,
The protective layer is formed to pass through the perforations of the printed layer and contact the inside of the metal layer when applied,
Between the metal layer and the heat insulating layer,
a conductive layer formed under the metal layer; and
a heating layer formed under the conductive layer;
In addition,
The conductive layer includes 3 to 10 parts by weight of a linear carbon compound based on 100 parts by weight of a conductive polymer,
The linear carbon compound is mixed with the conductive polymer to form a network structure,
The heating layer,
heating wires arranged at regular intervals; and
a waterproof layer formed under the heating wire;
Including,
Both ends of the heating wire are formed at the end of the flooring material and have a connector that can be connected to the heating wire of the flooring material,
The entire heating wire under the flooring material can be connected and controlled as one,
The heat insulating layer and the shock absorbing layer,
Installing a collection plate below the injection nozzle and applying a high voltage between the injection nozzle and the collection plate;
supplying the melted or melted polymer through the injection nozzle;
Discharging the molten polymer to the outside of the injection nozzle by rotating a centrifugal rotation unit in which the injection nozzle is installed;
forming nanofibers on an upper portion of the collecting plate by applying a high voltage as the discharged polymer moves downward;
Forming a thermal insulation layer by ultrasonically welding the nanofibers;
arranging a polymeric vibration absorber on top of the heat insulating layer;
Forming a shock absorbing layer by applying a compound for forming a shock absorbing layer on the top of the polymeric vibration absorber; and
attaching a lower portion of the heat insulating layer to the heating layer;
It is prepared by a method comprising
The compound for forming the shock absorbing layer impregnates a part of the heat insulating layer,
The polymer vibration absorber is made of polyurethane and has a spherical shape with a diameter of 0.1 to 5 mm,
The shock absorbing layer is a metallic flooring material for preventing inter-floor noise, characterized in that it includes the polymer vibration absorber therein.
delete According to claim 1,
An air gap is formed in an upper portion of the metal layer at a position corresponding to the perforation,
The void is
applying a protective agent to the surface of the metal layer;
perforating the metal layer coated with the protective agent at regular intervals;
forming a primary void by dipping the perforated metal layer in a primary etching solution and performing primary etching to expand an inner wall of the perforation;
immersing the metal layer in which the primary voids are formed in a secondary etchant to form secondary voids on the walls of the voids; and
removing the protective agent after the formation of the secondary pores is completed;
Metallic flooring material for preventing inter-floor noise, characterized in that produced by a method comprising a.
According to claim 1,
The polarization structure on the surface of the protective layer,
(a) applying a pattern material to the surface of the protective layer;
(b) forming a pre-pattern by etching the pattern material at regular intervals;
(c) after the etching is completed, applying a polarizing material on the exposed protective layer and the remaining pre-pattern;
(d) attaching the polarizing material to the side surface of the pre-pattern through etching; and
(e) formed by a method comprising the step of removing the prepattern,
In the step (b), a prepattern is formed by applying a pattern material on the protective layer and then performing a lithography or imprinting process,
The etching is a metal flooring material for preventing interlayer noise, characterized in that the milling process is performed by forming plasma using gas under a pressure of 0.1 mTorr to 10 mTorr and then accelerating the plasma to 100 eV to 5,000 eV.
delete delete According to claim 1,
A metal flooring material for preventing inter-floor noise, characterized in that it further comprises a cork layer at the bottom of the metal layer.

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