KR102466934B1 - Display device - Google Patents

Abstract

The present invention relates to a display device, and the display device according to the present invention includes a first substrate including a display area and a non-display area, a first structure disposed under the first substrate in the non-display area, and a first substrate on the first substrate. 2 substrates, a second structure disposed on the second substrate in a non-display area, and a liquid crystal layer disposed between the first substrate and the second substrate, the first substrate and the second substrate comprising the first structure and the second structure. Since the thickness and toughness are different, durability of the substrate in the non-display area is improved, and thus damage to the substrate during the manufacturing process of the display device may be reduced.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a display device in which durability of a substrate is improved and a defect rate is reduced.

Recently, as we enter the information age in earnest, the display field that visually expresses electrical information signals has developed rapidly. Device) has been developed and is rapidly replacing the existing cathode ray tube (CRT).

Specific examples of such a flat panel display include a liquid crystal display (LCD), an organic light emitting display (OLED), an electrophoretic display (EPD), a plasma display (PDP), and an electrowetting display (EWD). have.

The display device includes a substrate supporting various components of the display device. The substrate may be flexible and includes a display area where an image is displayed and a non-display area surrounding the display area. A plurality of pads may be disposed in the non-display area, and a chip on film (COF) may be disposed on the plurality of pads.

In the case of a flexible substrate, it can be easily damaged during a manufacturing process of a display device. Specifically, during a process such as bonding a COF to a plurality of pads, removing a glass substrate disposed outside the substrate, or attaching a polarizer to the outside of the substrate, the substrate may be exposed to high temperatures or an external force may be applied to the substrate. . Therefore, during the manufacturing process of the display device, the substrate may be deformed by high temperature or damaged by external force.

An object of the present invention is to provide a display device in which damage to the substrate is minimized and the defect rate of the display device is reduced by disposing a structure having a different toughness from that of the substrate outside the substrate in the non-display area.

Another object to be solved by the present invention is to provide a display device having enhanced durability of a substrate by disposing a structure having a thermal expansion coefficient smaller than that of the substrate outside the substrate in the non-display area.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In order to solve the above problems, a display device according to an exemplary embodiment of the present invention includes a first substrate including a display area and a non-display area, a first structure disposed under the first substrate in the non-display area, and a first substrate. A second substrate on the first substrate, a second structure disposed on the second substrate in a non-display area, and a liquid crystal layer disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate include the first structure and toughness may be different from that of the second structure. Accordingly, damage to the substrate during the manufacturing process of the display device may be minimized, and thus, the defective rate of the display device may be reduced.

In order to solve the above problems, a display device according to another embodiment of the present invention provides a first substrate including a display area and a non-display area, a second substrate facing the first substrate, and the first substrate and the second substrate. liquid crystal layer between the first sub-substrate disposed on the outer surface of the first substrate in the non-display area and made of a material different from that of the first substrate and disposed on the outer surface of the second substrate in the non-display area and made of a material different from that of the second substrate It may include a second sub-substrate made of. Accordingly, the toughness of the first substrate and the second substrate in the non-display area may be improved, and damage to the first substrate and the second substrate may be reduced during a manufacturing process of the display device.

Other embodiment specifics are included in the detailed description and drawings.

The present invention has an effect of reducing damage to the substrate during the manufacturing process of the display device by improving durability of the substrate in the non-display area.

In addition, the present invention has an effect of improving the durability of the display device because the thermal expansion rate of the substrate is reduced so that it is not easily deformed by heat.

Effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a plan view of a display device according to an exemplary embodiment of the present invention.
FIG. 2 is a cross-sectional view of II-II' of FIG. 1 .
3A to 3G are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention.
4 is a cross-sectional view of a display device according to another exemplary embodiment of the present invention.
5A to 5F are cross-sectional views illustrating a method of manufacturing a display device according to another exemplary embodiment of the present invention.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative, so the present invention is not limited to the details shown. Like reference numbers designate like elements throughout the specification. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

When an element or layer is referred to as “on” another element or layer, it includes all cases where another element or layer is directly on top of another element or another layer or other element intervenes therebetween.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Like reference numbers designate like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the size and thickness of the illustrated components.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, and as those skilled in the art can fully understand, various interlocking and driving operations are possible, and each embodiment can be implemented independently of each other. It may be possible to implement together in an association relationship.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a display device according to an exemplary embodiment of the present invention. FIG. 2 is a cross-sectional view of II-II' of FIG. 1 . In FIG. 1 , only the first substrate 111 , the data driver 120 , the gate driver 130 , and the plurality of pixels PX of the display device 100 are illustrated for convenience of description.

Referring to FIGS. 1 and 2 , the first substrate 111 is a base member for supporting various components of the display device 100 and may be made of a transparent insulating material. For example, the first substrate 111 may be made of a material having flexibility, and may be made of, for example, a plastic material such as polyimide. Specifically, the first substrate 111 may be made of transparent polyimide, but is not limited thereto.

A display area AA and a non-display area NA surrounding the display area AA may be defined on the first substrate 111 . Also, the first substrate 111 may have a flat shape in the display area AA and the non-display area NA. That is, the first substrate 111 may be flat over the entire area, and there may be no step difference in the first substrate 111 at the boundary between the display area AA and the non-display area NA.

Specifically, the display area AA is an area where an image is actually displayed on the display device 100 . A display unit, various driving elements for driving the display unit, and a plurality of signal lines may be disposed in the display area AA. For example, the display unit may be a liquid crystal display unit that drives liquid crystal by an electric field generated by a voltage applied to the pixel electrode 151 and the common electrode 152 . However, the display unit is not limited thereto, and the display unit may be an organic light emitting display unit composed of an organic light emitting element including an anode, an organic layer, and a cathode. In addition, various driving elements such as a transistor 140 and a capacitor for driving the display unit may be disposed in the display area AA. Although the display device 100 has been described as a liquid crystal display device in this specification, it is not limited thereto, and the display device 100 may also be an organic light emitting display device.

Specifically, a plurality of pixels PX are defined in the display area AA. The plurality of pixels PX is a minimum unit that emits light, and may include a red pixel, a green pixel, and a blue pixel. The plurality of pixels PX are defined in an area where the black matrix 170 is not disposed, and is an area where an image is displayed. Each of the plurality of pixels PX may be connected to a signal line, that is, a gate line and a data line.

Specifically, although not shown in FIG. 1 , a plurality of signal wires may be disposed in the display area AA of the first substrate 111 . The plurality of signal wires may include a plurality of data wires and a plurality of gate wires. The plurality of data lines extend in the first direction and transmit data signals to the plurality of pixels PX. The plurality of gate lines extend in the second direction and transmit gate signals to the plurality of pixels PX. In this case, the first direction and the second direction may be directions perpendicular to each other, but are not limited thereto.

The non-display area NA is an area in which an image is not displayed and is an area surrounding the display area AA. Various elements for driving the plurality of pixels PX disposed in the display area AA may be disposed in the non-display area NA. For example, as shown in FIG. 1 , a data driver 120 and a gate driver 130 may be disposed. In addition, link wires connected to various signal wires of the display area AA may be disposed in the non-display area NA. The data driver 120 and the gate driver 130 may be bonded to a plurality of pads formed in the non-display area NA.

The plurality of pads may be connected to the link wiring and may be connected to the signal wiring through the link wiring. Accordingly, each of the plurality of pads may be electrically connected to each of the plurality of pixels PX. Specifically, the data link wiring is connected to the data wiring. The gate link wiring is connected to the gate wiring.

The data driver 120 is a component for processing data for displaying an image and a driving signal for processing the data, and is a component for supplying signals to the plurality of pixels PX of the display area AA. The data driver 120 supplies data signals to the plurality of pixels PX of the display area AA through the data link lines disposed in the non-display area NA. Although the number of data drivers 120 is illustrated in FIG. 1 , the number of data drivers 120 is not limited thereto.

Referring to FIG. 1 , the data driver 120 includes a base film 121 and a driver IC 122 . The base film 121 is a film supporting the data driver 120 . The base film 121 may be made of an insulating material, for example, may be made of an insulating material having flexibility. The driving IC 122 is a component that processes a data voltage for displaying an image and a driving signal for processing the data voltage. The driving IC 122 is disposed on the first substrate 111 of the display device 100 in a manner such as COG (Chip On Glass), COF (Chip On Film), TCP (Tape Carrier Package), or the like. It can be. In FIG. 1 , for convenience of explanation, the data driver 120 is illustrated as a COF type mounted on the base film 121 , but is not limited thereto.

The gate driver 130 may output a gate signal under the control of a timing controller and select a pixel PX to which the data voltage is charged through a gate link line. The gate driver 130 may sequentially supply gate signals to gate wires using a shift register. The gate driver 130 includes a base film 131 and a driving IC 132 . The base film 131 is a film supporting the gate driver 130 . The base film 131 may be made of an insulating material, for example, may be made of an insulating material having flexibility. The driving IC 132 is a component that processes a gate voltage for displaying an image and a driving signal for processing it. The driving IC 132 is disposed on the first substrate 111 of the display device 100 in a manner such as COG (Chip On Glass), COF (Chip On Film), TCP (Tape Carrier Package), or the like. It can be. In FIG. 1 , for convenience of explanation, the gate driver 130 is illustrated as a COF method mounted on the base film 131 , but is not limited thereto. In addition, although the number of gate driving units 130 is shown as plural, the present invention is not limited thereto, and one gate driving unit 130 may be disposed on the first substrate 111 .

Referring to FIG. 2 , a transistor 140 is disposed on a first substrate 111 . The transistor 140 includes a gate electrode 141 , an active layer 142 disposed on the gate electrode 141 , and a source electrode 143 and a drain electrode 144 disposed on the active layer 142 . More specifically, a gate electrode 141 is formed on the first substrate 111 . A gate insulating layer 113 is formed on the gate electrode 141 , and an active layer 142 in which a channel of the transistor 140 is formed is formed on the gate insulating layer 113 . The gate insulating layer 113 may electrically insulate the active layer 142 and the gate electrode 141 . The gate insulating layer 113 is made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may be a single layer or a plurality of layers thereof, but is not limited thereto. A source electrode 143 and a drain electrode 144 of the transistor 140 may be formed on the active layer 142 . The transistor 140 may be a bottom gate type transistor as shown in FIG. 2 , but the transistor 140 is not limited thereto and may be a top gate type transistor.

Each of the plurality of transistors 140 may be electrically connected to a plurality of gate wires. Specifically, the plurality of gate wires may be disposed between the plurality of pixels PX and electrically connected to each of the plurality of transistors 140 . The plurality of transistors 140 may receive gate signals from each of the plurality of gate lines and transmit the gate signals to each of the plurality of pixels PX.

A passivation layer 114 is disposed on the plurality of transistors 140 . The passivation layer 114 is an insulating layer for protecting the transistor 140 . The passivation layer 114 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx). However, it is not limited thereto, and the passivation layer 114 may be omitted according to design.

A first planarization layer 115 is disposed on the passivation layer 114 . The first planarization layer 115 is a layer for planarizing an upper portion of elements such as the transistor 140 disposed in the display area AA. The first planarization layer 115 may be an insulating layer made of an organic material.

A pixel electrode 151 is disposed on the first planarization layer 115 . Specifically, the pixel electrode 151 is an electrode for forming an electric field in liquid crystal included in the display device 100 . The pixel electrode 151 may be disposed on the first planarization layer 115 in an area where a plurality of pixels PX are defined. In addition, the pixel electrode 151 may be connected to the drain electrode 144 of the transistor 140 through a contact hole formed in the first planarization layer 115 . Also, the pixel electrode 151 may be made of a transparent conductive material such as indium tin oxide (ITO), but is not limited thereto.

Also, a common electrode 152 is disposed on the first planarization layer 115 . The common electrode 152 is an electrode for forming an electric field in the liquid crystal layer 160 by forming an electric field together with the pixel electrode 151 . That is, the pixel electrode 151 and the common electrode 152 form an electric field, and the liquid crystal layer 160 can be driven by the electric field. The common electrode 152 may be made of the same material as the pixel electrode 151, and may be made of, for example, a transparent conductive material such as indium tin oxide (ITO), but is not limited thereto. Although the pixel electrode 151 and the common electrode 152 are illustrated as being disposed on the same plane in FIG. 2 , this is exemplary, and the arrangement of the pixel electrode 151 and the common electrode 152 is not limited thereto.

A lower alignment layer 116 is disposed on the first planarization layer 115 , the pixel electrode 151 and the common electrode 152 . The lower alignment layer 116 is a component for controlling alignment of liquid crystal included in the liquid crystal layer 160 . The initial arrangement of liquid crystal molecules included in the liquid crystal layer 160 may be matched by the lower alignment layer 116 .

A liquid crystal layer 160 is disposed on the lower alignment layer 116 . The liquid crystal layer 160 is a layer containing liquid crystal and can transmit or block light by an electric field. Specifically, an electric field may be formed by the common electrode 152 and the pixel electrode 151, and the liquid crystal layer 160 may be driven by the electric field to block or transmit light.

A sealant 117 is disposed on the lower alignment layer 116 . The sealant 117 is a component that seals the liquid crystal layer 160 and is disposed between the first substrate 111 and the second substrate 112 to fix the first substrate 111 and the second substrate 112 . The sealant 117 may be disposed on the lower alignment layer 116 of the non-display area NA, surrounding the display area AA. Accordingly, all side surfaces of the liquid crystal layer 160 may be in contact with the sealant 117 and the liquid crystal layer 160 may be sealed. However, it is not limited thereto, and the sealant 117 may be disposed to directly contact the first substrate 111 .

A first polarizer is disposed below the first substrate 111 . Specifically, the first polarizer 191 is disposed on the outer surface of the first substrate 111 in the display area AA.

A first structure 181 is disposed below the first substrate 111 . The first structure 181 may function as a first sub-substrate disposed under the first substrate 111 . Specifically, the first structure 181 is disposed below the first substrate 111 in the non-display area NA. The first structure 181 may be disposed on the outer surface of the first substrate 111 in the entire non-display area NA. The first structure 181 disposed in the non-display area NA overlaps the sealant 117 . That is, the sealant 117 may be disposed above the first structure 181 .

The first structure 181 is in contact with the side surface of the first polarizer 191 . Specifically, the first polarizer 191 is disposed below the first substrate 111 in the display area AA, that is, on the outer surface. Accordingly, each of the side surface of the first structure 181 and the side surface of the first polarizer 191 may come into contact with each other at the boundary between the display area AA and the non-display area NA.

In addition, the upper surface of the first structure 181 and the upper surface of the first polarizing plate 191 are disposed on the same plane. Specifically, both the upper surface of the first structure 181 and the upper surface of the first polarizing plate 191 contact the lower surface of the first substrate 111 . As described above, the first substrate 111 has a flat surface in the display area AA and the non-display area NA. Accordingly, the lower surface of the first substrate 111 is flat in the display area AA where the first polarizer 191 is disposed and the non-display area NA where the first structure 181 is disposed. Accordingly, the upper surface of the first structure 181 and the upper surface of the second structure 182 are disposed on the lower surface of the flat first substrate 111, that is, on the same plane.

The first structure 181 and the first substrate 111 may have different toughness. Toughness refers to the ability of an object to withstand being deformed by an external force without being destroyed. When an external force is applied to an object, the object undergoes elastic deformation that can return to its original shape, and as a larger external force is applied, the object undergoes plastic deformation that cannot return to its original shape. When a specific external force greater than the external force causing plastic deformation is applied to the object, the object may be destroyed, that is, damaged. Therefore, toughness may be determined based on the magnitude of an external force until an object undergoes elastic deformation or plastic deformation and is destroyed, and the degree of deformation of the object prior to destruction. Toughness can be defined as the energy per unit volume applied to a material until it breaks. An object with high toughness may have a large amount of deformation leading to failure as well as a large external force until failure compared to an object with low toughness.

Specifically, the toughness of the first structure 181 may be greater than that of the first substrate 111 . The magnitude of the external force applied to the first structure 181 until destruction may be greater than that of the first substrate 111 , and the amount of deformation until destruction may be greater. Accordingly, the energy per unit volume applied until the first structure 181 is destroyed may be greater than the energy per unit volume applied until the first substrate 111 is destroyed. That is, the first structure 181 is tougher than the first substrate 111, and thus may not be easily broken even though it is deformed by receiving an external force.

Also, the first structure 181 and the first substrate 111 may have different coefficients of thermal expansion. The coefficient of thermal expansion refers to the ratio of the change in volume of an object to the change in temperature due to a change in temperature under a constant pressure. A material with a relatively high coefficient of thermal expansion has a large increase in volume as the temperature rises.

Specifically, the coefficient of thermal expansion of the first structure 181 may be smaller than that of the first substrate 111 . Under the constant and same pressure, the change in volume of the first structure 181 according to the change in temperature may be smaller than the change in volume of the first substrate 111 according to the change in temperature. That is, the shape of the first structure 181 may not be easily deformed according to a change in temperature than the first substrate 111 .

For example, the thermal expansion coefficient of the first substrate 111 may be greater than or equal to 20 ppm/°C and less than or equal to 30 ppm/°C. When the coefficient of thermal expansion of the first substrate 111 is less than 20 ppm/° C., the value of the refractive index (Rth) in the thickness direction of the first substrate 111 increases and the contrast ratio may be reduced. Accordingly, the display The image quality of the device 100 may be reduced.

Also, the thermal expansion coefficient of the first substrate 111 may be 30 ppm/°C or less. When the thermal expansion rate of the first substrate 111 is increased, as described above, the degree of deformation by heat may be increased. In particular, when the coefficient of thermal expansion of the first substrate 111 is greater than 30 ppm/°C, the first substrate 111 may warp during a heating process and a cooling process during the manufacturing process of the display device 100 . Variations of (111) can occur.

Also, the thermal expansion coefficient of the first structure 181 may be smaller than that of the first substrate 111 . For example, the thermal expansion coefficient of the first structure 181 may be less than 20 ppm/°C. When the coefficient of thermal expansion of the first structure 181 is greater than or equal to 20 ppm/° C., the degree of heat-induced deformation of the first structure 181 may increase. When the coefficient of thermal expansion of the first structure 181 is 20 ppm/°C or higher, deformation may occur in the first structure 181 during a heating process and a cooling process during manufacturing of the display device 100 . Therefore, when the coefficient of thermal expansion of the first structure 181 is less than 20 ppm/°C, the increase in the volume of the first structure 181 according to the increase in temperature may be reduced, and thus, during the manufacturing process of the display device 100, the first structure 181 may increase in volume. Deformation of the structure 181 may be reduced.

For example, the first structure 181 may be made of a plastic material such as polyimide or colored polyimide. That is, unlike the first substrate 111 , the first structure 181 may be made of non-transparent and colored polyimide. For example, the first structure 181 may be made of yellow polyimide. In addition, the first structure 181 may be made of a fiber reinforced polymer (FRP). However, it is not limited thereto.

A second substrate 112 is disposed on the liquid crystal layer 160 . The second substrate 112 is a base member for supporting various components of the display device 100 and may be made of an insulating material. The second substrate 112 may support the black matrix 170 , the color filter 180 , the second planarization layer 118 , and the upper alignment layer 119 disposed below the second substrate 112 . The second substrate 112 may be made of the same material as the first substrate 111 . For example, the second substrate 112 may be made of a material having flexibility, and may be made of, for example, a plastic material such as polyimide. Specifically, the second substrate 112 may be made of transparent polyimide, but is not limited thereto.

A black matrix 170 is disposed under the second substrate 112 . The black matrix 170 may block elements disposed below the black matrix 170 from being viewed. The black matrix 170 is disposed in an area excluding the plurality of pixels PX in the display area AA. That is, the black matrix 170 is disposed in the entire display area AA except for the plurality of pixels PX, so that devices such as the gate wiring and the transistor 140 disposed between the plurality of pixels PX are visually recognized. can block

A color filter 180 is disposed under the second substrate 112 . The color filter 180 is a component containing dyes or pigments. The color filter 180 may include a red color filter, a green color filter, and a blue color filter. The red color filter includes a red dye or pigment and is disposed in a red pixel to transmit only red light. The green color filter includes a green dye or pigment and is disposed in a green pixel to transmit only green light. The blue color filter includes a blue dye or pigment and is disposed in a blue pixel to transmit only blue light.

A second planarization layer 118 is disposed under the second substrate 112 , the black matrix 170 and the color filter 180 . The second planarization layer 118 is a layer for planarizing the lower surface of the second substrate 112 on which the color filters 180 and the black matrix 170 are disposed. The second planarization layer 118 may be made of the same material as the first planarization layer 115 . For example, the second planarization layer 118 may be an insulating layer made of an organic material. In FIG. 2 , the sealant 117 is illustrated as being in contact with the second planarization layer 118 , but is not limited thereto, and the sealant 117 may be disposed in direct contact with the second substrate 112 .

An upper alignment layer 119 is disposed below the second planarization layer 118 . The upper alignment layer 119 is a component for controlling alignment of liquid crystal included in the liquid crystal layer 160 . The initial arrangement of liquid crystal molecules included in the liquid crystal layer 160 may be matched by the upper alignment layer 119 .

A second polarizer is disposed on the second substrate 112 . Specifically, the second polarizer 192 is disposed on the outer surface of the second substrate 112 in the display area AA.

A second structure 182 is disposed on the second substrate 112 . The second structure 182 may function as a second sub-substrate disposed on the second substrate 112 . Specifically, the second structure 182 is disposed on the second substrate 112 in the non-display area NA. The second structure 182 may be disposed on the outer surface of the second substrate 112 in the entire non-display area NA. The second structure 182 disposed in the non-display area NA overlaps the sealant 117 . That is, the sealant 117 may be disposed under the second structure 182 . Accordingly, the sealant 117 is disposed between the first structure 181 and the second structure 182 .

The second structure 182 is in contact with the side surface of the second polarizing plate 192 . Specifically, the second polarizing plate 192 is disposed on the second substrate 112 , that is, on the outer surface of the second substrate 112 in the display area AA. Accordingly, each of the side surface of the second structure 182 and the side surface of the second polarizer 192 may contact each other at the boundary between the display area AA and the non-display area NA.

In addition, the lower surface of the second structure 182 and the lower surface of the second polarizing plate 192 are disposed on the same plane. Specifically, both the lower surface of the second structure 182 and the lower surface of the second polarizing plate 192 contact the upper surface of the second substrate 112 . As described above, the second substrate 112 has a flat surface in the display area AA and the non-display area NA. Accordingly, the upper surface of the second substrate 112 is flat in the display area AA where the second polarizer 192 is disposed and the non-display area NA where the second structure 182 is disposed. Accordingly, the lower surface of the second structure 182 and the lower surface of the second structure 182 are disposed on the upper surface of the second substrate 112 having a flat shape, that is, on the same plane.

The second structure 182 and the second substrate 112 may have different toughness. As described above, toughness refers to the property that an object can withstand being deformed by an external force without being destroyed. The magnitude and amount of deformation of the external force until destruction of the second structure 182 according to the application of the external force may be different from the magnitude and amount of deformation of the external force until destruction of the second substrate 112 . That is, the second structure 182 and the second substrate 112 may exhibit different degrees of toughness and not easily breakage.

Specifically, the toughness of the second structure 182 may be greater than that of the second substrate 112 . The magnitude of the external force applied to the second structure 182 until destruction may be greater than that of the second substrate 112 , and the amount of deformation until destruction may be greater. Energy per unit volume applied until the second structure 182 is destroyed may be greater than energy per unit volume applied until the second substrate 112 is destroyed. That is, the second structure 182 is tougher than the second substrate 112 and may not be easily broken even though it is deformed by receiving an external force.

Also, the second structure 182 and the second substrate 112 may have different coefficients of thermal expansion. As described above, the coefficient of thermal expansion means the ratio of the change in volume of an object to the increase in temperature under a constant pressure. Accordingly, an increase in the volume of the second structure 182 according to an increase in temperature may be different from an increase in the volume of the second substrate 112 .

Specifically, the thermal expansion coefficient of the second structure 182 may be smaller than the thermal expansion coefficient of the second substrate 112 . Under the constant and same pressure, the change in volume of the second structure 182 according to the change in temperature may be smaller than the change in volume of the second substrate 112 according to the change in temperature. That is, the shape of the second structure 182 may not be easily deformed according to a change in temperature than the second substrate 112 .

For example, the thermal expansion coefficient of the second structure 182 may be less than 20 ppm/°C. When the thermal expansion rate of the second structure 182 is greater than or equal to 20 ppm/°C, the degree of heat deformation of the second structure 182 may increase. When the thermal expansion rate of the second structure 182 is 20 ppm/°C or higher, deformation may occur in the second structure 182 during a heating process and a cooling process during manufacturing of the display device 100 . Therefore, when the coefficient of thermal expansion of the second structure 182 is less than 20 ppm/°C, the increase in the volume of the second structure 182 according to the increase in temperature may be reduced, and thus, during the manufacturing process of the display device 100, the second structure 182 may increase in volume. Deformation of structure 182 may be reduced.

The second structure 182 may be made of the same material as the first structure 181 . For example, the second structure 182 may be made of a plastic material such as polyimide or colored polyimide. That is, unlike the second substrate 112 , the second structure 182 may be made of non-transparent and colored polyimide. For example, the first structure 181 may be made of yellow polyimide. In addition, the second structure 182 may be made of a fiber reinforced polymer. However, it is not limited thereto.

In the case of a conventional display device, the upper and lower substrates are made of a material with low toughness. In order for an image to be recognized on the surface of the display device, the upper and lower substrates may be made of a flexible and transparent material and have low toughness. When the upper and lower substrates have low toughness, damage may occur to the upper or lower substrate during the manufacturing process of the display device. Specifically, during the display device manufacturing process, a process of attaching an external module such as a COF to a plurality of pads disposed on a substrate and a process of attaching an upper substrate and a lower substrate using a sealant may be performed. In addition, during the display device manufacturing process, a process of attaching polarizers to the outer surfaces of the upper and lower substrates and a process of removing glass substrates supporting the upper and lower substrates from the outer surfaces of the upper and lower substrates are performed. It can be. In the process of performing these processes, the upper substrate and the lower substrate may be damaged such as tearing. In particular, the non-display areas of the upper and lower substrates are located outside the upper and lower substrates, and thus may be more easily damaged than the display areas. When the non-display areas of the upper and lower substrates are damaged, various wires and pads disposed in the non-display areas may be damaged, and thus, the defective rate of the display device may increase.

And, in the case of a conventional display device, the upper substrate and the lower substrate may be made of a material having a relatively high thermal expansion coefficient, and thus, the shape may be deformed during the manufacturing process of the display device. Specifically, during the manufacturing process of the display device, a process of forming a plurality of transistors on the lower substrate and a process of forming a color filter under the upper substrate may be performed. However, during these processes, the upper substrate and the lower substrate may be exposed to high temperatures. The upper substrate and the lower substrate may be made of a material having a relatively high coefficient of thermal expansion, and thus may be bent or deformed.

In contrast, the display device 100 according to an exemplary embodiment of the present invention includes a first structure 181 and a second structure 182 having greater toughness than the first substrate 111 and the second substrate 112 . Accordingly, damage to the first substrate 111 and the second substrate 112 may be reduced, and the defect rate of the display device 100 may be reduced. Specifically, the first structure 181 is disposed below the first substrate 111 in the non-display area NA, and the second structure 182 is on the second substrate 112 in the non-display area NA. is placed on Also, the first structure 181 and the second structure 182 may have greater toughness than the first substrate 111 and the second substrate 112 . Energy per unit volume applied until the first structure 181 and the second structure 182 are destroyed may be greater than energy per unit volume applied until the first substrate 111 and the second substrate 112 are destroyed. That is, the first structure 181 and the second structure 182 may be made of a material that is tougher than the first substrate 111 and the second substrate 112 and can better withstand impact.

In the non-display area NA, the first substrate 111 contacts the first structure 181 and the second substrate 112 contacts the second structure 182 . Accordingly, damage to each of the first substrate 111 and the second substrate 112 due to external force during the manufacturing process of the display device 100 can be reduced by the first structure 181 and the second structure 182 having high toughness. can Specifically, in a process in which an external force may be applied to the first substrate 111 and the second substrate 112 described above during the manufacturing process of the display device 100, the first structure 181 and the second structure having relatively high toughness Each of the numerals 182 may absorb an external force applied to each of the first substrate 111 and the second substrate 112 . Accordingly, the first substrate 111 and the second substrate 112 may maintain their original shapes without being damaged, such as being torn.

Also, the display device 100 according to an exemplary embodiment of the present invention includes the first structure 181 and the second structure 182 having lower thermal expansion rates than the first substrate 111 and the second substrate 112 . , Deformation of the first substrate 111 and the second substrate 112 may be suppressed during the manufacturing process of the display device 100 . Thermal expansion rates of the first structure 181 and the second structure 182 may be lower than those of the first substrate 111 and the second substrate 112 . Therefore, when the first substrate 111 and the second substrate 112 are exposed to high temperatures during the manufacturing process of the display device 100, deformation such as bending of the first substrate 111 and the second substrate 112 is reduced. It can be. Accordingly, the defect rate of the display device 100 may be reduced.

Hereinafter, a method of manufacturing the display device 100 will be described with reference to FIGS. 3A to 3G .

3A to 3G are cross-sectional views illustrating a method of manufacturing a display device according to an exemplary embodiment of the present invention.

First, referring to FIG. 3A , a first glass substrate GS1 is formed. The first glass substrate GS1 is a substrate that supports the first substrate 111 and various components disposed on the first substrate 111 under the first substrate 111 during the manufacturing process of the display device 100 . .

The thickness of the display area AA and the non-display area NA of the first glass substrate GS1 may be different from each other. Specifically, the top surface of the first glass substrate GS1 may be etched in the non-display area NA, and thus, the top surface of the first glass substrate GS1 may be etched more than the display area AA in the non-display area NA. height may be lower. Thus, the thickness of the first glass substrate GS1 in the non-display area NA may be greater than that in the display area AA.

Next, referring to FIG. 3B , a first structure 181 is disposed on the first glass substrate GS1 . The first structure 181 is formed on the first glass substrate GS1 in the non-display area NA. The first structure 181 is disposed in the non-display area NA such that the top surface of the first structure 181 is on the same plane as the top surface of the first glass substrate GS1 in the display area AA. (GS1). Accordingly, the top surface of the first glass substrate GS1 in the display area AA may be disposed on the same plane as the top surface of the first structure 181 in the non-display area NA.

Next, the first substrate 111 is disposed on the first glass substrate GS1 and the first structure 181 . The first substrate 111 is disposed on the first glass substrate GS1 in the display area AA and disposed on the first structure 181 in the non-display area NA. It may be attached on the first structure 181 . Accordingly, the first substrate 111 may have a flat shape in the display area AA and the non-display area NA.

Subsequently, referring to FIG. 3C , the transistor 140, the passivation layer 114, the first planarization layer 115, the pixel electrode 151, the lower alignment layer 116 and the common electrode ( 152) is formed. Specifically, the gate electrode 141 of the transistor 140 is formed on the first substrate 111 , and the gate insulating layer 113 is formed on the gate electrode 141 . An active layer 142 , a source electrode 143 , and a drain electrode 144 of the transistor 140 are formed on the gate insulating layer 113 .

A passivation layer 114 is formed on the transistor 140 . A first planarization layer 115 is formed on the passivation layer 114 to planarize the upper surface of the transistor 140 . A pixel electrode 151 and a common electrode 152 are formed on the first planarization layer 115 . The pixel electrode 151 is connected to the drain electrode 144 of the transistor 140 through a contact hole formed in the first planarization layer 115 and the passivation layer 114 .

A lower alignment layer 116 is formed on the pixel electrode 151 , the common electrode 152 , and the first planarization layer 115 .

Next, referring to FIG. 3D , a second structure 182 , a second substrate 112 , a black matrix 170 , a color filter 180 and a second planarization layer 118 are formed under the second glass substrate GS2 . ) is formed.

Specifically, a second glass substrate GS2 is disposed. The second glass substrate GS2 is a component that supports the second substrate 112 and various components disposed under the second substrate 112 on the second substrate 112 during the manufacturing process of the display device 100 . The thickness of the display area AA and the non-display area NA of the second glass substrate GS2 may be different from each other. Similar to the aforementioned first glass substrate GS1 , the lower surface of the second glass substrate GS2 may be etched in the non-display area NA. Thus, the thickness of the second glass substrate GS2 in the display area AA may be greater than that in the non-display area NA.

Subsequently, a second structure 182 is formed under the second glass substrate GS2 . The second structure 182 is formed under the second glass substrate GS2 in the non-display area NA. The second structure 182 is disposed in the non-display area NA such that the lower surface of the second structure 182 is on the same plane as the lower surface of the second glass substrate GS2 in the display area AA. (GS2) can be formed below. Accordingly, the lower surface of the second glass substrate GS2 in the display area AA may be disposed on the same plane as the lower surface of the second structure 182 in the non-display area NA.

Then, the second substrate 112 is disposed under the second glass substrate GS2 and the second structure 182 . The second substrate 112 is disposed under the second glass substrate GS2 in the display area AA and disposed under the second structure 182 in the non-display area NA. It may be attached under the second structure 182 . Accordingly, the second substrate 112 may have a flat shape in the display area AA and the non-display area NA.

Subsequently, a black matrix 170 is disposed below the second substrate 112 . The black matrix 170 is disposed below the second substrate 112 in an area excluding the plurality of pixels PX. The black matrix 170 is disposed under the second substrate 112 in an area excluding the plurality of pixels PX, and various components disposed in an area overlapping the black matrix 170 are placed on the upper portion of the display device 100. It can be prevented from being recognized in .

Subsequently, a color filter 180 is formed under the second substrate 112 . The color filter 180 is formed under the second substrate 112 to correspond to each of the plurality of pixels PX. For example, a red color filter may be formed to correspond to a red pixel among the plurality of pixels PX, a green color filter may be formed to correspond to a green pixel, and a blue color filter may be formed to correspond to a blue pixel.

Subsequently, a second planarization layer 118 is formed under the second substrate 112 , the color filter 180 and the black matrix 170 . The second planarization layer 118 covers both the color filter 180 and the black matrix 170 under the second substrate 112 and flattens the lower surface.

Subsequently, an upper alignment layer 119 is formed under the second planarization layer 118 . The upper alignment layer 119 may be disposed on the entire lower surface of the second planarization layer 118 .

Next, referring to FIG. 3E , the first substrate 111 and the second substrate 112 are fixed. Specifically, the sealant 117 is formed on the lower alignment layer 116 of the non-display area NA. A liquid crystal layer 160 is formed on the lower alignment layer 116 in a portion of the display area AA and the non-display area NA. The sealant 117 on the lower alignment layer 116 of the non-display area NA surrounds the liquid crystal layer 160 and may function as a dam to prevent the liquid crystal layer 160 from flowing outward. Thus, the side surface of the liquid crystal layer 160 may contact the side surface of the sealant 117 .

Subsequently, a second glass substrate GS2 is disposed on the liquid crystal layer 160 and the sealant 117 . Specifically, the second substrate 112, the black matrix 170, the color filter 180, the second planarization layer 118, and the upper alignment layer 119 are disposed on the liquid crystal layer 160 and the sealant 117 below. A second glass substrate GS2 is disposed. Pressure may be applied to the first glass substrate GS1 and the second glass substrate GS2 , and the first substrate 111 and the second substrate 112 are fixed by the sealant 117 .

Subsequently, referring to FIG. 3F , the first glass substrate GS1 and the second glass substrate GS2 are removed. The first glass substrate GS1 disposed below the first substrate 111 and the first structure 181 may be removed by a laser. Accordingly, the lower surface of the first substrate 111 and the lower surface and side surfaces of the first structure 181 in the display area AA may be exposed to the outside.

Also, the second glass substrate GS2 disposed on the second substrate 112 and the second structure 182 may be removed by a laser. Accordingly, the top surface of the first substrate 111 and the top and side surfaces of the second structure 182 in the display area AA may be exposed to the outside.

Subsequently, referring to FIG. 3G , a first polarizing plate 191 and a second polarizing plate 192 are formed on outer surfaces of the first substrate 111 and the second substrate 112 . Specifically, the first polarizer 191 is disposed on the outer surface of the first substrate 111 in the display area AA. Accordingly, the side surface of the first polarizer 191 may contact the side surface of the first structure 181 .

A second polarizer 192 is disposed on the outer surface of the second substrate 112 in the display area AA. Accordingly, the side surface of the second polarizing plate 192 may contact the side surface of the second structure 182 .

4 is a cross-sectional view of a display device according to another exemplary embodiment of the present invention. Compared to the display device 100 of FIGS. 1 and 2 , the display device 400 of FIG. 4 includes a first substrate 411 , a second substrate 412 , a first structure 481 and a second structure 482 . Except for this difference, the bar is substantially the same, and redundant description is omitted.

Referring to FIG. 4 , the first substrate 411 is a base member for supporting various components of the display device 400 and may be made of an insulating material. For example, the first substrate 411 may be made of a material having flexibility, and may be made of, for example, a plastic material such as polyimide. Specifically, the first substrate 411 may be made of transparent polyimide, but is not limited thereto.

A first structure 481 is disposed below the first substrate 411 . The first structure 481 may function as a first sub-substrate disposed below the first substrate 411 . In detail, the first structure 481 may be disposed on the outer surface of the first substrate 411 in the non-display area NA.

In this case, the lower surface of the first substrate 411 in the display area AA is disposed on the same plane as the lower surface of the first structure 481 . In detail, a portion of the first substrate 411 corresponding to the display area AA and the first structure 481 are disposed on the same layer. Accordingly, the lower surface of the first substrate 411 and the lower surface of the first structure 481 in the display area AA are disposed on the same plane, and the display area AA and the non-display area are on the first substrate 411. A step may exist at the boundary of (NA). That is, the first substrate may extend from the display area AA to the non-display area NA and may be formed higher at a portion overlapping the first structure 481 .

The first structure 481 and the first substrate 411 may have different toughness. Specifically, the toughness of the first structure 481 may be greater than that of the first substrate 411 . The first structure 481 may have a greater degree of external force applied until it is destroyed than the first substrate 411 and may have a greater amount of deformation until it is destroyed. Accordingly, the energy per unit volume applied until the first structure 481 is destroyed may be greater than the energy per unit volume applied until the first substrate 411 is destroyed. That is, the first structure 481 is tougher than the first substrate 411 and may not be easily broken even though it is deformed by an external force.

Also, the first structure 481 and the first substrate 411 may have different coefficients of thermal expansion. Specifically, the thermal expansion coefficient of the first structure 481 may be smaller than that of the first substrate 411 . Under the same and constant pressure, the change in volume of the first structure 481 according to the change in temperature may be smaller than the change in volume of the first substrate 411 according to the change in temperature. That is, the shape of the first structure 481 may not be easily deformed according to a change in temperature compared to the first substrate 411 .

For example, the thermal expansion coefficient of the first substrate 411 may be greater than or equal to 20 ppm/°C and less than or equal to 30 ppm/°C. When the coefficient of thermal expansion of the first substrate 411 is less than 20 ppm/° C., the value of the refractive index (Rth) in the thickness direction of the first substrate 411 may increase and the contrast ratio may decrease. Accordingly, the display The image quality of the device 400 may be reduced.

In addition, the thermal expansion coefficient of the first substrate 411 may be 30 ppm/°C or less. When the thermal expansion rate of the first substrate 411 is increased, as described above, the degree of deformation by heat may be increased. In particular, when the coefficient of thermal expansion of the first substrate 411 is greater than 30 ppm/° C., during a heating process and a cooling process during the manufacturing process of the display device 400, the first substrate 411 may be warped or the like. Variations of (411) may occur.

Also, the thermal expansion coefficient of the first structure 481 may be smaller than that of the first substrate 411 . For example, the thermal expansion coefficient of the first structure 481 may be less than 20 ppm/°C. When the coefficient of thermal expansion of the first structure 481 is greater than or equal to 20 ppm/°C, the degree of heat-induced deformation of the first structure 481 may increase. When the coefficient of thermal expansion of the first structure 481 is 20 ppm/°C or higher, deformation may occur in the first structure 481 during a heating process and a cooling process during manufacturing of the display device 400 . Therefore, when the coefficient of thermal expansion of the first structure 481 is less than 20 ppm/°C, the increase in the volume of the first structure 481 according to the increase in temperature may be reduced, and thus, during the manufacturing process of the display device 400, the first structure 481 may increase in volume. Deformation of the structure 481 may be reduced.

For example, the first structure 481 may be made of a plastic material such as polyimide or colored polyimide. That is, unlike the first substrate 411 , the first structure 481 may be formed of colored polyimide rather than transparent. For example, the first structure 481 may be made of yellow polyimide. In addition, the first structure 481 may be made of a fiber reinforced polymer (FRP). However, it is not limited thereto.

Also, a first polarizer 191 is disposed below the first substrate 411 . The first polarizer 191 is disposed on the outer surface of the first substrate 411 in the display area AA.

Also, the second substrate 412 is disposed to face the first substrate 411 . The second substrate 412 is a base member for supporting various components of the display device 400 and may be made of an insulating material. The second substrate 412 may be made of the same material as the first substrate 411 . For example, the second substrate 412 may be made of a material having flexibility, and may be made of, for example, a plastic material such as polyimide. Specifically, the second substrate 412 may be made of transparent polyimide, but is not limited thereto. A black matrix 170 , a color filter 180 , a second planarization layer 118 , and an upper alignment layer 119 are disposed below the second substrate 412 .

A second structure 482 is disposed below the second substrate 412 . The second structure 482 may function as a second sub-substrate disposed below the second substrate 412 . In detail, the second structure 482 may be disposed on the outer surface of the second substrate 412 in the non-display area NA.

In this case, the upper surface of the second substrate 412 in the display area AA is disposed on the same plane as the upper surface of the second structure 482 . In detail, a portion of the second substrate 412 corresponding to the display area AA and the second structure 482 are disposed on the same layer. Accordingly, the upper surface of the second substrate 412 and the upper surface of the second structure 482 in the display area AA are disposed on the same plane, and the display area AA and the non-display area are on the second substrate 412. A step may exist at the boundary of (NA). That is, the second substrate 412 may extend from the display area AA to the non-display area NA and may be formed lower at a portion overlapping the second structure 482 .

The second structure 482 and the second substrate 412 may have different toughness. Specifically, the toughness of the second structure 482 may be greater than that of the second substrate 412 . The magnitude of the external force applied to the second structure 482 prior to destruction may be greater than that of the second substrate 412 , and the amount of deformation prior to destruction may be greater than that of the second substrate 412 . Accordingly, the energy per unit volume applied until the second structure 482 is destroyed may be greater than the energy per unit volume applied until the second substrate 412 is destroyed. That is, the second structure 482 is tougher than the second substrate 412 and may not be easily broken even though it is deformed by receiving an external force.

Also, the second structure 482 and the second substrate 412 may have different coefficients of thermal expansion. Specifically, the thermal expansion coefficient of the second structure 482 may be smaller than the thermal expansion coefficient of the second substrate 412 . Under the same and constant pressure, the change in volume of the second structure 482 according to the change in temperature may be smaller than the change in volume of the second substrate 412 according to the change in temperature. That is, the shape of the second structure 482 may not be easily deformed according to a change in temperature than the second substrate 412 .

For example, the thermal expansion coefficient of the second structure 482 may be less than 20 ppm/°C. When the thermal expansion rate of the second structure 482 is greater than or equal to 20 ppm/°C, the degree of heat-induced deformation of the second structure 482 may increase. When the thermal expansion rate of the second structure 482 is 20 ppm/°C or higher, deformation may occur in the second structure 482 during a heating process and a cooling process during manufacturing of the display device 400 . Therefore, when the coefficient of thermal expansion of the second structure 482 is less than 20 ppm/°C, the increase in volume of the second structure 482 according to the increase in temperature may be reduced, and thus, during the manufacturing process of the display device 400, the second structure 482 may have a reduced volume. Deformation of structure 482 may be reduced.

The second structure 482 may be made of, for example, a plastic material such as polyimide or colored polyimide. For example, the second structure 482 may be made of yellow polyimide. In addition, the second structure 482 may be made of a fiber reinforced polymer. However, it is not limited thereto.

Also, a second polarizing plate 192 is disposed on the second substrate 412 . The second polarizer 192 is disposed on the outer surface of the second substrate 412 in the display area AA. As described above, the top surface of the second substrate 412 and the top surface of the second structure 482 in the display area AA are disposed on the same plane, and thus, the side surface of the second polarizer 192 It does not touch the sides of structure 482.

In the display device 400 according to another embodiment of the present invention, the first structure 481 and the second structure 482 having greater toughness than the first substrate 411 and the second substrate 412 are provided in the non-display area ( NA) is disposed on the outer surface of each of the first substrate 411 and the second substrate 412 . Accordingly, damage to the first substrate 411 and the second substrate 412 may be reduced, and the defect rate of the display device 400 may be reduced.

Specifically, the first structure 481 and the second structure 482 may have greater toughness than the first substrate 411 and the second substrate 412 . That is, the first structure 481 and the second structure 482 may be made of a material that is tougher than the first substrate 411 and the second substrate 412 and can better withstand impact. Also, in the non-display area NA, the first substrate 411 contacts the first structure 481 and the second substrate 412 contacts the second structure 482 . Accordingly, in a process in which an external force may be applied to the first substrate 411 and the second substrate 412 described above during the manufacturing process of the display device 400, the first structure 481 and the second structure having relatively high toughness ( 482) may absorb an external force applied to each of the first substrate 411 and the second substrate 412. Accordingly, the first substrate 411 and the second substrate 412 may maintain their original shapes without being damaged, such as being torn.

Also, the display device 400 according to another embodiment of the present invention includes the first structure 481 and the second structure 482 having lower thermal expansion rates than the first substrate 411 and the second substrate 412 . , Deformation of the first substrate 411 and the second substrate 412 may be suppressed during the manufacturing process of the display device 400 . Thermal expansion rates of the first structure 481 and the second structure 482 may be lower than those of the first substrate 411 and the second substrate 412 . Therefore, when the first substrate 411 and the second substrate 412 are exposed to high temperatures during the manufacturing process of the display device 400, the first structure 481 and the second structure 482 may absorb heat. . Accordingly, deformation such as bending of the first substrate 411 and the second substrate 412 may be reduced. Accordingly, the defective rate of the display device 400 may be reduced.

Hereinafter, a method of manufacturing the display device 400 will be described with reference to FIGS. 5A to 5F .

5A to sectional views illustrating a method of manufacturing a display device according to another exemplary embodiment of the present invention.

First, referring to FIG. 5A , a first glass substrate GS1 is formed. The first glass substrate GS1 is a substrate that supports the first substrate 411 and various components disposed on the first substrate 411 under the first substrate 411 during the manufacturing process of the display device 400 . to be. The thickness of the first glass substrate GS1 in the display area AA and the non-display area NA may be the same. That is, the top surface of the first glass substrate GS1 may be flat.

Subsequently, a first structure 481 is disposed on the first glass substrate GS1. The first structure 481 is formed on the first glass substrate GS1 in the non-display area NA. Accordingly, a step exists between the upper surface of the first glass substrate GS1 and the upper surface of the first structure 481 in the display area AA.

Subsequently, a first substrate 411 is disposed on the first glass substrate GS1 and the first structure 481 . The first substrate 411 is disposed on the first glass substrate GS1 in the display area AA and on the first structure 481 in the non-display area NA. It may be attached on the first structure 481 . As described above, there is a step difference between the upper surface of the first glass substrate GS1 and the upper surface of the first structure 481 in the display area AA, and therefore, the surface of the first substrate 411 may not be flat. can That is, the top surface of the first substrate 411 in the non-display area NA may be higher than the top surface of the first substrate 411 in the display area AA. Accordingly, the first substrate 411 may have a step at the boundary between the display area AA and the non-display area NA.

Next, referring to FIG. 5B , the transistor 140, the passivation layer 114, the first planarization layer 115, the pixel electrode 151, the lower alignment layer 116 and the common electrode ( 152) is formed. Specifically, the gate electrode 141 of the transistor 140 is formed on the first substrate 411 , and the gate insulating layer 113 is formed on the gate electrode 141 . An active layer 142 , a source electrode 143 , and a drain electrode 144 of the transistor 140 are formed on the gate insulating layer 113 .

A passivation layer 114 is formed on the transistor 140 . A first planarization layer 115 is formed on the passivation layer 114 to planarize the upper surface of the transistor 140 . A pixel electrode 151 and a common electrode 152 are formed on the first planarization layer 115 . The pixel electrode 151 is connected to the drain electrode 144 of the transistor 140 through a contact hole formed in the first planarization layer 115 and the passivation layer 114 .

A lower alignment layer 116 is formed on the pixel electrode 151 , the common electrode 152 , and the first planarization layer 115 .

Next, referring to FIG. 5C , a second structure 482 , a second substrate 412 , a black matrix 170 , a color filter 180 , and a second planarization layer 118 are formed under the second glass substrate GS2 . ) and an upper alignment layer 119 are formed.

Specifically, a second glass substrate GS2 is disposed. The second glass substrate GS2 is a component supporting the second substrate 412 and various components disposed below the second substrate 412 during the manufacturing process of the display device 400 . The second glass substrate GS2 may have the same thickness in the display area AA and the non-display area NA. That is, the lower surface of the second glass substrate GS2 may be flat.

Subsequently, a second structure 482 is formed under the second glass substrate GS2 . The second structure 482 is formed under the second glass substrate GS2 in the non-display area NA. Accordingly, a step exists between the lower surface of the second glass substrate GS2 and the lower surface of the second structure 482 in the display area AA.

Subsequently, a second substrate 412 is disposed under the second glass substrate GS2 and the second structure 482 . The second substrate 412 is disposed under the second glass substrate GS2 in the display area AA and disposed under the second structure 482 in the non-display area NA. It can be attached under the second structure 482 . As described above, there is a step difference between the lower surface of the second glass substrate GS2 and the lower surface of the second structure 482 in the display area AA, so the surface of the second substrate 412 may not be flat. can That is, the lower surface of the second substrate 412 in the non-display area NA may be lower than the lower surface of the second substrate 412 in the display area AA. Accordingly, the second substrate 412 may have a step at the boundary between the display area AA and the non-display area NA.

Subsequently, a black matrix 170 is disposed below the second substrate 412 . The black matrix 170 is disposed in an area below the second substrate 412 excluding the plurality of pixels PX. The black matrix 170 is disposed under the second substrate 412 in an area excluding the plurality of pixels PX, and various components disposed in an area overlapping the black matrix 170 are of the display device 400. Visibility from the top can be prevented.

Subsequently, a color filter 180 is formed under the second substrate 412 . The color filter 180 is formed under the second substrate 412 to correspond to each of the plurality of pixels PX. For example, a red color filter may be formed to correspond to a red pixel among the plurality of pixels PX, a green color filter may be formed to correspond to a green pixel, and a blue color filter may be formed to correspond to a blue pixel.

Subsequently, a second planarization layer 118 is formed under the second substrate 412 , the color filter 180 and the black matrix 170 . The second planarization layer 118 covers both the color filter 180 and the black matrix 170 under the second substrate 412 and flattens the lower surface.

Subsequently, an upper alignment layer 119 is formed under the second planarization layer 118 . The upper alignment layer 119 may be disposed on the entire lower surface of the second planarization layer 118 .

Next, referring to FIG. 5D , the first substrate 411 and the second substrate 412 are fixed. Specifically, the sealant 117 is formed on the lower alignment layer 116 of the non-display area NA. A liquid crystal layer 160 is formed on the lower alignment layer 116 in a portion of the display area AA and the non-display area NA. The sealant 117 on the lower alignment layer 116 of the non-display area NA surrounds the liquid crystal layer 160 and may function as a dam to prevent the liquid crystal layer 160 from flowing outward. Thus, the side surface of the liquid crystal layer 160 may contact the side surface of the sealant 117 .

Subsequently, a second glass substrate GS2 is disposed on the liquid crystal layer 160 and the sealant 117 . Specifically, the second substrate 412, the black matrix 170, the color filter 180, the second planarization layer 118, and the upper alignment layer 119 are disposed on the liquid crystal layer 160 and the sealant 117 below. A second glass substrate GS2 is disposed. Pressure may be applied to the first glass substrate GS1 and the second glass substrate GS2 , and the first substrate 411 and the second substrate 412 are fixed by the sealant 117 .

Subsequently, referring to FIG. 5E , the first glass substrate GS1 and the second glass substrate GS2 are removed. The first glass substrate GS1 disposed under the first substrate 411 and the first structure 481 may be removed by a laser. Accordingly, the lower surface of the first substrate 411 and the lower surface of the first structure 481 in the display area AA may be exposed to the outside.

Also, the second glass substrate GS2 disposed on the second substrate 412 and the second structure 482 may be removed by a laser. Accordingly, the top surface of the first substrate 411 and the top surface of the second structure 482 in the display area AA may be exposed to the outside.

Next, referring to FIG. 5F , a first polarizing plate 191 and a second polarizing plate 192 are formed on outer surfaces of the first substrate 411 and the second substrate 412 . Specifically, the first polarizer 191 is disposed on the outer surface of the first substrate 411 in the display area AA. The lower surface of the first substrate 411 and the lower surface of the first structure 481 are disposed on the same plane, and thus, the side surface of the first polarizer 191 does not contact the side surface of the first structure 481 .

A second polarizer 192 is disposed on the outer surface of the second substrate 412 in the display area AA. The upper surface of the second substrate 412 and the upper surface of the second structure 482 are disposed on the same plane, and thus, the side surface of the second polarizing plate 192 does not contact the side surface of the second structure 482 .

In the display device 400 according to another embodiment of the present invention, the lower surface of the first substrate 411 and the lower surface of the first structure 481 are disposed on the same plane, and the upper surface of the second substrate 412 and the second substrate 412 are disposed on the same plane. The upper surfaces of the two structures 482 are disposed on the same plane. Accordingly, the time required for the manufacturing process of the display device 400 and the process cost may be reduced.

Specifically, the first substrate 411 and the second substrate 412 may be flexible, and components disposed on the first substrate 411 and components disposed under the second substrate 412 are first Each of the substrate 411 and the second substrate 412 may not be supported. Accordingly, the first substrate 411, the first structure 481 and other components may be formed on the first glass substrate GS1 made of a relatively hard material. In addition, the second substrate 412, the second structure 482, and other components may be formed under the second glass substrate GS2 made of a relatively hard material. At this time, when there is no step difference between the first substrate 411 and the second substrate 412 and the first substrate 411 and the second substrate 412 have a flat shape, the first substrate 411 and the second substrate 412 In order to arrange the first structure 481 and the second structure 482 on the outer surface of each of the second substrates 412 , portions of the first and second glass substrates GS1 and GS2 need to be etched. The first structure 481 is disposed between the first glass substrate GS1 and the first substrate 411 in the non-display area NA, and the first substrate 411 covers the display area AA and the non-display area ( NA), the first glass substrate GS1 overlapping the first structure 481 may need to be etched. Similarly, the second structure 482 is disposed between the second glass substrate GS2 and the second substrate 412 in the non-display area NA, and the second substrate 412 is disposed in the display area AA and the non-display area AA. When the area NA is flat, the second glass substrate GS2 overlapping the second structure 482 may need to be etched. In this case, each etching process of the first glass substrate GS1 and the second glass substrate GS2 needs to be performed, which may require cost and time.

Unlike this, the display device 400 according to an exemplary embodiment of the present invention does not etch portions of the first glass substrate GS1 and the second glass substrate GS2, and the top surface and A first structure 481 and a second structure 482 may be disposed on the lower surface of the second glass substrate GS2 . Also, the first substrate 411 and the second substrate 412 may be disposed such that a step exists at a boundary between the display area AA and the non-display area NA. Therefore, a process of etching the first glass substrate GS1 and the second glass substrate GS2 may not be performed. Accordingly, the time required for the manufacturing process of the display device 400 may be reduced, and the manufacturing process cost may be reduced.

A display device according to embodiments of the present invention can be described as follows.

A display device according to an exemplary embodiment of the present invention includes a first substrate including a display area and a non-display area, a first structure disposed under the first substrate in the non-display area, a second substrate on the first substrate, and a non-display area. A second structure disposed on a second substrate in a display area and a liquid crystal layer disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate have toughness with the first structure and the second structure. ) may be different.

According to another feature of the present invention, the toughness of the first structure and the second structure may be greater than that of the first substrate and the second substrate.

According to another feature of the present invention, the first structure and the second structure may be disposed only in the non-display area.

According to another feature of the present invention, the thermal expansion coefficients of the first structure and the second structure may be smaller than those of the first substrate and the second substrate.

According to another feature of the present invention, the light transmittance of the first substrate and the second substrate may be greater than the light transmittance of the first structure and the second structure.

According to another feature of the present invention, the first substrate and the second substrate are made of transparent polyimide (PI), and the first structure and the second structure are colored polyimide (PI) and a fiber reinforced polymer. FRP) may be made of any one.

According to another feature of the present invention, the first substrate and the second substrate may have a flat shape in the display area and the non-display area.

According to another feature of the present invention, the lower surface of the first substrate in the display area is disposed on the same plane as the lower surface of the first structure, and the upper surface of the second substrate in the display area is on the same plane as the upper surface of the second structure. can be placed in

According to another feature of the present invention, a display device includes a first polarizing plate disposed under a first substrate in a display area and having an upper surface disposed on the same plane as a top surface of a first structure, and on a second substrate in the display area. and may further include a second polarizing plate having a lower surface disposed on the same plane as the lower surface of the second structure.

According to another feature of the present invention, the display device may further include a sealant disposed between the first substrate and the second substrate to overlap the first structure and the second structure in the non-display area.

A display device according to another embodiment of the present invention includes a first substrate including a display area and a non-display area, a second substrate facing the first substrate, a liquid crystal layer between the first substrate and the second substrate, and a non-display area. A first sub-substrate disposed on the outer surface of the first substrate and made of a material different from that of the first substrate, and a second sub-substrate disposed on the outer surface of the second substrate in the non-display area and made of a material different from that of the second substrate. can do.

According to another feature of the present invention, the energy per unit volume applied until the first sub-substrate and the second sub-substrate are destroyed may be greater than the energy per unit volume applied until the first and second substrates are destroyed.

According to another feature of the present invention, the amount of change in the volume of the first sub-substrate and the second sub-substrate due to the change in temperature may be smaller than the amount of change in volume due to the change in temperature of the first and second substrates.

According to another feature of the present invention, the display device further includes a first polarizing plate disposed on an outer surface of the first substrate in the display area and a second polarizing plate disposed on an outer surface of the second substrate in the display area, the first polarizing plate Each of the side surface of the polarizer and the side surface of the second polarizing plate may contact the side surface of the first sub-substrate and the side surface of the second sub-substrate, respectively.

According to another feature of the present invention, each of the first substrate and the second substrate may have a step at the boundary between the display area and the non-display area.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100, 400: display device
111, 411: first substrate
112, 412: second substrate
113: gate insulating layer
114: passivation layer
115: first planarization layer
116: lower alignment layer
117: sealant
118: second planarization layer
119: upper alignment layer
120: data driving unit
121: base film
122: driving IC
130: gate driver
131: base film
132: driving IC
140: transistor
141: gate electrode
142: active layer
143: source electrode
144: drain electrode
151: pixel electrode
152 common electrode
160: liquid crystal layer
170: Black Matrix
180: color filter
181, 481: first structure
182, 482: second structure
191: first polarizing plate
192: second polarizing plate
PX: pixels
AA: display area
NA: non-display area
GS1: first glass substrate
GS2: second glass substrate

Claims (15)

a first substrate including a display area and a non-display area;
a first structure disposed below the first substrate in the non-display area;
a second substrate on the first substrate;
a second structure disposed on the second substrate in the non-display area; and
A liquid crystal layer disposed between the first substrate and the second substrate;
The first substrate and the second substrate have different toughness from the first structure and the second structure,
The first structure and the second structure are disposed only in the non-display area. According to claim 1,
Toughness of the first structure and the second structure is greater than that of the first substrate and the second substrate. delete According to claim 1,
Thermal expansion coefficients of the first structure and the second structure are smaller than thermal expansion coefficients of the first substrate and the second substrate. a first substrate including a display area and a non-display area;
a first structure disposed below the first substrate in the non-display area;
a second substrate on the first substrate;
a second structure disposed on the second substrate in the non-display area; and
A liquid crystal layer disposed between the first substrate and the second substrate;
The light transmittance of the first substrate and the second substrate is greater than the light transmittance of the first structure and the second structure;
The first substrate and the second substrate have different toughness from the first structure and the second structure. According to claim 5,
The first substrate and the second substrate are made of transparent polyimide (PI),
The first structure and the second structure are made of any one of colored polyimide (PI) and fiber reinforced polymer (FRP). According to claim 1,
The first substrate and the second substrate have a flat shape in the display area and the non-display area. a first substrate including a display area and a non-display area;
a first structure disposed below the first substrate in the non-display area;
a second substrate on the first substrate;
a second structure disposed on the second substrate in the non-display area; and
A liquid crystal layer disposed between the first substrate and the second substrate;
In the display area, a lower surface of the first substrate is disposed on the same plane as a lower surface of the first structure;
In the display area, an upper surface of the second substrate is disposed on the same plane as an upper surface of the second structure;
The first substrate and the second substrate have different toughness from the first structure and the second structure. a first substrate including a display area and a non-display area;
a first structure disposed below the first substrate in the non-display area;
a second substrate on the first substrate;
a second structure disposed on the second substrate in the non-display area;
a liquid crystal layer disposed between the first substrate and the second substrate;
a first polarizer disposed below the first substrate in the display area and having an upper surface disposed on the same plane as an upper surface of the first structure; and
a second polarizing plate disposed on the second substrate in the display area and having a lower surface disposed on the same plane as a lower surface of the second structure;
The first substrate and the second substrate have different toughness from the first structure and the second structure. According to claim 1,
and a sealant disposed between the first substrate and the second substrate to overlap the first structure and the second structure in the non-display area. a first substrate including a display area and a non-display area;
a second substrate facing the first substrate;
a liquid crystal layer between the first substrate and the second substrate;
a first sub-substrate disposed on an outer surface of the first substrate in the non-display area and made of a material different from that of the first substrate; and
a second sub-substrate disposed on an outer surface of the second substrate in the non-display area and made of a material different from that of the second substrate;
The first sub-substrate and the second sub-substrate are disposed only in the non-display area. According to claim 11,
Energy per unit volume applied until the first sub-substrate and the second sub-substrate are destroyed is greater than energy per unit volume applied until the first and second substrates are not destroyed. According to claim 11,
A change in volume of the first sub-substrate and the second sub-substrate due to a change in temperature is smaller than a change in volume due to a change in temperature of the first and second substrates. a first substrate including a display area and a non-display area;
a second substrate facing the first substrate;
a liquid crystal layer between the first substrate and the second substrate;
a first sub-substrate disposed on an outer surface of the first substrate in the non-display area and made of a material different from that of the first substrate;
a second sub-substrate disposed on an outer surface of the second substrate in the non-display area and made of a material different from that of the second substrate;
a first polarizer disposed on an outer surface of the first substrate in the display area; and
A second polarizer disposed on an outer surface of the second substrate in the display area;
A side surface of the first polarizing plate and a side surface of the second polarizing plate respectively contact a side surface of the first sub-substrate and a side surface of the second sub-substrate, respectively. a first substrate including a display area and a non-display area;
a second substrate facing the first substrate;
a liquid crystal layer between the first substrate and the second substrate;
a first sub-substrate disposed on an outer surface of the first substrate in the non-display area and made of a material different from that of the first substrate; and
a second sub-substrate disposed on an outer surface of the second substrate in the non-display area and made of a material different from that of the second substrate;
The display device, wherein each of the first substrate and the second substrate has a step at a boundary between the display area and the non-display area.

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