KR102460645B1 - Manufacturing apparatus and method for a display apparatus - Google Patents

Abstract

Disclosed are an apparatus for manufacturing a display device and a method for manufacturing the display device. The present invention provides a source part generating a magnetic or electric field, a carrier disposed to face the source part, a carrier to which a display substrate is fixed, and a carrier spaced apart from the carrier to adjust the position of the carrier in a first direction A position adjusting unit, a carrier conveying unit for conveying the carrier in a second direction, a carrier guide unit arranged to be spaced apart from the carrier to adjust the position of the carrier, the position adjusting unit, the carrier conveying unit and the carrier guide unit It is disposed on at least one of the position control unit, the carrier transfer unit, and a shield for blocking the magnetic field generated in at least one of the carrier guide unit.

Description

BACKGROUND OF THE INVENTION Field of the Invention

Embodiments of the present invention relate to an apparatus and method, and more particularly, to a display apparatus and a method of manufacturing the display apparatus.

Electronic devices based on mobility are widely used. In addition to small electronic devices such as mobile phones, tablet PCs have recently been widely used as mobile electronic devices.

Such a mobile electronic device includes a display device to provide visual information such as an image or video to a user in order to support various functions. Recently, as other components for driving the display device are miniaturized, the proportion of the display device in electronic devices is gradually increasing, and a structure that can be bent to have a predetermined angle in a flat state is being developed.

In general, when a display device is manufactured, the display device may be mounted on a carrier so that the carrier may be moved in contact with the carrier through a roller. In this case, foreign substances may be generated due to the contact between the carrier and the roller, and such foreign substances may cause product defects during manufacturing of the display device. A display device manufacturing apparatus and a display device manufacturing method are provided.

An embodiment of the present invention includes a source part generating a magnetic field or an electric field, a carrier disposed to face the source part, to which a display substrate is fixed, and a carrier spaced apart from the carrier, the position of the carrier in the first direction A position adjusting unit for adjusting the position, a carrier transfer unit for transferring the carrier in the second direction, a carrier guide portion arranged to be spaced apart from the carrier to adjust the position of the carrier, the position adjustment unit, the carrier transfer unit and the Disclosed is an apparatus for manufacturing a display device including a shielding part disposed on at least one of carrier guide parts to block a magnetic field generated by at least one of the position adjusting part, the carrier transport part, and the carrier guide part.

In this embodiment, it may further include a carrier posture control unit arranged to be spaced apart from the position adjusting unit to control the posture of the carrier.

In this embodiment, the carrier posture control unit, the first posture control unit disposed on the carrier, and the first posture control unit and disposed to be spaced apart may include a second posture control unit for controlling the posture of the carrier.

In this embodiment, the carrier may be vertically arranged, and the position adjusting unit may be disposed on the upper surface of the carrier.

In this embodiment, the carrier guide portion may be disposed to face one surface of the carrier.

In this embodiment, the carrier guide part, a first guide part disposed on one side of both surfaces of the carrier, and a first guide part disposed to face the first guide part, and disposed on the other side of both surfaces of the carrier 2 may include a guide unit.

In this embodiment, the carrier transfer unit, a first transfer unit disposed on the carrier, and a second transfer unit that is disposed to be spaced apart from the first transfer unit, and generates a driving force for moving the carrier together with the first transfer unit may include

In this embodiment, it may further include a gap measuring sensor for measuring the distance between the position adjustment unit and the carrier.

In this embodiment, it may further include a posture measurement sensor for measuring the distance between the carrier guide portion and the carrier.

In this embodiment, the shielding unit is disposed on at least one of the position adjustment unit, the carrier transfer unit, and the carrier guide unit to generate a magnetic field generated in at least one of the position adjustment unit, the carrier transfer unit and the carrier guide unit. It may include a blocking unit for blocking.

In this embodiment, the shielding unit may further include a magnetic field guide unit disposed on the blocking unit and guiding a magnetic field generated by at least one of the position adjusting unit, the carrier transport unit, and the carrier guide unit.

In this embodiment, a plurality of the carrier transfer unit is provided, and the plurality of carrier transfer units are arranged to be spaced apart from each other in the second direction, and a distance between the adjacent carrier transfer units may be smaller than the length of the carrier.

Another embodiment of the present invention provides a first chamber unit on which a display substrate is loaded or unloaded, a second chamber unit for depositing a deposition material on the display substrate, and at least one of the first chamber unit and the second chamber unit. and a transfer unit for transferring the display substrate from the first chamber unit to the second chamber unit or from the second chamber unit to the first chamber unit, wherein the transfer unit faces the source unit a carrier to which the display substrate is fixed to transport the display substrate, a position adjusting unit arranged to be spaced apart from the carrier and adjusting the position of the carrier in a first direction, and transporting the carrier in a second direction and a guide portion arranged to be spaced apart from the carrier to adjust the position of the carrier, the position adjustment portion, the transfer portion and the guide portion disposed on at least one of the position adjustment portion, the transfer portion and the guide portion Disclosed is an apparatus for manufacturing a display device including a shielding unit that blocks a magnetic field generated by at least one of them.

In this embodiment, the second chamber unit may include a chamber in which the display substrate is accommodated, and a source unit disposed in the chamber and spraying a deposition material on the display substrate to generate a magnetic field or an electric field. .

Another embodiment of the present invention includes the steps of loading a display substrate into a first chamber unit, transferring the display substrate of the first chamber unit to a second chamber unit, and in the second chamber unit, a magnetic field or supplying a deposition material to the display substrate through a source for generating an electric field to deposit the deposition material on the display substrate, wherein the display substrate is floated and transported in a non-contact manner through a transport unit, and the second chamber Disclosed is a method of manufacturing a display device for shielding a magnetic field generated by a transfer unit in a unit.

In this embodiment, it is possible to shield the magnetic field toward the source part of the magnetic field generated by the transfer unit.

In this embodiment, the transfer unit may include a shielding portion disposed to face the source portion to shield the magnetic field.

In this embodiment, the transfer unit may include a carrier to which the display substrate is fixed, and a distance between the first chamber unit and the second chamber unit may be smaller than a width of the carrier.

In this embodiment, the transfer unit may constantly maintain the posture of the display substrate when the display substrate is transferred.

In this embodiment, the transfer unit may transfer the display substrate in a tilted state with respect to the ground.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

These general and specific aspects may be practiced using systems, methods, computer programs, or any combination of systems, methods, and computer programs.

The display device manufacturing apparatus and the display device manufacturing method according to the exemplary embodiments of the present invention may minimize foreign substances generated when the display substrate is transported.

In the display device manufacturing apparatus and the display device manufacturing method according to the exemplary embodiments of the present invention, it is possible to manufacture a high-quality display device by uniformly coating a deposition material on a display substrate.

The display device manufacturing apparatus and the display device manufacturing method according to the embodiments of the present invention can maintain a constant posture of the display substrate when the display substrate is transported, and it is possible to quickly and accurately transport the display substrate through a predetermined path do.

1 is a conceptual diagram illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
FIG. 2 is a front view illustrating an exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 .
3 is a side view showing the second transfer unit shown in FIG. 2 and the source unit shown in FIG. 1 .
4 is a cross-sectional view illustrating the second shielding unit shown in FIGS. 2 and 3 .
FIG. 5 is a front view illustrating another exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 .
6 is a side view showing the second transfer unit shown in FIG.
FIG. 7 is a front view illustrating another exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 .
FIG. 8 is a side view showing the second transfer unit shown in FIG. 7 .
FIG. 9 is a front view illustrating another embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 .
10 is a front view showing another embodiment of the second transfer unit shown in FIG.
FIG. 11 is a front view illustrating another exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 .
12 is a side view illustrating an apparatus for manufacturing the display device illustrated in FIG. 11 .
FIG. 13 is a plan view illustrating a display device manufactured with the device for manufacturing the display device shown in FIG. 1 .
14 is a cross-sectional view taken along line AA shown in FIG. 13 .

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted. .

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility that one or more other features or components may be added is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

In cases where certain embodiments are otherwise practicable, a specific process sequence may be performed different from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the order described.

1 is a conceptual diagram illustrating an apparatus for manufacturing a display device according to an exemplary embodiment. FIG. 2 is a front view illustrating an exemplary embodiment of a transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 . 3 is a side view showing the transfer unit shown in FIG. 2 and the source unit shown in FIG. 1 . 4 is a cross-sectional view illustrating the second shielding unit shown in FIGS. 2 and 3 .

1 to 3 , in the apparatus 10 for manufacturing a display device, a display substrate D is supplied from the outside and a deposition material is deposited on the display substrate D to form a predetermined layer. In this case, the deposition material may be deposited on the display substrate D in the form of a predetermined pattern on the display substrate D, or may be deposited on the display substrate D to cover the entire surface of the display substrate D. For example, the apparatus 10 for manufacturing a display device may form a source electrode or a drain electrode on the display substrate D. The apparatus 10 for manufacturing a display device may form an inorganic layer among the thin film encapsulation layers on the display substrate D. In this case, the display substrate D may mean a form in which various layers are formed on the substrate (not shown) before each layer is formed. Hereinafter, for convenience of description, the manufacturing apparatus 10 of the display device will be described in detail focusing on the case of forming an inorganic layer among the thin film encapsulation layers on the display substrate D. FIG.

Meanwhile, the apparatus 10 for manufacturing a display device may include a first chamber unit 100 , at least one second chamber unit 200 , and a transfer unit 300 .

The first chamber unit 100 may load the display substrate D from the outside or unload the display substrate D on which deposition is completed.

The second chamber unit 200 may be connected to the first chamber unit 100 to deposit a deposition material on the display substrate (D). At this time, the source unit 220 of the second chamber unit 200 may form a magnetic field or an electric field to deposit a deposition material on the display substrate (D). The second chamber unit 200 may deposit a deposition material on the display substrate D in various ways. For example, the second chamber unit 200 may deposit a deposition material on the display substrate D using a plasma chemical vapor deposition (PECVD) method. As another embodiment, the second chamber unit 200 may deposit a deposition material on the display substrate D by atomic layer deposition (ALD). As another embodiment, the second chamber unit 200 may deposit a deposition material on the display substrate D by a sputtering method.

A plurality of second chamber units 200 may be provided. The plurality of second chamber units 200 may be disposed to be spaced apart from each other. In this case, the plurality of second chamber units 200 may deposit the deposition material by the same deposition method, and it is also possible to deposit the deposition material by different deposition methods. In addition, the plurality of second chamber units 200 may be connected to each other, and a separate gate valve 400 is disposed between the plurality of second chamber units 200 to distinguish each second chamber unit 200 . .

The first chamber unit 100 and the second chamber unit 200 as described above can adjust the internal pressure to atmospheric pressure or a vacuum state. In this case, the first chamber unit 100 and the second chamber unit 200 may include a separate pressure control device.

The transfer unit 300 may transfer the display substrate D. In this case, the transfer unit 300 may transfer the display substrate D in a state in which it is arranged to form a predetermined angle with respect to the ground. That is, the display substrate D may be transferred in a tilted state with respect to the ground. For example, the transfer unit 300 may transfer the display substrate D with respect to the ground in a state in which the display substrate D is arranged to form an angle in the range of 90 degrees or less while exceeding 0 degrees. In this case, the ground may mean the surface on which the first chamber unit 100 and the second chamber unit 200 are installed, and the bottom surface of the first chamber (not shown) and the second chamber unit of the first chamber unit 100 . (200) may refer to the bottom surface of the second chamber 210.

It may be disposed in the first chamber unit 100 and the second chamber unit 200 . In this case, the transfer unit 300 may include a first transfer unit (not shown) disposed in the first chamber unit 100 and a second transfer unit 300-2 disposed in the second chamber unit 200 . have. In this case, the first transfer unit and the second transfer unit 300 - 2 may be disposed to be spaced apart from each other. At this time, since the first transfer unit and the second transfer unit 300-2 are the same or similar to each other, hereinafter, for convenience of description, the second transfer unit 300-2 will be described in detail.

The second transfer unit 300-2 includes a carrier 310, a second position adjustment unit 320-2, a second carrier transfer unit 330-2, a second carrier guide unit 340-2, and a second carrier. It may include a posture control unit 350-2, a second shielding unit 360-2, a second interval measuring sensor unit 371-2, and a second posture measuring sensor unit 372-2.

The carrier 310 may move the first chamber unit 100 and the second chamber unit 200 . In this case, the carrier 310 may move from the first chamber unit 100 to the second chamber unit 200 , and may move the plurality of second chamber units 200 . Also, the carrier 310 may move from the second chamber unit 200 to the first chamber unit 100 . In this case, one carrier 310 may be provided, and the first transfer unit and the second transfer unit 300 - 2 may share the carrier 310 with each other.

The carrier 310 as described above may be fixed to which the display substrate D is fixed. In this case, the carrier 310 may fix the display substrate D in various ways. As an embodiment, the carrier 310 may fix the display substrate D through the clamp 311 . In another embodiment, the carrier 310 may be provided with an adhesive chuck to fix the display substrate (D). As another embodiment, the carrier 310 may include an electrostatic chuck to fix the display substrate D. FIG. In this case, when the carrier 310 includes an electrostatic chuck, a secondary battery may be provided inside the carrier 310 , and a separate wireless charging module is mounted on the carrier 310 to be charged or supplied with current during transport. It is possible. Hereinafter, for convenience of description, a case in which the carrier 310 fixes the display substrate D through the clamp 311 will be described in detail.

The second position adjusting unit 320 - 2 may adjust the position of the carrier 310 in the first direction (eg, the vertical direction in FIG. 3 ). In this case, the second position adjusting unit 320 - 2 may adjust the position of the carrier 310 by applying an attractive force to the carrier 310 including a magnet or an electromagnet.

The second carrier transfer unit 330 - 2 may move the carrier 310 in the second direction (eg, the left and right direction of FIG. 2 ). In this case, the second direction may be a direction different from the first direction. In particular, the first direction and the second direction may be perpendicular to each other. A plurality of second carrier transfer units 330 - 2 may be provided, and some of the plurality of second carrier transfer units 330 - 2 may be disposed on one surface of the carrier 310 . Another part of the plurality of second carrier transfer units 330 - 2 may be disposed on the other surface of the carrier 310 .

The second carrier conveying unit 330-2 may include a first conveying unit 331-2 disposed on the carrier 310 and a second conveying unit 332-2 disposed to be spaced apart from the first conveying unit 331-2. can In this case, the second transfer unit 332 - 2 may be installed to be fixed to the inner wall of the second chamber 210 of the second chamber unit 200 . One of the first transfer unit 331-2 or the second transfer unit 332-2 as described above may include a permanent magnet. The other of the first transfer unit 331 - 2 or the second transfer unit 332 - 2 may include an electromagnet. In this case, when the first transfer unit 331-2 includes an electromagnet and the second transfer unit 332-2 includes a permanent magnet, the carrier 310 may include a wireless charging module as described above. However, hereinafter, for convenience of explanation, a case in which the first transfer unit 331-2 includes a permanent magnet and the second transfer unit 332-2 includes an electromagnet will be described in detail.

The first transfer unit 331 - 2 may include a permanent magnet. In this case, the first transfer unit 331 - 2 may include a plurality of permanent magnets so that different poles are alternated. In this case, the first transfer unit 331 - 2 may have a form in which a plurality of permanent magnets are arranged in a line.

The second transfer unit 332 - 2 may include a linear motion stage coil. In this case, the second transfer unit 332 - 2 may be in the form of an electromagnet, and may be formed to be elongated in the longitudinal direction of the first transfer unit 331 - 2 to face the first transfer unit 331 - 2 . In this case, the second transfer unit 332 - 2 may provide a driving force to move the carrier 310 by varying the applied current.

The second carrier guide unit 340 - 2 may maintain the posture of the carrier 310 . In this case, the second carrier guide part 340 - 2 may include a first guide part 341 - 2 and a second guide part 342 - 2 disposed to face each other on both surfaces of the carrier 310 . In this case, the first guide part 341-2 and the second guide part 342-2 include an electromagnet and adjust the attractive force acting on the carrier 310 to thereby control the first guide part 341-2 and the carrier 310. ) and the distance between the second guide part 342 - 2 and the other surface of the carrier 310 may be kept constant.

The second carrier posture control unit 350 - 2 may constantly maintain the posture of the carrier 310 . At this time, the second carrier posture control unit 350-2 includes a first posture control unit 351-2 disposed in the carrier 310 and a second posture control unit 352-2 disposed in the second chamber 210. can do. A part of the carrier 310 may be protruded or bent so that the first posture control unit 351 - 2 is disposed. In this case, the position of the second posture control unit 352 - 2 may not overlap with the position of the second position control unit 320 - 2 .

The first attitude control unit 351 - 2 and the second attitude control unit 352 - 2 may include at least one of a permanent magnet and an electromagnet. In this case, the polarities of the surfaces of the first posture control unit 351 - 2 and the second posture control unit 352 - 2 facing each other may be different from each other. For example, when the polarity of one surface of the first posture control unit 351-2 is the S pole, one surface of the first posture control unit 351-2 facing each other and one surface of the second posture control unit 352-2 facing each other The polarity may be the N pole. As another embodiment, when the polarity of one surface of the first posture control unit 351-2 is N pole, one surface of the first posture control unit 351-2 facing each other and one surface of the second posture control unit 352-2 facing each other The polarity may be S pole. Hereinafter, for convenience of description, the first attitude control unit 351-2 and the second attitude control unit 352-2 will be described in detail focusing on the case of permanent magnets.

The second shielding part 360-2 may be disposed on at least one of the second position adjusting part 320-2, the second carrier transport part 330-2, and the second carrier guide part 340-2. At this time, the second shielding unit 360-2 is a magnetic field generated by at least one of the second position adjusting unit 320-2, the second carrier transport unit 330-2, and the second carrier guide unit 340-2. can be blocked. The second shielding part 360 - 2 as described above is indicated by a dotted line in FIGS. 3 and 4 so as not to cover other components.

The second shielding unit 360-2 blocks the magnetic field generated by at least one of the second position adjusting unit 320-2, the second carrier conveying unit 330-2, and the second carrier guide unit 340-2. It may include a second blocking part 361-2. At this time, the second blocking unit 361-2 is a magnetic field generated by at least one of the second position adjusting unit 320-2, the second carrier transport unit 330-2, and the second carrier guide unit 340-2. It can be prevented from moving to the source unit 220 . In this case, at least a portion of the second blocking part 361 - 2 may include a non-magnetic material. In particular, a portion of the second blocking part 361 - 2 facing the source part 220 may be formed of a non-magnetic material.

The second blocking part 361 - 2 as described above may be formed in various shapes. For example, the second blocking part 361 - 2 may be formed in a plate shape. In another embodiment, the second blocking part 361-2 is formed so that one side is opened, and the second position adjusting part 320-2, the second carrier transport part 330-2, and the second carrier guide part 340-2 are formed. ) may be in a form in which at least one of them is accommodated. Hereinafter, for convenience of description, the second blocking part 361-2 will be described in detail focusing on a case in which one side is opened and a space is formed therein.

The second blocking unit 361 - 2 as described above may shield the magnetic field or electric field directed to the source unit 220 . In addition, the magnetic field or electric field generated by the source unit 220 affects at least one of the second position control unit 320-2, the second carrier transfer unit 330-2, and the second carrier guide unit 340-2. can be prevented from affecting In this case, precise control of the transfer unit 300 is possible when the transfer unit 300 is driven. In addition, since the electric field or magnetic field of the source unit 220 is not affected by the transfer unit 300 when the transfer unit 300 is driven, the deposition efficiency of the deposition material is the same as when the transfer unit 300 is not used. or almost similar.

The second shielding part 360-2 may include a second magnetic field guide part 262-2 disposed on the second blocking part 361-2 to guide an internal magnetic field in one direction. In this case, the second magnetic field guide part 262 - 2 may be formed of a magnetic material, and may be disposed in an open portion of the second blocking part 361 - 2 . The second magnetic field guide part 262 - 2 may be disposed to be completely inserted into the second blocking part 361 - 2 . In addition, the second magnetic field guide unit 262-2 is in contact with at least one of the second position adjustment unit 320-2, the second carrier transfer unit 330-2, and the second carrier guide unit 340-2. Alternatively, it may be disposed to be spaced apart from at least one of the second position adjustment unit 320-2, the second carrier transfer unit 330-2, and the second carrier guide unit 340-2.

The second gap measuring sensor unit 371-2 may measure the distance between the carrier 310 and the second position adjusting unit 320-2 measured in the first direction. In this case, the second gap measuring sensor unit 371-2 may include various types of sensors, such as an ultrasonic sensor, a laser sensor, and an optical sensor.

The second posture measurement sensor unit 372 - 2 may measure a distance (or spacing) between the second carrier guide unit 340 - 2 and one surface of the carrier 310 . In this case, a plurality of second posture measuring sensor units 372-2 may be provided, and some of the plurality of second posture measuring sensor units 372-2 are first guide units 341 - 1 based on the carrier 310 . 2) is disposed on the disposed portion, the other part of the plurality of second posture measurement sensor unit 372-2 is to be disposed on the portion where the second guide unit 342-2 is disposed with respect to the carrier 310 can

Meanwhile, referring to the operation method of the apparatus 10 for manufacturing the display device as described above, the display substrate D may be supplied to the first chamber unit 100 from the outside. In this case, the display substrate D may be supplied to the first chamber unit 100 in various ways. For example, the display substrate D may be supplied to the first chamber unit 100 through a robot arm or the like and fixed to the carrier 310 inside the first chamber unit 100 . As another embodiment, the carrier 310 may be withdrawn to the outside of the first chamber unit 100 , and it is also possible to fix the display substrate D on the drawn carrier 310 by fixing the display substrate D through a human force or a robot arm. do. Hereinafter, for convenience of explanation, a method of supplying the display substrate D by drawing out the carrier 310 from the first chamber unit 100 will be described in detail.

The first chamber unit 100 is provided with a device for regulating the internal pressure, so that the internal pressure can be set to atmospheric pressure or a vacuum state according to the inflow and outflow of the display substrate D. The carrier 310 may be carried out to the outside of the first chamber unit 100 when the internal pressure of the first chamber unit 100 is changed from a vacuum state to an atmospheric pressure. On the other hand, when the carrier 310 enters the first chamber unit 100, the first chamber unit 100 may change the internal pressure from the atmospheric pressure state to the vacuum state.

When the display substrate D is fixed to the carrier 310 and then enters the first chamber unit 100 , the first transfer unit may transfer the carrier 310 to the second chamber unit 200 . At this time, since the method of transferring the carrier 310 by the first transfer unit is the same as or similar to the method of transferring the carrier 310 in the second transfer unit 300-2, hereinafter, the second transfer unit 300-2 ) will be described in detail focusing on the method of transporting the carrier 310 through the.

When the display substrate (D) enters the second chamber unit 200, the deposition material is sprayed onto the display substrate (D) in a state in which a magnetic or electric field is formed in the source unit 220 to deposit the deposition material on the display substrate (D). can be deposited.

When the above process is completed, the display substrate D may be transferred to another second chamber unit 200 or transferred to the first chamber unit 100 . In particular, when a plurality of second chamber units 200 are provided, various layers are formed in each second chamber unit 200 and then the display substrate D is transferred in the opposite direction to the first transferred direction to the first chamber unit ( 100) may be transferred to the display substrate (D). In this case, the second transfer unit 300 - 2 may provide a moving force to the carrier 310 .

Specifically, after power is applied to the second transfer unit 332 - 2 , the direction of the current may be changed. In this case, the polarity of the second transfer unit 332 - 2 may be variable. At this time, due to the variable polarity of the second transfer unit 332 - 2 , a moving force may be generated in the carrier 310 through interaction with the first transfer unit 331 - 2 .

As described above, while the carrier 310 is being transported, the second gap measuring sensor unit 371-2 may measure the distance between the carrier 310 and the second position adjusting unit 320-2. At this time, the result measured by the second interval measuring sensor unit 371-2 may be transmitted to the second position adjusting unit 320-2 or may be transmitted to a separately provided control unit (not shown). When the control unit is provided separately, the control unit may control all components of the apparatus 10 for manufacturing a display device. However, hereinafter, for convenience of description, the control unit is not provided, and a case in which the components are directly controlled according to a measurement result will be described in detail. The current applied to the second position adjusting unit 320 - 2 may be controlled so that the measured result and the preset value become the same as described above. For example, when the preset value is greater than the measured result, the current applied to the second position adjusting unit 320 - 2 may be controlled to be smaller than the initial value. In addition, when the preset value is smaller than the measured result, the current applied to the second position adjusting unit 320 - 2 may be controlled to be greater than the initial value. When controlled as described above, the carrier 310 may move in a state spaced apart a predetermined distance from the bottom surface (or the ground) of the second chamber 210 .

While the above operation is performed, the second posture measurement sensor unit 372-2 is the distance between one surface of the carrier 310 and the first guide unit 341-2, and the other surface of the carrier 310 and the second guide. The distance between the parts 342 - 2 may be measured. The measurement result as described above may be transmitted to the first guide part 341 - 2 and the second guide part 342 - 2 . At this time, the first guide part 341-2 and the second guide part 342-2 vary the applied current based on the measured result, so that the first guide part 341-2 affects the carrier 310. It is possible to adjust the attractive force and the attractive force exerted by the second guide part 342 - 2 on the carrier 310 . Through this, the distance between the first guide part 341-2 and the carrier 310 and the distance between the second guide part 342-2 and the carrier 310 may be adjusted. Accordingly, it is possible for the carrier 310 to move along a predetermined path by the first guide part 341 - 2 and the second guide part 342 - 2 .

When the carrier 310 moves as described above, the second carrier posture control unit 350 - 2 may constantly maintain the posture of the carrier 310 . In detail, since the first posture control unit 351-2 and the second posture control unit 352-2 form an attractive force with each other, it is possible to prevent the posture of the carrier 310 from being changed. In particular, the second carrier attitude control unit 350-2 may prevent the carrier 310 from tilting while moving.

The second transfer unit 300-2 as described above can also transfer the carrier 310 in a tilted state with respect to the ground. In this case, the tilting of the carrier 310 by forming the current applied to the second position adjusting unit 320-2, the second carrier guide unit 340-2, and the second carrier transport unit 330-2 to be different from the existing ones. It is possible to transport the carrier 310 in the state maintained.

In this case, the second blocking unit 361 - 2 may minimize the influence of the magnetic field or electric field generated by each component to each other. In particular, the second blocking unit 361 - 2 may block the magnetic field or electric field of the source unit 220 as well as the magnetic field or electric field generated in adjacent components.

When the display substrate D is transferred from the second chamber unit 200 to the first chamber unit 100 through the second transfer unit 300-2, the carrier 310 is transferred to the second transfer unit 300-2. can be moved to the first transfer unit. In this case, although the first chamber unit 100 and the second chamber unit 200 are connected to each other, the end of the first transfer unit and the end of the second transfer unit 300 - 2 may be spaced apart from each other. In this case, the distance between the end of the first transfer unit and the end of the second transfer unit 300 - 2 may be smaller than the width of the carrier 310 measured in the second direction. In particular, a distance between the end of the first transfer unit and the end of the second transfer unit 300 - 2 may be less than half the width of the carrier 310 . In this case, when the distance between the end of the first transfer unit and the end of the second transfer unit 300-2 exceeds half the width of the carrier 310, the carrier 310 cannot move a certain path and the path can escape

The carrier 310 transferred to the first transfer unit may be withdrawn to the outside of the first chamber unit 100 after changing the pressure inside the first chamber unit 100 from a vacuum state to an atmospheric pressure state as described above. have. Thereafter, the display substrate D on which the deposition material is deposited may be separated from the carrier 310 to perform another process.

On the other hand, in the case of the apparatus 10 for manufacturing a display device for depositing a deposition material on the display substrate D as described above, the display substrate D is transferred in such a way that the display substrate D is in direct contact. In this case, a foreign material may be generated due to contact between the display substrate D and the transport device, and the foreign material may be deposited or adsorbed on the display substrate D during deposition of a deposition material, thereby increasing the defect rate of the display device.

However, by transferring the display substrate D in a non-contact manner as described above, it is possible to minimize foreign substances generated when the display substrate D is transported.

Accordingly, the apparatus 10 for manufacturing the display device may improve the deposition quality by minimizing the generation of foreign substances when the display substrate D is transported. In addition, the apparatus 10 for manufacturing the display device may minimize the external force applied to the display substrate D when the display substrate D is transported by transporting the display substrate D in a non-contact manner.

The apparatus 10 for manufacturing a display device may prevent malfunction due to disturbance of a magnetic field or electric field by supplying a magnetic force used to implement a non-contact method only to a necessary portion.

The manufacturing apparatus 10 of the display device can be precisely controlled by minimizing the influence of the magnetic field between the components. The display device manufacturing apparatus 10 minimizes the magnetic field applied to the source unit 220, so that it is possible to maintain the deposition quality similar to the conventional one.

FIG. 5 is a front view illustrating another exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 . 6 is a side view showing the second transfer unit shown in FIG.

5 and 6 , the second transfer unit 300A-2 includes a carrier 310A, a second position adjustment unit 320A-2, a second carrier transfer unit 330A-2, and a second carrier guide unit. (340A-2), the second carrier posture control unit (350A-2), the second shielding unit (360A-2), the second interval measuring sensor unit (371A-2) and the second posture measuring sensor unit (372A-2) may include. At this time, the carrier (310A), the second position adjustment unit (320A-2), the second carrier posture control unit (350A-2), the second shielding unit (360A-2), the second interval measurement sensor unit (371A-2) , The second posture measurement sensor unit 372A-2 is the same as or similar to that described with reference to FIGS. 1 to 3 , so a detailed description thereof will be omitted.

The second carrier transfer unit 330A-2 may be disposed only on one surface of the carrier 310A. At this time, the second carrier conveying unit 330A-2 is a first conveying unit 331A-2 disposed on the carrier 310A and a second conveying unit 332A-2 disposed to be spaced apart from the first conveying unit 331A-2. may include In this case, since the first transfer unit 331A-2 and the second transfer unit 332A-2 are the same as or similar to those described above, a detailed description thereof will be omitted.

Only one second carrier guide unit 340A-2 may be provided. In this case, the second carrier guide portion 340A-2 may be disposed at a different portion from the portion in which the second carrier transfer portion 330A-2 is disposed with respect to the carrier 310A. The second carrier guide unit 340A-2 may be disposed at a different height from that of the second carrier transport unit 330A-2. In addition, when the carrier 310A is inclined with respect to the ground, the second carrier guide part 340A-2 may be disposed higher than the second carrier transport part 330A-2. In this case, the second carrier guide unit 340A-2 may prevent the carrier 310A from falling or the movement path of the carrier 310A from being changed by applying an attractive force to the carrier 310A.

On the other hand, the second transfer unit (300A-2) as described above may operate in the same or similar manner as described above. Specifically, when the carrier 310A is transported, the second transport unit 332A-2 forms an electromagnetic field to apply a force to the first transport unit 331A-2 to transport the carrier 310A. At this time, the second position adjusting unit (320A-2) is based on the value measured by the second interval measuring sensor unit (371A-2) the distance between the carrier (310A) and the second position adjusting unit (320A-2) can be adjusted In this case, the second position adjusting unit 320A-2 may vary the applied current.

The second posture measurement sensor unit 372A-2 may measure a distance between the second carrier guide unit 340A-2 and the carrier 310A. The second carrier guide unit 340A-2 may control the posture of the carrier 310A based on the value measured by the second posture measurement sensor unit 372A-2.

As described above, while the carrier 310A moves, the second carrier posture control unit 350A-2 may constantly maintain the posture of the carrier 310A. In particular, the first posture control unit 351A-2 and the second posture control unit 352A-2 may control the posture of the carrier 310A as described with reference to FIGS. 1 to 4 .

As described above, while the second transfer unit 300A-2 transfers the display substrate D, the second shielding part 360A-2 is part of the magnetic field generated by each part of the second transfer unit 300A-2. can be blocked. In this case, since the method of shielding the magnetic field by the second shielding unit 360A-2 is the same as or similar to that described above, a detailed description thereof will be omitted.

Therefore, the second transfer unit 300A-2 can quickly and easily transfer the display substrate D in a non-contact manner. In addition, the second transfer unit (300A-2) may not affect the operation of the source unit (220).

FIG. 7 is a front view illustrating another exemplary embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 . FIG. 8 is a side view showing the second transfer unit shown in FIG. 7 .

7 and 8 , the second transfer unit 300B-2 includes a carrier 310B, a second position adjustment unit 320B-2, a second carrier transfer unit 330B-2, and a second carrier guide unit. (340B-2), the second carrier posture control unit (350B-2), the second shielding unit (360B-2), the second interval measuring sensor unit (371B-2) and the second posture measuring sensor unit (372B-2) may include. At this time, the carrier 310B, the second position adjustment unit 320B-2, the second carrier guide unit 340B-2, the second carrier posture control unit 350B-2, the second shielding unit 360B-2, Since the second interval measuring sensor unit 371B-2 and the second posture measuring sensor unit 372B-2 are the same as or similar to those described with reference to FIGS. 1 to 3, a detailed description thereof will be omitted.

The second carrier transfer unit 330B-2 may include a first transfer unit 331B-2 disposed on the carrier 310B and a second transfer unit 332B-2 disposed to be spaced apart from the carrier 310B. In this case, the second carrier transfer unit 330B-2 may be disposed on the lower surface of the carrier 310B. For example, the first transfer unit 331B-2 may be attached to the lower surface of the carrier 310B, and the second transfer unit 332B-2 may be disposed on the lower surface of the second chamber 210 . In this case, the first transfer unit 331B-2 may be in the form of an electromagnet, and the second transfer unit 332B-2 may be in the form of a permanent magnet arrangement.

In this case, the second carrier transfer unit 330B-2 may be disposed between the first guide part 341B-2 and the second guide part 342B-2.

Meanwhile, the method for transferring the display substrate D by the second transfer unit 300B-2 may be similar to that described above.

Specifically, by varying the polarities of the plurality of electromagnets of the second transfer unit 332B-2, a force may be applied to the first transfer unit 331B-2 to transfer the carrier 310B. When the carrier 310B is transported as described above, the display substrate D may be transported together with the carrier 310B.

When the carrier 310B is transported, the second carrier guide part 340B-2 may prevent the carrier 310B from shaking. In this case, as described above, the second carrier guide unit 340B-2 may include an electromagnet to adjust the distance between the second carrier guide unit 340B-2 and the carrier 310B.

The second posture measurement sensor unit 372B-2 may measure a distance between the carrier 310B and the second carrier guide unit 340B-2. In this case, the current applied to the second carrier guide unit 340B-2 may be varied according to the value measured by the second posture measurement sensor unit 372B-2.

The second positioning unit 320B-2 may adjust the height at which the carrier 310B is lifted from the bottom surface of the second chamber 210 . At this time, the second posture measuring sensor unit 372B-2 may measure the distance between the second position adjusting unit 320B-2 and the upper surface of the carrier 310B, and the second position adjusting unit 320B-2. A current applied based on a result measured by the second posture measurement sensor unit 372B-2 may be controlled.

The second carrier posture control unit 350B-2 may prevent the posture of the carrier 310B from being changed by forming an attractive force on the carrier 310B. In addition, the second shielding portion (360B-2) by shielding a portion of the magnetic field generated in each part of the second transfer unit (300B-2), the operation of each part of the second transfer unit (300B-2) is disturbed it can be prevented In addition, the second shielding part 360B-2 may block the magnetic field of each part of the second transfer unit 300B-2 that may disturb the magnetic or electric field generated during the operation of the source part 220 .

Accordingly, the second transfer unit 300B-2 may not affect the operation of the source unit when the display substrate D is deposited through the source unit 220 . In addition, the second transfer unit (300B-2) it is possible to transfer the display substrate (D) in an accurate path in a state in which the display substrate (D) is formed at a predetermined angle with respect to the ground.

FIG. 9 is a front view illustrating another embodiment of a second transfer unit of the apparatus for manufacturing the display device illustrated in FIG. 1 . 10 is a side view showing the second transfer unit shown in FIG.

9 and 10 , the second transfer unit 300C-2 includes a carrier 310C, a second position adjustment unit 320C-2, a second carrier transfer unit 330C-2, and a second carrier guide unit. It may include a 340C-2, a second shielding part 360C-2, a second interval measuring sensor part 371C-2, and a second posture measuring sensor part 372C-2. At this time, the carrier (310C), the second position adjusting unit (320C-2), the second carrier guide unit (340C-2), the second shielding unit (360C-2), the second interval measuring sensor unit (371C-2) , the second posture measurement sensor unit 372C-2 is the same as or similar to that described with reference to FIGS. 1 to 3, and thus a detailed description thereof will be omitted.

The second carrier transfer unit 330C-2 may be disposed on a protruding portion of the carrier 310C. At this time, the second carrier conveying unit 330C-2 is a first conveying unit 331C-2 disposed on the carrier 310C and a second conveying unit 332C-2 disposed to face the first conveying unit 331C-2. may include The second transfer unit 332C - 2 may be installed to be fixed to the inner wall of the second chamber 210 .

The second transfer unit 332C-2 may include a motor 322C-2a and a magnetic roller 322C-2b connected to the motor 322C-2a to rotate. In this case, the magnetic rollers 322C-2b may be arranged such that permanent magnets of different polarities are alternated. As another embodiment, the magnetic roller 322C-2b may be formed in the form of an electromagnet. However, hereinafter, for convenience of description, a case in which the magnetic rollers 322C-2b are arranged such that permanent magnets of different polarities are alternately will be described in detail.

Meanwhile, the method for transferring the display substrate D by the second transfer unit 300C-2 may be the same or similar to that described above.

Specifically, when the motor 322C-2a rotates, the magnetic roller 322C-2b may rotate. At this time, according to the rotation of the magnetic roller 322C-2b, the magnetic roller 322C-2b and the first transfer unit 331C-2 generate a repulsive force or attractive force to each other, thereby transferring the carrier 310C.

When the carrier 310C is transported, the second carrier guide part 340C-2 may prevent the carrier 310C from shaking. In this case, as described above, the second carrier guide unit 340C-2 may include an electromagnet to adjust the distance between the second carrier guide unit 340C-2 and the carrier 310C.

The second posture measuring sensor unit 372C-2 may measure a distance between the carrier 310C and the second carrier guide unit 340C-2. In this case, the current applied to the second carrier guide unit 340C-2 may be varied according to the value measured by the second posture measurement sensor unit 372C-2.

The second position adjusting unit 320C-2 may adjust the height at which the carrier 310C is lifted from the bottom surface of the second chamber 210 . At this time, the second gap measuring sensor unit 371C-2 may measure the distance between the second position adjusting unit 320C-2 and the upper surface of the carrier 310C, and the second position adjusting unit 320C-2. A current applied based on a result measured by the second interval measuring sensor unit 371C-2 may be controlled.

The second shielding part (360C-2) prevents the operation of each part of the second transfer unit (300C-2) from being disturbed by shielding a part of the magnetic field generated in each part of the second transfer unit (300C-2). can do. In addition, the second shielding part 360C-2 may block the magnetic field of each part of the second transfer unit 300C-2 that may disturb the magnetic or electric field generated during the operation of the source part 220 .

Accordingly, the second transfer unit 300C-2 may not affect the operation of the source unit when the display substrate D is deposited through the source unit. In addition, the second transfer unit 300C-2 is capable of transferring the display substrate D in an accurate path while forming the display substrate D at a predetermined angle with respect to the ground. It is a front view showing still another embodiment of the second transfer unit of the apparatus for manufacturing a display device. 12 is a side view illustrating an apparatus for manufacturing the display device illustrated in FIG. 11 .

11 and 12 , the second transfer unit 300D-2 includes a carrier 310D, a second carrier transfer unit 330D-2, a second carrier guide unit 340D-2, and a second shielding unit ( 360D-2) and a second posture measurement sensor unit 372D-2.

The carrier 310D may include a seating portion 312D on which the display substrate D is mounted and a protrusion 313D protruding from the seating portion 312D.

The second carrier transfer unit 330D - 2 may include a first transfer unit 331D - 2 disposed in the carrier 310D and a second transfer unit 332D - 2 disposed in the second chamber 210 . At this time, since the first transfer unit 331D-2 and the second transfer unit 332D-2 are the same as or similar to those described with reference to FIGS. 1 to 4 , a detailed description thereof will be omitted.

The first transfer part 331D-2 and the second transfer part 332D-2 may be disposed on one side of the seating part 312D. For example, the first transfer part 331D-2 and the second transfer part 332D-2 may be disposed on the upper surface of the seating part 312D.

The second carrier guide part 340D-2 may include a first guide part 341D-2 and a second guide part 342D-2. In this case, the first guide part 341D-2 and the second guide part 342D-2 may be disposed to face the protrusion part 313D. In particular, the first guide part 341D-2 and the second guide part 342D-2 may be arranged to be symmetrical to each other about the second carrier transport part 330D-2. In this case, the first guide part 341D-2 and the second guide part 342D-2 may control the posture of the carrier 310D as well as guide the movement of the carrier 310D.

The second posture measuring sensor unit 372D-2 may measure the distance between the protrusion 313D and the first guide unit 341D-2 and the protrusion 313D and the second guide unit 342D-2. At this time, between the protrusion 313D and the first guide 341D-2 and the protrusion 313D and the second guide 342D-2 based on the results measured by the second posture measuring sensor 372D-2. can be adjusted, and it is also possible to control the posture of the carrier 310D.

Meanwhile, the method for transferring the display substrate D by the second transfer unit 300D-2 may be the same as or similar to that described above.

Specifically, when a current is applied to the first transfer unit 331D-2, the first transfer unit 331D-2 may apply a force to the second transfer unit 332D-2 to transfer the carrier 310D. In this case, the carrier 310D may move in the X direction (or the second direction) of FIG. 11 .

When moving as described above, the second posture measuring sensor unit 372D-2 may measure the distance between the carrier 310D and the second carrier guide unit 340D-2. In this case, the levitation height of the carrier 310D may be determined based on a value measured by the second posture measurement sensor unit 372D-2.

In addition, it is also possible to control the posture of the carrier 310D from the result measured by the second posture measuring sensor unit 372D-2. Specifically, the degree of inclination (or inclination, angle) of the carrier 310D may be determined based on the results measured by the pair of second posture measurement sensor units 372D-2, and the degree of inclination of the carrier 310 may be determined. By controlling the current applied to the second carrier guide unit 340D-2 by comparing the preset value with the carrier 310D, the carrier 310D maintains a predetermined posture (eg, the lengthened degree of the carrier 310D) constant. can

As described above, while the display substrate D is transferred through the second transfer unit 300D-2, the second shielding part 360D-2 is a magnetic field generated in each part of the second transfer unit 300D-2. By shielding a part, it is possible to prevent the operation of each part of the second transfer unit 300D-2 from being disturbed. In addition, the second shielding part 360D-2 may block the magnetic field of each part of the second transfer unit 300D-2 that may disturb the magnetic or electric field generated when the source part 220 is operated.

Therefore, the second transfer unit 300D-2 may not affect the operation of the source unit when the display substrate D is deposited through the source unit 220 . In addition, the second transfer unit (300D-2) it is possible to transfer the display substrate (D) in an accurate path in a state in which the display substrate (D) is formed at a predetermined angle with respect to the ground.

FIG. 13 is a plan view illustrating a display device manufactured with the device for manufacturing the display device shown in FIG. 1 . 14 is a cross-sectional view taken along line A-A shown in FIG. 13 .

13 and 14 , in the display device 20 , a display area DA and a non-display area outside the display area DA may be defined on the substrate 21 . A light emitting part (not shown) may be disposed in the display area DA, and a power line (not shown) may be disposed in the non-display area. In addition, the pad part C may be disposed in the non-display area.

The display device 20 may include a display substrate (D) and a thin film encapsulation layer (E). In this case, the display substrate D includes a substrate 21 , a buffer layer 22 , a thin film transistor (TFT), a passivation layer 27 , a pixel electrode 28A, a pixel defining layer 29 , an intermediate layer 28B, and a counter electrode. (28C) may be included.

The substrate 21 may be made of a plastic material, or a metal material such as SUS or Ti. In addition, the substrate 21 may use polyimide (PI). Hereinafter, for convenience of description, a case in which the substrate 21 is formed of polyimide will be described in detail.

A light emitting part (not marked) may be formed on the substrate 21 . In this case, the light emitting part is provided with a thin film transistor (TFT), a passivation layer 27 is formed to cover them, and the organic light emitting device 28 can be formed on the passivation layer 27 .

A buffer layer 22 made of an organic compound and/or an inorganic compound is further formed on the upper surface of the substrate 21, and may be formed of SiOx (x≥1) or SiNx (x≥1).

After the active layer 23 arranged in a predetermined pattern is formed on the buffer layer 22 , the active layer 23 is buried by the gate insulating layer 24 . The active layer 23 has a source region 23C and a drain region 23A, and further includes a channel region 23B therebetween.

The active layer 23 may be formed to contain various materials. For example, the active layer 23 may contain an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer 23 may contain an oxide semiconductor. As another example, the active layer 23 may contain an organic semiconductor material. However, hereinafter, for convenience of description, a case in which the active layer 23 is formed of amorphous silicon will be described in detail.

The active layer 23 may be formed by forming an amorphous silicon film on the buffer layer 22 , crystallizing it to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. In the active layer 23, a source region 23C and a drain region 23A thereof are doped with impurities, depending on the type of TFT, such as a driving TFT (not shown) and a switching TFT (not shown).

A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 filling the gate electrode 25 are formed on the upper surface of the gate insulating layer 24 .

Then, after forming the contact hole H1 in the interlayer insulating layer 26 and the gate insulating layer 24, the source electrode 27B and the drain electrode 27A are respectively formed on the interlayer insulating layer 26 in the source region ( 23C) and the drain region 23A.

A passivation layer 27 is formed on the thin film transistor thus formed, and a pixel electrode 28A of the organic light emitting device 28 (OLED) is formed on the passivation layer 27 . This pixel electrode 28A is contacted to the drain electrode 27A of the TFT by a via hole H2 formed in the passivation film 27 . The passivation film 27 may be formed of an inorganic material and/or an organic material, a single layer, or two or more layers, and may be formed as a planarization film so that the upper surface is flat regardless of the curvature of the lower film, whereas the curvature of the film located below It may be formed so as to be curved along the . And, the passivation film 27 is preferably formed of a transparent insulator so as to achieve a resonance effect.

After the pixel electrode 28A is formed on the passivation film 27, a pixel defining film 29 is formed of an organic material and/or an inorganic material so as to cover the pixel electrode 28A and the passivation film 27, and the pixel The electrode 28A is opened so as to be exposed.

Then, an intermediate layer 28B and a counter electrode 28C are formed on at least the pixel electrode 28A.

The pixel electrode 28A functions as an anode electrode and the counter electrode 28C functions as a cathode electrode. Of course, the polarities of the pixel electrode 28A and the counter electrode 28C may be reversed.

The pixel electrode 28A and the counter electrode 28C are insulated from each other by the intermediate layer 28B, and voltages of different polarities are applied to the intermediate layer 28B so that the organic light emitting layer emits light.

The intermediate layer 28B may include an organic emission layer. As another optional example, the intermediate layer 28B includes an organic emission layer, in addition to a hole injection layer (HIL), a hole transport layer, and an electron transport layer. and at least one of an electron injection layer. The present embodiment is not limited thereto, and the intermediate layer 28B includes an organic light emitting layer and may further include various other functional layers (not shown).

In this case, the intermediate layer 28B as described above may be formed through the above-described display device manufacturing apparatus (not shown).

Meanwhile, one unit pixel includes a plurality of sub-pixels, and the plurality of sub-pixels may emit light of various colors. For example, each of the plurality of sub-pixels may include a sub-pixel emitting red, green, and blue light, and may include a sub-pixel (not marked) emitting red, green, blue, and white light.

Meanwhile, the thin-film encapsulation layer (E) as described above may include a plurality of inorganic layers or may include an inorganic layer and an organic layer.

The organic layer of the thin film encapsulation layer (E) is formed of a polymer, preferably a single film or a laminate film formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. More preferably, the organic layer may be formed of polyacrylate, and specifically may include a polymerized monomer composition including a diacrylate-based monomer and a triacrylate-based monomer. The monomer composition may further include a monoacrylate-based monomer. In addition, a known photoinitiator such as TPO may be further included in the monomer composition, but is not limited thereto.

The inorganic layer of the thin film encapsulation layer (E) may be a single film or a laminated film including a metal oxide or a metal nitride. Specifically, the inorganic layer may include any one of SiNx, Al ₂ O ₃ , SiO ₂ , and TiO ₂ .

The uppermost layer exposed to the outside of the thin film encapsulation layer (E) may be formed of an inorganic layer to prevent moisture permeation to the organic light emitting device.

The thin film encapsulation layer (E) may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin film encapsulation layer (E) may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As another example, the thin film encapsulation layer (E) may include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. .

The thin film encapsulation layer E may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially from an upper portion of the organic light emitting diode OLED.

As another example, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer sequentially from an upper portion of the organic light emitting diode OLED.

As another example, the thin film encapsulation layer (E) is sequentially formed from an upper portion of the organic light emitting diode (OLED) with a first inorganic layer, a first organic layer, a second inorganic layer, the second organic layer, a third inorganic layer, and a third It may include an organic layer and a fourth inorganic layer.

A metal halide layer including LiF may be further included between the organic light emitting diode (OLED) and the first inorganic layer. The metal halide layer may prevent the organic light emitting diode (OLED) from being damaged when the first inorganic layer is formed by sputtering.

The first organic layer may have a smaller area than the second inorganic layer, and the second organic layer may also have a smaller area than the third inorganic layer.

In the case of forming the inorganic layer as described above, it may be manufactured through the above-described display device manufacturing apparatus (not shown). In this case, the display substrate D may be transferred to the second chamber unit (not shown) through the first chamber unit (not shown), and the deposition material may be deposited on the display substrate D by the source unit (not shown). .

In this case, when the display substrate (D) is transported, the carrier (not shown) is transported without contact with other objects, so that foreign substances are not generated, so that the deposition quality of the display substrate (D) can be improved.

Accordingly, the display device 20 does not cause a defect because foreign substances are not adsorbed to the display substrate D when the deposition material is deposited, and an accurate image can be realized.

As such, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

10: manufacturing apparatus of a display device
20: display device
100: first chamber unit
200: second chamber unit
210: second chamber
220: source unit
262-2: second magnetic field guide unit
300: transfer unit
300-2, 300A-2, 300B-2, 300C-2, 300D-2: second transfer unit
310, 310A, 310B, 310C, 310D: Carrier
320-2, 320A-2, 320B-2, 320C-2: second position adjustment unit
330-2, 330A-2, 330B-2, 330C-2, 330D-2: second carrier transfer unit
331-2, 331A-2, 331B-2, 331C-2, 331D-2: first transfer unit
332-2, 332A-2, 332B-2, 332C-2, 332D-2: second transfer unit
340-2, 340A-2, 340B-2, 340C-2, 340D-2: second carrier guide part
341-2, 341B-2, 341D-2: first guide part
342-2, 342B-2, 342D-2: second guide part
350-2, 350A-2, 350B-2: second carrier attitude control unit
351-2, 351A-2: first posture control unit
352-2, 352A-2: second posture control unit
360-2, 360A-2, 360B-2, 360C-2, 360D-2: second shield
371-2, 371A-2, 371B-2, 371C-2: second interval measuring sensor unit
372-2, 372A-2, 372B-2, 372C-2, 372D-2: second posture measurement sensor unit
400: gate valve

Claims (20)

a source unit disposed to face the display substrate, supplying a deposition material to the display substrate, and generating a magnetic or electric field;
a carrier disposed to face the source unit and to which the display substrate is fixed;
a position adjusting unit disposed to be spaced apart from the carrier and configured to adjust the position of the carrier in a first direction;
a carrier transfer unit for transferring the carrier in a second direction;
a carrier guide portion disposed to be spaced apart from the carrier to adjust the position of the carrier; and
a shielding unit disposed on at least one of the position adjustment unit, the carrier transfer unit, and the carrier guide unit to block a magnetic field generated by at least one of the position adjustment unit, the carrier transfer unit, and the carrier guide unit; manufacturing equipment. The method of claim 1,
and a carrier posture control unit arranged to be spaced apart from the position adjusting unit and configured to control the posture of the carrier. 3. The method of claim 2,
The carrier posture control unit,
a first posture control unit disposed on the carrier; and
and a second posture control unit spaced apart from the first posture control unit to control the posture of the carrier. The method of claim 1,
The carrier is vertically arranged, and the position adjusting unit is disposed on an upper surface of the carrier. The method of claim 1,
The carrier guide part is disposed to face one surface of the carrier. The method of claim 1,
The carrier guide unit,
a first guide part disposed on one side of both surfaces of the carrier; and
and a second guide part disposed to face the first guide part and disposed on the other side of both surfaces of the carrier. The method of claim 1,
The carrier transport unit,
a first transfer unit disposed on the carrier; and
and a second transfer unit spaced apart from the first transfer unit and configured to generate a driving force for moving the carrier together with the first transfer unit. The method of claim 1,
The apparatus for manufacturing a display device further comprising a; an interval measuring sensor for measuring a distance between the position adjusting unit and the carrier. The method of claim 1,
The apparatus for manufacturing a display device further comprising a; an attitude measurement sensor unit for measuring a distance between the carrier guide unit and the carrier. The method of claim 1,
The shield is
A display device comprising a; a blocking unit disposed on at least one of the position adjusting unit, the carrier conveying unit, and the carrier guide unit to block a magnetic field generated by at least one of the position adjusting unit, the carrier conveying unit, and the carrier guide unit; manufacturing equipment. 11. The method of claim 10,
The shield is
and a magnetic field guide part disposed on the blocking part and guiding the magnetic field generated by at least one of the position adjusting part, the carrier transport part, and the carrier guide part. The method of claim 1,
A plurality of the carrier transfer unit is provided,
The plurality of carrier transporters are arranged to be spaced apart from each other in the second direction, and a distance between the adjacent carrier transporters is smaller than a length of the carrier. a first chamber unit on which the display substrate is loaded or unloaded;
a second chamber unit for depositing a deposition material on the display substrate;
A transfer unit disposed in at least one of the first chamber unit and the second chamber unit and transferring the display substrate from the first chamber unit to the second chamber unit or from the second chamber unit to the first chamber unit including;
The transfer unit is
a carrier disposed to face the source unit and to which the display substrate is fixed to transport the display substrate;
a position adjusting unit disposed to be spaced apart from the carrier and configured to adjust the position of the carrier in a first direction;
a transfer unit for transferring the carrier in a second direction;
a guide part disposed to be spaced apart from the carrier to adjust a position of the carrier; and
a shielding unit disposed on at least one of the position adjusting unit, the conveying unit, and the guide unit to block the magnetic field generated by at least one of the position adjusting unit, the conveying unit, and the guide unit;
The second chamber unit,
a chamber in which the display substrate is accommodated; and
and a source unit disposed inside the chamber and configured to spray a deposition material onto the display substrate and generate a magnetic or electric field. delete loading the display substrate into the first chamber unit;
transferring the display substrate of the first chamber unit to a second chamber unit; and
In the second chamber unit, supplying a deposition material to the display substrate facing the source portion through a source for generating a magnetic or electric field in the second chamber unit to deposit the deposition material on the display substrate;
The display substrate is transported by floating in a non-contact manner through the transfer unit on which the display substrate is seated, and the transfer unit shields the magnetic field generated by the transfer unit when the display substrate is transferred from the second chamber unit. manufacturing method. 16. The method of claim 15,
A method of manufacturing a display device for shielding a magnetic field directed toward the source unit among the magnetic fields generated by the transfer unit. 16. The method of claim 15,
and a shielding unit in which the transfer unit is disposed to face the source unit and shields the magnetic field. 16. The method of claim 15,
The transfer unit includes a carrier to which the display substrate is fixed,
A distance between the first chamber unit and the second chamber unit is smaller than a width of the carrier. 16. The method of claim 15,
The transfer unit maintains a constant posture of the display substrate when the display substrate is transferred. 16. The method of claim 15,
The transfer unit transfers the display substrate in a tilted state with respect to the ground.

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