KR102453491B1 - Floor for reducing noise between apartments - Google Patents

Abstract

In accordance with the present invention, disclosed is a floor for reducing noise between floors. The floor includes: a unit SPC floor panel (100); a floor noise reduction structure including a frame part (110) having a floor panel attachment surface (111) and a construction floor attachment surface (112) formed in upper and lower parts respectively, formed in a shape corresponding to the size of the unit SPC floor panel (100), having a plurality of space parts (113) spatially separated by a grid frame (114) in a matrix form and arranged therein, and formed with a first thickness (T1), a damping part (120) formed with a second thickness (T2) smaller than the first thickness (T1) and formed at a height above the floor panel attachment surface (111) to be resonated vertically and laterally, formed as at least one unit in each of the space parts (113), extended from at least one side of the grid frame (114) to damp vibrations and noise transmitted from the floor panel attachment surface (111), and a support part (130) erectly formed at a predetermined height from the construction floor attachment surface (112) to come in surface contact, line contact or point contact with the construction floor; and a sound absorption pad (140) having a thickness of 1 to 3 mm, attached between the unit SPC floor panel (100) and the floor noise reduction structure through an adhesive to damp vibrations and noise transmitted from the unit SPC floor panel (100). Therefore, the unit SPC floor panel (100), the floor noise reduction structure and the sound absorption pad (140) are integrated to effectively damp vibrations and noise transmitted from the SPC floor panel (100) without the need for extra sound absorption construction during floor construction.

Description

Floor noise reduction between floors{FLOOR FOR REDUCING NOISE BETWEEN APARTMENTS}

The present invention can reduce the number of work hours by not performing a separate sound absorbing construction during floor construction by forming a unit SPC floor panel, a noise reduction structure between floors, and a sound absorbing pad in one piece. It relates to a floor that reduces noise between floors, which can increase the strength of the bonding structure between pads.

As is well known, as the common housing types such as multi-family houses, villas, officetels, and apartments are common, the problem of inter-floor noise is emerging.

Accordingly, in order to reduce vibration and noise caused by floor impact, research on the development of new noise and vibration materials and noise and vibration reduction technology in the construction field is continuously being made.

As a related prior art, the sound insulation material for preventing noise transmission between floors according to Korean Patent Registration No. 10-1487374 is intended to prevent transmission of noise between floors by forming a raised structure through the sound insulation material having a plurality of intaglio concave grooves and embossed protrusions. However, there is a limit to reducing noise between floors by reducing only the contact area with the floor.

In addition, the interlayer noise prevention material according to Korean Patent Publication No. 10-1076381 is intended to maximize the sound absorption effect through membrane vibration by inducing interlayer impact or noise with a vortex-shaped bulkhead, but is limited in reducing excessive interlayer impact or noise. and may cause secondary noise by the bulkhead.

By improving this, there is a need for a technology capable of increasing the structural strength of the floor while simplifying the construction of the floor and more effectively alleviating the vibration and noise transmitted from the SPC floor panel to the floor under construction.

Korean Patent Publication No. 10-2113446 (Core layer composition for stone plastic composite plate (SPC), stone plastic composite plate (SPC)/flooring and manufacturing method thereof, May 20, 2020) Korean Patent Publication No. 10-1487374 (Sound insulating material for preventing transmission of noise between floors and its installation method, 2015.01.29) Korean Patent Publication No. 10-1076381 (interlayer noise prevention material, 2011.10.25)

The technical problem to be achieved by the spirit of the present invention is that the unit SPC floor panel, the interlayer noise reduction structure and the sound absorbing pad are integrally formed to reduce the number of work hours by not performing a separate sound absorbing construction during floor construction, and the unit SPC flooring An object of the present invention is to provide an interlayer noise reduction floor that can increase the strength of the bonding structure between the panel and the interlayer noise reduction structure and the sound absorbing pad.

In order to achieve the above object, an embodiment of the present invention provides a unit SPC floor panel in which fitting holes and insertion holes are respectively formed on both sides of a long side and are respectively coupled to adjacent insertion holes and fitting holes to form a floor; The floor panel attachment surface and the construction floor attachment surface are respectively formed up and down, and are formed in a shape corresponding to the size of the unit SPC floor panel, and a plurality of spaces inside are spatially separated and arranged in a matrix form by a grid frame , a frame portion formed to a first thickness, a frame portion formed to a second thickness smaller than the first thickness, formed at a height lifted from the floor panel attachment surface, and resonated vertically and horizontally, at least one formed inside each space portion, a damping unit extending from at least one of each side of the grid frame to attenuate vibration and noise transmitted from the floor panel attachment surface; Or comprising a support part in point contact, the interlayer noise reduction structure; and a sound-absorbing pad having a thickness of 1 mm to 3 mm that is respectively attached between the unit SPC floor panel and the interlayer noise reduction structure by an adhesive to attenuate vibration and noise transmitted from the unit SPC floor panel; provides

Here, on one side of the sound-absorbing pad in contact with the unit SPC floor panel, a linear, oblique, or cross-type micro-engraved pattern or micro-embossed pattern is formed, and the other side of the sound-absorbing pad is in contact with the interlayer noise reduction structure. A linear, oblique or cross-type micro-engraved pattern or micro-embossed pattern may be formed.

In addition, a plurality of adhesive through holes may be formed in the sound absorbing pad so that the adhesive applied to the unit SPC floor panel and the adhesive applied to the lattice frame of the interlayer noise reduction structure are in contact with each other.

In addition, the damping unit includes an oscillating plate formed in the center, a ring spaced apart from the oscillating plate and one or more lines enclosing the oscillating plate, and a first connecting piece extending linearly from at least one side of the grid frame and connected to the ring and the sounding plate can be composed of

In addition, it may further include a second connecting piece extending in a straight line from at least one side of the grid frame and connected to the ring.

In addition, the support part includes a first support formed at the corner of the grid frame, a second support formed at the intersection of the grid frame and the first connecting piece, and a third support formed at the intersection of each side of the grid frame. may include

In addition, the first support and the second support may be formed in a triangular shape in line contact with the construction floor.

In addition, the third support may be in surface contact with the construction floor in a cross shape.

In addition, the sounding board may be formed in a circular or oval shape, and the ring may be formed in a circular ring or an oval ring.

According to the present invention, by forming the unit SPC floor panel, the noise reduction structure between floors and the sound absorbing pad in one piece, it is possible to reduce the number of work hours by not performing a separate sound absorption construction during floor construction, and the unit SPC floor panel and the noise reduction structure between the floors It is possible to increase the strength of the bonding structure between the sound absorbing pad and the SPC floor panel, and to reduce the noise between floors by reducing the vibration and noise transmitted from the SPC floor panel to the construction floor through the double attenuation structure.

1 is a perspective view of a floor for reducing noise between floors according to an embodiment of the present invention, respectively.
2 is an exploded view of the inter-floor noise reduction floor of FIG. 1, respectively.
FIG. 3 shows a cross-sectional structure of the inter-floor noise reduction floor of FIG. 1. Referring to FIG.
4 is a perspective view of the inter-floor noise reduction structure of the inter-floor noise reduction floor of FIG. 1 .
5 is a side view, a plan view, and a side view, respectively, of the interlayer noise reduction structure of FIG. 4 .
6 and 7 show a cross-sectional structure of the interlayer noise reduction structure of FIG.
8 shows various modifications of the interlayer noise reduction structure of FIG. 4, respectively.
9 illustrates a modification of the frame portion of the interlayer noise reduction structure of FIG. 4 .

Hereinafter, embodiments of the present invention having the above-described characteristics with reference to the accompanying drawings will be described in more detail.

In the interfloor noise reduction flooring according to the embodiment of the present invention, fitting holes 101 and insertion holes 102 are respectively formed on both sides of a long side and are respectively coupled to adjacent insertion holes and fitting holes to form a floor, a unit SPC floor panel (100), the floor panel attachment surface 111 and the construction floor attachment surface 112 are respectively formed up and down, and are formed in a shape corresponding to the size of the unit SPC floor panel 100, and a plurality of space portions ( 113) are spatially separated and arranged in a matrix form by the lattice frame 114, the frame portion 110 formed of a first thickness T1, and a second thickness T2 smaller than the first thickness T1 It is formed as a floor panel mounting surface 111 at a height raised from the floor panel attachment surface 111 and resonates up, down, left and right, and at least one is formed inside each space part 113 , and extends from at least one or more of each side of the grid frame 114 . A damping part 120 for attenuating vibration and noise transmitted from the panel attachment surface 111, and a support part that is formed upright at a certain height from the construction floor attachment surface 112 to make surface contact, line contact or point contact with the construction floor ( 130), and 1 mm to 3 mm that are respectively attached between the unit SPC floor panel 100 and the inter-layer noise reduction structure by an adhesive to attenuate vibration and noise transmitted from the unit SPC floor panel 100 Including the sound-absorbing pad 140 of the thickness, the unit SPC floor panel 100, the interlayer noise reduction structure, and the sound-absorbing pad 140 are integrally formed so that no separate sound-absorbing construction is performed during floor construction, and the SPC floor panel ( 100) to effectively attenuate the vibration and noise transmitted from it.

Hereinafter, with reference to FIGS. 1 to 9 , the interfloor noise reduction floor of the above-described configuration will be described in detail as follows.

First, in the unit SPC (stone-plastic composite) floor panel 100, fitting holes 101 and insertion holes 102 are formed on both sides of the long side, respectively, and they are respectively coupled to the insertion holes and fitting holes of other unit SPC floor panels adjacent to each other. to form a floor.

For reference, SPC flooring panels can reduce energy consumption while using eco-friendly materials of natural limestone powder and polyvinyl chloride, and are made of stone plastic composites with good surface strength and durability, good fire resistance, and excellent heat transfer efficiency. panel, and the composition may consist of 40 to 50 parts by weight of calcium carbonate powder, 10 to 20 parts by weight of loess powder, 10 to 15 parts by weight of hemp fiber, 30 to 40 parts by weight of resin powder, and 8 to 12 parts by weight of resin stabilizer.

On the other hand, as shown in (a) of FIG. 2, on one side of the sound absorbing pad 140 in contact with the unit SPC floor panel 100, a linear, oblique, or cross-type micro-engraved pattern 141 or micro-embossed pattern ( 141) is formed, and as shown in (b) of FIG. 2 , on the other side of the sound-absorbing pad 140 in contact with the interlayer noise reduction structure, a linear, oblique or cross-type micro-engraved pattern 142 or micro-embossed pattern By forming 142, the contact area with the adhesive can be increased to increase the strength of the bonding structure between the unit SPC floor panel 100 interposed with the adhesive and the interlayer noise reduction structure and the sound absorbing pad 140 .

Also, as shown in FIG. 3 , on the sound absorption pad 140 , the adhesive applied to the bottom of the unit SPC floor panel 100 and the adhesive applied to the top of the grid frame 114 of the interlayer noise reduction structure are mutually applied. A plurality of adhesive through-holes 143 are formed so as to be in contact with the unit SPC floor panel 100 and the interlayer noise reduction structure and sound absorption even when the above and below adhesives are connected through the through-holes 143, even when deformed due to thermal deformation or moisture penetration. The strength of the bonding structure between the pads 140 may be further increased.

Next, the interlayer noise reduction structure is composed of the frame part 110 , the damping part 120 , and the support part 130 to attenuate vibration and noise transmitted from the SPC floor panel 100 through the sound absorbing pad 140 .

The frame part 110 is a configuration that forms the overall outer shape and skeleton, and the floor panel attachment surface 111 and the construction floor attachment surface 112 are formed to face each other vertically, and have a shape corresponding to the size of the unit SPC floor panel. is formed, and a plurality of space portions 113 on the inside are spatially partitioned and arranged in a matrix form by a grid frame 114, and are formed with a first thickness T1 of 4 mm to 5 mm.

The damping unit 120 is configured to detour the vibration and noise transmitted from the floor panel attachment surface 111 to the construction floor attachment surface 112 and thereby attenuate the sound within a range that does not come into contact with the SPC floor panel and the construction floor. As shown in enlarged view, the second thickness T2 is 1 mm to 2 mm smaller than the first thickness T1, and the height is raised from the floor panel attachment surface 111, that is, formed at a height spaced apart from the SPC floor panel. Therefore, it is made to sound without direct contact with the SPC floor panel.

In addition, at least one damping unit 120 is formed inside each space unit 113 , and extends from at least one or more of each side of the grid frame 114 , and vibration and noise transmitted from the floor panel attachment surface 111 . attenuate the

Specifically, referring to FIG. 6 , the attenuation unit 120 includes a ring 122 of one or more lines formed in the center and spaced apart from the sounding plate 121 at a predetermined interval to surround the sounding plate 121 . ) and a first connecting piece 123 extending in a straight line from at least one side of the grid frame 114 and continuously connected to the ring 122 and the sounding plate 121, from the first connecting piece 123 to the ring 122 ) and vibration and noise are sequentially transmitted to the sounding plate 121 , and are primarily attenuated by the vibration of the ring 122 , and are secondarily attenuated by the ringing of the ringing plate 121 . and noise can be effectively mitigated.

In addition, as mentioned above, the second connecting piece ( By further including 124), the vibration and noise transmitted from the first connection piece 123 and the vibration and noise transmitted from the second connection piece 124 overlap in the ring 122 to cancel the vibration and noise more efficiently. may be alleviated by

In addition, the sounding plate 121 may be formed in a circular or oval shape, and the ring 122 may be formed in a circular ring or an oval ring.

In addition, the width of the first connection piece 123 or the second connection piece 124 is formed to be greater than the width of the grid frame 114, so that the vibration and noise transmitted from the SPC floor panel are reduced by the sounding plate 121 and the ring rather than the construction floor. It is also possible to increase the damping effect by allowing more transmission to (122).

The support part 130 is formed upright at a certain height from the construction floor attachment surface 112 to minimize vibration and noise directly transmitted to the construction floor by making surface contact, line contact, or point contact with only a part of the construction floor.

Specifically, as shown in FIG. 6 , the support 130 is at the intersection of the first support 131 formed at each corner of the grid frame 114 , the grid frame 114 and the first connection piece 123 . The second support 132 is formed separately, and the third support 133 is formed at the intersection of each side of the grid frame 114. In this way, vibration and noise transmitted to the construction floor can be minimized.

Here, the first support 131 and the second support 132 may be formed in a triangular shape in line contact with the construction floor, but are not particularly limited thereto, and may have various shapes capable of surface contact, line contact or point contact. can be done

In addition, the third support 133 may be in surface contact with the construction floor in a cross shape, but is not particularly limited thereto, and various three-dimensional shapes having a square, circular, and rhombus planar shape capable of surface contact, line contact, or point contact. can be made with

8 shows various modifications of the interlayer noise reduction structure of FIG. 4, respectively, as in (a), the first connection piece 123 is connected to the ring 122 and the sounding plate 121, and the second connection piece (124) is configured to be connected to the ring 122, as in (b), only the first connecting piece 123 is connected to the ring 122 and the sounding plate 121, or, as in (c), the first The connecting piece 123 is connected to the ring 122 and the sounding plate 121, and the second connecting piece 124 is also configured to be connected to the ring 122 and the sounding plate 121, or as in (d), the second connecting piece Only 124 may be configured to be connected to the ring 122 and the sounding plate 121 .

Meanwhile, referring to FIG. 9 , on the outer surface of the outer side of the frame part 110 , the corrugation part 115 in the shape of a groove is formed in more than one line, so that the wrinkle part 115 is vertically directed from the SPC floor panel to the construction floor. It can also be folded by the pressure transmitted to the damping unit 120 or to absorb some of the vibration transmitted to the construction floor.

In addition, since the frame part 110, the damping part 120, and the support part 130 are simultaneously molded by a single mold, a separate assembly or attachment process is unnecessary, thereby reducing the number of manufacturing times. A plurality of grooves may be arranged on the surface of the 121 or ring 122 to provide a sound-absorbing effect like an egg plate, and the sound-absorbing plate 121 or the ring 122 may have a multi-layered structure coated with a sound-absorbing coating agent. In addition, the thickness of the sounding plate 121 may be formed thinner than the thickness of the ring 122 to minimize the deflection of the sounding plate 121 during long-term use. It may be formed to be dented in a parabolic shape.

Next, the sound-absorbing pad 140 is formed of a silicon, rubber, or PE foam material having a thickness of 1 mm to 3 mm, and is attached between the unit SPC floor panel 100 and the interlayer noise reduction structure by an adhesive, respectively. 100) to attenuate the vibration and noise transmitted from it.

In addition, although not shown, a plurality of egg plate-shaped grooves are arranged on one side or the other side of the sound-absorbing pad 140 to increase the sound-absorbing effect, and the unit SPC floor panel 100 and the interlayer noise reduction structure and In order to increase the strength of the bonding structure between the sound absorbing pads 140, a clip in close contact with the unit SPC floor panel 100 and the interlayer noise reduction structure and the sound absorbing pad 140 is attached to the opposite edge, or the unit SPC floor panel 100 and A fastener penetrating the interlayer noise reduction structure and the sound-absorbing pad 140 is inserted, so that the lifting phenomenon can be prevented.

Therefore, by the structure of the inter-floor noise reduction structure as described above, the unit SPC floor panel, the inter-layer noise reduction structure, and the sound-absorbing pad are integrally formed to reduce the number of working hours by not performing a separate sound-absorbing construction during floor construction. , It is possible to increase the strength of the bonding structure between the unit SPC floor panel and the inter-floor noise reduction structure and the sound-absorbing pad, and to reduce the noise between floors by alleviating the vibration and noise transmitted from the SPC floor panel to the construction floor through the double attenuation structure. have.

The embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiment of the present invention, and do not represent all of the technical spirit of the present invention, so various equivalents that can replace them at the time of the present application It should be understood that there may be water and variations.

100: unit SPC floor panel 101: fitting hole
102: insert
110: frame part 111: floor panel attachment surface
112: construction floor attachment surface 113: space part
114: grid frame 115: wrinkle part
120: attenuation unit 121: sound board
122: ring 123: first connection piece
124: second connection piece 130: support
131: first support 132: second support
133: third support
140: sound absorbing pad 141, 142: fine engraved pattern or fine embossed pattern
143: through hole

Claims (9)

a unit SPC floor panel in which fitting holes and insertion holes are respectively formed on both sides of the long side and are respectively coupled to adjacent insertion holes and fitting holes to form a floor;
The floor panel attachment surface and the construction floor attachment surface are respectively formed up and down, and are formed in a shape corresponding to the size of the unit SPC floor panel, and a plurality of spaces inside are spatially separated and arranged in a matrix form by a grid frame , a frame portion formed to a first thickness, a frame portion formed to a second thickness smaller than the first thickness, formed at a height lifted from the floor panel attachment surface, and resonated vertically and horizontally, at least one formed inside each space portion, a damping unit extending from at least one of each side of the grid frame to attenuate vibration and noise transmitted from the floor panel attachment surface; Or comprising a support part in point contact, the interlayer noise reduction structure; and
Containing, including;
The attenuation unit,
An oscillating plate formed in the center, one or more rings spaced apart from the oscillating plate and enclosing the oscillating plate, and a first connecting piece extending linearly from at least one side of the grid frame and connected to the ring and the oscillating plate It is characterized in that it consists of A floor to reduce noise between floors.
According to claim 1,
A linear, oblique, or cross-type micro-engraved pattern or micro-embossed pattern is formed on one side of the sound-absorbing pad in contact with the unit SPC floor panel, and a straight-type on the other side of the sound-absorbing pad in contact with the interlayer noise reduction structure. , Inter-floor noise reduction flooring, characterized in that a fine engraved pattern or a fine embossed pattern of an oblique or cross type is formed.
3. The method of claim 2,
A plurality of adhesive through holes are formed in the sound absorbing pad so that the adhesive applied to the unit SPC floor panel and the adhesive applied to the lattice frame of the interlayer noise reducing structure are in contact with each other.
delete According to claim 1,
Inter-floor noise reduction floor, characterized in that it further comprises a second connecting piece extending in a straight line from at least one side of the grid frame and connected to the ring.
6. The method of claim 5,
The support includes a first support formed at a corner of the grid frame, a second support formed at the intersection of the grid frame and the first connection piece, and a third support formed at the intersection of each side of the grid frame Noise reduction floor between floors, characterized in that.
7. The method of claim 6,
The first support and the second support are formed in a triangular shape in line contact with the construction floor, inter-floor noise reduction flooring.
7. The method of claim 6,
The third support is inter-floor noise reduction floor, characterized in that the surface contact with the construction floor in a cross shape.
According to claim 1,
The sounding board is formed in a circular or oval shape, and the ring is formed in a circular ring or an oval ring.

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