KR102431078B1 - Solar cell panel and method for manufacturing the same - Google Patents

Abstract

A solar cell panel according to an embodiment of the present invention includes a plurality of solar cells; an interconnector electrically connecting the plurality of solar cells; a sealing material sealing the plurality of solar cells and the interconnector; a first cover member positioned on one surface of the solar cell on the sealing material; and a second cover member positioned on the other surface of the solar cell on the sealing material, wherein an acid inhibiting material is provided on a surface portion of the interconnector adjacent to the sealing material.

Description

Solar cell panel and manufacturing method thereof

The present invention relates to a solar cell panel and a method for manufacturing the same, and more particularly, to a solar cell panel with improved structure and process, and a method for manufacturing the same.

Recently, as existing energy resources such as oil and coal are expected to be depleted, interest in alternative energy to replace them is increasing. Among them, a solar cell is spotlighted as a next-generation battery that converts solar energy into electrical energy. Solar cells can be manufactured by forming various layers and electrodes according to design. The design of these various layers and electrodes can determine the solar cell efficiency.

Since the solar cell has to be exposed to the external environment for a long time, it is manufactured in the form of a solar cell panel by a packaging process for protecting the solar cell. Since solar panels have to generate electricity for a long period of time in various environments, long-term reliability is greatly required. In a high-temperature and high-humidity environment, characteristics of a solar cell panel may be undesirably changed, and thus output may be reduced.

An object of the present invention is to provide a solar cell panel that can improve long-term reliability and can be manufactured by a simple manufacturing process and a manufacturing method thereof.

A solar cell panel according to an embodiment of the present invention includes a plurality of solar cells; an interconnector electrically connecting the plurality of solar cells; a sealing material sealing the plurality of solar cells and the interconnector; a first cover member positioned on one surface of the solar cell on the sealing material; and a second cover member positioned on the other surface of the solar cell on the sealing material, wherein an acid inhibiting material is provided on a surface portion of the interconnector adjacent to the sealing material.

A method of manufacturing a solar cell panel according to an embodiment of the present night may include: preparing a plurality of solar cells including a photoelectric conversion unit and an electrode; disposing an acid inhibiting material over a surface of an interconnector electrically connecting the plurality of solar cells; electrically connecting the plurality of solar cells using the interconnector on which the acid suppression material is located; and a sealing material sealing the solar cell and the interconnector, the solar cell and the interconnector, a first cover member located on one surface of the solar cell on the sealing material, and the other surface of the solar cell on the sealing material. and stacking and attaching a second cover member.

According to the present embodiment, since the acid inhibiting material is positioned on the surface portion of the interconnector adjacent to the sealing material, it is possible to effectively prevent corrosion of the electrode due to penetration of moisture. By placing the acid-suppressing material on the surface of the interconnector in this way, the acid-suppressing material can be formed on the periphery of the electrode (especially the busbar electrode) adjacent to the sealing material in a simple process. As a result, it is possible to prevent or minimize a decrease in output that may occur in a high-temperature and high-humidity environment, thereby improving the long-term reliability of the solar cell panel.

In addition, it is possible to manufacture a solar cell panel capable of reducing or preventing a decrease in output by preventing corrosion of an electrode by an acidic material by a simple process.

1 is a perspective view illustrating a solar cell panel according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1 .
FIG. 3 is a schematic partial cross-sectional view illustrating an enlarged part of a solar cell panel taken along line III-III of FIG. 1 .
4 is a front plan view of a solar cell included in the solar cell panel shown in FIG. 1 .
5 is a partial cross-sectional view of a solar cell panel according to a modification of the present invention.
6 is a partial cross-sectional view of a solar cell panel according to another modified example of the present invention.
7 is a partial cross-sectional view of a solar cell panel according to another modified example of the present invention.
8 is a partial cross-sectional view of a solar cell panel according to still another modified example of the present invention.
9 is a front plan view of a solar cell included in the solar cell panel shown in FIG. 8 .
10A to 10D are cross-sectional views illustrating a method of manufacturing a solar cell panel according to an embodiment of the present invention.
11 is a cross-sectional view illustrating a process of placing an acid inhibiting material on an interconnector in a method of manufacturing a solar cell panel according to another embodiment of the present invention.
12 is a graph showing a relative output degradation value compared to an initial output in the solar cell panel according to Example 1 and Comparative Example 1. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to these embodiments and may be modified in various forms.

In the drawings, in order to clearly and briefly describe the present invention, the illustration of parts irrelevant to the description is omitted, and the same reference numerals are used for the same or extremely similar parts throughout the specification. In addition, in the drawings, the thickness, width, etc. are enlarged or reduced in order to make the description more clear, and the thickness, width, etc. of the present invention are not limited to the bars shown in the drawings.

And, when a certain part "includes" another part throughout the specification, other parts are not excluded unless otherwise stated, and other parts may be further included. In addition, when a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly on" but also the case where another part is located in the middle. When a part, such as a layer, film, region, plate, etc., is "directly above" another part, it means that no other part is located in the middle. In addition, terms such as “first” and “second” are used to distinguish each other, and the present invention is not limited to the terms “first” and “second”.

Hereinafter, a solar cell panel and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a solar cell panel according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view taken along line II-II of FIG. 1 . The acid suppression material 152 or the acid suppression layer 150 is not shown in FIG. 1 for simplicity of illustration.

1 and 2 , a solar cell panel 100 according to the present embodiment includes a plurality of solar cells 10 , an interconnector 142 electrically connecting the plurality of solar cells 10 , and a plurality of solar cells 10 . A sealing material 130 surrounding and sealing the solar cell 10 and the interconnector 142 of front member) 110 , and a second cover member (or rear member) 120 positioned on the other surface (eg, a rear surface) of the solar cell 10 on the sealing material 130 , and the sealing material 130 is disposed on the sealing material 130 . An acid inhibiting material 152 is provided on the surface portion of the adjacent interconnector 142 .

At this time, the solar cell 10 includes a photoelectric conversion unit generating electrons and holes by the incident of light, and electrodes (reference numerals 42, 44, hereinafter the same) may be included. The photoelectric conversion unit and the electrodes 42 and 44 may have various structures. An example of the solar cell 10 applicable to the solar cell panel 100 according to an embodiment of the present invention will be described in detail later with reference to FIGS. 3 and 4 .

The first cover member 110 is positioned on the first encapsulant 131 to configure the front surface of the solar cell panel 100 , and the second cover member 120 is positioned on the second encapsulant 132 to form the solar cell. constituting the rear surface of the panel 100 . Each of the first cover member 110 and the second cover member 120 may be made of an insulating material capable of protecting the solar cell 10 from external impact, moisture, ultraviolet rays, and the like.

For example, the first cover member 110 may be a glass substrate having excellent durability, insulating properties, moisture resistance, light transmittance, and the like. The second cover member 120 may have a form such as a film or a sheet. For example, the second cover member 120 may include a plurality of layers including a resin to improve various properties. For example, the second cover member 120 may include a base member and a resin layer formed on at least one surface of the base member. The resin layer may include a first resin layer adjacent to the sealing material 130 , and may further include a second resin layer positioned on an opposite surface of the first resin layer. For example, the base member may include a polyamide-based material or a polyester-based material as the base material. In the present specification, the term "base material" refers to a material included in the largest percentage by weight in each layer. In this case, the polyester-based material may include polyethylene terephthalate (PET). The first resin layer may include a fluoropolymer or a polyolefin-based material as a base material. The second resin layer may include a fluorine-based polymer, a polyolefin-based material, or a polyamide-based material as a base material. The fluorine-based polymer may include polyvinyl fluoride (PVF), polyvinylidene fluoride (PVDF), ethylene tetrafluoroethylene (ETFE), and the like. Since the fluorine-based polymer does not have a bond with a risk of hydrolysis, it has excellent weather resistance and chemical resistance. Examples of the polyolefin-based material include ethylene vinyl acetate (EVA), polyethylene (PE), and polypropylene (PP). For example, the first resin layer may include a relatively inexpensive polyolefin-based material, and the second resin layer may include a fluorine-based polymer having excellent environmental resistance.

However, the present invention is not limited thereto. Accordingly, the first cover member 110 or the second cover member 120 may include various materials other than those described above and may have various shapes. For example, the first cover member 110 or the second cover member 120 may have various shapes (eg, a substrate, a film, a sheet, etc.) or materials, or the second cover member 120 may be non-transmissive. It may be composed of a material or a reflective material or the like.

In this embodiment, a plurality of solar cells 10 may be electrically connected in series, parallel, or series-parallel by the interconnector 142 and/or the bus ribbon 145 . As the in-connector 142 and/or the bus ribbon 145 , various structures and shapes capable of connecting the solar cell 10 such as a ribbon and a wire may be applied. In this case, the interconnector 142 may include a core layer (reference numeral 142a of FIG. 7 , the same hereinafter) made of a metal or the like and a solder layer (reference numeral 142b of FIG. 7 , the same hereinafter) made of a solder material. In this case, the core layer 142a and the solder layer 142b may be manufactured in an integrated state, or the solder layer 142b may be formed on the core layer 142a during the manufacturing process.

For example, the interconnector 142 includes a first electrode (reference numeral 42 in FIG. 3 ) located on the front surface of one solar cell 10 and a second electrode ( 42 ) located on the rear surface of the adjacent solar cell 10 . It may be formed to connect the reference numeral 44 of FIG. 3 . However, the present invention is not limited thereto, and adjacent solar cells 10 may be connected in other forms.

In this case, the interconnector 142 and/or the bus ribbon 145 may be electrically and physically connected to the solar cell 10 or the interconnector 142 using a tabbing process using a solder material. At this time, a flux layer including flux is formed on the interconnector 142 and/or the bus ribbon 145 to form the interconnector 142 and the solar cell 10 and/or the bus ribbon 145 and the interconnector 142 . adhesion properties can be further improved.

The encapsulant 130 may include a first encapsulant 131 positioned at the front of the solar cell 10 electrically connected to each other, and a second encapsulant 132 electrically positioned at the rear face of the solar cell 10 . can

The sealing material 130 prevents moisture and oxygen from entering the solar cell 150 and chemically bonds each element of the solar cell module 100 . The sealing material 130 includes an insulating material having light-transmitting properties and adhesive properties as a base material. For example, the sealing material 130 may include ethylene vinyl acetate resin (EVA), polyvinyl butyral, silicon resin, ester-based resin, olefin-based resin, polyethylene-based resin, ionomer, etc. as a base material. have. In particular, since the first sealing material 131 and the second sealing material 132 are made of ethylene vinyl acetate, it is possible to have excellent properties even at a low material cost. In addition, in the present embodiment, the sealing material 130 may further include an additional acid inhibiting material 134 , which will be described in more detail later with reference to FIG. 3 .

In addition, the sealing material 130 further includes a peroxide-based initiator and a crosslinking agent having a functional group that increases the crosslinking reaction, and if necessary, a sunscreen agent (for example, a benzophenone-based sunscreen agent), a UV stabilizer (for example, It may further include amine-based ultraviolet rays, antioxidants (eg, hydroxyphenyl-based antioxidants), coupling agents (eg, silane coupling agents), and the like.

However, the present invention is not limited thereto. Accordingly, the sealing material 130 may include various materials other than those described above and may have various shapes.

The second cover member 120 , the second sealing material 132 , the plurality of solar cells 10 and the interconnector 142 , the first sealing material 131 , the sealing member 150 and the second cover member 131 by the lamination process and the lamination process 1 The cover member 110 may be integrated to constitute the solar cell panel 100 . At this time, in this embodiment, the acid inhibiting material 152 is positioned at least on the surface portion of the interconnector 142 adjacent to the sealing material 130 . This will be described in more detail with reference to FIGS. 3 and 4 .

FIG. 3 is an enlarged and schematic partial cross-sectional view of a part of the solar cell panel 10 taken along line III-III of FIG. 1 , and FIG. 4 is a solar cell included in the solar cell panel 100 shown in FIG. 1 . (10) is a front plan view.

3 and 4 , the solar cell 10 includes a semiconductor substrate 12 including a base region 14 , and a conductive region ( ) formed in or on the semiconductor substrate 12 . 20 and 30 , and electrodes 42 and 44 connected to the conductive regions 20 and 30 . The semiconductor substrate 10 , the conductive regions 20 and 30 , etc. may constitute a photoelectric conversion unit involved in photoelectric conversion. Here, the conductivity-type regions 20 and 30 may include a first conductivity-type region 20 and a second conductivity-type region 30 having different conductivity types, and the electrodes 42 and 44 have a first conductivity type. It may include a first electrode 42 connected to the mold region 20 and a second electrode 44 connected to the second conductivity-type region 30 . This will be described in more detail.

The semiconductor substrate 12 may include the base region 14 having the first or second conductivity type by including the dopant of the first or second conductivity type at a relatively low doping concentration. In addition, a first conductivity type region 20 having a first conductivity type may be formed on one surface (eg, a front surface) of the semiconductor substrate 12 . In addition, a second conductivity type region 30 having a second conductivity type may be formed on the rear side of the semiconductor substrate 12 . In this case, the first and second conductivity-type regions 20 and 30 have a different conductivity type from that of the base region 14 , or have the same conductivity type as the base region 14 and have a higher doping concentration than the base region 14 . have

In this embodiment, various materials capable of representing n-type or p-type may be used as the first or second conductivity-type dopant. As the p-type dopant, boron (B), aluminum (Al), gallium (Ga), indium (In), etc. may be used, and in the case of the n-type dopant, phosphorus (P), arsenic (As), bismuth (Bi), antimony Group 5 elements, such as (Sb), can be used. For example, the p-type dopant may be boron (B) and the n-type dopant may be phosphorus (P).

One of the first and second conductivity type regions 20 and 30 having a conductivity type different from that of the base region 14 constitutes at least a part of the emitter region. The emitter region forms a pn junction with the base region 14 to generate carriers by photoelectric conversion. Another one of the first and second conductivity type regions 20 and 30 having the same conductivity type as the base region 14 constitutes at least a part of a surface field region. The electric field region forms an electric field that prevents loss of carriers by recombination at the surface of the semiconductor substrate 12 . For example, in this embodiment, the base region 14 has a second conductivity type, the first conductivity type region 20 constitutes an emitter region, and the second conductivity type region 30 constitutes a rear electric field region. can do. However, the present invention is not limited thereto.

The semiconductor substrate 12, or the base region 14 formed thereon, and the first and second conductivity-type regions 20 and 30, is a single crystalline semiconductor containing a dopant (e.g., a single monocrystalline or polycrystalline semiconductor, for example, monocrystalline or polycrystalline silicon, in particular monocrystalline silicon). As described above, the solar cell 10 based on the base region 14 or the semiconductor substrate 12 having few defects due to its high crystallinity has excellent electrical characteristics. In addition, an anti-reflection structure (eg, a texturing structure having a pyramid shape) capable of minimizing reflection may be formed on the front surface and/or the rear surface of the semiconductor substrate 12 .

In the present embodiment, the first and second conductivity-type regions 20 and 30 may be formed as doped regions constituting a part of the semiconductor substrate 12 . As another example, at least one of the first and second conductivity-type regions 20 and 30 may be formed on the semiconductor substrate 12 separately from the semiconductor substrate 12 . In this case, the first or second conductivity type regions 20 and 30 may be composed of an amorphous semiconductor layer, a microcrystalline semiconductor layer, or a polycrystalline semiconductor layer (for example, an amorphous silicon layer, a microcrystalline silicon layer, or a polycrystalline silicon layer). can In this case, a separate layer (a tunneling layer, a passivation layer, etc.) may be formed between the first or second conductivity-type regions 20 and 30 and the semiconductor substrate 12 .

and a first passivation film 22 and/or reflection as a first insulating film on at least the front surface of the semiconductor substrate 12 (more precisely, on the first conductivity type region 20 formed on the front surface of the semiconductor substrate 12 ) A barrier layer 24 may be positioned. In addition, the second passivation film 32, which is a second insulating film, may be positioned at least on the rear surface of the semiconductor substrate 12 (more precisely, on the second conductivity-type region 30 formed on the rear surface of the semiconductor substrate 12). have.

The first passivation layer 22 , the antireflection layer 24 , and the second passivation layer 32 may be formed substantially entirely on the semiconductor substrate 12 , except for the openings 102 and 104 . For example, the first passivation film 22 , the antireflection film 24 or the second passivation film 32 may be a silicon nitride film, a silicon nitride film containing hydrogen, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, a silicon carbide film, MgF ₂ , ZnS, TiO ₂ and CeO ₂ Any single layer selected from the group consisting of or a combination of two or more layers may have a multilayer structure. For example, the first passivation layer 22 and/or the antireflection layer 24 , and the second passivation layer 32 may not include a dopant or the like to have excellent insulating properties and passivation properties. However, the present invention is not limited thereto.

The first electrode 42 is formed while filling at least a portion of the first opening 102 to be electrically connected to (eg, contacted) the first conductivity-type region 20 , and the second electrode 44 is formed to 2 It is formed while filling at least a portion of the opening 104 and is electrically connected to the second conductivity-type region 30 (eg, a contact is formed). The first and second electrodes 42 and 44 are made of various conductive materials (eg, metal) and may have various shapes.

For example, at least one of silver (Ag), aluminum (Al), gold (Au), titanium (Ti), tungsten (W), and copper (Cu) using the first and second electrodes 42 and 44 as a conductive material. may contain one. In this case, the first and second electrodes 42 and 44 may be manufactured by applying and firing an electrode paste. According to this, the first and second electrodes 42 and 44 or the electrode paste improve adhesive properties. It may include a glass frit for.

The first electrode 42 may include a plurality of finger electrodes 42a spaced apart from each other while having a constant pitch and formed in one direction. Although the figure illustrates that the finger electrodes 42a are parallel to each other and parallel to the edge of the semiconductor substrate 10, the present invention is not limited thereto. In addition, the first electrode 42 may include a bus bar electrode 42b formed in a direction crossing (eg, orthogonal) to the finger electrodes 42a and connecting the finger electrodes 42a. Only one bus bar electrode 42b may be provided, or a plurality of bus bar electrodes 42b may be provided with a pitch larger than that of the finger electrodes 42a as shown in FIG. 2 . In this case, the width of the bus bar electrode 42b may be greater than the width of the finger electrode 42a, but the present invention is not limited thereto. Accordingly, the width of the bus bar electrode 42b may be equal to or smaller than the width of the finger electrode 42a.

The second electrode 44 may include a finger electrode and a bus bar electrode 44b respectively corresponding to the finger electrode 42a and the bus bar electrode 42b of the first electrode 42 . As for the finger electrode and the bus bar electrode 44b of the second electrode 44 , the contents of the finger electrode 42a and the bus bar electrode 42b of the first electrode 42 may be applied as they are. The width and pitch of the finger electrodes 42a of the first electrode 42 may be the same as or different from the width and pitch of the finger electrodes of the second electrode 44 . The width of the bus bar electrode 42b of the first electrode 42 may be the same as or different from the width of the bus bar electrode 44b of the second electrode 44 . The electrode 42b and the bus bar electrode 44b of the second electrode 44 may be disposed to have the same pitch at the same position.

As described above, in the present embodiment, the first and second electrodes 42 and 44 are partially formed while having a constant pattern. Accordingly, light may be incident to a portion where the first and second electrodes 42 and 44 are not formed. The solar cell 10 has a bi-facial structure in which light can be incident to the front and rear surfaces of the semiconductor substrate 12 . An interconnector 142 may be attached to the bus bar electrodes 42b and 44b. However, the present invention is not limited to the specific shapes of the first and second electrodes 42 and 44 and may have various shapes. In addition, although the double-sided light-receiving structure is illustrated in the drawings, various modifications are possible, such as the second electrode 44 being formed entirely on the rear surface of the semiconductor substrate 12 .

In the present embodiment, an acid inhibiting material 152 may be positioned on a surface portion of the interconnector 142 . The acid inhibiting material 152 may be located on the surface of the interconnector 142 or on the surface of the interconnector 142 . For example, in this embodiment, the acid inhibiting material 152 is the interconnector 142 . It is exemplified that it is located on the surface. In this case, the acid suppressing material 152 may be formed to surround the surface of the interconnector 142 attached to the bus bar electrodes 42b and 44b, and may be formed in a portion adjacent to the bus bar electrodes 42b and 44b. In particular, an acid inhibiting material 152 may also be positioned between the interconnector 142 and the busbar electrodes 42b and 44b. On the other hand, the acid suppressing material 152 may not be located in a portion adjacent to the finger electrodes 42a and 44b to which the interconnector 142 is not attached.

In this embodiment, the acid inhibiting material 152 is positioned on the surface portion of the interconnector 142 adjacent to the sealing material 130 to prevent corrosion of the electrodes 42 and 44, thereby reducing the output degradation of the solar panel 10. can be prevented

To describe this in more detail, when the solar cell panel 10 is used in a high temperature and high humidity environment, a phenomenon in which the output is lowered may occur over time. Although a clear reason for this is not known, an acid is generated in a high-temperature and high-humidity environment to accelerate the corrosion of the electrodes 42 and 44 to elute the material contained in the electrodes 42 and 44 to the electrodes 42, 44) increased resistance and decreased fill factor. The acidic material may be formed by reacting moisture penetrating into the solar cell panel 100 from the outside with the material constituting the sealing material 130 . For example, when the sealing material 130 is made of ethylene vinyl acetate, acetic acid (CH ₃ COOH) may be formed when acetate ions (CH ₃ COO ⁻ ) contained therein receive hydrogen ions (H ₊ ) from moisture. . In particular, when the second cover member 120 is made of a film, a sheet, or the like, moisture is relatively easily penetrated through the second cover member 120 , and this problem may appear more serious. In addition, when the electrodes 42 and 44 include silver (Ag) and boron (B) (eg, boron oxide (B ₂ O ₃ )) as a glass frit, this problem occurs more significantly.

In the solar cell 100 having the above-described double-sided light-receiving structure (in particular, when the base region 14 has an n-type), the first electrode 42 and the second electrode 44 are each made of silver ( Ag) is often included, so this problem can occur seriously. In particular, since the bus bar electrodes 42b and 44b to which the interconnector 142 is attached include a portion having a relatively large area, a problem due to corrosion may occur significantly.

In consideration of this, in this embodiment, at least the electrodes 42 and 44 (especially, the bus bar electrodes 42b and 44b) or the periphery of the electrode ( By preventing the corrosion of 42 and 44, it is possible to prevent the reduction in the output of the solar cell panel 100 by maintaining the high density and efficiency of the solar cell 100. In this way, the acid on the surface of the interconnector 142 is By locating the inhibiting material 152, it is possible to more effectively respond to corrosion of the electrodes 42 and 44. On the other hand, when the acid inhibiting material is placed only inside the sealing material 130 (eg, the sealing material 130 is formed) In the case of forming the sealing material 130 by mixing an acid-suppressing material with one of the materials to be used), the acid-suppressing material 152 may not be stably positioned in the periphery of the electrodes 42 and 44, so that the electrodes 42 and 44 may be corroded. may not be sufficient to prevent

Here, the acid suppressing material 152 may be formed of a resin, an organic material, or a compound of a metal and a non-metal. This is because, in the present embodiment, since the acid suppressing material 152 is positioned between the electrodes 42 and 44 and the solar cell 10, the shape and material thereof are not limited. For example, the acid inhibitor 152 is carbodiimide, aziridin, zinc stearate, calcium stearate, magnesium stearate, hydrotalcite. ), magnesium hydroxide (Mg(OH) ₂ ), sodium zeolite, potassium zeolite, phosphate, zinc oxide (eg, ZnO), alkali metal oxide or alkaline earth metal oxide. can do. These substances can receive hydrogen ions (H ⁺ ) generated from moisture and prevent the formation of acidic substances.

For example, alkali metal oxides or alkaline earth metal oxides react with hydrogen ions (H ⁺ ) and hydroxide ions (OH-) generated from moisture (i.e., hydrogen ions (H ⁺ ) and hydroxide ions (OH ^- )) It can be easily converted to alkali metal hydroxides or alkaline earth metal hydroxides. Thereby, acet ions (CH ₃ COO ⁻ ) and hydrogen ions (H ⁺ ) to be reacted with in the sealing material 130 are removed to prevent generation of an acidic material (eg, acetic acid).

For example, the acid inhibiting material 152 is composed of an alkali metal oxide or alkaline earth metal oxide, lithium oxide (eg, Li ₂ O), sodium oxide (eg, Na ₂ O), potassium oxide (eg, K ₂ O), beryllium oxide (eg, BeO), magnesium oxide (eg, MgO), calcium oxide (eg, CaO), strontium oxide (eg, SrO), barium oxide (eg, BaO), It may be a metal oxide particle composed of radium oxide (eg, RaO) or the like. This is because these materials are suitable for inhibiting acid without changing the properties of the electrodes 42 and 44 and the sealing material 130 . For example, when lithium oxide, sodium oxide, potassium oxide, or magnesium oxide is used as the acid-suppressing material 152 , generation of the acidic material may be effectively prevented. In particular, when an alkali metal oxide such as lithium oxide, sodium oxide, or potassium oxide is used as the acid suppressing material 152 , generation of the acidic material can be more effectively prevented.

As described above, when the acid suppressing material 152 is magnesium oxide, the principle of preventing the formation of the acidic material will be described using Formulas 1 to 3 below.

[Formula 1]

H ₂ O -> (H ⁺ ) + (OH ^- )

[Formula 2]

(H ⁺ ) + (CH ₃ COO ^- ) -> CH ₃ COOH

[Formula 3]

MgO + (H ⁺ ) + (OH ^- ) -> Mg(OH) ₂

When moisture (H ₂ O) penetrates into the solar cell panel 100 , it may be decomposed into hydrogen ions (H ⁺ ) and hydroxide ions (OH−) as shown in Chemical Formula 1 . When the generated hydrogen ions (H ⁺ ) react with acet ions (CH ₃ COO ⁻ ), acetic acid (CH ₃ COOH), which is an acidic substance, is generated as shown in Chemical Formula 2. However, in the presence of magnesium oxide (MgO), water decomposes and reacts with generated hydrogen ions (H ⁺ ) and hydroxide ions (OH-) to form magnesium hydroxide (Mg(OH) ₂ ) as shown in Chemical Formula 3, By removing the hydrogen ion (H ⁺ ) that will react with the ion (CH ₃ COO ^- ), it can serve to prevent the formation of acidic substances.

Accordingly, in the interior of the solar cell panel 100, that is, near the surface of the solar cell 10, the acid suppressing material 152, hydrogen ions (H ⁺ ) and/or hydroxide ions (OH-) (particularly, hydrogen ions) and It may further include an acid inhibition by-product 152a formed by the reaction. For example, when the acid inhibiting material 152 is an alkali metal oxide or alkaline earth metal oxide, an acid inhibiting byproduct consisting of an alkali metal hydroxide or alkaline earth metal hydroxide formed by reacting with hydrogen ions (H ⁺ ) and hydroxide ions (OH−) (152a) may be further included. That is, some of the acid suppression material 152 does not react and remains as it is, and the other portion reacts with hydrogen ions (H ⁺ ) and/or hydroxide ions (OH-) to change into acid suppression by-products 152a and remain. can Acid suppression by-product 152a may or may not be present.

The acid-suppressing material 152 or the acid-suppressing by-product 152a may be composed of particles having a size (or diameter) (eg, a size of 1 nm to 1 mm) of a micro-level or a nano-particle level. For example, the particle size of the acid suppression material 152 or the acid suppression by-product 152a may be 0.01 μm to 10 μm (eg, 0.01 μm to 3 μm). When the above-mentioned particle size exceeds a certain size (ie, 1 mm, for example, 10 μm), the degree of dispersion in the vicinity of the surface of the solar cell 10 is reduced when the same amount of the acid suppressing material 152 is included. The effect of the acid suppressing material 152 may not be effectively implemented. If the above-described particle size is less than a certain size (ie, 1 nm, for example, 0.01 μm), the effect of the acid suppressing material 152 may not be effectively implemented due to the small particle size. Although the figure illustrates that the acid suppressing material 152 has a spherical particle shape, the present invention is not limited thereto. In addition, the acid suppressing material 152 may be used by mixing particles having different shapes or different particle sizes. Various other modifications are possible.

The acid inhibiting material 152 or the acid inhibiting layer 150 may be formed by various methods, for example, by spray coating, dipping, spin coating, or the like. This will be described in detail later with reference to FIGS. 10A to 10D . The above-described acid inhibiting material 152 may be easily applied on the solar cell 10 by spray coating, dipping, spin coating, or the like.

In this embodiment, an acid inhibiting material on the surface of the interconnector 142 (more precisely, between the interconnector 142 and the sealant 130 and/or between the interconnector 142 and the busbar electrodes 42b, 44b). (152) is located. 3 illustrates that a plurality of particles constituting the acid suppression material 152 are densely located on the surface portion of the solar cell 10 to form one acid suppression layer 150 continuously connected to each other without breaking. . This acid suppression layer 150 is partially positioned on the solar cell 10 to correspond to the interconnector 142 , but surround the entire surface (particularly, the entire side surface) of the interconnector 142 and the interconnector 142 and It may be positioned between the sealant 130 to contact the interconnector 142 and the sealant 130 . In addition, it may be further positioned between the interconnector 142 and the busbar electrodes 42b and 44b to contact the interconnector 142 and the busbar electrodes 42b and 44b. Then, the effect of the acid-suppressing material 152 can be effectively realized, and the acid-suppressing material by a simple process of forming a material layer (eg, a flux layer) including the acid-suppressing material 152 on the interconnector 142 . (152) can be positioned at a desired position. In addition, even if the acid suppression material 152 or the acid suppression layer 150 is positioned between the interconnector 142 and the bus bar electrodes 42b and 44b, since the thickness is very thin, there may be no problem in electrical connection characteristics.

However, the present invention is not limited thereto, and the acid suppression material 152 or the acid suppression layer 150 may have various shapes and may be formed at various locations. Various modifications will be described in detail with reference to FIGS. 5 to 7 .

5 is a partial cross-sectional view of a solar cell panel according to a modification of the present invention. For reference, FIG. 5 illustrates a portion corresponding to FIG. 3 .

Referring to FIG. 5 , in this modified example, at least some of the acid suppressing material 152 having a particle shape are adjacent to each other and the rest are spaced apart from each other, or the acid suppressing material 152 having a particle shape is spaced apart from each other. In addition, in the lamination process, etc., the acid suppressing material 152 is partially pushed into the sealing material 130 and is surrounded by the sealing material 130 at the boundary between the solar cell 10 and the sealing material 130 and may be located inside the sealing material 130 . have. Then, the acid suppression material 152 does not have a continuous layer shape, and forms the acid suppression layer 150 in the form of particles constituting the acid suppression material 152 or in the form of an agglomeration of these particles while forming the solar cell ( 10) and the sealing material 130 may be located in a scattered form at the boundary portion.

6 is a partial cross-sectional view of a solar cell panel according to another modified example of the present invention. For reference, FIG. 6 illustrates a portion corresponding to FIG. 3 .

Referring to FIG. 6 , in this modified example, the acid suppression layer 150 does not continuously break the acid suppression material 152 on the surface that is not adjacent to the bus bar electrodes 42b and 44b in the interconnector 142 . However, it may not be formed on the surface adjacent to the bus bar electrodes 42b and 44b (ie, between the interconnector 142 and the bus bar electrodes 42b and 44b) or may be partially formed only in part. During the process of attaching the interconnector 142 to the busbar electrodes 42b and 44b, the acid inhibiting material 152 or the acid inhibiting layer ( 150) may be removed to have this shape. According to this configuration, since there is a portion where the interconnector 142 and the bus bar electrodes 42b and 44b contact each other, the electrical connection can be made more stably.

7 is a partial cross-sectional view of a solar cell panel according to another modified example of the present invention. For reference, FIG. 7 shows a portion corresponding to FIG. 3 .

Referring to FIG. 7 , in this modified example, an acid inhibiting material 152 is formed on the outer surface of the core layer (or body) 142a in the interconnector 142 to form a solder layer ( 142b). Then, the acid inhibiting material 152 may be positioned on the surface of the interconnector 142 adjacent to the sealing material 130 . Since the electrodes 42 and 44 are corroded by the acidic material, a problem may occur. The interconnector 142 attached to the electrodes 42 and 44 includes the acid suppressing material 152, material cost, process time, etc. can be reduced. A method of manufacturing such an interconnector 142 will be described in detail later with reference to FIG. 11 .

5 to 7 , the acid suppression byproduct 152a is not separately illustrated, but the acid suppression byproduct 152a may be provided on the surface of the interconnector 142 together.

Referring back to FIG. 2 , in this embodiment, the acid suppression material 152 or the acid suppression layer 150 is formed on the surface of the interconnector 142 to be included in the solar cell panel 100 . Accordingly, the acid suppression material 152 or the acid suppression layer 150 may be positioned on the periphery of the bus bar electrodes 42b and 44b, but not on the periphery of the finger electrodes 42a and 44a. However, the present invention is not limited thereto, and the acid suppression material 152 or the acid suppression layer 150 may be additionally formed on the finger electrodes 42a and 44a or on the surface of the solar cell 10 . Various other modifications are possible.

Meanwhile, in the present embodiment, an additional acid suppressing material 134 may be further included in the sealing material 130 . Accordingly, corrosion of the electrodes 42 and 44 can be further prevented by the additional acid suppressing material 134 located inside the sealing material 130 .

Such additional acid inhibiting substances 134 include carbodiimide, aziridine, zinc stearate, calcium stearate, magnesium stearate, hydrotalcite, magnesium hydroxide, sodium zeolite, potassium zeolite, phosphite, zinc oxide, alkali metal oxide or alkaline earth metal. Oxides may be included. In this case, the alkali metal oxide or alkaline earth metal oxide may include at least one of lithium oxide, sodium oxide, potassium oxide, beryllium oxide, magnesium oxide, calcium oxide, strontium oxide, barium oxide, and radium oxide, which are the acid inhibiting materials.

And, the interior of the sealing material 130 may further include an additional acid-suppressing by-product 134a formed by the reaction of the additional acid-suppressing material 134 with hydrogen ions (H ⁺ ) and/or hydroxide ions (OH-). That is, some of the additional acid-suppressing material 134 does not react and remains as it is, and the other part reacts with hydrogen ions (H ⁺ ) and/or hydroxide ions (OH-) to change into additional acid-suppressing by-products 134a. can remain Additional acid suppression by-products 134a may or may not be present.

The additional acid inhibiting material 134 may be added when the sealing material 130 is manufactured and positioned inside the sealing material 130 . Accordingly, the additional acid inhibiting material 134 may be present in a uniformly dispersed form throughout the sealing material 130 . Since the additional acid suppressing material 134 is added together when the sealing material 130 is formed, it may be included irrespective of the type, shape, or the like. Accordingly, various compounds or resins as well as oxides may be used as the additional acid inhibiting material 134 . The additional acid suppressing material 134 and the acid suppressing material 152 may be the same material or different materials.

At this time, based on the same unit area, the density of the acid suppressing material 152 located on the surface portion of the solar cell 10 is equal to or greater than the density of the additional acid suppressing material 134 included in the sealing material 130 . could be bigger In particular, the density of the acid suppressing material 152 in the portion adjacent to the solar cell 10 may be greater than the density of the additional acid suppressing material 134 inside the encapsulant 130 . Accordingly, it is possible to effectively prevent a problem that may be caused by an acidic material in a portion adjacent to the solar cell 10 . However, the present invention is not limited thereto.

As described above, according to the present embodiment, the acid inhibiting material 152 is positioned on the surface portion of the interconnector 142 adjacent to the sealing material 130 to effectively prevent corrosion of the electrodes 42 and 44 due to moisture penetration. . When the acid-suppressing material 152 is placed on the surface of the interconnector 142 in this way, the acid-suppressing material 152 is applied to the electrodes 42 and 44 (especially, the busbar electrodes) adjacent to the sealing material 130 in a simple process. 42b, 44b))). This effect may be further doubled when the electrodes 42 and 44 include silver (Ag) or boron (B) as a glass frit. As a result, it is possible to prevent or minimize a decrease in output that may occur in a high-temperature and high-humidity environment, thereby improving the long-term reliability of the solar cell panel 100 . As described above, when the long-term reliability of the solar cell panel 100 is improved, it is not necessary to precisely control the characteristics of other components in consideration of moisture penetration, thereby reducing material costs. For example, in the prior art, the second cover member 120, the electrodes 42, 44, etc. under very strict conditions were used to prevent moisture penetration, but according to the present embodiment, the second cover member 120, the electrode ( 42, 44) can be somewhat relaxed to reduce material costs.

The figure illustrates that the acid inhibiting material 152 is positioned on the surface portion of the interconnector 142 attached to the first and second electrodes 42 and 44 , respectively. This can be easily implemented by forming the acid suppression material 152 or the acid suppression layer 150 as a whole on the interconnector 142 connecting the first and second electrodes 42 and 44 . However, the present invention is not limited thereto. For example, when the base region 14 has an n-type, the first electrode 42 may include silver and the second electrode 44 may include a material other than silver (eg, aluminum). have. Alternatively, a larger amount of glass frit may be added to the second electrode 44 located at the rear side than the first electrode 42 located at the front side, regardless of the conductivity type of the base region 14 . At this time, since corrosion of the first electrode 42 containing silver or containing less glass frit may be more problematic, an acid inhibiting material is formed on the surface portion of the interconnector 142 attached to the first electrode 42 . 152 , and the acid inhibiting material 152 may not be located on a surface portion of the interconnector 144 attached to the second electrode 44 . Alternatively, the amount, density, etc. of the acid suppressing material 152 located on the periphery of the interconnect 142 attached to the first electrode 42 is located on the periphery of the interconnect 142 attached to the second electrode 44 . It may be greater than the amount, density, etc. of the acid inhibiting material 152 . However, the present invention is not limited thereto. Thus, even if the base region 14 has a p-type, and/or at least one of the first and second electrodes 42, 44 does not contain silver or contains a small amount of glass frit, the second Each of the interconnectors 142 attached to the first and second electrodes 42 and 44 may be provided with (particularly, the same amount) of the acid suppressing material 152 . Various other modifications are possible.

And, in the above-described embodiment, based on one surface of the solar cell 10, the bus bar electrodes 42b and 44b and corresponding interconnectors 142 are exemplified in 5 or less, respectively. In this case, the bus bar electrodes 42b and 44b or the interconnector 142 corresponding thereto may have a relatively wide width (a width of 1 mm to 2 mm), and the interconnector 142 is a ribbon having a rectangular cross section. can be configured. However, the present invention is not limited thereto.

Modifications thereof will be described in detail with reference to FIGS. 8 and 9 . 8 is a partial cross-sectional view of a solar cell panel according to another modified example of the present invention, and FIG. 9 is a front plan view of a solar cell included in the solar cell panel shown in FIG. 8 . For reference, FIG. 8 illustrates a part of a solar cell panel taken along a line VIII-VIII of FIG. 9 .

8 and 9 , in this modified example, six or more bus bar electrodes 42b and 44b and corresponding interconnectors 142 are provided with respect to one surface of the solar cell 10, respectively. , the interconnector 142 may have a relatively small width (for example, a width of 0.5 mm or less) and may be provided in a circular or rounded shape. The interconnector 142 may include a core layer 142a made of metal, and a solder layer 142b disposed on the outer surface of the core layer 142b and including a solder material. In this case, the bus bar electrodes 42b and 44b may include a plurality of pad parts 422b having a relatively wide width or area in order to stably attach the interconnector 142, and a plurality of pad parts 422b. ) may be provided with a line portion 421b of a small width to connect them.

An acid suppression material 152 or an acid suppression layer 150 may be positioned on the surface of the interconnector 142 . 9 illustrates that the acid suppression material 152 or the acid suppression layer 150 is located only on the surface not adjacent to the bus bar electrodes 42b and 44b and is located only between the interconnector 142 and the sealing material 130 . However, the present invention is not limited thereto, and the acid-suppressing material 152 or the acid-suppressing layer 150 is also located on the surface adjacent to the busbar electrodes 42b and 44b so that the busbar electrodes 42b and 44b and the interconnector are formed. It can also be located between (142). Alternatively, as shown in FIG. 7 , the acid suppressing material 152 may be included in the solder layer 142b. Various other modifications are possible.

A method of manufacturing the above-described solar cell panel 100 will be described in detail with reference to FIGS. 10A to 10D and FIG. 11 .

10A to 10D are cross-sectional views illustrating a method of manufacturing a solar cell panel according to an embodiment of the present invention. For reference, a portion corresponding to FIG. 3 is shown in FIGS. 10A and 10C.

As shown in FIG. 10A , a solar cell 10 is manufactured. Various known methods may be used for manufacturing the solar cell 10 .

As shown in FIG. 10B , an acid inhibiting material 152 is placed over the surface of the interconnect 142 . In this case, the acid inhibiting material 152 may be applied or sprayed on the surface of the interconnector 142 .

Various methods may be applied as a method of locating the acid inhibiting material 152 . For example, the acid suppressing material 152 in the form of particles may be applied to a desired location by spray coating, spin coating, dipping, or the like, and then dried or heat treated.

As an example, in FIG. 10B , it is illustrated that the acid suppression material 152 or the acid suppression layer 150 is disposed on the surface of the interconnector 142 by a spray process. That is, the acid suppression material 152 or the acid suppression layer 150 may be formed by spraying and applying the acid suppression material 152 at a high pressure using the spray nozzle 154 , and then drying it. Then, the acid suppression material 152 or the acid suppression layer 150 may be evenly formed on the surface of the interconnector 142 using a small amount of the acid suppression material 152 .

In this embodiment, for example, when forming the flux layer on the interconnector 142 , the acid inhibiting material 152 may be disposed together. That is, by forming the mixed material 156 in which the flux and the acid suppressing material 152 are mixed, and spraying the mixture through a spray process, the acid suppressing material 152 is formed inside the flux layer formed on the surface of the interconnector 142 . can be placed in this position. Then, the acid inhibiting material 152 can be formed on the surface of the interconnector 142 by a simple process. In this case, the particle size of the acid suppressing material 152 in the form of particles may be 0.01 um to 10 um (eg, 0.01 um to 3 um). A variety of known fluxes may be used. However, the present invention is not limited thereto, and the acid inhibiting material 152 may be mixed in a separate solvent and sprayed thereon.

For example, 0.0001 to 5 parts by weight (eg, 0.001 to 5 parts by weight) of the acid inhibitory material 152 may be included with respect to 100 parts by weight of the total solar cell 10 included in the solar panel 100 . Within this range, while sufficiently exhibiting the effect of the acid inhibitory material 152, it is possible to prevent undesired changes due to the acid inhibitory material 152 from occurring. However, the present invention is not limited thereto, and the weight portion of the acid suppressing material 152 may have a different value. In addition, although spray coating is exemplified in the above description, the present invention is not limited thereto, and the acid inhibiting material 152 may be positioned on the surface of the solar cell 10 in various ways.

Then, as shown in FIG. 10C , the interconnect 142 on which the acid suppression material 152 is located is attached to the electrodes 42 and 44 (particularly, the busbar electrodes 42b and 44b). Various known processes may be used as a tabbing process for attaching the interconnector 142 .

Subsequently, as shown in FIG. 10D , the solar cell 10 , the sealing material 130 sealing the solar cell 10 , and the first cover member 110 positioned on one surface of the solar cell 100 on the sealing material, and , stacking and attaching the second cover member 120 positioned on the other surface of the solar cell 10 on the sealing material 130. According to this, the acid inhibiting material positioned on the surface of the interconnector 142 ( 152) is positioned as it is at the boundary between the solar cell 10 and the sealing material 130. In this case, the sealing material 130 may further include an additional acid inhibiting material 134 dispersed therein. This is not limited thereto.

10C and 10D illustrate that the acid inhibiting material 152 is entirely formed on the surface of the interconnector 142 as shown in FIG. 3 . However, the present invention is not limited thereto, and the acid suppressing material 152 may be positioned as shown in FIG. 5 or FIG. 6 . In addition, although it has been exemplified that the interconnector 142 has a shape as shown in FIG. 3 in FIGS. 10B to 10D , it may have a shape as shown in FIG. 9 .

As described above, according to the present embodiment, the process can be simplified by including the acid suppressing material 152 in the process of forming the flux layer. Accordingly, the solar cell panel 100 capable of reducing or preventing output degradation by preventing corrosion of the electrodes 42 and 44 caused by acidic substances can be manufactured through a simple process.

In the above-described embodiment, it is exemplified that the acid inhibiting material 152 is placed on the flux layer using a spray process. However, the present invention is not limited thereto. Therefore, as shown in FIG. 7, when the solder layer 142b is formed using a spray process, the solder material constituting the solder layer 142b and the acid suppression material 152 are mixed and sprayed. An acid inhibiting material 152 may be positioned inside the solder layer 142b. In addition, the acid inhibiting material 152 may be positioned on the surface portion of the interconnector 142 by using the immersion process shown in FIG. 11 instead of the spray process shown in FIG. 10B .

11 is a cross-sectional view illustrating a process of placing an acid inhibiting material on an interconnector in a method of manufacturing a solar cell panel according to another embodiment of the present invention.

Referring to FIG. 11 , an acid inhibiting material 152 may be positioned on a surface portion of the interconnector 142 using an immersion process. In particular, when the interconnector 142 is formed of a ribbon as shown in FIG. 3 , the acid inhibiting material 152 is included when forming the solder layer 142b located on the surface portion of the interconnector 142 . can make it happen

More specifically, the core layer (or body) 142a of the interconnector 142 is immersed in the mixture 1420a of the solder material and the acid suppression material 152 for the formation of the solder layer 142b while advancing in one direction. do. Since the mixture 1420a of the solder material and the acid suppressing material 152 is heated to a temperature higher than room temperature, it has a state of constant fluidity and is naturally applied on the core layer 142a. For example, the mixture 1420a of the solder material and the acid inhibiting material 152 may be heated to a temperature of 200°C to 300°C. This is because the solder material has sufficient fluidity at such a temperature so that it can be uniformly applied. However, the present invention is not limited to the above temperature. Since wettability of the solder material with respect to the core layer 142a is high, the solder layer 142b may be stably and evenly formed on the surface portion of the interconnector 142 . Next, the interconnector 142 may be manufactured by cutting the core layer 142a on which the solder layer 142b is formed to a predetermined length. In this case, the core layer 142a may have a rectangular cross-sectional shape as shown in FIG. 3 , or may have a circular or rounded cross-sectional shape as shown in FIG. 7 .

In this modified example, an example in which the acid suppressing material 152 is located inside the solder layer 142b using an immersion process has been exemplified, but the present invention is not limited thereto. Even if the immersion process is used, various modifications are possible, such as locating the acid suppressing material 152 in the flux layer positioned on the solder layer 142b rather than including it in the solder layer 142b.

Hereinafter, the present invention will be described in more detail by way of examples of the present invention. The following experimental examples are merely presented to illustrate the present invention, and the present invention is not limited thereto.

Example One

A plurality of solar cells are manufactured. A flux layer was formed on the surface of the interconnector by spraying a mixture of magnesium particles and flux by a spray process. An interconnector with a flux layer was attached to the solar cell. In this case, the average size of the magnesium oxide particles was 0.2 μm, and the weight part of the magnesium oxide was 0.5 parts by weight based on 100 parts by weight of the total solar cell. Thereafter, the solar cell panel was manufactured by lamination together with the sealing material and the first and second cover members.

comparative example One

A solar cell panel was manufactured in the same manner as in Example 1, except that a flux containing no magnesium oxide particles was used to form the flux layer.

The solar cells according to Example 1 and Comparative Example 1 were subjected to a high accelerated temperature and humidity stress test (HAST). Hyperaccelerated temperature and humidity stress tests were performed for 192 hours. In the solar panel according to Example 1 and Comparative Example 1, the relative output reduction value compared to the initial output is shown in FIG. 12 .

12 , it can be seen that the output reduction value of the solar cell module according to Example 1 is only 63% of the output reduction value of the solar cell panel according to Comparative Example 1, which is very low.

The features, structures, effects, etc. as described above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by those of ordinary skill in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

100: solar panel
110: first cover member
120: second cover member
130: sealing material
134: additional acid inhibitory substances
134a: Additional Acid Suppression Byproduct
152: acid inhibitor
152a: acid inhibition byproduct
150: acid suppression layer
10: solar cell
42: first electrode
44: second electrode

Claims (20)

a plurality of solar cells;
an interconnector electrically connecting the plurality of solar cells and coated with an acid inhibiting material;
a sealing material sealing the plurality of solar cells and the interconnector;
a first cover member positioned on one surface of the solar cell on the sealing material; and
A second cover member positioned on the other surface of the solar cell on the sealing material
including,
at least a portion of the surface of the interconnect adjacent to the sealant is provided with the acid inhibiting material;
wherein the acid suppression material located between the interconnector and the sealant constitutes an acid suppression layer;
and wherein said acid suppression layer is partially positioned over said solar cell corresponding to said interconnector. The method of claim 1,
wherein the acid inhibiting material is located on or on a surface of the interconnector. The method of claim 1,
The solar cell includes a photoelectric conversion unit and an electrode,
the interconnector is attached to the electrode;
wherein the acid inhibiting material is located in a portion adjacent to the electrode to which the interconnector is attached. 4. The method of claim 3,
The electrode includes a plurality of finger electrodes and a bus bar electrode extending in a direction crossing the plurality of finger electrodes and connected to the plurality of finger electrodes,
the interconnector is attached to the bus bar electrode;
A solar cell panel in which the acid suppressing material is located in a portion adjacent to the bus bar electrode. 5. The method of claim 4,
wherein the acid inhibiting material is further positioned between the busbar electrode and the interconnector. According to claim 1,
A solar cell panel in which the acid-suppressing material is composed of an organic material or a compound of a metal and a non-metal. 7. The method of claim 6,
The acid inhibitory substance is carbodiimide, aziridin, zinc stearate, calcium stearate, magnesium stearate, hydrotalcite, magnesium hydroxide (Mg). A solar cell panel comprising (OH) ₂ ), at least one of sodium zeolite, potassium zeolite, phosphate, zinc oxide, alkali metal oxide and alkaline earth metal oxide. 8. The method of claim 7,
A solar cell panel comprising at least one of lithium oxide, sodium oxide, potassium oxide, beryllium oxide, magnesium oxide, calcium oxide, strontium oxide, barium oxide and radium oxide, which are the acid inhibiting materials. The method of claim 1,
A solar cell panel wherein the acid inhibiting material includes a plurality of particles. 10. The method of claim 9
A solar cell panel having a particle diameter of 0.01 um to 10 um of the acid-suppressing material. The method of claim 1,
A solar cell panel in which at least some of the plurality of particles are in contact with each other and others are spaced apart from each other, or the plurality of particles are positioned to be spaced apart from each other. delete The method of claim 1,
The solar cell panel further comprising an acid-suppressing by-product formed by the reaction of the acid-suppressing material and hydrogen ions on a surface portion of the interconnector. According to claim 1,
A solar cell panel further comprising an additional acid inhibiting material inside the encapsulant. 15. The method of claim 14,
A solar cell panel wherein the density of the acid suppressing material located on the surface portion of the interconnector is equal to or greater than the density of the additional acid suppressing material contained within the sealant. 4. The method of claim 3,
A solar cell panel in which the electrode includes boron (B).

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