KR102429987B1 - Micro lens array and Image sensor module including the same and Manufacturing method thereof - Google Patents

Abstract

The present invention relates to a micro lens array, an image sensor module including the same, and a manufacturing method thereof, and more particularly, to a micro lens array capable of imaging in a dark environment and downsizing, an image sensor module including the same, and a manufacturing method thereof. it's about
On the other hand, an image sensor module according to an embodiment of the present invention includes a transparent substrate; a first absorption layer having patterned holes formed on the surface of the substrate and formed of a metal; a first transmission layer formed on the surface of the first absorption layer while filling the holes formed in the first absorption layer and formed of a transparent polymer; a second absorption layer formed of an opaque polymer on the surface of the first transmission layer while forming holes patterned in a pattern corresponding to the pattern of holes formed in the first absorption layer; a second transmission layer formed on the surface of the second absorption layer while filling the holes formed in the second absorption layer and formed of a transparent polymer; a micro lens array including micro lenses formed on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer; and an image sensor disposed to be spaced apart from the micro lens by a predetermined distance.

Description

Micro lens array and image sensor module including same and manufacturing method thereof

The present invention relates to a micro lens array, an image sensor module including the same, and a manufacturing method thereof, and more particularly, to a micro lens array capable of imaging in a dark environment and downsizing, an image sensor module including the same, and a manufacturing method thereof. it's about

An image sensor is a device that converts an optical image into an electrical signal. Recently, with the development of the computer industry and the communication industry, the demand for an image sensor with improved performance is increasing in various fields such as digital cameras, camcorders, personal communication systems (PCS), game devices, security cameras, and medical micro cameras.

A typical image sensor includes a pixel array, and each pixel includes a photodiode having a photoelectric conversion function. In addition, each pixel is provided with a color filter to filter light having a wavelength of a specific region, thereby being photoelectrically converted by a photodiode.

In such an image sensor, optical crosstalk may occur due to a difference in the spectrum of light between adjacent pixels. Therefore, there is a need for a countermeasure for preventing the crosstalk phenomenon between pixels.

Meanwhile, in recent years, the number of pixels of an image sensor is increasing in order to realize a high resolution of a device using the image sensor, but the area of a region receiving light from the image sensor is gradually decreasing accordingly. This means that the amount of light incident on each pixel also decreases.

And, since the photoactive portion of the pixel receiving light is 50% or less of the total pixel area, it is preferable to increase the amount of light incident to the photoactive area of the pixel by forming a micro lens array on the pixel array.

Due to the recognition of the above problems, there have been various proposals for solving the problems.

(Patent Document 1) proposes a method of stacking several glass substrates by patterning a black polymer as an absorption layer on the upper and lower surfaces of the glass substrate. However, this proposal has a problem in that the thickness of the lens is increased by laminating a glass substrate.

In (Patent Document 2), a configuration in which an arrangement of lenses having different shapes is included in order to observe different segments of an image has been proposed. However, this proposal has a problem in that it is impossible to adjust the viewing angle because it does not include an absorbing layer-transmissive layer multi-layer structure between the lens array and the image sensor.

The content described as the above background art is only for understanding the background of the present invention, and should not be taken as an acknowledgment that it corresponds to the prior art already known to those of ordinary skill in the art.

US 7,897,903 B2 (2011.03.01) EP 0840502 A2 (1998.05.06)

The present invention provides a micro lens array capable of reducing optical cross-talk between micro lenses while reducing the overall length of the lenses, an image sensor module including the same, and a manufacturing method thereof.

In addition, the present invention provides a micro lens array in which a metal thin film layer and a black polymer layer are mixed to block visible light and infrared spectrum light entering between the micro lenses, an image sensor module including the same, and a manufacturing method thereof.

A micro lens array according to an embodiment of the present invention is a micro lens array applied to an image sensor module, comprising: a transparent substrate; a first absorption layer having patterned holes formed on the surface of the substrate and formed of a metal; a first transmission layer formed on the surface of the first absorption layer while filling the holes formed in the first absorption layer and formed of a transparent polymer; a second absorption layer formed of an opaque polymer on the surface of the first transmission layer while forming holes patterned in a pattern corresponding to the pattern of holes formed in the first absorption layer; a second transmission layer formed on the surface of the second absorption layer while filling the holes formed in the second absorption layer and formed of a transparent polymer; and a microlens formed on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer.

The second absorption layer and the second transmission layer are repeatedly formed a plurality of times.

The first absorption layer and the second absorption layer block transmission of visible light and infrared (IR) light.

On the other hand, an image sensor module according to an embodiment of the present invention includes a transparent substrate; a first absorption layer having patterned holes formed on the surface of the substrate and formed of a metal; a first transmission layer formed on the surface of the first absorption layer while filling the holes formed in the first absorption layer and formed of a transparent polymer; a second absorption layer formed of an opaque polymer on the surface of the first transmission layer while forming holes patterned in a pattern corresponding to the pattern of holes formed in the first absorption layer; a second transmission layer formed on the surface of the second absorption layer while filling the holes formed in the second absorption layer and formed of a transparent polymer; a micro lens array including micro lenses formed on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer; and an image sensor disposed to be spaced apart from the micro lens by a predetermined distance.

The space in which the micro lens and the image sensor are spaced apart is characterized in that it is formed as an empty space.

A distance between the micro lens and the image sensor may correspond to a focal length of the micro lens.

The second absorption layer and the second transmission layer of the microlens array are repeatedly formed a plurality of times.

Meanwhile, a method of manufacturing an image sensor module according to an embodiment of the present invention is a method of manufacturing an image sensor module, comprising the steps of: preparing a micro lens array on which micro lenses are formed; preparing an image sensor; and disposing the microlenses of the microlens array to face the sensing surface of the image sensor, and coupling the microlenses and the sensing surface of the image sensor by a predetermined distance apart.

The process of preparing the micro lens array includes: preparing a transparent substrate; forming a first absorption layer having holes patterned on the surface of the substrate using a metal material; forming a first transmission layer on the surface of the first absorption layer while filling the holes formed in the first absorption layer using a transparent polymer; forming a second absorption layer on the surface of the first transmission layer while forming holes patterned in a pattern corresponding to the pattern of the holes formed in the first absorption layer using an opaque polymer; forming a second transmission layer on the surface of the second absorption layer while filling the holes formed in the second absorption layer using a transparent polymer; and forming microlenses on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer.

The step of forming the second absorption layer and the step of forming the second transmission layer are repeated a plurality of times.

The forming of the first absorber layer may include coating LOR and GXR materials on the surface of the substrate and then using a photolithography process using a mask on which a hole pattern is formed. the process of forming a; depositing a metal on the entire surface of the substrate on which the first absorption layer pattern is formed; and removing the first absorption layer pattern to leave a first absorption layer having a pattern corresponding to the hole pattern on the surface of the substrate.

In the step of forming the first transmission layer, the transparent polymer is a thermosetting photoresist.

The forming of the microlens may include: forming a microlens pattern on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer; and heat-treating the micro lens pattern to form a plurality of micro lenses having a hemispherical shape.

The micro lens pattern is characterized in that it is formed using a thermoplastic photoresist.

The process of coupling the micro lens and the sensing surface of the image sensor by a predetermined distance is characterized in that the micro lens and the sensing surface of the image sensor are spaced apart by a distance corresponding to the focal length of the micro lens and coupled.

According to an embodiment of the present invention, the following effects can be expected.

First, there is an advantage in that not only a micro lens having a short focal length is used, but also the optical crosstalk reduction structure and the overall thickness of the lens can be manufactured in an ultra-thin using a semiconductor process method.

Second, even with a thin structure, the image contrast and image resolution (Modulation Transfer Function, MTF) during visible light imaging and near-infrared imaging by blocking light in the near-infrared (NIR) region as well as the light in the visible region between the micro lenses. ) can be improved.

Third, by forming a second absorption layer formed by coating a black polymer under the first absorption layer, which is a thin metal film, a ghost image in which light reflected from the image sensor is reflected back to the first absorption layer can be prevented.

Fourth, the microlens array is formed in the reverse direction during imaging, and a glass window is disposed on the top to refract light, thereby expanding the viewing angle can be expected.

Fifth, the image obtained using the present invention can be used for high-quality image synthesis and 3D depth information extraction application for a 3D camera according to the degree of overlap.

1 is a cross-sectional view showing an image sensor module according to an embodiment of the present invention;
2A and 2B are views showing a method of manufacturing an image sensor module according to an embodiment of the present invention;
3a is a graph comparing the transmittance of a micro lens array according to a comparative example and an embodiment;
Figure 3b is a graph comparing the reflectivity of the micro lens array according to the comparative example and the embodiment,
4 is a photograph showing an optical path image of a micro lens array according to a comparative example and an embodiment;
5 is a photograph showing a virtual image image of an image sensor module according to a comparative example and an embodiment;
Figure 6a is a photograph comparing the image after taking the image sensor module according to the comparative example and the embodiment,
Figure 6b is a graph comparing the image resolution (Resolution) of the image sensor module according to the comparative example and the embodiment,
6C is a graph comparing the contrast of the image sensor module according to the comparative example and the embodiment.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art completely It is provided to inform you. In the drawings, like reference numerals refer to like elements.

1 is a cross-sectional view showing an image sensor module according to an embodiment of the present invention.

As shown in the drawings, the image sensor module according to an embodiment of the present invention is largely composed of a micro lens array 100 and an image sensor 200 . At this time, the micro lens array 100 and the image sensor 200 are packaged by being spaced apart from each other by a predetermined distance and coupled thereto.

The micro lens array 100 is configured to have a short focal length while blocking not only visible light but also near-infrared (NIR) light among light incident to the image sensor 200 from the outside.

To this end, the micro lens array 100 includes a transparent substrate 110; a first absorbing layer 120 having a patterned hole 170 formed on the surface of the substrate 110 and made of a metal; a first transmission layer 130 formed on the surface of the first absorption layer 120 while filling the hole 170 formed in the first absorption layer 120 and formed of a transparent polymer; The first absorbing layer 120 is formed on the surface of the first transmission layer 130 while forming a patterned hole 170 in a pattern corresponding to the pattern of the hole 170 formed on the first absorbing layer 120 and made of an opaque polymer. 2 absorbent layer 140; a second transmission layer 150 formed on the surface of the second absorption layer 140 while filling the hole 170 formed in the second absorption layer 140 and formed of a transparent polymer; and microlenses 160 formed on the surface of the second transmission layer 150 in a pattern corresponding to the pattern of the holes 170 formed in the second absorption layer 140 .

In this case, the second absorption layer 140 and the second transmission layer 150 may be repeatedly formed a plurality of times. For example, in the present embodiment, the second absorption layer 140 and the second transmission layer 150 are repeatedly formed twice.

The substrate 110 is a substrate through which light is transmitted, and serves as a base for forming the first absorption layer 120 , the first transmission layer 130 , the second absorption layer 140 , and the second transmission layer 150 . . For example, the substrate may be formed of a glass window.

The first absorption layer 120 is a layer formed by patterning a metal material, and among the light incident to the microlens array 100 by the first absorption layer 120, infrared (IR), particularly near-infrared (NIR) light block it In this case, the first absorption layer 120 may be formed using chromium (Cr). In addition, the thickness of the first absorption layer 120 is preferably formed at a level of 100 nm.

Meanwhile, the first absorption layer 120 is formed by patterning the hole 170 . In this case, the hole 170 forms an incident path of the light so that the light incident on the micro lens array 100 is transmitted to reach the image sensor.

The first transmission layer 130 is a layer formed to transmit light incident to the microlens array 100 and to maintain a gap between the first absorption layer 120 and the second absorption layer 140, and is made of a transparent polymer. can be formed

In the second absorption layer 140 , the light incident through the hole 170 of the first transmission layer 130 is reflected from the image sensor 200 and reflected back to the first absorption layer 120 , and then back to the image sensor 200 . As a layer preventing the incident, it is formed using an opaque polymer so that light cannot be transmitted. At this time, the hole 170 corresponding to the pattern of the hole 170 formed in the first absorption layer 120 is patterned and formed in the second absorption layer 140 .

The second transmission layer 150 transmits light incident to the micro lens array 100 like the first transmission layer 130 and is formed to maintain a gap between the second absorption layer 140 and the micro lens 160 . As the layer, it can be formed using a transparent polymer.

In this case, the second absorption layer 140 and the second transmission layer 150 may be repeatedly formed a plurality of times according to the specifications of the image sensor module. In this embodiment, the second absorption layer 140 , the second transmission layer 150 , the second absorption layer 140 , and the second absorption layer 140 and the second transmission layer 150 are repeatedly formed twice. The transmission layer 150 is formed in this order.

Meanwhile, the micro lens 160 is a means for increasing the amount of light incident to the photoactive region of the pixel, and is located at a position corresponding to the pattern of the holes 170 formed in the first transmission layer 130 and the second transmission layer 150 . It is formed in the shape of a hemisphere.

In addition, the image sensor 200 is a device that converts an optical image into an electrical signal, and an image sensor applied to a typical image sensor module may be applied.

On the other hand, the micro lens array 100 and the image sensor 200 are arranged such that the micro lenses 160 of the micro lens array 100 face the sensing surface of the image sensor 200, and are coupled with a predetermined distance apart. are packaged

At this time, the space S where the micro lens 160 and the image sensor 200 are spaced apart is formed as an empty space, and the distance between the micro lens 160 and the image sensor 200 is the focal length of the micro lens 160 . It is preferable to be formed so as to correspond.

A method of manufacturing the image sensor module configured as described above will be described with reference to the drawings.

2A and 2B are diagrams illustrating a method of manufacturing an image sensor module according to an embodiment of the present invention.

As shown in FIGS. 2A and 2B , a method of manufacturing an image sensor module according to an embodiment of the present invention includes the steps of preparing a micro lens array 100 on which micro lenses 160 are formed; preparing the image sensor 200; The micro lens 160 of the micro lens array 100 is arranged to face the sensing surface of the image sensor 200, and the micro lens 160 and the sensing surface of the image sensor 200 are spaced apart from each other and coupled. includes the process.

The process of preparing the micro-lens array 100 includes the first absorption layer 120 , the first transmission layer 130 , the second absorption layer 140 , the second transmission layer 150 , and the micro lens 160 on the substrate 110 . ) is a sequential process.

In other words, first, preparing a transparent substrate 110; forming a first absorbing layer 120 in which a patterned hole 170 is formed on a surface of the substrate 110 using a metal material; forming a first transmission layer 130 on the surface of the first absorption layer 120 while filling the holes 170 formed in the first absorption layer 120 using a transparent polymer; Using an opaque polymer, a second absorption layer ( 140); forming a second transmission layer 150 on the surface of the second absorption layer 140 while filling the holes 170 formed in the second absorption layer 140 using a transparent polymer; and forming microlenses 160 on the surface of the second transmission layer 150 in a pattern corresponding to the pattern of the holes 170 formed in the second absorption layer 140 .

The step of preparing the transparent substrate 110 is a step of preparing the substrate 110 through which light is transmitted, and the substrate 110 is prepared with a glass window.

The step of forming the first absorption layer 120 is a step of patterning and forming a metal thin film capable of blocking light in the infrared region on the surface of the substrate 110, and a photolithography process and lift used in a semiconductor process. A lift-off process is used.

In other words, in the step of forming the first absorption layer 120 , the LOR 111 and the GXR material 112 are coated on the surface of the substrate 110 and then the hole pattern 114 is formed using the mask 113 . The LOR 111a and the GXR material 112a formed in an area other than the area corresponding to the hole pattern 114 are removed by a lithography process to form a pattern corresponding to the hole pattern 114 , the first dummy absorption layer pattern. (111b, 112b) are formed. (See (a) to (c) of FIG. 2A)

Then, metals 120 and 121 are deposited on the entire surface of the substrate 110 on which the first absorption layer patterns 111b and 112b are formed (see (d) of FIG. 2A).

Then, the first absorption layer patterns 111b and 112b are removed to leave the first absorption layer 120 having a pattern corresponding to the hole pattern 114 on the surface of the substrate 110 (FIG. 2A (e)). ) Reference)

When the first absorption layer 120 is formed in this way, the first transmission layer 130 covering the first absorption layer 120 is formed.

The step of forming the first transmission layer 130 is a step of forming a transparent polymer layer on the surface of the first absorption layer 120 while filling the holes 170 formed in the first absorption layer 120, and through which light is transmitted. The first transmission layer 130 is formed using a transparent polymer (see (f) of FIG. 2A).

In this case, it is preferable to use a thermosetting photoresist for the transparent polymer, and the first transmission layer 130 may be formed by coating the transparent thermosetting photoresist on the surface of the first transmission layer 130 and then curing it by exposing it to UV light.

In the step of forming the second absorption layer 140 , the light reflected from the image sensor 200 is reflected back to the first absorption layer 120 to prevent an incoming ghost image of the first transmission layer 130 . This is a step of forming an opaque polymer layer on the surface of the first transmission layer 130 using an opaque polymer on the surface.

At this time, in the second absorbing layer 140 , a hole 170 patterned in a pattern corresponding to the pattern of the hole 170 formed in the first absorbing layer 120 is formed (see (g) of FIG. 2A ).

In addition, it is preferable to use a material that can block light from being transmitted as the opaque polymer. For example, it is preferable to use a black thermosetting photoresist for the opaque polymer, and the second absorbing layer 140 is coated with a black thermosetting photoresist while patterning the surface of the first absorbing layer 120 and then cured by exposure to UV. can be formed

The step of forming the second transmission layer 150 is similar to the step of forming the first transmission layer 130 while filling the hole 170 formed in the second absorption layer 140 on the surface of the second absorption layer 140 . As a step of forming a transparent polymer layer, the second transmission layer 150 is formed using a transparent polymer through which light is transmitted (see (h) of FIG. 2A).

In particular, the steps of forming the second absorption layer 140 and forming the second transmission layer 150 may be repeated a plurality of times. In this embodiment, the step of forming the second absorption layer 140 and the step of forming the second transmission layer 150 were performed twice (see (h) of FIG. 2A).

At this time, it is preferable to use a thermosetting photoresist for the transparent polymer, and the second transmission layer 150 may be formed by coating a transparent thermosetting photoresist on the surface of the second transmission layer 150 and then curing it by exposing to UV light.

The step of forming the microlens 160 is a step of forming the microlens 160 on the surface of the second transmission layer 150 in a pattern corresponding to the pattern of the holes 170 formed in the second absorption layer 140 .

In order to form the microlens 160, the microlens pattern 161 is formed on the surface of the second transmission layer 150 in a pattern corresponding to the pattern of the hole 170 formed in the second absorption layer 140. ( 2a (i))

At this time, the micro lens pattern 161 is preferably formed using a thermoplastic photoresist, and the micro lens pattern 161 is coated with a thermoplastic photoresist while patterning on the surface of the second transmission layer 150, and then exposed to UV to harden. can be formed

If the patterned micro lens pattern 161 is formed on the surface of the second transmission layer 150 in this way, the micro lens pattern 161 is heat-treated to thermally reflow the micro lens pattern 161 to obtain a hemispherical shape. A plurality of micro lenses 160 having

If the micro lens array 100 is prepared through the above steps, an image sensor is prepared.

The process of preparing the image sensor 200 prepares the image sensor 200 applied to a typical image sensor module.

If the micro lens array 100 and the image sensor 200 are prepared in this way, the micro lens array 100 and the image sensor 200 are combined and packaged.

In the process of combining the micro lens array 100 and the image sensor 200 , the micro lenses 160 of the micro lens array 100 are disposed to face the sensing surface of the image sensor 200 , and the micro lenses 160 . and the sensing surface of the image sensor 200 are spaced apart from each other by a predetermined distance to be coupled.

At this time, the space S separated from the micro lens 160 and the image sensor 200 is formed as an empty space, and the sensing surface of the micro lens 160 and the image sensor 200 is the focal length of the micro lens 160 . are separated by a distance corresponding to , and combined.

Next, the present invention will be described through comparative examples and examples.

First, transmittance and reflectivity of the micro lens arrays according to Comparative Examples and Examples were compared.

3A is a graph comparing the transmittance of the micro lens array according to the Comparative Example and the Example, and FIG. 3B is a graph comparing the reflectivity of the micro lens array according to the Comparative Example and the Example.

In this case, in Comparative Example 1 (Cr 100nm), only the first absorption layer was formed as the absorption layer without the formation of the second absorption layer, and in Comparative Example 2 (Only Black PR), only the second absorption layer was formed as the absorption layer without the formation of the first absorption layer. In the example (Cr 100nm+Black PR), both the first absorption layer and the second absorption layer were formed as the absorption layer. In this case, the first absorption layer was formed of chromium (Cr) to a thickness of 100 nm, and the second absorption layer was formed using a black opaque polymer.

As can be seen in FIG. 3a , in Comparative Example 2, light was blocked in the visible light region (400 nm to 650 nm), but it was confirmed that the light blocking efficiency was very low in the near infrared region (650 nm to 900 nm).

On the other hand, in the case of the embodiment, it was confirmed that most of the light was blocked not only in the visible region but also in the near-infrared region.

And, as can be seen in 3b, it was confirmed that Comparative Example 1 showed a relatively high value of 60% reflectance.

On the other hand, in the case of Examples, it was confirmed that not only the reflectivity of the visible light region could be significantly reduced, but also the reflectivity of the near-infrared region could be reduced.

Next, optical paths of the micro lens arrays according to Comparative Examples and Examples were observed.

4 is a photograph showing an optical path image of a micro lens array according to a comparative example and an embodiment. In this case, FIG. 4 is an optical path image observed with a confocal laser scanning microscopy (CLSM). (Light source spectrum: 360 ~ 2600nm)

4(a) is an optical path of Comparative Example 2, and (b) is an optical path of Example.

As can be seen in FIG. 4 , in Comparative Example 2, it could be confirmed that light was transmitted between the microlenses, but in Example 2, it was confirmed that light between the microlenses was blocked.

Next, virtual images of the image sensor modules according to Comparative Examples and Examples were observed.

5 is a photograph showing a virtual image of an image sensor module according to a comparative example and an embodiment.

5 (a) is a virtual image of Comparative Example 1, (b) is a virtual image of Example.

As can be seen in FIG. 5 , in the case of Comparative Example 1, it was confirmed that the light reflected from the image sensor was re-reflected to the metal thin film as the first absorption layer, thereby generating a virtual image. On the other hand, in the case of the embodiment, it was confirmed that a virtual image was not generated as the first and second absorption layers were formed at the same time.

Next, images of the image sensor modules according to Comparative Examples and Examples were compared after photographing, and optical characteristics were compared.

Figure 6a is a photograph comparing the image sensor module according to the comparative example and the embodiment after image taking, Figure 6b is a graph comparing the image resolution (Resolution) of the image sensor module according to the comparative example and the embodiment, Figure 6c is a graph comparing the contrast of the image sensor module according to the comparative example and the embodiment.

6A (a) is a photograph after taking an image of Comparative Example 2, and (b) is a photograph after taking an image of Example.

As can be seen in FIG. 6a , as a result of comparing the pictures after taking the images of Comparative Example 2 and Example, it can be confirmed that the picture according to Example can be relatively clear and high-contrast images can be obtained than the picture according to Comparative Example 2. there was.

And, FIG. 6b is a result of comparing modulation transfer function (MTF) values for image resolution analysis. As can be seen in FIG. 6b, it can be confirmed that the embodiment has a relatively high MTF value, and the comparison As compared to Example 2, it was confirmed that the value was improved by about 2 times.

And, as can be seen in FIG. 6c , it was confirmed that the contrast value of the Example was about 4 times higher than that of Comparative Example 2.

Although the present invention has been described with reference to the accompanying drawings and the above-described preferred embodiments, the present invention is not limited thereto, and is defined by the claims described below. Accordingly, those of ordinary skill in the art can variously change and modify the present invention within the scope without departing from the spirit of the claims to be described later.

100: micro lens array 110: substrate
120: first absorption layer 130: first transmission layer
140: second absorption layer 150: second transmission layer
160: micro lens 170: hole
200: image sensor

Claims (15)

As a micro lens array which is packaged by being spaced apart from an image sensor and coupled to constitute an image sensor module,
a transparent substrate;
a first absorption layer having patterned holes formed on the surface of the substrate and formed of a metal thin film having a thickness of 100 nm using chromium (Cr) to block light in an infrared (IR) region;
a first transmission layer formed on the surface of the first absorption layer while filling the holes formed in the first absorption layer and formed of a transparent polymer;
It is formed on the surface of the first transmission layer while forming a hole patterned in a pattern corresponding to the pattern of the hole formed in the first absorption layer, the light passing through the hole formed in the first absorption layer is reflected by the image sensor and the second a second absorbing layer formed of an opaque polymer and disposed between the first absorbing layer and the image sensor to prevent re-reflection in the first absorbing layer;
a second transmission layer formed on the surface of the second absorption layer while filling the holes formed in the second absorption layer and formed of a transparent polymer;
and a micro lens formed on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer.
The method according to claim 1,
The second absorption layer and the second transmission layer are formed by repeating a plurality of times.
The method according to claim 1,
The first absorbing layer and the second absorbing layer block transmission of visible light and infrared (IR) light.
a transparent substrate; a first absorption layer having patterned holes formed on the surface of the substrate and formed of a metal thin film having a thickness of 100 nm using chromium (Cr) to block light in an infrared (IR) region; a first transmission layer formed on the surface of the first absorption layer while filling the holes formed in the first absorption layer and formed of a transparent polymer; a second absorption layer formed of an opaque polymer on the surface of the first transmission layer while forming holes patterned in a pattern corresponding to the pattern of holes formed in the first absorption layer; a second transmission layer formed on the surface of the second absorption layer while filling the holes formed in the second absorption layer and formed of a transparent polymer; a micro lens array including micro lenses formed on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer;
and an image sensor disposed to be spaced apart from the micro lens by a predetermined distance,
The second absorption layer is disposed between the first absorption layer and the image sensor in order to prevent light passing through the hole formed in the first absorption layer from being reflected by the image sensor and reflected back to the first absorption layer. image sensor module.
5. The method according to claim 4,
An image sensor module, characterized in that the space in which the micro lens and the image sensor are spaced apart is formed as an empty space.
6. The method of claim 5,
The distance between the micro lens and the image sensor is an image sensor module, characterized in that corresponding to the focal length of the micro lens.
5. The method according to claim 4,
The image sensor module, characterized in that the second absorption layer and the second transmission layer of the microlens array are repeatedly formed a plurality of times.
A method of manufacturing an image sensor module, comprising:
A process of preparing a micro lens array in which micro lenses are formed while forming a first absorption layer formed of a metal thin film having a thickness of 100 nm using chromium (Cr) to block light in the infrared (IR) region;
preparing an image sensor;
arranging the micro-lens of the micro-lens array to face the sensing surface of the image sensor, and combining the micro-lens and the sensing surface of the image sensor by a predetermined distance therebetween,
The process of preparing the micro lens array,
preparing a transparent substrate;
forming a first absorption layer in which holes patterned using chromium (Cr) are formed on the surface of the substrate;
forming a first transmission layer on the surface of the first absorption layer while filling the holes formed in the first absorption layer using a transparent polymer;
In order to prevent light passing through the holes formed in the first absorption layer from being reflected by the image sensor and reflected back to the first absorption layer, an opaque polymer is used to pattern the pattern corresponding to the pattern of the holes formed in the first absorption layer. forming a second absorption layer on the surface of the first transmission layer to be disposed between the first absorption layer and the image sensor while forming a hole;
forming a second transmission layer on the surface of the second absorption layer while filling the holes formed in the second absorption layer using a transparent polymer;
and forming microlenses on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer.
delete 9. The method of claim 8,
The method of manufacturing an image sensor module, characterized in that the step of forming the second absorption layer and the step of forming the second transmission layer are repeated a plurality of times.
9. The method of claim 8,
The step of forming the first absorption layer,
A photolithography process using a mask on which a hole pattern is formed after coating the surface of the substrate with LOR, a photosensitizer used in a lift-off process, and GXR, a photosensitizer used in a photolithography process forming a dummy first absorption layer pattern in a pattern corresponding to the hole pattern;
depositing a metal on the entire surface of the substrate on which the first absorption layer pattern is formed;
and removing the first absorption layer pattern to leave a first absorption layer having a pattern corresponding to the hole pattern on the surface of the substrate.
9. The method of claim 8,
In the step of forming the first transmission layer,
The transparent polymer is a method of manufacturing an image sensor module, characterized in that the thermosetting photoresist.
9. The method of claim 8,
The step of forming the microlens is,
forming a micro lens pattern on the surface of the second transmission layer in a pattern corresponding to the pattern of holes formed in the second absorption layer;
and forming a plurality of microlenses having a hemispherical shape by heat-treating the microlens pattern.
14. The method of claim 13,
The method of manufacturing an image sensor module, characterized in that the micro lens pattern is formed using a thermoplastic photoresist.
9. The method of claim 8,
The process of coupling the micro lens and the sensing surface of the image sensor by a predetermined distance apart from each other,
The method of manufacturing an image sensor module, characterized in that the micro lens and the sensing surface of the image sensor are coupled to each other by a distance corresponding to the focal length of the micro lens.

Images