KR102429138B1 - Circulating drive unit and substrate polishing appartus comprising the same - Google Patents

Abstract

Disclosed are a circulation driving unit and a substrate polishing apparatus including the same. A circulation driving unit according to an embodiment includes: a first driving unit for translationally moving the polishing unit including the polishing belt in a first direction; and a second driving unit for translationally moving the polishing unit in a second direction perpendicular to the first direction.

Description

Circulation drive unit and substrate polishing apparatus including the same

The following embodiments relate to a circulation driving unit and a substrate polishing apparatus including the same.

BACKGROUND ART In manufacturing a semiconductor device, a CMP (chemical mechanical polishing) operation including polishing, buffing, and cleaning is required. A semiconductor device has a multilayer structure, and a transistor device having a diffusion region is formed on a substrate layer. In the substrate layer, connecting metal lines are patterned and electrically connected to the transistor elements forming the functional elements. As is known, a patterned conductive layer is insulated from other conductive layers with an insulating material such as silicon dioxide. As more metal layers and associated insulating layers are formed, the need to flatten the insulating material increases. Without flattening, the production of additional metal layers becomes substantially more difficult because of the many variations in surface morphology. In addition, the metal line pattern is formed of an insulating material, so that the metal CMP operation removes the excess metal.

A CMP apparatus is a component for polishing, buffing, and cleaning one or both surfaces of a substrate, and includes a belt, a polishing pad, or a belt having a brush. Slurries are used to facilitate and enhance CMP operations.

Among the conventional CMP apparatuses, a belt-type CMP apparatus comprising a belt-type polishing pad mounted on two drums is known. In the belt-type CMP apparatus, the substrate is mounted on the carrier, the carrier moves horizontally in one direction, and the belt-type polishing pad is rotated clockwise or counterclockwise to closely adhere to the substrate while applying a predetermined force to perform polishing. is carried out When a substrate is polished through a belt-type polishing pad, the polishing pad is pressed toward the substrate through an air bearing, thereby enabling efficient polishing of the substrate.

When a substrate is polished through a belt-type polishing pad, since the contact of the polishing pad to the substrate is performed only in one direction, that is, in the rotational direction of the polishing pad, there is a problem in that a linear texture is generated on the surface to be polished of the substrate. . In this case, by moving the polishing pad in a direction perpendicular to the rotational direction, contact between the substrate and the polishing pad is performed in multiple directions, thereby reducing the occurrence of texture.

However, when the linear motion of the polishing pad is performed through the linear power unit composed of the ball screw of the motor, it is difficult to accelerate and decelerate according to the linear motion at a high speed due to the structural limitations of the linear power unit, and the required Since it is difficult to meet the linear movement speed, the efficiency of reducing the linear texture may be reduced.

Accordingly, there is a need for a device capable of realizing a high-speed circulating motion of the polishing pad without deceleration of the motor.

In this regard, Korean Patent Application Laid-Open No. 10-2016-0113279 discloses an invention related to a substrate transfer apparatus.

An object according to an embodiment is to provide a circular motion unit that implements a high-speed circular linear motion through a rotational motion, and a substrate polishing apparatus including the same.

An object according to an embodiment is to provide a circular motion unit that implements a trajectory motion through translational motion in two directions, and a substrate polishing apparatus including the same.

A circulation driving unit according to an embodiment includes: a first driving unit for translationally moving the polishing unit including the polishing belt in a first direction; and a second driving unit for translationally moving the polishing unit in a second direction perpendicular to the first direction.

In one side, the first driving unit and the second driving unit may orbital motion the polishing unit to form a constant orbit.

In one aspect, the orbit may be a circular orbit parallel to the ground.

In one side, the first driving unit and the second driving unit may be orbitally moved so that the polishing unit does not rotate.

In one side, the first driving unit, a first driving motor; a first bracket having a center connected to a rotation shaft of the first driving motor; and a first connecting member having one end connected to be spaced apart from the center of the first bracket and the other end connected to the polishing unit.

In one side, the first connection member is rotatably connected to the first bracket and the polishing unit, and the polishing unit may translate in a first direction according to the rotation of the first driving motor.

In one side, the second driving unit, a second driving motor; a first bracket having a center connected to the rotation shaft of the second driving motor; and a second connecting member having one end connected to be spaced apart from the center of the first bracket and the other end connected to the polishing unit.

In one side, the second connection member is rotatably connected to the second bracket and the polishing unit, and the polishing unit may translate in a second direction according to the rotation of the second driving motor.

An apparatus for polishing a substrate according to an embodiment includes: a polishing unit including a pair of driving rollers and a polishing belt wound around the driving roller and polishing the substrate while rotating; and a circulation driving unit connected to the polishing unit, wherein the circulation driving unit includes: a first driving unit for moving the polishing unit in parallel in a first direction; and a second driving unit for parallelly moving the polishing unit in a second direction.

In one side, the first direction and the second direction may be disposed on a plane perpendicular to each other and parallel to the substrate surface.

In one side, each of the first driving unit and the second driving unit may perform simple harmonic oscillation of the polishing unit in the first direction and the second direction.

In one aspect, the polishing unit may move without rotation along a circular orbit parallel to the surface of the substrate.

In one side, the substrate polishing apparatus, a first moving part movable in a first direction; and a second moving part connected to the polishing unit and connected to the support part so as to be movable in a second direction.

In one side, the first driving unit, a first driving motor; a first bracket connected to the first driving motor; and a first connecting member rotatably connected to the first bracket at one end and rotatably connected to the first moving unit at the other end so as to be eccentric to the rotation shaft of the first driving motor.

In one aspect, the first driving unit may further include a first supporting unit movable in a first direction, and the first driving motor may be disposed in the first supporting unit.

In one side, the second driving unit, a second driving motor; a second bracket connected to the second driving motor; and a first connecting member rotatably connected to the second bracket at one end and rotatably connected to the second moving unit at one end so as to be eccentric to the rotation shaft of the second driving motor.

A circular motion unit and a substrate polishing apparatus including the same according to an embodiment may implement a high-speed circular linear motion through a rotational motion.

A circular motion unit and a substrate polishing apparatus including the same according to an embodiment may implement a trajectory motion through translational motion in two directions.

Effects of the circular motion unit and the substrate polishing apparatus including the same according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical spirit of the present invention together with the detailed description of the present invention, so the present invention is limited to the matters described in those drawings It should not be construed as being limited.
1 is a perspective view of a substrate polishing apparatus according to an embodiment.
2 is a top view of a substrate polishing apparatus according to an exemplary embodiment.
3 is a front view of a substrate polishing apparatus according to an exemplary embodiment.
4 is an enlarged view of part A of FIG. 2 .
5 is an operation diagram illustrating an operation of the first driving unit.
6 and 7 are diagrams illustrating an operating state in which the circulation driving unit moves the polishing unit in a trajectory according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to exemplary drawings. In adding reference numerals to the components of each drawing, it should be noted that the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in the description of the embodiment, if it is determined that a detailed description of a related known configuration or function interferes with the understanding of the embodiment, the detailed description thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only for distinguishing the elements from other elements, and the essence, order, or order of the elements are not limited by the terms. When it is described that a component is "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to the other component, but another component is between each component. It will be understood that may also be "connected", "coupled" or "connected".

Components included in one embodiment and components having a common function will be described using the same names in other embodiments. Unless otherwise stated, descriptions described in one embodiment may be applied to other embodiments as well, and detailed descriptions within the overlapping range will be omitted.

1 is a perspective view of a substrate polishing apparatus according to an embodiment, FIG. 2 is a top view of the substrate polishing apparatus according to an embodiment, and FIG. 3 is a front view of the substrate polishing apparatus according to an embodiment.

1 to 3 , the apparatus for polishing a substrate according to an embodiment may perform a CMP process for polishing a substrate. The substrate polishing apparatus may cyclically move along a predetermined trajectory to enable multi-directional polishing of the substrate in the process of polishing the substrate.

The substrate W may include glass for a flat panel display device (FPD) such as a liquid crystal display (LCD) or a plasma display panel (PDP). However, the type of the substrate W is not limited thereto, and may be, for example, a silicon wafer for manufacturing a semiconductor device. In addition, although it is illustrated that the substrate W has a rectangular shape in the drawings, this is only an example, and the shape of the substrate W is not limited thereto.

The substrate polishing apparatus 1 according to an embodiment may include a polishing unit 100 , a first moving unit 301 , a second moving unit 302 , and a circulation driving unit 200 .

The polishing unit 100 can polish the to-be-polished surface of the board|substrate W by making contact with the board|substrate W. For example, the substrate W may be mounted on the movable substrate W stage S and disposed below the polishing unit 100 . The polishing unit 100 may polish the substrate W through friction with the substrate W while in contact with the surface to be polished of the substrate W located on the lower side. The polishing unit 100 may include a driving roller 101 , an abrasive belt 102 , and a driving motor 103 .

The driving roller 101 may rotate about a rotating shaft. In this case, the driving rollers 101 may be provided as a pair, and the pair of driving rollers 101 may be spaced apart from each other by a predetermined interval in a state in which the rotation shafts are parallel to each other. The pair of driving rollers 101 may rotate at the same angular velocity.

The abrasive belt 102 may be wound around the driving roller 101 to polish the substrate W while rotating. The abrasive belt 102 is integrally formed to form a closed loop, and may move in one direction according to the rotation of the driving roller 101 . In this case, the moving direction of the abrasive belt 102 may be perpendicular to the axis of rotation of the driving roller 101 .

The driving motor 103 may be connected to a rotation shaft of the driving roller 101 , and may provide a driving force for rotating the driving roller 101 . 1 , when the polishing unit 100 includes a pair of driving rollers 101 , the driving motor 103 may be connected to both sides of each driving roller 101 . An idler that is connected only to the rotation shaft of the driving roller 101 and freely rotates according to the rotation of the driving motor 103 may be connected to the rotation shaft of the other driving motor 103 . However, this is only an example, and the type and power transmission method of the driving motor 103 are not limited thereto.

The polishing unit may include an air bearing (not shown) for pressing the polishing belt 102 in the direction of the substrate (W). The air bearing is provided on the inside of the abrasive belt 102, and by spraying a fluid, for example, air toward the inner peripheral surface of the abrasive belt 102, the abrasive belt 102 can be pressed in the substrate (W) direction. . In addition, on the outside of the abrasive belt 102, a slurry spraying unit (not shown) for spraying the slurry to the abrasive belt 102 and a conditioning unit (not shown) for conditioning the polishing surface of the abrasive belt 102 are provided. can be

The first moving unit 301 and the second moving unit 302 may move the polishing unit 100 in the first direction and the second direction, respectively. The first moving unit 301 may be movable in a first direction. For example, a rail R disposed in a first direction may be provided on a lower side of the substrate polishing apparatus 1 , and the first moving part 301 may be slidably connected to the rail R.

The second moving unit 302 may move in the second direction. The second moving unit 302 may be slidably connected to the first moving unit 301 . For example, the first moving part 301 has a guide groove 3011 formed along the second direction, and the first moving part 301 is connected to the guide groove 3011 and is on the second moving part 302 . can slide The first moving part 301 may be connected to the polishing unit 100 so that the polishing unit 100 may move in the second direction. For example, the driving motor of the polishing unit 100 may be connected to the first moving part 301 .

According to such a structure, the polishing unit 100 is movable in the first direction according to the movement of the first moving unit 301 , and can be moved in the second moving unit 302 connected to the first moving unit 301 . By being able to move in the second direction along the line, it is possible to have a linear movement of two degrees of freedom.

The circulation driving unit 200 may orbital motion the polishing unit 100 with respect to the surface of the substrate W so that the contact between the substrate W and the polishing belt 102 is made in multiple directions. The circulation driving unit 200 may orbitally move the polishing unit 100 by moving the polishing unit 100 in two different directions. In other words, the polishing unit 100 may circulate while forming a constant trajectory by the circulation driving unit. In this case, the orbit of the orbital motion of the polishing unit 100 may be a circular orbit parallel to the ground. However, this is only an example, and the polishing unit 100 may circulate in various trajectories according to the operation of the circulation driving unit.

The circulation driving unit 200 may translate the polishing unit 100 in the first direction and the second direction. The first direction and the second direction may be perpendicular to each other and may be disposed on a plane parallel to the surface of the substrate (W). The circulation driving unit 200 may include a first driving unit 202 and a second driving unit 201 .

The first driving unit 202 may translate the polishing unit 100 in a first direction. In other words, the first driving unit 202 may provide a driving force for moving the polishing unit in parallel in the first direction. The first driving unit 202 may include a first driving motor 2021 , a first bracket 2022 , a first connecting member 2023 , and a first support unit.

The first driving motor 2021 may rotate about an axis. That is, the first driving motor 2021 may perform a rotational motion. In this case, the rotation axis of the first driving motor 2021 may be perpendicular to the ground, that is, the surface of the substrate W.

The first bracket 2022 may be connected to the rotation shaft of the first driving motor 2021 to rotate according to the rotation of the first driving motor 2021 . The first bracket 2022 may have a circular shape. In this case, the center of the first bracket 2022 may be connected to the rotation shaft of the first driving motor 2021 .

The first connecting member 2023 may connect the first bracket 2022 and the polishing unit 100 . For example, one side of the first connection member 2023 may be connected to the first bracket 2022 , and the other side may be connected to the first support unit. In this case, both sides of the first connecting member 2023 are rotatably connected to the first bracket 2022 and the first support, thereby preventing the first support from rotating according to the rotation of the first bracket 2022. have. A connection point of the first support member with respect to the first bracket 2022 may be a center of the first bracket 2022 , that is, a point spaced apart from the rotation axis of the first driving motor 2021 . Accordingly, as the first bracket 2022 rotates, the distance between the first bracket 2022 and the first support may be adjusted.

In summary, the first connecting member 2023 linearly moves the first support 2024 according to the rotational motion of the first driving motor 2021, thereby removing the polishing unit 100 connected to the first support 2024. Translation can be done in one direction.

The first support 2024 may move in a first direction. For example, the first supporting part 2024 may move together with the first moving part 301 along the first direction rail R arranged side by side on the rail R. In a state in which the polishing unit 100 polishes the substrate W, the position of the first support 2024 with respect to the first direction may be fixed. In this case, the first driving motor 2021 may be disposed on the first support part. Accordingly, the distance between the first support part 2024 and the first moving part 301 may be adjusted according to the operation of the first driving motor 2021 .

In summary, the first driving unit 202 may translate the first support unit in the first direction, for example, in the Y-axis direction of FIG. 1 according to the rotation of the first driving motor 2021 . When the first driving motor 2021 rotates at a constant angular speed, since the first moving unit 301 reciprocates along the first direction at a constant speed, the polishing unit 100 performs a simple harmonic motion along the first direction. (Simple harmonic oscillation) is possible.

The second driving unit 201 may translate the polishing unit 100 in the second direction, for example, the X-axis direction of FIG. 1 . The second driving unit 201 may provide a driving force for moving the polishing unit 100 in parallel in the second direction.

The second driving unit 201 may include a second driving motor 2011 , a second bracket 2012 , and a second connecting member 2013 .

The second driving motor 2011 may rotate about an axis perpendicular to the ground, for example, an axis parallel to the Z axis of FIG. 1 . The second bracket 2012 may be connected to the rotation shaft of the second driving motor 2011 to rotate. In this case, the second bracket 2012 may have a disk shape, and the center may be connected to the rotation shaft of the second driving motor 2011 . The second connecting member 2013 may connect the second bracket 2012 and the polishing unit 100 . For example, one side of the second connecting member is rotatably connected to the second bracket 2012 so as to be eccentric to the axis of rotation of the second driving motor 2011 , and the other end is rotatably connected to the second moving unit 302 . can Accordingly, the second connecting member 2013 may adjust the distance between the second bracket 2012 and the second moving part 302 according to the rotation of the second bracket 2012 .

In summary, the second connecting member 2013 linearly moves the second moving unit 302 according to the rotational motion of the second driving motor 2011 , thereby connecting the polishing unit 100 to the second moving unit 302 . can be translated in the second direction. In this case, when the second driving motor 2011 rotates at a constant angular speed, the second moving unit 302 may perform a simple harmonic motion reciprocating along the second direction at a constant speed.

FIG. 4 is an enlarged view of part A of FIG. 2 , and FIG. 5 is an operational view illustrating the operation of the first driving unit.

4 and 5 , the circulation driving unit 200 according to an embodiment may convert the rotational motion into a linear motion to move the polishing unit 100 . Hereinafter, the first driving unit 202 will be described as an example, but the operation method of the second driving unit 201 may be the same as that of the first driving unit 202 .

When the first driving motor 2021 is supplied with electric power to rotate, the first bracket 2022 may rotate about the rotational axis of the first driving motor 2021 . Since the first connection member 2023 is connected to the first bracket 2022 so as to be eccentric to the rotation shaft of the driving motor, the first bracket 2022 and the first connection member 2023 according to the rotation of the first driving motor 2021 ) may revolve around the axis of rotation of the first driving motor 2021 .

Since the length of the first connecting member 2023 is constant, the connecting portion of the first connecting member 2023 and the first support may reciprocate along the first direction as shown in FIG. 6 . In particular, when the driving motor rotates at a constant angular velocity, the first support unit may perform a linear oscillation motion along the first direction at a constant speed. That is, the polishing unit 100 connected to the first support may vibrate in the first direction. In this case, since the first connection member 2023 is rotatably connected with respect to the first support part and the first bracket 2022, the first support part is dependent on the rotation of the first bracket 2022 to receive rotational torque. can be prevented

According to this structure, compared to the case of linear motion of the polishing unit 100 through a device providing linear power, for example, a pneumatic cylinder or a linear actuator, a change in the rotational speed of the motor does not occur Therefore, it is possible to effectively move the polishing unit 100 into a linear vibration motion.

6 and 7 are diagrams illustrating an operating state in which the circulation driving unit moves the polishing unit in a trajectory according to an embodiment.

The circulation driving unit 200 moves the polishing unit 100 through the first driving unit 202 and the second driving unit 201 in the first direction (eg, the Y-axis direction in FIG. 6 ) and the second direction ( For example, by linear motion in the X-axis direction of FIG. 6 , the polishing unit 100 may be moved in a trajectory. When the first direction and the second direction are perpendicular to each other, the polishing unit 100 may perform a circular motion that draws an overall circular trajectory according to the movement of the first moving unit 301 and the second moving unit 302 . In a state where the separation distances of the first and second connecting members 2023 and 2013 are the same from the rotation shafts of the first and second driving motors 2021 and 2011, the polishing unit 100 is It may have a circular trajectory with the separation distance as the radius.

For example, in the state of FIG. 6 , the polishing unit 100 is located at the rightmost side in the vibration range in the first direction according to the operation of the first driving unit 202 , and the second driving unit 100 according to the operation of the second driving unit 201 . It can be located at the origin in the vibration range in two directions.

When the first driving motor 2021 and the second driving motor 2011 rotate at the same angular speed, the polishing unit 100 is located at the origin of the vibration range in the first direction, as shown in FIG. 7 , in the second direction. It may be located at the lowest part of the vibration range of As the first driving motor 2021 and the second driving motor 2011 rotate, the polishing unit 100 may return to the state of FIG. 6 again while drawing a circular trajectory. As a result, the polishing unit 100 may perform a trajectory motion forming a circular trajectory.

As described above, although the embodiments have been described with reference to the limited drawings, various modifications and variations are possible from the above description by those of ordinary skill in the art. For example, the described techniques are performed in an order different from the described method, and/or components of the described structures, devices, etc. are combined or combined in a different form than the described method, or other components or equivalents Appropriate results can be achieved even if substituted or substituted by

1: substrate polishing device
100: polishing unit
200: circulation drive device
201: first driving unit
202: second driving unit
301: first moving unit
302: second moving unit

Claims (16)

a first driving unit for translationally moving the polishing unit including the abrasive belt in a first direction parallel to the ground; and
and a second driving unit for translating the polishing unit in a second direction parallel to the ground and perpendicular to the first direction,
a first moving part movable in a first direction; and
Further comprising a second moving part connected to the polishing unit and connected to the first moving part so as to be movable in a second direction,
The first driving unit,
a first drive motor;
a first bracket connected to the first driving motor; and
and a first connecting member rotatably connected to the first bracket at one end and rotatably connected to the first moving unit at the other end so as to be eccentric to the rotation shaft of the first driving motor,
The second driving unit,
a second drive motor;
a second bracket connected to the second driving motor; and
and a second connecting member rotatably connected to the second bracket at one end and rotatably connected to the second moving unit at one end so as to be eccentric to the rotation shaft of the second drive motor.
According to claim 1,
The first driving unit and the second driving unit, the circular driving unit for orbital motion (orbital motion) of the polishing unit to form a constant trajectory.
3. The method of claim 2,
The orbit is a circular orbit parallel to the ground.
3. The method of claim 2,
The first driving unit and the second driving unit, a circular driving unit for orbiting the polishing unit so as not to rotate (rotation).
delete According to claim 1,
The first connection member is rotatably connected to the first bracket and the polishing unit,
The polishing unit is a circular drive unit, which translates in a first direction according to the rotation of the first drive motor.
delete According to claim 1,
The second connection member is rotatably connected to the second bracket and the polishing unit,
The polishing unit is a circular drive unit, which translates in a second direction according to the rotation of the second drive motor.
◈Claim 9 was abandoned at the time of payment of the registration fee.◈ a polishing unit including a driving roller and an abrasive belt wound around the driving roller and rotating to grind the substrate; and
a circulation drive unit connected to the polishing unit;
The circulation drive unit,
a first driving unit for moving the polishing unit in parallel in a first direction parallel to the ground; and
and a second driving unit for parallel-moving the polishing unit in a second direction parallel to the ground and perpendicular to the first direction,
a first moving part movable in a first direction; and
It is connected to the polishing unit and further comprises a second moving part connected to the first moving part so as to be movable in a second direction,
The first driving unit,
a first drive motor;
a first bracket connected to the first driving motor; and
and a first connecting member rotatably connected to the first bracket at one end and rotatably connected to the first moving unit at the other end so as to be eccentric to the rotation shaft of the first driving motor,
The second driving unit,
a second drive motor;
a second bracket connected to the second driving motor; and
and a second connecting member rotatably connected to the second bracket at one end and rotatably connected to the second moving unit at one end so as to be eccentric to the rotation shaft of the second driving motor.
◈Claim 10 was abandoned when paying the registration fee.◈ 10. The method of claim 9,
and the first direction and the second direction are perpendicular to each other and disposed on a plane parallel to the substrate surface.
◈Claim 11 was abandoned when paying the registration fee.◈ 11. The method of claim 10,
Each of the first driving unit and the second driving unit,
subjecting the polishing unit to simple harmonic oscillation along a first direction and a second direction.
◈Claim 12 was abandoned when paying the registration fee.◈ 12. The method of claim 11,
The polishing unit,
A substrate polishing apparatus, which moves without rotation along a circular orbit parallel to the surface of the substrate.
delete delete ◈Claim 15 was abandoned when paying the registration fee.◈ 10. The method of claim 9,
The first driving unit,
Further comprising a first support movable along the first direction,
and the first driving motor is disposed on the first support portion.
delete

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