KR102424265B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

An embodiment of the substrate processing apparatus includes a plurality of susceptors on which a substrate is mounted; a disk on which a plurality of the susceptors are disposed; a shaft coupled to the disk and supporting the disk; and a thermocouple disposed inside the disk, wherein the thermocouple may include a temperature sensing unit provided at one end and disposed between the susceptors adjacent to each other.

Description

Substrate processing apparatus and substrate processing method

The embodiment relates to a substrate processing apparatus and a substrate processing method used in a substrate processing process that is repeatedly performed.

The content described in this section merely provides background information for the embodiment and does not constitute the prior art.

In general, a semiconductor memory device, a liquid crystal display device, an organic light emitting device, etc. are manufactured by performing a plurality of semiconductor processes on a substrate and stacking structures having a desired shape.

A semiconductor manufacturing process includes a process of depositing a predetermined thin film on a substrate, a photolithography process of exposing a selected region of the thin film, and an etching process of removing the thin film of the selected region. A substrate processing process for manufacturing such a semiconductor is performed in a substrate processing apparatus including a chamber in which an optimal environment is created for the process.

The embodiment relates to a substrate processing apparatus and a substrate processing method used in a substrate processing process that is repeatedly performed.

The technical task to be achieved by the embodiment is not limited to the technical task mentioned above, and other technical tasks not mentioned will be clearly understood by those of ordinary skill in the art to which the embodiment belongs from the description below.

An embodiment of the substrate processing apparatus includes a plurality of susceptors on which a substrate is mounted; a disk on which a plurality of the susceptors are disposed; a shaft coupled to the disk and supporting the disk; and a thermocouple disposed inside the disk, wherein the thermocouple may include a temperature sensing unit provided at one end and disposed between the susceptors adjacent to each other.

The first distance from the center of the disk to the temperature sensing unit may be smaller than the second distance from the center of the disk to the center of the susceptor.

Another embodiment of the substrate processing apparatus may include: a depression formed in the disk and in which a part of the thermocouple is disposed; a cap disposed at an end of the recessed part and accommodating the temperature sensing part; and a cover member coupled to the disk at a central portion of the disk and covering the recessed portion.

The cover member may have a through hole formed at a position corresponding to the cap, and the cap may be inserted into the through hole.

The cap may include a small diameter portion inserted into the through hole and the upper surface of which is exposed; a large-diameter portion integrally formed with the small-diameter portion; a receiving part formed inside the small diameter part and accommodating a part of the thermocouple and the temperature sensing part; and a through hole formed to pass through the large-diameter portion to communicate with the receiving portion, and through which the thermocouple is disposed.

The substrate processing apparatus may further include a stopper disposed in the accommodating part and attached to the thermocouple, and the accommodating part may be filled with a ceramic adhesive.

Another embodiment of the substrate processing apparatus, a plurality of susceptors on which the substrate is seated; a disk on which a plurality of the susceptors are disposed; a shaft coupled to the disk and supporting the disk; and a temperature sensing unit provided at a position adjacent to an edge portion of the substrate, and may include a thermocouple disposed inside the disk.

The thermocouple may be disposed between the susceptors adjacent to each other in the circumferential direction of the disk among a plurality of the susceptors.

The thermocouples may be disposed on the disk in plurality and may be radially disposed.

The temperature sensing unit may be located at one end of the thermocouple.

The susceptor may be formed by recessing an upper surface of the disk, and the temperature sensing unit may be disposed at a position equal to or lower than a midpoint in the vertical direction of the side surface of the susceptor.

The temperature sensing unit may be disposed at a point within 5 mm downward from the midpoint in the vertical direction of the side surface of the susceptor.

The susceptor is formed by recessing an upper surface of the disk, and the length of the first line segment drawn from the center of the disk to the temperature sensing unit is smaller than the length of the second line segment drawn from the center of the disk to the center of the susceptor. it could be

The temperature sensing unit may be disposed at a point within 50 mm in the direction of the center of the susceptor from a point where the second line segment and the circumference of the susceptor meet.

The temperature sensing unit may be disposed at a point within 50 mm in the direction of the center of the disk from a point where the second line segment and the circumference of the susceptor meet.

Another embodiment of the substrate processing apparatus may further include a cable disposed inside the shaft and electrically connected to the thermocouple.

Another embodiment of the substrate processing apparatus includes a coupling member disposed in a depression formed in the disk; and a cover member disposed in the depression and covering the coupling member, wherein the temperature sensing unit may be disposed in a space formed between the coupling member and the cover member.

The temperature sensing unit may be bonded to at least one of the coupling member and the cover member by an adhesive, and the adhesive may be made of a ceramic material.

Another embodiment of the substrate processing apparatus includes a chamber; a plurality of susceptors provided in the chamber and on which a substrate is seated; a disk on which a plurality of the susceptors are disposed; a shaft coupled to the disk and supporting the disk; a thermocouple including a temperature sensing unit provided at a position adjacent to an edge of the substrate and disposed inside the disk; and a sealing part disposed at a portion where the shaft passes through the lower wall of the chamber.

The sealing part may be one in which a cooling pipe through which a refrigerant flows is disposed.

An embodiment of the substrate processing method includes: a measured temperature acquisition step in which a controller acquires an actual measured temperature of the disk from a temperature sensing unit provided in a thermocouple disposed inside the disk; a temperature comparison step in which the control unit compares the measured temperature with a set temperature of the disk; a temperature control step in which the controller controls the temperature of the disk when the difference between the measured temperature and the set temperature is out of a preset temperature range; and when the difference between the measured temperature and the set temperature is within a preset temperature range, a substrate processing step of performing a substrate processing process.

The control unit may control the temperature of the disk by controlling the amount of power supplied to the heating device disposed in the chamber.

Another embodiment of the substrate processing apparatus includes a chamber; a plurality of susceptors provided in the chamber and on which a substrate is seated; a disk on which a plurality of the susceptors are disposed; a shaft coupled to the disk and supporting the disk; a thermocouple including a temperature sensing unit and disposed inside the disk; a coupling member disposed in a depression formed in the disk; a cover member disposed in the depression and covering the coupling member; and a sealing part disposed at a portion where the shaft passes through the lower wall of the chamber, wherein the thermocouple is disposed between the susceptors adjacent to each other in the circumferential direction of the disk among a plurality of the susceptors, The temperature sensing unit may be disposed in a space formed between the coupling member and the cover member.

Another embodiment of the substrate processing apparatus, a plurality of susceptors on which the substrate is seated; a disk on which a plurality of the susceptors are disposed; a thermocouple disposed inside the disk and having a temperature sensing unit at one end; a recessed portion formed in the disk, in which a part of the thermocouple and the temperature sensing unit are disposed; a cap disposed at an end of the recessed part and accommodating the temperature sensing part; a cover member covering the depression; and a fixing member coupled to the disk at a central portion of the disk and fixing the cover member, wherein the temperature sensing unit may be disposed between the susceptors adjacent to each other.

The cover member may include a pressing portion overlapping a portion of the fixing member and being pressed by the fixing member; and an extended part extending from the pressing part and covering the temperature sensing part, wherein a step having a shape corresponding to the side surface of the fixing member is formed between the pressing part and the extended part.

The extension portion may have a through hole formed at a position corresponding to the cap, and the cap may be inserted into the through hole.

The cap may include a small diameter portion inserted into the through hole and the upper surface of which is exposed; a large-diameter portion integrally formed with the small-diameter portion; a receiving part formed inside the large diameter part and accommodating a part of the thermocouple and the temperature sensing part; and a through hole formed to pass through the large-diameter portion to communicate with the accommodating portion, the thermocouple passing therethrough, and a stopper disposed in the accommodating portion and attached to the thermocouple, wherein the accommodating portion includes: The ceramic adhesive may be filled.

In the embodiment, it is possible to accurately detect the temperature change trend of the substrate without interfering with the processing process of the substrate, so that the substrate can be placed in the same temperature atmosphere in each substrate processing process in the repetitive substrate processing process.

In an embodiment, the temperature sensing unit is disposed in a region adjacent to the seating position of the substrate among each region of the disk, so that it is possible to accurately detect the change in temperature of the substrate undergoing each process in the repeated processing of the substrate.

In an embodiment, since the temperature required for processing the substrate during each process in the repeated substrate processing process is maintained within a certain range, the characteristics and quality of the substrates manufactured in each processing process can be maintained the same or extremely similar. .

1 is a plan view showing a disk according to an embodiment.
2 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment. A direction AA of FIG. 1 is shown in FIG. 2 .
3 is an enlarged view showing a portion B of FIG. 2 .
4 and 5 are views for explaining an embodiment of the arrangement position of the temperature sensing unit.
6 is a flowchart illustrating a substrate processing method according to an exemplary embodiment.
7 is a diagram showing a disk according to another embodiment.
8 is an enlarged cross-sectional view showing a disk according to another embodiment.
9 is an enlarged view showing a disk according to another embodiment.
10 is a view showing a thermocouple according to another embodiment.
11 is a view for explaining the arrangement of a temperature sensing unit according to another embodiment.
12 is a perspective view showing a disk according to another embodiment.
13 is an exploded view illustrating a part of FIG. 12 .
14 is a cross-sectional view illustrating a part of FIG. 12 .
15 is a cross-sectional view of FIG. 14 viewed from another direction.
16 is a diagram showing a disk according to another embodiment.
FIG. 17 is a view showing a part of FIG. 16 .

Hereinafter, an embodiment will be described in detail with reference to the accompanying drawings. Since the embodiment can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the embodiment to a specific disclosed form, and should be understood to include all modifications, equivalents, and substitutions included in the spirit and scope of the embodiment.

Terms such as “first” and “second” may be used to describe various elements, but the elements should not be limited by the terms. These terms are used for the purpose of distinguishing one component from another. In addition, terms specifically defined in consideration of the configuration and operation of the embodiment are only for describing the embodiment, and do not limit the scope of the embodiment.

In the description of the embodiment, in the case where it is described as being formed in "up (up)" or "below (on or under)" of each element, on (on or under) ) includes both elements in which two elements are in direct contact with each other or one or more other elements are disposed between the two elements indirectly. In addition, when expressed as "up (up)" or "down (on or under)", it may include not only the upward direction but also the meaning of the downward direction based on one element.

Also, as used hereinafter, relational terms such as "upper/upper/above" and "lower/lower/below" etc. do not necessarily require or imply any physical or logical relationship or order between such entities or elements, It may be used to distinguish one entity or element from another entity or element.

1 is a plan view showing a disk 100 according to an embodiment. 2 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment. A direction AA of FIG. 1 is shown in FIG. 2 .

The substrate processing apparatus of the embodiment includes a disk 100 , a shaft 200 and a thermocouple 300 (thermo couple), and all of the disk 100 and a part of the shaft 200 are inside the chamber 20 . can be placed.

The chamber 20 constitutes a part of the substrate processing apparatus, and is a space in which a substrate is disposed and deposition and etching processes of the substrate are performed. Accordingly, although not shown in the chamber 20 , an injection unit for spraying a process gas necessary for substrate processing such as deposition and etching of the substrate may be disposed to face the substrate.

In addition, a discharge means for discharging the process gas foreign substances existing inside the chamber 20 to the outside and maintaining the inside of the chamber 20 at a pressure close to vacuum, for example, a vacuum pump, etc., are provided in the chamber 20 . can be combined

In addition, a plasma generator for generating plasma in the chamber 20 may be coupled to the chamber 20 .

In addition, a door for introducing the substrate into the chamber 20 or for discharging the substrate from the chamber 20 may be provided on the sidewall of the chamber 20 , and the substrate introducing means and the substrate taking out means are provided in the chamber (20) It may be provided inside or outside.

The disk 100, as shown in FIG. 1, is disposed in the chamber 20, and a substrate, for example, a disk-shaped wafer may be seated thereon. Accordingly, in the disk 100 , the plurality of susceptors 110 on which the substrate 10 is seated may be radially disposed with respect to the center CD of the disk 100 .

In this case, in order to stably seat the substrate 10 on the disk 100 , as shown in FIG. 2 , the susceptor 110 may be formed by recessing the upper surface of the disk 100 . In the embodiment, since a disk-shaped substrate is processed, the susceptor 110 may be formed in a circular shape when looking at the upper surface of the disk 100 as shown in FIG. 1 .

The shaft 200 may be coupled to the disk 100 and support the disk 100 . In this case, for example, the shaft 200 may be integrally formed with the shaft 200 in the central portion of the disk 100 .

The shaft 200 may be driven by a driving means (not shown). That is, the shaft 200 can be raised, lowered, or rotated by the driving means connected to the shaft 200 .

Accordingly, the disk 100 coupled to the shaft 200 is also raised, lowered, or rotated to drive the substrate 10 when the substrate 10 is drawn in, during the processing process of the substrate 10 or when the substrate 10 is moved. have.

Due to this structure, the substrate processing apparatus of the embodiment can process a plurality of substrates during one process. Once the substrate processing process is completed, the processed substrate is taken out of the chamber 20 , and a new substrate 10 is again introduced into the chamber 20 to be seated on the disk 100 , and the new substrate 10 is ), the same processing process as that of the previous substrate 10 may be performed in the chamber 20 .

As such, when the same substrate 10 processing process is repeatedly performed, it is necessary to precisely detect the temperature change trend of the substrate 10 .

If the temperature change trend of the substrate 10 in each processing process of the substrate 10 is different from each other, the quality and characteristics of the substrate 10 processed in each processing process may differ from each other.

In order to prevent this, it is necessary to keep the temperature change trend of the substrate 10 the same in each repeated processing process. .

For example, just before the substrate 10 processing process proceeds, the substrate 10 disposed on the disk 100 is heated using a heating device to reach a temperature required for processing, at this time, each In the substrate 10 processing process, it is necessary to keep the temperature of the substrate 10 immediately before the process proceeds similarly, that is, within a preset temperature range.

That is, it is necessary to ensure that the temperature of the substrate 10 immediately before the first processing process and the temperature of the substrate 10 immediately before proceeding with the second and third processing processes are all within the same preset temperature range.

Therefore, in the embodiment, in the processing process of processing the plurality of substrates 10 , the temperature of the substrate 10 immediately before the start of each processing process is the temperature at which the temperature change of the substrate is accurately detected so that all of the temperatures are within the same preset temperature range. Measuring means may be used.

In general, a non-contact pyrometer is used as a means for measuring the temperature of the substrate.

However, in this non-contact pyrometer, since the temperature measuring unit and the substrate 10 are disposed at a position significantly spaced apart from each other, the temperature of the substrate is accurately measured by being disturbed by the process gas and suspended particles present in the chamber 20 . This is not possible, so it is inappropriate to accurately detect the temperature change trend of the substrate.

On the other hand, it is also impossible to use a temperature measuring means that directly contacts the substrate 10 during the processing process of the substrate 10 . This is because the substrate 10 contact type temperature measuring means may interfere with the normal processing of the substrate 10 due to direct contact with the substrate 10 .

Therefore, in the embodiment, the temperature change of the substrate 10 is accurately detected without interfering with the processing process of the substrate 10, and in each substrate 10 processing process in the repetitive substrate 10 processing process, the substrate (10) can be placed in the same temperature atmosphere.

To this end, the temperature measuring means used in the embodiment may measure the temperature change trend of the substrate 10 using the thermocouple 300 embedded in the disk 100 .

The thermocouple 300 is disposed inside the disk 100 and may include a temperature sensing unit 310 . The temperature sensing unit 310 may be provided at a position adjacent to an edge portion of the substrate 10 .

At this time, as shown in FIG. 1 , the thermocouple 300 is located at a position corresponding to the cover member 600 , that is, the susceptors adjacent to each other in the circumferential direction of the disk 100 among the plurality of susceptors 110 . At least one may be disposed between the scepters 110 .

Of course, the thermocouple 300 may be disposed in plurality, in which case the thermocouple 300 may be disposed in plurality and radially on the disk 100, and each thermocouple 300 may be disposed adjacent to each other. It may be disposed between the scepters 110 .

The temperature sensing unit 310 is a portion for sensing a temperature in the thermocouple 300 . The thermocouple 300 is made of two conductors of different materials, and can sense a temperature at a junction where the two conductors are directly connected. Accordingly, the temperature sensing unit 310 of the embodiment may mean a contact point at which two conductive wires of the thermocouple 300 are directly connected to each other.

Accordingly, the temperature sensing unit 310 is a contact point to which two conductive wires of the thermocouple 300 are directly connected, and may be disposed at one end of the thermocouple 300 . In the embodiment, it is necessary to appropriately select the position of the temperature sensing unit 310 in order to accurately detect the temperature change trend of the substrate 10 . This will be described in detail later with reference to FIGS. 3 to 5 .

In an embodiment, the substrate processing apparatus may further include a cable 400 . Referring to FIG. 2 , the cable 400 may be disposed inside the shaft 200 and may be electrically connected to the thermocouple 300 . That is, one end of the cable 400 may be connected to the thermocouple 300 , and the other end may be connected to a controller (not shown).

The thermocouple 300 is connected to the control unit, and the control unit may receive the measured temperature of the thermocouple 300 from the thermocouple 300, and the cable 400 serves to electrically connect the thermocouple 300 and the control unit. can

At this time, the cable 400 is partially disposed inside the shaft 200 disposed outside the chamber 20, thereby electrically connected to the control unit disposed outside the chamber 20, and thus the control unit and the thermocouple 300 can be electrically connected.

In an embodiment, the substrate processing apparatus may further include a sealing unit 700 . As shown in FIG. 2 , the sealing part 700 may be disposed at a portion where the shaft 200 passes through the lower wall 21 of the chamber 20 .

The sealing part 700 may seal the chamber 20 . That is, the shaft 200 is disposed to penetrate the lower wall 21 of the chamber 20 , and can rise, fall, or rotate with respect to the chamber 20 , so that between the shaft 200 and the lower wall 21 , gaps may exist.

If such a gap exists, it may be difficult to maintain a pressure close to vacuum inside the chamber 20 . Accordingly, the sealing part 700 may serve to close the gap to maintain the inside of the chamber 20 at a pressure close to vacuum.

The sealing part 700 may be provided in the form of an O-ring to seal the gap, for example. In addition, the sealing part 700 may be provided with a cooling means.

The sealing part 700 may be heated by receiving heat from the chamber 20 that is in a high temperature state during substrate processing, and may expand by heating. When the sealing part 700 is heated, the sealing part 700 and the lower wall 21 of the chamber 20 may be deformed due to thermal expansion, and the sealing efficiency of the sealing part 700 may fall.

In addition, when the sealing part 700 is heated and thermally expanded, it may be difficult to raise, lower, or rotate the shaft 200 in contact with the sealing part 700 .

In order to suppress the occurrence of such a problem, a cooling means for suppressing thermal expansion of the sealing part 700 is required. In this case, the cooling means may be, for example, a cooling pipe 710 disposed inside the sealing part 700 and through which a refrigerant flows.

However, the cooling means is not limited thereto, and in another embodiment, a cooling fan disposed outside the chamber 20 and adjacent to the sealing part 700 may be used.

3 is an enlarged view showing a portion B of FIG. 2 . As shown in FIG. 3 , the thermocouple 300 of the embodiment may be disposed to be embedded in the disk 100 . In order to embed the thermocouple 300 in the disk 100 , a coupling member 500 and a cover member 600 may be provided.

In this case, in order for the thermocouple 300 to be disposed inside the disk 100 , a depression 120 in which the thermocouple 300 is disposed may be formed in the disk 100 .

The coupling member 500 is disposed in the depression 120 formed in the disk 100 , and may be coupled to the disk 100 . The cover member 600 may be disposed in the depression 120 and may be provided to cover the coupling member 500 .

In this case, a fixing member 800 for fixing the cover member 600 to the disk 100 may be provided. The fixing member 800 may be coupled to the disk 100 at the central portion of the disk 100 , and as the fixing member 800 is coupled to the disk 100 , the cover member 600 is depressed. It may be fixedly disposed on the unit 120 .

As the coupling member 500 and the cover member 600 are coupled to the recessed portion 120 of the disk 100 , a separation space SP is formed between the coupling member 500 and the cover member 600 . can be The temperature sensing unit 310 may be disposed in the separation space SP.

The separation space SP may guide the arrangement position of the temperature sensing unit 310 so that the temperature sensing unit 310 may be arranged at a designed position.

Therefore, in order to guide the separation space (SP) so that the temperature sensing unit 310 is disposed at a designed position, the shape of the coupling member 500 is appropriately adjusted to adjust the height of the coupling member 500 upper surface, By adjusting the shapes of the coupling member 500 and the cover member 600, it is necessary to appropriately adjust the lateral and vertical positions of the separation space SP, and the volume of the separation space SP.

On the other hand, in order for the temperature sensing unit 310 to repeatedly measure the temperature of the same position of the disk 100 more accurately, the temperature sensing unit 310 may be fixedly disposed at a specific position of the disk 100 . There is a need.

In order to fix the temperature sensing unit 310 to a specific position of the disk 100 , the temperature sensing unit 310 is bonded to at least one of the coupling member 500 and the cover member 600 by an adhesive. can be

For example, by filling a part or all of the adhesive in the separation space SP, the temperature sensing unit 310 is fixedly coupled to at least one of the coupling member 500 and the cover member 600 . can

In this case, the adhesive may be made of, for example, a ceramic material. Since the ceramic adhesive has strong heat resistance, it does not melt or soften even in a high-temperature atmosphere inside the chamber 20, so it may be suitable as the adhesive of the embodiment.

The temperature sensing unit 310 may measure a change in temperature of the substrate 10 disposed on the disk 100 . That is, the temperature sensing unit 310 does not measure the temperature of the substrate 10 in direct contact with the substrate 10 , but controls the substrate 10 to exist within the designed temperature range in the repeated substrate 10 processing process. It is possible to measure the temperature of a specific position of the disk 100 close to the substrate 10 to the extent necessary to do so.

Hereinafter, an embodiment of the arrangement position in the disk 100 to the extent that the temperature sensing unit 310 can achieve the above object will be described.

4 and 5 are diagrams for explaining an embodiment of the arrangement position of the temperature sensing unit 310 . The susceptor 110 may have a bottom surface and a side surface since the top surface of the disk 100 is depressed.

At this time, as shown in FIG. 4 , the temperature sensing unit 310 may be disposed at a position equal to or lower than the midpoint MP in the vertical direction of the side surface of the susceptor 110 .

If the temperature sensing unit 310 is disposed at a position higher than the intermediate point MP, it is located excessively close to the upper surface of the disk 100 . The portion close to the upper surface of the disk 100 may have a lower or higher temperature than the inside of the disk 100 according to a change in ambient temperature.

Therefore, when the temperature sensing unit 310 is located excessively close to the upper surface of the disk 100, the actual temperature of the disk 100 sensed by the temperature sensing unit 310 may change according to the change in ambient temperature, Accordingly, the temperature change trend of the substrate 10 may not be accurately detected.

In addition, as shown in FIG. 4 , the temperature sensing unit 310 may be disposed at a point within 5 mm downward from the intermediate point MP in the vertical direction of the side surface of the susceptor 110 .

If the temperature sensing unit 310 deviates from the midpoint MP by 5 mm in the downward direction, the temperature sensing unit 310 is excessively spaced from the substrate 10 disposed on the susceptor 110, so that the substrate It may not be possible to accurately detect the temperature change in (10).

Meanwhile, as shown in FIG. 5 , the length of the first line segment PH1 drawn from the center CD of the disk 100 to the temperature sensing unit 310 is determined from the center CD of the disk 100 . The length of the second line segment PH2 drawn up to the center CP of the susceptor 110 may be smaller than the length of the second line segment PH2 .

The edge of the disk 100 is more actively cooled than the center (CD) of the disk 100 , and thus the edge of the disk 100 may have a lower temperature than the center (CD) of the disk 100 .

Accordingly, if the temperature sensing unit 310 is disposed such that the length of the first line segment PH1 is greater than the length of the second line segment PH2 , the temperature sensing unit 310 is disposed close to the edge of the disk 100 . Therefore, since the temperature of the region having a low temperature among the regions of the disk 100 is sensed, the temperature change trend of the substrate 10 may not be accurately detected.

The radial arrangement position of the disk 100 of the temperature sensing unit 310 is, for example, between the second line segment PH2 and the susceptor 110 in order to accurately detect the temperature change trend of the substrate 10 . It may be appropriate to place it adjacent to the point where the circumferences meet.

More specifically, for example, the temperature sensing unit 310 is 50 mm toward the center CP of the susceptor 110 at a point where the second line segment PH2 and the circumference of the susceptor 110 meet. It can be placed at a point within

When the temperature sensing unit 310 is disposed close to the edge of the disk 100 out of the above range, as described above, since the temperature of the region having a lower temperature among the regions of the disk 100 is sensed, the substrate ( 10), it may not be possible to accurately detect the temperature change trend.

Or, for example, the temperature sensing unit 310 is a point within 50 mm in the direction of the center (CD) of the disk 100 at the point where the circumference of the second line segment PH2 and the susceptor 110 meet. can be placed in

When the temperature sensing unit 310 is disposed close to the center CD of the disk 100 out of the above range, the temperature sensing unit 310 is excessively moved from the substrate 10 disposed on the susceptor 110 . Since they are spaced apart, the temperature change trend of the substrate 10 may not be accurately detected.

In the embodiment, the temperature sensing unit 310 is disposed in an area adjacent to the seating position of the substrate 10 among each area of the disk 100, so that the substrate ( 10) can accurately detect the temperature change trend.

6 is a flowchart illustrating a substrate processing method according to an exemplary embodiment. The substrate processing method of the embodiment may include an actual measurement temperature acquisition step (S100), a temperature comparison step (S200), a temperature control step (S300), and a substrate processing step (S400).

In order to process the substrate 10 , the substrate 10 may be heated by a heating device disposed in the chamber 20 while being seated on the susceptor 110 of the disk 100 . In this case, the thermocouple 300 may measure the temperature of a position adjacent to the substrate 10 among the disk 100 .

Based on the measured temperature measured by the thermocouple 300 , the controller provided in the substrate processing apparatus may control the temperature of the substrate 10 .

In the measured temperature acquisition step ( S100 ), the controller may acquire the measured temperature of the disk 100 from the temperature sensing unit 310 provided in the thermocouple 300 disposed inside the disk 100 .

As described above, the thermocouple 300 does not directly measure the temperature of the substrate 10 in direct contact with the substrate 10 , but measures the temperature of a region adjacent to the substrate 10 among the disk 100 . can do.

The specific position of the temperature sensing unit 310 for measuring the temperature of the disk 100 in the region where the thermocouple 300 is adjacent to the substrate 10 has already been described above.

In the temperature comparison step ( S200 ), the controller may compare the measured temperature with the set temperature of the disk 100 . At this time, the set temperature of the disk 100 is a temperature value similar to the temperature of the substrate 10 required in the processing process of the substrate 10 .

That is, the measured temperature is not directly measured the temperature of the substrate 10 in direct contact with the substrate 10 . Accordingly, the set temperature of the disk 100 is different from the temperature of the substrate 10 required in the substrate 10 processing process, and the set temperature of the disk 100 may be set in consideration of the difference.

In the temperature control step ( S300 ), when the difference between the measured temperature and the set temperature is out of a preset temperature range, the controller may control the temperature of the disk 100 .

If the difference between the measured temperature and the set temperature is out of a preset temperature range, in a substrate processing process that is repeatedly performed, differences in characteristics and quality of the substrates manufactured in each process may occur.

Therefore, in order to maintain the same or extremely similar characteristics and quality of the substrates 10 manufactured in each process, the controller controls the temperature of the disk 100 so that the difference between the measured temperature and the set temperature is maintained within a preset temperature range. can control

The controller may control the temperature of the disk 100 by controlling the amount of power supplied to the heating device disposed in the chamber 20 . Meanwhile, the heating device may be, for example, a non-contact heating device that does not come into contact with the disk 100 or the substrate 10 , a heating device disposed on the disk, and other various types and types of heating devices.

When the temperature of the disk 100 is maintained within a preset temperature range, the temperature of the substrate 10 seated on the disk 100 and receiving heat transfer from the disk 100 may also be maintained within a temperature range required for processing.

At this time, since the temperature of the disk 100 and the temperature of the substrate 10 seated on the disk 100 may be different from each other, in consideration of this, the set temperature range of the disk 100 is the substrate 10 required for processing. It may be determined differently from the temperature range of

In the substrate processing step (S400), when the difference between the measured temperature and the set temperature is within a preset temperature range, the substrate 10 processing process may be performed. Of course, the measured temperature is the temperature of the disk 100 measured by the temperature sensing unit 310 provided in the thermocouple 300 , and the set temperature is the set temperature of the disk 100 .

The substrate 10 processing process is repeated, and each substrate 10 processing process may go through each of the above-described steps.

Therefore, according to the substrate processing method of the embodiment, since the temperature required for processing the substrate 10 during each process in the repeated substrate 10 processing process is maintained within a certain range, the substrate 10 manufactured in each processing process ) properties and quality can be maintained the same or extremely similar.

7 is a diagram illustrating a disk 100 according to another embodiment. 8 is an enlarged cross-sectional view showing a disk 100 according to another embodiment. Hereinafter, redundant descriptions of the contents consistent with the above will be omitted as much as possible.

7 , the substrate processing apparatus of the embodiment may include a susceptor 110 , a disk 100 , a shaft 200 , and a thermocouple 300 . A plurality of susceptors 110 are provided on the disk 100 , and the substrate 10 may be seated on each susceptor 110 .

A plurality of the susceptors 110 may be disposed on the disk 100 . The shaft 200 may be coupled to the disk 100 and support the disk 100 .

The thermocouple 300 may include a temperature sensing unit 310 disposed inside the disk 100 and disposed adjacent to an edge portion of the substrate 10 .

In this case, the temperature sensing unit 310 may be provided at one end of the thermocouple 300 . In addition, the temperature sensing unit 310 may be provided at a position adjacent to an edge portion of the substrate 10 . A specific arrangement position of the temperature sensing unit 310 will be described in detail below with reference to FIG. 9 .

The substrate processing apparatus of the embodiment may further include a depression 120 , a cap 1000 , and a cover member 600 .

The depression 120 may be formed in the disk 100 , and a part of the thermocouple 300 may be disposed thereon. As shown in FIG. 7 , the recessed portion 120 may be formed so that the longitudinal direction thereof is disposed in the radial direction of the disk 100 from the center of the disk 100 .

On the other hand, since the temperature sensing unit 310 provided at one end of the thermocouple 300 is disposed between the plurality of susceptors 110 , the recessed portion 120 also corresponds to the plurality of susceptors 110 . ) can be placed between

Meanwhile, although one depression 120 is illustrated in FIG. 7 , in another embodiment, a plurality of the depression portions 120 are provided, and the plurality of depression portions 120 are based on the center of the disk 100 . It can be arranged radially.

This is because a plurality of thermocouples 300 are provided, and each thermocouple 300 may be radially disposed with respect to the center of the disk 100, so that the plurality of depressions 120 are also the thermocouples 300. This is because it can be arranged to correspond to the arrangement structure of

The cap 1000 may be disposed at an end of the recessed part 120 and accommodate the temperature sensing part 310 . A specific structure of the cap 1000 will be described in detail below with reference to FIG. 11 .

The cover member 600 may be coupled to the disk 100 at the central portion of the disk 100 and cover the recessed portion 120 . In the cover member 600 , a protrusion protruding in a radial direction of the disk 100 may be formed to cover the depression 120 .

On the other hand, since the thermocouple 300 and the recessed part 120 may be provided in plurality that are radially disposed with respect to the center of the disk 100 , the protrusion of the cover member 600 may also be formed in a corresponding shape. can be provided.

That is, a plurality of protrusions of the cover member 600 may be provided radially with respect to the center of the disk 100 and the cover member 600 . Accordingly, the cover member 600 may have a star shape or a starfish shape when viewed as a whole.

The cover member 600 may have a through hole 6100 formed at a position corresponding to the cap 1000 , and the cap 1000 may be inserted into the through hole 6100 . The cover member 600 is disposed on the upper surface of the disk 100 , and is coupled to the disk 100 by a coupling mechanism, so that the cap 1000 is fixedly disposed at a designed position.

9 is an enlarged view showing a disk 100 according to another embodiment. As shown in FIG. 9 , the temperature sensing unit 310 may be provided at one end of the thermocouple 300 . In addition, at least one of the temperature sensing unit 310 may be disposed between the susceptors 110 adjacent to each other in the circumferential direction of the disk 100 among the plurality of susceptors 110 .

Of course, as described above, when the thermocouple 300 is provided in plurality, the temperature sensing unit 310 may be provided in plurality, each radially disposed with respect to the center of the disk 100 .

At this time, the first distance D1 from the center of the disk 100 to the temperature sensing unit 310 is the second distance D2 from the center of the disk 100 to the center of the susceptor 110 . To be smaller, the temperature sensing unit 310 may be disposed on the disk 100 .

As shown in FIG. 9 , an inner circle CL1 in contact with the outer periphery of each of the plurality of susceptors 110 and a radius smaller than the second distance D2 is drawn, and the second distance D2 as a radius is the outer side. A circle CL2 can be drawn.

In this case, the first distance D1 may be greater than the radius of the inner circle CL1 in the radial direction of the susceptor 110 and smaller than the radius of the outer circle CL2 , that is, the second distance D2 .

When the temperature sensing unit 310 is disposed as shown in FIG. 9 , the thermocouple 300 does not affect the arrangement of the susceptor 110 formed by being depressed in the disk 100, and the susceptor ( There is an effect that the temperature of the disk 100 similar to the actual temperature of the substrate 10 disposed on the disk 110 can be measured.

In particular, by disposing the temperature sensing unit 310 at the above position, the temperature sensing unit 310 as a whole is arranged at a position closer to the center than the outer surface of the disc 100 . can

Since the temperature sensing unit 310 is disposed at a position close to the center of the disc 100, it is not affected by the cooling of the disc 100 due to heat transfer from the outer surface of the disc 100 to the outside, and thus, the temperature sensing unit ( The temperature sensed by the 310 may be similar to the actual temperature of the substrate 10 .

10 is a view showing a thermocouple 300 according to another embodiment. 11 is a view for explaining the arrangement of the temperature sensing unit 310 according to another embodiment.

As shown in FIG. 10 , one end of the thermocouple 300 is connected to the cable 400 , and a temperature sensing unit 310 may be provided at the other end of the thermocouple 300 . In this case, the temperature sensing unit 310 may be accommodated in the cap 1000 .

The cable 400 may be disposed inside the shaft 200 , as described above. One end of the cable 400 may be electrically connected to the thermocouple 300 , and the other end may be connected to the controller.

A part of the thermocouple 300 may be disposed in the recessed part 120 , and an end of the thermocouple 300 provided with the temperature sensing part 310 may be accommodated in the cap 1000 . have.

Referring to FIG. 11 , the cap 1000 may include a small diameter part 1100 , a large diameter part 1200 , a receiving part 1300 , and a through hole 1400 .

The small diameter portion 1100 may be inserted into the through hole 6100 and the upper surface may be exposed to the outside through the through hole 6100 . The large-diameter portion 1200 is integrally formed with the small-diameter portion 1100, and between the small-diameter portion 1100 and the large-diameter portion 1200, the cap 1000 is separated to the outside through the through hole 6100. A step may be formed to restrain it.

The through hole 1400 may be formed to pass through the large diameter portion 1200 to communicate with the receiving portion 1300 , and the thermocouple 300 may be disposed therethrough. In this case, the through hole 1400 may be formed in a lateral direction of the large-diameter portion 1200 .

The accommodating part 1300 is formed inside the large diameter part 1200 and may accommodate a part of the thermocouple 300 and the temperature sensing part 310 . In this case, a part of the thermocouple 300 may be disposed in the through hole 1400 .

The accommodating part 1300 may be filled with an adhesive. The adhesive attaches the cap 1000 to the end of the depression 120 on the upper surface of the disk 100 and at the same time fixes a part of the thermocouple 300 and the temperature sensing unit 310 accommodated in the receiving unit 1300 . can play a role

That is, the adhesive filled in the accommodating part 1300 may be cured to prevent a part of the thermocouple 300 and the temperature sensing part 310 from leaving the set arrangement position.

In addition, the adhesive filled in the accommodating part 1300 may inhibit the source material from flowing into the accommodating part 1300 and thus deposition occurring inside the accommodating part 1300 . The source material may be in communication with the accommodating part 1300 and may be introduced into the accommodating part 1300 through a gap formed in the cap 1000 .

The source material introduced into the accommodating unit 1300 may be deposited on the temperature sensing unit 310, and due to the deposition of the source material, the temperature sensing unit 310 may be formed on the disk ( 100) may not be accurately measured, and accordingly, an error may occur in temperature control in the substrate processing apparatus.

Therefore, in the embodiment, by filling the accommodating part 1300 with an adhesive to suppress the source material from flowing into the accommodating part 1300 , the temperature sensing unit 310 can accurately measure the temperature of the disk 100 . .

In this case, the adhesive may be made of a material having excellent heat resistance that can withstand even a high temperature atmosphere inside the chamber 20 , for example, a ceramic adhesive formed of a ceramic material.

In an embodiment, it may further include a stopper 2000 disposed in the accommodating part 1300 and attached to the thermocouple 300 . In this case, the stopper 2000 may be attached to the thermocouple 300 by welding, bonding, or the like.

In addition, as shown in FIG. 11 , the stopper 2000 may be provided, for example, in a block shape, but is not limited thereto.

The stopper 2000 is attached to the thermocouple 300 and arranged to prevent the thermocouple 300 from rotating or from being separated from the accommodating part 1300 through the through hole 1400, thereby sensing the temperature. By not allowing the part 310 to deviate from the designed position, the temperature sensing part 310 can accurately measure the temperature of the disk 100 .

12 is a perspective view showing a disk 100 according to another embodiment. 13 is an exploded view illustrating a part of FIG. 12 . 14 is a cross-sectional view illustrating a part of FIG. 12 . 15 is a cross-sectional view of FIG. 14 viewed from another direction.

With respect to the embodiment shown in FIG. 12 or less, for the sake of clarity, descriptions overlapping with the above will be omitted as much as possible.

12 to 15 , the substrate processing apparatus of the embodiment includes a disk 100 on which a plurality of susceptors 110 are disposed, a thermocouple 300 , a depression 120 , a cap 1000 , and a cover member. 600 and a fixing member 800 may be included.

The thermocouple 300 may be disposed inside the disk 100 , the temperature sensing unit 310 may be provided at one end, and the other end may be connected to the cable 400 .

The recessed part 120 may be recessed in the disk 100 in the radial direction of the disk 100 , and a part of the thermocouple 300 and the temperature sensing part 310 may be disposed.

At this time, the temperature sensing unit 310 is disposed between the susceptors 110 adjacent to each other among the plurality of susceptors 110 , and since at least one is disposed, the recessed unit 120 is the temperature sensing unit ( It may be formed on the disk 100 at a position corresponding to the arrangement position of the 310 .

In addition, since the temperature sensing unit 310 is arranged in plurality, and the plurality of temperature sensing units 310 may be radially arranged on the disk 100 , the recessed unit 120 is also the temperature sensing unit 310 . ) may be formed on the disk 100 in the number and arrangement corresponding to the number and arrangement form.

The cap 1000 may be disposed at an end of the recessed part 120 and accommodate the temperature sensing part 310 . Since the specific configuration of the cap 1000 has already been described in detail with reference to FIG. 11 and the like, it will be briefly described below.

The cap 1000 may include a small diameter portion 1100 , a large diameter portion 1200 , a receiving portion 1300 , and a through hole 1400 . The small-diameter portion 1100 may be inserted into the through hole 6100 formed in the cover member 600 and disposed such that the upper surface thereof is exposed.

The large-diameter portion 1200 is integrally formed with the small-diameter portion 1100, and between the small-diameter portion 1100 and the large-diameter portion 1200, the cap 1000 is separated to the outside through the through hole 6100. A step may be formed to restrain it.

The accommodating part 1300 is formed inside the large diameter part 1200 and may accommodate a part of the thermocouple 300 and the temperature sensing part 310 . The through hole 1400 may be formed to pass through the large diameter portion 1200 to communicate with the receiving portion 1300 , and the thermocouple 300 may be disposed therethrough.

The accommodating part 1300 may be filled with an adhesive. The adhesive attaches the cap 1000 to the end of the depression 120 on the upper surface of the disk 100 and at the same time fixes a part of the thermocouple 300 and the temperature sensing unit 310 accommodated in the receiving unit 1300 . can play a role

In addition, the adhesive filled in the accommodating part 1300 can suppress the source material from flowing into the accommodating part 1300 and deposition in the accommodating part 1300, and thus the temperature sensing part 310 is The temperature of the disk 100 can be accurately measured.

Meanwhile, in an embodiment, a stopper 2000 disposed in the receiving part 1300 and attached to the thermocouple 300 may be further included. In this case, the stopper 2000 may be attached to the thermocouple 300 by welding, bonding, etc., for example, and the stopper 2000 may be provided, for example, in a block shape, but is not limited thereto. .

The cover member 600 may be disposed to cover the depression 120 . When viewed from the top of the disk 100 , the area of the cover member 600 may be smaller than the area of the depression 120 .

Due to the difference in area, a tolerance EM may be formed between the side surface of the cover member 600 and the side surface of the recessed part 120 . By properly forming the tolerance EM, the cover member 600 can be easily attached to and detached from the disk 100 .

When the tolerance EM is absent or the width of the tolerance EM is very small, it may be difficult to mount the cover member 600 to the depression 120 of the disk 100 . In addition, when the cover member 600 is removed from the disk 100 , a source material is deposited in a narrow gap between the cover member 600 and the recessed portion 120 , and this source material exerts a strong adhesive force. , it is difficult to separate the cover member 600 from the disk 100 .

Accordingly, by forming the tolerance EM to have a sufficient width, the cover member 600 may be easily mounted on the recessed portion 120 of the disk 100 .

In addition, by forming the tolerance EM to have a sufficient width, the source material suppresses the strong adhesion of the cover member 600 to the disk 100 so that the cover member 600 is easily separated from the disk 100 . can do it In this case, it may be appropriate that the width of the tolerance EM is, for example, 1 mm or more.

The fixing member 800 may be coupled to the disk 100 in the central portion of the disk 100 and fix the cover member 600 . The fixing member 800, as shown in FIG. 12, is formed in a disk shape, and can be coupled to the disk 100 by a coupling mechanism.

Since the fixing member 800 is coupled to the disk 100 , the cover member 600 may be fixedly disposed in the depression 120 .

The cover member 600 may include a pressing part 601 and an extension part 602 . The pressing part 601 may overlap a part of the fixing member 800 and may be pressed by the fixing member 800 . A space in which the thermocouple 300 is disposed may be formed under the pressing part 601 .

The extension part 602 may extend from the pressing part 601 and cover the temperature sensing part 310 . In this case, a step ST having a shape corresponding to the side surface of the fixing member 800 may be formed between the pressing part 601 and the extension part 602 .

The step ST causes the fixing member 800 to press the cover member 600 in the radial direction of the disk 100 , so that the diameter of the disk 100 in a state in which the cover member 600 is coupled to the disk 100 . It is possible to suppress the occurrence of slip in the direction.

In addition, by suppressing the slip of the cover member 600, the slip of the cap 1000 disposed in the through hole 6100 formed in the cover member 600 can also be suppressed, and the temperature sensing unit ( 310) may be stably disposed at the designed arrangement position. Accordingly, the temperature sensing unit 310 may repeatedly measure the temperature of the same position of the disk 100 .

The through hole 6100 is formed at a position corresponding to the cap 1000 in the extension part 602 , and the cap 1000 may be inserted into the through hole 6100 . In this case, the small diameter portion 1100 of the cap 1000 may be inserted into the through hole 6100 .

16 is a diagram illustrating a disk 100 according to another embodiment. FIG. 17 is a view showing a part of FIG. 16 . As shown, in the embodiment, the through hole 6100 may not be formed in the cover member 600 .

By suppressing the source material from flowing into the cover member 600 through the through hole 6100 , the cover member 600 can be easily removed from the disk 100 , and It is possible to suppress the source material from adversely affecting the thermocouple 300 and the temperature sensing unit 310 .

At this time, although not shown, the cap 1000 is disposed inside the cover member 600 , and the temperature sensing unit 310 may be accommodated in the cap 1000 . In this case, the cap 1000 may be provided such that the upper surface of the cap 1000 is in direct contact with the cover member 600 , without being divided into the large-diameter portion 1200 and the small-diameter portion 1100 .

In addition, as described above, a tolerance EM is formed between the cover member 600 and the recessed portion 120, and the tolerance EM is formed to have a sufficient width, so that the cover member 600 is a disk ( 100) can be easily attached and detached. In this case, it may be appropriate that the width of the tolerance EM is, for example, 1 mm or more.

Although only a few have been described as described above in relation to the embodiments, various other forms of implementation are possible. The technical contents of the above-described embodiments may be combined in various forms unless they are incompatible with each other, and may be implemented as a new embodiment through this.

100: disk
110: susceptor
120: depression
200: shaft
300: thermocouple
310: temperature sensing unit
400: cable
500: coupling member
600: cover member
700: sealing part
710: cooling tube
800: fixing member

Claims (27)

a plurality of susceptors on which the substrate is seated;
a disk on which a plurality of the susceptors are disposed;
a shaft coupled to the disk and supporting the disk; and
Thermocouple disposed inside the disk
including,
The thermocouple is
A substrate processing apparatus comprising a temperature sensing unit provided at one end and disposed between the susceptors adjacent to each other. According to claim 1,
A first distance from the center of the disk to the temperature sensing unit is smaller than a second distance from the center of the disk to the center of the susceptor. According to claim 1,
a depression formed in the disk and in which a part of the thermocouple is disposed;
a cap disposed at an end of the recessed part and accommodating the temperature sensing part; and
A cover member coupled to the disk at a central portion of the disk and covering the recessed portion
Substrate processing apparatus, characterized in that it further comprises. 4. The method of claim 3,
The cover member has a through hole formed at a position corresponding to the cap,
The cap is a substrate processing apparatus, characterized in that inserted into the through hole. 5. The method of claim 4,
the cap is
a small-diameter portion inserted into the through-hole and the upper surface of which is exposed;
a large-diameter portion integrally formed with the small-diameter portion;
a receiving part formed inside the large diameter part and accommodating a part of the thermocouple and the temperature sensing part; and
A through hole formed to pass through the large-diameter portion to communicate with the receiving portion, and through which the thermocouple is disposed
A substrate processing apparatus comprising a. 6. The method of claim 5,
It is disposed in the receiving portion, further comprising a stopper (stopper) attached to the thermocouple,
A substrate processing apparatus, characterized in that the receiving portion is filled with a ceramic adhesive. a plurality of susceptors on which the substrate is seated;
a disk on which a plurality of the susceptors are disposed;
a shaft coupled to the disk and supporting the disk; and
a thermocouple disposed inside the disk and including a temperature sensing unit provided at a position adjacent to the edge of the substrate
including,
The thermocouple is
At least one of the plurality of susceptors is disposed between the susceptors adjacent to each other in the circumferential direction of the disk. delete 8. The method of claim 7,
The thermocouple is
A substrate processing apparatus, characterized in that the disk is disposed in plurality and disposed radially. ◈Claim 10 was abandoned when paying the registration fee.◈ 8. The method of claim 7,
The substrate processing apparatus, characterized in that the temperature sensing unit is located at one end of the thermocouple. 8. The method of claim 7,
The susceptor is formed by depression of the upper surface of the disk,
The substrate processing apparatus, characterized in that the temperature sensing unit is disposed at a position equal to or lower than the midpoint in the vertical direction of the side surface of the susceptor. delete ◈Claim 13 was abandoned when paying the registration fee.◈ 8. The method of claim 7,
The susceptor is formed by depression of the upper surface of the disk,
A length of a first line segment drawn from the center of the disk to the temperature sensing unit is smaller than a length of a second line segment drawn from the center of the disk to a center of the susceptor. delete delete ◈Claim 16 has been abandoned at the time of payment of the registration fee.◈ 8. The method of claim 7,
The substrate processing apparatus according to claim 1, further comprising a cable disposed inside the shaft and electrically connected to the thermocouple. 8. The method of claim 7,
a coupling member disposed in a depression formed in the disk; and
A cover member disposed in the depression and covering the coupling member
further comprising,
The temperature sensing unit,
A substrate processing apparatus, characterized in that it is disposed in a space formed between the coupling member and the cover member. 18. The method of claim 17,
The temperature sensing unit,
bonded to at least one of the coupling member and the cover member by an adhesive;
The adhesive is a substrate processing apparatus, characterized in that provided with a ceramic (ceramic) material. 8. The method of claim 1 or 7,
A sealing part disposed at a portion where the shaft passes through the lower wall of the chamber
A substrate processing apparatus comprising a. 20. The method of claim 19,
The substrate processing apparatus, characterized in that the sealing part is disposed inside the cooling pipe through which the refrigerant flows. delete delete delete 7. The method according to any one of claims 4 to 6,
a fixing member coupled to the disk at a central portion of the disk and fixing the cover member;
further comprising,
The temperature sensing unit,
A substrate processing apparatus disposed between the susceptors adjacent to each other. 25. The method of claim 24,
The cover member,
a pressing part overlapping a portion of the fixing member and being pressed by the fixing member; and
An extension part extending from the pressing part and covering the temperature sensing part
including,
A substrate processing apparatus, characterized in that a step having a shape corresponding to the side surface of the fixing member is formed between the pressing part and the extension part. 26. The method of claim 25,
The substrate processing apparatus, characterized in that the through hole is formed in a position corresponding to the cap in the extension portion. delete

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