KR102403060B1 - Apparatus and method for temperature relative value calculation - Google Patents

Abstract

In the apparatus for calculating a relative temperature for calibration according to an embodiment, a delay unit receiving a first clock signal having a first frequency and delaying the first clock signal to output the delay unit, the signal output by the delay unit and the Temperature relative value calculation for calculating a temperature relative value that changes according to temperature based on an operation signal obtained by calculating a predetermined signal corrected with respect to the first clock signal and a second clock signal having a second frequency lower than the first frequency may include wealth.

Description

Apparatus and method for calculating temperature relative value {APPARATUS AND METHOD FOR TEMPERATURE RELATIVE VALUE CALCULATION}

The present invention relates to an apparatus for calculating a temperature relative value for calibration that compensates sensor data based on a relative temperature value, and a method for calculating a relative temperature value for calibration.

In general, in the case of a sensor system, sensor data is sensed through a sensing resistor. At this time, in order to measure the resistance value of the sensing resistor, the resistance value of the sensing resistor is checked through a measuring resistor provided inside the semiconductor chip or outside the semiconductor chip. are doing

On the other hand, the sensing resistance that senses the data value of the sensor and the measurement resistance used to measure the sensing resistance change values depending on the temperature. Alternatively, background calibration is required.

However, as the operating time of the sensor increases recently, when the chip (which may be a semiconductor chip) and the sensor age, the resistance characteristics inside the sensor and the chip change. When obtaining data, an error occurred in sensor data measurement because resistance characteristics due to sensor and chip aging were not considered.

Accordingly, there is a need for a technology capable of compensating for a sensor data change value in consideration of resistance characteristics according to aging of sensors and chips.

Korean Patent Publication No. 10-0218339 (published on June 10, 1999)

An object of the present invention is to provide an apparatus for calculating a temperature relative value for calibration and a method for calculating a temperature relative value for calibration.

In addition, compensating the sensor data value in consideration of the resistance characteristic of the sensor inside the chip according to the temperature change through the device and method may be included in the problem to be solved by the present invention.

However, the problems to be solved of the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the following description. will be.

In the apparatus for calculating a relative temperature for calibration according to an embodiment, a delay unit receiving a first clock signal having a first frequency and delaying the first clock signal to output the delay unit, the signal output by the delay unit and the Temperature relative value calculation for calculating a temperature relative value that changes according to temperature based on an operation signal obtained by calculating a predetermined signal corrected with respect to the first clock signal and a second clock signal having a second frequency lower than the first frequency may include wealth.

In addition, the temperature relative value calculating unit includes an AND gate for performing an AND operation on the operation signal and the second clock signal, a counter unit for counting an output value of the AND gater, a plurality of current sources and at least based on the output values of the counter unit A current controller including a plurality of switches, one of which is switched so that the current provided from at least one of the plurality of current sources is collected, and a controller configured to calculate the relative temperature value based on the value collected by the current controller may include

Also, the controller may calculate the sensor internal resistance value that is changed according to the sensor temperature inside the chip based on the current adjusted by the current controller and the output voltage value of the current controller.

Also, the second clock signal may be generated based on a frequency division ratio in the controller.

In the method of calculating a relative temperature for calibration according to an embodiment, receiving a first clock signal having a first frequency and delaying the output of the first clock signal, the signal output by the delay unit and the first clock signal Calculating a temperature relative value that changes according to temperature based on a second clock signal having a second frequency lower than the first frequency and an operation signal obtained by calculating a predetermined signal corrected with respect to one clock signal have.

In addition, the calculating of the temperature relative value includes the steps of performing an AND operation on the operation signal and the second clock signal, counting the output value of the AND operation, and a current is It may include providing to be collected, and calculating the temperature relative value based on the collected current value.

Also, in the controlling step, the sensor internal resistance value that is changed according to the sensor temperature inside the chip may be calculated based on the current adjusted in the step of adjusting the current and the voltage value of the signal to which the current is adjusted.

Also, the second clock signal may be generated based on a frequency division ratio in the controller.

In a computer-readable recording medium according to an embodiment, as a computer-readable recording medium storing a computer program, the computer program, when executed by a processor, receives a first clock signal having a first frequency, delaying and outputting the first clock signal; an operation signal obtained by calculating the signal output by the delay unit and a predetermined signal corrected with respect to the first clock signal; and a second frequency lower than the first frequency 2 The method may include instructions for causing the processor to perform a method including calculating a temperature relative value that changes according to a temperature based on the clock signal.

In the computer program according to an embodiment, as a computer program stored in a computer-readable recording medium, when the computer program is executed by a processor, it receives a first clock signal having a first frequency and receives the first clock signal. Delaying and outputting a clock signal; a signal output from the delay unit; an operation signal obtained by calculating a predetermined signal corrected for the first clock signal; and a second clock signal having a second frequency lower than the first frequency The method may include instructions for causing the processor to perform a method including calculating a temperature relative value that changes according to temperature based on the .

According to an embodiment, the device for calculating the temperature relative value for calibration measures the resistance value of the sensor inside the chip that changes according to the temperature, and compensates the sensor internal data based on the measured resistance value, so the resistance due to aging of the chip or sensor Characteristics may be taken into account to compensate for sensor data.

In addition, since the circuit of the device for calculating the relative value of temperature for calibration may be partially digitally implemented, it is possible to operate the circuit of the device for calculating the relative value of the temperature for calibration with little power.

In addition, the existing sensor data compensation system communicates with the sensors located in each zone of the sensor system and performs calibration based on the data of each sensor. The circuit configuration is simplified and the cost can be greatly reduced.

1 is a block diagram of a sensor data compensation system according to an embodiment.
2 is a configuration diagram of a sensor system according to an embodiment.
3 is a block diagram of an apparatus for calculating a temperature relative value for calibration according to an exemplary embodiment.
4 is a circuit diagram of an apparatus for calculating a relative temperature for calibration according to an exemplary embodiment.
5 is a circuit diagram of an in-chip data calibration apparatus according to an exemplary embodiment.
6 is a circuit diagram of an in-chip data calibration apparatus according to an exemplary embodiment.
7A to 7C are circuit diagrams of a mode conversion unit according to an exemplary embodiment.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

In describing the embodiments of the present invention, if it is determined that a detailed description of a well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, the terms to be described later are terms defined in consideration of functions in an embodiment of the present invention, which may vary according to intentions or customs of users and operators. Therefore, the definition should be made based on the content throughout this specification.

1 is a configuration diagram of a sensor data compensation system, and FIG. 2 is a configuration diagram of a sensor system.

First, referring to FIG. 1 , the sensor data compensation system 1 may compensate the data of the sensor system, and more specifically, the temperature relative value calculation device 100 for calibration, the in-chip data calibration device 200, and the outside of the chip. It may include a sensor data calibration apparatus 300 and a mode conversion apparatus 400 .

The temperature relative value calculating apparatus 100 for calibration may calculate a temperature relative value that changes according to the temperature of a sensor inside a chip (which may be a semiconductor chip), and compensate the data of the sensor inside the chip based on the relative temperature value.

The in-chip data calibration apparatus 200 may calculate a relative value of the in-chip data and compensate the in-chip data based on the relative value of the in-chip data.

The off-chip sensor data calibration apparatus 300 may calculate a relative value of external sensor data independently connected to the chip, and compensate the off-chip sensor data based on the relative value of the external sensor data.

The mode converter 400 may change the sensor mode of the sensor outside the chip.

Meanwhile, referring to FIG. 2 , the sensor system 50 may include a chip 10 (which may be a semiconductor chip), an internal sensor 20 , and an external sensor 30 .

As an embodiment, the sensor 20 inside the chip 10 included in the sensor system 50 may be a temperature sensor included in the chip 10 , and the sensor 30 outside the chip 10 is the chip 10 . ) may be a gas sensor independently connected to, but is not limited thereto.

3 is a diagram illustrating a configuration of an apparatus for calculating a temperature relative value for calibration according to an embodiment of the present invention. The temperature relative value calculator 100 for calibration of FIG. 3 may include a delay unit 110 and a temperature relative value calculator 120 . However, since the temperature relative value calculating apparatus 100 for calibration of FIG. 3 is only an embodiment of the present invention, the spirit of the present invention is not interpreted as being limited by FIG. 3 .

In this case, according to an embodiment, the apparatus 100 for calculating the relative temperature for calibration may not include at least one of the components illustrated in FIG. 3 and/or may additionally include a configuration not illustrated in FIG. 3 . In addition, each of the components included in the apparatus 100 for calculating the relative temperature for calibration may be implemented in the form of a software module or a hardware module, or a combination of a software module and a hardware module.

The delay unit 110 may receive the first clock signal and delay the first clock signal to output it.

Here, the first clock signal may be a signal input from the outside of the chip 10 having a first frequency, for example, the first frequency may be 200 kHz, but is not limited thereto.

The temperature relative value calculating unit 120 is a temperature relative that changes according to the temperature based on an operation signal obtained by calculating the signal output from the delay unit 110 and a predetermined signal corrected for the first clock signal and the second clock signal. value can be calculated.

Here, the second clock signal may have a second frequency lower than the first frequency, for example, the second frequency may be 199.1 kHz, but is not limited thereto.

More specifically, a detailed description of the apparatus 100 for calculating the relative temperature value for calibration will be described later in detail with reference to FIG. 4 .

4 is a circuit diagram of a temperature relative value calculating device for calibration.

Referring to FIG. 4 , the delay unit 110 may include a plurality of delay buffers 105 , and may receive an output signal of the first buffer 101 receiving the first clock signal.

In more detail, the delay unit 110 receives the output signal of the first buffer 101 receiving the first clock signal, and passes the output signal of the first buffer 101 through the plurality of delay buffers 105 to 1 The output signal of the buffer 101 may be delayed.

Meanwhile, in the plurality of delay buffers 105 of the delay unit 110 , the degree of delay of the signal input from the delay unit 110 may vary according to a change in temperature. For example, in the case of 27 degrees, the plurality of delay buffers Comparing the signal passing through 105 and the signal passing through the plurality of delay buffers 105 at 80 degrees, the signal passing through the plurality of delay buffers 105 at 80 degrees is delayed and output can be

As an embodiment, when the plurality of delay buffers 105 include 19 delay buffers, the output signal of the first buffer 101 passes through the first delay buffer (D<0>), compared to the 19th delay buffer When passing (D<18>), the degree of delay may increase. Also, as the temperature increases, when the 19th delay buffer is passed (D<18>), the delay of the output signal of the first buffer 101 may be increased.

The temperature relative value calculator 120 may include an AND gate 121 , a counter 123 , a current controller 127 , and a controller 130 .

AND gate 121 is a temperature pulse signal (P _Temp ) obtained by AND operation of an output value (D<18>) of the delay unit 110 and an inverter value (CLK _INV ) of an output value of the first buffer 101 and the second clock signal CLK _CAL may be received and an AND operation may be performed.

As an embodiment, the second clock signal CLK _CAL may be generated by itself based on a frequency division rate in the control unit 130 (microcontroller unit: microcontroller unit), but is not limited thereto.

On the other hand, the temperature pulse signal P _Temp is a pulse signal according to a temperature. At a low temperature, the pulse width of the pulse signal is narrow, and at a high temperature, the pulse width of the pulse signal may be wide. For example, when the pulse width of the temperature pulse signal (P _{Temp ) in the case of -30 degrees is compared with the pulse width of the temperature pulse signal (P Temp )} in the case of 80 degrees, the temperature pulse signal (P) in the case of -30 degrees The pulse width may be narrower than that of the temperature pulse signal P _Temp when _Temp is 80 degrees.

In addition, the value calculated by the AND gate 121 may be a point CLK _COUNT at which the temperature pulse signal P _Temp and the second clock signal CLK _CAL become “1” at the same time.

In more detail, in order to confirm the temperature pulse signal (P _Temp ), at least the frequency of the first clock signal having a first frequency (eg, may be 200 kHz) input to the first buffer 101 should be higher than the frequency of the AND gate ( 121), by performing an AND operation on the second clock signal CLK _CAL and the temperature pulse signal P _Temp having a second frequency lower than the first frequency (eg, may be 199.1 kHz), the second frequency is Since it is lower than the first frequency, a delay between the temperature pulse signal P _Temp and the second clun signal CLK _CAL may occur.

Therefore, the point at which the delay between the temperature pulse signal (P _Temp ) and the second frequency occurs, that is, the point at which the temperature pulse signal (P _Temp ) and the second clock signal (CLK _CAL ) become “1” at the same time (CLK _COUNT ) Through this, the temperature pulse signal (P _Temp ) can be checked.

The counter unit 123 may include an up counter (UP-COUNTER), and in more detail, count the output value CLK _COUNT of the AND gate 121 to check the temperature pulse signal P _Temp .

Meanwhile, the information counted by the counter unit 123 may be 8-bit information, but is not limited thereto.

The current controller 127 may include a plurality of current sources 125 and a plurality of switches 126 . On the other hand, the plurality of current sources 125 and the plurality of switches 127 are connected in series with each other, and the plurality of switches 127 may be connected to the resistor 135, R _CAL of the sensor 20 inside the chip 10 , The present invention is not limited thereto.

The plurality of current sources 125 may be selectively connected to the plurality of switches 126 as the plurality of switches 126 are switched to collect currents.

At least one of the plurality of switches 126 may be switched based on an output value of the counter unit 123 to collect currents provided from at least one of the plurality of current sources 125 .

In more detail, the current control unit 127 receives the output value of the counter unit 123 and receives a temperature signal from the decoder unit 124 that extracts temperature information from the output value of the counter unit 123 . can In this case, the decoder unit 124 may extract a signal related to a temperature of 5 bits among the signals of 8 bits input from the counter unit 123 , but is not limited thereto.

As an embodiment, the decoder unit 124 may have a preset current value that changes according to the temperature, receives 8-bit information from the counter 123, and converts 5-bit information related to temperature to the current control unit ( 127) can be entered. At this time, the current control unit 127 receives 5-bit temperature information from the decoder unit 124 and the plurality of switches 127 may be switched to be converted into a current preset in the decoder unit 124 , The present invention is not limited thereto.

The controller 130 may calculate a temperature relative value based on the current value collected by the current controller 127 .

In more detail, a signal passing the current collected by switching the plurality of switches 126 of the current controller 127 may be input to the second buffer 128 . At this time, the signal of the second buffer 128 is input to the analog-to-digital converter 129 and converted into a digital signal, and the controller 130 receives the digital signal D _CAL <0:9> and converts it to the digital signal. Based on the temperature relative value may be calculated, but is not limited thereto.

On the other hand, the analog-to-digital converter 129 and the controller 130 may be located outside the chip 10 , for example, but is not limited thereto, and the analog-to-digital converter 129 is located inside the chip. A signal of the second buffer 128 may be received.

As an embodiment, the controller 130 may control the sensor 20 inside the chip 10 based on the current collected by the current controller 127 and the voltage value of the digital signal input from the analog-to-digital converter 129 . ) It is possible to calculate the internal resistance value 135, R _CAL of the sensor 20 that is changed according to the temperature, and based on the calculated resistance value R _CAL , the data of the sensor 20 inside the chip may be compensated, but limited thereto it is not going to be

5 is a circuit diagram of an in-chip data calibration device.

Referring to FIG. 5 , the in-chip data calibration apparatus 200 may include a variable resistor 210 , a variable current source 220 , and an in-chip data controller 230 .

Here, the variable resistor 210 and the variable current source 220 may be located outside the chip 10 and may be controlled through the controller 130 (MCU), but is not limited thereto.

The chip internal data control unit 230 may operate the chip 10 internal data correction mode for correcting the internal data of the chip 10 . In this case, the internal data correction mode of the chip 10 may compensate the internal data of the chip 10 based on the resistance values and current values of the variable resistor 210 and the variable current source 220 .

In more detail, the chip internal data control unit 230 operates the chip 10 internal data correction mode, and at this time, the control unit 130 (MCU) controls the initial resistance values of the variable resistor 210 and the variable current source 220 and Each of the initial current values can be measured and stored.

Also, the controller 130 (MCU) may measure the voltage of the signal passing through the variable current source 220 through the analog-to-digital converter 129 (ADC) while varying the value of the variable current source 220 . In this case, the load may be fixed to the resistance R _CAL of the sensor inside the chip, but is not limited thereto.

Furthermore, the controller 130 (MCU) applies the fixed current I _CAL to the variable resistor 210 and at the same time varies the resistance value of the variable resistor 210 and converts the variable resistance value to the analog-to-digital converter 129 . , ADC).

Finally, after the storage of the initial resistance value and the initial current value of the variable resistor 210 and the variable current source 220 is finished, the controller 130 (MCU) performs a sensor operation and then the variable resistor 210 and the variable current source 220 . ), the degree of aging and coefficient of internal data of the chip 10 is extracted based on the result of comparing the measured resistance and current values with the initial resistance value and the initial current value, respectively, and this is sensed inside the chip 10 It can be compensated by applying it to data.

6 is a circuit diagram of an off-chip sensor data calibration device.

Referring to FIG. 6 , the off-chip sensor data calibration apparatus 300 may include an amplifier 310 and an off-chip sensor data compensator (not shown).

In more detail, the off-chip sensor data compensator (not shown) may execute an off-chip sensor data compensation mode for compensating the off-chip sensor data.

The off-chip sensor data compensator (not shown) is connected in parallel with the on-chip sensor resistor (R _Sensor ) when the off-chip sensor data compensation mode is executed, and the sensing resistor 305 has one side connected to the power supply (VDD). , R _Heat ) and the connected switch (307, S _Cal ) may be turned on. At this time, a current flows through the sensor resistor 135, R _Cal inside the chip, and the sensor resistor 135, R _Cal and the sensing resistor 305, R _Heat inside the chip may be connected in series.

In addition, the voltage applied to the sensing resistor 305, R _Heat is amplified through the amplifier 310 connected to both sides of the sensing resistor 305, R _Heat , and the amplified voltage can be input to the analog-to-digital converter 129. have. At this time, the output value of the analog-to-digital converter 129 is transmitted to the control unit 130 (MCU), and the control unit 130 (MCU) senses the resistance value based on the amplified voltage value and the sensor resistance value (R _Cal ) inside the chip. (305, R _Heat ) can be calculated.

Furthermore, the controller 130 (MCU) compensates the data value of the external sensor 30 based on the compared difference by comparing the calculated sensing resistance value 305, R _Heat , and a preset sensing resistance value R _{Heat_cal} . can do.

7A to 7C are circuit diagrams of a mode conversion unit.

7A to 7C , the mode conversion unit 400 may change the mode of the external sensor 30 of the chip 10 .

The mode converter 400 may include a plurality of current sources 410 , 420 , 430 , a plurality of switching elements (not shown), variable resistors 445 and 447 , a sensing resistor 450 , and a mode controller 460 .

In addition, the mode conversion unit 400 turns on or off a plurality of switching elements (not shown) in the mode control unit 460 according to the mode of the external sensor 30 of the chip 10 to turn on or off the circuit of the mode conversion unit 400 . It is possible to selectively control current to flow.

Hereinafter, as an embodiment, when the external sensor 30 of the chip 10 is a gas sensor, a method of converting to a harmful gas mode and an explosive gas mode will be described later.

First, in the case of the harmful gas mode, a resistance type sensor can be used in the circuit of the mode conversion unit 400 , and the first switch 401 , S _GAS1 connected to the power source VDD is turned on, and the variable resistance ( 445 , R _DAC ), 8-bit sensor 30 information can be obtained from the mode control unit 460 .

At this time, the mode control unit 460 turns on the second switch (402, S _GAS2 ) and the third switch (403, S _GAS2 ) of the first current source (410, I _DAC ) and the second current source (420, I _DAC ) Current can be controlled to flow through the variable resistor (445, R _DAC ) and the sensing resistor (450, R _SENSOR ).

On the other hand, when the second switch 402, S _GAS2 and the third switch 403, S _GAS2 are turned on in the mode control unit 460 in this way, the current may be adjusted to be close to the fixed voltage (V _CM ), at this time A reference voltage V _REF and a sensing voltage V _SENSE may be generated.

In addition, the reference voltage (V _REF ) and the sensing voltage (V _SENSE ) turn on the switches 463, 465, S _CDS in the mode control unit 460, and pass through the CDS circuits 464 and 466 to the analog-to-digital converter ( 129), it is possible to check the sensor data value outside the chip in the harmful gas mode.

In the case of the explosive gas mode, a current-type sensor may be used in the circuit of the mode conversion unit 400 , and the fourth switch 407, S _EXPLO ) and the fifth switch 409, S _EXPLO connected to the power supply (VDD) ) is turned on, and by adjusting the variable resistors 447 and R _DAC , 8-bit sensor 30 information can be obtained from the mode control unit 460 .

At this time, the mode control unit 460 turns on the sixth switch 449, S _EXPLO so that the current of the first current source 410, I _DAC and the third current source 430, I _SENSOR is changed to the variable resistor 445, 447, R _DAC ), and the sensing resistor 450, R _SENSOR , the current can be adjusted so that it approaches the fixed voltage V _CM , at which time the reference voltage V _REF and the sensing voltage V _SENSE can be generated. have.

On the other hand, the reference voltage (V _REF ) and the sensing voltage (V _SENSE ) turn on the switches 463, 465, S _CDS in the mode control unit 460, and pass through the CDS circuits 464 and 466 to the analog-to-digital converter ( 129), it is possible to check the sensor data value outside the chip in the case of explosive gas mode.

As described above, according to an embodiment, the device for calculating the temperature relative value for calibration measures the resistance value of the sensor inside the chip that changes according to the temperature, and compensates the internal data of the sensor based on the measured resistance value. The sensor data may be compensated by considering the resistance characteristics according to the aging of the sensor.

In addition, since the circuit of the device for calculating the relative value of temperature for calibration may be partially digitally implemented, it is possible to operate the circuit of the device for calculating the relative value of the temperature for calibration with little power.

In addition, the existing sensor data compensation system communicates with the sensors located in each zone of the sensor system and performs calibration based on the data of each sensor. The circuit configuration is simplified and the cost can be greatly reduced.

The above description is merely illustrative of the technical idea of the present invention, and various modifications and variations will be possible without departing from the essential quality of the present invention by those skilled in the art to which the present invention pertains. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

1: Sensor data compensation system
100: temperature relative value calculation device for calibration
110: delay unit
120: temperature relative value calculation unit
200: chip internal data calibration device
300: off-chip sensor data calibration device
400: mode conversion device

Claims (10)

In the calibration temperature relative value calculating device for calculating the temperature relative value of the sensor inside the chip,
a delay unit receiving a first clock signal having a first frequency input from the outside of the chip and delaying the first clock signal to output a delay signal;
A temperature pulse signal obtained by performing a first AND operation on the delay signal and the first clock signal, a second clock signal obtained by performing a second AND operation on a second clock signal, and the second clock having a second frequency lower than the first frequency Based on the signal, comprising a temperature relative value calculation unit for calculating a temperature relative value that changes according to the temperature of the sensor inside the chip
Temperature relative value calculator for calibration. The method of claim 1,
The temperature relative value calculation unit,
an AND gate for performing an AND operation on the operation signal and the second clock signal;
a counter for counting the output value of the AND gate;
A current control unit comprising a plurality of current sources and a plurality of switches that are switched based on an output value of the counter unit so that the current provided from at least one of the plurality of current sources is collected;
A control unit for calculating the temperature relative value based on the value collected by the current control unit;
Temperature relative value calculator for calibration. 3. The method of claim 2,
The control unit is
The sensor internal resistance value that changes according to the sensor temperature inside the chip is calculated based on the current adjusted by the current control unit and the output voltage value of the current control unit, and the chip internal sensor data based on the calculated resistance value to compensate
Temperature relative value calculator for calibration. The method of claim 1,
The second clock signal is
generated based on the division rate in the temperature relative value calculation device for calibration
Temperature relative value calculator for calibration. In the method of calculating a relative temperature for calibration performed by a temperature relative value calculation device for calibration for calculating a temperature relative value of a sensor inside a chip, the method comprising:
receiving a first clock signal having a first frequency input from outside the chip, delaying the first clock signal to output a delay signal;
A temperature pulse signal obtained by performing a first AND operation on the delay signal and the first clock signal, a second clock signal obtained by performing a second AND operation on a second clock signal, and the second clock having a second frequency lower than the first frequency based on the signal, calculating a temperature relative value that changes according to the temperature of the sensor inside the chip
How to calculate relative temperature for calibration. 6. The method of claim 5,
Calculating the temperature relative value comprises:
performing an AND operation on the operation signal and the second clock signal;
counting the output value of the AND operation;
providing a current to be collected based on the output value of the counting step;
Comprising the step of calculating the temperature relative value based on the combined current value
How to calculate relative temperature for calibration. 7. The method of claim 6,
After calculating the temperature compensation value,
Calculate the sensor internal resistance value that changes according to the sensor temperature inside the chip based on the current collected in the step of collecting the current and the voltage value of the signal from which the current is collected, and based on the calculated sensor internal resistance value and compensating for the sensor data inside the chip.
How to calculate relative temperature for calibration. 6. The method of claim 5,
The second clock signal is
generated based on the division rate in the temperature relative value calculation device for calibration
How to calculate relative temperature for calibration. As a computer-readable recording medium storing a computer program,
The computer program, when executed by a processor,
receiving a first clock signal having a first frequency input from outside the chip, delaying the first clock signal to output a delay signal;
A temperature pulse signal obtained by performing a first AND operation on the delay signal and the first clock signal, a second clock signal obtained by performing a second AND operation on a second clock signal, and the second clock having a second frequency lower than the first frequency Including instructions for causing the processor to perform a method including calculating a temperature relative value that changes according to the temperature of the sensor inside the chip based on the signal
computer readable recording medium. As a computer program stored in a computer-readable recording medium,
The computer program, when executed by a processor,
receiving a first clock signal having a first frequency input from outside the chip, delaying the first clock signal to output a delay signal;
A temperature pulse signal obtained by performing a first AND operation on the delay signal and the first clock signal, a second clock signal obtained by performing a second AND operation on a second clock signal, and the second clock having a second frequency lower than the first frequency Including instructions for causing the processor to perform a method including calculating a temperature relative value that changes according to the temperature of the sensor inside the chip, based on the signal
computer program.

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