KR102398356B1 - Deposition apparatus - Google Patents

Abstract

The present invention is for guiding a deposition material that has passed through a nozzle to a deposition target, and the guide for guiding the deposition material to a deposition target includes an outer guide having a space formed therein, and a passage positioned in the space and through which the deposition material passes. The inner guide includes a formed inner guide, and the inner guide may include a lower guide having a constant cross-sectional area of the passage, and an upper guide bent by the lower guide unit and having a cross-sectional area of the passage gradually expanded.

Description

Deposition apparatus

The present invention relates to a deposition apparatus, and to a deposition apparatus for depositing a deposition material as an object to be deposited.

Deposition is a method of coating gaseous particles with a thin solid film on the surface of an object such as metal or glass.

Recently, as organic light emitting diodes (OLED) displays are increasingly used in electronic devices such as TVs and mobile phones, research on devices and processes for manufacturing OLED display panels is active. In particular, the OLED display panel manufacturing process includes a process of depositing an organic material on a glass substrate in a vacuum state.

Specifically, the deposition process includes a process of heating a crucible in which the organic material is accommodated to evaporate the organic material in a gaseous state, and a process in which the gaseous organic material passes through a nozzle and is deposited on a substrate.

In this case, the gaseous organic material should be uniformly deposited on the substrate. Accordingly, the deposition apparatus must uniformly guide the gaseous organic material passing through the plurality of nozzles to each area of the substrate.

If the organic material in the gaseous state that has passed through a plurality of nozzles is not properly guided, a thin film with an uneven surface is formed or a clogging phenomenon that blocks the nozzle inlet occurs, so that the deposition process is not performed smoothly, or it is attached to other places. Problems such as interfering with the path of organic matter may occur.

SUMMARY OF THE INVENTION The present invention aims to solve the above and other problems.

An object of the present invention is to provide a deposition apparatus for guiding the movement of a deposition material so that the deposition material passing through a nozzle is uniformly deposited on an object to be deposited.

A deposition apparatus according to an embodiment of the present invention includes at least one nozzle for discharging a deposition material filled in at least one or more crucibles, and a guide for guiding the deposition material to an object to be deposited, wherein the guide is an outer guide having a space therein and an inner guide positioned in the space and having a passage through which the deposition material passes therein, wherein the inner guide includes a lower guide portion having a constant cross-sectional area of the passage, and an upper guide bent by the lower guide portion and gradually expanding the cross-sectional area of the passage may include wealth.

A cooling channel through which the cooling fluid passes may be formed in the outer guide.

The outer guide may include a support plate supporting the inner guide, and the inner guide may be disposed on an upper surface of the support plate.

A plurality of nozzles are disposed to be spaced apart from each other, and the plurality of nozzles includes a pair of outer nozzles disposed to be spaced apart in the horizontal direction, and a center nozzle disposed between the pair of outer nozzles, and the outlet of the center nozzle is directed toward the passage. can

The heat transfer coefficient of the outer guide may be lower than the heat transfer coefficient of the inner guide.

The inner guide may include a plurality of guide members forming a passage, and at least one of the plurality of guide members may be arranged to be movable in a horizontal direction so that the size of the passage can be changed.

The upper guide unit may be rotatably connected to the lower guide unit to allow angle adjustment.

The sub-guide may further include a sub-guide disposed on an upper portion of the outer guide to be spaced apart from the inner guide and having an opening through which the deposition material moves.

The opening may be larger than the passageway.

According to an embodiment of the present invention, there is an advantage that the inner guide can be protected by the outer guide. In addition, the outer guide blocks the deposition material from being sprayed into areas other than the deposition target, thereby lowering the degree of contamination of the chamber, and has the advantage of easy maintenance because the replacement cycle can be extended.

In addition, the deposition material guided by the lower guide part of the inner guide can be widely diffused while passing through the inside of the upper guide part of the inner guide. There are advantages that can be

In addition, the cooling channel formed in the outer guide can cool the outer guide, there is an advantage that can minimize the temperature rise of the vapor-deposited object that may be generated when the outer guide is high temperature.

In addition, there is an advantage in that the width of the movement path of the deposition material can be adjusted according to the type of deposition material or the size of the deposition material, and it is possible to efficiently respond to various deposition materials or deposition materials having different sizes.

In addition, the area in which the deposition material is deposited can be determined by the area of the opening of the sub guide, which has the advantage of further increasing reliability, and can minimize leakage of the deposition material through the gap between the outer guide and the deposition target. There is an advantage.

1 is a view showing a top view of a deposition apparatus system according to an embodiment of the present invention.
2 is a view showing a side view of a deposition apparatus system according to an embodiment of the present invention.
3 is a perspective view of a deposition apparatus according to an embodiment of the present invention.
4 is an exploded perspective view of a deposition apparatus according to an embodiment of the present invention.
5 is a perspective view of a guide according to an embodiment of the present invention.
6 is a view showing a nozzle cover according to an embodiment of the present invention.
7 is a perspective view of a crucible according to an embodiment of the present invention.
8 is a vertical cross-sectional view of a crucible according to an embodiment of the present invention.
9 is a perspective view of a heater unit according to an embodiment of the present invention.
10 is an exploded perspective view of a heater unit according to an embodiment of the present invention.
11 is a perspective view illustrating a cooling unit accommodating a heater unit according to an embodiment of the present invention.
12 is a view showing the inside of the guide according to an embodiment of the present invention.
13 is a view illustrating the outer guide shown in FIG. 12 .
14 is a cross-sectional view AA′ of the guide shown in FIG. 12 .
15 is a perspective view of an inner guide according to an embodiment of the present invention.
16 is a view illustrating a state in which the size of a passage formed in an inner guide according to an embodiment of the present invention is changed.
17 is a view illustrating a state in which an exit angle of a passage formed in an inner guide is varied according to an embodiment of the present invention.
18 is a view showing a sub guide according to an embodiment of the present invention.
19 is a diagram illustrating a state in which an outer guide, an inner guide, and a sub guide guide a path of a deposition material according to an embodiment of the present invention.
20 is a view showing an inner guide formed of a heat pipe according to another embodiment of the present invention.

Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings.

A deposition apparatus system according to an embodiment of the present invention will be described with reference to FIGS. 1 to 2 . 1 is a diagram illustrating a deposition apparatus system according to an embodiment of the present invention as viewed from above, and FIG. 2 is a diagram illustrating a side view of the deposition apparatus system according to an embodiment of the present invention.

1 to 2 , a deposition apparatus system 1 according to an embodiment of the present invention includes a support 10 , first drivers 11 and 12 positioned on the support 10 , and a first driver (11) The second driving unit 13 located on (12), located on the second driving unit 13, and moved by at least one of the first driving unit 11, 12 and the second driving unit 13 It includes a deposition apparatus 100, at least one or more vapor-deposited objects 14 and 15 to which a thin film material evaporated in the deposition apparatus 100 is attached, and an aligner 16 for fixing the vapor-deposited objects 14 and 15. can do.

The support part 10 may support the first driving part 11 and 12 , the second driving part 13 , and the deposition apparatus 100 . More specifically, the first driving units 11 and 12 are positioned on the support unit 10 , the second driving unit 13 is positioned on the first driving units 11 and 12 , and the deposition is performed on the second driving unit 13 . The device 100 may be located.

The first driving units 11 and 12 may be disposed on both sides of the support unit 10 .

A linear motor (not shown) is provided in the first driving units 11 and 12 to horizontally move the second driving unit 13 positioned on the first driving units 11 and 12 . In particular, the first driving units 11 and 12 may move the second driving unit 13 in one direction of the support unit 10 .

A linear motor (not shown) is provided in the second driving unit 13 to move the deposition apparatus 100 positioned on the second driving unit 13 . The driving direction of the second driving unit 13 may be a direction perpendicular to the driving direction of the first driving units 11 and 12 .

The deposition apparatus 100 may move on the support unit 10 by driving the first driving units 11 and 12 and the second driving unit 13 .

The deposition apparatus system 1 may include at least one or more vapor-deposited objects 14 and 15 . In the examples of FIGS. 1 and 2 , the deposition apparatus system 1 includes the first vapor-deposited object 14 and the second vapor-deposited object 15 as an example, but this is merely exemplary.

The vapor-deposited objects 14 and 15 may include a glass substrate.

At least one or more vapor-deposited objects 14 and 15 may be fixed by the aligner 16 . The vapor-deposited objects 14 and 15 may be disposed above the deposition apparatus 100 , so that a deposition material evaporated in the deposition apparatus 100 may be deposited on lower surfaces of the vapor-deposited objects 14 and 15 .

The deposition apparatus 100 may move on the support part 10 by the first driving part 11 and the second driving part 13 , and at least one of the deposition apparatus 100 positioned above the deposition apparatus 100 while moving on the support part 10 . A deposition material may be deposited on the deposition target 14 and 15 .

The support part 10 , the first driving part 11 , 12 and the second driving part 13 , the deposition apparatus 100 , at least one to-be-deposited object 14 , 15 , and the aligner 16 are provided in a vacuum chamber 2 . ) can be accommodated inside the

Next, the deposition apparatus 100 according to an embodiment of the present invention will be described in detail.

3 is a perspective view of a deposition apparatus according to an embodiment of the present invention, and FIG. 4 is an exploded perspective view of the deposition apparatus according to an embodiment of the present invention.

3 to 4 , the deposition apparatus 100 according to an embodiment of the present invention includes a moving unit 102 , a cooling unit 120 , a heater unit 130 accommodated in the cooling unit 120 , A crucible (140, crucible) accommodated in the inside of the heater unit 130, a nozzle cover 150 disposed on the upper surface of the crucible 140, and a guide 110 disposed on the upper surface of the nozzle cover 150 may include. there is.

In addition to the configurations listed above, the deposition apparatus 100 may further include at least one of an ATM box 101 and a QCM sensor 103 . However, in the deposition apparatus 100 according to the present invention, at least one of the ATM box 101 and the QCM sensor 103 may be omitted.

The moving unit 102 may be disposed on the second driving unit 13 . Accordingly, as the second driving unit 13 moves the moving unit 102 , the deposition apparatus 100 moves.

An ATM box 101 may be disposed in the mobile unit 102 . The ATM box 101 may accommodate electrical devices such as cables, sensors, and circuits of the deposition apparatus 100 . For example, the inside of the ATM box 101 may accommodate a cable connected to the QCM sensor 103 , a cable 139 connected to the heater unit 138 , a cable connected to a cooling channel (not shown), and the like. Accordingly, it is possible to minimize the problem that the cable connected to the deposition apparatus 100 interferes with the movement of the deposition apparatus 100 or interferes with the path of the deposition material.

The cooling unit 120 may block heat emitted from the heater unit 130 to heat the deposition material from being emitted to the outside of the deposition apparatus 100 .

An accommodating space is formed inside the cooling unit 120 , and the heater unit 130 may be disposed in the receiving space of the cooling unit 120 .

The cooling unit 120 may minimize leakage of heat emitted by the heater unit 130 accommodated therein to the outside.

The heater unit 130 may be accommodated in the inner space of the cooling unit 120 .

An accommodating space may be formed inside the heater unit 130, and a heater unit 138 (refer to FIG. 10) that emits heat and the crucible 140 may be accommodated in the accommodating space of the heater unit 130. .

Specifically, the heater unit 138 may be accommodated along the inner circumference of the heater unit 130 , and the crucible 140 may be accommodated inside the heater unit 138 .

Accordingly, the heater unit 138 of the heater unit 130 may emit heat, and the heat emitted from the heater unit 138 may heat the crucible 140 .

Meanwhile, the heater unit 130 may include a reflector 135 (refer to FIG. 10 ) that reflects heat emitted from the heater unit 138 . The reflector 135 may form an outer surface of the heater unit 130 . That is, the heater unit 130 includes a reflector 135 , a heater unit 138 , and a crucible 140 , the heater unit 138 is located inside the reflector 135 , and the inside of the heater unit 138 . The crucible 140 may be disposed to be located.

The reflector 135 may reflect heat emitted from the heater unit 138 in an inner direction of the heater unit 130 , and the reflected heat may further heat the crucible 140 . Accordingly, the power consumption used by the heater unit 138 to dissipate heat can be reduced.

The crucible 140 may accommodate the deposition raw material 3 (refer to FIG. 8 ) therein. When the crucible 140 is heated, the deposition raw material 3 accommodated in the crucible 140 may be evaporated into a deposition material 4 (refer to FIG. 8 ).

Here, the deposition raw material 3 is a material that is filled in the crucible 140 to be deposited on at least one or more of the deposition materials 14 and 15 , and represents a material in a state before being evaporated into the deposition material 4 . The deposition material 4 is a gaseous material in which the deposition raw material 3 in the liquid state is evaporated, and indicates a material that can be deposited on at least one or more objects 14 and 15 to be inspected. For convenience of description, this is merely a name for distinguishing between a liquid state material and a gaseous material, and thus does not need to be limited thereto.

At least one nozzle 141 and 142 (refer to FIG. 7 ) having a hole through which the deposition material 4 can pass may be positioned on the crucible 140 . The deposition material 4 evaporated inside the crucible 140 may pass through the nozzles 141 and 142 and be sprayed to the guide 110 .

The guide 110 may guide the deposition material 4 passing through the nozzles 141 and 142 toward the deposition target 14 and 15 . Also, the guide 110 may guide the deposition material 4 passing through the nozzles 141 and 142 to be uniformly deposited on the deposition target 14 and 15 .

Meanwhile, a nozzle cover 150 may be positioned between the crucible 140 and the guide 110 . The nozzle cover 150 may be a cover that covers the periphery of the nozzles 141 and 142 formed on the upper portion of the crucible 140 . The nozzle cover 150 minimizes the transfer of heat formed in the crucible 140 to the guide 110 , thereby minimizing the influence of the guide 110 heating on the vapor-deposited objects 14 and 15 .

Hereinafter, each configuration of the deposition apparatus 100 described above will be described in detail.

First, Figure 5 is a perspective view of a guide according to an embodiment of the present invention.

The guide 110 may have a hexahedral shape, and at least one surface may have a hole formed therein.

Specifically, at least one injection hole 112 through which the deposition material 4 passing through the nozzles 141 and 142 is injected into the inside of the guide 110 may be formed on the lower surface of the guide 110 . The size of the injection hole 112 may be larger than the size of the nozzles 141 and 142 .

An open space 113 through which the deposition material 4 moves may be formed inside the guide 110 . The deposition material 4 may pass through the open space 113 to be deposited on the vapor-deposited objects 14 and 15 .

In addition, at least one sensing hole 111 may be formed on a side surface of the guide 110 . At least one QCM sensor 103 may be disposed in the sensing hole 111 .

The QCM sensor 103 may sense the inside of the guide 110 through the sensing hole 111 . Specifically, the QCM sensor 103 may sense the deposition material 4 present in the guide 110 to obtain information such as an evaporation amount and state of the deposition material 4 .

Next, FIG. 6 is a view showing a nozzle cover according to an embodiment of the present invention.

At least one nozzle hole 151 may be formed in the nozzle cover 150 according to an embodiment of the present invention. The nozzle hole 151 may be a hole through which the nozzles 141 and 142 pass when the nozzle cover 150 is disposed on the crucible 140 . Accordingly, the deposition material 4 passing through the nozzles 141 and 142 may pass through the nozzle hole 151 and be sprayed to the guide 110 .

The nozzle cover 150 may block heat transfer between the crucible 140 and the guide 110 while passing the deposition material 4 therethrough. Specifically, the vapor-deposited substances 14 and 15 may be positioned on the upper portion of the guide 110 , and when the vapor-deposited substances 14 and 15 are heated, the deposition material 4 is deposited on the vapor-deposited substances 14 and 15 . It can be deposited non-uniformly. Therefore, heat transfer to the vapor-deposited objects 14 and 15 should be blocked, and the nozzle cover 150 may block heat transfer to the vapor-deposited objects 14 and 15 .

The nozzle cover 150 may be mounted on the crucible 140 .

7 is a perspective view of a crucible according to an embodiment of the present invention, and FIG. 8 is a vertical cross-sectional view of the crucible according to an embodiment of the present invention.

A space 143 in which the deposition raw material 3 and the deposition material 4 are accommodated may be formed in the crucible 140 . The deposition raw material 3 may be accommodated in the space 143 , and as the crucible 140 is heated, the deposition raw material 3 may be evaporated into the evaporation material 3 .

The deposition material 4 may move upward in the space 143 and may be discharged to the outside of the crucible 140 through at least one nozzle 141 and 142 . The deposition material 4 discharged from the crucible 140 may be injected into the guide 110 .

Meanwhile, at least one or more nozzles 141 and 142 may be formed on the crucible 140 . At least one or more nozzles 141 and 142 may supply the deposition material 4 evaporated from the deposition raw material 3 to the deposition target 14 and 15 .

The deposition apparatus 100 may include at least one vertical nozzle 141 and at least one inclined nozzle 142 .

Here, the vertical nozzle 141 means a nozzle in which the nozzle hole through which the deposition material 4 passes is formed in a vertical direction, and the inclined nozzle 142 is a nozzle in which the nozzle hole through which the deposition material 4 passes is formed in an inclined shape. may mean, but it is reasonable that it is not limited to such a name.

The vertical nozzle 141 and the inclined nozzle 142 may have different shapes, positions, and sizes.

For example, the vertical nozzle 141 may have a circular cross section in a horizontal direction, and may include a nozzle hole for moving the deposition material 4 in a vertical direction. The inclined nozzle 142 has a rectangular cross section in the horizontal direction and may include a nozzle hole for moving the deposition material 4 in a direction inclined at a predetermined angle. The deposition material 4 passing through the vertical nozzle 141 and the inclined nozzle 142 may be sprayed into the nozzle hole 151 .

The vertical nozzle 141 and the inclined nozzle 142 may be formed on the upper surface of the crucible 140 , respectively. Specifically, the vertical nozzle 141 may be formed inside the deposition apparatus 100 rather than the inclined nozzle 142 on the upper surface of the crucible 140 . The vertical nozzle 141 may be formed in a region closer to the center of the guide 110 than the inclined nozzle 142 . The vertical nozzle 141 may be positioned between a pair of inclined nozzles 142 . Accordingly, the deposition material 4 evaporated inside the crucible 140 is discharged in a vertical direction in an area close to the center of the guide 110 , and is discharged in an inclined direction in an area close to the side of the guide 110 . can

Meanwhile, a heater unit 130 for evaporating the deposition material 3 into the evaporation material 4 may be disposed outside the crucible 140 .

9 is a perspective view of a heater unit according to an embodiment of the present invention, and FIG. 10 is an exploded perspective view of a heater unit according to an embodiment of the present invention.

The heater unit 130 according to an embodiment of the present invention includes a frame 134, at least one reflector 135 mounted on the frame 134, and a heater unit 138 accommodated in the frame 134, At least one of the heater unit 138 and the heater cover 133 covering the upper portion of the frame 134 may be included.

The frame 134 supports the heater unit 130 , and may accommodate at least one heater unit 138 and the crucible 140 .

First, an accommodating space S1 in which the heater unit 138 and the crucible 140 are accommodated may be formed in the frame 134 . Specifically, the heater unit 138 may be accommodated along the inner circumference of the frame 134 , and the crucible 140 may be accommodated inside the heater unit 138 . The heater unit 138 may radiate heat to heat the crucible 140 .

The heater unit 138 may be divided into an upper heater unit 136 and a lower heater unit 137 . The upper heater unit 136 may be parallel to the nozzles 141 and 142 in the horizontal direction, and the lower heater unit 137 may be disposed in parallel with the space 143 of the crucible 140 in the horizontal direction.

The heater units 136 and 137 may be disposed on the upper part, the middle part, or the lower part of the frame 134 , or may be formed as a single heater unit. The heater unit thus formed suppresses the occurrence of a clogging phenomenon in which the deposition material 4 is deposited around the nozzles 141 and 142, and heats the space 143 of the crucible 140 to heat the deposition raw material ( 3) can be evaporated.

The heater unit 130 may include a cable 139 for supplying power to the heater unit 138 , and the cable 139 may be accommodated in the ATM box 101 .

In addition, the heater unit 130 may further include a heater cover 133 that minimizes the transfer of heat emitted from the heater unit 138 to the vapor-deposited objects 14 and 15, the heater cover 133 is It may be disposed above the upper heater unit 136 .

The heater cover 133 has a hole through which at least one of the nozzles 141 and 142 passes, so that the upper heater unit 136 can be covered while passing through the nozzles 141 and 142 . The nozzle cover 150 may be disposed on the heater cover 133 , and the guide 110 may be disposed on the nozzle cover 150 .

Meanwhile, the heater unit 130 may include at least one reflector 135 for concentrating the heat emitted from the heater unit 138 to the crucible 140 .

The reflector 135 may be mounted on the outer surface of the frame 134 . Specifically, the reflector 135 may be mounted on at least one of an upper surface, a side surface, and a lower surface of the frame 134 .

The reflector 135 may be formed of a material having high thermal reflectivity. Alternatively, the reflector 135 may be formed of a material having low thermal conductivity.

The reflector 135 may reflect the heat emitted from the heater unit 138 toward the outside of the heater unit 130 toward the crucible 140 . Accordingly, there is an advantage that the crucible 140 can be heated with little heat. In addition, there is an advantage of increasing the reusability of the thermal energy emitted to the outside, increasing the energy efficiency of the system, and reducing the effect on the vapor-deposited material. In addition, there is an advantage in that the heat emitted from the heater unit 138 can be minimized from being discharged to the outside of the deposition apparatus 100 .

The cooling unit 120 may be formed outside the heater unit 130 so that heat emitted from the heater unit 138 is not discharged to the outside of the deposition apparatus 100 .

11 is a perspective view illustrating a cooling unit accommodating a heater unit according to an embodiment of the present invention.

The deposition apparatus 100 according to an embodiment of the present invention includes at least one crucible 140 (additional crucible reference numeral 140 in FIG. 11 ), at least one heater unit 130 , and at least one cooling unit 120 . may include

The crucible 140 may be accommodated in the heater unit 130 , and the heater unit 130 may be accommodated in the cooling unit 120 . Accordingly, the size of the crucible 140 may be smaller than the size of the heater unit 130 , and the size of the heater unit 130 may be smaller than the size of the cooling unit 120 .

The number of crucibles 140 and the number of heater units 130 may be the same.

According to an embodiment, the deposition apparatus 100 may include a plurality of cooling units 120 , and each of the heater units 130 is accommodated in each of the cooling units 120 , the number of the crucibles 140 , and the heaters. The number of units 130 and the number of cooling units 120 may all be the same.

According to another embodiment, the deposition apparatus 100 may include a single cooling unit 120 , and a plurality of separation spaces are formed in one cooling unit 120 , so that each separation space has a heater unit. 130 may be accommodated.

The cooling unit 120 may block heat emitted from the heater unit 138 from being emitted to the outside of the deposition apparatus 100 . In the cooling unit 120 , the heat emitted from the heater unit 138 is emitted to the outside of the deposition apparatus 100 , and the deposition material 4 is deposited on the objects 14 and 15 positioned higher than the deposition apparatus 100 . It is possible to minimize the case of non-uniform deposition.

In this way, in the deposition apparatus 100, the heater unit 138 heats the crucible 140, and as the crucible 140 is heated, the deposition raw material 3 accommodated therein is evaporated into the deposition material 4, and the nozzle ( It is injected into the guide 110 through 141 and 142 , and the deposition material 4 may be deposited on the vapor-deposited objects 14 and 15 by moving in a direction in which the guide 110 guides.

Next, the guide 110 for guiding the deposition material 4 to the at least one deposition target 14 and 15 will be described in detail. Hereinafter, the case of guiding to any one (4) of the plurality of vapor-deposited objects 14 and 15 will be described as an example, but this is not limited thereto because it is merely exemplary.

12 is a view showing the inside of the guide according to an embodiment of the present invention, FIG. 13 is a view showing the outer guide shown in FIG. 12, and FIG. 14 is a cross-sectional view taken along line A-A' of the guide shown in FIG.

The guide 110 according to an embodiment of the present invention may guide the deposition material 4 discharged from the nozzles 141 and 142 to the deposition target 14 . Hereinafter, the deposition material 4 discharged from the nozzles 141 and 142 is the deposition material 4 discharged directly from the nozzles 141 and 142 , the nozzles 141 , 142 , and the nozzle cover 150 . All of the ejected deposition materials 4 are included.

The guide 110 may include an outer guide 200 having a space 113 formed therein, and an inner guide 300 positioned in the space 113 of the outer guide 200 .

The outer guide 200 may guide the deposition material 4 to the deposition target 14 by limiting the angle at which the deposition material 4 moves. Specifically, the outer guide 200 may have a hexahedral shape. Four side surfaces of the outer guide 200 may be formed as the outer surface 200a. The outer surface 200a blocks the deposition material 4 from flowing out, thereby preventing contamination of the chamber 2 and improving the uniformity of the deposition material 4 deposited as the deposition target 14 . The deposition material 4 cannot penetrate the outer surface 200a, and when it collides with the outer surface 200a, it is reflected and moved or deposited in a direction opposite to the direction in which it collides with the outer surface 200a, thereby preventing contamination. In this way, the outer surface 200a may limit the movement angle of the deposition material 4 .

The outer surface 200a may be a guide disposed on the side to minimize deposition outside the deposition target 4 due to factors such as collision between the deposition materials 4 .

A passage 301 through which the deposition material 4 passes is formed in the inner guide 300 to guide the deposition material 4 to the deposition target 14 . That is, the inner guide 300 may guide the deposition material 4 to pass through the passage 301 to guide the movement path of the deposition material 4 . The inner guide 300 may be formed in a 'Y' shape in a vertical cross-sectional shape.

Meanwhile, referring to FIG. 13 , a cooling channel 115 may be formed inside the outer surface 200a.

The cooling channel 115 may block the effect that the outer guide 200 may have on the vapor-deposited object 14 by being heated. Hereinafter, the structure and role of the cooling channel 115 will be described in detail.

An upper portion of the outer guide 200 may be adjacent to the deposition target 14 . The shortest distance between the outer guide 200 and the deposition target 14 may be shorter than the shortest distance between the inner guide 200 and the deposition target 14 .

Some of the heat supplied by the heater unit 138 may be transferred to the outer guide 200 or the inner guide 300 . When the outer guide 200 or the inner guide 300 is heated, heat may be transferred to the vapor-deposited object 14 located on the upper side. When the vapor-deposited object 14 is heated, there may be a problem in that deposition performance decreases due to problems such as thermal expansion of the vapor-deposited object 14 . This may cause a problem in that the deposition material 4 is non-uniformly deposited on the deposition target 14 .

Accordingly, the outer guide 200 may include a cooling channel 115 so that the outer guide 200 positioned adjacent to the vapor-deposited object 14 is not heated.

The cooling channel 115 is a pipe through which the cooling fluid moves, and may include a cooling channel inlet 115a into which the cooling fluid is injected and a cooling channel outlet 115b through which the cooling fluid is discharged to the outside.

The cooling channel 115 may be disposed inside the outer surface 200a. The cooling channel 115 may be uniformly disposed on the entire outer surface 200a.

In this way, by minimizing the heating of the outer guide 200 through the cooling channel 115, it is possible to minimize the effect on the vapor-deposited object (14).

According to another embodiment, the outer guide 200 may be designed as a combination of a heat pipe containing a heat transfer fluid and a coolant line. This has the advantage of maximizing cooling performance while being lighter in weight and easier to maintain than when the cooling channel 115 is included. A flow path of heat transfer fluid is formed inside the heat pipe, and the heat transfer fluid forms a cycle of evaporation, movement, cooling, and condensation. A similar effect to using a cooling water line can be seen by transferring In this case, since the outer surface 200a is detachable, the influence on the temperature of the vapor-deposited object 14 can be minimized while maximizing the internal workability.

On the other hand, in the case of the inner guide 300 , when the temperature rises high due to the influence of at least one adjacent nozzle 141 , 142 , the vapor-deposited object 14 may be affected. Therefore, the inner guide 300 has to increase the amount of heat transferred to the lower structure of the outer guide 200 in which the cooling water line is formed in order to minimize the effect on the deposition target 14, and for this purpose, the inner guide 300 is It can be manufactured using a material or device with a high heat transfer coefficient. Through this, the influence on the vapor-deposited object 14 can be minimized.

Also, when the temperature of the inner guide 300 is too low, clogging may occur in at least one nozzle 141 and 142 adjacent to the inner guide 200 . Accordingly, the temperature of the inner guide 300 may be controlled to be higher than the temperature of the outer guide 200 . The heat transfer coefficient of the inner guide 300 may be higher than the heat transfer coefficient of the outer guide 200 . Accordingly, the inner guide 300 may have a higher temperature than the outer guide 200 , thereby suppressing the occurrence of clogging around the nozzles 141 and 142 . In addition, since the heat transfer coefficient of the outer guide 200 is lower than that of the inner guide 300 , the outer guide 200 is heated more slowly, and the influence on the vapor-deposited object 14 can be minimized.

Referring to FIG. 14 , the outer guide 200 may include a support plate 201 supporting the inner guide 300 , and the inner guide 300 may be disposed on an upper surface of the support plate 201 .

The inner guide 300 may be disposed in parallel to the center nozzle 141c in a vertical direction. Specifically, a plurality of nozzles 141 may be disposed to be spaced apart from each other, and the plurality of nozzles may include a pair of outer nozzles 141a and 141b disposed to be spaced apart in the horizontal direction, and a pair of outer nozzles 141a ( It may include a center nozzle 141c disposed between 141b). The inner guide 300 may be disposed such that the passage 301 faces the outlet 144 of the center nozzle 141c.

Next, FIG. 15 is a perspective view of an inner guide according to an embodiment of the present invention.

In the inner guide 300 , a passage 301 through which the deposition material 4 discharged from the center nozzle 141c passes may be formed.

The inner guide 300 may include a lower guide part 310 having a constant cross-sectional area of the passage 301 and an upper guide portion 320 in which the cross-sectional area of the passage 301 is gradually expanded. The upper guide 320 may be formed by bending the lower guide 310 .

The inner guide 300 may include a plurality of guide members forming the passage 301 .

At least one of the plurality of guide members may be arranged to be movable in the horizontal direction so that the size of the passage 301 can be changed. Specifically, the lower guide 310 may be movable in the horizontal direction so that the size of the passage 301 is variable.

16 is a view illustrating a state in which the size of a passage formed in an inner guide according to an embodiment of the present invention is changed.

In the inner guide 300 , the horizontal length of the passage 301 may vary according to the arrangement of the plurality of guide members forming the inner guide 300 . The length of the passage 301 may be adjusted according to the type of the deposition material 4 , the temperature inside the guide 110 , and the distance between the nozzle 141 and the deposition target 14 .

For example, when the deposition material 4 is accumulated more in the central region between the both side regions than the both side regions of the vapor-deposited object 14, the inner guide 300 is disposed as shown in FIG. 16(b). It can be arranged as shown in Fig. 16 (a). That is, the inner guide 300 may be disposed such that the length of the passage 301 increases from D2 to D1.

Preferably, the length of the passage 301 may be 50 ~ 150 mm. However, since the above-described length of the passage 301 and the case in which the length of the passage 301 should be reduced are merely exemplary, it is appropriate that the present invention is not limited thereto.

As described above, if the length of the passage 301 is adjusted, there is an advantage in that the deposition material 4 discharged from the outer nozzles 141a and 141b can be minimized in the inner guide 300 .

At least one of the plurality of guide members may be rotatably disposed so that the exit angle of the passage 301 can be varied. Specifically, the upper guide 320 may be connected to the lower guide 310 so that the exit angle of the passage 301 is variable.

The upper guide 320 may be rotatably connected to the lower guide 310 .

The deposition material 4 may pass through the passage 301 to move into the space 113 formed in the outer guide 200 . A region moving from the passage 301 to the space 113 may be an exit of the passage 301 .

The exit angle of the passage 301 may be variable. For example, the upper guide 320 is disposed at an angle passing through the reference line K' as shown in FIG. It can be rotated as much as possible. A path according to the type of the deposition material 4 , the temperature inside the guide 110 , the distance between the nozzle 141 and the deposition target 14 , the region in which the deposition material 4 is to be deposited among the deposition target 14 , etc. The exit angle of 301 can be adjusted.

In this way, when the inner guide 300 is adjusted, the deposition material 4 can be minimized on the outer guide 200 , so that the use time of the outer guide 200 can be increased. Accordingly, there is an advantage in that the duration of the deposition process is increased and the yield is improved.

Next, FIG. 18 is a view showing a sub guide according to an embodiment of the present invention.

The guide 110 according to an embodiment of the present invention may further include a sub-guide 210 .

A pair of sub guides 210 may be disposed to be spaced apart from each other on an upper portion of the outer guide 200 . An opening 114 through which the deposition material 4 moves may be formed between the pair of sub-guides 210 . The opening 114 may be a hole formed on the upper surface of the outer guide 200 , and may be a hole opened toward the vapor-deposited object 14 . The deposition material 4 may move to the deposition target 14 through the opening 114 . The deposition material 4 may be deposited on the deposition target 14 by moving in a direction guided by the opening 114 formed by the pair of sub-guides 210 .

The length of the sub guide 210 is adjustable, and the size of the opening 114 may vary according to the length of the sub guide 210 .

The size of the opening 114 may be larger than the size of the passage 301 .

The guide 110 according to an embodiment of the present invention may more accurately deposit the deposition material 4 to the target point through the outer guide 200 , the inner guide 300 , and the sub guide 210 . In addition, if the inner guide 300 , the outer guide 200 , and the sub guide 210 are utilized, the uniformity of the deposition material 4 accumulated on the deposition target 14 may be improved. In addition, the outer guide 200 increases the duration of the deposition process with the advantage of increasing the replacement cycle of the deposition prevention plate by reducing the degree of contamination of the chamber 2 and increasing the uniformity of the deposition material 4 , and improving the yield has the advantage of

Next, FIG. 19 is a view showing a state in which the outer guide, the inner guide, and the sub guide guide the path of the deposition material according to an embodiment of the present invention.

The first to ninth guide lines 331 to 339 illustrated in FIG. 19 are virtual lines for convenience of description and do not actually exist.

The deposition material 4 discharged from any one 141a of the pair of outer nozzles 141a and 141b may move to areas A and B guided by the first guide line 331 and the second guide line 332 . Also, the upper guide 320 may move to the area C guided by the second guide line 332 and the third guide line 333 .

The deposition material 4 discharged from the center nozzle 141c is guided by the fourth guide line 334 , the fifth guide line 335 , and the sixth guide line 336 by the upper guide 320 in areas A and B. , can move to area C.

The deposition material 4 discharged from the other one 141b of the pair of outer nozzles 141a and 141b is guided by the upper guide 320 by the seventh guide line 337 and the eighth guide line 338 . It may move to area A, and may move to areas B and C guided by the eighth guide line 338 and the ninth guide line 339 .

The first guide line 331 and the ninth guide line 339 may be limited by the sub guide 210 . The fourth guide line 334 and the sixth guide line 336 may be limited by the inner guide 300 .

In this way, the outer guide 200 , the inner guide 300 , and the sub guide 210 guide the deposition material 4 passing through the nozzles 141a , 141b and 141c to the target point of the deposition object 14 . can do. The inner guide 300 or the sub guide 210 may be adjusted according to the target point of the vapor-deposited object 14 . By adjusting the inner guide 300 or the sub guide 210 , the deposited material 14 can be accurately deposited on the target point.

Meanwhile, the inner guide 300 is disposed to face the vapor-deposited object 14 , and when the inner guide 300 is heated, the temperature of the vapor-deposited object 14 may be increased. To minimize this, the inner guide 300 may be formed of a heat pipe.

20 is a view showing an inner guide formed of a heat pipe according to another embodiment of the present invention.

The inner guide 200 may be formed of a heat pipe having a fluid circulation passage 330 formed therein. The inner guide 200 may be formed such that the upper guide 320 is bent at the lower guide 310 through bending or processing.

A lower portion of the lower guide 310 may be an evaporator in which the fluid is evaporated, and an upper portion of the upper guide 320 may be a condensing portion in which the fluid is condensed. The heat pipe can use a heat conduction coefficient that is several to several hundred times that of a metal when manufactured, and can optimize the shape of the inner guide 200 to maximize the refrigerant circulation efficiency. Through this manufacturing method, it may be manufactured to form a circulation structure not only in the straight inner guide 200 but also in various angular structures.

As the temperature of the hot spot decreases through the heat pipe structure, the temperature of the entire area of the inner guide 200 becomes uniform. The amount of radiant heat emitted is αT ⁴ If the surface emissivity of the inner guide 200 is minimized and the peak temperature is reduced, it is possible to minimize the effect on the vapor-deposited material 14 .

Meanwhile, the deposition apparatus 100 according to an embodiment of the present invention may further include a shield unit (not shown).

The shield unit (not shown) is for reducing the reflected heat of the reflector toward the vapor-deposited object.

The cooling unit accommodating the crucible may have a flow path through which the cooling water flows, and the shield unit may be disposed above the cooling unit.

A Peltier unit may be disposed between the shield unit and the cooling unit. Since the Peltier unit is easily removable and can reduce the temperature to sub-zero, it is possible to keep the temperature of the hotspot itself low by reducing the initial temperature of the shield unit itself as much as possible. In addition, since the thermal conductivity flowing from the hot spot to the heat sink of the cooling water can be increased by using a heat pipe, the temperature of the shield unit itself can be kept low to reduce the amount of radiant heat emitted to the deposition target. The shield unit does not require a fastening structure such as a fitting for forming a cooling water line, and has the advantage of being relatively free from the constraint of the lowest temperature depending on the refrigerant when the cooling water is used. In addition, if the shield unit is used simultaneously with the cooling water line, it is possible to reduce the temperature to sub-zero, so there is an advantage in that it is possible to minimize the effect of a heat source such as a crucible on a vapor-deposited object. In addition, the shield unit can be easily installed and detachable, so maintenance is simple.

The above description is merely illustrative of the technical spirit of the present invention, and various modifications and variations will be possible without departing from the essential characteristics of the present invention by those skilled in the art to which the present invention pertains.

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments.

The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

110: guide 200: outer guide
220: sub guide 300: inner guide
310: lower guide 320: upper guide

Claims (9)

at least one nozzle for discharging the deposition material filled in at least one or more crucibles;
a guide for guiding the deposition material to a deposition target;
the guide is
an outer guide having a space formed therein;
an inner guide positioned in the space and having a passage through which the deposition material discharged from the nozzle passes therein;
The inner guide is
a lower guide having a constant cross-sectional area of the passage;
and an upper guide that is bent in the lower guide and that the cross-sectional area of the passage is gradually expanded,
The upper guide is rotatably connected to the lower guide, so that an angle can be adjusted. According to claim 1,
A cooling channel through which a cooling fluid passes is formed in the outer guide. According to claim 1,
The outer guide includes a support plate for supporting the inner guide,
and the inner guide is disposed on an upper surface of the support plate. According to claim 1,
A plurality of the nozzles are spaced apart,
multiple nozzles
A pair of outer nozzles spaced apart in the horizontal direction,
It includes a center nozzle disposed between the pair of outer nozzles,
The outlet of the center nozzle is directed toward the passage. at least one nozzle for discharging the deposition material filled in at least one or more crucibles;
a guide for guiding the deposition material to a deposition target;
the guide is
an outer guide having a space formed therein;
an inner guide positioned in the space and having a passage through which the deposition material discharged from the nozzle passes therein;
The inner guide is
a lower guide having a constant cross-sectional area of the passage;
and an upper guide that is bent in the lower guide and that the cross-sectional area of the passage is gradually expanded,
The heat transfer coefficient of the outer guide is lower than the heat transfer coefficient of the inner guide. at least one nozzle for discharging the deposition material filled in at least one or more crucibles;
a guide for guiding the deposition material to a deposition target;
the guide is
an outer guide having a space formed therein;
an inner guide positioned in the space and having a passage through which the deposition material discharged from the nozzle passes therein;
The inner guide is
a lower guide having a constant cross-sectional area of the passage;
and an upper guide that is bent in the lower guide and that the cross-sectional area of the passage is gradually expanded,
The inner guide includes a plurality of guide members forming the passage,
At least one of the plurality of guide members is disposed to be movable in a horizontal direction so that the size of the passage can be changed. delete According to claim 1,
and a sub-guide disposed on the upper portion of the outer guide to be spaced apart from the inner guide and having an opening through which the deposition material moves. 9. The method of claim 8,
and the opening is larger than the passage.

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