KR102386677B1 - Manufacturing method for high emissivity heat conductive radiation system and high emissivity heat conductive radiation system manufactured by the same - Google Patents

Abstract

The present invention comprises the steps of preparing a heat dissipating member made of a metal; and press-fitting an inorganic filler into the surface of the heat dissipating member.
In the high-radiation heat-conductive heat dissipation system manufactured according to the present invention, in contrast to the prior art in which it was difficult to improve thermal conductivity due to the low thermal conductivity of the organic binder, the inorganic filler exhibiting high emissivity through the surface treatment of the metal heat dissipation system is a metal The heat dissipation system exhibits high emissivity and improved thermal conductivity as it is press-fitted into or penetrates into the surface of the surface-treated metal surface, thereby facilitating heat dissipation.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a high radiation thermal conductivity heat dissipation system, and more particularly, to a method for manufacturing a high radiation thermal conductivity heat dissipation system that exhibits high radiation thermal conductivity through surface treatment to the heat radiation system, and a high radiation thermal conductivity heat dissipation system manufactured thereby is about

Recently, high integration for weight reduction, slimming, miniaturization, and high speed of electronic devices is pursued, and due to this, the amount of heat generated per unit volume due to energy loss of the electronic device increases and a thermal load is generated.

Such heat load may deteriorate the performance of the product, and in severe cases may cause a malfunction, and may lower the operational reliability of the related electronic circuit. In addition, thermal stress may be generated in the parts or case due to the internal temperature difference, which may cause deformation of the product. Therefore, in order to reduce such a heat load, many studies are being conducted to dissipate the heat generated by the electronic device to the outside.

In general, in order to dissipate heat of an electronic device, a heat dissipation system in which a heat dissipation member such as a heat sink or a heat sink is brought close to a heat source to dissipate heat is used.

Such a heat dissipation system is generally made of a metal with high thermal conductivity, and aluminum (Al), which has good thermal conductivity and is light and inexpensive, is mainly used as a metal heat sink.

However, the amount of heat dissipation required in recent highly integrated electronic devices is insufficient only with the heat dissipation properties of aluminum metal heat sinks. A method of imparting radiative thermal conductivity is being studied.

Such a thermally conductive composition is generally coated on the surface of a metal heat sink by including an inorganic filler in an organic binder.

Registered Patent No. 1534232 (Registration Announcement on July 6, 2015)

In the present invention, as described above, when the inorganic filler is coated on the surface of a metal heat sink using an organic binder, the problem of deterioration in heat dissipation caused by the organic binder is overcome, and the high radiation thermal conductivity of the metal heat dissipation system through surface treatment An object of the present invention is to provide a method for manufacturing a high radiation thermal conductivity heat dissipation system having

The present invention comprises the steps of preparing a heat dissipating member made of a metal; and press-fitting an inorganic filler into the surface of the heat dissipating member.

In addition, the inorganic filler press-in, (a) extruding the molten metal; and (b) spraying an inorganic filler on the extruded metal.

In addition, the inorganic filler press-in, (a) preparing a mixture by mixing the inorganic filler with the release agent; (b) spraying the mixture of step (a) into an injection mold; and (c) injecting and injecting molten metal into the injection mold of step (b).

In addition, the inorganic filler press-in, (a) heating the heat dissipating member to 500 to 600 ℃; (b) injecting high heat of 800° C. or higher to the heated surface of the heat dissipating member; and (c) spraying an inorganic filler on the upper surface of the heat dissipating member heated to high heat.

In addition, the step (c) is characterized in that the step of pressing the inorganic filler sprayed on the upper surface of the heat dissipating member is further included.

The present invention comprises the steps of preparing a heat dissipating member made of a metal; surface-treating the heat dissipating member; and coating the surface-treated heat-dissipating member with a high-radiation heat-conductive composition, wherein the surface treatment is a corrosion treatment or a sanding treatment.

In addition, the present invention provides a high radiation thermal conductivity heat dissipation system manufactured by the above method.

In the high-radiation heat-conductive heat dissipation system manufactured according to the present invention, in contrast to the prior art in which it was difficult to improve thermal conductivity due to the low thermal conductivity of the organic binder, the inorganic filler exhibiting high emissivity through the surface treatment of the metal heat dissipation system is a metal The heat dissipation system exhibits high emissivity and improved thermal conductivity as it is press-fitted into or penetrates into the surface of the surface-treated metal surface, thereby facilitating heat dissipation.

In addition, the high radiation thermal conductivity heat dissipation system manufactured according to the present invention has the effect of reducing the additional steps by simultaneously performing the high radiation thermal conductivity treatment during the injection or extrusion process of the metal heat dissipation system.

1 is an image of a high-radiation thermally conductive heat dissipation system manufactured according to an embodiment of the present invention (right) and a heat dissipation system coated with lacquer (left).
2 is a graph showing radiant heat (Y-axis) according to the contact temperature (X-axis) of a high-radiation thermally conductive heat dissipation system manufactured according to an embodiment of the present invention and a conventional heat dissipation system (no treatment).
3 is a graph showing radiant heat (Y-axis) according to the contact temperature (X-axis) of the high-radiation thermally conductive heat dissipation system and the lacquer-coated heat dissipation system manufactured according to an embodiment of the present invention.
4 is an infrared image according to heating of a high-radiation thermally conductive heat dissipation system (left) and a conventional heat dissipation system (untreated, right) manufactured according to an embodiment of the present invention.
5 is a temperature measurement experimental image for each point of the high radiation thermal conductivity heat dissipation system (horizental) manufactured according to an embodiment of the present invention.
6 is an image of the front (a) and back (b) of the temperature measurement experiment for each point of the high radiation thermal conductivity heat dissipation system (vertical) manufactured according to an embodiment of the present invention.
7 to 10 are flowcharts of a manufacturing method according to an embodiment of the present invention.

Hereinafter, before describing in detail through preferred embodiments of the present invention, terms or words used in the present specification and claims should not be construed as being limited to conventional or dictionary meanings, and meanings consistent with the technical spirit of the present invention and should be interpreted as a concept.

Throughout this specification, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

Hereinafter, it will be described in more detail with respect to the manufacturing method of the high radiation thermal conductivity heat dissipation system of the present invention and the high radiation thermal conductivity heat dissipation system manufactured thereby.

The present invention provides a method of manufacturing a high-radiation thermally conductive heat dissipation system, comprising the steps of preparing a heat dissipating member made of a metal and press-fitting an inorganic filler into a surface of the heat dissipating member.

In the present invention, the heat dissipation system means that the inorganic filler is press-fitted or coated by surface treatment and is attached to a heat source that generates heat, such as an electronic device, to conduct and radiate heat to the outside.

In addition, the heat dissipating member is made of a metal having high thermal conductivity but low emissivity, and may be a thin plate or a heat sink having heat dissipation fins formed thereon, but is not limited thereto.

In addition, being press-fit means a state embedded in the metal surface or a method of embedding, which may be accomplished by spraying or addition, but is not limited thereto.

The step of preparing the heat dissipating member made of metal is a step of preparing the heat dissipating member in which the metal is melted or the shape is completed.

An inorganic filler may be press-injected into the prepared heat dissipating member, and various known inorganic fillers may be used as the press-fitted inorganic filler, but boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al ₂ O ₃ ), and nitride It may include at least one of aluminum (AlN) and foamed inorganic thermally conductive powder.

In addition, the foamed inorganic thermal conductive powder is distilled water in 100% by weight, nitric acid (HNO ₃ ) and magnesium (Mg) in 4 to 9% by weight of a base solution, sodium oxide (Na ₂ O) 14 to 21% by weight, dioxide Silicon (SiO ₂ ) 45 to 56 wt%, iron oxide (Fe ₂ O ₃ ) 0.03 to 0.07 wt%, dispersant 0.3 to 0.9 wt%, magnesium carbonate (MgCO ₃ ) 1.6 to 5.2 wt%, potassium methyl siliconate (potassium methyl) siliconate) 3 to 9% by weight of silicon (Si) is added to the composition, solidified and foamed, and then pulverized.

Since the inorganic filler has high thermal conductivity and high emissivity, it can serve to compensate for the disadvantages of metals having high thermal conductivity and low emissivity.

In a method of press-inserting the above-described inorganic filler into the surface of the heat dissipating member, the molten metal may be press-injected by spraying the inorganic filler into the extruded metal (FIG. 7).

In the case of molten metal, for example, aluminum, it is extruded (S110) by heating the aluminum to a high temperature before melting or in the molten state, and then extruding it with sufficient pressure. The inorganic filler may be press-fitted to the surface (S120). Alternatively, a groove may be formed in the extrusion port of the extruded aluminum, and the inorganic filler may be injected and press-injected. At this time, if the inorganic filler is sprayed at high speed, the heat dissipation press-fitting layer can be more easily formed on the surface of the heated heat dissipating member.

In addition, the inorganic filler is prepared by mixing the inorganic filler with the release agent in a method of press-fitting the inorganic filler into the surface of the heat dissipating member, spraying the mixture into an injection or die-casting mold, and then injecting the molten metal into the injection mold and injecting the inorganic filler. can be press-fitted to the surface of the heat dissipating member (FIG. 8).

The release agent is a composition used to easily separate the metal injected into the injection mold from the injection mold, and when molten metal at a high temperature is injected into the injection mold after being injected into the injection mold, it burns out and disappears.

By mixing the inorganic filler with the release agent to prepare a mixture in which the release agent and the inorganic filler are mixed (S210), and spraying the prepared mixture into the injection mold (S220), the mold release agent and the inorganic filler can be coated on the surface of the injection mold.

The release agent coated on the injection mold is burned out by the high temperature of the injected molten metal, and on the surface of the injected molten metal, the inorganic filler contained in the mixture has a higher melting point than the metal, so it does not melt and remains on the surface of the metal (S230) It can be used as a high radiation thermal conductivity heat dissipation system by giving the heat dissipating member high radiation thermal conductivity.

In addition, the inorganic filler may be press-injected into the surface of the pre-fabricated heat dissipating member.

After heating the heat emitting member made of metal to 500 to 600 °C (FIG. 9 S310), a high heat of 800 °C or higher, preferably 1000 °C or higher, is injected to the heated heat dissipating member using a laser or the like (FIG. 9 S320) ). The heat dissipating member heated to a high temperature instantaneously has a molten surface, and when the inorganic filler is sprayed on the metal surface, the inorganic filler may be press-injected in a state in which the metal surface is melted by the high temperature ( FIG. 9 S330 ). Alternatively, the adhesion between the metal and the inorganic filler may be increased by pressing the inorganic filler sprayed onto the surface of the heat dissipating member heated to a high temperature to press the inorganic filler into the metal surface.

After cooling, the inorganic filler is press-fitted to the surface of the heat dissipating member, and high radiation thermal conductivity is imparted by the inorganic filler, so that it can be used as a high radiation thermal conductivity heat dissipation system.

In addition, the present invention includes the steps of preparing a heat dissipating member made of a metal, surface treating the heat dissipating member, and coating the surface-treated heat dissipating member with a high radiation heat conductive composition, wherein the surface treatment is corrosion treatment Or it provides a method of manufacturing a high radiation thermal conductivity heat dissipation system, characterized in that the sanding treatment (FIG. 10).

The step of preparing the heat dissipating member made of metal is a step of preparing the pre-fabricated heat dissipating member ( S410 ), which is a step of surface cleaning or washing for surface treatment, which will be described later.

In the step (S420) of surface treatment of the heat dissipating member, the metal surface is corroded or sanded to change the surface irregularly or to generate voids so that the inorganic filler can adhere well to the coating of the high radiation thermal conductivity composition to be described later. let it be

In the above-described corrosion treatment method, an etchant is applied to the metal surface by a method such as spray deposition, dipping, spraying or brushing, and the metal surface is etched due to the etchant to become irregular or voids are formed.

The metal surface on which the pores are formed can be cleaned with water or a cleaning solution.

For corrosion treatment, an etchant suitable for each type of metal can be used. For example, when an aluminum alloy is corroded by a dipping method, distilled water 190 ml, Nitric acid 5 ml, Hydrochloric acid 3 ml, Hydrofluoric acid 2 ml are mixed. Corrosion treatment can be performed by dipping in the etched solution for about 10 to 30 seconds and washing.

As another example, if pure aluminum, aluminum-magnesium alloy, and magnesium-silicon alloy are corroded by the dipping method, 25 ml of Methanol, 25 ml of Hydrochloric acid, 25 ml of Nitric acid, and 1 drop of Hydrofluoric acid are mixed in the etchant. It can be corroded by dipping and washing for 10 to 60 seconds.

As another example, in case of corrosion of aluminum-copper alloy by the dipping method, dipping in an etchant prepared by mixing 92 ml of distilled water, 6 ml of nitric acid, and 2 ml of hydrofluoric acid for 10 to 20 seconds and washing to corrode can

The sanding process etches the metal surface using a method of spraying the metal surface with sand blasting.

The surface of the heat dissipating member surface-treated by corrosion treatment or sanding treatment may be coated with a high radiation heat conductive composition to impart high radiation heat conductivity (S430).

The high radiation thermal conductivity composition used in the present invention includes at least one of boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al ₂ O ₃ ) and aluminum nitride (AlN) and foamed inorganic thermally conductive powder agent, and a binder comprising a silicate glass solution and isopropyl alcohol.

Here, the foamed inorganic thermally conductive powder is 100% by weight of distilled water, 4 to 9% by weight of a base solution containing nitric acid (HNO ₃ ) and magnesium (Mg) components, 14 to 21% by weight of sodium oxide (Na ₂ O), Silicon dioxide (SiO ₂ ) 45 to 56 wt%, iron oxide (Fe ₂ O ₃ ) 0.03 to 0.07 wt%, dispersant 0.3 to 0.9 wt%, magnesium carbonate (MgCO ₃ ) 1.6 to 5.2 wt%, potassium methyl siliconate (potassium) methyl siliconate) may be a material prepared by adding silicon (Si) to a composition containing 3 to 9% by weight, coagulating and foaming, and then pulverizing.

The manufacturing process of the foamed inorganic thermally conductive powder will be described as an example as follows.

In about 100% by weight of distilled water, about 14 to about 21% by weight of sodium oxide, about 45 to about 56% by weight of silicon dioxide, about 0.03 to about 0.07% by weight of iron oxide, and about 0.3 to about 0.9% by weight of a dispersant are added, and about Mix by heating and stirring slowly for 20 minutes at a temperature of 60 ~ 90 ℃. At this time, about 1.6 to about 5.2% by weight of magnesium carbonate and about 4 to about 9% by weight of the basic solution are slowly dropped and mixed in a substance in which sodium oxide, silicon dioxide, iron oxide, and a dispersant are mixed in distilled water, but water vapor in the mixed material Mix by stirring until it comes out.

When water vapor is generated, add about 3 to 9 wt% of potassium methyl silicate to the mixed material and heat and stir for about 1 hour and 30 minutes to about 2 hours, and the final mixed material becomes transparent. From this point on, stop heating and mix Mix by stirring until the material is cooled.

After adding about 0.1 to about 40 wt% of silicon (Si) to this liquid material, it is put in a dryer to a thickness of about 2 cm, and then subjected to an exothermic reaction at a temperature of about 20 ° C. or higher for about 24 hours to solidify into a mass material and foaming.

Thereafter, after crushing the hardened mass material by heating in the above-mentioned step, it is further pulverized with a pulverizer to make a powdery material having an average particle size of about 20 μm or less to prepare a foamed inorganic thermally conductive powder.

This foamed inorganic thermally conductive powder may have stable nonflammability even in a high temperature environment of about 1000° C. or higher, and may have excellent emissivity, heat absorbing and exothermic performance.

Boron nitride is a material having excellent heat dissipation performance and elasticity even in a high temperature environment of about 1000 °C or higher.

Silicon carbide may have excellent heat resistance, oxidation resistance, and corrosion resistance even in a high temperature environment of about 1500° C., excellent thermal conductivity, and excellent mechanical durability. The silicon carbide may be, for example, high purity green carbide.

Aluminum oxide (Al ₂ O ₃ ) may be stable even in a high temperature environment of about 1500 °C, and may have excellent fire resistance performance.

Aluminum nitride can be stable even in a high temperature environment of about 1700 ° C., has excellent thermal conductivity, and has electrical insulation.

A functional agent comprising at least one of boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al ₂ O ₃ ), and aluminum nitride (AlN) and foamed inorganic thermally conductive powder has thermal conductivity in a high temperature environment of about 1000 ° C. or higher. It is possible to improve the heat absorption, heat generation and efficiency performance of the composition, and it is possible to improve the emissivity of the material to which the thermally conductive composition is applied.

The functional agent may further include iron oxide (Fe ₂ O ₃ ). Iron oxide may improve the emissivity of the thermally conductive composition and may block electromagnetic waves.

Also, the functional agent may additionally include one or more of carbon-based materials such as graphite, graphene, carbon nanotubes, and carbon fibers.

Graphite may improve the durability and heat resistance in a vacuum state of the thermally conductive composition, graphene or carbon nanotubes may improve thermal conductivity, and carbon fiber may improve thermal conductivity and radiation performance.

The functional agent is one of boron carbide (B ₄ C), silicon nitride (Si ₃ N ₄ ), zirconium oxide (ZrO ₂ ), titanium dioxide (TiO ₂ ), zinc oxide (ZnO ₂ ), and zirconium nitride (ZrN) More may be included.

Here, boron carbide or silicon nitride can improve radiation performance, heat resistance, thermal conductivity, etc., zirconium oxide can improve fire resistance performance up to about 1800 ° C., titanium dioxide can improve corrosion resistance and hiding power, and oxidation Zinc can perform the function of a fluorescent pigment, and zirconium nitride can improve the corrosion resistance of the thermally conductive composition.

The thermally conductive composition may further include at least one of a commonly used coupling agent, a dispersant, an anti-settling agent, an anti-crack agent, and an adhesion promoter. Here, the coupling agent is about 0.2 to about 1 wt%, the dispersant is about 0.2 to about 1 wt%, the anti-settling agent is about 0.2 to about 1 wt%, the crack inhibitor is about 0.2 to about 1 wt%, and the adhesion enhancer is may be included in an amount of about 0.2 to about 1% by weight.

The binder of the thermally conductive composition may further include aluminum silicate. Aluminum silicate is an environmentally friendly material that has no volatile organic compounds (VOCs) and toxicity as well as harmful heavy metals such as lead and cadmium. Since it has a rigid structure, durability of the thermally conductive composition can be improved.

At this time, based on the entire binder, the silicate glass solution may be 70 to 85% by weight, isopropyl alcohol 5 to 15% by weight, and aluminum silicate 5 to 15% by weight, within this range, the functional agent and the binder bonding strength can be improved.

The thermally conductive composition may radiate far-infrared rays by receiving heat generated from the outside. Accordingly, the thermally conductive composition may be applied, for example, to an infrared irradiator for medical use, a heating and sterilizer for indoor horticultural use, a food (organic) dryer, and the like.

In addition, since the thermally conductive composition has high-efficiency heat absorbing and exothermic performance, it can be applied to various heaters, electric heaters, electric heaters, heat-resistant devices, high-temperature ceramic furnaces, drying furnaces, incinerators, heat exchangers, kitchen appliances, and the like.

In addition, the thermally conductive composition has excellent heat dissipation performance, so air conditioner outdoor units, telecommunication company repeaters, semiconductor equipment, transformers, solar power equipment, display devices, electronic circuit chips, wiring, automobile engines, radiators, batteries, on-coolers, radiators, It may be applied to CPU, mobile phone, tablet computer, audio, speaker (amplifier), weapon, aircraft, ship, spacecraft, etc., but is not limited thereto.

Hereinafter, a method for producing the thermally conductive composition will be described.

The method of manufacturing the thermally conductive composition includes preparing a binder, boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al ₂ O ₃ ), and aluminum nitride (AlN) and foamed inorganic thermally conductive powder. It includes the steps of preparing a functional agent including, and mixing the functional agent in a binder.

The method for preparing the foamed inorganic thermally conductive powder was described above, and the step of preparing the binder is a step of primary stirring while adjusting the pH to about 4.3 to about 4.5 by adding formic acid or acetic acid to distilled water, adding a silicate glass solution And silane (SiH ₄ ) is added over 4 to 10 times, followed by a second stirring for about 2 hours to about 4 hours, and aging the second stirred mixture at room temperature for about 4 hours to about 12 hours, and and stopping the reaction by adding isopropyl alcohol.

First, a first stirring step is performed. It is a step of adjusting the pH to 4.3 to 4.5 by adding formic acid to distilled water, and the reaction rate can be improved within this pH range.

Subsequently, in the secondary stirring step, silane is dividedly added over 4 to 10 times, the more silane is added, the less ductility is, and the less silane is added, the more flexible it can be. If the silanes are not added separately, the silanes may agglomerate. The silicate glass solution may be, for example, colloidal silica, but is not limited thereto.

Thereafter, through the aging step, isopropyl alcohol, which is a reaction retardant, is added to stop the reaction.

The thermally conductive composition and its manufacturing method according to the embodiments can improve heat absorption, heat generation and efficiency performance in a high temperature environment of about 1000 ° C. or higher, improve the emissivity of the material to which the composition is applied, and do not contain harmful substances Therefore, it is possible to reduce the harmfulness to the human body.

In addition, the present invention provides a high-radiation thermal conductivity heat dissipation system manufactured by the above-described manufacturing method.

The high emissivity thermal conductivity heat dissipation system of the present invention can compensate for the disadvantages of metals having low emissivity properties by press-fitting inorganic fillers having high emissivity or surface treatment and then coating the high emissivity thermal conductivity composition.

1 is an image of a high-radiation thermally conductive heat dissipation system manufactured according to an embodiment of the present invention (right) and a heat dissipation system in which a lacquer is coated on a general heat dissipation system.

2 is a graph showing radiant heat (Y-axis) according to the contact temperature (X-axis) of the high-radiation thermally conductive heat dissipation system and the conventional heat dissipation system manufactured according to an embodiment of the present invention.

3 is a graph showing radiant heat (Y-axis) according to the contact temperature (X-axis) of the high-radiation thermally conductive heat dissipation system and the lacquer-coated heat dissipation system manufactured according to an embodiment of the present invention.

4 is an infrared image according to heating of a high-radiation thermally conductive heat dissipation system (left) and a conventional heat dissipation system (right) manufactured according to an embodiment of the present invention.

5 is a temperature measurement experimental image for each point of the high radiation thermal conductivity heat dissipation system (horizental) manufactured according to an embodiment of the present invention.

Table 1 is data obtained by measuring the temperature change for each point of the high radiation thermal conductivity heat dissipation system of FIG. 5, and CH01 represents 18.7 °C as the environmental temperature.

Through the temperature measurement experiment for each point, the maximum temperature of 63.9 ℃ was recorded at point 4, and the temperature change was 45.2 ℃ except for the environmental temperature of 18.7 ℃.

6 is an image of the front (a) and back (b) of the temperature measurement experiment for each point of the high radiation thermal conductivity heat dissipation system (vertical) manufactured according to an embodiment of the present invention.

Table 2 is data obtained by measuring the temperature change for each point of the high radiation thermal conductivity heat dissipation system of FIG. 6, and CH01 represents 22.9 °C as the environmental temperature.

Through the temperature measurement experiment for each point, the highest temperature of 59.0 ℃ was recorded at point 2, and the temperature change was 36.1 ℃ except for the environmental temperature of 22.9 ℃.

The highly radiating thermal conductivity heat dissipation system accepts heat by bonding or contacting a heat source that emits heat, such as electronic devices, and discharges it to the outside.

The high radiation thermal conductivity heat dissipation system of the present invention has the disadvantage that the thermal conductivity of the organic binder was significantly lower than that of the metal and inorganic filler in the conventional method of coating a mixture of an organic binder and an inorganic filler. High radiation thermal conductivity can be imparted by creating a large amount of voids after press-in or surface treatment of the voids and inserting and coating the voids with an inorganic filler.

Claims (7)

Preparing a heat dissipating member made of a metal; and
Including; press-fitting an inorganic filler into the surface of the heat dissipating member;
The step of press-fitting the inorganic filler to the surface of the heat dissipating member,
(a) preparing a mixture by mixing an inorganic filler with a release agent;
(b) spraying the mixture of step (a) into an injection mold to coat the surface of the injection mold with a release agent and an inorganic filler; and
(c) injecting the molten metal into the injection mold of step (b) and injecting;
In step (b), the release agent coated on the injection mold is burned out by the high temperature of the molten metal injected, and the inorganic filler has a melting point higher than that of the metal, so it does not melt and remains on the metal surface. Method of manufacturing a high radiation thermal conductivity heat dissipation system, characterized in that imparting conductivity. delete delete delete The method of claim 1,
The step (c) is a method of manufacturing a high radiation thermal conductivity heat dissipation system, characterized in that further comprising the step of pressing the inorganic filler sprayed on the upper surface of the heat dissipating member. Preparing a heat dissipating member made of a metal;
surface-treating the heat dissipating member; and
Including; coating a highly radiating heat conductive composition on the surface-treated heat dissipation member;
The high radiation thermal conductivity composition includes an inorganic filler comprising at least one of boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al2O3) and aluminum nitride (AlN) and foamed inorganic thermally conductive powder,
The surface treatment generates a large amount of voids on the surface of the heat dissipating member by selecting any one of a surface corrosion method by chemical etching and a sanding treatment method, or using both methods,
In the step of coating the high radiation heat conductive composition on the surface-treated heat dissipating member, the high radiation heat conductive composition including the inorganic filler is inserted into the pores generated by the surface treatment to improve high radiation heat conductivity Method of manufacturing a high radiation thermal conductivity heat dissipation system, characterized in that. [Claim 7] A high-radiation heat conductive heat dissipation system manufactured by the manufacturing method of any one of claims 1 or 5 or 6.

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