KR102383379B1 - Conductive silicone paste and the emi shield gasket prepared thereby - Google Patents

Abstract

Embodiments of the present invention relate to a conductive silicone paste and an electromagnetic wave shielding gasket manufactured therefrom. According to an embodiment of the present invention, the conductive silicone paste comprises: graphite (Ni/C) containing nickel or copper powder (Ag/Cu) containing silver; a curable binder; toluene; and aerogel powder mixed in a ratio of 0.1-0.7 wt% to 100 wt% of the conductive silicone paste. The present invention can improve workability and productivity of the electromagnetic wave shielding gasket.

Description

Conductive silicone paste and electromagnetic shielding gasket manufactured therefrom

An embodiment of the present invention relates to a conductive silicone paste having an excellent aspect ratio and an electromagnetic wave shielding gasket prepared therefrom.

With the development of the current IT industry, wireless communication equipment that uses radio waves to transmit and receive signals without restriction of movement using radio waves is widely used. The development of a network base station that provides mobility is intensifying.

For example, the mobile communication service, which started commercialization in 1984 as 1G, evolves in a 10-year cycle, goes through 2G in the 1990s, 3G in the 2000s, 4G in the 2010s, and 5G commercialization in the 2020s. For this reason, as the operating frequency increases for high-speed and large-capacity data transmission, the necessity of shielding unnecessary electromagnetic waves due to the controversy over the normal operation of communication devices and the harmfulness of electromagnetic waves to the human body increases. Phosphorus electromagnetic shielding gaskets are widely used.

In particular, 5G's official name is IMT-2020, which is 20 times faster than the existing 4G, 10 times shorter low latency, and 10 times more super-connected wireless communication technology. It can provide tactile Internet, autonomous driving, and telemedicine services. At this time, the frequency band of 5G is 3.5 GHz or 28 GHz, which is much higher than the 850 MHz and 1.8 GHz frequency bands used in 4G. It requires an empty high-frequency band and can achieve high speed due to its high linearity. However, 5G has a short wavelength, short reach, and small diffraction angle, which makes it difficult to penetrate buildings, which limits indoor use. Electromagnetic wave shielding materials are also being used more and more together.

The aspect ratio of the electromagnetic shielding gasket did not become a big problem when applying the electromagnetic shielding gasket because the bending step of the housing was not large for small communication devices such as existing mobile phones. However, in the case of a network base station, since the housing size of the communication equipment is large and the bending step of the housing is large and severe, the electromagnetic wave shielding gasket 15 is installed on the lower plate 12 of the housing as shown in FIG. 1 and then the upper plate 11 of the housing ), when the electromagnetic wave shielding gasket 15 with a bad aspect ratio is applied due to the bending step of the housing, a portion that does not contact the upper plate 11 of the housing occurs. To this end, the upper plate 11 and the lower plate 12 of the housing must be assembled using more assembly screws (S) in the region where the electromagnetic wave shielding gasket 15 does not contact, that is, in the region where the bending step of the housing is severe. There was a problem in that the unit cost of parts increased. Therefore, there is a need for a method to solve the above-mentioned problems by applying an electromagnetic wave shielding gasket having an excellent aspect ratio even if the bending step of the housing is severe.

Republic of Korea Patent Publication No. 10-0555438 (2006.02.20.)

SUMMARY Embodiments of the present invention are to provide a conductive silicone paste having excellent aspect ratio and electromagnetic wave shielding performance and an electromagnetic wave shielding gasket manufactured therefrom.

In addition, embodiments of the present invention are to provide a conductive silicone paste having excellent thixo properties and good discharge properties during dispensing, and an electromagnetic wave shielding gasket manufactured therefrom.

According to an embodiment of the present invention, there is provided a conductive silicone paste including graphite containing nickel (Ni/C) or copper powder containing silver (Ag/Cu), a curable binder, and toluene, wherein the A conductive silicone paste is provided, comprising airgel powder mixed in a ratio of 0.1 to 0.7% by weight relative to 100% by weight of the conductive silicone paste.

Here, based on 100% by weight of the total of the conductive silicone paste, the graphite or the copper powder is 60% by weight, the curable binder is 35% by weight, and the toluene may be mixed in a ratio of 4.3 to 4.9% by weight; The airgel powder may be mixed to form a total of 5% by weight with the toluene.

In this case, it is preferable that the airgel powder has an average particle diameter (D50) of 20 μm and a specific surface area of 1000 m 2 /g.

In addition, the graphite may be coated with nickel having a nickel content of 40 wt%, and the copper powder may be coated with silver having a silver content of 5 wt%.

On the other hand, the conductive silicone paste according to an embodiment of the present invention may include non-conductive glass beads mixed within 15% by weight compared to 100% by weight of the conductive silicone paste.

In this case, the non-conductive glass beads may be mixed so that the total amount of the graphite or the copper powder is 60% by weight.

In addition, the non-conductive glass beads preferably have a spherical shape having an average particle diameter (D50) of 10 to 50 μm and a tap density of 2.0 to 5.0 g/cc.

Meanwhile, the conductive silicone paste according to an embodiment of the present invention may contain a silicone thickener mixed in an amount of 2 wt% or less based on 100 wt% of the conductive silicone paste.

In this case, the silicone thickener may be made of poly(ethylene glycol-ran-propylene glycol) monobutyl ether.

Meanwhile, the curable binder may be made of a thermosetting binder or a moisture curable binder, wherein the curable binder may be cured at a temperature of 100 to 150° C. and the moisture curable binder may be cured at room temperature.

According to another embodiment of the present invention, nickel-containing graphite (Ni/C) or silver-containing copper powder (Ag/Cu), a curable binder, toluene, and airgel powder (Aerogel Powder) As an electromagnetic wave shielding gasket formed of a conductive silicone paste containing

Here, the conductive silicon paste may include non-conductive glass beads, and in this case, the non-conductive glass beads may be mixed within 15 wt % based on 100 wt % of the conductive silicon paste.

According to embodiments of the present invention, it is possible to improve shape stability after molding of the conductive silicone paste by including the airgel powder having excellent thixo properties and superhydrophobicity due to its high specific surface area, thereby improving the electromagnetic wave having excellent aspect ratio. A shielding gasket may be provided.

And, according to the embodiments of the present invention, it is possible to apply an electromagnetic wave shielding gasket having an excellent aspect ratio to the communication equipment, so that even if the housing bending step of the communication equipment is severe, it is possible to reduce the manufacturing cost of the communication equipment by preventing the use of an additional assembly screw. There are advantages that can be

In addition, according to embodiments of the present invention, it is possible to improve the formability of the conductive silicone paste by including the non-conductive glass beads that are easy to disperse and can increase the fluidity, thereby improving the discharge properties even when the viscosity of the conductive silicone paste increases. There is an advantage in that the workability and productivity of the electromagnetic wave shielding gasket can be improved.

1 is a cross-sectional view schematically showing a state in which an electromagnetic wave shielding gasket made of a conventional conductive silicon paste is applied to a housing of a base station communication equipment;
2 is a cross-sectional view schematically illustrating a state in which an electromagnetic wave shielding gasket made of a conductive silicon paste according to an embodiment of the present invention is applied to a housing of a base station communication equipment;

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. The following detailed description is provided to provide a comprehensive understanding of the methods, apparatus, and/or systems described herein. However, this is merely an example and the disclosed embodiments are not limited thereto.

In describing the embodiments, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the disclosed embodiments, the detailed description thereof will be omitted. And, the terms to be described later are terms defined in consideration of functions in the disclosed embodiments, which may vary according to intentions or customs of users and operators. Therefore, the definition should be made based on the content throughout this specification. The terminology used in the detailed description is for the purpose of describing the embodiments only, and should in no way be limiting. Unless explicitly used otherwise, expressions in the singular include the meaning of the plural. In this description, expressions such as “comprising” or “comprising” are intended to indicate certain features, numbers, steps, acts, elements, some or a combination thereof, one or more other than those described. It should not be construed to exclude the presence or possibility of other features, numbers, steps, acts, elements, or any part or combination thereof.

The conductive silicone paste according to an embodiment of the present invention includes a graphite (Ni/C) containing nickel or a copper powder (Ag/Cu) containing silver, a curable binder, toluene, and an airgel powder ( Aerogel Powder) may be included.

Here, the airgel powder may be mixed in a ratio of 0.1 to 0.7% by weight relative to 100% by weight of the conductive silicone paste. That is, when the conductive silicone paste according to an embodiment of the present invention is manufactured like an electromagnetic wave shielding gasket through a manufacturing process such as injection, thixo (thixo) that can stably maintain the shape without spreading the paste by providing shape stability of the paste ) The airgel powder may be mixed to impart properties.

More specifically, the conductive silicone paste may be mixed in a ratio of about 60% by weight, the curable binder, 35% by weight, and the toluene, based on 100% by weight of the total, the graphite or the copper powder in a ratio of 4.3 to 4.9% by weight, , eventually, the airgel powder may be mixed in an amount of 0.1 to 0.7% by weight so that the total amount with the toluene constitutes 5% by weight. In this case, the airgel powder may be formed to have an average particle diameter (D50) of 20 μm and a specific surface area of 1000 m 2 /g or less. In addition, the graphite may be coated with nickel having a nickel content of 40 wt% as conductive particles, and the copper powder may be coated with silver having a silver content of 5 wt% so that the conductive silicon paste may have conductivity . At this time, the curable binder may be a thermosetting binder or a moisture curable binder, the thermosetting binder may be cured at a temperature of 100 ~ 150 ℃, the moisture curable binder may be cured at room temperature.

Accordingly, the conductive silicone paste of this embodiment maintains efficient conductivity and contains the aerogel powder, so that it has a high specific surface area, so it has excellent thixotropy and superhydrophobic properties even with a small content. As a result, when commercialized as an electromagnetic wave shielding gasket, an electromagnetic wave shielding gasket having an excellent aspect ratio can be provided.

Hereinafter, various manufacturing examples of the conductive silicone paste of this embodiment will be described in more detail in comparison with the comparative examples of the conventional conductive silicone paste.

comparative example

As an existing conductive silicone paste, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt%, which is a conductive particle, 35 wt% of a curable binder, and 5 wt% of toluene was mixed using a planetary mixer 30 It was prepared by mixing for minutes.

Preparation Example 1

As an example of the composition of the conductive silicone paste of this embodiment, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles, 35 wt% of a curable binder, 4.9 wt% of toluene, airgel powder 0.1% by weight was prepared by mixing for 30 minutes using a planetary mixer.

Preparation 2

As an example of the composition of the conductive silicone paste of this embodiment, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles, 35 wt% of a curable binder, 4.7 wt% of toluene, airgel powder 0.3% by weight was prepared by mixing for 30 minutes using a planetary mixer.

Preparation 3

As an example of the composition of the conductive silicone paste of this embodiment, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles, 35 wt% of a curable binder, 4.5 wt% of toluene, airgel powder 0.5 wt% was prepared by mixing for 30 minutes using a planetary mixer.

Preparation 4

As an example of the composition of the conductive silicone paste of this embodiment, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles, 35 wt% of a curable binder, 4.3 wt% of toluene, airgel powder 0.7 wt% was prepared by mixing for 30 minutes using a planetary mixer.

Preparation 5

As an example of the composition of the conductive silicone paste of this embodiment, 60 wt% of graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles, 35 wt% of a curable binder, 4.1 wt% of toluene, airgel powder 0.9 wt% was prepared by mixing for 30 minutes using a planetary mixer.

That is, the composition ratios from Comparative Example to Preparation Example 5 are shown in Table 1 below.

Ni/C thermosetting binder or
moisture curable binder toluene airgel powder Sum comparative example 60 35 5 - 100 Preparation Example 1 60 35 4.9 0.1 100 Preparation 2 60 35 4.7 0.3 100 Preparation 3 60 35 4.5 0.5 100 Preparation 4 60 35 4.3 0.7 100 Preparation 5 60 35 4.1 0.9 100

test example

As shown in Table 1 above, using the conductive silicone pastes from Comparative Examples to Preparation Example 5, dispensing length 100mm, line width 0.6mm, and then through a curing process to prepare aspect ratio comparison specimens, the discharge amount and line width of the prepared specimens , liquid level, and the measurement results of the aspect ratio are shown in Table 2 below. At this time, the discharge amount was measured by discharging at a pressure of 2 bar per minute using the 0.6Φ nozzle of the dispenser. And, the line width was measured at 50 magnification using a digital microscope. In addition, the liquid level was measured using a digimatic indicator (comparator). Here, the curable binder may include a one-component thermosetting silicone resin as a thermosetting binder and may be cured at a temperature of 100 to 150° C., may include a one-component moisture curing silicone resin as a moisture curable binder, and may be cured at room temperature. there is.

comparative example Preparation Example 1 Preparation 2 Preparation 3 Preparation 4 Preparation 5 Discharge (g/min) 0.50 0.47 0.45 0.36 0.26 No discharge Line width (R) 0.60 0.59 0.58 0.57 0.45 not measurable Liquid level (A) 0.40 0.43 0.45 0.48 0.39 not measurable Aspect Ratio (A/R) 0.66 0.72 0.77 0.84 0.86 not measurable

Referring to Table 2, it can be seen that the aspect ratio increases as the content of the airgel powder increases. However, as in Preparation Example 5, when the content of the aerogel powder exceeds 0.7% by weight, the viscosity increased relatively rapidly compared to the increase in the aspect ratio, and discharging through the nozzle was impossible. After all, the conductive silicone paste according to an embodiment of the present invention is preferably mixed with the airgel powder in an amount of 0.1 to 0.7% by weight.

On the other hand, the conductive silicone paste according to an embodiment of the present invention may increase the aspect ratio by including the aerogel powder as described above, but the discharge amount may be relatively reduced and thus the moldability may be deteriorated.

Accordingly, the conductive silicon paste may include non-conductive glass beads in order to prevent a drop in the discharge amount during dispensing. Here, the non-conductive glass is preferably mixed within 15% by weight of 100% by weight of the conductive silicon paste in order to prevent a relative decrease in conductivity. In this case, the non-conductive glass beads may be mixed with nickel-containing graphite (Ni/C) or silver-containing copper powder (Ag/Cu) to form a total of 60 wt%. In addition, the non-conductive glass beads preferably have a spherical shape having an average particle diameter (D50) of 10 to 50 μm and a tap density of 2.0 to 5.0 g/cc.

Hereinafter, various manufacturing examples of the conductive silicone paste including the non-conductive glass beads will be described in more detail compared to the comparative examples of the conventional conductive silicone paste.

comparative example

As an existing conductive silicone paste, graphite (Ni/C) coated with nickel with a nickel content of 40 wt% as conductive particles or copper powder (Ag/Cu) coated with silver with a silver content of 5 wt% as conductive particles (Ag/Cu) 60 wt% , 35% by weight of a curable binder, 4.7% by weight of toluene, and 0.3% by weight of aerogel Founder were prepared by mixing for 30 minutes using a planetary mixer.

Preparation Example 1

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 59% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 1% by weight were prepared by mixing for 30 minutes using a planetary mixer.

Preparation 2

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 57% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 3% by weight were prepared by mixing for 30 minutes using a planetary mixer.

Preparation 3

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 55% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 5% by weight were prepared by mixing for 30 minutes using a planetary mixer.

Preparation 4

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 50% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 10% by weight were prepared by mixing for 30 minutes using a planetary mixer.

Preparation 5

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 45% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 15% by weight were prepared by mixing for 30 minutes using a planetary mixer.

Preparation 6

As an example of the composition of the conductive silicone paste of this embodiment, graphite (Ni/C) coated with nickel having a nickel content of 40 wt% as conductive particles or copper powder coated with silver having a silver content of 5 wt% as conductive particles (Ag/Cu) 40% by weight, curable binder 35% by weight, toluene 4.7% by weight, airgel powder 0.3% by weight, and non-conductive glass beads 20% by weight were prepared by mixing for 30 minutes using a planetary mixer.

That is, the composition ratios from Comparative Example to Preparation Example 6 are shown in Table 3 below.

Ni/C or
Ag/Cu curable binder toluene airgel powder glass bead Sum comparative example 60 35 4.7 0.3 - 100 Preparation Example 1 59 35 4.7 0.3 One 100 Preparation 2 57 35 4.7 0.3 3 100 Preparation 3 55 35 4.7 0.3 5 100 Preparation 4 50 35 4.7 0.3 10 100 Preparation 5 45 35 4.7 0.3 15 100 Preparation 6 40 35 4.7 0.3 20 100

test example

As shown in Table 3 above, using the conductive silicone pastes from Comparative Examples to Preparation Example 6, dispensing length 100 mm, line width 0.6 mm, and then through a curing process to prepare aspect ratio comparison specimens, the discharge amount and line width of the prepared specimens , liquid level, aspect ratio, and the measurement results of specific resistance are shown in Table 4 below. At this time, the discharge amount was measured by discharging at a pressure of 2 bar per minute using the 0.6Φ nozzle of the dispenser. Then, the line width was measured at 50 magnification using a digital microscope. In addition, the liquid level was measured using a digimatic indicator (comparator). In addition, the resistivity was measured by a multimeter (Keithley 2000 multimeter) ASTM D991 method capable of supporting 4 terminals by manufacturing a resistivity sheet of 2×1×80 mm. Here, the curable binder may include a one-component thermosetting silicone resin as a thermosetting binder and may be cured at a temperature of 100 to 150° C., may include a one-component moisture curing silicone resin as a moisture-curable binder, and may be cured at room temperature. there is.

comparative example Preparation Example 1 Preparation 2 Preparation 3 Preparation 4 Preparation 5 Preparation 6 Discharge (g/min) 0.44 0.48 0.53 0.57 0.60 0.75 0.90 Line width (R) 0.58 0.59 0.61 0.63 0.65 0.75 0.95 Liquid level (A) 0.44 0.43 0.44 0.46 0.45 0.43 0.38 Aspect Ratio (A/R) 0.75 0.72 0.72 0.73 0.70 0.57 0.40 Specific resistance (Ω cm) 0.02 0.03 0.05 0.08 0.09 0.50 1.00

Referring to Table 4, it can be seen that the discharge amount increases as the content of the non-conductive glass beads increases. However, as in Preparation Example 5, when the content of the non-conductive glass beads is 15% by weight or more, as the discharge amount increases, not only the aspect ratio is lowered, but also the specific resistance is rapidly increased, so that the electromagnetic wave shielding performance is rapidly deteriorated. After all, in the conductive silicone paste according to an embodiment of the present invention, it is preferable to mix the non-conductive glass beads in an amount of 15% by weight or less.

On the other hand, the conductive silicone paste according to an embodiment of the present invention further contains a silicone thickener, thereby suppressing the behavior of molecules in a thickening method by hydrogen bonding to improve thixotropy, that is, spreading properties, thereby increasing thixo. It is also possible to increase the aspect ratio of products manufactured from Here, the silicone thickener is preferably mixed in an amount of 2% by weight or less based on 100% by weight of the conductive silicone paste in order to prevent a decrease in the discharge amount due to an increase in viscosity. In this case, the silicone thickener may be made of poly(ethylene glycol-ran-propylene glycol) monobutyl ether.

In conclusion, as shown in FIG. 2 , the electromagnetic wave shielding gasket 150 made of the conductive silicone paste according to an embodiment of the present invention has similar electromagnetic wave shielding performance, substrate adhesion, and elastic restoring force compared to the existing electromagnetic wave shielding gasket. While having physical properties, it has excellent thixotropic properties, that is, shape stability after molding, so that it can have an excellent aspect ratio.

Therefore, the electromagnetic wave shielding gasket 150 made of the conductive silicone paste according to an embodiment of the present invention is excellent even if the bending step of the housing is severe when the upper plate 11 of the housing is assembled after being installed on the lower plate 12 of the housing. Due to the aspect ratio, it may come into contact with the upper plate 11 of the housing, and thus, when assembling the upper plate 11 and the lower plate 12 of the housing, an additional assembly screw (S) is unnecessary, thereby improving workability and productivity, and manufacturing cost. can save

Although representative embodiments of the present invention have been described in detail above, those of ordinary skill in the art to which the present invention pertains will understand that various modifications are possible within the limits without departing from the scope of the present invention with respect to the above-described embodiments. . Therefore, the scope of the present invention should not be limited to the described embodiments, and should be defined by the claims described below as well as the claims and equivalents.

11: housing top plate
12: housing lower plate
15, 150: electromagnetic wave shielding gasket
S: Assembly screw

Claims (15)

As a conductive silicone paste containing graphite (Ni/C) containing nickel or copper powder containing silver (Ag/Cu), a curable binder, and toluene (Toluene),
Airgel powder mixed in a ratio of 0.1 to 0.7% by weight compared to 100% by weight of the conductive silicone paste (Aerogel Powder); and
Containing, conductive silicone paste comprising a; non-conductive glass beads mixed within 15% by weight compared to 100% by weight of the conductive silicone paste.
The method according to claim 1,
Based on 100% by weight of the total of the conductive silicone paste, the graphite or the copper powder is 60% by weight, the curable binder is 35% by weight, and the toluene is mixed in a ratio of 4.3 to 4.9% by weight;
The airgel powder is mixed to form a total of 5% by weight with the toluene, conductive silicone paste.
The method according to claim 1 or 2,
The airgel powder has an average particle diameter (D50) of 20 μm and a specific surface area of 1000 m 2 /g, a conductive silicone paste.
The method according to claim 1,
The graphite is coated with nickel having a nickel content of 40% by weight, conductive silicone paste.
The method according to claim 1,
The conductive silicone paste, wherein the copper powder is coated with silver having a silver content of 5% by weight.
delete The method according to claim 1,
The conductive silicone paste, wherein the non-conductive glass beads are mixed to form a total of 60 wt% with the graphite or the copper powder.
8. The method according to claim 1 or 7,
The non-conductive glass beads have a spherical shape having an average particle diameter (D50) of 10 to 50 μm and a tap density of 2.0 to 5.0 g/cc, a conductive silicone paste.
The method according to claim 1,
A conductive silicone paste comprising a silicone thickener mixed in an amount of 2% by weight or less based on 100% by weight of the conductive silicone paste.
10. The method of claim 9,
The silicone thickener is made of poly(ethylene glycol-ran-propylene glycol) monobutyl ether, conductive silicone paste.
The method according to claim 1,
The curable binder is a thermosetting binder or a moisture curable binder, conductive silicone paste.
12. The method of claim 11,
The curing temperature of the thermosetting binder is 100 ~ 150 ℃, the moisture curable binder is cured at room temperature, conductive silicone paste.
Graphite (Ni/C) containing nickel or copper powder (Ag/Cu) containing silver, a curable binder, toluene, airgel powder, and conductive including non-conductive glass beads An electromagnetic wave shielding gasket formed of silicon paste, comprising:
The airgel powder is mixed in a ratio of 0.1 to 0.7% by weight compared to 100% by weight of the conductive silicone paste,
The non-conductive glass beads are mixed within 15% by weight compared to 100% by weight of the conductive silicone paste, electromagnetic wave shielding gasket.
delete An electronic device provided with the electromagnetic wave shielding gasket of claim 13 .

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