KR102373941B1 - 반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 - Google Patents

반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 Download PDF

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KR102373941B1
KR102373941B1 KR1020167014743A KR20167014743A KR102373941B1 KR 102373941 B1 KR102373941 B1 KR 102373941B1 KR 1020167014743 A KR1020167014743 A KR 1020167014743A KR 20167014743 A KR20167014743 A KR 20167014743A KR 102373941 B1 KR102373941 B1 KR 102373941B1
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defects
floating
trees
class
floating trees
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KR20160083055A (ko
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치엔-후에이 아담 첸
크리스토퍼 마허
패트릭 휴에트
타이-캄 응
존 알. 조단 Iii
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케이엘에이 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H01L22/12—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/24323—Tree-organised classifiers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/245—Classification techniques relating to the decision surface
    • G06K9/6282—
    • G06K9/6285—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H01L22/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020167014743A 2013-11-03 2014-11-03 반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 Active KR102373941B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361899220P 2013-11-03 2013-11-03
US61/899,220 2013-11-03
US201461972418P 2014-03-31 2014-03-31
US61/972,418 2014-03-31
US14/257,921 US9489599B2 (en) 2013-11-03 2014-04-21 Decision tree construction for automatic classification of defects on semiconductor wafers
US14/257,921 2014-04-21
PCT/US2014/063668 WO2015066602A1 (en) 2013-11-03 2014-11-03 Decision tree construction for automatic classification of defects on semiconductor wafers

Publications (2)

Publication Number Publication Date
KR20160083055A KR20160083055A (ko) 2016-07-11
KR102373941B1 true KR102373941B1 (ko) 2022-03-11

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US (1) US9489599B2 (https=)
JP (1) JP6576342B2 (https=)
KR (1) KR102373941B1 (https=)
TW (1) TWI617799B (https=)
WO (1) WO2015066602A1 (https=)

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US11055069B2 (en) * 2015-07-31 2021-07-06 Rakuten, Inc. Tree structure data editing device, tree structure data editing method, and program
JP7015235B2 (ja) * 2015-08-05 2022-02-02 ケーエルエー コーポレイション 範囲に基づくリアルタイム走査電子顕微鏡非可視ビナー
TWI737659B (zh) * 2015-12-22 2021-09-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10204290B2 (en) 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
US10185728B2 (en) * 2016-12-19 2019-01-22 Capital One Services, Llc Systems and methods for providing data quality management
TWI660322B (zh) * 2018-05-17 2019-05-21 國立成功大學 考慮機台交互作用之辨識良率損失原因的系統與方法
US11321633B2 (en) * 2018-12-20 2022-05-03 Applied Materials Israel Ltd. Method of classifying defects in a specimen semiconductor examination and system thereof
WO2021076609A1 (en) * 2019-10-14 2021-04-22 Pdf Solutions, Inc. Collaborative learning model for semiconductor applications
CN113298166A (zh) * 2021-06-01 2021-08-24 中科晶源微电子技术（北京）有限公司 缺陷分类器和缺陷分类方法、装置、设备及存储介质
WO2023166584A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
WO2023166585A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
US20250117915A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Optical inspection-based automatic defect classification

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JP2004047939A (ja) * 2002-05-23 2004-02-12 Hitachi High-Technologies Corp 欠陥分類器の生成方法および欠陥自動分類方法
JP2009103508A (ja) * 2007-10-22 2009-05-14 Hitachi Ltd 欠陥分類方法及びその装置
JP2011254084A (ja) * 2011-06-27 2011-12-15 Hitachi High-Technologies Corp 欠陥分類方法及びその装置

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US6148099A (en) 1997-07-03 2000-11-14 Neopath, Inc. Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
JP4908995B2 (ja) 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
JP4616864B2 (ja) 2007-06-20 2011-01-19 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置および画像処理評価システム
US8233494B2 (en) 2008-01-22 2012-07-31 International Business Machines Corporation Hierarchical and incremental multivariate analysis for process control
US8315453B2 (en) 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
US8502146B2 (en) 2011-10-03 2013-08-06 Kla-Tencor Corporation Methods and apparatus for classification of defects using surface height attributes
TWI574136B (zh) * 2012-02-03 2017-03-11 應用材料以色列公司 基於設計之缺陷分類之方法及系統
TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法
US8948494B2 (en) 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples

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JP2004047939A (ja) * 2002-05-23 2004-02-12 Hitachi High-Technologies Corp 欠陥分類器の生成方法および欠陥自動分類方法
JP2009103508A (ja) * 2007-10-22 2009-05-14 Hitachi Ltd 欠陥分類方法及びその装置
JP2011254084A (ja) * 2011-06-27 2011-12-15 Hitachi High-Technologies Corp 欠陥分類方法及びその装置

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TW201525450A (zh) 2015-07-01
US20150125064A1 (en) 2015-05-07
US9489599B2 (en) 2016-11-08
JP2017502500A (ja) 2017-01-19
TWI617799B (zh) 2018-03-11
JP6576342B2 (ja) 2019-09-18
WO2015066602A1 (en) 2015-05-07
KR20160083055A (ko) 2016-07-11

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