KR102356169B1 - Manufacturing method of deck board - Google Patents

Manufacturing method of deck board Download PDF

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Publication number
KR102356169B1
KR102356169B1 KR1020200050550A KR20200050550A KR102356169B1 KR 102356169 B1 KR102356169 B1 KR 102356169B1 KR 1020200050550 A KR1020200050550 A KR 1020200050550A KR 20200050550 A KR20200050550 A KR 20200050550A KR 102356169 B1 KR102356169 B1 KR 102356169B1
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South Korea
Prior art keywords
wood
deck board
copper
zinc
zeolite
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KR1020200050550A
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Korean (ko)
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KR20210132321A (en
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한문수
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주식회사 이데크
한문수
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Priority to KR1020200050550A priority Critical patent/KR102356169B1/en
Publication of KR20210132321A publication Critical patent/KR20210132321A/en
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    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/04Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
    • E04F15/041Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
    • E04F15/043Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material the lower layer being of organic plastic with or without reinforcements or filling materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27KPROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K3/00Impregnating wood, e.g. impregnation pretreatment, for example puncturing; Wood impregnation aids not directly involved in the impregnation process
    • B27K3/16Inorganic impregnating agents
    • B27K3/22Compounds of zinc or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27KPROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K3/00Impregnating wood, e.g. impregnation pretreatment, for example puncturing; Wood impregnation aids not directly involved in the impregnation process
    • B27K3/16Inorganic impregnating agents
    • B27K3/32Mixtures of different inorganic impregnating agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27MWORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
    • B27M1/003Mechanical surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27MWORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
    • B27M1/00Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
    • B27M1/06Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by burning or charring, e.g. cutting with hot wire
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F13/00Coverings or linings, e.g. for walls or ceilings
    • E04F13/07Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
    • E04F13/08Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
    • E04F13/10Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements of wood or with an outer layer of wood
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/02177Floor elements for use at a specific location
    • E04F15/02183Floor elements for use at a specific location for outdoor use, e.g. in decks, patios, terraces, verandas or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B27WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27KPROCESSES, APPARATUS OR SELECTION OF SUBSTANCES FOR IMPREGNATING, STAINING, DYEING, BLEACHING OF WOOD OR SIMILAR MATERIALS, OR TREATING OF WOOD OR SIMILAR MATERIALS WITH PERMEANT LIQUIDS, NOT OTHERWISE PROVIDED FOR; CHEMICAL OR PHYSICAL TREATMENT OF CORK, CANE, REED, STRAW OR SIMILAR MATERIALS
    • B27K2240/00Purpose of the treatment
    • B27K2240/20Removing fungi, molds or insects

Abstract

본 발명은 목재 데크보드에 관한 것으로서, 아연 및 구리가 담지된 제올라이트가 분산된 함침액으로 처리되며, 일면에 불규칙한 요철면을 형성됨으로써, 목재데크의 곰팡이 발생 및 부패를 방지하여 제품의 품질 및 수명을 향상시키고 다양한 프레임에 적용하여 시공할 수 있다.The present invention relates to a wooden deck board, which is treated with an impregnating liquid in which zinc and copper-supported zeolite are dispersed, and by forming an irregular uneven surface on one surface, prevents mold and decay of the wooden deck, resulting in product quality and lifespan can be improved and applied to various frames for construction.

Description

데크보드의 제조방법.{MANUFACTURING METHOD OF DECK BOARD}Method of manufacturing deck board. {MANUFACTURING METHOD OF DECK BOARD}

본 발명은 데크보드의 제조방법에 관한 것으로, 더욱 상세하게는, 목분, 목섬유 또는 원목 등을 이용하여 데크보드를 제조하는 공정에 있어서, 항곰팡이성 조성물을 이용하여 함침 공정을 수행함으로써 데크보드의 보존성을 향상시킨 데크보드의 제조방법에 관한 것이다.The present invention relates to a method for manufacturing a deck board, and more particularly, in the process of manufacturing a deck board using wood flour, wood fiber or solid wood, etc., by performing an impregnation process using an antifungal composition. It relates to a method for manufacturing a deck board with improved preservation.

데크보드는 건축물의 내장재, 외장재, 바닥재 등에 사용되는 것으로서 천연 원목을 가공하여 제조하거나 합성 목재를 가공하여 제조하고 있다.The deck board is used for interior materials, exterior materials, flooring materials of buildings, and is manufactured by processing natural wood or processing synthetic wood.

천연 원목은 상용시 뒤틀림, 균열, 곰팡이 발생, 부패 등의 문제점으로 인해 장시간 습식 건조, 방부 처리 등의 공정이 필요하며, 합성 목재의 경우에도 동일한 문제가 발생하여 이를 방지하고 제품 수명을 연장시키기 위한 처리 공정이 필요하다.Natural wood requires long-term wet drying and antiseptic treatment due to problems such as warping, cracking, mold, and decay during commercial use. processing is required.

출원인은 대한민국 등록특허공보 10-1149280호를 통해 목섬유를 원료로 한 데크보드의 표면에 불규칙한 요철면을 가공을 하여 강도, 휨방지 및 균열 등의 발생을 억제하고 미끄럼 저항성을 향상시키고 있다.Through Korean Patent Publication No. 10-1149280, the applicant is processing the irregular uneven surface on the surface of the deck board made of wood fiber as a raw material to suppress the occurrence of strength, warpage, cracks, etc., and improve the slip resistance.

그러나 이러한 데크보드에 있어서도 장기간 사용시 곰팡이 발생이나 부패의 문제가 발생하고 있어 데크보드를 제조하는 공정을 최적화할 필요가 있다.However, even in such a deck board, it is necessary to optimize the process of manufacturing a deck board because the problem of mold or rot occurs during long-term use.

목재에 항균, 항곰팡이 성능을 부여하는 방법으로는 대한민국 등록특허공보 10-1823826호에서 황토를 함유하는 함침액에 목재를 함침하는 방법이 공지되어 있는데, 데크보드의 경우 원료인 목재를 고온, 고압에서 압축하여 성형하는 공정이 필요하므로, 이러한 함침액으로 목재를 처리하더라도 성형 공정 후 항균, 항곰팡이 성능이 저하되는 문제점이 있다.As a method of imparting antibacterial and antifungal performance to wood, a method of impregnating wood with an impregnation solution containing ocher is known in Korean Patent No. 10-1823826, and in the case of deck board, wood, which is a raw material, is heated at high temperature and high pressure. Since the process of molding by compression is required, there is a problem in that the antibacterial and antifungal performance is deteriorated after the molding process even if the wood is treated with such an impregnation solution.

또한, 대한민국 등록특허공보 10-1333743호에서는 은 및 아연을 전체 중량 대비 5 중량%로 담지시킨 제올라이트계 곰팡이 방지제를 적용하고 있어, 이 경우 목재의 성형 공정 후에도 항곰팡이 성능을 유지할 수는 있으나, 이 경우 목분, 바인더 수지와 함께 상기 곰팡이 방지제를 혼합하여 성형 가공하기 때문에 합성 목재를 이용한 데크보드에만 적용할 수 있고, 원목의 경우 적용하기 곤란한 문제점이 있다. In addition, in Korean Patent No. 10-1333743, a zeolite-based fungicide in which silver and zinc are supported in an amount of 5% by weight based on the total weight is applied. In the case of wood powder, since the mold inhibitor is mixed with the binder resin and molded, it can be applied only to deck boards using synthetic wood, and there is a problem in that it is difficult to apply in the case of solid wood.

대한민국 등록특허공보 10-1149280호Republic of Korea Patent Publication No. 10-1149280 대한민국 등록특허공보 10-1823826호Republic of Korea Patent Publication No. 10-1823826 대한민국 등록특허공보 10-1333743호Republic of Korea Patent Publication No. 10-1333743 대한민국 공개특허공보 10-2019-0038380호Korean Patent Publication No. 10-2019-0038380

본 발명은 상기와 같은 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 목재데크의 제조공정 중 함침 공정을 최적화함으로써 제조된 목재데크의 곰팡이 발생 및 부패를 방지하여 제품의 품질 및 수명을 향상시키는 것을 그 목적으로 한다.The present invention has been devised to solve the problems of the prior art as described above, and by optimizing the impregnation process during the manufacturing process of the wooden deck, it prevents mold generation and decay of the manufactured wooden deck, thereby improving the quality and lifespan of the product. for that purpose

상기와 같은 과제를 해결하기 위한 본 발명의 목재 데크보드는 아연 및 구리가 담지된 제올라이트가 분산된 함침액으로 처리되며, 일면에 불규칙한 요철면을 형성되는 것을 특징으로 한다.The wooden deck board of the present invention for solving the above problems is treated with an impregnation solution in which zinc and copper-supported zeolite are dispersed, characterized in that an irregular uneven surface is formed on one surface.

또한, 상기 데크보드는 목재 원료를 절단, 분쇄 또는 펠릿화하여 제조된 임가공 목재를 아연 및 구리가 담지된 제올라이트가 분산된 함침액에 투입하고 함침 및 숙성한 후, 상기 임가공 목재를 가압, 절단 및 표면 가공하여 제조될 수 있다.In addition, the deck board is prepared by cutting, pulverizing or pelletizing a wood raw material, put in an impregnation solution in which zinc and copper-supported zeolite are dispersed, impregnated and aged, and then pressurizing, cutting and It can be manufactured by surface processing.

또한, 상기 데크보드를 구성하는 상기 임가공 목재는 탄화 처리된 임가공 목재일 수 있다.In addition, the im-processed wood constituting the deck board may be carbonized im-processed wood.

본 발명에 따른 목재데크의 제조방법은 목재데크의 제조공정 중 함침 공정을 최적화함으로써 제조된 목재데크의 곰팡이 발생 및 부패를 방지하여 제품의 품질 및 수명을 향상시키는 효과를 나타낸다.The method for manufacturing a wooden deck according to the present invention shows the effect of improving the quality and lifespan of the product by preventing mold and decay of the manufactured wooden deck by optimizing the impregnation process during the manufacturing process of the wooden deck.

이하 본 발명을 상세하게 설명한다.Hereinafter, the present invention will be described in detail.

본 발명에 따른 목재 데크보드는 아연 및 구리가 담지된 제올라이트가 분산된 함침액으로 처리되며, 일면에 불규칙한 요철면을 형성되는 것을 특징으로 한다. 상기 목재 데크보드의 일면에 형성되는 불규칙한 요철면은 데크보드를 제조하는 공정 중 몰더기를 사용하여 표면가공함으로써 형성될 수 있는데, 이러한 일면에 형성된 요철면은 미끄럼 방지의 효과를 나타내기 위한 것으로서, 상기 목재 데크보드를 시공한 후 이용자가 데크보드 표면에서 미끌어지는 현상을 억제할 수 있는 구조를 제공하게 된다.The wooden deck board according to the present invention is treated with an impregnating solution in which zinc and copper-supported zeolite are dispersed, and is characterized in that an irregular uneven surface is formed on one surface. The irregular uneven surface formed on one surface of the wooden deck board can be formed by surface processing using a molder during the process of manufacturing the deck board. After constructing the wooden deck board, the user will provide a structure that can suppress the sliding phenomenon on the surface of the deck board.

상기 목재 데크보드는 목재 원료를 절단, 분쇄 또는 펠릿화하여 임가공 목재를 제조하는 단계, 상기 임가공 목재를 아연 및 구리가 담지된 제올라이트가 분산된 함침액에 투입하고 함침하여 함침 목재를 제조하는 단계, 상기 함침 목재를 숙성한 후 가압 및 절단 가공하여 데크보드를 제조하는 단계, 상기 데크보드를 표면 가공하여 일면에 불규칙한 요철면을 형성하는 표면 가공 단계를 포함하는 것을 특징으로 한다. 또한, 상기 표면 가공을 통해 불규칙한 요철면이 형성된 데크보드는 몰더 가공을 통해 최종적인 데크보드 형상으로 완성된다. 또한, 제조된 데크보드의 제품의 보호를 위해 표면에 천연오일을 도포하는 공정을 수행할 수 있다.The wooden deck board is prepared by cutting, pulverizing, or pelletizing a wood raw material to produce unprocessed wood, inserting the unprocessed wood into an impregnation solution in which zinc and copper-supported zeolite are dispersed and impregnated to produce impregnated wood; It is characterized in that it comprises a step of manufacturing a deck board by pressing and cutting processing after aging the impregnated wood, and a surface processing step of surface processing the deck board to form an irregular concave-convex surface on one surface. In addition, the deck board on which the irregular uneven surface is formed through the surface processing is completed in the final deck board shape through the molding process. In addition, it is possible to perform a process of applying natural oil to the surface for protection of the manufactured deck board product.

즉, 벌목한 나무를 절단하여 임가공 목재를 제조하여 이를 통해 목재 데크보드를 제조하게 된다. 목재 데크보드의 경우, 제조 후 표면 처리 등을 거치기는 하나 시간이 경과하면서 재질이 열화되는 것을 피할 수 없으며, 특히 곰팡이가 쉽게 발생하기 때문에 목재 재질의 부식뿐만 아니라 목재 본연의 심미적 효과도 저감되어 제품의 품질에 직접적인 영향을 미치고 있다. 목분과 플라스틱을 혼합한 합성목재의 경우 곰팡이의 문제가 적기는 하나 수팽창, 변색 정도가 크고 휨 강도가 상대적으로 작아 사용수명이 짧기 때문에 원목으로부터 목재 데크보드를 제조하여 제품의 품질을 향상시키고 있다. In other words, by cutting the felled wood to manufacture the processed wood, it is to manufacture a wooden deck board through this. In the case of wooden deck boards, although they undergo surface treatment after manufacturing, it is inevitable that the material deteriorates over time. has a direct impact on the quality of In the case of synthetic wood mixed with wood flour and plastic, there is little mold problem, but the degree of water expansion and discoloration is large and the service life is short due to the relatively small bending strength. .

이러한 목재 데크보드의 곰팡이와 곤란한 문제점을 해결하기 위하여 상기 임가공 목재를 탄화 처리할 수도 있는데, 탄화 처리의 경우 200 내지 250℃의 온도에서 열처리함으로써 목재의 표면 부분을 탄화처리하는 반탄화가 가능한데, 이를 통해 방충, 방부 및 곰팡이 발생을 억제할 수 있게 된다.In order to solve the mold and difficult problems of these wooden deck boards, the unprocessed wood may be carbonized, and in the case of carbonization, torrefaction of carbonizing the surface of the wood is possible by heat treatment at a temperature of 200 to 250 ° C., Through this, it is possible to suppress the occurrence of insect repellent, antiseptic and mold.

그러나 이러한 탄화 처리만으로는 곰팡이 발생을 충분히 억제할 수 없고 목재의 재질에 따라 탄화 처리에 의한 색감이 저하되는 경우도 있기 때문에 모든 목재 원료에 대하여 탄화 처리를 적용할 수는 없는 문제점이 있다. However, there is a problem that carbonization treatment cannot be applied to all wood raw materials because the carbonization treatment alone cannot sufficiently suppress the occurrence of mold and there are cases where the color due to the carbonization treatment is lowered depending on the material of the wood.

이러한 문제점을 해결하기 위하여 항곰팡이 성능을 나타내는 산화티탄, 산화구리, 산화아연과 같은 무기물질을 적용할 수도 있다. 예를 들어, 대한민국 공개특허공보 10-2019-0038380호에서는 산화티타늄 미립자와 항곰팡이성 금속을 함유하는 합금 미립자를 혼합한 항곰팡이제를 각종 부재의 표면에 적용하는 기술이 개시되어 있다. 그러나 목재데크의 경우 금속 성분이 검출되면 안 되며, 시판되는 목재데크의 경우 유해물질 검출시험에서 납, 카드뮴, 크롬, 구리, 아스타틴, 수은, 아연, 니켈 등의 금속이 검출되지 않아야 하는 등 무기물질을 항곰팡이제로 적용하기에는 문제점이 있다.In order to solve this problem, inorganic materials such as titanium oxide, copper oxide, and zinc oxide that exhibit antifungal performance may be applied. For example, Korean Patent Laid-Open Publication No. 10-2019-0038380 discloses a technique for applying an antifungal agent mixed with titanium oxide fine particles and alloy fine particles containing an antifungal metal to the surface of various members. However, in the case of wooden decks, metal components should not be detected, and in the case of commercially available wooden decks, metals such as lead, cadmium, chromium, copper, astatine, mercury, zinc, nickel, etc. should not be detected in a hazardous substance detection test. There is a problem in applying it as an antifungal agent.

따라서 본 발명에서는 상기 목재데크의 제조공정에서 임가공 목재를 항곰팡이제에 함침하는 공정을 수행함으로써, 아연 및 구리가 담지된 제올라이트가 분산된 함침액으로 처리된 목재 데크보드를 제공하게 된다.Therefore, in the present invention, by performing a process of impregnating the processed wood with an antifungal agent in the manufacturing process of the wooden deck, a wooden deck board treated with an impregnation solution in which zinc and copper-supported zeolite are dispersed is provided.

상기 항곰팡이 성능을 가진 함침액으로서, 아연 및 구리가 담지된 제올라이트가 분산된 수 분산액을 사용한다. 특히, 상기 아연 및 구리로는 산화아연 및 산화구리를 병용하고 있는데, 상기 산화아연(ZnO) 및 산화구리(II)(CuO)가 적절한 비율로 담지될 때 실험적으로 항곰팡이 성능이 우수한 것으로 나타났다. 산화아연이나 산화구리(II)의 항곰팡이 성능에 대해서는 일부 문헌에 보고되고 있으나, 본 발명에서는 상기 산화아연과 산화구리(II)를 혼합함으로써 데크보드에서의 항곰팡이 성능을 향상시키고 있다.As the impregnating liquid having the antifungal performance, an aqueous dispersion in which zinc and copper-supported zeolite are dispersed is used. In particular, as the zinc and copper, zinc oxide and copper oxide are used in combination, and when the zinc oxide (ZnO) and copper (II) oxide (CuO) are supported in an appropriate ratio, the antifungal performance is experimentally shown to be excellent. The anti-fungal performance of zinc oxide or copper (II) oxide has been reported in some literatures, but in the present invention, the anti-fungal performance of the deck board is improved by mixing the zinc oxide and copper (II) oxide.

특히, 상기 제올라이트에 담지되는 아연 및 구리의 몰비는 1:1 내지 1:1.5일 때 최적의 효과를 나타내는 것을 확인하였다. 담지 금속 산화물이 산화아연이나 산화구리 중 어느 하나를 단독으로 사용했을 때에는 충분한 항곰팡이 성능이 발현되지 않는 것으로 나타났고, 상기 아연 및 구리의 몰비를 벗어나는 경우에도 항곰팡이 성능이 저하되는 경향을 나타나었다.In particular, it was confirmed that the optimal effect was exhibited when the molar ratio of zinc and copper supported on the zeolite was 1:1 to 1:1.5. When either zinc oxide or copper oxide was used alone as the supported metal oxide, it was found that sufficient anti-fungal performance was not expressed, and even when the molar ratio of zinc and copper was exceeded, the anti-fungal performance was decreased .

또한, 상기 아연 및 구리는 제올라이트 100 중량%에 대하여 산화아연(ZnO) 및 산화구리(CuO)를 기준으로 0.1 내지 5 중량%의 범위에서 담지되는 것이 바람직하다. 제올라이트에 담지하는 방법은 질산아연(Zn(NO3)2) 및 질산구리(Cu(NO3)2)의 수화물 등 가용성의 출발물질을 물에 녹여 수용액을 제조한 후 이를 습식담지법에 의해 제조할 수 있다. 상기 제올라이트로는 천연 제올라이트를 사용하는 것이 바람직하다. 제올라이트는 표면적이 넓고 다공성 구조로 이루어져 있어 산화아연이나 산화구리를 흡착하는 담체로서 적합하며, 제올라이트 자체의 수분 흡착 성능이 있어 항곰팡이 성능을 발현하기에 적합한 재료로 파악된다.In addition, the zinc and copper are preferably supported in an amount of 0.1 to 5 wt% based on zinc oxide (ZnO) and copper oxide (CuO) based on 100 wt% of the zeolite. The method of supporting the zeolite is to prepare an aqueous solution by dissolving soluble starting materials such as hydrates of zinc nitrate (Zn(NO 3 ) 2 ) and copper nitrate (Cu(NO 3 ) 2 ) in water, and then it is prepared by wet loading method. can do. It is preferable to use a natural zeolite as the zeolite. Since zeolite has a large surface area and a porous structure, it is suitable as a carrier for adsorbing zinc oxide or copper oxide, and zeolite has its own moisture adsorption performance, so it is considered a suitable material to express antifungal performance.

상기 함침액의 처리에 따른 효과를 확인하기 위하여 다음과 같은 공정으로 데크보드를 제조하였다.In order to confirm the effect of the treatment of the impregnation solution, the deck board was manufactured by the following process.

절단기를 이용하여 대나무를 8 내지 18 등분으로 쪼개어 10 내지 15㎜ 길이의 대나무의 임가공 목재를 제조하였다. 상기 대나무를 다발로 하여 롤 압축함으로써 다발을 만든 후 함침액에 1 내지 5분 간 함침하여 함침 처리하였다.By using a cutter, the bamboo was divided into 8 to 18 equal parts to prepare a 10 to 15 mm long bamboo unprocessed wood. The bundle was made by roll compression using the bamboo as a bundle, and then impregnated with an impregnation solution for 1 to 5 minutes to perform the impregnation treatment.

또한, 천연 제올라이트 100 중량%에 대해 산화물의 흡착량이 3 중량%가 되도록 제올라이트에 질산아연과 질산구리의 수용액을 가한 후 습식담지법으로 흡착하였다. 흡착된 천연 제올라이트는 400℃에서 1시간 동안 열처리하였다. 상기 흡착된 천연 제올라이트의 원소분석을 통해 아연 및 구리의 몰비가 1:1.26인 것을 확인하였다.In addition, an aqueous solution of zinc nitrate and copper nitrate was added to the zeolite so that the adsorption amount of oxides was 3 wt% with respect to 100 wt% of the natural zeolite, and then adsorbed by a wet support method. The adsorbed natural zeolite was heat treated at 400° C. for 1 hour. Through elemental analysis of the adsorbed natural zeolite, it was confirmed that the molar ratio of zinc and copper was 1:1.26.

증류수 100 중량부에 상기 천연 제올라이트 30 중량부를 혼합하여 강제 교반한 후 2 중량부의 무수 황산나트륨(Na2SO4)을 첨가하고 추가적으로 교반하여 수 분산액을 제조하였다.30 parts by weight of the natural zeolite was mixed with 100 parts by weight of distilled water, followed by forced stirring, and then 2 parts by weight of anhydrous sodium sulfate (Na 2 SO 4 ) was added and further stirred to prepare an aqueous dispersion.

목재 원료를 절단, 분쇄 또는 펠릿화하여 임가공 목재를 제조하는 단계, 상기 임가공 목재를 아연 및 구리가 담지된 제올라이트가 분산된 함침액에 투입하고 함침하여 함침 목재를 제조하였다. 또한, 데크보드를 제조하는 공정은 통상적인 가압 및 절단 가공에 의해 제조하였으며, 표면 가공을 위하여 상기 데크보드를 가열 요철 롤 사이로 통과시키며 불규칙한 요철면을 형성하였다. 제품 생산을 위해서는 몰더 가공 및 천연오일 도포의 후처리를 수행하나 물성 테스트를 위하여 요철면을 형성한 데크보드를 시료로 시험평가를 실시하였다.A step of manufacturing an unprocessed wood by cutting, pulverizing, or pelletizing a wood raw material, the unprocessed wood was put into an impregnation solution in which zinc and copper-supported zeolite were dispersed, and impregnated to prepare an impregnated wood. In addition, the process of manufacturing the deck board was manufactured by conventional pressing and cutting processing, and for surface processing, the deck board was passed between the heating uneven rolls to form an irregular uneven surface. For product production, mold processing and post-treatment of natural oil application are performed, but for the purpose of physical property testing, test evaluation was performed with a sample of deck boards with concave-convex surfaces.

본 발명의 제조방법에 따른 데크보드에 대한 물성은 한국건설생활환경시험 연구원에 의뢰하여 KS F 3230:2013에 따라 측정하였다. 그 결과는 표 1과 같다.The physical properties of the deck board according to the manufacturing method of the present invention were measured according to KS F 3230:2013 at the request of the Korea Construction Living Environment Testing Institute. The results are shown in Table 1.

시험항목Test Items 단위unit 결과result 굴곡최대하중Flexural load NN 6.2056.205 충격저항성(실온)Impact resistance (room temperature) -- 균열 및 파괴없음No cracks and breaks 충격저상성(저온)Low impact resistance (low temperature) -- 균열 및 파괴없음No cracks and breaks 나사못 유지력screw holding force NN 991991 미끄럼저항성(C.S.R)Slip resistance (C.S.R) -- 0.410.41 길이선열팽창계수Length linear coefficient of thermal expansion 1/℃1/℃ 1.3×10-51.3×10-5 lead ㎎/ℓmg/L 불검출non-detection 카드뮴cadmium ㎎/ℓmg/L 불검출non-detection 비소arsenic ㎎/ℓmg/L 불검출non-detection 크롬chrome ㎎/ℓmg/L 불검출non-detection 수은Mercury ㎎/ℓmg/L 불검출non-detection 폼알데하이드 방출량Formaldehyde emission ㎎/ℓmg/L 0.10.1

표 1의 결과로부터 본 발명의 제조방법에 따라 제조된 데크보드의 모두 물성은 시판되는 데크보드와 동일한 정도인 것으로 나타나 데크보드로서 사용할 수 있는 것으로 나타났다.From the results of Table 1, all of the physical properties of the deck board manufactured according to the manufacturing method of the present invention appeared to be at the same level as that of the commercially available deck board, indicating that it can be used as a deck board.

또한, 상기 데크보드에 대하여 항곰팡이 성능을 평가하였다. 시험은 ASTM G 21-15에 따라 수행하였으며, 균주로는 Aspergillus niger ATCC 9642, Penicillium pinophilum ATCC 11797, Chaetomium globosum ATCC 6205, Gliocladium virens ATCC 9645, Aureobasidium pullulans ATCC 15233를 사용하였다. 평가기준은 육안 및 현미경 하에서 곰팡이의 발육은 보이지 않는 경우 0점, 육안으로는 곰팡이의 발육은 보이지 않지만, 현미경 하에서는 확인되는 경우 1점, 균사의 발육은 미미하고, 발육 부분의 면적은 시료의 전체 면적의 25%를 초과하지 않는 경우 2점, 균사의 발육은 중간 정도이고, 발육 부분의 면적은 시료의 전체 면적의 25 내지 50%인 경우 3점, 균사는 잘 발육하고, 발육 부분의 면적은 시료의 전체 면적의 50 내지 100%인 경우 4점, 균사의 발육은 심하고, 시료 전체면을 덮고 있는 경우 5점으로 하였다. 배양시험은 4주간 실시하였고, 4주 후의 상태로 평가하였다.In addition, the anti-fungal performance was evaluated for the deck board. The test was performed according to ASTM G 21-15, and strains Aspergillus niger ATCC 9642, Penicillium pinophilum ATCC 11797, Chaetomium globosum ATCC 6205, Gliocladium virens ATCC 9645, Aureobasidium pullulans ATCC 15233 were used. The evaluation criteria are 0 points when no growth of mold is seen with the naked eye or under a microscope, 1 point when no growth of mold is visible with the naked eye but is confirmed under a microscope, the growth of mycelia is insignificant, and the area of the growth part is the total of the sample. If it does not exceed 25% of the area, 2 points, the growth of the mycelium is medium, and the area of the growth part is 3 points if it is 25-50% of the total area of the sample, the mycelium is well developed, and the area of the growth part is When 50 to 100% of the total area of the sample was 4 points, the growth of mycelia was severe and the samples were taken as 5 points when the entire surface was covered. The culture test was conducted for 4 weeks, and the state was evaluated after 4 weeks.

또한, 비교를 위하여 실시예와 동일한 방법으로 데크보드를 제조하되, 함침액 처리 공정에서 함침액으로서 평균 입경이 0.5㎛인 산화구리와 산화아연 분말의 수 분산액을 사용하여 함침액 처리한 데크보드(비교예 1), 은 나노입자 수 분산액(5 중량% 은 함유)을 함침액으로 하여 함침액 처리한 데크보드(비교예 2), 임가공 목재를 함침액으로 처리하지 않고 240℃에서 30분간 탄화처리하는 공정을 수행하여 제조한 데크보드(비교예 3), 함침액 처리 공정 없이 임가공 목재를 숙성, 가압 및 절단 가공하는 경우(비교예 4)를 각각 대비하였다. 그 결과는 표 2와 같다.In addition, for comparison, a deck board was manufactured in the same manner as in the example, but in the impregnation solution treatment process, an impregnation solution treated deck board using an aqueous dispersion of copper oxide and zinc oxide powder having an average particle diameter of 0.5 μm as an impregnation solution ( Comparative Example 1), a deck board impregnated with an aqueous dispersion of silver nanoparticles (containing 5 wt% silver) as an impregnating liquid (Comparative Example 2), and carbonized treatment at 240° C. for 30 minutes without treating the preprocessed wood with the impregnating liquid A case of aging, pressing, and cutting processing (Comparative Example 4) was prepared for the deck board manufactured by performing the process of performing the following steps (Comparative Example 3), and the aging, pressing and cutting processing of the preprocessed wood without the impregnation solution treatment process. The results are shown in Table 2.

결과result 실시예Example 00 비교예1Comparative Example 1 1One 비교예2Comparative Example 2 1One 비교예3Comparative Example 3 22 비교예4Comparative Example 4 44

표 2의 결과를 살펴보면, 함침액 처리나 탄화 처리를 하지 않는 경우 데크보드의 곰팡이 발생이 심한 것을 확인할 수 있으나(비교예 4), 함침액으로 처리하거나 표면을 탄화 처리하는 경우 항곰팡이 성능이 향상되는 것을 확인할 수 있었다.Looking at the results of Table 2, it can be confirmed that the mold generation of the deck board is severe when the impregnation liquid treatment or carbonization treatment is not performed (Comparative Example 4), but the anti-fungal performance is improved when the impregnation liquid treatment or carbonization treatment is performed on the surface was able to confirm that

또한, 장기간 사용 후의 항곰팡이 성능을 평가하기 위하여 실시예 및 비교예 1 내지 3의 데크보드를 3개월 간 외부 환경에 방치한 후 동일한 방법으로 항곰팡이 성능을 평가하였다. 그 결과는 표 3과 같다.In addition, in order to evaluate the anti-fungal performance after long-term use, the deck boards of Examples and Comparative Examples 1 to 3 were left in an external environment for 3 months, and then the anti-fungal performance was evaluated in the same way. The results are shown in Table 3.

결과result 실시예Example 00 비교예1Comparative Example 1 33 비교예2Comparative Example 2 22 비교예3Comparative Example 3 33

표 3의 결과를 살펴보면, 데크보드가 외부 환경에서 장기간 방치될 경우, 비교예 1 내지 3에서는 항곰팡이 성능이 저하되는 결과를 나타내었으나, 실시예의 데크보드의 경우 항곰팡이 성능이 그대로 유지되고 있는 것을 확인할 수 있었다.Looking at the results of Table 3, when the deck board is left for a long time in an external environment, Comparative Examples 1 to 3 showed a result that the anti-fungal performance was lowered, but in the case of the deck board of the Example, the anti-fungal performance is maintained as it is. could check

따라서 본 발명에 따른 함침액을 이용한 처리 공정은 데크보드의 항곰팡이 성능을 향상시키는데 효과적임을 확인할 수 있었다.Therefore, it was confirmed that the treatment process using the impregnating liquid according to the present invention is effective in improving the anti-fungal performance of the deck board.

또한, 함침액의 종류에 따른 항곰팡이 성능을 평가하기 위하여 산화아연과 산화구리가 담지된 천연 제올라이트를 분산액에 적용한 실시예 외에 산화아연 3 중량%를 천연 제올라이트에 담지한 후 수 분산액을 제조하여 함침액으로 사용한 경우(비교예 5), 산화구리 3 중량%를 천연 제올라이트에 담지한 후 수 분산액을 제조하여 함침액으로 사용한 경우(비교예 6)에 대한 차이를 평가하였다. 데크보드를 3개월 간 외부 환경에 방치한 후 항곰팡이 성능을 평가하였을 때에는 뚜렷한 차이가 나타나지 않았으나, 6개월 간 외부 환경에 방치한 후 항곰팡이 성능을 평가한 경우, 실시예에서는 항곰팡이 성능이 0점으로 나타났으나, 비교예 5와 6에서는 항곰팡이 성능이 각각 2점, 1점인 것으로 나타났다. 이러한 결과로부터 상기 분산액에 사용되는 담지체의 종류에 따라 데크보드의 항곰팡이 성능에 차이가 발생하는 것을 확인할 수 있었으며, 본 발명에 따른 함침액을 적용하여 함침 공정을 수행할 때 제조되는 데크보드의 물성뿐만 아니라 항곰팡이 성능이 향상되는 것을 확인할 수 있었다.In addition, in order to evaluate the antifungal performance according to the type of impregnating liquid, in addition to the example in which zinc oxide and copper oxide-supported natural zeolite were applied to the dispersion, 3 wt% of zinc oxide was supported on the natural zeolite, and then an aqueous dispersion was prepared and impregnated When used as a liquid (Comparative Example 5), after 3 wt% of copper oxide was supported on natural zeolite, an aqueous dispersion was prepared and used as an impregnating liquid (Comparative Example 6) to evaluate the difference. When the anti-fungal performance was evaluated after the deck board was left in the external environment for 3 months, there was no significant difference, but when the anti-fungal performance was evaluated after leaving the deck board in the external environment for 6 months, the anti-fungal performance was 0 in the example. However, in Comparative Examples 5 and 6, the antifungal performance was found to be 2 points and 1 point, respectively. From these results, it was confirmed that a difference occurs in the anti-fungal performance of the deck board depending on the type of support used in the dispersion, and the deck board manufactured when the impregnation process is performed by applying the impregnation solution according to the present invention. It was confirmed that not only physical properties but also antifungal performance were improved.

본 발명은 상술한 바와 같이 바람직한 실시예를 들어 도시하고 설명하였으나, 상기 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형과 변경이 가능하다. 그러한 변형예 및 변경예는 본 발명과 첨부된 특허청구범위의 범위 내에 속하는 것으로 보아야 한다.Although the present invention has been illustrated and described with reference to preferred embodiments as described above, it is not limited to the above-described embodiments and is not limited to the above-described embodiments, and various methods can be made by those of ordinary skill in the art to which the invention pertains without departing from the spirit of the present invention. Transformation and change are possible. Such modifications and variations are intended to fall within the scope of the present invention and the appended claims.

Claims (3)

아연 및 구리가 담지된 제올라이트가 분산된 함침액으로 처리되며, 일면에 불규칙한 요철면을 형성되는 목재 데크보드로서,
상기 데크보드는 목재 원료를 절단, 분쇄 또는 펠릿화하여 제조된 임가공 목재를 아연 및 구리가 담지된 제올라이트가 분산된 함침액에 투입하고 함침 및 숙성한 후, 상기 임가공 목재를 가압, 절단 및 표면 가공하여 제조되며,
상기 아연 및 구리가 담지된 제올라이트는 아연 및 구리의 몰비가 1:1.26이며, 제올라이트 100 중량%에 대하여 산화아연 및 산화구리를 기준으로 산화물의 흡착량이 3 중량%가 되도록 담지되며,
상기 임가공 목재는 200 내지 250℃의 온도에서 열처리하여 목재의 표면 부분을 탄화 처리한 임가공 목재인 것을 특징으로 하는 목재 데크보드.
As a wooden deck board that is treated with an impregnation solution in which zinc and copper-supported zeolite are dispersed, and an irregular uneven surface is formed on one surface,
The deck board is prepared by cutting, pulverizing or pelletizing a wood raw material, put in an impregnation solution in which zinc and copper-supported zeolite are dispersed, impregnated and aged, and then pressurizing, cutting and surface processing the unprocessed wood is manufactured by
The zinc-copper-supported zeolite has a zinc-copper molar ratio of 1:1.26, and is supported so that the adsorption amount of oxides is 3 wt% based on zinc oxide and copper oxide with respect to 100 wt% of the zeolite,
The processed wood is a wood deck board, characterized in that the heat treatment at a temperature of 200 to 250 ℃ wood surface portion of the wood is carbonized treated wood.
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Citations (4)

* Cited by examiner, † Cited by third party
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JP2007526139A (en) * 2003-06-17 2007-09-13 フィブロ−テック,インコーポレイテッド Fine particle wood preservative and method for producing the same
JP2009209089A (en) * 2008-03-04 2009-09-17 Jgc Catalysts & Chemicals Ltd Antibacterial deodorant
KR100927170B1 (en) * 2009-06-18 2009-11-18 이청재 Compressed board and its manufacturing method
KR101149280B1 (en) * 2011-01-13 2012-05-25 글로벌피앤에프주식회사 Deck board method and deck board

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KR101333743B1 (en) 2013-05-14 2013-11-27 (주)이삭테크 Preparation method of eco-friendly synthetic wood composite, and eco-friendly synthetic wood composite prepared by the same
KR101823826B1 (en) 2017-05-29 2018-01-30 (주) 대현목재 Method of manufacturing loess wood
JP6930343B2 (en) 2017-09-29 2021-09-01 信越化学工業株式会社 Deodorant / antibacterial / antifungal agent-containing dispersion, its manufacturing method, and members having deodorant / antibacterial / antifungal agent on the surface

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Publication number Priority date Publication date Assignee Title
JP2007526139A (en) * 2003-06-17 2007-09-13 フィブロ−テック,インコーポレイテッド Fine particle wood preservative and method for producing the same
JP2009209089A (en) * 2008-03-04 2009-09-17 Jgc Catalysts & Chemicals Ltd Antibacterial deodorant
KR100927170B1 (en) * 2009-06-18 2009-11-18 이청재 Compressed board and its manufacturing method
KR101149280B1 (en) * 2011-01-13 2012-05-25 글로벌피앤에프주식회사 Deck board method and deck board

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