KR102354796B1 - Surfactant composition for adhesive and adhesive comprising the same - Google Patents

Abstract

The present invention relates to a surfactant composition for a sticking agent, a sticking agent composition comprising the same, and a method for manufacturing the same. The surfactant prepared by the present invention is included in the sticking agent to exhibit excellent sticking performance and emulsification stability at the same time, thereby being widely used in the process of preparing a sticking agent. The surfactant composition comprises a compound represented by chemical formula 1.

Description

Surfactant composition for pressure-sensitive adhesive and pressure-sensitive adhesive comprising the same

The present invention relates to a surfactant composition for an adhesive, a method for preparing the same, and an adhesive comprising the same.

Conventionally, most of the general-purpose pressure-sensitive adhesives are solvent-type pressure-sensitive adhesives prepared by using a volatile organic solvent as a solvent. However, as the industry is advanced, environmental regulations are gradually being strengthened, whereas the use of volatile organic solvents causes many environmental problems. Accordingly, there is an increasing demand for an adhesive having less environmentally harmful components in the adhesive field.

In response to this demand, recently, water-based or solvent-free adhesives using water as a solvent, which can replace solvent-type adhesives, have been developed.

Water-based adhesives are used for labels, electrical/electronic tapes, architectural/interior tapes, automotive tapes, other tapes, and medical applications. is increasing in importance.

Aqueous pressure-sensitive adhesives are manufactured by emulsion polymerization using a monomer mixture, initiator, surfactant, emulsifier, and additives (tackifier, defoamer, wetting agent, leveling agent, etc.) It is a method of polymerizing a monomer insoluble in water or a monomer having low solubility in water using the dispersing function.

In terms of performance, these water-based adhesives have a problem that adhesive properties such as initial adhesive force, peeling force and holding power are significantly inferior to solvent-type adhesives, and additives such as surfactants used during emulsion polymerization are pointed out as the main cause.

Efforts to improve initial adhesion, cohesion and water resistance by using special surfactants (reactive emulsifiers, polymer emulsifiers, etc.) for emulsion polymerization instead of general emulsifiers to solve problems such as environmental regulations and deterioration of resin properties in the development of water-based adhesives is being attempted by some multinational companies, but there are still problems such as agglomeration, unreacted emulsifier and bubble generation depending on the type of reactive emulsifier, so the need to develop a suitable emulsifier is increasing.

Korean Patent Publication No. 1996-41303

In order to solve the above problems, the present invention is to provide a surfactant composition that can be utilized in an adhesive, a method for preparing the same, and a pressure-sensitive adhesive composition comprising the same.

In order to solve the above problems, the present invention provides a surfactant composition for a pressure-sensitive adhesive comprising a compound of the formula (1):

[Formula 1]

In Formula 1, n is 7 to 11.

In one embodiment of the present invention, in Formula 1, n may be 9.

In addition, the present invention may provide a pressure-sensitive adhesive composition comprising the surfactant composition.

In one embodiment of the present invention, the composition may further include a monomer, an initiator and a solvent.

In another embodiment of the present invention, the composition may further include one or more additives selected from the group consisting of a tackifier, an emulsifier, an antifoaming agent, a stabilizer, a pH adjuster, a leveling agent, a wetting agent, and a biocide.

In another embodiment of the present invention, the monomer may be at least one selected from the group consisting of acrylic acid, n-butyl acrylate, 2-ethylhexyl acrylate and methyl methacrylate.

In another embodiment of the present invention, the pressure-sensitive adhesive may be used for one or more purposes selected from the group consisting of labels, electrical/electronic tapes, architectural/interior tapes, automotive tapes, and medical adhesives:

In addition, the present invention, the step of reacting by adding benzene and butenoic acid to the compound of Formula 2 (S1);

reacting by adding a catalyst after the reaction of step S1 (S2);

After the reaction of step S2, neutralizing by adding a basic solution (S3);

obtaining an oil layer after layer separation by adding distilled water to the neutralized solution (S4); and

It is possible to provide a method for preparing a surfactant composition for a pressure-sensitive adhesive comprising the compound of Formula 1, comprising the step (S5) of removing the solvent from the oily layer:

[Formula 1]

[Formula 2]

In Formulas 1 and 2, n is 7 to 11.

In another embodiment of the present invention, the catalyst in step S2 may be para-toluenesulfonic acid.

In another embodiment of the present invention, the step S1 is to react for 120 to 240 minutes at 40 to 80 ℃,

The step S2 is to react at 60 to 100 ℃ for 18 to 36 hours,

The step S3 may be neutralizing at 50 to 90 ℃ for 20 to 40 minutes.

In addition, the present invention comprises the steps of preparing an aqueous phase by stirring an initiator and distilled water (a);

After dissolving the compound of Formula 1 and the first acrylic acid in distilled water, the second acrylic acid is added and stirred to emulsify to prepare a pre-emulsion (b);

(c) pre-reacting by adding some of the pre-emulsion and an initiator to the aqueous phase of step a;

After the preliminary reaction, the remaining pre-emulsion is added dropwise to react (d); and

It provides a method for producing a pressure-sensitive adhesive composition comprising the step (e) of adjusting the pH after step d.

In one embodiment of the present invention, the first acrylic acid may be acrylic acid.

In another embodiment of the present invention, the second acrylic acid may be at least one selected from the group consisting of n-butyl acrylate, 2-ethylhexyl acrylate and methyl methacrylate.

In another embodiment of the present invention, the initiator of step a may be ammonium persulfate.

In another embodiment of the present invention, step a is to be performed while stirring at a temperature of 50 to 120 ℃ at a speed of 100 to 200 rpm,

Step b is to be carried out while stirring at a speed of 200 to 600 rpm,

Step c is to be carried out at a temperature of 40 to 120 ℃ for 1 to 10 minutes,

In step d, the reaction may be performed by dropping the pre-emulsion at a constant rate for 1 to 6 hours.

The surfactant according to the present invention is a nonionic surfactant, an acrylic surfactant in which butenoic acid is bound to polyethylene glycol, and has an appropriate viscosity and average particle size when used in an adhesive, thereby exhibiting excellent coating properties and adhesive properties. .

1 and 2 show H-NMR results of surfactants prepared by the method of the present invention.
^{2 to 7 show 13} C-NMR results of surfactants prepared by the method of the present invention.
8 shows the results of FT-IR analysis of the surfactant prepared by the method of the present invention.
9 is a schematic representation of a method for producing the pressure-sensitive adhesive composition of the present invention.

The present invention has an environmentally friendly advantage, but in order to overcome the limitations of conventional water-based pressure-sensitive adhesives, which have low water resistance and reduced adhesive properties, intensive research was conducted to prepare a surfactant for use in water-based pressure-sensitive adhesives, and the present invention was completed.

The present invention has developed a nonionic surfactant for a water-based pressure-sensitive adhesive, and provides an acrylic surfactant in which polyethylene glycol is used as a basic skeleton and butenoic acid is bonded to the terminal thereof. The HLB of the surfactant prepared in the present invention shows a value of 11 to 18, and can be used as a surfactant of various pressure-sensitive adhesives in addition to the surfactant for water-based adhesives.

Accordingly, the main object of the present invention is to provide a surfactant composition for a pressure-sensitive adhesive comprising a compound of the following formula (1).

[Formula 1]

In Formula 1, n is 7 to 11.

In particular, as in an embodiment of the present invention, n may be 9.

In addition, the present invention may provide a pressure-sensitive adhesive composition comprising the surfactant composition.

In addition, the present invention, the step of reacting by adding benzene and butenoic acid to the compound of Formula 2 (S1);

reacting by adding a catalyst after the reaction of step S1 (S2);

After the reaction of step S2, neutralizing by adding a basic solution (S3);

obtaining an oil layer after layer separation by adding distilled water to the neutralized solution (S4); and

A method for preparing a surfactant composition for a pressure-sensitive adhesive comprising a compound of Formula 1, comprising the step (S5) of removing the solvent from the oily layer:

[Formula 1]

[Formula 2]

In Formulas 1 and 2, n is 7 to 11.

In addition, the present invention comprises the steps of preparing an aqueous phase by stirring an initiator and distilled water (a);

After dissolving the compound of Formula 1 and the first acrylic acid in distilled water, the second acrylic acid is added and stirred to emulsify to prepare a pre-emulsion (b);

(c) pre-reacting by adding some of the pre-emulsion and an initiator to the aqueous phase of step a;

After the preliminary reaction, the remaining pre-emulsion is added dropwise to react (d); and

It provides a method for producing a pressure-sensitive adhesive composition comprising the step (e) of adjusting the pH after step d.

Hereinafter, the surfactant composition and the pressure-sensitive adhesive composition of the present invention, and a manufacturing method thereof will be described in more detail.

The pressure-sensitive adhesive composition of the present invention further contains a monomer, an initiator, and a solvent in addition to the surfactant. In addition to the above components, it may further include one or more additives selected from the group consisting of a tackifier, an emulsifier, an antifoaming agent, a stabilizer, a pH adjuster, a leveling agent, a wetting agent, and a biocide. In addition to the above-described additives and components, other additives or components may be further included as appropriate according to the use of the pressure-sensitive adhesive. The additive may be included in an amount of 0.001 to 30% by weight based on the total composition.

The monomer may be at least one selected from the group consisting of acrylic acid, n-butyl acrylate, 2-ethylhexyl acrylate and methyl methacrylate, but is not limited thereto. For example, C3 or less acrylic acid alkylester or methacrylic acid alkylester of alkyl groups, such as methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, isopropyl acrylate, and isopropyl methacrylate; (meth)acrylic acid cyclic alkyl esters, such as cyclohexyl (meth)acrylate; aromatic (meth)acrylic acid esters such as phenoxymethyl (meth)acrylate and benzyl (meth)acrylate; Aliphatic (hydroxyalkyl acrylate, hydroxyalkyl methacrylate, polyoxyethylene (meth) acrylate, methoxyethyl acrylate, ethoxymethyl acrylate, glycidyl acrylate, glycidyl methacrylate, etc.) meth)acrylic acid ester; (meth)acrylic acid amides such as acrylamide, methacrylamide, N-methylolacrylamide, N-methoxymethylacrylamide, and N-methoxybutylacrylamide; Vinyl methyl ketone, vinyl ethyl ketone, vinyl-n-propyl ketone, vinyl-i-propyl ketone, vinyl-n-butyl ketone, vinyl-i-butyl ketone, vinyl-t-butyl ketone, vinyl phenyl ketone, vinyl benzyl ketone , aldo group and/or keto group-containing radically polymerizable monomers such as divinyl ketone and diacetone acrylamide; nitrile group-containing unsaturated compounds such as (meth)acrylonitrile, crotonnitrile, 2-cyanoethyl (meth)acrylate, 2-cyanopropyl (meth)acrylate, and 3-cyanopropyl (meth)acrylate; monovinylaromatic compounds such as styrene, o-vinyltoluene, m-vinyltoluene, p-vinyltoluene, p-ethylvinylstyrene, α-methylstyrene, and α-fluorostyrene; vinyl halides such as vinyl chloride and vinylidene chloride; Monomers such as vinyl esters such as vinyl propionate may be included, but are not limited thereto.

The initiator may be ammonium persulfate, but is not limited thereto. The initiator for the pressure-sensitive adhesive may be used without limitation, such as a thermal decomposition initiator, a redox initiator, etc., potassium persulfate, sodium hydrogen sulfite, etc. may be used, but is not limited thereto.

As the solvent, distilled water (water) may be used in the case of a water-based pressure-sensitive adhesive, but a different solvent such as an organic solvent such as toluene may be used depending on the use of the pressure-sensitive adhesive to be prepared.

The composition may further include one or more additives selected from the group consisting of a tackifier, an emulsifier, an antifoaming agent, a stabilizer, a pH adjusting agent, a leveling agent, a wetting agent, and a biocide. The additive may be used without limitation as long as it is available to those skilled in the art.

The adhesive of the present invention may be used as a label, electrical/electronic tape, construction/interior tape, automotive tape, or medical adhesive.

The present invention provides a method for preparing a surfactant composition comprising steps S1 to S5. The S1 step is to react at 40 to 80 °C for 120 to 240 minutes, the S2 step is to react at 60 to 100 °C for 18 to 36 hours, and the S3 step is 50 to 90 °C for 20 to 40 minutes. Neutralization is preferred. When manufactured outside the above range, the properties as a surfactant may not be expressed due to overreaction or insufficient reaction.

In the method for preparing the surfactant composition of the present invention, the catalyst of step S2 may be para-toluenesulfonic acid, but is not limited thereto.

The present invention may provide a method for producing a pressure-sensitive adhesive composition comprising steps a to e. In step a, ammonium persulfate may be used as the initiator as in one embodiment of the present invention, but is not limited thereto as described above.

The step a is to be carried out while stirring at a speed of 100 to 200 rpm at a temperature of 50 to 120 ° C, the step b is to be performed while stirring at a speed of 200 to 600 rpm, and the step c is a temperature of 40 to 120 ° C. It is carried out for 1 to 10 minutes at a temperature, and step d may be to perform the reaction by dropping the pre-emulsion at a constant rate for 1 to 6 hours. The above manufacturing conditions are conditions optimized by the present inventors, and it has been confirmed through Examples that the pressure-sensitive adhesive prepared under the above conditions has excellent physical properties such as viscosity and heat resistance.

In the pressure-sensitive adhesive prepared in the present invention, the particle size may be about 100 to 750 nm. The particle size of the pressure-sensitive adhesive is affected by the type and concentration of the surfactant. When the reactive emulsifier is used, the average particle size is measured to be 400 to 650 nm and shows monomolecular properties. If the particle size is less than 100nm, there is a fear that particle stability may be deteriorated, and if it exceeds 750nm, coating properties and adhesive properties may be deteriorated.

The surfactant of the present invention is a nonionic surfactant, and it has the advantage of being able to change the hydrophile-lipophile balance (HLB) relatively freely, so that its applicability is relatively higher than that of the ionic surfactant. In the example of the present invention, the HLB value was 17.6, and when the HLB value was 11 to 18, considering the excellent efficacy as an aqueous adhesive emulsifier, the surfactant composition of the present invention was included in the adhesive to show excellent physical properties. can be expected

Hereinafter, preferred embodiments of the present invention will be described in detail. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted. Throughout the specification, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Terms used in the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present invention, terms such as include or have are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features, number, step , it should be understood that it does not preclude in advance the possibility of the presence or addition of an operation, component, part, or combination thereof.

Hereinafter, preferred embodiments of the present invention will be described so that those of ordinary skill in the art can easily implement them with reference to the accompanying drawings. In addition, in the description of the present invention, if it is determined that a detailed description of a related known function or a known configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, certain features presented in the drawings are enlarged, reduced, or simplified for ease of explanation, and the drawings and components thereof are not necessarily drawn to scale. However, those skilled in the art will readily understand these details.

Example 1. Synthesis of Reactive Emulsifier

In this example, a reactive emulsifier was synthesized according to Scheme 1 below.

[Scheme 1]

(in the above scheme, n=9)

First, an emulsifier UDP_10 (Polyoxyethylene 　 Undecylphenyl 　 Ether) of Chemical Formula 2 was prepared (n=9). Information of the components used in the Examples is shown in Table 1 below.

[Formula 2]

UDP_10 Benzene ρ -TsOH 3-Butenoic acid Na ₂ CO ₃ Mw 709 g/mol - 171.76 g/mol 86.07 g/mol 105.88 g/mol mol ratio One - 0.06 2 1.06 number of moles 0.042 - 0.0025 0.084 0.0445 weight (g) 30 g 100 mL 0.4294 g 7.23 4.714

30 g (0.042 mol) of the compound of Formula 2, 100 ml of Benzene, and 7.23 g (0.084 mol) of 3-butenoic acid were added, mixed in a 250 mL cylindrical three-necked flask, and reacted at 60° C. for 3 hours. Then, 0.4294 g (0.0025 mol) of the catalyst p-TsOH was added and reacted at 80° C. for 24 hours. After completion of the reaction, _{4.714 g (0.0445 mol) of Na 2} CO ₃ was added and reacted at 70° C. for 30 min to neutralize the catalyst.

After removing the solvent at 50 °C using a rotary evaporator, the neutralized solution was dissolved in 500 ml of DCM and fractionated by mixing with 500 ml of DW. After washing the DW layer with DCM 3 times to obtain a DCM layer, Na ₂ SO ₄ 5 g was added to remove residual water, and then filtered under reduced pressure to remove Na ₂ SO ₄ . After removal, the solvent was removed at 50 °C using a rotary evaporator and dried at 50 °C using a vacuum oven.

Example 2. Confirmation of the structure of the synthesized compound

H-NMR analysis was performed to confirm the result of the synthesis of the compound prepared in Example 1. The results are shown in Figure 1 and Table 2. A more detailed H-NMR result is shown in FIG. 2 . In addition, C-NMR analysis was performed and shown in FIGS. 3 to 7 .

expected value UDP_10 24 h Product a to d 23 26.41 27.89 26.20 e 2 2.01 2.2 2.02 f 2 2 2 2 g 2 2.03 2.12 2.03 h 2 2.04 2.15 2.04 i, j 34 44.92
(i, j, k) 45.2 42.26 k 2 2.2 2.02 l 2 - Unverifiable 2.01 m One - 2.13 0.96 n 2 - 4.36 2

As a result, in the H-NMR integral value, the I integral value (H = 2 ea) was found to be 2.01, confirming that the reaction had sufficiently occurred.

Initial S.M 30 g, final product 27 g

Initial S.M = 0.042 mol, Final Product = 0.034 mol

Yield(%) = ( 0.034 mol / 0.042 mol ) x ( 2.01/ 2 ) x 100 % = 81.36 %

Also, FT-IR analysis results are shown in FIG. 8 . As shown in Scheme 1, it can be confirmed that the compound of Formula 1 has a molecular structure.

Example 3. Preparation of water-based adhesive

In this Example 3, an adhesive was prepared using the compound of Formula 1 prepared in Example 1. As shown in FIG. 9, it was prepared by dividing the water phase and the oil phase, the pre-emulsion, and the two steps. The materials used are shown in Table 3 below.

Materials Assay　(%) Makers 2-Ethyl　hexyl　acrylate (2-EHAM) 99.5 LG　Chem. n-Butyl　acrylate (BAM) 95 Mijung Tec Methyl methacrylate (MMA) 99.5 LG　MMA Acrylic 　acid (AA) 99.5 LG　Chem. Ammonium　persulfate (APS) 98 Sigma　Aldrich

In the aqueous phase, put 147.45 mL of distilled water in a four-neck RBF reactor, _{and 11.8 mL (0.00517 mol) of a (NH 4} ) ₂ S ₂ O ₈ 10% solution was added, and the temperature inside the reactor was maintained at 80 °C while stirring at 150 rpm. did

In the oil phase, 110.59 mL of distilled water, a surfactant, and 4.17 g (0.0579 mol) of acrylic acid are dissolved. Then, n-butyl acrylate (BAM) 176.95 g (1.38 mol), 2-ethylhexyl acrylate (2-EHAM) 176.95 g (1.38 mol) ), methyl methacrylate (MMA) 62.67 g (0.489 mol) was added and emulsified at 400 rpm for 30 minutes, and then 3 g of pre_emulsion was added to the aqueous phase (NH ₄ ) ₂ S ₂ O ₈ 3.8% solution 1.84 mL (0.000307 mol) and After the pre-reaction was carried out at 80 ° C. for 5 minutes, the remaining pre_emulsion was added dropwise at a constant rate for 3 h to react.

When the dropping was completed, _{1.0 mL (0.000694 mol) of a 20% (NH 4} ) ₂ S ₂ O ₈ 20% solution was first stirred for 1 hour while maintaining the temperature and stirring speed to remove the unreacted monomer. After the stirring was completed, it was cooled to room temperature, and NH ₄ OH was added to adjust the pH to obtain a final aqueous acrylic adhesive.

Example 4. Confirmation of the physical properties of the adhesive

In this Example 4, the physical properties of the adhesive prepared in Example 3 were checked. For comparison, when n is 10 in the compound of Formula 2 (Comparative Example 1) and n is 20 (Comparative Example 2), an adhesive prepared by using the compound was used to check physical properties. Methods for confirming physical properties are summarized in Table 4 below. In the adhesive of Comparative Example, a small amount of layer separation occurred during the pre-emulsion process. The emulsion reaction proceeded, but due to poor emulsion stability, waxing (higher viscosity) and aggregates were generated. In order to confirm reproducibility, an aqueous acrylic pressure-sensitive adhesive was newly prepared once again in the same manner as in the method and raw materials described in Example 3 using the same reactive surfactant, and then the physical properties were checked.

Key performance indicators sample definition Measurement method (standard, environment, result calculation, etc.) solid content % It was carried out according to KS M 6638 standard, which is a general test method for adhesives stipulated in the Korean Industrial Standards, and 0.5 g of the sample was weighed to four decimal places on an aluminum plate, dried in an oven at 150 ℃ for 30 minutes, and dried again. Calculate the percentage (%) by dividing the dried weight, which is a value obtained by subtracting the weight of each aluminum plate, by the weight before drying peel strength kg/25mm - Prepare a 50mm wide, 150mm long coated steel sheet or SUS-304 cleaned with ethanol or isopropyl alcohol as an adherend, attach it to an adherend with a width of 25mm, and press it with a roller with a specified load (2kg). At room temperature, the adhesive force was measured at a peeling angle of 180° and a peeling rate of 300 mm/min. Thermal cohesiveness (1kg×1hr) ℃ - After attaching the test piece to the standard of ASTM D-3654 stainless steel (SUS304) with an adhesive area of 25mm × 25mm, it was left at a temperature of 23±2℃ and a relative humidity of 50±5% RH for 60 minutes.
- Measure the distance the tape is pushed under the conditions of applying a load of 1kg and temperature of 80℃ and time of 1hr Viscosity cps/25℃ To check the viscosity of the aqueous acrylic adhesive base emulsion, it was measured using a viscometer (DV-E Viscometer/LV, Brookfield Ametek). Viscosity is evaluated for stability by measuring the initial viscosity and viscosity 4 weeks after manufacturing. particle size nm A particle size distribution analyzer (Zetasizer Nano ZS90, Malvern) was used to check the average particle size of the aqueous acrylic adhesive base emulsion. For the preparation of the analysis sample, the particle size was measured as an average value after diluting 0.1 g of the adhesive base emulsion in 50 mL distilled water. For the accuracy of the measured value, each was measured 5 times or more and expressed as an average value.

NV(%)-solids Conversion rate (%) film thickness peel strength
(kgf/inch) Heat resistance test (ASTM D3654) Viscosity (cP) Particle size (nm) Measure the distance pushed after maintaining 80C for 1hr (weight 1kg) Example 3 60.1 100.31 60um 1.495 0.5 386.5 x Example 3 (Reproducibility) 60.1 100.31 60um 1.507 0.75 148.5 412.1 ± 51.17 nm Comparative Example 1 59.94 97.99 60um 1.561 1.5 258.6 698.3 ± 31.72 nm Comparative Example 2 60.00 98.09 60um 1.802 2.0 171.6 574.2 ± 33.2 nm

As confirmed in Table 5, in the case of the comparative example, it was confirmed that the heat-resisting power was inferior compared to the pressure-sensitive adhesive of the present invention. Peel strength is also lower in the embodiment, it can be seen that the adhesion function is excellent.

As a specific part of the present invention has been described in detail above, for those of ordinary skill in the art, it is clear that this specific description is only a preferred embodiment, and the scope of the present invention is not limited thereby. will be. Accordingly, it is intended that the substantial scope of the present invention be defined by the appended claims and their equivalents.

Claims (15)

A surfactant composition for a pressure-sensitive adhesive comprising a compound of Formula 1 below:
[Formula 1]

In Formula 1, n is 7 to 11. According to claim 1,
In Formula 1, n is 9, the surfactant composition for a pressure-sensitive adhesive. A pressure-sensitive adhesive composition comprising the surfactant composition of claim 1 . 4. The method of claim 3,
The composition is, the pressure-sensitive adhesive composition further comprising a monomer, an initiator and a solvent. 5. The method of claim 4,
The composition further comprises one or more additives selected from the group consisting of a tackifier, an emulsifier, an antifoaming agent, a stabilizer, a pH adjuster, a leveling agent, a wetting agent, and a biocide, The pressure-sensitive adhesive composition. 5. The method of claim 4,
The monomer is at least one selected from the group consisting of acrylic acid, n-butyl acrylate, 2-ethylhexyl acrylate and methyl methacrylate, the pressure-sensitive adhesive composition. 5. The method of claim 4,
The pressure-sensitive adhesive is used for at least one purpose selected from the group consisting of labels, electrical/electronic tapes, building/interior tapes, automotive tapes, and medical adhesives, the pressure-sensitive adhesive composition. reacting the compound of Formula 2 by adding benzene and butenoic acid (S1);
reacting by adding a catalyst after the reaction of step S1 (S2);
After the reaction of step S2, neutralizing by adding a basic solution (S3);
obtaining an oily layer after layer separation by adding distilled water to the neutralized solution (S4); and
A method for preparing a surfactant composition for a pressure-sensitive adhesive comprising a compound of Formula 1, comprising the step (S5) of removing the solvent from the oily layer:
[Formula 1]

[Formula 2]

In Formulas 1 and 2, n is 7 to 11. 9. The method of claim 8,
The catalyst of step S2 is para-toluenesulfonic acid, the method for producing a surfactant composition for a pressure-sensitive adhesive. 9. The method of claim 8,
The step S1 is to react for 120 to 240 minutes at 40 to 80 ℃,
The step S2 is to react at 60 to 100 ℃ for 18 to 36 hours,
The step S3 is to neutralize for 20 to 40 minutes at 50 to 90 ℃, a method for producing a surfactant composition for a pressure-sensitive adhesive. Preparing an aqueous phase by stirring an initiator and distilled water (a);
After dissolving the compound of Formula 1 and the first acrylic acid in distilled water, the second acrylic acid is added and stirred to emulsify to prepare a pre-emulsion (b);
(c) pre-reacting by adding some of the pre-emulsion and an initiator to the aqueous phase of step a;
After the preliminary reaction, the remaining pre-emulsion is added dropwise to react (d); and
A method for producing a pressure-sensitive adhesive composition comprising the step (e) of adjusting the pH after step d:
[Formula 1]

In Formula 1, n is 7 to 11. 12. The method of claim 11,
The first acrylic acid is acrylic acid, the method for producing a pressure-sensitive adhesive composition. 12. The method of claim 11,
The second acrylic acid is n-butyl acrylate, 2-ethylhexyl acrylate, and the method for producing a pressure-sensitive adhesive composition of at least one selected from the group consisting of methyl methacrylate. 12. The method of claim 11,
The initiator of step a is ammonium persulfate, the method for producing a pressure-sensitive adhesive composition. 12. The method of claim 11,
The step a is to be performed while stirring at a temperature of 50 to 120 ℃ at a speed of 100 to 200 rpm,
Step b is to be carried out while stirring at a speed of 200 to 600 rpm,
Step c is to be carried out at a temperature of 40 to 120 ℃ for 1 to 10 minutes,
In step d, the reaction is performed by dropping the pre-emulsion at a constant rate for 1 to 6 hours.

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