KR102348363B1 - Cooling performance variable type liquid-cooled heat sink - Google Patents

Abstract

The present invention relates to a variable cooling performance type water-cooled heat sink, which comprises: an upper cooling plate supporting at least one heat dissipation target on the upper plate surface and having a plurality of heat dissipation fins protruding from the lower plate surface at intervals; a lower cooling plate coupled to the lower part of the upper cooling plate to form a flow path through which a cooling fluid flows between the upper cooling plate and the lower cooling plate and having a fin accommodating space formed therein to form a part of the flow path and accommodate the plurality of heat dissipation fins; and a plurality of movable pin units installed on the lower cooling plate to be inserted between the pair of heat dissipation fins adjacent to each other when the upper cooling plate and the lower cooling plate are coupled, and installed on the lower cooling plate to individually adjust an insertion depth between the pair of heat dissipation fins. According to the present invention, since the insertion depth between the multiple movable fin units of the north number is adjusted individually between the heat dissipation fins, the cross-sectional area of the flow path is adjusted so that heat transfer performance by each heat dissipation fin can be changed, thereby being adaptively applied to heat distribution of the heat dissipation target.

Description

COOLING PERFORMANCE VARIABLE TYPE LIQUID-COOLED HEAT SINK

The present invention relates to a water-cooled heat sink with variable cooling performance, and more particularly, to a water-cooled heat sink with variable cooling performance capable of changing cooling performance according to a heat distribution or temperature of a heat-dissipating object.

If the heat generated from the equipment with high heat generation and high heat flux is not effectively removed, heat accumulation occurs and consequently accelerates the deterioration of electronic equipment, and in some cases, a fire may occur.

Therefore, since the temperature of the electronic equipment affects the performance and reliability, heat management is required to maintain the proper temperature of the electronic equipment.

However, the conventional air-cooled heat sink has difficulty in cooling high heat and high heat flux equipment such as high heat electronic components, batteries, and condensing solar panels due to the low thermal conductivity and specific heat of air.

Accordingly, recently, a water-cooled heat sink for cooling heat generated from electronic equipment using a cooling fluid such as water has been widely used.

The water-cooled heat sink is a technology that cools the heating part of electronic equipment by transferring heat by forced convection by flowing a cooling fluid using a pump.

In particular, as the heat flux exceeds 100 W/cm 2 in power semiconductors and CPUs of supercomputers, the need for a water-cooled heat sink with high heat transfer performance is increasing. Also, in recent years, the need for a water-cooled heat sink has been raised in cooling systems of electric vehicles, hydrogen vehicles, hybrid vehicles, and the like.

Accordingly, recent studies on increasing the density of fins due to the increase in heat flux in electronic equipment and research on complicating the shape of fins have been actively conducted and have been applied to actual industrial sites, but the complexity of the structure has increased.

In addition, since the conventional water-cooled heat sink inserts fins having a complicated shape to increase heat transfer, the manufacturing process is complicated, mass production is difficult, and manufacturing cost is increased.

Accordingly, in Korean Patent Application Laid-Open No. 10-2021-0085730 filed by the present applicant, a plurality of heat dissipation fins for supporting one or more heat dissipating objects and dissipating heat generated from the heat dissipating objects on one plate surface are formed to protrude at intervals. an upper cooling plate for cooling the heat dissipation object; The main flow path formed on the surface facing the upper cooling plate and through which the cooling fluid flows, and the plurality of heat dissipation fins are provided on the main flow path to be insertable and the cooling fluid flows continuously between the plurality of heat dissipation fins. There has been proposed a water-cooled heat sink having a plurality of heat dissipation fin insertion grooves forming a furnace and including a lower cooling plate coupled to an upper cooling plate to cool heat generated from a heat dissipating object.

The water-cooled heat sink disclosed in the Korean Patent Laid-Open Publication No. (Kokai) discloses a heat exchange area within the same volume by forming a flow path through which the cooling fluid flows between the heat dissipation fin of the upper cooling plate and the heat dissipation fin insertion groove of the lower cooling plate, thereby improving the flow structure of the fluid. heat transfer performance can be improved by increasing

In particular, the cooling fluid having a high velocity through the vertical flow path and flowing toward the horizontal flow path jets impingement on the inner surface of the heat dissipation fin insertion groove or the upper cooling plate in the inflection region, and then flows into the horizontal flow path. It provides the effect of increasing the cooling efficiency.

On the other hand, as described above, research on effective cooling is being actively conducted in accordance with the increase in heat flux in various fields, for example, metal processing, thermal management of electronic equipment and solar panels, and thermal management of laser diodes. .

In the actual use environment, since the heat load is not constant and continuously changes, various methods such as flow rate change and cooling water temperature change are used to respond to load fluctuations.

For example, in the case of metal processing, it is necessary to control the cooling rate in order to obtain excellent metal quality. For this purpose, methods of controlling the flow rate of cooling water or adjusting the amount of flux are used. However, to use these methods, the complexity of the system is required. increases

As another example, in the case of cooling systems such as electric vehicles, hydrogen vehicles, and hybrid vehicles, main heat is generated from inverters and motors during maximum operation, and main heat is generated from the on-board charger during charging. It is necessary to intensively cool the area that needs thermal management. However, the design is complicated because an additional control valve and piping system configuration are required for this purpose.

As described above, since an additional design is required to change the cooling performance according to a change in the cooling load, there is a problem in that the system configuration is complicated and related costs are increased.

Korean Patent Publication No. 10-2001-0027876 Korean Patent Publication No. 10-2021-0085730

An object of the present invention is to provide a water-cooling heat sink with variable cooling performance capable of controlling cooling performance by changing a shape of a cooling plate according to a heat distribution of a heat dissipating object to solve the above problems.

Another aspect of the present invention is to provide a water-cooled heat sink with variable cooling performance, which can improve heat transfer performance by increasing the heat exchange area within the same volume, simplify the structure, facilitate mass production, and reduce manufacturing cost. There is a purpose.

An object of the present invention is to provide a water-cooled heat sink with variable cooling performance according to the present invention, comprising: an upper cooling plate supporting at least one heat dissipation target on an upper plate surface, and having a plurality of heat dissipation fins protruding from the lower plate surface at intervals; Lower cooling coupled to a lower portion of the upper cooling plate to form a flow path through which a cooling fluid flows between the upper cooling plate and forming a part of the flow path, but having a fin accommodating space in which the plurality of heat dissipation fins are accommodated plate family; It is installed on the lower cooling plate to be inserted between the pair of heat dissipation fins adjacent to each other when the upper cooling plate and the lower cooling plate are coupled, and the insertion depth between the pair of heat dissipation fins is individually adjustable in the lower cooling plate. It is achieved by a water-cooled heat sink with variable cooling performance, characterized in that it includes a plurality of movable fin units to be installed.

Here, the upper cooling plate is formed on one side in the arrangement direction of the plurality of heat dissipation fins, the inlet through which the cooling fluid flows; It may further include an outlet formed on the other side of the arrangement direction through which the cooling fluid flowing along the flow path is discharged.

In addition, the flow path includes an inflow-side flow path formed between the inlet and the fin accommodating space, a fin-side flow path formed by the fin accommodating space, and an outlet-side flow path formed between the fin accommodating space and the outlet. comprising a furnace; The fin-side flow path includes a plurality of vertical flow paths through which the cooling fluid flows in the vertical direction between each of the heat dissipation fins and the movable fin units, and between each of the heat dissipation fins and the plate surface of the lower cooling plate, each of the movable fin units and a plurality of horizontal flow paths through which the cooling fluid flows in a horizontal direction between a plate surface of the upper cooling plate; The fin-side flow path may be alternately formed with the vertical flow path and the horizontal flow path.

In addition, each of the movable pin units includes a movable pin inserted between a pair of adjacent heat dissipation fins; It may include an insertion driving module for adjusting the insertion depth of the movable pin.

And, the cross-sectional area of the horizontal flow path formed between the movable pin and the plate surface of the upper cooling plate by controlling the insertion driving module so that the insertion depth of each of the movable pins is adjusted based on the heat distribution of the heat dissipation object It may further include a control unit for adjusting.

In addition, the controller may control the corresponding insertion driving module to narrow the cross-sectional area of the horizontal flow path positioned in a relatively high temperature distribution according to the heat distribution of the heat dissipation object.

In addition, the control unit may adjust the insertion depth of the entire plurality of movable pins based on the temperature of the heat dissipation target.

According to the present invention, the insertion depth between the plurality of movable fin units is individually controlled between the heat dissipation fins, and the cross-sectional area of the flow path is adjusted, so that the heat transfer performance by each heat dissipation fin can be changed, so that the heat distribution of the heat dissipation object is affected. An adaptively applicable cooling performance variable water-cooled heat sink is provided.

In addition, according to the present invention, a flow path through which the cooling fluid flows is formed between the heat dissipation fin of the upper cooling plate and the movable fin unit located on the lower cooling plate to improve the flow structure of the fluid, thereby increasing the heat exchange area within the same volume. Thus, heat transfer performance can be improved, and mass production is facilitated by simplifying the structure, and the effect of reducing manufacturing cost is provided.

1 is a cross-sectional view of a water-cooled heat sink with variable cooling performance according to an embodiment of the present invention;
2 is a bottom perspective view of a water-cooled heat sink with variable cooling performance according to an embodiment of the present invention;
3 and 4 are cross-sectional views taken along line AA of FIG. 1,
5 is a cross-sectional view of a water-cooled heat sink with variable cooling performance according to another embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the present embodiments allow the disclosure of the present invention to be complete, and those of ordinary skill in the art to which the present invention pertains. It is provided to fully inform those skilled in the art of the scope of the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and/or “comprising” does not exclude the presence or addition of one or more other components in addition to the stated components. Like reference numerals refer to like elements throughout, and "and/or" includes each and every combination of one or more of the recited elements.

Unless otherwise defined, all terms (including technical and scientific terms) used herein will have the meaning commonly understood by those of ordinary skill in the art to which this invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless specifically defined explicitly.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a water-cooled heat sink 100 with variable cooling performance according to an embodiment of the present invention, FIG. 2 is a bottom perspective view of a water-cooled heat sink 100 with variable cooling performance according to an embodiment of the present invention, and FIG. 3 and FIG. 4 is a cross-sectional view taken along line AA of FIG. 1 .

1 to 4, the cooling performance variable water-cooled heat sink 100 (hereinafter, referred to as 'water-cooled heat sink 100') according to an embodiment of the present invention is an upper cooling plate 130, a lower cooling It includes a plate 110 and a plurality of movable pin units 150 .

In the embodiment of the present invention, it is assumed that the upper cooling plate 130 and the lower cooling plate 110 are each independently manufactured. In addition, the upper cooling plate 130 and the lower cooling plate 110 may be coupled to each other through fastening means such as bolts.

Here, through the coupling between the upper cooling plate 130 and the lower cooling plate 110 , a flow path through which the cooling fluid flows is formed between the upper cooling plate 130 and the lower cooling plate 110 . A detailed description will be given later.

In the embodiment of the present invention, a rubber packing (not shown) may be provided on the surfaces facing each edge of the upper cooling plate 130 and the lower cooling plate 110 , and the cooling fluid flowing along the flow path through this Make sure that it does not leak to the outside.

For example, the upper cooling plate 130 has a rectangular cross-sectional shape having a predetermined thickness.

A heat dissipation object (not shown) is installed on the upper plate surface of the upper cooling plate 130 . Here, in the embodiment of the present invention, the heat dissipation object is provided on the upper surface of the upper cooling plate 130 as an example, but is not limited thereto, and the upper cooling plate 130 is a heat dissipation object separated from the upper cooling plate 130) It can also be closely supported on the bottom surface of the

In addition, the upper cooling plate 130 may include an inlet 131 through which the cooling fluid is introduced, and an outlet 132 through which the cooling fluid flowing in through the inlet 131 and flowing along the flow path is discharged to the outside. .

In the embodiment of the present invention, it is assumed that the inlet 131 and the outlet 132 are respectively formed on both sides of the plurality of movable pin units 150 in the arrangement direction.

Meanwhile, on the lower plate surface of the upper cooling plate 130 , a plurality of heat dissipation fins 133 are formed to protrude downward at regular intervals.

The plurality of heat dissipation fins 133 have a rectangular cross-sectional shape having a constant width and height. In the embodiment of the present invention, it is exemplified that the plurality of heat dissipation fins 133 each have the same thickness, but the technical spirit of the present invention is not limited thereto.

In addition, although the plurality of heat dissipation fins 133 are disposed at equal intervals vertically from the lower plate surface of the upper cooling plate 130 as an example, the technical spirit of the present invention is not limited thereto. As an example, of course, they may be provided with different thicknesses depending on the basic heat dissipation distribution of the heat dissipation object.

Meanwhile, the lower cooling plate 110 is coupled to the lower portion of the upper cooling plate 130 such that a flow path through which the cooling fluid flows is formed between the lower cooling plate 130 and the upper cooling plate 130 .

In addition, a fin accommodating space forming a part of the flow path is formed in the lower cooling plate 110 , and the fin accommodating space is formed by recessing the plurality of heat dissipation fins 133 to a depth that can be accommodated therein.

Through this configuration, when the upper cooling plate 130 and the lower cooling plate 110 are coupled, the plurality of heat dissipation fins 133 of the upper cooling plate 130 are disposed inside the fin accommodation space of the lower cooling plate 110 . In the positioned state, the end of each heat dissipation fin 133 is disposed to be spaced apart from the plate surface of the fin accommodating space by a predetermined distance, thereby forming a flow path between the end of the heat dissipation fin 133 and the plate surface of the fin accommodating space.

Here, in the embodiment of the present invention, it is assumed that the flow path includes an inlet side flow path 111 , a fin side flow path 113 , and an outlet side flow path 112 .

As shown in FIGS. 3 and 4 , the inflow-side flow path 111 is formed between the inlet 131 and the fin accommodating space, in the space between the upper cooling plate 130 and the lower cooling plate 110 . formed as an example. In the exemplary embodiment of the present invention, the plate surface of the lower cooling plate 110 is depressed to form the inflow-side flow path 111 , but the plate surface of the upper cooling plate 130 is depressed or both sides are depressed. The inflow-side flow path 111 may be formed in a state where the

The discharge-side flow path 112 is formed between the discharge port 132 and the fin receiving space. Like the inlet flow path 111 , the outlet flow path 112 is formed in the space between the upper cooling plate 130 and the lower cooling plate 110 , and its configuration is in the inlet flow path 111 . can respond

And, the fin-side flow path 113 is formed by the fin accommodating space. Here, the fin-side flow path 113 is configured to include a plurality of vertical flow paths 113a and a plurality of horizontal flow paths 113b, which will be described in detail later.

On the other hand, the plurality of movable fin units 150 according to the embodiment of the present invention is cooled so as to be inserted between a pair of adjacent heat dissipation fins 133 when the upper cooling plate 130 and the lower cooling plate 110 are coupled to each other. It is installed on the plate (110).

Here, each movable fin unit 150 is installed on the lower cooling plate 110 so that the insertion depth between the pair of heat dissipation fins 133 is individually adjustable. Accordingly, when the insertion depth of the movable pin unit 150 is adjusted, the cross-sectional area of the horizontal flow path 113b of the pin-side flow path 113 can be adjusted, so that the cooling performance at the corresponding position can be individually adjusted. do.

More specifically, as described above, the fin-side flow path 113 includes a plurality of vertical flow paths 113a through which the cooling fluid flows in the vertical direction between each heat dissipation fin 133 and the movable fin unit 150 . may include

In addition, in the fin-side flow path 113 , the cooling fluid flows between the respective heat dissipation fins 133 and the plate surfaces of the lower cooling plate 110 and between the respective movable fin units 150 and the plate surfaces of the upper cooling plate 130 . It may include a plurality of horizontal flow paths 113b flowing in the horizontal direction.

That is, in the embodiment of the present invention, the vertical flow path 113a and the horizontal flow path 113b are alternately formed to form the fin-side flow path 113 .

According to the above configuration, the cooling fluid flowing in through the inlet 131 flows along the inlet side flow path 111 and flows into the fin side flow path 113, after descending through the vertical flow path 113a. , flows along the horizontal flow path 113b, rises again along the vertical flow path 113a, and repeats flowing along the horizontal flow path 113b, then the outlet 132 through the discharge side flow path 112 ) is released as

According to the above configuration, the vertical flow path 113a and the horizontal flow path 113b form an inflection region in which the flow path is bent at a 90 degree angle. is formed

For example, the inflection region is formed in each boundary region of the vertical flow path 113a and the horizontal flow path 113b, so that the upper cooling plate 130 and the lower cooling plate 110 are the collision plates with which the cooling fluid collides. function will be performed.

Accordingly, the cooling fluid having a high velocity through the vertical flow path 113a and flowing toward the horizontal flow path 113b is jet impingement on the upper cooling plate 130 or the lower cooling plate 110 in the inflection region. After that, it flows to the horizontal flow path 113b.

Here, the jet collision is one of the methods in which a fluid collides with a wall surface of a heat source to transfer heat. Accordingly, as the cooling fluid jets collides with the upper cooling plate 130 or the lower cooling plate 110, the thermal boundary layer of the cooling fluid with jet collision becomes thinner, thereby reducing the heat of the cooling fluid according to Fourier's law of heat conduction. Due to the boundary layer, the cooling fluid has high heat transfer performance.

Meanwhile, each movable pin unit 150 may include a movable pin 151 and an insertion driving module 152 .

The movable pin 151 is inserted between a pair of heat dissipation fins 133 adjacent to each other. Through this, a vertical flow path 113a is formed between the respective heat dissipation fins 133 , and a horizontal flow path 113b is formed between the upper cooling plate 130 .

The insertion driving module 152 adjusts the distance between the end of the movable pin 151 and the lower plate surface of the upper cooling plate 130 by adjusting the insertion depth of the movable pin 151 . Through this, the cross-sectional area of the horizontal flow path 113b formed between the movable pin 151 and the plate surface of the upper cooling plate 130 is adjusted, so that it is possible to adjust the cooling performance of the corresponding area.

According to the above configuration, through the control of each insertion driving module 152 , the cross-sectional area of the horizontal flow path 113b formed by each movable pin 151 is adjusted, and each movable pin 151 is adjusted. It becomes possible to adjust the cooling performance in the region where it is located.

This makes it possible to adjust the cooling performance for each area based on the heat distribution of the heat dissipating object. For example, when the heat distribution of the heat dissipation object has a form in which heat is severe in the central portion, the insertion depth of the movable pin 151 in the central portion of the movable pins 151 shown in FIGS. 3 and 4 is adjusted relatively deeply. Accordingly, the cooling performance can be relatively improved by reducing the cross-sectional area of the horizontal flow path 113b in the corresponding region.

3 shows an example in which the cross-sectional area of the horizontal flow path 113b on the side of the inlet 131 is adjusted to be small, and FIG. 4 is a view showing an example in which the horizontal flow path 113b is adjusted so that the same cross-sectional area is formed.

As described above, the cooling performance in the horizontal flow path 113b can be adjusted according to the heat distribution of the heat dissipating object, thereby enabling more effective heat dissipation of the heat dissipating object.

Here, in the embodiment of the present invention, the insertion driving module 152 is provided in the form of a jig, and the insertion depth of each movable pin 151 is manually adjusted as an example.

As another example, the control unit (not shown) controls the insertion driving module 152 to adjust the insertion depth of the movable pin 151 based on the heat distribution of the heat dissipation object. Of course, the insertion driving module 152 controlled by the controller can be implemented in various forms, such as a step motor, an electromagnet, and hydraulic pressure.

3 and 4, the electromagnet type insertion driving module 152 is shown as an example, and the movable pin unit 150a of the water-cooled heat sink 100a according to the embodiment shown in FIG. 5 is As an example, the step motor type insertion driving module 152a moves the movable pin 151a up and down.

Through such a configuration, the controller may control the insertion driving module 152 so that the cross-sectional area of the horizontal flow path 113b positioned at a relatively high temperature distribution is narrowed according to the heat distribution of the heat dissipation object.

In addition, the controller may adjust the insertion depth of the entire movable pin 151 based on the temperature of the heat dissipation target. For example, when the temperature of the heat-dissipating object is high, the cross-sectional area of the entire horizontal flow path 113b may be reduced by deeply inserting the insertion depth of the entire movable pin 151 , thereby improving cooling performance.

On the other hand, when the same heat dissipation object performs an operation in which the current temperature load is lowered, the cross-sectional area of the horizontal flow path 113b may be increased by inserting the entire movable pin 151 not to be relatively deep.

Accordingly, by individually or entirely controlling the plurality of movable pins 151 according to the current driving state or heat distribution of the heat dissipating object, it is possible to adjust the cooling performance in a state suitable for the heat distribution or temperature of the heat dissipating object.

As mentioned above, although embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains know that the present invention can be embodied in other specific forms without changing its technical spirit or essential features. you will be able to understand Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

100: water cooling heat sink 110: lower cooling plate
111: inlet side flow path 112: discharge side flow path
113: fin side flow path 113a: vertical flow path
113b: horizontal flow path 130: upper cooling plate
131: inlet 132: outlet
133: cooling fin 150: movable fin unit
151: movable pin 152: insertion drive module

Claims (7)

In the cooling performance variable type water cooling heat sink,
an upper cooling plate supporting at least one heat dissipation target on an upper plate surface, and having a plurality of heat dissipation fins protruding from the lower plate surface at intervals;
Lower cooling coupled to a lower portion of the upper cooling plate so that a flow path through which a cooling fluid flows is formed between the upper cooling plate and a fin accommodating space that forms a part of the flow path and accommodates the plurality of heat dissipation fins plate family;
When the upper cooling plate and the lower cooling plate are coupled, they are installed on the lower cooling plate so as to be inserted between the pair of adjacent heat dissipation fins, and the insertion depth between the pair of heat dissipation fins is individually adjustable in the lower cooling plate. Including a plurality of movable pin units to be installed,
The upper cooling plate
an inlet formed on one side of the plurality of heat dissipation fins in the arrangement direction through which the cooling fluid flows;
It is formed on the other side of the arrangement direction and further includes an outlet through which the cooling fluid flowing along the flow path is discharged;
the flow path
an inflow-side flow path formed between the inlet and the fin accommodating space;
a fin-side flow path formed by the fin accommodating space;
a discharge-side flow path formed between the fin receiving space and the outlet;
The fin side flow path
a plurality of vertical flow paths through which the cooling fluid flows in the vertical direction between each of the heat dissipation fins and the movable fin units;
a plurality of horizontal flow paths through which the cooling fluid flows in a horizontal direction between each of the heat dissipation fins and a plate surface of the lower cooling plate and between each of the movable fin units and a plate surface of the upper cooling plate;
the fin-side flow path is alternately formed with the vertical flow path and the horizontal flow path;
Each of the movable pin units is
a movable pin inserted between a pair of adjacent heat dissipation fins;
and an insertion driving module for adjusting the insertion depth of the movable pin;
Controlling the insertion drive module so that the insertion depth of each of the movable pins is adjusted based on the heat distribution of the heat dissipation object to adjust the cross-sectional area of the horizontal flow path formed between the movable pin and the plate surface of the upper cooling plate Cooling performance variable water-cooled heat sink, characterized in that it further comprises a control unit. delete delete delete delete According to claim 1,
Wherein the control unit controls the insertion driving module to narrow the cross-sectional area of the horizontal flow path located in a relatively high temperature distribution according to the heat distribution of the heat dissipation object, the cooling performance variable water-cooled heat sink. According to claim 1,
The control unit, based on the temperature of the heat dissipation object, a cooling performance variable water-cooling heat sink, characterized in that for adjusting the insertion depth of the plurality of the entire movable fins.

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