KR102326782B1 - Overhead manufacturing, processing and storage system - Google Patents

Abstract

BACKGROUND This disclosure relates generally to substrates and manufacturing systems, processes and methods. In one exemplary embodiment, there is directed to methods, apparatus, and system for providing improved substrate processing and fabrication, wherein at least a portion of the system, apparatus or method is attached, for example, to a ceiling or overhead mounts. , may be in an overhead system, and thus find floor space and other efficiencies.

Description

OVERHEAD MANUFACTURING, PROCESSING AND STORAGE SYSTEM

This invention is disclosed in U.S. Provisional Patent Application No. 62/412,247 (docket number TEC003-PRO), filed at least on October 24, 2016, and entitled "Overhead Manufacturing, Processing, and Storage Systems," and June 2016; Priority is claimed to U.S. Provisional Patent Application No. 62/355,856 (Document No. TEC-001PRO), filed on the 28th, entitled "Substrate Storage and Processing," and may be incorporated herein for use.

The disclosure herein relates generally to substrates and manufacturing systems, processes and methods. In one embodiment, an improved substrate and manufacturing system, process and method are directed to a method, apparatus and system, wherein at least a portion of the system process or method is attached to a ceiling or overhead mounts, such as attached to a ceiling or overhead mounts. , may exist in an overhead system.

For many applications, particularly within substrate manufacturing and related industries, efficient and proper handling, storage and processing of materials such as substrates can be extremely important. Since the introduction of 300mm wafer semiconductor materials, Front Opening Unified Pods or “FOUPs” have become the standard storage and transport method for substrates and similar materials. FOUPs have been used to isolate and store silicon wafers for use in semiconductor production. Semiconductors critical to the design of digital circuits, microprocessors, and transistors require keeping these wafers as close to immaculate condition as the storage unit allows.

Thus, FOUPs allow wafers to be transferred between different machines used for processing and measuring the wafer. A recent improvement to this standard has been the Tec-Cell container, which provides much higher density and volume of wafer or substrate storage, as well as other improved capabilities for FOUPs of the prior art. However, as FOUP has become a standard within the industry and is still used on many machines, the need to use each in a different environment, as well as the need for a complete implementation of Tec-Cell, can be completed between Tec-Cell and FOUP. The swapping and sorting of wafers and substrates in the process must be completed and done in an efficient manner.

A major part of substrate fabrication and any fabrication and process can be space constraints. In factories, large processors, robots, and manufacturing systems are used within the constraints of small spaces, such as factories, warehouses, or buildings. Prior art systems provide key systems, components, storage, processors, etc. either floor mounted or distinctly staged on the ground floor. Placing all processes, systems and equipment on the floor can result in wasted space within the building, resulting in a lot of space lost. In addition, if the ground floor space is used, it may cause logistical problems because people, carts, machines, etc. that are forced to move or move only on the floor will be disturbed. Thus, it becomes clear to have machines and systems that can be reliably pushed from the ground floor to another location, a location that interferes with processes, people and machines that must be on the floor.

Thus, the ability to have ceiling or overhead mounted systems, including transport systems, processing and manufacturing systems, storage, buffering, stocker systems, sorting systems, among other processes and systems; The providing system may be needed within the art to improve the efficiency of substrate and wafer fabrication, among other fields.

Disclosed herein are methods, apparatus, and systems that provide improved substrate and fabrication systems, processes and methods, wherein at least a portion of the system process or method may reside within an overhead system, such as attached to a ceiling.

The present invention provides a system, apparatus or method that at least provides the ability to allow processing, sorting, storage, buffering, manufacturing and other applicable systems to be stored on the ceiling of a room within a manufacturing environment, such as substrate manufacturing. can provide In one exemplary embodiment the present invention may provide at least an overhead transport system (OHT), which may have any number of tracks, robots and extension capabilities. These may include the ability to move in any direction and any location along the ceiling. In this case, the transport system is capable of interacting with, transporting or transporting containers, such as FOUPs or Tec-Cells, interchangeably, by precise manipulators, between the floor-mounted system and the ceiling-mounted system. The same ability can be provided to OHT.

The floor-mounted system may be of any type as in the prior art, but may in particular include a user-operated control interface and controller as well as a loading and transport stocker. Any of the foregoing may be permanently or portable floor mounted, and may be hand or connected to a ceiling mount by any method as well as directly to an overhead ceiling mounted system. They can also be retracted up and down.

Additionally, there may be ceiling mounted systems, which may be of any type provided in the prior art, except that instead of being mounted to the floor, they may be specifically mounted to the ceiling. The ceiling system can interface with any number of ceiling systems as well as the floor system, and an OHT or robot with a ceiling mounted OHT can move wafers, Tec-Cells and FOUPs between them. The ceiling mounted system may include a stocker, such as a high density stocker and storage, a transfer station for moving wafers between the Tec-Cell and the FOUP, and a processing station, among others. Any combination, permutation, number, and direction of any processor may be in any order or direction.

The present invention now provides substrates and wafers, using containers such as FOUPs or Tec-Cells, to ensure that the floor is completely empty and allows for increased logistical options as well as space for walking and moving. It can be seen that it is possible to reliably provide a given plant with high efficiency space for processing or storage, since the systems and devices are attached or present as positively ceiling-mounted and the space below it can be positively empty. am.

The method and system disclosed herein may be implemented by any means for achieving the various aspects. Other features will become apparent from the accompanying drawings and the following detailed description.

Exemplary embodiments are shown by way of example and not limitation to the figures in the accompanying drawings in which like reference numerals indicate like elements.

1A shows a prior art flooring system as a component side component diagram.
1B shows an embodiment of a ceiling system of the present invention in a side component view.
2A, 2B, and 2C show a flow chart for one embodiment of the ceiling system of the present invention.
3A, 3B, 3C and 3D show one embodiment of the ceiling system of the present invention as a component side view.
4A, 4B, and 4C show a flow diagram of one embodiment of the ceiling system of the present invention.
5A, 5B, 5C, 5D and 5E illustrate one embodiment of the ceiling system of the present invention as a side component view.
6A, 6B, 6C and 6D illustrate a flow chart for one embodiment of the ceiling system of the present invention.
7A, 7B and 7C show one embodiment of the ceiling system of the present invention as a side component diagram.
8A, 8B, and 8C show a flow chart of one embodiment of the ceiling system of the present invention.
9A, 9B and 9C illustrate one embodiment of the ceiling system of the present invention as a side component diagram.
10A, 10B, and 10C show a flow diagram of one embodiment of the ceiling system of the present invention.
11A, 11B, 11C and 11D show one embodiment of the ceiling system of the present invention as side component views.
12A, 12B, 12C and 12D illustrate a flow chart for one embodiment of the ceiling system of the present invention.
13A and 13B show one embodiment of the ceiling system of the present invention as a side component view.
14A, 14B, 14C and 14D illustrate a flow chart for one embodiment of the ceiling system of the present invention.
15A, 15B, 15C and 5D show one embodiment of the ceiling system of the present invention as a side component view.
16A, 16B, 16C and 16D illustrate a flow chart for one embodiment of the ceiling system of the present invention.
17A, 17B and 17C show one embodiment of the ceiling system of the present invention as a side component view.
18A, 18B, and 18C illustrate a flow chart for one embodiment of the ceiling system of the present invention.

Other features of the present embodiments will become apparent from the accompanying drawings and the following detailed description.

Disclosed herein are methods, apparatus, and systems that may provide improved substrate and fabrication systems, processes and methods, wherein at least a portion of the system process or method may reside within an overhead system, such as attached to a ceiling.

The present invention may include an overhead system in some embodiments that may be added to any other embodiments.

The present invention may include a ceiling mounted system, in some embodiments, which may be in addition to any other embodiments.

The present invention may include a ceiling mounted system, which may include subsystems, in some embodiments, which may be in addition to any other embodiments.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system that may include a subsystem, wherein the subsystem is a substrate or a FOUP or Tec-Cell. for handling, storage, or other manipulating containers holding wafers.

The present invention may include, in some embodiments, which may be in addition to any other embodiments, a ceiling mounted system that may include subsystems, all subsystems being ceiling mounted.

The present invention may include, in some embodiments, which may be in addition to any other embodiment, a ceiling mounted system, which may include subsystems, some subsystems being ceiling mounted and some being floor mounted. do.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system that may include subsystems, wherein a container such as a FOUP or Tec-Cell is placed between the subsystems. can move from

The present invention may include, in some embodiments, which may be in addition to any other embodiments, a ceiling mounted system that may include subsystems, wherein a container such as a FOUP or Tec-Cell is transported via the OHT As such, it can move between subsystems.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system that may include subsystems, wherein containers such as FOUPs or Tec-Cells, in any combination , can move between subsystems in either direction or number.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling-mounted system that may include subsystems, wherein the user manipulates any subsystem of the overall system. There may be a drop down controller for this.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system that may include a subsystem, wherein the subsystem is any system such as a stocker, heater, processor. may provide, or sort or buffer the system.

The present invention may include, in some embodiments, which may be in addition to any other embodiments, a ceiling mounted system that may include a subsystem, wherein the subsystem is adapted to an existing floor mounted system or a ceiling system. are integrated

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system that may include subsystems, wherein each subsystem or some subsystem provides a purge gas capability. include

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling mounted system, wherein the system may reduce or eliminate a footprint because the system is mounted to the ceiling. In this way, other logistics such as users, containers, carts, etc. can use the ground floor, improving space requirements and efficiency for the system.

The present invention may include a distributed OHT track for storage of Tec-Cell carriers/containers and other containers as well as FOUPs, in some embodiments that may be added to any other embodiments. The track may be a conventional track, a conveyor, or any other method. The present invention may include an operator station on the floor for accessing the ceiling mounted system, in some embodiments, which may be in addition to any other embodiments. This may include a Fab with a drop ceiling.

The present invention may include applications related to ceiling systems, in some embodiments that may be added to any other embodiments, wherein the system may be installed in a ceiling such that zero occupancy above ground level area can be achieved. This minimization of the footprint can be achieved by installing a portion of the system on the ceiling.

The present invention may include, in some embodiments, in addition to any other embodiments, a ceiling that may have a drop ceiling similar to a raise floor, which may include a system in the space between the ceiling and the drop ceiling. It is possible to enable laminar flow through

The present invention provides a complete ceiling system, such as a stocker in the ceiling, including OHT load ports, robots, and storage, all installed in the ceiling, in some embodiments which may be added to any other embodiments. may include. Additional stations such as opener stations, sorter stations, or transfer stations (for example, changing from one container to another, a container of a different type, or another container of the same type) will be included. can

The present invention provides, in some embodiments that may be added to any other embodiments, such as creating a special OHT storage area, which may contain a track for each FOUP, for example storage only without load ports or robots. It may include a simplified complete ceiling system that can be used in the area. The OHT storage area can be used to store high-density containers such as Tec-Cell containers (new containers or existing containers).

The present invention includes a partial ceiling system, such as a stocker with one part (storage area) on the ceiling and one part (operator loading station) on the floor, in some embodiments that may be added to any other embodiments. can do. Other stations such as sorter stations, transfer stations, opener stations (or zoom stations) may be on the ceiling or floor.

The present invention may include a partial floor station, such as an operator access station on the floor, in some embodiments that may be added to any other embodiments. The partial floor system may include an EFEM, which may be placed on the floor to provide operator access to the system, such as placing the system to handle FOUPs. The system may be a stocker, or a handling system, which may be placed in part on a ceiling.

The present invention may include a partial floor station, such as an operator access station on the floor, in some embodiments that may be added to any other embodiments. The partial floor system may include a monitor, which may be placed on the floor to allow an operator to access the system. The system may be a stocker, or a handling system, which may be placed in part on a ceiling. The load port may be an OHT load port, and thus may be located in the ceiling.

The present invention may include a system in which all parts of the system may be located in a ceiling, in some embodiments that may be added to any other embodiments. Alternatively, some of the system may be mounted to the ceiling and other portions may optionally be mounted to the floor. Specifically, the storage station may be located on the ceiling. An operator interface station may be located on the floor, and the rest of the system may be on the ceiling. Ceiling components may be clustered in one location or may be spread out, for example distributed throughout the installation.

The present invention may include a stocker system on the ceiling, in some embodiments that may be in addition to any other embodiments. Additionally, at least a storage station of the stocker may be disposed on the ceiling. Other stations, such as load ports and robots, may be on the ceiling or on the floor or, for example, a sorter station may be on the ceiling.

In some embodiments, the present invention may be added to any other embodiment, at least a sorter station may be arranged on the ceiling. Other stations, such as load ports and robots, may be on the ceiling or on the floor.

The present invention may be in addition to any other embodiments, in some embodiments, at least an ID reader station may be disposed on the ceiling. Other stations, such as load ports and robots, may be on the ceiling or on the floor.

The present invention, in some embodiments that may be added to any other embodiments, may include a transfer and swap station on a ceiling, wherein at least the transfer or swap station may be disposed on the ceiling. . Other stations, such as load ports and robots, may be on the ceiling or on the floor. The transfer station may be used to transfer wafers from one type of container to another, such as transferring from a FOUP to a high density Tec-Cell container. The replacement station can be used to transfer wafers from one container to a different but identical type of container, such as transferring from one FOUP to another.

The present invention may include a distributed OHT track for storage of a Tec-Cell container, in some embodiments that may be added to any other embodiments, wherein at least the OHT track is to be used to store the Tec-Cell container. can The track may be configured to be accessible randomly, for example a parking lot. Alternatively, a first in last out configuration may be used, with temporary storage for swapping containers.

The present invention, in some embodiments that may be in addition to any other embodiment, may include an operator station on the floor for accessing the system on the ceiling, wherein the operator access station is located on the floor and A processing or storage station is located on the ceiling. Wafers, FOUPs or Tec-Cell containers can be loaded into an operator access station for transfer to the ceiling station. Alternatively, a FOUP or Tec-Cell container may come from the OHT to be transported to the ceiling station.

The present invention may include one or more monitors on the floor to allow an operator to operate the system on the ceiling, in some embodiments that may be added to any other embodiments. For example, the load port is an OHT load port, so it can accept FOUPs from the OHT track. An on-ceiling robot may be coupled to an OHT load port to access the wafer in the FOUP and take the wafer to a processing or storage system, where the processing or storage system may also be located on the ceiling.

Additionally, a load port is located on the floor to accommodate FOUP or Tec-Cell containers, which can then be transported to the OHT load port.

The present invention, in some embodiments that may be added to any other embodiments, accommodates FOUP or Tec-Cell containers, with robots for transporting FOUP or Tec-Cell containers or wafers to a ceiling processing or storage station. EFEM can be included on the floor to

The present invention, in some embodiments that may be added to any other embodiments, may include a fixture having a drop ceiling, wherein the fixture may be configured to mount a ceiling component of the system. The drop sealing may be linked to the ceiling component to enable laminar flow through the system, terminating in the space between the ceiling and the drop sealing. Such a configuration may be similar to the raised floor of a facility terminating at the raised floor while allowing laminar flow through the system.

Although embodiments of the present invention have been described with reference to specific embodiments, it will be apparent that various modifications and changes can be made therein without departing from the broader spirit and scope of the various embodiments. It will be understood by those of ordinary skill in the art that terms describing a process, product, member, or method are industry terms and may refer to similar alternative terms. In addition, the components shown in the drawings, their connections, couplings, and relationships, and their functions are merely exemplary and are not intended to limit the embodiments described herein.

1A (prior art) shows a prior art floor system in a side component view; 1A, it is easy to see how the prior art uses overhead space in a given area and provides limited floor space. In Fig. 1A (prior art) we can see a given workspace 100 , which may contain workpieces 130 such as stockers, processors, heaters, etc., and these workpieces are FOUP or a container or compartments such as the Tec-Cell 140 . An object 150 as described above may be moved by an overhead transport system, such as a track 110 having an arm or robot 120, which may be positioned above and descend to components of the system. have.

1B shows an embodiment of a ceiling system of the present invention in a side component view. It will be readily appreciated that at least some, or in one embodiment, all of the processing equipment and components may be fixed to the ceiling. The system includes a manufacturing facility 105 . The manufacturing facility 105 may be an entire space or a portion of an entire space. The manufacturing facility 105 may further include a conveyor or overhead conveyer 115 . The overhead conveyer 115 may be a moving track, such as used for moving a wagon. To this conveyor or overhead transporter 115 is attached a mobile robot or arm 125 that traverses the conveyor or overhead transporter 115 . Manufacturing facility 105 may further include overhead compartments 160 and 165 such as stockers, processors, heaters, and the like. The overhead compartments 160 and 165 may be adapted to receive the container 175 . The container 175 may be a FOUP or a Tec-Cell, but the scope of the present invention is not limited thereto. Such containers 175 may enter or exit overhead compartments 160 and 165 using a mobile robot or arm 125 that traverses over an overhead transporter or conveyor 115 .

2A, 2B, and 2C show a flow chart for one embodiment of the ceiling system of the present invention. 2A illustrates a process 200 of at least installing at least a portion of a system in a ceiling of a manufacturing facility. This process reduces the footprint of the system in semiconductor manufacturing and processing facilities. Process 220 configures at least a portion of the system to be mounted to a ceiling of a manufacturing facility, and process 240 reduces at least a footprint of the system by mounting at least a portion of the system to a ceiling of a manufacturing facility. In one embodiment, all parts of the substrate management system may be installed in the ceiling of a semiconductor manufacturing and processing facility.

3A, 3B, 3C, and 3D show side component views of one embodiment of the present invention in which the entire system is located on the ceiling of a semiconductor manufacturing and processing facility. As shown in FIG. 3A , a conveyor 310 having a moving unit 320 may be used to transport semiconductor substrates to a storage or processing station 360 . The storage or processing station 360 may include a robot for loading or unloading the moving unit 320 into the storage or processing station 360 . The moving unit 320 may transfer the FOUP or Tec-Cell or other container 350 for storage in the station 360 with the assistance of the robot. There may be two OHT loading stations, one for input and one for output.

FIG. 3B shows a conveyor, such as OHT 311 , having a moving portion 321 for transporting semiconductor substrate containers to an unloading location 351 inside a storage station 361 . The storage station 361 includes a robot 331 for loading/unloading containers or substrates from the moving unit 321 to the stocker processor 341 . The storage station 361 may also be a processing station, and may include an IP reading station, a sorter station, a swapping station, and the like. Furthermore, the operator may use the access controller 371 to control the functions of the OHT 311 and the robot 331 .

3C(a) shows a swapping station that may be used to replace a FOUP and a Tec-Cell. For example, there may be an input for a low-density FOUP and an output for a high-density Tec-cell container. Similarly, Figure 3C(b) shows a swapping station for the input of the high density Tec-Cell container and the output of the low density FOUP. Both configurations are used to switch wafers between container types for any use. According to embodiments disclosed herein, there may be two OHTs on two ends or one OHT on one end, depending on space and throughput requirements. Additionally, the swapping station may use an optional drop down controller 382 . The controller 382 can be used to load containers from the ground or unload containers to the ground. The controller can be pulled by the user to access its functions and to access the swapping station.

Figure 3D shows an integrated system illustrating both the prior art floor mounted system and the inventive ceiling mounted system. The system may utilize a loader system. For example, in one embodiment, the ceiling system 363 utilizes a floor mounted OHT loading station 373 to automatically or manually load containers. A container 383 , such as a Tec-Cell or FOUP, may be stored or entered into the OHT loading station 373 , and the OHT 323 may pick up the container and move it along the track 313 at ceiling level. The OHT 323 then enters the ceiling mounted processing/storage system 363 , where the FOUP/container 353 or its wafers may be manipulated by the robot 333 . The wafer may then be stored in storage or processing station 343 . Also, in one embodiment, an operator may load the FOUP into the loading station 383 , and then take the FOUP to the OHT track 313 , and then the FOUP to the OHT loading station 363 .

4A, 4B, and 4C show a flow diagram of one embodiment of the ceiling system of the present invention. 4A illustrates a process 400 of at least forming a manufacturing facility, a system that may be configured to be mounted to the ceiling of the process. 4B illustrates a process 420 of receiving a container from an OHT track, which may be located on the ceiling of a manufacturing facility forming at least the system, and a transfer mechanism that may be mounted on the ceiling to transfer substrates from the container to the chamber. Process 430 is described. 4C illustrates at least a process 450 of receiving a container from an OHT loading station, which may be located in a first system, a process of transferring the container to a second system, which may be separate from the first system and may be mounted on a ceiling. At 460 , a process 470 for storing or processing containers of the second system is described.

These and other processes include at least forming systems on ceilings, storage/processing stations 440, ID reading stations, sorter stations, swapping systems, ceiling and floor mounted systems. processing or storage in an integrated system of Also, any of the processes and systems may be processed in a ceiling system and then transferred to a loading station of another system, or take a container from a stocker and then transfer the container to a loading station of another system. can work

The second system may include an ID reading station, a sorter station, a swapping system, and an integrated system of ceiling mounted and floor mounted systems. A person of ordinary skill in the art to which the present invention pertains will know that the system processes in a ceiling system and then transfers containers to a loading station of another system or takes containers from a stocker and then transfers the containers to another system. It will be appreciated that the reverse operation may be performed, such as transferring to a loading station.

5A, 5B, 5C, 5D and 5E show side component views of one embodiment of the present invention, wherein an operator located on the floor of a semiconductor manufacturing and processing facility operates its ceiling mounted storage and processing system. 5A shows an operation station, such as a computer or controller 570, on the floor of a semiconductor manufacturing and processing facility. The controller 570 may be wirelessly coupled to the system and may be used by an operator to load recipes, processes, and the like. In addition, the operation station can be ceiling mounted so that the operator can pull it down, or it can be free standing or floor mounted.

Additionally, the station may be handheld or portable. There may also be an OHT 510 , which enters a processing/storage compartment 560 to store a FOUP or Tec-Cell 550 . A robot 530 may be used to maneuver the container and store it in the storage 540 . Figure 5B shows the same invention as Figure 5A except that it has a movable computer or controller 571 that can be configured to move vertically or horizontally with respect to the ceiling station.

5C shows a floor mounted FOUP loading station 572 . As shown, the FOUP 582 can be moved from a floor mounted station 572 to a ceiling mounted station 562 . Also, as shown, the FOUP 552 may be mounted to the ceiling. Similarly, FIG. 5D shows a floor mounted FOUP loading station 573 . As shown, the FOUP 583 can be moved from a floor mounted station 573 to a ceiling mounted station 563 . In addition, the FOUP 553 may be mounted on the ceiling and attached to the OHT 513 .

Additionally, the robot 533 may be used to maneuver (store or process) the FOUP 553 to enter a storage/processing/sorter or Tec-Cell transfer station 543 within the overhead system 563 . Similarly, FIG. 5E shows a FOUP 584 within a floor mounted station 574 , which may be connected to an OHT 524 via a ceiling mounted track 514 . The track may load the FOUP to a location 554 of the ceiling mounted system 564 , which may include an EFEM and a controller. In one embodiment, the system may be configured to be mounted on the ceiling of a manufacturing facility with an operator accessible station located on the floor. In another embodiment, the system comprises a pull-down controller for accessing the ceiling system; pull down controller). In another embodiment, the system supports inputting information on a wall controller unit to access the ceiling system.

6A, 6B, 6C and 6D show a flow chart for one embodiment of the ceiling system of the present invention. This may include a ceiling system in which the operator station is on the floor or embodiments in which the system is on the ceiling and the operator station is on the floor.

6A illustrates a process 600, which is the process of at least forming a system, wherein the system may be configured to be mounted on a ceiling of a manufacturing facility with an operator access station positioned on the floor.

6B illustrates process 620, which is the process of unloading a controller from a ceiling system to at least gain access to the ceiling system, wherein the ceiling system may be configured to be mounted at least in part on a ceiling.

6C illustrates process 640, which is the process of entering information on a wall controller unit to access at least a ceiling system, the ceiling system being configured to be mounted at least in part on a ceiling.

6D illustrates process 660 of loading at least a container into an on-floor loading station and at least transferring the container to a ceiling system or an OHT track to be moved to a ceiling system, wherein at least a portion of the ceiling system is semiconductor manufacturing. A process 670 that is configured to be mounted on the ceiling of a facility is described.

The flow charts described above and below can be used for complete ceiling systems (with loading stations of other separate systems) and for ceiling systems with loading stations on the floor, using loading stations of other systems, said other The system may have software enabling transfer to the ceiling system, and may have software allowing other programs to access the loading station, wherein the system with the ceiling system and loading station is controlled by the OHT track and software. Two independent systems connected, the ceiling system can in particular have a loading station on the floor and the rest on the ceiling.

7A, 7B and 7C show side component views of one embodiment of the present invention in which a ceiling system operates in conjunction with other floor components of a semiconductor manufacturing and processing facility. More specifically, FIG. 7A shows a ceiling system 702 having other components of the floor system 704 such as an on-floor loading station or EFEM. For example, the floor system 704 can be used to input the FOUP, convert it to a high density Tec-Cell, and then transfer the Tec-Cell to a storage chamber mounted on the ceiling system 702 .

7B shows a processing system 706 installed on the floor. The processing system 706 may be used for processes such as deposition, etching, ID reading, sorting, and the like. In one embodiment, the processing system 706 may be a conventional processing system used to receive input from the ceiling mounted system 708 of the present invention. For example, the ceiling system 708 may have a stocker that stores high density Tec-Cells. In this way, the ceiling system 708 can be used to transfer the Tec-Cell to the process system 706 for conversion to a low density FOUP.

Similarly, FIG. 7C shows a loading station or EFEM mounted on at least the floor of a floor system 710 of a semiconductor manufacturing and processing facility. The floor system 710 can be used to process high density Tec-Cells and convert them to low density FOUPs. The FOUP may then be transferred to a processing chamber mounted on a ceiling system 712 of a semiconductor manufacturing and processing facility. The processing system 712 may be configured to perform processes such as deposition, etching, ID reading, and sorting.

8A, 8B, and 8C show a flow chart of one embodiment of the ceiling system of the present invention. 8A illustrates a ceiling system having at least another component of the floor. Process 800 describes at least forming a system, wherein a portion of the system may be configured to be mounted on a ceiling of a manufacturing facility while other portions are located on a floor.

8B illustrates at least a process 820 of receiving a first container at a loading station, and a process 830 of processing substrates in a first container of a processing station on the floor and placing the processed substrates in a second container. , and process 840, which is the process of transferring the second container to the station on the ceiling.

The processing may be first done on the floor and then moved to the ceiling to continue, such processing may be ID reading, sorting, densify or enlarge density, deposition, etching, storage, and the like.

8C shows process 860, which is receiving a first container of a loading station, process 870, which is processing substrates in a first container of a first station on the ceiling and placing the processed substrates in a second container; And a process 880 of transferring the second container to the second station on the floor will be described.

The treatment may be first done at the ceiling and then moved to the floor to continue, which may be ID reading, sorting, densify or enlarge density, deposition, etching, storage, and the like.

9A, 9B and 9C show side component views of one embodiment of the present invention in which a plurality of ceiling and floor systems are distributed throughout a semiconductor manufacturing and processing facility. More specifically, a semiconductor manufacturing and processing facility has a plurality of ceiling components distributed throughout the facility and a plurality of loading stations distributed throughout the facility at different locations, and the like. In one embodiment, the loading station and the ceiling component may be movable components.

Specifically, FIG. 9A shows a distributed ceiling/floor system 900 that includes multiple floor loading stations for servicing one ceiling system. Such a setup may be referred to as a floor distributed system. That is, there may be one ceiling system serviced by a plurality of floor systems. Similarly, a distributed ceiling system may include one floor loading station for servicing multiple ceiling systems. In addition, the system 900 may include at least a container 950 such as a Tec-Cell or an OHT 920 that may include a FOUP. The OHT may be configured to move in any order between floor mounted systems 970A, 970B as well as ceiling mounted systems 960A, 960B, 960C. In particular, OHT can be used to connect distributed floor and ceiling mounted systems in semiconductor manufacturing and processing facilities.

9B shows a specific embodiment of a ceiling distributed system in a semiconductor manufacturing and processing facility. As shown, the system includes one floor loading station for multiple ceiling systems. The floor loading station may be configured to load the FOUP to any ceiling system. In one embodiment, a container 951 such as a FOUP or Tec-Cell may be moved between the plurality of subsystems 961a, 961b via an OHT 921 mounted on a track 911. Additionally, FOUP 951 may be lowered to position 981 for transport to any of a plurality of floor mounted systems 971 .

9C shows a distributed floor system comprising one ceiling system serviced by multiple floor systems. The floor system may include any loading station on the floor and may be used for loading containers in one ceiling system. Container 982, such as a Tec-Cell or FOUP, from a floor mounted system, such as system 972, via OHT 922 using track 912 to ceiling mounted system 962 at location 952. can move This configuration may be accomplished in any order and may include floor-to-ceiling or ceiling-to-floor movement as well as floor-mounted to floor-mounted movement, such as through a ceiling system.

10A, 10B, and 10C show a flow diagram of one embodiment of the ceiling system of the present invention. 10A illustrates a distributed ceiling system having ceiling components throughout the fab and loading stations throughout the fab. This may at least include process 1000, which is the process of forming a distributed system, wherein the distributed system may be configured to be disposed at different locations on the ceiling and/or floor of a manufacturing facility.

FIG. 10B shows process 1020, which may include one loading station for multiple ceiling stations, receiving containers in a loading station on a floor, selecting a ceiling station where the ceiling station is mounted on the ceiling. a process 1030 that may be executed, and a process 1040 of transferring the container to a selected ceiling station. The reverse operation may be performed for any process in other embodiments, such as sending a container from a ceiling system to a loading station.

10C may also include a transfer operation and processing of the substrate and wafer after transfer, or may include any other operation such as sorting, reading, heating, and the like. This is a process 1060 of selecting a loading station on the floor, a process 1070 of selecting a ceiling station that can be mounted on the ceiling, and a process of transferring containers between the loading station and the ceiling station ( 1080) at least.

The process may be based on a distributed ceiling system having ceiling components throughout the facility and loading stations throughout the facility. The distributed system may be configured to be placed at different locations on the ceiling and/or floor of the manufacturing facility. Such systems may also interoperate with non-ceiling based systems.

11A, 11B, 11C and 11D show side component views of one embodiment of the present invention in which the ceiling system is used as an overall ceiling stocker. Specifically, FIG. 11A shows a ceiling-mounted system 1102 that includes a stocker for storing high-density Tec-Cells or low-density FOUPs. The ceiling stocker may include a high density Tec-Cell container, an opener, and an OHT loader for FOUP. Containers may be exchanged by the ceiling mounted system 1102 between high density and low density containers.

11B shows another ceiling mounted system 1102 that includes a stocker that stores high density Tec-Cells in its storage chamber. System 1102 may use OHT to transport containers, and may use OHT as storage. System 1102 may use a controller on the wall of a semiconductor manufacturing and processing facility to control the functions of system 1102 . In one embodiment, the controller may be operated by a human and may be used to guide the OHT to transport a container, the system 1102 in the loading, unloading, or processing of semiconductor substrates stored in a high density Tec-Cell. It can also be used to control a robot inside.

11C shows an additional loading station 1172 located on the floor of a semiconductor manufacturing and processing facility as shown in system 1102 of FIG. 11B. The loading station 1172 may be an independent loading station designed to service the ceiling system. In general, OHT is used as a loading station, but as shown in Fig. 11C, it is possible for the system to implement an external loading station. The loading station may load containers 1182 from the ground into a ceiling mounted storage stocker 1142 . The OHT track may be used to move containers from the loading station to the ceiling system 1162 and into the stocker 1142 .

11D illustrates one embodiment of a distributed ceiling system 1102 distributed throughout a semiconductor manufacturing and processing facility. Semiconductor manufacturing and processing facilities may be operated by software. The software can be used to automate the functions of the facility and can be used to operate processing stations and swapping stations to convert low and high density containers such as FOUPs and Tec-Cells. Also, as shown, the ceiling system may include a plurality of stockers, robots, and loading stations for transporting substrate containers. In one embodiment the stocker comprises a wall mounted controller, wherein the stocker may be configured to have at least a portion mounted on a ceiling. In other embodiments, the stocker may be configured to use a loading station of another system.

12A, 12B, 12C and 12D illustrate a flow chart for an embodiment of the ceiling system of the present invention. 12A illustrates a process 1200, which is the process of forming at least a stocker, wherein the stocker may be configured to be mounted on a ceiling of a manufacturing facility.

12B illustrates process 1220, which is the process of forming at least a stocker, wherein the stocker includes a wall mounted controller, the stocker may be configured to have at least a portion mounted on a ceiling.

12C illustrates process 1240, which is the process of forming at least a stocker, wherein the stocker may be configured to use another system's loading station, and the stocker may be configured to have at least a portion mounted on a ceiling. .

12D illustrates process 1260, which is at least loading a container to a loading station on the floor, and process 1270, which is a process for transferring a container to a ceiling stocker, where the container is directly loaded into an input loading station or storage chamber of the stocker. It may be configured to be transported to a connected loading station.

13A and 13B show one embodiment of the present invention in side component views, wherein the ceiling system is used as a distributed OHT track stocker. Specifically, Figures 13A(a) and 13A(b) show the OHT as a storage system (so that the FOUP can be stored in an open area). The OHT track may be designed so that the FOUP can be stored on a branch track 1366 and exit the main track 1311 during storage. In addition, the system can store high-density Tec-Cell containers. 13B(a) and 13B(b) also illustrate the OHT as the storage system 1361 . However, in addition to the system shown in FIG. 13A, the system may use a cover having laminar flow surrounding the storage area, where the OHT 1311 is a high-density storage track inside the storage 1361 ( 1366) may be followed.

14A, 14B, 14C and 14D show a flow chart for one embodiment of a ceiling system of the present invention, which uses an OHT stocker as stocker storage and an OHT stocker as temporary storage, as well as a FOUP or It may be for high-density Tec-Cells.

14A illustrates process 1400, which is the process of forming a decentralized OHT track stocker system for storing at least containers.

14B illustrates process 1420, which is the process of forming at least a stocker, wherein the stocker includes a distributed OHT track system inside a ceiling-mounted purged enclosure.

14C illustrates at least process 1450, which is a process for sending containers from a stocker to a distributed OHT track system, and process 1450, which is a process for transporting containers to a handling system.

14D illustrates process 1480, which is the process of transferring at least containers between a handling system and a distributed OHT track stocker system.

15A, 15B, 15C, and 15D illustrate one embodiment of the present invention in side component views, wherein a ceiling system of a semiconductor manufacturing and processing facility may include a stocker having an operator station on the floor. . The stocker may include a link to the construction of the ceiling system. Specifically, FIG. 15A shows an operator monitoring station 1502 . The station may also be used as a control station 1502 controlled by a human operator. Station 1502, as shown, is installed on the floor of a semiconductor manufacturing and processing facility.

15B also shows another operator loading station 1504 installed on the floor. As shown, the system can be used to move a FOUP to a loading station mounted on the ceiling system of a semiconductor manufacturing and processing facility. As shown in FIG. 15C , the FOUP may be moved up by the loading station to the OHT track, which may move the FOUP to a ceiling mounted stocker for storage or further processing. Similarly, FIG. 15D shows one embodiment in which a floor operator loading station 1504 is used to service a plurality of ceiling mounted systems of a semiconductor manufacturing and processing facility. One floor mounted station may use the OHT track to transport FOUPs from one ceiling station to another. In one embodiment, a plurality of floor mounted operator loading stations may also be used.

16A, 16B, 16C and 16D illustrate a flow chart for one embodiment of the ceiling system of the present invention.

16A illustrates process 1600, which is the process of operating a ceiling stocker from at least a controller on the floor.

16B illustrates process 1620, which is the process of sending containers from at least an on-floor loading station to a ceiling stocker.

16C illustrates process 1640, which is the process of sending containers from at least the on-floor loading station to the OHT track, and process 1650, which is the process of transporting the containers to the ceiling stocker.

16D illustrates process 1670, which is at least selecting a ceiling stocker that can be mounted on the ceiling, and process 1680, which is the process of transferring containers between a loading station on the floor and the selected ceiling stocker.

16A-D may illustrate in one embodiment a flow chart of a process for operating a ceiling stocker from a controller installed on the floor of a semiconductor manufacturing and processing facility. In another embodiment, a process for sending containers from a loading station on the floor of a semiconductor manufacturing and processing facility to a ceiling stocker is disclosed. In another embodiment, a process for transferring containers from an on-floor loading station to an OHT and a process for transferring containers to a ceiling stocker are disclosed. In another embodiment, a process of selecting a ceiling stocker is disclosed for transferring containers between a loading station on the floor and a selected ceiling stocker.

A controller may be used to load, unload, transfer and process substrates stored in the ceiling stocker, and one or more controllers may be used at any location for a control operation or any operation.

17A, 17B, and 17C show side component views of one embodiment of the present invention in which a stocker may have a ceiling mounted portion and a floor mounted portion of a semiconductor manufacturing and processing facility. A floor system 1704 and a ceiling system 1702 may be coupled to transfer wafers therebetween. Specifically, a ceiling mounted system 1702 and a ground system 1704 are shown in FIGS. 17A and 17B , in which one or more of a storage, loading, opener, or processing operation is performed on the ceiling system 1702 and the ground level system. Split the semiconductor manufacturing and processing operations to occur elsewhere on system 1704 .

In particular, FIG. 17A illustrates loading the substrate container directly into the ceiling portion, and FIG. 17B illustrates loading the substrate container first into the OHT track 1706 and then into the ceiling portion. Any number and combination of migrations may be made within the system for any purpose, such as saving space or using already owned equipment or processors, storage, or the like. 17C also illustrates a partially distributed system in which one component may be on the ceiling system 1702 while multiple components may be on the floor system 1704 . Similarly, one component may be on a floor and a plurality of components may be on a ceiling, and a plurality of components may be on a ceiling and a plurality of components may be on a ceiling.

18 illustrates a flow chart of a process for densifying a substrate in a container available on the floor of a semiconductor manufacturing and processing facility. The process may also be used to transfer containers from a ceiling stocker to a floor system for processing. The processing includes enlarging the space between the substrates in the container.

18A, 18B, and 18C show a flow chart for one embodiment of the ceiling system of the present invention.

18A illustrates process 1800, which is a process for densifying substrates in containers on at least a floor system, and process 1810, a process for storing densified substrates in a ceiling stocker.

18B illustrates at least process 1830, which is a process for transferring a container from a ceiling stocker to a floor system, and process 1840, which is a process for enlarging the space between substrates within the container.

18C shows process 1860, a process for selecting a ceiling stocker and a floor system, process 1870, a process for transferring a container between the ceiling stocker and a floor system, and enlarging or densifying a substrate within the container. Process 1880, which is a process, is described.

A number of embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the claimed invention. Furthermore, the logic flows shown in the figures do not require the specific order shown, or sequential order, to achieve desirable results. Further, other steps may be provided, or steps may be removed from the described flows, and other components may be added to the described systems or other components may be removed from the described systems. Accordingly, other embodiments may be within the scope of the following claims.

The various systems, methods, and apparatus disclosed herein are machine-readable and/or machine-accessible that are compatible with a data processing system (eg, a computer system) and/or can be performed in any order. It may be contemplated that it may be embodied in a medium.

Structures and modules in the figures are shown in communication with only some specific structures and not others and may be shown as distinct. Structures may merge with each other, perform overlapping functions, and communicate with other structures not shown as connected in the figures. Accordingly, the specification and/or drawings are to be regarded in an illustrative rather than a restrictive sense.

Claims (20)

A substrate processing system comprising:
At least the following subsystems:
a storage system for storing a plurality of substrates;
a processing system for performing one or more operations on the plurality of substrates;
a loading system for loading the plurality of substrates into the storage system and the processing system and for unloading the plurality of substrates from the storage system and the processing system; and
a transfer system for transferring the substrate between the storage system, the processing system, and the loading system;
wherein the storage system, the processing system, the loading system and the transport system are all mounted to the ceiling with no footprint at ground level.
Substrate processing system.
The method of claim 1,
Ceiling mounted subsystems reduce the footprint of the substrate processing system;
Substrate processing system.
The method of claim 1,
wherein the substrate processing system includes at least one of a high density container and a low density container, wherein the high density container holds substrates at a higher density than the low density container.
Substrate processing system.
4. The method of claim 3,
The high-density container comprises a Tec-Cell container,
Substrate processing system.
4. The method of claim 3,
wherein the low density container comprises a forward opening integrated pod (FOUP) container;
Substrate processing system.
The method of claim 1,
wherein the storage system comprises one or more of an opener station, an ID reading station, a transfer station, and a high-density storage;
Substrate processing system.
delete The method of claim 1,
comprising an operator station on the floor for access to a ceiling mounted subsystem;
Substrate processing system.
The method of claim 1,
wherein the substrate processing system comprises a controller unit;
Substrate processing system.
10. The method of claim 9,
wherein the controller unit is a user-operable drop-down controller;
Substrate processing system.
11. The method of claim 10,
wherein the drop down controller is configured to move vertically and horizontally with respect to the ceiling;
Substrate processing system.
11. The method of claim 10,
wherein the drop down controller is configured to be manually pulled down by a user;
Substrate processing system.
The method of claim 1,
wherein the conveying system is an overhead conveying track (OHT);
Substrate processing system.
The method of claim 1,
wherein the ceiling-mounted subsystem is integrated with a conventional non-ceiling system;
Substrate processing system.
The method of claim 1,
The space below the ceiling-mounted subsystem is freed up for logistical operations.
Substrate processing system.
The method of claim 1,
further comprising a drop sealing arrangement for accessing a sub-system mounted to the ceiling from the floor;
Substrate processing system.
The method of claim 1,
and a raised floor arrangement for accessing the ceiling mounted subsystem from the raised floor.
Substrate processing system.
A substrate processing system comprising:
At least the following subsystems:
one or more containers, wherein there is one or a plurality of high-density containers and low-density containers, the high-density container holding substrates at a higher density than the low-density container;
a storage system for storing a plurality of substrates;
a processing system for performing one or more operations on the plurality of substrates;
a loading system for loading the plurality of substrates into the storage system and the processing system and for unloading the plurality of substrates from the storage system and the processing system; and
a transfer system for transferring the substrate between the storage system, the processing system, and the loading system;
one or more subsystems are mounted to the ceiling, the ceiling mounted subsystems reducing the footprint of the substrate processing system;
wherein the container, the storage system, the handling system, the loading system and the transport system are all mounted to the ceiling with no footprint at ground level.
Substrate processing system.
19. The method of claim 18,
wherein the storage system comprises one or more of an opener station, an ID reading station, a transfer station, and a high-density storage;
Substrate processing system.
19. The method of claim 18,
wherein the substrate processing system includes a controller unit, wherein the controller unit is a user-operable drop down controller.
Substrate processing system.

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